CN113376092A - Packaging detection equipment for semiconductor wafer after being pasted on substrate - Google Patents
Packaging detection equipment for semiconductor wafer after being pasted on substrate Download PDFInfo
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- CN113376092A CN113376092A CN202110648507.8A CN202110648507A CN113376092A CN 113376092 A CN113376092 A CN 113376092A CN 202110648507 A CN202110648507 A CN 202110648507A CN 113376092 A CN113376092 A CN 113376092A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N19/00—Investigating materials by mechanical methods
- G01N19/08—Detecting presence of flaws or irregularities
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Abstract
The invention relates to the technical field of semiconductor processing, and discloses packaging detection equipment for a semiconductor wafer after being pasted on a substrate, which comprises a processing machine table, a feeding conveyer belt, an installation shell, a detection contact mechanism and a detection reaction mechanism, wherein the feeding conveyer belt is fixedly connected to the top of the processing machine table, the installation shell is fixedly connected to the top of the processing machine table, the detection contact mechanism is fixedly connected to the bottom of the installation shell and used for contacting with a semiconductor chip to be detected, and the detection reaction mechanism is fixedly connected to the inside of the installation shell. This encapsulation check out test set after semiconductor wafer pastes dress base plate, the detection thimble that the damage area corresponds the contact can't be jack-up to preset position, then the first fixed contact and the first moving contact that correspond can't contact, and balanced curb plate inclines to heavier one side, drives the second fixed contact and the second moving contact back that correspond the side for the alarm is reported to the police and is indicateed.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to packaging detection equipment for a semiconductor wafer after being attached to a substrate.
Background
The semiconductor packaging refers to a process of processing a wafer passing a test according to a product model and a function requirement to obtain an independent chip, and the packaging process is as follows: the wafer from the previous process of the wafer is cut into small chips after scribing process, then the cut chips are pasted on the corresponding small island of the substrate (lead frame) frame by glue, and then the bonding pads of the chips are connected to the corresponding pins of the substrate by utilizing superfine metal (gold tin copper aluminum) wires or conductive resin to form the required circuit; and then packaging and protecting the independent wafer by using a plastic shell, carrying out a series of operations after plastic packaging, carrying out finished product testing after packaging, generally carrying out the processes of inspection, testing, packaging and the like, and finally warehousing and shipping.
The appearance of a packaged chip needs to be detected to check whether the chip is defective or not, the defect is caused by the fact that the edge of the chip is damaged due to foreign matters or impact among the chips, when the defect reaches the inside of the chip, AL wiring or an active area is damaged, and the defect is caused.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides the packaging detection equipment after the semiconductor wafer is mounted on the substrate, which has the advantage of high automation degree and solves the problems that the existing packaging detection equipment is generally observed by naked eyes manually, the detection efficiency is low, the error is large, and the defective rate is easily increased.
(II) technical scheme
In order to realize the purpose of high automation degree, the invention provides the following technical scheme: the utility model provides a encapsulation check out test set after semiconductor wafer pastes dress base plate, includes the processing board, still includes pay-off conveyer belt, installation casing, detects contact mechanism, detection reaction mechanism, processing board top fixedly connected with pay-off conveyer belt, processing board top fixedly connected with installation casing, installation casing bottom fixedly connected with detects contact mechanism for with wait to detect the semiconductor chip contact, the inside fixedly connected with of installation casing detects reaction mechanism, owing to judge whether defect appears in the semiconductor chip who waits to detect.
Further, the contact detection mechanism comprises an electric push rod, a detection plate, a movable groove, a mounting plate, a through groove, a detection thimble, a first moving contact and a first fixed contact, the bottom of the mounting shell is fixedly connected with the electric push rod with the model number of 64STG-200mm-IP65, the bottom of the electric push rod is fixedly connected with the detection plate, the movable groove is arranged in the detection plate, the mounting plate is fixedly connected with the inside of the movable groove, the through groove is arranged in the mounting plate, the detection thimble is movably connected with the inside of the through groove, the first moving contact is fixedly connected with the top of the detection thimble, and the first fixed contact is fixedly connected with the top wall in the movable groove.
Furthermore, the detection thimble is made of metal materials, the bottom of the detection thimble is fixedly connected with a flexible ball, and the bottom of the flexible ball is in contact with the top of the semiconductor packaging chip to be detected, so that the semiconductor packaging chip is prevented from being damaged.
