KR101538835B1 - Method for manufacturing laminate, and laminate - Google Patents

Abstract

A resin layer is interposed between a device substrate and a support plate so that the resin layer is peelably adhered to a first main surface of the device substrate and the laminate block fixed on the support plate is cut to a predetermined dimension, And a step of planarizing at least a part of the circumferential direction of the outer circumferential surface of the laminate block.

Description

[0001] METHOD FOR MANUFACTURING LAMINATE, AND LAMINATE [0002]

The present invention relates to a method for producing a laminate and a laminate.

2. Description of the Related Art In recent years, devices (electronic devices) such as a solar cell (PV), a liquid crystal panel (LCD), and an organic EL panel (OLED) have been made thinner and lighter. ) Has been progressing in thinning. If the strength of the device substrate is reduced by thinning, the handling of the device substrate in the device manufacturing process is reduced.

Therefore, conventionally, a method of forming a device member on a device substrate thicker than the final thickness, and then thinning the device substrate by chemical etching treatment has been widely adopted. However, in this method, for example, when the thickness of one device substrate is thinned from 0.7 mm to 0.2 mm or 0.1 mm, most of the material of the original device substrate is undercut by the etchant, Which is not preferable from the viewpoint of efficiency of use.

In the method of thinning a device substrate by the above chemical etching treatment, when fine scratches are present on the surface of the device substrate, fine recesses (etch pits) are formed starting from scratches by etching, .

In recent years, in order to cope with the above-mentioned problem, a laminated body in which a resin layer fixed on a support plate is peelably adhered to a first main surface of a device substrate is prepared, and a device member is formed on a second main surface of the device substrate of the laminate (Refer to, for example, Japanese Patent Application Laid-Open No. 2001-325819).

International Publication No. 2007/018028 pamphlet

However, in the conventional laminate, concave grooves may be formed on the outer circumferential surface of the laminate. For example, when the device substrate or the backing plate is chamfered, or when the resin layer is formed by applying a liquid resin composition to the backing plate by heating and curing, the outer circumferential surface of the device substrate or the backing plate and the outer circumferential surface of the resin layer show a round shape The concave groove is formed on the outer peripheral surface of the laminate.

In the device manufacturing process, there is a process of forming a pattern such as wiring or element formation by performing a treatment such as sandblasting or etching on a conductive film formed on the surface of a device substrate. Before this pattern forming step, there is a coating step of applying a coating solution such as a resist solution on the surface of the conductive film in order to protect a part of the surface of the conductive film.

In the coating step of the device manufacturing process, the coating liquid tends to enter the concave groove due to the capillary phenomenon and is likely to be stored. The coating liquid stored in the concave groove is difficult to be removed even by washing, and the residue tends to remain after drying. This residue becomes an oscillation source in the heat treatment process in the device manufacturing process, so that the oscillation causes contamination of the heat treatment process, thereby lowering the yield of the device as a product.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and its main object is to provide a method of manufacturing a laminate capable of suppressing oscillation and a laminate in a device manufacturing process.

In order to solve the above object, the present invention provides a method for producing a laminate,

A resin layer is interposed between the device substrate and the support plate, the resin layer is peelably adhered to the first main surface of the device substrate, and the laminate block fixed on the support plate is cut to a predetermined dimension, And a step of planarizing at least a part of the circumferential direction of the outer circumferential surface.

Further, it is preferable that the method of producing a laminate of the present invention includes a step of chamfering a corner of the flattened portion of the outer peripheral surface of the laminate block.

It is preferable that the planarized portion of the outer circumferential surface of the resin layer is substantially parallel to the thickness direction of the resin layer.

It is preferable that the device substrate is a glass substrate produced by a float method, and the step of grinding the second main surface of the device substrate after chamfering the corner portion.

The device substrate is preferably a glass substrate having a thickness of 0.03 mm or more and less than 0.8 mm.

The resin layer preferably includes at least one selected from the group consisting of an acrylic resin layer, a polyolefin resin layer, a polyurethane resin layer, and a silicone resin layer.

The thickness of the resin layer is preferably 5 to 50 mu m.

Further, in the laminate of the present invention,

A resin layer is interposed between the device substrate and the support plate, the resin layer is peelably adhered to the first main surface of the device substrate, and the laminate block fixed on the support plate is cut to a predetermined dimension, At least a part of the circumferential direction of the outer circumferential surface is planarized.

According to the present invention, it is possible to provide a method of producing a laminate capable of suppressing oscillation and a laminate in a device manufacturing process.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a process chart of a method of manufacturing a laminate according to a first embodiment of the present invention; Fig.
Fig. 2 is a partial side view of a laminate block before planarization in the first embodiment of the present invention. Fig.
3 is a partial side view of a laminated block after planarization in the first embodiment of the present invention.
4 is an explanatory diagram (1) of a chamfering method according to the first embodiment of the present invention.
5 is an explanatory diagram (2) of a chamfering method according to the first embodiment of the present invention.
6 is an explanatory view (3) of a chamfering method according to the first embodiment of the present invention.
7 is a partial side view of a laminated block after chamfering according to the first embodiment of the present invention.
8 is a partial side view of a laminated block after polishing according to the first embodiment of the present invention.
9 is a process chart of a device manufacturing method according to the first embodiment of the present invention.
10 is a process chart of the LCD manufacturing method according to the first embodiment of the present invention.
11 is a process chart of an OLED manufacturing method according to the first embodiment of the present invention.
12 is a partial side view of a laminated block before planarization according to a second embodiment of the present invention.
13 is a partial side view of a laminated block before planarization according to a third embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and a description thereof will be omitted.

(First Embodiment)

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a process diagram of a method of manufacturing a laminate according to a first embodiment of the present invention. FIG. As shown in FIG. 1, a method of manufacturing a laminate includes a resin layer interposed between a device substrate and a support plate, the resin layer being peelably adhered to a first main surface of the device substrate, (Step S11) of cutting the block to a predetermined dimension so as to planarize at least a part of the circumferential direction of the outer circumferential surface of the laminate block.

