CN213122195U - Chip testing mechanism - Google Patents

Chip testing mechanism Download PDF

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Publication number
CN213122195U
CN213122195U CN202021485519.0U CN202021485519U CN213122195U CN 213122195 U CN213122195 U CN 213122195U CN 202021485519 U CN202021485519 U CN 202021485519U CN 213122195 U CN213122195 U CN 213122195U
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China
Prior art keywords
testing
chip
assembly
processing unit
central processing
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CN202021485519.0U
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Chinese (zh)
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庄渊胜
蔡江梁
王强
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Dongguan Qianying Electronics Co ltd
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Dongguan Qianying Electronics Co ltd
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Priority to CN202021485519.0U priority Critical patent/CN213122195U/en
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Abstract

The utility model relates to the technical field of chip detection, in particular to a chip testing mechanism, which comprises a conveying belt, a feeding component and a testing machine, wherein sliding grooves are arranged at two sides of the conveying belt, a plurality of testing boards are arranged in the feeding component, the testing machine comprises a testing table, a testing board mounting groove and a testing component, the testing component is mounted on the testing table, the testing board mounting groove is arranged at the upper part of the testing table, the testing board is provided with a plurality of chip mounting holes, the bottom part of the testing board mounting groove is provided with a plurality of testing devices, the utility model inserts the testing chips into the testing board during detection, then the testing board is placed in the feeding component for feeding, the testing board is sent into the testing board mounting through the conveying belt, and then the chips in the testing board are detected through the matching of the testing component and, the utility model discloses but automatic feeding, and a plurality of chips of disposable detectable, the effectual detection efficiency who improves the chip.

