CN114593888B - Chip packaging durability test method and test device - Google Patents
Chip packaging durability test method and test device Download PDFInfo
- Publication number
- CN114593888B CN114593888B CN202210302554.1A CN202210302554A CN114593888B CN 114593888 B CN114593888 B CN 114593888B CN 202210302554 A CN202210302554 A CN 202210302554A CN 114593888 B CN114593888 B CN 114593888B
- Authority
- CN
- China
- Prior art keywords
- chip
- bottom wall
- control unit
- central control
- sliding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M7/00—Vibration-testing of structures; Shock-testing of structures
- G01M7/08—Shock-testing
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The application provides a chip packaging durability test method and a chip packaging durability test device, and the chip packaging durability test method comprises a detection platform, a central control unit, a test cover, a pressure sensor and a lifting assembly, wherein the lifting assembly comprises a sliding assembly and a lifting platform, the sliding assembly is electrically connected to the central control unit, one end of the sliding assembly extends into a sliding rail and can slide between a first position and a second position along the extension direction of the sliding rail, the first position is adjacent to a table top, the second position is far away from the table top, and the other end of the sliding assembly extends into a test cavity through an avoidance groove; the elevating platform sets up in the test chamber to be connected with the one end that stretches into the test chamber of slip subassembly, the surface of the orientation second diapire of elevating platform is used for placing the chip. This application sets up pressure sensor through first diapire and the lateral wall at the test cover for the striking number of times and the striking effort that the accurate determination chip received, the internal parameter of test chip after the striking simultaneously, thereby confirm the stability of chip.
Description
Technical Field
The application relates to the technical field of chip packaging, in particular to a chip packaging durability testing method and a chip packaging durability testing device.
Background
With the progress of society, the chip is required to change design continuously with higher speed, higher performance and higher integration level, and the packaging of the chip is particularly important, after the chip is packaged, a randomly extracted sample chip needs to be subjected to impact test to simulate a scene when the packaged chip falls, and internal parameter detection (such as leakage current, signal-to-noise ratio, intermodulation distortion, jitter, phase noise and the like) is performed on the packaged chip after the simulation falls so as to detect whether the packaged chip displaces or damages the internal structure of the chip after the chip falls, thereby indirectly determining whether the chip is effectively protected inside the chip, namely determining the stability of the chip packaging.
In the existing impact test of the packaged chip, a high-speed impact device is mostly adopted to repeatedly impact a certain surface of the chip for many times, and internal parameters of the packaged chip are detected; repeatedly impacting the other surface of the chip for many times by using a high-speed impacting device, and detecting the internal parameters of the packaged chip again; and then selecting other surfaces for the above detection, which is not described herein. However, the detection method has strong regularity, and a large and flat surface is selected for collision in a test, so that a real scene of collision on the packaged chip cannot be simulated really, for example, a scene of collision on the side surface when the chip is in a free fall cannot be simulated, and therefore, the stability of the packaged chip when the chip is collided cannot be simulated accurately.
Disclosure of Invention
The embodiment of the application provides a device for testing the durability of chip packaging, so as to improve the technical problem.
In a first aspect, an embodiment of the present application provides a device for testing chip package durability, which includes a test table having a table top; the central control unit is arranged on the detection table; the detection frame is arranged on the table board and extends towards one side far away from the central control unit, the detection frame is provided with a slide rail, and the extending direction of the slide rail is consistent with the extending direction of the detection frame; the testing cover comprises a first bottom wall, a second bottom wall and side walls, the first bottom wall is attached to the table board, the second bottom wall is arranged opposite to the first bottom wall, the side walls are connected between the first bottom wall and the second bottom wall, and the first bottom wall, the second bottom wall and the side walls enclose a testing cavity; the side wall and the detection frame are arranged at intervals and provided with avoidance grooves, the avoidance grooves are communicated with the test cavity, and the extension direction of the avoidance grooves is consistent with that of the slide rails; the pressure sensor is connected to the central control unit, the first bottom wall and the side wall are covered with the pressure sensor, and the pressure sensor is used for detecting acting force applied to the chip during impact; the lifting assembly comprises a sliding assembly and a lifting platform, the sliding assembly is electrically connected to the central control unit, one end of the sliding assembly extends into the sliding rail and can slide between a first position and a second position along the extending direction of the sliding rail, the first position is close to the table top, the second position is far away from the table top, and the other end of the sliding assembly extends into the test cavity through the avoiding groove; the elevating platform sets up in the test cavity to be connected with the one end that stretches into the test cavity of slip subassembly, the surface of the orientation second diapire of elevating platform is used for placing the chip.
