JP2010018505A - Glass laminate, panel for display device with supporting body, panel for display device, display device, and methods for manufacturing them - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a glass laminate which suppresses the generation of glass defects caused by foreign matter such as air bubbles or dust mixed into between glass substrates, and can be treated by an existing manufacturing line without generating etch-pits, and in which a closely adhered thin glass substrate and a resin layer can be easily separated in a short time. <P>SOLUTION: The glass laminate 10 has a thin glass substrate 12 having a first main surface and a second main surface, a supporting glass substrate 13 having a first main surface and a second main surface, and a resin layer 14 having easy peelability. In the glass laminate 10, the resin layer 14 fixed to the first main surface of the supporting glass substrate 13 is closely adhered to the first main surface of the thin glass substrate 12. The glass laminate 10 also has at least one recessed portion 15 at an end part of the supporting glass substrate. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention includes a glass laminate including a glass substrate used for a liquid crystal display device, an organic EL display device and the like, a display device-equipped panel including the same, a display device panel formed using the same, and the display device panel The present invention relates to a display device and a manufacturing method thereof.

  In the field of liquid crystal display devices (LCD), organic EL display devices (OLED), especially portable display devices such as mobile phones and mobile phones, weight reduction and thinning of display devices are important issues.

In order to cope with this problem, it is desired to further reduce the thickness of the glass substrate used in the display device. As a method of reducing the plate thickness, generally, before or after forming the display device member on the surface of the glass substrate, the glass substrate is etched using hydrofluoric acid or the like, and further physically polished as necessary. A thinning method is performed.
However, if the glass substrate is thinned by performing an etching process or the like before forming the display device member on the surface of the glass substrate, the strength of the glass substrate is lowered and the amount of deflection is increased. For this reason, there arises a problem that it becomes difficult to perform processing in an existing display panel panel production line.
In addition, if the glass substrate is thinned by performing an etching process after forming the display device member on the surface of the glass substrate, the fineness formed on the surface of the glass substrate in the process of forming the display device member on the surface of the glass substrate. There arises a problem in that a simple flaw appears, that is, a problem that etch pits occur.

  Therefore, for the purpose of solving such problems, a thin glass substrate (hereinafter also referred to as “thin glass substrate”) is bonded to another supporting glass substrate to form a laminate, and the display is performed in that state. A method of performing a predetermined process for manufacturing the apparatus and then separating the thin glass substrate and the supporting glass substrate has been proposed.

For example, in Patent Document 1, a product glass substrate and a reinforcing glass substrate are bonded and integrated using electrostatic adsorption force or vacuum adsorption force between glass substrates, and a display using the product glass substrate is used. A method of manufacturing the device is described.
For example, Patent Document 2 describes a method for manufacturing a liquid crystal display device in which the ends of a substrate and a support of a liquid crystal display device are bonded using a glass frit adhesive, and then an electrode pattern or the like is formed. ing.
For example, Patent Document 3 describes a method for manufacturing a substrate for a display device, which includes a step of irradiating a laser beam to at least the vicinity of the peripheral surface of two glass substrates to fuse the two glass substrates. .

For example, in Patent Document 4, substrate transfer is performed by attaching a substrate to a substrate transfer jig in which an adhesive layer is provided on a support, and transferring the substrate transfer jig through a manufacturing process of a liquid crystal display element. A manufacturing method of a liquid crystal display device is described in which liquid crystal display element formation processing is sequentially performed on a substrate attached to a jig for use, and the substrate is peeled off from the substrate carrying jig after completing a predetermined process.
For example, Patent Document 5 discloses that an electrode substrate for a liquid crystal display element is subjected to a predetermined process on the electrode substrate for a liquid crystal display element using a jig in which an ultraviolet curable pressure-sensitive adhesive is provided on a support, and then cured with an ultraviolet ray. A method for producing a liquid crystal display element, comprising: irradiating a mold adhesive with ultraviolet rays to reduce the adhesive strength of the ultraviolet curable adhesive and peeling the liquid crystal display element electrode substrate from the jig. Are listed.
For example, Patent Document 6 describes a transport method in which a thin plate is temporarily fixed to a support plate with an adhesive material, a peripheral portion of the adhesive material is sealed with a seal material, and the support plate on which the thin plate is temporarily fixed is transported. .

For example, Patent Document 7 discloses a thin glass laminate obtained by laminating a thin glass substrate and a supporting glass substrate, and the thin glass and the supporting glass have easy peelability and non-adhesiveness. A thin glass laminate characterized by being laminated via a silicone resin layer is described. Then, in order to separate the thin glass substrate and the supporting glass substrate, it is only necessary to apply a force to pull the thin glass substrate vertically away from the supporting glass substrate. It is described that it can be more easily peeled off by injecting air into the interface.
For example, Patent Document 8 discloses a thin glass laminate obtained by laminating a thin glass substrate and a supporting glass substrate, and the thin glass substrate and the supporting glass substrate are easily peelable and non-adhesive. A thin glass laminate comprising: a laminated silicone resin layer having at least one hole communicating with the silicone resin layer and the supporting glass substrate. Are listed. Then, by injecting compressed gas into the interface between the thin glass substrate and the silicone resin layer through the holes provided in the support glass substrate, the thin glass substrate and the support are supported without applying stress that may cause the glass to break. It is described that it is possible to separate the glass substrate.

  Moreover, although it is not a glass laminated body, in patent document 9, the notch part is provided in the affixing sheet affixed on the product made from glass or this component, It is characterized by the above-mentioned. A sheet is described. And since the cut-in portion is folded to provide the cut-out portion, it is described that the tip of the tool for peeling is easy to enter and that the folded-up portion is easy to lift and can be easily peeled off. Yes.

JP 2000-241804 A JP 58-54316 A JP 2003-2160868 A Japanese Patent Laid-Open No. 8-86993 Japanese Patent Laid-Open No. 9-105896 JP 2000-252342 A International Publication No. 2007/018028 Pamphlet JP 2007-326358 A JP 2003-308019 A

  However, a method of fixing glass substrates described in Patent Document 1 using electrostatic adsorption force or vacuum adsorption force, a method of fixing both ends of a glass substrate described in Patent Document 2 using glass frit, or a patent In the method of merging two glass substrates by irradiating laser light near the end face of the peripheral edge described in Document 3, glass substrates are laminated and adhered without any intermediate layer, and thus mixed between glass substrates. Distortion defects occur in the glass substrate due to foreign matters such as bubbles and dust. Therefore, it is difficult to obtain a glass substrate laminate having a smooth surface.

  Moreover, in the method of disposing an adhesive layer or the like between the glass substrates described in Patent Documents 4 to 6, both glass substrates can be avoided although the occurrence of distortion defects due to mixing of bubbles or the like between the glass substrates as described above can be avoided. Is difficult to separate, and the thin glass substrate may be damaged during the separation. Further, the remaining adhesive on the thin glass substrate after separation also becomes a problem.

On the other hand, according to the thin glass laminate described in Patent Document 7, a distortion defect due to mixing of bubbles or the like between the glass substrates as described above hardly occurs. It is also possible to peel the thin glass substrate and the supporting glass substrate. Furthermore, the problem of remaining adhesive on the thin glass substrate after separation is solved. However, it is desirable to separate both glass substrates more easily and in a shorter time. In particular, when the glass substrate is large, it is an important point for industrial use.
In the case of the glass laminate described in Patent Document 8, in the heat treatment step for forming a film or the like on the thin glass substrate, the portion in contact with the silicone resin layer and the portion in contact with the hole in the thin glass substrate. In addition, there is a drawback that traces of film are easily generated due to a difference in heat capacity.

  In addition, when forming a glass laminate as described above, it is usually set in a press machine in a vacuum lamination press method, that is, in a state where a supporting glass substrate and a thin glass substrate are temporarily laminated via a resin layer, and evacuated. Although the method of pressing after reducing pressure is applied, there is a problem that bubbles between the thin glass substrate and the resin layer remain even if pressed. In particular, it becomes remarkable when the size of the thin glass substrate is large. As a countermeasure for this, for example, by adsorbing and holding the thin glass substrate to the upper pressing means, while maintaining a gap between the supporting glass substrate and the thin glass substrate, the space where both substrates exist is evacuated, and then A method of bringing both substrates into contact and pressing can be considered. However, in this case, since the thin glass substrate cannot be adsorbed and held by the pressurizing means by the vacuum adsorption method, it is held by the electrostatic adsorption method as an existing alternative method. However, the electrostatic adsorption device is very expensive.

  Note that Patent Document 9 describes an adhesive sheet that can be easily peeled off, and is not related to the glass laminate.