Description

Chip testing mechanism
Technical Field
The utility model belongs to the technical field of the chip detects technique and specifically relates to indicate a chip test mechanism.
Background
Design and manufacture factories of integrated circuit chips often need to use a chip tester to test the integrated circuit chips, the chip tester mainly comprises a chip tester host and a chip load board, when in testing, the chip tester host and the chip load board are connected together to transmit signals to realize a chip testing function, the connection of the chip load board and the chip tester host is crucial, the connection or the contact is not good, the signals can not be normally transmitted, and the accuracy of the test is influenced.
The existing chip testing mechanism generally carries out independent testing on chips, the chips need to be assembled in the testing process, the chips need to be manually installed on the testing mechanism, the testing process is complex, and the testing cost is high.
SUMMERY OF THE UTILITY MODEL
The utility model discloses problem to prior art provides an automatic chip accredited testing organization of material loading.
In order to solve the technical problem, the utility model discloses a following technical scheme:
the utility model provides a pair of chip test mechanism, including conveyer belt, material loading subassembly and test machine, the material loading subassembly set up in the one end of conveyer belt, the test machine install in the other end of conveyer belt, the conveyer belt both sides are provided with the sliding tray, be provided with a plurality of test boards in the material loading subassembly, the test machine includes the testboard, surveys test board mounting groove and test assembly, test unit mount in on the testboard, survey the test board mounting groove set up in testboard upper portion, survey the test board and be provided with a plurality of chip mounting holes, survey test board mounting groove bottom and be provided with a plurality of testing device.
Preferably, the test assembly comprises a central processing unit, a camera assembly, a voltage test module and a display, the camera assembly and the voltage test module are electrically connected with the central processing unit, the test device is electrically connected with the central processing unit, and the display is electrically connected with the central processing unit.
Preferably, the chip testing mechanism further comprises an alarm, the alarm is installed on the side portion of the testing table, and the alarm is electrically connected with the central processing unit.
Preferably, the feeding assembly comprises a pushing cylinder, a driving cylinder and a limiting frame, the driving cylinder is installed at the bottom of the limiting frame, a tray is arranged on the driving cylinder, the feeding assembly is installed on the tray, and the pushing cylinder is installed at one end, far away from the conveying belt, of the limiting frame.
Preferably, the conveyer belt is driven by a motor, and the motor is a stepping motor.
Preferably, the test device comprises a first socket assembly and a second socket assembly, the second socket assembly is stacked on the first socket assembly, probe probes are arranged in the middle of the first socket assembly and the middle of the second socket assembly, and the probe probes are electrically connected with the central processing unit.
Preferably, the number of the detection probes is four, and the four detection probes are uniformly distributed at two ends of the middle of the first socket assembly and two ends of the middle of the second socket assembly.
The utility model has the advantages that:
the utility model provides a chip testing mechanism, which comprises a conveying belt, a feeding component and a testing machine, wherein the feeding component is arranged at one end of the conveying belt, the testing machine is arranged at the other end of the conveying belt, sliding grooves are arranged at two sides of the conveying belt, a plurality of testing boards are arranged in the feeding component, the testing machine comprises a testing board, a testing board mounting groove and a testing component, the testing component is arranged on the testing board, the testing board mounting groove is arranged at the upper part of the testing board, the testing board is provided with a plurality of chip mounting holes, and a plurality of testing devices are arranged at the bottom of the testing board mounting groove. The utility model discloses but automatic feeding, and a plurality of chips of disposable detectable, the effectual detection efficiency who improves the chip.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is another schematic structural diagram of the present invention.
Fig. 3 is a cross-sectional view of the testing device of the present invention.
The reference numerals are respectively:
the test device comprises a conveying belt-1, a feeding assembly-2, a testing machine-3, a sliding groove-4, a testing plate-5, a testing table-6, a testing plate mounting groove-7, a testing assembly-8, a display-9, an alarm-10, a pushing cylinder-11, a driving cylinder-12, a limiting frame-13, a tray-14, a motor-15, a first socket assembly-16, a second socket assembly-17, a detection probe-18 and a detection device-19.
Detailed Description
In order to facilitate understanding of those skilled in the art, the present invention will be further described with reference to the following examples and drawings, which are not intended to limit the present invention. The present invention will be described in detail with reference to the accompanying drawings.
As shown in FIGS. 1-3, the utility model provides a chip testing mechanism, which comprises a conveyor belt 1, a feeding component 2 and a testing machine 3, wherein the feeding component 2 is arranged at one end of the conveyor belt 1, the testing machine 3 is arranged at the other end of the conveyor belt 1, sliding grooves 4 are arranged at two sides of the conveyor belt 1, a plurality of testing boards 5 are arranged in the feeding component 2, the testing machine 3 comprises a testing table 6, a testing board mounting groove 7 and a testing component 8, the testing component 8 is arranged on the testing table 6, the testing board mounting groove 7 is arranged at the upper part of the testing table 6, the testing board 5 is provided with a plurality of chip mounting holes, a plurality of testing devices are arranged at the bottom of the testing board mounting groove 7, when in testing, a testing chip is inserted into the testing board 5, and then the testing board 5 is arranged in the feeding component 2 for feeding, will survey test panel 5 through conveyer belt 1 and send into to surveying in panel 5 installation, later detect surveying the chip in panel 5 through the cooperation of test subassembly 8 and testboard 6, the utility model discloses but automatic feeding, and a plurality of chips of disposable detectable, the effectual detection efficiency who improves the chip.
In this embodiment, test assembly 8 includes central processing unit, the subassembly of making a video recording, voltage test module and display 9, make a video recording the subassembly voltage test module all with central processing unit electric connection, the test device with central processing unit electric connection, display 9 with central processing unit electric connection, the utility model discloses a voltage test module is used for the output voltage of test chip and will test the digit transmission to central processing unit, and the subassembly of making a video recording is shot and will be shot the photo of surveying the chip of surveying test panel 5 and send central processing unit to central processing unit, and central processing unit will accept the signal handle and compare rather than inside predetermined numerical value, then signal transmission through handling shows to display 9, makes things convenient for the inspector to learn the condition of being detected the chip.
In this embodiment, the chip testing machine 3 further includes an alarm 10, the alarm 10 is installed on the side portion of the testing table 6, the alarm 10 is electrically connected to the central processing unit, and when the central processing unit detects a defective product, the alarm 10 is started to alarm.
In this embodiment, material loading subassembly 2 is including pushing away actuating cylinder 11, drive actuating cylinder 12 and spacing 13, drive actuating cylinder 12 install in spacing 13 bottom, it is provided with tray 14 to drive on the actuating cylinder 12, material loading subassembly 2 install in on the tray 14, pushing away actuating cylinder 11 install in spacing 13 keeps away from the one end of conveyer belt 1, specifically, when the material loading, drive actuating cylinder 12 and will survey test panel 5 and upwards promote, pushing away actuating cylinder 11 will survey test panel 5 and promote conveyer belt 1, and the sliding tray 4 at conveyer belt 1 both ends is spacing to surveying test panel 5, prevents to survey test panel 5 at the in-process of material loading and appears turning on one's side, conveyer belt 1 adopts the drive of motor 15, motor 15 is step motor 15.
In this embodiment, the test device includes first socket subassembly 16 and second socket subassembly 17, second socket subassembly 17 superposes in above first socket subassembly 16, first socket subassembly 16 middle part with second socket subassembly 17 middle part is provided with probe 18, probe 18 with central processing unit electric connection, specifically, the utility model discloses the chip that detects has the pin, inserts the pin downwards when examining test panel 5 in, when examining, the pin of detecting the chip can insert first socket subassembly 16 middle part with second socket subassembly 17 middle part, contacts with probe 18, then carries out the circular telegram detection to the chip through test subassembly 8, sees whether the chip is in normal voltage value.
In this embodiment, in order to ensure the stability of the contact between the lead of the detection chip and the detection probes, the number of the detection probes 18 is four, and the four detection probes 18 are uniformly distributed at two ends of the middle of the first socket component 16 and two ends of the middle of the second socket component 17.
The above description is only for the preferred embodiment of the present invention, and the present invention is not limited to the above description, and although the present invention is disclosed in the preferred embodiment, it is not limited to the above description, and any person skilled in the art can make some changes or modifications to equivalent embodiments without departing from the scope of the present invention, but all the technical solutions of the present invention are within the scope of the present invention.

