TWI587558B - Substrate handling device, substrate processing system, substrate processing system, control device and manufacturing method of display element - Google Patents

Description

Substrate crucible, substrate processing apparatus, substrate processing system, control device, and manufacturing method of display element

The present invention relates to a substrate stack, a substrate processing apparatus, a substrate processing system, a control device, and a method of manufacturing a display element.

As a display element constituting a display device such as a display device, for example, an organic electroluminescence (organic EL) element is known. The organic EL device is composed of an anode and a cathode on a substrate and has an organic light-emitting layer interposed between the anode and the cathode. In the organic EL device, a hole is injected from the anode to the organic light-emitting layer, and a hole is bonded to the electron in the organic light-emitting layer, and the light emitted by the combination is used to obtain display light. In the organic EL element, for example, an electric circuit connected to an anode and a cathode is formed on a substrate.

As one of methods for producing an organic EL element, for example, a method called a roll to roll (hereinafter, simply referred to as "reel method") is known (see, for example, Patent Document 1). In the reel method, a sheet-like substrate which is wound on the substrate supply side is fed, and the substrate is conveyed while the substrate on the substrate collection side is taken up, and the substrate is conveyed, and the substrate is conveyed and wound up. A method in which a light-emitting layer of an organic EL element, an anode, a cathode, a circuit, or the like is sequentially formed on a substrate.

In the configuration described in Patent Document 1, for example, the substrate feeding roller and the substrate winding roller can be removed from the production line. The removed drum is, for example, transported to another production line and can be installed on the other production line for use.

[Advanced technical literature]

[Patent Document 1] International Publication No. 2006/100868

However, in the above configuration, the substrate wound around the reel is exposed to the external environment of the production line, so that foreign matter such as dust adheres to the substrate.

The aspect of the present invention is to provide a substrate, a substrate processing apparatus, and a substrate processing system which are capable of preventing foreign matter from adhering to a substrate.

A substrate raft according to an aspect of the present invention includes: a cymbal body having an opening that carries in and out the substrate and accommodates the substrate passing through the opening; and a shackle body that is detachably connected to the external connection portion a blocking portion that closes the opening portion in accordance with a connection state between the seat portion and the external connection portion.

A substrate raft according to an aspect of the present invention includes: a cymbal body having an opening that carries in and out the substrate and accommodates the substrate passing through the opening; and a shackle body that is detachably connected to the external connection portion The opening portion is configured to be closable by the substrate in accordance with a connection state between the seat portion and the external connection portion.

A substrate processing apparatus according to an aspect of the present invention includes: a substrate processing unit that processes a substrate; the substrate 匣; and a substrate processing unit connection portion that is provided in the substrate processing unit and that is connected to the substrate 。.

A substrate processing system according to an aspect of the present invention includes: a first processing device that performs a first processing on a substrate; a second processing device that performs a second processing on the substrate after the first processing; and the first processing from the first processing The substrate relay device that recovers the substrate and supplies the recovered substrate to the second processing device, and uses the substrate 匣 as the substrate relay device.

A control device according to an aspect of the present invention includes: a substrate processing apparatus that processes a substrate; and a main control unit that controls the substrate 连接 connected to the substrate processing apparatus.

A method of manufacturing a display device according to an aspect of the present invention includes: a step of processing a substrate in a substrate processing unit; and a step of supplying the substrate to the substrate processing unit using the substrate 。.

According to the aspect of the invention, it is possible to prevent foreign matter from adhering to the substrate.

Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.

(Organic EL device)

Fig. 1(a) is a plan view showing the structure of an organic EL element. Figure 1 (b) is a cross-sectional view taken along line b-b of Figure 6 (a). Figure 1 (c) is a cross-sectional view taken along line c-c of Figure 1 (a).

As shown in FIGS. 1(a) to 1(c), the organic EL element 50 is formed on the thin substrate FB to form the gate electrode G and the gate insulating layer I, and further to form the source electrode S, the drain electrode D, and the pixel electrode. After P, a bottom contact type of the organic semiconductor layer OS is formed.

As shown in FIG. 1(b), a gate insulating layer I is formed on the gate electrode G. A source electrode S of the source bus bar SBL is formed on the gate insulating layer I, and a drain electrode D connected to the pixel electrode P is formed. An organic semiconductor layer OS is formed between the source electrode S and the drain electrode D. This completes the field effect transistor. Further, on the pixel electrode P, a light-emitting layer IR is formed as shown in FIGS. 1(b) and 1(c), and a transparent electrode ITO is formed on the light-emitting layer IR.

As shown in FIG. 1(b) and FIG. 1(c), for example, a partition wall BA (a bank layer (BANK LAYER)) is formed on the sheet substrate FB. Further, as shown in FIG. 1(c), the source bus bar SBL is formed between the partition walls BA. As described above, the source bus bar SBL is formed with high precision by the partition wall BA, and the pixel electrode P and the light-emitting layer IR are also formed correctly. Further, although not shown in FIGS. 1(b) and 1(c), the gate bus bar GBL is formed between the partition walls BA in the same manner as the source bus bar SBL.

This organic EL element 50 is very suitably used for a display portion of an electronic device such as a display device such as a display device. In this case, for example, the organic EL element 50 is formed into a panel shape. In the manufacture of such an organic EL element 50, it is necessary to form a substrate on which a thin film transistor (TFT) and a pixel electrode are formed. In order to accurately form an organic compound layer (light-emitting element layer) including one or more layers of the light-emitting layer on the pixel electrode on the substrate, it is necessary to form the partition wall BA (bank layer) easily and accurately in the boundary region of the pixel electrode.

(substrate processing device)

FIG. 2 is a schematic view showing the configuration of a substrate processing apparatus 100 that performs processing using a flexible sheet substrate FB.

The substrate processing apparatus 100 is a device in which the organic EL element 50 shown in FIG. 1 is formed using a strip-shaped sheet substrate FB. As shown in FIG. 2, the substrate processing apparatus 100 includes a substrate supply unit 101, a substrate processing unit 102, a substrate collection unit 103, and a control unit 104. The sheet substrate FB is transported from the substrate supply unit 101 to the substrate collection unit 103 via the substrate processing unit 102. The control unit 104 collectively controls the operation of the substrate processing apparatus 100.

In the following description, the XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. The direction in which the sheet substrate FB is conveyed in the horizontal plane is the X-axis direction, the direction orthogonal to the X-axis direction in the horizontal plane is the Y-axis direction, and the direction orthogonal to the X-axis direction and the Y-axis direction (that is, the vertical direction) ) is the Z-axis direction. Further, the directions of rotation (inclination) around the X-axis, the Y-axis, and the Z-axis are θX, θY, and θZ directions, respectively.

As the sheet substrate FB, for example, a heat resistant resin film, stainless steel or the like can be used. For example, the resin film may be a polyethylene resin, a polypropylene resin, a polyester resin, an ethylene-vinyl alcohol copolymer resin, a polyvinyl chloride resin, a cellulose resin, a polyamide resin, a polycarbonate resin, a polystyrene resin, or the like. Materials such as vinyl acetate resin. The dimension of the sheet substrate FB in the Y direction is, for example, about 1 m to 2 m, and the dimension in the X direction is, for example, 10 m or more. Of course, this size is merely an example and is not limited thereto. For example, the dimension of the sheet substrate FB in the Y direction may be 50 cm or less, or may be 2 m or more. Further, the dimension of the sheet substrate FB in the X direction may be 10 m or less. Further, the flexibility of the present embodiment means that the substrate can be bent without causing shear or breakage even if a predetermined force is applied to the substrate at least to its own weight. The flexibility described above varies depending on the material, size, thickness, temperature, and the like of the substrate.

The sheet substrate FB preferably has a small coefficient of thermal expansion so that the size does not change even if it is subjected to heat of, for example, about 200 °C. For example, an inorganic filler may be mixed in the resin film to reduce the coefficient of thermal expansion. Examples of the inorganic filler include titanium oxide, zinc oxide, aluminum oxide, and cerium oxide.

The substrate supply unit 101 is connected to the supply side connection unit 102A provided in the substrate processing unit 102. The substrate supply unit 101 supplies, for example, a sheet substrate FB wound in a roll shape to the substrate processing unit 102. The substrate collection unit 103 collects the sheet substrate FB processed by the substrate processing unit 102.

FIG. 3 is a view showing the configuration of the substrate processing unit 102.

As shown in FIG. 3, the substrate processing unit 102 includes a transport unit 105, an element forming unit 106, an alignment unit 107, and a substrate cutting unit 108. In the substrate processing unit 102, the constituent elements of the above-described organic EL element 50 are formed on the sheet substrate FB while the sheet substrate FB supplied from the substrate supply unit 101 is transported, and the sheet substrate FB on which the organic EL element 50 is formed is transferred to the substrate. The portion sent by the recovery unit 103.

The transport unit 105 has a plurality of rollers RR disposed at positions in the X direction. The sheet substrate FB can also be transported in the X-axis direction by the rotation of the drum RR. The roller RR may be a rubber roller that is sandwiched between the sheet substrates FB from both sides, and the sheet substrate FB may be a roller RR having a ratchet as long as it has a perforator. One of the plurality of rollers RR of the plurality of rollers RR is movable in the Y-axis direction orthogonal to the conveying direction.

The element forming portion 106 has a partition wall forming portion 91, an electrode forming portion 92, and a light emitting layer forming portion 93. The partition wall forming portion 91, the electrode forming portion 92, and the light-emitting layer forming portion 93 are arranged in this order from the upstream side to the downstream side in the transport direction of the sheet substrate FB. Hereinafter, each configuration of the element forming portion 106 will be described in order.

The partition wall forming portion 91 has an impression cylinder 110 and a heat transfer roller 115. The partition wall forming portion 91 forms the partition wall BA on the sheet substrate FB sent from the substrate supply portion 101. The sheet substrate FB is pressed by the impression cylinder 110 at the partition wall forming portion 91, and the sheet substrate FB is heated to a temperature above the glass transition point by the heat transfer roller 115 to maintain the shape of the partition wall BA after pressing. Therefore, the mold shape formed on the surface of the drum of the impression cylinder 110 is transferred to the sheet substrate FB. The sheet substrate FB is heated by the heat transfer roller 115 to, for example, about 200 °C.

The surface of the cylinder of the impression cylinder 110 is mirror-finished, and a micro imprint mold 111 made of a material such as SiC or Ta is attached to the surface of the cylinder. The micro imprint mold 111 is a stamper for wiring of a thin film transistor and a stamper for a color filter.

The impression cylinder 110 forms an alignment mark AM on the sheet substrate FB using the fine imprint mold 111. Since the alignment mark AM is formed on both sides in the width direction of the sheet substrate FB, that is, in the Y-axis direction, the fine imprint mold 111 has a stamper for the alignment mark AM.

The electrode forming portion 92 is provided on the +X side of the partition wall forming portion 91, and forms a thin film transistor using, for example, an organic semiconductor. Specifically, after the gate electrode G, the gate insulating layer I, the source electrode S, the drain electrode D, and the pixel electrode P as shown in FIG. 1 are formed, the organic semiconductor layer OS is formed.

As the thin film transistor (TFT), it may be an inorganic semiconductor or an organic semiconductor. A thin film transistor of an inorganic semiconductor is known as an amorphous germanium system, but a thin film transistor using an organic semiconductor may also be used. As long as the organic semiconductor is used to constitute the thin film transistor, the thin film transistor can be formed by a printing technique or a droplet coating method. Further, in a thin film transistor using an organic semiconductor, a field effect type transistor (FET) as shown in Fig. 1 is particularly preferable.

The electrode forming portion 92 has a droplet applying device 120, a heat treatment device BK, a cutting device 130, and the like.

In the present embodiment, as the droplet applying device 120, for example, a droplet applying device 120G used when forming the gate electrode G, a droplet applying device 120I used when forming the gate insulating layer I, and a source are formed. The droplet applying device 120SD used for the electrode S, the drain electrode D, and the pixel electrode P, and the droplet applying device 120OS used for forming the organic semiconductor layer OS.

4 is a plan view showing the configuration of the droplet applying device 120. In Fig. 4, the configuration when the droplet applying device 120 is viewed from the +Z side is shown. The droplet applying device 120 is formed to be long in the Y-axis direction. A droplet driving device 120 is provided with a driving device (not shown). The droplet applying device 120 can be moved by, for example, the X direction, the Y direction, and the θZ direction by the driving device.

A plurality of nozzles 122 are formed in the droplet coating device 120. The nozzle 122 is provided in the opposing surface of the droplet applying device 120 and the sheet substrate FB. The nozzles 122 are arranged, for example, in the Y-axis direction, for example, two rows of the nozzles 122 (mouth array) are formed. The control unit 104 can apply the droplets to all the nozzles 122 at a time, and can individually adjust the timing at which the droplets are applied to the respective nozzles 122.

As the droplet applying device 120, for example, an inkjet method, a dispenser method, or the like can be employed. Examples of the inkjet method include a charging control method, a pressurized vibration method, a motor conversion method, an electrothermal conversion method, and an electrostatic attraction method. In the droplet coating method, the waste of materials is less and the desired amount of material can be reliably disposed at a desired position. Further, the amount of one drop of the metallic ink coated by the droplet coating method is, for example, 1 to 300 ng.

Returning to Fig. 2, the droplet applying device 120G coats the metallic ink in the partition wall BA of the gate bus bar GBL. The droplet applying device 120I is an electrically insulating ink that coats a polyimine-based resin or a urethane-based resin in a switching portion. The droplet applying device 120SD coats the metal ink in the partition wall BA of the source bus bar SBL and the partition wall BA of the pixel electrode P. The droplet applying device 120OS applies an organic semiconductor ink to a switching portion between the source electrode S and the drain electrode D.

A metal ink having a particle diameter of about 5 nm or so can be stably dispersed in a solvent at room temperature, and carbon, silver (Ag) or gold (Au) can be used as the conductor. The compound forming the organic semiconductor ink may be a single crystal material or an amorphous material, and may be a low molecular weight or a high molecular weight. In particular, a single crystal or a π-conjugated polymer of a condensed cyclic aromatic hydrocarbon compound represented by condensed pentabenzene, a co-triphenyl, an onion or the like is exemplified as a compound which forms an organic semiconductor ink.

The heat treatment apparatus BK is disposed on the +X side of each droplet application device 120 (on the downstream side in the substrate transfer direction). The heat treatment apparatus BK can emit, for example, hot air or far infrared rays to the sheet substrate FB. The heat treatment apparatus BK uses the radiant heat of these, and the droplets applied to the sheet substrate FB are dried or baked (baked) to be hardened.

