WO2024210000A1 - シリコーン組成物および粘着部材 - Google Patents

シリコーン組成物および粘着部材 Download PDF

Info

Publication number
WO2024210000A1
WO2024210000A1 PCT/JP2024/011949 JP2024011949W WO2024210000A1 WO 2024210000 A1 WO2024210000 A1 WO 2024210000A1 JP 2024011949 W JP2024011949 W JP 2024011949W WO 2024210000 A1 WO2024210000 A1 WO 2024210000A1
Authority
WO
WIPO (PCT)
Prior art keywords
silicone
adhesive
addition
silicone rubber
composition
Prior art date
Application number
PCT/JP2024/011949
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
衛一 工藤
拓巳 熊澤
靖史 土屋
Original Assignee
株式会社寺岡製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社寺岡製作所 filed Critical 株式会社寺岡製作所
Priority to JP2024521128A priority Critical patent/JPWO2024210000A1/ja
Priority to TW113112289A priority patent/TW202444831A/zh
Publication of WO2024210000A1 publication Critical patent/WO2024210000A1/ja

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition

Definitions

  • the present invention relates to a silicone composition and an adhesive member having a layer of silicone adhesive formed after the silicone composition has hardened.
  • Patent Documents 1 to 3 disclose examples of adhesive members having a silicone adhesive layer.
  • Patent Document 1 discloses an adhesive sheet for processing electronic components, etc., used for electronic components such as semiconductor wafers or chips.
  • This adhesive sheet holds the electronic components, etc. on a layer of silicone adhesive so that the laminate with the electronic components, etc. can be brought into contact with an organic solvent.
  • Patent Document 2 also discloses an addition-curing silicone adhesive composition and its cured product that can be used for temporary fixation of micro-objects.
  • the addition-curing silicone adhesive composition in Patent Document 2 does not contain solid resin components that are not involved in crosslinking, so it has sufficient adhesive strength as an adhesive for temporary fixation and has the advantage of little migration of material components.
  • Patent Document 3 discloses a protective film having a silicone adsorption layer for protecting the surface of a touch panel, which can be easily attached and peeled off repeatedly from the surface of a touch panel or the like.
  • the size of the semiconductor electronic components that are to be held by the adhesive sheet for processing electronic components in Patent Document 1 is approximately 5 to 10 millimeters. Therefore, even if the adhesive strength of the adhesive sheet in Patent Document 1 is approximately 800 millinewtons per 25 millimeter width, the electronic components can be peeled off from the surface of the adhesive layer without being embedded in the adhesive layer.
  • the adhesive sheet of Patent Document 1 when using the adhesive sheet of Patent Document 1 to temporarily fix electronic components, etc., that are smaller than the electronic components envisioned in Patent Document 1 (sizes of several micrometers to several tens of micrometers), the adhesive is flexible and has a strong adhesive force, so the electronic components, etc. bite into the adhesive layer, making it difficult to remove the temporarily fixed electronic components, etc.
  • Patent Document 2 Although the addition-type silicone adhesive composition in Patent Document 2 is suitable for temporary fixing of semiconductor devices with advanced miniaturization, it is necessary to prepare a special cross-linkable organopolysiloxane resin that is involved in the cross-linking.
  • the silicone adsorption sheet in Patent Document 3 functions as a protective film to protect the surface of a touch panel, and is not intended to hold objects. As a result, it does not have sufficient adhesive strength to hold objects, and if it is used to temporarily fix electronic components, etc., there is a problem that the electronic components, etc. may fall off during transportation.
  • Patent Documents 1 and 3 anticipate contamination due to migration of adhesive material components to electronic components, etc.
  • an adhesive member with a silicone adhesive layer that has sufficient adhesive strength to prevent tiny electronic components, such as micro LEDs with chip sides of about 50 to 200 micrometers, mini LEDs with chip sides of less than 50 micrometers, and optical chips of image sensors, from peeling off during transport even when these electronic components are temporarily fixed and transported. Furthermore, there is a demand for an adhesive member that has adhesive properties that make it difficult for electronic components to sink into the adhesive member, that allows the electronic components to be easily peeled off, and that makes it difficult for material components to transfer to the fixed component when peeled off.