In some embodiments, the lifting platform comprises a first lifting part and a second lifting part, the first lifting part is connected to one end, extending into the testing cavity, of the sliding assembly and is attached to the side wall of the avoidance groove, the first lifting part is provided with a containing cavity, a through hole is formed in the surface, far away from the avoidance groove, of the first lifting part, and the through hole is communicated with the containing cavity; the second lifting part is arranged in the accommodating cavity in a sliding mode, and the second lifting part can at least partially extend out of the accommodating cavity through the interface; the second lifting part is electrically connected with the central control unit and used for placing the chip.
In some embodiments, the second lifting portion includes a leading portion, an intermediate portion, and a trailing portion, the leading portion being slidably disposed within the receiving cavity and being at least partially extendable out of the receiving cavity via the port; the head part is provided with a first installation cavity, and the surface of the head part, which is far away from the avoidance groove, is provided with a first avoidance port; the middle part is arranged in the first mounting cavity in a sliding manner and can at least partially extend out of the first mounting cavity through the first avoidance port; the middle part is provided with a second mounting cavity, and the surface of the middle part, which is far away from the avoidance groove, is provided with a second avoidance port; the tail part is arranged in the second mounting cavity in a sliding mode and can at least partially extend out of the second mounting cavity through the second avoiding opening.
In some embodiments, a surface of the first lifting part facing the table top is provided with a first sliding groove, the first sliding groove is communicated with the accommodating cavity, and the head part is slidably connected to a side wall of the first sliding groove; the surface of the head part facing the table top is provided with a second sliding groove which is communicated with the first mounting cavity, and the middle part of the head part is connected to the side wall of the second sliding groove in a sliding manner; a third sliding groove is formed in the surface, facing the table top, of the middle part, the third sliding groove is communicated with the second mounting cavity, and the tail part of the third sliding groove is connected to the side wall of the third sliding groove in a sliding mode; the surface of the first lifting part facing the first bottom wall, the surface of the head part facing the first bottom wall, the surface of the middle part facing the first bottom wall and the surface of the tail part facing the first bottom wall are all in the same horizontal plane.
In some embodiments, the heights of the head portion, the middle portion and the tail portion gradually decrease from the side close to the avoiding groove to the side far from the avoiding groove, the included angle between the surface of the head portion facing the second bottom wall, the surface of the middle portion facing the second bottom wall and the surface of the tail portion facing the second bottom wall and the first bottom wall is the same, and the side of the surface of the tail portion facing the second bottom wall far from the avoiding groove is connected with the side of the surface of the tail portion facing the first bottom wall far from the avoiding groove.
In some embodiments, a surface of the second lifting portion facing the second bottom wall is provided with a detection device for detecting whether the chip is placed on the surface of the second lifting portion facing the second bottom wall; when the detection device does not detect that the chip is placed in the second lifting part, the detection device generates a first placing signal and transmits the first placing signal to the central control unit, the central control unit receives the first placing signal and then generates a withdrawing instruction and transmits the withdrawing instruction to the second lifting part, and the second lifting part receives the withdrawing instruction and then slides into the accommodating cavity; when detection device detected that the chip was placed in second lift portion, detection device generated the second and placed the signal and transmitted well accuse unit, and well accuse unit receives the second and places the signal after the generation and continuously stretch out the instruction to transmit to second lift portion, second lift portion receive continuously stretch out the instruction after, at least part stretches out and holds the chamber.
In some embodiments, the sliding assembly includes a motor, the motor is disposed on the table top and located in the sliding rail, and the motor is electrically connected to the central control unit; one end of the screw rod is connected with the motor, and the other end of the screw rod extends along the extension direction of the slide rail; the first position and the second position are located on the screw rod; the sliding part is sleeved and connected with the screw rod and can move between a first position and a second position along the extension direction of the screw rod; one end of the connecting rod is connected to the sliding piece, and the other end of the connecting rod is connected with the first lifting part through the avoiding groove; after the central control unit generates a first rotation instruction and sends the first rotation instruction to the motor, the motor drives the screw rod to rotate in the forward direction, so that the sliding piece moves from the first position to the second position; after the central control unit generates a second rotation instruction and sends the second rotation instruction to the motor, the motor drives the screw rod to rotate reversely, so that the sliding piece moves from the second position to the first position.
