WO2025123710A1 - 壳体的制备方法、壳体和电子设备 - Google Patents

壳体的制备方法、壳体和电子设备 Download PDF

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Publication number
WO2025123710A1
WO2025123710A1 PCT/CN2024/109742 CN2024109742W WO2025123710A1 WO 2025123710 A1 WO2025123710 A1 WO 2025123710A1 CN 2024109742 W CN2024109742 W CN 2024109742W WO 2025123710 A1 WO2025123710 A1 WO 2025123710A1
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WO
WIPO (PCT)
Prior art keywords
metal
layer
shell
dense
appearance
Prior art date
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Pending
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PCT/CN2024/109742
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English (en)
French (fr)
Inventor
张少辉
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Honor Device Co Ltd
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Honor Device Co Ltd
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Filing date
Publication date
Application filed by Honor Device Co Ltd filed Critical Honor Device Co Ltd
Priority to CN202480051982.9A priority Critical patent/CN121753485A/zh
Publication of WO2025123710A1 publication Critical patent/WO2025123710A1/zh
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
    • B21J5/00—Methods for forging, hammering, or pressing; Special equipment or accessories therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/04—Metal casings

Definitions

  • the present application relates to the technical field of electronic equipment, and in particular to a method for preparing a shell, a shell and an electronic device.
  • holes are usually formed on the outer surface of the housing of the electronic devices due to process problems, making the surface structure of the housing loose. It is usually necessary to use a filling material to fill the holes on the outer surface of the housing using a putty process to make the outer surface of the housing have a better appearance.
  • the housing and the filling material are made of different materials, it is easy to cause poor adhesion of the filling material on the housing, and the surface consistency of the housing is poor.
  • the purpose of the embodiments of the present application is to provide a method for preparing a shell, a shell and an electronic device.
  • the shell obtained by the preparation method does not require filling materials and has good surface consistency of the shell.
  • the present application provides a method for preparing a shell, and the method for preparing a shell includes:
  • a metal casting is provided, the metal casting comprises a metal matrix and a metal outer layer, the metal outer layer is located outside the metal matrix and is adjacent to the metal matrix, and holes are formed in the metal outer layer;
  • the portion of the metal outer layer that is away from the metal matrix is subjected to hot deformation forging to obtain a dense metal layer.
  • the part of the metal outer layer in the metal casting that is away from the metal matrix is processed by hot deformation forging, and the material in the part of the metal outer layer in the metal casting that is away from the metal matrix is micro-flowed by means of heating and deformation, that is, the part close to the outer surface of the metal casting is micro-flowed, and the structure in the part of the metal outer layer that is away from the metal matrix is homogenized after the flow, and a metal dense layer is formed.
  • the holes of the metal dense layer formed by hot deformation forging are closed, and the prepared shell does not need to be filled with soil, which is conducive to improving the surface consistency of the shell.
  • multiple filling and grinding links are omitted, and the manufacturing process is simple and low in cost.
  • the structural strength of the shell is improved.
  • the step of hot-deforming and forging the portion of the metal outer layer away from the metal substrate to obtain the metal dense layer includes:
  • the excess metal layer is removed to obtain the shell.
  • the outer surface of the shell is facilitated to achieve a hole-free appearance, thereby facilitating an improvement in the appearance of the shell.
  • the thickness of the metal residue layer is ⁇ H, and ⁇ H is 0.3 mm to 0.5 mm.
  • the shell further includes an appearance layer
  • the method for preparing the shell further includes: preparing the appearance layer on the outer surface of the dense layer.
  • the temperature of hot deformation forging is 200°C to 300°C.
  • An embodiment of the present application also provides a shell, which includes a metal substrate, a metal dense layer and a metal adjacent layer.
  • the metal dense layer is located on the outside of the metal substrate and is spaced apart from the metal substrate.
  • the metal adjacent layer is fixedly connected between the metal substrate and the metal dense layer. Holes are formed in the metal dense layer and the metal adjacent layer. The porosity of the metal dense layer is smaller than the porosity of the metal adjacent layer.
  • a metal dense layer is arranged on the outside of the metal substrate, and the porosity of the metal dense layer is less than the porosity of the metal adjacent layer, so that the surface structure of the metal dense layer is dense, the holes on the outer surface of the metal dense layer are small or even non-existent, and the metal dense layer does not need to be filled with filling materials, thereby avoiding the existing problem of needing to additionally fill the holes on the outer surface of the shell with filling materials, thereby avoiding the problem of the filling material having poor adhesion on the shell and being easy to fall off.
  • the outer surface of the metal dense layer does not need to be filled with filling materials, the outer surface of the metal dense layer has better consistency, which is conducive to improving the appearance of the shell.
  • the porosity of the metal dense layer is ⁇ 5%.
  • the diameter of the holes in the dense metal layer is ⁇ 50 ⁇ m.
  • the thickness of the dense metal layer is D, and D is 0.3 mm to 0.5 mm.
  • the shell further includes an appearance layer, which is disposed on the outer surface of the metal dense layer.
  • the appearance layer is provided to decorate the surface gloss, color, etc. of the shell.
  • An embodiment of the present application also provides an electronic device, including a functional module and a housing as described above, wherein the functional module is installed in the housing.
  • the shell is a middle frame
  • the electronic device further includes a back cover, which is mounted on the middle frame.
  • FIG1 is a schematic diagram of a top view of an electronic device provided in an embodiment of the present application.