  • a silicone composition that contains an addition-curing liquid silicone rubber that cures by a reaction between a vinyl group and a Si-H bond, the silicone composition containing a polysiloxane containing a vinyl group and a polysiloxane containing a Si-H bond, and an MQ silicone resin, the silicone composition contains the addition-curing liquid silicone rubber and the MQ silicone resin as main components, the weight content of the MQ silicone resin relative to the sum of the addition-curing liquid silicone rubber and the MQ silicone resin is 10% or more and 40% or less, the swelling degree of the addition-curing liquid silicone rubber after curing alone is 350% or less according to the swelling degree measurement method described below, and the silicone composition becomes a silicone adhesive after curing having a Shore hardness A of 17 or more and 90 or less and an adhesive strength of 5.0 or more and 26.0 newtons or less per 25 square millimeters.
  • the silicone composition of the present invention becomes a silicone adhesive having a Shore A hardness of 17 or more and 90 or less, and an adhesive strength of 5.0 or more and 26.0 or less Newtons per 25 square millimeters. This allows for adhesive strength that allows for temporary fixing of tiny electronic components less than 200 micrometers, and realizes adhesive properties that are unlikely to sink into the adhesive material, are easy to peel off, and are unlikely to cause migration of material components from the adhesive material.
  • FIG. 1 is a cross-sectional view showing a conceptual cross section of an adhesive member according to a first embodiment of the present invention.
  • FIG. 4 is a cross-sectional view showing a conceptual cross section of an adhesive member according to a second embodiment of the present invention.
  • FIG. 11 is a cross-sectional view showing a conceptual cross section of an adhesive member according to a third embodiment of the present invention.
  • FIG. 10 is a cross-sectional view showing a conceptual cross section of an adhesive member according to a fourth embodiment of the present invention.
  • the silicone composition according to the basic embodiment of the present invention will be described below.
  • the silicone composition after curing is defined as a "silicone pressure sensitive adhesive.”
  • the silicone composition is formed by mixing an addition-curing liquid silicone rubber and an MQ silicone resin in a predetermined content ratio, which will be described later.
  • the silicone composition of the present invention contains addition curable liquid silicone and MQ silicone resin as main components.
  • the term "main component” refers to a component that has a large effect on the properties of the silicone composition, and means the component with the largest content (excluding fillers and solvents, which will be described later).
  • the combined content of addition curable liquid silicone and MQ silicone resin in the silicone composition exceeds 50% by weight, preferably 60% by weight or more, more preferably 75% by weight or more, and even more preferably 95% by weight or more. This also applies when the content is 100% by weight.
  • the addition-curing liquid silicone rubber in this invention is typically a silicone having a skeleton mainly composed of two-dimensional siloxane bonds.
  • the addition-curing liquid silicone rubber is a silicone rubber that cures by the reaction between vinyl groups and Si-H bonds, and is defined as an addition-curing liquid silicone rubber that contains a polysiloxane containing a vinyl group and a polysiloxane containing a Si-H bond.
  • Addition type liquid silicone rubber cures by the reaction of vinyl groups with Si-H bonds, and is available in one-component types in which a polysiloxane containing vinyl groups and a polysiloxane containing Si-H bonds are premixed, and two-component types in which a polysiloxane containing vinyl groups and a polysiloxane containing Si-H bonds are mixed at the time of use.
  • addition-type liquid silicone rubbers include LSR7005, LSR7030, LSR7040, LSR7050, LSR7060, LSR7070FC, LSR7080, LSR7080J, and LSR7090 manufactured by Momentive Performance Materials Japan LLC, and MS-1001, MS-1002, and MS-1003 manufactured by Dow Toray Co., Ltd.
  • the addition-curing liquid silicone rubber may be used not only as a single material containing addition-curing liquid silicone rubber, but also as a mixture of multiple materials containing addition-curing liquid silicone rubber.
  • MQ silicone resin is a silicone having a skeleton mainly composed of three-dimensional siloxane bonds.
  • the "M (unit)” represents R3SiO
  • the "Q (unit)” represents SiO4
  • MQ silicone resin is a silicone resin composed of a combination of trialkylsiloxy units (M units ( R3SiO1 /2 )) and tetrafunctional siloxy units (Q units (SiO4 /2 )).
  • the R group in the M unit represents an organic (C-containing) substituent.
  • the R group include a hydrocarbon group (especially an alkyl) containing 1 to 10 carbon atoms, a phenyl group, a phenylalkyl group, or a hydroxyl group. Of these, an alkyl group or a hydroxyl group containing 1 to 8 carbon atoms is preferred, and a methyl group or a phenyl group is more preferred. All the R groups may be the same or different.
