WO2011055781A1 - Substrate cartridge, substrate processing apparatus, substrate processing system, substrate processing method, control apparatus, and method for manufacturing display element - Google Patents
Substrate cartridge, substrate processing apparatus, substrate processing system, substrate processing method, control apparatus, and method for manufacturing display element Download PDFInfo
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- WO2011055781A1 WO2011055781A1 PCT/JP2010/069684 JP2010069684W WO2011055781A1 WO 2011055781 A1 WO2011055781 A1 WO 2011055781A1 JP 2010069684 W JP2010069684 W JP 2010069684W WO 2011055781 A1 WO2011055781 A1 WO 2011055781A1
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- substrate
- information
- unit
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- cartridge
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H16/00—Unwinding, paying-out webs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/10—Handled articles or webs
- B65H2701/12—Surface aspects
- B65H2701/124—Patterns, marks, printed information
- B65H2701/1242—Patterns, marks, printed information printed information
- B65H2701/12422—Patterns, marks, printed information printed information codes or the like which can be used for further processing, e.g. relative to consumed or still available material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/10—Handled articles or webs
- B65H2701/18—Form of handled article or web
- B65H2701/184—Wound packages
- B65H2701/1849—Wound packages in cartridge or similar packaging device
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/10—Handled articles or webs
- B65H2701/19—Specific article or web
- B65H2701/1942—Web supporting regularly spaced non-adhesive articles
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
Definitions
- the present invention relates to a substrate cartridge, a substrate processing apparatus, a substrate processing system, a substrate processing method, a control device, and a display element manufacturing method.
- an organic electroluminescence (organic EL) element As a display element constituting a display device such as a display device, for example, an organic electroluminescence (organic EL) element is known.
- the organic EL element has an anode and a cathode on a substrate and an organic light emitting layer sandwiched between the anode and the cathode.
- holes are injected from an anode into an organic light emitting layer to combine holes and electrons in the organic light emitting layer, and display light can be obtained by emitted light at the time of the combination.
- an electric circuit connected to, for example, an anode and a cathode is formed on a substrate.
- a method for producing an organic EL element for example, a method called a roll-to-roll method (hereinafter simply referred to as “roll method”) is known (for example, see Patent Document 1).
- roll method a single sheet-like substrate wound around a substrate supply side roller is sent out, and the substrate is transported while being wound up by a substrate recovery side roller.
- a light emitting layer, an anode, a cathode, an electric circuit, and the like constituting an organic EL element are sequentially formed on a substrate in a processing apparatus.
- a substrate feeding roller and a substrate winding roller are detachable from the processing apparatus.
- the removed roller is conveyed to, for example, another processing apparatus, and can be used by being attached to the other processing apparatus.
- aspects of the present invention provide a substrate cartridge, a substrate processing apparatus, a substrate processing system, a substrate processing method, a control apparatus, and a display element manufacturing method that enable efficient processing on a substrate.
- a substrate cartridge comprising a cartridge main body that accommodates a substrate, and an information holding unit that retains information including at least specification information relating to specification values of the substrate accommodated in the cartridge main body.
- a cartridge main body that accommodates a substrate, and an information holding unit that holds information including process information based on at least specification information relating to the specification value of the substrate accommodated in the cartridge main body.
- a substrate cartridge is provided.
- the apparatus includes a substrate processing unit that processes a substrate, a substrate loading unit that loads a substrate into the substrate processing unit, and a substrate unloading unit that unloads the substrate from the substrate processing unit,
- a substrate processing apparatus in which the substrate cartridge of the present invention is used as at least one of the substrate carry-in portion and the substrate carry-out portion is provided.
- the substrate processing apparatus for processing the substrate the substrate cartridge of the present invention connected to the substrate processing apparatus, and information from the information holding unit of the substrate cartridge are received, and the information is There is provided a substrate processing system including a main control device for controlling the substrate processing apparatus based on the above.
- a substrate processing method for processing a substrate while supplying the substrate and collecting the processed substrate wherein the substrate supply and substrate are performed using the substrate cartridge of the present invention.
- a substrate processing method for performing at least one of the recovery operations and processing the substrate using information obtained through the substrate cartridge is provided.
- a control device comprising a main control unit for controlling a substrate processing apparatus for processing a substrate and a substrate cartridge of the present invention connected to the substrate processing apparatus.
- a step of processing a substrate in the substrate processing unit and a step of supplying a substrate to the substrate processing unit or collecting a substrate from the substrate processing unit using the substrate cartridge of the present invention.
- a method for manufacturing a display element is provided.
- the cartridge main body that stores the substrate
- the information holding unit that holds at least one of the identification information for identifying the cartridge main body and the processing information of the substrate stored in the cartridge main body, A substrate cartridge is provided.
- the apparatus includes a substrate processing unit that processes a substrate, a substrate carry-in unit that carries a substrate into the substrate processing unit, and a substrate carry-out unit that carries out the substrate from the substrate processing unit.
- a substrate processing apparatus in which the substrate cartridge of the present invention is used as at least one of the substrate carry-in portion and the substrate carry-out portion is provided.
- the substrate processing apparatus for processing the substrate receives information
- the substrate cartridge of the present invention connected to the substrate processing apparatus, and the information holding unit of the substrate cartridge receive information
- a substrate processing system includes a main controller that controls the substrate processing apparatus based on the information.
- a substrate processing method for performing at least one of the recovery operations and processing the substrate using information obtained through the substrate cartridge is provided.
- a control device comprising a main control unit for controlling a substrate processing apparatus for processing a substrate and a substrate cartridge of the present invention connected to the substrate processing apparatus.
- a step of processing a substrate in the substrate processing unit and a step of supplying a substrate to the substrate processing unit or recovering the substrate from the substrate processing unit using the substrate cartridge of the present invention.
- a method for manufacturing a display element is provided.
- efficient processing can be performed on the substrate.
- FIG. 1 is a configuration diagram of an organic EL element according to a first embodiment of the present invention.
- 1 is a cross-sectional view of an organic EL element according to a first embodiment of the present invention.
- 1 is a cross-sectional view of an organic EL element according to a first embodiment of the present invention.
- FIG. 3 is a cross-sectional view illustrating a configuration of a substrate cartridge according to the embodiment.
- the figure which shows the structure of the control part which concerns on this embodiment The figure which shows the accommodation operation
- movement of the droplet which concerns on this embodiment The figure which shows the structure of the thin film formed between the partition walls concerning this embodiment.
- substrate which concerns on this embodiment The figure which shows the process of cut
- FIG. 1A is a plan view showing a configuration of an organic EL element.
- 1B is a cross-sectional view taken along line bb in FIG. 1A.
- 1C is a cross-sectional view taken along the line cc in FIG. 1A.
- a gate insulating layer I is formed on the gate electrode G.
- a source electrode S of the source bus line SBL is formed on the gate insulating layer I, and a drain electrode D connected to the pixel electrode P is formed.
- An organic semiconductor layer OS is formed between the source electrode S and the drain electrode D. This completes the field effect transistor.
- a light emitting layer IR is formed on the pixel electrode P, and a transparent electrode ITO is formed on the light emitting layer IR.
- a partition wall BA (bank layer) is formed on the sheet substrate FB.
- source bus lines SBL are formed between the barrier ribs BA.
- the gate bus line GBL is also formed between the partition walls BA in the same manner as the source bus line SBL.
- the organic EL element 50 is suitably used for a display device such as a display device and a display unit of an electronic device.
- a display device such as a display device and a display unit of an electronic device.
- an organic EL element 50 formed in a panel shape is used.
- TFT thin film transistor
- a pixel electrode In manufacturing such an organic EL element 50, it is necessary to form a substrate on which a thin film transistor (TFT) and a pixel electrode are formed.
- TFT thin film transistor
- a pixel electrode In order to accurately form one or more organic compound layers (light-emitting element layers) including a light-emitting layer on the pixel electrode on the substrate, a partition BA (bank layer) is easily and accurately formed in the boundary region of the pixel electrode. It is desirable.
- FIG. 2 is a schematic diagram illustrating a configuration of a substrate processing apparatus 100 that performs processing using a flexible sheet substrate FB.
- the substrate processing apparatus 100 is an apparatus that forms the organic EL element 50 shown in FIG. 1 using a strip-shaped sheet substrate FB.
- the substrate processing apparatus 100 includes a substrate supply unit 101, a substrate processing unit 102, a substrate collection unit 103, and a control unit 104.
- the sheet substrate FB is transported from the substrate supply unit 101 to the substrate recovery unit 103 via the substrate processing unit 102.
- the control unit 104 controls the overall operation of the substrate processing apparatus 100.
- the control unit 104 includes a database 104DB that is a storage unit that stores information.
- an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system.
- the sheet substrate FB is conveyed in the X-axis direction
- the direction orthogonal to the X-axis direction is the Y-axis direction
- the direction orthogonal to the X-axis direction and the Y-axis direction (that is, the vertical direction) is Z.
- Z Axial direction.
- the rotation (inclination) directions around the X axis, Y axis, and Z axis are the ⁇ X, ⁇ Y, and ⁇ Z directions, respectively.
- the sheet substrate FB for example, a heat-resistant resin film, stainless steel, or the like can be used.
- the resin film is made of polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, vinyl acetate resin, etc. Can be used.
- the dimension in the Y direction of the sheet substrate FB is, for example, about 1 m to 2 m, and the dimension in the X direction is, for example, 10 m or more. Of course, this dimension is only an example and is not limited thereto.
- the dimension in the Y direction of the sheet substrate FB may be 50 cm or less, or 2 m or more.
- substrate FB may be 10 m or less.
- the flexibility in the present embodiment refers to the property that the substrate can be bent without being broken or broken even when a predetermined force of at least its own weight is applied to the substrate. Further, for example, the property of bending by the predetermined force is also included in the flexibility. The flexibility varies depending on the material, size, thickness, environment such as temperature, etc. of the substrate.
- substrate FB you may use the sheet
- the sheet substrate FB preferably has a smaller coefficient of thermal expansion so that the dimensions do not change even when subjected to heat of about 200 ° C., for example.
- an inorganic filler can be mixed with a resin film to reduce the thermal expansion coefficient.
- the inorganic filler include titanium oxide, zinc oxide, alumina, silicon oxide and the like.
- the substrate supply unit 101 is connected to a supply side connection unit 102 ⁇ / b> A provided in the substrate processing unit 102.
- the substrate supply unit 101 supplies, for example, the sheet substrate FB wound in a roll shape to the substrate processing unit 102.
- the substrate recovery unit 103 recovers the sheet substrate FB that has been processed by the substrate processing unit 102.
- FIG. 3 is a diagram illustrating a configuration of the substrate processing unit 102.
- the substrate processing unit 102 includes a transport unit 105, an element forming unit 106, an alignment unit 107, and a substrate cutting unit 108.
- the substrate processing unit 102 forms each component of the organic EL element 50 on the sheet substrate FB while conveying the sheet substrate FB supplied from the substrate supply unit 101, and the sheet on which the organic EL element 50 is formed. This is the part that sends out the substrate FB to the substrate recovery unit 103.
- the transport unit 105 has a plurality of rollers RR arranged at positions along the X direction.
- the sheet substrate FB is also transported in the X-axis direction by the rotation of the roller RR.
- the roller RR may be a rubber roller that sandwiches the sheet substrate FB from both sides, or may be a roller RR with a ratchet as long as the sheet substrate FB has perforation.
- some of the rollers RR are movable in the Y-axis direction orthogonal to the transport direction.
- the element forming unit 106 includes a partition forming unit 91, an electrode forming unit 92, and a light emitting layer forming unit 93.
- the partition wall forming portion 91, the electrode forming portion 92, and the light emitting layer forming portion 93 are arranged in the order of the partition wall forming portion 91, the electrode forming portion 92, and the light emitting layer forming portion 93 from the upstream side to the downstream side in the transport direction of the sheet substrate FB. ing.
- each structure of the element formation part 106 is demonstrated.
- the partition wall forming unit 91 includes an imprint roller 110 and a thermal transfer roller 115.
- the partition forming unit 91 forms the partition BA on the sheet substrate FB sent from the substrate supply unit 101.
- the sheet substrate FB is pressed by the imprint roller 110, and the sheet substrate FB is heated to the glass transition point or more by the thermal transfer roller 115 so that the pressed partition wall BA maintains its shape. Therefore, the mold shape formed on the roller surface of the imprint roller 110 is transferred to the sheet substrate FB.
- the sheet substrate FB is heated to, for example, about 200 ° C. by the thermal transfer roller 115.
- the roller surface of the imprint roller 110 is mirror-finished, and a fine imprint mold 111 made of a material such as SiC or Ta is attached to the roller surface.
- the fine imprint mold 111 forms a thin film transistor wiring stamper and a color filter stamper.
- the imprint roller 110 forms the alignment mark AM on the sheet substrate FB using the fine imprint mold 111.
- the fine imprint mold 111 has a stamper for the alignment marks AM.
- the electrode forming portion 92 is provided on the + X side of the partition wall forming portion 91, and for example, a thin film transistor using an organic semiconductor is formed. Specifically, after forming the gate electrode G, the gate insulating layer I, the source electrode S, the drain electrode D, and the pixel electrode P as shown in FIG. 1, the organic semiconductor layer OS is formed.
- the thin film transistor may be an inorganic semiconductor type or an organic semiconductor type.
- an inorganic semiconductor thin film transistor an amorphous silicon type is known, but a thin film transistor using an organic semiconductor may be used. If a thin film transistor is formed using this organic semiconductor, the thin film transistor can be formed by utilizing a printing technique or a droplet coating technique.
- the field effect transistor (FET) as shown in FIG. 1 is particularly preferable.
- the electrode forming unit 92 includes a droplet applying device 120, a heat treatment device BK, a cutting device 130, and the like.
- a droplet applying device 120 for example, a droplet applying device 120G used when forming the gate electrode G, a droplet applying device 120I used when forming the gate insulating layer I, the source electrode S, A droplet applying device 120SD used when forming the drain electrode D and the pixel electrode P, a droplet applying device 120OS used when forming the organic semiconductor OS, and the like are used.
- FIG. 4 is a plan view showing the configuration of the droplet applying apparatus 120.
- FIG. 4 shows a configuration when the droplet applying device 120 is viewed from the + Z side.
- the droplet applying device 120 is formed long in the Y-axis direction.
- the droplet applying device 120 is provided with a driving device (not shown).
- the droplet applying device 120 can be moved, for example, in the X direction, the Y direction, and the ⁇ Z direction by the driving device.
- a plurality of nozzles 122 are formed in the droplet applying device 120.
- the nozzle 122 is provided on the surface of the droplet applying device 120 that faces the sheet substrate FB.
- the nozzles 122 are arranged, for example, along the Y-axis direction, and two rows (nozzle rows) of the nozzles 122 are formed, for example.
- the control unit 104 can apply the droplets to all the nozzles 122 at once, and can individually adjust the timing of applying the droplets to each nozzle 122.
- an inkjet method or a dispenser method can be employed.
- the inkjet method include a charge control method, a pressure vibration method, an electromechanical conversion method, an electrothermal conversion method, and an electrostatic suction method.
- the use of the material is less wasteful, and a desired amount of the material can be accurately disposed at a desired position.
- the amount of one drop of metal ink applied by the droplet application method is, for example, 1 to 300 nanograms.
- the droplet applying device 120G applies metal ink into the partition wall BA of the gate bus line GBL.
- the droplet applying device 120I applies an electrically insulating ink of polyimide resin or urethane resin to the switching unit.
- the droplet applying device 120SD applies metal ink in the partition BA of the source bus line SBL and in the partition BA of the pixel electrode P.
- the droplet applying device 120OS applies the organic semiconductor ink to the switching unit between the source electrode S and the drain electrode D.
- Metal ink is a liquid in which a conductor having a particle diameter of about 5 nm is stably dispersed in a solvent at room temperature, and carbon, silver (Ag), gold (Au), or the like is used as the conductor.
- the compound forming the organic semiconductor ink may be a single crystal material family or an amorphous material, and may be a low molecule or a polymer. Particularly preferred among the compounds forming the organic semiconductor ink include a single crystal or ⁇ -conjugated polymer of a condensed ring aromatic hydrocarbon compound typified by pentacene, triphenylene, anthracene and the like.
- the heat treatment apparatus BK is disposed on the + X side (downstream side in the substrate transport direction) of each droplet applying apparatus 120.
- the heat treatment apparatus BK can radiate, for example, hot air or far infrared rays to the sheet substrate FB.
- the heat treatment apparatus BK uses these radiant heats to dry or bake (bake) the droplets applied to the sheet substrate FB and harden them.
- the cutting device 130 is provided on the + X side of the droplet applying device 120SD and on the upstream side of the droplet applying device 120OS.
- the cutting device 130 cuts the source electrode S and the drain electrode D formed by the droplet applying device 120SD using, for example, laser light.
