WO2025022610A1 - バルクフィーダおよび装着支援装置 - Google Patents

バルクフィーダおよび装着支援装置 Download PDF

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Publication number
WO2025022610A1
WO2025022610A1 PCT/JP2023/027398 JP2023027398W WO2025022610A1 WO 2025022610 A1 WO2025022610 A1 WO 2025022610A1 JP 2023027398 W JP2023027398 W JP 2023027398W WO 2025022610 A1 WO2025022610 A1 WO 2025022610A1
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WIPO (PCT)
Prior art keywords
component
cavity
mark
mounting
supply
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Pending
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PCT/JP2023/027398
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English (en)
French (fr)
Japanese (ja)
Inventor
将士 木村
真吾 青木
僚祐 安藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
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Fuji Corp
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Publication date
Application filed by Fuji Corp filed Critical Fuji Corp
Priority to PCT/JP2023/027398 priority Critical patent/WO2025022610A1/ja
Priority to JP2025535497A priority patent/JPWO2025022610A1/ja
Publication of WO2025022610A1 publication Critical patent/WO2025022610A1/ja
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components

Definitions

  • the present invention relates to a bulk feeder and a mounting assistance device.
  • the bulk feeder is equipped to a component mounting machine that mounts components on a board, and is used to supply components in a bulk state in a supply area (see Patent Document 1).
  • the mounting support device supports the mounting process by the component mounting machine using the bulk feeder.
  • the component mounting machine executes image processing to recognize the state of component supply by the bulk feeder, and controls the component picking operation using a suction nozzle based on the results of the image processing.
  • the image processing for recognizing the supply status includes judging whether or not parts are stored in the multiple cavities formed in the supply area of the bulk feeder so that they can be picked up. If there is an erroneous judgment in this type of image processing, it can lead to an error in the picking operation, and even if picking is successful, it could affect the processing that is executed afterwards.
  • the present specification aims to provide a bulk feeder suitable for image processing to recognize the supply state, and to provide a mounting assistance device that supports the mounting process by improving the accuracy of the image processing.
  • This specification discloses a bulk feeder having a plurality of cavities capable of accommodating parts, and a mark attached to a specified area of the bottom surface of the cavity that is hidden by the parts accommodated in the cavity.
  • This specification discloses an attachment assistance device that is applied to a component attachment machine that picks up components from a component supply device equipped with the above-mentioned bulk feeder and attaches the components to a board, and that is equipped with a state recognition unit that performs image processing on image data acquired by imaging a supply area in which multiple cavities are formed, and recognizes the supply state of the components in the supply area.
  • image processing can be performed to recognize the supply state using the mark on the bottom surface of the cavity. This can improve the accuracy of the image processing. This can prevent mistakes during the picking operation by the component mounting machine, and as a result, high productivity can be maintained in the component mounting machine.
  • FIG. 2 is a plan view showing a schematic diagram of the component mounting machine;
  • FIG. 2 is a side view showing a schematic of a portion of a bulk feeder including a feeding area.
  • FIG. 3 is a plan view seen from a direction III in FIG. 2 .
  • FIG. 2 shows a first embodiment of a marked cavity.
  • FIG. 13 shows a second embodiment of a marked cavity.
  • 1 is a block diagram showing a component mounting machine to which a mounting assistance device is applied; 13 is a flowchart showing a supply state recognition process.
  • FIG. 13 is a diagram showing image data obtained by capturing an image of a supply region.
  • FIG. 13 is an enlarged view showing image data on which a blob generation process has been executed.
  • FIG. 1 is a flow chart showing a first aspect of a process for extracting candidate blobs; 11A and 11B are explanatory diagrams showing before and after blob removal processing and recognition components.
  • FIG. 13 is an explanatory diagram showing recognition components and marks based on foreign objects in a cavity.
  • 13 is a flowchart showing a second embodiment of the process for extracting candidate blobs.
  • 13 is a flowchart showing a cavity validity determination.
  • the bulk feeder 30 is provided on a component mounting machine 10 that mounts components on a board 91, and is used to supply components in a bulk state in a supply area As (see FIG. 3).
  • the mounting assistance device 50 supports the mounting process by the component mounting machine 10 using the bulk feeder 30.
  • the mounting assistance device 50 is incorporated in the control device 20 of the component mounting machine 10.
  • the mounting assistance device 50 improves the accuracy of image processing that recognizes the supply state of the components supplied by the bulk feeder 30, thereby suppressing the occurrence of errors in the picking operation in the mounting process.
  • the component mounting machine 10 described above performs a mounting process for mounting components on the board 91 as a specified substrate-related operation.
  • the component mounting machine 10 is installed along with other substrate-related operation machines in the transport direction of the board 91 to form a production line.
  • Each of the multiple substrate-related operation machines is communicatively connected to a host computer 60 (see FIG. 5) that controls the production line as a whole.
  • the production line includes, for example, a printing machine, the component mounting machine 10, a reflow furnace, and an inspection machine as multiple substrate-related operation machines.
  • Board transport device 11 1 the component mounting machine 10 includes a board transport device 11.
