JP2009186916A - Method of manufacturing display device panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent the occurrence of glass defects due to foreign matters included between glass substrates to perform processing in an existing production line without causing an edge pit, and to easily separate a thin plate glass substrate, a resin layer and a support glass substrate closely attached to each other in a short time. <P>SOLUTION: A method of manufacturing a display device panel includes a dipping step of dipping in an organic solvent 40 the display device panel 30 with a support in which easily releasable resin layers 38a and 38b fixed to first main surfaces of support glass substrates 39a and 39b having the first main surfaces and second main surfaces are closely attached to the main surfaces of thin plate glass substrates 32a and 32b having the first main surfaces and second main surfaces. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a display device panel, and a display device panel with a support.

In recent years, liquid crystal display devices (LCD) and organic EL display devices (OLED) have been widely used as display devices. In particular, in the field of mobile display devices such as mobile phones and mobile phones, there is a demand for lighter and thinner display devices.
In order to cope with this, a glass substrate used for a display device has been made thinner. As a method for reducing the plate thickness, generally, before or after forming the display device member on the surface of the glass substrate, the outer surface of the glass substrate is etched using hydrofluoric acid or the like. Further, a method of performing physical polishing and thinning is performed.

However, if the glass substrate is thinned by performing an etching process or the like before forming the display device member on the surface of the glass substrate, the strength of the glass substrate is reduced and the amount of deflection is increased. Therefore, the problem that it cannot process in the existing manufacturing line arises.
In addition, if the glass substrate is thinned by performing an etching process after forming the display device member on the surface of the glass substrate, the fineness formed on the surface of the glass substrate in the process of forming the display device member on the surface of the glass substrate. The problem of making obvious scratches, that is, a problem called edge pit occurs.

  Therefore, for the purpose of solving such problems, a thin glass substrate (hereinafter also referred to as “thin glass substrate”) is bonded to another supporting glass substrate to form a laminate, and the display is performed in that state. A method of performing a predetermined process for manufacturing the apparatus and then separating the thin glass substrate and the supporting glass substrate has been proposed.

For example, in Patent Document 1, a product glass substrate and a reinforcing glass substrate are bonded and integrated using an electrostatic adsorption force or a vacuum adsorption force between glass substrates, and a display using the product glass substrate is used. A method of manufacturing the device is described.
Further, Patent Document 2 describes a method for manufacturing a liquid crystal display device in which end portions of a substrate and a support of a liquid crystal display device are bonded using a glass frit adhesive, and thereafter an electrode pattern or the like is formed. Has been.
Patent Document 3 describes a method for manufacturing a substrate for a display device, which includes a step of irradiating laser light to at least the vicinity of the edge surface of two glass substrates to fuse the two glass substrates.

In Patent Document 4, a substrate is attached to a substrate transport jig having an adhesive layer provided on a support, and the substrate transport jig is transported through a manufacturing process of a liquid crystal display element. A liquid crystal display device manufacturing method is described in which liquid crystal display element formation processing is sequentially performed on a substrate attached to a jig, and the substrate is peeled off from the substrate carrying jig after a predetermined process is completed.
In Patent Document 5, an electrode substrate for a liquid crystal display element is subjected to a predetermined processing on the electrode substrate for a liquid crystal display element using a jig in which an ultraviolet curable adhesive is provided on a support, and then an ultraviolet curable type is used. A method for producing a liquid crystal display element, comprising: irradiating an adhesive with ultraviolet rays to reduce the adhesive strength of the ultraviolet curable adhesive and peeling the liquid crystal display element electrode substrate from the jig. Has been.
Patent Document 6 describes a transport method in which a thin plate is temporarily fixed to a support plate with an adhesive material, a peripheral portion of the adhesive material is sealed with a seal material, and the support plate on which the thin plate is temporarily fixed is transported.

Patent Document 7 discloses a thin glass laminate obtained by laminating a thin glass substrate and a supporting glass substrate, wherein the thin glass and the supporting glass are easily peelable and non-adhesive. A thin glass laminate characterized by being laminated via a resin layer is described. Then, in order to separate the thin glass substrate and the supporting glass substrate, it is only necessary to apply a force to separate the thin glass substrate from the supporting glass substrate in the vertical direction. It is described that it can be more easily peeled off by injecting air into the interface.
Patent Document 8 describes a double-sided adhesive sheet for manufacturing semiconductors using silicone.
JP 2000-241804 A JP 58-54316 A JP 2003-2160868 A Japanese Patent Laid-Open No. 8-86993 Japanese Patent Laid-Open No. 9-105896 JP 2000-252342 A International Publication No. 2007/018028 Pamphlet JP 2004-26950 A

  However, a method for fixing glass substrates described in Patent Document 1 using electrostatic adsorption force or vacuum adsorption force, a method for fixing both ends of a glass substrate described in Patent Document 2 with glass frit, or Patent Document 3 In the method of merging two glass substrates by irradiating laser light near the end face of the peripheral portion described in the above, the glass substrates are laminated and adhered without any intermediate layer. Distortion defects occur in the glass substrate due to foreign matters such as dust. Therefore, it is difficult to obtain a glass substrate laminate having a smooth surface.

  Moreover, in the method of disposing an adhesive layer or the like between the glass substrates described in Patent Documents 4 to 6, both glass substrates can be avoided although the occurrence of distortion defects due to mixing of bubbles or the like between the glass substrates as described above can be avoided. Is difficult to separate, and the thin glass substrate may be damaged during the separation. Further, the remaining adhesive on the thin glass substrate after separation also becomes a problem.

  On the other hand, according to the thin glass laminate described in Patent Document 7, a distortion defect due to mixing of bubbles or the like between the glass substrates as described above hardly occurs. It is also possible to peel the thin glass substrate and the supporting glass substrate. Furthermore, the problem of remaining adhesive on the thin glass substrate after separation is solved. However, it is desirable to separate both glass substrates more easily and in a shorter time. In particular, when the glass substrate is large, it is an important point for industrial use.

  The present invention has been made in view of the above problems. In other words, it suppresses the occurrence of glass defects due to foreign matters such as bubbles and dust mixed between glass substrates, and can be processed in an existing production line without generating edge pits. It is an object of the present invention to provide a method for manufacturing a panel for a display device that can be easily and quickly separated from a supporting glass substrate. Moreover, it aims at providing the manufacturing method of a display apparatus including the manufacturing method of such a panel for display apparatuses. Furthermore, it aims at providing the panel for display apparatuses with a support body which can be processed with the manufacturing method of such a panel for display apparatuses.

The present inventor has intensively studied in order to solve the above problems, and has completed the present invention.
The present invention includes the following (1) to (9).
(1) A method for producing a panel for a display device having a thin glass substrate,
The first main surface of the thin glass substrate having the first main surface and the second main surface has easy peelability fixed to the first main surface of the supporting glass substrate having the first main surface and the second main surface. The manufacturing method of the panel for display apparatuses which comprises the immersion process which immerses the panel for display apparatuses with a support body which the resin layer is closely_contact | adhered in an organic solvent.
(2) The manufacturing method of the panel for display apparatuses as described in said (1) whose difference of the solubility parameter of the said organic solvent and the said resin layer is 3 or less.
(3) The manufacturing method of the panel for display apparatuses as described in said (1) or (2) whose said resin layer is a silicone resin layer.
(4) The manufacturing method of the panel for display apparatuses in any one of said (1)-(3) which provides an ultrasonic vibration to the panel for display apparatuses with a support body immersed in the said organic solvent.
(5) In the display device-equipped panel, the area of the first main surface of the thin glass substrate is larger than the surface area of the resin layer,
The portion of the thin glass substrate that is not in contact with the resin layer and the support glass substrate facing the first glass surface form a gap that is connected to the end surface of the display panel with support. The manufacturing method of the panel for display apparatuses in any one of said (1)-(4).
(6) The manufacturing method of the panel for display apparatuses as described in said (5) whose depth of the said clearance gap part from the said end surface of the said thin glass substrate is 10 mm or more.
(7) Further, after the dipping step, the method further comprises a peeling step of peeling the thin glass substrate and the supporting glass substrate by spraying a fluid onto the end surface of the display device panel with a support. )-(6) The manufacturing method of the panel for display apparatuses in any one of.
(8) A method for manufacturing a display device, comprising the dipping step and / or the peeling step according to any one of (1) to (7).
(9) Display with support, in which a resin layer having easy peelability fixed to the first main surface of the supporting glass substrate is in close contact with the first main surface of the thin glass substrate that is a part of the display device panel A device panel,
The area of the first main surface of the thin glass substrate is larger than the surface area of the resin layer, the portion of the thin glass substrate that is not in contact with the resin layer, and the supporting glass substrate facing the portion Forming a gap portion connected to the end face.