- the cutting device 130 includes a light source (not shown) and a galvanometer mirror 131 that irradiates the laser light from the light source onto the sheet substrate FB.
- a laser having a wavelength to be absorbed is preferable for the metal film to be cut. Further, by using a pulsed laser, thermal diffusion can be prevented and damage other than the cut portion can be reduced.
- a femtosecond laser with a wavelength of 760 nm is preferable.
- a femtosecond laser irradiation unit using a titanium sapphire laser as a light source is used.
- the femtosecond laser irradiation unit irradiates the laser beam LL with a pulse of 10 KHz to 40 KHz, for example.
- the distance between the source electrode S and the drain electrode D that determines the performance of the field effect transistor can be accurately cut. ing.
- the distance between the source electrode S and the drain electrode D is, for example, about 3 ⁇ m to about 30 ⁇ m.
- a carbon dioxide laser or a green laser can be used.
- the galvanometer mirror 131 is disposed in the optical path of the laser beam LL.
- the galvanometer mirror 131 reflects the laser beam LL from the light source onto the sheet substrate FB.
- the galvanometer mirror 131 is provided to be rotatable in the ⁇ X direction, the ⁇ Y direction, and the ⁇ Z direction, for example. As the galvano mirror 131 rotates, the irradiation position of the laser beam LL changes.
- a thin film transistor or the like can be formed by utilizing a printing technique or a droplet coating method technique without using a so-called photolithography process. Yes.
- a printing technique a droplet coating technique, or the like
- the partition wall BA is formed by using the partition wall forming portion 91, ink bleeding and spreading are prevented.
- the distance between the source electrode S and the drain electrode D that determines the performance of the thin film transistor is formed by laser processing or machining.
- the light emitting layer forming portion 93 is disposed on the + X side of the electrode forming portion 92.
- the light emitting layer forming unit 93 forms, for example, the light emitting layer IR and the pixel electrode ITO which are components of the organic EL device on the sheet substrate FB on which the electrodes are formed.
- the light emitting layer forming unit 93 includes a droplet applying device 140 and a heat treatment device BK.
- the light emitting layer IR formed by the light emitting layer forming portion 93 contains a host compound and a phosphorescent compound (also referred to as a phosphorescent compound).
- the host compound is a compound contained in the light emitting layer.
- a phosphorescent compound is a compound in which light emission from an excited triplet is observed and emits phosphorescence at room temperature.
- a droplet applying device 140 for example, a droplet applying device 140Re that forms a red light emitting layer, a droplet applying device 140Gr that forms a green light emitting layer, a droplet applying device 140Bl that forms a blue light emitting layer, an insulating material.
- a droplet applying device 140I that forms a layer, a droplet applying device 140IT that forms a pixel electrode ITO, and the like are used.
- an ink jet method or a dispenser method can be adopted as in the case of the droplet applying device 120 described above.
- a device for forming these layers for example, a droplet applying device
- the droplet applying device 140Re applies the R solution onto the pixel electrode P.
- the discharge amount of the R solution is adjusted so that the film thickness after drying becomes 100 nm.
- the R solution for example, a solution obtained by dissolving a red dopant material in 1,2-dichloroethane in polyvinyl carbazole (PVK) as a host material is used.
- the droplet applying device 140Gr applies the G solution onto the pixel electrode P.
- the G solution for example, a solution in which a green dopant material is dissolved in 1,2-dichloroethane in a host material PVK is used.
- the droplet applying device 140B1 applies the B solution onto the pixel electrode P.
- the solution B for example, a solution in which a blue dopant material is dissolved in 1,2-dichloroethane in a host material PVK is used.
- the droplet applying device 120I applies an electrically insulating ink to a part of the gate bus line GBL or the source bus line SBL.
- the electrically insulating ink for example, polyimide resin or urethane resin ink is used.
- the droplet applying device 120IT applies ITO (Indium Tin Oxide) ink on the red, green, and blue light emitting layers.
- ITO Indium Tin Oxide
- a compound in which several percent of tin oxide (SnO 2 ) is added to indium oxide (In 2 O 3 ) is used.
- an amorphous material such as IDIXO (In 2 O 3 —ZnO) capable of forming a transparent conductive film may be used.
- the transparent conductive film preferably has a transmittance of 90% or more.
- the heat treatment apparatus BK is disposed on the + X side (downstream side in the substrate transport direction) of each droplet applying apparatus 140.
- the heat treatment apparatus BK can emit hot air, far-infrared rays, and the like to the sheet substrate FB, similarly to the heat treatment apparatus BK used in the electrode forming unit 92.
- the heat treatment apparatus BK uses these radiant heats to dry or bake (bake) the droplets applied to the sheet substrate FB and harden them.
- Alignment unit 107 has a plurality of alignment cameras CA (CA1 to CA8) provided along the X direction.
- the alignment camera CA may pick up an image with CCD or CMOS under visible light illumination, process the picked-up image to detect the position of the alignment mark AM, or irradiate the alignment mark AM with the laser light and scatter the light. Even if light is received, the position of the alignment mark AM may be detected.
- the alignment camera CA1 is disposed on the + X side of the thermal transfer roller 115.
- the alignment camera CA1 detects the position of the alignment mark AM formed by the thermal transfer roller 115 on the sheet substrate FB.
- the alignment cameras CA2 to CA8 are respectively arranged on the + X side of the heat treatment apparatus BK. Alignment cameras CA2 to CA8 detect the position of alignment mark AM on sheet substrate FB that has passed through heat treatment apparatus BK.
- the sheet substrate FB may expand and contract in the X axis direction and the Y axis direction through the thermal transfer roller 115 and the heat treatment apparatus BK.
- the alignment camera CA By disposing the alignment camera CA on the + X side of the thermal transfer roller 115 that performs heat treatment or on the + X side of the heat treatment apparatus BK in this way, it is possible to detect the positional deviation of the sheet substrate FB due to thermal deformation or the like. Yes.
- the detection results from the alignment cameras CA1 to CA8 are transmitted to the control unit 104. Based on the detection results of the alignment cameras CA1 to CA8, the control unit 104 adjusts, for example, the ink application position and timing of the droplet application device 120 and the droplet application device 140, and supplies the sheet substrate FB from the substrate supply unit 101. Adjustment of the speed and the conveyance speed of the roller RR, adjustment of movement in the Y direction by the roller RR, adjustment of the cutting position and timing of the cutting device 130, and the like are performed.
- the substrate cartridge 1 is used as the substrate supply unit 101 and the substrate recovery unit 103.
- an XYZ orthogonal coordinate system common to FIG. 2 is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system.
- the following XYZ orthogonal coordinate system will be described by taking as an example a case where the substrate cartridge 1 is used as the substrate supply unit 101 in a state where the substrate supply unit 101 is connected to the substrate processing unit 102.
- FIG. 5 is a perspective view showing the configuration of the substrate cartridge 1.
- FIG. 6 is a diagram showing a configuration along the section AA ′ in FIG. As shown in FIGS. 5 and 6, the substrate cartridge 1 has a cartridge body 2 and a mount portion 3.
- the cartridge main body 2 is a part that accommodates the sheet substrate FB.
- the cartridge main body 2 includes a storage unit 20, a transfer unit (transfer mechanism) 21, a substrate guide unit 22, a second substrate transfer unit 36, and a second substrate guide unit 37.
- the mount 3 is provided on the cartridge body 2.
- the cartridge body 2 is made of aluminum or duralumin.
- the accommodating part 20 is a part for accommodating the sheet substrate FB.
- the accommodating part 20 is formed in a cylindrical shape so that, for example, the sheet substrate FB wound in a roll shape can be accommodated, and is provided so as to partially protrude toward the + X side (protruding part 23). In the present embodiment, they are arranged in a state extending in the Y direction in the drawing.
- the accommodating part 20 has a lid part 25 and a substrate driving mechanism 24.
- the lid portion 25 is provided at the + Y side end portion or the ⁇ Y side end portion of the accommodating portion 20.
- the lid portion 25 is provided so as to be detachable from the housing portion 20. By detaching the lid portion 25 from the housing portion 20, the inside of the housing portion 20 can be directly accessed.
- the lid part 25 has a window part 28 and a display part 29.
- the window portion 28 is formed of, for example, a material that can transmit visible light, such as glass or plastic.
- the inside of the accommodating portion 20 can be observed through the window portion 28.
- the display unit 29 is a part that displays information such as the state of the sheet substrate FB. On the display unit 29, for example, the length dimension of the sheet substrate FB accommodated in the accommodating unit 20, the remaining length of the sheet substrate FB, and the like are displayed.
- the substrate driving mechanism 24 is a portion that performs an operation of winding the sheet substrate FB and an operation of feeding the sheet substrate FB.
- the substrate driving mechanism 24 is provided inside the housing part 20.
- the substrate driving mechanism 24 includes a roller part (shaft part) 26 and a guide part 27. As shown in FIG. 6, the roller part 26 has a rotating shaft member 26a, a diameter-expanded part 26b, and an adhesive part 26c.
- the rotating shaft member 26a is a columnar member formed of a highly rigid metal such as aluminum.
- the rotating shaft member 26a is rotatably supported through an opening 25a and a bearing member 25b provided at the center of the lid 25, for example.
- the central axis of the rotating shaft member 26a is in a state parallel to the Y direction, for example, and the rotating shaft member 26a rotates in the ⁇ Y direction.
- the rotary shaft member 26a is connected to a rotation drive mechanism (not shown).
- the rotary shaft member 26a is rotated about the central axis by drive control of the rotary drive mechanism.
- the rotation drive mechanism can rotate the rotating shaft member 26a in, for example, both the + ⁇ Y direction and the ⁇ Y direction.
- the enlarged diameter portion 26b is formed with a uniform thickness on the surface of the rotary shaft member 26a.
- the enlarged diameter portion 26b is formed so as to rotate integrally with the rotary shaft member 26a.
- the bonding portion 26c is formed with a uniform thickness on the surface of the enlarged diameter portion 26b in a sectional view.
- the adhesion part 26c is formed using a material having a degree of adhesiveness to which the sheet substrate FB is adhered.
- the guide unit 27 includes a rotating member (first guide member) 27a and a tip member (first guide member) 27b.
- a rotating member (first guide member) 27a For example, one end of the rotating member 27a is attached to the accommodating portion 20 via a shaft portion 27c, and is provided to be rotatable in the ⁇ Y direction around the shaft portion 27c.
- the rotation member 27a is connected to a rotation drive mechanism (not shown).
- the tip member 27b is connected to the other end of the rotating member 27a in a cross-sectional view.
- the tip member 27b is formed to have an arcuate curved surface in cross-sectional view.
- the sheet substrate FB is guided to the roller portion 26 through a curved surface on the + Z side having a circular arc shape in cross section provided on the tip member 27b.
- the tip member 27b rotates integrally with the rotation member 27a. For example, when the rotating member 27 a rotates in a direction away from the roller portion 26 (outward direction in the radial direction of the roller portion 26), the rotating member 27 a comes into contact with the inner periphery of the accommodating portion 20. For this reason, the contact between the tip member 27b and the sheet substrate FB wound around the roller portion 26 is avoided.
- the mount unit 3 is a part connected to the substrate processing unit 102.
- the mount part 3 is provided, for example, at the + X side end of the protrusion 23 provided in the housing part 20.
- the mount part 3 has an insertion part 3 a for connection with the substrate processing part 102.
- a terminal 3c that is electrically connected to the substrate processing unit 102 is provided on the end surface 3b on the substrate processing unit 102 side of the insertion unit 3a.
- the mount unit 3 When the substrate cartridge 1 is used as the substrate supply unit 101, the mount unit 3 is connected to the supply side connection unit 102 ⁇ / b> A of the substrate processing unit 102. When the substrate cartridge 1 is used as the substrate collection unit 103, the mount unit 3 is connected to the collection side connection unit 102B of the substrate processing unit 102. The mount unit 3 is detachably connected regardless of whether the mount unit 3 is connected to either the substrate supply unit 101 or the substrate recovery unit 103 of the substrate processing unit 102.
- the mount 3 is provided with an opening 34 and a second opening 35.
- the opening 34 is an opening provided on the + Z side, and is a portion where the sheet substrate FB is taken in and out of the cartridge body 2.
- the cartridge main body 2 accommodates the sheet substrate FB via the opening 34.
- the sheet substrate FB accommodated in the cartridge main body 2 is sent out of the cartridge main body 2 through the opening 34.
- the second opening 35 is an opening provided on the ⁇ Z side, and is a portion in which a belt-like second substrate SB different from the sheet substrate FB is taken in and out of the cartridge body 2.
- the second substrate SB include a protective substrate that protects the element formation surface of the sheet substrate FB.
- a protective substrate for example, a slip sheet or the like can be used.
- the second opening 35 is disposed with a space from the opening 34.
- the second opening 35 is formed in the same size and shape as the opening 34, for example.
- a conductive material such as a stainless steel thin plate (eg, a thickness of 0.1 mm or less) may be used. In this case, if the second substrate SB is electrically connected to the cartridge body 2 when the second substrate SB is accommodated in the cartridge body 2 together with the sheet substrate FB, the sheet substrate FB can be prevented from being charged.
- the transfer unit 21, the substrate guide unit 22, the second substrate transfer unit 36, and the second substrate guide unit 37 are provided, for example, inside the protrusion 23.
- the substrate guide part 22 is provided between the opening 34 and the transport part 21.
- the substrate guide portion 22 is a portion that guides the sheet substrate FB between the opening 34 and the transport portion 21.
- the substrate guide 22 has substrate guide members 22a and 22b.
- the board guide members 22a and 22b are arranged to face each other so as to leave a gap 22c in the Z direction, and are provided so that the facing surfaces are substantially parallel to the XY plane.
- the gap 22c is connected to the opening 34, and the sheet substrate FB moves through the opening 34 and the gap 22c.
- the second substrate guide portion 37 is a portion that guides the second substrate SB between the mount portion 3 and the transport portion 21.
- the second substrate guide portion 37 includes second substrate guide members 37a, 37b, and 37c.
- the second substrate guide members 37a and 37b are arranged to face each other so as to leave a gap 37d in the Z direction, and the facing surfaces are provided so as to be substantially parallel to the XY plane, respectively.
- the second substrate guide member 37c is arranged to be inclined so that the second substrate SB is guided to the + Z side. Specifically, the ⁇ X side end portion of the second substrate guide member 37c is arranged in a state inclined to the + Z side with respect to the + X side end portion.
- the second substrate transport unit 36 transports the second substrate SB between the mount unit 3 and the transport unit 21.
- the second substrate transport unit 36 is disposed between the second substrate guide members 37a and 37b and the second substrate guide member 37c.
- the second substrate transport unit 36 includes a main driving roller 36a and a driven roller 36b.
- the main driving roller 36a is provided so as to be rotatable in the ⁇ Y direction, for example, and is connected to a rotation driving mechanism (not shown).
- the driven roller 36b is arranged with a gap between the driven roller 36a and the main driven roller 36a so that the second substrate SB is sandwiched between the driven roller 36b.
- the transport unit 21 transports the sheet substrate FB and the second substrate SB between the mount unit 3 and the storage unit 20.
- the conveyance unit 21 includes a tension roller (tension mechanism) 21a and a measurement roller (measurement unit) 21b.
- the tension roller 21 a is a roller that applies tension to the sheet substrate FB and the second substrate between the roller unit 26.
- the tension roller 21a is provided to be rotatable in the ⁇ Y direction.
- a rotation drive mechanism (not shown) is connected to the tension roller 21a.
- the tension roller 21a and the measurement roller 21b may be provided so as to be movable in the Z direction in FIG.
- the measuring roller 21b is a roller having a smaller diameter than the tension roller 21a.
- the measuring roller 21b is disposed with a predetermined gap between the measuring roller 21b and the tension roller 21a so that the sheet substrate FB and the second substrate SB can be sandwiched between the measuring roller 21b. Even when only the sheet substrate FB is sandwiched and when the sheet substrate FB and the second substrate SB are sandwiched together, the size of the gap between the measurement roller 21b and the tension roller 21a can be adjusted. I do not care.
- the measuring roller 21b is a driven roller that rotates as the tension roller 21a rotates.
- the transport unit 21 includes a detection unit 21c that detects the rotation speed and rotation angle of the measurement roller 21b, for example.
- a detection unit 21c that detects the rotation speed and rotation angle of the measurement roller 21b, for example.
- an encoder or the like is used as the detection unit 21c.
- the detection unit 21c can measure, for example, the transport distance of the sheet substrate FB via the measurement roller 21b.
- the sheet substrate FB and the second substrate SB are respectively connected to the substrate guide unit 22 and the second substrate SB.
- the junction portion 39 joins.
- the sheet substrate FB and the second substrate SB merged at the merge unit 39 are conveyed by the conveyance unit 21 in a merged state.
- the transport unit 21 presses the sheet substrate FB and the second substrate SB in close contact with each other.
- the conveyance unit 21 also serves as a pressing mechanism that presses the second substrate SB against the sheet substrate FB.
