JP2011084402A - Substrate cartridge, substrate treatment apparatus, substrate treatment system, control apparatus and method of manufacturing display element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate cartridge, a substrate treatment apparatus, a substrate treatment system, a control apparatus and a method of manufacturing a display element capable of preventing a foreign substance from attaching to the substrate. <P>SOLUTION: The substrate cartridge includes a cartridge body having an opening through which the substrate is moved in and out for storing the substrate via the opening and a mount arranged in the cartridge body and detachably connected to an external connecting part. The opening is formed in a manner capable of being blocked by the substrate corresponding to a connection state between the mount and the external connecting part. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a substrate cartridge, a substrate processing apparatus, a substrate processing system, a control apparatus, and a display element manufacturing method.

  As a display element constituting a display device such as a display device, for example, an organic electroluminescence (organic EL) element is known. The organic EL element has an anode and a cathode on a substrate and an organic light emitting layer sandwiched between the anode and the cathode. In the organic EL element, holes are injected from an anode into an organic light emitting layer to combine holes and electrons in the organic light emitting layer, and display light can be obtained by emitted light at the time of the combination. In the organic EL element, an electric circuit connected to, for example, an anode and a cathode is formed on a substrate.

  As one of methods for producing an organic EL element, for example, a method called a roll-to-roll method (hereinafter simply referred to as “roll method”) is known (see, for example, Patent Document 1). In the roll method, a single sheet-like substrate wound around a substrate supply side roller is sent out, and the substrate is transported while being wound up by a substrate recovery side roller. In this manner, a light emitting layer, an anode, a cathode, an electric circuit, and the like constituting an organic EL element are sequentially formed on a substrate.

  In the configuration described in Patent Document 1, for example, a substrate feeding roller and a substrate winding roller are detachable from the production line. The removed roller is transported to, for example, another production line, and can be used by being attached to the other production line.

International Publication No. 2006/100868 Pamphlet

However, in the above configuration, since the substrate wound around the roller is left in an external environment of the production line in a bare state, there is a possibility that foreign matters such as dust adhere to the substrate.
In view of the above circumstances, an object of the present invention is to provide a substrate cartridge, a substrate processing apparatus, and a substrate processing system that can prevent foreign matters from adhering to a substrate.

  The substrate cartridge according to the present invention has an opening through which a substrate is taken in and out, and is provided in the cartridge main body through which the substrate is accommodated, and is detachable from the external connection portion. The opening portion is provided so as to be closed by the substrate in accordance with a connection state between the mount portion and the external connection portion.

  A substrate processing apparatus according to the present invention includes a substrate processing unit that processes a substrate, the substrate cartridge, and a substrate processing side connection unit that is provided in the substrate processing unit and connected to the substrate cartridge.

  A substrate processing system according to the present invention includes a first processing apparatus that performs a first process on a substrate, a second processing apparatus that performs a second process on the substrate after the first process, and the first processing apparatus to the substrate. And a substrate relay device that supplies the recovered substrate to the second processing apparatus, and the substrate cartridge is used as the substrate relay device.

  A control apparatus according to the present invention includes a substrate processing apparatus that processes a substrate, and a main control unit that controls the substrate cartridge connected to the substrate processing apparatus.

  The display element manufacturing method according to the present invention includes a step of processing a substrate in a substrate processing unit, and a step of supplying the substrate to the substrate processing unit using the substrate cartridge.

  According to the present invention, it is possible to prevent foreign matters from adhering to the substrate.

1 is a configuration diagram of an organic EL element according to a first embodiment of the present invention. The figure which shows the structure of the substrate processing apparatus which concerns on this embodiment. The figure which shows the structure of the board | substrate process part which concerns on this embodiment. The figure which shows the structure of the droplet application apparatus which concerns on this embodiment. The perspective view which shows the structure of the board | substrate cartridge which concerns on this embodiment. FIG. 3 is a cross-sectional view illustrating a configuration of a substrate cartridge according to the embodiment. The figure which expands and shows the cross section of the board | substrate cartridge which concerns on this embodiment. FIG. 3 is a side view showing a configuration of a part of the substrate cartridge according to the embodiment. FIG. 3 is a side view showing a configuration of a part of the substrate cartridge according to the embodiment. The figure which shows the accommodation operation | movement of the board | substrate cartridge which concerns on this embodiment. The figure which shows the accommodation operation | movement of the board | substrate cartridge which concerns on this embodiment. The figure which shows the connection operation | movement of the board | substrate cartridge which concerns on this embodiment. The figure which shows the connection operation | movement of the board | substrate cartridge which concerns on this embodiment. The figure which shows the process of the partition formation of the substrate processing part which concerns on this embodiment. The figure which shows the shape and arrangement | positioning of the partition formed in the sheet | seat board | substrate which concerns on this embodiment. Sectional drawing of the partition formed in the sheet | seat board | substrate which concerns on this embodiment. The figure which shows the application | coating operation | movement of the droplet which concerns on this embodiment. The figure which shows the structure of the thin film formed between the partition walls concerning this embodiment. The figure which shows the process of forming a gate insulating layer in the sheet | seat board | substrate which concerns on this embodiment. The figure which shows the process of cut | disconnecting the wiring of the sheet | seat board | substrate which concerns on this embodiment. The figure which shows the process of forming a thin film in the source-drain formation area concerning this embodiment. The figure which shows the process of forming the organic-semiconductor layer concerning this embodiment. The figure which shows an example of the alignment which concerns on this embodiment. The figure which shows the removal operation | movement of the board | substrate cartridge which concerns on this embodiment. The figure which shows the structure of the substrate processing system which concerns on 2nd Embodiment of this invention. The figure which shows the structure of the substrate processing system which concerns on 3rd Embodiment of this invention. The figure explaining collection | recovery operation | movement of the sheet | seat board | substrate FB which concerns on this embodiment. The figure explaining collection | recovery operation | movement of the sheet | seat board | substrate FB which concerns on this embodiment. The figure explaining collection | recovery operation | movement of the sheet | seat board | substrate FB which concerns on this embodiment. The figure which shows the other structure of the substrate processing system which concerns on this embodiment. The figure which shows the structure of the substrate processing system which concerns on 4th Embodiment of this invention. The figure which shows the structure of the substrate processing apparatus which concerns on 5th Embodiment of this invention. The figure which shows the structure of the substrate processing apparatus which concerns on 6th Embodiment of this invention. The figure which shows the structure of the roller of the substrate processing apparatus which concerns on 7th Embodiment of this invention. The figure which shows the structure of the obstruction | occlusion part of the other substrate processing apparatus which concerns on this embodiment. The figure which shows the structure of the other organic EL element which concerns on this embodiment.

[First Embodiment]
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.
(Organic EL device)
FIG. 1A is a plan view showing the configuration of the organic EL element. FIG.1 (b) is bb sectional drawing in Fig.1 (a). FIG.1 (c) is cc sectional drawing in Fig.1 (a).

  As shown in FIGS. 1A to 1C, the organic EL element 50 includes a sheet substrate FB on which a gate electrode G and a gate insulating layer I are formed, and a source electrode S, a drain electrode D, and a pixel electrode P. After the formation, the bottom contact type in which the organic semiconductor layer OS is formed.

  As shown in FIG. 1B, a gate insulating layer I is formed on the gate electrode G. A source electrode S of the source bus line SBL is formed on the gate insulating layer I, and a drain electrode D connected to the pixel electrode P is formed. An organic semiconductor layer OS is formed between the source electrode S and the drain electrode D. This completes the field effect transistor. Further, as shown in FIGS. 1B and 1C, the light emitting layer IR is formed on the pixel electrode P, and the transparent electrode ITO is formed on the light emitting layer IR.

  As shown in FIG. 1B and FIG. 1C, for example, a partition BA (bank layer) is formed on the sheet substrate FB. As shown in FIG. 1C, source bus lines SBL are formed between the barrier ribs BA. Thus, the presence of the partition BA allows the source bus line SBL to be formed with high accuracy, and the pixel electrode P and the light emitting layer IR to be accurately formed. Although not shown in FIGS. 1B and 1C, the gate bus line GBL is also formed between the partition walls BA in the same manner as the source bus line SBL.

  This organic EL element 50 is suitably used for a display device such as a display device and a display unit of an electronic device. In this case, for example, an organic EL element 50 formed in a panel shape is used. In manufacturing such an organic EL element 50, it is necessary to form a substrate on which a thin film transistor (TFT) and a pixel electrode are formed. In order to accurately form one or more organic compound layers (light-emitting element layers) including a light-emitting layer on the pixel electrode on the substrate, a partition BA (bank layer) is easily and accurately formed in the boundary region of the pixel electrode. It is desirable.

(Substrate processing equipment)
FIG. 2 is a schematic diagram illustrating a configuration of a substrate processing apparatus 100 that performs processing using a flexible sheet substrate FB.
The substrate processing apparatus 100 is an apparatus that forms the organic EL element 50 shown in FIG. 1 using a strip-shaped sheet substrate FB. As illustrated in FIG. 2, the substrate processing apparatus 100 includes a substrate supply unit 101, a substrate processing unit 102, a substrate collection unit 103, and a control unit 104. The sheet substrate FB is transported from the substrate supply unit 101 to the substrate recovery unit 103 via the substrate processing unit 102. The control unit 104 controls the overall operation of the substrate processing apparatus 100.

  In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. In the horizontal plane, the sheet substrate FB is conveyed in the X-axis direction, in the horizontal plane the direction orthogonal to the X-axis direction is the Y-axis direction, and the direction orthogonal to the X-axis direction and the Y-axis direction (that is, the vertical direction) is Z. Axial direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

  As the sheet substrate FB, for example, a heat-resistant resin film, stainless steel, or the like can be used. Specifically, materials such as polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin are used. be able to. The dimension in the Y direction of the sheet substrate FB is, for example, about 50 cm to 2 m, and the dimension in the X direction is, for example, 10 m or more. Of course, this dimension is only an example and is not limited thereto. For example, the dimension in the Y direction of the sheet substrate FB may be 50 cm or less, or 2 m or more. Moreover, the dimension of the X direction of the sheet | seat board | substrate FB may be 10 m or less. Note that the flexibility in the present embodiment refers to the property that the substrate can be bent without being broken or broken even when a predetermined force of at least its own weight is applied to the substrate. The flexibility varies depending on the material, size, thickness, environment such as temperature, etc. of the substrate.

  The sheet substrate FB preferably has a smaller coefficient of thermal expansion so that, for example, the size does not change even when the sheet substrate FB receives heat of about 200 ° C. For example, an inorganic filler can be mixed with a resin film to reduce the thermal expansion coefficient. Examples of the inorganic filler include titanium oxide, zinc oxide, alumina, silicon oxide and the like.

  The substrate supply unit 101 is connected to a supply side connection unit 102 </ b> A provided in the substrate processing unit 102. The substrate supply unit 101 supplies, for example, the sheet substrate FB wound in a roll shape to the substrate processing unit 102. The substrate recovery unit 103 recovers the sheet substrate FB that has been processed by the substrate processing unit 102.

FIG. 3 is a diagram illustrating a configuration of the substrate processing unit 102.
As shown in FIG. 3, the substrate processing unit 102 includes a transport unit 105, an element forming unit 106, an alignment unit 107, and a substrate cutting unit 108. The substrate processing unit 102 forms each component of the organic EL element 50 on the sheet substrate FB while conveying the sheet substrate FB supplied from the substrate supply unit 101, and the sheet on which the organic EL element 50 is formed. This is the part that sends out the substrate FB to the substrate recovery unit 103.

  The transport unit 105 has a plurality of rollers RR arranged at positions along the X direction. The sheet substrate FB is also transported in the X-axis direction by the rotation of the roller RR. The roller RR may be a rubber roller that sandwiches the sheet substrate FB from both sides, or may be a roller RR with a ratchet as long as the sheet substrate FB has perforation. Among the plurality of rollers RR, some of the rollers RR are movable in the Y-axis direction orthogonal to the transport direction.

  The element forming unit 106 includes a partition forming unit 91, an electrode forming unit 92, and a light emitting layer forming unit 93. The partition wall forming portion 91, the electrode forming portion 92, and the light emitting layer forming portion 93 are arranged in the order of the partition wall forming portion 91, the electrode forming portion 92, and the light emitting layer forming portion 93 from the upstream side to the downstream side in the transport direction of the sheet substrate FB. ing. Hereinafter, each structure of the element formation part 106 is demonstrated.

