CN102574659B - The manufacture method of substrate cartridge, substrate board treatment, base plate processing system, substrate processing method using same, control setup and display element - Google Patents
The manufacture method of substrate cartridge, substrate board treatment, base plate processing system, substrate processing method using same, control setup and display element Download PDFInfo
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- CN102574659B CN102574659B CN201080048076.1A CN201080048076A CN102574659B CN 102574659 B CN102574659 B CN 102574659B CN 201080048076 A CN201080048076 A CN 201080048076A CN 102574659 B CN102574659 B CN 102574659B
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- 239000000758 substrate Substances 0.000 title claims abstract description 1147
- 238000000034 method Methods 0.000 title claims abstract description 182
- 238000011282 treatment Methods 0.000 title claims abstract description 157
- 238000003672 processing method Methods 0.000 title claims abstract description 15
- 238000012545 processing Methods 0.000 title claims description 225
- 238000004519 manufacturing process Methods 0.000 title description 21
- 239000000463 material Substances 0.000 claims abstract description 403
- 230000008569 process Effects 0.000 claims abstract description 130
- 230000007547 defect Effects 0.000 claims abstract description 74
- 238000003860 storage Methods 0.000 claims abstract description 40
- 238000004891 communication Methods 0.000 claims abstract description 39
- 238000011084 recovery Methods 0.000 claims description 16
- 230000007246 mechanism Effects 0.000 claims description 15
- 238000012360 testing method Methods 0.000 claims description 15
- 230000005540 biological transmission Effects 0.000 claims description 13
- 238000005520 cutting process Methods 0.000 claims description 13
- 230000002159 abnormal effect Effects 0.000 claims description 10
- 238000001035 drying Methods 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 8
- 230000002520 cambial effect Effects 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 238000011068 loading method Methods 0.000 claims description 6
- 238000004064 recycling Methods 0.000 claims description 4
- 238000005259 measurement Methods 0.000 claims description 2
- 229920005989 resin Polymers 0.000 abstract description 14
- 239000011347 resin Substances 0.000 abstract description 14
- 238000000465 moulding Methods 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 description 137
- 238000005755 formation reaction Methods 0.000 description 137
- 230000009471 action Effects 0.000 description 71
- 238000000137 annealing Methods 0.000 description 23
- 238000012546 transfer Methods 0.000 description 23
- 238000007726 management method Methods 0.000 description 20
- 239000004065 semiconductor Substances 0.000 description 19
- 238000000576 coating method Methods 0.000 description 15
- 230000001681 protective effect Effects 0.000 description 15
- 239000010409 thin film Substances 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 13
- 150000001875 compounds Chemical class 0.000 description 12
- 239000012212 insulator Substances 0.000 description 10
- 239000010408 film Substances 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 238000003825 pressing Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 7
- 230000008439 repair process Effects 0.000 description 7
- 238000012937 correction Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 238000007781 pre-processing Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 229920003227 poly(N-vinyl carbazole) Polymers 0.000 description 4
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000007641 inkjet printing Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- -1 amilan Polymers 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- RFHAOTPXVQNOHP-UHFFFAOYSA-N fluconazole Chemical compound C1=NC=NN1CC(C=1C(=CC(F)=CC=1)F)(O)CN1C=NC=N1 RFHAOTPXVQNOHP-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- YNPNZTXNASCQKK-UHFFFAOYSA-N phenanthrene Chemical compound C1=CC=C2C3=CC=CC=C3C=CC2=C1 YNPNZTXNASCQKK-UHFFFAOYSA-N 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 150000003673 urethanes Chemical class 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 206010013786 Dry skin Diseases 0.000 description 1
- 229910000737 Duralumin Inorganic materials 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 125000005605 benzo group Chemical group 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013480 data collection Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- SLIUAWYAILUBJU-UHFFFAOYSA-N pentacene Chemical compound C1=CC=CC2=CC3=CC4=CC5=CC=CC=C5C=C4C=C3C=C21 SLIUAWYAILUBJU-UHFFFAOYSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 230000027756 respiratory electron transport chain Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000005619 thermoelectricity Effects 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H16/00—Unwinding, paying-out webs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/10—Handled articles or webs
- B65H2701/12—Surface aspects
- B65H2701/124—Patterns, marks, printed information
- B65H2701/1242—Patterns, marks, printed information printed information
- B65H2701/12422—Patterns, marks, printed information printed information codes or the like which can be used for further processing, e.g. relative to consumed or still available material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/10—Handled articles or webs
- B65H2701/18—Form of handled article or web
- B65H2701/184—Wound packages
- B65H2701/1849—Wound packages in cartridge or similar packaging device
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/10—Handled articles or webs
- B65H2701/19—Specific article or web
- B65H2701/1942—Web supporting regularly spaced non-adhesive articles
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
Abstract
Substrate cartridge (1) possesses the main body (2) of storage sheet material substrate (FB) and keeps the information retaining section (IC) of information.Maintaining part (IC) can be IC chip or bar code.This information relates to the specification (material, thickness etc.) of substrate (FB).This information also relates to the technique for substrate (FB).This information also relates to the defect of substrate (FB).In addition, this information is the information for identifying main body (2).Information is displayed on the display part (29) of main body (2).The department of assembly (3) of main body (2) is connected with substrate board treatment.Department of assembly (3) has terminal (3C), and the communication between the control part (104) of maintaining part (IC) and device is carried out via this terminal.Substrate processing method using same comprises and obtains information from the maintaining part (IC) of cylinder (1) and process substrate (FB) according to this information.Substrate (FB) is the resin molding it defining organic electroluminescent device.Be poured out by peristome (34) by the substrate (FB) twisted in main body (2).
Description
Technical field
The present invention relates to the manufacture method of substrate cartridge, substrate board treatment, base plate processing system, substrate processing method using same, control setup and display element.
Its content based on No. 2009-253975, the Japanese Patent Application proposed on November 5th, 2009 and Japanese Patent Application 2009-253976 CLAIM OF PRIORITY, and is quoted so far by the application.
Background technology
As the display element forming the read out instruments such as display equipment, be known to such as organic electroluminescent (organic EL) element.Organic EL element becomes have anode and negative electrode on substrate, and has the formation of the organic luminous layer be clipped between these anode and negative electrodes.Organic EL element is formed as, from anode to organic luminous layer injected hole, making hole and electron recombination in organic luminous layer, obtains display light by the luminescence of this compound tense.Organic EL element is such as formed with the circuit etc. be connected with anode and negative electrode on substrate.
As one of method making organic EL element, be known to the method (such as with reference to patent documentation 1) being such as referred to as volume to volume (rolltoroll) mode (hereinafter referred to as " volume mode ").Volume mode is while release the substrate of 1 sheet twisted on the roller of substrate supply side and utilize the roller of substrate recovery side to batch the substrate be released, while transmit substrate, during being released to being taken up from substrate, in processing equipment, on substrate, form the method for the luminescent layer, anode, negative electrode, circuit etc. that form organic EL element successively.
In the formation described in patent documentation 1, becoming roller that such as substrate releases and the roller that substrate batches can the formation dismantled of processing equipment relatively.Roller under dismounting such as can be transported to other processing equipment, and is installed on these other processing equipment and uses.
Patent documentation 1: No. 2006/100868th, International Publication
But, only in the formation of processing equipment handling, can be difficult to differentiate the substrate what has such as batched on roller as described above.Which in addition, be such as difficult to differentiate the process substrate twisted on roller being proceeded to the stage.Therefore, just need to adopt some method to confirm the operation of substrate when roller is installed, spend time thus.
Summary of the invention
The object of the invention is to, the manufacture method can carrying out the substrate cartridge (cartridge) of actv. process, substrate board treatment, base plate processing system, substrate processing method using same, control setup and display element to substrate is provided.
1st mode of the present invention provides a kind of substrate cartridge, and this substrate cartridge possesses: the cylinder main body of storage substrate; And information retaining section, it keeps the information at least comprising the specification information relevant with the specification value of the substrate be accommodated in a main body.
2nd mode of the present invention provides a kind of substrate cartridge, and this substrate cartridge possesses: the cylinder main body of storage substrate; And information retaining section, it keeps the information at least comprising technique information, and this technique information is the information based on the specification information relevant with the specification value of the substrate be accommodated in a main body.
3rd mode of the present invention provides a kind of substrate board treatment, this substrate board treatment possesses: the processing substrate portion for the treatment of substrate, the substrate loading unit of carrying out moving into processing substrate portion substrate and the substrate carrying out taking out of from processing substrate portion substrate take out of portion, uses substrate cartridge of the present invention to take out of at least one party in portion as substrate loading unit and substrate.
4th mode of the present invention provides a kind of base plate processing system, and this base plate processing system possesses: the substrate board treatment for the treatment of substrate; The substrate cartridge of the present invention be connected with substrate board treatment; And main control unit, it is received information from the information retaining section of substrate cartridge, and controls substrate board treatment based on this information.
5th mode of the present invention provides a kind of substrate processing method using same, this substrate processing method using same is that one side supplying substrate is while process this substrate, and the substrate processing method using same of substrate after recycling, this substrate processing method using same uses substrate cartridge of the present invention to any one party in the recovery of the supply and substrate of carrying out substrate, utilizes the information obtained via substrate cartridge to carry out treatment substrate.
6th mode of the present invention provides a kind of control setup, and this control setup possesses: the substrate board treatment for the treatment of substrate; And to the master control part that the substrate cartridge of the present invention be connected with this substrate board treatment controls.
7th mode of the present invention provides a kind of manufacture method of display element, and this manufacture method comprises: in processing substrate portion treatment substrate operation and use substrate cartridge of the present invention to reclaim the operation of substrate to processing substrate portion supplying substrate or from processing substrate portion.
8th mode of the present invention provides a kind of substrate cartridge, and this substrate cartridge possesses: the cylinder main body of storage substrate; And information retaining section, it keeps the information of at least one party in the identifying information that identifies cylinder main body and the process information being accommodated in the substrate in a main body.
9th mode of the present invention provides a kind of substrate board treatment, this substrate board treatment possesses: the processing substrate portion for the treatment of substrate, the substrate loading unit of carrying out moving into this processing substrate portion substrate and the substrate carrying out taking out of from processing substrate portion substrate take out of portion, and uses substrate cartridge of the present invention to take out of at least one party in portion as substrate loading unit and substrate.
10th mode of the present invention provides a kind of base plate processing system, and this base plate processing system possesses: the substrate board treatment for the treatment of substrate; The substrate cartridge of the present invention be connected with this substrate board treatment; And main control unit, it is received information from the information retaining section of this substrate cartridge, and controls substrate board treatment based on this information.
11st mode of the present invention provides a kind of substrate processing method using same, this substrate processing method using same is that one side supplying substrate is while process this substrate, and the substrate processing method using same of substrate after recycling, this substrate processing method using same utilizes substrate cartridge of the present invention at least one party in the recovery of the supply and substrate of carrying out substrate, uses the information obtained via substrate cartridge to carry out treatment substrate.
12nd mode of the present invention provides a kind of control setup, and this control setup possesses: the substrate board treatment for the treatment of substrate and the master control part controlled the substrate cartridge of the present invention be connected with this substrate board treatment.
13rd mode of the present invention provides a kind of manufacture method of display element, and this manufacture method comprises: in processing substrate portion treatment substrate operation and utilize substrate cartridge of the present invention to reclaim the operation of substrate to processing substrate portion supplying substrate or from processing substrate portion.
According to mode of the present invention, actv. process can be carried out to substrate.
Accompanying drawing explanation
Figure 1A is the pie graph of organic EL element of the first embodiment of the present invention.
Figure 1B is the section-drawing of organic EL element of the first embodiment of the present invention.
Fig. 1 C is the section-drawing of organic EL element of the first embodiment of the present invention.
Fig. 2 is the figure of the formation representing substrate board treatment of the present embodiment.
Fig. 3 is the figure of the formation representing processing substrate portion of the present embodiment.
Fig. 4 is the figure of the formation representing droplet applying apparatus of the present embodiment.
Fig. 5 is the block diagram of the formation representing substrate cartridge of the present embodiment.
Fig. 6 is the section-drawing of the formation representing substrate cartridge of the present embodiment.
Fig. 7 A is the figure of the formation representing control part of the present embodiment.
Fig. 7 B is the figure of the formation representing control part of the present embodiment.
Fig. 8 is the figure of the storage action representing substrate cartridge of the present embodiment.
Fig. 9 is the figure of the storage action representing substrate cartridge of the present embodiment.
Figure 10 is the figure of the connecting moves representing substrate cartridge of the present embodiment.
Figure 11 is the figure of the connecting moves representing substrate cartridge of the present embodiment.
Figure 12 is the figure representing the operation that the next door in processing substrate portion of the present embodiment is formed.
Figure 13 represents the shape in the next door formed on sheet material substrate of the present embodiment and the figure of configuration.
Figure 14 is the section-drawing in the next door formed on sheet material substrate of the present embodiment.
Figure 15 A is the figure of the coating action representing drop of the present embodiment.
Figure 15 B is the figure of the coating action representing drop of the present embodiment.
Figure 16 A is the figure of the formation representing the film formed between next door of the present embodiment.
Figure 16 B is the figure of the formation representing the film formed between next door of the present embodiment.
Figure 17 represents the figure forming the operation of gate insulator on sheet material substrate of the present embodiment.
Figure 18 represents of the present embodiment by the figure of the operation of the wiring cut-off of sheet material substrate.
Figure 19 represents the figure in the film forming operation of source drain forming region of the present embodiment.
Figure 20 is the figure of the operation representing formation organic semiconductor layer of the present embodiment.
Figure 21 is the figure of the example representing aligning of the present embodiment (alignment).
Figure 22 is the figure of the dismounting action representing substrate cartridge of the present embodiment.
Figure 23 is the figure of the formation representing substrate board treatment of the second embodiment of the present invention.
Figure 24 is the figure of the recovery action that sheet material substrate FB of the present embodiment is described.
Figure 25 is the figure of the recovery action that sheet material substrate FB of the present embodiment is described.
Figure 26 is the figure of the recovery action that sheet material substrate FB of the present embodiment is described.
Figure 27 is the figure of the formation representing base plate processing system of the third embodiment of the present invention.
Figure 28 is the figure of the formation representing processing substrate portion of the fourth embodiment.
Figure 29 A is the figure of the formation of the part representing sheet material substrate of the present embodiment.
Figure 29 B is the figure of the formation of the part representing sheet material substrate of the present embodiment.
Figure 30 is the figure of the formation representing base plate processing system of the sixth embodiment of the present invention.
Figure 31 is the figure of the example representing process information of the present embodiment.
Detailed description of the invention
Below, with reference to accompanying drawing, the 1st embodiment of the present invention is described.
(organic EL element)
Figure 1A is the birds-eye view of the formation representing organic EL element.Figure 1B is the b-b section-drawing in Figure 1A.Fig. 1 C is the c-c section-drawing in Figure 1A.
As shown in Figure 1A ~ Fig. 1 C, organic EL element 50 defines gate electrode G and gate insulator I on sheet material substrate FB, and then after forming source electrode S, drain electrode D and pixel electrode P, form bottom contact (bottomcontact) type of organic semiconductor layer OS.
As shown in Figure 1B, gate electrode G is formed with gate insulator I.Gate insulator I is formed the source electrode S of source bus line SBL, and is formed with the drain electrode D be connected with pixel electrode P.Organic semiconductor layer OS is formed between source electrode S and drain electrode D.So far, FET is completed.In addition, as shown in Figure 1B and Fig. 1 C, on pixel electrode P, be formed with luminescent layer IR, this luminescent layer IR is formed with transparency electrode ITO.