  • FIG2 is a schematic cross-sectional view of a partial structure of a housing in the electronic device shown in FIG1 ;
  • FIG3 is a schematic diagram of a process for preparing a housing of the electronic device shown in FIG2 ;
  • FIG4 is a schematic diagram of the cross-sectional structure of a casting mold for forming a metal casting in the preparation process shown in FIG3 ;
  • FIG5 is a schematic diagram of the cross-sectional structure of a metal casting formed in the preparation process shown in FIG3;
  • FIG6 is a schematic diagram showing the changes of the metal substrate formed by hot deformation and forging in the A portion of the metal casting shown in FIG5 ;
  • FIG. 7 is a schematic diagram showing the changes in removing the metal surplus layer and preparing the appearance layer of the metal casting after hot deformation forging shown in FIG. 6 .
  • FIG. 1 is a schematic diagram of a top view of an electronic device 1 provided in an embodiment of the present application.
  • the electronic device 1 includes a functional module 100 and a housing 300, wherein the functional module 100 is installed in the housing 300.
  • the electronic device 1 may be a mobile phone, a tablet computer, a computer (Personal Computer, PC) or a wearable device.
  • the wearable device includes a watch or a bracelet.
  • the functional module 100 may be a display screen of the electronic device 1
  • the housing 300 may be a middle frame of the electronic device 1.
  • the electronic device 1 is a mobile phone
  • the functional module 100 is a display screen of the mobile phone
  • the housing 300 is a middle frame of the mobile phone.
  • the electronic device 1 also includes a back cover, which is mounted on the middle frame.
  • FIG. 2 is a cross-sectional schematic diagram of a partial structure of the housing 300 of the electronic device 1 shown in FIG. 1 .
  • the housing 300 includes a metal substrate 10 and an appearance layer 30, wherein the appearance layer 30 is attached to the outer surface of the metal substrate 10.
  • the "metal" referred to in the embodiment of the present application includes pure metal and metal alloy.
  • the material of the metal substrate 10 can be magnesium alloy or aluminum alloy.
  • the outer surface of the metal substrate 10 includes an appearance surface 101 and a non-appearance surface 102.
  • the non-appearance surface 102 is connected to the appearance surface 101.
  • the appearance surface 101 of the metal substrate 10 refers to the outer surface of the metal substrate 10 that can be observed by the user in the assembled electronic device 1
  • the non-appearance surface 102 refers to the outer surface of the metal substrate 10 that is not observed by the user in the assembled electronic device 1.
  • the metal substrate 10 includes a metal dense layer 11, a metal adjacent layer 13 and a metal matrix 15 in sequence.
  • the metal adjacent layer 13 is connected between the metal dense layer 11 and the metal matrix 15 to achieve the metal adjacent layer 13 adjacent to the metal dense layer 11, and is located on the side of the metal dense layer 11 away from the outside of the metal substrate 10.
  • the outer surface of the metal dense layer 11 is the outer surface of the metal substrate 10, and the outer surface of the metal dense layer 11 includes the appearance surface 101.
  • holes 103 are formed in the metal dense layer 11 and the metal adjacent layer 13. There are basically no holes 103 in the metal matrix 15. In this embodiment, the hole diameter of the hole 103 in the metal dense layer 11 is ⁇ 50 ⁇ m.
  • the thickness of the metal dense layer 11 from the appearance surface 101 of the metal substrate 10 and in the direction away from the outside of the metal substrate 10 is D.
  • D is 0.3 mm to 0.5 mm.
  • the thickness of the metal dense layer 11 is measured as follows: as shown in FIG2 , the metal substrate 10 is cut into a cross-section tangential method slice in a direction perpendicular to the appearance surface 101, the boundary is simulated in the area with the hole 103, the boundary line between the metal dense layer 11 and the metal adjacent layer 13 is drawn, and the distance between the boundary line between the metal dense layer 11 and the metal adjacent layer 13 and the cross-section line of the appearance surface 101 is measured as the thickness D of the metal dense layer 11.
  • the metal dense layer 11, the metal adjacent layer 13 and the metal matrix 15 are made of the same material, the porosity of the metal dense layer 11 is greater than the porosity of the metal matrix 15, and the porosity of the metal dense layer 11 is less than the porosity of the metal adjacent layer 13. In this embodiment, the porosity of the metal dense layer 11 is ⁇ 5%.
  • the calculation method of "the porosity of the metal dense layer 11" is: according to the above measurement method, the boundary line between the drawn metal dense layer 11 and the metal adjacent layer 13 is A metal dense layer 11 region is formed between the section lines of the appearance surface 101.
  • the total area of the metal dense layer 11 region is S1
  • the area of a single hole 103 is S11
  • the number of holes 103 is N1
  • the calculation method of "the porosity of the metal adjacent layer 13" is as follows: according to the above measurement method, the boundary line between the metal adjacent layer 13 and the metal substrate 15 is drawn, and the metal adjacent layer 13 region is formed from the boundary line between the metal dense layer 11 and the metal adjacent layer 13 to the boundary line between the metal adjacent layer 13 and the metal substrate 15.
  • the total area of the region of the metal adjacent layer 13 is S2
  • the area of a single hole 103 is S22
  • the number of holes 103 is N2
  • the appearance layer 30 is attached to the outer surface of the metal dense layer 11, that is, attached to the surface of the metal dense layer 11 away from the metal adjacent layer 13, so that the appearance layer 30 is attached to the appearance surface 101 of the metal substrate 10, thereby realizing that the appearance layer 30 is attached to the outer surface of the metal substrate 10.