The cutting device 130 is provided on the +X side of the droplet applying device 120SD and on the upstream side of the droplet applying device 120OS. The cutting device 130 cuts off the source electrode S and the drain electrode D formed by the droplet applying device 120SD using, for example, laser light. The cutting device 130 includes a light source (not shown) and a current mirror 131 that irradiates the laser light from the light source onto the sheet substrate FB.

As the type of the laser light, it is preferable to use a laser having a wavelength that the cut metal film absorbs, and in the wavelength conversion laser, a 2, 3, and 4 harmonic of YAG or the like is preferable. Further, by using a pulse type laser, heat diffusion can be prevented, and damage other than the cut portion can be reduced. When the material is aluminum, it is preferably a femtosecond laser having a wavelength of 760 nm.

In the present embodiment, for example, a femtosecond laser irradiation unit using a titanium sapphire laser as a light source is used. The femtosecond laser irradiation unit irradiates the laser light LL with a pulse of, for example, 10 kHz to 40 kHz.

In the present embodiment, since the femtosecond laser is used, the sub-microsecond processing can be performed, and the distance between the source electrode S and the drain electrode D which determines the performance of the field effect transistor can be accurately cut. The distance between the source electrode S and the drain electrode D is, for example, about 3 μm to 30 μm.

In addition to the above-described femtosecond laser, for example, a carbon dioxide gas laser or a green laser can be used. Further, in addition to the laser, it can be mechanically cut by a dicing saw or the like.

The current mirror 131 is disposed on the optical path of the laser light LL. The current mirror 131 reflects the laser light LL from the light source onto the sheet substrate FB. The current mirror 131 is set to be rotatable in, for example, the θX direction, the θY direction, and the θZ direction. By the rotation of the current mirror 131, the irradiation position of the laser light LL changes.

By using both of the partition wall forming portion 91 and the electrode forming portion 92 described above, a thin film transistor or the like can be formed by a printing technique or a droplet coating method without using a so-called lithography process. When only the electrode forming portion 92 such as a printing technique or a droplet coating method is used, a thin film transistor or the like may not be formed accurately due to penetration or expansion of the ink.

On the other hand, since the partition wall BA is formed by using the partition wall forming portion 91, penetration or expansion of the ink can be prevented. Further, the distance between the source electrode S and the drain electrode D which determines the performance of the thin film transistor is formed by laser processing or machining.

The light-emitting layer forming portion 93 is disposed on the +X side of the electrode forming portion 92. The light-emitting layer forming portion 93 is formed of, for example, a light-emitting layer IR or a pixel electrode ITO which is a constituent element of the organic EL device, on the sheet substrate FB on which the electrode is formed. The light emitting layer forming portion 93 has a droplet applying device 140 and a heat processing device BK.

The light-emitting layer IR formed by the light-emitting layer forming portion 93 contains a main compound and a phosphorescent compound (also referred to as a phosphorescent compound). The main compound is a compound contained in the light-emitting layer. The phosphorescent compound is a compound from which the luminescence of the triplet state is observed, and phosphorescence is emitted at room temperature.

In the present embodiment, as the droplet applying device 140, for example, a droplet applying device 140Re that forms a red light emitting layer, a droplet applying device 140Gr that forms a green light emitting layer, and a droplet applying device 140B1 that forms a blue light emitting layer are used to form insulation. The layer droplet applying device 140I and the droplet applying device 140IT forming the pixel electrode ITO and the like.

As the droplet applying device 140, an inkjet method, a dispenser method, or the like can be employed similarly to the above-described droplet applying device 120. When a hole transporting layer, an electron transporting layer, or the like is provided as a constituent element of the organic EL element 50, a device for forming such a layer (for example, a droplet applying device or the like) is separately provided.

The droplet applying device 140Re applies the R solution to the pixel electrode P. The droplet applying device 140Re adjusts the discharge amount of the R solution so that the film thickness after drying becomes 100 nm. As the R solution, for example, a solution in which a main material of polyvinylcarbazole (PVK) plus a red doping material is dissolved in 1,2-dichloroethane can be used.

The droplet applying device 140Gr applies a G solution to the pixel electrode P. As the G solution, for example, a solution in which a main material PVK plus a green doping material is dissolved in 1,2-dichloroethane can be used.

The droplet applying device 140B1 applies the B solution to the pixel electrode P. As the B solution, for example, a solution in which a main material PVK plus a blue dopant is dissolved in 1,2-dichloroethane can be used.

The droplet applying device 140I applies an electrically insulating ink to a portion of the gate bus bar GBL or the source bus bar SBL. As the electrically insulating ink, for example, an ink of a polyimide resin or a polyurethane resin can be used.

The droplet applying device 140IT is coated with an ITO (Indium Tin Oxide) ink on the red, green, and blue light-emitting layers. As the ITO ink, a compound or the like in which tin oxide (SnO ₂ ) is added to indium oxide (In ₂ O ₃ ) can be used. Further, a material which is amorphous such as IDIXO (In ₂ O ₃ -ZnO) and which can produce a transparent conductive film can also be used. The transparent conductive film preferably has a transmittance of 90% or more.

The heat treatment apparatus BK is disposed on the +X side of each droplet application device 140 (on the downstream side in the substrate transfer direction). The heat treatment apparatus BK can emit, for example, hot air or far infrared rays to the sheet substrate FB in the same manner as the heat treatment apparatus BK used in the electrode forming unit 92. The heat treatment apparatus BK uses the radiant heat of these, and the droplets applied to the sheet substrate FB are dried or baked (baked) to be hardened.

The alignment portion 107 has a plurality of alignment cameras CA (CA1 to CA8) disposed in the X direction. The alignment camera CA can take CCD or CMOS photography under visible light illumination, and process the photographic image to detect the position of the alignment mark AM, or can also irradiate the laser light to the alignment mark AM even if it receives the scattered light. The position of the alignment mark AM can be detected.

The alignment camera CA1 is disposed on the +X side of the thermal transfer roller 115. The alignment camera CA1 detects the position of the alignment mark AM formed by the thermal transfer roller 115 on the sheet substrate FB. The alignment cameras CA2 to CA8 are disposed on the +X side of the heat treatment device BK, respectively. The alignment cameras CA2 to CA8 detect the position of the alignment mark AM of the sheet substrate FB passing through the heat treatment device BK.

The sheet substrate FB may be expanded and contracted in the X-axis direction and the Y-axis direction by the heat transfer roller 115 and the heat treatment device BK. The positional shift of the sheet substrate FB due to thermal deformation or the like can be detected by arranging the alignment camera CA on the +X side of the thermal transfer roller 115 or the +X side of the heat treatment device BK which is heat-treated as described above.

The detection results of the alignment cameras CA1 to CA8 are transmitted to the control unit 104. The control unit 104 performs, for example, adjustment of the application position and time of the ink of the droplet applying device 120 or the droplet applying device 140, and the supply speed of the sheet substrate FB from the substrate supply unit 101, based on the detection results of the alignment cameras CA1 to CA8. The adjustment of the conveyance speed of the drum RR, the adjustment of the movement of the drum RR in the Y direction, and the adjustment of the cutting position or time of the cutting device 130 are performed.

(substrate 匣)

In the present embodiment, the substrate 1 is used as the substrate supply unit 101 and the substrate collection unit 103. In the following description, for convenience of explanation, an XYZ orthogonal coordinate system common to FIG. 2 is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. The following XYZ orthogonal coordinate system will be described as an example in which the substrate stack 1 is used as the substrate supply unit 101 in a state where the substrate supply unit 101 is connected to the substrate processing unit 102.

Fig. 5 is a perspective view showing the configuration of the substrate 匣1. Further, Fig. 6 is a view showing a configuration of a cross section taken along line A-A' of Fig. 5. As shown in FIGS. 5 and 6, the substrate 1 has a crucible body 2, a seat portion 3, and a closing portion 4.

The body 2 is a portion that houses the sheet substrate FB. The crucible body 2 has a housing portion 20, a conveying portion (transporting mechanism) 21, a substrate guiding portion 22, a second substrate conveying portion 36, and a second substrate guiding portion 37. Further, the seat portion 3 is provided on the cymbal body 2. Further, for example, the crucible body 2 is made of aluminum or Duralumin.

The accommodating portion 20 is a portion that houses the sheet substrate FB. The accommodating portion 20 is formed in a cylindrical shape so as to be able to be housed in a roll-shaped sheet substrate FB, and is partially protruded toward the +X side (projecting portion 23). In the present embodiment, it is arranged in a state extending in the Y direction in the drawing. The accommodating portion 20 has a lid portion 25 and a substrate driving mechanism 24 .

The lid portion 25 is provided at the +Y side end portion or the -Y side end portion of the accommodating portion 20. The lid portion 25 is provided to be detachable from the accommodating portion 20. By detaching the lid portion 25 from the accommodating portion 20, the inside of the accommodating portion 20 can be directly processed. The switch mechanism of the lid portion 25 may be configured such that the lid portion 25 and the accommodating portion 20 are provided with threads that engage with each other, and the lid portion 25 and the accommodating portion 20 may be connected by a hinge mechanism. The lid portion 25 has a window portion 28 and a display portion 29.

The window portion 28 is formed of, for example, a material that is transparent to visible light, such as glass or plastic. The inside of the accommodating portion 20 can be observed through the window portion 28. The display unit 29 is a portion that displays information such as the state of the sheet substrate FB. For example, the length of the sheet substrate FB accommodated in the accommodating portion 20 or the remaining length of the sheet substrate FB is displayed on the display unit 29.

The substrate drive mechanism 24 is a part that performs an operation of winding up the sheet substrate FB and an operation of feeding out the sheet substrate FB. The substrate driving mechanism 24 is provided inside the housing portion 20. The substrate drive mechanism 24 has a drum portion (shaft portion) 26 and a guide portion 27. As shown in FIG. 6, the roller unit 26 has a rotating shaft member 26a, an enlarged diameter portion 26b, and a rear portion 26c.

The rotating shaft member 26a is a cylindrical member formed of a metal having a high rigidity such as aluminum. The rotating shaft member 26a is rotatably supported by, for example, the opening 25a provided in the center of the lid portion 25 and the bearing member 25b. In this case, the central axis of the rotating shaft member 26a is parallel to, for example, the Y direction, and the rotating shaft member 26a is rotated in the θY direction.

The rotating shaft member 26a is connected to a rotation driving mechanism (not shown). The rotary shaft member 26a is rotated about the central axis by the drive control of the rotary drive mechanism. As shown in FIG. 6, the rotation drive mechanism can rotate the rotation shaft member 26a in any of the +θY direction and the -θY direction, for example.

The enlarged diameter portion 26b is formed on the surface of the rotating shaft member 26a with a uniform thickness. The enlarged diameter portion 26b is formed to rotate integrally with the rotating shaft member 26a. The succeeding portion 26c is formed in a uniform thickness on the surface of the enlarged diameter portion 26b in a cross-sectional view. The succeeding portion 26c is formed using a material having a degree of adhesion to the sheet substrate FB.

The guide portion 27 has a rotation member (first guide member) 27a and a distal end member (first guide member) 27b. For example, one end of the turning member 27a is attached to the accommodating portion 20 through the shaft portion 27c, and is rotatable about the θY direction around the shaft portion 27c. The turning member 27a is connected to a rotation driving mechanism (not shown).

The front end member 27b is connected to the other end of the rotary member 27a in a cross-sectional view. For example, the front end member 27b is formed to have a curved surface that is arcuate in cross section. The sheet substrate FB is guided to the drum portion 26 through the +Z side curved surface which is formed in the arc shape of the end member 27b. The front end member 27b is integrally rotated with the rotation member 27a. For example, when the rotary member 27a is rotated in a direction away from the roller portion 26 (outside the radial direction of the roller portion 26), it is abutted along the inner circumference of the housing portion 20. Therefore, the contact between the front end member 27b and the sheet substrate FB taken up by the roller portion 26 can be avoided.

The seat portion 3 is connected to a portion of the substrate processing portion 102. The seat portion 3 is provided, for example, at the +X side end portion of the protruding portion 23 provided in the housing portion 20. The seat portion 3 has an insertion portion 3a for connection to the substrate processing portion 102. When the substrate cassette 1 is used as the substrate supply unit 101, the seat portion 3 is connected to the supply side connection portion 102A of the substrate processing unit 102. When the substrate cassette 1 is used as the substrate collection portion 103, the seat portion 3 is connected to the collection-side connection portion 102B of the substrate processing portion 102. The seat portion 3 is connected to be detachably attached to any of the substrate supply unit 101 and the substrate collection unit 103 that are connected to the substrate processing unit 102.

The seat portion 3 is provided with an opening portion 34 and a second opening portion 35. The opening portion 34 is provided in the opening portion on the +Z side, and is a portion where the sheet substrate FB enters and exits with the crucible body 2. The substrate body 2 houses the sheet substrate FB that passes through the opening portion 34. The sheet substrate FB accommodated in the crucible body 2 is sent out to the outside of the crucible body 2 through the opening portion 34.

The second opening portion 35 is provided in the opening portion on the -Z side, and is a portion in which the strip-shaped second substrate SB which is different from the sheet substrate FB is moved in and out from the crucible body 2 . The second substrate SB is, for example, a protective substrate that protects the element forming surface of the sheet substrate FB. As the protective substrate, for example, a liner or the like can be used. The second opening portion 35 is disposed, for example, at an interval from the opening portion 34. The second opening portion 35 is formed, for example, in the same size and shape as the opening portion 34. Further, as the second substrate SB of the present embodiment, a conductive material such as a stainless steel thin plate (for example, a thickness of 0.1 mm or less) may be used. In this case, when the second substrate SB is housed in the crucible body 2 together with the sheet substrate FB, if the second substrate SB is electrically connected to the crucible body 2, the charging of the sheet substrate FB can be prevented.

The conveyance unit 21, the substrate guide unit 22, the second substrate conveyance unit 36, and the second substrate guide unit 37 are provided, for example, inside the protrusions 23. Fig. 7 is a cross-sectional view showing an enlarged configuration of the periphery of the protruding portion 23 in Fig. 6. In FIG. 7, in order to make it easy to discriminate the illustration, a part of the structure is omitted and displayed.

The substrate guiding portion 22 is provided between the opening portion 34 and the conveying portion 21 . The substrate guiding portion 22 is a portion that guides the sheet substrate FB between the opening portion 34 and the conveying portion 21. The substrate guiding portion 22 has substrate guiding members 22a and 22b. The substrate guiding members 22a and 22b are disposed to face each other in the Z-direction gap 21c, and the opposing surfaces are substantially parallel to the XY plane. The gap 22c is connected to the opening 34, and the sheet substrate FB moves in the opening 34 and the gap 22c.