The laminated body after planarization is used in device manufacturing, which will be described later in detail. The resin-layer-attached support plate in the laminate after the planarization is used until the middle of the manufacturing process of the device (until the device substrate and the resin layer are peeled off by the peeling operation). After the device substrate and the resin layer are peeled off, the resin-layer-attached support plate is excluded from the device manufacturing process and is not a member constituting the device. The resin layer-attached support plate peeled off from the device substrate can be reused in the production process of the laminate. That is, a new device substrate is laminated on the resin layer of the resin-layer-attached support plate, and a new laminate block can be obtained.

First, a laminated block before planarization will be described. Next, a laminated block after planarization will be described. Finally, a manufacturing process of a device will be described.

Fig. 2 is a partial side view of the laminate block before planarization in the first embodiment of the present invention. Fig. As shown in Fig. 2, the laminate block 10 before planarization has a resin layer 13 interposed between the device substrate 11 and the support plate 12. As shown in Fig. The resin layer 13 is in close contact with the first main surface 111 of the device substrate 11 in a releasable manner and is fixed on the support plate 12.

(Device substrate)

The device substrate 11 is formed with a device member on the second main surface 112 to constitute a device. Here, the device member refers to a member constituting at least a part of a device (electronic apparatus). Specific examples thereof include a thin film transistor (TFT) and a color filter (CF). Examples of the device include a solar cell (PV), a liquid crystal panel (LCD), an organic EL panel (OLED), and the like. The device member is formed on the second main surface 112 of the device substrate 11 after the outer peripheral surface of the laminate block 10 is planarized.

The device substrate 11 may be of a general type, and may be a metal substrate such as a glass substrate, a resin substrate, or an SUS substrate. Among these, a glass substrate is preferable. This is because the glass substrate is excellent in chemical resistance and moisture permeability, and has a low heat shrinkage ratio. The coefficient of linear expansion specified in JIS R3102-1995 is used as an index of heat shrinkage.

If the coefficient of linear expansion of the device substrate 11 is large, the manufacturing process of the device often involves heat treatment, and thus various problems are likely to occur. For example, when the TFT is formed on the device substrate 11, if the device substrate 11 on which the TFT is formed under heating is cooled, there is a fear that the positional shift of the TFT becomes excessive due to heat shrinkage of the device substrate 11 .

The glass substrate can be obtained by melting a glass raw material and shaping the molten glass into a plate shape. Such a molding method may be a general one, and for example, a float method, a fusion method, a slot-down draw method, a full-call method, a Lubus method, or the like is used. Particularly, a glass substrate having a small thickness can be obtained by a method in which a glass molded into a plate shape is heated at a moldable temperature and pulled by means of drawing or the like to thin it (lead-through method).

The glass of the glass substrate is not particularly limited, but is preferably an alkali-free glass, borosilicate glass, soda lime glass, high silica glass, or other oxide-based glass containing silicon oxide as a main component. As the oxide-based glass, glass having a silicon oxide content of 40 to 90 mass% in terms of oxide is preferable.

As the glass of the glass substrate, it is preferable to adopt a glass suitable for the kind of device and its manufacturing process. For example, the glass substrate for a liquid crystal panel is preferably made of a glass (alkali-free glass) substantially free of an alkali metal component since elution of the alkali metal component is likely to affect the liquid crystal. As described above, the glass of the glass substrate is appropriately selected based on the kind of the applied device and the manufacturing process thereof.

The thickness of the device substrate is not particularly limited, but is usually less than 0.8 mm, preferably not more than 0.3 mm, and more preferably not more than 0.15 mm. Further, it is preferably 0.03 mm or more. Particularly, in the case where the device substrate is a glass substrate, it is usually less than 0.8 mm, preferably not more than 0.3 mm, more preferably not more than 0.15 mm from the viewpoint of reducing the thickness and / or weight of the glass substrate. If it is 0.8 mm or more, the demand for thinning and / or lightening of the glass substrate can not be satisfied. When it is 0.3 mm or less, it is possible to impart good flexibility to the glass substrate. When the thickness is 0.15 mm or less, the glass substrate can be rolled up. The thickness of the glass substrate is preferably 0.03 mm or more for ease of production of the glass substrate and easy handling of the glass substrate.

The type of the resin of the resin substrate is not particularly limited. Examples of the transparent resin include a resin such as polyethylene terephthalate resin, polycarbonate resin, transparent fluororesin, transparent polyimide resin, polyether sulfone resin, polyethylene naphthalate resin, polyacrylic resin, cycloolefin resin, silicone resin, , Organic polymer / bio-nanofiber hybrid resin, and the like. Examples of the opaque resin include polyimide resin, fluorine resin, polyamide resin, polyaramid resin, polyetheretherketone resin, polyether ketone resin, and various liquid crystal polymer resins. In addition, the resin substrate may have a functional layer such as a protective layer formed on the surface thereof.

(Support plate)

The support plate 12 supports and reinforces the device substrate 11 to prevent deformation, scratches, breakage, and the like of the device substrate 11 in the device manufacturing process. In the case of using the device substrate 11 having a thinner thickness than that of the conventional device, the laminate block 10 having the same thickness as that of the conventional device substrate can be manufactured. In the device manufacturing process, Making the technology or manufacturing facility usable is one of the purposes of using the support plate 12.

The thickness of the support plate 12 may be thicker or thinner than the device substrate 11. Preferably, the thickness of the support plate 12 is selected based on the thickness of the device substrate 11, the thickness of the resin layer 13, and the thickness of the laminate block 10. For example, if the current device manufacturing process is designed to process a substrate having a thickness of 0.5 mm and the sum of the thickness of the device substrate 11 and the thickness of the resin layer 13 is 0.1 mm, The thickness is 0.4 mm. When the support plate 12 is a glass plate, the thickness of the glass plate is preferably 0.08 mm or more for ease of handling and difficulty in breaking.

The support plate 12 may be of any general type, for example, a glass plate, a resin plate, a metal plate, or the like. It is preferable that the support plate 12 is formed of a material having a small difference in coefficient of linear expansion from the device substrate 11 when the manufacturing process of the device involves heat treatment, desirable.

The difference in average coefficient of linear expansion (hereinafter simply referred to as "average coefficient of linear expansion") at 25 to 300 ° C between the device substrate 11 and the support plate 12 is preferably 700 × 10 ^-7 / ° C or less, Preferably not more than 500 x 10 < ^-7 > / DEG C, and more preferably not more than 300 x 10 < ^-7 > If the car is excessively large, there is a possibility that the laminate block 10 is vigorously bent or the device substrate 11 and the support plate 12 are peeled off during heating and cooling in the manufacturing process of the device. This problem does not occur when the material of the device substrate 11 and the material of the support plate 12 are the same.