  • MQ silicone resins examples include trimethylsiloxysilicate, trifluoroalkyldimethyltrimethylsiloxysilicate, phenylmethylvinylsiloxysilicate, and phenylpropyldimethylsiloxysilicate.
  • MQ silicone resins examples include SR545, SR1000, SS4230, and SS4267 manufactured by Momentive Performance Materials Japan, LLC; KF-7312J, KF-9021, KM-9717, X-21-5249, X-21-5595, X-21-5616, X-52-8005, and X-51-1302M manufactured by Shin-Etsu Chemical Co., Ltd.; BY11-018 and BELSIL TMS 803 manufactured by Wacker Asahi Kasei Silicone Co., Ltd.; and MQ-1600 Solid Resin manufactured by Dow Toray Co., Ltd.
  • MQ silicone resins may be used not only as a single material containing MQ silicone resin, but also as a mixture of multiple materials containing MQ silicone resin.
  • the silicone composition can be prepared to contain additives such as coloring materials (pigments or dyes), adhesion aids, adhesion promoters, polymerization inhibitors, antioxidants, ultraviolet absorbers which are light resistance stabilizers, light stabilizers, antistatic agents, peroxide curing agents, adhesion promoters, reaction regulators, silane coupling agents, addition reaction control agents, fillers (described below), non-reactive silicone compounds, silicone rubber components other than addition-curing liquid silicone rubber, silicone resins other than MQ silicone resins, silicone oligomers, thermosetting resins, etc., within the scope of the invention.
  • additives such as coloring materials (pigments or dyes), adhesion aids, adhesion promoters, polymerization inhibitors, antioxidants, ultraviolet absorbers which are light resistance stabilizers, light stabilizers, antistatic agents, peroxide curing agents, adhesion promoters, reaction regulators, silane coupling agents, addition reaction control agents, fillers (described below), non-reactive silicone compounds, silicone rubber components
  • Reaction regulators include, for example, 1-ethynylcyclohexanol, 3,5-dimethyl-1-hexyn-3-ol, 3-methyl-1-butyn-3-ol, 1-phenyl-2-propyn-1-ol, etc.
  • silane coupling agents examples include vinyltrimethoxysilane, vinyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, and 3-aminopropyltrimethoxysilane.
  • Addition reaction control agents include, for example, addition reaction control agents for imparting curability and pot life, and addition reaction retarders containing linear or cyclic alkenyl groups.
  • the silicone gum component may be, for example, polydimethylsiloxane gum.
  • the silicone gum may be crosslinked.
  • Silicone gums are often polydiorganosiloxanes with organo groups selected from alkyl, haloalkyl, aralkyl, alkenyl, aryl, alkoxy, or halogen-substituted aryl groups.
  • Representative organo groups include, but are not limited to, methyl, ethyl, phenyl, and the like.
  • non-reactive silicone compounds include silicone oils made of polysiloxane, polyether-modified silicone oils, aralkyl-modified silicone oils, fluoroalkyl-modified silicone oils, long-chain alkyl-modified silicone oils, higher fatty acid ester-modified silicone oils, higher fatty acid amide-modified silicone oils, and phenyl-modified silicone oils.
  • modified silicone resins include OH-modified silicone resin, vinyl-modified silicone resin, and phenyl-modified silicone resin.
  • thermosetting resins include unsaturated polyester resins, thermosetting acrylic resins, thermosetting amino resins, thermosetting melamine resins, thermosetting urea resins, thermosetting urethane resins, thermosetting oxetane resins, and thermosetting epoxy/oxetane composite resins.
  • the method for producing the silicone composition there are no particular limitations on the method for producing the silicone composition, and it can be obtained by mixing and stirring each component, and other components as necessary, in any order.
  • a silicone adhesive is defined as a cured silicone composition, and the silicone adhesive can be applied to the adhesive members 1a to 1d in the embodiments described below.
  • the silicone composition can be used as a silicone adhesive, which is a cured product obtained by curing the silicone composition.
  • the silicone composition can be applied to a material with high separability and cured to form a silicone adhesive.
  • "curing” refers to providing an elastomeric structure to the silicone composition by crosslinking.