Furthermore, electric putter electric connection is to the equipment power, electric putter and the equal electric connection of pay-off conveyer belt to automatic control system, and the cooperation through current mechanical automatic control system control pay-off conveyer belt and electric putter starts.
Further, the detection reaction mechanism comprises a holding tank, a mounting shaft, a balance connecting shaft, a balance side plate, a second moving contact, a second fixed contact, a limit groove, a magnet ball, an electromagnet and a magnetic shielding plate, the holding tank is arranged in the mounting shell, the mounting shaft is fixedly connected in the holding tank, the top of the mounting shaft is movably connected with the balance connecting shaft, the balance side plate is fixedly connected to the outer side of the balance connecting shaft, the second moving contact is fixedly connected to the bottom of the balance side plate, the second fixed contact is fixedly connected to the inner bottom wall of the holding tank, the limit groove is arranged in the balance side plate, the magnet balls are movably connected in the limit groove, the number of the detection thimbles is the same as the number of the magnet balls, the number of the detection thimbles is even, one half of the magnet balls are positioned on the balance side plate on one side, the other half of the magnet balls are positioned on the balance side plate on the other side, the electromagnetic iron is fixedly connected inside the mounting shell, and the magnetic shielding plate is fixedly connected inside the mounting shell.
Furthermore, the first fixed contact is electrically connected to a power supply of the equipment, the first moving contact is electrically connected to the electromagnet, and when the first fixed contact and the first moving contact are in contact, a circuit is communicated, so that the electromagnet is magnetic when electrified.
Furthermore, the top of the installation shell is fixedly connected with an alarm, the type of the alarm is LTD-1101J, the second fixed contact is electrically connected to a power supply of the equipment, the second moving contact is electrically connected to the alarm, and after the second fixed contact is contacted with the second moving contact, a circuit is communicated, so that the alarm gives an alarm.
Furthermore, the magnetism of the corresponding surfaces of the electromagnets and the magnet balls is opposite, the magnetic shielding plates are fixed between two adjacent electromagnets at intervals, and the electromagnets are prevented from attracting the adjacent magnet balls through the magnetic shielding plates.
(III) advantageous effects
Compared with the prior art, the invention provides the packaging detection equipment after the semiconductor wafer is pasted on the substrate, which has the following beneficial effects:
1. according to the packaging detection device after the semiconductor wafer is attached to the substrate, the feeding conveyer belt conveys the semiconductor packaging chip to be detected to the position below the detection plate, at the moment, the electric push rod is started to drive the detection plate to move downwards, the detection thimble is jacked up by the semiconductor packaging chip to be detected, the corresponding detection thimble moves upwards, the electromagnet is electrified to have magnetism after the first fixed contact and the first moving contact are driven to be contacted, and the electromagnet attracts the magnet ball upwards.
2. According to the packaging detection device after the semiconductor wafer is attached to the substrate, the detection thimble correspondingly contacted with the damaged area cannot be jacked to a preset position, the corresponding first fixed contact cannot be contacted with the first moving contact, at the moment, two sides of the balance side plate cannot be balanced, the balance side plate inclines to the heavier side, and after the second fixed contact and the second moving contact on the corresponding side are driven to be contacted, a circuit is communicated, so that an alarm is prompted to give an alarm.
Drawings
FIG. 1 is a schematic overall front view of the apparatus of the present invention;
FIG. 2 is a schematic front view of a contact detection mechanism according to the present invention;
FIG. 3 is a schematic front view of a detecting thimble according to the present invention;
FIG. 4 is a schematic front view of the detection reaction mechanism of the present invention.