  The partition forming unit 91 includes an imprint roller 110 and a thermal transfer roller 115. The partition forming unit 91 forms the partition BA on the sheet substrate FB sent from the substrate supply unit 101. In the partition wall forming unit 91, the sheet substrate FB is pressed by the imprint roller 110, and the sheet substrate FB is heated to the glass transition point or more by the thermal transfer roller 115 so that the pressed partition wall BA maintains its shape. Therefore, the mold shape formed on the roller surface of the imprint roller 110 is transferred to the sheet substrate FB. The sheet substrate FB is heated to, for example, about 200 ° C. by the thermal transfer roller 115.

  The roller surface of the imprint roller 110 is mirror-finished, and a fine imprint mold 111 made of a material such as SiC or Ta is attached to the roller surface. The fine imprint mold 111 forms a thin film transistor wiring stamper and a color filter stamper.

  The imprint roller 110 uses the fine imprint mold 111 to form the alignment mark AM on the sheet substrate FB. In order to form alignment marks AM on both sides in the Y-axis direction, which is the width direction of the sheet substrate FB, the fine imprint mold 111 has a stamper for the alignment marks AM.

  The electrode forming portion 92 is provided on the + X side of the partition wall forming portion 91, and for example, a thin film transistor using an organic semiconductor is formed. Specifically, after forming the gate electrode G, the gate insulating layer I, the source electrode S, the drain electrode D, and the pixel electrode P as shown in FIG. 1, the organic semiconductor layer OS is formed.

  The thin film transistor (TFT) may be an inorganic semiconductor type or an organic semiconductor type. As an inorganic semiconductor thin film transistor, an amorphous silicon type is known, but a thin film transistor using an organic semiconductor may be used. If a thin film transistor is formed using this organic semiconductor, the thin film transistor can be formed by utilizing a printing technique or a droplet coating technique. Of the thin film transistors using organic semiconductors, the field effect transistor (FET) as shown in FIG. 1 is particularly preferable.

The electrode forming unit 92 includes a droplet applying device 120, a heat treatment device BK, a cutting device 130, and the like.
In this embodiment, as the droplet applying device 120, for example, a droplet applying device 120G used when forming the gate electrode G, a droplet applying device 120I used when forming the gate insulating layer I, the source electrode S, A droplet applying device 120SD used when forming the drain electrode D and the pixel electrode P, a droplet applying device 120OS used when forming the organic semiconductor OS, and the like are used.

  FIG. 4 is a plan view showing the configuration of the droplet applying apparatus 120. FIG. 4 shows a configuration when the droplet applying device 120 is viewed from the + Z side. The droplet applying device 120 is formed long in the Y-axis direction. The droplet applying device 120 is provided with a driving device (not shown). The droplet applying device 120 can be moved, for example, in the X direction, the Y direction, and the θZ direction by the driving device.

  A plurality of nozzles 122 are formed in the droplet applying device 120. The nozzle 122 is provided on the surface of the droplet applying device 120 that faces the sheet substrate FB. The nozzles 122 are arranged, for example, along the Y-axis direction, and two rows (nozzle rows) of the nozzles 122 are formed, for example. The control unit 104 can apply the droplets to all the nozzles 122 at once, and can individually adjust the timing of applying the droplets to each nozzle 122.

  As the droplet applying device 120, for example, an ink jet method or a dispenser method can be adopted. Examples of the inkjet method include a charge control method, a pressure vibration method, an electromechanical conversion method, an electrothermal conversion method, and an electrostatic suction method. In the droplet coating method, the use of the material is less wasteful, and a desired amount of the material can be accurately disposed at a desired position. The amount of one drop of metal ink applied by the droplet application method is, for example, 1 to 300 nanograms.

  Returning to FIG. 2, the droplet applying device 120 </ b> G applies metal ink in the partition BA of the gate bus line GBL. The droplet applying device 120I applies an electrically insulating ink of polyimide resin or urethane resin to the switching unit. The droplet applying device 120SD applies metal ink in the partition BA of the source bus line SBL and in the partition BA of the pixel electrode P. The droplet applying device 120OS applies the organic semiconductor ink to the switching unit between the source electrode S and the drain electrode D.

  Metal ink is a liquid in which a conductor having a particle diameter of about 5 nm is stably dispersed in a solvent at room temperature, and carbon, silver (Ag), gold (Au), or the like is used as the conductor. The compound forming the organic semiconductor ink may be a single crystal material family or an amorphous material, and may be a low molecule or a polymer. Particularly preferred among the compounds forming the organic semiconductor ink include a single crystal or π-conjugated polymer of a condensed ring aromatic hydrocarbon compound typified by pentacene, triphenylene, anthracene and the like.

  The heat treatment apparatus BK is disposed on the + X side (downstream side in the substrate transport direction) of each droplet applying apparatus 120. The heat treatment apparatus BK can radiate, for example, hot air or far infrared rays to the sheet substrate FB. The heat treatment apparatus BK uses these radiant heats to dry or bake (bake) the droplets applied to the sheet substrate FB and harden them.

  The cutting device 130 is provided on the + X side of the droplet applying device 120SD and on the upstream side of the droplet applying device 120OS. The cutting device 130 cuts the source electrode S and the drain electrode D formed by the droplet applying device 120SD using, for example, laser light. The cutting device 130 includes a light source (not shown) and a galvanometer mirror 131 that irradiates the laser light from the light source onto the sheet substrate FB.

  The type of laser light is preferably a laser having a wavelength to be absorbed with respect to the metal film to be cut. Further, by using a pulsed laser, thermal diffusion can be prevented and damage other than the cut portion can be reduced. When the material is aluminum, a femtosecond laser with a wavelength of 760 nm is preferable.

  In this embodiment, for example, a femtosecond laser irradiation unit using a titanium sapphire laser as a light source is used. The femtosecond laser irradiation unit irradiates the laser beam LL with a pulse of 10 KHz to 40 KHz, for example.

  In this embodiment, since a femtosecond laser is used, processing on the order of submicron is possible, and the distance between the source electrode S and the drain electrode D that determines the performance of the field effect transistor can be accurately cut. ing. The distance between the source electrode S and the drain electrode D is, for example, about 3 μm to about 30 μm.

  In addition to the femtosecond laser described above, for example, a carbon dioxide laser or a green laser can be used. Moreover, it is good also as a structure cut | disconnected mechanically with a dicing saw etc. besides a laser.

  The galvanometer mirror 131 is disposed in the optical path of the laser beam LL. The galvanometer mirror 131 reflects the laser beam LL from the light source onto the sheet substrate FB. The galvanometer mirror 131 is provided to be rotatable in the θX direction, the θY direction, and the θZ direction, for example. As the galvano mirror 131 rotates, the irradiation position of the laser beam LL changes.

  By using both the partition wall formation portion 91 and the electrode formation portion 92, a thin film transistor or the like can be formed by utilizing a printing technique or a droplet coating method technique without using a so-called photolithography process. Yes. For example, when only the electrode forming portion 92 using a printing technique, a droplet coating technique, or the like is used, there is a case where a thin film transistor or the like cannot be accurately performed due to ink bleeding and spreading.

  On the other hand, since the partition wall BA is formed by using the partition wall forming portion 91, the ink is prevented from bleeding and spreading. The distance between the source electrode S and the drain electrode D that determines the performance of the thin film transistor is formed by laser processing or machining.

  The light emitting layer forming portion 93 is disposed on the + X side of the electrode forming portion 92. The light emitting layer forming unit 93 forms, for example, the light emitting layer IR and the pixel electrode ITO which are components of the organic EL device on the sheet substrate FB on which the electrodes are formed. The light emitting layer forming unit 93 includes a droplet applying device 140 and a heat treatment device BK.

  The light emitting layer IR formed by the light emitting layer forming portion 93 contains a host compound and a phosphorescent compound (also referred to as a phosphorescent compound). The host compound is a compound contained in the light emitting layer. A phosphorescent compound is a compound in which light emission from an excited triplet is observed and emits phosphorescence at room temperature.

  In the present embodiment, as the droplet applying device 140, for example, a droplet applying device 140Re that forms a red light emitting layer, a droplet applying device 140Gr that forms a green light emitting layer, a droplet applying device 140Bl that forms a blue light emitting layer, an insulating material. A droplet applying device 140I that forms a layer, a droplet applying device 140IT that forms a pixel electrode ITO, and the like are used.

  As the droplet applying device 140, an ink jet method or a dispenser method can be employed as in the case of the droplet applying device 120 described above. When providing, for example, a hole transport layer and an electron transport layer as components of the organic EL element 50, a device for forming these layers (for example, a droplet applying device) is separately provided.

  The droplet applying device 140Re applies the R solution onto the pixel electrode P. In the droplet applying device 140Re, the discharge amount of the R solution is adjusted so that the film thickness after drying becomes 100 nm. As the R solution, for example, a solution in which a red dopant material is dissolved in 1,2-dichloroethane in polyvinylcarbazole (PVK) as a host material is used.

  The droplet applying device 140Gr applies the G solution onto the pixel electrode P. As the G solution, for example, a solution in which a green dopant material is dissolved in 1,2-dichloroethane in a host material PVK is used.

  The droplet applying device 140B1 applies the B solution onto the pixel electrode P. As the B solution, for example, a solution in which a blue dopant material is dissolved in 1,2-dichloroethane in a host material PVK is used.

  The droplet applying device 120I applies an electrically insulating ink to a part of the gate bus line GBL or the source bus line SBL. As the electrically insulating ink, for example, polyimide resin or urethane resin ink is used.

The droplet applying device 120IT applies ITO (Indium Tin Oxide) ink on the red, green, and blue light emitting layers. As the ITO ink, a compound in which several percent of tin oxide (SnO ₂ ) is added to indium oxide (In ₂ O ₃ ) is used. Alternatively, an amorphous material such as IDIXO (In ₂ O ₃ —ZnO) capable of forming a transparent conductive film may be used. The transparent conductive film preferably has a transmittance of 90% or more.

  The heat treatment apparatus BK is disposed on the + X side (downstream side in the substrate transport direction) of each droplet applying apparatus 140. The heat treatment apparatus BK can emit hot air, far-infrared rays, and the like to the sheet substrate FB, similarly to the heat treatment apparatus BK used in the electrode forming unit 92. The heat treatment apparatus BK uses these radiant heats to dry or bake (bake) the droplets applied to the sheet substrate FB and harden them.

  The alignment unit 107 includes a plurality of alignment cameras CA (CA1 to CA8) provided along the X direction. The alignment camera CA may pick up an image with CCD or CMOS under visible light illumination, process the picked-up image to detect the position of the alignment mark AM, or irradiate the alignment mark AM with the laser light and scatter the light. Even if light is received, the position of the alignment mark AM may be detected.

  The alignment camera CA1 is disposed on the + X side of the thermal transfer roller 115. The alignment camera CA1 detects the position of the alignment mark AM formed by the thermal transfer roller 115 on the sheet substrate FB. Alignment cameras CA2 to CA8 are respectively arranged on the + X side of heat treatment apparatus BK. The alignment cameras CA2 to CA8 detect the position of the alignment mark AM on the sheet substrate FB that has passed through the heat treatment apparatus BK.

  The sheet substrate FB may expand and contract in the X-axis direction and the Y-axis direction through the thermal transfer roller 115 and the heat treatment apparatus BK. By disposing the alignment camera CA on the + X side of the thermal transfer roller 115 that performs heat treatment or on the + X side of the heat treatment apparatus BK in this way, it is possible to detect the positional deviation of the sheet substrate FB due to thermal deformation or the like. Yes.

  The detection results by the alignment cameras CA1 to CA8 are transmitted to the control unit 104. Based on the detection results of the alignment cameras CA <b> 1 to CA <b> 8, the control unit 104 adjusts the ink application position and timing of the droplet application device 120 and the droplet application device 140, and supplies the sheet substrate FB from the substrate supply unit 101. Adjustment of the speed and the conveyance speed of the roller RR, adjustment of movement in the Y direction by the roller RR, adjustment of the cutting position and timing of the cutting device 130, and the like are performed.