The present invention has been made in view of the above problems. That is, firstly, a first object of the present invention is to provide a glass laminate that can easily and quickly separate a thin glass substrate and a resin layer that are in close contact with each other.
In addition, a second object of the present invention is to provide a method capable of easily and economically manufacturing the glass laminate as described above without causing foreign substances such as bubbles and dust between the glass substrates. With the goal.
Moreover, it aims at providing the panel for display apparatuses with a support body containing such a glass laminated body. It is another object of the present invention to provide a display device panel and a display device which are formed using such a support-equipped display device panel.
Furthermore, it aims at providing the method for manufacturing such a display device panel with a support, a display device panel, and a display device.

The present inventor has intensively studied in order to solve the above problems, and has completed the present invention.
The present invention includes the following (1) to (16).
(1) A thin glass substrate having a first main surface and a second main surface, a supporting glass substrate having a first main surface and a second main surface, and a resin layer, and on the first main surface of the thin glass substrate, A glass laminate having an easily peelable resin layer fixed to the first main surface of the support glass substrate, the glass laminate having one or more recessed portions at an end of the support glass substrate. .
(2) The glass laminate according to (1) above, wherein the area of the recessed portion is 5 mm ² or more per location.
(3) The glass laminate according to (1) or (2), wherein the resin layer is an acrylic resin layer, a polyolefin resin layer, a polyurethane resin layer, or a silicone resin layer.
(4) The glass laminated body in any one of said (1)-(3) whose thickness of the said resin layer is 5-50 micrometers.
(5) The glass laminated body in any one of said (1)-(4) whose difference of the linear expansion coefficient of the said thin glass substrate and the said support glass substrate is 150 * 10 < ^-7 > / degrees C or less.
(6) The support glass substrate has three or more recessed portions, and the center of gravity of a polygon having each of the recessed portions as a vertex coincides with the center of gravity of the thin glass substrate. The glass laminate according to any one of 5).
(7) A display device-equipped panel having a display device member on the second main surface of the thin glass substrate in the glass laminate according to any one of (1) to (6).
(8) A display device panel formed using the support-equipped display device panel according to (7).
(9) A display device having the display device panel according to (8).

(10) A method for producing a glass laminate according to any one of (1) to (6) above, wherein a recessed portion forming step of forming a recessed portion at an end of the supporting glass substrate, and the supporting glass substrate A resin layer forming step of forming and fixing an easily peelable resin layer on the first main surface of the thin glass substrate, and being fixed on the first main surface of the supporting glass substrate to the first main surface of the thin glass substrate The manufacturing method of a glass laminated body which comprises the contact | adherence process which closely_contact | adheres the said resin layer.
(11) In the step of forming the recesses in the support glass substrate so that the center of gravity of the polygon having each recess as a vertex coincides with the center of gravity of the support glass substrate. The manufacturing method of the glass laminated body as described in said (10) which exists.
(12) A base having three or more pins arranged in the chamber, capable of projecting upward from the base surface and capable of being housed inside the base by applying a downward force. And the positional relationship between the pins on the surface of the base is the same as the positional relationship of the concave portions of the supporting glass substrate, and the positions of the pins and the concave portions are on the base. The supporting glass substrate to which the resin layer is fixed so as to overlap is placed with the resin layer as the upper side, and then the thin glass substrate and the resin layer are opposed to each other while maintaining a gap. The thin glass substrate is placed on the pins protruding upward, and then the inner space of the chamber where the thin glass substrate and the supporting glass substrate exist is brought into a negative pressure state. Board from top to bottom (10) or (11), which is a step of bringing the resin layer fixed on the first main surface of the supporting glass substrate into close contact with the first main surface of the thin glass substrate by pressing A method for producing a glass laminate.
(13) In the contact step, the center of gravity of the polygonal base surface having each of the pins as vertices coincides with the center of gravity of the first main surface of the thin glass substrate, (10) to (10) above. (12) The manufacturing method of the glass laminated body in any one of.
(14) In the manufacturing method according to any one of (10) to (13), a step of forming a display device member on the second main surface of the thin glass substrate in the obtained glass laminate. A method for manufacturing a panel for a display device with a support, which is provided.
(15) In the manufacturing method described in (14) above, a separation step of separating the thin glass substrate and the supporting glass substrate in the obtained display device-equipped display panel from the recessed portion as a starting point. A method for manufacturing a panel for a display device.
(16) A method for manufacturing a display device, further comprising the step of obtaining the display device by using the obtained display device panel in the manufacturing method according to (15).

The glass substrate obtained by this invention can isolate | separate the closely_contact | adhered thin glass substrate and resin layer easily and in a short time. The separated thin glass substrate can be processed in an existing display panel manufacturing line. Furthermore, according to the manufacturing method of the glass substrate of this invention, generation | occurrence | production of the glass defect by foreign materials, such as a bubble mixed between glass substrates and dust, and generation | occurrence | production of an etch pit can be suppressed.
As a result, it is possible to provide a method capable of easily and economically producing a glass laminate having almost no bubbles between glass substrates.
Moreover, the panel for display apparatuses with a support containing such a glass laminated body can be provided. In addition, it is possible to provide a display device panel and a display device that are formed using such a support-equipped display device panel.
Furthermore, a display device panel with a support, a display device panel, and a method for manufacturing the display device can be provided.

The present invention will be described.
The present invention includes a thin glass substrate having a first main surface and a second main surface, a supporting glass substrate having a first main surface and a second main surface, and a resin layer having easy peelability, the thin glass substrate A glass laminate in which the resin layer fixed to the first main surface of the support glass substrate is in close contact with the first main surface of the support glass substrate, and has at least one recessed portion at an end of the support glass substrate. It is a glass laminate.
Hereinafter, such a glass laminate is also referred to as “a laminate of the present invention”.

The laminated body of this invention is demonstrated using figures.
FIG. 1 is a schematic front view showing one embodiment of the laminate of the present invention, and FIG. 2 is a cross-sectional view (schematic cross-sectional view) taken along line AA ′.
One mode of the laminate of the present invention described here is also referred to as “mode 1” below.

In aspect 1, the laminate 10 of the present invention has a thin glass substrate 12, a supporting glass substrate 13, and a resin layer 14, and is laminated so that the resin layer 14 is sandwiched between both glass substrates.
As shown in FIG. 1, when viewed from the front, the thin glass substrate 12, the resin layer 14, and the support glass substrate 13 are each rectangular, and the main surface area of the thin glass substrate 12 is the same as the surface area of the resin layer 14. However, it is smaller than the main surface area of the supporting glass substrate 13. And the thin glass substrate 12 and the resin layer 14 are located so that it may be settled inside the support glass substrate 13, when it sees from the front.

  The resin layer 14 is fixed to the first main surface of the support glass substrate 13 and is in close contact with the first main surface of the thin glass substrate 12. In addition, the resin layer 14 is easily peelable from the first main surface of the thin glass substrate 12. Here, of the two main surfaces of the thin glass substrate 12, the main surface on the support glass substrate 13 side (resin layer 14 side) is the first main surface, and the main surface on the opposite side is the second main surface. It is. Of the two main surfaces of the supporting glass substrate 13, the main surface on the thin glass substrate 12 side (the side where the resin layer 14 is present) is the first main surface, and the opposite main surface is the second main surface. Surface.

  And the laminated body 10 of this invention in aspect 1 has the two recessed parts 15 in the edge part of the support glass substrate 13. FIG. In the case of aspect 1, it has the two recessed parts 15 in one side in four sides which the support glass substrate 13 at the time of seeing from the front has. In addition, in the first aspect, the recessed portion 15 has an elliptical half shape when viewed from the front. The recessed portion 15 is formed not only on the end portion of the supporting glass substrate 13 but also on the resin layer 14.

Next, another aspect of the laminate of the present invention will be described.
FIG. 3 is a schematic front view showing another embodiment of the laminate of the present invention, and FIG. 4 is a BB ′ sectional view (schematic sectional view) thereof.
One mode of the laminate of the present invention described here is also referred to as “mode 2” below.
Aspect 2 is the same aspect as Aspect 1. However, Aspect 2 is different from Aspect 1 in that the area of the recessed portion is slightly narrower and recessed portion 25 is not formed in resin layer 24.
About the other part of aspect 2, it is the same as that of aspect 1.

  The laminate of the present invention is, for example, the glass laminate of Embodiments 1 and 2 as described above.

  Next, each of the thin glass substrate, the supporting glass substrate, the resin layer, and the recessed portion included in the laminate of the present invention will be described.

The thin glass substrate will be described.
The thickness, shape, size, physical properties (heat shrinkage, surface shape, chemical resistance, etc.), composition, etc. of the thin glass substrate are not particularly limited. For example, a conventional glass substrate for a display device such as an LCD or OLED It may be the same.

