WO2010110087A1

WO2010110087A1 - Manufacturing method for electronic device

Info

Publication number: WO2010110087A1
Application number: PCT/JP2010/054154
Authority: WO
Inventors: 研一江畑
Original assignee: 旭硝子株式会社
Priority date: 2009-03-24
Filing date: 2010-03-11
Publication date: 2010-09-30
Also published as: TWI480165B; KR20110131223A; CN102362305A; CN102362305B; TW201113155A; JPWO2010110087A1

Abstract

Provided is a manufacturing method for an electronic device, wherein an electronic device (10) with a support comprises a substrate (12) having a first main surface and a second main surface on which an electronic device member (14) is provided and a support substrate (19) having a first main surface and a second main surface. A resin layer (18) having a releasable surface secured to the first main surface of the support substrate is closely connected to the first main surface of the substrate (12). The manufacturing method comprises a step of separating a support consisting of the support substrate (19) and the resin layer (18) from the electronic device (10) with a support to obtain an electronic device including the electronic device member (14) and the substrate (12), and a step of removing a foreign matter adhered to the first main surface of the substrate (12) in the electronic device.

Description

Manufacturing method of electronic device

The present invention relates to an electronic device manufacturing method and an electronic device with a support.

In recent years, liquid crystal display devices (LCD) and organic EL display devices (OLED) have been widely used as display devices. In particular, in the field of mobile display devices such as mobile phones and mobile phones, there is a demand for lighter and thinner display devices.
Similarly, electronic devices such as solar cells, thin film secondary batteries, and semiconductor wafers having a circuit formed on the surface are also required to be lighter and thinner.
In order to meet these demands, thinning of substrates such as glass, resin, and metal used for electronic devices such as display devices has been progressing.
In the case of a glass substrate, as a method of reducing the plate thickness, generally, after forming a display device member on the surface of the glass substrate and forming a display device panel, both outer sides of the display device panel are formed using chemical etching. A method of etching the surface to reduce the thickness of the display device panel is used.

In this method of thinning the substrate by chemical etching, for example, when thinning the thickness of one glass substrate from 0.7 mm to 0.2 mm or 0.1 mm, most of the original glass substrate material is etched. Since it will be scraped off by the liquid, it is not preferable from the viewpoint of productivity and efficiency of use of raw materials. On the other hand, if a glass substrate having a thin plate thickness is adopted from the beginning to manufacture a TFT array substrate or a color filter substrate, the strength of the glass substrate at the time of manufacture becomes insufficient and the amount of deflection increases. Therefore, the problem that it cannot process in the existing manufacturing line arises.
In the substrate thinning method by chemical etching, the glass substrate is thinned by performing chemical etching after forming the display device member on the surface of the glass substrate. There is a case in which a problem that an obvious scratch appears, that is, a problem of generation of etch pits may occur.

Therefore, for the purpose of solving such problems, a thin glass substrate having a thickness of less than 0.7 mm (also referred to as “thin glass substrate”) is bonded to another supporting glass substrate to form a laminate, A method of performing a predetermined process for manufacturing the display device in a state and then separating the thin glass substrate and the supporting glass substrate has been proposed.

For example, in Patent Document 1, a product glass substrate and a reinforcing glass substrate are bonded and integrated using an electrostatic adsorption force or a vacuum adsorption force between glass substrates, and a display using the product glass substrate is used. A method of manufacturing the device is described.
Further, Patent Document 2 describes a method for manufacturing a liquid crystal display device in which end portions of a substrate and a support of a liquid crystal display device are bonded using a glass frit adhesive, and thereafter an electrode pattern or the like is formed. Has been.
Patent Document 3 describes a method for manufacturing a substrate for a display device, which includes a step of irradiating laser light to at least the vicinity of the edge surface of two glass substrates to fuse the two glass substrates.

In Patent Document 4, a substrate is attached to a substrate transport jig having an adhesive layer provided on a support, and the substrate transport jig is transported through a manufacturing process of a liquid crystal display element. A liquid crystal display device manufacturing method is described in which liquid crystal display element formation processing is sequentially performed on a substrate attached to a jig, and the substrate is peeled off from the substrate carrying jig after a predetermined process is completed.
In Patent Document 5, an electrode substrate for a liquid crystal display element is subjected to a predetermined processing on the electrode substrate for a liquid crystal display element using a jig in which an ultraviolet curable adhesive is provided on a support, and then an ultraviolet curable type is used. A method for producing a liquid crystal display device, comprising: irradiating an adhesive with ultraviolet rays to reduce the adhesive strength of the ultraviolet curable adhesive and peeling the electrode substrate for a liquid crystal display element from the jig. Has been.
Patent Document 6 describes a transport method in which a thin plate is temporarily fixed to a support plate with an adhesive, a peripheral portion of the adhesive is sealed with a sealant, and the support plate on which the thin plate is temporarily fixed is transported.

Patent Document 7 discloses a thin glass laminate obtained by laminating a thin glass substrate and a supporting glass substrate, and the thin glass substrate and the supporting glass substrate have peelability and non-adhesiveness. A thin glass laminate characterized by being laminated via a silicone resin layer is described. Then, in order to separate the thin glass substrate and the supporting glass substrate, it is only necessary to apply a force to separate the thin glass substrate from the supporting glass substrate in the vertical direction. It is described that it can be more easily peeled off by injecting air into the interface.
Patent Document 8 describes a double-sided adhesive sheet for manufacturing semiconductors using silicone.

Japanese Unexamined Patent Publication No. 2000-241804 Japanese Unexamined Patent Publication No. 58-54316 Japanese Unexamined Patent Publication No. 2003-216068 Japanese Patent Laid-Open No. 8-86993 Japanese Unexamined Patent Publication No. 9-105896 Japanese Unexamined Patent Publication No. 2000-252342 International Publication No. 2007/018028 Pamphlet Japanese Unexamined Patent Publication No. 2004-26950

However, a method for fixing glass substrates described in Patent Document 1 using electrostatic adsorption force or vacuum adsorption force, a method for fixing both ends of a glass substrate described in Patent Document 2 with glass frit, or Patent Document 3 In the method of merging two glass substrates by irradiating laser light near the end face of the peripheral portion described in the above, the glass substrates are laminated and adhered without any intermediate layer. Distortion defects occur in the glass substrate due to foreign matters such as dust. Therefore, it is difficult to obtain a glass substrate laminate having a smooth surface.

In addition, in the method of disposing an adhesive layer or the like between glass substrates described in Patent Documents 4 to 6, although the occurrence of distortion defects due to mixing of bubbles or the like between the glass substrates as described above can be avoided, both glasses It is difficult to separate the substrate, and the thin glass substrate may be damaged during the separation. Further, the remaining adhesive on the thin glass substrate after separation also becomes a problem.

On the other hand, according to the thin glass substrate laminate described in Patent Document 7, distortion defects due to mixing of bubbles or the like between the glass substrates as described above are unlikely to occur. It is also possible to peel the thin glass substrate and the supporting glass substrate. Furthermore, the problem of remaining adhesive on the thin glass substrate after peeling is solved. However, even if a film with an adhesive such as a polarizing film or a retardation film is attached to the surface of the thin glass substrate after peeling, the adhesive strength is weak and the film may peel off. In particular, it was easy to peel off when the pressure sensitive adhesive in the polarizing film or the like was acrylic. When the present inventor diligently investigated the cause, in the case of the laminated body described in Patent Document 7, it seems that the silicone resin layer does not remain on the thin glass substrate after peeling, but some sort of origin derived from the resin layer. Substance (for example, a compound. Also, for example, a low molecular weight compound that is a part of a substance that forms a resin layer and is deposited on the surface of the resin layer). It was thought that this was caused by a slight amount of foreign matter such as dust scattered in the air, metal pieces or machine oil resulting from the manufacturing process on the surface of the thin glass substrate. Furthermore, the present inventor has found a method for removing the foreign matter without causing thermal, electromagnetic, mechanical and chemical damage to the thin glass substrate and the display device member attached thereto. When the thin glass substrate is a part of the display device panel, a display device member such as a thin film transistor, an organic EL element, or a color filter is formed on the surface opposite to the separation surface of the thin glass substrate. This is because there are cases where the two thin glass substrates are made into cells by the sealing agent, and it is necessary to prevent them from being damaged as described above.

The present invention has been made in view of the above problems. That is, the present invention provides an electronic device by peeling a support made of the resin layer and the support substrate from an electronic device with a support in which a substrate having a member for an electronic device, a resin layer, and a support substrate are laminated. After that, the main surface of the electronic device substrate is not damaged without causing thermal, electromagnetic, mechanical and chemical damage to the substrate and the electronic device member (eg, thin film transistor, organic EL element, color filter). A method of manufacturing an electronic device that can remove attached foreign matter and, as a result, can firmly adhere a film with an adhesive such as a polarizing film or a retardation film to the surface of the substrate after peeling with a resin layer attached The purpose is to provide.

The present inventor has intensively studied in order to solve the above problems, and has completed the present invention.
The present invention relates to the following (1) to (8).

(1) The first of the support substrate having the first main surface and the second main surface on the first main surface of the substrate having the first main surface and the second main surface and having the electronic device member on the second main surface. A support comprising the support substrate and the resin layer is peeled from an electronic device with a support to which a resin layer having a peelable surface fixed to the main surface is in close contact, and includes the electronic device member and the substrate. The manufacturing method of an electronic device which comprises the peeling process which obtains an electronic device, and the removal process which removes the foreign material attached to the 1st main surface of the said board | substrate in the said electronic device.

(2) The method for manufacturing an electronic device according to (1), wherein the resin layer is a silicone resin layer.

(3) the adhesive strength of the first main surface of the substrate before the releasing surface of the resin layer in close contact with the first main surface of the substrate and f _0, the in an electronic device obtained after the removing step board The manufacturing method of the electronic device according to (1) or (2), wherein f ≧ f ₀ when the adhesive strength of the first main surface is f.

(4) The method for manufacturing an electronic device according to any one of (1) to (3), wherein the removing step is a step of irradiating the first main surface of the substrate with plasma to remove the foreign matter. .

(5) The method for manufacturing an electronic device according to any one of (1) to (3), wherein the removing step is a step of removing the foreign matter using a chemical solution containing an acid or an alkali.

(6) Manufacture of an electronic device according to any one of (1) to (3), wherein the removing step is a step of removing the foreign matter using a chemical solution containing a solvent having a solubility parameter of 7 to 15. Method.

(7) The method for manufacturing an electronic device according to (5) or (6), which is a step of further removing the foreign matter using ultrasonic vibration.

(8) The method of manufacturing an electronic device according to any one of (1) to (7), wherein the electronic device has two or more removal steps.

According to the present invention, a substrate having a member for an electronic device such as a display device, an electronic device with a support in which a resin layer and a support substrate are laminated, a support made of the resin layer and the support substrate is peeled off, After obtaining the electronic device, the substrate for the electronic device without causing thermal, electromagnetic, mechanical and chemical damage to the substrate and the member for the electronic device (for example, thin film transistor, organic EL element, color filter) As a result, it is possible to firmly adhere a film with an adhesive such as a polarizing film or a retardation film to the surface of the substrate after the peeling, to which the resin layer is attached. A device manufacturing method can be provided.