  • the appearance layer 30 can be used for decorative effects such as surface gloss and color of the shell 300.
  • the appearance layer 30 can be an organic resin appearance layer.
  • the appearance layer 30 may include a primer layer, a mid-paint layer and a top-paint layer, the primer layer is attached to the outer surface of the metal dense layer 11, the mid-paint layer is attached to the surface of the primer layer away from the metal dense layer 11, and the top-paint layer is attached to the surface of the mid-paint layer away from the primer layer.
  • the surface structure of the metal dense layer 11 is dense, the holes on the outer surface of the metal dense layer 11 are small or even have no holes, and the metal dense layer 11 does not need to be filled with filling materials, thereby avoiding the existing problem of needing to additionally fill the holes on the outer surface of the shell 300 with filling materials, thereby avoiding the problem of the filling material being easy to fall off due to poor adhesion on the shell 300.
  • the outer surface of the metal dense layer 11 since the outer surface of the metal dense layer 11 does not need to be filled with filling materials, the outer surface of the metal dense layer 11 has better consistency, which is conducive to improving the appearance of the shell 300.
  • FIG. 3 is a schematic diagram of the preparation process of the housing 300 in the electronic device 1 shown in FIG. 2 .
  • the present application also provides a method for preparing the housing 300, including:
  • FIG. 4 is a schematic diagram of the cross-sectional structure of a casting mold 120 for casting the metal casting 110 in the preparation process shown in Figure 3.
  • the casting mold 120 which is provided with a cavity 121, a first opening 123 and a second opening 125.
  • the cavity 121 is arranged on the inner side of the casting mold 120, and the first opening 123 and the second opening 125 are both connected to the cavity 121.
  • Molten metal raw material is poured into the cavity 121 from the first opening 123, and excess molten metal raw material can overflow from the second opening 125.
  • the molten metal raw material fills the entire cavity 121, and is cooled in the cavity 121 to form the metal casting 110.
  • FIG. 5 is a schematic diagram of the cross-sectional structure of the metal casting 110 formed in the preparation process shown in FIG.
  • the metal outer layer 12 faces the outer side of the metal casting 110, and a hole 103 is formed in the metal outer layer 12.
  • the thickness of the metal outer layer 12 is W.
  • the measurement of the thickness W of the metal outer layer 12 can refer to the measurement method of the thickness of the metal dense layer 11.
  • the metal outer surface layer 12 includes a surface layer 124 and a metal adjacent layer 13.
  • the surface layer 124 faces the outer side of the metal casting 110, and the metal adjacent layer 13 is connected between the surface layer 124 and the metal substrate 15 to achieve the metal adjacent layer 13 adjacent to the surface layer 124, and is located on the side of the surface layer 124 away from the outer surface of the metal casting 110.
  • the surface layer 124 and the metal adjacent layer 13 are composed of the same material, and a plurality of holes 103 are formed in the surface layer 124 and the metal adjacent layer 13.
  • the boundary between the surface layer 124 and the metal adjacent layer 13 in the metal outer layer 12 is not obvious, and the multiple holes 103 in the metal outer layer 12 are uneven in size and are irregularly distributed in the area between the surface layer 124 and the metal adjacent layer 13.
  • FIG. 6 is a schematic diagram of the change of the part A in the metal casting 110 shown in FIG. 5 during the hot deformation forging to form the metal substrate 10.
  • the surface layer 124 in the metal outer layer 12 is subjected to hot deformation forging, and the surface layer 124 is extruded to form a metal dense layer 11, so as to realize the preparation of the metal substrate 10 by hot deformation forging of the metal casting 110.
  • the surface layer 124 is heated and deformed, and the surface layer 124 is extruded to form a metal dense layer 11, and the material of the surface layer 124 in the metal outer layer 12 flows micro-flow, and after the flow, the outer surface of the metal casting 110 and the holes 103 in the surface layer 124 will be closed, while the holes 103 in the metal adjacent layer 13 are basically unchanged, so that the porosity of the metal dense layer 11 is less than the porosity of the metal adjacent layer 13.
  • the temperature of hot deformation forging is 200° C. to 300° C.
  • the deformation amount of the metal dense layer 11 relative to the surface layer 124 in the thickness direction is ⁇ W, and ⁇ W is 0.3mm-0.5mm, that is, the deformation amount of the metal substrate 10 relative to the metal casting 110 in the thickness direction of the surface layer 124 ⁇ W is 0.3mm-0.5mm.
  • the outer surface of the metal casting 110 includes a surface to be treated, and the metal casting 110 is pressed during the hot deformation forging process to form a metal hot deformation layer 126 on the surface layer 124 through hot deformation forging, and the surface to be treated of the metal casting 110 is formed as the appearance surface 101 of the metal substrate 10.
  • the thickness of the metal outer surface layer 12 can be 0.5mm-1.0mm, that is, the thickness of the portion of the metal casting 110 close to the surface to be treated of the metal casting 110 is 0.5mm-1.0mm.
  • the metal thermal deformation layer 126 includes a metal dense layer 11 and a metal surplus layer 17 .
  • the metal dense layer 11 is connected between the metal adjacent layer 13 and the metal surplus layer 17 .
  • the metal surplus layer 17 is located outside the metal dense layer 11 .