  • crosslinking of polymers There are two types of crosslinking of polymers: chemical crosslinking, which utilizes the formation of covalent bonds to bond polymer chains together, and physical crosslinking, which utilizes reversible interactions due to non-covalent bonds such as hydrophobic interactions, ionic interactions, hydrogen bonds, or coordinate bonds.
  • the crosslinking of the addition-type liquid silicone rubber of the present invention is preferably chemical crosslinking, since it is strong and has little volume change due to swelling.
  • organic peroxide crosslinking type can also be used as a crosslinking form.
  • addition reaction curing which is a crosslinking mechanism in which a platinum catalyst or the like is contained in the addition-curing liquid silicone rubber and the non-crosslinking MQ silicone resin, can be selected.
  • crosslinking agents include organopolysiloxanes having at least two hydrogen atoms bonded to silicon atoms in one molecule, specifically dimethylhydrogensiloxane-methylhydrogensiloxane copolymers endblocked with dimethylhydrogensiloxane, trimethylsiloxy group endblocked dimethylsiloxane-methylhydrogensiloxane copolymers, trimethylsiloxy group endblocked methylhydrogenpolysiloxanes, and poly(hydrogensilsesquioxanes).
  • the catalyst examples include platinum-based catalysts such as particulate platinum, particulate platinum adsorbed on a carbon powder carrier, chloroplatinic acid, alcohol-modified chloroplatinic acid, olefin complexes of chloroplatinic acid, and platinum group metal compounds such as palladium and rhodium. By using such catalysts, the curing reaction can be made to proceed more efficiently.
  • platinum-based catalysts include CAT-PL-50T manufactured by Shin-Etsu Chemical Co., Ltd. and DOWSIL® NC-25 or DOWSIL® SRX212 manufactured by Dow Toray Co., Ltd.
  • the amount of platinum catalyst contained is an effective amount as a catalyst, and can be adjusted as appropriate depending on the desired curing speed.
  • the method for applying the silicone composition is not particularly limited, and can be appropriately selected from known application methods such as a spin coater, comma coater, lip coater, roll coater, die coater, knife coater, blade coater, rod coater, kiss coater, gravure coater, screen coating, dip coating, cast coating, etc.
  • the method for curing the silicone composition is not particularly limited, and can be selected from, for example, heat curing, room temperature curing, ultraviolet curing, or a combination of these.
  • the content ratio of the addition type liquid silicone rubber and the MQ silicone resin can be defined as the weight content of the MQ silicone resin relative to the sum of the weight of the addition type liquid silicone rubber and the weight of the MQ silicone resin.
  • the weight content of the MQ silicone resin relative to the sum of the weight of the addition type liquid silicone rubber and the weight of the MQ silicone resin is adjusted to be 10 percent or more and 40 percent or less.
  • the silicone composition has excellent adhesive strength (dynamic adhesive strength)
  • the weight content of the MQ silicone resin relative to the sum of the weight of the addition type liquid silicone rubber and the weight of the MQ silicone resin is 20 percent or more and 40 percent or less.
  • the weight content of the addition type liquid silicone rubber is the remainder obtained by subtracting the weight of the MQ silicone resin from the sum of the weight of the addition type liquid silicone rubber and the weight of the MQ silicone resin, which is the total (100 percent).
  • the crosslink density of the adhesive composition depends on the swelling degree of the adhesive composition. That is, when the crosslink density is high, the three-dimensionally crosslinked polymer chains that constitute the adhesive are difficult to spread even when immersed in toluene, and the swelling degree is low. On the other hand, when the crosslink density is low, the polymer chains are easy to spread, and the swelling degree is high. Therefore, the crosslink density of the addition type liquid silicone rubber that forms the silicone composition is expressed by the swelling degree of the addition type liquid silicone rubber that forms the silicone composition. That is, in order to obtain a silicone composition that has an appropriate adhesive force that can temporarily fix small electronic components, etc.
  • the swelling degree of the addition type liquid silicone rubber that forms the silicone composition alone after curing can be measured, and the crosslink density of the addition type liquid silicone rubber can be controlled based on that.
  • the degree of swelling of the adhesive member after hardening the silicone composition containing the addition type liquid silicone rubber is adjusted to be 350 percent or less. More particularly, it is preferable that the degree of swelling is adjusted to be 300 percent or less.
  • the swelling degree is defined as follows. That is, a sample of addition-curable liquid silicone rubber alone is used, which is prepared as a test piece for measuring swelling degree, having a thickness of 50 micrometers and a square shape (50 mm x 50 mm) with one side being 50 millimeters (50 millimeter sides).