(Resin layer)

The resin layer 13 is fixed on the support plate 12 and is also in close contact with the first main surface 111 of the device substrate 11 in a peelable manner. The resin layer 13 prevents displacement of the device substrate 11 until the peeling operation is performed and peels easily from the device substrate 11 by the peeling operation so that the device substrate 11 is peeled Thereby preventing damage to the semiconductor device.

The surface of the resin layer 13 is not adhered to the adhesive force of a general adhesive agent but is adhered to the first main surface 111 of the device substrate 11 by a force due to a van der Waals force between solid molecules . This is because it is easily peeled off. In the present invention, the property that the surface of the resin layer can easily be peeled off is referred to as peelability.

On the other hand, the bonding force of the resin layer 13 to the surface of the support plate 12 is relatively higher than the bonding force of the resin layer 13 to the first main surface 111 of the device substrate 11. In the present invention, the bonding of the surface of the resin layer 13 to the surface of the device substrate 11 is referred to as adhesion, and the bonding to the surface of the support plate 32 is referred to as fixing.

The thickness of the resin layer 13 is not particularly limited, but is preferably 5 to 50 탆, more preferably 5 to 30 탆, and further preferably 7 to 20 탆. This is because if the thickness of the resin layer 13 is within this range, adhesion between the resin layer 13 and the device substrate 11 becomes sufficient. This is because occurrence of distortion defects in the device substrate 11 can be suppressed even if bubbles or foreign substances are interposed between the resin layer 13 and the device substrate 11. If the thickness of the resin layer 13 is too thick, it is not economical because it requires time and material to be formed.

The resin layer 13 may be composed of two or more layers. In this case, the " thickness of the resin layer " means the total thickness of all the resin layers.

In the case where the resin layer 13 is composed of two or more layers, the kinds of resins forming the respective layers may be different.

The surface tension of the resin layer 13 is preferably 30 mN / m or less, more preferably 25 mN / m or less and still more preferably 22 mN / m or less. Further, it is preferably at least 15 mN / m. This is because the surface tension in this range makes it easier to peel off the device substrate 11, and at the same time, the device substrate 11 can be sufficiently adhered.

The surface tension is measured as follows. First, a plurality of liquids having a known surface tension are used for the resin layer 13, and the contact angle of each liquid at 20 占 폚 is measured. Subsequently, the surface tension and the contact angle (cos?) Of each liquid are plotted, approximated by a straight line, and the surface tension value that cos? = 1 is extrapolated to obtain the critical surface tension of the resin layer 13. This critical surface tension is defined as the surface tension of the resin layer 13. [

The resin layer 13 is preferably made of a material having a glass transition point lower than room temperature (about 25 캜) or having no glass transition point. The resin layer becomes a non-tacky resin layer, so that it can be separated from the device substrate 11 more easily, and at the same time, the device substrate 11 can be closely contacted.

Further, since the resin layer 13 is often subjected to heat treatment in the manufacturing process of the device, it is preferable that the resin layer 13 has heat resistance.

If the elastic modulus of the resin layer 13 is too high, the adhesion with the device substrate 11 tends to be lowered. On the other hand, if the elastic modulus of the resin layer 13 is too low, the peelability tends to be lowered.

The kind of the resin forming the resin layer 13 is not particularly limited. For example, acrylic resin, polyolefin resin, polyurethane resin and silicone resin can be mentioned. These resins may be used alone or in combination of several kinds of resins. Of these, a silicone resin is preferable. This is because the silicone resin is excellent in heat resistance and peelability. If the support plate 12 is a glass plate, it is easily fixed to the support plate 12 by the condensation reaction with the silanol group on the surface. It is also preferable that the silicone resin layer is hardly deteriorated in peelability even if it is treated at about 300 to 400 DEG C for about 1 hour.

It is preferable that the resin layer 13 is made of a silicone resin (cured product) used for the peeling paper among the silicone resin. The resin layer 13 formed by curing the curable resin composition to be a silicone resin for release paper on the surface of the support plate 12 is preferable since it has excellent releasability. Further, since the flexibility is high, occurrence of distortion defects in the device substrate 11 can be suppressed even if foreign substances such as bubbles or dust are mixed between the resin layer 13 and the device substrate 11.

The curable silicone to be a silicone resin for the release agent is classified into a condensation reaction type silicone, an addition reaction type silicone, an ultraviolet ray curable type silicone and an electron ray curable type silicone, depending on the curing mechanism. Of these, addition reaction type silicon is preferable. This is because the curing reaction is easily performed and the degree of peelability is good when the resin layer 13 is formed, and the heat resistance is high.

The addition reaction type silicone is a curable resin composition comprising a combination of an organoalkenyl polysiloxane having an unsaturated group such as a vinyl group and a catalyst such as an organohydrogenpolysiloxane having a hydrogen atom bonded to a silicon atom and a platinum catalyst, Or hardened by heating to form a cured silicone resin.

In addition, the curable silicone to be a silicone resin for release paper is in the form of a solvent, an emulsion and a solvent, and any type can be used. Of these, no-solvent formulations are preferred. Productivity, safety, and environmental characteristics. Further, since the solvent that generates foaming during the curing at the time of forming the resin layer 13, that is, at the time of heat curing, ultraviolet curing or electron beam curing is not included, the bubbles are hardly left in the resin layer 13 Because.

Specific examples of the curable silicone to be a release silicone resin include KNS-320A and KS-847 (both manufactured by Shin-Etsu Silicone Co., Ltd.) and TPR6700 (GE Toshiba Silicone Co., Ltd.) (Available from Arakawa Chemical Industries, Ltd.) and a methylhydrogenpolysiloxane " 12031 " (available from Arakawa Chemical Industries, Ltd.), vinyl silicone " 11364 " 11365 " manufactured by Arakawa Chemical Industries, Ltd.) and methylhydrogenpolysiloxane " 12031 " (available from Arakawa Chemical Industries Co., Ltd.) 12031 " (manufactured by Arakawa Chemical Industries, Ltd.).

In addition, KNS-320A, KS-847 and TPR6700 are curable silicones containing a subject and a crosslinking agent in advance.