  • FIG. 7 is a schematic diagram showing the changes in removing the metal surplus layer 17 and preparing the appearance layer 30 of the metal casting 110 after hot deformation forging shown in FIG. 6 .
  • the metal surplus layer 17 in the metal heat deformation layer 126 is removed along the thickness direction of the metal heat deformation layer 126 by CNC (Computerized Numerical Control) processing.
  • the thickness of the metal surplus layer 17 is ⁇ H
  • ⁇ H is 0.3mm-0.5mm
  • the thickness of the metal dense layer 11 is D.
  • the appearance layer 30 can be prepared by spraying or physical vapor deposition (PVD).
  • PVD physical vapor deposition
  • the polished metal substrate 10 can also be subjected to sandblasting anodizing surface treatment to improve the adhesion of the appearance layer 30 to the outer surface of the metal dense layer 11 of the metal substrate 10, and at the same time, it can also improve the corrosion resistance and aesthetics of the metal substrate 10.
  • the shell 300 prepared in the embodiment of the present application is taken as a simulated sample, and after simulation, the reliability of the shell 300 in terms of bending resistance and drop resistance meets the requirements.
  • the existing method of preparing the metal casting 110 is mainly CNC (Computerized Numerical Control) processing, which takes a long time and has a high processing cost.
  • the embodiment of the present application provides a method for preparing a housing 300, which provides the metal casting 110 by casting. Compared with the method of preparing the metal casting 110 by CNC processing, the casting time is short and the cost is lower.
  • the metal casting 110 will form holes 103 on the outer surface, thereby affecting the appearance of the metal casting 110, and further affecting the appearance of the housing 300.
  • the metal casting 110 needs to be firstly processed by CNC, and then the outer surface of the metal casting 110 needs to be polished, and then the holes 103 on the outer surface of the metal casting 110 are filled with filling materials using a filling process, and the filling materials are baked to solidify, and then the outer surface of the metal casting 110 is polished again, and then the above-mentioned filling, baking and polishing steps are repeated until the appearance of the metal casting 110 is qualified.
  • the appearance layer 30 is coated on the outer surface of the metal casting 110 to prepare the housing 300.
  • the metal casting 110 is exposed.
  • the crystal structure of the metal casting 110 is exposed by HF acid corrosion.
  • the position of the filler can be clearly observed on the surface of the metal casting 110, and there is a clear boundary between the position of the filler and the position without the filler.
  • the surface consistency of the shell 300 is poor, the appearance is uneven, the manufacturing process is long, the appearance needs to be polished, filled and baked multiple times, the yield is low, and the preparation cost is high.
  • the method for preparing the shell 300 provided in the embodiment of the present application is to perform hot deformation forging on the portion of the metal outer surface layer 12 in the metal casting 110 that is away from the metal substrate 15, and to cause micro-flow of the material in the portion of the metal outer surface layer 12 in the metal casting 110 that is away from the metal substrate 15 by means of heating and deformation, that is, micro-flow occurs in the portion of the metal casting 110 close to the outer surface, and after the flow, the structure in the portion of the metal outer surface layer 12 that is away from the metal substrate 15 is homogenized, and a metal dense layer 11 is formed.
  • the outer surface of the metal casting 110 and some of the holes 103 in the metal outer surface layer 12 are closed, so as to achieve the closure of the holes 103 on the outer surface of the prepared metal dense layer 11, and the porosity of the prepared metal dense layer 11 is low, which is conducive to improving the appearance effect of the prepared metal substrate 10, and further to improving the appearance effect of the shell 300.
  • the holes 103 of the metal dense layer 11 formed by hot deformation forging are closed, and the prepared shell 300 does not need to be put into soil, which improves the surface consistency of the metal substrate 10, thereby facilitating the improvement of the surface consistency of the shell 300.
  • the manufacturing process is simple and low in cost.
  • the structural strength of the metal substrate 10 can also be improved, thereby facilitating the improvement of the structural strength of the shell 300.