(Substrate cartridge)
In the present embodiment, the substrate cartridge 1 is used as the substrate supply unit 101 and the substrate recovery unit 103. In the following description, for convenience of explanation, an XYZ orthogonal coordinate system common to FIG. 2 is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. The following XYZ orthogonal coordinate system will be described by taking as an example a case where the substrate cartridge 1 is used as the substrate supply unit 101 in a state where the substrate supply unit 101 is connected to the substrate processing unit 102.

  FIG. 5 is a perspective view showing the configuration of the substrate cartridge 1. FIG. 6 is a diagram showing a configuration along the section AA ′ in FIG. As shown in FIGS. 5 and 6, the substrate cartridge 1 has a cartridge body 2 and a mount portion 3.

  The cartridge body 2 is a part that accommodates the sheet substrate FB. The cartridge main body 2 includes a storage unit 20, a transfer unit (transfer mechanism) 21, a substrate guide unit 22, a second substrate transfer unit 36, and a second substrate guide unit 37. The mount 3 is provided on the cartridge body 2. For example, the cartridge body 2 is made of aluminum or duralumin.

  The accommodating portion 20 is a portion that accommodates the sheet substrate FB. The accommodating part 20 is formed in a cylindrical shape so that, for example, the sheet substrate FB wound in a roll shape can be accommodated, and is provided so as to partially protrude toward the + X side (protruding part 23). In the present embodiment, they are arranged in a state extending in the Y direction in the drawing. The accommodating part 20 has a lid part 25 and a substrate driving mechanism 24.

  The lid portion 25 is provided at the + Y side end portion or the −Y side end portion of the accommodating portion 20. The lid portion 25 is provided so as to be detachable from the housing portion 20. By detaching the lid portion 25 from the housing portion 20, the inside of the housing portion 20 can be directly accessed. As an opening / closing mechanism of the lid portion 25, for example, the lid portion 25 and the accommodating portion 20 may be provided with threads that engage with each other, and the lid portion 25 and the accommodating portion 20 are connected by a hinge mechanism. It does not matter as a structure to do. The lid part 25 has a window part 28 and a display part 29.

  The window portion 28 is formed of, for example, a material that can transmit visible light, such as glass or plastic. The inside of the accommodating portion 20 can be observed through the window portion 28. The display unit 29 is a part that displays information such as the state of the sheet substrate FB. On the display unit 29, for example, the length dimension of the sheet substrate FB accommodated in the accommodating unit 20, the remaining length of the sheet substrate FB, and the like are displayed.

  The substrate driving mechanism 24 is a part that performs an operation of winding the sheet substrate FB and an operation of feeding the sheet substrate FB. The substrate driving mechanism 24 is provided inside the housing part 20. The substrate driving mechanism 24 includes a roller part (shaft part) 26 and a guide part 27. As shown in FIG. 6, the roller part 26 has a rotating shaft member 26a, a diameter-expanded part 26b, and an adhesive part 26c.

  The rotary shaft member 26a is a columnar member made of a highly rigid metal such as aluminum. The rotating shaft member 26a is rotatably supported through an opening 25a and a bearing member 25b provided at the center of the lid 25, for example. In this case, the central axis of the rotating shaft member 26a is in a state parallel to the Y direction, for example, and the rotating shaft member 26a rotates in the θY direction.

  The rotation shaft member 26a is connected to a rotation drive mechanism (not shown). The rotary shaft member 26a is rotated about the central axis by drive control of the rotary drive mechanism. As shown in FIG. 6, the rotation drive mechanism can rotate the rotary shaft member 26a in, for example, both the + θY direction and the −θY direction.

  The enlarged diameter portion 26b is formed with a uniform thickness on the surface of the rotary shaft member 26a. The enlarged diameter portion 26b is formed so as to rotate integrally with the rotary shaft member 26a. The bonding portion 26c is formed with a uniform thickness on the surface of the enlarged diameter portion 26b in a sectional view. The adhesion part 26c is formed using a material having a degree of adhesiveness to which the sheet substrate FB is adhered.

  The guide portion 27 includes a rotating member (first guide member) 27a and a tip member (first guide member) 27b. For example, one end of the rotating member 27a is attached to the accommodating portion 20 via a shaft portion 27c, and is provided to be rotatable in the θY direction around the shaft portion 27c. The rotation member 27a is connected to a rotation drive mechanism (not shown).

  The tip member 27b is connected to the other end of the rotating member 27a in a sectional view. For example, the tip member 27b is formed to have an arcuate curved surface in cross-sectional view. The sheet substrate FB is guided to the roller portion 26 through a curved surface on the + Z side having a circular arc shape in cross section provided on the tip member 27b. The tip member 27b rotates integrally with the rotation member 27a. For example, when the rotating member 27 a rotates in a direction away from the roller portion 26 (outward direction in the radial direction of the roller portion 26), the rotating member 27 a comes into contact with the inner periphery of the accommodating portion 20. For this reason, the contact between the tip member 27b and the sheet substrate FB wound around the roller portion 26 is avoided.

  The mount unit 3 is a part connected to the substrate processing unit 102. The mount part 3 is provided, for example, at the + X side end of the protrusion 23 provided in the housing part 20. The mount part 3 has an insertion part 3 a for connection with the substrate processing part 102. When the substrate cartridge 1 is used as the substrate supply unit 101, the mount unit 3 is connected to the supply side connection unit 102 </ b> A of the substrate processing unit 102. When the substrate cartridge 1 is used as the substrate collection unit 103, the mount unit 3 is connected to the collection side connection unit 102B of the substrate processing unit 102. The mount unit 3 is detachably connected regardless of whether the mount unit 3 is connected to either the substrate supply unit 101 or the substrate recovery unit 103 of the substrate processing unit 102.

  The mount 3 is provided with an opening 34 and a second opening 35. The opening 34 is an opening provided on the + Z side, and is a portion where the sheet substrate FB is taken in and out of the cartridge body 2. The cartridge main body 2 accommodates the sheet substrate FB via the opening 34. The sheet substrate FB accommodated in the cartridge main body 2 is sent out of the cartridge main body 2 through the opening 34.

  The second opening 35 is an opening provided on the −Z side, and is a portion into which the belt-shaped second substrate SB different from the sheet substrate FB is taken in and out of the cartridge body 2. Examples of the second substrate SB include a protective substrate that protects the element formation surface of the sheet substrate FB. As the protective substrate, for example, a slip sheet or the like can be used. For example, the second opening 35 is disposed with a space from the opening 34. The second opening 35 is formed in the same size and shape as the opening 34, for example. In addition, as the second substrate SB in the present embodiment, a conductive material such as a stainless steel thin plate (eg, a thickness of 0.1 mm or less) may be used. In this case, if the second substrate SB is electrically connected to the cartridge body 2 when the second substrate SB is accommodated in the cartridge body 2 together with the sheet substrate FB, the sheet substrate FB can be prevented from being charged.

  A gas supply port (switching mechanism) 4 is provided at the + X side end of the protrusion 23. The gas supply port 4 is provided with a supply port 41 connected to an external gas supply source. The gas supply port 4 is provided, for example, at the center in the Y direction. In FIG. 5, only one gas supply port 4 is provided, but a plurality of gas supply ports 4 may be provided.

  The transfer unit 21, the substrate guide unit 22, the second substrate transfer unit 36, and the second substrate guide unit 37 are provided, for example, inside the protrusion 23. FIG. 7 is an enlarged cross-sectional view showing the configuration around the protrusion 23 in FIG. In FIG. 7, a part of the configuration is omitted for easy illustration.

  The substrate guide part 22 is provided between the opening 34 and the transport part 21. The substrate guide portion 22 is a portion that guides the sheet substrate FB between the opening 34 and the transport portion 21. The substrate guide 22 has substrate guide members 22a and 22b. The board guide members 22a and 22b are arranged to face each other so as to leave a gap 22c in the Z direction, and are provided so that the facing surfaces are substantially parallel to the XY plane. The gap 22c is connected to the opening 34, and the sheet substrate FB moves through the opening 34 and the gap 22c.

  The second substrate guide portion 37 is a portion that guides the second substrate SB between the mount portion 3 and the transport portion 21. The second substrate guide portion 37 includes second substrate guide members 37a, 37b, and 37c. The second substrate guide members 37a and 37b are arranged to face each other so as to leave a gap 37d in the Z direction, and the facing surfaces are provided so as to be substantially parallel to the XY plane, respectively. The second substrate guide member 37c is arranged to be inclined so that the second substrate SB is guided to the + Z side. Specifically, the −X side end portion of the second substrate guide member 37c is arranged in a state inclined to the + Z side with respect to the + X side end portion.

  The second substrate transport unit 36 transports the second substrate SB between the mount unit 3 and the transport unit 21. The second substrate transport unit 36 is disposed between the second substrate guide members 37a and 37b and the second substrate guide member 37c. The second substrate transport unit 36 includes a main driving roller 36a and a driven roller 36b. The main driving roller 36a is provided so as to be rotatable in the θY direction, for example, and is connected to a rotation driving mechanism (not shown). The driven roller 36b is arranged with a gap between the driven roller 36a and the main driven roller 36a so that the second substrate SB is sandwiched between the driven roller 36b.

  The transport unit 21 transports the sheet substrate FB and the second substrate SB between the mount unit 3 and the storage unit 20. The conveyance unit 21 includes a tension roller (tension mechanism) 21a and a measurement roller (measurement unit) 21b. The tension roller 21 a is a roller that applies tension to the sheet substrate FB and the second substrate SB with the roller unit 26. The tension roller 21a is provided to be rotatable in the θY direction. For example, a rotation drive mechanism (not shown) is connected to the tension roller 21a. The tension roller 21a and the measurement roller 21b may be provided so as to be movable in the Z direction in FIG.

  The measuring roller 21b is a roller having a smaller diameter than the tension roller 21a. The measuring roller 21b is disposed with a predetermined gap between the measuring roller 21b and the tension roller 21a so that the sheet substrate FB and the second substrate SB can be sandwiched between the measuring roller 21b. Even when only the sheet substrate FB is sandwiched and when the sheet substrate FB and the second substrate SB are sandwiched together, the size of the gap between the measurement roller 21b and the tension roller 21a can be adjusted. I do not care. The measuring roller 21b is a driven roller that rotates as the tension roller 21a rotates.

  By rotating the tension roller 21a while the sheet substrate FB is sandwiched between the tension roller 21a and the measurement roller 21b, tension is applied to the sheet substrate FB, and the sheet substrate FB is taken up and sent out, respectively. The sheet substrate FB can be conveyed.

  The conveyance unit 21 includes a detection unit 21c that detects, for example, the number of rotations and the rotation angle of the measurement roller 21b. For example, an encoder or the like is used as the detection unit 21c. The detection unit 21c can measure, for example, the transport distance of the sheet substrate FB via the measurement roller 21b.

  The cartridge body 2 is provided with an information processing unit IC (see FIG. 5). The information processing unit IC is composed of, for example, an IC chip and is embedded in, for example, the cartridge body 2. The information processing unit IC is provided with a storage unit MR that stores processing information of the substrate processing apparatus 100 and the substrate cartridge 1, a communication unit CR that communicates processing information with the control unit 104, for example.

  Examples of the processing information include information such as tact and throughput of the substrate processing apparatus 100, information such as the conveyance speed of the substrate cartridge 1, the winding / feeding-out speed of the roller unit 26, and information related to the sheet substrate FB. As for “tact”, processing per unit processing area (for example, an area where the above-described droplet coating apparatuses 120 and 140 can be processed at once, a screen area per panel of the organic EL element 50, or an entire panel area). Point to time. “Throughput” refers to the amount of sheet substrate FB that can be processed per unit time (for example, the length, the number of panels, the number of substrate cartridges 1, etc.).

  For example, when the sheet substrate FB is inserted through the opening 34 and the second substrate SB is inserted through the second opening 35, the sheet substrate FB and the second substrate SB are respectively connected to the substrate guide unit 22 and the second substrate SB. By being guided by the substrate guide portion 37, the junction portion 39 joins. The sheet substrate FB and the second substrate SB merged at the merge unit 39 are conveyed by the conveyance unit 21 in a merged state. At this time, the transport unit 21 presses the sheet substrate FB and the second substrate SB in close contact with each other. For this reason, the conveyance unit 21 also serves as a pressing mechanism that presses the second substrate SB against the sheet substrate FB.

