ZA731439B - Electroless copper plating solution and process - Google Patents

Electroless copper plating solution and process

Info

Publication number
ZA731439B
ZA731439B ZA731439A ZA731439A ZA731439B ZA 731439 B ZA731439 B ZA 731439B ZA 731439 A ZA731439 A ZA 731439A ZA 731439 A ZA731439 A ZA 731439A ZA 731439 B ZA731439 B ZA 731439B
Authority
ZA
South Africa
Prior art keywords
plating solution
copper plating
electroless copper
electroless
solution
Prior art date
Application number
ZA731439A
Other languages
English (en)
Inventor
K Hacias
Original Assignee
Oxy Metal Finishing Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oxy Metal Finishing Corp filed Critical Oxy Metal Finishing Corp
Publication of ZA731439B publication Critical patent/ZA731439B/xx

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31678Of metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
ZA731439A 1972-03-13 1973-03-01 Electroless copper plating solution and process ZA731439B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US23430272A 1972-03-13 1972-03-13

Publications (1)

Publication Number Publication Date
ZA731439B true ZA731439B (en) 1973-11-28

Family

ID=22880806

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA731439A ZA731439B (en) 1972-03-13 1973-03-01 Electroless copper plating solution and process

Country Status (10)

Country Link
US (1) US3793037A (fr)
JP (1) JPS5518782B2 (fr)
AR (1) AR197980A1 (fr)
AU (1) AU467404B2 (fr)
BE (1) BE793376A (fr)
CA (1) CA989105A (fr)
ES (1) ES410196A1 (fr)
FR (1) FR2175729B1 (fr)
GB (1) GB1373895A (fr)
ZA (1) ZA731439B (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4981725A (en) * 1972-07-11 1991-01-01 Amp-Akzo Corporation Process and composition for sensitizing articles for metallization
US4259113A (en) * 1976-05-26 1981-03-31 Kollmorgen Technologies Corporation Composition for sensitizing articles for metallization
JPS52144901A (en) * 1976-05-28 1977-12-02 Shin Shirasuna Electric Corp Device for monitoring power supply voltage
JPS546731U (fr) * 1977-06-16 1979-01-17
JPS645617Y2 (fr) * 1981-05-29 1989-02-13
US4758025A (en) * 1985-06-18 1988-07-19 Mobil Oil Corporation Use of electroless metal coating to prevent galling of threaded tubular joints
KR960003723B1 (ko) * 1986-05-19 1996-03-21 하라마 카세이 고오교오 가부시끼가이샤 기판 금속의 표면상에 금속 필름을 형성하는 방법
JPH0332385U (fr) * 1989-08-07 1991-03-28
DE4440299A1 (de) * 1994-11-11 1996-05-15 Metallgesellschaft Ag Verfahren zur stromlosen Abscheidung von Kupferüberzügen auf Eisen- und Eisenlegierungsoberflächen
GB0031806D0 (en) * 2000-12-29 2001-02-07 Chemetall Plc Electroless copper plating of ferrous metal substrates
AU2002248343A1 (en) * 2001-01-12 2002-08-19 University Of Rochester Methods and systems for electro-or electroless-plating of metal in high-aspect ratio features
JP2009001872A (ja) * 2007-06-22 2009-01-08 Kobe Steel Ltd 線状材の銅めっき方法および銅めっきワイヤ
BR112013003430A2 (pt) * 2010-08-17 2016-06-21 Chemetall Gmbh "processo para o cobreamento de substratos metálicos sem corrente elétrica."

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2049517A (en) * 1934-06-06 1936-08-04 American Chem Paint Co Method of and material for inhibiting or retarding acid corrosion of ferrous metals
US2217921A (en) * 1938-03-23 1940-10-15 American Chem Paint Co Art of drawing ferrous metal
US3141780A (en) * 1962-03-30 1964-07-21 Minnesota Mining & Mfg Copper coating compositions

Also Published As

Publication number Publication date
JPS492726A (fr) 1974-01-11
BE793376A (fr) 1973-04-16
AU467404B2 (en) 1975-11-27
GB1373895A (en) 1974-11-13
FR2175729B1 (fr) 1976-08-20
CA989105A (en) 1976-05-18
AR197980A1 (es) 1974-05-24
FR2175729A1 (fr) 1973-10-26
ES410196A1 (es) 1976-01-01
AU5269773A (en) 1974-08-29
US3793037A (en) 1974-02-19
JPS5518782B2 (fr) 1980-05-21

Similar Documents

Publication Publication Date Title
AU7611474A (en) Electroless plating
HK49576A (en) Electroless deposition of copper
ZA731439B (en) Electroless copper plating solution and process
CA979603A (en) Electroless copper plating
HK65076A (en) Electroless copper plating
CA969703A (en) Electroless gold plating bath and process
GB1393271A (en) Preetch treatment in electroless plating
ZA706968B (en) Electroless copper plating solution and process
ZA73351B (en) Electroless copper tin plating solution and process
AU478644B2 (en) Electroless copper tin plating solution and process
AU444903B2 (en) Electroless copper plating solution and process
CA914353A (en) Electroless plating solution and process
AU477446B2 (en) Copper plating bath and process
AU2102270A (en) Electroless copper plating solution and process
AU5622773A (en) Copper plating bath and process
AU448668B2 (en) Electroless plating solution and process
CA902303A (en) Electroless copper plating
AU443206B2 (en) Electroless copper plating
CA880776A (en) Electroless copper plating solution
CA911105A (en) Electroless gold plating baths
AU1886170A (en) Electroless plating solution and process
CA901207A (en) Electroless nickel plating bath
CA913302A (en) Electroless cobalt plating bath
CA871026A (en) Electroless copper plating
AU422357B2 (en) Electroless copper plating solution