  • the metal outer layer 12 of the metal casting 110 of the embodiment of the present application the portion of the metal outer layer 12 away from the metal substrate 15 is extruded to form a metal dense layer 11, and a more stable gripping force can be formed between the metal dense layer 11 and the appearance layer 30, and the metal dense layer 11 can be more stable. It shows better wear resistance and resistance to the appearance layer 30 falling off, which is beneficial to improving the bonding ability between the metal substrate 10 and the appearance layer 30, thereby helping to improve the appearance effect of the shell 300.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Forging (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

本申请提供一种壳体的制备方法、壳体和电子设备，壳体的制备方法包括：提供一金属铸件，金属铸件包括金属基体和金属外表层，金属外表层位于金属基体的外侧，且与金属基体邻接，金属外表层中形成有孔洞；对金属外表层背离金属基体的部分进行热变形锻压，得到金属致密层。利用该制备方法得到的壳体不需要填补材料，壳体的表面一致性较好。

Description

壳体的制备方法、壳体和电子设备
本申请要求于2023年12月14日提交中国专利局、申请号为202311719664.9、申请名称为“壳体的制备方法、壳体和电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子设备技术领域，尤其涉及一种壳体的制备方法、壳体和电子设备。
背景技术
目前市场上的电子设备中，通常会因工艺问题在电子设备的壳体的外表面形成孔洞，使得壳体的表面结构疏松。现有通常需要利用补土工艺使用填补材料对壳体的外表面的孔洞进行填充，以使得壳体的外观面具有较好的外观效果。但由于壳体与填补材料为不同的材料，容易导致填补材料在壳体上的附着力差，壳体的表面一致性较差。
发明内容
本申请实施例的目的是提供一种壳体的制备方法、壳体和电子设备，利用该制备方法得到的壳体不需要填补材料，壳体的表面一致性较好。
本申请实施例提供一种壳体的制备方法，壳体的制备方法包括：
提供一金属铸件，金属铸件包括金属基体和金属外表层，金属外表层位于金属基体的外侧，且与金属基体邻接，金属外表层中形成有孔洞；
对金属外表层背离金属基体的部分进行热变形锻压，得到金属致密层。
本申请实施例提供的壳体的制备方法中，通过对金属铸件中金属外表层中背离金属基体的部分进行热变形锻压进行处理，利用加热变形的方式，使得金属铸件中金属外表层背离金属基体的部分中的材料发生微流动，即金属铸件中靠近外表面的部分发生微流动，流动后金属外表层背离金属基体的部分中的组织均匀化，并形成金属致密层。此时，在热变形锻压过程中，金属铸件的外表面及金属外表层中的部分孔洞闭合，以实现制备得到的金属致密层的外表面的孔洞闭合，得到的金属致密层的孔隙率较低，从而利于提升壳体的外观效果。本申请实施例提供的壳体的制备方法中，经热变形锻压形成的金属致密层的孔洞发生闭合，制备得到的壳体无需进行补土工艺，利于提升壳体的表面一致性，同时相较于上述传统工艺省去了多次补土和打磨的环节，制造工艺简单，成本低。此外，通过将金属外表层背离金属基体的部分通过热变形锻压形成金属致密层，利于提升壳体的结构强度。
在一种可能的实施方式中，在对金属外表层背离金属基体的部分进行热变形锻压，得到金属致密层的步骤中，包括：
对金属外表层背离金属基体的部分进行热变形锻压，得到金属热变形层，其中，金属热变形层包括金属致密层和金属余量层，金属余量层位于金属致密层的外侧；
去除金属余量层，得到壳体。通过去除金属余量层，利于实现壳体的外表面无孔洞的外观效果，从而利于提升壳体的外观效果。
在一种可能的实施方式中，金属余量层的厚度为△H，△H为0.3mm～0.5mm。
在一种可能的实施方式中，壳体还包括外观层，壳体的制备方法还包括：在致密层的外表面上制备外观层。相较于外观层直接附着于金属铸件的外表面的方式，金属致密层与外观层之间能够形成更稳定的抓接力，且金属致密层能够表现出更好的耐磨和抗外观层脱落的能力，利于提升金属致密层与外观层的结合能力，从而利于提升壳体的外观效果。
在一种可能的实施方式中，热变形锻压的温度为200℃～300℃。
本申请实施例还提供一种壳体，壳体包括金属基体、金属致密层和金属邻接层，金属致密层位于金属基体的外侧，且与金属基体间隔设置，金属邻接层固定连接于金属基体和金属致密层之间，金属致密层和金属邻接层中均形成有孔洞，金属致密层的孔隙率小于金属邻接层的孔隙率。
本申请实施例提供的壳体中，通过在金属基体的外侧设置金属致密层，且金属致密层的孔隙率小于金属邻接层的孔隙率，使得金属致密层的表面结构致密，金属致密层的外表面的孔洞较小甚至没有孔洞，不需要对金属致密层进行填充填补材料，避免了现有需要额外在壳体的外表面的孔洞中进行填充填补材料的问题，从而避免了填补材料在壳体上的附着力差而导致容易脱落的问题。同时，由于金属致密层的外表面不需要进行填充填补材料，使得金属致密层的外表面一致性较好，从而利于提升壳体的外观效果。