FIG. 1 is a schematic cross-sectional view showing one embodiment of the panel with a support of the present invention. FIG. 2: is a schematic front view which shows another one aspect | mode of the panel with a support body of this invention. FIG. 3 is a schematic cross-sectional view showing another embodiment of the panel with a support of the present invention. FIG. 4 is a schematic front view showing another embodiment of the panel with a support of the present invention. FIG. 5: is a schematic front view which shows another one aspect | mode of the panel with a support body of this invention. FIG. 6 is a schematic cross-sectional view showing another embodiment of the panel with a support of the present invention. FIG. 7 is a schematic diagram for explaining an example of an atmospheric pressure remote plasma apparatus that can be used in the removing step of the panel manufacturing method of the present invention.

The present invention will be described.
The electronic device manufacturing method of the present invention (hereinafter also referred to as “the electronic device manufacturing method of the present invention”) is a first substrate having a first main surface and a second main surface and an electronic device member on the second main surface. From the electronic device with a support, in which the resin layer having a peelable surface fixed to the first main surface of the support substrate having the first main surface and the second main surface is in close contact with the main surface, the support substrate and the A peeling step of peeling a support made of a resin layer to obtain an electronic device including the electronic device member and the substrate; and a removing step of removing foreign substances attached to the first main surface of the substrate in the electronic device; An electronic device manufacturing method comprising:

Moreover, the electronic device with a support used for the peeling step in the electronic device manufacturing method of the present invention, that is, the first main surface and the second main surface on the first main surface of the substrate having the first main surface and the second main surface. The electronic device with a support in which the resin layer having a peelable surface fixed to the first main surface of the support substrate having a surface is in close contact is also referred to as “the electronic device with a support of the present invention” below.

Although details will be described later, the electronic device with a support used in the present invention is provided on the first main surface of the substrate having the first main surface and the second main surface and the electronic device member on the second main surface. The resin layer having a peelable surface fixed to the first main surface of the support substrate having the first main surface and the second main surface is in close contact.
That is, the electronic device with a support has an electronic device member, a substrate, a resin layer, and a support substrate, which are laminated in this order. The electronic device has an electronic device member and a substrate, and the electronic device member is formed on the second main surface of the substrate.
Moreover, the electronic device with a support body is one in which a laminate in which a substrate, a resin layer, and a support substrate are laminated in this order is laminated via an electronic device member, that is, a support substrate, a resin layer, a substrate, an electron A device member, a substrate, a resin layer, and a support substrate may be laminated in this order.
Here, the electronic device refers to an electronic component such as a display panel, a solar cell, a thin film secondary battery, or a semiconductor wafer having a circuit formed on the surface. The display device panel includes a liquid crystal panel, an organic EL panel, a plasma display panel, a field emission panel, and the like.
Hereinafter, as one of the electronic devices in the present invention, a panel for a display device in which a substrate and a supporting substrate are made of glass will be described in detail. Below, the manufacturing method of the panel for display apparatuses is called "the panel manufacturing method of this invention", and the panel for display apparatuses with a support body is called "the panel with a support body of this invention."

First, the thin glass substrate in the panel with a support of the present invention will be described.
The thickness, shape, size, physical properties (heat shrinkage rate, surface shape, chemical resistance, etc.), composition, etc. of the thin glass substrate are not particularly limited. For example, conventional glass for display devices such as LCD and OLED It may be the same as the substrate.

The thickness of the thin glass substrate is preferably less than 0.7 mm, more preferably 0.5 mm or less, and further preferably 0.4 mm or less. Further, the thickness of the thin glass substrate is preferably 0.05 mm or more, more preferably 0.07 mm or more, and further preferably 0.1 mm or more.

The shape of the thin glass substrate is not limited, but is preferably rectangular. Here, the rectangle is substantially a rectangle and includes a shape obtained by cutting off the corners of the peripheral portion (corner cut).

Although the size of the thin glass substrate is not limited, for example, in the case of a rectangle, it may be 100 to 2000 mm × 100 to 2000 mm, and more preferably 500 to 1000 mm × 500 to 1000 mm.
Even with such a thickness and size, in the present invention, the thin glass substrate and the support can be easily peeled off.

Properties of the thin glass substrate such as thermal shrinkage, surface shape, chemical resistance, etc. are not particularly limited, and vary depending on the type of display device to be manufactured.
The heat shrinkage rate is preferably small. Specifically, the linear expansion coefficient, which is an index of the thermal shrinkage rate, is preferably 500 × 10 ⁻⁷ / ° C. or less, more preferably 300 × 10 ⁻⁷ / ° C. or less, and 200 × 10 ⁻⁷ / ° C. More preferably, it is 100 ° C. ⁻⁷ / ° C. or less, and further preferably 45 × 10 ⁻⁷ / ° C. or less.
In addition, in this invention, a linear expansion coefficient means a thing prescribed | regulated to JISR3102 (1995).

The composition of the glass material of the thin glass substrate may be the same as that of alkali glass or alkali-free glass containing an alkali metal oxide that is conventionally known, for example. Among these, alkali-free glass is preferable because of its low thermal shrinkage rate.

The panel with a support of the present invention has a display device member on the second main surface of the thin glass substrate.
The display device member is composed of a light emitting layer, a protective layer, a TFT array (hereinafter referred to as an array), a color filter, a liquid crystal, and ITO that are provided on the surface of a conventional glass substrate for a display device such as an LCD or OLED. It means various circuit patterns such as transparent electrodes. The kind of member for display apparatuses on the 2nd main surface of the said thin glass substrate is not specifically limited.
A panel for a display device is composed of such a member for a display device and the thin glass substrate.

Next, the support glass substrate in the panel with a support of the present invention will be described.
The panel with a support of the present invention has a support glass substrate on which a resin layer is fixed as a support on the first main surface of the thin glass substrate. The supporting glass substrate is in close contact with the thin glass substrate through the resin layer, and reinforces the strength of the thin glass substrate.

The thickness, shape, size, physical properties (heat shrinkage rate, surface shape, chemical resistance, etc.), composition, etc. of the supporting glass substrate are not particularly limited.
The thickness of the supporting glass substrate is not particularly limited, but it is necessary that the supporting glass panel of the present invention has such a thickness that can be processed in the current production line.
For example, the thickness is preferably 0.1 to 1.1 mm, more preferably 0.3 to 0.8 mm, and still more preferably 0.4 to 0.7 mm.
For example, when the current production line is designed to process a substrate having a thickness of 0.5 mm and the thickness of the thin glass substrate is 0.1 mm, the thickness of the supporting glass substrate and the resin layer Together with the thickness, it is 0.4 mm. In addition, the current production line is most commonly designed to process a glass substrate having a thickness of 0.7 mm. For example, if the thickness of a thin glass substrate is 0.4 mm, the resin layer The thickness is 0.3 mm.
The relationship between the thickness of the supporting glass substrate and the relative thickness of the thin glass substrate is not limited, and the thickness of the supporting glass substrate may be larger than the thickness of the thin glass substrate. It may be thinner than the thickness of the thin glass substrate.

The shape of the supporting glass substrate is not limited, but is preferably rectangular. Here, the rectangle is substantially a rectangle and includes a shape obtained by cutting off the corners of the peripheral portion (corner cut).

Although the size of the supporting glass substrate is not limited, it is preferably about the same as the thin glass substrate, and slightly larger than the thin glass substrate. For example, specifically, it is preferable that the longitudinal direction or the lateral direction is larger by about 0.05 to 10 mm. The reason is that it is easy to protect the end portion of the thin glass substrate from the contact of an alignment device such as a positioning pin at the time of manufacturing a panel for a display device, and that the thin glass substrate and the supporting glass substrate are more easily separated. Because it can.

The supporting glass substrate may have a linear expansion coefficient that is substantially the same as or different from that of the thin glass substrate. Substantially the same is preferable in that the thin glass substrate or the supporting glass substrate is less likely to warp when processed by the panel manufacturing method of the present invention.
The difference in linear expansion coefficient between the thin glass substrate and the supporting glass substrate is preferably 300 × 10 ⁻⁷ / ° C. or less, more preferably 100 × 10 ⁻⁷ / ° C. or less, and 50 × 10 ⁻⁷ / ° C. More preferably, it is not higher than ° C.

The composition of the glass material of the supporting glass substrate may be the same as that of alkali glass or non-alkali glass, for example. Among these, alkali-free glass is preferable because of its low thermal shrinkage rate.

In the embodiment of the present invention, the substrate is a thin glass substrate, but the present invention is not limited to this. From the viewpoint of industrial availability, glass plates, silicon wafers, metal plates, plastic plates and the like are preferable examples.
When a thin glass plate (thin glass substrate) is employed as the substrate, the composition of the thin glass substrate may be the same as that of alkali glass or non-alkali glass, for example. Among these, alkali-free glass is preferable because of its low thermal shrinkage rate.
When adopting a plastic plate as the substrate, the type is not particularly limited, for example, in the case of a transparent substrate, polyethylene terephthalate resin, polycarbonate resin, polyethersulfone resin, polyethylene naphthalate resin, polyacrylic resin, polysilicone resin, Examples thereof include transparent fluororesins. In the case of an opaque substrate, polyimide resin, fluorine resin, polyamide resin, polyaramid resin, polyether ketone resin, polyether ether ketone resin, various liquid crystal polymer resins, and the like are exemplified.
When a metal plate is employed as the substrate, the type is not particularly limited, and examples thereof include a stainless steel plate and a copper plate.
The heat resistance of the substrate is not particularly limited, but it is preferable that the heat resistance is high when forming a TFT array of a display device member. Specifically, the 5% heating weight loss temperature is preferably 300 ° C. or higher. Furthermore, it is more preferable that it is 350 degreeC or more.
In this case, any of the above glass plates is applicable in terms of heat resistance.
From the viewpoint of heat resistance, preferable plastic plates include polyimide resin, fluororesin, polyamide resin, polyaramid resin, polyethersulfone resin, polyetherketone resin, polyetheretherketone resin, polyethylene naphthalate resin, various liquid crystal polymer resins, etc. Is exemplified.
The substrate may be a laminate in which different materials are laminated, such as a glass plate, a silicon wafer, a metal plate, and a plastic plate. For example, a laminate in which different types of substrates are laminated via a resin layer, such as a laminate in which a glass plate, a resin layer, and a plastic plate are laminated in this order, or a laminate in which a glass plate, a plastic, and a glass plate are laminated in this order. The laminated body which uses what was multilayered with the board | substrate of a different kind so that it may be used as a board | substrate is mentioned.
Furthermore, the laminated body etc. which use as a board | substrate what laminated | stacked the same kind board so that two or more glass plates or two or more plastic plates may be used as a board | substrate may be sufficient.

