ZA909984B - Photosensitive resin composition and method of use thereof - Google Patents

Photosensitive resin composition and method of use thereof

Info

Publication number
ZA909984B
ZA909984B ZA909984A ZA909984A ZA909984B ZA 909984 B ZA909984 B ZA 909984B ZA 909984 A ZA909984 A ZA 909984A ZA 909984 A ZA909984 A ZA 909984A ZA 909984 B ZA909984 B ZA 909984B
Authority
ZA
South Africa
Prior art keywords
resin composition
photosensitive resin
photosensitive
composition
resin
Prior art date
Application number
ZA909984A
Other languages
English (en)
Inventor
Katsue Nishikawa
Nishikawa Katsue
Hsi-Chuan Tsai
Tsai Hsi-Chuan
Original Assignee
Grace W R & Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Grace W R & Co filed Critical Grace W R & Co
Publication of ZA909984B publication Critical patent/ZA909984B/xx

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Epoxy Resins (AREA)
ZA909984A 1989-12-15 1990-12-12 Photosensitive resin composition and method of use thereof ZA909984B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1325788A JPH03191352A (ja) 1989-12-15 1989-12-15 感光性樹脂組成物

Publications (1)

Publication Number Publication Date
ZA909984B true ZA909984B (en) 1991-10-30

Family

ID=18180613

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA909984A ZA909984B (en) 1989-12-15 1990-12-12 Photosensitive resin composition and method of use thereof

Country Status (9)

Country Link
EP (1) EP0433081A3 (zh)
JP (1) JPH03191352A (zh)
KR (1) KR910012819A (zh)
CN (1) CN1053687A (zh)
AU (1) AU629077B2 (zh)
BR (1) BR9006391A (zh)
CA (1) CA2032329A1 (zh)
MX (1) MX170891B (zh)
ZA (1) ZA909984B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1317691A2 (en) 2000-09-11 2003-06-11 Showa Denko K.K. Photosensitive composition, cured article thereof, and printed circuit board using the same
JP2002278064A (ja) * 2001-03-15 2002-09-27 Jsr Corp 感放射線性樹脂組成物、表示パネル用スペーサーおよび表示パネル
JP4994922B2 (ja) * 2007-04-06 2012-08-08 太陽ホールディングス株式会社 ソルダーレジスト組成物およびその硬化物
JP5505066B2 (ja) * 2010-04-28 2014-05-28 Ｊｓｒ株式会社 感放射線性樹脂組成物、表示素子の層間絶縁膜、保護膜及びスペーサーならびにそれらの形成方法
WO2013146482A1 (ja) 2012-03-30 2013-10-03 日本ビー・ケミカル株式会社 ハードコーティング組成物および高屈折率アンチブロッキング層形成組成物
CN104950573A (zh) * 2014-03-31 2015-09-30 太阳油墨（苏州）有限公司 光固化性热固化性树脂组合物、干膜、固化物、及印刷电路板
CN108003271B (zh) * 2017-12-25 2020-06-16 广东三求光固材料股份有限公司 一种碱溶型抗电镀光敏树脂及其制备方法与应用

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0030213A1 (de) * 1979-11-29 1981-06-10 Ciba-Geigy Ag Durch Licht vernetzbare Schicht auf Druckformen und Verfahren zur Herstellung von Offset-Druckplatten
GB8307220D0 (en) * 1983-03-16 1983-04-20 Ciba Geigy Ag Production of images
DE3620254C2 (de) * 1985-06-18 1994-05-05 Canon Kk Durch Strahlen mit wirksamer Energie härtbare Harzmischung
JPS63258975A (ja) * 1986-12-26 1988-10-26 Toshiba Corp ソルダーレジストインキ組成物
JP2604174B2 (ja) * 1987-03-25 1997-04-30 東京応化工業株式会社 耐熱性感光性樹脂組成物
JPH0717737B2 (ja) * 1987-11-30 1995-03-01 太陽インキ製造株式会社 感光性熱硬化性樹脂組成物及びソルダーレジストパターン形成方法
GB2235925B (en) * 1989-09-12 1992-09-30 Sericol Group Ltd Photocurable compositions

Also Published As

Publication number Publication date
AU6810390A (en) 1991-06-20
EP0433081A3 (en) 1992-01-29
BR9006391A (pt) 1991-09-24
CN1053687A (zh) 1991-08-07
AU629077B2 (en) 1992-09-24
JPH03191352A (ja) 1991-08-21
EP0433081A2 (en) 1991-06-19
CA2032329A1 (en) 1991-06-16
MX170891B (es) 1993-09-21
KR910012819A (ko) 1991-08-08

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