FIGS. 8 and 9 are enlarged views showing the configuration of the + X side end portion of the protruding portion 23, and are views showing a flow path mechanism connected to the gas supply port 4.
As shown in FIGS. 8 and 9, the supply port 41 of the gas supply port 4 is connected to a flow path 42 formed inside the protrusion 23. The flow path 42 is branched into a first flow path 42a and a second flow path 42b. The substrate guide member 22a has a flow path 43a formed therein, and the first flow path 42a is connected to the flow path 43a via a connection portion 42c. A plurality of gas ejection ports 44a are formed on the −Z side surface of the substrate guide member 22a, and the flow paths 43a are connected to the gas ejection ports 44a, respectively. Thus, the board guide member 22a is formed in an air pad shape for ejecting gas from the surface on the −Z side.

  On the other hand, as shown in FIGS. 8 and 9, a channel 43b is also formed inside the substrate guide member 22b. The second flow path 42b is connected to the flow path 43b through the connection portion 42d. A plurality of gas ejection ports 44b are formed on the surface on the + Z side of the substrate guide member 22b, and the flow path 43b is connected to each of these gas ejection ports 44b. Thus, the board guide member 22b is formed in an air pad shape for ejecting gas from the surface on the + Z side.

  One end of the seal member 47 is connected to the surface on the −Z side of the board guide member 22b. The other end of the seal member 47 is connected to the −Z side surface of the mount portion 3, for example. The space between the substrate guide member 22 b and the opening 34 is sealed by the seal member 47. The surface on the −Z side of the board guide member 22 b is pressed by the pressing mechanism 45. The end portion on the −Z side of the pressing mechanism 45 is fixed to, for example, a support portion 46 supported on the inner surface of the protruding portion 23.

  As shown in FIG. 8, in a state where the gas supply source is not connected to the supply port 41 of the gas supply port 4, no gas flows through the flow path mechanism, and the substrate guide member 22a and the substrate guide member 22b Since no gas is injected, the substrate guide member 22b is pressed to the + Z side by the pressing mechanism 45, and the sheet substrate FB is sandwiched in cooperation with the substrate guide member 22a.

  On the other hand, as shown in FIG. 9, for example, an external gas supply unit GS is inserted into the supply port 41 to supply the gas, so that the gas flows on the substrate guide member 22 a side. 42a, the connection part 42c, and the flow path 43a are injected from the gas outlet 44a in the -Z direction. On the substrate guide member 22b side, the gas is injected from the gas outlet 44b in the + Z direction through the channel 42 through the channel 42b, the connecting portion 42d, and the channel 43b.

By injecting gas from both sides in the Z direction across the sheet substrate FB, a gas layer (air bearing) is formed between the sheet substrate FB and the gas ejection port 44a and between the sheet substrate FB and the gas ejection port 44b. ) Is formed. By forming a gas layer on the + Z side surface and the −Z side surface of the sheet substrate FB, the substrate guide member 22a moves to the + Z side, and the substrate guide member 22b moves to the −Z side. Thus, the sheet substrate FB can be released from the state of being sandwiched between the substrate guide member 22a and the substrate guide member 22b.
Further, for example, the gas injected from the substrate guide member 22a and the substrate guide member 22b is a gas that has passed through an ionizer, so that the sheet substrate FB can be prevented from being charged or neutralized.

(Accommodating sheet substrate in substrate cartridge)
Next, an accommodating operation for accommodating the sheet substrate FB in the substrate cartridge 1 configured as described above will be described. 10 and 11 are views showing the state of the substrate cartridge 1 during the accommodating operation. In FIGS. 10 and 11, the outer shape of the substrate cartridge 1 is indicated by a broken line in order to facilitate the discrimination of the drawings.

  As shown in FIGS. 10 and 11, when the sheet substrate FB is accommodated in the substrate cartridge 1, the substrate cartridge 1 is held in the holder HD. Thereafter, for example, gas is supplied from the supply port 41 of the gas supply port 4, and gas is injected from the substrate guide members 22a and 22b. Due to the gas injection, the substrate guide members 22a and 22b are affected by the mutual injection from the closed state by the pressing mechanism 45, and the space between the substrate guide member 22a and the substrate guide member 22b is expanded. In this state, the sheet substrate FB is inserted from the opening 34. When inserting the sheet substrate FB, the tension roller 21a and the rotating shaft member 26a (roller portion 26) are rotated.

  The sheet substrate FB inserted through the opening 34 receives gas injection from both the + Z side and the −Z side, and a gas layer is formed on each surface. The sheet substrate FB moves between the substrate guide member 22a and the substrate guide member 22b so as to slide between the gas layers. In the transport unit 21, the sheet substrate FB is sandwiched between the tension roller 21a and the measurement roller 21b and transported to the storage unit 20 side. Along with the rotation of the measurement roller 21b, for example, the detection length of the sheet substrate FB is detected by the detection unit 21c.

  As illustrated in FIG. 10, the sheet substrate FB that has passed through the conveyance unit 21 toward the storage unit 20 is guided while being bent in the −Z direction by its own weight. In the present embodiment, since the guide portion 27 is provided on the −Z side of the sheet substrate FB, the sheet substrate FB is guided to the roller portion 26 along the rotating member 27a and the tip member 27b of the guide portion 27. It will be.

  When the leading edge of the sheet substrate FB reaches the bonding portion 26c of the roller portion 26, the leading edge of the sheet substrate FB and the bonding portion 26c are bonded. When the roller portion 26 rotates in this state, the sheet substrate FB is gradually bonded to the bonding portion 26c, and the sheet substrate FB is wound around the roller portion 26. After the sheet substrate FB is bonded to the bonding portion 26c, for example, the rotation speed of the tension roller 21a and the rotation speed of the rotation shaft member 26a are set so that the sheet substrate FB does not bend between the roller portion 26 and the conveyance portion 21. Then, the sheet substrate FB is conveyed.

  After the sheet substrate FB is wound around the roller portion 26, for example, by one rotation, the guide portion 27 is retracted as shown in FIG. By rotating the roller unit 26 in this state, the sheet substrate FB is gradually wound around the roller unit 26. Although the thickness of the wound sheet substrate FB is gradually increased, since the guide portion 27 has already been retracted, the sheet substrate FB and the guide portion 27 do not come into contact with each other.

  After winding up the sheet substrate FB of a desired length, for example, a portion of the sheet substrate FB outside the opening 34 is cut to stop the gas supply to the supply port 41, and the substrate guide member 22a and the substrate The sheet guide member 22b is closed with the sheet substrate FB interposed therebetween. In this way, the sheet substrate FB is accommodated in the substrate cartridge 1. During the accommodation operation of the sheet substrate FB, for example, the total length of the sheet substrate FB accommodated in the substrate cartridge 1 may be calculated based on the measured length of the sheet substrate FB measured by the detection unit 21c. Further, the calculation result may be displayed on the display unit 29, or may be stored in the storage unit MR or communicated using the communication unit CR.

  Further, for example, the operator may take up the sheet substrate FB while observing the inside of the accommodating portion 20 from the window portion 28. In this case, for example, the winding operation is performed while checking whether or not the sheet substrate FB is wound in a bent state, and whether or not the wound shape (roll shape) of the sheet substrate FB is distorted. In the event of an abnormality, the winding can be stopped immediately.

(Operation of substrate processing equipment)
Next, the operation of the substrate processing apparatus 100 configured as described above will be described.
In the present embodiment, a connection operation for connecting the substrate cartridge 1 containing the sheet substrate FB to the supply side connection unit 102A as the substrate supply unit 101, an operation for supplying the sheet substrate FB by the substrate cartridge 1 by the substrate supply unit 101, and a substrate processing unit The element forming operation by 102 and the removing operation of the substrate cartridge 1 are sequentially performed.

First, the connection operation of the substrate cartridge 1 will be described. FIG. 12 is a diagram illustrating the connection operation of the substrate cartridge 1.
As shown in FIG. 12, the supply side connection portion 102 </ b> A has an insertion port formed in a shape corresponding to the mount portion 3, and the gas supply portion GS is inserted into the supply port 41 of the gas supply port 4. Is formed.

  In the connection operation, the mounting unit 3 and the supply-side connection unit 102A are aligned with the substrate cartridge 1 held by a holder (for example, the same configuration as the holder HD shown in FIG. 10). After alignment, the mount unit 3 is moved to the + X side and inserted into the substrate processing unit 102. At this time, the gas supply unit GS is inserted into the supply port 41 of the gas supply port 4. For this reason, when the mount unit 3 is connected to the substrate processing unit 102, the substrate guide member 22a and the substrate guide member 22b are in an open state.

  Next, the supply operation will be described. When the sheet substrate FB is supplied to the substrate processing unit 102, for example, the rotation shaft member 26a (roller unit 26) and the tension roller 21a of the substrate cartridge 1 are rotated in the opposite direction to that in the storing operation, and are shown in FIG. As described above, the sheet substrate FB is sent out through the opening 34.

  Next, an element forming operation will be described. In the element forming operation, as shown in FIG. 2, while the sheet substrate FB is supplied from the substrate supply unit 101 to the substrate processing unit 102, the substrate processing unit 102 forms elements on the sheet substrate FB. In the substrate processing unit 102, as shown in FIG. 3, the sheet substrate FB is conveyed by a roller RR.

  For example, the control unit 104 may communicate processing information with the substrate cartridge 1 and control the operation of the substrate processing unit 102 based on the processing information. Specifically, the rotational speed of each roller RR in the substrate processing unit 102 is adjusted in accordance with the supply speed of the sheet substrate FB from the substrate cartridge 1. In addition, the control unit 104 detects whether or not the roller RR is displaced in the Y-axis direction, and when it is displaced, moves the roller RR to correct the position. Further, the control unit 104 also performs position correction of the sheet substrate FB.

  The sheet substrate FB supplied from the substrate supply unit 101 to the substrate processing unit 102 is first transported to the partition wall forming unit 91. In the partition forming part 91, the sheet substrate FB is sandwiched and pressed between the imprint roller 110 and the thermal transfer roller 115, and the partition BA and the alignment mark AM are formed on the sheet substrate by thermal transfer.

  FIG. 14 is a diagram illustrating a state where the partition walls BA and the alignment marks AM are formed on the sheet substrate FB. FIG. 15 is an enlarged view of a part of FIG. FIG. 16 is a diagram illustrating a configuration along a DD cross section in FIG. 15. 14 and 15 show a state when the sheet substrate FB is viewed from the + Z side.

  As shown in FIG. 14, the partition wall BA is formed in the element formation region 60 in the center in the Y direction of the sheet substrate FB. As shown in FIG. 15, by forming the partition wall BA, the element formation region 60 includes a region where the gate bus line GBL and the gate electrode G are formed (gate formation region 52), the source bus line SBL, the source electrode S, A region for forming the drain electrode D and the anode P (source / drain formation region 53) is partitioned. As shown in FIG. 16, the gate formation region 52 is formed in a trapezoidal shape in a cross-sectional view. Although not shown, the source / drain formation region 53 has the same shape. The width W (μm) in the partition wall BA is the line width of the gate bus line GBL. The width W is preferably about 2 to 4 times the droplet diameter d (μm) applied from the droplet applying apparatus 120G.

  The cross-sectional shapes of the gate formation region 52 and the source / drain formation region 53 are V-shaped or U-shaped in cross-section so that the sheet substrate FB can be easily peeled after the fine imprint mold 11 presses the sheet substrate FB. It is preferable to have a shape. As other shapes, for example, a rectangular shape in a sectional view may be used.

  On the other hand, as shown in FIG. 14, a pair of alignment marks AM is formed in the edge regions 61 at both ends in the Y direction of the sheet substrate FB. The partition wall BA and the alignment mark AM are formed at the same time because the mutual positional relationship is important. As shown in FIG. 15, a predetermined distance PY between the alignment mark AM and the gate formation region 52 is defined in the Y-axis direction, and the alignment mark AM and the source / drain formation region 53 are defined in the X-axis direction. A predetermined distance PX is defined. Therefore, based on the positions of the pair of alignment marks AM, it is possible to detect the deviation in the X-axis direction, the deviation in the Y-axis direction, and the θ rotation of the sheet substrate FB.