  • the board transport device 11 sequentially transports boards 91 in a transport direction, and positions the boards 91 at predetermined positions within the machine.
  • the component mounting machine 10 includes a component supplying device 12.
  • the component supplying device 12 supplies components to be mounted on the board 91.
  • the component supplying device 12 has feeders 122 set in a plurality of slots 121.
  • the feeders 122 may be, for example, a tape feeder that feeds and moves a carrier tape containing a large number of components to supply the components so that they can be picked.
  • the feeders 122 may be, for example, a bulk feeder 30 that supplies components stored in a bulk state so that they can be picked. Details of the bulk feeder 30 will be described later.
  • the component mounting machine 10 includes a component transfer device 13.
  • the component transfer device 13 transfers the components supplied by the component supply device 12 to a predetermined mounting position on the board 91.
  • the component transfer device 13 includes a head drive device 131, a movable table 132, a mounting head 133, and a suction nozzle 134.
  • the head drive device 131 moves the movable table 132 in the horizontal direction (X direction and Y direction) by a linear motion mechanism.
  • the mounting head 133 is detachably fixed to the movable table 132 by a clamp member (not shown) and is provided so as to be movable horizontally within the machine.
  • the mounting head 133 supports multiple suction nozzles 134 that are rotatable and movable up and down.
  • the suction nozzles 134 are holding members that pick up and hold the parts supplied by the feeder 122.
  • the suction nozzles 134 use the supplied negative pressure air to pick up the parts supplied by the feeder 122.
  • a chuck that holds the parts by gripping them can be used as the holding member attached to the mounting head 133.
  • Component camera 14, board camera 15 The component mounting machine 10 includes a component camera 14 and a board camera 15.
  • the component camera 14 and the board camera 15 are digital imaging devices having imaging elements such as CMOS.
  • the component camera 14 and the board camera 15 capture images based on a control signal and send image data acquired by the capture.
  • the component camera 14 is configured to be able to capture images of the components held by the suction nozzle 134 from below.
  • the board camera 15 is provided on a moving stage 132 so as to be movable in the horizontal direction integrally with the mounting head 133.
  • the board camera 15 is configured to be able to capture images of the board 91 from above.
  • the board camera 15 can also capture various devices within the movable range of the movable stage 132.
  • the board camera 15 can capture images of the supply area As where the bulk feeder 30 supplies components and the reference mark 49 provided on the top of the bulk feeder 30 within the camera's field of view. In this way, the board camera 15 can be used to capture images of different objects in order to obtain image data to be used for various image processing.
  • the component mounting machine 10 includes a control device 20 as shown in Fig. 1.
  • the control device 20 is mainly composed of a CPU, various memories, and a control circuit.
  • the control device 20 includes a storage unit 21 as shown in Fig. 5.
  • the storage unit 21 is composed of a storage device such as a hard disk device or a flash memory.
  • the storage unit 21 of the control device 20 stores various data such as a control program M1 used to control the mounting process, component data M2, and cavity information M3.
  • Control program M1 indicates the mounting positions, mounting angles, and component types of components to be mounted on board 91 in the planned mounting order during the mounting process.
  • the mounting process includes a process of repeating a PP cycle (pick-and-place cycle), which includes a collection cycle and a mounting cycle, multiple times.
  • the above-mentioned “collection cycle” refers to a process of repeating a collection operation, in which components supplied by component supply device 12 are picked up by suction nozzle 134, multiple times.
  • the above-mentioned “mounting cycle” refers to a process in which a mounting operation is repeated multiple times to mount the picked components at a predetermined mounting position on the board 91 at a predetermined mounting angle.
  • the control program M1 has preset therein the execution order of a PP cycle consisting of multiple picking and mounting operations grouped together in consideration of the number of suction nozzles 134 supported by the mounting head 133, the travel distance of the mounting head 133, etc.
  • Component data M2 includes shape data for each type of component.
  • shape data includes at least one of the outer edge shape of the component, the shape of the characteristic part of the component, and the dimensions of the component.
  • the "outer edge shape” of a component corresponds to the shape of the outer edge when the inside of the component and the background are separated using the outer edge as the boundary.
  • the "shape of the characteristic part" of a part corresponds to the boundary shape of the characteristic part on the appearance resulting from the part's shape, pattern, color, etc.
  • the characteristic part of a part may be the corners, bumps, terminals, leads, etc. of the part.
  • the part data M2 may also include, for example, the maximum allowable movement speed (acceleration) for each part, the pick-up position (for example, the position of contact with the suction nozzle 134), etc.
  • Cavity information M3 is information about the cavities 45 that are formed in the supply area As of the bulk feeder 30 and individually accommodate parts, associated with the identification information (ID) of the bulk feeder 30.
  • the cavity information M3 may include the shape (including the length of each side and the depth), position, orientation, and type of corresponding part of the cavity 45 in the supply area As.
  • the cavity information M3 includes the initial state of the mark Kr that is affixed to the bottom surface of each of the multiple cavities 45. Details of the process using cavity information M3 will be described later.
  • the control device 20 executes a process for recognizing the holding state of the components held by each of the multiple holding members (suction nozzles 134). Specifically, the control device 20 processes image data acquired by imaging with the component camera 14, and recognizes the position and angle of each component relative to the reference position of the mounting head 133. Note that in addition to the component camera 14, the control device 20 may also process image data acquired by imaging the components from the side, below, or above using, for example, a head camera unit that is integrally provided with the mounting head 133.
  • the control device 20 controls the mounting operation by the mounting head 133 so that the component is mounted on the board 91 in a specified orientation. At this time, the control device 20 controls the mounting operation based on the recognized holding state of the component. In other words, the control device 20 corrects the position of the mounting head 133 and the angle of the suction nozzle 134 about the Q axis so as to correct the positional and angular deviation of the component held by the suction nozzle 134 with respect to the Q axis (the rotation axis of the suction nozzle 134). As a result, the component held by the suction nozzle 134 is mounted at a specified mounting angle in a specified mounting position instructed by the control program M1.
  • Bulk feeder 30 is set in component mounting machine 10 and functions as part of component supply device 12. Bulk feeder 30 supplies components housed in component cases in a bulk state (loose and irregular in each position) that is not packaged like a carrier tape. Therefore, unlike tape feeders, bulk feeder 30 does not use carrier tape, and therefore has the advantage of being able to omit loading of carrier tape and collection of used tape.
  • Some types of bulk feeders 30 supply components in irregular positions to the planar supply area As, for example. However, if the components are so close together in the supply area As that they are touching each other, or if they are piled up (overlapping vertically), or if the components are in a horizontal position with their width direction aligned vertically, the component mounting machine 10 cannot pick up these components. Therefore, to increase the proportion of components that can be picked up, some types of bulk feeders 30 supply components in an aligned state in the supply area As. In this embodiment, a bulk feeder 30 that aligns components will be described as an example.
  • Track unit 40 The bulk feeder 30 is provided with a track unit 40 that is vibrable and detachable from a feeder body 31 formed in a flat box shape.
  • a connector 311 and two positioning pins 312 are provided at the front (right end in FIG. 2 ) of the feeder body 31.
  • the feeder body 31 When the feeder body 31 is set in the slot 121 of the component supplying device 12, it is supplied with power via the connector 311 and is capable of communicating with the control device 20 of the component mounting machine 10.
  • the track unit 40 is vibrated by the vibration device 35.
  • the track unit 40 is formed with a transport path R along which multiple parts are transported, and a supply area As that is connected to the transport path R and opens upward so that multiple parts can be picked up.
  • the track unit 40 is formed to extend in the front-to-rear direction (left-to-right direction in Figure 3) of the feeder body 31.
  • a pair of side walls 46 that protrude upward are formed on both edges of the track unit 40 in the width direction (top-bottom direction in Figure 3).
  • the pair of side walls 46, together with the tip 47 of the track unit 40 are wall members that surround the periphery of the transport path R and prevent leakage of parts transported on the transport path R.
  • a plurality of cavities 45 are formed in the supply area As of the track unit 40.
  • Each of the plurality of cavities 45 opens upward and accommodates components in a position in which the thickness direction of the components is the up-down direction.
  • the plurality of cavities 45 are arranged in a staggered pattern.
  • the "supply area As" of the track unit 40 is an area where components are supplied in bulk, and where the components can be picked up by the suction nozzle 134 supported by the mounting head 133.
  • the "transport path R" of the track unit 40 is a path along which the components that have circulated from the component case side to the track unit 40 are transported to the supply area As.
  • the vibration device 35 also applies vibrations to the track unit 40 so that the multiple parts are transported along the transport path R.
  • a forward and upward external force, or a rearward and upward external force is applied to the parts.
  • the multiple parts are transported to the front or rear of the track unit 40.
  • the bulk feeder 30 controls the operation of the vibration device 35 by the feeder control device 36 to transport the parts and perform the operation of supplying the parts to the supply area As.
  • the parts are stored in the multiple cavities 45 by the supply operation, and the suction nozzle 134 is ready to pick up the parts.
  • a shutter 48 capable of closing the opening of the supply area As is provided on the top of the track unit 40.
  • the shutter 48 is in a state in which its opening and closing operation is controlled by a shutter drive device (not shown).
  • a shutter drive device not shown.
  • the bulk feeder 30 has a plurality of cavities 45 capable of accommodating components. Furthermore, in this embodiment, as shown in Fig. 4A, the bulk feeder 30 has a mark Kr affixed to a specified region Rd on the bottom surface of the cavity 45 that is hidden by the components accommodated in the cavity 45. The mark Kr is used in image processing for recognizing the supply state of the components 92 in the supply region As.
  • the above-mentioned "prescribed area Rd" is set based on the area in which the outer edge of the component may be located when it is housed in the cavity 45 in the normal position. Specifically, as shown by the dashed line or the two-dot dashed line on the right and bottom of FIG. 4A, assuming that components 92A-92D are housed in close contact with the corners of the cavity 45, the area enclosed by the extension lines L1-L4 passing through the outer edges of these components 92A-92D corresponds to the prescribed area Rd.
  • the prescribed area Rd is an area that cannot be seen from above as long as the component 92 is housed in the cavity 45 in the normal position (the thickness direction is the up-down direction) (see the right and bottom of FIG. 4A and the right of FIG. 4B). Note that the prescribed area Rd may be set to an area narrower than the area enclosed by the above-mentioned extension lines L1-L4, taking into account the allowable error.
  • the mark Kr used in image processing may take various forms. For example, as shown in FIG. 4A, one mark Kr is placed at the center of the specified region Rd. The mark Kr is also circular. As shown in FIG. 4B, multiple marks Kr may be placed inside the specified region Rd. As shown in FIG. 4B, three marks Kr may be placed in a staggered pattern, or two marks Kr may be placed diagonally across the specified region Rd.
  • the mark Kr may be of any shape, such as a circle, a polygon, or an ellipse.
  • the mark Kr is applied, for example, by applying white paint to the bottom surface of the cavity 45.
  • the mark Kr may have various colors and patterns.
  • the mark Kr is set to a brightness that is higher than the brightness of the body 93 of the part 92 in the image data that has been image-processed. This is to prevent the mark Kr from being converted to black together with the body 93 when black-and-white binarization is performed in the image processing.
  • mark Kr can be adopted as long as they are visible from above when the part 92 is not housed in the cavity 45.
  • the mark Kr can be applied by forming a recess of a predetermined shape in the bottom surface of the cavity 45 and applying paint to the recess. With such a configuration, contact between the mark Kr and the housed part 92 is prevented, and peeling of the mark Kr can be prevented for a long period of time.
  • the mounting support device 50 supports the component supply state recognition process executed by the control device 20 of the component mounting machine 10 in the mounting process.
  • the supply state recognition process includes image processing, and this image processing includes a determination as to whether or not a component supplied to the supply area As of the bulk feeder 30 is suitable for the picking operation by the component mounting machine 10.
  • control device 20 processes image data D1 (see FIG. 7) acquired by imaging with a camera (in this embodiment, the board camera 15), recognizes whether there is a component suitable for the collection operation in the supply area As, and if there is a component suitable for the collection operation, recognizes the position and angle of that component. Then, the control device 20 controls the operation of the mounting head 133 in the collection operation based on the results of the supply status recognition process.
  • the position and orientation of the recognized part (hereinafter also referred to as the "recognized part") will differ from the actual one, which may cause an error in the picking operation. Furthermore, even if the part can be picked, there is a risk that it will affect the processing that is executed afterwards, such as the part transfer operation or mounting operation.
  • the mounting assistance device 50 incorporated in the control device 20 of the component mounting machine 10 employs a configuration that can improve the accuracy of the image processing included in the recognition process of the component supply state (see FIG. 6).
  • the mounting assistance device 50 includes a state recognition unit 51.
  • the mounting assistance device 50 may also be configured to further include an acquisition unit 52, a determination unit 53, and a notification unit 54.
  • the mounting assistance device 50 acquires image data D1 captured by the board camera 15 as shown in FIG. 6 (S11).
  • the state recognition unit 51 executes recognition processing (S20) using the image data D1.
  • the determination unit 53 executes determination processing (S30) as to whether or not the part is suitable for collection operation.
  • State recognition unit 51 acquisition unit 52
  • the state recognition unit 51 performs image processing on image data D1 acquired by imaging the supply area As in which a plurality of cavities 45 are formed, each of which accommodates a plurality of components 92, to acquire information about the recognized components 80.
  • blob analysis is used as a method for recognizing the components 92 scattered in the supply area As as the recognized components 80.
  • the state recognition unit 51 first executes a generation step (S21) of generating a plurality of blobs 70 from the image data D1.
  • the state recognition unit 51 binarizes the image data D1 using a predetermined threshold value, and for example, colors each pixel white when its brightness value is higher than the threshold value, and black when its brightness value is equal to or lower than the threshold value.
  • Figure 8 shows an enlarged portion of the binarized image data D1, with the pre-processing cavity 45 indicated by a dashed line.
  • the blobs 70 correspond to closed white regions in the binarized image data D1.
  • the component 92 has a rectangular body 93 as the component main body, and a pair of electrode parts 94 provided at both ends of the body 93.
  • the mark Kr is set to a brightness higher than the brightness of the body 93 in the image data D1.
  • the state recognition unit 51 performs binarization processing on the image data D1 using a threshold value set higher than the brightness of the body 93 and lower than the brightness of the mark Kr and the electrode parts 94.
  • the generated blob 70 includes a mark blob 76 that corresponds to the mark Kr attached to the bottom surface of the cavity 45 that does not contain a component 92.
  • the image processing by the state recognition unit 51 includes a recognition process that recognizes whether or not the mark Kr attached to each of the multiple cavities 45 has been recognized based on the presence or absence of the mark blob 76 (whether or not it has been detected).
  • the apparent shape of the mark Kr affixed to each cavity 45 may change due to partial peeling or adhesion of foreign matter as the bulk feeder 30 repeatedly supplies the components 92. Changes in the apparent shape of the mark Kr can cause the accuracy of the recognition process to decrease. Therefore, the acquisition unit 52 acquires the initial state of the mark Kr affixed to each of the multiple cavities 45 based on the initial image data Dn acquired by imaging the supply area As with the components 92 removed from the supply area As.
  • the above initial image data Dn is obtained, for example, by imaging with the board camera 15 when the bulk feeder 30 is installed in the component supply device 12 and before the supply operation of the first component 92 is performed.
  • the initial image data Dn may also be obtained, for example, by imaging the supply area As with a dedicated camera in an external setup area where the track unit 40 is set on the bulk feeder 30.
  • the acquisition unit 52 acquires the current state of the apparent shape of the mark Kr for each of the multiple cavities 45 as an initial state by performing image processing similar to the generation step of the blob 70.
  • the acquisition unit 52 records the acquired initial state in the cavity information M3.
  • the state recognition unit 51 then performs recognition processing of the mark Kr based on the initial state in the image processing.
  • the state recognition unit 51 may detect, for example, a mark blob 76 corresponding to the mark Kr in the initial state at the center of the bottom of the cavity 45. This configuration makes it possible to prevent a decrease in the accuracy of the recognition processing in response to changes in the mark Kr over time.
  • the blob 70 may refer to a pair of electrode portions 94 formed on both ends of the component 92 in the longitudinal direction, or may refer to the entire component 92 including the body 93. These differ depending on the type of component 92 (including the color and gloss of the body 93 and electrode portions 94) and the threshold value used for binarization.
  • the recognition process (S20) recognizes the component 92 using one or more blobs 70. Note that the mounting assistance device 50 can determine how the blob 70 is formed based on the component data M2.
  • the blobs 70 in the binarized image data D1 may include, for example, parts 92 that are not housed in the cavity 45 or foreign objects 89 (see FIG. 7). If these defective blobs 72, 73 are mistaken for part of the part 92, the accuracy of the recognition process will decrease. Therefore, the state recognition unit 51 extracts candidate blobs 71 that are deemed suitable for the recognition process from among the multiple blobs 70 (S22). In other words, this extraction step is a process of removing blobs 70 (72, 73) that are unsuitable for the recognition process.
  • the state recognition unit 51 extracts candidate blobs 71 contained in the appropriate area, as shown in FIG. 9 (S41).
  • the above-mentioned "appropriate area” is an area that can be expected to contain blobs 70 of a part 92 accommodated in a normal posture, and is set mainly to an area having the same shape as the cavity 45 with allowable error taken into account.
  • the state recognition unit 51 extracts blobs 70 contained in the appropriate area set based on the cavity information M3 as candidate blobs 71. As a result, blobs 70 located outside the cavity 45 are removed, as shown in FIG. 10A.
  • the suction nozzle 134 is pressed into contact with the component 92 housed in the cavity 45 to pick up the component.
  • the component 92 is pressed against the bottom surface of the cavity 45, and as shown on the left side of FIG. 10B, metal pieces that have fallen off the electrode portion 94 of the component 92 may adhere to the bottom surface of the cavity 45 as foreign matter 89. It is expected that if the collection operation described above is repeated, tiny foreign matter 89 will gradually accumulate.
  • the blob 70 generation step (S21) multiple foreign bodies 89 are generated as blobs 70 (bad blobs 73), as shown on the right side of FIG. 10B.
  • the foreign bodies 89 that have adhered as described above adhere to the area where the electrode portion 94 of the part 92 that is held so as to be able to be picked up in the cavity 45 is located. Therefore, if the recognition part 80 is constructed with this bad blob 73 as the candidate blob 71, there is a risk that it will be mistaken for the presence of a pickable part.
  • this embodiment takes into consideration the above circumstances and employs a configuration that prevents misidentification of the recognized component 80 by performing an extraction process of the candidate blob 71 using the mark Kr.
  • the state recognition unit 51 determines whether or not the mark Kr has been recognized in the image processing for each of the multiple cavities 45 (S42). In other words, the state recognition unit 51 determines whether or not the mark blob 76 has been detected in the image data D1 in the area where the cavity 45 indicated by the cavity information M3 is located.
  • the state recognition unit 51 determines that the cavity 45 does not contain a component 92. The state recognition unit 51 determines that none of the blobs 70 located inside the specific cavity 45 can be candidate blobs 71, and removes the blobs 70 that are included in the appropriate region together with the mark blob 76 (S43). When the mark Kr is not recognized for a specific cavity 45 (S42: No), the state recognition unit 51 extracts the blobs 70 that are included in the appropriate region as candidate blobs 71 (S44).
  • the state recognition unit 51 executes the above-mentioned judgment (S42) and removal processing (S43) as necessary for all cavities 45. Note that, in the case where multiple marks Kr are attached to a cavity 45, the state recognition unit 51 may determine that a part 92 is not contained in the corresponding cavity 45 if a mark blob 76 corresponding to at least one mark Kr is detected in the image processing.
  • defective blobs 72 corresponding to closed regions of the part 92 not contained in the cavity 45 and defective blobs 73 corresponding to foreign bodies 89 located inside and outside the cavity 45 can be removed so that they will not be used in subsequent processes.
  • the extraction using the blob 70 and the appropriate region (S41) as described above or the extraction using the mark blob 76 (S42-S44) may be omitted, and a mode may be adopted in which, from among the multiple blobs 70, a candidate blob 71 corresponding to at least a portion of the closed region of the part 92 is simply extracted (allowing that some of the candidate blobs may include defective blobs) depending on the relationship with the subsequent processes.
  • the state recognition unit 51 executes a recognition step (S23) in which a rectangular area including one or more candidate blobs 71 is recognized as a part 92 in the image data D1.
  • the state recognition unit 51 recognizes a rectangular area circumscribing one or more candidate blobs 71 as a part 92 in the image data D1, as shown in FIG. 10A. This allows, for example, a recognized part 80 consisting of a pair of candidate blobs 71, or a recognized part 80 consisting of one candidate blob 71 to be obtained.
  • the state recognition unit 51 also recognizes information necessary for subsequent processing, such as the reference position, angle (supply angle), shape (including the lengths of the short and long sides), and area (corresponding to the number of pixels contained in the rectangular area) in the supply area As for each of the multiple recognition components 80. Through this processing, the state recognition unit 51 recognizes the supply state of the components 92 in the supply area As, and stores the recognition results in the memory unit 21.
  • the above recognition process (S20) is premised on the premise that the component mounting machine 10 only targets components 92 that are properly accommodated in the cavity 45 for the picking operation. Therefore, if the bulk feeder 30 is a type that does not have a cavity 45 in the supply area As, the state recognition unit 51 may extract candidate blobs 71, for example, from among the multiple blobs 70, based on conditions such as having a certain range of area and a blob shape that is close to a rectangle, and obtain the position and shape of the recognized component 80 in the supply area As.
  • Determination unit 53, notification unit 54 The determination unit 53 determines (S30) whether the component 92 (recognized component 80) recognized in the recognition process (S20) is suitable for the picking operation by the component mounting machine 10 based on the supply state of the component 92.
  • the recognized component 80 may not be suitable for the picking operation.
  • One possible cause of this is that, for example, two components 92 are housed in the cavity 45 in an abnormal position, with their longitudinal directions aligned vertically. In such a case, it is assumed that the electrode parts of each component 92 will be mistakenly recognized as the electrode parts of a single component 92, and the recognized component 80 will be recognized. Also, if the process of removing blobs 70 inside and outside the cavity 45 is omitted in the recognition process (S20), it is assumed that the defective blob 73 corresponding to the foreign object 89 will be mistakenly recognized as part of the component 92, and the recognized component 80 will be recognized.
  • the determination unit 53 first determines whether the blob 70 is good or bad (S31). Various methods can be used to determine whether the blob 70 is good or bad. Specifically, as shown in FIG. 11, if the ratio of the area of one or more candidate blobs 71 contained in a rectangular region to the area of the recognition component 80 does not exceed a preset threshold (S51: No), the determination unit 53 determines that the candidate blob 71 is a bad blob 73 and that the recognition component 80 is not suitable for the collection operation (S54).
  • the determination unit 53 determines whether or not the mark blob 76 is included in the rectangular region of the recognition component 80 (S52).
  • the process of extracting the candidate blob 71 using the mark Kr and removing the blobs 70 included in the appropriate region together with the mark blob 76 is omitted in the previous candidate blob extraction process (S22), misidentification of the recognition component 80 can be prevented by performing the quality determination of the blob 70 using the mark Kr (S31).
  • the determination unit 53 determines whether or not the mark Kr has been recognized in the recognition process of the mark Kr included in the image processing for each of the multiple cavities 45 (S52). That is, the determination unit 53 determines whether or not a mark blob 76 has been detected in the image data D1 in the area in which the cavity 45 indicated by the cavity information M3 is located. If the mark Kr is not recognized for a specific cavity 45 (S52: Yes), the determination unit 53 determines that the mark Kr is hidden by the contained component 92 and the mark blob 76 was not generated, as shown in FIG. 10A. The determination unit 53 determines that the candidate blob 71 used to recognize the recognized component 80 is "good: corresponds to at least a part of the closed area of the component 92" (S53).
  • the determination unit 53 determines that there is no component 92 that corresponds to the recognized component 80 because the mark Kr is visible from above, as shown in FIG. 10B.
  • the determination unit 53 determines that the candidate blob 71 used to recognize the recognized component 80 is "bad: contains a bad blob and does not correspond to the closed region of the component 92" (S54).
  • the recognized component 80 determined in this way is excluded from the subsequent determination process.
  • the notification unit 54 may externally notify information including the need for maintenance under specified conditions.
  • the notification unit 54 first determines that the cavity 45 is a target cavity requiring maintenance. Whether or not a cavity is a target cavity is recorded in the cavity information M3. Then, the notification unit 54 issues an external notification when the ratio of target cavities to the total number of multiple cavities 45 exceeds a preset threshold value (S55).
  • the notification unit 54 notifies, for example, the host computer 60 or a terminal carried by the operator, that the time for maintenance of the bulk feeder 30 is approaching. As a result, maintenance of the bulk feeder 30 is promoted at an appropriate time.
  • the judgment (S52) using the mark Kr in the quality judgment (S31) of the blobs 70 and the notification process (S55) may be omitted.
  • the determination unit 53 determines whether the recognized component 80 is a component 92 that has been supplied in the supply area As so as to be able to be picked up (S32). Specifically, the determination unit 53 determines whether the recognized component 80 is suitable for a picking operation based on whether at least one of the position, angle, shape, and area of the recognized component 80 is within a range that can be taken if the recognized component 80 is stored in a normal posture.
  • the mounting assistance device 50 obtains judgment results for each of the multiple recognized components 80 as to whether or not it is suitable for the picking operation.
  • This judgment result is stored as information indicating, for example, whether or not each of the multiple cavities 45 contains a pickable component 92.
  • the pickable components 92 are associated with information such as their reference position (center position) and supply angle.
  • control device 20 executes a calibration process and recognizes the positions of multiple cavities 45 within the machine. In the above calibration process, control device 20 first moves board camera 15 to above reference mark 49 of bulk feeder 30, and obtains image data by imaging board camera 15.
  • control device 20 recognizes the position of the bulk feeder 30 within the machine based on the positions of the pair of reference marks 49 included in the image data through image processing, and the position of the board camera 15 at the time of image capture.
  • the control device 20 can acquire the coordinate values of each cavity 45 based on the results of the calibration process and cavity information M3 indicating the arrangement of the cavities 45.
  • the acquisition unit 52 of the mounting assistance device 50 may acquire the initial state of the mark Kr affixed to each of the multiple cavities 45 using the image data used in the above calibration process.
  • the board transport device 11 of the component mounting machine 10 executes a board 91 loading process.
  • the board 91 is loaded into the machine and positioned at a predetermined position within the machine.
  • the control device 20 causes the bulk feeder 30 to execute a supply operation.
  • a state is created in which a plurality of components 92 are contained in at least some of the multiple cavities 45 of the bulk feeder 30.
  • the mounting assistance device 50 executes a process to recognize the supply status of the components 92.
  • the control device 20 executes a PP cycle.
  • the control device 20 executes a picking cycle in which the picking operation of picking up the part 92 using multiple suction nozzles 134 is repeated.
  • the control device 20 controls the operation of the mounting head 133 in the picking operation so that the mounting head 133 is sequentially positioned according to the reference position of the pickable part 92.
  • the control device 20 determines the angle of the suction nozzle 134 according to the supply angle of the pickable part 92.
  • the control device 20 then executes a process for recognizing the holding state of the components 92 held by each of the multiple suction nozzles 134.
  • the control device 20 moves the mounting head 133 above the component camera 14 and sends an image capture command to the component camera 14.
  • the control device 20 processes the image data acquired by the component camera 14, and recognizes the attitude (position and angle) of the components 92 held by each of the multiple suction nozzles 134.
  • the result of the holding state recognition process is recorded in the memory unit 21 as an operation result indicating whether or not a pick-up error occurred during the pick-up operation.
  • the control device 20 executes a mounting cycle in which the mounting operation of mounting components using the multiple suction nozzles 134 is repeated.
  • the control device 20 controls the operation of the mounting head 133 so that the components 92 are mounted at the mounting positions specified by the control program M1.
  • the control device 20 controls the operation of the mounting head 133 so that the suction nozzles 134 are positioned and angled relative to the mounting positions based on the results of the recognition process.
  • the control device 20 also executes supply management processing for the parts 92 in parallel with the above-mentioned PP cycle.
  • the supply management processing includes setting the execution timing of the supply operation of the parts 92 by the bulk feeder 30, commanding the supply operation, and supply status recognition processing. For example, when the supply operation of the parts 92 is executed, the supply operation by the bulk feeder 30 is executed in the period from the end of the collection cycle of the current PP cycle to the start of the collection cycle of the next PP cycle. When the supply operation by the bulk feeder 30 is executed, the mounting assistance device 50 executes the above-mentioned supply status recognition processing again.
  • the control device 20 executes the unloading process of the board 91.
  • the board transport device 11 unclamps the positioned board 91 and unloads the board 91 out of the component mounting machine 10.
  • the mounting assist device 50 assists in the recognition process of the supply state of the components 92 by the bulk feeder 30 in the mounting process by the component mounting machine 10.
  • the mounting assist device may assist the mounting process by determining the validity of the multiple cavities 45 and performing a process of prompting maintenance as necessary.
  • the judgment unit 53 judges the validity of the picking operation for each of the multiple cavities 45 based on the picking error detected in the picking operation of the component 92 from the supply area As by the component mounting machine 10 and the result of the recognition process of the mark Kr in the image data D1.
  • the above-mentioned "picking error” includes a state in which the suction nozzle 134 attempting the picking operation does not properly hold the component 92, and is detected, for example, in the recognition process of the holding state.
  • the "effectiveness" of the cavity 45 for the picking operation is an index showing whether the cavity 45 has a sufficient function to properly supply components 92 so that the picking operation of the component mounting machine 10 can be performed normally.
  • the cavity 45 may be clogged with multiple components 92 depending on the shape and size of the components 92. In such a case, the cavity 45 temporarily loses the function of storing components 92 in the correct position, and is determined to be ineffective for the mounting operation.
  • each of the multiple cavities 45 is recorded, for example, as additional information in the cavity information M3. Then, when the component mounting machine 10 executes the supply status recognition process, the cavity 45 that is determined to be invalid is treated as not existing, and the process related to the blob 70 located inside that cavity 45 (such as the process of extracting candidate blobs 71 and the process of recognizing the component) can be skipped.
  • the mounting support device 50 executes a process for determining the validity of the cavity 45 as shown in FIG. 12. Note that in the second embodiment, the various processes using the mark Kr in the recognition process for the supply state of the component 92 exemplified in the first embodiment are omitted.
  • the mounting support device 50 first acquires image data D1 when the recognition component 80 that was intended to be picked was generated by the picking operation in which the picking error was detected (S61).
  • the determination unit 53 identifies the cavity 45 for which a sampling operation was attempted in which a sampling error was detected in the acquired image data D1, and executes a recognition process for the mark Kr (S62).
  • This recognition process for the mark Kr is substantially the same as that included in the image processing exemplified in the first embodiment, and therefore a detailed description is omitted.
  • the determination unit 53 obtains a processing result indicating whether the mark Kr affixed to the cavity 45 is hidden by the part 92 and cannot be recognized, or whether the part 92 does not exist and the mark Kr can be recognized.
  • the determination unit 53 determines that the cavity 45 is not valid for the collection operation (S64). In other words, since the mark Kr was not recognized, it is assumed that one or more parts 92 are present in the cavity 45 so as to block the mark Kr, but since they are not stored in the correct position, they are not picked up and are the cause of the collection error. Therefore, the determination unit 53 determines that such a cavity 45 is not valid (does not have the original storage function) and sets it as an invalid cavity. This updates the cavity information M3. Furthermore, if the mark 63 is recognized (S63: Yes), the process of setting an invalid cavity by the determination unit 53 (S64) is omitted.
  • the determination unit 53 may set the cavity 45 as an invalid cavity when the mark Kr is not recognized and a specified condition is satisfied in the invalid cavity setting process (S64) described above.
  • the setting condition may be, for example, a case where a collection error is detected a specified number of times consecutively in the collection operation from a specified cavity 45. In other words, when a collection error occurs in the same cavity 45 and the mark Kr is not recognized in any of the recognition processes, the determination unit 53 sets this cavity 45 as an invalid cavity.
  • the blockage may be cleared by vibrating the track unit 40 during the subsequent supply operation of the parts 92 in the bulk feeder 30.
  • the bulk feeder 30 may be capable of performing a maintenance operation in which a stronger vibration is applied to the track unit 40 than during the supply operation in order to clear the blockage in the cavity 45. If this is expected to clear the blockage, the effectiveness of the cavity 45 may be appropriately set by adding the above-mentioned specified conditions.
  • the notification unit 54 may, as necessary, notify the outside world of information including whether or not maintenance of the bulk feeder 30 is required.
  • the cavities 45 that are set as invalid cavities as described above are determined to be target cavities requiring maintenance, and are recorded in the cavity information M3. Then, if the ratio of the target cavities to the total number of the multiple cavities 45 is equal to or greater than a preset threshold value (S65: Yes), the notification unit 54 issues a notification to the outside (S66). On the other hand, if the ratio is less than the threshold value (S65: No), the notification process to the outside (S66) is omitted.
  • the notification unit 54 notifies, for example, the host computer 60 or a terminal carried by the worker, that it is approaching the time for maintenance to clear the clog. This encourages workers to perform maintenance such as clearing the clog in the cavity 45, preventing a decline in productivity.
  • the mounting assist device 50 is configured to be incorporated in the control device 20 of the component mounting machine 10. However, a part or all of the mounting assist device 50 may be incorporated in the host computer 60 or other external devices. For example, the mounting assist device 50 may be incorporated in the host computer 60 and may be a dedicated device installed on the production line.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
PCT/JP2023/027398 2023-07-26 2023-07-26 バルクフィーダおよび装着支援装置 Pending WO2025022610A1 (ja)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013243273A (ja) * 2012-05-22 2013-12-05 Fuji Mach Mfg Co Ltd 部品吸着動作監視装置及び部品有無検出装置
JP2022011358A (ja) * 2020-06-30 2022-01-17 ヤマハ発動機株式会社 確認装置、表面実装機
JP7261314B2 (ja) * 2019-11-14 2023-04-19 株式会社Fuji 部品装着機

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013243273A (ja) * 2012-05-22 2013-12-05 Fuji Mach Mfg Co Ltd 部品吸着動作監視装置及び部品有無検出装置
JP7261314B2 (ja) * 2019-11-14 2023-04-19 株式会社Fuji 部品装着機
JP2022011358A (ja) * 2020-06-30 2022-01-17 ヤマハ発動機株式会社 確認装置、表面実装機

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