- the cartridge body 2 is provided with an information holding unit IC (see FIG. 5).
- the information holding unit IC is composed of, for example, an IC chip (eg, a type that can only be read, a type that can be read and written), and the like, and is embedded in the cartridge body 2, for example.
- the information holding unit IC stores, for example, specification information regarding the specification value of the sheet substrate FB accommodated in the cartridge body 2, process information based on the specification information, identification information for identifying the cartridge body 2, and the like.
- the storage unit MR and a communication unit CR that communicates information stored in the storage unit MR.
- the storage unit MR is configured to store information including two pieces of specification information and identification information in the present embodiment, but may be configured to store information including only one of them. .
- the communication unit CR is not limited to the configuration provided in the information holding unit IC as in the present embodiment, and may be configured to be provided independently of the information holding unit IC, for example.
- a configuration in which one information holding unit IC is provided is shown as an example.
- a plurality of information holding units IC may be provided in the cartridge body 2.
- the configuration is not limited to the configuration in which the information holding unit IC is embedded in the cartridge main body 2, and for example, the information holding unit IC may be mounted so as to be separable from the cartridge main body 2. Examples of such a configuration include a configuration in which an IC chip or the like is detachably mounted.
- the information holding unit IC may be configured to be electrically connected to the display unit 29, and the information held in the information holding unit IC may be displayed on the display unit 29. Further, at least a part of the information held by the information holding unit IC may be held on the sheet substrate FB. Examples of such a configuration include a configuration in which a one-dimensional or two-dimensional barcode is formed on the sheet substrate FB, a configuration in which an IC tag or the like is embedded in the sheet substrate FB, and the like.
- the specification value examples include the material of the sheet substrate FB, flexibility, heat resistance, wear resistance, thickness, friction coefficient, tension resistance, stretchability, tension, and expansion coefficient.
- the stretchability may be a value with respect to heat or tension applied to the sheet substrate FB, or may be a value with respect to heat and tension.
- the specification values include lyophilicity with a predetermined liquid to be attached to the sheet substrate FB, drying properties of the predetermined liquid on the sheet substrate FB, and the like.
- the predetermined liquid include droplets ejected from the droplet applying device 120, metal ink, electrically insulating ink, and solutions ejected from the droplet applying device 140.
- the specification information also includes preprocessing information related to the preprocessing performed on the sheet substrate FB.
- the preprocessing information is information on processing performed on the sheet substrate FB before being accommodated in the cartridge body 2.
- pretreatment include modification treatment (liquid repellent treatment, lyophilic treatment, etc.) on the sheet substrate FB, surface protection film formation treatment, and the like.
- modification treatment liquid repellent treatment, lyophilic treatment, etc.
- surface protection film formation treatment and the like.
- this lyophilic process for example, a lyophilic process for ink ejected from the droplet applying apparatuses 120 and 140 can be cited.
- Process information is information related to processing performed on the sheet substrate FB, and includes information such as a process ID and a process name corresponding to the specification information.
- the process performed on the sheet substrate FB includes at least one unit process corresponding to the specification information of the sheet substrate FB.
- processing by each component of the substrate processing apparatus 100 corresponds to the unit processing.
- Such processing includes each processing performed on the substrate, for example, heating processing, cooling processing, transport processing, press processing, coating processing, vapor deposition processing, sputtering processing, light irradiation processing, electron beam irradiation processing.
- Exposure processing Exposure processing, development processing, immersion processing, drying processing, physical processing processing (cutting, partial removal, etc.), chemical processing processing (dissolution processing, etc.), bonding processing with other substrates, detection processing, alignment processing, A deformation process, a modification process, a partition wall formation process, and the like are included.
- the information holding unit IC is electrically connected to the terminal 3c, for example.
- the terminal 3c is connected to a device side terminal 102C (see FIG. 2) provided in the supply side connection unit 102A of the substrate processing unit 102.
- the information holding unit IC is electrically connected to the substrate processing unit 102 through the terminal 3c, and can transmit information to and from the substrate processing unit 102 through the terminal 3c.
- the information holding unit IC can communicate information with the communication unit 104CR (see FIG. 2) provided in the control unit 104 of the substrate processing apparatus 100 via the communication unit CR. In this case, transmission of information between the substrate cartridge 1 and the substrate processing unit 102 is controlled by the control unit 104.
- processing information such as the tact and throughput of the substrate processing apparatus 100, the transport speed of the substrate cartridge 1, the winding / feeding speed of the roller section 26 are stored in the storage section MR of the information holding section IC.
- Various processing information such as information on the sheet substrate FB and the like may be held.
- processing per unit processing region for example, a region where the above-described liquid droplet coating apparatuses 120 and 140 can be processed at once, a screen region around one panel of the organic EL element 50, or a whole panel region.
- “Throughput” refers to the amount of sheet substrate FB that can be processed per unit time (for example, the length, the number of panels, the number of substrate cartridges 1, etc.).
- FIG. 7A and 7B are table diagrams of information stored in the control unit 104.
- the control unit 104 associates and stores identification information, specification information table, and process information (process ID), a second table that associates and stores process ID and unit process combination information, and the like.
- a database 104DB is provided.
- FIG. 7A is a diagram showing the first table
- FIG. 7B is a diagram showing the second table.
- identification information is stored in the first table Tb1, for example, as N1, N2, N3,.
- the first table Tb1 stores specification information of the sheet substrate FB accommodated in the substrate cartridge 1 corresponding to the identification information for each specification value.
- the specification information of the sheet substrate FB three specification values of the material, flexibility, and heat resistance of the sheet substrate FB are shown as examples.
- the above three values are used as representative examples of the specification values. However, more specification values are actually stored than in this case.
- the specification values of the material are stored as, for example, “material M1, material M2, material M3,...” And the like, and the specification values of flexibility are, for example, “flexibility F1, flexibility F2, acceptable
- the heat resistance specification value is stored as, for example, “heat resistance HR1, heat resistance HR2, heat resistance HR3,...” Or the like.
- the first table Tb1 stores a process ID corresponding to the combination of the specification values.
- the process ID is stored as “ID1, ID2, ID3,...”, For example.
- the process ID is linked to the second table shown in FIG. 7B.
- the second table Tb2 stores a combination of the above unit processes corresponding to the process ID.
- unit processing A in the transport unit 105 of the substrate processing unit 102, unit processing B in the partition forming unit 91 of the element forming unit 106, unit processing C in the electrode forming unit 92, and unit processing D in the light emitting layer forming unit 93. are shown as an example of a combination of unit processes.
- the unit process may be a process in the alignment unit 107, a process in the substrate cutting unit 108, or the like.
- unit processing A1, unit processing B3, unit processing C2, unit processing D3,...” Is stored as a combination of unit processing corresponding to process ID1.
- unit process A2, unit process B1, unit process C3, unit process D2,...” Are stored.
- process ID 3 “unit processing A1, unit processing B2, unit processing C1, unit processing D1,...” Is stored.
- the unit process A1 and the unit process A2 in the unit process A can be processes different from each other with respect to the conveyance speed, the pressing force of the roller RR, and the like.
- the unit processes B1 to B3 in the unit process B may be processes different from each other with respect to the type, hardness, pitch, and the like of the imprint mold 111 of the imprint roller 110, or the heating temperature by the thermal transfer roller 115.
- the processing may be different from each other.
- the unit processes C1 to C3 of the unit process C and the D1 to D3 of the unit process D are the electrode forming processes in the electrode forming unit 92, respectively, as in the present embodiment.
- a process for forming an electrode by vapor deposition or a process for forming an electrode by a sputtering method may be used.
- the configuration of the substrate processing unit 102 is such that a vapor deposition device, a sputtering device, and the like are separately provided in addition to the droplet applying devices 120 and 140, and the control unit 104 is controlled so that processing corresponding to the process ID is performed.
- the unit processing may be different processing depending on the type of droplet used.
- the unit processing may be stored as different processing for each condition.
- the sheet substrate FB inserted through the opening 34 is guided to the transport unit 21 by the substrate guide unit 22.
- the sheet substrate FB is sandwiched between the tension roller 21a and the measurement roller 21b and transported to the storage unit 20 side.
- the detection length of the sheet substrate FB is detected by the detection unit 21c.
- the sheet substrate FB that has passed through the transport unit 21 toward the storage unit 20 is guided while being bent in the ⁇ Z direction by its own weight.
- the sheet substrate FB since the guide portion 27 is provided on the ⁇ Z side of the sheet substrate FB, the sheet substrate FB is guided to the roller portion 26 along the rotating member 27a and the tip member 27b of the guide portion 27. It will be.
- the leading edge of the sheet substrate FB reaches the bonding portion 26c of the roller portion 26, the leading edge of the sheet substrate FB and the bonding portion 26c are bonded.
- the roller portion 26 rotates in this state, the sheet substrate FB is gradually bonded to the bonding portion 26c, and the sheet substrate FB is wound around the roller portion 26.
- the rotation speed of the tension roller 21a and the rotation speed of the rotation shaft member 26a are set so that the sheet substrate FB does not bend between the roller portion 26 and the conveyance portion 21. Then, the sheet substrate FB is conveyed.
- the guide portion 27 is retracted as shown in FIG.
- the sheet substrate FB is gradually wound around the roller unit 26.
- the thickness of the wound sheet substrate FB is gradually increased, since the guide portion 27 has already been retracted, the sheet substrate FB and the guide portion 27 do not come into contact with each other.
- the sheet substrate FB After winding up the sheet substrate FB having a desired length, for example, a portion of the sheet substrate FB outside the opening 34 is cut. In this way, the sheet substrate FB is accommodated in the substrate cartridge 1.
- the total length of the sheet substrate FB accommodated in the substrate cartridge 1 may be calculated based on the measured length of the sheet substrate FB measured by the detection unit 21c. Further, the calculation result may be displayed on the display unit 29. Further, the calculation result may be displayed on the display unit 29, or may be stored in the storage unit MR or communicated using the communication unit CR.
- the operator may take up the sheet substrate FB while observing the inside of the accommodating portion 20 from the window portion 28.
- the winding operation is performed while checking whether or not the sheet substrate FB is wound in a bent state, and whether or not the wound shape (roll shape) of the sheet substrate FB is distorted. In the event of an abnormality, the winding can be stopped immediately.
- connection operation for connecting the substrate cartridge 1 containing the sheet substrate FB to the supply side connection unit 102A as the substrate supply unit 101, an operation for supplying the sheet substrate FB by the substrate cartridge 1 by the substrate supply unit 101, and a substrate processing unit The element forming operation by 102 and the removing operation of the substrate cartridge 1 are sequentially performed.
- FIG. 10 is a diagram illustrating the connection operation of the substrate cartridge 1.
- the supply side connection portion 102 ⁇ / b> A has an insertion port formed in a shape corresponding to the mount portion 3.
- the mounting unit 3 and the supply-side connection unit 102A are aligned with the substrate cartridge 1 held by a holder (for example, the same configuration as the holder HD shown in FIGS. 8 and 9). After alignment, the mount unit 3 is moved to the + X side and inserted into the substrate processing unit 102.
- the terminal 3C of the mount unit 3 and the device side terminal 102C of the supply side connection unit 102A are brought into contact with each other.
- Information communication is performed between the information holding unit IC of the substrate cartridge 1 and the communication unit 104CR of the control unit 104 by the contact between the terminal 3C and the device side terminal 102C.
- the control unit 104 reads information (eg, identification information, specification information, etc.) held in the information holding unit IC of the substrate supply unit 101.
- the control unit 104 determines a process ID according to the specification information among the read information, selects a unit processing combination corresponding to the process ID from the second table Tb2, and performs each of the following operations (supply operation, The unit processing selected as the element forming operation is performed.
- the unit process is switched according to the specification value of the sheet substrate FB to be processed, so that the optimum process is performed on the sheet substrate FB.
- the control unit 104 writes the specification information read from the substrate supply unit 101 to the information holding unit IC of the substrate collection unit 103, thereby transmitting the specification information of the substrate supply unit 101 to the substrate collection unit 103. It doesn't matter. Further, the control unit 104 may transmit information regarding the unit processing selected based on the above-described specification information to the substrate collection unit 103. In such a case, since the control unit 104 transmits information based on each unit process performed on the sheet substrate FB in the substrate processing unit 102 to the substrate recovery unit 103, the substrate recovery unit 103 transmits the information to the sheet substrate FB. It is possible to store process progress information such as what kind of processing has been performed as specification information.
- the information holding unit IC Prior to the connection operation of the substrate cartridge 1, the information holding unit IC transmits the information to the control unit 104 by wireless communication between the communication unit CR of the information holding unit IC and the communication unit 104CR of the control unit 104. You may make it transmit.
- the supply operation will be described.
- the rotating shaft member 26a roller unit 26
- the tension roller 21a of the substrate cartridge 1 are rotated in the opposite direction to that in the accommodating operation, and shown in FIG.
- the sheet substrate FB is sent out through the opening 34.
- the element forming operation As shown in FIG. 2, while the sheet substrate FB is supplied from the substrate supply unit 101 to the substrate processing unit 102, the substrate processing unit 102 forms elements on the sheet substrate FB. In the substrate processing unit 102, as shown in FIG. 3, the sheet substrate FB is conveyed by a roller RR.
- the control unit 104 may control the operation of the substrate processing unit 102 based on the processing information supplied from the substrate cartridge 1 separately from the combination of unit processes described above. For example, the control unit 104 may adjust the rotation speed of each roller RR in the substrate processing unit 102 in accordance with the supply speed of the sheet substrate FB from the substrate cartridge 1. In addition, the control unit 104 detects whether or not the roller RR is displaced in the Y-axis direction, and when it is displaced, moves the roller RR to correct the position. Further, the control unit 104 also performs position correction of the sheet substrate FB.
- the sheet substrate FB supplied from the substrate supply unit 101 to the substrate processing unit 102 is first transported to the partition wall forming unit 91.
- the sheet substrate FB is sandwiched and pressed between the imprint roller 110 and the thermal transfer roller 115, and the partition BA and the alignment mark AM are formed on the sheet substrate by thermal transfer.
- FIG. 12 is a view showing a state in which the partition walls BA and the alignment marks AM are formed on the sheet substrate FB.
- FIG. 13 is an enlarged view of a part of FIG.
- FIG. 14 is a diagram showing a configuration along a DD section in FIG. 12 and 13 show a state when the sheet substrate FB is viewed from the + Z side.
- the partition wall BA is formed in the element formation region 60 at the center in the Y direction of the sheet substrate FB.
- the element forming region 60 includes a region for forming the gate bus line GBL and the gate electrode G (gate forming region 52), the source bus line SBL, the source electrode S, A region for forming the drain electrode D and the anode P (source / drain formation region 53) is partitioned.
- the gate formation region 52 is formed in a trapezoidal shape in a cross-sectional view.
- the source / drain formation region 53 has the same shape.
- the width W ( ⁇ m) in the partition wall BA is the line width of the gate bus line GBL.
- the width W is preferably about 2 to 4 times the droplet diameter d ( ⁇ m) applied from the droplet applying apparatus 120G.
- the cross-sectional shapes of the gate formation region 52 and the source / drain formation region 53 are V-shaped or U-shaped in cross-section so that the sheet substrate FB can be easily peeled after the fine imprint mold 11 presses the sheet substrate FB. It is preferable to have a shape. As other shapes, for example, a rectangular shape in a sectional view may be used.
- a pair of alignment marks AM is formed in the edge regions 61 at both ends in the Y direction of the sheet substrate FB.
- the partition wall BA and the alignment mark AM are formed at the same time because the mutual positional relationship is important.
- a predetermined distance PY between the alignment mark AM and the gate formation region 52 is defined in the Y-axis direction, and the alignment mark AM and the source / drain formation region 53 are defined in the X-axis direction.
- a predetermined distance PX is defined. Therefore, based on the positions of the pair of alignment marks AM, it is possible to detect the deviation in the X-axis direction, the deviation in the Y-axis direction, and the ⁇ rotation of the sheet substrate FB.
- a pair of alignment marks AM is provided for each of the plurality of rows of barrier ribs BA in the X-axis direction.
- the alignment mark AM is provided for each row of barrier ribs BA.
- the alignment mark AM may be provided not only in the edge region 61 of the sheet substrate FB but also in the element forming region 60. 12 and 13, the alignment mark AM has a cross shape, but may have another mark shape such as a circular mark or an oblique straight mark.
- the sheet substrate FB is conveyed to the electrode forming unit 92 by the conveying roller RR.
- the electrode forming section 92 droplets are applied by each droplet applying device 120, and electrodes are formed on the sheet substrate FB.
- FIGS. 15A and 15B are views showing a state of the sheet substrate FB on which droplet application is performed by the droplet applying apparatus 120G.
- the droplet applying device 120G applies metal ink in the order of 1 to 9, for example, to the gate forming region 52 of the sheet substrate FB on which the partition walls BA are formed.