  14 and 15, a pair of alignment marks AM is provided for each of the plurality of rows of barrier ribs BA in the X-axis direction. However, the present invention is not limited to this. For example, the alignment mark AM is provided for each row of barrier ribs BA. Anyway. If there is a space, the alignment mark AM may be provided not only in the edge region 61 of the sheet substrate FB but also in the element forming region 60. 14 and 15, the alignment mark AM has a cross shape, but may have other mark shapes such as a circular mark and an oblique straight mark.

  Subsequently, the sheet substrate FB is conveyed to the electrode forming unit 92 by the conveyance roller RR. In the electrode forming section 92, droplets are applied by each droplet applying device 120, and electrodes are formed on the sheet substrate FB.

  On the sheet substrate FB, the gate bus line GBL and the gate electrode G are first formed by the droplet applying device 120G. FIGS. 17A and 17B are views showing a state of the sheet substrate FB on which droplet application is performed by the droplet applying apparatus 120G.

  As shown in FIG. 17A, the droplet applying device 120G applies metal ink to the gate forming region 52 of the sheet substrate FB on which the partition walls BA are formed, for example, in the order of 1-9. This order is, for example, the order in which the ink is applied linearly with the tension between the metal inks. FIG. 17B is a diagram illustrating a state in which, for example, one drop of metal ink is applied. As shown in FIG. 17B, since the partition wall BA is provided, the metal ink applied to the gate formation region 52 is held without being diffused. In this way, the metal ink is applied to the entire gate formation region 52.

  After the metal ink is applied to the gate forming region 52, the sheet substrate FB is transported so that the applied portion of the metal ink is positioned on the −Z side of the heat treatment apparatus BK. The heat treatment apparatus BK performs heat treatment on the metal ink applied on the sheet substrate FB, and dries the metal ink. FIG. 18A is a diagram illustrating a state of the gate formation region 52 after the metal ink is dried. As shown in FIG. 18A, by drying the metal ink, the conductor contained in the metal ink is laminated in a thin film shape. Such a thin-film conductor is formed over the entire gate formation region 52, and as shown in FIG. 18B, the gate bus line GBL and the gate electrode G are formed on the sheet substrate FB.

  Next, the sheet substrate FB is conveyed to the −Z side of the droplet applying apparatus 120I. In the droplet applying device 120I, the electrically insulating ink is applied to the sheet substrate FB. In the droplet applying device 120I, for example, as shown in FIG. 19, electrically insulating ink is applied onto the gate bus line GBL and the gate electrode G passing through the source / drain formation region 53.

  After the electrical insulating ink is applied, the sheet substrate FB is transported to the −Z side of the heat treatment apparatus BK, and the heat treatment apparatus BK heat-treats the electrical insulation ink. By this heat treatment, the electrically insulating ink is dried, and the gate insulating layer I is formed. FIG. 19 shows a state in which the gate insulating layer I is formed in a circular shape so as to straddle the partition BA, but it is not particularly necessary to form it beyond the partition BA.

  After the gate insulating layer I is formed, the sheet substrate FB is transported to the −Z side of the droplet applying apparatus 120SD. In the droplet applying device 120SD, metal ink is applied to the source / drain formation region 53 of the sheet substrate FB. For the portion of the source / drain formation region 53 that straddles the gate insulating layer I, for example, metal ink is ejected in the order of 1 to 9 shown in FIG.

  After discharging the metal ink, the sheet substrate FB is conveyed to the −Z side of the heat treatment apparatus BK, and the metal ink is dried. After the drying process, the conductor contained in the metal ink is laminated in a thin film shape, and the source bus line SBL, the source electrode S, the drain electrode D, and the anode P are formed. However, at this stage, the source electrode S and the drain electrode D are connected.

  Next, the sheet substrate FB is conveyed to the −Z side of the cutting device 130. The sheet substrate FB is cut between the source electrode S and the drain electrode D by the cutting device 130. FIG. 21 is a diagram illustrating a state where the gap between the source electrode S and the drain electrode D is cut by the cutting device 130. The cutting device 130 performs cutting while adjusting the irradiation position of the laser beam LL onto the sheet substrate FB using the galvanometer mirror 131.

  After the space between the source electrode S and the drain electrode D is cut, the sheet substrate FB is transported to the −Z side of the droplet applying apparatus 120OS. In the droplet applying apparatus OS, the organic semiconductor layer OS is formed on the sheet substrate FB. Organic semiconductor ink is ejected across the source electrode S and the drain electrode D into a region overlapping the gate electrode G on the sheet substrate FB.

  After discharge of the organic semiconductor ink, the sheet substrate FB is conveyed to the −Z side of the heat treatment apparatus BK, and the organic semiconductor ink is dried. After the drying treatment, semiconductors included in the organic semiconductor ink are laminated in a thin film shape, and an organic semiconductor OS is formed as shown in FIG. Through the above steps, the field effect transistor and the connection wiring are formed on the sheet substrate FB.

  Subsequently, the sheet substrate FB is transported to the light emitting layer forming unit 93 by the transport roller RR (see FIG. 3). In the light emitting layer forming section 93, red, green, and blue light emitting layers IR are formed by the droplet applying device 140Re, the droplet applying device 140Gr, the droplet applying device 140Bl, and the heat treatment device BK, respectively. Since the barrier ribs BA are formed on the sheet substrate FB, even when the red, green, and blue light emitting layers IR are continuously applied without heat treatment by the heat treatment apparatus BK, the solution is applied to the adjacent pixel regions. Overflow does not cause color mixing.

  After the formation of the light emitting layer IR, the sheet substrate FB is formed with the insulating layer I through the droplet applying device 140I and the heat treatment device BK, and the transparent electrode IT is formed through the droplet applying device 140IT and the heat treatment device BK. Through such steps, the organic EL element 50 shown in FIG. 1 is formed on the sheet substrate FB.

  In the element forming operation, in order to prevent the sheet substrate FB from shifting in the X direction, the Y direction, and the θZ direction in the process of forming the organic EL element 50 while transporting the sheet substrate FB as described above, an alignment operation is performed. Is going. Hereinafter, the alignment operation will be described with reference to FIG.

  In the alignment operation, a plurality of alignment cameras CA (CA1 to CA8) provided in each unit appropriately detect the alignment mark AM formed on the sheet substrate FB, and transmit the detection result to the control unit 104. The control unit 104 causes the alignment operation to be performed based on the transmitted detection result.

  For example, the control unit 104 detects the feeding speed of the sheet substrate FB based on the imaging interval of the alignment mark AM detected by the alignment camera CA (CA1 to CA8), and whether or not the roller RR is rotating at a predetermined speed, for example. Determine whether. When it is determined that the roller RR is not rotating at a predetermined speed, the control unit 104 issues an instruction for adjusting the rotation speed of the roller RR and applies feedback.

  For example, the control unit 104 detects whether or not the position of the alignment mark AM in the Y-axis direction is shifted based on the imaging result of the alignment mark AM, and detects whether or not the sheet substrate FB is displaced in the Y-axis direction. To do. When the misregistration is detected, the control unit 104 detects how long the misregistration continues in a state where the sheet substrate FB is conveyed.

  If the positional deviation time is short, it can be dealt with by switching the nozzle 122 that applies droplets among the plurality of nozzles 122 of the droplet applying apparatus 120. If the deviation of the sheet substrate FB in the Y-axis direction continues for a long time, the position of the sheet substrate FB in the Y-axis direction is corrected by the movement of the roller RR.

For example, the control unit 104 detects whether or not the sheet substrate FB is displaced in the θZ direction based on the positions of the alignment marks AM detected by the alignment camera CA in the X-axis and Y-axis directions. When the misalignment is detected, the control unit 104 detects how long the misalignment continues in the state in which the sheet substrate FB is conveyed in the same manner as when detecting the misalignment in the Y-axis direction. If this time is short, the nozzle 122 for applying droplets among the plurality of nozzles 122 of the droplet applying apparatus 120 is switched. If the deviation continues for a long time, the two rollers RR provided at a position sandwiching the alignment camera CA that has detected the deviation are moved in the X direction or the Y direction to correct the position of the sheet substrate FB in the θZ direction.

  Next, the removal operation will be described. For example, after forming the organic EL element 50 on the sheet substrate FB and collecting the sheet substrate FB, the substrate cartridge 1 used as the substrate supply unit 101 is removed from the substrate processing unit 102.

FIG. 24 is a diagram illustrating the removal operation of the substrate cartridge 1.
In the detaching operation, the mount unit 3 is moved in the −X direction to be removed from the supply side connection unit 102A. Since the gas supply part GS is pulled out from the supply port 41 of the gas supply port 4 by removing the mount part 3, the gap between the substrate guide member 22a and the substrate guide member 22b is closed again with the sheet substrate FB interposed therebetween. It becomes a state.

  Thus, in the state where the mount unit 3 and the substrate processing unit 102 are connected, the gap between the substrate guide member 22a and the substrate guide member 22b is opened, so that the opening 34 is opened. In a state where the mount unit 3 and the substrate processing unit 102 are not connected, the opening 34 is closed by the sheet substrate FB because the substrate guide member 22a and the substrate guide member 22b are closed with the sheet substrate FB interposed therebetween. It will be in the state.

As described above, according to the present embodiment, the cartridge main body 2 that has the opening 34 through which the flexible sheet substrate FB is taken in and out and accommodates the sheet substrate FB through the opening 34, and the cartridge Mount portion 3 provided in main body 2 and detachably connected to supply side connection portion 102A and recovery side connection portion 102B, and between mount portion 3, supply side connection portion 102A and recovery side connection portion 102B Depending on the connection state, the opening 34 is provided so as to be closed by the sheet substrate FB, so that foreign matter such as dust can be prevented from entering from the opening 34. Thereby, it can prevent that a foreign material adheres to the sheet | seat board | substrate FB.
Further, according to the present embodiment, the substrate cartridge 1 can be easily attached to and detached from the object (for example, the substrate processing unit 102).

[Second Embodiment]
Next, a second embodiment of the present invention will be described. In this embodiment, the same or equivalent components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted or simplified.
FIG. 25 is a diagram showing a configuration of the substrate processing system SYS according to the present embodiment.
As shown in FIG. 25, the substrate processing system SYS includes a substrate manufacturing apparatus (first processing apparatus) 201, a substrate processing apparatus 202 (second processing apparatus), and a relay apparatus (substrate relay apparatus) 203. The substrate manufacturing apparatus 201 and the substrate processing apparatus 202 are installed in, for example, separate production lines, separate sites, separate factories, and the like.

  The substrate manufacturing apparatus 201 is an apparatus that manufactures, for example, the flexible strip-shaped sheet substrate FB described in the above embodiment as the first process. A substrate manufacturing unit 211 and a control unit 212 are provided. A sheet substrate FB is manufactured in the substrate manufacturing unit 211 under the control of the control unit 212.

  The substrate processing apparatus 202 is an apparatus that forms the organic EL element 50 (see FIG. 3 and the like) described in the first embodiment on the sheet substrate FB as the second process. The substrate processing apparatus 202 includes a substrate processing unit 222, a substrate recovery unit 223, and a control unit 224. The substrate processing unit 222, the substrate recovery unit 223, and the control unit 224 have the same configuration as the substrate processing unit 102, the substrate recovery unit 103, and the control unit 104 in the first embodiment.

  The relay apparatus 203 is formed so as to be detachably connected to both the substrate manufacturing apparatus 201 and the substrate processing apparatus 202. Specifically, the relay device 203 is mounted on the connection unit 211A provided in the substrate manufacturing unit 211 of the substrate manufacturing apparatus 201 and the connection unit 222A provided in the substrate processing unit 222 of the substrate processing apparatus 202. 3 are connected. Note that the configurations of the connection unit 211A and the connection unit 222A are the same as those of the supply-side connection unit 102A described in the first embodiment.

  The relay apparatus 203 is an apparatus that collects the sheet substrate FB manufactured by the substrate manufacturing apparatus 201 and supplies it to the substrate processing apparatus 202. As the relay device 203, for example, the substrate cartridge 1 described in the first embodiment is used. Description of the detailed configuration of the relay device 203 is omitted.

  In the substrate processing system SYS configured as described above, first, the relay device 203 is connected to the connection unit 211A of the substrate manufacturing apparatus 201. After connecting the relay device 203 to the connection unit 211 </ b> A, the sheet manufacturing unit 211 supplies the sheet substrate FB to the relay device 203. The relay device 203 winds up and collects the sheet substrate FB by the same operation as that described in the first embodiment.