  The thickness of the thin glass substrate is not particularly limited, but is preferably less than 0.7 mm, more preferably 0.5 mm or less, and further preferably 0.4 mm or less. Further, it is preferably 0.05 mm or more, more preferably 0.07 mm or more, and further preferably 0.1 mm or more.

  The shape of the thin glass is not limited, but is preferably rectangular.

  Although the magnitude | size of a sheet glass is not limited, For example, in the case of a rectangle, it may be 100-2000 mm x 100-2000 mm, and it is preferable that it is 500-1000 mm x 500-1000 mm.

  Even with such a preferable thickness and preferable size, the laminate of the present invention can easily peel the thin glass substrate and the supporting glass substrate.

Properties of the thin glass substrate such as thermal shrinkage, surface shape, chemical resistance, etc. are not particularly limited, and vary depending on the type of display device to be manufactured.
However, it is preferable that the thermal contraction rate of the thin glass substrate is small. Specifically, it is preferable to use a material having a linear expansion coefficient of 150 × 10 ⁻⁷ / ° C. or less, which is an index of heat shrinkage, more preferably 100 × 10 ⁻⁷ / ° C. or less, and 45 × 10 10. More preferably, it is ⁻⁷ / ° C. or lower. The reason is that it is difficult to make a high-definition display device when the thermal contraction rate is large.
In addition, in this invention, a linear expansion coefficient means a thing prescribed | regulated to JISR3102 (1995).

  The composition of the thin glass substrate may be the same as that of alkali glass or non-alkali glass, for example. Among these, alkali-free glass is preferable because of its low thermal shrinkage rate.

Next, the support glass substrate will be described.
The supporting glass substrate supports the thin glass substrate through the resin layer and reinforces the strength of the thin glass substrate.
Further, the supporting glass substrate has one or more recessed portions at its end. The “end portion” is a portion near the end face of the supporting glass substrate, and is also an outer edge portion when viewed from the front. The recessed portion will be described later.

  The thickness, shape, size, physical properties (heat shrinkage rate, surface shape, chemical resistance, etc.), composition, etc. of the supporting glass substrate are not particularly limited.

The thickness of the supporting glass substrate is not particularly limited, but it is necessary that the thickness of the laminated body of the present invention be a thickness that can be processed in the current display panel production line.
For example, the thickness is preferably 0.1 to 1.1 mm, more preferably 0.3 to 0.8 mm, and still more preferably 0.4 to 0.7 mm.
For example, when the current production line is designed to process a substrate having a thickness of 0.5 mm and the thickness of the thin glass substrate is 0.1 mm, the thickness of the supporting glass substrate and the resin layer The sum with the thickness is 0.4 mm. The current production line is most commonly designed to process a glass substrate having a thickness of 0.7 mm. For example, if the thickness of a thin glass substrate is 0.4 mm, the supporting glass The sum of the thickness of the substrate and the thickness of the resin layer is 0.3 mm.
The thickness of the supporting glass substrate is preferably thicker than that of the thin glass substrate.

  The shape of the supporting glass substrate is not limited, but is preferably rectangular.

  Although the size of the supporting glass substrate is not limited, it is preferably about the same as the thin glass substrate, and is slightly larger than the thin glass substrate (the vertical direction or the horizontal direction is about 0.05 to 10 mm larger). Is preferred. The reason is that it is easy to protect the end portion of the thin glass substrate from the contact of an alignment device such as a positioning pin at the time of manufacturing a panel for a display device, and that the thin glass substrate and the supporting glass substrate are more easily separated. Because it can.

The supporting glass substrate may have a linear expansion coefficient that is substantially the same as or different from that of the thin glass substrate. Substantially the same is preferable in that the thin glass substrate or the supporting glass substrate is less likely to warp when the laminate of the present invention is heat-treated.
The difference in coefficient of linear expansion between the thin glass substrate and the supporting glass substrate is preferably 150 × 10 ⁻⁷ / ° C. or less, more preferably 100 × 10 ⁻⁷ / ° C. or less, and 50 × 10 ⁻⁷ / ° C. More preferably, it is not higher than ° C.

  The composition of the supporting glass substrate may be the same as, for example, glass containing an alkali metal oxide or non-alkali glass. Among these, alkali-free glass is preferable because of its low thermal shrinkage rate.

Next, the resin layer will be described.
In the laminate of the present invention, the resin layer is fixed to the first main surface of the support glass substrate. And although the resin layer is closely_contact | adhered with the 1st main surface of the said thin glass substrate, it can peel easily. That is, the resin layer has easy peelability from the thin glass substrate.
In the laminate of the present invention, the resin layer and the thin glass substrate are not attached by the adhesive force that the adhesive has, but are attached by the force caused by the van der Waals force between the solid molecules, that is, the adhesive force. Yes.

The thickness of the resin layer is not particularly limited. It is preferably 5 to 50 μm, more preferably 5 to 30 μm, and even more preferably 7 to 20 μm. This is because when the thickness of the resin layer is in such a range, the thin glass substrate and the resin layer are sufficiently adhered. Moreover, even if bubbles or foreign substances are present, it is possible to suppress the occurrence of distortion defects in the thin glass substrate. On the other hand, if the resin layer is too thick, it takes time and materials to form the resin layer, which is not economical.
In addition, the resin layer may consist of two or more layers. In this case, “the thickness of the resin layer” means the total thickness of all the layers.
Moreover, when a resin layer consists of two or more layers, the kind of resin which forms each layer may differ.

  The resin layer preferably has a surface tension of 30 mN / m or less, more preferably 25 mN / m or less, and even more preferably 22 mN / m or less. This is because such surface tension can be more easily peeled off from the thin glass substrate, and at the same time, the close contact with the thin glass substrate becomes sufficient.

  The resin layer is preferably made of a material having a glass transition point lower than room temperature (about 25 ° C.) or having no glass transition point. This is because it becomes a non-adhesive resin layer, is more easily peelable, can be more easily peeled off from the thin glass substrate, and at the same time is sufficiently adhered to the thin glass substrate.

  Moreover, it is preferable that the resin layer has heat resistance. For example, when the display device member is formed on the second main surface of the thin glass substrate, the laminate of the present invention can be subjected to heat treatment.

  Moreover, when the elasticity modulus of a resin layer is too high, it exists in the tendency for adhesiveness with a thin glass substrate to become low. Moreover, when an elastic modulus is too low, easy peelability will become low.

  The kind of resin which forms a resin layer is not specifically limited. For example, acrylic resin, polyolefin resin, polyurethane resin, and silicone resin can be mentioned. Several types of resins can be mixed and used. Of these, silicone resins are preferred. This is because the silicone resin is excellent in heat resistance and easy to peel from a thin glass substrate. Moreover, it is because it is easy to fix to a support glass substrate by the condensation reaction with the silanol group of the support glass substrate surface. It is also preferable that the silicone resin layer is not easily deteriorated even if it is treated at about 300 to 400 ° C. for about 1 hour, for example.

  Moreover, it is preferable that a resin layer consists of silicone for release paper among silicone resins, and it is preferable that it is the hardened | cured material. The silicone for release paper is mainly composed of silicone containing linear dimethylpolysiloxane in the molecule. The resin layer formed by curing the composition containing the main agent and the crosslinking agent on the surface (first main surface) of the supporting glass substrate using a catalyst, a photopolymerization initiator, etc. has excellent easy peelability. Since it has, it is preferable. Moreover, since the flexibility is high, even if foreign matters such as bubbles and dust are mixed between the thin glass substrate and the resin layer, the occurrence of distortion defects of the thin glass substrate can be suppressed.

  Such release paper silicones are classified into condensation reaction type silicones, addition reaction type silicones, ultraviolet ray curable type silicones and electron beam curable type silicones depending on their curing mechanism, and any of them can be used. Among these, addition reaction type silicone is preferable. This is because the curing reaction is easy, the degree of easy peeling is good when the resin layer is formed, and the heat resistance is also high.

  The release paper silicone is classified into a solvent type, an emulsion type, and a solventless type, and any type can be used. Among these, a solventless type is preferable. This is because productivity, safety, and environmental characteristics are excellent. Further, since a solvent that causes foaming is not included at the time of curing when forming the resin layer, that is, at the time of heat curing, ultraviolet curing, or electron beam curing, bubbles are unlikely to remain in the resin layer.

  In addition, as the release paper silicone, specifically, the commercially available product names or model numbers are KNS-320A, KS-847 (both manufactured by Shin-Etsu Silicone), TPR6700 (GE Toshiba Silicone), vinyl silicone “8500”. (Arakawa Chemical Industries, Ltd.) and methylhydrogenpolysiloxane "12031" (Arakawa Chemical Industries, Ltd.), vinyl silicone "11364" (Arakawa Chemical Industries, Ltd.) and methylhydrogenpolysiloxane " 12031 "(made by Arakawa Chemical Co., Ltd.), vinyl silicone" 11365 "(made by Arakawa Chemical Co., Ltd.) and methylhydrogenpolysiloxane" 12031 "(made by Arakawa Chemical Co., Ltd.), etc. It is done. KNS-320A, KS-847, and TPR6700 are silicones that contain a main agent and a crosslinking agent in advance.