  According to the present invention, it is possible to easily suppress the occurrence of distortion defects of the glass substrate due to foreign matters such as bubbles and dust mixed between the glass substrates, and processing is performed on an existing production line without generating edge pits. It is possible to provide a method for manufacturing a panel for a display device that can easily and quickly separate a thin glass substrate, a resin layer, and a supporting glass substrate that are in close contact with each other. Moreover, the manufacturing method of a display apparatus including the manufacturing method of such a display apparatus panel can be provided. Furthermore, the display device panel with a support which can be processed by such a method for manufacturing a display device panel can be provided.

The present invention will be described.
The present invention is a method for manufacturing a panel for a display device having a thin glass substrate, wherein the first main surface and the second main surface are formed on the first main surface of the thin glass substrate having a first main surface and a second main surface. For a display device, comprising a dipping step of immersing a panel for a display device with a support, which is adhered to a first principal surface of a supporting glass substrate having a surface, in close contact with an organic solvent. It is a manufacturing method of a panel.
Hereinafter, such a manufacturing method is also referred to as a “panel manufacturing method of the present invention”.
Further, the panel for a display device with a support used in the dipping process in the panel manufacturing method of the present invention, that is, the first main surface and the first main surface of the thin glass substrate having the first main surface and the second main surface, The panel for a display device with a support, in which the resin layer having easy peelability fixed to the first main surface of the support glass substrate having the second main surface is in close contact, is referred to as “the panel with a support according to the present invention” below. Also called.

  First, the panel with a support of the present invention will be described. In the panel with support of the present invention, the thin glass substrate is not particularly limited in thickness, shape, size, physical properties (heat shrinkage rate, surface shape, chemical resistance, etc.), composition, etc. It may be the same as a glass substrate for a display device such as an OLED.

  The thickness of the thin glass substrate is preferably less than 0.7 mm, more preferably 0.5 mm or less, and even more preferably 0.4 mm or less. Further, it is preferably 0.05 mm or more, more preferably 0.07 mm or more, and further preferably 0.1 mm or more.

  The shape of the thin glass is not limited, but is preferably rectangular.

  Although the magnitude | size of a sheet glass is not limited, For example, in the case of a rectangle, it may be 100-2000 mm x 100-2000 mm, and it is more preferable that it is 500-1000 mm x 500-1000 mm.

  Even with such a thickness and size, the thin glass substrate and the supporting glass substrate can be easily peeled off by the dipping process or the dipping process and the peeling process in the panel manufacturing method of the present invention.

Properties of the thin glass substrate such as thermal shrinkage, surface shape, chemical resistance and the like are not particularly limited, and vary depending on the type of display device to be manufactured.
The heat shrinkage rate is preferably small. Specifically, the linear expansion coefficient, which is an index of the heat shrinkage rate, is preferably 500 × 10 ⁻⁷ / ° C. or less, more preferably 300 × 10 ⁻⁷ / ° C. or less, and 200 × 10 ⁻⁷ / ° C. More preferably, it is 100 degrees C < ^-7 > / degrees C or less, More preferably, it is 45 * 10 < ^-7 > / degrees C or less.
In addition, in this invention, a linear expansion coefficient means a thing prescribed | regulated to JISR3102 (1995).

  The composition of the thin glass substrate may be the same as that of alkali glass or non-alkali glass, for example. Among these, alkali-free glass is preferable because of its low thermal shrinkage rate.

The panel with a support of the present invention has a display device member on the second main surface of the thin glass substrate.
The display device member includes a light emitting layer, a protective layer, a TFT array (hereinafter referred to as an array), a color filter, a liquid crystal, and ITO, which are provided on a surface of a glass substrate for a display device such as a conventional LCD or OLED. It means various circuit patterns such as transparent electrodes. The kind of member for display apparatuses on the 2nd main surface of the said thin glass substrate is not specifically limited.
A panel for a display device is composed of such a member for a display device and the thin glass substrate.

  The panel with a support of the present invention has a support glass substrate on which a resin layer is fixed as a support on the first main surface of the thin glass substrate. The supporting glass substrate is in close contact with the thin glass substrate through the resin layer, and reinforces the strength of the thin glass substrate.

The thickness, shape, size, physical properties (heat shrinkage rate, surface shape, chemical resistance, etc.), composition, etc. of the supporting glass substrate are not particularly limited.
The thickness of the supporting glass substrate is not particularly limited, but it is necessary that the supporting glass panel of the present invention has such a thickness that can be processed in the current production line.
For example, the thickness is preferably 0.1 to 1.1 mm, more preferably 0.3 to 0.8 mm, and still more preferably 0.4 to 0.7 mm.
For example, when the current production line is designed to process a substrate having a thickness of 0.5 mm and the thickness of the thin glass substrate is 0.1 mm, the thickness of the supporting glass substrate and the resin layer Together with the thickness, it is 0.4 mm. In addition, the current production line is most commonly designed to process a glass substrate having a thickness of 0.7 mm. For example, if the thickness of a thin glass substrate is 0.4 mm, the resin layer The thickness is 0.3 mm.
The thickness of the supporting glass substrate is preferably thicker than that of the thin glass substrate.

  The shape of the supporting glass substrate is not limited, but is preferably rectangular.

  Although the size of the supporting glass substrate is not limited, it is preferably about the same as the thin glass substrate, and slightly larger than the glass substrate. For example, specifically, it is preferable that each of the vertical direction or the horizontal direction is larger by about 0.05 to 10 mm. The reason is that it is easy to protect the end portion of the thin glass substrate from the contact of an alignment device such as a positioning pin at the time of manufacturing a panel for a display device, and that the thin glass substrate and the supporting glass substrate are more easily separated. Because it can.

The supporting glass substrate may have a linear expansion coefficient that is substantially the same as or different from that of the thin glass substrate. Substantially the same is preferable in that the thin glass substrate or the supporting glass substrate is less likely to warp when processed by the panel manufacturing method of the present invention.
The difference in coefficient of linear expansion between the thin glass substrate and the supporting glass substrate is preferably 300 × 10 ⁻⁷ / ° C. or less, more preferably 100 × 10 ⁻⁷ / ° C. or less, and 50 × 10 ⁻⁷ / ° C. More preferably, it is not higher than ° C.

  The composition of the supporting glass substrate may be the same as that of alkali glass or non-alkali glass, for example. Among these, alkali-free glass is preferable because of its low thermal shrinkage rate.

The resin layer fixed to the first main surface of the supporting glass substrate is attached to and closely adhered to the first main surface of the thin glass substrate, but can be easily peeled off. That is, the resin layer has easy peelability from the thin glass substrate.
In the panel with a support of the present invention, it is considered that the resin layer and the thin glass substrate are not attached by the adhesive force that the adhesive has, and the force caused by the van der Waals force between the solid molecules, that is, the adhesion It is thought to be attached by power.