  At this time, for example, information from the control unit 212 to the information processing unit IC (see FIG. 5) of the relay device 203 such as the tact and throughput of the board manufacturing device 201, the transport speed of the relay device 203, and the winding of the roller unit 26 Processing information such as information such as the feeding speed, process information indicating all processes and processed processes, information on the sheet substrate FB such as the remaining length and the total length of the sheet substrate FB, and the like are transmitted.

  The processing information transmitted to the information processing unit IC is received by the communication unit CR of the information processing unit IC and stored in the storage unit MR or displayed on the display unit 29. In addition, information regarding the length of the sheet substrate FB detected by the detection unit 21c of the relay device 203 is also transmitted to the information processing unit IC.

  Next, the relay apparatus 203 that has collected the sheet substrate FB is transported to the substrate processing apparatus 202 by a transport system TR such as a truck. After the relay apparatus 203 is transported to the substrate processing apparatus 202, the relay apparatus 203 is connected to the connection unit 222A of the substrate processing apparatus 202 in the procedure described in the first embodiment, and the substrate processing is performed while supplying the sheet substrate FB from the relay apparatus 203. In the part 222, the organic EL element 50 is formed on the sheet substrate FB.

  At this time, for example, the control unit 224 communicates with the information processing unit IC of the relay device 203 and receives processing information stored in the information processing unit IC. Based on the received processing information, the control unit 224 adjusts operations related to the received processing information such as the conveyance speed of the sheet substrate FB, the heating time and the heating temperature of the thermal transfer roller 115 and the heat treatment apparatus BK, and the like. Each step of forming the organic EL element 50 is performed. The sheet substrate FB on which the organic EL element 50 is formed is cut into a panel shape, for example, and collected by the substrate collection unit 223.

  As described above, according to the present embodiment, the substrate manufacturing apparatus 201 that performs the process of manufacturing the flexible sheet substrate FB as the first process, and the sheet substrate FB as the second process after the manufacture of the sheet substrate FB. A substrate processing apparatus 202 that performs a process for forming the organic EL element 50, and a relay device 203 that recovers the sheet substrate FB from the substrate manufacturing apparatus 201 and supplies the recovered sheet substrate FB to the substrate processing apparatus 202. Since the above-described substrate cartridge 1 is used as 203, it is possible to avoid dust and the like from adhering to the sheet substrate FB between the substrate manufacturing apparatus 201 and the substrate processing apparatus 202. In addition, the processing information of the substrate manufacturing apparatus 201 can be supplied to the substrate processing apparatus 202 using the information processing unit IC provided in the relay apparatus 203, and processing can be performed in the substrate processing apparatus 202 using the processing information. Therefore, the processing efficiency in the substrate processing apparatus 202 is improved. In the present embodiment, since the substrate cartridge 1 is used as the relay device 203, the length and remaining length of the sheet substrate FB can be easily grasped. In the present embodiment, since the substrate cartridge 1 is used as the relay device 203, a plurality of processes can be easily subdivided, for example, as in the first process and the second process.

[Third Embodiment]
Next, a third embodiment of the present invention will be described. In the present embodiment, components that are the same as or equivalent to those in the above embodiment are given the same reference numerals, and descriptions thereof are omitted or simplified.
FIG. 26 is a diagram showing a configuration of the substrate processing system SYS2 according to the present embodiment.
As shown in FIG. 26, the substrate processing system SYS2 includes a first substrate processing apparatus (first processing apparatus) 300, second substrate processing apparatuses (second processing apparatuses) 310 and 320, and a relay apparatus (substrate relay apparatus) 303. Have. The first substrate processing apparatus 300 and the second substrate processing apparatuses 310 and 320 are installed in, for example, the same site or the same factory.

  The first substrate processing apparatus 300 is an apparatus that forms the partition BA of the organic EL element 50 on the sheet substrate FB, for example. The second substrate processing apparatuses 310 and 320 are apparatuses that form, for example, an electrode (such as the gate electrode G), the light emitting layer IR of the organic EL element 50, and the transparent electrode ITO on the sheet substrate FB. The second substrate processing apparatuses 310 and 320 have the same configuration. In the following description, the configuration and operation of the second substrate processing apparatus will be described using the second substrate processing apparatus 310 as a representative in principle. However, the same description can be applied to the second substrate processing apparatus 320.

  As described above, the substrate processing system SYS2 has a configuration in which the apparatus for forming the organic EL element 50 is divided into two types of apparatuses, the first substrate processing apparatus 300 and the second substrate processing apparatuses 310 and 320. The relay device 303 is a device that delivers (relays) the sheet substrate FB from the first substrate processing apparatus 300 to the second substrate processing apparatuses 310 and 320. In the present embodiment, the substrate cartridge 1 having the same configuration as that of the first embodiment is used as the relay device 303.

  The first substrate processing apparatus 300 includes a substrate supply unit 301, a substrate processing unit 302, a first control unit 304, a second control unit 305, and a protective substrate supply unit 306. The substrate supply unit 301 has the same configuration as the substrate supply unit 101 in the first embodiment, for example. The substrate processing unit 302 has the same configuration as the partition wall forming unit 91 in the substrate processing apparatus 100 of the first embodiment, and a supply side connection unit 302A is provided at a connection part with the substrate supply unit 301. Yes. The configuration of the supply side connection portion 302A is the same as that of the supply side connection portion 102A in the first embodiment. Thus, the first substrate processing apparatus 300 has the same configuration as the configuration from the substrate supply unit 101 of the substrate processing apparatus 100 to the partition wall forming unit 91 of the substrate processing unit 102 in the first embodiment.

  At the + X side end of the substrate processing unit 302, a collection side connection unit 302B connected to the mount unit 3 of the relay device 303 is provided. The collection side connection unit 302B has the same configuration as the supply side connection unit 302A. The first control unit 304 receives the processing information stored in the information processing unit IC of the substrate supply unit 301, and controls the operation (for example, operations related to processing and processes) of the substrate processing unit 302 based on the processing information. . The second control unit 305 transmits processing information such as the substrate supply unit 301, the substrate processing unit 302, and the sheet substrate FB to the information processing unit IC of the relay device 303. Examples of the processing information include information having the same contents as the processing information described in the first embodiment. The first substrate processing apparatus 300 may include a control device (not shown), and the control device may control and manage the first control unit 304 and the second control unit 305 in an integrated manner. The protective substrate supply unit 306 is provided, for example, at the + X side end of the substrate processing unit 302.

  The second substrate processing apparatus 310 includes a substrate processing unit 311, a substrate recovery unit 312, a first control unit 314, and a second control unit 315. The substrate processing unit 311 has the same configuration as the electrode forming unit 92 and the light emitting layer forming unit 93 in the substrate processing apparatus 100 of the first embodiment. The substrate processing unit 311 has a supply side connection portion 311A at the −X side end portion and a recovery side connection portion 311B at the + X side end portion. The supply side connection portion 311A and the collection side connection portion 311B have the same configuration as the above supply side connection portion 302A and the collection side connection portion 302B, respectively.

  The relay device 303 is detachably connected to the supply side connection unit 311A. The first control unit 314 receives the processing information stored in the information processing unit IC of the relay device 303, and controls the operation of the substrate processing unit 311 (for example, operations related to processing and processes) based on the processing information. The second control unit 315 transmits processing information such as the relay device 303, the substrate processing unit 311, and the sheet substrate FB to the information processing unit IC of the substrate collection unit 312. Examples of the processing information include information having the same contents as the processing information described in the first embodiment.

  Next, in the substrate processing system SYS2 configured as described above, the sheet substrate FB is first accommodated in the substrate cartridge 1, and the substrate cartridge 1 is connected to the supply side connection portion 302A of the substrate processing unit 302 in the first substrate processing apparatus 300. Are connected as the substrate supply unit 101. The substrate cartridge 1 is used as the substrate supply unit 301. Further, the empty substrate cartridge 1 is connected as the relay device 303 to the collection side connection unit 302B of the substrate processing unit 302.

  Next, the sheet substrate FB is supplied from the substrate supply unit 301 to the substrate processing unit 302, and the partition wall BA is formed in the substrate processing unit 302. At this time, the control unit 304 and the control unit 305 communicate with the information processing unit IC of the board supply unit 301 and the information processing unit IC of the relay device 303 and receive information stored in the information processing unit IC. To do. Based on the received information, the control units 304 and 305 adjust the operation of the partition BA while adjusting the operation related to the received processing information such as the conveyance speed of the sheet substrate FB, the heating time and the heating temperature by the thermal transfer roller 115, and the like. Form.

  The sheet substrate FB on which the partition wall BA is formed is sent out from the substrate processing unit 302 to the relay device 303, and is rolled up by the relay device 303 and collected. In the relay device 303, the sheet substrate FB is collected so that the protective substrate PB is disposed on the surface of the sheet substrate FB on which the partition wall BA is formed.

27 to 29 are diagrams illustrating how the sheet substrate FB is recovered by the substrate recovery unit 103. FIG. In FIG. 27 to FIG. 29, a part of the configuration is omitted in order to make it easy to distinguish the diagrams.
In the collecting operation, as shown in FIG. 27, the sheet substrate FB is inserted into the opening 34 of the substrate cartridge 1, and at the same time, the protective substrate PB is inserted from the second opening 35. As shown in FIGS. 26 and 27, the protective substrate PB is supplied from, for example, the protective substrate supply unit 306 described above.

  As shown in FIG. 28, the inserted sheet substrate FB and protective substrate PB are guided by the substrate guide 22 and the second substrate guide 37, respectively, and merge at the junction 39. As shown in FIG. 29, the sheet substrate FB and the protective substrate PB that have joined at the joining unit 39 are transported by the transport unit 21 in a joined state, and are pressed against and closely contacted with the tension roller 21a and the measuring roller 21b. The sheet substrate FB and the protective substrate PB are wound and collected by the roller unit 26 in a close contact state.

  Next, the relay device 303 that has collected the sheet substrate FB with the protective substrate PB adhered thereto is transported to the second substrate processing apparatus 310 by a transport system TR2 such as a forklift. After the transfer, the relay device 303 is connected to the supply side connection unit 311A of the second substrate processing apparatus 310 in the procedure described in the first embodiment, and the empty substrate cartridge 1 is connected to the recovery side connection unit 311B as the substrate recovery unit 312. Connect. After the substrate recovery unit 312 is connected to the recovery side connection unit 311B, the substrate processing unit 311 forms the electrode, the light emitting layer IR, and the transparent electrode ITO on the sheet substrate FB while supplying the sheet substrate FB from the relay device 303.

  At this time, for example, the control units 314 and 315 communicate with the information processing unit IC of the relay apparatus 303 and the information processing unit IC of the substrate collection unit 312 and process information stored in the respective information processing units IC. Receive. Based on the received processing information, the control units 314 and 315 adjust the operations related to the received processing information such as the conveyance speed of the sheet substrate FB, the heating time and the heating temperature by the heat treatment apparatus BK, and the like, The light emitting layer IR and the transparent electrode ITO are formed.

In addition, when the processing speed of the first substrate processing apparatus 300 and the processing speed of the second substrate processing apparatus 310 are, for example, 2: 1, the first substrate processing apparatus 300 is faster than the second substrate processing apparatus 310. May be large (tact is small), the number of relay destinations of the relay device 303 may be increased. In the present embodiment, for example, the second substrate processing apparatus 320 is added as a relay destination of the relay apparatus 303. As a result, the sheet substrate FB processed by the first substrate processing apparatus 300 is processed in parallel at two locations of the second substrate processing apparatuses 310 and 320, and the processing speed is lower (tact is larger). The line will increase.
As described above, since the sheet substrate FB is processed through the processing by the first substrate processing apparatus 300 and the processing by the second substrate processing apparatus 310, the first substrate processing apparatus 300 and the second substrate processing apparatus 310 are combined with each other. When using each table (or when processing is performed continuously), the overall processing speed of the substrate processing system SYS2 is that of the apparatus with the lower processing speed of the first substrate processing apparatus 300 and the second substrate processing apparatus 310. It becomes processing speed.
On the other hand, in this embodiment, since the number of lines is increased by using two second substrate processing apparatuses 310 (second substrate processing apparatuses 310 and 320) having a lower processing speed, the difference in processing speed is compensated. Therefore, the processing speed of the first substrate processing apparatus 300 can be utilized. This avoids a reduction in the processing efficiency of the entire substrate processing system SYS2.