The second substrate guiding portion 37 is a portion that guides the second substrate SB between the seat portion 3 and the conveying portion 21 . The second substrate guiding portion 37 has second substrate guiding members 37a, 37b, and 37c. The second substrate guiding members 37a and 37b are disposed to face each other in the Z-direction gap 37d, and the opposing surfaces are substantially parallel to the XY plane. The second substrate guiding member 37c is obliquely arranged to guide the second substrate SB toward the +Z side. Specifically, the end portion on the -X side of the second substrate guide member 37c is disposed to be inclined toward the +Z side with respect to the +X side end portion.

The second substrate transport unit 36 transports the second substrate SB between the seat portion 3 and the transport unit 21 . The second substrate conveying portion 36 is disposed between the second substrate guiding members 37a and 37b and the second substrate guiding member 37c. The second substrate transfer unit 36 has a drive roller 36a and a driven roller 36b. The driving roller 36a is provided to be rotatable in, for example, the θY direction, and is connected to a rotation driving mechanism (not shown). The driven roller 36b is disposed to be spaced apart from the driving roller 36a so as to sandwich the second substrate SB between the driven roller 36a and the driving roller 36a.

The conveyance unit 21 conveys the sheet substrate FB and the second substrate SB between the seat portion 3 and the accommodating portion 20 . The conveyance unit 21 has a tension roller (tension mechanism) 21a and a measurement drum (measurement unit) 21b. The tension roller 21a is a roller that applies tension to the sheet substrate FB and the second substrate SB between the roller unit 26. The tension roller 21a is provided to be rotatable in the θY direction. For example, a rotation drive mechanism (not shown) is connected to the tension roller 21a. Further, the tension roller 21a and the measuring roller 21b may be provided to be movable in the Z direction of Fig. 7, respectively.

The measuring drum 21b is a drum having a smaller diameter than the tension roller 21a. The measurement drum 21b is disposed so as to be able to sandwich the sheet substrate FB and the second substrate SB between the tension roller 21a and the tension roller 21a. It is also possible to adjust the size of the gap between the measuring drum 21b and the tension roller 21a so as to sandwich only the sheet substrate FB or sandwich the sheet substrate FB and the second substrate SB. The measurement drum 21b is a driven roller that rotates in accordance with the rotation of the tension roller 21a.

By rotating the tension roller 21a while the sheet substrate FB is being sandwiched between the tension roller 21a and the measurement roller 21b, the sheet substrate FB can be wound onto the sheet substrate FB while applying tension to the sheet substrate FB. Take the direction and the direction of delivery.

The conveyance unit 21 has a detection unit 21c that detects, for example, the rotation speed or the rotation angle of the measurement drum 21b. As the detecting unit 21c, for example, an encoder or the like can be used. By the detecting unit 21c, for example, the transport distance of the sheet substrate FB passing through the measuring drum 21b can be measured.

The UI unit 2 is provided with an information processing unit IC (see FIG. 5). The information processing unit IC is composed of, for example, an IC chip, and is buried in, for example, the body 2 . The information processing unit IC is provided with a storage unit MR that stores processing information of the substrate processing apparatus 100 and the substrate 1 or a communication unit CR that transmits and receives processing information to and from the control unit 104, for example.

For example, information such as the tact time and yield of the substrate processing apparatus 100, the conveyance speed of the substrate 1 , the winding speed of the roller unit 26, the feed speed, and the like, information about the sheet substrate FB, and the like are exemplified. . The "takt time" refers to a processing area per unit (for example, a disposable processing area such as the above-described droplet applying device 120 or the droplet applying device 140, or a screen area of one panel of the organic EL element 50, and a panel full area). Processing time. The "yield" means the amount of the sheet substrate FB that can be processed per unit time (for example, the length, the number of panels, the number of the substrates 匣1, and the like).

For example, when the sheet substrate FB is inserted through the opening portion 34 and the second substrate SB is inserted through the second opening portion 35, the sheet substrate FB and the second substrate SB are guided by the substrate guiding portion 22 and the substrate guiding portion 37, respectively. The lead is merged at the junction 39. The sheet substrate FB and the second substrate SB which are merged at the junction portion 39 are conveyed by the conveying portion 21 in a state of being merged. At this time, the conveyance unit 21 presses the sheet substrate FB and the second substrate SB to be in close contact with each other. Therefore, the conveying unit 21 also serves as a pressing mechanism that presses the second substrate SB toward the sheet substrate FB.

Referring to FIGS. 5 and 6, the closing portion 4 is provided on the +X side end portion of the protruding portion 23. The blocking portion 4 closes the portion of the opening portion 34 and the second opening portion 35 in accordance with the connection state between the seat portion 3 and the substrate processing portion 102. The closing portion 4 has a cover member 41 and a switching mechanism 42.

8 and FIG. 9 are views showing a configuration in which the +X side end portion of the protruding portion 23 is enlarged, and a configuration of the closing portion 4 is shown.

As shown in FIGS. 8 and 9, the cover member 41 is formed to cover the size of the end surface 3b of the seat portion 3. The cover member 41 is attached to the seat portion 3 through the fixing member 43 and the shaft portion 44.

The fixing member 43 is abutted and fixed to the +X side end portion of the protruding portion 23. The shaft portion 44 is supported to be rotatable to the fixing member 43. The cover member 41 is integrally provided with the shaft portion 44. Therefore, the cover member 41 can be rotated about the shaft portion 44. The lid member 41 is in a closed state in a state in which the end surface 3b of the seat portion 3 is covered as shown in Fig. 8, and the state in which the end surface 3b of the seat portion 3 is not covered as shown in Fig. 9 is in an open state. The lid member 41 is an opening portion 34 and a second opening portion 35 that are openable and closable on the end surface 3b by being rotated about the shaft portion 44.

The switching mechanism 42 switches the opening and closing portion of the cover member 41. The switching mechanism 42 has a belt member 45, an elastic member 46, and a moving member 47.

The belt member 45 is formed using a material having flexibility. The belt member 45 has one end fixed to the cover member 41 and the other end fixed to the moving member 47. The elastic member 46 connects the cover member 41 and the protruding portion 23 in such a manner as to bring the cover member 41 and the protruding portion 23 closer together by an elastic force. Therefore, when no external force is applied, the cover member 41 is in a closed state due to the elastic force of the elastic member 46.

The moving member 47 is disposed, for example, on the -Z side of the fixing member 43. The moving member 47 has a head portion 47a and a belt fixing portion 47b.

On the other hand, a groove portion 48 is formed on the -Z side of the fixing member 43. The groove portion 48 is formed along, for example, the X direction. A groove portion 23a is formed on the -Z side of the protruding portion 23 from the abutting portion with the fixing member 43 in the -X direction. A groove portion 23b is formed along the groove portion 23a at the bottom of the groove portion 23a. The groove portion 23b is formed on an extension line of the groove portion 48 and is connected to the groove portion 48.

The belt fixing portion 47b is inserted into the groove portion 48 of the fixing member 43. Therefore, the moving member 47 can be moved in the direction (X direction) along the groove portion 48 in a state where the belt fixing portion 47b is inserted into the groove portion 48. The +X end portion of the groove portion 48 is formed to abut against the belt fixing portion 47b when the lid member 41 is in the closed state.

The groove portion 23a is formed such that the dimension in the Y direction is substantially equal to the dimension of the head portion 47a in the Y direction, and the head portion 47a can enter the groove portion 23a from the side of the fixing member 43. A groove portion 23b is formed along the groove portion 23a at the bottom of the groove portion 23a. The groove portion 23b is formed on an extension line of the groove portion 48 and is connected to the groove portion 48. The end portion on the -X side of the groove portion 23a is formed such that the lid member 41 abuts against the head portion 47a when, for example, the state of being opened by 90 degrees with respect to the closed state.

By moving the moving member 47 in the -X direction with respect to the fixing member 43, by, for example, an external force or the like, the belt fixing portion 47b is moved in the -X direction, and the belt member 45 is pulled toward the -X side. The cover member 41 connected to the belt member 45 is pulled by the belt member 45 as shown in Fig. 9 to be opened. By releasing the external force from the state shown in Fig. 9, the elastic force of the elastic member 46 causes the cover member 41 to be pulled toward the protruding portion 23 side, and the cover member 41 is returned to the closed state as shown in Fig. 8 . When the lid member 41 is brought into a closed state from the open state, the lid member 41 pulls the belt member 45 toward the +X side, and the moving member 47 also returns to the original position.

(Storage operation of the sheet substrate to the substrate)

Next, the housing operation of accommodating the sheet substrate FB in the substrate 1 configured as described above will be described. 10 and 11 are views showing the state of the substrate 匣 1 during the storage operation. In FIGS. 10 and 11, in order to easily discriminate the figure, the outer shape of the substrate 匣1 is shown by a broken line.

As shown in FIG. 10 and FIG. 11, when the substrate FB1 accommodates the sheet substrate FB, for example, the moving member 47 is pulled toward the protruding portion 23 side, and the lid member 41 of the closing portion 4 is opened to hold the substrate 匣1. On the holder HD. In this state, the sheet substrate FB is inserted from the opening portion 34. When the sheet substrate FB is inserted, the tension roller 21a and the rotating shaft member 26a (roller portion 26) are first rotated.

The sheet substrate FB inserted through the opening 34 is guided by the substrate guiding portion 22 to the conveying portion 21. In the transport unit 21, the sheet substrate FB is sandwiched between the tension roller 21a and the measurement drum 21b, and is transported to the accommodating portion 20 side. The detection unit 21c detects the transport length of the sheet substrate FB with the rotation of the measurement drum 21b.

The sheet substrate FB of the transport unit 21 passes through the side of the accommodating portion 20, and is guided while being bent in the -Z direction by its own weight. In the present embodiment, since the guide portion 27 is provided on the -Z side of the sheet substrate FB, the sheet substrate FB is guided to the drum portion 26 along the swivel member 27a and the tip end member 27b of the guide portion 27.

After the front end of the sheet substrate FB reaches the succeeding portion 26c of the drum portion 26, the front end of the sheet substrate FB is followed by the succeeding portion 26c. When the roller portion 26 rotates in this state, the sheet substrate FB is gradually followed by the succeeding portion 26c, and the sheet substrate FB is taken up by the succeeding portion 26c. After the sheet substrate FB is followed by the succeeding portion 26c, the sheet substrate FB is conveyed while the rotation speed of the tension roller 21a and the rotation speed of the rotating shaft member 26a are adjusted, so that the sheet substrate FB is not between the drum portion 26 and the conveying portion 21. Will bend.

After the sheet substrate FB is wound up by the pair of roller portions 26 by, for example, a rotation amount, the guide portion 27 is retracted as shown in FIG. By rotating the drum portion 26 in this state, the sheet substrate FB is gradually taken up by the drum portion 26. Although the thickness of the wound sheet substrate FB is gradually increased, since the guide portion 27 has been retracted, the sheet substrate FB does not come into contact with the guide portion 27.

After the sheet substrate FB having the desired length has been taken up, for example, the portion outside the opening portion 34 of the sheet substrate FB is cut, and the lid member 41 of the closing portion 4 is closed. In this manner, the sheet substrate FB is housed in the substrate 匣1. In the storage operation of the sheet substrate FB, the entire length of the sheet substrate FB accommodated in the substrate 1 may be calculated based on the measurement length of the sheet substrate FB measured by the detecting unit 21c. Further, the display unit 29 can display the calculation result, and the storage unit MR can store or use the communication unit CR to perform communication.

Further, for example, the operator may perform the winding of the sheet substrate FB while observing the inside of the accommodating portion 20 from the window portion 28. In this case, it is possible to perform the winding operation while checking whether or not the sheet substrate FB is wound in a state of being bent and the winding shape (reel shape) of the sheet substrate FB is deformed, and in the case where an abnormality occurs. The winding can be stopped immediately.

(Operation of substrate processing apparatus)

Next, the operation of the substrate processing apparatus 100 configured as described above will be described.

In the present embodiment, the substrate 匣 1 in which the sheet substrate FB is housed is connected as the connection operation of the substrate supply unit 101 to the supply-side connection unit 102A, and the substrate FB of the substrate 匣1 is performed by the substrate supply unit 101. The supply operation, the element forming operation of the substrate processing unit 102, and the removal operation of the substrate 匣1.

First, the connection operation of the substrate 匣1 will be described. Fig. 12 is a view showing the connection operation of the substrate 匣1.

As shown in FIG. 12, in the supply-side connecting portion 102A, the insertion opening is formed in a shape corresponding to the seat portion 3, and the engaging portion 51 that is engaged with the moving member 47 is formed.

In the connecting operation, the substrate 3 is held in the holder (the same configuration as the holder HD shown in FIG. 10, for example), and the seat 3 and the supply-side connecting portion 102A are aligned. After the alignment, the seat portion 3 is moved to the +X side to be inserted into the substrate processing portion 102. At this time, the moving member 47 that is engaged with the engaging portion 51 moves in the -X direction with respect to the seat portion 3. Therefore, when the seat portion 3 is connected to the substrate processing portion 102, the lid member 41 is in an open state.

Next, the supply operation will be described. When the sheet substrate FB is supplied to the substrate processing unit 102, for example, the rotating shaft member 26a (roller portion 26) of the substrate 1 and the tension roller 21a are rotated in the opposite direction to the housing operation, and as shown in FIG. The portion 34 sends out the sheet substrate FB.

Next, the component forming operation will be described. In the element forming operation, as shown in FIG. 2, while the substrate processing unit 101 supplies the sheet substrate FB from the substrate supply unit 101, the substrate processing unit 102 forms the element on the sheet substrate FB. In the substrate processing unit 102, as shown in FIG. 3, the sheet substrate FB is conveyed by the drum RR.

The control unit 104 can perform communication of processing information with, for example, the substrate 1 and control the operation of the substrate processing unit 2 based on the processing information. Specifically, the rotation speed of each of the rollers RR in the substrate processing unit 2 is adjusted in accordance with the supply speed of the sheet substrate FB from the substrate 1 . Moreover, the control unit 104 detects whether or not the drum RR is displaced in the Y-axis direction, and when the shift is made, the drum RR is moved to correct the position. Moreover, the control unit 104 performs the position correction together with the sheet substrate FB.