In the embodiment of the present invention, the support substrate is a support glass substrate using a glass plate, but the present invention is not limited to this. From the viewpoint of industrial availability, glass plates, silicon wafers, metal plates, plastic plates and the like are preferable examples.
When a glass plate is employed as the support substrate, the thickness, shape, size, physical properties (thermal shrinkage, surface shape, chemical resistance, etc.), composition, etc. of the support glass substrate are not particularly limited.
The thickness of the supporting glass substrate is not particularly limited, but it is necessary that the supporting glass substrate has a thickness that can be processed by the current production line.
For example, the thickness is preferably 0.1 to 1.1 mm, more preferably 0.3 to 0.8 mm, and still more preferably 0.4 to 0.7 mm.
For example, when the current production line is designed to process a substrate having a thickness of 0.5 mm and the thickness of the thin glass substrate is 0.1 mm, the thickness of the supporting glass substrate and the resin layer Together with the thickness, it is 0.4 mm. In addition, the current production line is most commonly designed to process a glass substrate having a thickness of 0.7 mm. For example, if the thickness of a thin glass substrate is 0.4 mm, the resin layer The thickness is 0.3 mm.
The thickness of the supporting glass substrate is preferably thicker than that of the thin glass substrate.

Next, the resin layer in the panel with a support of the present invention will be described.
The resin layer is fixed to the first main surface of the support glass substrate. And although the resin layer is closely_contact | adhered to the 1st main surface of the said thin glass substrate, it can peel easily. That is, the resin layer is bonded to the first main surface of the thin glass substrate with a certain degree of bonding force, but when peeling, the bonding force is such that the thin glass substrate can be easily peeled without breaking. It is combined with. In this invention, the property which can peel easily on the surface of a resin layer is called peelability.
In the panel with a support of the present invention, the resin layer and the first main surface of the thin glass substrate are not attached by the adhesive force that the adhesive has, the force due to van der Waals force between solid molecules, That is, it is preferable that it is attached by adhesion.
On the other hand, the bonding force of the resin layer to the first main surface of the supporting glass substrate is relatively higher than the bonding force of the thin glass substrate to the first main surface. In this invention, the coupling | bonding with respect to the 1st main surface of a thin glass substrate is called close_contact | adherence, and the coupling | bonding with respect to the 1st main surface of a support glass substrate is called fixation.

The thickness of the resin layer is not particularly limited. The thickness is preferably 1 to 100 μm, more preferably 5 to 30 μm, and even more preferably 7 to 20 μm. This is because when the thickness of the resin layer is within such a range, the first main surface of the thin glass substrate and the resin layer are sufficiently adhered.
Moreover, even if bubbles or foreign substances are present, it is possible to suppress the occurrence of distortion defects in the thin glass substrate. On the other hand, if the resin layer is too thick, it takes time and materials to form the resin layer, which is not economical.

In addition, the resin layer may consist of two or more layers. In this case, “the thickness of the resin layer” means the total thickness of all the layers.
Moreover, when a resin layer consists of two or more layers, the kind of resin which forms each layer may differ.

In the resin layer, the surface tension of the peelable surface of the resin layer with respect to the first main surface of the thin glass substrate is preferably 30 mN / m or less, more preferably 25 mN / m or less, and 22 mN / m or less. More preferably. This is because such surface tension can be more easily peeled off from the first main surface of the thin glass substrate, and at the same time, the close contact with the first main surface of the thin glass substrate becomes sufficient.
Moreover, it is preferable that a resin layer consists of a material whose glass transition point is lower than room temperature (about 25 degreeC) or does not have a glass transition point. It becomes a non-adhesive resin layer, has higher releasability, can be more easily peeled off from the first main surface of the thin glass substrate, and at the same time, is sufficiently adhered to the first main surface of the thin glass substrate Because.
Moreover, it is preferable that the resin layer has heat resistance. In the panel manufacturing method of the present invention, for example, when a member for a display device is formed on the second main surface of the thin glass substrate, the glass laminate of the thin glass substrate, the resin layer, and the supporting glass substrate can be subjected to heat treatment. Because.
Moreover, since the adhesiveness with the 1st main surface of a thin glass substrate will become low when the elasticity modulus of a resin layer is too high, it is unpreferable. Moreover, since an exfoliation property will become low when an elasticity modulus is too low, it is unpreferable.

The type of resin forming the resin layer is not particularly limited. For example, acrylic resin, polyolefin resin, polyurethane resin, and silicone resin can be used. Several types of resins can be mixed and used. Of the group of resins, silicone resins are preferred. This is because the silicone resin is excellent in heat resistance and preferably has a degree of peelability from the thin glass substrate. In addition, when a curable silicone resin is cured on the first main surface of the support glass substrate to form a silicone resin layer, it is fixed to the support glass substrate by a condensation reaction with the silanol groups on the first main surface of the support glass substrate. It is easy. The silicone resin layer is also preferable in that the peelability does not substantially deteriorate even when it is treated at, for example, about 300 to 400 ° C. for about 1 hour.

The resin layer is preferably a cured product of curable silicone for release paper among silicone resins. The silicone for release paper is mainly composed of silicone containing linear dimethylpolysiloxane in the molecule. The resin layer formed by curing the composition containing the main agent and the crosslinking agent on the surface (first main surface) of the supporting glass substrate using a catalyst, a photopolymerization initiator or the like has excellent peelability. Therefore, it is preferable. Further, since the resin layer has high flexibility, even if foreign matter such as bubbles or dust is mixed between the thin glass substrate and the resin layer, the occurrence of distortion defects of the thin glass substrate can be suppressed.

Such silicone for release paper is classified into a condensation reaction type silicone, an addition reaction type silicone, an ultraviolet curable type silicone, or an electron beam curable type silicone depending on the curing mechanism, and any of them can be used. Among these, addition reaction type silicone is preferable. This is because the curing reaction is easy, the degree of peelability is good when the resin layer is formed, and the heat resistance is also high.

Moreover, the silicone for release paper is classified into a solvent type, an emulsion type, and a solventless type, and any type can be used. Among these, a solventless type is preferable. This is because productivity, safety, and environmental characteristics are excellent. Further, since a solvent that causes foaming is not included at the time of curing when forming the resin layer, that is, at the time of heat curing, ultraviolet curing, or electron beam curing, bubbles are unlikely to remain in the resin layer.

As release paper silicone, specifically, commercially available product names or model numbers are KNS-320A, KS-847 (both manufactured by Shin-Etsu Silicone), TPR6700 (GE Toshiba Silicone), vinyl Combination of silicone “8500” (Arakawa Chemical Industries, Ltd.) and methyl hydrogen polysiloxane “12031” (Arakawa Chemical Industries, Ltd.), vinyl silicone “11364” (Arakawa Chemical Industries, Ltd.) and methyl hydrogen Combination with polysiloxane "12031" (manufactured by Arakawa Chemical Co., Ltd.), combination of vinyl silicone "11365" (manufactured by Arakawa Chemical Industries, Ltd.) and methylhydrogen polysiloxane "12031" (manufactured by Arakawa Chemical Industries, Ltd.) Etc. KNS-320A, KS-847, and TPR6700 are silicones that contain a main agent and a crosslinking agent in advance.

Further, it is preferable that the silicone resin forming the resin layer has a property that the components in the silicone resin do not easily migrate to the thin glass substrate, that is, low silicone migration.

Next, the support-equipped panel of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic cross-sectional view showing one embodiment of the panel with a support of the present invention.
In FIG. 1, the display device panel 16 includes a layered display device member 14 and a thin glass substrate 12, which are laminated. Here, the display device member 14 is formed on the second main surface of the thin glass substrate 12. And the 1st main surface of the thin glass substrate 12 and the surface of the resin layer 18 fixed to the 1st main surface of the support glass substrate 19 adhere closely, and the panel 10 with a support body of this invention is formed. ing.
In the panel 10 with a support of the present invention shown in FIG. 1, the thin glass substrate 12, the resin layer 18, and the support glass substrate 19 have substantially the same size in the surface direction.

FIG. 2 is a schematic front view showing another embodiment of the panel with a support of the present invention, and FIG. 3 is a cross-sectional view (schematic cross-sectional view) taken along line AA ′.
2 and 3, the display device panel 26 includes a layered display device member 24 and a thin glass substrate 22, which are laminated. Here, the display device member 24 is formed on the second main surface of the thin glass substrate 22. And the 1st main surface of the thin glass substrate 22 and the resin layer 28 fixed to the 1st main surface of the support glass substrate 29 have adhered, and the panel 20 with a support body of this invention is formed. Yes.
The panel 20 with a support of the present invention of the embodiment shown in FIGS. 2 and 3 has a major surface area of the support glass substrate 29 larger than that of the thin glass substrate 22, and the outer edge in the surface direction of the thin glass substrate 22 is support glass. It does not protrude from the outer edge of the substrate 29.

2 and 3, the panel 20 with a support of the present invention has an area (hereinafter referred to as “surface” in the resin layer) of the surface of the resin layer 28 (surface contacting the first main surface of the thin glass substrate 22). The area of the first main surface of the thin glass substrate 22 is larger than the area. The surface area of the resin layer 28 is smaller than the area of the first main surface of the thin glass substrate 22 due to the formation of gaps 25 described later. A portion α of the first main surface of the thin glass substrate 22 that is not in contact with the resin layer 28 and a portion β of the supporting glass substrate 29 facing the end α of the support-equipped panel 20 of the present invention (γ1, γ2). ) Is formed.
It is preferable that such a gap portion 25 is formed because the thin glass substrate and the resin layer can be more easily peeled in the peeling step in the panel manufacturing method of the present invention described later.

Further, the depth of the gap portion 25 is preferably 1 mm or more, more preferably 3 mm or more, and further preferably 5 mm or more. Moreover, it is preferable that it is 15 mm or less, and it is more preferable that it is 10 mm or less. This is because the thin glass substrate and the resin layer can be more easily peeled in the peeling step in the panel manufacturing method of the present invention described later.
The “depth of the gap” means the length from the end surface (γ2) of the thin glass substrate to the end surface of the resin layer in the direction perpendicular to the end surface. In the case shown in FIGS. 2 and 3, it means the length of the portion indicated by α. As shown in FIG. 5 to be described later, when the length in the direction perpendicular to the end surface from the end surface of the thin glass substrate to the end surface of the resin layer varies depending on the location of the end surface of the thin glass substrate as the starting point, the maximum Is the “depth of the gap”.

Further, the position of the gap portion 25 may be the central portion of one side of the rectangular thin glass substrate 22 as shown in FIG. 2, or all of one side of the rectangular thin glass substrate 22 as shown in FIG. Good. Further, one of the corners of the rectangular thin glass substrate 22 as shown in FIG. 5 may be a large corner cut. 4 and 5 are schematic front views showing still another aspect of the panel with a support according to the present invention.

Further, as shown in the schematic sectional view of FIG. 6, the panel with a support of the present invention supports both main surfaces of the display device member 34 with the thin glass substrates (32a, 32b) and the resin layers (38a, 38b). A mode of sandwiching with a laminated body with glass substrates (39a, 39b) may be employed. Even if it is such an aspect, it is a panel with a support body of this invention which can be processed with the panel manufacturing method of this invention.

Next, the manufacturing method of the panel with a support of this invention is demonstrated.
Although the manufacturing method of the panel with a support body of this invention is not specifically limited, The resin layer formation process which forms the resin layer which has a peelable surface in the 1st main surface of the said support glass substrate, The said thin glass substrate, and the said support glass An adhesion process for laminating a substrate and bringing the peelable surface of the resin layer into close contact with the first main surface of the thin glass substrate; and a display device for forming a display device member on the second main surface of the thin glass substrate It is preferable that it is a manufacturing method of the panel with a support which comprises for a member formation process.