  The organic EL element 50 is formed on the sheet substrate FB by forming the light emitting layer IR and the transparent electrode ITO on the sheet substrate FB on which the partition walls BA and electrodes are formed. The sheet substrate FB on which the organic EL element 50 is formed is wound and collected, for example, by the substrate collection unit 312 in the same manner as the operation procedure shown in FIGS.

  As described above, according to the present embodiment, the first substrate processing apparatus 300 that performs the partition BA and electrode formation processing on the sheet substrate FB as the first processing, and the second substrate on the partition BA and electrode formation processing after the electrode formation processing. As a process, the second substrate processing apparatus 310 that performs the formation process of the light emitting layer IR and the transparent electrode ITO, and the sheet substrate FB is recovered from the first substrate processing apparatus 300, and the recovered sheet substrate FB is supplied to the second substrate processing apparatus 310. Since the substrate cartridge 1 according to the present invention is used as the relay device 303, the first substrate processing device 300 and the second substrate processing device installed in the same site or factory. It is possible to avoid dust and the like from adhering to the sheet substrate FB with the area 310. Further, processing information can be communicated using the information processing unit IC provided in the substrate cartridge 1, and processing can be performed in the substrate processing units 302 and 311 using the processing information, so that the overall processing of the substrate processing system SYS2 can be performed. The processing efficiency will be improved.

  The substrate processing system SYS2 may be configured such that the processing speed of the second substrate processing apparatus 310 is higher than the processing speed of the first substrate processing apparatus 300. As such a configuration, for example, a configuration in which the first substrate processing apparatus 300 includes the partition wall forming unit 91 and the electrode forming unit 92 and the second substrate processing apparatus 310 includes the light emitting layer forming unit 93 can be given. In this case, the difference in processing speed can be compensated for by increasing the number of first substrate processing apparatuses 300 to be larger than the number of second substrate processing apparatuses 310, for example, based on the same concept as the present embodiment.

  For example, FIG. 30A shows a configuration of a substrate processing system SYS2 'in which two first substrate processing apparatuses 300 are provided and one second substrate processing apparatus 310 is provided. Since the number of processing lines by the first substrate processing apparatus 300 having a low processing speed increases, the difference in processing speed is compensated. In this case, for example, it is preferable to control the processing timing in the two first substrate processing apparatuses 300 so that the relay apparatus 303 is alternately connected to the second substrate processing apparatus 310. Thereby, the waiting time of the relay apparatus 303 can be reduced as much as possible, and processing can be performed efficiently.

  Further, the substrate processing system SYS2 ′ has a configuration in which the first substrate processing apparatus 300 is further divided into a partition wall forming apparatus 340 and an electrode forming apparatus 350 (substrate processing system SYS2 ″, for example, as shown in FIG. 30B). The partition forming device 340 has a configuration corresponding to the partition forming portion 91 described in the first embodiment, and the electrode forming device 350 corresponds to the electrode forming portion 92 described in the first embodiment. Similar to the substrate processing system SYS2 ′, the second substrate processing apparatus 310 includes a light emitting layer forming unit 93.

  Of the three types of processes, the partition wall forming process, the electrode forming process, and the light emitting layer forming process, the electrode forming process particularly requires high alignment accuracy, and therefore the processing speed is the lowest. Therefore, as shown in FIG. 30B, two electrode forming apparatuses 350 having a low processing speed are arranged to increase the number of lines, and the partition forming apparatus 340 and the second processing apparatus 310 (the light emitting layer forming portion 93 are installed). The difference in processing speed can be compensated by arranging each of them.

  In this case, the relay device 303 from the partition wall forming device 340 to the electrode forming device 350 functions in the same manner as the relay device 303 of the substrate processing system SYS2 of the above embodiment, and the electrode processing device 350 to the second processing device 310. The relay device 303 has the same function as the relay device 303 of the substrate processing system SYS ′. In addition, regarding this substrate processing system SYS2 ″, for example, the electrode forming apparatus 350 may be divided into a gate forming apparatus for forming the gate electrode G and a source / drain forming apparatus for forming the source electrode S and the drain electrode D. In this case, since the processing speed of the source / drain formation apparatus is lower than that of the gate formation apparatus, it is preferable to provide a plurality of lines of the source / drain formation apparatus. In addition, by increasing the number of lines of the divided devices, the cost for increasing the number of lines can be reduced.

[Fourth Embodiment]
Next, a fourth embodiment of the present invention will be described.
FIG. 31 is a diagram showing a substrate processing system SYS3 according to this embodiment. The substrate processing system SYS3 according to the present embodiment is partly different from the substrate processing system SYS2 described in the third embodiment, and the other configurations are the same. Hereinafter, the difference from the third embodiment will be mainly described. In the following description, the same components as those in the third embodiment are denoted by the same reference numerals, and the description thereof is omitted or simplified.

  As shown in FIG. 31, the substrate processing system SYS3 includes a first substrate processing apparatus (first processing apparatus) 300, second substrate processing apparatuses (second processing apparatuses) 310 and 320, and a relay apparatus (substrate relay apparatus) 303. Have. The substrate processing system SYS3 according to this embodiment is the third point in that the control devices 304 and 305 and the control devices 314 and 315 in the third embodiment are not provided, and that the main control device CONT is provided. This is different from the embodiment. About another structure, it is the same as that of 3rd Embodiment.

  The main control unit CONT uses, for example, the first substrate processing based on the processing information described in the first embodiment (information on the substrate processing device tact, throughput, transport speed, winding speed / feed-out speed, sheet substrate FB, etc.). The apparatus 300, the second substrate processing apparatuses 310 and 320, and the relay apparatus 303 are collectively controlled. For example, it is possible to determine which of the second substrate processing apparatuses 310 and 320 is the relay destination of the relay apparatus 303 based on the conveyance speed, the winding speed, and the delivery speed of the sheet substrate FB.

  As described above, in the present embodiment, since the first substrate processing apparatus 300, the second substrate processing apparatuses 310 and 320, and the relay apparatus 303 are collectively controlled by the main controller CONT, a series of operations for the sheet substrate FB is performed. Processing can be performed efficiently.

[Fifth Embodiment]
Next, a fifth embodiment of the present invention will be described.
FIG. 32 is a schematic diagram showing a configuration of a manufacturing apparatus 410 for manufacturing a display element (for example, an organic EL element) having a pixel electrode and a light emitting layer on a flexible substrate, and the substrate processing unit 102 of FIG. This is another example. However, the same reference numerals are assigned to the same members or apparatuses that the substrate processing unit 102 has.

  A manufacturing apparatus 410 shown in FIG. 32 is different from the substrate processing unit 102 in that it has two partition wall forming units 91. In one partition wall forming step, partition walls BA for wiring of thin film transistors are formed using the imprint roller 110, and alignment marks AM are formed on both sides in the Y-axis direction that is the width direction of the sheet substrate FB. In the other partition forming step, the printing roller 440 is used.

  A metal mask is formed on the printing roller 440 so that the surface thereof can be screen-printed. Further, an ultraviolet curable resin is held inside the printing roller 440. The ultraviolet curable resin is applied to the sheet substrate FB through the metal mask by the squeegee 441. Thereby, the partition walls BA of the ultraviolet curable resin are formed. The height of this partition is 10 or less μm. The partition wall BA of the ultraviolet curable resin formed on the sheet substrate FB is cured by an ultraviolet lamp 444 such as a mercury lamp.

  In the case where a light emitting layer, a hole transport layer, and an electron transport layer are formed on the display element, the partition wall BA needs to be increased. In the thermal transfer by the imprint roller 110, the partition wall BA extruded from the sheet substrate FB cannot be made too high. Therefore, a printing roller 440 is provided separately from the imprint roller 110.

  An alignment camera CA6 is arranged on the upstream side of the printing roller 440, and the control unit 104 grasps the position of the sheet substrate FB in front of the printing roller 440. Then, the control unit 104 controls the rotation of the printing roller 440 and prints the ultraviolet curable resin in accordance with the position of the thin film transistor formed on the sheet substrate FB.

The ultraviolet curable resin layer refers to a layer mainly composed of a resin that is cured through a crosslinking reaction or the like by ultraviolet irradiation. As the ultraviolet curable resin, a component containing a monomer having an ethylenically unsaturated double bond is preferably used and cured by irradiating with ultraviolet rays to form an ultraviolet curable resin layer. As the ultraviolet curable resin, for example, an ultraviolet curable urethane acrylate resin, an ultraviolet curable polyester acrylate resin, an ultraviolet curable epoxy acrylate resin, an ultraviolet curable polyol acrylate resin, or an ultraviolet curable epoxy resin is preferable. Used. Of these, ultraviolet curable acrylate resins are preferred. In addition, if it is for the partition BA of a light emitting layer, it is preferable that it is a black matrix, Therefore You may introduce | transduce metals and oxides, such as chromium, into an ultraviolet curable acrylate resin.

  The partition wall BA of the ultraviolet curable resin may be formed on the partition wall BA formed on the sheet substrate by the imprint roller 110, or may be formed in a region where the partition wall BA is not formed by the imprint roller 110. Also good. The subsequent light emitting layer forming step may be the same configuration as the step described in the first embodiment.

[Sixth Embodiment]
Next, a sixth embodiment of the present invention will be described.
In the present embodiment, a manufacturing apparatus and a manufacturing method of a liquid crystal display element will be described. The liquid crystal display element generally includes a deflection filter, a sheet substrate FB having a thin film transistor, a liquid crystal layer, a color filter, and a deflection filter. Among these, it has been described that the sheet substrate FB having a thin film transistor can be manufactured by the substrate processing unit 102 illustrated in the upper part of FIG. 1 or the manufacturing apparatus 410 illustrated in the upper part of FIG.

  In the present embodiment, liquid crystal supply and color filter CF bonding will be described. It is necessary to supply liquid crystal to the liquid crystal display element, and it is necessary to form a liquid crystal sealing wall. For this reason, in this embodiment, the printing roller 440 depicted in the lower part of FIG. 32 is used not for the partition BA for the light emitting layer but for the sealing wall of the liquid crystal.

  FIG. 33 shows a supply bonding apparatus 420 that supplies liquid crystal and bonds color filters.

  The supply bonding apparatus 420 includes an upstream low vacuum chamber 82 and a downstream low vacuum chamber 83, and a high vacuum chamber 84 is provided between the upstream low vacuum chamber 82 and the downstream low vacuum chamber 83. Yes. The low vacuum chambers 82 and 83 and the high vacuum chamber 84 are evacuated by a rotary pump or a turbo molecular pump 89.

  A color filter CF is supplied to the upstream low vacuum chamber 82, and a sheet substrate FB on which a liquid crystal sealing wall is formed is supplied via the printing roller 40 shown in FIG. The Note that alignment marks are also formed on both sides of the color filter CF in the Y-axis direction.

  First, a thermosetting adhesive for adhering to the color filter CF is applied from the adhesive dispenser 72 to the sheet substrate FB on which the liquid crystal sealing wall is formed. Then, the sheet substrate FB is sent to the high vacuum chamber 84 via the upstream low vacuum chamber 82. In the high vacuum chamber 84, liquid crystal is applied from the liquid crystal dispenser 74. Then, the color filter CF and the sheet substrate FB are bonded by the thermal transfer roller 76.

  The alignment mark AM of the sheet substrate FB is imaged by the alignment camera CA11, and the alignment mark AM of the color filter CF is imaged by the alignment camera CA12. The results captured by the alignment cameras CA11 and CA12 are sent to the control unit 104, and the deviation in the X-axis direction, the deviation in the Y-axis direction, and θ rotation are grasped. The thermal transfer roller 76 changes the rotational speed in accordance with the position signal sent from the control unit 104 and bonds the color filter CF and the sheet substrate FB while aligning them.

  The adhered liquid crystal display element sheet CFB is sent to the outside through the downstream low vacuum chamber 83. In addition, although the adhesive was demonstrated with the thermosetting adhesive, you may use an ultraviolet curable adhesive. In this case, an ultraviolet lamp or the like is used instead of the thermal transfer roller 76.