It is preferable that the silicone resin forming the resin layer 13 has a property that the components in the silicon resin layer are difficult to transfer to the device substrate 11, that is, low silicon transition property.

(Fixing method)

The method of fixing the resin layer 13 on the support plate 12 is not particularly limited, and for example, a method of fixing a film-shaped resin on the surface of the support plate 12 is exemplified. Specifically, the surface of the support plate 12 is subjected to a surface modification treatment (priming treatment) in order to impart a high fixing force (high peel strength) to the surface of the support plate 12, For example. For example, chemical methods such as silane coupling agents, chemical methods (primer treatment) to increase the fixing power, physical methods to increase the surface activation period such as frame (flame) treatment, increase the surface roughness such as sand blast treatment, And a mechanical treatment method for increasing the mechanical strength.

Further, for example, a method of coating the curable resin composition to be the resin layer 13 on the support plate 12 can be mentioned. Examples of the coating method include spray coating, die coating, spin coating, dip coating, roll coating, bar coating, screen printing and gravure coating. Of these methods, the resin composition can be appropriately selected depending on the kind thereof.

When the curable resin composition to be the resin layer 13 is coated on the support plate 12, the applied amount of coating is preferably 1 to 100 g / m 2, more preferably 5 to 20 g / m 2.

For example, in the case of forming the resin layer 13 from the curable resin composition of the addition reaction type silicone, the curable resin composition comprising the mixture of the alkenyl polysiloxane and the organohydrogenpolysiloxane and the catalyst is subjected to the spray- , And is then heated and cured. The heat curing conditions vary depending on the blending amount of the catalyst. For example, when 2 parts by mass of the platinum-based catalyst is blended with respect to 100 parts by mass of the total amount of the alkenyl polysiloxane and the organohydrogenpolysiloxane, Deg.] C, preferably 100 [deg.] C to 200 [deg.] C. In this case, the reaction time is 5 to 60 minutes, preferably 10 to 30 minutes. In order to obtain a silicone resin layer having low silicone transferability, it is preferable to advance the curing reaction as far as possible so that unreacted silicon components do not remain in the silicone resin layer. The above reaction temperature and reaction time are preferable because almost no unreacted silicon component can be left in the silicone resin layer. When the reaction time is excessively longer than the above-mentioned reaction time or the reaction temperature is excessively high, oxidative decomposition of the silicone resin occurs at the same time, and a silicon component with a low molecular weight is generated, and silicon migration property may be enhanced. It is also preferable to advance the curing reaction as far as possible so that the unreacted silicon component remains in the silicone resin layer, in order to improve the peelability after the heat treatment.

Further, for example, when the resin layer 13 is produced by using a curable resin composition to be a silicone resin for a release paper, the curable resin composition coated on the support plate 12 is heated and cured to form a silicone resin layer. By thermally curing the curable resin composition, the silicone resin is chemically bonded to the support plate 12 during the curing reaction. Further, the silicone resin layer is bonded to the support plate 12 by the anchor effect. By these actions, the silicone resin layer is firmly fixed to the support plate 12.

(Close contact method)

The resin layer 13 formed on the support may be peelably adhered to the device substrate 11 by any known method. For example, the device substrate 11 may be laminated on the releasable surface of the resin layer 13 under atmospheric pressure, and then the resin layer 13 and the device substrate 11 may be pressed together using a roll or press have. It is preferable that the resin layer 13 and the device substrate 11 are more closely contacted with each other by a roll or a press. Bubbles mixed in between the resin layer 13 and the device substrate 11 can be relatively easily removed by pressing by roll or press, which is preferable.

It is more preferable that the resin layer 13 formed on the support and the device substrate 11 are pressed together by a vacuum laminating method or a vacuum press method because the suppression of mixing of bubbles and the securing of good adhesion are more preferable. Even when minute bubbles remain, there is an advantage that bubbles do not grow due to heating, and it is difficult to lead to distortion defects in the device substrate 11 by pressing under vacuum.

When the resin layer 13 is brought into close contact with the device substrate 11 in a peelable manner, the surfaces of the resin layer 13 and the device substrate 11 which are in contact with each other are thoroughly cleaned and laminated in an environment with high cleanliness . Even if foreign matters are mixed in between the resin layer 13 and the device substrate 11, the resin layer 13 is deformed, so that the flatness of the surface of the device substrate 11 is not affected. However, the higher the cleanliness, It is preferable.

The order of the step of fixing the resin layer 13 on the support plate 12 and the step of adhering the resin layer 13 to the device substrate 11 in a releasable manner is not limited and may be, for example, substantially the same .

(Cutting of the laminate block)

The concave groove 15 may be formed on the outer peripheral surface 14 of the laminated body block 10 thus obtained. For example, as shown in Fig. 2, when the device substrate 11 and the support plate 12 are chamfered, or when the resin layer 13 is coated with the liquid resin composition on the support plate 12 and thermally cured The concave grooves 15 are formed on the outer circumferential surface 14 of the laminate block 10 because the outer circumferential surfaces of the device substrate 11, the support plate 12 and the resin layer 13 are rounded.

In the present embodiment, as shown in Fig. 1, the method of manufacturing a laminated body has a step of cutting the laminated block to a predetermined dimension and planarizing at least a part of the circumferential direction of the outer peripheral face of the laminated block (step S11) . More specifically, the laminate block is cut to a predetermined size, and at least a part of the circumferential direction of the laminate block (preferably the entire circumferential direction) is removed, and at least a part of the circumferential direction of the laminate block Preferably, the circumferential overall circumference is flattened.

The laminate block 10 may be cut by a general method. For example, a scribe line is formed by using a blade, a laser, or the like on a main surface of at least one of a device substrate and a support plate, a method of cutting with a blade, a method of melting and cutting with a high- And a method of dividing and cutting the same. These cutting methods are used alone or in combination. The term " cutting " includes melting cutting and division cutting.

The cutting method is appropriately selected depending on the type and thickness of the device substrate 11, the support plate 12, and the resin layer 13, and the like. For example, in the case where the device substrate 11 or the support plate 12 is made of glass, a scribe line is formed on the glass main surface, and then the stacked block 10 is bent and deformed to divide and cut along the scribe line . In the case where the device substrate 11 and the support plate 12 are made of glass, a scribe line is formed on the main surfaces of both glass substrates, and then the laminate block 10 is bent and deformed to be divided and cut along both scribe lines Method is preferable. In the case of the split cutting, it is preferable that the thickness of the resin layer 13 is 50 占 퐉 or less. If the resin layer 13 is excessively thick, it is difficult to cut the resin layer.