  • the test piece for measuring swelling degree means a sample in which only the addition-curable liquid silicone rubber is cured.
  • the swelling degree defined in the present invention is a swelling ratio defined as the amount of toluene absorbed by immersing this sample in toluene for one day in an atmosphere of 23 degrees Celsius (°C) and 50 percent humidity, with the mass of the insoluble portion being taken as 100 percent.
  • A is defined as the initial mass of the sample (test piece for measuring the swelling degree of silicone rubber)
  • B is the mass of the sample (test piece for measuring the swelling degree of silicone rubber) after immersion in toluene
  • C is the dry mass of the sample (test piece for measuring the swelling degree of silicone rubber) after immersion in toluene and drying at 130 degrees Celsius (°C) for 2 hours.
  • the Shore hardness A (JIS K6253) of the addition type liquid silicone rubber alone that forms the silicone composition of the present invention after curing is preferably in the range of 25 to 90 from the viewpoint of suppressing sinking of electronic components into the adhesive member.
  • the Shore hardness A of the blend is measured after it has cured.
  • the silicone composition may further contain a filler.
  • a filler has the advantage that the physical properties of the silicone composition, such as the elastic modulus, dimensional stability, yield strength, and breaking elongation, can be easily adjusted.
  • Representative examples of fillers include inorganic fillers and organic fillers.
  • Representative shapes of fillers include spherical, acicular, and flake-shaped. One type of filler selected from these may be contained, or two or more types of fillers may be contained.
  • Constituent materials for inorganic fillers include, for example, crystalline silica, amorphous silica, silicone powder, wollastonite, talc, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, aluminum borate whiskers, and boron nitride.
  • Constituent materials for inorganic fillers include elemental metals such as aluminum, gold, silver, copper, and nickel, as well as alloys, amorphous carbon, and graphite.
  • constituent materials for organic fillers include, for example, polymethylmethacrylate (PMMA), polyimide, polyamideimide, polyetheretherketone, polyetherimide, and polyesterimide.
  • PMMA polymethylmethacrylate
  • Polyimide polyimide
  • polyamideimide polyamideimide
  • polyetheretherketone polyetheretherketone
  • polyesterimide polyesterimide.
  • Silica gel and silicone powder can also be selected as fillers because of their excellent colorlessness and transparency.
  • the silicone adhesive After the silicone composition thus prepared is cured, the silicone adhesive has the following properties: a Shore A hardness of 17 to 90; and an adhesion strength of 5.0 to 26.0 Newtons per 25 square millimeters.
  • the silicone adhesive further has a reference adhesion strength to float glass of 0.02 to 0.75 Newtons per centimeter width, and a silicone migration amount of less than 1 microgram per square centimeter as measured by X-ray fluorescence analysis.
  • the silicone adhesive obtained by curing the silicone composition prepared in this manner has the above-mentioned properties.
  • Tables 1 to 3 will be used to explain Examples 1 to 9 that are compatible with the present invention and Comparative Examples 1 to 6 that are incompatible with the present invention.
  • Table 1 shows Examples 1 to 9
  • Table 2 shows Comparative Examples 1 to 4
  • Table 3 shows Comparative Examples 5 and 6.
  • the samples of Examples 1 to 9 are addition-curing liquid silicone rubber alone, which is a component of the silicone composition, and have been prepared so that the swelling degree measured by the swelling degree measurement method described below is in the range of 350 percent or less.
  • the samples are addition-curing liquid silicone rubber that cures by the reaction between vinyl groups and Si-H bonds and contains a polysiloxane containing vinyl groups and a polysiloxane containing Si-H bonds, and have been prepared so that the swelling degree is in the range of 350 percent or less.
  • the compositions of the silicone compositions of Examples 1 to 9 are as follows:
  • Example 1 Momentive Performance Materials' product name LSR7060 was selected as the addition-curing liquid silicone rubber, and Momentive Performance Materials' product SR545 was selected as the MQ silicone resin.
  • the MQ silicone resin was prepared to be 42.9% by mass when the addition-curing liquid silicone rubber was taken as 100% by mass.
  • the weight content of the MQ silicone resin relative to the sum of the addition-curing liquid silicone rubber and the MQ silicone resin was prepared to be 30%.