  The thickness of the resin layer is not particularly limited. It is preferable that it is 1-100 micrometers, It is more preferable that it is 5-30 micrometers, It is further more preferable that it is 7-20 micrometers. This is because when the thickness of the resin layer is in such a range, the thin glass substrate and the resin layer are sufficiently adhered. Moreover, even if bubbles or foreign substances are present, it is possible to suppress the occurrence of distortion defects in the thin glass substrate. On the other hand, if the resin layer is too thick, it takes time and materials to form the resin layer, which is not economical.

In addition, the resin layer may consist of two or more layers. In this case, “the thickness of the resin layer” means the total thickness of all the layers.
Moreover, when a resin layer consists of two or more layers, the kind of resin which forms each layer may differ.

In the resin layer, the surface tension of the surface of the resin layer relative to the first main surface of the thin glass substrate is preferably 30 mN / m or less, more preferably 25 mN / m or less, and 22 mN / m or less. Further preferred. This is because such surface tension can be more easily peeled off from the thin glass substrate, and at the same time, the close contact with the thin glass substrate becomes sufficient.
Moreover, it is preferable that a resin layer consists of a material whose glass transition point is lower than room temperature (about 25 degreeC) or does not have a glass transition point. This is because it becomes a non-adhesive resin layer, is more easily peelable, can be more easily peeled off from the thin glass substrate, and at the same time is sufficiently adhered to the thin glass substrate.
Moreover, it is preferable that the resin layer has heat resistance. In the panel manufacturing method of the present invention, for example, when a member for a display device is formed on the second main surface of the thin glass substrate, the glass laminate of the thin glass substrate, the resin layer, and the supporting glass substrate can be subjected to heat treatment. Because.
Moreover, since the adhesiveness with a thin glass substrate will become low when the elasticity modulus of a resin layer is too high, it is unpreferable. On the other hand, if the elastic modulus is too low, the easy peelability is lowered, which is not preferable.

  The kind of resin which forms a resin layer is not specifically limited. For example, acrylic resin, polyolefin resin, polyurethane resin, and silicone resin can be used. Several types of resins can be mixed and used. Of the group of resins, silicone resins are preferred. This is because the silicone resin is excellent in heat resistance and preferably has a degree of easy peeling from a thin glass substrate. Moreover, it is because it is easy to fix to a support glass substrate by the condensation reaction with the silanol group of the 1st main surface of a support glass substrate. It is also preferable that the silicone resin layer is not easily deteriorated even if it is treated at about 300 to 400 ° C. for about 1 hour, for example.

  Moreover, it is preferable that a resin layer consists of silicone for release paper among silicone resins, and it is preferable that it is the hardened | cured material. The silicone for release paper is mainly composed of silicone containing linear dimethylpolysiloxane in the molecule. The resin layer formed by curing the composition containing the main agent and the crosslinking agent on the surface (first main surface) of the supporting glass substrate using a catalyst, a photopolymerization initiator, etc. has excellent easy peelability. Since it has, it is preferable. Moreover, since the flexibility is high, even if foreign matters such as bubbles and dust are mixed between the thin glass substrate and the resin layer, the occurrence of distortion defects of the thin glass substrate can be suppressed.

  Such release paper silicones are classified into condensation reaction type silicones, addition reaction type silicones, ultraviolet ray curable type silicones and electron beam curable type silicones depending on their curing mechanism, and any of them can be used. Among these, addition reaction type silicone is preferable. This is because the curing reaction is easy, the degree of easy peeling is good when the resin layer is formed, and the heat resistance is also high.

  The release paper silicone is classified into a solvent type, an emulsion type, and a solventless type, and any type can be used. Among these, a solventless type is preferable. This is because productivity, safety, and environmental characteristics are excellent. Further, since a solvent that causes foaming is not included at the time of curing when forming the resin layer, that is, at the time of heat curing, ultraviolet curing, or electron beam curing, bubbles are unlikely to remain in the resin layer.

  Further, as release paper silicone, specifically, commercially available products or model numbers are KNS-320A, KS-847 (both manufactured by Shin-Etsu Silicone), TPR6700 (GE Toshiba Silicone), vinyl silicone. A combination of “8500” (Arakawa Chemical Industries, Ltd.) and methylhydrogenpolysiloxane “12031” (Arakawa Chemical Industries, Ltd.), vinyl silicone “11364” (Arakawa Chemical Industries, Ltd.) and methylhydrogenpoly Combination with siloxane “12031” (Arakawa Chemical Industries), combination of vinyl silicone “11365” (Arakawa Chemical Industries) and methylhydrogenpolysiloxane “12031” (Arakawa Chemical Industries), etc. Is mentioned. KNS-320A, KS-847, and TPR6700 are silicones that contain a main agent and a crosslinking agent in advance.

  Moreover, it is preferable that the silicone resin which forms a resin layer has a property which the component in a silicone resin does not transfer easily to a thin glass substrate, ie, low silicone transferability.

Next, the support-equipped panel of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic cross-sectional view showing one embodiment of the panel with a support of the present invention.
In FIG. 1, the display device panel 16 includes a layered display device member 14 and a thin glass substrate 12, which are laminated. Here, the display device member 14 is formed on the second main surface of the thin glass substrate 12. And the 1st main surface of the thin glass substrate 12 and the surface of the resin layer 18 fixed to the 1st main surface of the support glass substrate 19 adhere closely, and the panel 10 with a support body of this invention is formed. ing.
In the panel 10 with a support of the present invention shown in FIG. 1, the thin glass substrate 12, the resin layer 18, and the support glass substrate 19 have the same size.

FIG. 2 is a schematic front view showing another embodiment of the panel with a support of the present invention, and FIG. 3 is an AA ′ cross-sectional view (schematic cross-sectional view) thereof.
2 and 3, the display device panel 26 includes a layered display device member 24 and a thin glass substrate 22, which are laminated. Here, the display device member 24 is formed on the second main surface of the thin glass substrate 22. And the 1st main surface of the thin glass substrate 22 and the resin layer 28 fixed to the 1st main surface of the support glass substrate 29 have adhered, and the panel 20 with a support body of this invention is formed. Yes.
The support-equipped panel 20 of the embodiment of the present invention shown in FIGS. 2 and 3 has a major surface area of the support glass substrate 29 larger than that of the thin glass substrate 22.

2 and 3 of the present invention is also referred to as the “surface area” of the resin layer 28 (hereinafter referred to as “surface area”) of the surface of the resin layer 28 (the surface in contact with the thin glass substrate 22). ) The area of the first main surface of the thin glass substrate 22 is larger. The surface area of the resin layer 28 is smaller than the area of the first main surface of the thin glass substrate 22 due to the formation of gaps 25 described later. A portion α of the first main surface of the thin glass substrate 22 that is not in contact with the resin layer 28 and a portion β of the supporting glass substrate 29 opposite to the portion α are the end surfaces (γ ₁ , A gap 25 connected to γ ₂ ) is formed.
It is preferable that such a gap portion 25 is formed because the thin glass substrate and the resin layer can be more easily separated in the dipping step and / or the peeling step in the panel manufacturing method of the present invention described later.

Further, the depth of the gap portion 25 is preferably 1 mm or more, more preferably 3 mm or more, and further preferably 5 mm or more. Moreover, it is preferable that it is 15 mm or less, and it is more preferable that it is 10 mm or less. This is because the thin glass substrate and the resin layer can be more easily peeled in the dipping step and / or the peeling step in the panel manufacturing method of the present invention described later.
The “depth of the gap” means the length from the end face (γ ₂ ) of the thin glass substrate to the end face of the resin layer in the direction perpendicular to the end face. In the case shown in FIGS. 2 and 3, it means the length of the portion indicated by α. As shown in FIG. 5 to be described later, when the length in the direction perpendicular to the end surface from the end surface of the thin glass substrate to the end surface of the resin layer varies depending on the location of the end surface of the thin glass substrate as the starting point, the maximum Is the “depth of the gap”.