[Seventh Embodiment]
Next, a seventh embodiment of the present invention will be described.
FIG. 34 is a diagram for explaining a mechanism for alignment in the Y-axis direction by the printing roller 40. A metal mask is formed on the surface of the printing roller. With the signal from the control unit 104, the alignment in the X-axis direction can be adjusted by the rotation speed of the printing roller. The alignment in the Y-axis direction has the following method.

  FIG. 34A shows a printing roller 440p in which the center of the roller swells or dents by a pneumatic or hydraulic control method. By supplying air or oil in response to a signal from the speed & alignment control unit 90, the positions of the roller central portion and the peripheral portion in the Y-axis direction can be changed.

  FIG. 34B shows a printing roller 440q in which the entire roller is enlarged or reduced by the thermal deformation control method. By heating or cooling with a signal from the speed & alignment control unit 90, the position of the entire roller in the Y-axis direction and the position in the X-axis direction can be changed.

  FIG. 34C shows a printing roller 440r in which the entire roller is bent by the bending deformation control method. The printing roller 440r preferably has a slit in the circumferential direction so as to bend with a small force.

The technical scope of the present invention is not limited to the above-described embodiment, and appropriate modifications can be made without departing from the spirit of the present invention.
In the above embodiment, only the substrate guide members 22a and 22b are formed in an air pad shape, and the supply port 41 of the gas supply port 4 is connected only to the substrate guide members 22a and 22b on the opening 34 side. For example, the second substrate guide members 37a and 37b on the second opening 35 side may have the same configuration.

  For example, as shown in FIG. 35, a flow path 49 is provided from the supply port 41 to the second substrate guide members 37a and 37b, and the first flow path 49 is connected to the second substrate guide member 37a. The flow path 49a and the second flow path 49b connected to the second substrate guide member 37b can be branched. In this case, the electromagnetic valve V1 may be provided in the flow path 42 and the electromagnetic valve V2 may be provided in the flow path 49 so that the opening / closing control can be performed independently by the opening 34 and the second opening 35. Absent. The control of the electromagnetic valves V1 and V2 can be performed by, for example, the control unit 104 or the information processing unit IC.

  As described above, since the opening 34 and the second opening 35 are independently opened and closed, it is possible to prevent an unused opening from being opened. Thereby, intrusion of foreign matters such as dust from the opening can be prevented.

  Further, for example, when a trouble occurs in a part of the above-described substrate processing apparatus or substrate processing system, the sheet substrate FB may be cut so as to remove the trouble occurrence portion. Thereby, the fall of the yield of the sheet | seat board | substrate FB can be prevented. Further, in the substrate cartridge and the substrate processing system in the present embodiment, the remaining length of the sheet substrate FB can be known even when the sheet substrate FB is cut due to a defect or the like, or when the line down occurs due to a power failure or the like. Processing can be done immediately. Therefore, according to the present embodiment, the processing efficiency is improved and the safety is improved.

  In the above embodiment, the field effect transistor shown in FIG. 1 has been described as an example. However, the present invention is not limited to this. FIG. 36A and FIG. 36B are cross-sectional views showing field effect transistors different from the above embodiment. In addition to the field effect transistor shown in FIG. 1, for example, a bottom gate type can be manufactured as the field effect transistor shown in FIG. After forming the gate electrode G, the gate insulating layer I, and the organic semiconductor layer OS on the sheet substrate FB, the source electrode S and the drain electrode D are formed.

FIG. 36B shows a top gate type field effect transistor, in which a source electrode S and a drain electrode D are formed on a sheet substrate FB, an organic semiconductor layer OS is formed, and a gate insulating layer is further formed thereon. I, a gate electrode G is formed.
Any of these field-effect transistors can be handled by using the substrate processing unit 102 in which the order of metal ink or the like is changed.

  Moreover, in the said embodiment, although it was set as the structure by which the opening part 34 and the 2nd opening part 35 were provided in the + X side edge part of the mount part 3, it is not restricted to this, For example, a position different from the mount part 3 It does not matter even if it is the composition provided in. Further, the second opening 35 may not be provided.

  In the above-described embodiment, the substrate cartridge 1 is configured to include the substrate drive mechanism 24 and is configured to wind up and store the sheet substrate FB. However, the present invention is not limited to this, and is configured to be stored by other methods. It does not matter.

  In the above embodiment, the adhesive portion 26c is provided on the surface of the roller portion 26 of the substrate driving mechanism 24. However, the present invention is not limited to this, and any other configuration can be used as long as the sheet substrate FB can be held. A mechanism may be used. Further, the adhesive portion 26 c is not necessarily provided on the entire surface of the roller portion 26, and may be configured to be provided on a part of the surface of the roller portion 26.

  Moreover, about the conveyance part 21 and the guide part 27 which are arrange | positioned inside the accommodating part 20, it is not restricted to the form illustrated in the said embodiment, It is good also as another arrangement | positioning.

  In the above embodiment, the configuration in which only one external connection unit to which the substrate cartridge 1 is connected is provided for each substrate processing unit has been described as an example. However, the present invention is not limited to this. For example, a configuration having a plurality of external connection portions in the Z direction may be employed. With this configuration, for example, the substrate cartridge 1 can be attached in a state of being inverted in the Z direction.

  In the above embodiment, the external connection portion may be configured to be movable in the Z direction. In this case, for example, when the substrate cartridge 1 is attached in the state reversed in the Z direction, the external connection portion may be moved in the Z direction.

  Further, in the above embodiment, the clamp mechanism that sandwiches the sheet substrate FB when the opening 34 is opened and closed is configured to be used as the substrate guide members 22a and 22b, but is not limited thereto. The clamp mechanism may be provided separately from the board guide members 22a and 22b.

FB ... Sheet substrate PB ... Protective substrate SYS, SYS2 ... Substrate processing system 1 ... Substrate cartridge 2 ... Cartridge body 3 ... Mount portion 4 ... Gas supply port 20 ... Storage portion 21 ... Conveying portion 21a ... Tension roller 21b ... Measuring roller 21c ... Detection unit 22 ... Substrate guide part 22a, 22b ... Substrate guide member (clamp mechanism) 23 ... Projection part 24 ... Substrate drive mechanism 25 ... Cover part 26 ... Roller part 26c ... Adhesion part 27 ... Guide part 28 ... Window part 29 ... Display unit 34... Opening unit 35... Second opening 36... Substrate transport unit 37... Substrate guide unit 41... Supply port 42 and 43 ... Channel 44a and 44b ... Gas outlet 45 ... Pressing member 50 ... Organic EL element 51. Engagement unit 100, 202, 300, 310, 320 ... substrate processing apparatus 102A, 302A, 311A ... Supply side connection unit 102B, 302B, 311B ... Recovery side connection unit 103, 223, 312 ... Substrate recovery unit 201 ... Substrate manufacturing device 203, 303 ... Relay device 211 ... Substrate manufacturing unit 211A, 222A ... Connection unit 222, 302, 311 , 321... Substrate processing section

Claims (37)

A cartridge main body having an opening through which the substrate is taken in and out, and containing the substrate through the opening;
A mounting portion provided on the cartridge body and detachably connected to the external connection portion;
The opening portion is provided so as to be able to be closed by the substrate according to a connection state between the mount portion and the external connection portion. The cartridge body has a clamping mechanism for sandwiching the substrate in the opening,
The substrate cartridge according to claim 1, wherein the clamp mechanism closes the opening while sandwiching the substrate. The substrate cartridge according to claim 2, wherein the clamp mechanism has a gas ejection port that supplies gas to a portion sandwiching the substrate. The substrate cartridge according to claim 3, wherein the gas ejection port ejects the gas so that a gap is formed between the clamp mechanism and the substrate. 5. The substrate cartridge according to claim 3, wherein the cartridge body includes a switching mechanism that switches between ejection and non-ejection of the gas according to a connection state between the mount portion and the external connection portion. The substrate cartridge according to any one of claims 1 to 5, wherein the opening is provided in the mount. The substrate cartridge according to any one of claims 1 to 6, wherein the cartridge main body includes a winding / feeding-out mechanism that winds the substrate or feeds the substrate. The cartridge body has an accommodating portion that is connected to the opening and accommodates the substrate.
The substrate cartridge according to claim 7, wherein the winding and feeding mechanism is provided in the housing portion. The winding and feeding mechanism is
A shaft member held rotatably;
The substrate cartridge according to claim 7, further comprising: a first guide member that guides the substrate to the shaft member or guides the substrate to the opening. The substrate cartridge according to claim 9, wherein the shaft member includes an adhesion portion that adheres the substrate. The substrate cartridge according to claim 9 or 10, wherein the guide member is provided so as to be movable at least in a radial direction of rotation of the shaft member. The substrate cartridge according to any one of claims 7 to 11, wherein the cartridge body includes a transport mechanism that transports the substrate between the opening and the take-out and feed mechanism. The substrate cartridge according to claim 12, wherein the transport mechanism includes a tension mechanism that applies tension to the substrate. The substrate cartridge according to claim 12, wherein the transport mechanism includes a measurement unit that measures a transport amount of the substrate. The substrate cartridge according to claim 14, further comprising a storage unit that stores data based on the carry amount. The substrate cartridge according to claim 14, further comprising a communication unit that performs data communication based on the carry amount. The substrate cartridge according to claim 14, further comprising a display unit that displays data based on the carry amount. The substrate cartridge according to any one of claims 12 to 17, wherein the cartridge main body includes a substrate guide member that guides the substrate between the opening and the transport mechanism. The substrate cartridge according to any one of claims 1 to 18, wherein the cartridge main body includes a lid portion that is openable and closable. The substrate cartridge according to any one of claims 1 to 19, wherein the cartridge main body includes a window portion through which an accommodation state of the substrate can be observed. The substrate cartridge according to any one of claims 1 to 20, wherein the cartridge main body includes a second opening for taking in and out a protective substrate that protects a surface of the substrate. The substrate cartridge according to claim 21, wherein the cartridge main body includes a pressing mechanism that presses the protective substrate against the substrate. The substrate cartridge according to claim 22, wherein the cartridge body includes a protective substrate guide member that guides the protective substrate between the second opening and the pressing mechanism. The substrate cartridge according to any one of claims 1 to 23, wherein the substrate is accommodated in the cartridge main body so that at least a part of the substrate overlaps each other. The substrate cartridge according to any one of claims 1 to 24, wherein the substrate is accommodated in a roll shape in the cartridge body. A substrate processing unit for processing the substrate;
A substrate cartridge according to any one of claims 1 to 25;
A substrate processing apparatus, comprising: a substrate processing side connection unit provided in the substrate processing unit and connected to the substrate cartridge. 27. The substrate processing apparatus according to claim 26, wherein the substrate processing side connection unit is provided on at least one of a substrate carry-in side and a substrate carry-out side in the substrate processing unit. The substrate processing apparatus according to claim 26, wherein the substrate processing side connection portion is provided to be movable. The substrate processing apparatus according to claim 26, wherein a plurality of the substrate processing side connection portions are provided. 30. The substrate cartridge according to claim 26, wherein the substrate cartridge is used as at least one of a supply unit that supplies the substrate to the substrate processing unit and a recovery unit that recovers the substrate from the substrate processing unit. The substrate processing apparatus as described. The substrate processing according to any one of claims 26 to 30, wherein the substrate processing unit includes at least one of forming a display element on the substrate and transporting the substrate. apparatus. A first processing apparatus for performing a first processing on a substrate;
A second processing apparatus for performing a second process on the substrate after the first process;
A substrate relay device for recovering the substrate from the first processing apparatus and supplying the recovered substrate to the second processing apparatus;
A substrate processing system using the substrate cartridge according to any one of claims 1 to 25 as the substrate relay device. The first process includes a process of forming an electric circuit on the substrate;
The substrate processing system according to claim 32, wherein the second process includes a process of forming pixels on the substrate. The substrate processing system according to claim 32 or 33, wherein the substrate relay device is used according to processing information of each of the first processing apparatus and the second processing apparatus. The substrate processing system according to claim 34, further comprising a system control unit that manages at least the processing information. A substrate processing apparatus that processes a substrate, and a main control unit that controls the substrate cartridge according to any one of claims 1 to 25 connected to the substrate processing apparatus. Processing the substrate in the substrate processing unit;
A method for manufacturing a display element, comprising: supplying the substrate to the substrate processing unit using the substrate cartridge according to any one of claims 1 to 25.

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