The sheet substrate FB supplied from the substrate supply unit 101 to the substrate processing unit 102 is first conveyed to the partition wall forming portion 91. In the partition wall forming portion 91, the sheet substrate FB is sandwiched and pressed by the impression cylinder 110 and the thermal transfer roller 115, and the partition wall BA and the alignment mark AM are formed by thermal transfer on the sheet substrate FB.

FIG. 14 is a view showing a state in which the partition wall BA and the alignment mark AM are formed on the sheet substrate FB. Fig. 15 is a view showing a part of Fig. 14 enlarged. Fig. 16 is a view showing the configuration of the cross section taken along the line D-D of Fig. 15. 14 and 15 are views showing a state in which the sheet substrate FB is viewed from the +Z side.

As shown in FIG. 14, the partition wall BA is formed in the element formation region 60 of the center portion of the sheet substrate FB in the Y direction. As shown in FIG. 15, by forming the partition wall BA, the region forming the gate bus line GBL and the gate electrode G (the gate forming region 52) and the source bus line SBL are formed in the element forming region 60. A region of the source electrode S, the drain electrode D, and the anode P (source drain formation region 53). As shown in FIG. 16, the gate forming region 52 is formed in a trapezoidal shape in cross section. Although not shown in the drawings, the source drain formation region 53 has the same shape. The width W (μm) in the partition wall BA is the line width of the gate bus bar GBL. The width W is preferably set to be about twice to four times as large as the droplet diameter d (μm) applied from the droplet applying device 120G.

Further, the cross-sectional shape of the gate forming region 52 and the source drain forming region 53 is preferably V-shaped or U-shaped in cross section, so that the sheet substrate FB is easily pressed after the micro-imprinting mold 111 presses the sheet substrate FB. Stripped. Other shapes may be, for example, a rectangular shape in the cross section.

On the other hand, as shown in FIG. 14, the alignment mark AM is formed in a pair of edge regions 61 at both end portions of the sheet substrate FB in the Y direction. The partition wall BA and the alignment mark AM are formed at the same time due to their mutual positional relationship. As shown in FIG. 15, a predetermined distance PY between the alignment mark AM and the gate formation region 52 is defined in the Y-axis direction, and a predetermined distance between the alignment mark AM and the source drain formation region 53 is defined in the X-axis direction. PX. Therefore, the offset of the sheet substrate FB in the X-axis direction, the shift in the Y-axis direction, and the θ rotation can be detected based on the position of the pair of alignment marks AM.

In FIGS. 14 and 15, the alignment mark AM is provided in a pair of the plurality of rows of partition walls BA in the X-axis direction. However, the alignment mark AM is not limited thereto. For example, the alignment mark AM may be provided for each row of the partition walls BA. Further, as long as there is a space, the alignment mark AM may be provided not only in the edge region 61 of the sheet substrate FB but also in the element formation region 60. Further, in FIGS. 14 and 15, the alignment mark AM has a cross shape, but may be other mark shapes such as a circular mark or a slanted straight line mark.

Next, the sheet substrate FB is transported to the electrode forming portion 92 by the transport roller RR. In the electrode forming portion 92, droplets are applied by the respective droplet applying devices 120 to form electrodes on the sheet substrate FB.

The gate bus line GBL and the gate electrode G are first formed on the sheet substrate FB by the droplet applying device 120G. 17(a) and 17(b) are views showing the state of the sheet substrate FB which is subjected to droplet application by the droplet applying device 120G.

As shown in Fig. 17 (a), the droplet applying device 120G applies the metallic ink in the order of, for example, 1 to 9 in the gate forming region 52 of the sheet substrate FB on which the partition wall BA is formed. This order is, for example, in the order in which the metallic inks are applied in a straight line to each other. Fig. 17 (b) is a view showing, for example, a state in which a drop of the metallic ink is applied. As shown in Fig. 17 (b), since the partition wall BA is provided, the metallic ink applied to the gate forming region 52 is not diffused and held. In this way, the metal ink is entirely coated on the gate forming region 52.

After the metal ink is applied to the gate forming region 52, the sheet substrate FB is conveyed so that the portion coated with the metallic ink is located on the -Z side of the heat treatment device BK. The heat treatment apparatus BK heat-treats the metal ink applied on the sheet substrate FB to dry the metal ink. Fig. 18 (a) is a view showing a state in which the gate forming region 52 is dried after the metallic ink is dried. As shown in Fig. 18 (a), the conductive volume layer contained in the metallic ink is formed into a film shape by drying the metallic ink. The film-shaped conductor is formed on the entire gate forming region 52, and as shown in FIG. 18(b), the gate bus line GBL and the gate electrode G are formed on the sheet substrate FB.

Next, the sheet substrate FB is conveyed to the -Z side of the droplet applying device 120I. The electrically insulating ink is applied to the sheet substrate FB by the droplet applying device 120I. In the droplet applying device 120I, for example, as shown in FIG. 19, electrically insulating ink is applied onto the gate bus bar line GBL passing through the source drain forming region 53 and the gate electrode G.

After the application of the electrically insulating ink, the sheet substrate FB is conveyed to the -Z side of the heat treatment apparatus BK, and the electrically insulating ink is heat-treated by the heat treatment apparatus BK. The gate insulating layer I is formed by drying the electrically insulating ink by this heat treatment. In FIG. 19, although the gate insulating layer I is formed in a circular shape so as to straddle the partition wall BA, it is not particularly required to be formed across the partition wall BA.

After the gate insulating layer I is formed, the sheet substrate FB is transferred to the -Z side of the droplet applying device 120SD. In the droplet applying device 120SD, the metallic ink is applied to the source drain formation region 53 of the sheet substrate FB. For the portion of the source drain formation region 53 that straddles the gate insulating layer I, the metallic ink is ejected in the order of, for example, 1 to 9 shown in FIG.

After the discharge of the metallic ink, the sheet substrate FB is conveyed to the -Z side of the heat treatment apparatus BK, and the metal ink is dried. After the drying treatment, the conductive volume layer contained in the metallic ink is in the form of a film, and the source bus bar SBL, the source electrode S, the drain electrode D, and the anode P are formed. However, at this stage, the state in which the source electrode S and the drain electrode D are connected is obtained.

Next, the sheet substrate FB is conveyed to the -Z side of the cutting device 130. The sheet substrate FB is cut between the source electrode S and the drain electrode D at the cutting device 130. Fig. 21 is a view showing a state in which the cutting device 130 cuts off the interval between the source electrode S and the drain electrode D. The cutting device 130 performs cutting while adjusting the irradiation position of the laser light LL to the sheet substrate FB using the current mirror 131.

After the source electrode S and the drain electrode D are cut, the sheet substrate FB is transported to the -Z side of the droplet applying device OS. In the droplet applying device OS, an organic semiconductor layer OS is formed on the sheet substrate FB. The organic semiconductor ink is discharged so as to straddle the source electrode S and the drain electrode D in the region of the sheet substrate FB which is superposed on the gate electrode G.

After the discharge of the organic semiconductor ink, the sheet substrate FB is transferred to the -Z side of the heat treatment apparatus BK, and the organic semiconductor ink is dried. After the drying treatment, the semiconductor laminate contained in the organic semiconductor ink is in the form of a film, and the organic semiconductor layer OS is formed as shown in FIG. By the above steps, the field effect transistor and the connection wiring are formed on the sheet substrate FB.

Next, the sheet substrate FB is transported to the light-emitting layer forming portion 93 by the transport roller RR. In the light-emitting layer forming portion 93, red, green, and blue light-emitting layers IR are formed by the droplet applying device 140Re, the droplet applying device 140Gr, the droplet applying device 140B1, and the heat treatment device BK, respectively. Since the partition wall BA is formed on the sheet substrate FB, even if the red, green, and blue light-emitting layers IR are not heat-treated by the heat treatment device BK, the coating is continued, and the solution is not moved to the adjacent pixel region. Overflow produces a color mixture.

After the formation of the light-emitting layer IR, the sheet substrate FB forms the insulating layer I through the droplet applying device 140I and the heat treatment device BK, and forms the transparent electrode IT through the droplet applying device 140IT and the heat treatment device BK. Through the above steps, the organic EL element 50 shown in Fig. 1 is formed on the sheet substrate FB.

In the element forming operation, in order to prevent the sheet substrate FB from being displaced in the X direction, the Y direction, and the θZ direction while the organic EL element 50 is being formed while the sheet substrate FB is being conveyed as described above, the alignment operation is performed. Hereinafter, the alignment operation will be described with reference to FIG.

In the alignment operation, the plurality of alignment cameras CA (CA1 to CA8) provided in the respective portions appropriately detect the alignment mark AM formed on the sheet substrate FB, and send the detection result to the control unit 104. The control unit 104 performs an alignment operation based on the detection result sent.

For example, the control unit 104 detects the feed speed of the sheet substrate FB based on the photographing interval of the alignment mark AM detected by the alignment cameras CA (CA1 to CA8), and determines whether or not the drum RR is rotated at, for example, a predetermined speed. When it is determined that the drum RR is not rotating at a predetermined speed, the control unit 104 issues a command application feedback that adjusts the rotation speed of the drum RR.

Further, for example, the control unit 104 detects whether or not the position of the alignment mark AM in the Y-axis direction is shifted based on the photographing result of the alignment mark AM, and detects the presence or absence of the positional shift of the sheet substrate FB in the Y-axis direction. When the positional shift is detected, the control unit 104 detects the extent to which the positional shift continues in the state in which the sheet substrate FB is conveyed.

If the time of the positional shift is short, that is, by switching the nozzles 122 for applying the liquid droplets in the plurality of nozzles 122 of the droplet applying device 120. When the shift in the Y-axis direction of the sheet substrate FB continues for a long time, the position correction of the sheet substrate FB in the Y-axis direction is performed by the movement of the drum RR.

Further, for example, the control unit 104 detects whether or not the sheet substrate FB is shifted in the θZ direction based on the position of the alignment mark AM detected by the alignment camera CA in the X-axis and Y-axis directions. When the positional shift is detected, the control unit 104 detects the extent to which the positional shift continues in the state in which the sheet substrate FB is conveyed, similarly to the detection of the positional shift in the Y-axis direction.

If the time of the positional shift is short, that is, by switching the nozzles 122 for applying the liquid droplets in the plurality of nozzles 122 of the droplet applying device 120. When the offset continues for a long time, the two rollers RR (positioned at the position of the alignment camera CA with the offset detected) are moved in the X direction or the Y direction to perform position correction in the θZ direction of the sheet substrate FB. .

Next, the removal operation will be described. For example, after the organic EL element 50 is formed on the sheet substrate FB and the sheet substrate FB is collected, the substrate 1 used as the substrate supply unit 101 is removed from the substrate processing unit 102.

Fig. 24 is a view showing the removal operation of the substrate 匣1.

In the unloading operation, the seat portion 3 is moved in the -X direction and is removed from the supply side connecting portion 102A. When the seat portion 3 is removed, the engagement state between the engaging member and the moving member 47 is released, and the elastic force of the elastic member 46 causes the lid member 41 to be in a closed state. As described above, the lid member 41 is opened in a state where the seat portion 3 is connected to the substrate processing portion 102, and the lid member 41 is in a closed state in a state where the seat portion 3 and the substrate processing portion 102 are not connected.

As described above, according to the present embodiment, the main body 2 having the opening 34 that carries in and out of the sheet substrate FB and housing the sheet substrate FB passing through the opening 34 is provided in the main body 2 and on the supply side connecting portion 102A. The seat portion 3 that is detachably connected to the recovery-side connecting portion 102B; the blocking portion 4 of the opening portion 34 is closed in accordance with the connection state between the seat portion 3 and the supply-side connecting portion 102A and the collecting-side connecting portion 102B. Intrusion of foreign matter such as dust from the opening portion 34 is prevented. Thereby, it is possible to prevent foreign matter from adhering to the sheet substrate FB.

Further, according to the present embodiment, the substrate 1 can be easily attached to and detached from the object (for example, the substrate processing unit 102).

Fig. 25 is a view showing the configuration of a substrate processing system SYS according to an embodiment. In the following description, the same or equivalent components as those in the above-described embodiments are denoted by the same reference numerals, and their description is omitted or simplified.

As shown in FIG. 25, the substrate processing system SYS includes a substrate manufacturing apparatus (first processing apparatus) 201, a substrate processing apparatus (second processing apparatus) 202, and a relay apparatus (substrate relay apparatus) 203. The substrate manufacturing apparatus 201 and the substrate processing apparatus 202 are provided, for example, on different production lines, at different locations, in different workshops, and the like.

The substrate manufacturing apparatus 201 is a device that manufactures, for example, the flexible sheet substrate FB described in the above embodiment as the first processing. The substrate manufacturing apparatus 201 includes a substrate manufacturing unit 211 and a control unit 212. The sheet substrate FB is manufactured by the substrate manufacturing unit 211 by the control unit 212.

The substrate processing apparatus 202 is formed by forming the organic EL element 50 shown in FIG. 3 or the like as the second processing on the sheet substrate FB. The substrate processing apparatus 202 includes a substrate processing unit 222, a substrate collection unit 223, and a control unit 224. The substrate processing unit 222, the substrate collection unit 223, and the control unit 224 have the same configuration as the substrate processing unit 102, the substrate collection unit 103, and the control unit 104 shown in FIG.

The relay device 203 is formed to be detachably connected to both the substrate manufacturing apparatus 201 and the substrate processing apparatus 202. Specifically, the relay device 203 is connected to the connection portion 211A of the substrate manufacturing unit 211 provided in the substrate manufacturing apparatus 201 and the connection portion 222A of the substrate processing unit 222 provided in the substrate processing apparatus 202 through the seat portion 3. The configuration of the connecting portion 211A and the connecting portion 222A is the same as that of the supply-side connecting portion 102A shown in FIG. 2 and the like.

The relay device 203 is a device that collects the sheet substrate FB manufactured by the substrate manufacturing apparatus 201 and supplies it to the substrate processing apparatus 202. As the relay device 203, for example, the substrate 1 shown in Fig. 2 or the like is used. The detailed configuration of the relay device 203 will be omitted.

In the substrate processing system SYS configured as described above, the relay device 203 is first connected to the connection portion 211A of the substrate manufacturing apparatus 201. After the relay device 203 is connected to the connection portion 211A, the substrate substrate FB is supplied from the substrate manufacturing unit 211 to the relay device 203. The relay device 203 winds up and collects the sheet substrate FB in the same manner as the operations shown in FIGS. 10 and 11 and the like.