  Moreover, it is preferable that the silicone resin which forms a resin layer has a property which the component in a silicone resin layer does not transfer easily to a thin glass substrate, ie, low silicone transfer property.

Next, the recessed portion will be described.
The glass laminated body of this invention has one or more recessed parts in the edge part of the said support glass substrate.
The glass laminate of the present invention in which a part of the end surface (four surfaces other than the two main surfaces) of the support glass substrate is partly cut or a part of the end part is cut out to form a concave portion is peeled off from the support glass substrate. When it is desired, it can be peeled off using the recessed portion as a clue. Specifically, for example, a sharp blade-like object can be inserted into the recessed portion, or a mixed fluid of water and compressed air can be sprayed to peel off.

  The shape of the recessed portion will be described with reference to the drawings. Fig.5 (a) is the figure which expanded the part (C) of the recessed part 15 of FIG. FIG. 5A shows only the supporting glass substrate 13 and its recessed portion 15, and the thin glass substrate 12 and the resin layer 14 shown in FIG. 1 are omitted. FIG. 5B shows a recessed portion 15 shown in FIG. 5A and a recessed portion 15 ′ having a slightly different shape.

  FIG. 5A is a front view, and as described above, the recessed portion 15 has an elliptical half shape. The recessed portion 15 is formed by cutting an end portion of the supporting glass substrate 13 into an elliptical half shape, and a corner 3 is formed at the boundary between the recessed portion 15 and the end surface of the supporting glass substrate 13. The recessed portion 15 ′ shown in FIG. 5B has a shape in which the corner 3 of the recessed portion 15 shown in FIG.

  The shape of the recessed portion may be other than those shown in FIGS. 5A and 5B, and is not particularly limited. For example, a triangle, a rectangle, a polygon, a semicircle, etc. may be sufficient. However, the shape of the half of the ellipse shown in FIG. 5A is preferable, and the shape shown in FIG. This is because the concave portion having such a shape can be formed relatively easily and is difficult to be chipped when the laminate of the present invention is handled. Further, the recessed portion can be shaped by cutting out the end face using a grindstone for chamfering the supporting glass substrate.

The size of the recessed portion will be described. The size of the recessed portion is not particularly limited, but if it is too large, the portion of the thin glass substrate that is not supported by the supporting glass substrate increases, so that damage occurs when the process equipment contacts the relevant portion (edge) of the thin glass substrate. It is easy to be connected to. On the other hand, if it is too small, it becomes difficult to use it as a sufficient clue for peeling. The width at the end of the recessed portion is preferably 1 mm to 50 mm, and more preferably 5 mm to 30 mm. Here, the width of the recessed portion refers to the length of line segments indicated by X _a and X _b in FIGS. 5 (a) and 5 (b). That is, the line segments X _a , X connecting the boundary between the end surface of the supporting glass substrate 13 (13 ′) and the recess 15 (15 ′) (two points indicated by “corner 3” in FIG. 5A). It means the length of _b .
Further, if the depth of the recessed portion is so deep that it reaches the display device formation region of the thin glass substrate, the result is that the heat capacity differs only in that portion in the heating process. However, if it is too shallow, it becomes difficult to use it as a sufficient clue for peeling. Therefore, the depth of the recessed portion is preferably 5 mm to 50 mm, and more preferably 10 mm to 30 mm. Here, the depth of the recessed portion, FIG. 5 (a), the (b), the concave portion of the line segment a straight line (tangent) in contact with the boundary line X _a or X _b a straight line parallel to the line segment X _a or is intended to mean a _{Y a} or _{Y b} is the distance between _{X b.}

Further, the area of the recessed portion is not particularly limited. However, since the part which is not supported by the support glass substrate in a thin glass substrate will increase when too large, when a process apparatus contacts the said part (edge) of a thin glass substrate, it will lead easily to a failure | damage. On the other hand, if it is too small, it becomes difficult to use it as a sufficient clue for peeling. It is preferably 5 mm ² or more per location, more preferably 25 mm ² or more, and even more preferably 50 mm ² or more. Further, it is preferably 2500 mm ² or less per one point, more preferably 1500 mm ² or less, and more preferably 900 mm ² or less. Here, the area of the recessed portion is the area of the portion surrounded by the boundary line and the line segment X _a (X _b ) between the recessed portion and the supporting glass substrate 13 (13 ′) in _FIGS. Means.

Although there is no restriction | limiting in particular about the position and the number in which a recessed part is provided, It is preferable that it is 3-4 pieces per sheet | seat of this invention. In addition, when the laminate of the present invention is viewed from the front, it is preferable that two concave portions are provided on each of two pairs of opposing sides of the four sides of the laminate of the present invention.
For example, it is preferable that it is an aspect like Fig.6 (a)-(c). 6A to 6C are schematic front views of the laminate of the present invention. In these drawings, only the supporting glass substrate and the recessed portion formed therein are shown for easy understanding. In the embodiment shown in FIG. 6A, the support glass substrate 33a has three concave portions ( _35a1 , _35a2 , _35a3 ). Each recess is present on each of three sides of the four sides of the supporting glass substrate. In the embodiment shown in FIG. 6B, the support glass substrate 33b has four concave portions (35 _b1 , 35 _b2 , 35 _b3 , 35 _b4 ). Each of the recesses is present in two on each of a pair of opposing sides (two sides) of the four sides of the supporting glass substrate. In the embodiment shown in FIG. 6C, the support glass substrate 33c has four recessed portions (35 _c1 , 35 _c2 , 35 _c3 , 35 _c4 ). Each recess is present in each of the four corners of the support glass substrate.
In the laminate of the present invention, it is preferable that the supporting glass substrate has three or more recessed portions, and the center of gravity of the polygon having each of the recessed portions as the apex coincides with the center of gravity of the thin glass substrate.

Moreover, it is preferable that the space | interval of a recessed part is 500 mm or less, and it is more preferable that it is 300 mm or less. This is because if the adjacent concave portions are separated by more than 500 mm, the peeling operation may not be performed smoothly. Here, the “interval between recesses” means the distance between adjacent recesses on the four sides when the support glass substrate is viewed from the front. That is, it is the shortest distance between the ends of the two recessed portions measured along the side of the supporting glass substrate. The “end of the recessed portion” refers to a position corresponding to the intersection of the recessed portion and the side (straight line) of the supporting glass substrate.
This distance will be described with reference to FIG. FIG. 7 is a schematic front view of the laminate of the present invention having three recessed portions. In FIG. 7, the description of the thin glass substrate and the resin layer is omitted. In the laminated body of the present invention shown in FIG. 7, two concave portions (451, 452) are formed on one side, and another concave portion (453) is formed on another side adjacent to the side. ing. Each recess has the same shape as the recess described in FIG. 1 and FIG. 5A (half the shape of an ellipse), and is shown as “corner 3” in FIG. 5A. Have the same corners (41a, 41b, 42a, 42b, 43a, 43b). As shown in FIG. 7, among the two corners of the recessed portion 451 and the recessed portion 452, the left side is the corner 41a and the corner 42a, and the right side is the corner 41b and the corner 42b. Of the two corners of the recessed portion 453, the side closer to the recessed portion 452 is the corner 43b, and the far side is the corner 43a. In the laminated body of the present invention shown in FIG. 7, the distance (interval) between the recessed portion 451 and the recessed portion 452 means the distance between the corners of each recessed portion. That is, the distance _{Z a1} between corner 41a and the corner 42b is the distance between the recessed portion 451 and the recess 452 (space). The distance between the recessed portion 452 and the recessed portion 453 is the distance between the corner 42a and the corner 43b on the side of the supporting glass substrate, and means the sum of the distance Z _a2 and the distance Z _a3. .
Even in the case where the concave portion has no corner (for example, the shape shown in FIG. 5B), the boundary between the end surface of the supporting glass substrate and the concave portion is regarded as the corner, and the distance between the concave portions is determined. Suppose you want.

A panel for a display device with a support can be obtained by forming a display device member on the second main surface of the thin glass substrate in the laminate of the present invention.
The display device member means various circuit patterns, such as a light emitting layer, a protective layer, a color filter, a liquid crystal, a transparent electrode made of ITO, etc. on a surface of a glass substrate for a display device such as a conventional LCD or OLED. .
The display device panel with a support of the present invention includes, for example, a display device panel with a support according to the present invention in which a TFT array (hereinafter simply referred to as “array”) is formed on the second main surface of a thin glass substrate. A thin glass substrate and another glass substrate on which a color filter is further formed (for example, a glass substrate having a thickness of about 0.3 mm or more) are also included.