The manufacturing method of the thin glass substrate and the supporting glass substrate in the manufacturing method of the panel with a support of the present invention is not particularly limited. For example, it can be produced by a conventionally known method. For example, it can be obtained by melting a conventionally known glass raw material to form a molten glass, and then forming it into a plate shape by a float method, a fusion method, a slot method, a redraw method or the like.

The resin layer formation process in the manufacturing method of the panel with a support of this invention is demonstrated.
The method for forming the resin layer on the surface (first main surface) of the supporting glass substrate is not particularly limited.
For example, a method of adhering a film-like resin to the surface of a supporting glass substrate can be mentioned. Specifically, a method of performing a surface modification treatment to give a high adhesive force to the surface of the film and adhering to the first main surface of the supporting glass substrate can be mentioned. Treatment methods for surface modification include chemical methods (primer treatment) that chemically improve adhesion, such as silane coupling agents, and physical methods that increase surface active groups, such as flame (flame) treatment. Examples thereof include a mechanical method for increasing the catch by increasing the surface roughness, such as sandblasting.

Moreover, the method of coating the resin composition used as a resin layer on the 1st main surface of a support glass substrate by a well-known method, for example is mentioned. Known methods include spray coating, die coating, spin coating, dip coating, roll coating, bar coating, screen printing, and gravure coating. From such a method, it can select suitably according to the kind of resin composition.
For example, when a solventless release paper silicone is used as the resin composition, a die coating method, a spin coating method or a screen printing method is preferred.

When manufacturing the panel with a support of the present invention having a gap as described with reference to FIGS. 2 to 5, mask the portions where the gap is to be formed in advance, and coat the resin composition thereon. It is preferable to do. Masking means that when a resin composition is coated, a removable film or the like is pasted on a portion where a gap is formed in advance so that the resin composition is not coated on that portion, and the film is peeled off later. Is the method.

When the resin composition is coated on the first main surface of the supporting glass substrate, the coating amount is preferably 1 to 100 g / m ² , and more preferably 5 to 20 g / m ² .

As another method, for example, when a resin layer is formed from an addition reaction type silicone, a resin composition containing a silicone (main agent) containing linear dimethylpolysiloxane in the molecule, a crosslinking agent and a catalyst, The coating is performed on the first main surface of the supporting glass substrate by a known method such as the spray coating method, followed by heat curing. The heating and curing conditions vary depending on the blending amount of the catalyst. For example, when 2 parts by weight of a platinum-based catalyst is blended with respect to 100 parts by weight of the total amount of the main agent and the cross-linking agent, The reaction is preferably carried out at 100 ° C to 200 ° C. In this case, the reaction time is 5 to 60 minutes, preferably 10 to 30 minutes. In order to obtain a silicone resin layer having a low silicone migration property, it is preferable to allow the curing reaction to proceed as much as possible so that an unreacted silicone component does not remain in the silicone resin layer, but at such a reaction temperature and reaction time. When it exists, it is possible to prevent an unreacted silicone component from remaining in the silicone resin layer, which is preferable. If the reaction time is too long or the reaction temperature is too high, the silicone resin is simultaneously oxidized and decomposed to produce a low molecular weight silicone component, which may increase the silicone transferability. It is preferable to allow the curing reaction to proceed as much as possible so that an unreacted silicone component does not remain in the silicone resin layer in order to improve the peelability after the heat treatment.

After the resin layer is formed on the first main surface of the supporting glass substrate by such a method, a thin glass substrate is laminated on the surface of the resin layer.
Also, for example, when a resin layer is manufactured using silicone for release paper, the silicone resin layer is formed by heating and curing the silicone for release paper coated on the first main surface of the supporting glass substrate, and then the adhesion step The thin glass substrate is laminated on the silicone resin-formed surface of the supporting glass substrate. By curing the release paper silicone with heat, the cured silicone resin is chemically bonded to the supporting glass substrate. Moreover, a silicone resin layer couple | bonds with a support glass substrate by an effect. By these actions, the silicone resin layer is firmly fixed to the first main surface of the supporting glass substrate.

The contact | adherence process in the manufacturing method of the panel with a support body of this invention is demonstrated.
The adhesion step includes laminating the first main surface of the thin glass substrate and the support glass substrate on which the resin layer is formed on the first main surface, and the resin layer on the first main surface of the thin glass substrate. It is the process of closely attaching the peelable surface.
The first main surface of the thin glass substrate and the peelable surface of the resin layer are preferably bonded by a force caused by van der Waals force between the solid molecules facing each other, that is, an adhesion force. In this case, the supporting glass substrate and the thin glass substrate can be held in a laminated state.

A method for laminating the thin glass substrate and the supporting glass substrate in which the resin layer is fixed to the first main surface is not particularly limited. For example, it can implement using a well-known method. For example, after laminating a thin glass substrate on the surface of the resin layer under a normal pressure environment, a method of pressure bonding the resin layer and the thin glass substrate using a roll or a press can be mentioned. It is preferable because the resin layer and the thin glass substrate are more closely adhered by pressure bonding with a roll or a press. Further, it is preferable because bubbles mixed between the resin layer and the thin glass substrate can be easily removed by pressure bonding with a roll or a press.
When pressure bonding is performed by a vacuum laminating method or a vacuum pressing method, it is more preferable because suppression of bubble mixing and securing of good adhesion are more preferably performed. By pressure bonding under vacuum, there is an advantage that even if a minute bubble remains, the bubble does not grow by heating, and it is difficult to cause a distortion defect of the thin glass substrate.

In the adhesion step, when the thin glass substrate is laminated on the peelable surface of the resin layer of the supporting glass substrate, it is preferable that the surface of the thin glass substrate is sufficiently washed and laminated in a clean environment. Even if a foreign substance is mixed between the resin layer and the thin glass substrate, the resin layer is not deformed and does not affect the flatness of the surface of the thin glass substrate. Since it becomes favorable, it is preferable.

Thus, after obtaining the glass laminated body (henceforth "thin glass laminated body") which laminated | stacked the thin glass substrate, the resin layer, and the support glass substrate, it is the 1st of the thin glass substrate in this thin glass laminated body. (2) A display device member is formed on the main surface.
In forming the display device member, it is also preferable to improve the flatness by polishing the second main surface of the thin glass substrate as necessary.
The display device member is not particularly limited. For example, an array or a color filter included in the LCD can be mentioned. Further, for example, a transparent electrode, a hole injection layer, a hole transport layer, a light emitting layer, and an electron transport layer included in the OLED can be given.

The member formation process for display apparatuses in the manufacturing method of the panel with a support of the present invention is explained.
The display device member forming step is a step of forming a display device member on the second main surface of the thin glass substrate of the thin glass laminate.
A method of forming the display device member on the second main surface of the thin glass substrate of the thin glass laminate is not particularly limited, and may be the same as a conventionally known method.
For example, when manufacturing an LCD as a display device, a process for forming an array on a conventionally known glass substrate, a process for forming a color filter, a glass substrate on which the array is formed, and a glass substrate on which the color filter is formed are used as a sealing agent. It may be the same as various processes such as a process of bonding via an array (coloring process of array / color filter). More specifically, examples of the processing performed in these steps include pure water cleaning, drying, film formation, resist coating, exposure, development, etching, and resist removal. Furthermore, as a process performed after implementing an array color filter bonding process, there exists a liquid-crystal injection | pouring process and the sealing process of the injection port performed after implementation of this process, The process implemented by these processes is mentioned.

Taking the case of manufacturing an OLED as an example, as a process for forming an organic EL structure on the second main surface of a thin glass substrate, a process of forming a transparent electrode, a hole injection layer, a hole transport layer, Various processes such as a process for depositing a light emitting layer / electron transport layer and the like, a sealing process, and the like are performed. Specifically, for example, a film forming process, a vapor deposition process, and an adhesion of a sealing plate are performed. Processing and the like.

Thus, the panel with a support of the present invention can be produced.

Next, the panel manufacturing method of the present invention will be described.
Although the panel manufacturing method of this invention is not specifically limited, In the panel for display apparatuses obtained through the peeling process which peels the support body which consists of the said support glass substrate and the said resin layer from the said panel with a support body, and this peeling process It is preferable that it is a panel manufacturing method which comprises the removal process of removing foreign materials, such as a transcription | transfer material originating in the said resin layer, attached to the 1st main surface of a thin glass substrate.

The peeling process in the panel manufacturing method of this invention is demonstrated.
A peeling process is a process of peeling the support body which consists of the said support glass substrate and the said resin layer from the said panel for display apparatuses with a support body.
As long as the peeling method is a method capable of peeling without causing thermal, electromagnetic, mechanical and chemical damage to the thin glass substrate, the display device member formed on the second main surface, and the sealant. There is no particular limitation. Further, a method in which the supporting glass substrate is not damaged is preferable, and a method in which the resin layer having peelability fixed to the first main surface of the supporting glass substrate is not damaged is more preferable.

As a specific peeling method, for example, a sharp blade-like object can be inserted into the interface between the thin glass substrate and the resin layer, or a mixed fluid of water and compressed air can be blown off. Preferably, the panel with support is placed on the surface plate so that the supporting glass substrate side is on the upper side and the display device panel side is on the lower side, and the display device panel side substrate is vacuum-adsorbed on the surface plate (on both sides). In this state, the support glass substrate is laminated sequentially.) In this state, a mixed fluid of water and compressed air is sprayed on the boundary between the thin glass substrate and the resin layer of the panel with support, and the end of the support glass substrate is Pull up vertically. Then, an air layer is sequentially formed at the boundary, the air layer spreads over the entire boundary, and the support can be easily peeled off (support glass substrates are laminated on both main surfaces of the panel with the support). If it is, repeat the peeling step one side at a time).

The support that has been peeled off by such a peeling step can be reused. For example, when the resin layer is a silicone resin layer, the lower the silicone resin layer in the support after peeling, the lower the silicone transferability, so that the poor peeling due to the increase in peel strength when the glass laminate is subjected to the heating step is suppressed. Tend to be. Therefore, it can be reused more preferably.

The removal process in the panel manufacturing method of the present invention will be described.
The removing step is a step of removing foreign matter attached to the first main surface of the thin glass substrate in the display device panel.
As described above, a film with an adhesive such as a polarizing film or a retardation film on the first main surface (the surface in close contact with the resin layer) of the thin glass substrate in the display device panel obtained after being subjected to the peeling step. Even if affixed, the adhesive strength was weak and sometimes peeled off. When the present inventor examined the cause of this, the transferred material derived from the resin layer on the first main surface, dust particles scattered in the air, and foreign matters such as metal pieces and machine oil resulting from the manufacturing process were very little. It was thought that the cause was attached. Then, the inventor removes the foreign matter without causing thermal, electromagnetic, mechanical and chemical damage to the thin glass substrate and the display device member formed on the second main surface of the thin glass substrate. I found a way to do it.