在一种可能的实施方式中，金属致密层的孔隙率≤5％。
在一种可能的实施方式中，金属致密层的孔洞的孔直径≤50μm。
在一种可能的实施方式中，金属致密层的厚度为D，D为0.3mm～0.5mm。
在一种可能的实施方式中，壳体还包括外观层，外观层设置于金属致密层的外表面。通过设置外观层，以对壳体的表面光泽度、颜色等进行装饰。
本申请实施例还提供一种电子设备，包括功能模组和如上述的壳体，功能模组安装于壳体。
在一种可能的实施方式中，壳体为中框，电子设备还包括后盖，后盖安装于中框。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的电子设备的俯视结构示意图；
图2为图1所示电子设备中壳体的部分结构的截面示意图；
图3为图2所示电子设备中壳体的制备流程示意图；
图4为图3所示制备流程中铸造形成金属铸件的铸造模具的截面结构示意图；
图5为图3所示制备流程中成型的金属铸件的截面结构示意图；
图6为图5所示金属铸件中A部分在热变形锻压形成金属基材的变化示意图；
图7为图6所示经热变形锻压后的金属铸件去除金属余量层和制备外观层的变化示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
请参阅图1，图1为本申请实施例提供的电子设备1的俯视结构示意图。
电子设备1包括功能模组100和壳体300，功能模组100安装于壳体300。其中，电子设备1可以是手机、平板电脑、计算机(Personal Computer，PC)或可穿戴设备等设备。可穿戴设备包括手表或手环等设备。示例性的，功能模组100可以为电子设备1的显示屏，壳体300可以为电子设备1的中框。
本实施例中，以电子设备1为手机，功能模组100为手机的显示屏，壳体300为手机的中框进行示例说明。其中，电子设备1还包括后盖，后盖安装于中框。
参阅图2，图2为图1所示电子设备1中壳体300的部分结构的截面示意图。
壳体300包括金属基材10和外观层30，外观层30附着于金属基材10的外表面。其中，本申请实施例中涉及的“金属”包括纯金属和金属合金。示例性的，金属基材10的材质可以为镁合金或铝合金。
具体的，金属基材10的外表面包括外观面101和非外观面102。非外观面102与外观面101连接。其中，金属基材10的外观面101是指金属基材10在组装的电子设备1中能够被用户观察到的外表面，非外观面102是指金属基材10在组装的电子设备1中不被用户观察到的外表面。
自金属基材10的外观面101且背离金属基材10的外侧的方向，金属基材10依次包括金属致密层11、金属邻接层13和金属基体15。金属邻接层13连接于金属致密层11与金属基体15之间，以实现金属邻接层13与金属致密层11邻接，且位于金属致密层11背离金属基材10的外侧的一侧。具体的，金属致密层11的外表面即为金属基材10的外表面，金属致密层11的外表面包括外观面101。其中，金属致密层11和金属邻接层13中均形成有孔洞103。金属基体15中大致没有孔洞103。本实施例中，金属致密层11中孔洞103的孔直径≤50μm。
自金属基材10的外观面101且沿背离金属基材10的外侧的方向，金属致密层11的厚度为D。示例性的，D为0.3mm～0.5mm。其中，金属致密层11的厚度的测量方法为：如图2所示，沿垂直于外观面101的方向对金属基材10做断面切向法片，在具有孔洞103的区域模拟边界，绘制出金属致密层11与金属邻接层13之间的边界线，测量金属致密层11与金属邻接层13之间的边界线和外观面101的断面线之间的距离即为金属致密层11的厚度D。
本实施例中，金属致密层11、金属邻接层13和金属基体15为相同材质，金属致密层11的孔隙率大于所述金属基体15的孔隙率，且金属致密层11的孔隙率小于金属邻接层13的孔隙率。本实施例中，金属致密层11的孔隙率≤5％。其中，“金属致密层11的孔隙率”计算方式为：按照上述测量方法，绘制的金属致密层11与金属邻接层13之间的边界线到 外观面101的断面线之间形成金属致密层11区域，在金属致密层11的区域内，金属致密层11的区域的总面积为S1，单个孔洞103的面积为S11，孔洞103的个数为N1，金属致密层11的孔隙率＝金属致密层11区域内孔洞103的面积*孔洞103的个数/金属致密层11区域的总面积＝S11*N1/S1。
类似的，“金属邻接层13的孔隙率”的计算方式为：按照上述测量方法，绘制出金属邻接层13与金属基体15之间的边界线，金属致密层11与金属邻接层13之间的边界线到金属邻接层13与金属基体15之间的边界线之间形成金属邻接层13区域。在金属邻接层13的区域内，金属邻接层13的区域的总面积为S2，单个孔洞103的面积为S22，孔洞103的个数为N2，金属邻接层13的孔隙率＝金属邻接层13区域内孔洞103的面积*孔洞103的个数/金属邻接层13区域的总面积＝S22*N2/S2。
外观层30附着于金属致密层11的外表面，也即附着于金属致密层11背离金属邻接层13的表面，以实现外观层30附着于金属基材10的外观面101，从而实现外观层30附着于金属基材10的外表面。其中，外观层30可以用于壳体300的表面光泽度、颜色等装饰作用。示例性的，外观层30可以为有机树脂外观层。本实施例中，外观层30可以包括底漆层、中漆层和面漆层，底漆层附着于金属致密层11的外表面，中漆层附着于底漆层背离金属致密层11的表面，面漆层附着于中漆层背离底漆层的表面。