  Further, a display device panel can be obtained from such a support-equipped display device panel. As described above, the thin glass substrate and the resin layer fixed to the supporting glass substrate are peeled off from the panel for a display device with a support as a clue for peeling as described above. And the panel for display apparatuses which has a thin glass substrate can be obtained.

  Further, a display device can be obtained from such a display device panel. Examples of the display device include an LCD and an OLED. Examples of LCD include TN type, STN type, FE type, TFT type, and MIM type.

Next, the manufacturing method of the laminated body of this invention is demonstrated.
Although the manufacturing method of the laminated body of this invention is not specifically limited, The resin which has an easily peelable property on the 1st main surface of the said recessed part formation process which forms a recessed part in the edge part of the said supporting glass substrate, and the said supporting glass substrate A resin layer forming step of forming and fixing a layer, and an adhesion step of closely adhering the resin layer fixed on the first main surface of the supporting glass substrate to the first main surface of the thin glass substrate. It is preferable that it is a manufacturing method of a glass laminated body.
Hereinafter, such a production method is also referred to as a “production method of the present invention”.

  The manufacturing method of the said thin glass substrate used in the manufacturing method of this invention and the said support glass substrate itself is not specifically limited. For example, it can be produced by a conventionally known method. For example, it can be obtained by melting a conventionally known glass raw material to form a molten glass and then forming it into a plate shape by a float method, a fusion method, a down draw method, a slot down method, a redraw method or the like.

The recessed part formation process in the manufacturing method of this invention is demonstrated.
A recessed part formation process is a process of forming a recessed part in the edge part of the said support glass substrate.
In the recess forming step, the support glass substrate is cut into a predetermined size and shape (for example, a rectangle), and then the recess is formed. For example, it is preferable to cut out the shape of the recessed portion using a diamond grindstone. Thereafter, the ribbed surface is chamfered with a similar grindstone by a normal method. Subsequently, the supporting glass substrate on which the chamfered portion is formed is cleaned by a cleaning machine.

  Here, it is preferable that three or more concave portions are formed on the support glass substrate so that the center of gravity of the polygon having each formed concave portion as a vertex coincides with the center of gravity of the support glass substrate. This is because the thin glass substrate can be closely adhered in the subsequent adhesion process.

Next, the resin layer forming step will be described.
A method for forming a resin layer on the surface (first main surface) of the supporting glass substrate is not particularly limited.
For example, a method of adhering a film-like resin to the surface of a supporting glass substrate can be mentioned. Specifically, in order to give a high adhesive force to the surface of the film, a method of performing surface modification treatment (priming treatment) on the surface of the supporting glass substrate and adhering to the first main surface of the supporting glass substrate can be mentioned. For example, chemical methods such as silane coupling agents to improve adhesion (primer treatment), physical methods to increase surface active groups such as flame (flame) treatment, and surfaces such as sandblast treatment Examples of such a mechanical processing method increase the catch by increasing the roughness of the material.

Moreover, the method of coating the resin composition used as a resin layer on the 1st main surface of a support glass substrate by a well-known method, for example is mentioned. Known methods include spray coating, die coating, spin coating, dip coating, roll coating, bar coating, screen printing, and gravure coating. From such a method, it can select suitably according to a kind to a resin composition.
For example, when a solventless release paper silicone is used as the resin composition, a die coating method, a spin coating method or a screen printing method is preferred.

In the case of coating a resin composition on the first main surface of the supporting glass substrate, it is preferable that the coating amount is 1 to 100 g / ^{m 2,} and more preferably 5 to 20 g / ^{m 2.}
For example, when forming a resin layer from an addition reaction type silicone, a resin composition containing a silicone (main agent) containing a linear dimethylpolysiloxane in the molecule, a crosslinking agent and a catalyst is used for the known spray coating method or the like. It is coated on a supporting glass substrate by the method, and then cured by heating. The heat curing conditions vary depending on the blending amount of the catalyst. For example, when 2 parts by weight of the platinum-based catalyst is blended with respect to 100 parts by weight of the total amount of the main agent and the cross-linking agent, Preferably it is made to react at 100 to 200 degreeC. In this case, the reaction time is 5 to 60 minutes, preferably 10 to 30 minutes. In order to obtain a silicone resin layer having a low silicone migration property, it is preferable to advance the curing reaction as much as possible so that an unreacted silicone component does not remain in the silicone resin layer. It is preferable that the reaction temperature and the reaction time are as described above because no unreacted silicone component remains in the silicone resin layer. If the reaction time is too long or the reaction temperature is too high, the oxidative decomposition of the silicone resin occurs at the same time, and a low molecular weight silicone component is produced, which may increase the silicone transferability. It is preferable to allow the curing reaction to proceed as much as possible so that an unreacted silicone component does not remain in the silicone resin layer in order to improve the peelability after the heat treatment.

  For example, when the resin layer is manufactured using release paper silicone, the release paper silicone coated on the support glass substrate is heated and cured to form a silicone resin layer, and then the support glass substrate silicone is formed in the adhesion step. A thin glass substrate is laminated on the resin forming surface. By curing the silicone for release paper by heating, the cured silicone resin is chemically bonded to the supporting glass. Further, the silicone resin layer is bonded to the supporting glass by the anchor effect. By these actions, the silicone resin layer is firmly fixed to the supporting glass substrate.

  In addition, in the manufacturing method of this invention, the order of a recessed part formation process and a resin layer formation process is not specifically limited. The resin layer may be formed after forming the recessed portion on the supporting glass substrate, or the recessed portion may be formed after forming the resin layer. In the latter case, the recessed portion may reach the resin layer.

The adhesion process will be described.
The adhesion process is a process in which the resin layer fixed on the first main surface of the supporting glass substrate is adhered to the first main surface of the thin glass substrate. The thin glass substrate and the resin layer are brought into close contact with the resin layer by a force caused by van der Waals force between the adjacent solid molecules that are very close to each other, that is, an adhesive force. In this case, the support glass substrate, the thin glass substrate, and the resin layer can be held in a laminated state.

  The method for laminating the thin glass substrate on the surface of the resin layer fixed to the supporting glass substrate is not particularly limited. For example, it can implement using a well-known method. For example, after laminating a thin glass substrate on the surface of the resin layer under a normal pressure environment, a method of pressure bonding the resin layer and the thin glass substrate using a roll or a press can be mentioned. It is preferable because the resin layer and the thin glass substrate are more closely adhered by pressure bonding with a roll or a press. In addition, it is preferable because bubbles mixed between the resin layer and the thin glass substrate are relatively easily removed by pressure bonding with a roll or a press. When pressure bonding is performed by a vacuum laminating method or a vacuum pressing method, it is more preferable because suppression of bubble mixing and securing of good adhesion are more preferably performed. By pressure bonding under vacuum, there is an advantage that even if a minute bubble remains, the bubble does not grow by heating, and it is difficult to cause a distortion defect of the thin glass substrate.

Further, the adhesion step is a base having three or more pins that are disposed in the chamber and can protrude upward from the base surface and can be accommodated inside the base by applying a downward force. The position of the pin overlaps the position of the recessed portion on the base where the positional relationship of the pins on the surface of the base is the same as the positional relationship of the recessed portions of the support glass substrate. The supporting glass substrate to which the resin layer is fixed is placed with the resin layer as the upper side, and then the upper side so that the thin glass substrate and the resin layer face each other while maintaining a gap. The thin glass substrate is placed on the protruding pins, and then the inner space of the chamber where the thin glass substrate and the supporting glass substrate exist is brought into a negative pressure state. Push from top to bottom It allows the first main surface of the thin glass substrate is preferably a step of adhesion of the resin layer fixed to the first main surface of the supporting glass substrate.
Such a preferable adhesion process will be described with reference to FIGS.

  FIG. 8 is a schematic perspective view showing that a supporting glass substrate having a resin layer is placed on the base surface. FIG. 9 is a schematic cross-sectional view of a vacuum chamber, in which a supporting glass substrate and a thin glass substrate can be brought into close contact with each other via a resin layer. FIG. 9A shows a state before close contact, and FIG. 9B shows a state after close contact.

In FIG. 8, the base 50 has four pins 51 that can protrude upward from the surface thereof and can be accommodated inside the base by applying a downward force. A spring or the like is attached to the base of the pin 51, and when a force is applied from the upper side to the lower side (inside the base), the spring or the like can be contracted and pushed into the base. The pin 51 is provided with a lock mechanism, and is locked when the pin 51 is pushed into the base. The pin 51 can be held in the base until the lock is released.
The mutual positional relationship of the pins 51 on the surface of the base 50 is the same as the positional relationship of the four recessed portions 53 included in the support glass substrate 52 placed on the surface. The support glass substrate 52 is placed so that the position and the position of the recessed portion 53 overlap. A resin layer 54 is fixed to the main surface of the support glass substrate 52, and the support glass substrate 52 is placed on the base 50 so that the resin layer 54 is on the upper side.