As described above, the foreign matter is the first of the thin glass substrate including any substance derived from the resin layer (that is, a transfer product), dust particles scattered in the air, metal pieces or machine oil resulting from the manufacturing process, and the like. It means something other than a thin glass substrate attached to the main surface. Examples of the transferred material include compounds that form a resin layer, and those attached to the first main surface by being in close contact with the first main surface of the thin glass substrate. Further, for example, a low molecular compound that is a part of the substance forming the resin layer and is deposited on the surface of the resin layer can be used.
The transferred material will be specifically described. For example, when the resin layer is made of silicone, a comparison is made on the first main surface of the thin glass substrate due to the close contact between the first main surface of the thin glass substrate and the silicone resin layer fixed to the first main surface of the supporting glass substrate. It is considered that a low molecular weight silicone compound is attached by a diffusion effect in the resin layer. Here, when a glass laminated body passes through a heating process, it is difficult to remove a silicone compound from the 1st main surface of a thin glass substrate using the solvent etc. which can melt | dissolve a silicone compound. On the other hand, when the substrate is not a thin glass substrate but a substrate made of a resin such as polyimide (hereinafter also referred to as a resin substrate), the resin substrate is peeled off from the support, and then a resin that can dissolve the silicone compound is used to The silicone compound adhering to the first main surface of the substrate can be removed. In general, an acrylic adhesive is used in a polarizing film or the like, and is adjusted so as to obtain an appropriate adhesive strength to a hydrophilic glass substrate surface. On the other hand, when a silicone compound that is water repellent adheres to the glass substrate surface, the adhesive strength of the acrylic adhesive to the glass substrate surface decreases and the rework property increases, but the polarizing plate peels off due to external force. There is.
The factors that determine the adhesive strength of the polarizing film to the glass substrate surface include the hydrophilicity of the glass substrate surface, that is, the water contact angle, the elasticity of the film, the viscosity of the adhesive, etc. , And a 25 mm width polarizing film or a film with an adhesive attached to the glass substrate surface, and then measured by a method of peeling by 90 °.

The method for removing the foreign matter attached to the first main surface of the substrate such as the thin glass substrate in the electronic device such as the display device panel is not particularly limited, but depends on the type of the resin layer or the substrate as described above. It is difficult to remove even if a solvent is used, and it is preferable to apply a method of thermally or chemically decomposing foreign matter. For example, when the resin layer is a silicone resin layer and the substrate is a thin glass substrate, the foreign substance is considered to be mainly composed of a silicone compound, but the silicone compound attached to the first main surface of the thin glass substrate is silica, Examples thereof include a method of thermally decomposing into water and carbon dioxide, and a method of chemically decomposing using acid or alkali. On the other hand, when the resin layer is a silicone resin layer and the substrate is a resin substrate, the silicone compound adhering to the resin substrate can be removed not only by thermal or chemical decomposition but also by dissolution with a solvent.

Moreover, the panel for display apparatuses used for a removal process is the aspect by which members for electronic devices, such as an array, an organic EL element, or a color filter, are formed on the 2nd main surface of a thin glass substrate, or two thin glass plates Since the substrate is bonded with a sealant and liquid crystal is injected between the two laminated thin glass substrates, it is necessary to remove the foreign matter without damaging them. That is, the removing step is preferably a step of removing the foreign matter without causing thermal, electromagnetic, mechanical, and chemical damage to the thin glass substrate, the display device member, and the sealant.

Further, the adhesive strength of the first main surface of the thin glass substrate before adhering the resin layer is f _0, and the first main surface of the thin glass substrate in the display device panel obtained after the removing step is adhered. It is preferable that f ≧ f ₀ when the strength is f. This can be realized by optimally performing the processes in the peeling step and the removing step.

As a method for removing foreign substances such as a silicone compound attached to the first main surface of the thin glass substrate, a plasma irradiation treatment is a preferred example. In particular, a method that has an electric field shield by a so-called remote plasma method and that does not have a thermal or electromagnetic influence on the display device panel is preferable. Further, the atmospheric pressure remote plasma method is preferable compared to a method requiring high vacuum such as a plasma ashing method, and it is preferable because foreign matter can be removed at low cost.
By such plasma irradiation treatment, the adhesive strength of a film with an adhesive such as a polarizing plate on the first main surface of the thin glass substrate can be made equal to or higher than that before adhering to the resin layer. Yes (i.e., adhesive strength f ≧ adhesive strength _{f 0} becomes), it preferred.
The number of times of plasma irradiation on the first main surface of the thin glass substrate is not particularly limited, and the plasma may be irradiated once or plural times as long as the first main surface of the thin glass substrate can obtain a desired adhesive strength. .
The surface temperature of the thin glass substrate at the time of plasma irradiation is preferably 100 ° C. or lower. The reason is that the display performance can be maintained without causing deterioration or damage to a member such as a sealant or a liquid crystal of the display device panel.

A specific example of the atmospheric pressure remote plasma method is shown.
An apparatus that can be used for performing the atmospheric pressure remote plasma method will be described with reference to FIG.
FIG. 7 is a schematic diagram of a plasma discharge apparatus that can be used to remove the foreign matter by a remote plasma method in the removing step of the panel manufacturing method of the present invention.
In FIG. 7, the voltage application electrode 42 and the ground electrode 43 are installed to face each other, and the surfaces facing the base material are each covered with a solid dielectric 46. The processing gas is introduced into the discharge space 44 formed by the voltage application electrode 42 and the ground electrode 43 in the direction of the arrow, is converted into plasma, and is blown out from the plasma blowing port 45 toward the display device panel 50.
Here, the conveyance speed of the display device panel 50 is preferably 0.1 to 5 m / min, more preferably 0.5 to 2 m / min, and preferably about 1 m / min.

As a method for removing foreign substances such as a silicone compound attached to the first main surface of the thin glass substrate in the display device panel, it is preferable to remove the foreign substances using a chemical solution containing acid or alkali. From the viewpoint of maintenance such as prevention of corrosion of the treatment apparatus, treatment using a chemical solution containing an alkali is more preferable. Also, in treatments using chemicals containing acids or alkalis, butt dipping cleaning is preferable to shower cleaning because of contact with the liquid, and there is no particular effect on the sealant by selecting an appropriate concentration, temperature, and processing time. Foreign substances such as silicone compounds can be removed. For example, a chemical solution containing 10 to 30% by mass (preferably 15 to 25% by mass) acid or alkali adjusted to 30 to 70 ° C. (preferably 40 to 60 ° C.) is used for 1 to 20 minutes (preferably 5 (~ 15 minutes) The method of processing can be illustrated. In addition, when the display device panel is immersed in an acid or alkaline chemical solution, a member that is preferably not in contact with the chemical solution in the display device member is preferably appropriately sealed or masked. For example, if the display device member has a liquid crystal injection hole, there is a possibility that a chemical solution may enter the display device, so that it is preferable to appropriately perform sealing or masking treatment.

As a method of removing foreign substances such as silicone compounds attached to the first main surface of the thin glass substrate, thermal, electromagnetic, mechanical and chemical to the thin glass substrate, the display member and the sealant Corona discharge and flame (that is, flame treatment) can be mentioned within the range of treatment conditions that do not cause damage.
As the treatment conditions, for example, the surface temperature of the thin glass substrate during corona discharge or flame treatment is preferably 100 ° C. or less. The reason is that the display performance can be maintained without causing deterioration or damage to a member such as a sealant or a liquid crystal of the display device panel.

As a method for removing a foreign substance such as a silicone compound attached to the first main surface of the thin glass substrate, thermal, electromagnetic, mechanical or chemical to the thin glass substrate, the display device member and the sealant Foreign substances can be removed using a chemical solution containing a solvent having an sp value, that is, a solubility parameter of 7 to 15 (unit: cal ^1/2 cm ^−3/2 ) within a range of processing conditions that do not cause damage. preferable. When the solubility parameter is outside the range of 7 to 15, since the affinity between the liquid and the resin layer is low, the liquid is difficult to get wet with the resin layer. For example, it is preferable to remove the foreign substances using a chemical solution containing methanol, ethanol, propanol, acetone, xylene, hexane, or the like. Furthermore, from the viewpoint of environmental load, it is preferable to use an alcohol-based cleaning liquid, for example, a cleaning liquid containing methanol, ethanol, propanol or the like. By selecting an appropriate concentration, temperature, and treatment time for the cleaning liquid, it is possible to remove foreign substances such as a silicone compound attached to the substrate surface while suppressing damage to the sealing agent. These solvents are used alone or in combination. In addition, when the display device panel is in contact with the chemical solution containing the solvent, the display device member that is preferably not in contact with the chemical solution is preferably appropriately sealed or masked. For example, when the display device panel has a liquid crystal injection hole, there is a risk that a chemical solution may enter the display device panel from the liquid crystal injection hole. Therefore, it is preferable to perform sealing or masking treatment on the liquid crystal injection hole.

In the panel manufacturing method of this invention, it is preferable to have two or more such removal processes.
That is, it is preferable that the foreign matter is removed by performing a single type of removing step a plurality of times, or the foreign matter is removed by combining a plurality of types of removing steps. For example, the above-described method using plasma and a method using a chemical solution such as an acid may be combined to remove the foreign matter. In the removing step, it is preferable to further remove the foreign matter using ultrasonic vibration.

Thus, in the panel manufacturing method of the present invention, a panel for a display device can be obtained by further subjecting it to a desired process. For example, in the case of an LCD, the desired process is a process of dividing a large cell having a plurality of cells into cells of a desired size, injecting liquid crystal into the divided cell, and then setting the injection port. The process of sealing, the process of sticking a polarizing plate to the cell with which the said inlet was sealed, and a module formation process are mentioned. For example, in the case of OLED, in addition to these steps, a step of assembling a thin glass substrate on which an organic EL structure is formed and a counter substrate may be mentioned. Note that the step of dividing into cells of a desired size is preferably performed by a laser cutter because the strength of the thin glass substrate is not reduced by the cutting process and no cullet is produced.

Specific examples of the panel manufacturing method of the present invention will be described.

First, the manufacturing method of the panel with a support of the present invention in the panel manufacturing method of the present invention will be described.
First, a thin glass substrate and a supporting glass substrate are prepared, and these surfaces are cleaned. Examples of cleaning include pure water cleaning and UV cleaning.
Next, a resin layer is formed on the first main surface of the supporting glass substrate. For example, a silicone resin is coated on the first main surface of the supporting glass substrate using a screen printer. And it heat-hardens, forms a resin layer on the 1st main surface of a support glass substrate, and obtains the support glass substrate to which the resin layer was fixed.
Next, the peelable surface of the resin layer and the first main surface of the thin glass substrate are attached and bonded together. For example, the resin layer and the thin glass substrate can be bonded together by vacuum pressing at room temperature. And the thin glass laminated body which is a laminated body of a support glass substrate, a resin layer, and a thin glass substrate can be obtained.
Next, if necessary, the second main surface of the thin glass substrate in the thin glass laminate may be polished or washed. Examples of cleaning include pure water cleaning and UV cleaning.
After manufacturing two thin glass laminated bodies by such a method, the member for display apparatuses is formed in the 2nd main surface of the thin glass substrate in each thin glass laminated body. One thin glass laminate is subjected to a known color filter forming step to form a color filter on the second main surface of the thin glass substrate. And another thin glass laminated body forms an array in the 2nd main surface of the thin glass substrate by using for a well-known array formation process.
Two panels with a support of the present invention can be manufactured by such a method.
Hereinafter, the panel with a support of the present invention having the color filter obtained here is also referred to as “panel x with support”, and the panel with a support of the present invention having an array is also referred to as “panel y with support”. .