- This order is, for example, the order in which the ink is applied linearly with the tension between the metal inks.
- FIG. 15B is a diagram illustrating a state in which, for example, one drop of metal ink is applied. As shown in FIG. 15B, since the partition wall BA is provided, the metal ink applied to the gate formation region 52 is held without being diffused. In this way, the metal ink is applied to the entire gate formation region 52.
- FIG. 16A is a diagram illustrating a state of the gate formation region 52 after the metal ink is dried. As shown in FIG. 16A, by drying the metal ink, the conductor contained in the metal ink is laminated in a thin film shape. Such a thin film-like conductor is formed on the entire gate formation region 52, and as shown in FIG. 16B, the gate bus line GBL and the gate electrode G are formed on the sheet substrate FB.
- the sheet substrate FB is conveyed to the ⁇ Z side of the droplet applying apparatus 120I.
- the electrically insulating ink is applied to the sheet substrate FB.
- electrically insulating ink is applied onto the gate bus line GBL and the gate electrode G passing through the source / drain formation region 53.
- FIG. 17 shows a state in which the gate insulating layer I is formed in a circular shape so as to straddle the partition BA, but it is not particularly necessary to form it beyond the partition BA.
- the sheet substrate FB is transported to the ⁇ Z side of the droplet applying apparatus 120SD.
- metal ink is applied to the source / drain formation region 53 of the sheet substrate FB.
- metal ink is ejected in the order of 1 to 9 shown in FIG.
- the sheet substrate FB After discharging the metal ink, the sheet substrate FB is conveyed to the ⁇ Z side of the heat treatment apparatus BK, and the metal ink is dried. After the drying process, the conductor contained in the metal ink is laminated in a thin film shape, and the source bus line SBL, the source electrode S, the drain electrode D, and the anode P are formed. However, at this stage, the source electrode S and the drain electrode D are connected.
- FIG. 19 is a diagram illustrating a state in which the gap between the source electrode S and the drain electrode D is cut by the cutting device 130.
- the cutting device 130 performs cutting while adjusting the irradiation position of the laser beam LL onto the sheet substrate FB using the galvanometer mirror 131.
- the sheet substrate FB is transported to the ⁇ Z side of the droplet applying apparatus OS.
- the organic semiconductor layer OS is formed on the sheet substrate FB.
- Organic semiconductor ink is ejected across the source electrode S and the drain electrode D into a region overlapping the gate electrode G on the sheet substrate FB.
- the sheet substrate FB is conveyed to the ⁇ Z side of the heat treatment apparatus BK, and the organic semiconductor ink is dried. After the drying treatment, semiconductors included in the organic semiconductor ink are laminated in a thin film shape, and an organic semiconductor OS is formed as shown in FIG. Through the above steps, the field effect transistor and the connection wiring are formed on the sheet substrate FB.
- the sheet substrate FB is transported to the light emitting layer forming unit 93 by the transport roller RR (see FIG. 3).
- red, green, and blue light emitting layers IR are formed by the droplet applying device 140Re, the droplet applying device 140Gr, the droplet applying device 140Bl, and the heat treatment device BK, respectively. Since the barrier ribs BA are formed on the sheet substrate FB, even when the red, green, and blue light emitting layers IR are continuously applied without heat treatment by the heat treatment apparatus BK, the solution is applied to the adjacent pixel regions. Overflow does not cause color mixing.
- the insulating layer I is formed on the sheet substrate FB via the droplet applying device 140I and the heat treatment device BK, and the transparent electrode IT is formed via the droplet applying device 140IT and the heat treatment device BK.
- the organic EL element 50 shown in FIG. 1 is formed on the sheet substrate FB.
- an alignment operation is performed. Is going.
- the alignment operation will be described with reference to FIG.
- a plurality of alignment cameras CA (CA1 to CA8) provided in each unit appropriately detect the alignment mark AM formed on the sheet substrate FB, and transmit the detection result to the control unit 104.
- the control unit 104 causes the alignment operation to be performed based on the transmitted detection result.
- control unit 104 detects the feeding speed of the sheet substrate FB based on the imaging interval of the alignment mark AM detected by the alignment camera CA (CA1 to CA8), and whether or not the roller RR is rotating at a predetermined speed, for example. Determine whether. When it is determined that the roller RR is not rotating at a predetermined speed, the control unit 104 issues an instruction for adjusting the rotation speed of the roller RR and applies feedback.
- control unit 104 detects whether or not the position of the alignment mark AM in the Y-axis direction is shifted based on the imaging result of the alignment mark AM, and detects whether or not the sheet substrate FB is displaced in the Y-axis direction. To do. When the misregistration is detected, the control unit 104 detects how long the misregistration continues in a state where the sheet substrate FB is conveyed.
- the time of positional deviation corresponds by switching the nozzle 122 which apply
- FIG. If the deviation of the sheet substrate FB in the Y-axis direction continues for a long time, the position of the sheet substrate FB in the Y-axis direction is corrected by the movement of the roller RR.
- the control unit 104 detects whether or not the sheet substrate FB is displaced in the ⁇ Z direction based on the positions of the alignment marks AM detected by the alignment camera CA in the X-axis and Y-axis directions.
- the control unit 104 detects how long the positional deviation continues while the sheet substrate FB is conveyed, as in the case of detecting the positional deviation in the Y-axis direction. If the positional deviation time is short, it can be dealt with by switching the nozzle 122 that applies droplets among the plurality of nozzles 122 of the droplet applying apparatus 120. If the deviation continues for a long time, the two rollers RR provided at a position sandwiching the alignment camera CA that has detected the deviation are moved in the X direction or the Y direction to correct the position of the sheet substrate FB in the ⁇ Z direction.
- the removal operation will be described. For example, after forming the organic EL element 50 on the sheet substrate FB and collecting the sheet substrate FB, the substrate cartridge 1 used as the substrate supply unit 101 is removed from the substrate processing unit 102.
- FIG. 22 is a view showing the removal operation of the substrate cartridge 1.
- the mount unit 3 is removed by moving the mount unit 3 in the ⁇ X direction and removing it from the supply side connection unit 102A. In this operation, the mount portion 3 comes off along the guide of the supply side connection portion 102A.
- the substrate cartridge 1 includes the cartridge main body 2 that accommodates the sheet substrate FB, and information that includes specification information regarding the specification values of at least the sheet substrate FB accommodated in the cartridge main body 2.
- the control unit 104 discriminates the specification value of the sheet substrate FB using the specification information of the sheet substrate FB accommodated in the cartridge main body 2. be able to. For this reason, the process with respect to a board
- the substrate processing apparatus 100 includes a substrate processing unit 102 that processes the sheet substrate FB, a substrate supply unit 101 that carries the sheet substrate FB into the substrate processing unit 102, and the substrate processing unit 102. Since the substrate cartridge 1 is used as the substrate supply unit 101, the substrate processing unit 102 applies the information from the substrate cartridge 1 to the sheet substrate FB. Optimal processing can be switched. Thereby, problems such as breakage and deformation of the sheet substrate FB in the substrate processing unit 102 are reduced.
- the process of processing the sheet substrate FB in the substrate processing unit 102 and the substrate cartridge 1 is used to supply the sheet substrate FB to the substrate processing unit 102 or the substrate. And the step of recovering the sheet substrate FB from the processing unit 102. Therefore, the display element can be efficiently manufactured under a high level of information management.
- control unit 104 can update information such as specification information held in the information holding unit IC of the substrate cartridge 1, so that the substrate cartridge 1 used as the substrate supply unit 101. Can be recycled.
- FIG. 23 is a diagram showing a configuration of the substrate processing apparatus 200 according to the present embodiment.
- the substrate processing apparatus 200 includes a substrate supply unit 201, a substrate processing unit 202, a substrate recovery unit 203, and a control unit 204.
- the present embodiment is different from the first embodiment in that the substrate cartridge 1 is used for each of the substrate supply unit 201 and the substrate recovery unit 203.
- the substrate processing unit 202 has a configuration in which the substrate cutting unit 108 is not provided in the substrate processing unit 102 of the first embodiment, for example. For this reason, the sheet substrate FB processed by the substrate processing unit 202 is recovered by the substrate recovery unit 203 in a sheet form without being cut.
- the specification information of the sheet substrate FB, the process information, the identification information of the substrate cartridge 1 are held in the substrate cartridge 1, and the control unit 204 is provided with the first table Tb1 and the second table Tb2.
- the configuration that enables communication between the information holding unit IC and the control unit 204 is the same as the configuration described in the first embodiment.
- FIG. 24 to 26 are diagrams showing how the sheet substrate FB is recovered by the substrate recovery unit 103.
- FIG. 24 to 26 a part of the configuration is omitted for easy understanding of the drawings.
- the sheet substrate FB is inserted into the opening 34 of the substrate cartridge 1 and at the same time, the protective substrate PB is inserted from the second opening 35.
- the protection substrate PB is supplied from, for example, a protection substrate supply unit (not shown).
- the inserted sheet substrate FB and protective substrate PB are guided by the substrate guide portion 22 and the second substrate guide portion 37, respectively, as shown in FIG.
- the sheet substrate FB and the protective substrate PB that have joined at the joining unit 39 are transported by the transport unit 21 in a joined state, and are pressed and adhered to the tension roller 21a and the measuring roller 21b.
- the sheet substrate FB and the protective substrate PB are wound and collected by the roller unit 26 in a close contact state.
- the control unit 204 sends the specification information of the processed sheet substrate FB to the information holding unit IC of the substrate cartridge 1 used as the substrate collecting unit 203 and Process information corresponding to the specification information is transmitted.
- the information holding unit IC receives the transmitted information and stores it in the storage unit MR.
- the substrate processing apparatus 200 includes the substrate processing unit 202 that processes the sheet substrate FB, the substrate supply unit 201 that carries the sheet substrate FB into the substrate processing unit 202, and the substrate processing unit. 202, and the substrate cartridge 1 is used as the substrate supply unit 201 and the substrate collection unit 203. Therefore, the information from the substrate cartridge 1 is used as the collection destination substrate cartridge. 1 is transmitted.
- the substrate processing apparatus 200 uses the above information even when managing the collection destination substrate cartridge 1 or when processing the sheet substrate FB accommodated in the collection destination substrate cartridge 1. Can do. Thereby, the information management capability of the substrate processing apparatus 200 can be improved, and the processing efficiency is significantly improved.
- the substrate processing unit 202 has the same configuration as the substrate processing unit 102 described in the first embodiment has been described.
- the present invention is not limited to this.
- the substrate processing unit 202 may have a configuration in which only a part of the partition wall forming unit 91, the electrode forming unit 92, and the light emitting layer forming unit 93 included in the substrate processing unit 102 described in the first embodiment is provided. I do not care.
- the sheet substrate FB is recovered by the substrate recovery unit 203 in a state where only the partition walls BA are formed.
- the sheet substrate FB collected by the substrate collection unit 203 is subjected to electrode formation processing and light emitting layer formation processing in another substrate processing unit.
- the substrate cartridge 1 Since the substrate cartridge 1 is detachably attached to the substrate processing unit 202, in such a case, the substrate cartridge 1 is removed from the substrate processing unit 202, and the substrate cartridge 1 is transported to another substrate processing unit. Can be connected. Since the information holding unit IC of the substrate cartridge 1 holds information including the specification information of the sheet substrate FB, process information, and identification information of the substrate cartridge 1, the information is also stored in the connected substrate processing unit. Can be used to process. As described above, the information on the sheet substrate FB is transmitted through the substrate cartridge 1 even when the substrate processing units straddle a plurality of substrate processing units in one production line and information communication is not performed between the substrate processing units. Can communicate. Even in this case, the information management capability can be improved, and the processing efficiency is remarkably improved.
- FIG. 27 is a diagram showing a configuration of the substrate processing system SYS according to the present embodiment.
- the substrate processing system SYS has a first substrate processing apparatus 300, a second substrate processing apparatus 310, and a main controller CONT.
- the first substrate processing apparatus 300 and the second substrate processing apparatus 310 are installed in, for example, the same site or the same factory.
- the first substrate processing apparatus 300 is an apparatus that forms the partition walls BA of the organic EL elements 50 on the sheet substrate FB, for example.
- the second substrate processing apparatus 310 is an apparatus that forms, for example, an electrode (such as the gate electrode G), the light emitting layer IR of the organic EL element 50, and the transparent electrode ITO on the sheet substrate FB.
- the substrate processing system SYS has a configuration in which the apparatus for forming the organic EL element 50 is divided into two types of apparatuses, the first substrate processing apparatus 300 and the second substrate processing apparatus 310.
- the first substrate processing apparatus 300 includes a substrate supply unit 301, a substrate processing unit 302, and a substrate recovery unit 303.
- the substrate cartridge 1 is used as the substrate supply unit 301 and the substrate recovery unit 303.
- the substrate processing unit 302 has the same configuration as the partition wall forming unit 91 in the substrate processing apparatus 100 of the first embodiment, and a supply side connection unit 302A is provided at a connection part with the substrate supply unit 301. Yes.
- the configuration of the supply side connection portion 302A is the same as that of the supply side connection portion 102A in the first embodiment.
- the first substrate processing apparatus 300 has the same configuration as the configuration from the substrate supply unit 101 of the substrate processing apparatus 100 to the partition wall forming unit 91 of the substrate processing unit 102 in the first embodiment.
- a connection part with the substrate recovery unit 303 is provided with a recovery side connection unit 302 ⁇ / b> B connected to the mount unit 3 of the substrate cartridge 1.
- the collection side connection unit 302B has the same configuration as the supply side connection unit 302A.
- the second substrate processing apparatus 310 includes a substrate supply unit 311, a substrate processing unit 312, and a substrate recovery unit 313, and each unit has the same configuration as the first substrate processing apparatus 300.
- the substrate processing unit 312 has the same configuration as the electrode forming unit 92 and the light emitting layer forming unit 93 in the substrate processing apparatus 100 of the first embodiment.
- the substrate cartridge 1 is used as the substrate supply unit 311 and the substrate recovery unit 313. Further, the substrate recovery unit 303 (substrate cartridge 1) removed from the first substrate processing apparatus 300 and transported to the second substrate processing apparatus 310 is used as the substrate supply unit 311 of the second substrate processing apparatus 310. ing. Therefore, the substrate cartridge 1 also functions as a relay device that relays the sheet substrate FB from the first substrate processing apparatus 300 to the second substrate processing apparatus 310.
- the main controller CONT is connected to each of the first substrate processing apparatus 300 and the second substrate processing apparatus 310 via a wired or wireless communication mechanism, and the first substrate processing apparatus 300 and the second substrate processing apparatus.
- the apparatus 310 is generally controlled.
- the main control unit CONT has the first table Tb1 and the second table Tb2 described in the first embodiment. For this reason, the main controller CONT can comprehensively manage information held in the information holding unit IC of the substrate cartridge 1 used in the first substrate processing apparatus 300 and the second substrate processing apparatus 310. .
- the main controller CONT comprehensively manages the information held in the information holding unit IC of the substrate cartridge 1
- the information management capability of the substrate processing system SYS can be improved.
- the processing efficiency of the substrate processing system SYS will be improved.
- the information holding unit IC of the substrate cartridge 1 may be configured to hold only identification information. I do not care.
- the main memory MMR (see FIG. 27) of the main controller CONT has specification information corresponding to the identification information.
- the control device CONT can recognize the specification information based on the identification information of the substrate cartridge 1, and can perform processing (eg, unit processing) based on the specification information.
- the main control unit CONT reads the specification information corresponding to the identification information read from the information holding unit IC from the main storage unit MMR, and outputs the processing signal to the first in order to perform processing based on the specification information.
- the data is transmitted to the substrate processing apparatus 300 or the second substrate processing apparatus 310.
- the processing signal is, for example, a command signal such as a setting value for causing the first substrate processing apparatus 300 to perform each processing.
- the control unit 104 may be used instead of the main control unit CONT. Thereby, the processing efficiency of the first substrate processing apparatus 300 or the second substrate processing apparatus 310 is improved.
- the second substrate processing apparatus 310 is described as an example of the connection destination of the substrate cartridge 1 removed from the first substrate processing apparatus 300, but the present invention is not limited to this.
- a plurality of processing devices 320 (indicated by a one-dot chain line in FIG. 27) for performing a plurality of types of unit processing such as a coating device, a vapor deposition device, and a sputtering device are arranged, and each processing device 320 is integrated by the main controller CONT. You may make it control to.
- the connection destination of the substrate cartridge 1 removed from the first substrate processing apparatus 300 can be controlled to be switched for each processing apparatus 320 by the main controller CONT. By this control, processing according to the specification information of the sheet substrate FB is performed.
- the substrate cartridge 1 may hold the process ID without holding the specification information. According to this configuration, information management of the substrate processing system SYS becomes easier.
- the process switching based on the specification information is performed in the control unit 104 or the main control unit CONT.
