ZA200700824B - Vertical crack forming method and vertical crack forming device in substrate - Google Patents

Vertical crack forming method and vertical crack forming device in substrate

Info

Publication number
ZA200700824B
ZA200700824B ZA200700824A ZA200700824A ZA200700824B ZA 200700824 B ZA200700824 B ZA 200700824B ZA 200700824 A ZA200700824 A ZA 200700824A ZA 200700824 A ZA200700824 A ZA 200700824A ZA 200700824 B ZA200700824 B ZA 200700824B
Authority
ZA
South Africa
Prior art keywords
vertical crack
crack forming
substrate
forming method
forming device
Prior art date
Application number
ZA200700824A
Other languages
English (en)
Inventor
Yamamoto Koji
Hasaka Noboru
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of ZA200700824B publication Critical patent/ZA200700824B/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
ZA200700824A 2004-07-30 2007-01-29 Vertical crack forming method and vertical crack forming device in substrate ZA200700824B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004247570 2004-07-30

Publications (1)

Publication Number Publication Date
ZA200700824B true ZA200700824B (en) 2009-05-27

Family

ID=35786352

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA200700824A ZA200700824B (en) 2004-07-30 2007-01-29 Vertical crack forming method and vertical crack forming device in substrate

Country Status (12)

Country Link
US (1) US7723212B2 (xx)
EP (1) EP1772245B1 (xx)
JP (1) JP4916312B2 (xx)
KR (1) KR101193874B1 (xx)
CN (1) CN101001729B (xx)
BR (1) BRPI0513669A (xx)
MX (1) MX2007001159A (xx)
RU (1) RU2007107398A (xx)
SG (1) SG156607A1 (xx)
TW (1) TW200607772A (xx)
WO (1) WO2006011608A1 (xx)
ZA (1) ZA200700824B (xx)

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JP5478957B2 (ja) * 2009-06-30 2014-04-23 三星ダイヤモンド工業株式会社 脆性材料基板の割断方法
JP5609870B2 (ja) * 2009-07-03 2014-10-22 旭硝子株式会社 脆性材料基板の割断方法及び割断装置並びにその割断方法により得られる車両用窓ガラス
US8932510B2 (en) * 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
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US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
US8720228B2 (en) * 2010-08-31 2014-05-13 Corning Incorporated Methods of separating strengthened glass substrates
TW201231421A (en) * 2010-11-30 2012-08-01 Corning Inc Methods for separating a sheet of brittle material
WO2013094059A1 (ja) * 2011-12-22 2013-06-27 三星ダイヤモンド工業株式会社 脆性材料基板の割断方法
CN104136967B (zh) 2012-02-28 2018-02-16 伊雷克托科学工业股份有限公司 用于分离增强玻璃的方法及装置及由该增强玻璃生产的物品
US9828278B2 (en) 2012-02-28 2017-11-28 Electro Scientific Industries, Inc. Method and apparatus for separation of strengthened glass and articles produced thereby
US10357850B2 (en) 2012-09-24 2019-07-23 Electro Scientific Industries, Inc. Method and apparatus for machining a workpiece
WO2013130608A1 (en) 2012-02-29 2013-09-06 Electro Scientific Industries, Inc. Methods and apparatus for machining strengthened glass and articles produced thereby
KR101479707B1 (ko) 2012-04-18 2015-01-07 이화여자대학교 산학협력단 크랙 제어에 의한 박막 패터닝 방법 및 그 박막 패터닝 구조물
JP5887403B2 (ja) * 2012-04-27 2016-03-16 並木精密宝石株式会社 複合基板の製造方法、半導体素子の製造方法、複合基板および半導体素子
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
US8975177B2 (en) * 2013-03-14 2015-03-10 Intel Corporation Laser resist removal for integrated circuit (IC) packaging
US9412702B2 (en) 2013-03-14 2016-08-09 Intel Corporation Laser die backside film removal for integrated circuit (IC) packaging
KR101523229B1 (ko) * 2013-11-28 2015-05-28 한국생산기술연구원 저온 특성이 향상된 금속 재료 및 그 제조방법
KR101606629B1 (ko) * 2014-03-31 2016-03-25 재단법인 포항금속소재산업진흥원 무기물 분말의 구형화 방법 및 장치
US9165832B1 (en) * 2014-06-30 2015-10-20 Applied Materials, Inc. Method of die singulation using laser ablation and induction of internal defects with a laser
CN104713898B (zh) * 2015-03-06 2017-06-30 中国科学院力学研究所 一种表面离散强化材料热疲劳性能的激光测试方法及装置
JP6544149B2 (ja) * 2015-08-31 2019-07-17 三星ダイヤモンド工業株式会社 脆性材料基板における傾斜クラックの形成方法および脆性材料基板の分断方法
US10442720B2 (en) * 2015-10-01 2019-10-15 AGC Inc. Method of forming hole in glass substrate by using pulsed laser, and method of producing glass substrate provided with hole
KR102176869B1 (ko) * 2018-07-30 2020-11-11 주식회사 탑 엔지니어링 기판 가공 장치 및 기판 가공 방법
CN109163978B (zh) * 2018-09-03 2021-01-29 中国石油天然气集团有限公司 低温输气钢管承压能力及韧脆转变行为全尺寸试验方法
TWI681241B (zh) * 2018-12-04 2020-01-01 友達光電股份有限公司 顯示裝置製作方法及使用該方法製作的顯示裝置
CN112725719B (zh) * 2020-10-21 2022-05-20 西安交通大学 一种陶瓷防护涂层及其制备方法
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Also Published As

Publication number Publication date
SG156607A1 (en) 2009-11-26
CN101001729A (zh) 2007-07-18
EP1772245B1 (en) 2014-05-07
JPWO2006011608A1 (ja) 2008-05-01
EP1772245A4 (en) 2011-02-02
MX2007001159A (es) 2007-09-25
BRPI0513669A (pt) 2008-05-13
KR20070043866A (ko) 2007-04-25
TWI378904B (xx) 2012-12-11
US20080194079A1 (en) 2008-08-14
KR101193874B1 (ko) 2012-10-26
RU2007107398A (ru) 2008-09-10
TW200607772A (en) 2006-03-01
JP4916312B2 (ja) 2012-04-11
EP1772245A1 (en) 2007-04-11
US7723212B2 (en) 2010-05-25
WO2006011608A1 (ja) 2006-02-02
CN101001729B (zh) 2011-03-23

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