  Further, the position of the gap portion 25 may be the central portion of one side of the rectangular thin glass substrate 22 as shown in FIG. 2, or all of one side of the rectangular thin glass substrate 22 as shown in FIG. Good. Moreover, it may be formed so as to lack one of the corners of the rectangular thin glass substrate 22 as shown in FIG. 4 and 5 are schematic front views showing still another aspect of the panel with a support according to the present invention.

  Further, as shown in the schematic sectional view of FIG. 6, the panel with a support of the present invention supports both main surfaces of the display device member 34 with the thin glass substrates (32a, 32b) and the resin layers (38a, 38b). A mode of sandwiching with a laminated body with glass substrates (39a, 39b) may be employed. Even if it is such an aspect, it is a panel with a support body of this invention which can be processed with the panel manufacturing method of this invention.

Next, the manufacturing method of the panel with a support of this invention is demonstrated.
The manufacturing method of a thin glass substrate and a support glass substrate is not specifically limited. For example, it can be produced by a conventionally known method. For example, it can be obtained by melting a conventionally known glass raw material to form a molten glass and then forming it into a plate shape by a float method, a fusion method, a down draw method, a slot down method, a redraw method or the like.

The method for forming the resin layer on the surface (first main surface) of the support glass substrate thus produced is not particularly limited.
For example, the method of adhering a film to the surface of a support glass substrate is mentioned. Specifically, a method of performing a surface modification treatment to give a high adhesive force to the surface of the film and adhering to the first main surface of the supporting glass substrate can be mentioned. Surface modification treatment methods include chemical methods such as silane coupling agents that chemically improve adhesion, physical methods that increase surface active groups such as flame treatment, and sandblast treatment. Examples thereof include a mechanical method for increasing the catch by increasing the surface roughness.

Moreover, the method of coating the resin composition used as a resin layer on the 1st main surface of a support glass substrate by a well-known method, for example is mentioned. Known methods include spray coating, die coating, spin coating, dip coating, roll coating, bar coating, screen printing, and gravure coating. From such a method, it can select suitably according to a kind to a resin composition.
For example, when a solventless release paper silicone is used as the resin composition, a die coating method, a spin coating method or a screen printing method is preferred.

  In addition, when manufacturing the panel with a support body of this invention which has a clearance gap as demonstrated using FIGS. 2-5, it masks beforehand in the location which forms a clearance gap, and coats a resin composition on it. It is preferable to do. Masking means that when a resin composition is coated, a removable film or the like is pasted on a portion where a gap is formed in advance so that the resin composition is not coated on that portion, and the film is peeled off later. Is the method.

In the case of coating a resin composition on the first main surface of the supporting glass substrate, it is preferable that the coating amount is 1 to 100 g / ^{m 2,} and more preferably 5 to 20 g / ^{m 2.}

  As another method, for example, when a resin layer is formed from an addition reaction type silicone, a resin composition containing a silicone (main agent) containing linear dimethylpolysiloxane in the molecule, a crosslinking agent and a catalyst, It coats on a support glass substrate by well-known methods, such as a spray coat method, and makes it heat-harden after that. The heat curing conditions vary depending on the blending amount of the catalyst. For example, when 2 parts by weight of the platinum-based catalyst is blended with respect to 100 parts by weight of the total amount of the main agent and the crosslinking agent, 50 to 250 ° C. in the atmosphere, The reaction is preferably performed at 100 ° C to 200 ° C. In this case, the reaction time is 5 to 60 minutes, preferably 10 to 30 minutes. In order to obtain a silicone resin layer having a low silicone migration property, it is preferable to allow the curing reaction to proceed as much as possible so that an unreacted silicone component does not remain in the silicone resin layer, but at such a reaction temperature and reaction time. When it exists, it is possible to prevent an unreacted silicone component from remaining in the silicone resin layer, which is preferable. If the reaction time is too long or the reaction temperature is too high, the silicone resin is simultaneously oxidized and decomposed to produce a low molecular weight silicone component, which may increase the silicone transferability. It is also preferable to allow the curing reaction to proceed as much as possible so that an unreacted silicone component does not remain in the silicone resin layer in order to improve the peelability after the heat treatment.

After the resin layer is formed on the first main surface of the supporting glass substrate by such a method, a thin glass substrate is laminated on the surface of the resin layer.
When the resin layer is manufactured using the release paper silicone, the release paper silicone coated on the support glass substrate is heat-cured to form a silicone resin layer, and then the thin glass is formed on the silicone resin formation surface of the support glass substrate. Laminate the substrates. By curing the silicone for release paper by heating, the cured silicone resin is chemically bonded to the supporting glass. Further, the silicone resin layer is bonded to the supporting glass by the anchor effect. By these actions, the silicone resin layer is firmly fixed to the supporting glass substrate.

  The thin glass substrate and the resin layer are brought into close contact with the resin layer by a force caused by van der Waals force between the adjacent solid molecules that are very close to each other, that is, an adhesive force. In this case, the supporting glass substrate and the thin glass substrate can be held in a laminated state. Moreover, in this case, the components in the resin layer are prevented from transferring to the surface of the thin glass substrate after being separated from the support glass substrate.

  The method for laminating the thin glass substrate on the surface of the resin layer fixed to the supporting glass substrate is not particularly limited. For example, it can implement using a well-known method. For example, after laminating a thin glass substrate on the surface of the resin layer under a normal pressure environment, a method of pressure bonding the resin layer and the thin glass substrate using a roll or a press can be mentioned. It is preferable because the resin layer and the thin glass substrate are more closely adhered by pressure bonding with a roll or a press. Further, it is preferable because bubbles mixed between the resin layer and the thin glass substrate are easily removed by pressure bonding with a roll or a press. When pressure bonding is performed by a vacuum laminating method or a vacuum pressing method, it is more preferable because suppression of bubble mixing and securing of good adhesion are more preferably performed. By pressure bonding under vacuum, there is an advantage that even if a minute bubble remains, the bubble does not grow by heating, and it is difficult to cause a distortion defect of the thin glass substrate.

  When laminating a thin glass substrate on the surface of the resin layer of the supporting glass substrate, it is preferable that the surface of the thin glass substrate is sufficiently washed and laminated in a clean environment. This is because even if foreign matter is present, the flatness of the surface of the thin glass substrate is not affected by the deformation of the resin layer, but the higher the cleanness, the better the flatness and the better.

Thus, after obtaining the glass laminated body (henceforth a "thin glass laminated body") which laminated | stacked the thin glass substrate, the resin layer, and the support glass substrate, the 1st of the thin glass substrate in this thin glass laminated body is obtained. (2) A display device member is formed on the main surface.
In forming the display device member, it is also preferable to improve the flatness by polishing the second main surface of the thin glass substrate as necessary.
The display device member is not particularly limited. For example, an array or a color filter included in the LCD can be mentioned. Further, for example, a transparent electrode, a hole injection layer, a hole transport layer, a light emitting layer, and an electron transport layer included in the OLED can be given.

A method of forming such a display device member is not particularly limited, and may be the same as a conventionally known method.
For example, when manufacturing an LCD as a display device, a process of forming an array on a conventionally known glass substrate, a process of forming a color filter, and a glass substrate on which the array is formed and a glass substrate on which the color filter is formed are bonded together. It may be the same as various steps such as a step (array / color filter bonding step). More specifically, examples of the processing performed in these steps include pure water cleaning, drying, film formation, resist coating, exposure, development, etching, and resist removal. Further, as a process performed after performing the bonding process of the array side substrate and the color filter side substrate, there are a liquid crystal injection process and an injection port sealing process performed after the process, and these processes are performed. Processing.