Claims (7)

1. A chip testing mechanism is characterized in that: the feeding assembly is arranged at one end of the conveying belt, the testing machine is mounted at the other end of the conveying belt, sliding grooves are formed in two sides of the conveying belt, a plurality of testing plates are arranged in the feeding assembly, the testing machine comprises a testing table, a testing plate mounting groove and a testing assembly, the testing assembly is mounted on the testing table, the testing plate mounting groove is formed in the upper portion of the testing table, a plurality of chip mounting holes are formed in the testing plate, and a plurality of testing devices are arranged at the bottom of the testing plate mounting groove.
2. The chip testing mechanism of claim 1, wherein: the testing component comprises a central processing unit, a camera shooting component, a voltage testing module and a display, the camera shooting component and the voltage testing module are electrically connected with the central processing unit, the testing device is electrically connected with the central processing unit, and the display is electrically connected with the central processing unit.
3. The chip testing mechanism of claim 2, wherein: the chip testing mechanism further comprises an alarm, the alarm is mounted on the side portion of the testing table and electrically connected with the central processing unit.
4. The chip testing mechanism of claim 1, wherein: the feeding assembly comprises a pushing cylinder, a driving cylinder and a limiting frame, the driving cylinder is installed at the bottom of the limiting frame, a tray is arranged on the driving cylinder, the feeding assembly is installed on the tray, and the pushing cylinder is installed at one end, far away from the conveying belt, of the limiting frame.
5. The chip testing mechanism of claim 1, wherein: the conveyer belt adopts motor drive, the motor is step motor.
6. The chip testing mechanism of claim 2, wherein: the testing device comprises a first socket assembly and a second socket assembly, the second socket assembly is overlapped on the first socket assembly, detection probes are arranged in the middle of the first socket assembly and the middle of the second socket assembly, and the detection probes are electrically connected with the central processing unit.
7. The chip testing mechanism of claim 6, wherein: the four detection probes are uniformly distributed at two ends of the middle of the first socket assembly and two ends of the middle of the second socket assembly.
CN202021485519.0U 2020-07-24 2020-07-24 Chip testing mechanism Active CN213122195U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021485519.0U CN213122195U (en) 2020-07-24 2020-07-24 Chip testing mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021485519.0U CN213122195U (en) 2020-07-24 2020-07-24 Chip testing mechanism

Publications (1)

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CN213122195U true CN213122195U (en) 2021-05-04

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CN202021485519.0U Active CN213122195U (en) 2020-07-24 2020-07-24 Chip testing mechanism

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113376092A (en) * 2021-06-10 2021-09-10 深圳市卓晶微智能机器人科技有限公司 Packaging detection equipment for semiconductor wafer after being pasted on substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113376092A (en) * 2021-06-10 2021-09-10 深圳市卓晶微智能机器人科技有限公司 Packaging detection equipment for semiconductor wafer after being pasted on substrate

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