Next, as shown in FIG. 9A, the thin glass substrate 55 is placed on the upper side of the supporting glass substrate 52 placed as described above. Here, since the height of the pin 51 (the length protruding upward from the surface of the base 50) is longer than the total thickness of the support glass substrate 52 and the resin layer 54, the thin glass substrate 55 is provided with the pin 51. The thin glass substrate 55 and the resin layer 54 face each other while maintaining a gap.
Here, it is preferable that the center of gravity of the surface of the polygonal base 50 having each pin 51 as a vertex coincides with the center of gravity of the thin glass substrate 55. This is because it is possible to obtain the laminate of the present invention in which the center of gravity of the supporting glass substrate and the center of gravity of the thin glass substrate coincide. Moreover, it is because the laminated body of this invention can be manufactured with sufficient precision.

  Next, as shown in FIG. 9B, the inside of the chamber 57 in which the thin glass substrate 55 and the supporting glass substrate 52 exist is decompressed to change from a negative pressure to a vacuum state. Is pressed from the upper side to the lower side, the resin layer 54 fixed on the first main surface of the supporting glass substrate 52 can be brought into close contact with the first main surface of the thin glass substrate 55. Adhering in such a state from a negative pressure to a vacuum is preferable because gas hardly remains between the surface of the resin layer and the first main surface of the thin glass substrate. In particular, it is effective when the area of the thin glass substrate is large. Conventionally, in such a vacuum lamination press method, since a thin glass substrate cannot be vacuum-adsorbed and held on the upper pressurizing means, a very expensive electrostatic attraction apparatus is applied. In this method, the thin glass substrate is supported by pins, which is preferable in that the apparatus can be made very inexpensive as compared with the electrostatic adsorption apparatus.

  In the adhesion step, when the thin glass substrate is laminated on the surface of the resin layer of the supporting glass substrate, it is preferable that the surface of the thin glass substrate is sufficiently washed and laminated in a high clean environment. Even if a foreign substance enters between the resin layer and the thin glass substrate, the resin layer is deformed, so the flatness of the surface of the thin glass substrate is not affected. However, the higher the cleanness, the better the flatness. Therefore, it is preferable.

  The laminate of the present invention can be produced by such a production method of the present invention.

According to the manufacturing method of the present invention, a display device with a support is further provided by the manufacturing method further comprising the step of forming a member for display device on the second main surface of the thin glass substrate in the obtained glass laminate of the present invention. Panels can be manufactured.
Here, the display device member is not particularly limited. For example, an array or a color filter included in the LCD can be mentioned. Further, for example, a transparent electrode, a hole injection layer, a hole transport layer, a light emitting layer, and an electron transport layer included in the OLED can be given.

A method of forming such a display device member is not particularly limited, and may be the same as a conventionally known method.
For example, when manufacturing a TFT-LCD as a display device, a step of forming an array on a conventionally known glass substrate, a step of forming a color filter, a glass substrate on which the array is formed, and a glass substrate on which the color filter is formed It may be the same as various steps such as a step of bonding through a sealing material or the like (array / color filter bonding step). More specifically, examples of the treatment performed in these steps include pure water cleaning, drying, film formation, resist coating, exposure, development, etching, and resist removal. Furthermore, as a process performed after implementing an array color filter bonding process, there exists a liquid-crystal injection | pouring process and the sealing process of the injection port performed after implementation of this process, The process implemented by these processes is mentioned.
Taking the case of manufacturing an OLED as an example, as a process for forming an organic EL structure on the second main surface of a thin glass substrate, a process of forming a transparent electrode, a hole injection layer, a hole transport layer, Various processes such as a process for depositing a light emitting layer / electron transport layer and the like, a sealing process, and the like are performed. Specifically, for example, a film forming process, a vapor deposition process, and an adhesion of a sealing plate are performed. Processing and the like.
In this way, a panel for a display device with a support can be produced.

Moreover, after obtaining such a display device panel with a support, the thin glass substrate and the support glass substrate in the obtained display device panel with a support are further separated from each other with the recessed portion as a starting point. A display device panel can be obtained by a manufacturing method including a separation step.
The display device panel is, for example, a separation step of separating the thin glass substrate and the support glass substrate by using the recessed portion in the display device-equipped display device panel obtained by the manufacturing method of the present invention as described above. It can manufacture with the manufacturing method which comprises. The method for peeling is not particularly limited. Specifically, for example, a sharp blade-like object can be inserted into the recessed portion, or a mixed fluid of water and compressed air can be sprayed to peel off. Preferably, the support glass substrate of the display device panel with the support is placed on the surface plate so that the support glass substrate is on the upper side and the panel side is on the lower side, and the panel side substrate is vacuum-adsorbed on the surface plate (support glass substrate on both sides). In this state, the mixture of water and compressed air is sprayed on the interface between the thin glass and the resin layer, and the edge of the supporting glass substrate is pulled vertically upward. increase. Then, an air layer is formed from the recessed portion to the interface between the resin layer and the panel-side thin glass substrate, the air layer spreads over the entire interface, and the supporting glass substrate can be easily peeled off (the front surface of the display device). If a supporting glass substrate is laminated on both the side and back side thin glass substrates, this operation is repeated one side at a time).

Furthermore, a display apparatus can be manufactured by the manufacturing method which comprises the process of obtaining a display apparatus using the obtained display apparatus panel.
Here, the operation in the step of obtaining the display device is not particularly limited, and for example, the display device can be produced by a conventionally known method.

Example 1
The glass laminated body of the aspect shown in FIG. 10 was manufactured. This glass laminate is similar to the first aspect described above.
First, an automatic chamfering device (CGE1300; manufactured by Siraitec Co., Ltd.) is applied to a supporting glass substrate 63 (Asahi Glass Co., Ltd., AN100) having a length of 720 mm, a width of 600 mm, a thickness of 0.4 mm, and a linear expansion coefficient of 38 × 10 ⁻⁷ / ° C. ^Two semi-elliptical recesses 65 having a width of 15 mm, a depth of 5 mm, and an area of 50 mm ² were formed. Thereafter, the surface was cleaned by washing with pure water and UV.

Next, a mixture of 100 parts by weight of silicone for solvent-free addition reaction type release paper and 2 parts by weight of platinum-based catalyst is placed on the first main surface of the supporting glass substrate 63 in a size of 715 mm in length and 595 mm in width. It applied with the printing machine (coating amount 30g / m < ² >). And it heat-hardened in air | atmosphere for 30 minutes at 180 degreeC, and obtained the 20-micrometer-thick silicone resin layer 64. FIG.

Next, a first main surface (later contact with a silicone resin layer) of a thin glass substrate 62 (Asahi Glass Co., Ltd., AN100) having a length of 720 mm, a width of 600 mm, a thickness of 0.3 mm, and a linear expansion coefficient of 38 × 10 ⁻⁷ / ° C. The surface to be cleaned) was cleaned with pure water and UV. And the surface of the silicone resin layer 64 on the 1st main surface of the support glass substrate 63 and the thin glass substrate 62 are bonded together by the vacuum press at room temperature, and the glass laminated body A (laminated body 60 of this invention) is obtained. It was.

  In such a glass laminate A according to Example 1, the thin glass substrate and the supporting glass substrate were in close contact with the silicone resin layer without generating bubbles, and had no convex defects and good smoothness. .

Next, the glass laminate A was subjected to the following peel test 1 to evaluate peelability. This will be described with reference to FIGS.
<Peel test 1>
Ten glass laminates A were produced. One of them is placed on the surface plate 61 so that the supporting glass substrate 63 is on the upper side and the thin glass substrate 62 is on the lower side, and then the thin glass substrate 62 is vacuum-adsorbed on the surface plate (see FIG. 11).
In this state, the mixed fluid 69 of water and compressed air is sprayed on the interface between the thin glass substrate 62 and the resin layer 64 at the two recessed portions 65 of the glass laminate A (FIG. 12), and the end of the supporting glass substrate 63. The part was pulled vertically upward (FIG. 13). Then, an air layer was formed from the recessed portion 65 to the interface between the silicone resin layer 64 and the thin glass substrate 62, and the air layer spread over the entire surface of the interface and could be easily peeled off.

  This operation was continuously performed for the remaining nine glass laminates A. Then, about 10 glass laminated bodies A, the peeling operation | work was able to be performed within 20 minutes without a problem.

Next, another glass laminate A was prepared. And this was heat-processed in air | atmosphere at 300 degreeC for 1 hour. The heat resistance to the heat treatment was good.
And it used for the peeling test 1 similar to the above. In this case as well, peeling could be performed without any problem.

