EP4174461A4 - Semiconductor apparatus - Google Patents

Semiconductor apparatus Download PDF

Info

Publication number
EP4174461A4
EP4174461A4 EP20940477.1A EP20940477A EP4174461A4 EP 4174461 A4 EP4174461 A4 EP 4174461A4 EP 20940477 A EP20940477 A EP 20940477A EP 4174461 A4 EP4174461 A4 EP 4174461A4
Authority
EP
European Patent Office
Prior art keywords
semiconductor apparatus
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP20940477.1A
Other languages
German (de)
French (fr)
Other versions
EP4174461A1 (en
Inventor
Shuliang NING
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Changxin Memory Technologies Inc
Original Assignee
Changxin Memory Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Changxin Memory Technologies Inc filed Critical Changxin Memory Technologies Inc
Publication of EP4174461A1 publication Critical patent/EP4174461A1/en
Publication of EP4174461A4 publication Critical patent/EP4174461A4/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/01—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using semiconducting elements having PN junctions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/02—Means for indicating or recording specially adapted for thermometers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/04—Arrangements for writing information into, or reading information out from, a digital store with means for avoiding disturbances due to temperature effects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/02—Means for indicating or recording specially adapted for thermometers
    • G01K1/026—Means for indicating or recording specially adapted for thermometers arrangements for monitoring a plurality of temperatures, e.g. by multiplexing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/02—Means for indicating or recording specially adapted for thermometers
    • G01K1/028—Means for indicating or recording specially adapted for thermometers arrangements for numerical indication
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K3/00—Thermometers giving results other than momentary value of temperature
    • G01K3/005—Circuits arrangements for indicating a predetermined temperature
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/1917—Control of temperature characterised by the use of electric means using digital means
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/1927—Control of temperature characterised by the use of electric means using a plurality of sensors
    • G05D23/193—Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces
    • G05D23/1932—Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces to control the temperature of a plurality of spaces
    • G05D23/1934—Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces to control the temperature of a plurality of spaces each space being provided with one sensor acting on one or more control means
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
    • G05D23/2033—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature details of the sensing element
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
    • G05D23/2033—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature details of the sensing element
    • G05D23/2034—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature details of the sensing element the sensing element being a semiconductor
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/025—Geometric lay-out considerations of storage- and peripheral-blocks in a semiconductor storage device
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K2219/00—Thermometers with dedicated analog to digital converters
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/50—Marginal testing, e.g. race, voltage or current testing
    • G11C2029/5002—Characteristic
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Remote Sensing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dram (AREA)
  • Read Only Memory (AREA)
EP20940477.1A 2020-06-30 2020-11-11 Semiconductor apparatus Pending EP4174461A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202010611253.8A CN113945293B (en) 2020-06-30 2020-06-30 Semiconductor device with a plurality of semiconductor chips
PCT/CN2020/128135 WO2022000927A1 (en) 2020-06-30 2020-11-11 Semiconductor apparatus

Publications (2)

Publication Number Publication Date
EP4174461A1 EP4174461A1 (en) 2023-05-03
EP4174461A4 true EP4174461A4 (en) 2024-01-17

Family

ID=79317356

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20940477.1A Pending EP4174461A4 (en) 2020-06-30 2020-11-11 Semiconductor apparatus

Country Status (4)

Country Link
US (1) US20220307908A1 (en)
EP (1) EP4174461A4 (en)
CN (1) CN113945293B (en)
WO (1) WO2022000927A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220130826A (en) * 2020-07-17 2022-09-27 창신 메모리 테크놀로지즈 아이엔씨 semiconductor device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120163413A1 (en) * 2010-12-28 2012-06-28 Jung-Sik Kim Semiconductor device with stacked structure having through electrode, semiconductor memory device, semiconductor memory system, and operating method thereof
US20150043266A1 (en) * 2013-08-09 2015-02-12 Samsung Electronics Co., Ltd. Enhanced temperature range for resistive type memory circuits with pre-heat operation
US20170249091A1 (en) * 2016-02-26 2017-08-31 Sandisk Technologies Llc Data storage device with temperature sensor and temperature calibration circuitry and method of operating same
CN208953151U (en) * 2018-10-18 2019-06-07 杭州士兰微电子股份有限公司 Excess temperature detection device
CN210742762U (en) * 2019-08-20 2020-06-12 福建星网智慧科技股份有限公司 Control circuit for low-temperature starting of mainboard

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6453218B1 (en) * 1999-03-29 2002-09-17 Intel Corporation Integrated RAM thermal sensor
CN104115227B (en) * 2011-12-23 2017-02-15 英特尔公司 Memory operations using system thermal sensor data
JP6425462B2 (en) * 2014-08-27 2018-11-21 ルネサスエレクトロニクス株式会社 Semiconductor device
US9668337B2 (en) * 2015-09-08 2017-05-30 Western Digital Technologies, Inc. Temperature management in data storage devices
US10228872B2 (en) * 2016-03-10 2019-03-12 Toshiba Memory Corporation Semiconductor device, and information-processing device
CN107271878B (en) * 2017-06-14 2019-07-30 山东阅芯电子科技有限公司 Pass through the hot properties test method and device of electric current heating semiconductor
CN107764431B (en) * 2017-12-06 2023-12-08 西安智多晶微电子有限公司 Chip core temperature detection circuit
CN109547025A (en) * 2018-11-20 2019-03-29 恒通旺达(深圳)科技有限公司 A kind of quick D conversion method and analog-digital converter
CN210626994U (en) * 2019-09-27 2020-05-26 恒大智慧充电科技有限公司 Start control device and electronic equipment
CN110687740A (en) * 2019-11-19 2020-01-14 四川长虹电器股份有限公司 System for DLP projection low temperature starts

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120163413A1 (en) * 2010-12-28 2012-06-28 Jung-Sik Kim Semiconductor device with stacked structure having through electrode, semiconductor memory device, semiconductor memory system, and operating method thereof
US20150043266A1 (en) * 2013-08-09 2015-02-12 Samsung Electronics Co., Ltd. Enhanced temperature range for resistive type memory circuits with pre-heat operation
US20170249091A1 (en) * 2016-02-26 2017-08-31 Sandisk Technologies Llc Data storage device with temperature sensor and temperature calibration circuitry and method of operating same
CN208953151U (en) * 2018-10-18 2019-06-07 杭州士兰微电子股份有限公司 Excess temperature detection device
CN210742762U (en) * 2019-08-20 2020-06-12 福建星网智慧科技股份有限公司 Control circuit for low-temperature starting of mainboard

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2022000927A1 *

Also Published As

Publication number Publication date
CN113945293B (en) 2023-04-18
EP4174461A1 (en) 2023-05-03
WO2022000927A1 (en) 2022-01-06
CN113945293A (en) 2022-01-18
US20220307908A1 (en) 2022-09-29

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