  Taking the case of manufacturing an OLED as an example, as a process for forming an organic EL structure on the first main surface of a thin glass substrate, a process of forming a transparent electrode, a hole injection layer, a hole transport layer, Various processes such as a process for depositing a light emitting layer / electron transport layer and the like, a sealing process, and the like are performed. Specifically, for example, a film forming process, a vapor deposition process, and an adhesion of a sealing plate are performed. Processing and the like.

  Thus, the panel with a support of the present invention can be manufactured.

Next, the panel manufacturing method of the present invention will be described.
The panel manufacturing method of this invention manufactures the panel with a support body of this invention by the above methods, and immerses the panel with a support body of this invention in an organic solvent at an immersion process after that.
By immersing, the thin glass substrate and the resin layer fixed to the supporting glass substrate are separated. Alternatively, the adhesion between the thin glass substrate and the resin layer is weakened so that the peeling can be easily performed in the peeling step performed after this step.

An immersion process for immersing the panel with a support of the present invention in an organic solvent will be described.
The method for immersing the panel with a support of the present invention in an organic solvent is not particularly limited. For example, the method of immersing to the depth into which the interface of a thin glass substrate and a resin layer is immersed in the bathtub into which the organic solvent was poured at least is mentioned. Then, it is considered that the interface between the easily peelable resin layer and the thin glass substrate is fixed only by the force caused by the van der Waals force between the opposing solid molecules as described above, that is, the adhesion force. Therefore, it is considered that the organic solvent permeates into the interface from the end portion of the interface between the thin glass substrate and the resin layer by a capillary phenomenon and cuts the van der Waals force. Then, the thin glass substrate and the resin layer fixed to the supporting glass substrate can be separated. Alternatively, the adhesion between the thin glass substrate and the resin layer can be weakened so that the peeling can be easily performed in the peeling step performed after this step.

Moreover, it is preferable to apply ultrasonic vibration to the panel with a support of the present invention immersed in an organic solvent. This is because separation between the thin glass substrate and the resin layer is promoted. This is presumably because the penetration of the organic solvent between the thin glass substrate and the resin layer is promoted.
The frequency of the ultrasonic wave is not particularly limited, but is preferably 20 to 120 kHz, more preferably 30 to 100 kHz, and further preferably 40 to 80 kHz. This is because an apparatus that can apply ultrasonic waves at such a frequency is easily available.
FIG. 7 schematically shows an outline of the dipping process. FIG. 7 is a schematic cross-sectional view showing that the panel with support 30 of the embodiment of the present invention shown in FIG. 6 is immersed in the bathtub 42 into which the organic solvent 40 is poured. An ultrasonic generator 41 that generates ultrasonic vibrations is installed at the bottom of the bathtub 42.

  In addition, when the panel with a support of the present invention is immersed in an organic solvent, a member that is preferably not in contact with the organic solvent in the display device member is preferably appropriately sealed or masked. For example, if the display device member has a liquid crystal injection hole, liquid may enter the display device side, so that it is preferable to perform sealing or masking treatment as appropriate.

The organic solvent is not particularly limited, but a solvent having a solubility parameter close to that of the substance forming the resin layer is preferable. The difference in solubility parameter is preferably 3 or less, more preferably 2 or less, and even more preferably 1.5 or less. For example, when the resin layer is a silicone resin layer, an organic solvent having a solubility parameter of 10 or less is preferable.
Table 1 shows preferable combinations of the organic solvent and the resin layer.

  When the resin layer is a silicone resin layer, xylene, butyl acetate or n-octane can swell the silicone resin layer well, the penetration into the interface proceeds quickly, and the boiling point is 100 ° C. or higher, and the organic solvent Since the volatilization amount of can be suppressed, it is preferable.

  Although the panel manufacturing method of the present invention includes such a dipping process, it is preferable to further include a peeling process after the dipping process.

The peeling process will be described.
The peeling step is a step of peeling the thin glass substrate and the supporting glass substrate by spraying a fluid onto the end face of the panel with a support of the present invention after the dipping step.
As described above, the thin glass substrate and the resin layer fixed to the supporting glass substrate are separated by the dipping step. However, depending on the processing conditions, the type of the resin material, and the like, the separation may take time. In such a case, in the dipping process, only the adhesion between the thin glass substrate and the resin layer is weakened, and before the thin glass substrate and the resin layer are separated, the panel with the support of the present invention is taken out from the organic solvent, and then In this peeling step, it is preferable to peel the thin glass substrate and the resin layer because the processing efficiency is improved.

As a specific peeling method, a method is preferred in which, after the dipping step, a fluid is sprayed onto the end face of the support-equipped panel of the present invention to peel the thin glass substrate and the supporting glass substrate.
Here, the fluid means mainly gas and / or liquid that does not damage the end surface when sprayed onto the end surface of the thin glass substrate. That is, although it may contain powder, it does not contain powder that scratches the end face of the thin glass substrate. The fluid is preferably water and / or air, more preferably a mixture of water and air, and even more preferably the mixing ratio of water and air is 1:10 to 10: 1 by volume. It is because it can peel more efficiently.
In addition, a razor or the like can be inserted into the end face of the panel with a support of the present invention, whose adhesion is reduced by immersion in an organic solvent, and physically separated.

When fluid is sprayed onto the end face of the panel with a support of the present invention, the fluid enters the interface between the thin glass substrate and the resin layer, and the organic solvent remaining on the end face also enters the interface. It is preferable because the thin glass substrate and the resin layer can be peeled off.
In particular, when the panel with a support of the present invention is an embodiment having the gap, the fluid easily enters the gap and then enters the interface by spraying the fluid onto the end face connected to the gap. Therefore, it is preferable because peeling becomes easier.

  When a silicone resin layer is used as the resin layer, the peeled support glass substrate and the support made of the silicone resin layer can be reused. When the silicone resin in such a support after peeling has low silicone migration, this silicone resin layer tends to have a high residual adhesion rate. Therefore, reuse can be performed without problems.

  Thus, in the panel manufacturing method of the present invention, the panel with a support of the present invention is subjected to the dipping step, whereby the thin glass substrate and the support glass substrate are separated to obtain a display device panel. . Or after the said immersion process, the panel for display apparatuses can be obtained by using for the said peeling process further. Alternatively, after being subjected to the immersion step or the peeling step, it is further subjected to a desired step, whereby a display device panel can be obtained. For example, in the case of LCD, the desired process includes a process of dividing into cells of a desired size, a process of injecting liquid crystal and then sealing the injection port, a process of attaching a polarizing plate, and a module forming process. It is done. For example, in the case of OLED, in addition to these steps, a step of assembling a thin glass substrate on which an organic EL structure is formed and a counter substrate may be mentioned. Note that the step of dividing into cells of a desired size is preferably performed by a laser cutter because the strength of the thin glass substrate is not reduced by the cutting process and no cullet is produced.

A specific example of the panel manufacturing method of the present invention will be described using a flowchart.
FIG. 8 is a flowchart showing a specific example of the panel manufacturing method of the present invention.

First, the manufacturing method of the panel with support of the present invention in the panel manufacturing method of the present invention will be described.
First, a thin glass substrate and a supporting glass substrate are prepared, and these surfaces are cleaned. Examples of cleaning include pure water cleaning and UV cleaning.
Next, a resin layer is formed on the first main surface of the supporting glass substrate. For example, a silicone resin is coated on the first main surface of the supporting glass substrate using a screen printer. And it heat-hardens, forms a resin layer on the 1st main surface of a support glass substrate, and obtains the support glass substrate to which the resin layer was fixed.
Next, the resin layer and the first main surface of the sheet glass are attached and bonded together. For example, the resin layer and the thin glass substrate can be bonded together by vacuum pressing at room temperature. And the thin glass laminated body which is a laminated body of a support glass substrate, a resin layer, and a thin glass substrate can be obtained.
Next, if necessary, the second main surface of the thin glass substrate in the thin glass laminate may be polished or washed. Examples of cleaning include pure water cleaning and UV cleaning.
After manufacturing two thin glass laminated bodies by such a method, the member for display apparatuses is formed in the 2nd main surface of the thin glass substrate in each thin glass laminated body. One thin glass laminate is subjected to a known color filter forming step to form a color filter array on the second main surface of the thin glass glass substrate. Then, the other thin glass laminate is subjected to a known array forming process to form a TFT array on the second main surface of the thin glass glass substrate.
Two panels with a support of the present invention can be manufactured by such a method.
In the following, the panel with support of the present invention having the color filter array obtained here is referred to as “panel with support x”, and the panel with support of the present invention having the TFT array is referred to as “panel y with support”. Also called.

