ZA74310B - Improvements in or relating to electrical component assemblies - Google Patents

Improvements in or relating to electrical component assemblies

Info

Publication number
ZA74310B
ZA74310B ZA740310A ZA74310A ZA74310B ZA 74310 B ZA74310 B ZA 74310B ZA 740310 A ZA740310 A ZA 740310A ZA 74310 A ZA74310 A ZA 74310A ZA 74310 B ZA74310 B ZA 74310B
Authority
ZA
South Africa
Prior art keywords
relating
electrical component
component assemblies
assemblies
electrical
Prior art date
Application number
ZA740310A
Other languages
English (en)
Inventor
F Utner
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of ZA74310B publication Critical patent/ZA74310B/xx

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/284Applying non-metallic protective coatings for encapsulating mounted components
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157Partial encapsulation or coating
    • H01L23/3164Partial encapsulation or coating the coating being a foil
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19041Component type being a capacitor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954Other details of electrical connections
    • H05K2201/10977Encapsulated connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305Moulding and encapsulation
    • H05K2203/1311Foil encapsulation, e.g. of mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305Moulding and encapsulation
    • H05K2203/1316Moulded encapsulation of mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305Moulding and encapsulation
    • H05K2203/1322Encapsulation comprising more than one layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Details Of Resistors (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
  • Installation Of Indoor Wiring (AREA)
  • Cable Accessories (AREA)
  • Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
ZA740310A 1973-01-30 1974-01-16 Improvements in or relating to electrical component assemblies ZA74310B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2304412A DE2304412A1 (de) 1973-01-30 1973-01-30 Feuchtedichte umhuellung fuer elektrische bauelemente oder bauelementekombinationen

Publications (1)

Publication Number Publication Date
ZA74310B true ZA74310B (en) 1974-11-27

Family

ID=5870335

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA740310A ZA74310B (en) 1973-01-30 1974-01-16 Improvements in or relating to electrical component assemblies

Country Status (18)

Country Link
JP (1) JPS49105161A (fr)
AT (1) AT327345B (fr)
AU (1) AU6352073A (fr)
BE (1) BE810374A (fr)
BR (1) BR7309911D0 (fr)
CH (1) CH562512A5 (fr)
CS (1) CS170484B2 (fr)
DD (1) DD109475A5 (fr)
DE (1) DE2304412A1 (fr)
ES (2) ES422705A1 (fr)
FR (1) FR2215780B1 (fr)
GB (1) GB1418949A (fr)
IT (1) IT1006156B (fr)
LU (1) LU68391A1 (fr)
NL (1) NL7317195A (fr)
SE (1) SE385757B (fr)
SU (1) SU528892A3 (fr)
ZA (1) ZA74310B (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4154344A (en) * 1976-11-09 1979-05-15 Minnesota Mining And Manufacturing Company Material for forming envelopes used to protect electronic components
DE2830472C3 (de) * 1978-07-11 1981-07-16 Siemens AG, 1000 Berlin und 8000 München Verfahren zum serienmäßigen Umhüllen elektrischer Bauelemente, insbesondere Kondensatoren
DE3216192A1 (de) * 1982-04-30 1983-11-03 Siemens AG, 1000 Berlin und 8000 München Elektrisches bauelement, das zentriert und justiert in einem gehaeuse untergebracht ist
DE3346896C2 (de) * 1983-12-23 1995-05-11 Siemens Ag Vorrichtung zum Schutz von Anzeigeelementen und mit diesen verbundenen Schaltungen vor Störungen durch elektrostatische Ladungen
DE3624852A1 (de) * 1986-01-10 1987-07-16 Orga Druck Gmbh Elektronische daten- und/oder programmtraeger und verfahren zu seiner herstellung
DE20011590U1 (de) * 2000-07-03 2000-09-07 Infineon Technologies AG, 81541 München Halbleiterchip-Modul mit Schutzfolie
EP2293657A1 (fr) * 2009-08-24 2011-03-09 Schreiner Group GmbH & Co. KG Composant électronique et procédé de formation de composant électronique
US10834827B2 (en) 2017-09-14 2020-11-10 HELLA GmbH & Co. KGaA System for potting components using a cap

Also Published As

Publication number Publication date
DD109475A5 (fr) 1974-11-05
BR7309911D0 (pt) 1974-10-22
DE2304412A1 (de) 1974-08-01
GB1418949A (en) 1975-12-24
FR2215780A1 (fr) 1974-08-23
JPS49105161A (fr) 1974-10-04
BE810374A (fr) 1974-05-16
AT327345B (de) 1976-01-26
NL7317195A (fr) 1974-08-01
SU528892A3 (ru) 1976-09-15
SE385757B (sv) 1976-07-19
LU68391A1 (fr) 1973-11-22
CH562512A5 (fr) 1975-05-30
AU6352073A (en) 1975-06-12
ES422705A1 (es) 1976-04-16
FR2215780B1 (fr) 1977-09-23
ES422706A1 (es) 1976-04-16
ATA869073A (de) 1975-04-15
IT1006156B (it) 1976-09-30
CS170484B2 (fr) 1976-08-27

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