- the switching control apparatus Alternatively, a switching control unit
- the switching control device is provided with tables corresponding to the first table Tb1 and the second table Tb2, so that the information held in the information holding unit IC of the substrate cartridge 1 is transmitted to the switching control device.
- a process is selected based on information stored in the table, and the selection result is transmitted to the control unit 104 or the main control device CONT.
- a switching control device may be provided in the substrate cartridge 1, for example.
- the substrate cartridge 1 is used only for the substrate supply unit of the substrate processing unit, and the substrate cartridge 1 is used for both the substrate supply unit and the substrate recovery unit of the substrate processing unit.
- the substrate cartridge 1 may be used only for the substrate recovery unit.
- the substrate processing apparatus 100 is an apparatus that forms the organic EL element 50 shown in FIG. 1 using a flexible strip-shaped sheet substrate FB.
- the substrate processing apparatus 100 includes a substrate supply unit 101, a substrate processing unit 102, a substrate collection unit 103, and a control unit 104.
- the sheet substrate FB is transported from the substrate supply unit 101 to the substrate recovery unit 103 via the substrate processing unit 102.
- the control unit 104 controls the overall operation of the substrate processing apparatus 100.
- the control unit 104 includes a database 104DB that is a storage unit that stores information.
- FIG. 28 is a diagram illustrating a configuration of the substrate processing unit 102.
- the substrate processing unit 102 includes a transport unit 105, an element forming unit 106, an alignment unit 107, and a substrate cutting unit 108.
- the substrate processing unit 102 forms each component of the organic EL element 50 on the sheet substrate FB while conveying the sheet substrate FB supplied from the substrate supply unit 101, and the sheet on which the organic EL element 50 is formed. This is the part that sends out the substrate FB to the substrate recovery unit 103.
- the substrate cartridge 1 is used as the substrate supply unit 101 and the substrate recovery unit 103. As shown in FIGS. 5 and 6, the substrate cartridge 1 has a cartridge body 2 and a mount portion 3.
- the cartridge body 2 is provided with an information holding unit IC (see FIG. 5).
- the information holding unit IC is composed of, for example, an IC chip (eg, a type that can only be read, a type that can be read and written), and the like, and is embedded in the cartridge body 2, for example.
- the information holding unit IC includes, for example, a storage unit MR that stores information such as processing information of the sheet substrate FB accommodated in the cartridge body 2 and identification information for identifying the cartridge body 2, and the storage unit MR.
- a communication unit CR that communicates information stored in the computer.
- the storage unit MR is configured to store information including two of processing information and identification information in the present embodiment, but may be configured to store information including only one of them. .
- the communication unit CR is not limited to the configuration provided in the information holding unit IC as in the present embodiment, and may be configured to be provided independently of the information holding unit IC, for example.
- the processing information in the present embodiment includes defect information on the sheet substrate FB as an example.
- This defect information includes the position information of the defective portion on the sheet substrate FB, the degree of the defect whether or not the defect can be repaired, the type of defect such as a pattern defect or pattern protrusion, and the defect on the sheet substrate FB. And at least one of the repair status (eg, presence / absence of repair).
- the position information of the defective portion on the sheet substrate FB may be, for example, the position coordinates of the defective portion on the sheet substrate FB, or may be the distance from the end portion of the sheet substrate FB to the defective portion. I do not care.
- the defect information on the sheet substrate FB is transmitted from the information holding unit IC to the control unit 104 of the substrate processing unit 102 via the communication unit CR.
- the control unit 104 to which the defect information is transmitted controls each process of the electrode forming unit 92 and the like based on the defect information. As an example, when it is determined that the defect portion cannot be repaired from the degree of the defect included in the defect information, the control unit 104 performs an electrode formation process on the defect portion or the element formation region 60 including the defect portion. Information not to be transmitted is transmitted to the droplet applying device 120 together with the position information of the defective portion.
- the control unit 104 applies droplet application information for performing an electrode forming process on the defective portion or the element forming region 60 including the defective portion. Communicate to device 120. As described above, the control unit 104 can select a process for the defective portion based on the defect information described above, and can transmit the selected process to the droplet applying apparatus 120 or the like in advance.
- a pattern PTN such as a mark serving as a reference position is formed along the X direction at a position along the edge in the Y direction of the sheet substrate FB, and a defect is formed using the pattern PTN.
- the position of the part P1 may be detected, and the detection result may be used as the position information of the defective part P1.
- an encoder pattern of an encoder position information detection device is formed as a pattern PTN on the sheet substrate FB.
- the encoder pattern is, for example, a pattern that can determine the position of the sheet substrate FB in the X direction.
- the positional coordinates of the defective part P1 are arranged in the Y direction based on the position of the defective part P1 in the X direction. It can be specified by detecting the position of the defective portion P1 in the Y direction using a line sensor or a camera movable in the Y direction.
- the position information of the defective portion P1 is the region number (for example, A110) assigned to each of the regions (for example, defective regions) divided into a plurality along the X direction in the sheet substrate FB. , A111, A112, etc.).
- the processing information in this embodiment includes positional information regarding a predetermined portion on the sheet substrate FB, processing progress information on the sheet substrate FB, and formation layers (eg, each electrode layer, TFT layer, light emission) formed on the sheet substrate FB. Layer information), shape information related to the shape of the sheet substrate FB, and the like.
- the predetermined portion on the sheet substrate FB include the above-described defect portion, a portion on which the alignment reference mark is formed, and a portion on which the reference mark serving as an index of the length and interval of the sheet substrate FB is formed. It is done.
- the processing information includes information regarding the connection positions (joint positions) between the unit substrates.
- the progress information includes information indicating how far the processing has progressed with respect to the sheet substrate FB.
- the progress information includes, for example, a stage in which only the partition walls BA are formed on the sheet substrate FB, a stage in which the partition walls and electrodes are formed on the sheet substrate FB, and a stage in which the partition walls, electrodes, and light emitting layers are formed on the sheet substrate FB.
- it is information indicating the stage of processing.
- the progress information may include a stage in which pre-processing (for example, lyophilic processing, liquid repellent processing, protective film formation processing, etc.) is performed on the sheet substrate FB, the gate electrode, the source electrode, A step of forming an electrode such as a drain electrode may be included.
- This progress information is transmitted from the information holding unit IC to the control unit 104 of the substrate processing unit 102 via the communication unit CR, and is used as one piece of information for selecting processing to be performed on the sheet substrate FB in the substrate processing unit 102. It is done.
- the form information includes the shape of the formation layer (eg, electrode layer or light-emitting layer) formed on the sheet substrate FB, positional displacement of the formation layer, dimensions of the formation layer (eg, size, layer thickness, etc.), and formation range of the formation layer. , Information such as the position of the formation layer is included.
- This form information is transmitted from the information holding unit IC to the control unit 104 of the substrate processing unit 102 via the communication unit CR.
- configuration information is used as one piece of information for setting a processing start position when processing on the sheet substrate FB is stopped midway due to system down of the apparatus or maintenance of the apparatus.
- the positional deviation of the formation layer which is the above-described form information, is one piece of information for notifying the maintenance time of the apparatus and the abnormality of the apparatus based on the information on the number and ratio of the positional deviations in the sheet substrate FB. Used as one.
- the shape information includes information related to the overall shape of the sheet substrate FB. For example, when a part of the sheet substrate FB is cut out or the sheet substrate FB is configured to have an opening in the sheet substrate FB, the shape information is information on the notch or the opening (eg, shape type). And location information).
- This shape information is transmitted from the information holding unit IC to the control unit 104 of the substrate processing unit 102 via the communication unit CR. For example, such shape information is used to grasp the wear frequency and the degree of scratches on the sheet substrate FB by the transport unit 21, and the control unit 104 determines the maintenance time of the apparatus and the abnormality of the apparatus based on the shape information.
- the information holding unit IC is electrically connected to the terminal 3c, for example.
- the terminal 3c is connected to a device side terminal 102C (see FIG. 2) provided in the supply side connection unit 102A of the substrate processing unit 102.
- the information holding unit IC is electrically connected to the substrate processing unit 102 through the terminal 3c, and can transmit information to and from the substrate processing unit 102 through the terminal 3c.
- the information holding unit IC can communicate information with the communication unit 104CR (see FIG. 2) provided in the control unit 104 of the substrate processing apparatus 100 via the communication unit CR. In this case, transmission of information between the substrate cartridge 1 and the substrate processing unit 102 is controlled by the control unit 104.
- information such as the tact and throughput of the substrate processing apparatus 100, the transport speed of the substrate cartridge 1, the winding / feeding speed of the roller section 26 are stored in the storage section MR of the information holding section IC.
- Various reference information such as such information and information on the sheet substrate FB may be held.
- processing per unit processing region for example, a region where the above-described liquid droplet coating apparatuses 120 and 140 can be processed at once, a screen region around one panel of the organic EL element 50, or a whole panel region.
- “Throughput” refers to the amount of sheet substrate FB that can be processed per unit time (for example, the length, the number of panels, the number of substrate cartridges 1, etc.).
- the reference information is transmitted to the control unit 104 via the communication unit CR, like the identification information and the processing information.
- a forming device 109A that forms a pattern PTN on the sheet substrate FB
- a detection device 109B that detects the pattern PTN
- a cutting and removing device 109C that cuts and removes part of the sheet substrate FB
- a sheet substrate An abnormality detection device 109D for detecting an abnormality including defect information on the FB is provided in the substrate processing unit 102 (see FIG. 28).
- the position information of the defect portion can be detected by the detection device 109B.
- the detected position information of the defective portion is transmitted as defect information of the sheet substrate FB by the control unit 104 to the information holding unit IC of the substrate collection unit 103 (substrate cartridge 1).
- the defect portion included in the defect information is cut based on the position information of the defect portion. It is cut and removed by the removing device 109C. In this case, for example, as shown in FIG. 29B, a cutout portion CH is formed in a part of the sheet substrate FB.
- connection operation of connecting the substrate cartridge 1 containing the sheet substrate FB to the supply side connection unit 102A as the substrate supply unit 101, the supply operation of the sheet substrate FB by the substrate cartridge 1 by the substrate supply unit 101, the substrate processing The element forming operation by the unit 102 and the removing operation of the substrate cartridge 1 are sequentially performed.
- the supply side connection portion 102 ⁇ / b> A has an insertion port formed in a shape corresponding to the mount portion 3.
- the mounting unit 3 and the supply-side connection unit 102A are aligned with the substrate cartridge 1 held by a holder (for example, the same configuration as the holder HD shown in FIGS. 8 and 9). After alignment, the mount unit 3 is moved to the + X side and inserted into the substrate processing unit 102.
- the terminal 3C of the mount unit 3 and the device side terminal 102C of the supply side connection unit 102A are brought into contact with each other.
- Information is communicated between the information holding unit IC of the substrate cartridge 1 and the control unit 104 by contacting the terminal 3C with the device-side terminal 102C. Through this communication operation, the processing information and reference information held in the information holding unit IC are transmitted to the control unit 104.
- the information holding unit IC Prior to the connection operation of the cartridge 1, transmits the information to the control unit 104 by wireless communication performed between the communication unit CR of the information holding unit IC and the communication unit 104 CR of the control unit 104. You may make it.
- the supply operation will be described.
- the rotating shaft member 26a roller unit 26
- the tension roller 21a of the substrate cartridge 1 are rotated in the opposite direction to that in the accommodating operation, and shown in FIG.
- the sheet substrate FB is sent out through the opening 34.
- the element forming operation As shown in FIG. 2, while the sheet substrate FB is supplied from the substrate supply unit 101 to the substrate processing unit 102, the substrate processing unit 102 forms elements on the sheet substrate FB. In the substrate processing unit 102, as shown in FIG. 28, the sheet substrate FB is conveyed by a roller RR.
- the control unit 104 may control the operation of the substrate processing unit 102 based on the reference information supplied from the substrate cartridge 1. For example, the control unit 104 may adjust the rotation speed of each roller RR in the substrate processing unit 102 in accordance with the supply speed of the sheet substrate FB from the substrate cartridge 1. In addition, the control unit 104 detects whether or not the roller RR is displaced in the Y-axis direction, and when it is displaced, moves the roller RR to correct the position. Further, the control unit 104 also performs position correction of the sheet substrate FB.
- the sheet substrate FB supplied from the substrate supply unit 101 to the substrate processing unit 102 is first transported to the partition wall forming unit 91.
- the sheet substrate FB is sandwiched and pressed between the imprint roller 110 and the thermal transfer roller 115, and the partition BA and the alignment mark AM are formed on the sheet substrate by thermal transfer.
- the removal operation will be described. For example, after forming the organic EL element 50 on the sheet substrate FB and collecting the sheet substrate FB, the substrate cartridge 1 used as the substrate supply unit 101 is removed from the substrate processing unit 102.
- the control unit 104 can perform processing using information transmitted from the substrate cartridge 1. For example, the control unit 104 determines the processing state of the sheet substrate FB according to the processing information read from the information holding unit IC of the substrate cartridge 1 (substrate supply unit 101), and performs the following operations ( Supply operation, element formation operation, etc.) may be performed. For example, the control unit 104 determines whether or not the defective portion of the sheet substrate FB needs to be repaired, whether or not an element can be formed in the region including the defective portion of the sheet substrate FB, or excision of the defective portion of the sheet substrate FB by the cutting and removing device 109C. Is determined based on the defect information read from the information holding unit IC of the substrate supply unit 101.
- the control unit 104 can perform control so as not to process the defective portion. Thereby, the substrate processing apparatus 100 can reduce the cost (for example, the amount of material used, the application time of the material, etc.) used for each processing.
- the control unit 104 performs a process of repairing the defective portion in the partition formation operation, the electrode formation operation, and the light emitting layer formation operation. You may control. Note that the control unit 104 may perform control so that the repair history related to the repair of the defective portion processed in the substrate processing unit 102 is stored in the information holding unit IC of the substrate recovery unit 103 as processing information.
- the repair history includes the type of defect, the success or failure of repair of the defective portion, the repair content (for example, repair method or procedure) of what repair has been performed, the repair date and time, and the like.
- the control unit 104 performs control so that the defective portion is repaired based on the repair history when the defective portion is repaired. For example, the control unit 104 sets the optimal repair content for the defective portion to be repaired based on a combination of the type of defect, the success or failure of repair, and the repair content included in the repair history.
- control unit 104 applies, for example, a liquid droplet to a portion where an abnormality is detected in a part of the sheet substrate FB (eg, a defective portion) or a portion determined to be abnormal based on information from the substrate cartridge 1. It is also possible to control to directly form a pattern that can be distinguished from other parts by using the coating device 120, the droplet coating device 140, or the like. In this case, the abnormality detection device 109D only needs to detect the pattern, so that the detection accuracy is improved.
- the control unit 104 can store processing information such as defect information obtained in the process of each operation in the information holding unit IC of the substrate collection unit 103.
- the control unit 104 can cause the substrate collection unit 103 to store processing information obtained by each process in the substrate processing unit 102. Note that the processing information accumulated in the substrate recovery unit 103 is used as information as described above in the next production line or the like.
- the control unit 104 determines that the partition wall BA has already been formed on the sheet substrate FB based on the processing information read from the information holding unit IC of the substrate supply unit 101.
- the control unit 104 can omit the partition forming operation and perform the next electrode forming operation.
- the control unit 104 updates the information holding unit IC of the substrate recovery unit 103 as the processing information, which omits the partition forming operation as described above and causes the next electrode forming operation to be performed.
- control unit 104 may transmit the processing information of the substrate supply unit 101 to the substrate collection unit 103 after performing the above operations. In such a case, the control unit 104 transmits the processing information based on each process performed on the sheet substrate FB in the substrate processing unit 102 and the processing information of the substrate supply unit 101 to the substrate recovery unit 103.
- the unit 103 can hold processing progress information such as what processing has been performed on the sheet substrate FB as processing information.
- the substrate cutting unit 108 when cutting the sheet substrate FB in the substrate cutting unit 108, the substrate cutting unit 108 is provided with the defect or notch by cutting so as to avoid a portion where a defect or notch is formed.
- the part can be removed efficiently.
- a portion that can be used as an element can be reused separately.
- the removal operation will be described. For example, after forming the organic EL element 50 on the sheet substrate FB and collecting the sheet substrate FB, the substrate cartridge 1 used as the substrate supply unit 101 is removed from the substrate processing unit 102.
- FIG. 22 is a view showing the removal operation of the substrate cartridge 1.
- the mount unit 3 is removed by moving the mount unit 3 in the ⁇ X direction and removing it from the supply side connection unit 102A. In this operation, the mount portion 3 comes off along the guide of the supply side connection portion 102A.
- the substrate cartridge 1 includes the cartridge body 2 that houses the sheet substrate FB, the identification information that identifies the cartridge body 2, and the processing information of the sheet substrate FB that is housed in the cartridge body 2.
- the substrate processing unit 102 can perform appropriate processing on the sheet substrate FB based on the identification information or the processing information. .