As shown in Figure 1B and Fig. 1 C, such as, on sheet material substrate FB, be formed with next door BA (cofferdam layer).And as shown in Figure 1 C, source bus line SBL is formed between the BA of next door.Like this, by there is next door BA, source bus line SBL high precision is formed, and pixel electrode P and luminescent layer IR is also formed exactly.In addition, in Figure 1B and Fig. 1 C although not shown, but grid bus GBL be also formed in the same manner as source bus line SBL between the BA of next door.
This organic EL element 50 is applicable to such as with the display part etc. of the read out instruments such as the display equipment electronic machine that is representative.In this situation, use the parts such as organic EL element 50 being formed as panel shape.In the manufacture of such organic EL element 50, need to make the substrate defining thin film transistor (TFT), pixel electrode.In order to precision on pixel electrode on the substrate forms more than the 1 layer organic compound layer (light emitting element layer) comprising luminescent layer well, wish pixel electrode borderline region easily and precision forms next door BA (cofferdam layer) well.
(substrate board treatment)
Fig. 2 represents to use to have the skeleton diagram that flexual sheet material substrate FB carries out the formation of the substrate board treatment 100 processed.
Substrate board treatment 100 uses banded sheet material substrate FB to form the device of the organic EL element 50 shown in Fig. 1.As shown in Figure 2, substrate board treatment 100 has: substrate supply unit 101, processing substrate portion 102, substrate recoverer 103 and control part 104.Sheet material substrate FB is transmitted to substrate recoverer 103 through processing substrate portion 102 by from substrate supply unit 101.The unified action controlling substrate board treatment 100 of control part 104.In addition, control part 104 has the data bank 104DB of the storage part as the information of storage.
In the following description, set XYZ orthogonal coordinate system, be described with reference to the position relationship of this XYZ orthogonal coordinate system to each parts.The direction of transfer of sheet material substrate FB in horizontal surface is set to X-direction, direction orthogonal with X-direction in horizontal surface is set to Y direction, direction (i.e. vertical) orthogonal with X-direction and Y direction is respectively set to Z-direction.In addition, rotation (inclination) direction around X-axis, Y-axis and Z axis is set to θ X, θ Y and θ Z-direction respectively.
As sheet material substrate FB, such as, can use the resin film of resistance to effect of heat, corrosion-resistant steel etc.Such as, resin film can use the materials such as poly-vinyl resin, acrylic resin, alkide resin, ethylene-vinyl alcohol copolymer resin, Vinyl chloride resin, celluosic resin, amilan, polyimide resin, polycarbonate resin, polystyrene resin, vinyl acetate resin.The size of the Y-direction of sheet material substrate FB is such as formed about 1m ~ 2m, and the size of X-direction is such as formed more than 10m.Certainly, this size is an example only, is not limited thereto.Such as, the size of the Y-direction of sheet material substrate FB also can be below 50cm, also can be more than 2m.In addition, the size of the X-direction of sheet material substrate FB also can be below 10m.Wherein, though the pliability in present embodiment refer to such as to substrate apply at least to conduct oneself with dignity the specified force of degree also can not break, damaged, the character of this curved substrate can be made.In addition, such as because of afore mentioned rules power, bending character is also contained in pliability.In addition, above-mentioned pliability changes according to the material, size, the environment such as thickness or temperature etc. of this substrate.In addition, as sheet material substrate FB, can use the substrate that 1 banded, also can be connect multiple unit substrate and be formed as banded formation.
The thermal expansion coefficient of preferred sheet material substrate FB is little, even if so that the hot size being such as subject to about 200 DEG C does not also change.Such as inorganic filler can be mixed in resin film to reduce thermal expansion coefficient.As the example of inorganic filler, titanium oxide, zinc oxide, aluminium oxide, monox etc. can be enumerated.
Substrate supply unit 101 is connected with the supply side connecting portion 102A being arranged at processing substrate portion 102.Substrate supply unit 101 supplies the sheet material substrate FB being such as rolled into web-like to processing substrate portion 102.Substrate recoverer 103 is recovered in the sheet material substrate FB after being processed in processing substrate portion 102.
Fig. 3 is the figure of the formation representing processing substrate portion 102.
As shown in Figure 3, processing substrate portion 102 has transport unit 105, element forming part 106, aligned portions 107 and substrate cutting portion 108.Processing substrate portion 102 is while transmit the sheet material substrate FB supplied by substrate supply unit 101, while form each inscape of above-mentioned organic EL element 50 on this sheet material substrate FB, and send the part of the sheet material substrate FB after defining organic EL element 50 to substrate recoverer 103.
Transport unit 105 has multiple roller RR of the position be configured in along the X direction.Rotated by roller RR, sheet material substrate FB is transmitted along X-direction.Roller RR can be the rubber rollers clipping sheet material substrate FB from two sides, if sheet material substrate FB has perforation, also can be the roller RR of band ratchet.A part of roller RR in multiple roller RR can move to the Y direction orthogonal with direction of transfer.
Element forming part 106 has next door forming portion 91, electrode forming portion 92 and luminescent layer forming portion 93.Next door forming portion 91, electrode forming portion 92 and luminescent layer forming portion 93 from the upstream side of the direction of transfer of sheet material substrate FB to downstream, by the arranged in order of next door forming portion 91, electrode forming portion 92 and luminescent layer forming portion 93.Below, each formation of element forming part 106 is described.
Next door forming portion 91 has roller platen 110 and hot transfer roll 115.Next door forming portion 91 forms next door BA to the sheet material substrate FB released by substrate supply unit 101.In next door forming portion 91, utilize roller platen 110 to press sheet material substrate FB, and in order to make the next door BA be pressed into keep shape, utilize hot transfer roll 115 that sheet material substrate FB is heated to more than glass transition temperature.Therefore, the mould shape be formed on the roller surface of roller platen 110 can be transferred on sheet material substrate FB.Sheet material substrate FB is such as heated to about 200 DEG C by hot transfer roll 115.
The fine imprint mold 111 be made up of materials such as SiC, Ta, by mirror-like finish, has been installed on the surface in the roller surface of roller platen 110 at its roller.Fine imprint mold 111 defines the pressing mold (stamper) of the wiring of thin film transistor and the pressing mold of colored filter.
Roller platen 110 uses fine imprint mold 111 couples of sheet material substrate FB to form alignment mark AM.In order to form alignment mark AM in the both sides of the Width of sheet material substrate FB, i.e. Y direction, fine imprint mold 111 has the pressing mold of alignment mark AM.
Electrode forming portion 92 is arranged on the+X side of next door forming portion 91, such as, formed and employ organic semi-conductor thin film transistor.Specifically, after defining gate electrode G as shown in Figure 1, gate insulator I, source electrode S, drain electrode D and pixel electrode P, form organic semiconductor layer OS.
As thin film transistor (TFT), can be the thin film transistor of inorganic semiconductor system, also can be the use of organic semi-conductor thin film transistor.As the thin film transistor of inorganic semiconductor, be known to the thin film transistor of amorphous layer, but also can be the use of organic semi-conductor thin film transistor.As long as use this organic semiconductor to form thin film transistor, printing technology, droplet applying law technology just can be applied flexibly to form thin film transistor.In addition, particularly preferably FET (FET) is as shown in Figure 1 being employed in organic semi-conductor thin film transistor.
Electrode forming portion 92 has droplet applying apparatus 120, annealing device BK, shutoff device 130 etc.
In the present embodiment, as droplet applying apparatus 120, the droplet applying apparatus 120OS etc. droplet applying apparatus 120G, the droplet applying apparatus 120I used when forming gate insulator I such as used when formation gate electrode G, the droplet applying apparatus 120SD used when forming source electrode S, drain electrode D and pixel electrode P can be used, using when forming organic semiconductor OS.
Fig. 4 is the birds-eye view of the formation representing droplet applying apparatus 120.Illustrate in Fig. 4 from the formation during observation droplet applying apparatus 120 of+Z side.Droplet applying apparatus 120 along Y direction longer formed.Not shown actuating device is provided with in droplet applying apparatus 120.Droplet applying apparatus 120 by this actuating device such as can in X direction, Y-direction and θ Z-direction move.
Multiple nozzle 122 is formed in droplet applying apparatus 120.Nozzle 122 be arranged in droplet applying apparatus 120 with the opposed faces of sheet material substrate FB.Nozzle 122 is such as along Y direction arrangement, and the row (nozzle rows) of this nozzle 122 are such as formed with 2 row.Control part 104 can make all nozzles 122 apply drop in the lump, also can adjust the opportunity of coating drop respectively to each nozzle 122.
As droplet applying apparatus 120, such as, can adopt ink-jetting style, separatory mode etc.As ink-jetting style, charged mode, pressurization and vibration mode, data-collection formula, thermoelectricity conversion regime, electrostatic adherence mode etc. can be enumerated.Droplet applying method is wasted few in the use of material, and can the material of amount on the position of hope exactly desired by configuration.Wherein, the amount of of the metallic ink applied by droplet applying method is such as 1 ~ 300 nanogram.
Turn back to Fig. 2, droplet applying apparatus 120G is to plating ink in the next door BA of grid bus GBL.Droplet applying apparatus 120I is to the electrical insulating property ink of switch (switching) portion coating polyimide system resin or urethanes system resin.Droplet applying apparatus 120SD is plating ink in the next door BA of source bus line SBL and in the next door BA of pixel electrode P.Droplet applying apparatus 120OS applies organic ink ductor to the switch portion between source electrode S and drain electrode D.
Metallic ink is the liquid that particle diameter is about electric conductor stable dispersion in the solvent of room temperature of about 5nm, and carbon, silver (Ag) or gold (Au) etc. can be used as electric conductor.The compound forming organic ink ductor can be monocrystalline material section, and also can be amorphous materials, can be low molecule, also can be Polymer.As particularly preferred compound in the compound forming organic ink ductor, can enumerate with pentacene, benzo [9,10] phenanthrene, anthracene etc. is the single crystals of the contracting ring system aromatic hydrocarbon compound of representative or pi-conjugated system Polymer etc.
Annealing device BK is configured in the+X side (substrate direction of transfer downstream) of each droplet applying apparatus 120 respectively.Annealing device BK can radiate such as hot blast, far-infrared rays etc. to sheet material substrate FB.Annealing device BK uses these radiation heat carry out dry or that sintering (roasted) sheet material substrate FB is coated drop and make it solidify.
Shutoff device 130 be arranged on the+X side of droplet applying apparatus 120SD, the upstream side of droplet applying apparatus 120OS.Shutoff device 130 such as uses laser etc. to cut off the source electrode S and drain electrode D that are formed by droplet applying apparatus 120SD.Shutoff device 130 has not shown light source and makes the laser from this light source be irradiated to galvanometer mirror (galvanometermirror) 131 on sheet material substrate FB.
As the kind of laser, be preferably can the laser of absorbed wavelength for the metallic membrane that will carry out cutting off, in wavelength conversion laser, 2,3,4 times of high order harmonics of YAG etc. be better.In addition, by using pulsed laser that thermal diffusion can be prevented, the damage beyond cutting portion can be reduced.When material is aluminium, preferably adopt the femto-second laser of 760nm wavelength.
In the present embodiment, have employed and such as use titanium sapphire laser device as the femtosecond laser irradiation portion of light source.This femtosecond laser irradiation portion is such as with the pulse irradiation laser LL of 10KHz ~ 40KHz.
Owing to using femto-second laser in present embodiment, so the processing of submicron order can be carried out, the source electrode S of performance and the interval of drain electrode D that determine FET can be cut off exactly.The interval of source electrode S and drain electrode D is such as about 3 μm ~ about 30 μm.
Except above-mentioned femto-second laser, also can use such as carbon dioxide laser or green (light) laser etc.In addition, except laser, also can adopt and mechanically carry out by cast-cutting saw etc. the formation cut off.
Galvanometer mirror 131 is configured in the light path of laser LL.Galvanometer mirror 131 makes the laser LL from light source reflex on sheet material substrate FB.Galvanometer mirror 131 is configured to such as to rotate in θ X-direction, θ Y-direction and θ Z-direction.Rotated by galvanometer mirror 131, the irradiation position of laser LL can change.
By using above-mentioned next door forming portion 91 and electrode forming portion 92 both sides, even if do not use so-called photo-mask process, printing technology, droplet applying law technology also can be applied flexibly to form thin film transistor etc.Such as only used adopt the electrode forming portion 92 of printing technology, droplet applying law technology etc. time, exist due to the infiltration of ink, expansion and precision can not form the situation of thin film transistor etc. well.
On the other hand, owing to forming next door BA, so infiltration, the expansion of ink can be prevented by use next door forming portion 91.In addition, the source electrode S of performance of thin film transistor is determined and the interval of drain electrode D is processed by laser or machine up and being formed.
Luminescent layer forming portion 93 is configured in the+X side of electrode forming portion 92.Luminescent layer forming portion 93 is formed such as luminescent layer IR, the pixel electrode ITO etc. of the inscape of organic el device on the sheet material substrate FB defining electrode.Luminescent layer forming portion 93 has droplet applying apparatus 140 and annealing device BK.
The luminescent layer IR formed by luminescent layer forming portion 93 contains host compound and phosphorescent compounds (also referred to as phosphorescence luminance compound).Host compound is the compound contained in luminescent layer.Phosphorescent compounds is the compound that observation carrys out the luminescence of self-stimulated triplet, at room temperature produces phosphorescence luminous.
In the present embodiment, as droplet applying apparatus 140, employ the droplet applying apparatus 140Re such as forming red light emitting layer, the droplet applying apparatus 140Gr forming green light emitting layer, form the droplet applying apparatus 140Bl of blue light-emitting layer, form the droplet applying apparatus 140I of insulating barrier and form the droplet applying apparatus 140IT etc. of pixel electrode ITO.
As droplet applying apparatus 140, same with above-mentioned droplet applying apparatus 120, ink-jetting style or separatory mode can be adopted.Such as when arranging the inscape as organic EL element 50 such as hole transmission layer and electron transfer layer, the device (such as droplet applying apparatus etc.) forming these layers is set in addition.
Droplet applying apparatus 140Re applies R solution on pixel electrode P.Droplet applying apparatus 140Re adjusts the spray volume of R solution, to make dried thickness for 100nm.As R solution, the polyvinylcarbazole (PVK) of such as material of main part can use the solution of Red dopants material dissolves in 1,2-dichlorethane.
Droplet applying apparatus 140Gr applies G solution on pixel electrode P.As G solution, such as material of main part PVK can use the solution of green dopant material dissolves in 1,2-dichlorethane.
Droplet applying apparatus 140Bl applies B solution on pixel electrode P.As B solution, such as material of main part PVK can use the solution of blue dopant material dissolves in 1,2-dichlorethane.
Droplet applying apparatus 120I is to the part coating electrical insulating property ink of grid bus GBL or source bus line SBL.As electrical insulating property ink, such as, can use the ink of polyimide system resin or urethanes system resin.
Droplet applying apparatus 120IT applies ITO (IndiumTinOxide: indium tin oxide) ink on redness, green and blue light-emitting layer.As ITO ink water, indium oxide (In can be used in
2o
3) in the addition of the oxide of tin (SnO of several percentage points
2) compound etc.In addition, also can use and can use IDIXO (In
2o
3-ZnO) etc. noncrystalline make the material of nesa coating.The transmitance of preferably clear conducting film is more than 90%.
Annealing device BK is configured in the+X side (substrate direction of transfer downstream) of each droplet applying apparatus 140 respectively.Annealing device BK is same with the annealing device BK used in electrode forming portion 92, can radiate such as hot blast, far-infrared rays etc. to sheet material substrate FB.Annealing device BK uses these radiation heated dryings or the coated drop of sintering (roasted) sheet material substrate FB to solidify to make it.