In the figure: 1. processing a machine table; 2. a feeding conveyor belt; 3. installing a shell; 4. detecting a contact mechanism; 41. an electric push rod; 42. detecting a plate; 43. a movable groove; 44. mounting a plate; 45. a through groove; 46. detecting a thimble; 47. a first moving contact; 48. a first fixed contact; 5. a detection reaction mechanism; 51. accommodating grooves; 52. installing a shaft; 53. balancing the connecting shaft; 54. a balance side plate; 55. a second moving contact; 56. a second fixed contact; 57. a limiting groove; 58. a magnet ball; 59. an electromagnet; 510. a magnetic shield panel; 6. an alarm.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
referring to fig. 1-3, a packaging and inspecting apparatus for a semiconductor wafer after being mounted on a substrate includes a processing machine 1, a feeding and conveying belt 2, an installation housing 3, an inspecting and contacting mechanism 4, and an inspecting and reacting mechanism 5, wherein the feeding and conveying belt 2 is fixedly connected to the top of the processing machine 1, the installation housing 3 is fixedly connected to the top of the processing machine 1, the inspecting and contacting mechanism 4 is fixedly connected to the bottom of the installation housing 3 and is used for contacting with a semiconductor chip to be inspected, and the inspecting and reacting mechanism 5 is fixedly connected to the inside of the installation housing 3, so as to determine whether the semiconductor chip to be inspected has a defect;
the detection contact mechanism 4 comprises an electric push rod 41, a detection plate 42, a movable groove 43, a mounting plate 44, a through groove 45, a detection thimble 46, a first moving contact 47 and a first fixed contact 48, the bottom of the shell 3 of the installation shell 3 is fixedly connected with the electric push rod 41, the bottom of the electric push rod 41 is fixedly connected with the detection plate 42, the movable groove 43 is arranged in the detection plate 42, the mounting plate 44 is fixedly connected in the movable groove 43, the through groove 45 is arranged in the mounting plate 44, the detection thimble 46 is movably connected in the through groove 45, the first moving contact 47 is fixedly connected at the top of the detection thimble 46, the first fixed contact 48 is fixedly connected at the top wall in the movable groove 43, the detection thimble 46 is made of metal material, the flexible ball is fixedly connected at the bottom of the detection thimble 46, the bottom of the flexible ball is contacted with the top of a semiconductor packaging chip to be detected, the semiconductor packaging chip is prevented from being damaged, and the electric push rod 41 is electrically connected to a power supply of equipment, the electric push rod 41 and the feeding conveyer belt 2 are both electrically connected to an automatic control system, and the feeding conveyer belt 2 and the electric push rod 41 are controlled to be matched and started through the existing mechanical automatic control system.
Example two:
referring to fig. 1-4, a packaging and inspecting apparatus for a semiconductor wafer after being mounted on a substrate includes a processing machine 1, a feeding and conveying belt 2, an installation housing 3, an inspecting and contacting mechanism 4, and an inspecting and reacting mechanism 5, wherein the feeding and conveying belt 2 is fixedly connected to the top of the processing machine 1, the installation housing 3 is fixedly connected to the top of the processing machine 1, the inspecting and contacting mechanism 4 is fixedly connected to the bottom of the installation housing 3 and is used for contacting with a semiconductor chip to be inspected, and the inspecting and reacting mechanism 5 is fixedly connected to the inside of the installation housing 3, so as to determine whether the semiconductor chip to be inspected has a defect;
the detection contact mechanism 4 comprises an electric push rod 41, a detection plate 42, a movable groove 43, a mounting plate 44, a through groove 45, a detection thimble 46, a first moving contact 47 and a first fixed contact 48, the bottom of the installation shell 3 is fixedly connected with the electric push rod 41, the bottom of the electric push rod 41 is fixedly connected with the detection plate 42, the movable groove 43 is arranged in the detection plate 42, the mounting plate 44 is fixedly connected in the movable groove 43, the through groove 45 is arranged in the mounting plate 44, the detection thimble 46 is movably connected in the through groove 45, the first moving contact 47 is fixedly connected at the top of the detection thimble 46, the first fixed contact 48 is fixedly connected at the top wall in the movable groove 43, the detection thimble 46 is made of metal materials, the flexible ball is fixedly connected at the bottom of the detection thimble 46, the bottom of the flexible ball is contacted with the top of a semiconductor packaging chip to be detected, the semiconductor packaging chip is prevented from being damaged, and the electric push rod 41 is electrically connected to a power supply of equipment, the electric push rod 41 and the feeding conveyer belt 2 are both electrically connected to an automatic control system, and the feeding conveyer belt 2 and the electric push rod 41 are controlled to be matched and started by the existing mechanical automatic control system;