- the substrate processing apparatus 100 includes a substrate processing unit 102 that processes the sheet substrate FB, a substrate supply unit 101 that carries the sheet substrate FB into the substrate processing unit 102, and the substrate processing unit 102. Since the substrate cartridge 1 is used as the substrate supply unit 101, the substrate processing unit 102 applies the information from the substrate cartridge 1 to the sheet substrate FB. Optimal processing can be performed. Thereby, the process with respect to the sheet
- the process of processing the sheet substrate FB in the substrate processing unit 102 and the substrate cartridge 1 is used to supply the sheet substrate FB to the substrate processing unit 102 or the substrate. And the step of recovering the sheet substrate FB from the processing unit 102. Therefore, the display element can be efficiently manufactured under a high level of information management.
- control unit 104 can update information such as processing information held in the information holding unit IC of the substrate cartridge 1, so that the substrate cartridge 1 used as the substrate supply unit 101 can be recycled. Is possible.
- the substrate processing apparatus 200 includes a substrate supply unit 201, a substrate processing unit 202, a substrate recovery unit 203, and a control unit 204.
- the substrate processing unit 202 has a configuration in which the substrate cutting unit 108 is not provided in the substrate processing unit 102 of the fourth embodiment, for example. For this reason, the sheet substrate FB processed by the substrate processing unit 202 is recovered by the substrate recovery unit 203 in a sheet form without being cut.
- the configuration in which the identification information and processing information of the sheet substrate FB are held, the configuration in which communication between the information holding unit IC and the control unit 204 is possible, and the like have been described in the fourth embodiment. It is the same as the configuration.
- the sheet substrate FB is inserted into the opening 34 of the substrate cartridge 1, and at the same time, the protective substrate PB is inserted from the second opening 35.
- the protection substrate PB is supplied from, for example, a protection substrate supply unit (not shown).
- the inserted sheet substrate FB and protective substrate PB are guided by the substrate guide portion 22 and the second substrate guide portion 37, respectively, as shown in FIG.
- the sheet substrate FB and the protective substrate PB that have joined at the joining unit 39 are transported by the transport unit 21 in a joined state, and are pressed against and closely contacted with the tension roller 21a and the measuring roller 21b.
- the sheet substrate FB and the protective substrate PB are wound and collected by the roller unit 26 in a close contact state.
- the control unit 204 transmits the processing information of the processed sheet substrate FB to the information holding unit IC of the substrate cartridge 1 used as the substrate collection unit 203. .
- the information holding unit IC receives the transmitted information and stores it in the storage unit MR.
- the substrate processing apparatus 200 includes the substrate processing unit 202 that processes the sheet substrate FB, the substrate supply unit 201 that carries the sheet substrate FB into the substrate processing unit 202, and the substrate processing unit. 202, the substrate collection unit 203 for carrying out the substrate from the substrate 202, and the substrate cartridge 1 is used as the substrate supply unit 201 and the substrate collection unit 203. Therefore, the processing information from the substrate cartridge 1 is the collection destination substrate. It is transmitted to the cartridge 1.
- the substrate processing apparatus 200 uses the above information even when managing the collection destination substrate cartridge 1 or when processing the sheet substrate FB accommodated in the collection destination substrate cartridge 1. Can do. Thereby, the information management capability of the substrate processing apparatus 200 can be improved, and the processing efficiency is significantly improved.
- the present invention is not limited to this.
- the substrate processing unit 202 only a part of the partition wall forming unit 91, the electrode forming unit 92, and the light emitting layer forming unit 93 constituting the substrate processing unit 102 described in the fourth embodiment may be provided. I do not care.
- the sheet substrate FB is recovered by the substrate recovery unit 203 in a state where only the partition walls BA are formed.
- the sheet substrate FB collected by the substrate collection unit 203 is subjected to electrode formation processing and light emitting layer formation processing in another substrate processing unit.
- the substrate cartridge 1 Since the substrate cartridge 1 is detachably attached to the substrate processing unit 202, in such a case, the substrate cartridge 1 is removed from the substrate processing unit 202, and the substrate cartridge 1 is transported to another substrate processing unit. Can be connected. Since the information holding unit IC of the substrate cartridge 1 holds the identification information of the substrate cartridge 1 and the processing information of the sheet substrate FB, the connected substrate processing unit can also perform processing using the information. it can. As described above, the information on the sheet substrate FB is transmitted through the substrate cartridge 1 even when the substrate processing units straddle a plurality of substrate processing units in one production line and information communication is not performed between the substrate processing units. Can communicate. Even in this case, the information management capability can be improved, and the processing efficiency is remarkably improved.
- FIG. 30 is a diagram showing a configuration of the substrate processing system SYS according to the present embodiment.
- the substrate processing system SYS includes a first substrate processing apparatus 300, a second substrate processing apparatus 310, and a main controller CONT.
- the first substrate processing apparatus 300 and the second substrate processing apparatus 310 are installed in, for example, the same site or the same factory.
- the first substrate processing apparatus 300 is an apparatus that forms the partition walls BA of the organic EL elements 50 on the sheet substrate FB, for example.
- the second substrate processing apparatus 310 is an apparatus that forms, for example, an electrode (such as the gate electrode G), the light emitting layer IR of the organic EL element 50, and the transparent electrode ITO on the sheet substrate FB.
- the substrate processing system SYS has a configuration in which the apparatus for forming the organic EL element 50 is divided into two types of apparatuses, the first substrate processing apparatus 300 and the second substrate processing apparatus 310.
- the first substrate processing apparatus 300 includes a substrate supply unit 301, a substrate processing unit 302, and a substrate recovery unit 303.
- the substrate cartridge 1 is used as the substrate supply unit 301 and the substrate recovery unit 303.
- the substrate processing unit 302 has the same configuration as the partition wall forming unit 91 in the substrate processing apparatus 100 of the fourth embodiment, and a supply side connection unit 302A is provided at a connection part with the substrate supply unit 301. Yes.
- the configuration of the supply side connection portion 302A is the same as that of the supply side connection portion 102A in the fourth embodiment.
- the first substrate processing apparatus 300 has the same configuration as the configuration from the substrate supply unit 101 of the substrate processing apparatus 100 to the partition wall forming unit 91 of the substrate processing unit 102 in the fourth embodiment.
- a connection part with the substrate recovery unit 303 is provided with a recovery side connection unit 302 ⁇ / b> B connected to the mount unit 3 of the substrate cartridge 1.
- the collection side connection unit 302B has the same configuration as the supply side connection unit 302A.
- the second substrate processing apparatus 310 includes a substrate supply unit 311, a substrate processing unit 312, and a substrate recovery unit 313, and each unit has the same configuration as the first substrate processing apparatus 300.
- the substrate processing unit 312 has the same configuration as the electrode forming unit 92 and the light emitting layer forming unit 93 in the substrate processing apparatus 100 of the fourth embodiment.
- the substrate cartridge 1 is used as the substrate supply unit 311 and the substrate recovery unit 313. Further, the substrate recovery unit 303 (substrate cartridge 1) removed from the first substrate processing apparatus 300 and transported to the second substrate processing apparatus 310 is used as the substrate supply unit 311 of the second substrate processing apparatus 310. ing. Therefore, the substrate cartridge 1 also functions as a relay device that relays the sheet substrate FB from the first substrate processing apparatus 300 to the second substrate processing apparatus 310.
- the main controller CONT is connected to each of the first substrate processing apparatus 300 and the second substrate processing apparatus 310 via a wired or wireless communication mechanism, and the first substrate processing apparatus 300 and the second substrate processing apparatus.
- the apparatus 310 is generally controlled. For this reason, the main controller CONT can comprehensively manage information held in the information holding unit IC of the substrate cartridge 1 used in the first substrate processing apparatus 300 and the second substrate processing apparatus 310. .
- the main controller CONT comprehensively manages the information held in the information holding unit IC of the substrate cartridge 1
- the information management capability of the substrate processing system SYS is improved.
- the processing efficiency of the substrate processing system SYS is significantly improved.
- the information holding unit IC of the substrate cartridge 1 holds only the identification information. It does not matter.
- the main controller CONT for example, the main memory MMR (see FIG. 27) of the main controller CONT has processing information corresponding to the identification information, and the main controller The CONT can recognize the processing information based on the identification information of the substrate cartridge 1 and can perform processing based on the processing information.
- the processing information includes defect information of the sheet substrate FB as shown in FIG.
- the main control unit CONT reads defect information corresponding to the identification information read from the information holding unit IC from the main storage unit MMR. Then, a processing signal is transmitted to the first substrate processing apparatus 300 or the second substrate processing apparatus 310 in order to perform processing based on the defect information (for example, repair of the defective portion).
- the processing signal is, for example, a command signal such as a setting value for causing the first substrate processing apparatus 300 to perform each processing.
- the control unit 104 may be used instead of the main control device CONT. Thereby, the processing efficiency of the first substrate processing apparatus 300 or the second substrate processing apparatus 310 is improved.
- the technical scope of the present invention is not limited to the above-described embodiment, and appropriate modifications can be made without departing from the spirit of the present invention.
- the forming apparatus 109A, the detecting apparatus 109B, the cutting / removing apparatus 109C, and the abnormality detecting apparatus 109D shown in FIG. 28 of the fourth embodiment are merely examples, and may be arranged differently from the arrangement shown in FIG. Of course, a configuration in which some devices are not provided may be employed.
- the substrate processing unit 102 may be configured to remove a part of the sheet substrate FB using the substrate cutting device 108.
- a plurality of forming devices 109A, detecting devices 109B, and cutting / removing devices 109C may be provided.
- the abnormality detection device 109 ⁇ / b> D is not limited to a configuration in which the abnormality detection device 109 ⁇ / b> D is disposed on each downstream side of the partition wall formation unit 91, the electrode formation unit 92, and the light emitting layer formation unit 93, and may be appropriately omitted or increased in number.
- the pattern PTN or the like is formed using, for example, the imprint roller 110 or the thermal transfer roller 115 of the partition wall forming unit 91, the droplet applying device 120 of the electrode forming unit 92, the droplet applying device 140 of the light emitting layer forming unit 93, or the like. It may be formed on the sheet substrate FB. Note that the pattern PTN may be formed in advance on the sheet substrate FB.
- the configuration for forming the encoder pattern indicating the position in the X direction as the pattern PTN in the above description is an example, and the encoder pattern may be formed in advance on the sheet substrate FB.
- the substrate processing apparatus 102 measures, for example, the distance from the edge in the Y direction of the sheet substrate FB or the pattern PTN (distance in the Y direction).
- a configuration in which the position in the Y direction is detected using an apparatus or the like may be used.
- a detection device that detects grid-like position coordinates in the XY directions set on the sheet substrate FB may be separately provided in the substrate processing unit 102.
- the substrate cartridge 1 is used only for the substrate supply unit of the substrate processing unit, and the substrate cartridge 1 is used for both the substrate supply unit and the substrate recovery unit of the substrate processing unit.
- the substrate cartridge 1 may be used only for the substrate recovery unit.
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Abstract
Description
本願は、2009年11月5日に出願された特願2009-253975号及び特願2009-253976号に基づき優先権を主張し、その内容をここに援用する。 The present invention relates to a substrate cartridge, a substrate processing apparatus, a substrate processing system, a substrate processing method, a control device, and a display element manufacturing method.
This application claims priority based on Japanese Patent Application Nos. 2009-253975 and 2009-253976 filed on Nov. 5, 2009, the contents of which are incorporated herein by reference.
(有機EL素子)
図1Aは、有機EL素子の構成を示す平面図である。図1Bは、図1Aにおけるb-b断面図である。図1Cは、図1Aにおけるc-c断面図である。 Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.
(Organic EL device)
FIG. 1A is a plan view showing a configuration of an organic EL element. 1B is a cross-sectional view taken along line bb in FIG. 1A. 1C is a cross-sectional view taken along the line cc in FIG. 1A.
図2は、可撓性を有するシート基板FBを用いて処理を行う基板処理装置100の構成を示す概略図である。
基板処理装置100は、帯状のシート基板FBを用いて図1に示す有機EL素子50を形成する装置である。図2に示すように、基板処理装置100は、基板供給部101、基板処理部102、基板回収部103及び制御部104を有している。シート基板FBは、基板供給部101から基板処理部102を経て基板回収部103へと搬送されるようになっている。制御部104は、基板処理装置100の動作を統括的に制御する。また、制御部104は、情報を記憶する記憶部であるデータベース104DBを有する。 (Substrate processing equipment)
FIG. 2 is a schematic diagram illustrating a configuration of a
The
図3に示すように、基板処理部102は、搬送部105、素子形成部106、アライメント部107及び基板切断部108を有している。基板処理部102は、基板供給部101から供給されるシート基板FBを搬送しつつ、当該シート基板FBに上記の有機EL素子50の各構成要素を形成し、有機EL素子50が形成されたシート基板FBを基板回収部103へと送り出す部分である。 FIG. 3 is a diagram illustrating a configuration of the
As shown in FIG. 3, the
本実施形態では、液滴塗布装置120として、例えばゲート電極Gを形成する際に用いられる液滴塗布装置120G、ゲート絶縁層Iを形成する際に用いられる液滴塗布装置120I、ソース電極S、ドレイン電極D及び画素電極Pを形成する際に用いられる液滴塗布装置120SD、有機半導体OSを形成する際に用いられる液滴塗布装置120OSなどが用いられている。 The
In this embodiment, as the
本実施形態では、基板供給部101及び基板回収部103として、基板カートリッジ1が用いられている。以下の説明においては、説明の便宜上、図2と共通のXYZ直交座標系を設定し、このXYZ直交座標系を参照しつつ各部材の位置関係について説明する。以下のXYZ直交座標系は、基板供給部101が基板処理部102に接続されている状態において基板カートリッジ1が当該基板供給部101として用いられる場合を例に挙げて説明する。 (Substrate cartridge)
In the present embodiment, the
制御部104は、例えば識別情報、諸元情報テーブル及びプロセス情報(プロセスID)を対応付けて記憶させる第1テーブルと、プロセスIDと単位処理の組み合わせ情報とを対応付けて記憶させる第2テーブルとを有するデータベース104DBが設けられている。 7A and 7B are table diagrams of information stored in the
For example, the
次に、上記のように構成された基板カートリッジ1にシート基板FBを収容する収容動作を説明する。図8及び図9は、収容動作時の基板カートリッジ1の状態を示す図である。図8及び図9においては、図を判別しやすくするため、基板カートリッジ1の外形を破線で示している。 (Accommodating sheet substrate in substrate cartridge)
Next, an accommodating operation for accommodating the sheet substrate FB in the
次に、上記のように構成された基板処理装置100の動作を説明する。
本実施形態では、シート基板FBを収容した基板カートリッジ1を基板供給部101として供給側接続部102Aに接続する接続動作、基板供給部101による基板カートリッジ1によるシート基板FBの供給動作、基板処理部102による素子形成動作、基板カートリッジ1の取り外し動作、を順に行う。 (Operation of substrate processing equipment)
Next, the operation of the
In the present embodiment, a connection operation for connecting the
図10に示すように、供給側接続部102Aについては、マウント部3に対応する形状に挿入口を形成しておく。 First, the connection operation of the
As shown in FIG. 10, the supply
位置ずれの時間が短時間であれば、液滴塗布装置120の複数のノズル122のうち液滴を塗布するノズル122を切り替えることによって対応する。ずれが長時間続くようであれば、当該ズレを検出したアライメントカメラCAを挟む位置に設けられる2つのローラRRをX方向又はY方向に移動させ、シート基板FBのθZ方向の位置補正を行う。 For example, the
If the positional deviation time is short, it can be dealt with by switching the
図22に示すように、取り外し動作では、マウント部3を-X方向に移動させて供給側接続部102Aから外すことで、マウント部3を外すようにする。この動作において、マウント部3は、供給側接続部102Aのガイドに沿って外れることになる。 FIG. 22 is a view showing the removal operation of the
As shown in FIG. 22, in the removal operation, the
次に、本発明の第2実施形態を説明する。
図23は、本実施形態に係る基板処理装置200の構成を示す図である。
図23に示されるように、基板処理装置200は、基板供給部201、基板処理部202、基板回収部203及び制御部204を有している。本実施形態では、基板供給部201及び基板回収部203のそれぞれに上記基板カートリッジ1が用いられている点で第1実施形態とは異なっている。 [Second Embodiment]
Next, a second embodiment of the present invention will be described.
FIG. 23 is a diagram showing a configuration of the
As shown in FIG. 23, the
回収動作では、図24に示すように、基板カートリッジ1の開口部34にシート基板FBを挿入すると同時に、第2開口部35から保護基板PBを挿入する。保護基板PBは、例えば不図示の保護基板供給部から供給される。 24 to 26 are diagrams showing how the sheet substrate FB is recovered by the
In the collecting operation, as shown in FIG. 24, the sheet substrate FB is inserted into the
次に、本発明の第3実施形態を説明する。
本実施形態では、複数の基板処理部において情報の通信が行われる場合を例に挙げて説明する。 [Third Embodiment]
Next, a third embodiment of the present invention will be described.