In this case, information such as the tact time and the yield of the substrate manufacturing apparatus 201, the conveyance speed of the relay device 203, and the roller unit 26 are transmitted from the control unit 212 to the information processing unit IC (see FIG. 5) of the relay device 203. Information such as the information on the sheet substrate FB, such as the information on the sheet substrate FB, such as the information on the sheet substrate FB, such as the information on the sheet substrate FB, and the like, the process information such as the full-process or the processed process, and the remaining length or the total length of the sheet substrate FB.

The processing information transmitted to the information processing unit IC is received by the communication unit CR of the information processing unit IC, and stored in the storage unit MR or displayed on the display unit 29. Further, the information processing unit IC also transmits information on the length of the sheet substrate FB on the side of the detection unit 21c of the relay device 203.

Next, the relay device 203 of the recovered sheet substrate FB is transported to the substrate processing apparatus 202 by a transport system TR such as a truck. After the relay device 203 is transported to the substrate processing device 202, the relay device 203 is connected to the connection portion 222A of the substrate processing device 202 in the flow shown in FIGS. 12 and 13 and the like, and the sheet substrate FB is supplied from the relay device 203. The organic EL element 50 is formed on the sheet substrate FB on the substrate processing unit 222.

At this time, for example, the control unit 224 communicates with the information processing unit IC of the relay device 203, and receives the processing information stored in the information processing unit IC. The control unit 224 adjusts the transport speed of the sheet substrate FB, the heating time of the heat transfer roller 115 and the heat treatment device BK, or the heating temperature, etc., based on the received processing information, to form the organic EL element 50 while operating in association with the received processing information. Each step is performed. The sheet substrate FB on which the organic EL element 50 is formed is cut into, for example, a panel shape, and is collected by the substrate collecting portion 223.

As described above, in the present embodiment, the substrate manufacturing apparatus 201 that performs the process of manufacturing the flexible sheet substrate FB is used as the first processing, and the organic sheet is formed on the sheet substrate FB after the sheet substrate FB is manufactured. The processing of the EL element 50 is performed as the substrate processing apparatus 202 of the second processing, the relay apparatus 203 which collects the sheet substrate FB from the substrate manufacturing apparatus 201, and supplies the collected sheet substrate FB to the substrate processing apparatus 202 as the relay apparatus 203. Since the substrate 匣1 is used, it is possible to prevent dust or the like from adhering to the sheet substrate FB between the substrate manufacturing apparatus 201 and the substrate processing apparatus 202. In addition, since the processing information of the substrate manufacturing apparatus 201 can be supplied to the substrate processing apparatus 202 by using the information processing unit IC provided in the relay device 203, the processing information can be processed by the substrate processing apparatus 202, so that the processing efficiency of the substrate processing apparatus 202 is performed. rise. Further, in the present embodiment, since the substrate 匣1 is used as the relay device 203, the length or the remaining length of the sheet substrate FB can be easily grasped. Further, in the present embodiment, since the substrate 匣1 is used as the relay device 203, the plurality of steps can be easily subdivided into, for example, the first processing or the second processing.

Fig. 26 is a view showing the configuration of a substrate processing system SYS2 of one embodiment. In the following description, the same or equivalent components as those in the above-described embodiments are denoted by the same reference numerals, and their description is omitted or simplified.

As shown in FIG. 26, the substrate processing system SYS2 includes a first substrate processing apparatus (first processing apparatus) 300, second substrate processing apparatuses (second processing apparatuses) 310 and 320, and a relay apparatus (substrate relay apparatus) 303. The first substrate processing apparatus 300 and the second substrate processing apparatuses 310 and 320 are provided, for example, at the same place or in the same factory.

The first substrate processing apparatus 300 is, for example, a device in which the partition wall BA of the organic EL element 50 is formed on the sheet substrate FB. The second substrate processing apparatuses 310 and 320 are, for example, devices for forming an electrode (gate electrode G or the like) of the sheet substrate FB, a light-emitting layer IR of the organic EL element 50, and a transparent electrode ITO. The second substrate processing apparatuses 310 and 320 have the same configuration. In the following description, the second substrate processing apparatus 310 will be described as a representative in the description of the configuration or operation of the second substrate processing apparatuses 310 and 320. However, the second substrate processing apparatus 320 can be similarly described.

The apparatus for forming the organic EL element 50 in the substrate processing system SYS2 is divided into two types of devices of the first substrate processing apparatus 300 and the second substrate processing apparatuses 310 and 320. The relay device 303 is a device that transfers (relays) the sheet substrate FB from the first substrate processing device 300 to the second substrate processing devices 310 and 320. In the present embodiment, as the relay device 303, the substrate 1 having the same configuration as that shown in Fig. 5 or the like is used.

The first substrate processing apparatus 300 includes a substrate supply unit 301, a substrate processing unit 302, a first control unit 304, a second control unit 305, and a protective substrate supply unit 306. The substrate supply unit 301 has the same configuration as the substrate supply unit 101 shown in FIG. 2 . Each of the substrate processing units 302 has the same configuration as the partition wall forming portion 91 of the substrate processing apparatus 100 shown in FIG. 2, and a supply-side connecting portion 302A is provided at a portion to be connected to the substrate supply unit 301. The configuration of the supply-side connecting portion 302A is the same as that of the supply-side connecting portion 102A shown in FIG. The first substrate processing apparatus 300 has the same configuration as the partition wall forming unit 91 of the substrate processing apparatus 101 to the substrate processing unit 102 shown in FIG. 2 and the like.

A recovery side connection portion 302B connected to the seat portion 3 of the relay device 303 is provided at the +X side end portion of the substrate processing portion 302. The collection-side connection portion 302B has the same configuration as the supply-side connection portion 302A. The first control unit 304 receives the processing information stored in the information processing unit IC of the substrate supply unit 301, and controls the operation of the substrate processing unit 302 (for example, the operation of the processing or the process) based on the processing information. The second control unit 305 transmits processing information such as the substrate supply unit 301, the substrate processing unit 302, and the sheet substrate FB to the information processing unit IC of the relay device 303. As the processing information, for example, information similar to the processing information described in the above embodiment can be cited. The first substrate processing apparatus 300 may have a control device (not shown) that integrally controls and manages the configuration of the first control unit 304 and the second control unit 305. The protective substrate supply unit 306 is provided, for example, at the +X side end portion of the substrate processing unit 302.

The second substrate processing apparatus 310 includes a substrate processing unit 311 , a substrate collection unit 312 , a first control unit 314 , and a second control unit 315 . The substrate processing unit 311 has the same configuration as the electrode forming portion 92 and the light-emitting layer forming portion 93 of the substrate processing apparatus 100 shown in FIG. 2 . The substrate processing unit 311 has a supply side connection portion 311A at the -X side end portion and a recovery side connection portion 311B at the +X side end portion. The supply-side connecting portion 311A and the recovery-side connecting portion 311B have the same configuration as the supply-side connecting portion 302A and the collecting-side connecting portion 302B, respectively.

The relay device 303 is detachably connected to the supply side connecting portion 311A. The first control unit 314 receives the processing information stored in the information processing unit IC of the relay device 303, and controls the operation of the substrate processing unit 311 (for example, the operation of the processing or the process) based on the processing information. The second control unit 315 transmits the processing information of the relay device 303, the substrate processing unit 311, and the sheet substrate FB to the information processing unit IC of the substrate collection unit 312. As the processing information, for example, information similar to the processing information described in the above embodiment can be cited.

Then, in the substrate processing system SYS2 configured as described above, the sheet substrate FB is placed in the substrate 匣1, and the substrate 匣1 is connected to the supply side of the substrate processing unit 302 as the substrate supply unit 301 in the first substrate processing apparatus 300. Part 302A. This substrate 匣 1 is used as the substrate supply unit 301. Further, the empty substrate 匣1 is connected to the recovery side connecting portion 302B of the substrate processing unit 302 as a relay device 303.

Next, the substrate supply unit 301 supplies the sheet substrate FB to the substrate processing unit 302, and the substrate processing unit 302 forms the partition wall BA. At this time, the control unit 304 and the control unit 305 communicate with the information processing unit IC of the substrate supply unit 301 and the information processing unit IC of the relay device 303, and receive the processing information stored in the information processing unit IC. The control unit 304 and the control unit 305 form the partition wall BA while adjusting the conveyance speed of the sheet substrate FB, the heating time of the heat transfer roller 115, the heating temperature, and the like in association with the received processing information, based on the received processing information.

The sheet substrate FB on which the partition wall BA is formed is sent from the substrate processing unit 302 to the relay device 303, and is taken up by the relay device 303 and collected in a reel shape. In the relay device 303, the sheet substrate FB is collected such that the protective substrate PB is disposed on the surface of the sheet substrate FB where the partition wall BA is formed.

27 to 29 are views showing how the sheet substrate FB of the substrate collecting unit 103 is recovered. In FIGS. 27 to 29, in order to easily discriminate the map, a state in which a part of the configuration is omitted is displayed.

In the collection operation, as shown in FIG. 27, the protective substrate PB is inserted from the second opening 35 at the same time as the opening 34 of the substrate FB1 is inserted into the substrate FB. As shown in FIGS. 26 and 27, the protective substrate PB is supplied from, for example, the above-described protective substrate supply unit 306.

As shown in FIG. 28, the inserted sheet substrate FB and the protective substrate PB are guided by the substrate guiding portion 22 and the second substrate guiding portion 37, respectively, and merged at the junction portion 39. As shown in FIG. 29, the sheet substrate FB and the protective substrate PB which are merged at the junction portion 39 are conveyed by the transport portion 21 in a state of being merged, and are pressed and held by the tension roller 21a and the measurement drum 21b. The sheet substrate FB and the protective substrate PB are taken up and collected by the drum portion 26 in a state of being adhered.

Then, the relay device 303 that has collected the sheet substrate FB on which the protective substrate PB is sealed is transported to the second substrate processing device 310 by the transport system TR2 such as a stacker. After the transfer, the relay device 303 is connected to the supply-side connection portion 311A of the second substrate processing device 310 in the flow shown in FIG. 12 and FIG. 13 and the empty substrate 匣1 is connected to the recovery side as the substrate collection portion 312. Connection portion 311B. After the empty substrate 匣1 is connected to the recovery-side connection portion 311B, the electrode, the light-emitting layer IR, and the transparent electrode ITO are formed on the substrate FB on the substrate processing unit 311 while the sheet substrate FB is supplied from the relay device 303.

At this time, for example, the control units 314 and 315 communicate with the information processing unit IC of the relay device 303 and the information processing unit IC of the substrate collection unit 312, and receive the processing information stored in each information processing unit IC. The control units 314 and 315 adjust the moving speed of the sheet substrate FB or the heating time or the heating temperature of the heat treatment device BK to form the electrode, the light-emitting layer IR, and the transparent electrode ITO, based on the received processing information.

In addition, when the processing speed of the first substrate processing apparatus 300 and the processing speed of the second substrate processing apparatus 310 are, for example, 2:1, the processing speed of the first substrate processing apparatus 300 is larger than that of the second substrate processing apparatus 310 (takt time). In the case of small), the relay object of the relay device 303 can be increased. In this embodiment. As the relay target of the relay device 303, for example, the second substrate processing device 320 is added. As a result, the sheet substrate FB processed by the first substrate processing apparatus 300 is processed in parallel at the second substrate processing apparatuses 310 and 320, and the line of the processing speed is small (the tact time is large) increases.

When the sheet substrate FB is processed by the processing of the first substrate processing apparatus 300 and the processing by the second substrate processing apparatus 310, when the first substrate processing apparatus 300 and the second substrate processing apparatus 310 are used one by one ( When the processing is continued, the processing speed of the entire substrate processing system SYS2 is the processing speed of the processing device having a small processing speed in the first substrate processing apparatus 300 and the second substrate processing apparatus 310.

With the above-described method, in the second embodiment, the number of lines is increased by using the second substrate processing apparatuses 310 (the second substrate processing apparatuses 310 and 320) having a small processing speed, so that the difference in processing speed can be compensated. The processing speed of the first substrate processing apparatus 300. Thereby, the processing efficiency of the entire substrate processing system SYS2 can be prevented from being lowered.

The organic EL element 50 is formed on the sheet substrate FB by forming the electrode, the light-emitting layer IR, and the transparent electrode ITO by the sheet substrate FB on which the partition wall BA is formed. The sheet substrate FB on which the organic EL element 50 is formed is wound up and collected by, for example, the substrate collecting portion 312 in the same manner as the operation flow shown in FIGS. 27 to 29 .

As described above, in the present embodiment, the first substrate processing apparatus 300 that performs the formation process of the partition wall BA on the sheet substrate FB, and the sheet substrate FB that has been subjected to the partition wall BA formation process are provided with electrodes and light-emitting layers. The formation of the IR and the transparent electrode ITO is performed as the second substrate processing apparatus 310 of the second processing, the sheet substrate FB is recovered from the first substrate processing apparatus 300, and the collected sheet substrate FB is supplied to the second substrate processing apparatus 310. Since the device 303 uses the substrate 1 of the present invention as the relay device 303, it is possible to prevent the substrate substrate FB from being disposed between the first substrate processing device 300 and the second substrate processing device 310 at the same place or in the factory. Foreign matter adheres. Further, since the information processing unit IC provided in the substrate 1 can transmit and receive processing information, and the processing information is processed by the substrate processing units 302 and 311, the overall processing efficiency of the substrate processing system SYS2 increases.

In the other example, the first substrate processing apparatus 300 is a device in which the partition wall BA or the electrode (the gate electrode G or the like) of the organic EL element 50 is formed on the sheet substrate FB. The second substrate processing apparatuses 310 and 320 are, for example, devices in which the light-emitting layer IR of the organic EL element 50 and the transparent electrode ITO are formed on the sheet substrate FB.

In this example, the organic EL element 50 is formed on the sheet substrate FB by forming the light-emitting layer IR and the transparent electrode ITO by the sheet substrate FB on which the partition wall BA and the electrode are formed. The sheet substrate FB on which the organic EL element 50 is formed is wound up and collected by, for example, the substrate collecting portion 312 in the same manner as the operation flow shown in FIGS. 27 to 29 .

Further, the substrate processing system SYS2 may be configured such that the processing speed of the second substrate processing apparatus 310 is higher than the processing speed of the first substrate processing apparatus 300. In the above configuration, for example, the first substrate processing apparatus 300 has the partition wall forming portion 91 and the electrode forming portion 92, and the second substrate processing device 310 has the light emitting layer forming portion 93. In this case, in the same manner as in the present embodiment, for example, the difference in the processing speed can be compensated for by making the number of the first substrate processing apparatuses 300 larger than the number of the second substrate processing apparatuses 310.