Aligned portions 107 has the multiple alignment cameras CA (CA1 ~ CA8) arranged along the X direction.Alignment cameras CA can utilize CCD or CMOS to make a video recording under visible light illumination, and processes this photographed images to detect the position of alignment mark AM, also can irradiate laser to alignment mark AM, and receive its scattering light to detect the position of alignment mark AM.
Alignment cameras CA1 is configured in the+X side of hot transfer roll 115.Alignment cameras CA1 detects the position of the alignment mark AM formed on sheet material substrate FB by hot transfer roll 115.Alignment cameras CA2 ~ CA8 is configured in the+X side of annealing device BK respectively.Alignment cameras CA2 ~ CA8 detects the position that have passed through the alignment mark AM of the sheet material substrate FB of annealing device BK.
Due to through overheated transfer roll 115 and annealing device BK, so sheet material substrate FB likely stretches to X-direction and Y direction.Like this, by+X the side of+X the side of the hot transfer roll 115 of heat-treating, annealing device BK configuration alignment cameras CA, the position deviation of the sheet material substrate FB caused because of thermal deformation etc. can be detected.
The testing result of alignment cameras CA1 ~ CA8 is sent to control part 104.Control part 104 carries out the coating position of the ink of such as droplet applying apparatus 120, droplet applying apparatus 140 and the adjustment on opportunity based on the testing result of alignment cameras CA1 ~ CA8, supplies the adjustment of the speed of sheet material substrate FB or the transfer rate of roller RR from substrate supply unit 101, by the adjustment of roller RR to the off-position and opportunity etc. of the adjustment of the movement of Y-direction, shutoff device 130.
(substrate cartridge)
In the present embodiment, use substrate cartridge 1 as substrate supply unit 101 and substrate recoverer 103.In the following description, for convenience of explanation, the XYZ orthogonal coordinate system that setting is general with Fig. 2, is described with reference to the position relationship of this XYZ orthogonal coordinate system to each parts.Following XYZ orthogonal coordinate system is described by situation about using for the state infrabasal plate cylinder 1 be connected with processing substrate portion 102 at substrate supply unit 101 as this substrate supply unit 101.
Fig. 5 is the block diagram of the formation representing substrate cartridge 1.And Fig. 6 is the figure of the formation represented along the A-A ' section in Fig. 5.As shown in figs.5 and 6, substrate cartridge 1 has a main body 2 and assembling (mount) portion 3.
Cylinder main body 2 is parts of storage sheet material substrate FB.Cylinder main body 2 has incorporating section 20, transport unit (connecting gear) 21, substrate-guided portion 22, the 2nd substrate conveying portion 36 and the 2nd substrate-guided portion 37.And above-mentioned department of assembly 3 is arranged at a main body 2.In addition, such as cylinder main body 2 is aluminum or duralumin etc.
Incorporating section 20 is parts of storage sheet material substrate FB.Incorporating section 20 is formed as cylindric, can receive the sheet material substrate FB being such as rolled into web-like, and is configured to a part outstanding to+X side (protrusion 23).In the present embodiment, configure with the state that Y-direction extends in the drawings.Incorporating section 20 has cap 25 and base plate driving mechanism 24.
Cap 25 is arranged on+Y side end or the-Y side end of incorporating section 20.Cap 25 is configured to relatively to load and unload incorporating section 20.By making cap 25 relatively load and unload incorporating section 20, the inside of incorporating section 20 directly can be entered.As the switching mechanism of cap 25, can be such as the formation of the ridge being provided with engaging mutually on cap 25 and incorporating section 20, also can be the formation be connected with incorporating section 20 by cap 25 with linkage.Cap 25 has window portion 28 and display part 29.
Window portion 28 such as by can through the material of visible ray, the such as formation such as glass, plastics.The inside of incorporating section 20 can be observed through window portion 28.Display part 29 is parts of the information such as the state of display sheet material substrate FB.On display part 29, indication example is as long etc. more than the length dimension of sheet material substrate FB of storage in incorporating section 20, sheet material substrate FB.
Base plate driving mechanism 24 is carried out batching the action of sheet material substrate FB and sends the part of action of sheet material substrate FB.Base plate driving mechanism 24 is arranged on the inside of incorporating section 20.Base plate driving mechanism 24 has roller portion (axle portion) 26 and guide part 27.As shown in Figure 6, roller portion 26 has rotating shaft member 26a, wide diameter portion 26b and adhesive portion 26c.
Rotating shaft member 26a is such as the columnar component formed by the metal that the rigidity such as aluminium are high.Rotating shaft member 26a is such as arranged on the peristome 25a of the central portion of cap 25 and bearing sub-assembly 25b and is supported as rotating.In this situation, the center shaft of rotating shaft member 26a is such as in the state parallel with Y-direction, and rotating shaft member 26a rotates to θ Y-direction.
Rotating shaft member 26a is connected with not shown rotary drive mechanism.By the drived control of rotary drive mechanism, rotating shaft member 26a rotates centered by center shaft.As shown in Figure 6, rotary drive mechanism can make rotating shaft member 26a such as rotate to any one direction of+θ Y-direction and-θ Y-direction.
Wide diameter portion 26b is formed in the surface of rotating shaft member 26a with uniform thickness.Wide diameter portion 26b is formed as rotating integrally with rotating shaft member 26a.Be formed in the surface of wide diameter portion 26b with uniform thickness under adhesive portion 26c analyses and observe.Adhesive portion 26c uses the adhesive material with the degree bondd by sheet material substrate FB to be formed.
Guide part 27 has rotatable parts (the 1st guide member) 27a and front end component (the 1st guide member) 27b.Rotatable parts 27a is configured to such as one end and is installed on incorporating section 20 by axle portion 27c, can rotate centered by this axle portion 27c to θ Y-direction.Rotatable parts 27a is connected with not shown rotary drive mechanism.
Be connected with the other end of rotatable parts 27a under front end component 27b analyses and observe.Such as, front end component 27b has the curved surface of arc-shaped under being formed as analysing and observe.Sheet material substrate FB is directed to roller portion 26 via this curved surface analysing and observe the lower+Z side for arc-shaped being arranged at front end component 27b.Front end component 27b and rotatable parts 27a unitary rotation.Such as when rotatable parts 27a rotates to the direction (the diametric lateral direction in roller portion 26) away from roller portion 26, the inner circumferential along incorporating section 20 abuts.Thus, front end component 27b can be avoided and twist in the contact between the sheet material substrate FB in roller portion 26.
Department of assembly 3 is the parts be connected with processing substrate portion 102.Department of assembly 3 is such as arranged on+X the side end of the protrusion 23 being located at incorporating section 20.Department of assembly 3 has the insertion section 3a for being connected with processing substrate portion 102.The end face 3b of the side, processing substrate portion 102 in the 3a of insertion section, is provided with the terminal 3c be electrically connected between processing substrate portion 102.
When substrate cartridge 1 uses as substrate supply unit 101, department of assembly 3 is connected with the supply side connecting portion 102A in processing substrate portion 102.When substrate cartridge 1 uses as substrate recoverer 103, department of assembly 3 is connected with the recovery side connecting portion 102B in processing substrate portion 102.Department of assembly 3, when being connected with the substrate supply unit 101 in processing substrate portion 102 and any one party of substrate recoverer 103, all connecting into and can load and unload.
Department of assembly 3 is provided with peristome 34 and the 2nd peristome 35.Peristome 34 is the peristomes being arranged on+Z side, is the part of sheet material substrate FB of coming in and going out between cylinder main body 2.In cylinder main body 2, storage is through the sheet material substrate FB of this peristome 34.The sheet material substrate FB of storage in cylinder main body 2 is sent to a main body 2 outside via this peristome 34.
2nd peristome 35 is the peristomes being arranged on-Z side, is the part of the 2nd substrate SB of the band shape that discrepancy is different from sheet material substrate FB between cylinder main body 2.As the 2nd such substrate SB, such as, can enumerate the protective substrate etc. that the element forming surface of sheet material substrate FB is protected.Holding paper (insertingpaper) etc. such as can be used as protective substrate.2nd peristome 35 is configured to such as spaced apart with peristome 34.2nd peristome 35 is formed such as identical with peristome 34 size and shape.In addition, as the 2nd substrate SB in present embodiment, stainless thin plate (such as thickness is that 0.1mm is such as the following) etc. also can be used to have the material of electric conductivity.In this situation, when the 2nd substrate SB is incorporated in a main body 2 together with sheet material substrate FB, if the 2nd substrate SB is electrically connected with cylinder main body 2, then sheet material substrate FB can be prevented charged.
Transport unit 21, substrate-guided portion 22, the 2nd substrate conveying portion 36 and the 2nd substrate-guided portion 37 are such as arranged on the inside of protrusion 23.Substrate-guided portion 22 is arranged between peristome 34 and transport unit 21.Substrate-guided portion 22 is the parts guiding sheet material substrate FB between peristome 34 and transport unit 21.Substrate-guided portion 22 has substrate guide member 22a and 22b.Substrate guide member 22a and 22b is separated gap 22c by opposite disposed one-tenth in Z-direction, and opposed faces is set as almost parallel with XY plane respectively.This gap 22c is connected with peristome 34, and sheet material substrate FB moves in peristome 34 and gap 22c.
2nd substrate-guided portion 37 is the parts guiding the 2nd substrate SB between department of assembly 3 and transport unit 21.2nd substrate-guided portion 37 has the 2nd substrate guide member 37a, 37b with 37c.2nd substrate guide member 37a and 37b is separated gap 37d by opposite disposed one-tenth in Z-direction, and opposed faces is set as almost parallel with XY plane respectively.2nd substrate with guide member 37c according to guiding the mode of the 2nd substrate SB by tilted configuration to+Z side.Specifically, oblique state configuration is rolled with the relative+X side end of-X side end of the 2nd substrate guide member 37c to+Z.
2nd substrate conveying portion 36 transmits the 2nd substrate SB between department of assembly 3 and transport unit 21.2nd substrate conveying portion 36 is configured between the 2nd substrate guide member 37a and 37b and the 2nd substrate guide member 37c.2nd substrate conveying portion 36 has drive roll 36a and driven voller 36b.Drive roll 36a is configured to such as to rotate to θ Y-direction, and is connected with not shown rotary drive mechanism.Driven voller 36b is configured to the spaced apart at gaps with drive roll 36a, to clamp the 2nd substrate SB between drive roll 36a.
Transport unit 21 transmits sheet material substrate FB and the 2nd substrate SB between department of assembly 3 and incorporating section 20.Transport unit 21 has jockey pulley (tension mechanism) 21a and measures roller (determination part) 21b.Jockey pulley 21a is roller sheet material substrate FB and the 2nd substrate being given to tension force between roller portion 26.Jockey pulley 21a is configured to rotate to θ Y-direction.Jockey pulley 21a is connected with such as not shown rotary drive mechanism.In addition, jockey pulley 21a and mensuration roller 21b also can be configured to move respectively to the Z-direction in Fig. 6.
Measuring roller 21b is the roller with the diameter less than jockey pulley 21a.Measure roller 21b and be configured to the gap with the spaced apart regulation of jockey pulley 21a, sheet material substrate FB and the 2nd substrate SB can be clamped between jockey pulley 21a.Also can be the formation of the size that can adjust the gap measured between roller 21b and jockey pulley 21a, to meet the situation only clamping sheet material substrate FB and the situation together clamping sheet material substrate FB and the 2nd substrate SB.Measuring roller 21b is the driven voller rotated along with the rotation of jockey pulley 21a.
By jockey pulley 21a and measure clip sheet material substrate FB between roller 21b state under jockey pulley 21a is rotated, can to sheet material substrate FB imparting tension force, while transmit sheet material substrate FB respectively to the take-up direction of this sheet material substrate FB and transport direction.
Transport unit 21 has test example as measured the rotating speed of roller 21b, the test section 21c of the anglec of rotation.As this test section 21c, such as, coder etc. can be used.The transmission distance etc. via the sheet material substrate FB measuring roller 21b such as can be measured by this test section 21c.
Such as inserting sheet material substrate FB via peristome 34, when inserting the 2nd substrate SB via the 2nd peristome 35, sheet material substrate FB and the 2nd substrate SB by being guided by substrate-guided portion 22 and the 2nd substrate-guided portion 37 respectively, and converges in fluidic junction 39.Sheet material substrate FB after converging in fluidic junction 39 and the 2nd substrate SB is transmitted by transport unit 21 with the state converged.At this moment, transport unit 21 presses sheet material substrate FB and the 2nd substrate SB and makes it touch.Therefore, transport unit 21 doubles as the pressing mechanism pressing the 2nd substrate SB to sheet material substrate FB.
Information retaining section IC (with reference to Fig. 5) is provided with in cylinder main body 2.Information retaining section IC is such as made up of IC chip (such as read-only type, read-write type etc.) etc., such as, be embedded within a main body 2.Information retaining section IC has: storage part MR, its store such as relevant with the specification value of the sheet material substrate FB be accommodated in a main body 2 specification information, based on this specification information process information, identify the information such as identifying information of cylinder main body 2; With Department of Communication Force CR, it communicates to the information be stored in this storage part MR.Storage part MR becomes the formation storing and comprise the information of specification information and identifying information both sides in the present embodiment, but also can be the formation storing the information only comprising any one party.About Department of Communication Force CR, being not limited to the formation be arranged on as in the present embodiment in information retaining section IC, also can be the formation such as independently arranged with information retaining section IC.
Be described for the formation being provided with 1 information retaining section IC in present embodiment, but also can be such as that this information retaining section IC arranges multiple formations in cylinder main body 2.As such example, such as, can enumerate the bar code etc. above-mentioned information being held in one dimension or two dimension, the paster being formed with this bar code is attached to the formation etc. of the position different from above-mentioned information retaining section IC.In addition, information retaining section IC is not limited to embedded to the formation in cylinder main body 2, such as, also can become the formation being mounted to by information retaining section IC to be separated with cylinder main body 2.As such formation, such as, can enumerate the formation etc. of releasably installing IC chip etc.In addition, such as when use above-mentioned be formed with the paster etc. of bar code time, owing to this paster can be peeled off, so can be separated with cylinder main body 2 from cylinder main body 2.In addition, also can be that information retaining section IC becomes with display part 29 formation be electrically connected, this information remained in information retaining section IC shows such formation on display part 29.In addition, the information that also can be configured to make sheet material substrate FB keep being kept by information retaining section IC at least partially.As such formation, such as, can enumerate on sheet material substrate FB, form the formation of the bar code of one dimension or two dimension etc., in sheet material substrate FB, embed the formation etc. of IC tag etc.
As an example of specification value, the material of sheet material substrate FB, pliability, resistance to effect of heat, wearability, thickness, friction coefficient, stretch resistance, retractility, tension force, coefficient of expansion etc. can be enumerated.Wherein, retractility can be the value corresponding to the heat that is applied in of sheet material substrate FB or tension force, also can be the value corresponding to heat and tension force.In addition, as specification value, comprise with sheet material substrate FB on adhere to the lyophily of regulation liquid, this regulation liquid on sheet material substrate FB drying property etc.As this regulation liquid, comprise such as from droplet applying apparatus 120 spray drop, metallic ink, electrical insulating property ink, from droplet applying apparatus 140 spray solution etc.In addition, specification information also comprises the pre-processing information relevant with the pre-processing carried out sheet material substrate FB.Pre-processing information refers to the information to the process that sheet material substrate FB carries out before being incorporated in a main body 2.As such pre-processing, such as, can enumerate the formation processing etc. of the reformation process (lyophoby process, lyophily process etc.) to sheet material substrate FB, surface protection film.As this lyophily process, such as, can enumerate the lyophily process etc. to the ink sprayed from above-mentioned droplet applying apparatus 120,140.