In the present embodiment, a case where information communication is performed in a plurality of substrate processing units will be described as an example.
図27に示されるように、基板処理システムSYSは、第1基板処理装置300、第2基板処理装置310及び主制御装置CONTを有している。この第1基板処理装置300及び第2基板処理装置310は、例えば同一の敷地内や、同一の工場内に設置されている。 FIG. 27 is a diagram showing a configuration of the substrate processing system SYS according to the present embodiment.
As shown in FIG. 27, the substrate processing system SYS has a first
例えば、基板カートリッジ1が諸元情報を保持しないで、プロセスIDを保持させる構成としても構わない。この構成によれば、基板処理システムSYSの情報管理がより簡単になる。 The technical scope of the present invention is not limited to the above-described embodiment, and appropriate modifications can be made without departing from the spirit of the present invention.
For example, the
次に、本発明の第4実施形態を説明する。以下の説明では、上記実施形態と同一又は同等の構成要素については、同一の符号を付し、その説明を省略あるいは簡略化する。本実施形態においても、図2に示すように、基板処理装置100は、可撓性を有する帯状のシート基板FBを用いて図1に示す有機EL素子50を形成する装置である。図2に示すように、基板処理装置100は、基板供給部101、基板処理部102、基板回収部103及び制御部104を有している。シート基板FBは、基板供給部101から基板処理部102を経て基板回収部103へと搬送されるようになっている。制御部104は、基板処理装置100の動作を統括的に制御する。また、制御部104は、情報を記憶する記憶部であるデータベース104DBを有する。 [Fourth Embodiment]
Next, a fourth embodiment of the present invention will be described. In the following description, components that are the same as or equivalent to those in the above embodiment are denoted by the same reference numerals, and the description thereof is omitted or simplified. Also in this embodiment, as shown in FIG. 2, the
図28に示すように、基板処理部102は、搬送部105、素子形成部106、アライメント部107及び基板切断部108を有している。基板処理部102は、基板供給部101から供給されるシート基板FBを搬送しつつ、当該シート基板FBに上記の有機EL素子50の各構成要素を形成し、有機EL素子50が形成されたシート基板FBを基板回収部103へと送り出す部分である。 FIG. 28 is a diagram illustrating a configuration of the
As shown in FIG. 28, the
また、図28に示す実施形態においては、基板供給部102の情報保持部ICに欠陥情報が記憶されている場合、該欠陥情報に含まれる欠陥部分は、該欠陥部分の位置情報に基づき、切断除去装置109Cによって切断されて除去される。この場合、例えば図29Bに示すように、シート基板FBの一部に切り欠き部CHが形成されることになる。 In the embodiment shown in FIG. 28, when a defect portion on the sheet substrate FB is detected by the
In the embodiment shown in FIG. 28, when defect information is stored in the information holding unit IC of the
次に、上記のように構成された基板処理装置100の動作を説明する。
本実施形態においても、シート基板FBを収容した基板カートリッジ1を基板供給部101として供給側接続部102Aに接続する接続動作、基板供給部101による基板カートリッジ1によるシート基板FBの供給動作、基板処理部102による素子形成動作、基板カートリッジ1の取り外し動作、を順に行う。 (Operation of substrate processing equipment)
Next, the operation of the
Also in the present embodiment, the connection operation of connecting the
図22に示すように、取り外し動作では、マウント部3を-X方向に移動させて供給側接続部102Aから外すことで、マウント部3を外すようにする。この動作において、マウント部3は、供給側接続部102Aのガイドに沿って外れることになる。 FIG. 22 is a view showing the removal operation of the
As shown in FIG. 22, in the removal operation, the
次に、本発明の第5実施形態を説明する。
本実施形態では、基板供給部201及び基板回収部203のそれぞれに上記基板カートリッジ1が用いられている点で第4実施形態とは異なっている。本実施形態においても、図23に示すように、基板処理装置200は、基板供給部201、基板処理部202、基板回収部203及び制御部204を有している。 [Fifth Embodiment]
Next, a fifth embodiment of the present invention will be described.
This embodiment is different from the fourth embodiment in that the
次に、本発明の第6実施形態を説明する。
本実施形態では、複数の基板処理部において情報の通信が行われる場合を例に挙げて説明する。 [Sixth Embodiment]
Next, a sixth embodiment of the present invention will be described.
In the present embodiment, a case where information communication is performed in a plurality of substrate processing units will be described as an example.
図30に示されるように、基板処理システムSYSは、第1基板処理装置300、第2基板処理装置310及び主制御装置CONTを有している。この第1基板処理装置300及び第2基板処理装置310は、例えば同一の敷地内や、同一の工場内に設置されている。 FIG. 30 is a diagram showing a configuration of the substrate processing system SYS according to the present embodiment.
As shown in FIG. 30, the substrate processing system SYS includes a first
例えば、第4実施形態の図28に示される形成装置109A、検出装置109B、切断除去装置109C及び異常検知装置109Dは、一例に過ぎず、図3に示される配置とは異なる配置であっても構わないし、一部の装置を設けないようにする構成であっても構わない。 The technical scope of the present invention is not limited to the above-described embodiment, and appropriate modifications can be made without departing from the spirit of the present invention.
For example, the forming
Claims (65)
- 基板を収容するカートリッジ本体と、
少なくとも前記カートリッジ本体に収容される前記基板の諸元値に関する諸元情報を含む情報を保持する情報保持部と
を備える基板カートリッジ。 A cartridge body for accommodating the substrate;
A substrate cartridge comprising: an information holding unit that holds at least information including specification information relating to specification values of the substrate accommodated in the cartridge main body. - 前記情報保持部は、前記諸元情報に基づくプロセス情報を保持する
請求項1に記載の基板カートリッジ。 The substrate cartridge according to claim 1, wherein the information holding unit holds process information based on the specification information. - 基板を収容するカートリッジ本体と、
少なくとも前記カートリッジ本体に収容される前記基板の諸元値に関する諸元情報に基づくプロセス情報を含む情報を保持する情報保持部と
を備える基板カートリッジ。 A cartridge body for accommodating the substrate;
A substrate cartridge comprising: an information holding unit that holds information including at least process information based on specification information relating to specification values of the substrate contained in the cartridge main body. - 前記諸元値は、前記基板の材質、可撓性、耐熱性、磨耗性、伸縮性、厚さ、膨張係数、摩擦係数及び耐テンション性のうち少なくとも1つを含む
請求項1から請求項3のうちいずれか一項に記載の基板カートリッジ。 The specification value includes at least one of a material, flexibility, heat resistance, wear resistance, stretchability, thickness, expansion coefficient, friction coefficient, and tension resistance of the substrate. The substrate cartridge according to any one of the above. - 前記諸元値は、前記基板に付着させる所定液体との親液性、及び、前記基板上の前記所定液体の乾燥性のうち少なくとも1つを含む
請求項1から請求項4のうちいずれか一項に記載の基板カートリッジ。 5. The specification value includes at least one of a lyophilic property with a predetermined liquid attached to the substrate and a drying property of the predetermined liquid on the substrate. The substrate cartridge according to Item. - 前記諸元情報は、前記基板に対して行われた前処理に関する前処理情報を含む
請求項1から請求項5のうちいずれか一項に記載の基板カートリッジ。 The substrate cartridge according to any one of claims 1 to 5, wherein the specification information includes preprocessing information regarding preprocessing performed on the substrate. - 前記情報は、前記カートリッジ本体を識別する識別情報を含む
請求項1から請求項6に記載の基板カートリッジ。 The substrate cartridge according to claim 1, wherein the information includes identification information for identifying the cartridge main body. - 前記情報保持部は、複数箇所に設けられている
請求項1から請求項7のいずれか一項に記載の基板カートリッジ。 The substrate cartridge according to any one of claims 1 to 7, wherein the information holding unit is provided at a plurality of locations. - 前記情報保持部は、前記カートリッジ本体に対して分離可能に設けられる
請求項1から請求項8のうちいずれか一項に記載の基板カートリッジ。 The substrate cartridge according to claim 1, wherein the information holding unit is provided so as to be separable from the cartridge main body. - 前記情報保持部に接続され、前記情報の送信及び受信のうち少なくとも一方を行う通信部
を更に備える請求項1から請求項9のうちいずれか一項に記載の基板カートリッジ。 The substrate cartridge according to any one of claims 1 to 9, further comprising a communication unit connected to the information holding unit and performing at least one of transmission and reception of the information. - 前記カートリッジ本体は、前記基板を処理する基板処理装置に対して着脱可能に接続されるマウント部を有する
請求項1から請求項10のうちいずれか一項に記載の基板カートリッジ。 The substrate cartridge according to any one of claims 1 to 10, wherein the cartridge main body includes a mount portion that is detachably connected to a substrate processing apparatus that processes the substrate. - 前記マウント部は、前記基板処理装置の一部によって案内される被案内部を有する
請求項11に記載の基板カートリッジ。 The substrate cartridge according to claim 11, wherein the mount portion includes a guided portion guided by a part of the substrate processing apparatus. - 前記マウント部は、前記基板処理装置と前記情報保持部とを電気的に接続する端子部を有する
請求項11又は請求項12に記載の基板カートリッジ。 The substrate cartridge according to claim 11, wherein the mount unit includes a terminal unit that electrically connects the substrate processing apparatus and the information holding unit. - 前記カートリッジ本体は、前記諸元情報に基づいて前記基板の引き込み及び前記基板の送り出しのうち少なくとも一方を行う基板駆動機構を有する
請求項1から請求項13のうちいずれか一項に記載の基板カートリッジ。 The substrate cartridge according to any one of claims 1 to 13, wherein the cartridge main body includes a substrate driving mechanism that performs at least one of drawing the substrate and feeding the substrate based on the specification information. . - 前記情報保持部は、前記情報を表示する表示部を有する
請求項1から請求項14のうちいずれか一項に記載の基板カートリッジ。 The substrate cartridge according to any one of claims 1 to 14, wherein the information holding unit includes a display unit that displays the information. - 基板を処理する基板処理部と、
前記基板処理部に前記基板の搬入を行う基板搬入部と、
前記基板処理部から前記基板の搬出を行う基板搬出部と
を備え、
前記基板搬入部及び前記基板搬出部のうち少なくとも一方として、前記請求項1から請求項15のうちいずれか一項に記載の基板カートリッジが用いられる
基板処理装置。 A substrate processing unit for processing the substrate;
A substrate carry-in unit for carrying the substrate into the substrate processing unit;
A substrate unloading unit for unloading the substrate from the substrate processing unit,
The substrate processing apparatus according to any one of claims 1 to 15, wherein at least one of the substrate carry-in unit and the substrate carry-out unit is used. - 前記基板処理部での前記処理には、前記基板カートリッジの前記情報保持部に保持される前記情報が用いられる
請求項16に記載の基板処理装置。 The substrate processing apparatus according to claim 16, wherein the information held in the information holding unit of the substrate cartridge is used for the processing in the substrate processing unit. - 前記処理は、前記基板の前記諸元情報に応じた少なくとも1つの単位処理を含み、
前記基板処理部は、前記情報に応じて前記単位処理を切り替える
請求項16又は請求項17に記載の基板処理装置。 The processing includes at least one unit processing according to the specification information of the substrate,
The substrate processing apparatus according to claim 16, wherein the substrate processing unit switches the unit processing according to the information. - 前記処理は、前記基板の前記諸元情報に応じた少なくとも1つの単位処理を含む
請求項16又は請求項17に記載の基板処理装置。 The substrate processing apparatus according to claim 16, wherein the processing includes at least one unit processing corresponding to the specification information of the substrate. - 前記基板カートリッジとの間で電気的に接続される装置側端子部
を更に備える請求項16から請求項19のいずれか一項に記載の基板処理装置。 The substrate processing apparatus according to any one of claims 16 to 19, further comprising a device-side terminal portion that is electrically connected to the substrate cartridge. - 前記基板処理部は、前記基板カートリッジとの間で前記情報の送信及び受信のうち少なくとも一方を行う装置側通信部を有する
請求項16から請求項20のうちいずれか一項に記載の基板処理装置。 The substrate processing apparatus according to any one of claims 16 to 20, wherein the substrate processing unit includes an apparatus-side communication unit that performs at least one of transmission and reception of the information with the substrate cartridge. . - 基板を処理する基板処理装置と、
前記基板処理装置に接続される、請求項1から請求項15のうちいずれか一項に記載の基板カートリッジと、
前記基板カートリッジの前記情報保持部から前記情報を受け取ると共に、前記情報に基づいて前記基板処理装置を制御する主制御装置と
を備える基板処理システム。 A substrate processing apparatus for processing a substrate;
The substrate cartridge according to any one of claims 1 to 15, which is connected to the substrate processing apparatus,
A substrate processing system comprising: a main controller that receives the information from the information holding unit of the substrate cartridge and controls the substrate processing apparatus based on the information. - 前記処理は、前記基板の前記諸元情報に応じた少なくとも1つの単位処理を含む
請求項22に記載の基板処理システム。 The substrate processing system according to claim 22, wherein the processing includes at least one unit processing corresponding to the specification information of the substrate. - 前記主制御装置は、前記情報に応じて前記基板処理装置における前記単位処理を切り替える
請求項23に記載の基板処理システム。 The substrate processing system according to claim 23, wherein the main control device switches the unit processing in the substrate processing apparatus according to the information. - 基板を供給しつつ前記基板を処理し、処理後の前記基板を回収する基板処理方法であって、
請求項1から請求項15のうちいずれか一項に記載の基板カートリッジを用いて、前記基板の供給及び前記基板の回収のうち少なくとも一方を行い、
前記基板カートリッジを介して得られる前記情報を用いて前記基板を処理する
基板処理方法。 A substrate processing method of processing the substrate while supplying the substrate and recovering the processed substrate,
Using the substrate cartridge according to any one of claims 1 to 15, at least one of supply of the substrate and recovery of the substrate is performed,
A substrate processing method for processing the substrate using the information obtained through the substrate cartridge. - 前記基板の前記諸元情報に応じた少なくとも1つの単位処理を、前記情報に応じて切り替えながら前記処理を行う
請求項25に記載の基板処理方法。 The substrate processing method according to claim 25, wherein the processing is performed while switching at least one unit processing according to the specification information of the substrate according to the information. - 前記処理は、前記諸元情報に応じた少なくとも1つの単位処理を行う
請求項25に記載の基板処理方法。 The substrate processing method according to claim 25, wherein the processing performs at least one unit processing according to the specification information. - 基板を処理する基板処理装置、及び、前記基板処理装置に接続される請求項1から請求項15のうちいずれか一項に記載の基板カートリッジ、を制御する主制御部を備える
制御装置。 A control apparatus comprising: a main control unit that controls a substrate processing apparatus that processes a substrate; and the substrate cartridge according to claim 1 connected to the substrate processing apparatus. - 基板処理部において基板を処理する工程と、
請求項1から請求項15のうちいずれか一項に記載の基板カートリッジを用いて、前記基板処理部に前記基板を供給する又は前記基板処理部から前記基板を回収する工程と、を有する
表示素子の製造方法。 Processing the substrate in the substrate processing unit;
A step of supplying the substrate to the substrate processing unit or recovering the substrate from the substrate processing unit using the substrate cartridge according to any one of claims 1 to 15. Manufacturing method. - 基板を収容するカートリッジ本体と、
前記カートリッジ本体を識別する識別情報及び前記カートリッジ本体に収容される前記基板の処理情報のうち少なくとも一方の情報を保持する情報保持部と
を備える基板カートリッジ。 A cartridge body for accommodating the substrate;
A substrate cartridge comprising: an information holding unit that holds at least one of identification information for identifying the cartridge body and processing information of the substrate housed in the cartridge body. - 前記処理情報は、前記基板の欠陥情報を含む
請求項30に記載の基板カートリッジ。 The substrate cartridge according to claim 30, wherein the processing information includes defect information of the substrate. - 前記情報保持部は、前記処理情報を有し、
前記処理情報は、前記基板の所定部分に関する位置情報を含む
請求項30又は請求項31に記載の基板カートリッジ。 The information holding unit has the processing information,
32. The substrate cartridge according to claim 30, wherein the processing information includes position information regarding a predetermined portion of the substrate. - 前記所定部分は、前記基板の欠陥部分を含む
請求項32に記載の基板カートリッジ。 The substrate cartridge according to claim 32, wherein the predetermined portion includes a defective portion of the substrate. - 前記処理情報は、前記欠陥部分の欠陥履歴を含む
請求項33に記載の基板カートリッジ。 The substrate cartridge according to claim 33, wherein the processing information includes a defect history of the defective portion. - 前記位置情報は、前記基板の端部と前記所定部分との間の距離を含む
請求項32から請求項34のうちいずれか一項に記載の基板カートリッジ。 The substrate cartridge according to any one of claims 32 to 34, wherein the position information includes a distance between an end portion of the substrate and the predetermined portion. - 前記位置情報は、前記基板上のマークと前記所定部分との間の距離を含む
請求項32から請求項35のうちいずれか一項に記載の基板カートリッジ。 The substrate cartridge according to any one of claims 32 to 35, wherein the position information includes a distance between a mark on the substrate and the predetermined portion. - 前記情報保持部は、前記処理情報を有し、
前記処理情報は、前記基板に対する所定処理の進捗情報を含む
請求項30から請求項36のうちいずれか一項に記載の基板カートリッジ。 The information holding unit has the processing information,
The substrate cartridge according to any one of claims 30 to 36, wherein the processing information includes progress information of a predetermined processing for the substrate. - 前記情報保持部は、前記処理情報を有し、
前記処理情報は、前記基板に形成される形成層の形態情報を含む