  • Example 2 As in Example 1, Momentive Performance Materials' product name LSR7060 was selected as the addition-curing liquid silicone rubber, and Momentive Performance Materials' product SR545 was selected as the MQ silicone resin.
  • the composition was adjusted so that the MQ silicone resin was 25.0% by mass when the addition-curing liquid silicone rubber was 100% by mass.
  • the weight content of the MQ silicone resin relative to the sum of the addition-curing liquid silicone rubber and the MQ silicone resin was adjusted to 20%.
  • Example 3 as in Example 1, Momentive Performance Materials' product name LSR7060 was selected as the addition-curing liquid silicone rubber, and Momentive Performance Materials' product SR545 was selected as the MQ silicone resin.
  • the MQ silicone resin was prepared to be 66.7% by mass when the addition-curing liquid silicone rubber was taken as 100% by mass.
  • the weight content of the MQ silicone resin relative to the sum of the addition-curing liquid silicone rubber and the MQ silicone resin was prepared to be 40%.
  • Example 4 similar to Example 1, Momentive Performance Materials' product name LSR7060 was selected as the addition-curing liquid silicone rubber, and Momentive Performance Materials' product SR545 was selected as the MQ silicone resin.
  • the MQ silicone resin was prepared to be 11.1% by mass when the addition-curing liquid silicone rubber was taken as 100% by mass.
  • the weight content of the MQ silicone resin relative to the sum of the addition-curing liquid silicone rubber and the MQ silicone resin was prepared to be 10%.
  • Example 5 Momentive Performance Materials' product name LSR7030 was selected as the addition-curing liquid silicone rubber, and Momentive Performance Materials' product SR545 was selected as the MQ silicone resin.
  • the MQ silicone resin was prepared to be 42.9% by mass when the addition-curing liquid silicone rubber was taken as 100% by mass.
  • the weight content of the MQ silicone resin relative to the sum of the addition-curing liquid silicone rubber and the MQ silicone resin was prepared to be 30%.
  • Example 6 Momentive Performance Materials' product names LSR7060 and LSR7005 were selected as the addition-curing liquid silicone rubbers, and Momentive Performance Materials' SR545 was selected as the MQ silicone resin.
  • the addition-curing liquid silicone rubbers LSR7060 and LSR7005 were each 50% by mass (total 100% by mass) and the MQ silicone resin was 42.9% by mass.
  • the weight content of the MQ silicone resin relative to the sum of the addition-curing liquid silicone rubber and the MQ silicone resin was adjusted to 30%.
  • Example 7 Momentive Performance Materials' product names LSR7060 and LSR7005 were selected as the addition-curing liquid silicone rubber, and Momentive Performance Materials' SR545 was selected as the MQ silicone resin.
  • the addition-curing liquid silicone rubber LSR7060 was 70% by mass and LSR7005 was 30% by mass (total amount 100% by mass) and the MQ silicone resin was 42.9% by mass.
  • the weight content of the MQ silicone resin relative to the sum of the addition-curing liquid silicone rubber and the MQ silicone resin was adjusted to 30%.
  • Example 8 Momentive Performance Materials' product name 7080J was selected as the addition-curing liquid silicone rubber, and Momentive Performance Materials' SR545 was selected as the MQ silicone resin.
  • the MQ silicone resin was prepared to be 42.9% by mass when the addition-curing liquid silicone rubber was taken as 100% by mass.
  • the weight content of the MQ silicone resin relative to the sum of the addition-curing liquid silicone rubber and the MQ silicone resin was prepared to be 30%.
  • Example 9 is the same as Example 1 in that the addition-curing liquid silicone rubber is LSR7060 manufactured by Momentive Performance Materials, and the MQ silicone resin is SR545 manufactured by Momentive Performance Materials. Like Example 1, Example 9 is prepared so that the MQ silicone resin is 42.9% by mass when the addition-curing liquid silicone rubber is 100% by mass. In Example 9, the weight content of the MQ silicone resin relative to the sum of the addition-curing liquid silicone rubber and the MQ silicone resin is prepared to be 30%. In addition to Example 1, Example 9 further contains a filler, and is prepared so that the filler is 1.4% by mass when the addition-curing liquid silicone rubber is 100% by mass.
  • a platinum catalyst is added in advance to the addition-curing liquid silicone rubber contained in the silicone composition corresponding to the silicone adhesive of Example 1 to Example 9.