Technique information is the information relevant with the process implemented sheet material substrate FB, is the information comprising the technique ID corresponding with specification information, technique name etc.At least 1 processed in units corresponding with the specification information of sheet material substrate FB is contained to the pack processing that this sheet material substrate FB implements.As this processed in units, be such as equivalent to the process etc. of each inscape of substrate board treatment 100 in the present embodiment.As such process, comprise each process that substrate is implemented, such as, comprise furnace run, cooling processing, transmission process, punching press process, coating process, vapor deposition treatment, sputter process, photo-irradiation treatment, electron beam irradiation process, exposure-processed, development treatment, dip treating, dry process, Physical Processing process (cut off, part remove), chemical process process (dissolution process etc.), and the joining process, check processing, registration process, deformation process, reformation process, next door formation processing etc. of other substrates.
Information retaining section IC is such as electrically connected with above-mentioned terminal 3c.Terminal 3c, when substrate cartridge 1 is connected with processing substrate portion 102, is connected with the device side terminal 102C (with reference to Fig. 2) of the supply side connecting portion 102A being arranged on this processing substrate portion 102.In this situation, information retaining section IC is electrically connected with processing substrate portion 102 via terminal 3c, can by transmission of information between terminal 3c and processing substrate portion 102.In addition, information retaining section IC by Department of Communication Force CR, and can be arranged on the communication carrying out information between the Department of Communication Force 104CR (with reference to Fig. 2) in the control part 104 of substrate board treatment 100.In this situation, controlled the transmission of the information between substrate cartridge 1 and processing substrate portion 102 by control part 104.
In addition, except above-mentioned each information, in the storage part MR of information retaining section IC, also can keep the various process informations such as information, the information relevant with sheet material substrate FB such as the transfer rate of the information such as the productive temp of such as substrate board treatment 100, capacity rating, substrate cartridge 1, the batching of roller portion 26/rate of delivery." productive temp " refers to the processing time in processed in units region (figure surface area of every 1 panel of 1 manageable region such as droplet applying apparatus 120,140 as escribed above or organic EL element 50, the whole region of panel)." capacity rating " refers to the amount (such as the number etc. of length, panel number, substrate cartridge 1) of unit time manageable sheet material substrate FB.These process informations are same with identifying information, specification information, technique information etc. is delivered to control part 104 via Department of Communication Force CR.
Fig. 7 A and Fig. 7 B is the tabular drawing of the information be stored in control part 104.
Control part 104 is provided with data bank 104DB, and this data bank 104DB has such as by the 1st form of identifying information, specification information table and technique information (technique ID) corresponding stored and by the 2nd form of the combined information corresponding stored of technique ID and processed in units.
Fig. 7 A is the figure representing the 1st form, Fig. 7 B is the figure representing the 2nd form.As shown in Figure 7 A, in the 1st form Tb1, identifying information be such as stored as N1, N2, N3 ...In addition, in the 1st form Tb1, the specification information of the sheet material substrate FB that be accommodated in substrate cartridge 1 corresponding with this identifying information is stored by each specification value.According to the example of Fig. 7 A, as the specification information of sheet material substrate FB, enumerate the material of sheet material substrate FB, pliability, these 3 specification value of resistance to effect of heat have been that example represents.Certainly, employ above-mentioned 3 values here in order to make explanation simple and be described as the typical example of specification value, in fact store the specification value more than this situation.In this situation, the specification value of material is such as stored as " material M1, material M2, material M3 ... " Deng, flexual specification value is such as stored as " pliability F1, pliability F2, pliability F3 ... " Deng, the specification value of resistance to effect of heat is such as stored as " resistance to effect of heat HR1, resistance to effect of heat HR2, resistance to effect of heat HR3 ... " Deng.In addition, in the 1st form Tb1, the technique ID corresponding with the combination of this specification value is stored.Technique ID is such as stored as " ID1, ID2, ID3 ... " Deng.The 2nd form shown in technique ID with Fig. 7 B links.
As shown in Figure 7 B, in the 2nd form Tb2, store the combination of the above-mentioned processed in units corresponding with technique ID.In figure 7b, the example of the processed in units D in the processed in units B in the next door forming portion 91 of the processed in units A in the transport unit 105 of aforesaid substrate handling part 102, element forming part 106, the processed in units C in electrode forming portion 92 and luminescent layer forming portion 93 as the combination of processed in units is illustrated.In addition, processed in units also can be the process in such as aligned portions 107, the process etc. in substrate cutting portion 108.
In figure 7b, " processed in units A1, processed in units B3, processed in units C2, processed in units D3 ... is such as stored " as the combination of the processed in units corresponding with technique ID1.Store " processed in units A2, processed in units B1, processed in units C3, processed in units D2 ... " as the process corresponding with technique ID2.Store " processed in units A1, processed in units B2, processed in units C1, processed in units D1 ... " as the process corresponding with technique ID3.
In addition, the processed in units A1 such as, in processed in units A and processed in units A2 can become the process mutually distinguished the pressing force etc. of transfer rate, roller RR.Such as, the process that the processed in units B1 in processed in units B ~ B3 can be distinguished mutually as the kind, hardness, spacing etc. of the imprint mold 111 to roller platen 110, also can as the process mutually distinguished the heating-up temperature of hot transfer roll 115.Such as, processed in units C1 ~ the C3 of processed in units C and the D1 ~ D3 of processed in units D is as the formation processing of the electrode in electrode forming portion 92, except employing the coating process of droplet applying apparatus 120, droplet applying apparatus 140 as in the present embodiment, respectively can as the process being formed electrode by evaporation, also can as the process being formed electrode by sputtering method.In this situation, the formation in processing substrate portion 102 is except droplet applying apparatus 120,140, and arrange evaporation coating device, sputter equipment etc. in addition, control part 104 controls according to the mode of carrying out the process corresponding with technique ID.In addition, such as, when using above-mentioned droplet applying apparatus 120 and 140, processed in units also can be kind according to used drop and different process.Equally, when processing in processed in units with different conditions, processed in units also can be stored as different process by each condition respectively.
(sheet material substrate is to the storage action of substrate cartridge)
Next, the storage action of receiving sheet material substrate FB in above-mentioned such substrate cartridge 1 formed is described.Fig. 8 and Fig. 9 is the figure of the state of substrate cartridge 1 when representing storage action.In Fig. 8 and Fig. 9, for the ease of differentiating figure, the profile of substrate cartridge 1 represented by dashed line.
As shown in FIG. 8 and 9, when receiving sheet material substrate FB in substrate cartridge 1, substrate cartridge 1 is remained on supporting mass HD.In this condition, sheet material substrate FB is inserted from peristome 34.When inserting sheet material substrate FB, be in the state having made jockey pulley 21a and rotating shaft member 26a (roller portion 26) rotate in advance.
The sheet material substrate FB inserted via peristome 34 is guided to transport unit 21 by substrate-guided portion 22.In transport unit 21, sheet material substrate FB is sandwiched in jockey pulley 21a and measures between roller 21b and be sent to side, incorporating section 20.While mensuration roller 21b rotates, such as, in test section 21c, detect the transmission length of sheet material substrate FB.
It is directed while the sheet material substrate FB that transport unit 21 is passed through to side, incorporating section 20 is bending to-Z-direction based on deadweight.In the present embodiment, because guide part 27 is arranged on the-Z side of sheet material substrate FB, so sheet material substrate FB is guided along the rotatable parts 27a of guide part 27 and front end component 27b by roller portion 26.
When the front end of sheet material substrate FB arrives the adhesive portion 26c in roller portion 26, front end and the adhesive portion 26c of this sheet material substrate FB bond.In this condition, when roller portion 26 rotates, sheet material substrate FB is gently bonding with adhesive portion 26c, and sheet material substrate FB is rolled in roller portion 26.After sheet material substrate FB is bonding with adhesive portion 26c, such as, adjust the rotative speed of jockey pulley 21a and the rotative speed of rotating shaft member 26a, to make sheet material substrate FB not bend between roller portion 26 and transport unit 21, while transmit sheet material substrate FB.
After 1 circle sheet material substrate FB has such as been rolled up in pair roller portion 26, as shown in Figure 9, guide part 27 is kept out of the way.By making roller portion 26 rotate in this condition, sheet material substrate FB is gently rolled onto in roller portion 26.The thickness of the sheet material substrate FB be taken up is thickening gradually, but keeps out of the way, so sheet material substrate FB can not contact with guide part 27 due to guide part 27.
After the sheet material substrate FB of the length desired by having batched, such as, cut off the part in the outside of the peristome 34 in sheet material substrate FB.Like this, in substrate cartridge 1, sheet material substrate FB is received.In the storage action of sheet material substrate FB, also based on the measured length of the sheet material substrate FB be measured in test section 21c, the total length of the sheet material substrate FB be such as accommodated in substrate cartridge 1 can be calculated.And, can make to calculate result and be presented on display part 29.In addition, can make to calculate result and be presented on display part 29, also can be stored in storage part MR, utilize Department of Communication Force CR to communicate to it.
In addition, the inside of incorporating section 20 can such as also be observed from window portion 28 by operator, while carry out batching of sheet material substrate FB.In this situation, can while confirm that such as whether sheet material substrate FB is taken up with the state of bending, or whether the shape (winding form) that sheet material substrate FB is taken up is crooked state, carries out batching operation, when there occurs abnormal, can stop immediately batching.
(action of substrate board treatment)
Next, the action of the substrate board treatment 100 formed as described above is described.
In the present embodiment, the supply action of sheet material substrate FB that the connecting moves carrying out the substrate cartridge 1 having received sheet material substrate FB to be connected as substrate supply unit 101 with supply side connecting portion 102A in order, substrate supply unit 101 realize based on substrate cartridge 1, the element in processing substrate portion 102 form the dismounting action of action, substrate cartridge 1.
First, the connecting moves of substrate cartridge 1 is described.Figure 10 is the figure of the connecting moves representing substrate cartridge 1.
As shown in Figure 10, for supply side connecting portion 102A, insert port is formed as the shape corresponding with department of assembly 3.
In connecting moves, under substrate cartridge 1 being remained on the state on supporting mass (such as same with the supporting mass HD shown in Fig. 8 and Fig. 9 formation), carry out the contraposition of department of assembly 3 and supply side connecting portion 102A.After contraposition, department of assembly 3 is moved to+X side and is inserted in processing substrate portion 102.
At this moment, the terminal 3C of the department of assembly 3 and device side terminal 102C of supply side connecting portion 102A contacts with each other.Contacted with device side terminal 102C by terminal 3C, the communication of information can be carried out between the information retaining section IC of substrate cartridge 1 and the Department of Communication Force 104CR of control part 104.By this communication operation, control part 104 reads in the information (such as identifying information, specification information etc.) kept in the information retaining section IC of substrate supply unit 101.In control part 104, technique ID is judged according to the specification information in the information that this reads, from the 2nd form Tb2, select the combination of the processed in units corresponding with this technique ID, carry out the processed in units selected as following each action (supply action, element form action etc.).By this action, owing to switching processed in units according to the specification value of the sheet material substrate FB becoming handling object, so carry out best process to sheet material substrate FB.In addition, control part 104 also by the specification information etc. read from substrate supply unit 101 being written to the information retaining section IC of substrate recoverer 103, can carry out the specification information to substrate recoverer 103 transferring substrates supply unit 101.In addition, control part 104 also can transmit the information relevant with the processed in units selected based on above-mentioned specification information to substrate recoverer 103.Under these circumstances, due to control part 104 to substrate recoverer 103 transmit based in processing substrate portion 102 to the information of the constituent parts process that sheet material substrate FB carried out, so substrate recoverer 103 can by sheet material substrate FB has been carried out what kind of process wait process remain specification information through information.
In addition, before the connecting moves of substrate cartridge 1, above-mentioned information also can be transmitted to control part 104 by the radio communication of carrying out between the Department of Communication Force CR and the Department of Communication Force 104CR of control part 104 of information retaining section IC by information retaining section IC.
Then, supply action is described.When supplying sheet material substrate FB to processing substrate portion 102, such as make the rotating shaft member 26a of substrate cartridge 1 (roller portion 26) and jockey pulley 21a to contrary with during storage action towards rotation, as shown in figure 11, sheet material substrate FB is sent via peristome 34.
Then, element formation action is described.As shown in Figure 2, formed in action at element, from substrate supply unit, 101 pairs of processing substrate portions 102 supply sheet material substrate FB, while in processing substrate portion 102 on this sheet material substrate FB forming element.As shown in Figure 3, processing substrate portion 102 utilizes roller RR to transmit sheet material substrate FB.
Control part 104 also can be different from the combination of above-mentioned processed in units and control the action in processing substrate portion 102 based on the process information supplied by substrate cartridge 1.Such as, control part 104 can according to being supplied the speed of sheet material substrate FB by substrate cartridge 1 to adjust the rotative speed of each roller RR in processing substrate portion 102.In addition, whether control part 104 measuring roll RR, to Y direction skew, makes roller RR move correction position when offseting.In addition, control part 104 carries out the position correction of sheet material substrate FB in the lump.
First the sheet material substrate FB being supplied to processing substrate portion 102 by substrate supply unit 101 is sent to next door forming portion 91.In next door forming portion 91, sheet material substrate FB is stamped roller 110 and hot transfer roll 115 clamps pressing, is transferred on sheet material substrate forms next door BA and alignment mark AM by heat.
Figure 12 represents the figure defining the state of next door BA and alignment mark AM on sheet material substrate FB.A part of Figure 12 is amplified the figure represented by Figure 13.Figure 14 is the figure of the formation represented along the D-D section in Figure 13.Figure 12 and Figure 13 illustrates from the appearance during observation sheet material substrate FB of+Z side.
As shown in figure 12, next door BA is formed at the element-forming region 60 of the Y-direction central portion of sheet material substrate FB.As shown in figure 13, by forming next door BA, in element-forming region 60, the region (grid forming region 52) forming grid bus GBL and gate electrode G and the region (source drain forming region 53) forming source bus line SBL, source electrode S, drain electrode D and anode P are divided.As shown in figure 14, grid forming region 52 is formed as trapezoidal shape under analysing and observe.Though the diagram of eliminating, source drain forming region 53 also becomes same shape.Width W (μm) in the BA of next door becomes the live width of grid bus GBL.Preferably relative to the bubble diameter d (μm) applied by droplet applying apparatus 120G, this width W is the width of 2 times ~ about 4 times.
In addition, for the section shape of grid forming region 52 and source drain forming region 53, preferably analysing and observe lower is V-shape or U-shaped, and to make after fine imprint mold 11 has pressed sheet material substrate FB, sheet material substrate FB is easy to peel off.As other shape, such as, also can be that analysing and observe lower is rectangular shape.
On the other hand, as shown in figure 12, alignment mark AM is formed a pair in the fringe region 61 at the Y-direction both ends of sheet material substrate FB.Next door BA and alignment mark AM due to mutual alignment relation more important, so be formed simultaneously.As shown in figure 13, define the predetermined distance PY between alignment mark AM and grid forming region 52 in Y direction, define the predetermined distance PX between alignment mark AM and source drain forming region 53 in X-direction.Therefore, the skew of X-direction of sheet material substrate FB, the skew of Y direction and θ can be detected based on the position of a pair alignment mark AM to rotate.