In some embodiments, the sliding assembly further comprises a first position detector and a second position detector, both of which are electrically connected to the central control unit; the first position detector is arranged at the first position, is used for detecting the sliding piece positioned at the first position, generates a first position signal and sends the first position signal to the central control unit; the second position detector is arranged at the second position, is used for detecting the sliding piece positioned at the second position, generates a second position signal and sends the second position signal to the central control unit;
when the central control unit receives the first position signal and the first placing signal, the central control unit generates a stretching instruction and transmits the stretching instruction to the second lifting part, so that the second lifting part slides from the accommodating cavity to at least partially stretch out of the accommodating cavity, and the chip on the first bottom wall is shoveled to the surface, facing the second bottom wall, of the second lifting part;
when the central control unit receives the first position signal and the second placing signal, the central control unit generates a continuous generation instruction and transmits the continuous generation instruction to the second lifting part, and generates a first rotation instruction and transmits the first rotation instruction to the motor so as to enable the lifting platform to move from the first position to the second position;
when the central control unit receives the second position signal and the second placing signal, the central control unit generates a withdrawing instruction and transmits the withdrawing instruction to the second lifting part, so that the second lifting part slides into the accommodating cavity, and the chip positioned on the surface, facing the second bottom wall, of the second lifting part abuts against the first lifting part and falls;
when the central control unit receives the second position signal and the placing signal, the central control unit generates a second rotation instruction and sends the second rotation instruction to the motor, so that the lifting platform has a second position to move to the first position.
In a second aspect, an embodiment of the present application provides a detection method applied to the chip package durability test apparatus, including:
a detection chip placing lifting platform;
controlling the sliding component to drive the lifting platform to move from a first position to a second position;
controlling the lifting platform to enable the chip to fall down;
monitoring the magnitude of acting force applied to the chip generated by the pressure sensor during impact; and
the chip is tested for intrinsic parameters.
In some embodiments, detecting the magnitude of the force to which the pressure sensor generates the die impact and testing the die's intrinsic parameters further comprises:
setting a repetition number Q, and comparing the number Q of times that the first position moves to the second position with the repetition number Q; when Q is less than Q, returning to control the sliding component to drive the lifting platform to move from the first position to the second position; when Q = Q, the intrinsic parameters of the test chip are performed.
According to the chip package durability test method and the chip package durability test device, the pressure sensors are arranged on the first bottom wall and the side wall of the test cover and used for detecting the acting force of the chip when the lifting platform is located at the second position and the chip falls down and impacts the first bottom wall or the side wall, and the pressure sensors measure the impact acting force once when the chip impacts the first bottom wall or the side wall, so that the impact times and the impact acting force of the chip can be accurately measured, meanwhile, the internal parameters of the chip are tested after the impact, and the stability of the chip is determined.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic diagram of a testing apparatus according to an embodiment of the present invention;
FIG. 2 is an enlarged view taken at A in FIG. 1;
fig. 3 is a flowchart of a testing method according to an embodiment of the present invention.
Detailed Description
In order to make the technical solution better understood by those skilled in the art, the technical solution in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It should be apparent that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments obtained by a person skilled in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.
In a first aspect, the present application provides a chip package durability testing apparatus 100, which includes a testing table 10, where the testing table 10 has a table top; a central control unit 20, wherein the central control unit 20 is arranged on the detection table 10; the detection frame 30 is arranged on the table top and extends towards one side far away from the central control unit 20, the detection frame 30 is provided with a slide rail, and the extending direction of the slide rail is consistent with the extending direction of the detection frame 30; the testing cover 40 comprises a first bottom wall, a second bottom wall and side walls, the first bottom wall is attached to the table board, the second bottom wall is arranged opposite to the first bottom wall, the side walls are connected between the first bottom wall and the second bottom wall, and the first bottom wall, the second bottom wall and the side walls enclose a testing cavity; the side wall and the detection frame 30 are arranged at intervals and provided with avoidance grooves, the avoidance grooves are communicated with the test cavity, and the extension direction of the avoidance grooves is consistent with that of the slide rails; the pressure sensor 50 is connected to the central control unit 20, the pressure sensor 50 is covered on both the first bottom wall and the side wall, and the pressure sensor 50 is used for detecting acting force applied when the chip is impacted; the lifting assembly 60 comprises a sliding assembly 62 and a lifting table 61, the sliding assembly 62 is electrically connected to the central control unit 20, one end of the sliding assembly 62 extends into the sliding rail and can slide between a first position and a second position along the extending direction of the sliding rail, the first position is adjacent to the table top, the second position is far away from the table top, and the other end of the sliding assembly extends into the test cavity through the avoiding groove; the lifting table 61 is disposed in the testing chamber and connected to one end of the sliding assembly 62 extending into the testing chamber, and a surface of the lifting table 61 facing the second bottom wall is used for placing a chip.