The cutting direction may be a direction from the device substrate 11 to the support plate 12 or a direction from the support plate 12 to the device substrate 11. Further, the cutting direction may be one direction or two directions. It is also preferable that the cutting direction is substantially parallel to the thickness direction of the laminate block (that is, the thickness direction of the resin layer). This is because the exposed area of the resin layer 13 can be reduced and deterioration of the resin layer 13 due to the heat treatment in the device manufacturing process can be suppressed.

Fig. 3 is a partial side view of the laminated block after the peripheral surface planarization in the first embodiment of the present invention. Fig. The laminate block 10A of Fig. 3 is obtained by cutting the laminate block 10 along line A-A 'in Fig. The device substrate 11A after the planarization, the support plate 12A and the resin layer 13A correspond to the device substrate 11, the support plate 12 and the resin layer 13 before planarization, respectively.

The laminated block 10A after the planarization has the resin layer 13A interposed between the device substrate 11A and the support plate 12A. The resin layer 13A is in close contact with the first main surface 111A of the device substrate 11A in a detachable manner and is fixed on the support plate 12A. In addition, a device member is formed on the second main surface 112A of the device substrate 11A in detail, as will be described later.

The outer peripheral surface 14A of the laminated block 10A after planarization is flat as shown in Fig. 3, and the recessed groove 15 (see Fig. 2) is removed.

However, when such concave groove 15 exists, the coating liquid such as a resist solution tends to invade by the capillary phenomenon in the device manufacturing process and is likely to be stored. The coating liquid stored in the concave groove (15) is difficult to be removed by washing, and the residue easily remains after drying. Since this residue becomes an oscillation source in the heat treatment process in the device manufacturing process, the oscillation causes contamination of the heat treatment process and deteriorates the yield of the device as a product.

In the present embodiment, since the concave groove 15 is removed, the residue of the coating liquid is hardly stored in the device manufacturing process. Therefore, the oscillation can be suppressed in the heat treatment process, and the lowering of the yield of the device, which is a product, can be suppressed.

(Chamfer of the laminate block)

As shown in Fig. 1, the method of manufacturing a laminated body may further include a step (step S12) of chamfering a corner of the flattened portion of the outer peripheral surface of the laminated body block. The impact resistance and safety can be improved by chamfering.

When chamfering the corners of the laminate block before planarizing the outer circumferential surface of the laminate block, if the concave groove exists on the outer circumferential surface of the laminate block, the end of the device substrate or the end of the support plate may be bent and damaged.

In the present embodiment, the outer peripheral surface of the laminate block is planarized, and then the corners of the laminate block are chamfered, so that the recessed grooves are removed in advance. This makes it possible to suppress the end of the device substrate or the end of the support plate from being bent and broken at the time of chamfering.

The chamfering method may be a general method. For example, a method of using a chamfering device such as a grinder can be mentioned. As shown in Fig. 4, the chamfer may be a chamfer for machining the flattened corner portions 110 and 120 into a flat surface, and the chamfered portions 110 and 120 may be chamfered The chamfer may be a chamfer for machining the corner portions 110 and 120 after the planarization by a combination of a flat surface and an arcuate surface, as shown in Fig. 6, and is not particularly limited. Further, the resin layer may be chamfered by cutting off the resin layer, or may be chamfered without cutting the resin layer.

The chamfer dimension is appropriately selected in accordance with the type and thickness of the device substrate, the support plate, and the resin layer. R chamfer, the curvature radius R1 on the device substrate side and the curvature radius R2 on the support plate side may be the same or different. When the corner portion is processed into a flat surface, the chamfer angle? 1 on the device substrate side and the chamfer angle? 2 on the support plate side may be the same or different.

After the chamfering, it is preferable that the planarized portion of the outer circumferential surface of the resin layer is substantially parallel to the thickness direction of the resin layer. Thus, the exposed area of the resin layer can be reduced.

If the exposed area of the resin layer is large, the resin layer is easily deteriorated by the heat treatment in the manufacturing process of the device.

In this embodiment, since the exposed area of the resin layer can be reduced, deterioration of the resin layer in the device manufacturing process can be suppressed.

7 is a partial side view of the laminated block after chamfering according to the first embodiment of the present invention. In Fig. 7, the shape of the laminate block before chamfering is indicated by a dotted line. The laminate block 10B of Fig. 7 is obtained by R-chamfering both corner portions of the cut surface of the laminate block 10A of Fig. The device substrate 11B, the support plate 12B and the resin layer 13B after chamfering correspond to the device substrate 11A, the support plate 12A, and the resin layer 13A before chamfering, respectively.

The laminated block 10B after chamfering is provided with a resin layer 13B interposed between the device substrate 11B and the support plate 12B. The resin layer 13B is in close contact with the first main surface 111B of the device substrate HB and is fixed on the support plate 12B.

As shown in Fig. 7, the laminated block 10B after chamfering is excellent in impact resistance and safety since the outer peripheral face 14B has a round shape.

The outer peripheral surface 134B of the resin layer 13B is substantially parallel to the thickness direction of the resin layer 13B (the direction of the arrow A in Fig. 7) of the laminate block 10B after the chamfering, The exposed area of the resin layer 13B is small. As a result, the resin layer 13B can be prevented from being deteriorated by the heat treatment in the manufacturing process of the device.

(Polishing of laminated block)

As shown in Fig. 1, when the device substrate is a glass substrate manufactured by a float process, the method of manufacturing a laminate includes a polishing step (hereinafter referred to as a polishing step) for polishing the second main surface of the device substrate after chamfering Step S13). Here, the glass substrate produced by the float method includes a glass substrate obtained by pulling the glass substrate produced by the float method by the lead-down method to further reduce the thickness.

The float method is a method in which a molten glass is flowed out on a molten tin in a float bath and flows in a downstream direction to be formed into a strip-shaped glass. The glass plate is cut to produce a glass substrate, but minute unevenness and curvature are generated on the surface of the glass substrate.