In Figure 12 and Figure 13, alignment mark AM is provided with a pair by the multirow next door BA of X-direction, but is not limited thereto, such as, also can arrange alignment mark AM by every 1 row next door BA.In addition, if having living space, then except the fringe region 61 of sheet material substrate FB, also alignment mark AM can be set in element-forming region 60.In addition, in Figure 12 and Figure 13, alignment mark AM illustrates cross shape, but also can be other mark shape such as linear mark of sphere shaped markup, inclination.
Next, sheet material substrate FB is sent to electrode forming portion 92 by transfer roller RR.In electrode forming portion 92, carry out the coating of the drop based on each droplet applying apparatus 120, sheet material substrate FB forms electrode.
On sheet material substrate FB, first form grid bus GBL and gate electrode G by droplet applying apparatus 120G.Figure 15 A and Figure 15 B represents the figure utilizing droplet applying apparatus 120G to carry out the appearance of the sheet material substrate FB of droplet applying.
As shown in fig. 15, droplet applying apparatus 120G to define next door BA sheet material substrate FB grid forming region 52 in such as with 1 ~ 9 order plating ink.This order is such as the order being coated in linearity by metallic ink tension force each other.Figure 15 B is the figure representing the state after being such as coated with 1 metallic ink.As shown in fig. 15b, owing to being provided with next door BA, so be kept with being coated on the metallic ink indiffusion of grid forming region 52.Like this, to the overall plating ink of grid forming region 52.
After being coated with metallic ink to grid forming region 52, the mode being positioned at the-Z side of annealing device BK according to the part being coated with this metallic ink transmits sheet material substrate FB.Annealing device BK heat-treats the metallic ink be coated on sheet material substrate FB, makes this metallic ink dry.Figure 16 A is the figure representing the state making the dried grid forming region 52 of metallic ink.As shown in Figure 16 A, by making metallic ink dry, the conductor layer comprised in metallic ink builds up film-form.The electric conductor of such film-form is formed at the entirety of grid forming region 52, as shown in fig 16b, sheet material substrate FB forms grid bus GBL and gate electrode G.
Then, sheet material substrate FB is sent to the-Z side of droplet applying apparatus 120I.In droplet applying apparatus 120I, apply electrical insulating property ink to sheet material substrate FB.In droplet applying apparatus 120I, as shown in figure 17, by coated electrical insulating property ink on the grid bus GBL of source drain forming region 53 and on gate electrode G.
After coated electrical insulating property ink, sheet material substrate FB is sent to the-Z side of annealing device BK, implements heat treatment by annealing device BK to this electrical insulating property ink.Electrical insulating property ink is dry by this heat treatment, forms gate insulator I.Illustrate gate insulator I in Figure 17 and be formed as round-shaped state according to across next door BA upper type, but do not need necessarily to cross over next door BA to be formed.
After defining gate insulator I, sheet material substrate FB is sent to the-Z side of droplet applying apparatus 120SD.In droplet applying apparatus 120SD, to the source drain forming region 53 plating ink of sheet material substrate FB.To the part striding across gate insulator I in source drain forming region 53, such as, with the order of 1 ~ 9 shown in Figure 18 ejection metallic ink.
After having sprayed metallic ink, sheet material substrate FB has been sent to the-Z side of annealing device BK, carries out the drying process of metallic ink.After this drying process, electric conductor tegillum contained in metallic ink builds up film-form, forms source bus line SBL, source electrode S, drain electrode D and anode P.But in this stage, be in the state be connected between source electrode S with drain electrode D.
Then, sheet material substrate FB is sent to the-Z side of shutoff device 130.In shutoff device 130, cut-off between the source electrode S of sheet material substrate FB and drain electrode D.Figure 19 is the figure representing the state after utilizing shutoff device 130 to be cut off at the interval of source electrode S and drain electrode D.In shutoff device 130, galvanometer mirror 131 is used to adjust the irradiation position of laser LL to sheet material substrate FB, while cut off.
After cut-off between source electrode S and drain electrode D, sheet material substrate FB is sent to the-Z side of droplet applying apparatus OS.In droplet applying apparatus OS, sheet material substrate FB forms organic semiconductor layer OS.Organic semiconductor ink is sprayed to the region overlapping with gate electrode G on sheet material substrate FB according to the mode striding across source electrode S and drain electrode D.
After being ejected organic semiconductor ink, sheet material substrate FB is sent to the-Z side of annealing device BK, carries out the drying process of organic semiconductor ink.After this drying process, semiconductor layer contained in organic semiconductor ink builds up film-form, as shown in figure 20, forms organic semiconductor OS.By above operation, sheet material substrate FB forms FET and connecting wiring.
Next, sheet material substrate FB is sent to luminescent layer forming portion 93 (with reference to Fig. 3) by transfer roller RR.In luminescent layer forming portion 93, droplet applying apparatus 140Re, droplet applying apparatus 140Gr, droplet applying apparatus 140Bl and annealing device BK is utilized to form redness, green, blue luminescent layer IR respectively.Owing to being formed with next door BA on sheet material substrate FB, even if so when not utilizing annealing device BK to heat-treat redness, green and blue luminescent layer IR and continue to apply, solution also can not overflow to adjacent pixel region and colour mixture occur.
After formation luminescent layer IR, sheet material substrate FB forms insulating barrier I through droplet applying apparatus 140I and annealing device BK, forms transparency electrode IT through droplet applying apparatus 140IT and annealing device BK.Through such operation, sheet material substrate FB forms the organic EL element 50 shown in Fig. 1.
Action being formed for element, is formed in the process of organic EL element 50 transmitting sheet material substrate FB as described above, in order to prevent sheet material substrate FB from offseting to X-direction, Y-direction and θ Z-direction, having carried out alignment actions.Below, with reference to Figure 21, alignment actions is described.
In alignment actions, the multiple alignment cameras CA (CA1 ~ CA8) being arranged at each several part detect the alignment mark AM be suitably formed on sheet material substrate FB, and send testing result to control part 104.Control part 104 carries out alignment actions based on the testing result of sending.
Such as, the transfer rate of sheet material substrate FB is detected at the shooting interval etc. of the alignment mark AM that control part 104 detects based on alignment cameras CA (CA1 ~ CA8), judges whether roller RR such as rotates with specified speed.When being judged as that roller RR does not rotate with specified speed, the adjustment instruction that control part 104 sends the rotative speed of roller RR applies feedback.
In addition, such as control part 104 is based on the image pickup result of alignment mark AM, and whether the position detecting the Y direction of alignment mark AM offsets, and detects the position skew whether sheet material substrate FB exists Y direction.When detecting that position offsets, control part 104 detects the time that continue for how degree in the state upper/lower positions skew making sheet material substrate FB transmit.
If the time of position skew is the short time, then the nozzle 122 by switching the coating drop in multiple nozzles 122 of droplet applying apparatus 120 is dealt with.If the skew of the Y direction of sheet material substrate FB continue for the long period, then carried out the position correction of the Y direction of sheet material substrate FB by the movement of roller RR.
In addition, whether the X-axis of alignment mark AM that detects based on alignment cameras CA of such as control part 104 and the position of Y direction are detected sheet material substrate FB and are offset to θ Z-direction.When detecting that position offsets, control part 104 is same with when detecting that the position of Y direction offsets, and detects the time that continue for how degree in the state upper/lower positions skew transmitting sheet material substrate FB.
If the time of position skew is the short time, then the nozzle 122 by switching the coating drop in multiple nozzles 122 of droplet applying apparatus 120 is dealt with.If skew continue for the long period, then make to be arranged on clip the alignment cameras CA this skew being detected position on 2 roller RR move to X-direction or Y-direction, carry out the position correction of the θ Z-direction of sheet material substrate FB.
Then, dismounting action is described.Such as on sheet material substrate FB, form organic EL element 50, and after having reclaimed sheet material substrate FB, the substrate cartridge 1 used as substrate supply unit 101 is unloaded from processing substrate portion 102.
Figure 22 is the figure of the dismounting action representing substrate cartridge 1.
As shown in figure 22, in dismounting action, by making department of assembly 3 move along-X-direction and unload from supply side connecting portion 102A, unload department of assembly 3.In this action, department of assembly 3 is removed along the guiding of supply side connecting portion 102A.
As mentioned above, according to the present embodiment, because substrate cartridge 1 possesses the cylinder main body 2 of storage sheet material substrate FB; With information retaining section IC, it keeps the information at least comprising the specification information relevant with the specification value of the sheet material substrate FB be accommodated in a main body 2; So such as control part 104 can use the specification information etc. of the sheet material substrate FB be accommodated in a main body 2, differentiate the specification value etc. of this sheet material substrate FB.Therefore, the process to substrate can effectively be carried out.In addition, the information management capability comprising the manufacture line entirety of sheet material substrate FB improves.
In addition, according to the present embodiment, due to substrate board treatment 100 possess process sheet material substrate FB processing substrate portion 102, carry out moving into processing substrate portion 102 the substrate supply unit 101 of sheet material substrate FB and carry out taking out of from processing substrate portion 102 the substrate recoverer 103 of substrate, and use substrate cartridge 1 as substrate supply unit 101, so processing substrate portion 102 can use the information from substrate cartridge 1 to switch sheet material substrate FB and carry out best process.Thus, the undesirable condition such as breakage, distortion that the sheet material substrate FB in processing substrate portion 102 occurs can be reduced.
In addition, according to the present embodiment, due in the manufacturing process of display element, there is the operation that processes sheet material substrate FB in processing substrate portion 102 and use substrate cartridge 1 to supply sheet material substrate FB to processing substrate portion 102 or reclaim the operation of sheet material substrate FB from processing substrate portion 102, so effectively display element can be manufactured under the information management of high level.
In addition, according to the present embodiment, such as the information such as the specification information kept in the information retaining section IC of substrate cartridge 1 can be upgraded due to control part 104, so the recycling of the substrate cartridge 1 used as substrate supply unit 101 can be realized.
[the 2nd embodiment]
Next, the 2nd embodiment of the present invention is described.
Figure 23 is the figure of the formation representing substrate board treatment 200 of the present embodiment.
As shown in figure 23, substrate board treatment 200 has: substrate supply unit 201, processing substrate portion 202, substrate recoverer 203 and control part 204.In the present embodiment, to employ aforesaid substrate cylinder 1 this point respectively different from the 1st embodiment for substrate supply unit 201 and substrate recoverer 203.
Processing substrate portion 202 becomes the formation such as not arranging substrate cutting portion 108 in the processing substrate portion 102 of the 1st embodiment.Therefore, the sheet material substrate FB after the process of this processing substrate portion 202 keeps sheet to be reclaimed by substrate recoverer 203 not cut-offly.
In addition, the identifying information of the specification information of such as sheet material substrate FB, technique information, substrate cartridge 1 is held in the formation of substrate cartridge 1, the formation that illustrates in the formation that is provided with the 1st form Tb1 and the 2nd form Tb2 in control part 204, the formation that can communicate between information retaining section IC with control part 204 etc. and the 1st embodiment is same.
Figure 24 ~ Figure 26 is the figure of the appearance of the recovery of the sheet material substrate FB represented in substrate recoverer 103.In Figure 24 ~ Figure 26, in order to easily differentiate figure, represent with the state of the formation eliminating a part.
In recovery action, as shown in figure 24, while inserting sheet material substrate FB to the peristome 34 of substrate cartridge 1, insert protective substrate PB from the 2nd peristome 35.Protective substrate PB is such as supplied by not shown protective substrate supply unit.
As shown in figure 25, the sheet material substrate FB be inserted into and protective substrate PB is guided by substrate-guided portion 22 and the 2nd substrate-guided portion 37 respectively, converges in fluidic junction 39.Sheet material substrate FB after converging in fluidic junction 39 and protective substrate PB as shown in figure 26, is transmitted by transport unit 21 with the state converged, and is pressed with mensuration roller 21b by jockey pulley 21a and touch.Sheet material substrate FB and protective substrate PB is batched by roller portion 26 with the state of contiguity and reclaims.
Control part 204 is when sheet material substrate FB is reclaimed by substrate recoverer 203, and the information retaining section IC to the substrate cartridge 1 used as substrate recoverer 203 sends the technique information corresponding with the specification information of the sheet material substrate FB after process and this specification information.Information retaining section IC receives this information of sending and is stored in storage part MR.
Like this, according to the present embodiment, due to substrate board treatment 200 possess process sheet material substrate FB processing substrate portion 202, carry out moving into processing substrate portion 202 the substrate supply unit 201 of sheet material substrate FB and carry out taking out of from processing substrate portion 202 the substrate recoverer 203 of substrate, and use substrate cartridge 1 as substrate supply unit 201 and substrate recoverer 203, so be delivered to from the information of substrate cartridge 1 substrate cartridge 1 reclaiming destination.Thus, when when managing the substrate cartridge 1 of this recovery destination, to the sheet material substrate FB process be accommodated in the substrate cartridge 1 reclaiming destination, substrate board treatment 200 can use above-mentioned information.Thereby, it is possible to make the information management capability of substrate board treatment 200 improve, treatment effeciency is significantly improved.
In addition, in the present embodiment, illustrate that processing substrate portion 202 becomes the situation of the formation same with the processing substrate portion 102 recorded in the 1st embodiment, but be not limited to this.It also can be such as the formation of the part be only provided with in processing substrate portion 202 in the next door forming portion 91 in the formation processing substrate portion 102 recorded in the 1st embodiment, electrode forming portion 92 and luminescent layer forming portion 93.
Such as, for only arrange next door forming portion 91 as processing substrate portion 202, the formation that do not arrange electrode forming portion 92 and luminescent layer forming portion 93 is described.In this situation, sheet material substrate FB is recycled to substrate recoverer 203 with the state of the formation only having carried out next door BA in processing substrate portion 202.Sheet material substrate FB after being reclaimed by substrate recoverer 203 carries out electrode formation processing and luminescent layer formation processing in other processing substrate portion.
Because substrate cartridge 1 is configured to load and unload by opposing substrate handling part 202, so under these circumstances, substrate cartridge 1 can be dismantled from processing substrate portion 202, and substrate cartridge 1 is transmitted make it be connected with other processing substrate portion.Due to maintain in the information retaining section IC of this substrate cartridge 1 comprise sheet material substrate FB specification information, technique information, substrate cartridge 1 the information of identifying information, so also this information can be used process in the processing substrate portion of connecting object.Like this, stride across multiple processing substrate portion when manufacturing on line at 1, and when this processing substrate portion does not carry out the communication of information to each other, also can carry out the communication of the information of sheet material substrate FB via substrate cartridge 1.In this situation, information management capability also can be made to improve, treatment effeciency is significantly improved.
[the 3rd embodiment]
Then, the 3rd embodiment of the present invention is described.
In the present embodiment, be described for the situation of carrying out the communication of information in multiple processing substrate portion.
Figure 27 is the figure of the formation representing base plate processing system SYS of the present embodiment.
As shown in figure 27, base plate processing system SYS has the 1st substrate board treatment 300, the 2nd substrate board treatment 310 and main control unit CONT.1st substrate board treatment 300 and the 2nd substrate board treatment 310 are such as arranged in Same Site or in same factory.
1st substrate board treatment 300 is such as the device of the next door BA forming organic EL element 50 on sheet material substrate FB.2nd substrate board treatment 310 is such as on sheet material substrate FB, form electrode (gate electrode G etc.), the luminescent layer IR of organic EL element 50, the device of transparency electrode ITO.Like this, base plate processing system SYS becomes the formation that the device forming organic EL element 50 is divided into the device of the 1st substrate board treatment 300 and the 2nd these two kinds of substrate board treatment 310.