In some embodiments, the lifting table 61 includes a first lifting portion 611 and a second lifting portion 612, the first lifting portion 611 is connected to one end of the sliding assembly 62 extending into the testing chamber and is attached to a side wall of the avoiding groove, the first lifting portion 611 is provided with an accommodating chamber, a surface of the first lifting portion 611 far away from the avoiding groove is provided with a through opening, and the through opening is communicated with the accommodating chamber; the second lifting part 612 is slidably arranged in the accommodating cavity, and the second lifting part 612 can at least partially extend out of the accommodating cavity through the opening; the second lifting portion 612 is electrically connected to the central control unit 20 and used for placing a chip.
In some embodiments, the second lift portion 612 comprises a leading portion 6121, a middle portion 6122, and a trailing portion 6123, wherein the leading portion 6121 is slidably disposed within the receiving cavity and can at least partially protrude out of the receiving cavity through the opening; the header 6121 is provided with a first mounting cavity, and the surface of the header 6121, which is far away from the avoidance groove, is provided with a first avoidance port; the middle part 6122 is arranged in the first mounting cavity in a sliding manner, and can at least partially extend out of the first mounting cavity through the first avoidance port; the middle portion 6122 is provided with a second mounting cavity, and a second avoidance port is arranged on the surface, far away from the avoidance groove, of the middle portion 6122; the tail 6123 is slidably disposed in the second mounting cavity and can at least partially extend out of the second mounting cavity through the second avoiding opening.
In some embodiments, a surface of the first lifting portion 611 facing the table top is provided with a first sliding groove, the first sliding groove is communicated with the accommodating cavity, and the head portion 6121 is slidably connected to a side wall of the first sliding groove; the surface of the head 6121 facing the table top is provided with a second sliding groove, the second sliding groove is communicated with the first mounting cavity, and the middle part 6122 is connected to the side wall of the second sliding groove in a sliding manner; a third sliding groove is formed in the surface, facing the table top, of the middle portion 6122, the third sliding groove is communicated with the second mounting cavity, and the tail portion 6123 is connected to the side wall of the third sliding groove in a sliding mode; the surface of the first lift portion 611 facing the first bottom wall, the surface of the leading portion 6121 facing the first bottom wall, the surface of the middle portion 6122 facing the first bottom wall, and the surface of the trailing portion 6123 facing the first bottom wall are all at the same level.
In some embodiments, the heights of the leading portion 6121, the middle portion 6122 and the tail portion 6123 gradually decrease from the side close to the avoidance groove to the side far from the avoidance groove, the included angle between the surface of the leading portion 6121 facing the second bottom wall, the included angle between the surface of the middle portion 6122 facing the second bottom wall and the included angle between the surface of the tail portion 6123 facing the second bottom wall and the side far from the avoidance groove are the same as the included angle between the surface of the tail portion 6123 facing the second bottom wall and the side far from the avoidance groove.
In some embodiments, a surface of the second lifting portion 612 facing the second bottom wall is provided with a detection device for detecting whether a chip is placed on the surface of the second lifting portion 612 facing the second bottom wall; when the detection device does not detect that the chip is placed in the second lifting part 612, the detection device generates a first placing signal and transmits the first placing signal to the central control unit 20, the central control unit 20 generates a withdrawing instruction after receiving the first placing signal and transmits the withdrawing instruction to the second lifting part 612, and the second lifting part 612 slides into the accommodating cavity after receiving the withdrawing instruction; when the detection device detects that the chip is placed in the second lifting portion 612, the detection device generates a second placing signal and transmits the second placing signal to the central control unit 20, the central control unit 20 receives the second placing signal and then generates a continuous extending instruction, the continuous extending instruction is transmitted to the second lifting portion 612, and after the second lifting portion 612 receives the continuous extending instruction, at least part of the continuous extending instruction extends out of the accommodating cavity.