For example, Fig. 30(a) shows a configuration in which two first substrate processing apparatuses 300 and one substrate processing system SYS2' provided with one second substrate processing apparatus 310 are provided. Since the number of processing lines of the first substrate processing apparatus 300 having a small processing speed increases, the difference in processing speed is compensated. In this case, for example, the timing of the processing in the two first substrate processing apparatuses 300 is controlled, and the relay apparatus 303 is preferably connected to the second substrate processing apparatus 310 in an interactive manner. Thereby, the waiting time of the second substrate processing apparatus 310 can be reduced as much as possible, and the processing can be performed efficiently.

Further, the substrate processing system SYS2' is, for example, as shown in FIG. 30(b), and the first substrate processing apparatus 300 is further divided into the partition wall forming apparatus 340 and the electrode forming apparatus 350 (substrate processing system SYS2). Further, the partition wall forming device 340 has a configuration corresponding to the partition wall forming portion 91 shown in Fig. 3, and the electrode forming device 350 has a configuration corresponding to the electrode forming portion 92 shown in Fig. 3. The second substrate processing device 310 and The substrate processing system SYS2' also has a light-emitting layer forming portion 93.

In the three kinds of processes of the partition wall forming process, the electrode forming process, and the light-emitting layer forming process, the electrode forming process particularly requires high alignment precision, so the processing speed is the smallest. Therefore, as shown in FIG. 30(b), the number of lines is increased by arranging two electrode forming apparatuses 350 having a small processing speed, and the partition wall forming apparatus 340 and the second substrate processing apparatus 310 (having the light-emitting layer forming portion 93) ) Each configuration can compensate for the difference in processing speed.

In this case, the relay device 303 from the partition wall forming device 340 to the electrode forming device 350 performs the same operation as the relay device 303 of the substrate processing system SYS2 of the above-described embodiment, and proceeds from the electrode forming device 350 to the second substrate processing device. The relay device 303 of 310 performs the same operation as the relay device 303 of the substrate processing system SYS2'. Further, regarding the substrate processing system SYS2", for example, the electrode forming device 350 is formed by dividing the gate forming means for forming the gate electrode G and the source drain forming means for forming the source electrode S and the drain electrode D. In this case, since the source drain forming means has a smaller processing speed than the gate forming means, it is preferable to provide the source drain forming means with a plurality of lines. As described above, by dividing the processing speed by a small device and dividing The increase in the number of lines of the device reduces the cost relative to the increase in the number of lines.

Fig. 31 is a view showing the configuration of a substrate processing system SYS3 of an embodiment. Further, the substrate processing system SYS3 of the present embodiment is different from the configuration of a part of the substrate processing system SYS2 shown in FIG. 26, and other configurations are the same. Hereinafter, the difference from the substrate processing system SYS2 will be mainly described. In the following description, the same components as those of the substrate processing system SYS2 are denoted by the same reference numerals, and their description will be omitted or simplified.

As shown in FIG. 31, the substrate processing system SYS3 includes a first substrate processing apparatus (first processing apparatus) 300, second substrate processing apparatuses (second processing apparatuses) 310 and 320, and a relay apparatus (substrate relay apparatus) 303. The substrate processing system SYS3 of the present embodiment differs from the substrate processing system SYS2 in that the control devices 304 and 305 and the control devices 314 and 315 in which the substrate processing system SYS2 are not provided and the main control device CONT are provided. The other components are the same as the substrate processing system SYS2.

The main control unit CONT controls the first substrate processing based on, for example, the processing information (the tact time, the yield, the transport speed, the take-up speed, the feed speed, and the information on the sheet substrate FB of the substrate processing apparatus) described in the above embodiment. The device 300, the second substrate processing devices 310 and 320, and the relay device 303. For example, based on the transport speed, the take-up speed, and the feed speed of the sheet substrate FB, it can be determined which of the second substrate processing apparatuses 310 and 320 the relay device 303 is to be relayed.

As described above, in the present embodiment, the first substrate processing apparatus 300, the second substrate processing apparatuses 310 and 320, and the relay apparatus 303 are collectively controlled by the main control unit CONT, so that one of the sheet substrates FB can be efficiently connected. deal with.

32 is a schematic view showing a configuration of a manufacturing apparatus 410 for a display element (for example, an organic EL element) having a pixel electrode, a light-emitting layer, and the like, which is manufactured on a flexible substrate, and is another example of the substrate processing unit 102 of FIG. However, the same members or devices as those of the substrate processing unit 102 are given the same reference numerals.

The manufacturing apparatus 410 shown in FIG. 32 is different from the above-described substrate processing unit 102 in that it has two partition wall forming portions 91. In one of the partition wall forming steps, the partition wall BA for wiring of the thin film transistor is formed by the impression cylinder 110, and the alignment mark AM is formed on both sides in the width direction of the sheet substrate FB, that is, in the Y-axis direction. Further, the printing cylinder 440 is used in the other partition wall forming step.

The printing cylinder 440 is formed with a metal reticle to make its surface screen printable. Further, an ultraviolet curable resin is held inside the printing cylinder 440. The ultraviolet curable resin is applied to the sheet substrate FB via the metal mask by the brushing portion 441. Thereby, the partition wall BA of the ultraviolet curable resin is formed. The height of this partition wall BA is 10 μm or less. The partition wall BA of the ultraviolet curable resin formed on the sheet substrate FB is cured by an ultraviolet lamp 444 such as a mercury lamp.

In the case where the display element forms the light-emitting layer, the hole transport layer, and the electron transport layer, the partition wall BA must be raised. The thermal transfer by the impression cylinder 110 is less likely to raise the partition wall BA extruded from the sheet substrate FB. Therefore, a printing cylinder 440 is provided in addition to the impression cylinder 110.

The alignment camera CA6 is disposed on the upstream side of the printing cylinder 440, and the control unit 104 grasps the position of the sheet substrate FB near the printing cylinder 440. Thereafter, the control unit 104 controls the rotation of the printing cylinder 440 to print the ultraviolet curable resin at the position of the thin film transistor formed on the sheet substrate FB.

The ultraviolet curable resin layer refers to a layer containing a resin which is cured by a bridging reaction or the like by ultraviolet irradiation as a main component. As the ultraviolet curable resin, a component containing a monomer having an ethylenically unsaturated double bond is preferably used, and the ultraviolet curable resin layer is formed by curing by irradiation with ultraviolet rays. As the ultraviolet curable resin, an ultraviolet curable urethane acrylate resin, an ultraviolet curable polyester acrylate resin, an ultraviolet curable epoxy acrylate resin, an ultraviolet curable polyol acrylate resin, or the like, Ultraviolet curing epoxy resin is preferred. Among them, an ultraviolet curable acrylate resin is preferred. In addition, it is preferable that the partition wall BA of the light-emitting layer is a black matrix, so that a metal or an oxide such as chromium can be introduced into the ultraviolet curable acrylate resin.

The partition wall BA of the ultraviolet curable resin may be formed to be overlapped on the partition wall BA formed on the sheet substrate FB by the impression cylinder 110, or may be formed in a region where the partition wall BA is not formed by the impression cylinder 110. The subsequent step of forming the light-emitting layer is the same as the step described above using FIG. 3 and the like.

Next, a description will be given of a manufacturing apparatus and a manufacturing method of a liquid crystal display element according to an embodiment. The liquid crystal display element is generally composed of a deflecting filter, a thin film substrate FB having a thin film transistor, a liquid crystal layer, a color filter, and a deflecting filter. Here, it has been described that the sheet substrate FB having the thin film transistor can be fabricated by the substrate processing unit 102 in the upper stage of FIG. 3 or the manufacturing apparatus 410 depicted in the upper stage of FIG.

In the present embodiment, the description of the bonding of the liquid crystal and the color filter CF will be described. It is necessary for the liquid crystal display element to supply liquid crystal, and it is necessary to form a sealing wall of liquid crystal. Therefore, the printing cylinder 440 depicted in the lower stage of Fig. 32 is used in the present embodiment for the sealing wall of the liquid crystal instead of the partition wall BA for the light-emitting layer.

Fig. 33 is a view showing a supply bonding device 420 which performs supply of liquid crystal and bonding of color filters.

The supply bonding device 420 is provided with an upstream side low vacuum chamber 82 and a downstream side low vacuum chamber 83, and a high vacuum chamber 84 is provided between the upstream side low vacuum chamber 82 and the downstream side low vacuum chamber 83. The low vacuum chamber 82, the low vacuum chamber 83, and the high vacuum chamber 84 are evacuated by a rotary pump or a turbo molecular pump 89.

The color filter CF is supplied to the upstream side low vacuum chamber 82, and the sheet substrate FB on which the liquid crystal sealing wall is formed is supplied through the printing cylinder 440 shown in FIG. Further, alignment marks are formed on both sides of the color filter CF in the Y-axis direction.

The sheet substrate FB on which the liquid crystal sealing wall is formed is first coated with a thermosetting adhesive which is applied to the color filter CF from the adhesive distributor 72. Thereafter, the sheet substrate FB is sent to the high vacuum chamber 84 through the upstream side low vacuum chamber 82. The liquid crystal is applied from the liquid crystal distributor 74 in the high vacuum chamber 84. Thereafter, the color filter CF and the sheet substrate FB are followed by the thermal transfer roller 76.

The alignment mark AM of the sheet substrate FB is photographed by the alignment camera CA11, and the alignment mark AM of the color filter CF is photographed by the alignment camera CA12. The results of the shooting by the alignment cameras CA11 and CA12 are sent to the control unit 104 to grasp the shift in the X-axis direction, the shift in the Y-axis direction, and the θ rotation. The thermal transfer roller 76 follows the alignment signal sent from the control unit 104 to change the rotational speed, and then aligns the color filter CF and the sheet substrate FB.

The succeeding liquid crystal display element sheet substrate CFB is sent to the outside through the downstream side low vacuum chamber 83. Further, although the adhesive is a thermosetting adhesive, an ultraviolet curable adhesive may be used. In this case, an ultraviolet lamp or the like is used instead of the thermal transfer roller 76.

Figure 34 is a view for explaining the mechanism for the alignment of the printing drum 440 in the Y-axis direction. A metal mask is formed on the surface of the printing cylinder 440. The alignment of the X-axis direction by the signal from the control unit 104 can adjust the speed of the printing cylinder 440. The alignment of the X-axis direction has the following method.

Fig. 34 (a) shows a printing cylinder 440p in which the center of the drum is expanded or contracted by air pressure or oil pressure control. By supplying air or oil with a signal from the speed & alignment control unit 90, the position of the center portion of the drum and the peripheral portion in the Y-axis direction can be changed.

Fig. 34 (b) shows a printing cylinder 440q in which the entire drum is enlarged or contracted by a thermal deformation control method. By heating or cooling the signal from the speed & alignment control unit 90, the position of the entire Y-axis direction of the drum and the position of the X-axis direction can be changed.

Fig. 34 (c) shows a printing cylinder 440r in which the entire drum is bent by a bending deformation control method. The printing cylinder 440r is preferably formed with a slit in the circumferential direction and can be bent with a small force.

The technical scope of the present invention is not limited to the above-described embodiments, and may be appropriately modified without departing from the spirit and scope of the invention.

In the above-described embodiment, the configuration of the closing portion 4 of the substrate 1 indicates that the lid member 41 covers both the opening portion 34 and the second opening portion 35, but the invention is not limited thereto. For example, the lid member 41A shown in FIG. 33 may open and close the opening portion 34, and the lid member 41B may open and close the second opening portion 35.

When the configuration is used, for example, as shown in FIG. 35, when the control cover member 41A and the cover member 41B are opened and closed so that the seat portion 3 is inserted into the supply-side connecting portion 102A of the substrate processing portion 102, the cover member 41A and the cover member 41B are opened and seated. The driving device in which the lid member 41A and the lid member 41B are closed when there is no connection between the portion 3 and the supply-side connecting portion 102A.

By opening and closing the opening portion 34 and the second opening portion 35 as described above, it is possible to prevent the unused opening portion from being opened. Thereby, it is possible to prevent entry of foreign matter such as dust from the opening.

Further, in the case where a problem occurs in one of the substrate processing apparatus or the substrate processing system described above, the sheet substrate FB may be cut to remove the occurrence position of the problem. Thereby, the decrease in the yield of the sheet substrate FB can be prevented. Further, in the case of the substrate cassette or the substrate processing system according to the present embodiment, when the sheet substrate FB is cut due to a defect or the like, or when the line is stopped due to power failure or the like, since the remaining length of the sheet substrate FB is known, it is immediately available. After the re-action is processed. Therefore, according to the present embodiment, an increase in processing efficiency or an increase in safety can be achieved.

Further, in the above embodiments, the field effect type transistor shown in FIG. 1 is described as an example, but the invention is not limited thereto. 36(a) and 36(b) are cross-sectional views showing a field effect type transistor which is different from the above embodiment. In addition to the field effect type transistor shown in Fig. 1, the bottom gate type is manufactured as, for example, the field effect type transistor shown in Fig. 36 (a). After the gate electrode G, the gate insulating layer I, and the organic semiconductor layer OS are formed on the thin substrate FB, the source electrode S and the drain electrode D are formed.

36(b) is a top gate type field effect type transistor, after the source electrode S and the drain electrode D are formed on the sheet substrate FB, an organic semiconductor layer OS is formed, and a gate insulating layer I is formed thereon. , the gate electrode G.

Regardless of any of the field effect transistors, the substrate processing unit 102 that changes the order of the metal ink or the like can be used.

Further, in the above-described embodiment, the opening portion 34 and the second opening portion 35 are provided on the +X side end portion of the seat portion 3, but the present invention is not limited thereto, and may be provided at a position different from the seat portion 3, for example. . Further, the second opening portion 35 may not be provided.

Further, in the above-described embodiment, the configuration of the substrate driving mechanism 24 is included, and the sheet substrate FB is wound up and stored as the substrate 匣1. However, the present invention is not limited thereto, and may be accommodated by other methods.

Further, in the above-described embodiment, the configuration of the attachment portion 26c is provided on the surface of the roller portion 26 of the substrate drive mechanism 24. However, the configuration is not limited thereto, and any other mechanism may be used as long as the configuration of the sheet substrate FB can be maintained. Further, the rear portion 26c does not have to be provided on the entire surface of the drum portion 26, and may be provided on one of the surfaces of the drum portion 26.

Further, the transport unit 21 or the guide unit 27 disposed inside the accommodating portion 20 is not limited to the one exemplified in the above embodiment, and may be other arrangements.