(Example 2)
Example 2 was the same as Example 1, except that the size of the recessed part was reduced as shown in FIG. 14 and a supporting glass substrate in which the recessed part did not reach the resin layer was used.
First, an automatic chamfering device (CGE1300; manufactured by Siraitec Co., Ltd.) is applied to a supporting glass substrate 73 (Asahi Glass Co., Ltd., AN100) having a length of 720 mm, a width of 600 mm, a thickness of 0.6 mm, and a linear expansion coefficient of 38 × 10 ⁻⁷ / ° C. ^Two semi-elliptical concave portions 75 having a width of 10 mm, a depth of 3 mm, and an area of 21 mm ² were formed. Thereafter, the surface was cleaned by washing with pure water and UV.

Next, as a resin for forming the resin layer 74, linear polyorganosiloxane having vinyl groups at both ends and methyl hydrogen polysiloxane having hydrosilyl groups in the molecule were used. Then, this is mixed with a platinum-based catalyst to prepare a mixture, which is coated on the first main surface of the supporting glass substrate 73 with a size of 710 mm in length and 595 mm in width by a screen printing machine (coating amount 20 g / m ² ) and cured by heating in the air at 180 ° C. for 30 minutes to form a silicone resin layer having a thickness of 20 μm. Here, the mixing ratio of the linear polyorganosiloxane and the methylhydrogen polysiloxane was adjusted so that the molar ratio of hydrosilyl group to vinyl group was 1/1. The platinum-based catalyst was added in an amount of 5 parts by mass with respect to a total of 100 parts by mass of the linear polyorganosiloxane and methyl hydrogen polysiloxane.

Next, as the thin glass substrate 72, a glass substrate (AN100 manufactured by Asahi Glass Co., Ltd.) having a length of 720 mm, a width of 600 mm, a thickness of 0.1 mm, and a linear expansion coefficient of 38 × 10 ⁻⁷ / ° C. is used. The surface of the silicone resin layer 74 on one main surface and the thin glass substrate 72 were bonded together by a vacuum press at room temperature to obtain a glass laminate B (laminate 70 of the present invention).

In such a glass laminate B according to Example 2, the thin glass substrate and the supporting glass substrate were in close contact with the silicone resin layer without generating bubbles, and had no convex defects and good smoothness. .
Moreover, when the peeling test 1 was implemented like Example 1, the peeling operation | work was able to be performed within 30 minutes about 10 glass laminated bodies without a problem. Moreover, the glass laminated body B at the time of heat-processing at 300 degreeC for 1 hour in air | atmosphere had favorable heat resistance with respect to heat processing. Furthermore, the peelability was also good.

(Example 3)
The glass laminated body of the aspect shown in FIG. 15 was manufactured. This glass laminate is similar to the first aspect described above.
First, an automatic chamfering device (CGE1300; manufactured by Siraitec Co., Ltd.) is applied to a supporting glass substrate 83 (Asahi Glass Co., Ltd., AN100) having a length of 720 mm, a width of 600 mm, a plate thickness of 0.4 mm, and a linear expansion coefficient of 38 × 10 ⁻⁷ / ° C. Were used to form four semi-elliptical recesses 85 having a width of 15 mm, a depth of 5 mm, and an area of 50 mm ² , each at a position 10 mm from the corner in the vicinity. Thereafter, the surface was cleaned by washing with pure water and UV.
Next, the resin layer 84 was formed in the same manner as in Example 2.
The first main surface (later contacted with a silicone resin layer) of a thin glass substrate 82 (Asahi Glass Co., Ltd., AN100) having a length of 720 mm, a width of 600 mm, a plate thickness of 0.3 mm, and a linear expansion coefficient of 38 × 10 ⁻⁷ / ° C. The side surface) was cleaned with pure water and UV. And it laminated | stacked at normal temperature using the vacuum heater press apparatus (MKP-200TV-WH-ST) by Mikado Technos shown in FIG.
This lamination method will be specifically described with reference to FIG. 16 and FIG. 17 which is an enlarged view of a part (E) thereof.

The vacuum heater press device 100 has four pins 91 that can protrude upward from the surface of the base 90 and can be stored in the base 90 by applying a downward force. A spring 101 is attached to the base of the pin 91. When a force is applied from the upper side to the lower side (inside the base), the spring 101 contracts and is pushed into the base. Since the lock mechanism 102 including the lock pin 102a and the recess 102b is provided, when the pin 91 is pushed into the base, the lock pin 102a is locked into the recess 102b by the action of the base spring, and is locked. The pin 91 is held in a state of being pushed into the base until the lock is released.
The mutual positional relationship of the pins 91 on the surface of the base 90 is the same as the positional relationship of the four recessed portions 85 included in the support glass substrate 83 placed on the surface.

The support glass substrate 83 was placed on the base 90 of the vacuum heater press 100 such that the position of the pin 91 and the position of the recessed portion 85 overlapped. Here, the surface of the supporting glass substrate 83 on which the resin layer 84 is fixed is on the upper side. That is, the supporting glass substrate 83 and the resin layer 84 were placed so as to be in the state shown in FIG.
Next, as shown in FIG. 16A, the thin glass substrate 82 was gently set on the four pins 91. Here, the first main surface of the thin glass substrate 82 was set on the lower side.
Next, as shown in FIG. 16B, the pressurizing means 96 was lowered to the first lowered position, and the formed chamber was decompressed to −100 kPa.
Next, as shown in FIG. 16 (c), the pressing means 96 is lowered to the second processing position, and the resin fixed on the first main surface of the supporting glass substrate 83 to the first main surface of the thin glass substrate 82. Layer 84 was adhered. When the pressurizing means 96 was lowered to the second processing position, the lock mechanism 102 acted and the pin 91 was held in a state of being pushed into the base 90. In this state, a pressure of 300 kN / m ³ was applied to the multilayer substrate. Then, after maintaining this state for 10 seconds, the vacuum was broken, the pressurizing means 96 was raised, and the glass laminate 80 was taken out.
In such a glass laminate 80 according to Example 3, the thin glass substrate and the supporting glass substrate were in close contact with the silicone resin layer without generating bubbles, had no convex defects, and had good smoothness. .

Example 4
In this example, an LCD is manufactured using the glass laminate B obtained in Example 2.
Two glass laminates B are prepared, and one is subjected to an array forming process to form an array on the second main surface of the thin glass substrate. The remaining one sheet is subjected to a color filter forming process to form a color filter on the second main surface of the thin glass substrate. After the glass laminate having the array formed thereon and the glass laminate having the color filter formed thereon are bonded to each other through a sealing material, compressed air and water are placed in the concave portion of each laminate in the same manner as in the above peeling test. Then, each supporting glass substrate is separated. On the surface of the thin glass substrate after separation, there is no damage that leads to a decrease in strength.
Subsequently, the glass substrate is cut and divided into 168 cells having a length of 51 mm and a width of 38 mm, and then a liquid crystal injection step and an injection port sealing step are performed to form a liquid crystal cell. A step of attaching a polarizing plate to the formed liquid crystal cell is performed, and then a module formation step is performed to obtain an LCD. The LCD obtained in this way does not have a problem in characteristics.

(Example 5)
In this example, an LCD is manufactured using the glass laminate A obtained in Example 1.
Two glass laminates A are prepared, and one is subjected to an array forming process to form an array on the second main surface of the thin glass substrate. The remaining one sheet is subjected to a color filter forming process to form a color filter on the second main surface of the thin glass substrate. After the glass laminate having the array formed thereon and the glass laminate having the color filter formed thereon are bonded to each other through a sealing material, compressed air and water are placed in the concave portion of each laminate in the same manner as in the above peeling test. Then, each supporting glass substrate is separated. The surface of the thin glass substrate after separation is not damaged so as to reduce the strength.
Subsequently, the thickness of each thin glass substrate is set to 0.15 mm by chemical etching. Etch pits that cause optical problems are not observed on the surface of the thin glass substrate after the chemical etching treatment.
Thereafter, the thin glass substrate is cut and divided into 168 cells of 51 mm in length × 38 mm in width, and then a liquid crystal injection step and an injection port sealing step are performed to form a liquid crystal cell. A step of attaching a polarizing plate to the formed liquid crystal cell is performed, and then a module formation step is performed to obtain an LCD. The LCD obtained in this way does not have a problem in characteristics.