In some embodiments, the sliding assembly 62 includes a motor disposed on the table and located in the sliding track, the motor is electrically connected to the central control unit 20; one end of the screw rod is connected with the motor, and the other end of the screw rod extends along the extension direction of the slide rail; the first position and the second position are positioned on the screw rod; the sliding part is sleeved and connected with the screw rod and can move between a first position and a second position along the extension direction of the screw rod; one end of the connecting rod is connected to the sliding part, and the other end of the connecting rod is connected with the first lifting part 611 through the avoiding groove; after the central control unit 20 generates a first rotation instruction and sends the first rotation instruction to the motor, the motor drives the screw rod to rotate in the forward direction, so that the sliding part moves from the first position to the second position; after the central control unit 20 generates the second rotation command and sends the second rotation command to the motor, the motor drives the screw rod to rotate reversely, so that the sliding member moves from the second position to the first position.
In some embodiments, the sliding assembly 62 further includes a first position detector and a second position detector, both of which are electrically connected to the central control unit 20; the first position detector is arranged at the first position and is used for detecting the sliding part at the first position, generating a first position signal and sending the first position signal to the central control unit 20; the second position detector is arranged at the second position, is used for detecting the sliding piece positioned at the second position, generates a second position signal and sends the second position signal to the central control unit 20;
when the central control unit 20 receives the first position signal and the first placement signal, the central control unit 20 generates an extending command and transmits the extending command to the second elevating portion 612, so that the second elevating portion 612 slides from the accommodating cavity to at least partially extend out of the accommodating cavity, so as to shovel the chip, which is the first bottom wall, to the surface, facing the second bottom wall, of the second elevating portion 612;
when the central control unit 20 receives the first position signal and the second placing signal, the central control unit 20 generates a continuous generation instruction and transmits the continuous generation instruction to the second lifting part 612, and generates a first rotation instruction and transmits the first rotation instruction to the motor, so that the lifting platform 61 moves from the first position to the second position;
when the central control unit 20 receives the second position signal and the second placement signal, the central control unit 20 generates a retraction instruction and transmits the retraction instruction to the second lifting portion 612, so that the second lifting portion 612 slides into the accommodating cavity, and the chip located on the surface of the second lifting portion 612 facing the second bottom wall abuts against the first lifting portion 611 and falls;
when the central control unit 20 receives the second position signal and a placing signal, the central control unit 20 generates a second rotation command and sends the second rotation command to the motor, so that the lifting platform 61 has the second position to move to the first position.
In a second aspect, the present invention provides a detection method applied to the chip package endurance testing apparatus 100, including:
a detection chip placement elevating table 61;
controlling the sliding assembly 62 to drive the lifting table 61 to move from the first position to the second position;
controlling the lifting table 61 to drop the chip;
monitoring the magnitude of the force applied to the chip impact generated by the pressure sensor 50; and
the chip is tested for intrinsic parameters.
In some embodiments, detecting the magnitude of the force to which the chip impact generated by the pressure sensor 50 is subjected and testing the internal parameters of the chip further comprises:
setting a repetition frequency Q, and comparing the frequency Q of the first position moving to the second position with the repetition frequency Q; when Q is less than Q, the return control sliding assembly 62 drives the lifting platform 61 to move from the first position to the second position; when Q = Q, the intrinsic parameters of the test chip are performed.
In this application, the terms "mounted," "connected," "secured," and the like are to be construed broadly unless otherwise expressly specified or limited. For example, the connection can be fixed, detachable or integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate member, or they may be connected through the inside of two elements, or they may be connected only through surface contact or through surface contact of an intermediate member. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as the case may be.
Furthermore, the terms "first," "second," and the like are used merely for distinguishing between descriptions and not intended to imply or imply a particular structure. The description of the terms "some embodiments," "other embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiments or examples is included in at least one embodiment or example of the application. In this application, the schematic representations of the terms used above are not necessarily intended to be the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the various embodiments or examples and features of the various embodiments or examples described in this application can be combined and combined by those skilled in the art without conflicting.
The above embodiments are only for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present application and are intended to be included within the scope of the present application.