1st substrate board treatment 300 has substrate supply unit 301, processing substrate portion 302 and substrate recoverer 303.In the present embodiment, above-mentioned substrate cartridge 1 is employed as substrate supply unit 301 and substrate recoverer 303.
Processing substrate portion 302 has the formation same with the next door forming portion 91 in the substrate board treatment 100 of the 1st embodiment respectively, and the connecting bridge with substrate supply unit 301 is provided with supply side connecting portion 302A.The formation of supply side connecting portion 302A becomes identical formation with the supply side connecting portion 102A in the 1st embodiment.Like this, the 1st substrate board treatment 300 has the formation identical with the formation of the next door forming portion 91 from the substrate supply unit 101 of substrate board treatment 100 to processing substrate portion 102 in the 1st embodiment.
In processing substrate portion 302, the connecting bridge of substrate recoverer 303 is provided with the recovery side connecting portion 302B be connected with the department of assembly 3 of substrate cartridge 1.Reclaim side connecting portion 302B and become the formation identical with supply side connecting portion 302A.
2nd substrate board treatment 310 has substrate supply unit 311, processing substrate portion 312 and substrate recoverer 313, becomes the formation identical with the 1st substrate board treatment 300 in each portion.Processing substrate portion 312 has the formation identical with the electrode forming portion 92 in the substrate board treatment 100 of the 1st embodiment and luminescent layer forming portion 93.
In the 2nd substrate board treatment 310, use above-mentioned substrate cartridge 1 as substrate supply unit 311 and substrate recoverer 313.In addition, from the 1st substrate board treatment 300 unload and the substrate recoverer 303 (substrate cartridge 1) being transmitted to the 2nd substrate board treatment 310 as the 2nd substrate board treatment 310 substrate supply unit 311 and use.Therefore, substrate cartridge 1 also plays a role as from the 1st substrate board treatment 300 to the relay of the 2nd substrate board treatment 310 relaying sheet material substrate FB.
Main control unit CONT is connected with the 1st substrate board treatment 300 and the 2nd substrate board treatment 310 respectively via wired or wireless communication agency, unified these the 1st substrate board treatments 300 of control and the 2nd substrate board treatment 310.And main control unit CONT has the 1st form Tb1 and the 2nd form Tb2 that record in the 1st embodiment.Therefore, in main control unit CONT, the information that can keep in the information retaining section IC of substrate cartridge 1 that uses of unified management the 1st substrate board treatment 300 and the 2nd substrate board treatment 310.
Like this, in the present embodiment, the information kept in the information retaining section IC due to main control unit CONT unified management substrate cartridge 1, so the information management capability of base plate processing system SYS can be made to improve, makes the treatment effeciency of base plate processing system SYS improve.
When as in the present embodiment, when utilizing the manufacture line of the unified management organic EL element 50 such as control part 104, main control unit CONT, the information retaining section IC of substrate cartridge 1 also only can keep the formation of identifying information.Such as, when utilizing the manufacture line of main control unit CONT unified management organic EL element 50, the main storage portion MMR (with reference to Figure 27) of main control unit CONT has the specification information corresponding with identifying information, main control unit CONT can identify specification information based on the identifying information of substrate cartridge 1, carries out the process (such as processed in units) based on this specification information.Like this, main control unit CONT reads the specification information corresponding with the identifying information read from information retaining section IC from main storage portion MMR, in order to carry out the process based on this specification information, to the 1st substrate board treatment 300 or the 2nd substrate board treatment 310 transmission processing signal.Processing signals is such as making the 1st substrate board treatment 300 etc. carry out the command signals such as the setting value of each process.In addition, when such as utilizing the manufacture line of control part 104 unified management organic EL element 50, as long as use control part 104 to replace main control unit CONT.Thus, the treatment effeciency of the 1st substrate board treatment 300 or the 2nd substrate board treatment 310 improves.
In addition, in the present embodiment, illustrate the situation of the 2nd substrate board treatment 310 as the connecting object of the substrate cartridge 1 pulled down from the 1st substrate board treatment 300, but be not limited thereto.Such as, also can configure multiple processing equipment 320 (representing with long and short dash line in Figure 27) that applying device, evaporation coating device, sputter equipment etc. carry out the processed in units of multiple types, control each processing equipment 320 by main control unit CONT is unified.In this situation, also can be controlled to the connecting object being switched the substrate cartridge 1 pulled down from the 1st substrate board treatment 300 by main control unit CONT by each processing equipment 320.By this control, the process corresponding with the specification information of sheet material substrate FB can be carried out.
Technical scope of the present invention is not limited to above-mentioned embodiment, can suitably be changed without departing from the scope of the subject in the invention.
Such as, can be that substrate cartridge 1 does not keep specification information and keeps the formation of technique ID.According to this formation, the information management of base plate processing system SYS becomes simpler.
In addition, in the above-described embodiment, in control part 104 or main control unit CONT, carry out the switching of the technique based on specification information, but be not limited to this, the switching control (or switch control portion) controlled the switching of technique also can be set in addition.In this situation, be provided with in advance in switching control and above-mentioned 1st form Tb1, form that the 2nd form Tb2 is corresponding, the information kept in the information retaining section IC of substrate cartridge 1 is delivered to this switching control.In switching control, select technique based on the information stored in form, and this selection result is sent to above-mentioned control part 104 or main control unit CONT.In addition, such switching control such as also can be arranged in substrate cartridge 1.
In addition, in above-mentioned 1st embodiment and the 2nd embodiment, illustrate that the substrate supply unit in only processing substrate portion employs the formation that the formation of substrate cartridge 1, the substrate supply unit in processing substrate portion and substrate recoverer both sides employ substrate cartridge 1, but also can be that such as only substrate recoverer employs the formation of substrate cartridge 1.
[the 4th embodiment]
Then, the 4th embodiment of the present invention is described.In the following description, prosign is marked to the inscape identical or equal with above-mentioned embodiment, and omit or simplify its explanation.As shown in Figure 2, in the present embodiment, substrate board treatment 100 is also use the sheet material substrate FB with flexual band shape to form the device of the organic EL element 50 shown in Fig. 1.As shown in Figure 2, substrate board treatment 100 has substrate supply unit 101, processing substrate portion 102, substrate recoverer 103 and control part 104.Sheet material substrate FB is sent to substrate recoverer 103 from substrate supply unit 101 through processing substrate portion 102.The unified action controlling substrate board treatment 100 of control part 104.And control part 104 has the data bank 104DB of the storage part as the information of storage.
Figure 28 is the figure of the formation representing processing substrate portion 102.
As shown in figure 28, processing substrate portion 102 has transport unit 105, element forming part 106, aligned portions 107 and substrate cutting portion 108.Processing substrate portion 102 is while transmit the sheet material substrate FB supplied by substrate supply unit 101, while form each inscape of above-mentioned organic EL element 50 on this sheet material substrate FB, and by part that the sheet material substrate FB after defining organic EL element 50 sends to substrate recoverer 103.
In the present embodiment, also using substrate cartridge 1 as substrate supply unit 101 and substrate recoverer 103.As shown in figs.5 and 6, substrate cartridge 1 has a main body 2 and department of assembly 3.
Information retaining section IC (with reference to Fig. 5) is provided with in cylinder main body 2.Information retaining section IC is such as made up of IC chip (such as read-only type, read-write type etc.) etc., such as embedded in cylinder main body 2.In the present embodiment, information retaining section IC has: storage part MR, and it stores the information such as the process information of the sheet material substrate FB be such as accommodated in a main body 2, the identifying information of identification cylinder main body 2; And Department of Communication Force CR, it communicates to the information be stored in this storage part MR.About storage part MR, become the formation storing and comprise the information of both process information and identifying information in the present embodiment, but also can be the formation storing the information only comprising any one party.About Department of Communication Force CR, be not limited to the formation be arranged on as in the present embodiment in information retaining section IC, such as, also can become the formation independently arranged with information retaining section IC.
As an example of the process information in present embodiment, comprise the defect information on sheet material substrate FB.This defect information comprise the defect part on sheet material substrate FB location information, can or cannot the defect level of repair-deficiency, pattern shortcoming, pattern to give prominence to etc. in the reparation situation (such as with or without repairing) of the defect on the kind of defect, sheet material substrate FB etc. at least a kind.Wherein, the location information of the defect part on sheet material substrate FB can be such as the position coordinate of the defect part on sheet material substrate FB, also can be the distance from the end of sheet material substrate FB to this defect part.
Defect information on above-mentioned sheet material substrate FB is delivered to the control part 104 in processing substrate portion 102 from information retaining section IC via Department of Communication Force CR.The control part 104 being passed this defect information carrys out each process of control electrode forming portion 92 grade based on this defect information.As an example, when being judged as repairing this defect part according to the degree of defect contained in this defect information, the information of electrode formation processing of not carrying out for this defect part or the element-forming region 60 that comprises this defect part is passed to droplet applying apparatus 120 together with the location information of defect part by control part 104.As another example, when the reparation of defect part contained in this defect information completes, the information of electrode formation processing of carrying out for this defect part or the element-forming region 60 that comprises this defect part is passed to droplet applying apparatus 120 by control part 104.Like this, the process that control part 104 can be selected for defect part based on above-mentioned defect information, and the process this selected passes to droplet applying apparatus 120 etc. in advance.
In addition, also can be as shown in figure 29 a, the position at the edge along Y-direction along the X direction in sheet material substrate FB is formed and such as becomes the pattern P TN such as the mark of reference position, uses this pattern P TN to detect the position of defect part P1, and using the location information of this testing result as defect part P1.In the example shown in Figure 29 A, sheet material substrate FB is formed with the encoder-pattern of coder (position information detection device) as pattern P TN.Encoder-pattern is such as the such pattern in the position of the X-direction that can differentiate sheet material substrate FB.Even if when the location information of defect part P1 is the position of the X-direction of sheet material substrate FB, the position coordinate of defect part P1 also based on the position of the X-direction of defect part P1, can configure line sensor in the Y direction by use or can determine along the position of the Y-direction of the detection defect part P1 such as the camera of Y-direction movement.
In addition, as shown in figure 29 a, the location information of defect part P1 also can be to being divided into the area code (such as A110, A111, A112 etc.) given in multiple regions (such as defect area) along the X direction in sheet material substrate FB.
Wherein, the process information in present embodiment also comprises the location information relevant with the established part on sheet material substrate FB, the shape information for the progress information of the process of sheet material substrate FB, the formation layer (such as each electrode layer, TFT layer, luminescent layer etc.) be formed on sheet material substrate FB, the shape information etc. relevant with the shape of sheet material substrate FB.Here, the part etc. that the established part on sheet material substrate FB can be enumerated above-mentioned defect part, define the part of the Fiducial marks of contraposition, defines the Fiducial marks becoming the length of sheet material substrate FB or the index at interval.In addition, when connecting multiple unit substrate and forming sheet material substrate FB, process information also comprises the information relevant with this unit substrate connection location each other (position of seam).
Progress information comprises and represents that process proceeds to the information etc. in which stage to sheet material substrate FB.Progress information be such as represent the stage only defining next door BA on sheet material substrate FB, the stage defining next door and electrode on sheet material substrate FB, define on sheet material substrate FB next door, electrode and luminescent layer stage etc. processing stage information.In addition, progress information also can comprise the stage of sheet material substrate FB having been carried out to pre-processing (such as lyophily process, lyophoby process, protective film formation processing etc.), can also comprise the formation stages of the electrodes such as gate electrode, source electrode, drain electrode.This progress information is delivered to the control part 104 in processing substrate portion 102 from information retaining section IC via Department of Communication Force CR, use one of information of the process that sheet material substrate FB carries out as selecting in processing substrate portion 102.
Shape information is included in the information such as shape, cambial position deviation, cambial size (such as size, thickness etc.), cambial forming range, cambial position of the formation layer (such as electrode layer, luminescent layer) that sheet material substrate FB is formed.This shape information is delivered to the control part 104 in processing substrate portion 102 from information retaining section IC via Department of Communication Force CR.Such as, when due to the system failure of device, the maintenance of device and stop process to sheet material substrate FB in midway time, such shape information can use as one of information of the starting position of setting process.In addition, as an example, come based on the information being reserved as the number of this position deviation on sheet material substrate FB, ratio as the cambial position deviation of above-mentioned shape information the maintenance period of notifying device, the exception of device one of information and use.
In addition, shape information comprises the information relevant with the shape of the entirety of sheet material substrate FB.Such as when having the formation of peristome on the part becoming sheet material substrate FB is by one of incised notch or sheet material substrate FB, shape information also comprises the information (kind of such as shape, location information) etc. of this incised notch, peristome.This shape information is delivered to the control part 104 in processing substrate portion 102 from information retaining section IC via Department of Communication Force CR.Such as, such shape information is used to the wearing and tearing frequency of sheet material substrate FB, the degree of flaw grasped because transport unit 21 causes, and control part 104 exports the information notified the maintenance period of device, the exception of device based on this shape information.
In addition, information retaining section IC is such as electrically connected with above-mentioned terminal 3c.When substrate cartridge 1 is connected with processing substrate portion 102, terminal 3c is connected with the device side terminal 102C (with reference to Fig. 2) of the supply side connecting portion 102A being arranged on this processing substrate portion 102.In this situation, information retaining section IC is electrically connected with processing substrate portion 102 via terminal 3c, can via the transmission carrying out information between terminal 3c and processing substrate portion 102.In addition, information retaining section IC via Department of Communication Force CR and can be arranged on the communication carrying out information between Department of Communication Force 104CR in the control part 104 of substrate board treatment 100 (with reference to Fig. 2).In this situation, the transmission of the information between substrate cartridge 1 and processing substrate portion 102 is controlled by control part 104.
In addition, except above-mentioned each information, information, the information relevant with sheet material substrate FB etc. such as the transfer rate of the information such as the productive temp of such as substrate board treatment 100, capacity rating, substrate cartridge 1, the batching of roller portion 26/rate of delivery in the storage part MR of information retaining section IC, also can be kept various with reference to information." productive temp " refers to the processing time in each processed in units region (figure surface area often opening panel of 1 manageable region such as droplet applying apparatus 120,140 as escribed above or organic EL element 50, the whole region of panel)." capacity rating " refers to the amount (such as the number etc. of length, panel number, substrate cartridge 1) of unit time manageable sheet material substrate FB.These are same with identifying information, process information etc. with reference to information, are delivered to control part 104 via Department of Communication Force CR.
Wherein, in the present embodiment, the forming apparatus 109A such as forming pattern P TN on sheet material substrate FB, the detecting device 109B detecting this pattern P TN, cut-out remove the cut-out removal device 109C of a part of sheet material substrate FB, detect the abnormal checking device 109D etc. (with reference to Figure 28) of the exception of the defect information comprised on sheet material substrate FB is provided with in processing substrate portion 102.
In the embodiment shown in Figure 28, when being detected that by abnormal checking device 109D the defective part on sheet material substrate FB is graded, the location information of this defect part can be detected by detecting device 109B.Such as, the location information of the defect part detected is passed to the information retaining section IC of substrate recoverer 103 (substrate cartridge 1) by control part 104 as the defect information of sheet material substrate FB.
In addition, in the embodiment shown in Figure 28, when storing defect information in the information retaining section IC of substrate supply unit 102, the defect part that this defect information is comprised by cut-out removal device 109C by the location information based on this defect part cuts off, removes.In this situation, as shown in fig. 29b, incised notch portion CH is formed in a part of sheet material substrate FB.
(action of substrate board treatment)
Then, the action of above-mentioned such substrate board treatment 100 formed is described.