  In the panel manufacturing method of the present invention, the panel x with support and the panel y with support manufactured in this way are further processed by, for example, the following methods of case 1 to case 4 to manufacture a panel for a display device. To do.

(Case 1)
In case 1, as described above, the color filter array and the TFT array in each of the support-equipped panel x and the support-equipped panel y are opposed to each other and attached using a sealing agent such as an ultraviolet curable sealing agent for cell formation. Match. The panel with support of the present invention obtained here is also referred to as “panel with support z1” below. The panel with support z1 is in a state where liquid crystal is not yet sealed.
Next, the liquid crystal injection hole of the support-equipped panel z1 is sealed. For example, the outer side may be further sealed using an ultraviolet curable water-soluble sealant or the like.
And the panel z1 with a support body after sealing is used for an immersion process. Specifically, panel z1 with a support is immersed in a bathtub in which an organic solvent is stored. And the adhesive force of a thin glass substrate and a resin layer is weakened, and the two support bodies which panel z1 with a support body has are isolate | separated. Here, before the separation is completed, the two supports may be peeled by taking them out from the organic solvent and further subjecting them to a peeling step. Here, the panel obtained by separating the two supports is also referred to as “panel w1” below. The two separated supports are reused for manufacturing another support-equipped panel.
Next, the panel w1 is cut into individual cells.
Next, liquid crystal is injected into the cut individual cells and then sealed to form a liquid crystal cell.
Then, a polarizing plate is further attached to form a backlight and the like, and the LCD 1 can be obtained.

(Case 2)
In case 2, as described above, the color filter array and the TFT array in each of the support-equipped panel x and the support-equipped panel y are opposed to each other, liquid crystal is sealed, and thereafter, an ultraviolet curable sealant for cell formation, etc. Bond together using the sealant. The panel with support of the present invention obtained here is also referred to as “panel with support z2” below.
Next, the panel with support z2 is subjected to an immersion process. Specifically, the support-equipped panel z2 is immersed in a bathtub in which an organic solvent is stored. And the adhesive force of a thin glass substrate and a resin layer is weakened, and the two support bodies which panel z2 with a support body has are isolate | separated. Here, before the separation is completed, the two supports may be peeled by taking them out from the organic solvent and further subjecting them to a peeling step. Hereinafter, the panel obtained by separating the two supports is also referred to as “panel w2”. The two separated supports are reused for manufacturing another support-equipped panel.
Next, the panel w2 is cut into individual cells.
Then, a polarizing plate is further attached to form a backlight and the like, and the LCD 2 can be obtained.

(Case 3)
In case 3, as described above, the color filter array and the TFT array in each of the support-equipped panel x and the support-equipped panel y are opposed to each other, liquid crystal is sealed, and then a cell-forming ultraviolet curable sealant or the like Bond together using the sealant. And it cut | disconnects to an individual cell with a support body. The panel with support of the present invention obtained by cutting here is also referred to as “panel with support z3” below.
Next, the panel with support z3 is subjected to an immersion process. Specifically, the support-equipped panel z3 is immersed in a bathtub in which an organic solvent is stored. And the adhesive force of a thin glass substrate and a resin layer is weakened, and the two support bodies which panel z3 with a support body has are isolate | separated. Here, before the separation is completed, the two supports may be peeled by taking them out from the organic solvent and further subjecting them to a peeling step. Hereinafter, the panel obtained by separating the two supports is also referred to as “panel w3”.
Further, an LCD 3 can be obtained by attaching a polarizing plate and forming a backlight and the like.

(Case 4)
In case 4, as described above, the color filter array and the TFT array in each of the support-equipped panel x and the support-equipped panel y are opposed to each other and attached using a sealing agent such as an ultraviolet curable sealing agent for cell formation. Match. And it cut | disconnects to an individual cell with a support body. The panel with a support of the present invention obtained by cutting here is also referred to as “panel with support z4” below. The panel with support z4 is in a state where liquid crystal is not sealed yet.
Next, the liquid crystal injection hole of the support-equipped panel z4 is sealed. For example, the outer side may be further sealed using an ultraviolet curable water-soluble sealant or the like.
And the panel z4 with a support after sealing is used for an immersion process. Specifically, panel z4 with a support is immersed in a bathtub in which an organic solvent is stored. And the adhesive force of a thin glass substrate and a resin layer is weakened, and two support bodies which panel z4 with a support body has are isolate | separated. Here, before the separation is completed, the two supports may be peeled by taking them out from the organic solvent and further subjecting them to a peeling step. Here, the panel obtained by separating the two supports is also referred to as “panel w4” below.
Next, liquid crystal is injected into the cell of the panel w4 and then sealed.
Further, an LCD 4 can be obtained by attaching a polarizing plate and forming a backlight and the like.

  The panel manufacturing method of the present invention is, for example, a manufacturing method of case 1 to case 4 shown in the flowchart of FIG.

  According to the dipping process or the peeling process included in the panel manufacturing method of the present invention, when the thin glass substrate is large, the thin glass substrate can be easily peeled even when the thickness is, for example, 730 × 920 mm.

Next, a method for manufacturing the display device of the present invention will be described.
The manufacturing method of the display device of the present invention is a manufacturing method including the panel manufacturing method of the present invention.
After obtaining the panel for display devices by the panel manufacturing method of the present invention, the display device can be obtained by subjecting the panel to further known processes.

  The display device manufacturing method of the present invention is suitable for manufacturing a small display device used in a mobile terminal such as a mobile phone or a PDA. The display device is mainly an LCD or an OLED, and the LCD includes a TN type, STN type, FE type, TFT type, MIM type, IPS type, VA type, and the like. Basically, the present invention can be applied to both passive drive type and active drive type display devices.

Example 1
First, a supporting glass substrate (AN100 manufactured by Asahi Glass Co., Ltd.) having a length of 720 mm, a width of 600 mm, a plate thickness of 0.4 mm, and a linear expansion coefficient of 38 × 10 ⁻⁷ / ° C. was cleaned by pure water cleaning and UV cleaning.
Next, on the supporting glass substrate, 100 parts by mass of solvent-free addition reaction type release paper silicone (manufactured by Shin-Etsu Silicone Co., Ltd., KNS-320A, viscosity: 0.40 Pa · s, solubility parameter (SP value) = 7.3) And a platinum based catalyst (manufactured by Shin-Etsu Silicone Co., Ltd., CAT-PL-56) 2 parts by mass were coated with a screen printer in a size of 705 mm in length and 595 mm in width (coating amount 30 g / m ² ). .
Next, this was heat-cured at 180 ° C. for 30 minutes in the air to obtain a silicone resin layer having a thickness of 20 μm on the surface of the supporting glass substrate.

Next, the surface of the thin glass substrate (AN100 manufactured by Asahi Glass Co., Ltd.) having a length of 720 mm, a width of 600 mm, a thickness of 0.3 mm, and a linear expansion coefficient of 38 × 10 ⁻⁷ / ° C. is cleaned with pure water. After cleaning by UV cleaning, the silicone resin layer and the thin glass substrate were bonded together by a vacuum press at room temperature to obtain a thin glass laminate (thin glass laminate A1).
In addition, formation of the resin layer and lamination | stacking of the thin glass substrate were performed so that the clearance gap of 15 mm in depth might be formed in the edge part of a thin glass laminated body.
In the obtained thin glass laminate A1, both glass substrates were in close contact with the silicone resin layer without generating bubbles, and there was no distortion-like defects and good smoothness.