Claims (10)
1. A device for testing the durability of a chip package, comprising:
a test table having a table top;
the central control unit is arranged on the detection table;
the detection frame is arranged on the table board and extends towards one side far away from the central control unit, the detection frame is provided with a slide rail, and the extending direction of the slide rail is consistent with the extending direction of the detection frame;
the test cover comprises a first bottom wall, a second bottom wall and a side wall, the first bottom wall is attached to the table board, the second bottom wall is arranged opposite to the first bottom wall, the side wall is connected between the first bottom wall and the second bottom wall, and a test cavity is defined by the first bottom wall, the second bottom wall and the side wall; the side wall and the detection frame are arranged at intervals and provided with avoidance grooves, the avoidance grooves are communicated with the test cavity, and the extension direction of the avoidance grooves is consistent with that of the slide rails;
the pressure sensor is connected to the central control unit, the first bottom wall and the side wall are covered with the pressure sensor, and the pressure sensor is used for detecting acting force applied to the chip during impact; and
the lifting assembly comprises a sliding assembly and a lifting platform, the sliding assembly is electrically connected to the central control unit, one end of the sliding assembly extends into the sliding rail and can slide between a first position and a second position along the extending direction of the sliding rail, the first position is adjacent to the table board, the second position is far away from the table board, and the other end of the sliding assembly extends into the test cavity through the avoiding groove; the elevating platform set up in the test intracavity, and with sliding assembly's the stretching into the one end in test chamber is connected, the orientation of elevating platform the surface of second diapire is used for placing the chip.
2. The chip package durability test apparatus according to claim 1, wherein the lift table comprises:
the first lifting part is connected to one end, extending into the testing cavity, of the sliding assembly and is attached to the side wall of the avoidance groove, an accommodating cavity is formed in the first lifting part, a through hole is formed in the surface, far away from the avoidance groove, of the first lifting part, and the through hole is communicated with the accommodating cavity; and
the second lifting part is arranged in the accommodating cavity in a sliding mode and can at least partially extend out of the accommodating cavity through the through hole; the second lifting part is electrically connected with the central control unit and used for placing the chip.
3. The chip package durability test apparatus according to claim 2, wherein the second lift portion includes:
the header part is arranged in the accommodating cavity in a sliding mode and can at least partially extend out of the accommodating cavity through the through opening; the head part is provided with a first mounting cavity, and the surface of the head part, which is far away from the avoidance groove, is provided with a first avoidance port;
the middle part is arranged in the first mounting cavity in a sliding mode and can at least partially extend out of the first mounting cavity through the first avoidance port; the middle part is provided with a second mounting cavity, and a second avoidance port is formed in the surface of the middle part, which is far away from the avoidance groove; and
the tail part is arranged in the second mounting cavity in a sliding mode and can at least partially extend out of the second mounting cavity through the second avoiding opening.
4. The chip package durability testing apparatus according to claim 3, wherein a surface of the first elevating portion facing the table surface is provided with a first sliding groove, the first sliding groove communicates with the accommodating cavity, and the header portion is slidably connected to a side wall of the first sliding groove;
a second sliding groove is formed in the surface, facing the table top, of the head part, the second sliding groove is communicated with the first mounting cavity, and the middle part is connected to the side wall of the second sliding groove in a sliding mode;
a third sliding groove is formed in the surface, facing the table top, of the middle portion, the third sliding groove is communicated with the second mounting cavity, and the tail portion is connected to the side wall of the third sliding groove in a sliding mode;
a surface of the first lift portion facing the first bottom wall, a surface of the head portion facing the first bottom wall, a surface of the middle portion facing the first bottom wall, and a surface of the tail portion facing the first bottom wall are all at the same horizontal plane.
5. The device for testing the durability of chip packages according to claim 3, wherein the heights of the head portion, the middle portion and the tail portion are gradually reduced from a side close to the avoiding groove to a side far away from the avoiding groove, the surface of the head portion facing the second bottom wall, the surface of the middle portion facing the second bottom wall and the surface of the tail portion facing the second bottom wall are all the same as the included angle of the first bottom wall, and the side of the tail portion facing the surface of the second bottom wall far away from the avoiding groove is connected to a side of the tail portion facing the surface of the first bottom wall far away from the avoiding groove.