In the panel manufacturing method of the present invention, the panel x with support and the panel y with support manufactured as described above are further processed by, for example, the following methods 1 to 4 to manufacture a panel for a display device. To do.

(Case 1)
In case 1, as described above, the color filter forming surface and the array forming surface of each of the support-equipped panel x and the support-equipped panel y are opposed to each other, and a sealant such as an ultraviolet curable sealant for cell formation is used. And paste them together. The panel with support of the present invention obtained here is also referred to as “panel with support z1” below. The support-equipped panel z1 is in a state in which liquid crystal is not yet sealed, that is, a so-called empty cell.
Next, when performing the removal process by a chemical | medical solution, the liquid crystal injection hole of the panel z1 with a support body is temporarily sealed. For example, the outside of the inlet may be further sealed using an ultraviolet curable sealant or the like.
And the two support bodies of panel z1 with a support body after sealing are used for the peeling process in the above-mentioned panel manufacturing method of this invention, and are peeled. And it uses for the removal process in the panel manufacturing method of this invention. The panel thus obtained is also referred to as “panel w1” below. The two separated substrates are reused for the production of another panel with a substrate.
Next, after removing the temporary sealing of the liquid crystal injection hole of the panel w1, the panel w1 is cut into individual cells.
Next, liquid crystal is injected into the cut individual cell from the injection hole, and then the injection hole is sealed to form a liquid crystal cell.
Further, a polarizing plate is attached to the liquid crystal cell, and a backlight or the like is formed, whereby the LCD 1 can be obtained.
In this case, the removing step in the panel manufacturing method of the present invention may be performed after the support is peeled from the panel with the support or after the individual cells are cut and the liquid crystal cells are formed. However, in the case of chemical treatment after peeling off the support, it is desirable to temporarily seal the injection hole in order to prevent penetration of the chemical into the empty cell.

(Case 2)
In Case 2, a liquid crystal cell is manufactured using a conventionally known liquid crystal dropping method (ODF). Liquid crystal is suspended on either the color filter forming surface or the array forming surface in each of the panel with support x and the panel with support y, and the other formation surface is opposed to the surface on which the liquid crystal is suspended, Bonding is performed using a sealant such as an ultraviolet curable sealant for cell formation. The panel with support of the present invention obtained here is also referred to as “panel with support z2” below.
Next, the two support bodies of the support-equipped panel z2 are subjected to a peeling step in the above-described panel manufacturing method of the present invention and peeled off. And it uses for the removal process in the panel manufacturing method of this invention. The panel thus obtained is also referred to as “panel w2” below. The two separated substrates are reused for the production of another panel with a substrate.
Next, the panel w2 is cut into individual cells.
Further, a polarizing plate is attached to the panel w2 cut into individual cells, and a backlight or the like is formed, whereby the LCD 2 can be obtained.
In this case, the removal step of the present invention in this case may be either after the support glass substrate is peeled off or after the cells are individually cut and the liquid crystal cell is formed. However, in the case of chemical treatment after peeling off the support, it is desirable to temporarily seal the injection hole in order to prevent penetration of the chemical into the empty cell.

(Case 3)
In case 3, a liquid crystal cell is manufactured using ODF. Liquid crystal is suspended on either the color filter forming surface or the array forming surface in each of the panel with support x and the panel with support y, and the other formation surface is opposed to the surface on which the liquid crystal is suspended, Bonding is performed using a sealant such as an ultraviolet curable sealant for cell formation. The bonded panel x with support and panel y with support are cut into individual cells together with the support. The panel with support of the present invention obtained by cutting here is also referred to as “panel with support z3” below.
Next, two support bodies of the panel z3 with a support body are peeled in the peeling process in the above-mentioned panel manufacturing method of this invention. And it uses for the removal process in the panel manufacturing method of this invention. The panel thus obtained is also referred to as “panel w3” below.
And LCD3 can be obtained by attaching a polarizing plate to the panel w3 and forming a backlight or the like.

(Case 4)
In the case 4, as described above, the color filter forming surface and the array forming surface of each of the support-equipped panel x and the support-equipped panel y are opposed to each other, and a sealant such as an ultraviolet curable sealant for cell formation is used. And paste them together. And it cut | disconnects to an individual cell with a support body. The panel with a support of the present invention obtained by cutting here is also referred to as “panel with support z4” below. The support-attached panel z4 is in a state in which liquid crystal is not yet sealed, that is, a so-called empty cell state.
Next, when implementing the removal process by a chemical | medical solution, the liquid crystal injection hole of panel z4 with a support body is temporarily sealed.
Next, the two support bodies of the support-equipped panel z4 are subjected to a peeling step in the above-described panel manufacturing method of the present invention and peeled off. And it uses for the removal process in the panel manufacturing method of this invention. The panel thus obtained is also referred to as “panel w4” below.
Next, after removing the temporary sealing of the liquid crystal injection hole of the panel w4, the liquid crystal is injected into the cell of the panel w4 and then sealed.
Further, an LCD 4 can be obtained by attaching a polarizing plate and forming a backlight and the like.
However, in the case of chemical treatment after peeling off the support, it is desirable to temporarily seal the injection hole in order to prevent penetration of the chemical into the empty cell.

According to the panel manufacturing method of the present invention, when the thin glass substrate is large, for example, even if it is 730 × 920 mm, the thin glass substrate can be easily peeled off.

Next, a method for manufacturing the display device of the present invention will be described.
The manufacturing method of the display device of the present invention is a manufacturing method including the panel manufacturing method of the present invention.
After obtaining the panel for display devices by the panel manufacturing method of the present invention, the display device can be obtained by subjecting the panel to further known processes.

The method for manufacturing a display device of the present invention is suitable for manufacturing a small display device used for a mobile terminal such as a mobile phone or a PDA. The display device is mainly an LCD or an OLED, and the LCD includes a TN type, STN type, FE type, TFT type, MIM type, IPS type, VA type, and the like. Basically, the present invention can be applied to both passive drive type and active drive type display devices.

As described above, the display device panel having the display device member on the surface (second main surface) of the substrate has been described as a representative example of the electronic device of the present invention. However, as described above, the present invention is not limited to this. In addition to the display device member, the solar cell having the surface (second main surface) of the substrate, the member for a solar cell, the member for a thin film secondary battery, and the member for an electronic device such as an electronic component circuit, the thin film 2 Of course, it may be an electronic device such as a secondary battery or an electronic component.
For example, as the solar cell member, in the silicon type, a transparent electrode such as positive electrode tin oxide, a silicon layer represented by p layer / i layer / n layer, a metal of the negative electrode, and the like can be cited. And various members corresponding to the dye-sensitized type, the quantum dot type, and the like.
Moreover, as a member for a thin film secondary battery, in the lithium ion type, a transparent electrode such as a metal or a metal oxide of a positive electrode and a negative electrode, a lithium compound of an electrolyte layer, a metal of a current collecting layer, a resin as a sealing layer, etc. In addition, various members corresponding to nickel hydrogen type, polymer type, ceramic electrolyte type and the like can be mentioned.
In addition, as a circuit for an electronic component, in a CCD or CMOS, a metal of a conductive part, a silicon oxide or a silicon nitride of an insulating part, and the like, various sensors such as a pressure sensor and an acceleration sensor, a rigid printed board, a flexible printed board And various members corresponding to a rigid flexible printed circuit board.

Example 1a
First, a supporting glass substrate (Asahi Glass Co., Ltd., AN100, non-alkali glass) having a length of 720 mm, a width of 600 mm, a thickness of 0.4 mm, and a linear expansion coefficient of 38 × 10 ⁻⁷ / ° C. was washed with pure water and UV washed. Cleaned.
Next, on the first main surface of the supporting glass substrate, solvent-free addition reaction type release paper silicone (manufactured by Shin-Etsu Silicone Co., Ltd., KNS-320A, viscosity: 0.40 Pa · s, solubility parameter (SP value) = 7. 3) A mixture of 100 parts by mass and 2 parts by mass of a platinum-based catalyst (CAT-PL-56, manufactured by Shin-Etsu Silicone Co., Ltd.) was applied to a rectangle with a size of 705 mm in length and 595 mm in width by a screen printer (coating) Work rate 30 g / m ² ).
Next, this was heat-cured at 180 ° C. for 30 minutes in the air to form a 20 μm thick silicone resin layer on the first main surface of the supporting glass substrate.

Next, the thin glass substrate (Asahi Glass Co., Ltd., AN100, non-alkali glass) having a length of 720 mm, a width of 600 mm, a thickness of 0.3 mm, and a linear expansion coefficient of 38 × 10 ⁻⁷ / ° C. is contacted with the silicone resin layer. After cleaning the surface with pure water and UV cleaning, the silicone resin layer and the thin glass substrate are bonded together by a vacuum press at room temperature to form a thin glass laminate (hereinafter also referred to as “thin glass laminate A1”). Obtained.
The formation of the resin layer and the lamination of the thin glass substrates were performed so that a gap portion having a depth of 15 mm was formed at the end of the thin glass laminate A1.
In the obtained thin glass laminate A1, both glass substrates were in close contact with the silicone resin layer without generating bubbles, and there was no distortion defect and smoothness was good.

Next, the thin glass laminate A1 was heat-treated at 250 ° C. for 2 hours in the air. The resin layer of the thin glass laminate A1 was not deteriorated by heat, and it was confirmed that the heat resistance was good.

Next, the second main surface of the thin glass substrate in the thin glass laminate A1 was fixed on a fixed base. Moreover, it adsorb | sucked to the 2nd main surface of the support glass substrate with the suction pad. Then, a 0.4 mm thick knife is inserted into the interface between the thin glass substrate and the resin layer, which is one of the four corners of the thin glass laminate A1, and then adsorbed slightly. The pad was moved in a direction away from the fixed base, and the thin glass substrate and the support (supporting glass substrate having a resin layer) were peeled off. The thin glass substrate obtained by peeling is also referred to as “thin glass substrate a1”.

Next, a polarizing film (manufactured by Nitto Denko Corporation, acrylic adhesive) was attached to the first main surface (surface on which the resin layer was in close contact) in the thin glass substrate a1. And the adhesive strength of the said polarizing film was measured. The measuring method is 90 ° peeling at the end of the film after a polarizing film having a width of 25 mm or a film with an adhesive is pasted on the glass substrate surface. As a result, the adhesive strength was 0.20 N / 25 mm.

Next, after once peeling off the polarizing film, the first main surface of the thin glass substrate a1 was irradiated with plasma using an atmospheric pressure remote plasma apparatus (manufactured by Sekisui Chemical Co., Ltd.). Here, the processing conditions are: output 3 kW, nitrogen / air flow ratio = 600 slm / 750 sccm, conveyance speed 1 m / min. It was. The surface temperature of the thin glass substrate a at the time of plasma irradiation was 50 ° C. or less.

Next, the same polarizing film as before the plasma irradiation was attached to the first main surface of the thin glass substrate a1 after the plasma irradiation, and the adhesive strength of the polarizing film was measured by the same method.
As a result, the adhesive strength was 4.7 N / 25 mm after 90 ° peeling. Moreover, when the 1st main surface of the thin glass substrate a1 was observed with the optical microscope, foreign material adhesion, cracking, and chipping were not found.
In addition, the adhesive strength in the 1st main surface of the thin glass substrate before forming thin glass laminated body A1 was 3.9 N / 25mm.