By polishing in the polishing step, minute unevenness and bending can be removed from the surface of the glass substrate, and the flatness of the surface on which the device member is formed can be improved. Therefore, the reliability of the device, which is a product, can be increased. This effect is remarkable when the thickness of the glass substrate is 0.03 to 0.3 mm. A glass substrate having a thickness of 0.03 to 0.3 mm is difficult to polish by itself, and it is difficult to polish the glass substrate before it is formed into a laminated block.

However, when the second main surface of the device substrate is polished before planarization, if the concave groove exists on the outer peripheral surface of the laminate block, the abrasive may not enter the concave groove and may not fall off, or the device substrate may be bent and broken. Further, even after the flattening, sharp corners of the device substrate are liable to be broken when the second main surface of the device substrate is polished before chamfering.

In the present embodiment, since the second main surface of the device substrate is polished after chamfering (i.e., after planarization), the corners of the device substrate are pre-chamfered and the concave grooves are removed in advance. Therefore, it is possible to suppress the adhesion of the abrasive to the concave groove and the breakage of the device substrate at the time of polishing.

The polishing method may be a general method. For example, a polishing method using abrasive grains such as cerium oxide can be mentioned.

The polishing value is appropriately set depending on the thickness of the device substrate and the device to be used, but is, for example, 0.05 to 10 mu m.

8 is a partial side view of the laminated block after polishing according to the first embodiment of the present invention. In Fig. 8, the shape of the laminate block before polishing is shown by a dotted line. The laminate block 10C of Fig. 8 is obtained by polishing the second main surface 112B of the device substrate 11B of the laminate block 10B of Fig. The device substrate 11C after polishing corresponds to the device substrate 11B before polishing.

The laminated block 10C after polishing has a resin layer 13B interposed between the device substrate 11C and the support plate 12B. The resin layer 13B is in close contact with the first main surface 111C of the device substrate 11C in a detachable manner and is fixed on the support plate 12B.

The laminate block 10C after polishing has a higher flatness and cleanliness of the second main surface 112C on which the device member is formed, as compared with the laminate block 10B before polishing.

(Device Manufacturing Method)

 Fig. 9 is a process diagram showing a manufacturing method of a device according to the first embodiment of the present invention.

A method of manufacturing a device includes a step (step S61) of forming a device member using a coating liquid on a second main surface of a device substrate of a laminated block (laminate) after planarization, a step of peeling the device substrate and a resin layer (Step S62). Here, the laminated block (laminate) after planarization naturally includes a laminate block (laminate) after the chamfering and a laminate block (laminate) after polishing.

The member for a device is a member that is formed on a second main surface of the device substrate and constitutes at least a part of the device. The device-use member may be a part (hereinafter referred to as " part member ") of the entire member rather than all of the member finally formed on the second main surface of the device substrate (hereinafter referred to as the " This is because the device substrate with a partial member, which is peeled off from the resin layer, can be used as a device substrate with an entire member in a subsequent step. Thereafter, the device is manufactured using the entire member-attached device substrate. Further, another device member may be formed on the peeling surface (first main surface) of the entire device-attached device substrate peeled from the resin layer. Further, the device can be manufactured by assembling the device using the whole member-mounted laminate, then peeling the resin-layer-attached supporting plate with the laminate with the whole member. It is also possible to manufacture the device by assembling the device by using two sheets of the whole member stacked layers and then peeling the two sheets of the resin layer stacked with the stack of the whole members.

The method for peeling the device substrate and the resin layer may be any known method. For example, a separating blade is inserted between the device substrate and the resin layer, and then a fluid mixed with compressed air and water is injected at the position where the separating blade is inserted. In this state, one main surface of the laminate is maintained flat, and the other main surface is deformed so as to bend sequentially in the vicinity of the insertion position. In this manner, the device substrate and the resin layer can be peeled off.

10 is a process diagram of a manufacturing method of an LCD according to the first embodiment of the present invention. In this embodiment mode, a method of manufacturing a TFT-LCD is described, but the present invention may be applied to a method of manufacturing an STN-LCD, and there is no limitation on the type or method of the liquid crystal panel.

A manufacturing method of a TFT-LCD is a method of manufacturing a metal film and a metal film formed by a general film-forming method such as a CVD method and a sputtering method using a resist solution on a second main surface of a device substrate of a laminated block (laminate) (Step S71) of forming a thin film transistor (TFT) by patterning with an oxide film or the like on the second main surface of the device substrate of another laminated block (laminate) after another planarization, (Step S72) of laminating the device substrate with the TFT and the device substrate with the CF (step S73), and a step of peeling the device substrate and the resin layer (step S74). The order of the TFT forming step (step S71) and the CF forming step (step S72) is not limited, and may be substantially simultaneous. The peeling step (step S74) may be carried out before the laminating step (step S73), or during the TFT forming step or the CF forming step.

In the TFT forming step and the CF forming step, TFTs or CFs are formed on the second main surface of the device substrate by using well-known photolithography or etching techniques. At this time, a resist solution is used as a coating liquid for pattern formation.

Further, the second main surface of the device substrate may be cleaned, if necessary, before forming the TFT or CF. As the cleaning method, well-known dry cleaning or wet cleaning can be used.

In the lamination step, a liquid crystal material is injected between the laminate of TFT-attached laminate and CF laminate, and laminated. As a method of injecting the liquid crystal material, for example, there are a reduced pressure injection method and a dropping injection method.

In the reduced-pressure injection method, for example, a sealing material and a spacer material are first used to bond the two stacked layers so that the face where the TFT exists and the face where the CF exists are opposed to each other. Then, the two resin layer-attached support plates are peeled off from both stacked bodies. Thereafter, the bonded device substrates are cut into a plurality of cells. After setting the inside of each cut cell to a reduced pressure atmosphere, a liquid crystal material is injected into each cell from the injection hole, and the injection hole is sealed. Then, a polarizing plate is attached to each cell, and a backlight or the like is built in to manufacture a liquid crystal panel.

In the present embodiment, two resin layer-attached support plates are peeled off from both stacks, and then both device substrates bonded together are cut into a plurality of cells. However, the present invention is not limited to this. For example, before attaching the two laminated bodies using the sealing material and the spacer material, the resin-layer-attached supporting plate may be peeled from each laminated body.