6. The chip package durability test device according to claim 2, wherein a surface of the second lift portion facing the second bottom wall is provided with a detection device for detecting whether the chip is placed on the surface of the second lift portion facing the second bottom wall;
when the detection device does not detect that the chip is placed on the second lifting part, the detection device generates a first placing signal and transmits the first placing signal to the central control unit, the central control unit receives the first placing signal and then generates a withdrawing instruction and transmits the withdrawing instruction to the second lifting part, and the second lifting part receives the withdrawing instruction and then slides into the accommodating cavity;
when the detection device detects that the chip is placed in the second lifting portion, the detection device generates a second placing signal and transmits the second placing signal to the central control unit, the central control unit receives the second placing signal and then generates a continuous extending instruction and transmits the continuous extending instruction to the second lifting portion, and the second lifting portion receives the continuous extending instruction and then at least partially extends out of the accommodating cavity.
7. The chip package endurance testing apparatus of claim 6, wherein the sliding assembly comprises:
the motor is arranged on the table top and positioned in the slide rail, and the motor is electrically connected with the central control unit;
one end of the screw rod is connected with the motor, and the other end of the screw rod extends along the extending direction of the slide rail; the first position and the second position are located on the screw rod;
the sliding part is sleeved and connected with the screw rod and can move between the first position and the second position along the extension direction of the screw rod; and
one end of the connecting rod is connected to the sliding piece, and the other end of the connecting rod is connected with the first lifting part through the avoiding groove;
when the central control unit generates a first rotation instruction and sends the first rotation instruction to the motor, the motor drives the screw rod to rotate in the forward direction, so that the sliding piece moves from the first position to the second position; when the central control unit generates a second rotation instruction and sends the second rotation instruction to the motor, the motor drives the screw rod to rotate reversely, so that the sliding piece moves from the second position to the first position.
8. The device for testing the durability of a chip package according to claim 7, wherein the sliding assembly further comprises a first position detector and a second position detector, and the first position detector and the second position detector are electrically connected with the central control unit; the first position detector is arranged at the first position, is used for detecting the sliding part at the first position, generates a first position signal and sends the first position signal to the central control unit; the second position detector is arranged at the second position, is used for detecting the sliding piece positioned at the second position, generates a second position signal and sends the second position signal to the central control unit;
when the central control unit receives the first position signal and the first placement signal, the central control unit generates an extension instruction and transmits the extension instruction to the second lifting part, so that the second lifting part slides from being located in the accommodating cavity to extending out of the accommodating cavity at least partially to shovel the chip on the first bottom wall to a surface of the second lifting part facing the second bottom wall;
when the central control unit receives the first position signal and the second placing signal, the central control unit generates the continuous generation instruction and transmits the continuous generation instruction to the second lifting part, and generates a first rotation instruction and sends the first rotation instruction to a motor, so that the lifting platform moves from the first position to the second position;
when the central control unit receives the second position signal and the second placement signal, the central control unit generates the retraction command and transmits the retraction command to the second lifting part, so that the second lifting part slides into the accommodating cavity, and the chip on the surface of the second lifting part facing the second bottom wall abuts against the first lifting part and falls;
when the central control unit receives the second position signal and the placing signal, the central control unit generates the second rotation instruction and sends the second rotation instruction to the motor, so that the lifting platform moves to the first position from the second position.
9. A testing method applied to the chip package endurance testing apparatus according to any one of claims 1 to 8, comprising:
detecting that the chip is placed on the lifting table;
controlling the sliding assembly to drive the lifting table to move from the first position to the second position;
controlling the lifting platform to enable the chip to fall down;
monitoring the magnitude of an acting force generated by the pressure sensor and applied to the chip impact; and
testing the intrinsic parameters of the chip.
