ZA202204798B - Computer chip packaging test apparatus - Google Patents

Computer chip packaging test apparatus

Info

Publication number
ZA202204798B
ZA202204798B ZA2022/04798A ZA202204798A ZA202204798B ZA 202204798 B ZA202204798 B ZA 202204798B ZA 2022/04798 A ZA2022/04798 A ZA 2022/04798A ZA 202204798 A ZA202204798 A ZA 202204798A ZA 202204798 B ZA202204798 B ZA 202204798B
Authority
ZA
South Africa
Prior art keywords
test apparatus
chip packaging
computer chip
packaging test
computer
Prior art date
Application number
ZA2022/04798A
Inventor
Cheng Fei
Original Assignee
Suzhou Ebins Information Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Ebins Information Tech Co Ltd filed Critical Suzhou Ebins Information Tech Co Ltd
Publication of ZA202204798B publication Critical patent/ZA202204798B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
ZA2022/04798A 2020-09-03 2022-04-29 Computer chip packaging test apparatus ZA202204798B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202010918124.3A CN111856255A (en) 2020-09-03 2020-09-03 Computer chip packaging test equipment
PCT/CN2020/130685 WO2022048039A1 (en) 2020-09-03 2020-11-21 Computer chip encapsulation test device

Publications (1)

Publication Number Publication Date
ZA202204798B true ZA202204798B (en) 2022-07-27

Family

ID=72967540

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA2022/04798A ZA202204798B (en) 2020-09-03 2022-04-29 Computer chip packaging test apparatus

Country Status (3)

Country Link
CN (1) CN111856255A (en)
WO (1) WO2022048039A1 (en)
ZA (1) ZA202204798B (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111856255A (en) * 2020-09-03 2020-10-30 苏州艾宾斯信息技术有限公司 Computer chip packaging test equipment
CN113376092A (en) * 2021-06-10 2021-09-10 深圳市卓晶微智能机器人科技有限公司 Packaging detection equipment for semiconductor wafer after being pasted on substrate
CN113295988B (en) * 2021-07-28 2021-10-01 江苏澳芯微电子有限公司 Computer chip packaging test equipment
CN114217205B (en) * 2021-11-29 2023-06-02 徐州领测半导体科技有限公司 Full-automatic test equipment for packaging semiconductor chip
CN114593888B (en) * 2022-03-25 2023-02-10 德凯宜特（昆山）检测有限公司 Chip packaging durability test method and test device
CN114937617B (en) * 2022-05-23 2023-09-08 无锡昌德微电子股份有限公司 Testing arrangement is used in production of MOS chip
CN115078785B (en) * 2022-06-30 2023-07-11 深圳市瑞亿科技电子有限公司 PCBA processing is with electron complete machine testing arrangement
CN115267512B (en) * 2022-08-22 2023-06-27 深圳市睿智科精密科技有限公司 Detection device and detection method for chip package
CN115561060A (en) * 2022-09-02 2023-01-03 嘉兴市扬佳科技合伙企业(有限合伙) Test equipment of spacer for semiconductor packaging
CN115532985B (en) * 2022-10-20 2023-06-02 天王电子（深圳）有限公司 Foot calibrating device
CN115980555A (en) * 2023-03-20 2023-04-18 无锡祺芯半导体科技有限公司 Intelligent chip packaging test equipment
CN116008597B (en) * 2023-03-24 2023-06-13 昆山佰易仪器设备有限公司 Testing device for semiconductor element
CN116136470B (en) * 2023-04-20 2023-07-14 天津仁爱学院 Cylinder sleeve damage testing device
CN116538898B (en) * 2023-07-04 2023-09-08 常州爱塞尔科技有限公司 Parallelism testing mechanism of press mounting equipment
CN117074926B (en) * 2023-10-16 2024-01-02 深圳市微特精密科技股份有限公司 Quick positioner of FCT test fixture
CN117560485B (en) * 2024-01-12 2024-04-05 广东诺正电子股份有限公司 Digital television set top box interface detection equipment

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07248349A (en) * 1994-03-10 1995-09-26 Sakurai Seisakusho:Kk Support device for board to be inspected in electric continuity inspection machine
CN209868381U (en) * 2019-04-13 2019-12-31 深圳市荣测捷科技有限公司 Movable test clamp jig
CN110456253B (en) * 2019-08-12 2021-07-27 安徽龙芯微科技有限公司 Chip processing device integrating testing and sorting functions
CN211180088U (en) * 2019-08-16 2020-08-04 广东华测检测机器人股份有限公司 FPC test jig convenient to go up unloading
CN211348357U (en) * 2019-12-07 2020-08-25 昆山佳奇利电子科技有限公司 Test fixture rack with slide rail structure
CN111856255A (en) * 2020-09-03 2020-10-30 苏州艾宾斯信息技术有限公司 Computer chip packaging test equipment

Also Published As

Publication number Publication date
CN111856255A (en) 2020-10-30
WO2022048039A1 (en) 2022-03-10

Similar Documents

Publication Publication Date Title
ZA202204798B (en) Computer chip packaging test apparatus
SG10202005078SA (en) Nested interposer package for ic chips
SG10202004327QA (en) Heterogeneous nested interposer package for ic chips
GB201818245D0 (en) A circuit test device for an integrated chip
SG10201907872RA (en) Semiconductor package including test pad
EP3019879A4 (en) Testing apparatus and method for microcircuit and wafer level ic testing
EP2926342A4 (en) Apparatus, method and system for providing termination for multiple chips of an integrated circuit package
SG10202007807WA (en) Organic interposers for integrated circuit packages
IT201700046645A1 (en) Measurement board for a test device of electronic devices
CA199284S (en) Stand for electronic device
EP4120276A4 (en) Method for testing control chip and related device
PL3648714T3 (en) Device and method for folding an instrument set in a package
EP4130726A4 (en) Inspection device
SG11202111977XA (en) Method for inspecting semiconductor and semiconductor inspecting device
EP4089917A4 (en) Chip packaging module and packaging method thereof, and electronic device with chip packaging module
EP3780092A4 (en) Chip packaging structure and electronic device
HK1209899A1 (en) Flip chip pad geometry for an ic package substrate ic
GB201902604D0 (en) Apparatus and methods for packaging
EP4174461A4 (en) Semiconductor apparatus
GB202010325D0 (en) Methods and apparatus for packaging
EP4030130C0 (en) Module and apparatus for drying containers
EP3883131A4 (en) Packaging structure, semiconductor device, and electronic apparatus
GB202007585D0 (en) On-die computer apparatus
KR102270758B9 (en) IC IC The module IC test apparatus of the module IC handler
GB202006316D0 (en) Test processing apparatus