In the present embodiment, also perform that the connecting moves, the substrate supply unit 101 that are connected as substrate supply unit 101 with supply side connecting portion 102A by the substrate cartridge 1 having received sheet material substrate FB carry out in order supply the action of sheet material substrate FB by substrate cartridge 1, dismounting action that element that processing substrate portion 102 carries out forms action, substrate cartridge 1.
First, the connecting moves of substrate cartridge 1 is described.As shown in Figure 10, for supply side connecting portion 102A, insert port is formed as the shape corresponding with department of assembly 3.
In connecting moves, with the contraposition making substrate cartridge 1 state remained on supporting mass (such as same with the supporting mass HD shown in Fig. 8 and Fig. 9 formation) carry out department of assembly 3 and supply side connecting portion 102A.After contraposition, department of assembly 3 is made to move along+X side and be inserted into processing substrate portion 102.
At this moment, the terminal 3C of the department of assembly 3 and device side terminal 102C of supply side connecting portion 102A contacts with each other.Contacted with device side terminal 102C by terminal 3C, the communication of information can be carried out between the information retaining section IC of substrate cartridge 1 and 104 of control part 104.By this communication operation, the process information kept in information retaining section IC, reference information are delivered to control part 104.In addition, also can before the connecting moves of cylinder 1, information retaining section IC transmits above-mentioned information by the radio communication of carrying out between the Department of Communication Force CR and the Department of Communication Force 104CR of control part 104 of information retaining section IC to control part 104.
Then, supply action is described.When supplying sheet material substrate FB to processing substrate portion 102, such as make the rotating shaft member 26a of substrate cartridge 1 (roller portion 26) and jockey pulley 21a to contrary with during storage action towards rotation, as shown in figure 11, sheet material substrate FB is sent via peristome 34.
Then, illustrate that element forms action.Formed in action at element, as shown in Figure 2, from substrate supply unit, 101 pairs of processing substrate portions 102 supply sheet material substrate FB, while to forming element on this sheet material substrate FB in processing substrate portion 102.In processing substrate portion 102, as shown in figure 28, sheet material substrate FB is transmitted by roller RR.
Control part 104 also can control the action in processing substrate portion 102 based on the reference information supplied by substrate cartridge 1.Such as, control part 104 also can coordinate and supplies the speed of sheet material substrate FB to adjust the rotative speed of each roller RR in processing substrate portion 102 from substrate cartridge 1.In addition, whether control part 104 measuring roll RR, in Y direction skew, when there occurs skew, makes roller RR move correction position.In addition, control part 104 carries out the position correction of sheet material substrate FB in the lump.
First the sheet material substrate FB being supplied to processing substrate portion 102 by substrate supply unit 101 is sent to next door forming portion 91.In next door forming portion 91, utilize roller platen 110 and hot transfer roll 115 to clamp sheet material substrate FB and press, be transferred on sheet material substrate by heat and form next door BA and alignment mark AM.
Then, dismounting action is described.Such as on sheet material substrate FB, form organic EL element 50, and after having reclaimed sheet material substrate FB, the substrate cartridge 1 used as substrate supply unit 101 is pulled down from processing substrate portion 102.
Before carrying out above-mentioned each action, control part 104 can use the information transmitted by substrate cartridge 1 to process.Such as, control part 104 can judge the treatment state of sheet material substrate FB according to the process information read in the information retaining section IC from substrate cartridge 1 (substrate supply unit 101), and carries out following each action (supply action, element form action etc.) according to this treatment state.Such as, control part 104 is based on the defect information read in the information retaining section IC from substrate supply unit 101, judge whether to need the reparation for the defect part of sheet material substrate FB, or in the region forming element comprising defect part of sheet material substrate FB, or removal device 109C could be cut off by the defect part excision etc. of sheet material substrate FB the need of passing through.When being judged as that the defect part of sheet material substrate FB can not be repaired, control part 104 can control according to the mode not carrying out processing for this defect part.Thus, substrate board treatment 100 can reduce the cost (use amount of such as material, the coating time etc. of material) used in each process.In addition, when the defect part on sheet material substrate FB can be repaired, control part 104 can control according to being formed in above-mentioned next door the mode of carrying out the process of repairing this defect part in action, electrode formation action, luminescent layer formation action.In addition, control part 104 also can control according to carrying out storing reparation resume relevant with the reparation of this defect part processed in processing substrate portion 102 mode as the process of process information in the information retaining section IC of substrate recoverer 103.Here, above-mentioned reparation resume comprise the kind of defect, the reparation of defect part win or lose, the repair content repair text (such as restorative procedure, step) how carrying out repairing, repair the date etc.Control part 104 is according to when the reparation of defect part, and the mode of carrying out the reparation of this defect part based on above-mentioned reparation resume controls.Such as, the kind of the defect that comprises based on above-mentioned reparation resume of control part 104, the win or lose of reparation, the combination of repair content repair text set the best repair content for the defect part that will repair.
In addition, control part 104 also can control in the following manner: such as use droplet applying apparatus 120, droplet applying apparatus 140 etc., to abnormal part (such as defect part) being detected or be judged as that there is abnormal part directly forms the pattern that can identify between other parts according to the information from substrate cartridge 1 in a part of sheet material substrate FB.In this situation, as long as abnormal checking device 109D detects this pattern, therefore accuracy of detection improves.
In addition, when carrying out above-mentioned each action, when defect part being detected by the abnormal checking device 109D being arranged on the upstream side in processing substrate portion 102 shown in Figure 28 in one of sheet material substrate FB, control part 104 transmits the defect information relevant with this defect part to the information retaining section IC of substrate recoverer 103.Therefore, the process informations such as the defect information obtained in the process of above-mentioned each action can be stored in the information retaining section IC of substrate recoverer 103 by control part 104.Like this, control part 104 can make the process information obtained in each process in processing substrate portion 102 accumulate in substrate recoverer 103.Wherein, the process information of accumulation in substrate recoverer 103 is being used as information as described above in next manufacturing line etc.
In addition, when before carrying out above-mentioned each action, based on the process information that the information retaining section IC from substrate supply unit 101 reads, by control part 104 be determined as on sheet material substrate FB, defined next door BA time, control part 104 can omit this next door and forms action and carry out electrode below and form action etc.Then, control part 104 will omit that next door as described above forms action and treatment step that electrode below carrying out forms action upgrades as process information in the information retaining section IC of substrate recoverer 103.
In addition, after having carried out above-mentioned each action, control part 104 also can to the process information of substrate recoverer 103 transferring substrates supply unit 101.Under these circumstances, due to control part 104 to substrate recoverer 103 transmit based in processing substrate portion 102 to the process information of each process that sheet material substrate FB has carried out and the process information of substrate supply unit 101, so substrate recoverer 103 can keep to sheet material substrate FB carried out what kind of process wait process be used as process information through information.
In addition, when carrying out the cut-out of sheet material substrate FB in substrate cutting portion 108, by being formed with defect according to eliminating, the mode of part of otch cuts off, and the part being provided with this defect, otch can be removed effectively by substrate cutting portion 108.The part that can use as element in this removed part also can be recycled in addition.
Then, dismounting action is described.Such as on sheet material substrate FB, form organic EL element 50, and after having reclaimed sheet material substrate FB, the substrate cartridge 1 used as substrate supply unit 101 is unloaded from processing substrate portion 102.
Figure 22 is the figure of the dismounting action representing substrate cartridge 1.
As shown in figure 22, in dismounting action, by making department of assembly 3 move it unloaded from supply side connecting portion 102A along-X-direction, unload department of assembly 3.In this action, department of assembly 3 is removed along the guiding of supply side connecting portion 102A.
As mentioned above, according to the present embodiment, because substrate cartridge 1 possesses the cylinder main body 2 of storage sheet material substrate FB; With information retaining section IC, it keeps identifying the identifying information of cylinder main body 2 and being accommodated in the information of at least one party in the process information of the sheet material substrate FB in a main body 2; So processing substrate portion 102 can carry out suitable process based on this identifying information or process information to this sheet material substrate FB.
In addition, according to the present embodiment, due to substrate board treatment 100 possess process sheet material substrate FB processing substrate portion 102, carry out moving into processing substrate portion 102 the substrate supply unit 101 of sheet material substrate FB and carry out taking out of from processing substrate portion 102 the substrate recoverer 103 of substrate, and use substrate cartridge 1 as substrate supply unit 101, so processing substrate portion 102 can use the information from substrate cartridge 1 to carry out best process to sheet material substrate FB.Thus, the process for sheet material substrate FB in processing substrate portion 102 can effectively be carried out.
In addition, according to the present embodiment, owing to there is in the manufacturing process of display element the operation that processes sheet material substrate FB in processing substrate portion 102 and using substrate cartridge 1 to supply sheet material substrate FB to processing substrate portion 102 or reclaim the operation of sheet material substrate FB from processing substrate portion 102, so effectively display element can be manufactured under the information management of high level.
In addition, according to the present embodiment, the information such as the process information kept in the information retaining section IC of substrate cartridge 1 can be upgraded due to control part 104, so the substrate cartridge 1 used as substrate supply unit 101 can be re-used.
[the 5th embodiment]
Then, the 5th embodiment of the present invention is described.
In the present embodiment, to employ aforesaid substrate cylinder 1 this point respectively different from the 4th embodiment for substrate supply unit 201 and substrate recoverer 203.In the present embodiment, as shown in figure 23, substrate board treatment 200 also has substrate supply unit 201, processing substrate portion 202, substrate recoverer 203 and control part 204.
Processing substrate portion 202 becomes the formation such as not arranging substrate cutting portion 108 in the processing substrate portion 102 of the 4th embodiment.Therefore, the sheet material substrate FB in this processing substrate portion 202 after process cut-offly is not reclaimed by substrate recoverer 203 with sheet.
In addition, such as keep the formation of the identifying information of sheet material substrate FB, process information, the formation that can communicate between information retaining section IC with control part 204 etc. same with the formation illustrated in the 4th embodiment.
In recovery action, as shown in figure 24, while inserting sheet material substrate FB to the peristome 34 of substrate cartridge 1, insert protective substrate PB from the 2nd peristome 35.Protective substrate PB is such as supplied by not shown protective substrate supply unit.
As shown in figure 25, the sheet material substrate FB after insertion and protective substrate PB is guided by substrate-guided portion 22 and the 2nd substrate-guided portion 37 respectively, converges in fluidic junction 39.Sheet material substrate FB after converging in fluidic junction 39 and protective substrate PB as shown in figure 26, is transmitted by transport unit 21 with the state converged, and is touched by jockey pulley 21a and the 21b pressing of mensuration roller.Sheet material substrate FB and protective substrate PB is batched by roller portion 26 and reclaims under the state of contiguity.
Control part 204 when being reclaimed sheet material substrate FB by substrate recoverer 203, to the process information of the sheet material substrate FB after the information retaining section IC transmission processing of the substrate cartridge 1 used as substrate recoverer 203.Information retaining section IC receives this information of sending and is stored in storage part MR.
Like this, according to the present embodiment, due to substrate board treatment 200 possess process sheet material substrate FB processing substrate portion 202, carry out moving into processing substrate portion 202 the substrate supply unit 201 of sheet material substrate FB and carry out taking out of from processing substrate portion 202 the substrate recoverer 203 of substrate, and use substrate cartridge 1 as substrate supply unit 201 and substrate recoverer 203, so be delivered to from the process information of substrate cartridge 1 substrate cartridge 1 reclaiming destination.Thus, when when managing the substrate cartridge 1 of this recovery destination, to the sheet material substrate FB process be accommodated in the substrate cartridge 1 reclaiming destination, substrate board treatment 200 can use above-mentioned information.Thereby, it is possible to make the information management capability of substrate board treatment 200 improve, treatment effeciency is significantly improved.
In addition, present embodiment becomes the formation identical with the processing substrate portion 102 described in the 4th embodiment for processing substrate portion 202 and is illustrated, but is not limited to this.Such as in processing substrate portion 202, it also can be the formation of the part in the next door forming portion 91 in the formation processing substrate portion 102 be only provided with described in the 4th embodiment, electrode forming portion 92 and luminescent layer forming portion 93.
Such as, for only arrange next door forming portion 91 as processing substrate portion 202, the formation that do not arrange electrode forming portion 92 and luminescent layer forming portion 93 is described.In this situation, in processing substrate portion 202, sheet material substrate FB is recovered to substrate recoverer 203 with the state of the formation only having carried out next door BA.The sheet material substrate FB reclaimed by substrate recoverer 203 carries out electrode formation processing and luminescent layer formation processing in other processing substrate portion.
Because substrate cartridge 1 is configured to load and unload by opposing substrate handling part 202, so under these circumstances, unload substrate cartridge 1 from processing substrate portion 202, and substrate cartridge 1 is transmitted make it be connected with other processing substrate portion.The process information of the identifying information of substrate cartridge 1, sheet material substrate FB is maintained, so also this information can be used process in the processing substrate portion of connecting object in information retaining section IC due to this substrate cartridge 1.Like this, stride across multiple processing substrate portion when manufacturing on line at 1, and when this processing substrate portion can not carry out the communication of information each other, also can communicate via the information of substrate cartridge 1 to sheet material substrate FB.In this situation, information management capability also can be made to improve, treatment effeciency is significantly improved.
[the 6th embodiment]
Then, the 6th embodiment of the present invention is described.
In the present embodiment, be described for the situation can carrying out the communication of information in multiple processing substrate portion.
Figure 30 is the figure of the formation representing base plate processing system SYS of the present embodiment.
As shown in figure 30, base plate processing system SYS has the 1st substrate board treatment 300, the 2nd substrate board treatment 310 and main control unit CONT.1st substrate board treatment 300 and the 2nd substrate board treatment 310 are such as arranged in Same Site or in same factory.
1st substrate board treatment 300 is such as the device of the next door BA forming organic EL element 50 on sheet material substrate FB.2nd substrate board treatment 310 is such as on sheet material substrate FB, form electrode (gate electrode G etc.), the luminescent layer IR of organic EL element 50, the device of transparency electrode ITO.Like this, base plate processing system SYS becomes the formation that the device forming organic EL element 50 is divided into the device of the 1st substrate board treatment 300 and the 2nd these two kinds of substrate board treatment 310.
1st substrate board treatment 300 has substrate supply unit 301, processing substrate portion 302 and substrate recoverer 303.In the present embodiment, above-mentioned substrate cartridge 1 is employed as substrate supply unit 301 and substrate recoverer 303.
Processing substrate portion 302 has the formation identical with the next door forming portion 91 in the substrate board treatment 100 of the 4th embodiment respectively, and the part be connected with substrate supply unit 301 is provided with supply side connecting portion 302A.The formation of supply side connecting portion 302A becomes identical formation with the supply side connecting portion 102A in the 4th embodiment.Like this, the 1st substrate board treatment 300 has the formation identical with the formation of the next door forming portion 91 from the substrate supply unit 101 of substrate board treatment 100 to processing substrate portion 102 in the 4th embodiment.
In processing substrate portion 302, the connecting bridge of substrate recoverer 303 is provided with the recovery side connecting portion 302B be connected with the department of assembly 3 of substrate cartridge 1.Reclaim side connecting portion 302B and become the formation identical with supply side connecting portion 302A.
2nd substrate board treatment 310 has substrate supply unit 311, processing substrate portion 312 and substrate recoverer 313, becomes the formation identical with the 1st substrate board treatment 300 in each portion.Processing substrate portion 312 has the formation identical with the electrode forming portion 92 in the substrate board treatment 100 of the 4th embodiment and luminescent layer forming portion 93.