  Next, apart from the thin glass laminate A1 obtained as described above, the thin glass substrate A1 was further heat-treated in the atmosphere at 300 ° C. for 1 hour to obtain a thin glass laminate A2. The resin layer of the thin glass laminate A2 was not deteriorated by heat, and it was confirmed that the heat resistance was good.

Next, the peelability of the formed thin glass laminates A1 and A2 was evaluated as follows.
<Peel test 1>
First, xylene (dissolution parameter value (SP value) = 8.8) is stored to a depth of 50 mm in a 1 m square vat with a ultrasonic vibration plate set at the bottom and a depth of 50 mm. Ten laminates A1 were immersed. Immersion was performed one by one. From the end of the thin glass laminate A1 immediately after the immersion, it was confirmed that the solvent had permeated the boundary between the thin glass substrate and the resin layer.
Next, a 40 kHz ultrasonic wave was applied for 30 seconds. And it took out and compressed air was sprayed on the edge part which has a clearance gap, supporting each of the thin glass substrate in the thin glass laminated body A1, and a support glass substrate with a suction pad from the upper and lower sides, and the thin glass substrate was able to peel. This operation was repeated 10 times within 20 minutes, and all 10 sheets could be peeled off without any problem.
Moreover, when the same test was done also about thin glass laminated body A2, the result similar to the case of A1 was obtained.

<Peeling test 2>
Except that the ultrasonic waves were not vibrated, a peel test was carried out continuously for 10 sheets of the thin glass laminate A1 in the same procedure as the peel test 1. As a result, all 10 sheets could be peeled off without any problem, but it took 35 minutes to peel 10 sheets.

<Peeling test 3>
Except that the solvent to be used was changed to isopropyl alcohol (SP value = 11.5), a peel test was carried out continuously for 10 thin glass laminates A1 in the same procedure as the peel test 1. As a result, 10 sheets could be peeled off without any problem, but it took 60 minutes to peel 10 sheets.

<Comparative peel test 1>
Ten thin glass laminates A1 were prepared. One of them was placed so that the supporting glass substrate was on the upper side, and the thin glass substrate side was vacuum-adsorbed on a surface plate. In this state, a sharp razor was inserted into the interface between the silicone resin layer at the end of the thin glass laminate A1 and the thin glass substrate, and the ends at both interfaces were pry open and gradually peeled off from the end. It took 1 hour to repeat this operation 10 times, and the edge of the thin glass substrate was damaged in 2 out of 10 sheets.

(Example 2)
A supporting glass substrate (AN100 manufactured by Asahi Glass Co., Ltd.) having a length of 720 mm, a width of 600 mm, a plate thickness of 0.6 mm, and a linear expansion coefficient of 38 × 10 ⁻⁷ / ° C. is cleaned by pure water cleaning and UV cleaning, and then the supporting glass substrate Above, linear polyorganosiloxane having vinyl groups at both ends (trade name “8500”, manufactured by Arakawa Chemical Industries, Ltd.), methyl hydrogen polysiloxane having a hydrosilyl group in the molecule (Arakawa Chemical Industries, Ltd.) (Product name “12031”) and a platinum catalyst (product name “CAT12070” manufactured by Arakawa Chemical Industries, Ltd.) are applied in a screen printer with a size of 705 mm in length and 595 mm in width ( A silicone resin layer having a thickness of 20 μm was obtained by heating and curing in the air at 180 ° C. for 30 minutes at a coating amount of 20 g / m ² ).
Here, the mixing ratio of the linear polyorganosiloxane and the methylhydrogen polysiloxane was adjusted so that the molar ratio of hydrosilyl group to vinyl group was 1/1. The platinum catalyst was 5 parts by mass with respect to 100 parts by mass in total of the linear polyorganosiloxane and methyl hydrogen polysiloxane.

Next, the surface of the thin glass substrate (AN100 manufactured by Asahi Glass Co., Ltd.) having a length of 720 mm, a width of 600 mm, a thickness of 0.1 mm, and a linear expansion coefficient of 50 × 10 ⁻⁷ / ° C. is cleaned with pure water. After cleaning by UV cleaning, the silicone resin layer forming surface of the supporting glass substrate and the thin glass substrate were bonded together by a vacuum press at room temperature to obtain a thin glass laminate (thin glass laminate B).
In addition, formation of the resin layer and lamination | stacking of the thin glass substrate were performed so that the clearance gap of 15 mm in depth might be formed in the edge part of a thin glass laminated body.
In the thin glass laminate B, the glass substrate was in close contact with the silicone resin layer without generating bubbles, and there was no distortion defect and smoothness was good.
Moreover, the peelability of the formed thin glass laminated body B was evaluated as follows.

<Peeling test 4>
In the same manner as the peel test 1, a peel test was performed on ten thin glass laminates B in succession. As a result, all 10 sheets could be peeled off without any problem. It took 20 minutes to peel 10 sheets.

<Comparative peel test 2>
Ten thin glass laminates B were prepared and placed so that the supporting glass substrate was on the upper side, and the thin glass substrate side was vacuum-adsorbed on a surface plate. In this state, a sharp razor was inserted into the interface between the silicone resin layer at the end of the thin glass laminate B and the thin glass substrate, the ends at both interfaces were separated by an external force, and gradually peeled off from the ends. It took 2 hours to repeat this operation 10 times, and the edge of the glass substrate was damaged in 2 out of 10 sheets.

(Example-1)
An LCD is manufactured using the thin glass laminate B obtained in Example 2.
Two thin glass laminates B are prepared, and one is subjected to an array forming process to form an array on the second main surface of the thin glass substrate. The remaining one sheet is subjected to a color filter forming process to form a color filter on the second main surface of the thin glass substrate. The thin glass laminate B on which the array is formed and the thin glass laminate B on which the color filter is formed are bonded together using an ultraviolet curable sealant for cell formation to obtain a panel C with a support. Here, the liquid crystal injection hole is sealed, and further, the outside is sealed with an ultraviolet curable water-soluble sealant.
Then, the panel C with the support is immersed in xylene (SP value = 8.8) stored to a depth of 50 mm in a 1 m square bat having a ultrasonic vibration plate set at the bottom and a depth of 100 mm. Subsequently, the substrate is vibrated with a 40 kHz ultrasonic wave for 30 seconds, taken out, and air is blown onto the end surfaces connected to the gaps of the panel C with the support, while supporting the upper and lower glasses of the panel C with the support with the suction pads. Then, the two support glass substrates and the resin layer are peeled from the thin glass substrate, and the display device panel C can be obtained.

  Subsequently, the panel C is immersed in hot water to remove the water-soluble sealing agent and then cut, and divided into 168 cells of 51 mm in length x 38 mm in width, followed by a liquid crystal injection step and an injection hole sealing step. Thus, a liquid crystal cell is formed. A step of attaching a polarizing plate to the formed liquid crystal cell is performed, and then a module formation step is performed to obtain an LCD. The LCD obtained in this way does not have a problem in characteristics. As a result, a liquid crystal display device having a total thickness of about 0.2 mm between the outer surfaces of the two opposing substrates can be obtained.