the detection reaction mechanism 5 comprises an accommodating groove 51, an installing shaft 52, a balance connecting shaft 53, a balance side plate 54, a second moving contact 55, a second fixed contact 56, a limit groove 57, a magnet ball 58, an electromagnet 59 and a magnetic shielding plate 510, wherein the accommodating groove 51 is arranged in the installing shell 3, the installing shaft 52 is fixedly connected in the accommodating groove 51, the balance connecting shaft 53 is movably connected at the top of the installing shaft 52, the balance side plate 54 is fixedly connected at the outer side of the balance connecting shaft 53, the second moving contact 55 is fixedly connected at the bottom of the balance side plate 54, the second fixed contact 56 is fixedly connected on the inner bottom wall of the accommodating groove 51, the limit groove 57 is arranged in the balance side plate 54, the magnet balls 58 are movably connected in the limit groove 57, the number of the detection thimbles 46 is the same as that of the magnet balls 58, the number of the detection thimbles 46 is even, and one half of the magnet balls 58 are positioned on the balance side plate 54 on one side, the other half of the magnet balls 58 are positioned on the balance side plate 54 at the other side, the electromagnet 59 is fixedly connected inside the mounting shell 3, the magnetic shielding plate 510 is fixedly connected inside the mounting shell 3, the first fixed contact 48 is electrically connected to the power supply of the equipment, the first movable contact 47 is electrically connected to the electromagnet 59, when the first fixed contact 48 and the first movable contact 47 are contacted, a circuit is connected, so that the electromagnet 59 is electrified and has magnetism, the alarm 6 is fixedly connected to the top of the mounting shell 3, the second fixed contact 56 is electrically connected to the power supply of the equipment, the second movable contact 55 is electrically connected to the alarm 6, when the second fixed contact 56 is contacted with the second movable contact 55, the circuit is communicated, so that the alarm 6 gives an alarm prompt, the magnetism of the corresponding surface of the electromagnet 59 and the magnet ball 58 is opposite, the magnetic shielding plates 510 are fixed between two adjacent electromagnets 59 at intervals, the electromagnet 59 is prevented from causing an attraction reaction to the adjacent magnet ball 58 by the magnetic shield plate 510.
The working principle is as follows: the electric push rod 41 and the feeding conveyer belt 2 are both electrically connected to an automatic control system, the feeding conveyer belt 2 and the electric push rod 41 are controlled to be matched and started through the existing mechanical automatic control system, the semiconductor packaging chip to be detected is conveyed to the position below the detection plate 42 by the feeding conveyer belt 2, the electric push rod 41 is started to drive the detection plate 42 to move downwards at the moment, the detection thimble 46 synchronously moves downwards, the first fixed contact 48 and the first movable contact 47 are not in contact at the moment, the electromagnet 59 is not electrified, and the outer side of the magnet ball 58 is movably connected to the inside of the limiting groove 57;
the bottom of the detection thimble 46 is fixedly connected with a flexible ball, the bottom of the flexible ball is in contact with the top of a semiconductor packaging chip to be detected, the semiconductor packaging chip is prevented from being damaged, the detection thimble 46 is different in length, the detection thimble 46 is jacked up by the semiconductor packaging chip to be detected, so that the corresponding detection thimble 46 moves upwards to drive the first fixed contact 48 and the first moving contact 47 to be contacted, a circuit is communicated, the electromagnet 59 is electrified to have magnetism, the magnetism of the electromagnet 59 and the magnetism of the corresponding surface of the magnet ball 58 are opposite, and the magnet ball 58 is attracted upwards by the electromagnet 59;
the number of the detection thimbles 46 is the same as that of the magnet balls 58, the number of the detection thimbles 46 is even, one half of the magnet balls 58 are located on the balance side plate 54 on one side, the other half of the magnet balls 58 are located on the balance side plate 54 on the other side, if the surface of the semiconductor packaging chip is damaged, the detection thimbles 46 correspondingly contacted with a damaged area cannot be jacked to a preset position, the corresponding first fixed contacts 48 cannot be contacted with the first movable contacts 47, the corresponding magnet balls 58 are still connected inside the balance side plate 54 at the moment, two sides of the balance side plate 54 cannot be balanced, the balance side plate 54 inclines towards one heavier side, the second fixed contacts 56 and the second movable contacts 55 on the corresponding side are driven to be contacted, a circuit is connected, and the alarm 6 gives an alarm prompt.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a encapsulation check out test set after semiconductor wafer pastes dress to base plate, includes processing board (1), its characterized in that: still include pay-off conveyer belt (2), installation casing (3), detect contact mechanism (4), detect reaction mechanism (5), processing board (1) top fixedly connected with pay-off conveyer belt (2), processing board (1) top fixedly connected with installation casing (3), installation casing (3) bottom fixedly connected with detects contact mechanism (4) for with the semiconductor chip contact that waits to detect, the inside fixedly connected with of installation casing (3) detects reaction mechanism (5), owing to judge whether defect appears in the semiconductor chip that waits to detect.