  • the weight content of the MQ silicone resin relative to the sum of the addition-curing liquid silicone rubber and the MQ silicone resin is 10% or more and 40% or less, and the swelling degree of the addition-curing liquid silicone rubber after it is cured by itself is adjusted to 350% or less, as measured by the swelling degree measurement method described below.
  • the samples of Comparative Example 1 to Comparative Example 6 are addition type liquid silicone rubbers that are cured by reaction between vinyl groups, which are components of the silicone composition, and Si-H bonds, and are samples that have been prepared so that the swelling degree measured by the swelling degree measurement method described below after the addition type liquid silicone rubber containing a polysiloxane containing a vinyl group and a polysiloxane containing a Si-H bond is cured alone exceeds 350 percent.
  • the compositions of the silicone compositions of Comparative Example 1 to Comparative Example 6 are as follows:
  • Comparative Example 2 Momentive Performance Materials' product name LSR7060 was selected as the addition-curing liquid silicone rubber, and Momentive Performance Materials' product SR545 was selected as the MQ silicone resin. Comparative Example 2 was prepared so that the MQ silicone resin was 100% by mass when the addition-curing liquid silicone rubber was 100% by mass. Comparative Example 2 was prepared so that the weight content of the MQ silicone resin relative to the sum of the addition-curing liquid silicone rubber and the MQ silicone resin was 50%.
  • Examples 1 to 9 and Comparative Examples 1 to 4 were made by curing a silicone composition to form a silicone adhesive, which was then used to produce an adhesive tape in the form of an adhesive member as described below.
  • a silicone composition was prepared by mixing silicone resin, filler, toluene (dilution solvent), and ethyl acetate (dilution solvent) in a specified ratio (by weight) for 100 parts of silicone rubber solids by weight, and the silicone composition was applied to polyimide according to the procedure described above, and then dried and cured at 170 degrees Celsius (°C) to remove the dilution solvent and crosslink, forming a silicone adhesive.
  • the amount of silicone composition applied was controlled so that the silicone adhesive film thickness after curing was 30 micrometers.
  • a PET release liner which is a polyethylene terephthalate resin release film (PET resin release film), was attached to the silicone adhesive, and accelerated at 40 degrees Celsius (°C) for three days.
  • the swelling degree measurement samples of Examples 1 to 9 and Comparative Examples 1 to 4 were prepared by first mixing the same silicone rubber as above with toluene (dilution solvent) and ethyl acetate (dilution solvent), applying the mixture to a PET release liner, and drying at 170 degrees Celsius (°C) to remove the dilution solvent and crosslink the mixture to form a measurement composition. Next, a PET release liner was attached to the measurement composition, and the mixture was accelerated at 40 degrees Celsius (°C) for three days to obtain a swelling degree measurement sample. The amount of the swelling degree measurement sample applied was controlled so that the film thickness of the swelling degree measurement sample after curing was 50 micrometers.
  • a silicone composition was prepared by mixing one or two types of addition-curing silicone adhesive stock solutions having a specified solid content with toluene (diluting solvent) and ethyl acetate (diluting solvent) in the content ratio (by weight) shown in Table 3, and the silicone composition was applied to polyimide according to the procedure described above, and dried and cured at 150 degrees Celsius (°C) to remove the diluting solvent and crosslink, to form a silicone adhesive. The amount of silicone composition applied was controlled so that the silicone adhesive film thickness after curing was 30 micrometers.
  • the swelling degree measurement samples of Comparative Examples 5 and 6 were prepared by mixing the same addition-curing silicone adhesive stock solution as above, toluene (dilution solvent), and ethyl acetate (dilution solvent) in a specified ratio (by weight), applying it to a PET release liner, and drying it at 150 degrees Celsius (°C) to remove the dilution solvent and crosslink the mixture, forming a measurement composition.
  • a PET release liner was attached to the measurement composition to obtain a swelling degree measurement sample.
  • the amount of the swelling degree measurement sample applied was controlled so that the film thickness of the swelling degree measurement sample after curing was 50 micrometers.
  • the swelling degree of Examples 1 to 9 and Comparative Examples 1 to 4 is measured using a sample of addition-curing liquid silicone rubber alone, which is prepared as a test piece for measuring swelling degree, having a thickness of 50 micrometers and a square shape (50 mm x 50 mm) with one side measuring 50 millimeters (50 millimeters square).