In the above-described embodiment, the external connection portion, which is the connection target of the substrate 匣1, is described as an example in which only one substrate processing unit is provided. However, the present invention is not limited thereto. For example, the external connection portion has a plurality of external connection portions in the Z direction. No problem. According to this configuration, for example, the substrate 匣1 can be mounted in a state where the Z direction is reversed.

Further, in the above embodiment, the external connection portion may be moved in the Z direction. In this case, for example, when the substrate 匣1 is mounted in a state in which the Z direction is reversed, the external connection portion may be moved in the Z direction.

(other forms of the substrate)

Fig. 37 is a perspective view showing the configuration of a substrate stack 2001 of another embodiment. Fig. 38 is a view showing the configuration of the cross section taken along the line A-A' of Fig. 37. In the following description, the same or equivalent components as those in the above-described embodiments are denoted by the same reference numerals, and their description is omitted or simplified. As shown in FIGS. 37 and 38, the substrate stack 2001 has a crucible body 2 and a seat portion 3.

In the present embodiment, the substrate 匣2001 is used as the substrate supply unit 101 and the substrate collection unit 103. In the following description, for convenience of explanation, an XYZ orthogonal coordinate system common to FIG. 2 is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. The following XYZ orthogonal coordinate system will be described as an example in which the substrate stack 2001 is used as the substrate supply unit 101 in a state where the substrate supply unit 101 is connected to the substrate processing unit 102.

As the sheet substrate FB, for example, a heat resistant resin film, stainless steel or the like can be used. Specifically, a polyethylene resin, a polypropylene resin, a polyester resin, an ethylene-vinyl alcohol copolymer resin, a polyvinyl chloride resin, a cellulose resin, a polyamide resin, a polycarbonate resin, a polystyrene resin, or the like can be used. Materials such as vinyl acetate resin. The dimension of the sheet substrate FB in the Y direction is, for example, about 50 cm to 2 m, and the dimension in the X direction is, for example, 10 m or more. Of course, this size is merely an example and is not limited thereto. For example, the dimension of the sheet substrate FB in the Y direction may be 50 cm or less, or may be 2 m or more. Further, the dimension of the sheet substrate FB in the X direction may be 10 m or less. Further, the flexibility of the present embodiment means that the substrate can be bent without causing shear or breakage even if a predetermined force is applied to the substrate at least to its own weight. The flexibility described above varies depending on the material, size, thickness, temperature, and the like of the substrate.

The substrate drive mechanism 24 is a part that performs an operation of winding up the sheet substrate FB and an operation of feeding out the sheet substrate FB. The substrate driving mechanism 24 is provided inside the housing portion 20. The substrate drive mechanism 24 has a drum portion (shaft portion) 26 and a guide portion 27. As shown in FIG. 38, the roller portion 26 has a rotating shaft member 26a, an enlarged diameter portion 26b, and a rear portion 26c.

The rotating shaft member 26a is connected to a rotation driving mechanism (not shown). The rotary shaft member 26a is rotated about the central axis by the control of the rotary drive mechanism. As shown in FIG. 38, the rotation drive mechanism can rotate the rotation shaft member 26a in any of the +θY direction and the -θY direction, for example.

A gas supply port (switching mechanism) 2004 is provided at the +X side end of the protruding portion 23. The gas supply port 2004 is provided with a supply port 2041 that is connected to an external gas supply source. The gas supply port 2004 is provided, for example, at the center of the Y direction. Although only one of the gas supply ports 2004 is provided in Fig. 37, a plurality of them may be provided.

The UI unit 2 is provided with an information processing unit IC (see FIG. 37). The information processing unit IC is composed of an IC chip or the like and is buried in, for example, the body 2 . The information processing unit IC is provided with a storage unit MR that stores processing information of the substrate processing apparatus 100 and the substrate 匣 2001, or a communication unit CR that transmits and receives processing information to and from the control unit 104, for example.

FIG. 39 and FIG. 40 are views showing a configuration in which the +X side end portion of the protruding portion 23 is enlarged, and shows a flow path mechanism connected to the gas supply port 2004.

As shown in FIGS. 39 and 40, the supply port 2041 of the gas supply port 2004 is connected to the flow path 2042 formed inside the protruding portion 23. The flow path 2042 is divided into a first flow path 2042a and a second flow path 2042b. The substrate guide member 22a has a flow path 2043a formed therein, and the first flow path 2042a is connected to the flow path 2043a via the connection portion 42c. A plurality of gas ejection ports 2044a are formed on the surface on the -Z side of the substrate guiding member 22a, and the flow path 2043a is connected to the gas ejection ports 2044a. As described above, the substrate guiding member 22a is formed in a cushion shape in which gas is ejected from the surface on the -Z side.

On the other hand, as shown in FIGS. 39 and 40, a flow path 2043b is formed inside the substrate guiding member 22b. The second flow path 2042b is connected to the flow path 2043b via the connection portion 42d. A plurality of gas discharge ports 2044b are formed on the +Z side of the substrate guide member 22b, and the flow path 2043b is connected to the gas discharge ports 2044b. As described above, the substrate guiding member 22b is formed in a cushion shape in which gas is ejected from the surface on the +Z side.

One end of the sealing member 2047 is connected to the surface on the -Z side of the substrate guiding member 22b. The other end portion of the sealing member 2047 is connected to, for example, the surface on the -Z side of the seat portion 3. The sealing member 2047 is in a sealed state between the substrate guiding member 22b and the opening portion 34. The surface on the -Z side of the substrate guide member 22b is pressed by the pressing mechanism 2045. The end portion of the pressing mechanism 2045 on the -Z side is fixed to, for example, a support portion 2046 supported on the inner surface of the protruding portion 23.

As shown in FIG. 39, in a state where the gas supply source is not connected to the supply port 2041 of the gas supply port 2004, no gas flows through the channel mechanism, and the gas is not ejected from the substrate guide member 22a and the substrate guide member 22b. Therefore, the substrate guiding member 22b is pressed by the pressing mechanism 2045 toward the +Z side, and the sheet substrate FB is sandwiched between the substrate guiding member 22a and the substrate guiding member 22a.

On the other hand, as shown in FIG. 40, for example, the external gas supply unit GS is inserted into the supply port 2041 to supply the gas, and the gas passage passage 2042, the first flow path 2042a, and the connection portion are provided on the substrate guide member 22a side. 42c and the flow path 2043a are ejected from the gas ejection port 2044a in the -Z direction. Further, the gas is ejected from the flow path 2042 through the second flow path 2042b, the connection portion 42d, and the flow path 2043b from the gas discharge port 2044b in the +Z direction on the substrate guide member 22b side.

A gas layer (air bearing) is formed between the sheet substrate FB and the gas ejection port 2044a and between the sheet substrate FB and the gas ejection port 2044b by ejecting gas from both sides of the sheet substrate FB. A gas layer is formed on the surface on the +Z side and the -Z side of the sheet substrate FB, and the substrate guiding member 22a is moved to the +Z side, and the substrate guiding member 22b is moved to the -Z side, and the substrate can be guided. The state in which the lead member 22a is sandwiched by the substrate guiding member 22b releases the sheet substrate FB.

Further, for example, the gas ejected from the substrate guiding member 22a and the substrate guiding member 22b is a gas that passes through the free agent, so that charging or erasing of the sheet substrate FB can be prevented.

(Storage operation of the sheet substrate to the substrate)

Next, the storage operation of the sheet substrate FB in the substrate cassette 2001 configured as described above will be described. 41 and 42 are views showing the state of the substrate stack 2001 during the housing operation. In Fig. 41 and Fig. 42, in order to make it easy to discriminate the figure, the outer shape of the substrate 匣2001 is shown by a broken line.

As shown in FIG. 41 and FIG. 42, when the substrate FB is accommodated in the substrate 匣 2001, the substrate 匣 2001 is held in the holder HD. After that, for example, gas is supplied from the supply port 2041 of the gas supply port 2004, and the gas is ejected from the substrate guiding member 22a and the substrate guiding member 22b. By the ejection of the gas, the substrate guiding member 22a and the substrate guiding member 22b are subjected to the action of the mutual ejection from the state in which the pressing mechanism 2045 is closed, and the substrate guiding member 22a and the substrate guiding member 22b are used. The width becomes wider. In this state, the sheet substrate FB is inserted from the opening portion 34. When the sheet substrate FB is inserted, the tension roller 21a and the rotating shaft member 26a (roller portion 26) are first rotated.

The sheet substrate FB inserted through the opening 34 receives gas injection from both sides of the +Z side and the -Z side, and forms a gas layer on each surface. The sheet substrate FB moves between the substrate guiding member 22a and the substrate guiding member 22b so as to slide between the gas layers. In the transport unit 21, the sheet substrate FB is sandwiched between the tension roller 21a and the measurement drum 21b, and is transported to the accommodating portion 20 side. The detection unit 21c detects the transport length of the sheet substrate FB with the rotation of the measurement drum 21b.

As shown in FIG. 41, the sheet substrate FB passing through the conveying unit 21 on the side of the accommodating portion 20 is guided while being bent in the -Z direction by its own weight. In the present embodiment, since the guide portion 27 is provided on the -Z side of the sheet substrate FB, the sheet substrate FB is guided to the drum portion 26 along the swivel member 27a and the tip end member 27b of the guide portion 27.

After the front end of the sheet substrate FB reaches the succeeding portion 26c of the drum portion 26, the front end of the sheet substrate FB is followed by the succeeding portion 26c. When the roller portion 26 rotates in this state, the sheet substrate FB is gradually followed by the succeeding portion 26c, and the sheet substrate FB is taken up by the succeeding portion 26c. After the sheet substrate FB is followed by the succeeding portion 26c, the sheet substrate FB is conveyed while the rotation speed of the tension roller 21a and the rotation speed of the rotating shaft member 26a are adjusted, so that the sheet substrate FB is not between the drum portion 26 and the conveying portion 21. Will bend.

After the sheet substrate FB is wound up, for example, by a rotation amount, the guide portion 27 is retracted as shown in FIG. By rotating the drum portion 26 in this state, the sheet substrate FB is gradually taken up by the drum portion 26. Although the thickness of the wound sheet substrate FB is gradually increased, since the guide portion 27 has been retracted, the sheet substrate FB does not come into contact with the guide portion 27.

After the sheet substrate FB of the desired length has been taken up, for example, the portion outside the opening 34 of the sheet substrate FB is cut, and the supply of the gas to the supply port 2041 is stopped, and the substrate guiding member 22a and the substrate are guided. The member 22b is in a state in which the holding substrate is closed. In this manner, the sheet substrate FB is housed in the substrate 匣2001. In the storage operation of the sheet substrate FB, the entire length of the sheet substrate FB accommodated in the substrate 1 may be calculated based on the measurement length of the sheet substrate FB measured by the detecting unit 21c. Further, the display unit 29 can display the calculation result, and the storage unit MR can store or use the communication unit CR to perform communication.

Further, for example, the operator may perform the winding of the sheet substrate FB while observing the inside of the accommodating portion 20 from the window portion 28. In this case, it is possible to perform the winding operation while checking whether or not the sheet substrate FB is wound in a state of being bent and the winding shape (reel shape) of the sheet substrate FB is deformed, and in the case where an abnormality occurs. The winding can be stopped immediately.

(Operation of substrate processing apparatus)

Next, the operation of the substrate processing apparatus 100 configured as described above will be described.

In the present embodiment, the substrate 匣 2001 in which the sheet substrate FB is housed is connected as the connection operation of the substrate supply unit 101 to the supply side connection unit 102A, and the substrate FB of the substrate 匣 2001 is performed by the substrate supply unit 101. The supply operation, the element forming operation of the substrate processing unit 102, and the removal operation of the substrate cassette 2001.

First, the connection operation of the substrate stack 2001 will be described. Fig. 43 is a view showing the connection operation of the substrate cassette 2001.

As shown in FIG. 43, the supply-side connecting portion 102A is formed such that the insertion port has a shape corresponding to the seat portion 3, and the gas supply portion GS is formed at a position where the supply port 2041 of the gas supply port 2004 is inserted.

In the connection operation, the substrate 3 is held in the holder (the same configuration as the holder HD shown in FIG. 41, for example), and the seat portion 3 and the supply-side connecting portion 102A are aligned. After the alignment, the seat portion 3 is moved to the +X side to be inserted into the substrate processing portion 102. At this time, the gas supply unit GS is inserted into the supply port 2041 of the gas supply port 2004. Therefore, when the seat portion 3 is connected to the substrate processing portion 102, the substrate guiding member 22a and the substrate guiding member 22b are opened.

Next, the supply operation will be described. When the sheet substrate FB is supplied to the substrate processing unit 102, for example, the rotating shaft member 26a (roller portion 26) of the substrate 匣2001 and the tension roller 21a are rotated in the opposite direction to the housing operation, and as shown in FIG. The portion 34 sends out the sheet substrate FB.

Next, the component forming operation will be described. In the element forming operation, as shown in FIG. 2, while the substrate processing unit 101 supplies the sheet substrate FB from the substrate supply unit 101, the substrate processing unit 102 forms the element on the sheet substrate FB. Specifically, the operation is the same as that described using FIGS. 14 to 23 .

Next, the removal operation will be described. For example, after the organic EL element 50 is formed on the sheet substrate FB and the sheet substrate FB is collected, the substrate 匣 2001 used as the substrate supply unit 101 is removed from the substrate processing unit 102.

Fig. 45 is a view showing the removal operation of the substrate cassette 2001.

In the unloading operation, the seat portion 3 is moved in the -X direction and is removed from the supply side connecting portion 102A. By the removal of the seat portion 3, the gas supply portion GS is detached from the supply port 2041 of the gas supply port 2004, and the sheet substrate FB is sandwiched between the substrate guide member 22a and the substrate guide member 22b, and is again closed.

As described above, when the seat portion 3 is connected to the substrate processing portion 102, the substrate guiding member 22a and the substrate guiding member 22b are opened, so that the opening portion 34 is opened. When the seat portion 3 and the substrate processing portion 102 are not connected, the sheet substrate FB is closed between the substrate guiding member 22a and the substrate guiding member 22b, and the opening portion 34 is closed by the sheet substrate FB.

As described above, according to the present embodiment, the main body 2 having the opening 34 that carries in and out of the sheet substrate FB and housing the sheet substrate FB passing through the opening 34 is provided in the main body 2 and on the supply side connecting portion 102A. The seat portion 3 to which the recovery-side connecting portion 102B is detachably connected, and the opening portion 34 can be closed by the sheet substrate FB in accordance with the connection state between the seat portion 3 and the supply-side connecting portion 102A and the collecting-side connecting portion 102B. Therefore, it is possible to prevent entry of foreign matter such as dust from the opening portion 34. Thereby, it is possible to prevent foreign matter from adhering to the sheet substrate FB.