2. The apparatus of claim 1, wherein the inspection tool comprises: the contact detection mechanism (4) comprises an electric push rod (41), a detection plate (42), a movable groove (43), a mounting plate (44), a through groove (45), a detection thimble (46), a first moving contact (47) and a first fixed contact (48), the bottom of the mounting shell (3) is fixedly connected with an electric push rod (41), the bottom of the electric push rod (41) is fixedly connected with a detection plate (42), a movable groove (43) is arranged in the detection plate (42), a mounting plate (44) is fixedly connected in the movable groove (43), a through groove (45) is arranged in the mounting plate (44), a detection thimble (46) is movably connected in the through groove (45), the top of the detection thimble (46) is fixedly connected with a first moving contact (47), the inner top wall of the movable groove (43) is fixedly connected with a first fixed contact (48).
3. The apparatus of claim 2, wherein the inspection device comprises: the detection thimble (46) is made of metal materials, and a flexible ball is fixedly connected to the bottom of the detection thimble (46).
4. The apparatus of claim 2, wherein the inspection device comprises: the electric push rod (41) is electrically connected to an equipment power supply.
5. The apparatus of claim 2, wherein the inspection device comprises: the detection reaction mechanism (5) comprises an accommodating groove (51), an installing shaft (52), a balance connecting shaft (53), a balance side plate (54), a second moving contact (55), a second fixed contact (56), a limit groove (57), a magnet ball (58), an electromagnet (59) and a magnetic shielding plate (510), wherein the accommodating groove (51) is formed in the installing shell (3), the installing shaft (52) is fixedly connected in the accommodating groove (51), the balance connecting shaft (53) is movably connected to the top of the installing shaft (52), the balance side plate (54) is fixedly connected to the outer side of the balance connecting shaft (53), the second moving contact (55) is fixedly connected to the bottom of the balance side plate (54), the second fixed contact (56) is fixedly connected to the inner bottom wall of the accommodating groove (51), the limit groove (57) is formed in the balance side plate (54), and the magnet ball (58) is movably connected in the limit groove (57), the electromagnetic shielding device is characterized in that an electromagnet (59) is fixedly connected inside the mounting shell (3), and a magnetic shielding plate (510) is fixedly connected inside the mounting shell (3).
6. The apparatus of claim 5, wherein the inspection device comprises: the first fixed contact (48) is electrically connected to a power supply of the equipment, and the first movable contact (47) is electrically connected to the electromagnet (59).
7. The apparatus of claim 5, wherein the inspection device comprises: the top of the mounting shell (3) is fixedly connected with an alarm (6), the second fixed contact (56) is electrically connected to an equipment power supply, and the second moving contact (55) is electrically connected to the alarm (6).
8. The apparatus of claim 5, wherein the inspection device comprises: the corresponding surfaces of the electromagnets (59) and the magnet balls (58) are opposite in magnetism, and the magnetic shielding plates (510) are fixed between two adjacent electromagnets (59) at intervals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110648507.8A CN113376092A (en) | 2021-06-10 | 2021-06-10 | Packaging detection equipment for semiconductor wafer after being pasted on substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110648507.8A CN113376092A (en) | 2021-06-10 | 2021-06-10 | Packaging detection equipment for semiconductor wafer after being pasted on substrate |
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| CN113376092A true CN113376092A (en) | 2021-09-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110648507.8A Withdrawn CN113376092A (en) | 2021-06-10 | 2021-06-10 | Packaging detection equipment for semiconductor wafer after being pasted on substrate |
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| CN (1) | CN113376092A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114545188A (en) * | 2022-03-02 | 2022-05-27 | 深圳市卓晶微智能机器人科技有限公司 | Semiconductor test equipment that suitability is strong |
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Application publication date: 20210910 |
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