(Example 1b)
On the first main surface of the supporting glass substrate, linear polyorganosiloxane having a vinyl group at both ends (trade name “8500”, manufactured by Arakawa Chemical Industries, Ltd.) and methylhydro having a hydrosilyl group in the molecule Example 1a, except that a mixture of Genpolysiloxane (Arakawa Chemical Industries, trade name “12031”) and a platinum-based catalyst (Arakawa Chemical Industries, trade name “CAT12070”) was used. After obtaining a thin glass laminate (hereinafter also referred to as “thin glass laminate A2”) by the above method, heat treatment was performed in the atmosphere.
Next, the thin glass substrate and the support (supporting glass substrate having a resin layer) were peeled off in the same manner as in Example 1a. The thin glass substrate obtained by peeling is also referred to as “thin glass substrate a2”.
Next, as a result of measuring the adhesive strength of the polarizing film on the first main surface of the thin glass substrate a2 by the same method as in Example 1a, it was 0.60 N / 25 mm.
Next, the polarizing film is once peeled off, and the thin glass substrate a2 is immersed in a resist stripping solution (manufactured by Parker Corporation, containing 20% by mass of potassium hydroxide as a main component) for 10 minutes at 50 ° C. Then, washing with water and air blowing were performed.
Next, as a result of measuring the adhesive strength of the polarizing film on the first main surface of the thin glass substrate a2, it was 4.5 N / 25 mm.

(Example 1c)
After obtaining a thin glass laminate (hereinafter also referred to as “thin glass laminate A3”) in the same manner as in Example 1b, heat treatment was performed in the air.
Next, the thin glass substrate and the support (support glass substrate having a resin layer) were peeled off in the same manner as in Example 1b. The thin glass substrate obtained by peeling is also referred to as “thin glass substrate a3”.
Next, the thin glass substrate a3 was immersed in a resist stripping solution. Here, the temperature of the stripping solution was 50 ° C., and immersion was performed for 5 minutes. In addition, ultrasonic vibration was applied to the thin glass substrate a3 using an ultrasonic vibration plate installed in the liquid tank.
Next, as a result of measuring the adhesive strength of the polarizing film on the first main surface of the thin glass substrate a3, it was 4.0 N / 25 mm.

Example 1d
After a thin glass laminate (hereinafter also referred to as “thin glass laminate A4”) was obtained in the same manner as in Example 1b, heat treatment was performed in the air.
Next, the thin glass substrate and the support (support glass substrate having a resin layer) were peeled off in the same manner as in Example 1b. The thin glass substrate obtained by peeling is also referred to as “thin glass substrate a4”.
Next, on the first main surface of the thin glass substrate a4, the surface temperature of the thin glass substrate is changed by a frame processing machine (manufactured by Alcotech) at the edge of the oxygen burner flame four times at a scanning speed of 10 m / min. The treatment was performed under conditions of 100 ° C. or lower.
Next, the result of measuring the adhesive strength of the polarizing film on the first main surface of the thin glass substrate a4 was 4.0 N / 25 mm.

Example 1e
In Example 1e, except that the thin glass substrate was changed to a polyimide resin substrate having a thickness of 0.05 mm (manufactured by Toray DuPont, Kapton 200HV), a device substrate laminate (hereinafter, “ Device substrate laminate A5 ”) was also obtained. Of the two main surfaces of the polyimide resin substrate, a surface that is in close contact with the peelable surface of the resin layer is a first main surface, and a main surface that forms the electronic device member is a second main surface. Although the heat resistance of the resin layer of the device substrate laminate A5 was evaluated by the same method as in Example 1a, it was confirmed that there was no deterioration due to heat and the heat resistance was good.
Next, the polyimide resin substrate and the support (supporting glass substrate having a resin layer) were peeled off in the same manner as in Example 1a. The polyimide resin substrate obtained by peeling is also referred to as “polyimide resin substrate a5”.
Next, a polarizing film was attached to the first main surface of the polyimide resin substrate a5 in the same manner as in Example 1a in the same manner as in Example 1a. And the adhesive strength of the polarizing film in the 1st main surface of the polyimide resin substrate a5 was measured. The adhesive strength of the polarizing film was 0.50 N / 25 mm.
Next, plasma was irradiated to the 1st main surface of the polyimide resin board | substrate a5 by the method similar to Example 1a using a normal pressure remote plasma apparatus, and the polarizing film was stuck. It was 3.0 N / 25mm as a result of measuring the adhesive strength of the polarizing film in the 1st main surface of the polyimide resin substrate a5.
In addition, the adhesive strength in the 1st main surface of the polyimide resin substrate before board | substrate laminated body A5 for devices was 1.5 N / 25mm.

(Example 1f)
In Example 1f, except that the thin glass substrate was changed to a stainless steel (SUS304) substrate having a mirror finish of 0.1 mm in thickness, a device substrate laminate (hereinafter “device substrate” was used in the same manner as in Example 1a. Also referred to as “laminate A6”). Of the two main surfaces of the stainless steel substrate, the surface that is in close contact with the peelable surface of the resin layer is the first main surface, and the main surface that forms the electronic device member is the second main surface. The heat resistance of the resin layer of the device substrate laminate A6 was evaluated in the same manner as in Example 1a, but it was confirmed that the heat resistance was good and there was no deterioration due to heat.
Next, the stainless steel substrate and the support (supporting glass substrate having a resin layer) were peeled off in the same manner as in Example 1a. The stainless steel substrate obtained by peeling is also referred to as “stainless steel substrate a6”.
Next, a polarizing film was attached to the first main surface of the stainless steel substrate a6 in the same manner as in Example 1a in the same manner as in Example 1a. And the adhesive strength of the polarizing film in the 1st main surface of the stainless steel substrate a6 was measured. The adhesive strength of the polarizing film was 0.40 N / 25 mm.
Next, plasma was irradiated to the 1st main surface of the stainless steel substrate a6 by the same method as Example 1a using a normal pressure remote plasma apparatus, and the polarizing film was stuck. It was 1.5 N / 25mm as a result of measuring the adhesive strength of the polarizing film in the 1st main surface of the stainless steel substrate a6.
In addition, the adhesive strength in the 1st main surface of the stainless steel substrate before board | substrate laminated body for device A6 formation was 1.0 N / 25mm.

(Example 1g)
First, a glass film (Asahi Glass Co., Ltd., AN100, non-alkali glass) having a length of 350 mm, a width of 300 mm, a plate thickness of 0.08 mm, and a linear expansion coefficient of 38 × 10 ⁻⁷ / ° C. was washed with an alkaline detergent, The film surface was cleaned. Further, a 0.1% methanol solution of γ-mercaptopropyltrimethoxysilane was sprayed on the surface of the glass film and dried at 80 ° C. for 3 minutes. On the other hand, the surface of a polyimide resin substrate (manufactured by Toray DuPont, Kapton 200HV) having a length of 350 mm, a width of 300 mm, and a thickness of 0.05 mm was plasma-treated. Then, a glass / resin laminated substrate was formed using a press apparatus in which a glass film and a polyimide resin substrate were superposed and heated to 320 ° C. Of the two main surfaces of the glass / resin laminated substrate, the main surface on the polyimide resin substrate side that is in close contact with the peelable surface of the resin layer is the first main surface, and the main surface on the opposite glass film side is the second main surface. .
In Example 1g, a device substrate laminate (hereinafter also referred to as “device substrate laminate A7”) was obtained in the same manner as in Example 1a, except that the thin glass substrate was changed to the glass / resin laminate substrate. . The heat resistance of the resin layer of the device substrate laminate A7 was evaluated in the same manner as in Example 1a, but it was confirmed that the heat resistance was good and there was no deterioration due to heat.
Next, the glass / resin laminated substrate and the support (supporting glass substrate having a resin layer) were peeled off in the same manner as in Example 1a. The glass / resin laminated substrate obtained by peeling is also referred to as “glass / resin laminated substrate a7”.
Next, the polarizing film was stuck on the 1st main surface of the glass / resin laminated substrate a7 by the method similar to Example 1a by the method similar to Example 1a. And the adhesive strength of the polarizing film in the 1st main surface of glass / resin laminated substrate a7 was measured. The adhesive strength of the polarizing film was 0.40 N / 25 mm.
Next, plasma was irradiated to the 1st main surface of the glass / resin laminated substrate a7 by the method similar to Example 1a using a normal pressure remote plasma apparatus, and the polarizing film was stuck. It was 3.0 N / 25mm as a result of measuring the adhesive strength of the polarizing film in the 1st main surface of the glass / resin laminated substrate a7.
In addition, the adhesive strength in the 1st main surface of the glass / resin laminated substrate before formation of substrate laminated body A7 for devices was 1.5 N / 25mm.

(Example 1h)
In Example 1h, a device substrate laminate A51 was obtained in the same manner as in Example 1e.
Next, the polyimide resin substrate and the support (support glass substrate having a resin layer) were peeled off in the same manner as in Example 1e.
Next, a polarizing film was attached to the first main surface of the polyimide resin substrate in the device substrate laminate A51 in the same manner as in Example 1a in the same manner as in Example 1a. And the adhesive strength of the polarizing film in the 1st main surface of a polyimide resin substrate was measured. The adhesive strength of the polarizing film was 0.40 N / 25 mm.
Next, brush cleaning is performed while spraying an alcohol-based cleaning agent (Neocol R7, manufactured by Nippon Alcohol Sales Co., Ltd.) on the first main surface of the polyimide resin substrate. After removing the cleaning agent from the first main surface of the polyimide resin substrate by air blowing, a polarizing film was attached in the same manner as in Example 1a. It was 2.8 N / 25mm as a result of measuring the adhesive strength of the polarizing film in the 1st main surface of a polyimide resin board | substrate.

(Example 2)
First, a supporting glass substrate (Asahi Glass Co., Ltd., AN100, non-alkali glass) having a length of 720 mm, a width of 600 mm, a thickness of 0.6 mm, and a linear expansion coefficient of 38 × 10 ⁻⁷ / ° C. is cleaned with pure water and UV cleaning. Turned into.
Next, on the first main surface of the supporting glass substrate, linear polyorganosiloxane having vinyl groups at both ends (trade name “8500”, manufactured by Arakawa Chemical Industries, Ltd.), and hydrosilyl group in the molecule A mixture of methylhydrogenpolysiloxane (trade name “12031” manufactured by Arakawa Chemical Industries, Ltd.) and a platinum-based catalyst (trade name “CAT12070” manufactured by Arakawa Chemical Industries, Ltd.) is 705 mm long and 595 mm wide. The size was applied by a screen printing machine (coating amount 20 g / m ² ). Here, the mixing ratio of the linear polyorganosiloxane and the methylhydrogen polysiloxane was adjusted so that the molar ratio of hydrosilyl group to vinyl group was 1/1. The platinum catalyst was 5 parts by mass with respect to 100 parts by mass in total of the linear polyorganosiloxane and methyl hydrogen polysiloxane.
Next, this was heat-cured at 180 ° C. for 30 minutes in the air to form a 20 μm thick silicone resin layer on the first main surface of the supporting glass substrate.