請求項30から請求項37のうちいずれか一項に記載の基板カートリッジ。 The information holding unit has the processing information,
The substrate cartridge according to any one of claims 30 to 37, wherein the processing information includes configuration information of a formation layer formed on the substrate. - 前記情報保持部は、前記処理情報を有し、
前記処理情報は、前記基板の形状に関する形状情報を含む
請求項30から請求項38のうちいずれか一項に記載の基板カートリッジ。 The information holding unit has the processing information,
The substrate cartridge according to any one of claims 30 to 38, wherein the processing information includes shape information related to a shape of the substrate. - 前記情報保持部は、前記処理情報を有し、
前記基板は、単位基板が複数接続されて形成されており、
前記処理情報は、前記単位基板同士の接続部分の位置に関する情報を含む
請求項30から請求項39のうちいずれか一項に記載の基板カートリッジ。 The information holding unit has the processing information,
The substrate is formed by connecting a plurality of unit substrates,
The substrate cartridge according to any one of claims 30 to 39, wherein the processing information includes information related to a position of a connection portion between the unit substrates. - 前記情報保持部は、前記処理情報を有し、
前記処理情報の少なくとも一部は、前記基板に形成されている
請求項30から請求項40のうちいずれか一項に記載の基板カートリッジ。 The information holding unit has the processing information,
The substrate cartridge according to any one of claims 30 to 40, wherein at least a part of the processing information is formed on the substrate. - 前記情報保持部は、前記カートリッジ本体に対して分離可能に設けられる
請求項30から請求項41のうちいずれか一項に記載の基板カートリッジ。 The substrate cartridge according to any one of claims 30 to 41, wherein the information holding unit is provided so as to be separable from the cartridge body. - 前記情報保持部は、複数箇所に設けられている
請求項30から請求項42のうちいずれか一項に記載の基板カートリッジ。 The substrate cartridge according to any one of claims 30 to 42, wherein the information holding unit is provided at a plurality of locations. - 前記情報保持部に接続され、前記情報の送信及び受信のうち少なくとも一方を行う通信部
を更に備える請求項30から請求項43のうちいずれか一項に記載の基板カートリッジ。 The substrate cartridge according to any one of claims 30 to 43, further comprising a communication unit connected to the information holding unit and performing at least one of transmission and reception of the information. - 前記情報保持部は、前記識別情報を有し、
前記通信部は、前記識別情報に対応する前記処理情報を受信する
請求項30から請求項44のうちいずれか一項に記載の基板カートリッジ。 The information holding unit has the identification information,
The substrate cartridge according to any one of claims 30 to 44, wherein the communication unit receives the processing information corresponding to the identification information. - 前記カートリッジ本体は、前記基板を処理する基板処理装置に対して着脱可能に接続されるマウント部を有する
請求項30から請求項45のうちいずれか一項に記載の基板カートリッジ。 The substrate cartridge according to any one of claims 30 to 45, wherein the cartridge main body includes a mount portion that is detachably connected to a substrate processing apparatus that processes the substrate. - 前記マウント部は、前記基板処理装置の一部によって案内される被案内部を有する
請求項46に記載の基板カートリッジ。 The substrate cartridge according to claim 46, wherein the mount portion includes a guided portion guided by a part of the substrate processing apparatus. - 前記マウント部は、前記基板処理装置と前記情報保持部とを電気的に接続する端子部を有する
請求項46又は請求項47に記載の基板カートリッジ。 48. The substrate cartridge according to claim 46, wherein the mount portion includes a terminal portion that electrically connects the substrate processing apparatus and the information holding portion. - 前記カートリッジ本体は、前記基板の引き込み又は前記基板の送り出しのうち少なくとも一方を行う基板駆動機構を有する
請求項30から請求項48のうちいずれか一項に記載の基板カートリッジ。 The substrate cartridge according to any one of claims 30 to 48, wherein the cartridge main body includes a substrate driving mechanism that performs at least one of drawing the substrate and feeding the substrate. - 前記情報保持部は、前記情報を表示する表示部を有する
請求項30から請求項49のうちいずれか一項に記載の基板カートリッジ。 The substrate cartridge according to any one of claims 30 to 49, wherein the information holding unit includes a display unit that displays the information. - 前記情報保持部は、前記識別情報に対応させて前記処理情報を有する
請求項30から請求項50のうちいずれか一項に記載の基板カートリッジ。 The substrate cartridge according to any one of claims 30 to 50, wherein the information holding unit has the processing information corresponding to the identification information. - 基板を処理する基板処理部と、
前記基板処理部に前記基板の搬入を行う基板搬入部と、
前記基板処理部から前記基板の搬出を行う基板搬出部と
を備え、
前記基板搬入部及び前記基板搬出部のうち少なくとも一方として、前記請求項30から請求項51のうちいずれか一項に記載の基板カートリッジが用いられる
基板処理装置。 A substrate processing unit for processing the substrate;
A substrate carry-in unit for carrying the substrate into the substrate processing unit;
A substrate unloading unit for unloading the substrate from the substrate processing unit,
52. The substrate processing apparatus, wherein the substrate cartridge according to any one of claims 30 to 51 is used as at least one of the substrate carry-in portion and the substrate carry-out portion. - 前記基板処理部での前記処理には、前記基板カートリッジの前記情報保持部に保持される前記情報が用いられる
請求項52に記載の基板処理装置。 53. The substrate processing apparatus according to claim 52, wherein the information held in the information holding unit of the substrate cartridge is used for the processing in the substrate processing unit. - 前記基板カートリッジとの間で電気的に接続される装置側端子部
を更に備える請求項52又は請求項53に記載の基板処理装置。 54. The substrate processing apparatus according to claim 52, further comprising an apparatus-side terminal portion that is electrically connected to the substrate cartridge. - 前記基板処理部は、前記基板カートリッジとの間で前記情報の送信及び受信のうち少なくとも一方を行う装置側通信部を有する
請求項52から請求項54のうちいずれか一項に記載の基板処理装置。 The substrate processing apparatus according to any one of claims 52 to 54, wherein the substrate processing unit includes an apparatus-side communication unit that performs at least one of transmission and reception of the information with the substrate cartridge. . - 前記基板カートリッジの前記情報保持部に前記情報を送る制御部
を更に備える請求項52から請求項55のうちいずれか一項に記載の基板処理装置。 The substrate processing apparatus according to any one of claims 52 to 55, further comprising a control unit that sends the information to the information holding unit of the substrate cartridge. - 前記基板処理部は、前記基板を切断する切断部を有し、
前記制御部は、前記切断部によって切断された前記基板の位置に関する情報を前記情報保持部に送る
請求項56に記載の基板処理装置。 The substrate processing unit has a cutting unit for cutting the substrate,
57. The substrate processing apparatus according to claim 56, wherein the control unit sends information related to a position of the substrate cut by the cutting unit to the information holding unit. - 前記基板処理部は、前記基板上の異常部を検出する検出部を有し、
前記制御部は、前記検出部によって検出される前記基板の位置に関する情報を前記情報保持部に送る
請求項56又は請求項57に記載の基板処理装置。 The substrate processing unit has a detection unit for detecting an abnormal portion on the substrate,
The substrate processing apparatus according to claim 56, wherein the control unit sends information related to the position of the substrate detected by the detection unit to the information holding unit. - 前記基板処理部は、前記基板に付与された前記情報を検出する第2検出部を有する
請求項58に記載の基板処理装置。 59. The substrate processing apparatus according to claim 58, wherein the substrate processing unit includes a second detection unit that detects the information given to the substrate. - 前記基板に前記情報を付与する情報付与部を更に備え、
前記情報付与部は、前記情報保持部に保持される前記情報に対応して前記基板に前記情報を付与する
請求項52から請求項59のうちいずれか一項に記載の基板処理装置。 An information providing unit for applying the information to the substrate;
The substrate processing apparatus according to any one of claims 52 to 59, wherein the information providing unit provides the information to the substrate corresponding to the information held in the information holding unit. - 基板を処理する基板処理装置と、
前記基板処理装置に接続される、請求項30から請求項51のうちいずれか一項に記載の基板カートリッジと、
前記基板カートリッジの前記情報保持部から前記情報を受け取ると共に、前記情報に基づいて前記基板処理装置を制御する主制御装置と
を備える基板処理システム。 A substrate processing apparatus for processing a substrate;
52. The substrate cartridge according to any one of claims 30 to 51, connected to the substrate processing apparatus,
A substrate processing system comprising: a main controller that receives the information from the information holding unit of the substrate cartridge and controls the substrate processing apparatus based on the information. - 前記主制御装置は、前記識別情報に対応させて前記処理情報を記憶する主記憶部を備える
請求項61に記載の基板処理システム。 The substrate processing system according to claim 61, wherein the main controller includes a main storage unit that stores the processing information in association with the identification information. - 基板を供給しつつ前記基板を処理し、処理後の前記基板を回収する基板処理方法であって、
請求項30から請求項51のうちいずれか一項に記載の基板カートリッジを用いて、前記基板の供給及び前記基板の回収のうち少なくとも一方を行い、
前記基板カートリッジを介して得られる前記情報を用いて前記基板を処理する
基板処理方法。 A substrate processing method of processing the substrate while supplying the substrate and recovering the processed substrate,
Using the substrate cartridge according to any one of claims 30 to 51, performing at least one of supply of the substrate and recovery of the substrate,
A substrate processing method for processing the substrate using the information obtained through the substrate cartridge. - 基板を処理する基板処理装置、及び、前記基板処理装置に接続される請求項30から請求項51のうちいずれか一項に記載の基板カートリッジ、を制御する主制御部を備える
制御装置。 52. A control apparatus comprising: a main control unit that controls a substrate processing apparatus that processes a substrate; and the substrate cartridge according to any one of claims 30 to 51 connected to the substrate processing apparatus. - 基板処理部において基板を処理する工程と、
請求項30から請求項51のうちいずれか一項に記載の基板カートリッジを用いて、前記基板処理部に前記基板を供給する又は前記基板処理部から前記基板を回収する工程と、を有する
表示素子の製造方法。 Processing the substrate in the substrate processing unit;
A step of supplying the substrate to the substrate processing unit or recovering the substrate from the substrate processing unit using the substrate cartridge according to any one of claims 30 to 51. Manufacturing method.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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KR1020127006524A KR101678716B1 (en) | 2009-11-05 | 2010-11-05 | Substrate cartridge, substrate processing apparatus, substrate processing system, substrate processing method, and method for manufacturing electric circuit |
CN201080048076.1A CN102574659B (en) | 2009-11-05 | 2010-11-05 | The manufacture method of substrate cartridge, substrate board treatment, base plate processing system, substrate processing method using same, control setup and display element |
US13/461,523 US9379339B2 (en) | 2009-11-05 | 2012-05-01 | Substrate cartridge, substrate-processing apparatus, substrate-processing system, substrate-processing method, control apparatus, and method of manufacturing display element |
HK12112641.4A HK1171728A1 (en) | 2009-11-05 | 2012-12-07 | Substrate cartridge, substrate processing apparatus, substrate processing system, substrate processing method, control apparatus, and method for manufacturing display element |
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JP2009253976A JP2011098809A (en) | 2009-11-05 | 2009-11-05 | Substrate cartridge, substrate processing device, substrate processing system, substrate processing method, control device and method of manufacturing display element |
JP2009-253975 | 2009-11-05 | ||
JP2009-253976 | 2009-11-05 | ||
JP2009253975A JP2011098808A (en) | 2009-11-05 | 2009-11-05 | Substrate cartridge, substrate processing device, substrate processing system, substrate processing method, control device and method of manufacturing display element |
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US13/461,523 Continuation US9379339B2 (en) | 2009-11-05 | 2012-05-01 | Substrate cartridge, substrate-processing apparatus, substrate-processing system, substrate-processing method, control apparatus, and method of manufacturing display element |
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KR (1) | KR101678716B1 (en) |
CN (1) | CN102574659B (en) |
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62123735A (en) * | 1985-11-22 | 1987-06-05 | Mitsubishi Electric Corp | Wafer cassette |
JPH03138958A (en) * | 1989-10-24 | 1991-06-13 | Seiko Epson Corp | Wafer carrier and method of identifying wafer carrier |
JPH08293540A (en) * | 1995-04-24 | 1996-11-05 | Sony Corp | Substrate holding device |
JP2000272784A (en) * | 1999-01-18 | 2000-10-03 | Seiko Instruments Inc | Printing paper assembly of photosensitive microcapsule type, and printer and printing system using it |
JP2003100843A (en) * | 2001-09-26 | 2003-04-04 | Dainippon Screen Mfg Co Ltd | Method for managing substrate, system for processing substrate and mounting table |
WO2004079818A1 (en) * | 2003-03-04 | 2004-09-16 | Shin-Etsu Polymer Co., Ltd. | Precision substrate storage container |
JP2006248564A (en) * | 2005-03-10 | 2006-09-21 | Ishida Co Ltd | Wrapper container |
JP2006286966A (en) * | 2005-03-31 | 2006-10-19 | Fujitsu Ltd | Semiconductor device and production management method thereof |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01158360A (en) * | 1987-12-16 | 1989-06-21 | Fuji Photo Film Co Ltd | Test film cassette |
EP0456388A1 (en) * | 1990-05-08 | 1991-11-13 | International Business Machines Corporation | Processing high-density circuit substrates and container for use in such processing |
JPH04219805A (en) * | 1990-12-20 | 1992-08-10 | Ikegai Corp | Continuous machining method for different kind of work |
GB2439001B (en) | 2005-03-18 | 2011-03-09 | Konica Minolta Holdings Inc | Method of forming organic compound layer, method of manufacturing organic el element and organic el element |
US8801307B2 (en) * | 2009-09-25 | 2014-08-12 | Nikon Corporation | Substrate cartridge, substrate processing apparatus, substrate processing system, control apparatus, and method of manufacturing display element |
JP5556105B2 (en) * | 2009-09-25 | 2014-07-23 | 株式会社ニコン | Substrate cartridge, substrate processing apparatus, substrate processing system, control apparatus, and display element manufacturing method |
-
2010
- 2010-11-04 TW TW099137889A patent/TWI538861B/en active
- 2010-11-05 KR KR1020127006524A patent/KR101678716B1/en active IP Right Grant
- 2010-11-05 CN CN201080048076.1A patent/CN102574659B/en active Active
- 2010-11-05 WO PCT/JP2010/069684 patent/WO2011055781A1/en active Application Filing
-
2012
- 2012-12-07 HK HK12112641.4A patent/HK1171728A1/en not_active IP Right Cessation
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62123735A (en) * | 1985-11-22 | 1987-06-05 | Mitsubishi Electric Corp | Wafer cassette |
JPH03138958A (en) * | 1989-10-24 | 1991-06-13 | Seiko Epson Corp | Wafer carrier and method of identifying wafer carrier |
JPH08293540A (en) * | 1995-04-24 | 1996-11-05 | Sony Corp | Substrate holding device |
JP2000272784A (en) * | 1999-01-18 | 2000-10-03 | Seiko Instruments Inc | Printing paper assembly of photosensitive microcapsule type, and printer and printing system using it |
JP2003100843A (en) * | 2001-09-26 | 2003-04-04 | Dainippon Screen Mfg Co Ltd | Method for managing substrate, system for processing substrate and mounting table |
WO2004079818A1 (en) * | 2003-03-04 | 2004-09-16 | Shin-Etsu Polymer Co., Ltd. | Precision substrate storage container |
JP2006248564A (en) * | 2005-03-10 | 2006-09-21 | Ishida Co Ltd | Wrapper container |
JP2006286966A (en) * | 2005-03-31 | 2006-10-19 | Fujitsu Ltd | Semiconductor device and production management method thereof |
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CN102574659A (en) | 2012-07-11 |
CN102574659B (en) | 2016-02-24 |
TWI538861B (en) | 2016-06-21 |
TW201132565A (en) | 2011-10-01 |
KR101678716B1 (en) | 2016-11-23 |
HK1171728A1 (en) | 2013-04-05 |
KR20120092098A (en) | 2012-08-20 |
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