(Example-2)
An LCD is manufactured using the thin glass laminate A1 obtained in Example 1.
Two sheet glass laminates A1 are prepared, and one sheet is subjected to an array forming step to form an array on the second main surface of the sheet glass substrate. The remaining one sheet is subjected to a color filter forming process to form a color filter on the second main surface of the thin glass substrate. A panel D with support is obtained by laminating the thin glass laminate A1 on which the array is formed and the thin glass laminate A1 on which the color filter is formed using an ultraviolet curable sealant for cell formation. Here, the liquid crystal injection hole is sealed, and further, the outside is sealed with an ultraviolet curable water-soluble sealant.
Then, the panel D with the support is immersed in xylene (SP value = 8.8) stored in a 1 m square bat having a depth of 50 mm and an ultrasonic diaphragm set at the bottom so that the depth is 50 mm. Subsequently, the ultrasonic wave of 40 kHz is vibrated and then taken out, and air is blown onto the end face connected to the gap portion of the panel D with support while supporting the upper and lower glasses of the panel D with support with the suction pads. Then, two support glass substrates and a resin layer are peeled from a thin glass substrate, and the panel D can be obtained.

Subsequently, after the panel D is immersed in hot water to remove the water-soluble sealing agent, the thickness of the thin glass substrate is set to 0.15 mm by chemical etching. Generation of edge pits that cause an optical problem is not observed on the glass substrate surface after the chemical etching treatment.
And after dividing | segmenting into 168 cells of length 51mm x width 38mm, a liquid crystal injection process and a sealing process of an injection hole are implemented, and a liquid crystal cell is formed. A step of attaching a polarizing plate to the formed liquid crystal cell is performed, and then a module formation step is performed to obtain an LCD. The LCD obtained in this way does not have a problem in characteristics. As a result, a liquid crystal display device having a total thickness of about 0.3 mm between the outer surfaces of the two opposing substrates can be obtained.

(Example-3)
An LCD is manufactured using the thin glass laminate B obtained in Example 2 and a non-alkali glass substrate having a thickness of 0.7 mm.
The thin glass laminated body B is prepared and it uses for a color filter formation process, and forms a color filter on the 2nd main surface of the thin glass substrate of the thin glass laminated body B. On the other hand, an alkali-free glass substrate having a thickness of 0.7 mm (AN-100 manufactured by Asahi Glass) is subjected to an array forming step to form an array on the surface of the alkali-free glass substrate having a thickness of 0.7 mm.
Next, the thin glass laminate B on which the color filter is formed and the non-alkali glass substrate on which the array is formed are bonded together using an ultraviolet curable sealant for cell formation to obtain a panel E with a support. Here, the liquid crystal injection hole is sealed, and further, the outside is sealed with an ultraviolet curable water-soluble sealant.

  Then, the panel E with the support is immersed in xylene (SP value = 8.8) stored to a depth of 50 mm in a 1 m square bat with a ultrasonic vibration plate set at the bottom. Subsequently, the substrate is taken out after being vibrated with an ultrasonic wave of 40 kHz, and compressed air is blown onto the end surfaces connected to the gaps of the panel E with the support, while supporting the upper and lower glasses of the panel E with the support with the suction pads. Then, the support glass substrate in the thin glass laminated body B can be peeled. The laminate obtained here is referred to as a thin glass substrate-non-alkali glass substrate bonded body E.

  Subsequently, the thin glass substrate-non-alkali glass substrate bonded body E is divided into 168 cells of 51 mm long × 38 mm wide using a laser cutter or a scribe-break method. Thereafter, a liquid crystal injection step and an injection port sealing step are performed to form a liquid crystal cell. A step of attaching a polarizing plate to the formed liquid crystal cell is performed, and then a module formation step is performed to obtain an LCD. The LCD obtained in this way does not have a problem in characteristics. As a result, a liquid crystal display device having a total thickness of about 0.8 mm between the outer surfaces of the two opposing substrates can be obtained.

(Example-4)
An OLED is produced using the thin glass laminate B obtained in Example 2.
A process for forming a transparent electrode, a process for forming an auxiliary electrode, a process for depositing a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and the like, and a process for sealing them are performed. An organic EL structure is formed on the thin glass substrate to obtain a panel F with a support.
Then, the panel F with the support is immersed in xylene (SP value = 8.8) having a depth of 50 mm in a 1 m square bat having a depth of 50 mm set with an ultrasonic diaphragm at the bottom. . Subsequently, the ultrasonic waves of 40 kHz are vibrated and then taken out, and compressed air is blown onto the end surfaces connected to the gaps of the panel F with the support while supporting the upper and lower glasses of the panel F with the support with the suction pads. Then, the supporting glass substrate on which one silicone resin is formed can be peeled from the OLED.
The surface of the thin glass substrate after separation is not damaged so as to reduce the strength.
Subsequently, the thin glass substrate is cut using a laser cutter or a scribe-break method, and divided into 288 cells of 41 mm in length and 30 mm in width, and then the glass substrate on which the organic EL structure is formed and the counter substrate are separated. Assemble and perform module formation process to create OLED. There is no problem in characteristics of the OLED obtained in this way.
In the above example, the glass substrate is cut after being divided into display panel units. However, a structure in which a plurality of panels are connected to each other can be processed as a unit.

It is a schematic sectional drawing which shows the one aspect | mode of the panel with a support body of this invention. It is a schematic front view which shows another one aspect | mode of the panel with a support body of this invention. It is a schematic sectional drawing which shows another one aspect | mode of the panel with a support body of this invention. It is a schematic front view which shows another one aspect | mode of the panel with a support body of this invention. It is a schematic front view which shows another one aspect | mode of the panel with a support body of this invention. It is a schematic sectional drawing which shows another one aspect | mode of the panel with a support body of this invention. It is a schematic cross section for demonstrating the immersion process in the panel manufacturing method of this invention. It is a figure (flowchart) for demonstrating the specific example of the panel manufacturing method of this invention.

Explanation of symbols

10, 20, 30 Panel with support of the present invention 12, 22, 32 Thin glass substrate 14, 24, 34 Display device member 16, 26 Display device panel 18, 28, 38 Resin layer 19, 29, 39 Support glass Substrate 25 Gap

Claims (9)

A method for manufacturing a panel for a display device having a thin glass substrate,
The first main surface of the thin glass substrate having the first main surface and the second main surface has easy peelability fixed to the first main surface of the supporting glass substrate having the first main surface and the second main surface. The manufacturing method of the panel for display apparatuses which comprises the immersion process which immerses the panel for display apparatuses with a support body which the resin layer is closely_contact | adhered in an organic solvent.   The manufacturing method of the panel for display apparatuses of Claim 1 whose difference of the solubility parameter of the said organic solvent and the said resin layer is 3 or less.   The manufacturing method of the panel for display apparatuses of Claim 1 or 2 whose said resin layer is a silicone resin layer.   The manufacturing method of the panel for display apparatuses in any one of Claims 1-3 which provides an ultrasonic vibration to the panel for display apparatuses with a support body immersed in the said organic solvent. In the display device-equipped panel, the area of the first main surface of the thin glass substrate is larger than the surface area of the resin layer,
The portion of the thin glass substrate that is not in contact with the resin layer and the support glass substrate facing the first glass surface form a gap that is connected to the end surface of the display panel with support. The manufacturing method of the panel for display apparatuses in any one of Claims 1-4.   The manufacturing method of the panel for display apparatuses of Claim 5 whose depth of the said clearance gap part from the said end surface of the said thin glass substrate is 1-15 mm.   Furthermore, after the said immersion process, the peeling process of spraying a fluid on the said end surface of the said panel for display apparatuses with a support body and peeling the said thin glass substrate and the said support glass substrate is comprised. The manufacturing method of the panel for display apparatuses in any one.   The manufacturing method of a display apparatus which comprises the immersion process and / or peeling process in any one of Claims 1-7. Panel for display device with support, in which a resin layer having easy peelability fixed to the first main surface of the supporting glass substrate is in close contact with the first main surface of a thin glass substrate which is a part of the display device panel Because
The area of the first main surface of the thin glass substrate is larger than the surface area of the resin layer, the portion of the thin glass substrate that is not in contact with the resin layer, and the supporting glass substrate facing the portion Forming a gap portion connected to the end face.

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