In the 2nd substrate board treatment 310, use above-mentioned substrate cartridge 1 as substrate supply unit 311 and substrate recoverer 313.In addition, to unload and the substrate recoverer 303 (substrate cartridge 1) sending the 2nd substrate board treatment 310 to is used as the substrate supply unit 311 of the 2nd substrate board treatment 310 from the 1st substrate board treatment 300.Therefore, substrate cartridge 1 also plays a role as from the 1st substrate board treatment 300 to the relay of the 2nd substrate board treatment 310 relaying sheet material substrate FB.
Main control unit CONT is connected with the 1st substrate board treatment 300 and the 2nd substrate board treatment 310 respectively via wired or wireless communication agency, unified these the 1st substrate board treatments 300 of control and the 2nd substrate board treatment 310.Therefore, in main control unit CONT, the information that can keep in the information retaining section IC of substrate cartridge 1 that uses of unified management the 1st substrate board treatment 300 and the 2nd substrate board treatment 310.
Like this, in the present embodiment, be maintained at the information in the information retaining section IC of substrate cartridge 1 due to main control unit CONT unified management, so the information management capability of base plate processing system SYS can be made to improve, the treatment effeciency of base plate processing system SYS significantly improved.
Such as, when as in the present embodiment, during manufacture line by unified management organic EL element 50 such as control part 104, main control unit CONT, the information retaining section IC of substrate cartridge 1 also can become the formation only keeping identifying information.When passing through the manufacture line of main control unit CONT unified management organic EL element 50, the main storage portion MMR (with reference to Figure 27) of such as main control unit CONT has the process information corresponding with identifying information, main control unit CONT can carry out identifying processing information based on the identifying information of substrate cartridge 1, carries out the process based on this process information.As concrete example, when as shown in figure 28, when comprising the defect information of sheet material substrate FB in process information, the process (reparation of such as defect part) that main control unit CONT carries out based on this defect information to read the defect information corresponding with the identifying information read from information retaining section IC from main storage portion MMR, and to the 1st substrate board treatment 300 or the 2nd substrate board treatment 310 transmission processing signal.Processing signals is such as making the 1st substrate board treatment 300 etc. carry out the command signals such as the setting value of each process.Such as, in addition, when utilizing the manufacture line of control part 104 unified management organic EL element 50, as long as use control part 104 to replace main control unit CONT.Thus, the treatment effeciency of the 1st substrate board treatment 300 or the 2nd substrate board treatment 310 improves.
Technical scope of the present invention is not limited to above-mentioned embodiment, can suitably be changed without departing from the scope of the subject in the invention.
Such as, forming apparatus 109A shown in Figure 28, detecting device 109B, the cut-out removal device 109C and abnormal checking device 109D of the 4th embodiment are only examples, also can be the configuration different from the configuration shown in Fig. 3, can also be the formation not arranging a part of device.
Such as when not arranging cut-out removal device 109C, processing substrate portion 102 also can become the formation using aforesaid substrate shutoff device 108 to remove a part of this sheet material substrate FB.In addition, also can configure multiple forming apparatus 109A, detecting device 109B respectively and cut off removal device 109C.Abnormal checking device 109D is not limited to the formation in each downstream being configured in next door forming portion 91, electrode forming portion 92 and luminescent layer forming portion 93, also can be formed as the formation suitably omitting or increase number.
In addition, above-mentioned pattern P TN etc. such as also can use the droplet applying apparatus 120 of the roller platen 110 of next door forming portion 91, hot transfer roll 115, electrode forming portion 92, the droplet applying apparatus 140 etc. of luminescent layer forming portion 93 is formed on sheet material substrate FB.In addition, pattern P TN also can be previously formed on sheet material substrate FB.
In addition, formation represents that the encoder-pattern of the position of X-direction is an example as the formation of the pattern P TN in above-mentioned explanation, and encoder-pattern also can be previously formed on sheet material substrate FB.In addition, such as when the position of Y-direction of sheet material substrate FB being detected, substrate board treatment 102 can become such as use measurement and detect the formation of the position of Y-direction with the edge of Y-direction of sheet material substrate FB, the measuring device etc. of the distance (distance in Y-direction) of pattern P TN.In addition, the formation arranged in addition in processing substrate portion 102 detecting device that the position coordinate of the lattice-shaped be located on the XY direction of sheet material substrate FB detects can also be become.
In addition, in above-mentioned 4th embodiment and the 5th embodiment, only to use the formation of substrate cartridge 1 to the substrate supply unit in processing substrate portion, to use the formation of substrate cartridge 1 to be illustrated to the substrate supply unit in processing substrate portion and substrate recoverer both sides, but it also can be such as the formation only substrate recoverer being used to substrate cartridge 1.
Description of reference numerals: 50 ... organic EL element; FB ... sheet material substrate; IC ... information retaining section; SYS ... base plate processing system; CONT ... main control unit; 1 ... substrate cartridge; 2 ... cylinder main body; 100,200 ... substrate board treatment; 300 ... 1st substrate board treatment; 310 ... 2nd substrate board treatment; 320 ... processing equipment; 101,201,301,311 ... substrate supply unit; 102,202,302,312 ... processing substrate portion; 103,203,303,313 ... substrate recoverer; 104,204 ... control part.
Claims (28)
1. a substrate cartridge, is the substrate cartridge that the length dimension that the sheet material substrate with flexual band shape can be batched regulation carries out accommodating, it is characterized in that possessing:
Cylinder main body, it possesses the spindle unit batching described sheet material substrate in inside, and has the peristome for making described sheet material substrate come in and go out;
Department of assembly, it is located at this main body, connects into can load and unload with the external connecting of the processing equipment of the described sheet material substrate of process;
Base plate driving mechanism, it carries out the described introducing of sheet material substrate and at least one party in sending;
Test section, it is arranged at affiliated cylinder main body, measures by the conveying distance of described base plate driving mechanism to described sheet material substrate; And
Information retaining section, it keeps and the material of described substrate of receiving in described cylinder main body, pliability, resistance to effect of heat, wearability, retractility, coefficient of expansion, friction coefficient, stretch resistance, with the lyophily of the regulation liquid be attached on described substrate, and the specification information that in each specification value of the drying property of described regulation liquid on described substrate at least 1 is relevant, with the technique information of combination determining the multiple processed in units set according to described specification information, and the whole length of the described sheet material substrate to calculate according to the measurement performed by described test section.
2. substrate cartridge according to claim 1, is characterized in that,
Described information retaining section also stores the defect information of described sheet material substrate.
3. substrate cartridge according to claim 2, is characterized in that,
Described information retaining section also stores the location information of the defect part of described sheet material substrate.
4. substrate cartridge according to claim 3, is characterized in that,
Described information retaining section also stores the defect resume of the described defect part of described sheet material substrate.
5. substrate cartridge according to claim 3, is characterized in that,
Described information retaining section also stores the distance between the end of described sheet material substrate and described defect part.
6. substrate cartridge according to claim 3, is characterized in that,
Described location information comprises the distance between mark and described defect part being formed in described sheet material substrate.
7. substrate cartridge according to claim 1, is characterized in that,
Described information retaining section also stores by the progress information of described processing equipment for the predetermined processing of described sheet material substrate.
8. substrate cartridge according to claim 1, is characterized in that,
Described information retaining section also stores the cambial shape information formed on described sheet material substrate by described processing equipment.
9. substrate cartridge according to claim 1, is characterized in that,
The described specification information kept in described information retaining section comprises the shape information relevant with the shape of described sheet material substrate.
10. substrate cartridge according to claim 1, is characterized in that,
Described sheet material substrate is connected by multiple unit substrate and is formed,
Described information retaining section also stores the information relevant with the position of described unit substrate connecting bridge each other.
11. substrate cartridges according to claim 1, is characterized in that,
Described information retaining section be configured to described cylinder body portion from.
12. substrate cartridges according to claim 1, is characterized in that,
Multiple positions of described cylinder main body are provided with described information retaining section.
13. substrate cartridges according to claim 1, is characterized in that,
Described information retaining section comprises the Department of Communication Force of at least one party in the transmission and reception carrying out described information.
14. substrate cartridges according to claim 13, is characterized in that,
Described information retaining section keeps identifying information,
Described Department of Communication Force receives described specification information, described technique information according to described identifying information.
15. substrate cartridges according to claim 1, is characterized in that,
Described department of assembly has the portion of terminal be electrically connected with described information retaining section by described processing equipment.
16. substrate cartridges according to claim 1, is characterized in that,
Described information retaining section has the display part of at least one of whole length of the described specification information of display, described sheet material substrate.
17. substrate cartridges according to claim 14, is characterized in that,
Described information retaining section possesses the storage part storing described specification information, described technique information corresponding to described identifying information.
18. 1 kinds of substrate board treatments, is characterized in that possessing:
The handling part of process sheet material substrate, the substrate loading unit of carrying out moving into described sheet material substrate to described handling part and the substrate carrying out taking out of from described handling part described sheet material substrate take out of portion,
And utilize described substrate cartridge according to claim 1 to take out of at least one party in portion as described substrate loading unit and described substrate.
19. substrate board treatments according to claim 18, is characterized in that,
The described technique information kept in the described information retaining section of described substrate cartridge is used in the described process of described handling part.
20. substrate board treatments according to claim 18 or 19, is characterized in that,
Also possesses the external connecting of the device side be electrically connected between described substrate cartridge.
21. substrate board treatments according to claim 18, is characterized in that,
Described handling part has the device side Department of Communication Force of the transmission of carrying out described specification information or described technique information between described substrate cartridge and at least one party in receiving.
22. substrate board treatments according to claim 18, is characterized in that,
The described information retaining section also possessed to described substrate cartridge sends the control part of described technique information.
23. substrate board treatments according to claim 22, is characterized in that,
Described handling part has the cutting portion of described sheet material substrate cutting,
Described control part sends the information relevant with the position of the described sheet material substrate cut off by described cutting portion to described information retaining section.
24. substrate board treatments according to claim 22 or 23, is characterized in that,
Described handling part has the test section detected the abnormal portion on described sheet material substrate,
Described control part sends the information relevant with the position of the described sheet material substrate detected by described test section to described information retaining section.
25. substrate board treatments according to claim 18, is characterized in that,
Also possess the information assigning unit of giving described information to described sheet material substrate,
Described information assigning unit corresponds to the described information kept in described information retaining section and gives described information to described sheet material substrate.
26. 1 kinds of base plate processing systems, is characterized in that possessing:
The substrate board treatment for the treatment of substrate;
The substrate cartridge according to claim 14 be connected with described substrate board treatment; With
Main control unit, it accepts described specification information or described technique information from the described information retaining section of described substrate cartridge, and controls described substrate board treatment based on described technique information.
27. base plate processing systems according to claim 26, is characterized in that,
Described main control unit possesses the main storage portion that the described identifying information kept with described information retaining section stores described technique information accordingly.
28. 1 kinds of substrate processing method using sames are to processing equipment supply sheet material substrate while process described sheet material substrate, and the substrate processing method using same of described sheet material substrate after recycling, it is characterized in that,
A substrate cartridge according to claim 1 to be supply connected with the external connecting of described processing equipment with substrate cartridge described sheet material substrate is supplied to described processing equipment,
Another substrate cartridge according to claim 1 to be connected with the external connecting of described processing equipment with substrate cartridge as recovery and to reclaim the described sheet material substrate after by described processing equipment process,
The described specification information that described processing equipment keeps based on the described information retaining section of described supply substrate cartridge or described technique information process described sheet material substrate, further, the process carried out for described sheet material substrate is passed to the described information retaining section of described recovery substrate cartridge through information.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009253976A JP2011098809A (en) | 2009-11-05 | 2009-11-05 | Substrate cartridge, substrate processing device, substrate processing system, substrate processing method, control device and method of manufacturing display element |
| JP2009-253976 | 2009-11-05 | ||
| JP2009253975A JP2011098808A (en) | 2009-11-05 | 2009-11-05 | Substrate cartridge, substrate processing device, substrate processing system, substrate processing method, control device and method of manufacturing display element |
| JP2009-253975 | 2009-11-05 | ||
| PCT/JP2010/069684 WO2011055781A1 (en) | 2009-11-05 | 2010-11-05 | Substrate cartridge, substrate processing apparatus, substrate processing system, substrate processing method, control apparatus, and method for manufacturing display element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102574659A CN102574659A (en) | 2012-07-11 |
| CN102574659B true CN102574659B (en) | 2016-02-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201080048076.1A Active CN102574659B (en) | 2009-11-05 | 2010-11-05 | The manufacture method of substrate cartridge, substrate board treatment, base plate processing system, substrate processing method using same, control setup and display element |
Country Status (5)
| Country | Link |
|---|---|
| KR (1) | KR101678716B1 (en) |
| CN (1) | CN102574659B (en) |
| HK (1) | HK1171728A1 (en) |
| TW (1) | TWI538861B (en) |
| WO (1) | WO2011055781A1 (en) |
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| JPH01158360A (en) * | 1987-12-16 | 1989-06-21 | Fuji Photo Film Co Ltd | Test film cassette |
| EP0456388A1 (en) * | 1990-05-08 | 1991-11-13 | International Business Machines Corporation | Processing high-density circuit substrates and container for use in such processing |
| JPH04219805A (en) * | 1990-12-20 | 1992-08-10 | Ikegai Corp | Continuous machining method for different kind of work |
| JP2000272784A (en) * | 1999-01-18 | 2000-10-03 | Seiko Instruments Inc | Printing paper assembly of photosensitive microcapsule type, and printer and printing system using it |
| JP4759292B2 (en) * | 2005-03-10 | 2011-08-31 | 株式会社イシダ | Packaging material container |
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| US8801307B2 (en) * | 2009-09-25 | 2014-08-12 | Nikon Corporation | Substrate cartridge, substrate processing apparatus, substrate processing system, control apparatus, and method of manufacturing display element |
| JP5556105B2 (en) * | 2009-09-25 | 2014-07-23 | 株式会社ニコン | Substrate cartridge, substrate processing apparatus, substrate processing system, control apparatus, and display element manufacturing method |
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2010
- 2010-11-04 TW TW099137889A patent/TWI538861B/en active
- 2010-11-05 KR KR1020127006524A patent/KR101678716B1/en active IP Right Grant
- 2010-11-05 CN CN201080048076.1A patent/CN102574659B/en active Active
- 2010-11-05 WO PCT/JP2010/069684 patent/WO2011055781A1/en active Application Filing
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2012
- 2012-12-07 HK HK12112641.4A patent/HK1171728A1/en not_active IP Right Cessation
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| JPS62123735A (en) * | 1985-11-22 | 1987-06-05 | Mitsubishi Electric Corp | Wafer cassette |
| JPH03138958A (en) * | 1989-10-24 | 1991-06-13 | Seiko Epson Corp | Wafer carrier and method of identifying wafer carrier |
| JPH08293540A (en) * | 1995-04-24 | 1996-11-05 | Sony Corp | Substrate holding device |
| JP2003100843A (en) * | 2001-09-26 | 2003-04-04 | Dainippon Screen Mfg Co Ltd | Method for managing substrate, system for processing substrate and mounting table |
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| CN1841649A (en) * | 2005-03-31 | 2006-10-04 | 富士通株式会社 | Manufacturing managing method of semiconductor devices and a semiconductor substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101678716B1 (en) | 2016-11-23 |
| TWI538861B (en) | 2016-06-21 |
| WO2011055781A1 (en) | 2011-05-12 |
| KR20120092098A (en) | 2012-08-20 |
| HK1171728A1 (en) | 2013-04-05 |
| TW201132565A (en) | 2011-10-01 |
| CN102574659A (en) | 2012-07-11 |
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