(Example 6)
In this example, an LCD is manufactured using the glass laminate B obtained in Example 2 and a non-alkali glass substrate (AN-100 manufactured by Asahi Glass) having a thickness of 0.7 mm.
A glass laminate B is prepared and subjected to a color filter forming step to form a color filter on the second main surface of the thin glass substrate of the glass laminate. On the other hand, the alkali-free glass substrate is subjected to an array forming process to form an array on one main surface.
After the glass laminate on which the color filter is formed and the non-alkali glass substrate on which the array is formed are bonded together via a sealing material, compressed air is applied to the concave portion of each laminate in the same manner as in the above-described peeling test. Each supporting glass substrate is separated after spraying a mixed fluid of water. The surface of the thin glass substrate after separation is not damaged so as to cause a decrease in strength.
Subsequently, the separated support glass substrate is divided into 168 cells of 51 mm length × 38 mm width using a laser cutter or a scribe-break method. Thereafter, a liquid crystal injection step and an injection port sealing step are performed to form a liquid crystal cell. A step of attaching a polarizing plate to the formed liquid crystal cell is performed, and then a module formation step is performed to obtain an LCD. The LCD obtained in this way does not have a problem in characteristics.

(Example 7)
In this example, an OLED is manufactured using the glass laminate B obtained in Example 2.
A thin glass sheet of a glass laminate that is provided for a step of forming a transparent electrode, a step of forming an auxiliary electrode, a step of depositing a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and the like An organic EL structure is formed on the substrate. Next, a mixed fluid of compressed air and water is sprayed on the concave portion of the laminated body, and each supporting glass substrate is separated. The surface of the thin glass substrate after separation is not damaged so as to reduce the strength.
Subsequently, the thin glass substrate is cut using a laser cutter or a scribe-break method, and divided into 288 cells of 41 mm in length and 30 mm in width, and then the glass substrate on which the organic EL structure is formed and the counter substrate are separated. Assemble and perform module formation process to create OLED. There is no problem in characteristics of the OLED obtained in this way.

(Comparative Example 1)
A test was performed in the same manner as in Example 1 except that a supporting glass without a recess was used. In the obtained glass laminate C according to Comparative Example 1, the glass substrate was in close contact with the silicone resin layer without generating bubbles, there was no convex defect, and the smoothness was good.
Moreover, it used for the peeling test 2 shown below.

<Peeling test 2>
Ten glass laminates C were produced. One of them was placed on a surface plate so that the supporting glass substrate was on the upper side and the thin glass substrate was on the lower side, and the thin glass substrate was vacuum-adsorbed on the surface plate. And after spraying the mixed fluid of compressed air and water to the edge part of a thin glass substrate and a resin layer, it peeled from the edge gradually.
This operation was continuously performed on the remaining nine glass laminates C. Then, it took 1 hour to perform the peeling operation on the 10 glass laminates. Thus, although it was possible to peel a support glass substrate from the glass laminated body which does not have a recessed part, it turned out that the efficiency of peeling work is low.

FIG. 1 is a schematic front view showing one embodiment of the laminate of the present invention. FIG. 2 is a schematic cross-sectional view showing a cross section A-A ′ of FIG. 1. FIG. 3 is a schematic front view showing another embodiment of the laminate of the present invention. FIG. 4 is a schematic cross-sectional view showing a B-B ′ cross section of FIG. 3. FIGS. 5A and 5B are enlarged views of the recessed portion. 6 (a), (b) and (c) are schematic front views of the laminate of the present invention. FIG. 7 is a schematic front view of the laminate of the present invention. FIG. 8 is a schematic perspective view for explaining a preferable adhesion process. FIGS. 9A and 9B are schematic cross-sectional views for explaining a preferable adhesion process (showing the end surface of D-D ′ in FIG. 8). FIG. 10 is a schematic front view for explaining the aspect of the first embodiment. FIG. 11 is a schematic cross-sectional view for explaining the peeling method. FIG. 12 is a schematic cross-sectional view for explaining the peeling method. FIG. 13 is a schematic cross-sectional view for explaining the peeling method. FIG. 14 is a schematic cross-sectional view for explaining an aspect of the second embodiment. FIG. 15 is a schematic front view for explaining an aspect of the third embodiment. FIG. 16 is a schematic cross-sectional view for explaining the manufacturing process of the third embodiment. FIG. 17 is an enlarged view of a part (E) of FIG.

Explanation of symbols

Laminates 12 and 22 the thin glass substrate 13, 23 supporting the glass substrate 14, 24 a resin layer 15, 15 10 and 20 present invention ', 25 recess triangular X _{a, X b} line Y _a, a _{Y b} recess depth 33a, 33b, 33c supporting glass substrate _{35 a1,} 35 a2, 35 _a3 recess _{35 b1, 35 b2, 35 b3} , 35 b4 recess _{35 c1, 35 c2, 35 c3} , 35 c4 recess 451 and 452, 453 recess 41a, 41b, 42a, 42b, 43a, 43b angle _{Z a1,} Z a2, Z _a3 recess distance 50, 90 base plate 51,91 pins 52 supporting the glass substrate 53 recess 54 resin layer 55 thin glass substrate 56, 96 Pressurizing means 57, 97 Chamber 60, 70, 80 Laminate 62, 72, 82 Thin glass substrate 63, 73, 83 Support glass substrate 64, 74, 84 Resin layer 65, 75, 85 Recessed portion 61 Surface plate 69 Mixed fluid 100 Vacuum heater press device 101 Spring 102a Locking pin 102b Recessed portion 102 Lock mechanism

Claims (16)

A thin glass substrate having a first main surface and a second main surface, a supporting glass substrate having a first main surface and a second main surface, and a resin layer having easy peelability, the first main surface of the thin glass substrate A glass laminate in which the resin layer fixed to the first main surface of the supporting glass substrate is in close contact with the surface,
The glass laminated body which has one or more recessed parts in the edge part of the said support glass substrate. The glass laminated body of Claim 1 whose area of the said recessed part is 5 mm < ² > or more per location.   The glass laminate according to claim 1 or 2, wherein the resin layer is an acrylic resin layer, a polyolefin resin layer, a polyurethane resin layer, or a silicone resin layer.   The glass laminated body in any one of Claims 1-3 whose thickness of the said resin layer is 5-50 micrometers. The glass laminated body in any one of Claims 1-4 whose difference of the linear expansion coefficient of the said thin glass substrate and the said support glass substrate is 150 * 10 < ^-7 > / degrees C or less.   The support glass substrate has three or more recessed portions, and the center of gravity of a polygon having each of the recessed portions as a vertex coincides with the center of gravity of the thin glass substrate. The glass laminated body of description.   The panel for display apparatuses with a support which has a member for display apparatuses in the 2nd main surface of the said thin glass substrate in the glass laminated body in any one of Claims 1-6.   A display device panel formed using the support-equipped display device panel according to claim 7.   A display device comprising the display device panel according to claim 8. It is a manufacturing method of the glass laminated body in any one of Claims 1-6,
A recessed portion forming step of forming a recessed portion at an end of the supporting glass substrate;
A resin layer forming step of forming and fixing an easily peelable resin layer on the first main surface of the supporting glass substrate;
The manufacturing method of a glass laminated body which comprises the contact | adherence process of closely_contact | adhering the said resin layer fixed on the 1st main surface of the said supporting glass substrate to the 1st main surface of the said thin glass substrate. The recess forming step includes
The glass laminate according to claim 10, which is a step of forming three or more recessed portions in the support glass substrate so that the center of gravity of a polygon having each recess as a vertex coincides with the center of gravity of the support glass substrate. Body manufacturing method. The adhesion step
A base having three or more pins disposed in the chamber and capable of projecting upward from the base surface and being retractable by applying a downward force, The resin layer is placed on the base where the positional relationship between the pins is the same as the positional relationship between the recessed portions of the supporting glass substrate so that the positions of the pins and the recessed portions overlap. Place the supporting glass substrate fixed, with the resin layer as the upper side,
Next, the thin glass substrate is placed on the pins protruding upward so that the thin glass substrate and the resin layer face each other while maintaining a gap,
Next, the space in the chamber where the thin glass substrate and the supporting glass substrate exist is brought into a negative pressure state,
Thereafter, the resin glass fixed on the first main surface of the supporting glass substrate is brought into close contact with the first main surface of the thin glass substrate by pressing the thin glass substrate from the upper side to the lower side by a pressing means. The manufacturing method of the glass laminated body of Claim 10 or 11 which is a process to perform.   In the adhesion step, the center of gravity of the base surface of the polygon having each of the pins as apexes coincides with the center of gravity of the first main surface of the thin glass substrate. The manufacturing method of the glass laminated body of description.   The manufacturing method according to claim 10, further comprising a step of forming a display device member on the second main surface of the thin glass substrate in the obtained glass laminate. Manufacturing method of panel for display device.   The manufacturing method according to claim 14, further comprising a separation step of separating the thin glass substrate and the support glass substrate in the obtained display device-equipped display panel from the recessed portion as a starting point. Manufacturing method of panel for apparatus.   The manufacturing method according to claim 15, further comprising a step of obtaining a display device by using the obtained display device panel.

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