Next, the thin glass substrate (Asahi Glass Co., Ltd., AN100, non-alkali glass) having a length of 720 mm, a width of 600 mm, a thickness of 0.1 mm, and a linear expansion coefficient of 50 × 10 ⁻⁷ / ° C. is contacted with the silicone resin layer. After the surface is cleaned with pure water and UV cleaning, the silicone resin layer and the thin glass substrate are bonded together by a vacuum press at room temperature to form a thin glass laminate (hereinafter also referred to as “thin glass laminate B”). Obtained.
The formation of the resin layer and the lamination of the thin glass substrates were performed so that a gap portion having a depth of 15 mm was formed at the end of the thin glass laminate B.
In the obtained thin glass laminate B, both glass substrates were in close contact with the silicone resin layer without generating bubbles, and there was no distortion defect and smoothness was good.

Next, two thin glass laminates B were prepared. Then, an array is formed on the second main surface of the thin glass substrate of one thin glass laminate B (referred to as “thin glass laminate B1”). Specifically, the insulating layer and the amorphous silicon layer are formed by a CVD method, the electrode layer is formed by a sputtering method, and each patterning is performed by a method called photolithography.
Further, a color filter is formed on the second main surface of the thin glass substrate of the other thin glass laminate B (referred to as “thin glass laminate B2”). Specifically, a black matrix and RGB pixels are formed by a coating and baking method, an electrode layer is formed by a sputtering method, and each color pattern is formed by a method called photolithography.

And the array formation surface in thin glass laminated body B1 and the color filter formation surface in thin glass laminated body B2 are made to oppose, and it bonds together using the ultraviolet curing sealing agent for cell formation, and is a panel for display apparatuses with a support body. (Hereinafter also referred to as “panel C with support”).

Next, the second main surface of the supporting glass substrate, which was a part of the thin glass laminate B1 in the panel C with the supporting body, is fixed on the fixing base. Moreover, the 2nd main surface of the support glass substrate which was a part of thin glass laminated body B2 in the panel C with a support body is adsorb | sucked with an adsorption pad. And it is one of the four corner | angular parts which the panel C with a support body is, Comprising: At the interface of the thin glass substrate which was a part of thin glass laminated body B2, and a resin layer, thickness 0.1mm The knife glass is inserted, the thin glass substrate and the support (support glass substrate having the resin layer) are slightly peeled off, and then the suction pad is moved away from the fixing base, so that the first main surface of the thin glass substrate And the support are peeled off. What was obtained by peeling the support of the thin glass laminate B2 from the panel C with support is also referred to as “panel Cx with support”.

Next, the first main surface of the thin glass substrate that was a part of the thin glass laminate B2 in the support-equipped panel Cx is fixed on a fixed base. Moreover, the 2nd main surface of the support glass substrate which was a part of thin glass laminated body B1 in the panel Cx with a support body is adsorb | sucked with an adsorption pad. And it is one of four corner | angular parts which panel Cx with a support body has, Comprising: At the interface of the thin glass substrate which was a part of thin glass laminated body B1, and a resin layer, thickness 0.1mm A knife is inserted, the thin glass substrate and the support (support glass substrate having a resin layer) are slightly peeled off, and then the suction pad is moved away from the fixing base, so that the thin glass substrate and the support are moved. Peel off. The product obtained here, that is, the product obtained by peeling the two supports from the support-equipped panel C is referred to as “panel C”.

Next, a polarizing film (manufactured by Nitto Denko Corporation, acrylic adhesive) is attached to the first main surface of each of the two thin glass substrates of the panel C. And the adhesive strength of the said polarizing film was measured. The measuring method is the same as in Example 1a. As a result, the adhesive strength becomes 0.78 N / 25 mm and 0.59 N / 25 mm at 90 ° peeling.

Next, the film is once peeled off, and the panel C is cut to obtain 168 cells of 51 mm long × 38 mm wide. Then, liquid crystal injection and injection hole sealing are performed on each, thereby forming a liquid crystal cell. Thereafter, the liquid crystal cell is immersed in a resist stripping solution (manufactured by Parker Corporation, containing 20% by mass of potassium hydroxide as a main component) at 20 ° C. for 10 minutes, washed with water and air blown. Thereafter, the first main surface of the thin glass substrate on which the array of liquid crystal cells is formed is fixed on the fixing base, and the first main surface of the thin glass substrate on which the color filter is formed is adsorbed by the suction pad, and from the fixing base. When pulled away at 20 N / 25 mm, there is no peeling of the sealant and destruction of the cell.

Next, the same polarizing film as that before immersing in the resist stripping solution is applied to the first main surface of the thin glass substrate in the liquid crystal cell after being immersed in the resist stripping solution, and the adhesive strength of the polarizing film is measured by the same method. . As a result, the adhesive strength is 4.4 N / 25 mm after 90 ° peeling.

Then, an LCD can be obtained by performing a module forming process. The LCD obtained in this way does not suffer from characteristic problems, that is, deterioration of array performance or color filter chromaticity. As a result, a liquid crystal display device having a total thickness of about 0.2 mm between the outer surfaces of the two opposing thin glass substrates of the LCD can be obtained.

(Example 3)
A thin glass laminate B formed in Example 2 and a non-alkali glass substrate having a thickness of 0.7 mm (Asahi Glass Co., Ltd., AN100, non-alkali glass) were prepared (the thin glass laminate B used here) “Thin glass laminate B3”). And the color filter was formed in the 2nd main surface of the thin glass substrate of thin glass laminated body B3 by the method similar to Example 2, and the array was formed in one main surface of an alkali free glass substrate.

Then, as in Example 2, the array-forming surface of the alkali-free glass substrate and the color filter forming surface of the thin glass laminate B3 are opposed to each other, liquid crystal is sealed, and an ultraviolet curable sealing agent for cell formation is added. A panel for a display device with a support (hereinafter also referred to as “panel D with a support”) is obtained. Here, the liquid crystal injection hole is sealed.

Next, the support of the thin glass laminate B3 can be peeled by the same method as in Example 2. What was obtained here, ie, what was obtained by peeling a support body from panel D with a support body, is set as "panel D."

Next, after the panel D is cut and 168 cells are obtained in the same manner as in Example 2, a liquid crystal cell is formed.
Then, the obtained liquid crystal cell is immersed in the same resist stripping solution as in Example 2. Here, the temperature of the stripping solution is 50 ° C., and the immersion is performed for 5 minutes. In addition, ultrasonic vibration is applied to the liquid crystal cell using an ultrasonic vibration plate installed in the liquid tank.

Next, a polarizing film is attached to the first main surface of the thin glass substrate of the liquid crystal cell after being immersed in the resist stripping solution, and the adhesive strength of the polarizing film is measured. The type of polarizing film used and the method for measuring the adhesive strength are the same as in Example 1. As a result, the adhesive strength is 4.3 N / 25 mm after 90 ° peeling.

Then, an LCD can be obtained by performing a module forming process. The LCD obtained in this way does not suffer from characteristic problems, that is, deterioration of array performance or color filter chromaticity. As a result, a liquid crystal display device having a total thickness of about 0.8 mm between the outer surfaces of the two opposing thin glass substrates of the LCD can be obtained.

Example 4
Two thin glass laminates B formed in Example 2 are prepared. Then, an array is formed on the second main surface of the thin glass substrate of one thin glass laminate B (referred to as “thin glass laminate B4”) in the same manner as in Example 2. Further, an organic EL structure is formed on the second main surface of the thin glass substrate of the other thin glass laminate B (referred to as “thin glass laminate B5”). Specifically, a step of forming a transparent electrode, a step of forming an auxiliary electrode, a step of depositing a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and the like, and a step of sealing them, An organic EL structure is formed on the thin glass substrate of the thin glass laminate B5.

Then, a panel E with a support is obtained by combining the thin glass laminate B4 and the thin glass laminate B5.

Next, the support of the thin glass laminate B4 and the thin glass laminate B5 can be peeled by the same method as in Example 2. The product obtained here, that is, the product obtained by peeling the support from the support-equipped panel E is referred to as “panel E”. On the surface of the thin glass substrate in panel E, there is no damage that leads to a decrease in strength.

Next, the first main surface of the thin glass substrate on which the organic EL structure is formed is irradiated with plasma using an atmospheric pressure remote plasma apparatus (manufactured by Sekisui Chemical Co., Ltd.). Here, the processing conditions are: output 3 kW, nitrogen / air flow ratio = 600 slm / 750 sccm, conveyance speed 1 m / min. And The surface temperature of the thin glass substrate at the time of plasma irradiation is 50 ° C. or less.

Next, the panel E was cut using a laser cutter or a scribe-break method, and divided into 288 cells of 41 mm in length and 30 mm in width, and then a PET film (manufactured by Nitto Denko Corporation, acrylic as a protective film) on the cell surface. Adhesive). The adhesive strength at that time is 3.9 N / 25 mm. Then, a module formation process is implemented and OLED is produced.
The OLED obtained in this way does not have a problem in characteristics.
In the above example, the support is peeled off before being divided into display panel units. However, a structure in which a plurality of panels are connected to each other can be processed as a unit.
In addition to the above example, the support can be peeled off after being divided into display panel units.

Although the invention has been described in detail and with reference to specific embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention.
This application is based on Japanese Patent Application No. 2009-072282 filed on Mar. 24, 2009, the contents of which are incorporated herein by reference.

10, 20, 30

Panels

12, 22, and 32 with support of the present invention

Thin glass substrates

14, 24, 34

Display device members

16, 26

Display device panels

18, 28, 38 Resin layers 19, 29, 39 Support glass Substrate 25 Gap 41 Power supply (High voltage pulse power supply)
42 Voltage Application Electrode 43 Installation Electrode 44 Discharge Space 45 Plasma Blowout Port 46 Solid Dielectric 50 Display Device Panel After Stripping Process

Claims

On the first main surface of the substrate having the first main surface and the second main surface and having the electronic device member on the second main surface, on the first main surface of the support substrate having the first main surface and the second main surface An electronic device including the electronic device member and the substrate is obtained by peeling the support substrate and the support made of the resin layer from the electronic device with a support to which the resin layer having a fixed peelable surface is in close contact. Peeling process;
A method of manufacturing an electronic device, comprising: a removing step of removing foreign matter attached to the first main surface of the substrate in the electronic device.
The method for manufacturing an electronic device according to claim 1, wherein the resin layer is a silicone resin layer.
The adhesive strength of the first main surface of the substrate before adhering the peelable surface of the resin layer to the first main surface of the substrate is defined as f 0, and the first of the substrates in the electronic device obtained after the removing step. The method for manufacturing an electronic device according to claim 1, wherein f ≧ f 0 when the adhesive strength of the main surface is f.
4. The method of manufacturing an electronic device according to claim 1, wherein the removing step is a step of irradiating the first main surface of the substrate with plasma to remove the foreign matter.
The method of manufacturing an electronic device according to any one of claims 1 to 3, wherein the removing step is a step of removing the foreign matter using a chemical solution containing an acid or an alkali.
The method of manufacturing an electronic device according to any one of claims 1 to 3, wherein the removing step is a step of removing the foreign matter using a chemical solution containing a solvent having a solubility parameter of 7 to 15.
Furthermore, the manufacturing method of the electronic device of Claim 5 or 6 which is the process of removing the said foreign material using ultrasonic vibration.
The method for manufacturing an electronic device according to any one of claims 1 to 7, comprising two or more removing steps.