10. The method of claim 9, wherein said detecting the magnitude of the force applied to the chip impact generated by the pressure sensor and said testing the intrinsic parameters of the chip further comprises:
setting a repetition number Q, and comparing the number Q of times that the first position moves to the second position with the repetition number Q; when Q is less than Q, returning to control the sliding assembly to drive the lifting platform to move from the first position to the second position; when Q = Q, testing intrinsic parameters of the chip is performed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210302554.1A CN114593888B (en) | 2022-03-25 | 2022-03-25 | Chip packaging durability test method and test device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210302554.1A CN114593888B (en) | 2022-03-25 | 2022-03-25 | Chip packaging durability test method and test device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114593888A CN114593888A (en) | 2022-06-07 |
| CN114593888B true CN114593888B (en) | 2023-02-10 |
Family
ID=81811377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210302554.1A Active CN114593888B (en) | 2022-03-25 | 2022-03-25 | Chip packaging durability test method and test device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114593888B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116124406B (en) * | 2023-04-13 | 2023-08-08 | 山东泰芯电子科技有限公司 | Chip packaging durability testing device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1940518A (en) * | 2005-09-30 | 2007-04-04 | 日月光半导体制造股份有限公司 | Fall impacting device and its testing method |
| CN208953657U (en) * | 2018-08-22 | 2019-06-07 | 深圳市鑫尚宁科技有限公司 | A kind of automatic connecting test equipment of chip |
| CN210245462U (en) * | 2019-07-30 | 2020-04-03 | 苏州易锝玛精密机械有限公司 | BGA encapsulation chip rapid heating testing arrangement |
| CN111856255A (en) * | 2020-09-03 | 2020-10-30 | 苏州艾宾斯信息技术有限公司 | Computer chip packaging test equipment |
| CN213241781U (en) * | 2020-11-20 | 2021-05-18 | 安徽绿保电子科技有限公司 | Semi-outdoor single red LED display module packaging structure of p10 |
| CN214374918U (en) * | 2021-02-02 | 2021-10-08 | 深圳成之杰兴科技有限公司 | Chip test bench |
-
2022
- 2022-03-25 CN CN202210302554.1A patent/CN114593888B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1940518A (en) * | 2005-09-30 | 2007-04-04 | 日月光半导体制造股份有限公司 | Fall impacting device and its testing method |
| CN208953657U (en) * | 2018-08-22 | 2019-06-07 | 深圳市鑫尚宁科技有限公司 | A kind of automatic connecting test equipment of chip |
| CN210245462U (en) * | 2019-07-30 | 2020-04-03 | 苏州易锝玛精密机械有限公司 | BGA encapsulation chip rapid heating testing arrangement |
| CN111856255A (en) * | 2020-09-03 | 2020-10-30 | 苏州艾宾斯信息技术有限公司 | Computer chip packaging test equipment |
| WO2022048039A1 (en) * | 2020-09-03 | 2022-03-10 | 苏州艾宾斯信息技术有限公司 | Computer chip encapsulation test device |
| CN213241781U (en) * | 2020-11-20 | 2021-05-18 | 安徽绿保电子科技有限公司 | Semi-outdoor single red LED display module packaging structure of p10 |
| CN214374918U (en) * | 2021-02-02 | 2021-10-08 | 深圳成之杰兴科技有限公司 | Chip test bench |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114593888A (en) | 2022-06-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN114593888B (en) | Chip packaging durability test method and test device | |
| KR101918960B1 (en) | Diver Helmet Impact Tester | |
| KR101799526B1 (en) | Compressive strength testing method for concrete and tester | |
| JP6805445B2 (en) | Condition evaluation device for inspection objects | |
| JP2003344252A (en) | Drop impact testing machine, and testing method for drop impact test | |
| WO2007041374A3 (en) | Method and apparatus of high speed property mapping | |
| CN101886997A (en) | Impact tester of single soldered ball | |
| CA2756755A1 (en) | A balance control system and method for a movable barrier operator | |
| CN110658056A (en) | Circular pipe fitting low-speed drop hammer impact test detection device and impact test instrument | |
| KR200452509Y1 (en) | glass impact tester | |
| CN112098193A (en) | Concrete strength detection method | |
| KR100887365B1 (en) | Load force measure apparatus | |
| CN100430267C (en) | Retaining system for vehicle occupants | |
| JP2010175417A5 (en) | ||
| CN105486266A (en) | Novel slide shoe detection device and method | |
| CN105403799B (en) | Electrostatic transducer analysis method for reliability and system | |
| CN201788053U (en) | Damage prevention device used in experimental process of deadweight machine and deadweight machine using same | |
| CN110658057A (en) | Method and device for measuring section deformation of circular pipe in drop hammer impact test | |
| CN105910903B (en) | Safe automobile air bag rigidity detection device | |
| CN211785617U (en) | Air-throwing impact type calibrating device of acceleration sensor | |
| CN201697844U (en) | Single solder ball impact tester | |
| CN207703655U (en) | A kind of diamond compact apparatus for impact testing | |
| CN105544623A (en) | Calibrating device and calibrating method applied to dynamic measuring instrument of foundation pile | |
| CN218885958U (en) | Acceleration sensor test fixture | |
| JP2000304668A (en) | Method and apparatus for measurement of drop shock |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |