Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/04—Oxygen-containing compounds
  • C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates

Definitions

• the present invention relates to a resin composition, pellets, and molded articles.
• the present invention relates to a resin composition whose main component is polycarbonate resin.
• Patent Document 1 discloses polycarbonate resin composition pellets containing a polycarbonate resin (A), an aromatic compound (B) represented by the following formula, and a phosphorus-based stabilizer (C), characterized in that the content of the aromatic compound (B) in the pellets is 0.001 to 1 mass %, and the content of the phosphorus-based stabilizer (C) is 0.003 to 0.5 mass %.
• Y is an organic group that does not contain any of the elements nitrogen, sulfur, and halogen, or a hydrogen atom.
• X is an alkyl group or an aryl group which may have a substituent
• Y is an organic group which does not contain any of the elements nitrogen, sulfur, and halogen
• X is an organic group which does not contain any of the elements nitrogen, sulfur, and halogen
• X and Y may be the same or different.
• g represents an integer of 1 or 2;
• n represents an integer of 0 to 5, and when n is 2 or more, the n X's may be the same or different.
• k represents an integer of 1 to 4, and when k is 2 or more, the two or more -(CH 2 ) g OY groups in which Y is the organic group may be the same or different, provided that n+k is 6 or less.
• resin molded products used for components that require transparency are required to have a low YI value and high transmittance.
• molded products formed from the resin composition described in Patent Document 1 have an excellent YI value.
• a lower YI value and transmittance may be required.
• the present invention has an object to solve the above problems, and to provide a resin composition, pellets, and a molded article that can provide a molded article having a low YI value and high transmittance.
• a resin composition comprising 0.01 to 1.5 parts by mass of a compound represented by formula (1) per 100 parts by mass of a polycarbonate resin.
• each R is independently a substituted or unsubstituted aliphatic hydrocarbon group having 1 to 10 carbon atoms.
• the present embodiment is an example for explaining the present invention, and the present invention is not limited to the present embodiment.
• the word "to” is used to mean that the numerical values before and after it are included as the lower limit and upper limit.
• various physical properties and characteristic values are those at 23° C. unless otherwise specified. If the measurement methods, etc. described in the standards shown in this specification vary from year to year, they will be based on the standards as of January 1, 2023, unless otherwise specified.
• the resin composition of the present embodiment is characterized in that it contains 0.01 to 1.5 parts by mass of the compound represented by formula (1) per 100 parts by mass of polycarbonate resin.
• each R is independently a substituted or unsubstituted aliphatic hydrocarbon group having 1 to 10 carbon atoms.
• a resin composition capable of providing a molded article having a low YI value can be obtained.
• a resin composition having excellent extrudability can be obtained, the production of pellets can be facilitated.
• a molded article having excellent mold deposit can be produced. That is, in this embodiment, the hue is improved by blending the compound represented by formula (1). It is believed that the -CH2 portion of the benzene ring of the compound represented by formula (1) undergoes a reduction reaction, suppressing an increase in hue.
• the compound represented by formula (1) has a -CH2OR structure at the para position, which has succeeded in further lowering the YI value. The reason for this is presumably that the para-position, which is difficult to undergo condensation reaction, can efficiently undergo reduction reaction, thereby preventing an increase in the YI value.
• the resin composition of the present embodiment will be described below.
• the resin composition of the present embodiment contains a polycarbonate resin.
• the polycarbonate resin is preferably an aromatic polycarbonate resin, and more preferably a polycarbonate resin having a bisphenol skeleton.
• the polycarbonate resin having a bisphenol skeleton is preferably a structural unit having a bisphenol skeleton in 90 mol % or more of all structural units, more preferably a structural unit having at least one skeleton of bisphenol A, bisphenol C, and bisphenol AP, and even more preferably a structural unit having a bisphenol A skeleton in 90 mol % or more of all structural units.
• the viscosity average molecular weight (Mv) of the polycarbonate resin is preferably 10,000 or more, more preferably 12,000 or more, and even more preferably 15,000 or more. By making it equal to or more than the lower limit, the durability of the molded article obtained tends to be further improved.
• the upper limit of the viscosity average molecular weight (Mv) of the polycarbonate resin is preferably 50,000 or less, more preferably 40,000 or less, even more preferably 30,000 or less, even more preferably 25,000 or less, and even more preferably 20,000 or less. By making it equal to or less than the upper limit, the moldability of the molded article tends to be further improved.
• the viscosity average molecular weight is the viscosity average molecular weight of the mixture.
• the method for producing the polycarbonate resin is not particularly limited, and polycarbonate resins produced by the conventionally known phosgene method (interfacial polymerization method) or melt method (ester exchange method) can be used.
• polycarbonate resins with an adjusted amount of OH groups in the terminal groups can be used.
• the polycarbonate resin used in this embodiment may be recycled polycarbonate resin (including recovered products, material recycled products, chemical recycled products, etc.), rejected products, or scraps from thermoplastic resin molding.
• the content of the polycarbonate resin in the resin composition of this embodiment is preferably 85% by mass or more of the resin composition, more preferably 90% by mass or more, even more preferably 95% by mass or more, even more preferably 97% by mass or more, and even more preferably 98% by mass or more.
• the upper limit of the content of the polycarbonate resin in the resin composition is the amount such that the sum of the polycarbonate resin and the compound represented by formula (1) is 100% by mass.
• the resin composition of the present embodiment may contain only one type of polycarbonate resin, or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.
• the resin composition of this embodiment contains 0.01 to 1.5 parts by mass of the compound represented by formula (1) relative to 100 parts by mass of polycarbonate resin.
• the YI value of the obtained molded article can be reduced.
• the extrudability of the resin composition of this embodiment can be improved, making it easier to produce pellets.
• a resin composition (pellets) with excellent mold deposit during molding can be obtained.
• each R is independently a substituted or unsubstituted aliphatic hydrocarbon group having 1 to 10 carbon atoms.
• each R is independently a substituted or unsubstituted aliphatic hydrocarbon group having 1 to 10 carbon atoms, and preferably an unsubstituted aliphatic hydrocarbon group having 1 to 10 carbon atoms.
• the aliphatic hydrocarbon group is preferably a substituted or unsubstituted alkyl group, and more preferably an unsubstituted alkyl group.
• the alkyl group is preferably a straight-chain alkyl group or a branched alkyl group, and more preferably a straight-chain alkyl group.
• the aliphatic hydrocarbon group preferably has 7 or less carbon atoms, more preferably 5 or less carbon atoms, and even more preferably 3 or less carbon atoms.
• each R is preferably an unsubstituted alkyl group having 1 to 5 carbon atoms, more preferably an unsubstituted alkyl group having 1 to 4 carbon atoms, even more preferably an unsubstituted alkyl group having 1 to 3 carbon atoms, and still more preferably a methyl group or an ethyl group.
• R may be the same or different, but it is preferable that R is the same.
• the substituent that the substituted or unsubstituted aliphatic hydrocarbon group having 1 to 10 carbon atoms may have include an aryl group and a halogen atom, and a phenyl group, a fluorine atom and a chlorine atom are preferred. In this embodiment, it is preferred that the group is unsubstituted.
• the total number of hydrogen atoms directly bonded to the carbon atom bonded to the aromatic ring of the compound represented by formula (1) and the total number of hydrogen atoms directly bonded to the hydroxyl group directly bonded to the carbon atom bonded to the aromatic ring of the compound represented by formula (1) is preferably 3 or more, more preferably 4 or more. By making it equal to or more than the lower limit, the transmittance in the short wavelength region tends to be improved.
• the upper limit of the total number of hydrogen atoms directly bonded to the carbon atom bonded to the aromatic ring of the compound represented by formula (1) and the total number of hydrogen atoms directly bonded to the hydroxyl group directly bonded to the carbon atom bonded to the aromatic ring of the compound represented by formula (1) is preferably 6 or less, more preferably 5 or less, and even more preferably 4 or less. By making it equal to or less than the upper limit, the transmittance in the short wavelength region tends to be improved.
• the resin composition of the present embodiment contains two or more types of compounds represented by formula (1), the number of protons at the benzyl position of the compound represented by formula (1) and the addition concentration are multiplied, and the sum of these values is the relative proton number.
• the content of the compound represented by formula (1) in the resin composition of this embodiment is 0.01 parts by mass or more, preferably 0.05 parts by mass or more, more preferably 0.08 parts by mass or more, more preferably 0.1 parts by mass or more, even more preferably 0.2 parts by mass or more, and even more preferably 0.5 parts by mass or more, relative to 100 parts by mass of polycarbonate resin.
• the transmittance in the short wavelength region tends to be improved.
• the content of the compound represented by formula (1) is 1.5 parts by mass or less, preferably 1.3 parts by mass or less, more preferably 1.2 parts by mass or less, even more preferably 1.1 parts by mass or less, even more preferably 1.0 parts by mass or less, and even more preferably 0.9 parts by mass or less, relative to 100 parts by mass of polycarbonate resin.
• the resin composition of the present embodiment may contain only one type of compound represented by formula (1), or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.
• the resin composition of the present embodiment may contain other components as necessary, as long as the desired physical properties are not significantly impaired.
• the other components include various resin additives.
• resin additives include epoxy compounds and/or oxetane compounds, stabilizers, release agents, ultraviolet absorbers, colorants (dyes, pigments), antistatic agents, flame retardants, flame retardant assistants, anti-dripping agents, anti-fogging agents, anti-blocking agents, flow improvers, plasticizers, dispersants, antibacterial agents, etc.
• the resin additives may be contained alone or in any combination and ratio of two or more kinds.
• the resin composition of the present embodiment may contain an epoxy compound and/or an oxetane compound.
• an epoxy compound and/or an oxetane compound By containing an epoxy compound and/or an oxetane compound, the YI value and the YI value after heating can be reduced, and a molded product having excellent light transmittance in visible light can be obtained.
• the epoxy compound means a compound containing an epoxy group, and may contain only one epoxy group or two or more epoxy groups in one molecule, but preferably contains one to four epoxy groups, more preferably contains one to three epoxy groups, and even more preferably contains two epoxy groups.
• the oxetane compound means a compound containing an oxetanyl group, and may contain only one oxetanyl group or two or more oxetanyl groups in one molecule, but preferably contains one to four oxetanyl groups, more preferably contains one to three oxetanyl groups, and even more preferably contains two oxetanyl groups.
• the composition contains at least an epoxy compound.
• the molecular weight of the epoxy compound and/or oxetane compound is not particularly limited, but is preferably 100 or more, and is preferably 1500 or less, more preferably 1000 or less, even more preferably 800 or less, and may be 500 or less.
• the epoxy compound and/or the oxetane compound is preferably an alicyclic epoxy compound and/or an alicyclic oxetane compound.
• the alicyclic epoxy compound and/or alicyclic oxetane compound used in the present embodiment is preferably a compound represented by formula (2), a compound represented by formula (3), or a compound represented by formula (4), more preferably a compound represented by formula (2) and/or a compound represented by formula (4), and further preferably a compound represented by formula (2).
• Equation (2) (In formula (2), A 1 represents a divalent organic group.)
• a 1 is preferably a hydrocarbon group having 1 to 10 carbon atoms, -O-, -C( ⁇ O)-, or a group consisting of a combination of two or more of the above groups, and more preferably an alkylene group having 1 to 10 carbon atoms, -O-, -C( ⁇ O)-, or a group consisting of a combination of two or more of the above groups.
• the alkylene group may be linear, branched, or cyclic, preferably linear or branched, and more preferably linear.
• Preferred examples of the compound represented by formula (2) include the following compounds. Equation (3) (In formula (3), A2 and A3 each independently represent a divalent organic group.)
• each A 2 is independently preferably a hydrocarbon group having 1 to 10 carbon atoms, more preferably an alkylene group having 1 to 10 carbon atoms, and even more preferably an alkylene group having 1 to 3 carbon atoms.
• a 3 is preferably a hydrocarbon group having 1 to 20 carbon atoms, -O-, -C( ⁇ O)-, or a group consisting of a combination of two or more of the above groups, more preferably an alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 12 carbon atoms, -O-, -C( ⁇ O)-, or a group consisting of a combination of two or more of the above groups, and even more preferably an alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 12 carbon atoms, -O-, or a group consisting of a combination of two or more of the above groups.
• the end of A 3 is preferably a hydrocarbon group having 1 to 20 carbon atoms, more preferably an alkylene group having 1 to 10 carbon atoms or an arylene group having 6 to 12 carbon atoms, and even more preferably an alkylene group having 1 to 10 carbon atoms.
• Preferred examples of the compound represented by formula (3) include the following compounds. n is an arbitrary integer, preferably 1 to 11.
• Equation (4) (In formula (4), A4 and A5 each independently represent a divalent organic group.
• R a is an alkyl group having 1 to 5 carbon atoms, and nb is 0 or 1.)
• a 4 is preferably each independently a hydrocarbon group having 1 to 20 carbon atoms, -O-, -C( ⁇ O)-, or a group consisting of a combination of two or more of the above groups, more preferably an alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 12 carbon atoms, -O-, -C( ⁇ O)-, or a group consisting of a combination of two or more of the above groups, even more preferably an alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 12 carbon atoms, or a group consisting of a combination of two or more of the above groups, still more preferably an alkylene group having 1 to 10 carbon atoms, still more preferably an alkylene group having 1 to 3 carbon atoms, and still more preferably an ethylene group or a methylene group.
• the end of A5 is preferably a hydrocarbon group having 1 to 20 carbon atoms, more preferably an alkylene group having 1 to 10 carbon atoms or an arylene group having 6 to 12 carbon atoms, even more preferably an alkylene group having 1 to 10 carbon atoms, and even more preferably an alkylene group having 1 to 3 carbon atoms.
• R a is preferably an alkyl group having 1 to 3 carbon atoms, and is preferably a methyl group or an ethyl group.
• nb is preferably 1.
• Preferred examples of the compound represented by formula (4) include the following compounds.
• Preferred examples of the epoxy compound and/or oxetane compound used in this embodiment include, in addition to the above, the compounds described in paragraphs 0043 to 0069 of JP2021-038306A and paragraphs 0023 to 0037 of JP2021-031658A, the contents of which are incorporated herein by reference.
• the content is preferably 0.01 parts by mass or more, more preferably 0.05 parts by mass or more, even more preferably 0.1 parts by mass or more, even more preferably 0.2 parts by mass or more, and even more preferably 0.5 parts by mass or more, relative to 100 parts by mass of the polycarbonate resin.
• the content is preferably 0.01 parts by mass or more, more preferably 0.05 parts by mass or more, even more preferably 0.1 parts by mass or more, even more preferably 0.2 parts by mass or more, and even more preferably 0.5 parts by mass or more, relative to 100 parts by mass of the polycarbonate resin.
• the content of the epoxy compound and/or the oxetane compound is preferably 1.5 parts by mass or less, more preferably 1.3 parts by mass or less, even more preferably 1.1 parts by mass or less, even more preferably 1.0 parts by mass or less, and even more preferably 0.9 parts by mass or less, relative to 100 parts by mass of the polycarbonate resin.
• the resin composition of the present embodiment may contain only one type of epoxy compound and oxetane compound (preferably an epoxy compound), or may contain two or more types. When two or more types are contained, it is preferable that the total amount is in the above range.
• the resin composition of the present embodiment may contain a stabilizer.
• the stabilizers include heat stabilizers and antioxidants.
• Examples of the stabilizer include phenol-based, amine-based, phosphorus-based, and thioether-based stabilizers. Among these, in the present embodiment, it is preferable to include a phosphorus-based heat stabilizer.
• any known phosphorus-based heat stabilizer can be used.
• Specific examples include phosphorus oxoacids such as phosphoric acid, phosphonic acid, phosphorous acid, phosphinic acid, and polyphosphoric acid; metal acid pyrophosphates such as sodium acid pyrophosphate, potassium acid pyrophosphate, and calcium acid pyrophosphate; phosphates of Group 1 or Group 2B metals such as potassium phosphate, sodium phosphate, cesium phosphate, and zinc phosphate; organic phosphate compounds, organic phosphite compounds, and organic phosphonite compounds, with organic phosphite compounds other than the phosphite compounds having the structure represented by formula (P) described below being particularly preferred.
• phosphorus oxoacids such as phosphoric acid, phosphonic acid, phosphorous acid, phosphinic acid, and polyphosphoric acid
• metal acid pyrophosphates such as sodium acid pyrophosphate, potassium acid pyrophosphat
• organic phosphite compound examples include triphenyl phosphite, tris(mononylphenyl)phosphite, tris(mononyl/dinonyl-phenyl)phosphite, tris(2,4-di-tert-butylphenyl)phosphite, monooctyldiphenyl phosphite, dioctylmonophenyl phosphite, monodecyldiphenyl phosphite, didecylmonophenyl phosphite, tridecyl phosphite, trilauryl phosphite, tristearyl phosphite, and 2,2-methylenebis(4,6-di-tert-butylphenyl)octyl phosphite.
• organic phosphite compounds include "ADK STAB (registered trademark; the same applies hereinafter) 1178,""ADK STAB 2112," and “ADK STAB HP-10” manufactured by ADEKA CORPORATION, "JP-351,””JP-360,” and “JP-3CP” manufactured by Johoku Chemical Industry Co., Ltd., and "IRGAFOS (registered trademark; the same applies hereinafter) 168" manufactured by BASF SE.
• the resin composition of this embodiment may or may not contain a phosphite compound having a structure represented by formula (P).
• the content of the phosphite compound having a structure represented by formula (P) in the resin composition of this embodiment is preferably 0% by mass or more and less than 0.01% by mass, more preferably less than 0.001% by mass, and even more preferably less than 0.0001% by mass. In this way, by configuring the resin composition to be substantially free of the compound represented by formula (P), a molded product having excellent light transmittance for visible light can be obtained.
• Examples of compounds represented by formula (P) include distearyl pentaerythritol diphosphite, bis(decyl)pentaerythritol diphosphite, bis(tridecyl)pentaerythritol diphosphite, and bis(nonylphenyl)pentaerythritol diphosphite.
• a hindered phenol-based antioxidant is preferably used as the phenol-based antioxidant.
• Specific examples of hindered phenol-based antioxidants include pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, thiodiethylene bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], N,N'-hexane-1,6-diylbis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionamide], 2,4-dimethyl-6-(1-methylpentadecyl)phenol, diethyl[[3,5-bis(1,1-dimethylethyl)-4-hydroxyphenyl]methyl]phosphate, 4,6-bis(
• pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate] and octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate are preferred.
• hindered phenol-based antioxidants include "Irganox (registered trademark; the same applies below) 1010" and “Irganox 1076" manufactured by BASF, and "Adeka STAB AO-50" and "Adeka STAB AO-60” manufactured by ADEKA.
• the content of the stabilizer (preferably a phosphorus-based stabilizer other than a phosphite compound having a structure represented by formula (P)) in the resin composition of this embodiment is usually 0.001 part by mass or more, preferably 0.005 part by mass or more, more preferably 0.01 part by mass or more, and usually 1 part by mass or less, preferably 0.5 part by mass or less, more preferably 0.3 part by mass or less, relative to 100 parts by mass of the polycarbonate resin.
• the resin composition of the present embodiment may contain only one type of stabilizer, or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.
• the resin composition of the present embodiment may contain a mold release agent.
• the mold release agent By blending the mold release agent, the mold releasability can be further improved.
• the release agent include aliphatic carboxylic acids, salts of aliphatic carboxylic acids, esters of aliphatic carboxylic acids and alcohols, aliphatic hydrocarbon compounds having a number average molecular weight of 200 to 15,000, polysiloxane-based silicone oils, ketone waxes, and light amides. Of these, aliphatic carboxylic acids, salts of aliphatic carboxylic acids, and esters of aliphatic carboxylic acids and alcohols are preferred.
• the release agent For details of the release agent, please refer to paragraphs 0055 to 0061 of JP2018-095706A, the contents of which are incorporated herein by reference.
• the content thereof in the resin composition is preferably 0.01 to 3 mass %.
• the resin composition of the present embodiment may contain only one type of release agent, or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.
• the resin composition of this embodiment preferably has a low YI value when molded into a 300 mm long optical path molded product.
• the YI value when the resin composition of this embodiment is molded into a 300 mm long optical path molded product is preferably 17.3 or less, more preferably 16.5 or less, even more preferably 15.0 or less, and even more preferably 14.5 or less.
• the lower limit of the YI value is ideally 0, but even if it is 1.0 or more, further 5.0 or more, and particularly 10.0 or more, the required performance is sufficiently met.
• Such a low YI value is achieved by blending a compound represented by formula (1). The YI value is measured according to the method described in the Examples below.
• the resin composition of this embodiment has a light transmittance at a wavelength of 400 nm when molded into a 300 mm long optical path molded product of preferably 42.0% or more, more preferably 43.0% or more, more preferably 44.0% or more, even more preferably 45.0% or more, and even more preferably 47.0% or more.
• the upper limit of the light transmittance at a wavelength of 400 nm is not particularly specified, but 99.0% or less is practical, and even 95.0% or less sufficiently meets the required performance.
• the resin composition of this embodiment preferably has a light transmittance at a wavelength of 420 nm when molded into a 300 mm long optical path molded product of 56.0% or more, more preferably 57.0% or more, more preferably 58.0% or more, even more preferably 59.0% or more, and even more preferably 60.0% or more.
• the upper limit of the light transmittance at a wavelength of 420 nm is not particularly set, but 99.0% or less is practical, and even 95.0% or less sufficiently meets the required performance.
• the resin composition of this embodiment has a light transmittance at a wavelength of 500 nm when molded into a 300 mm long optical path molded product of preferably 65.0% or more, more preferably 67.0% or more, more preferably 68.0% or more, even more preferably 70.0% or more, and even more preferably 75.0% or more.
• the upper limit of the light transmittance at a wavelength of 500 nm is not particularly specified, but 99.0% or less is practical, and even if it is 95.0% or less, the required performance is sufficiently satisfied.
• the YI value and the light transmittance are measured according to the method described in the Examples section below.
• the method for producing the resin composition of the present embodiment is not limited, and a wide variety of known methods for producing resin compositions can be used.
• a method in which the polycarbonate resin, the compound represented by formula (1), and other components to be mixed as necessary are mixed in advance using various mixers such as a tumbler or a Henschel mixer, and then melt-kneaded using a mixer such as a Banbury mixer, a roll, a Brabender, a single-screw kneading extruder, a twin-screw kneading extruder, or a kneader can be used.
• the temperature for melt-kneading is not particularly limited, but is usually in the range of 240 to 320°C.
• the molded article of this embodiment is formed from the resin composition or pellets of this embodiment.
• the above-mentioned resin composition (for example, pellets) is molded into a molded article by various molding methods.
• the shape of the molded article is not particularly limited and can be appropriately selected depending on the use and purpose of the molded article, and examples thereof include film-shaped, rod-shaped, cylindrical, annular, circular, elliptical, polygonal, irregular, hollow, frame-shaped, box-shaped, panel-shaped, and button-shaped articles.
• the method for forming the molded product is not particularly limited, and any conventionally known molding method can be used, such as injection molding, injection compression molding, extrusion molding, profile extrusion, transfer molding, hollow molding, gas-assisted hollow molding, blow molding, extrusion blow molding, IMC (in-mold coating molding), rotational molding, multi-layer molding, two-color molding, insert molding, sandwich molding, foam molding, and pressure molding.
• the resin composition of this embodiment is suitable for molded products obtained by injection molding, injection compression molding, and extrusion molding.
• the resin composition of this embodiment is not limited to molded products obtained by these methods.
• the molded article of this embodiment can be widely used for molded articles containing polycarbonate resin, particularly optical parts. Specifically, it is preferably used in electric/electronic devices/parts, office automation devices/parts, information terminal devices/parts, machine parts, home appliances, vehicle parts, building materials, various containers, leisure goods/miscellaneous goods, lighting equipment, etc., and more specifically, it is preferably used for power covers, lighting lenses, lighting covers, light guiding members, etc. More specifically, it can be used for light guides and lenses that guide light from light sources such as LEDs in vehicle headlamps (headlamps), rear lamps, fog lamps, etc. for automobiles or motorcycles.
• the resin composition of this embodiment in addition to the above, the descriptions in JP-A-2020-189992, paragraphs 0098 to 0105, the contents of which are incorporated herein by reference.
• This mixture was fed to a single-screw extruder "VS40-32V" manufactured by Tanabe Plastics Machinery Co., Ltd., kneaded under conditions of a screw rotation speed of 80 rpm, a discharge rate of 20 kg/hr, and a barrel temperature of 250°C, and extruded in a strand shape from the tip of the extrusion nozzle.
• the extrudate was quenched in a water tank, cut and pelletized using a pelletizer, and pellets of the resin composition were obtained.
• the 300 mm long optical path molded product obtained above was used as a test piece, and the light transmittance at wavelengths of 400 nm, 420 nm, 440 nm, 460 nm, 480 nm, and 500 nm over a 300 mm length was measured using a long optical path spectrophotometer with a C light source and a 2°C field of view.
• the long-path spectrophotometric colorimeter used was "ASA1" manufactured by Nippon Denshoku Industries Co., Ltd. However, in Comparative Examples 1 and 2, the light transmittance was not measured because molding was not possible.
• the number of protons at the benzylic position means the total number of hydrogen atoms bonded directly to the carbon atom bonded to the aromatic ring of the compound represented by formula (1) and the number of hydrogen atoms bonded to the hydroxyl group bonded directly to the carbon atom bonded to the aromatic ring of the compound represented by formula (1).
• the resin composition of the present embodiment gave molded articles with low YI values. Furthermore, the molded article obtained from the resin composition of the present embodiment had excellent extrudability, good mold deposit, and high light transmittance in the visible region.

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