In the dropping injection method, for example, a liquid crystal material is first dropped on either one of the two stacked layers, and both the stacked layers are stacked by using a sealing material and a spacer material, . Then, the two resin layer-attached support plates are peeled off from both stacked bodies. Thereafter, the stacked device substrates are cut into a plurality of cells. Then, a polarizing plate is attached to each cell, and a backlight or the like is built in to manufacture a liquid crystal panel.

The manufacturing method of the liquid crystal panel may further include a step (step S75) of thinning the glass substrate by a chemical etching treatment after peeling the resin substrate-attached support plate from the glass substrate as the device substrate. Since the first main surface of the glass substrate is protected by the support plate, etch pits are less likely to be generated even if the etching process is performed.

In the example shown in Fig. 10, one laminate is used for each of the TFT-equipped device substrate and the CF-attached device substrate, but the present invention is not limited thereto. For example, a laminate may be used for manufacturing a substrate of either a TFT-attached device substrate or a CF-attached device substrate.

11 is a process diagram of a manufacturing method of an organic EL panel (OLED) according to the first embodiment of the present invention.

A method of manufacturing an organic EL panel includes a step (step S81) of forming an organic EL element on a second main surface of a device substrate of a laminated body after planarization using a resist solution for forming a pattern (step S81) (Step S82), and a step of peeling off the device substrate and the resin layer (step S83). The peeling step (step S83) may be either before the laminating step (step S82) or during the organic EL element forming step (step S81).

In the organic EL element formation step, an organic EL element is formed on the second main surface of the device substrate by using a well-known photolithography technique, vapor deposition technique or the like. At this time, a resist liquid is applied as a coating liquid for pattern formation on the second main surface of the device substrate. The organic EL element is composed of, for example, a transparent electrode layer, a hole transporting layer, a light emitting layer, and an electron transporting layer.

Further, the second main surface of the device substrate may be cleaned, if necessary, before forming the organic EL device. As the cleaning method, for example, dry cleaning or wet cleaning may be used.

In the laminating step, for example, for the first time, the supporting plate with the resin layer is peeled off from the device substrate with the organic EL element. Thereafter, the device substrate with the organic EL element is cut into a plurality of cells. Subsequently, each cell and the counter substrate are bonded so that the organic EL element and the counter substrate are in contact with each other. Thus, an organic EL display is manufactured.

Thus produced display panels such as LCDs and OLEDs are not particularly limited in their use but are suitably used for portable electronic devices such as cellular phones, PDAs, digital cameras, game machines, and the like.

(Second Embodiment)

The second embodiment relates to a laminate block before planarization.

12 is a partial side view of the laminated block before planarization in the second embodiment of the present invention. 12, the laminate block 20 before planarization is formed by interposing a resin layer 23 between the device substrate 21 and the support plate 22. As shown in Fig. The resin layer 23 is in close contact with the first main surface 211 of the device substrate 21 in a detachable manner and is fixed on the support plate 22.

The support plate 22 is larger than the resin layer 23 and the resin layer 23 is larger than the device substrate 21. 12, since the outer circumferential surface of the device substrate 21 has a rounded shape, the outer circumferential surface 24 of the laminate block 20 is formed with a concave groove (not shown) 25 are formed.

In this case also, by cutting the laminate block 20 along line A-A 'in Fig. 12, the outer peripheral surface 24 of the laminate block 20 can be flattened, and the concave groove 25 can be removed have.

However, when the laminate block 20 is cut along the line B-B 'or C-C' in FIG. 12, since the outer circumferential surface 24 of the laminate block 20 can not be flattened, ).

In this case, residues of the coating liquid easily remain in the manufacturing process of the device due to the remaining concave groove 25. Since this residue becomes an oscillation source in the heat treatment process in the device manufacturing process, the oscillation causes contamination of the heat treatment process and deteriorates the yield of the device as a product.

In this embodiment, since the concave groove 25 can be removed, the oscillation can be suppressed in the manufacturing process of the device, and the lowering of the yield of the device as a product can be suppressed.

(Third Embodiment)

13 is a partial side view of a laminated block before planarization in the third embodiment of the present invention. As shown in Fig. 13, the laminate block 30 before planarization is formed by interposing a resin layer 33 between the device substrate 31 and the support plate 32. As shown in Fig. The resin layer 33 is in close contact with the first main surface 311 of the device substrate 31 in a detachable manner and is fixed on the support plate 32.

The resin layer 33 is smaller than the device substrate 31 and the support plate 32. [ As a result, the concave groove 35 is formed on the outer peripheral surface 34 of the laminate block 30, as shown in Fig.

Also in this case, the outer peripheral surface 34 of the laminate block 30 can be flattened by cutting the laminate block 30 along line A-A 'in Fig. 13, and the concave groove 35 can be removed have.

When the laminate block 30 is cut along the line B-B 'or C-C' in FIG. 13, the outer circumferential surface 34 of the laminate block 30 can not be flattened, ) Are partially or wholly remaining.

In this case, a residue of the coating liquid tends to remain in the manufacturing process of the device due to a part or the whole of the concave groove 35 remaining. This residue becomes an oscillation source in the heat treatment process in the device manufacturing process, so that the oscillation contaminates the heat treatment process and lowers the yield of the device as a product.

In the present embodiment, since the concave groove 35 can be removed, oscillation can be suppressed in the manufacturing process of the device, and deterioration of device yield, which is a product, can be suppressed.

Example

Hereinafter, the present invention will be described in detail by way of examples and the like, but the present invention is not limited to these examples.

(Example 1)

As the support plate, a glass plate (AN100, non-alkali glass made by Asahi Glass Co., Ltd.) having a length of 370 mm x 320 mm x 0.6 mm obtained by the float method was used. The average linear expansion coefficient of this glass plate was 38 x 10 < ^-7 > / deg.

This glass plate was cleaned with pure water and UV-cleaned to clean the surface of the glass plate. Thereafter, a mixture of 100 parts by mass of solvent-free addition reaction type silicone (KNS-320A, manufactured by Shinetsu Silicone Co., Ltd.) and 5 parts by mass of a platinum-based catalyst (CAT- (Coating amount 20 g / m < 2 >).

The reactive solvent of the present invention is a reaction product of a straight chain organoalkenyl polysiloxane (subject) having a vinyl group and a methyl group bonded to a silicon atom and a straight chain organohydrogenpolysiloxane (crosslinking agent) having a hydrogen atom bonded to a silicon atom and a methyl group .