本申请实施例提供的壳体300中，通过在金属基体15的外侧设置金属致密层11，且金属致密层11的孔隙率小于金属邻接层13的孔隙率，使得金属致密层11的表面结构致密，金属致密层11的外表面的孔洞较小甚至没有孔洞，不需要对金属致密层11进行填充填补材料，避免了现有需要额外在壳体300的外表面的孔洞中进行填充填补材料的问题，从而避免了填补材料在壳体300上的附着力差而导致容易脱落的问题。同时，由于金属致密层11的外表面不需要进行填充填补材料，使得金属致密层11的外表面一致性较好，从而利于提升壳体300的外观效果。
参阅图3，图3为图2所示电子设备1中壳体300的制备流程示意图。
本申请实施例还提供一种上述壳体300的制备方法，包括：
S1、提供一金属铸件110。具体的，参阅图4，图4为图3所示制备流程中铸造形成金属铸件110的铸造模具120的截面结构示意图。取铸造模具120，铸造模具120设有空腔121、第一开口123和第二开口125。空腔121设于铸造模具120的内侧，第一开口123和第二开口125均与空腔121连通。从第一开口123往空腔121内浇注熔融的金属原料，多余的熔融的金属原料可从第二开口125处溢出，熔融的金属原料填充满整个空腔121，并在空腔121内冷却成型为金属铸件110。
金属铸件110在铸造过程中，一方面由于第一开口123和第二开口125与金属铸件110的外表面接触，气体容易从第一开口123和第二开口125进入金属铸件110靠近外观面的部分(如图5所示金属铸件110中的金属外表层12)中，从而容易造成铸造完成后的金属铸件110的外观面以及靠近外观面的部分中形成孔洞103(参见图5)。另一方面，金属铸件110的金属原料中含有的部分物质在高温状态下能够气化，也会使得金属铸件110的外观面以及靠近外观面的部分中形成孔洞103(参见图5)。
结合参阅图5，图5为图3所示制备流程中成型的金属铸件110的截面结构示意图。自 金属铸件110的外表面且背离金属铸件110的外侧的方向，金属铸件110依次包括金属外表层12和与金属外表层12邻接的金属基体15。其中，金属外表层12朝向金属铸件110的外侧，且金属外表层12中形成有孔洞103。示例性的，金属外表层12的厚度为W。其中，金属外表层12的厚度W的测量可参照上述金属致密层11的厚度的测量方式。
S2、对金属外表层12背离金属基体15的部分进行热变形锻压，得到金属致密层11。本实施例中，金属铸件110经热变形锻压得到金属基材10。具体的，继续参阅图5，自金属铸件110的外表面且沿背离金属铸件110的外侧的方向，金属外表层12包括表层124和金属邻接层13。表层124朝向金属铸件110的外侧，金属邻接层13连接于表层124与金属基体15之间，以实现金属邻接层13与表层124邻接，且位于表层124背离金属铸件110的外表面的一侧。其中，表层124和金属邻接层13由相同材质构成，表层124和金属邻接层13中均形成有多个孔洞103。在对金属铸件110中金属外表层12进行热变形锻压之前，金属外表层12中表层124和金属邻接层13的分界并不明显，金属外表层12中的多个孔洞103大小不均，且无规则地分布于表层124和金属邻接层13中的区域。
结合参阅图6，图6为图5所示金属铸件110中A部分在热变形锻压形成金属基材10的变化示意图。对金属外表层12中的表层124进行热变形锻压，表层124被挤压形成金属致密层11，以实现对金属铸件110进行热变形锻压制备得到金属基材10。具体的，在金属铸件110在热变形锻压过程中，通过对表层124进行加热变形的方式，表层124被挤压形成金属致密层11，金属外表层12中表层124的材料发生微流动，流动后金属铸件110的外表面及表层124中的孔洞103会发生闭合，而金属邻接层13中的孔洞103基本未发生变化，从而实现金属致密层11的孔隙率小于金属邻接层13的孔隙率。示例性的，热变形锻压的温度为200℃～300℃。金属铸件110在热变形锻压后，金属致密层11相对表层124在厚度方向的变形量为△W，△W为0.3mm～0.5mm，也即金属基材10相对金属铸件110在表层124厚度方向的变形量△W为0.3mm～0.5mm。本实施例中，金属铸件110的外表面包括待处理面，金属铸件110在热变形锻压过程中，挤压待处理面，以使得表层124经热变形锻压形成金属热变形层126，金属铸件110的待处理面形成为金属基材10的外观面101。示例性的，金属铸件110在热变形锻压前，金属外表层12的厚度可以为0.5mm～1.0mm，也即在金属铸件110靠近金属铸件110待处理面的部分的厚度为0.5mm～1.0mm。其中，金属热变形层126包括金属致密层11和金属余量层17，金属致密层11连接于金属邻接层13与金属余量层17之间，金属余量层17位于金属致密层11的外侧。
结合参阅图7，图7为图6所示经热变形锻压后的金属铸件110去除金属余量层17和制备外观层30的变化示意图。
S3、去除金属余量层17，得到壳体300。本实施例中，采用CNC(Computerized Numerical Control，计算机数字化控制)加工的方式,沿金属热变形层126的厚度方向去除金属热变形层126中的金属余量层17。示例性的，金属余量层17的厚度为△H，△H为0.3mm～0.5mm，去除金属余量层17后，金属致密层11的厚度为D。通过去除金属余量层17，利于实现金属基材10的外表面无孔洞103的外观效果，提升了金属基材10的外观效果，从而利于提升壳体300的外观效果。可以理解的是，金属余量层17的厚度可以根据实际需要进行调整。
S4、在金属致密层11的外表面上制备外观层30。示例性的，可以用喷涂或物理气相沉积(Physical Vapor Deposition，PVD)的方式制备外观层30。本实施例中，在步骤S4之间，还包括对金属致密层11的外表面进行打磨的步骤，以去除金属致密层11的外表面上的刀纹。在一些实施例中，还可以对打磨后的金属基材10进行喷砂阳极表面处理，以提升外观层30在金属基材10的金属致密层11的外表面的附着力，同时还能够提升金属基材10的耐腐蚀性和美观度。
取本申请实施例制备得到的壳体300，模拟样品，仿真后壳体300抗弯抗跌等可靠性满足需求。