Further, according to the present embodiment, the substrate 匣2001 can be easily attached and detached to an object (for example, the substrate processing unit 102).

The technical scope of the present invention is not limited to the above-described embodiments, and may be appropriately modified without departing from the spirit and scope of the invention.

In the above-described embodiment, only the substrate guiding member 22a and the substrate guiding member 22b are formed in an air cushion shape, and only the substrate guiding member 22a for connecting the supply port 2041 of the gas supply port 2004 to the opening portion 34 and the substrate are used. The guide member 22b is not limited thereto. For example, the second substrate guide member 37a on the second opening portion 35 side and the second substrate guide member 37b can be configured in the same manner.

For example, as shown in FIG. 46, a flow path 2049 for the second substrate guiding member 37a and the second substrate guiding member 37b from the supply port 2041 can be provided, and the flow path 2049 can be branched to be connected to the second substrate guide. The first flow path 2049a of the member 37a and the second flow path 2049b connected to the second substrate guiding member 37b. In this case, the electromagnetic valve V1 is provided in the flow path 2042, and the electromagnetic valve V2 is provided in the flow path 2049 so that the opening 34 and the second opening 35 can be independently opened and closed. The control of the solenoid valve V1 and the solenoid valve V2 can be performed, for example, by the control unit 104 or the information processing unit IC.

Further, in the above-described embodiment, the substrate guiding member 22a and the substrate guiding member 22b are used together as a clamping mechanism for sandwiching the sheet substrate FB when opening and closing the opening 34, but The holding mechanism is not limited to this, and the holding mechanism may be a mechanism other than the substrate guiding member 22a and the substrate guiding member 22b.

FB. . . Thin substrate

PB. . . Protective substrate

SYS, SYS2. . . Substrate processing system

1, 2001. . . Substrate

2. . .匣 body

3. . . Seat

4. . . Occlusion

20. . . Containment department

twenty one. . . Transport department

21a. . . Tension roller

21b. . . Measuring roller

21c. . . Detection department

twenty two. . . Substrate guide

22a, 22b. . . Guide member for substrate (clamping mechanism)

twenty three. . . Protruding

twenty four. . . Substrate drive mechanism

25. . . Cover

26. . . Roller section

26c. . . Next

27. . . Guide

28. . . Window

29. . . Display department

34. . . Opening

35. . . Second opening

36. . . Substrate transfer unit

37. . . Substrate guide

41. . . Cover member

42. . . Switching mechanism

50. . . Organic EL element

51. . . Clamping department

100, 202, 300, 310, 320. . . Substrate processing device

102A, 302A, 311A. . . Supply side connection

102B, 302B, 311B. . . Recycling side connection

103, 223, 312. . . Substrate recycling department

201. . . Substrate manufacturing device

203, 303. . . Relay device

211. . . Substrate manufacturing department

211A, 222A. . . Connection

222, 302, 311, 321. . . Substrate processing unit

2004. . . Gas supply埠

2041. . . Supply port

2042, 2043. . . Flow path

2044a, 2044b. . . Gas outlet

2045. . . Pressing mechanism

Fig. 1 is a configuration diagram of an organic EL element formed by a substrate processing apparatus of the present embodiment.

Fig. 2 is a view showing the configuration of a substrate processing apparatus.

Fig. 3 is a view showing the configuration of a substrate processing unit.

Fig. 4 is a view showing the configuration of a droplet applying device.

Fig. 5 is a perspective view showing the constitution of the substrate 匣.

Fig. 6 is a cross-sectional view showing the structure of a substrate.

Fig. 7 is a view showing a cross section showing an enlarged structure of the substrate 。.

Fig. 8 is a side view showing the constitution of a portion of the substrate.

Fig. 9 is a side view showing the constitution of a portion of the substrate.

Fig. 10 is a view showing the housing operation of the substrate cassette.

Fig. 11 is a view showing the housing operation of the substrate cassette.

Fig. 12 is a view showing the connection operation of the substrate 匣.

Fig. 13 is a view showing the connection operation of the substrate 匣.

Fig. 14 is a view showing a step of forming a partition wall of the substrate processing portion.

Fig. 15 is a view showing the shape and arrangement of partition walls formed on a sheet substrate.

Figure 16 is a cross-sectional view showing a partition wall formed on a sheet substrate.

Fig. 17 is a view showing the coating operation of the liquid droplets.

Fig. 18 is a view showing the constitution of a film formed between partition walls.

Fig. 19 is a view showing a step of forming a gate insulating layer on a substrate.

Fig. 20 is a view showing a step of cutting the wiring of the sheet substrate.

Fig. 21 is a view showing a step of forming a thin film in a source-drain formation region.

Figure 22 is a view showing the steps of forming an organic semiconductor layer.

Fig. 23 is a view showing an example of alignment.

Fig. 24 is a view showing the removal operation of the substrate cassette.

Fig. 25 is a view showing the configuration of a substrate processing system.

Fig. 26 is a view showing the configuration of a substrate processing system.

Fig. 27 is a view for explaining the recovery operation of the sheet substrate FB.

Fig. 28 is a view for explaining the recovery operation of the sheet substrate FB.

Fig. 29 is a view for explaining the recovery operation of the sheet substrate FB.

Fig. 30 is a view showing another configuration of the substrate processing system.

Figure 31 is a diagram showing the configuration of a substrate processing system.

Fig. 32 is a view showing the configuration of a substrate processing apparatus.

Fig. 33 is a view showing the configuration of a substrate processing apparatus.

Figure 34 is a view showing the configuration of a drum of a substrate processing apparatus.

Fig. 35 is a view showing the configuration of a closing portion of another substrate processing apparatus.

Fig. 36 is a view showing the constitution of other organic EL elements.

Fig. 37 is a perspective view showing the configuration of a substrate cassette according to another embodiment of the present invention.

Figure 38 is a cross-sectional view showing the structure of a substrate crucible.

Fig. 39 is a side view showing the constitution of a portion of the substrate 。.

Fig. 40 is a side view showing the constitution of a portion of the substrate.

Fig. 41 is a view showing the housing operation of the substrate cassette.

Fig. 42 is a view showing the housing operation of the substrate cassette.

Fig. 43 is a view showing the connection operation of the substrate 匣.

Fig. 44 is a view showing the connection operation of the substrate 匣.

Fig. 45 is a view showing the removal operation of the substrate 匣.

Fig. 46 is a view showing the configuration of a closing portion of another substrate processing apparatus.

1. . . Substrate

2. . .匣 body

3. . . Seat

3a. . . Insertion

3b. . . End face

4. . . Occlusion

20. . . Containment department

twenty three. . . Protruding

twenty four. . . Substrate drive mechanism

25. . . Cover

25a. . . Opening

25b. . . Bearing component

26. . . Roller section

28. . . Window

29. . . Display department

34. . . Opening

35. . . Second opening

CR. . . Communication department

IC. . . Information Processing Department

MR. . . Storage department

Claims (44)

A substrate 收容 can accommodate a flexible strip-shaped substrate in a predetermined length dimension, and includes a cymbal body having a first opening for loading and unloading a substrate and accommodating the substrate through the first opening; a body portion detachably connected to a seat portion of an external connection portion of the device for processing the substrate; and when the seat portion is connected to the external connection portion, the first opening portion is opened, and the seat portion is detached from the external connection portion In the state, the closing portion of the first opening is closed. The substrate according to claim 1, wherein the first opening is provided in the seat. The substrate according to claim 1, wherein the crucible body has a substrate driving mechanism that winds the substrate or feeds the substrate. The substrate of claim 3, wherein the crucible body has an accommodating portion that is connected to the first opening and houses the substrate, and the substrate driving mechanism is provided in the accommodating portion. The substrate according to claim 3, wherein the substrate driving mechanism has a shaft member that is held rotatably; and the substrate is guided to the shaft member or the substrate is guided to the first opening. 1 guide member. The substrate according to claim 5, wherein the shaft member has a subsequent portion to which the substrate is attached. The substrate according to claim 5, wherein the first guiding member is movable at least in a radial direction of the rotation of the shaft member. The substrate of claim 3, wherein the crucible body has a transport mechanism that transports the substrate between the first opening and the substrate drive mechanism. The substrate according to claim 8, wherein the conveying mechanism has a tension mechanism that applies tension to the substrate. The substrate cartridge according to claim 8, wherein the transport mechanism has a measuring unit that measures a transport amount of the substrate. The substrate of claim 10, further comprising a storage unit for storing data based on the amount of conveyance. The substrate of claim 10, further comprising a communication unit that performs communication based on the data of the transport amount. The substrate of claim 10, further comprising a display unit that displays data based on the amount of conveyance. The substrate of the eighth aspect of the invention, wherein the crucible body has a substrate guiding member that guides the substrate between the first opening and the conveying mechanism. The substrate cartridge according to any one of claims 1 to 14, wherein the dam body has a lid portion that is openable and closable. The substrate cartridge according to any one of claims 1 to 14, wherein the dam body has a window portion in which a state in which the substrate is accommodated is observed. The substrate cartridge according to any one of claims 1 to 14, wherein the crucible body has a protective substrate that is carried in and carried out to protect the substrate. The second opening. The substrate according to claim 17, wherein the crucible body has a pressing mechanism for pressing the protective substrate against the substrate. The substrate according to claim 18, wherein the crucible body has a protective substrate guiding member that guides the protective substrate between the second opening and the pressing mechanism. The substrate according to claim 17, wherein the blocking portion is configured to open the second opening when the seat portion is connected to the external connecting portion, and the seat portion is detached from the external connecting portion. In the state, the second opening is closed. The substrate cartridge according to claim 20, wherein the blocking portion is configured to switch the first opening portion and the second opening portion independently to an open state and a closed state. The substrate according to claim 21, wherein the blocking portion has a cover member provided in each of the first opening and the second opening. The substrate cartridge of claim 22, wherein the blocking portion has a driving mechanism for driving opening and closing of the cover member or switching between opening and closing of the cover member corresponding to a connection state between the seat portion and the external connecting portion mechanism. The substrate according to any one of claims 1 to 14, wherein the substrate is housed in the body of the crucible at least partially overlapping each other. A substrate crucible according to any one of claims 1 to 14, wherein The substrate is housed in the spool body in a reel shape. A substrate processing apparatus comprising: a substrate processing unit that continuously processes a flexible strip-shaped substrate; and is connectable to the seat portion of the substrate cassette according to any one of claims 1 to 14 The substrate processing side connecting portion of the external connection portion. The substrate processing apparatus according to claim 26, wherein the substrate processing-side connecting portion is provided on at least one of a substrate carrying-in side and a substrate carrying-out side of the substrate processing unit. The substrate processing apparatus according to claim 26, wherein the substrate processing side connecting portion is movable. The substrate processing apparatus according to claim 26, wherein the substrate processing side connecting portion is provided in plurality. The substrate processing apparatus according to claim 26, wherein the substrate is used as at least one of a supply unit that supplies the substrate to the substrate processing unit and a recovery unit that collects the substrate from the substrate processing unit. The substrate processing apparatus according to any one of the preceding claims, wherein the substrate processing unit includes at least one of an operation of forming a display element on the substrate and an operation of transporting the substrate. A substrate processing system comprising: a first processing device that performs a first process on a substrate; a second processing device that performs a second process on the substrate after the first process; and recovers the substrate from the first processing device and Recycling of the aforementioned base A substrate relay device that is supplied to the second processing device, and a substrate that is used in any one of claims 1 to 14 is used as the substrate relay device. The substrate processing system according to claim 32, wherein the first process includes a process of forming the substrate forming circuit, and the second process includes a process of forming a pixel on the substrate. The substrate processing system of claim 32, wherein the substrate relay device is used in accordance with processing information of each of the first processing device and the second processing device. The substrate processing system of claim 34, comprising a system control unit that manages at least the processing information. The substrate processing system according to any one of claims 32 to 35, further comprising a main control unit that controls the first processing device, the second processing device, and the substrate relay device. The substrate processing system of claim 36, wherein the main control unit determines a relay target of the substrate relay device based on data based on a conveyance amount of the substrate. A method of manufacturing a display device, comprising: a step of processing a substrate having a flexible strip shape in a processing unit for manufacturing a display element of a display device; and using any one of items 1 to 14 of the patent application scope The step of supplying the substrate to the substrate processing unit by the substrate 。. The substrate according to claim 1, wherein the blocking portion includes a clamping mechanism disposed in the first opening to sandwich the substrate; The clamping mechanism closes the first opening in a state in which the substrate is sandwiched. The substrate cartridge of claim 39, wherein the clamping mechanism has a gas discharge port for supplying a gas to a portion sandwiching the substrate. The substrate according to claim 40, wherein the gas ejection port ejects the gas to cause a gap between the clamping mechanism and the substrate. The substrate of claim 40 or 41, wherein the crucible body has a state in which the gas is ejected when the seat portion is connected to the external connection portion, and the seat portion is detached from the external connection portion. A switching mechanism that switches the manner in which the gas is not ejected. A substrate 收容 accommodating a strip-shaped and flexible sheet substrate forming a circuit, comprising: a cymbal body including a first opening extending in a width direction of the sheet substrate to carry the sheet substrate in and out in a longitudinal direction, a rotatable shaft member that can wind the sheet substrate in a predetermined length dimension in a direction in which the first opening portion extends, a lid portion that can open and close the first opening portion, and the sheet substrate is housed as a reel shape; a seat portion provided in the body of the crucible and detachably connected to an external connection portion of the processing device for processing the sheet substrate; and a switching mechanism for causing the first opening when the seat portion is connected to the external connection portion The lid portion is opened and closed so that the first opening portion is closed when the seat portion is removed from the external connection portion. A substrate 收容 accommodating a strip-shaped and flexible sheet substrate forming a circuit, comprising: a cymbal body including a first opening extending in a width direction of the sheet substrate to carry the sheet substrate in and out in a longitudinal direction, a rotatable shaft member that has a rotation center axis in a direction in which the first opening extends, and that can wind the sheet substrate by a predetermined length, is movable in the first opening, and sandwiches the sheet substrate or a liberating clamping mechanism; the seat portion is disposed on the 匣 body and detachably connected to an external connection portion of the processing device for processing the sheet substrate; and the clamping mechanism is when the seat portion is detached from the external connection portion The sheet substrate is sandwiched and the first opening is closed, and when the seat portion is connected to the external connection portion, the sheet substrate is released and the first opening portion is opened.