The mixture coated and applied on the glass plate was heated and cured at 180 ° C for 10 minutes in air to form a resin layer having a length of 366 mm and a width of 316 mm on a glass plate and fixed.

On the other hand, as the device substrate, a resin substrate (Sumilite FS-5300 manufactured by Sumitomo Bakelite Co., Ltd.) having a length of 370 mm x 320 mm x 0.1 mm thick made of polyethersulfone was used. The average linear expansion coefficient of the resin substrate was 540 x 10 < ^-7 > / DEG C.

The resin substrate was cleaned with pure water and UV-cleaned to clean the surface of the resin substrate. Thereafter, the resin substrate and the glass plate were aligned, and then the resin layer fixed on the glass plate was brought into close contact with the first main surface of the resin substrate at room temperature using a vacuum press apparatus.

Thus, a laminate block substantially identical to the laminate block shown in Fig. 2 was obtained. The obtained laminate block was cut in the thickness direction, and the outer peripheral portion of the laminate block was removed with a width of 10 mm over the entire circumferential direction. Specifically, the resin substrate and the resin layer are cut in the thickness direction by using a cutter knife, and a scribe line is formed on the main surface of the glass plate by using a glass cutter. Then, the laminate block is bent and deformed to follow the scribe line And the outer peripheral portion of the laminate block was removed over the entire circumferential direction.

In this state, the outer circumferential surfaces of the resin substrate, the glass plate, and the resin layer were aligned over the entire circumferential direction, and the outer circumferential surface of the laminate block was planarized over the entire circumferential direction. Further, no concave groove was found on the outer peripheral surface of the laminate block.

Subsequently, the laminated block after the planarization was immersed in a resist solution for a black matrix for CF (PMA-ST, manufactured by Asahi Glass Co., Ltd.), followed by washing with propylene glycol monomethyl ether acetate (main solvent for resist solution). Thereafter, the resultant was dried in a hot air oven at 120 DEG C for 30 minutes, and the outer peripheral surface of the laminate was observed under a microscope. No residue of the resist solution was observed.

(Example 2)

Example 2 was the same as Example 1 except that a glass plate (AN100, non-alkali glass made by Asahi Glass Co., Ltd.) having a length of 370 mm x 320 mm x 0.4 mm obtained by a float method was used as the support plate, A resin layer was formed on a glass plate and fixed.

In Example 2, a glass substrate (AN100, non-alkali glass made by Asahi Glass Co., Ltd.) having a length of 370 mm x 320 mm x 0.3 mm obtained by a float method was used as the device substrate, The resin layer fixed on the glass plate was brought into close contact with the first main surface of the glass substrate.

Thus, a laminate block substantially identical to the laminate block shown in Fig. 2 was obtained. The obtained laminate block was cut in the thickness direction, and the outer peripheral portion of the laminate block was removed to a width of 10 mm over the entire circumferential direction. Specifically, a scribe line is formed on the second main surface of the glass substrate by using a glass cutter, a scribe line is formed on the main surface of the glass sheet by using a glass cutter, and then the laminate block is bent and deformed to form a scribe line And the outer peripheral portion of the laminate block was removed over the entire circumferential direction.

In this state, the outer circumferential surfaces of the glass substrate, the glass plate, and the resin layer were aligned over the entire circumferential direction, and the outer circumferential surface of the laminate block was planarized over the entire circumferential direction. Further, no concave groove was found on the outer peripheral surface of the laminate block.

The corner portion of the outer circumferential surface of the laminated block was chamfered over the entire circumferential direction using a grinding wheel. The chamfer dimension was defined as radius of curvature R = 0.4 (unit: mm).

Then, in the same manner as in Example 1, the chamfered laminate block was immersed in the resist solution, washed, and dried, and then the outer peripheral surface of the laminate was observed under a microscope. As a result, residues of the resist solution were not confirmed.

(Comparative Example 1)

In Comparative Example 1, the laminated block before cutting obtained in the same manner as in Example 2 was immersed in the resist solution in the same manner as in Example 1, washed and dried, and then the outer peripheral surface of the laminated body was observed under a microscope. As a result, residues of the resist solution were confirmed.

Although the present invention has been described in detail with reference to specific embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the present invention.

This application is based on Japanese Patent Application No. 2010-012785 filed on January 25, 2010, the contents of which are incorporated herein by reference.

10: laminated block
11: Device substrate
111: first main surface
112: 2nd week
12: Support plate
13: Resin layer
14:
15: concave groove

Claims (8)

A method of manufacturing a laminate used for manufacturing a device,
A resin layer is interposed between a glass substrate board and a glass support plate and the resin layer is peelably adhered to the first main surface of the device substrate and the laminate block fixed on the support plate is cut to a predetermined dimension, And a step of planarizing at least a part of the circumferential direction of the outer circumferential surface of the laminate block,
And removing the concave groove existing on the outer periphery of the block of the laminate by the above process. The method according to claim 1, further comprising a step of chamfering a corner of the planarized portion of the outer circumferential surface of the laminate block. The method according to claim 2, wherein the device substrate is a glass substrate manufactured by a float process,
And polishing the second main surface of the device substrate after chamfering the corner portion. The method according to any one of claims 1 to 3, wherein the planarized portion of the outer circumferential surface of the resin layer is parallel to the thickness direction of the resin layer. The method of manufacturing a laminated body according to any one of claims 1 to 3, wherein the device substrate is a glass substrate having a thickness of 0.03 mm or more and less than 0.8 mm. The method according to any one of claims 1 to 3, wherein the resin layer comprises at least one member selected from the group consisting of an acrylic resin, a polyolefin resin, a polyurethane resin, and a silicone resin. The method for producing a laminate according to any one of claims 1 to 3, wherein the resin layer has a thickness of 5 to 50 탆. In a laminate used for manufacturing a device,
A resin layer is interposed between a glass substrate board and a glass support plate, the resin layer is brought into close contact with the first main surface of the device substrate in a peelable manner, and the laminate block fixed on the support plate is cut to a predetermined dimension, Wherein at least a part of a circumferential direction of the outer circumferential surface of the laminate block is planarized to thereby remove concave grooves existing on the outer periphery of the laminate block.

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