现有主要采用CNC(Computerized Numerical Control，计算机数字化控制)加工的方式制备金属铸件110，加工时间长，并且加工成本高。本申请实施例提供一种壳体300的制备方法，采用铸造的方式提供金属铸件110，相较于采用CNC加工制备金属铸件110的方式，铸造时间短，成本更低。
另外，金属铸件110在铸造后会在外表面形成孔洞103，从而影响金属铸件110的外观效果，进而影响壳体300的外观效果。传统工艺在利用金属铸件110制备壳体300时，需要先对金属铸件110进行CNC加工，然后打磨金属铸件110的外表面，之后再利用补土工艺使用填补材料对金属铸件110的外表面的孔洞103进行填充，并烘烤使得填补材料固化，而后再次对金属铸件110的外表面进行打磨，然后重复上述补土、烘烤和打磨的步骤直至金属铸件110的外观效果合格。最后再在金属铸件110的外表面上涂覆外观层30，以制备形成壳体300。此种方式制备的壳体300在去掉表面的外观层30后，露出的金属铸件110，利用HF酸腐蚀法露出金属铸件110的晶像组织，金属铸件110的表面能够明显观察到补土的位置，补土的位置与未进行补土的位置之间具有明显界限，壳体300的表面一致性差，外观凹凸不平，制造流程长，外观需要多次打磨、补土和烘烤，良率低，制备成本高。
本申请实施例提供的壳体300的制备方法，通过对金属铸件110中金属外表层12中背离金属基体15的部分进行热变形锻压进行处理，利用加热变形的方式，使得金属铸件110中金属外表层12背离金属基体15的部分中的材料发生微流动，即金属铸件110中靠近外表面的部分发生微流动，流动后金属外表层12背离金属基体15的部分中的组织均匀化，并形成金属致密层11。此时，在热变形锻压过程中，金属铸件110的外表面及金属外表层12中的部分孔洞103闭合，以实现制备得到的金属致密层11的外表面的孔洞103闭合，得到的金属致密层11的孔隙率较低，从而利于提升制备得到金属基材10的外观效果，进而利于提升壳体300的外观效果。本申请实施例提供的壳体300的制备方法中，经热变形锻压形成的金属致密层11的孔洞103发生闭合，制备得到的壳体300无需进行补土工艺，提升了金属基材10的表面一致性，从而利于提升壳体300的表面一致性，同时相较于上述传统工艺省去了多次补土和打磨的环节，制造工艺简单，成本低。此外，通过将金属外表层12背离金属基体15的部分通过热变形锻压形成金属致密层11，还能够提升金属基材10的结构强度，从而利于提升壳体300的结构强度。
另外，相较于外观层30直接附着于金属铸件110的外表面的方式，本申请实施例的金属铸件110的金属外表层12中金属外表层12背离金属基体15的部分被挤压形成金属致密层11，金属致密层11与外观层30之间能够形成更稳定的抓接力，且金属致密层11能够表 现出更好的耐磨和抗外观层30脱落的能力，利于提升金属基材10与外观层30的结合能力，从而利于提升壳体300的外观效果。
以上所揭露的仅为本申请较佳实施例而已，当然不能以此来限定本申请之权利范围，本领域普通技术人员可以理解实现上述实施例的全部或部分流程，并依本申请权利要求所作的等同变化，仍属于本申请所涵盖的范围。

Claims (12)

  1. 一种壳体的制备方法，其特征在于，所述壳体的制备方法包括：
    提供一金属铸件，所述金属铸件包括金属基体和金属外表层，所述金属外表层位于所述金属基体的外侧，且与所述金属基体邻接，所述金属外表层中形成有孔洞；
    对所述金属外表层背离所述金属基体的部分进行热变形锻压，得到金属致密层。
  2. 根据权利要求1所述的壳体的制备方法，其特征在于，在对所述金属外表层背离所述金属基体的部分进行热变形锻压，得到金属致密层的步骤中，包括：
    对所述金属外表层背离所述金属基体的部分进行热变形锻压，得到金属热变形层，其中，所述金属热变形层包括金属致密层和金属余量层，所述金属余量层位于所述金属致密层的外侧；
    去除所述金属余量层，得到所述壳体。
  3. 根据权利要求2所述的壳体的制备方法，其特征在于，所述金属余量层的厚度为△H，△H为0.3mm～0.5mm。
  4. 根据权利要求1至3任一项所述的壳体的制备方法，其特征在于，所述壳体还包括外观层，所述壳体的制备方法还包括：在所述致密层的外表面上制备所述外观层。
  5. 根据权利要求1至3任一项所述的壳体的制备方法，其特征在于，所述热变形锻压的温度为200℃～300℃。
  6. 一种壳体，其特征在于，所述壳体包括金属基体、金属致密层和金属邻接层，所述金属致密层位于所述金属基体的外侧，且与所述金属基体间隔设置，所述金属邻接层固定连接于所述金属基体和所述金属致密层之间，所述金属致密层和所述金属邻接层中均形成有孔洞，所述金属致密层的孔隙率小于所述金属邻接层的孔隙率。
  7. 根据权利要求6所述壳体，其特征在于，所述金属致密层的孔隙率≤5％。
  8. 根据权利要求6所述的壳体，其特征在于，所述金属致密层的孔洞的孔直径≤50μm。
  9. 根据权利要求6所述的壳体，其特征在于，所述金属致密层的厚度为D，D为0.3mm～0.5mm。
  10. 根据权利要求6至9任一项所述的壳体，其特征在于，所述壳体还包括外观层，所述外观层设置于所述金属致密层的外表面。
  11. 一种电子设备，其特征在于，包括功能模组和如权利要求6至10任一项所述的壳体，所述功能模组安装于所述壳体。
  12. 根据权利要求11所述的电子设备，其特征在于，所述壳体为中框，所述电子设备还包括后盖，所述后盖安装于所述中框。
PCT/CN2024/109742 2023-12-14 2024-08-05 壳体的制备方法、壳体和电子设备 Pending WO2025123710A1 (zh)

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