  • the swelling degree defined in the present invention is the swelling ratio defined as the amount of toluene absorbed when the sample is immersed in toluene for one day in an atmosphere of 23 degrees Celsius (°C) and 50 percent humidity, with the mass of the insoluble portion considered as 100 percent.
  • A is defined as the initial mass of the sample (test piece for measuring the swelling degree of silicone rubber)
  • B is the mass of the sample (test piece for measuring the swelling degree of silicone rubber) after immersion in toluene
  • C is the dry mass of the sample (test piece for measuring the swelling degree of silicone rubber) after immersion in toluene and drying at 130 degrees Celsius (°C) for 2 hours.
  • the swelling degrees of Comparative Examples 5 and 6 were measured (compared) using the silicone rubber component from which the silicone-based adhesive was cured and then washed with toluene to remove the MQ silicone resin already contained therein.
  • the swelling degree of Comparative Examples 5 and 6 was measured in the same manner as above, using a sample of addition-curing liquid silicone rubber alone, which was prepared as a square (50 mm x 50 mm) test piece for measuring swelling degree, 50 micrometers thick and 50 millimeters on each side (50 millimeter corners).
  • the swelling degree defined in the present invention is a swelling ratio defined as the amount of toluene absorbed when the sample is immersed in toluene for one day in an atmosphere of 23 degrees Celsius (°C) and 50 percent humidity, with the mass of the insoluble portion being 100 percent.
  • A is defined as follows: A: initial mass of the sample (test piece for measuring the swelling degree of silicone-based pressure-sensitive adhesive); B: mass of the sample after immersion in toluene (test piece for measuring the swelling degree of silicone rubber); C: dry mass of the sample after immersion in toluene and drying at 130 degrees Celsius (°C) for 2 hours (test piece for measuring the swelling degree of silicone rubber only (silicone rubber alone)).
  • the prepared silicone composition was placed in an aluminum cup No. 3, thoroughly pre-dried at room temperature and 60 degrees Celsius (°C), cross-linked at 170 degrees Celsius (°C), and accelerated at 40 degrees Celsius (°C) for three days to obtain a silicone adhesive as a sample for measuring Shore hardness A.
  • the amount of silicone composition applied was controlled so that the film thickness of the silicone adhesive after curing was 6 to 10 mm.
  • the prepared silicone composition was placed in an aluminum cup No.
  • MQ silicone resin amount is shown as the amount when “silicone rubber weight” is taken as 100.
  • MQ silicone resin weight content is the weight content ratio of MQ silicone resin when the sum of silicone rubber and MQ silicone resin is taken as 100 percent, meaning that if the weight content of MQ silicone resin is 30 percent, the weight content of silicone rubber is 70 percent.
  • the degree of swelling is expected to have an error of about +/- 10 percent.
  • A-1 to A-4 and B-1 are as follows.
  • A-1 Addition-curing liquid silicone rubber (product name LSR7060, manufactured by Momentive Performance Materials)
  • A-2 Addition-curing liquid silicone rubber (product name LSR7030, manufactured by Momentive Performance Materials)
  • A-3) Addition-curing liquid silicone rubber (product name LSR7080J, manufactured by Momentive Performance Materials)
  • A-4) Addition-curing liquid silicone rubber (product name LSR7005, manufactured by Momentive Performance Materials)
  • B-1) MQ silicone resin product name SR545, manufactured by Momentive Performance Materials
  • S1, S2 and catalyst C are as follows.
  • S1 Addition-curing silicone-based adhesive (product name SD-4560, manufactured by Dow Toray) solid content concentration 60% by mass
  • S2 Addition-curing silicone-based adhesive (product name SD-4587L, manufactured by Dow Toray) solid content concentration 40% by mass
  • Catalyst C Platinum catalyst (product name NC-25, manufactured by Dow Toray)
  • the Shore hardness A of the silicone pressure-sensitive adhesive is a value measured in accordance with JIS K6253.
  • the Shore hardness A is a hardness index that is often used when measuring the hardness of soft samples such as rubber and elastomers. If the Shore hardness A of the silicone composition is less than 17, there is a risk that electronic components or the like will sink into the formed pressure-sensitive adhesive member.
  • the adhesive strength of a silicone adhesive is defined as the dynamic adhesive strength, which is the force at which peeling occurs when a tensile load is applied in a direction perpendicular to the entire surface of the applied test specimen.
  • a test specimen with an area of 25 square millimeters was attached with the adhesive side to a stainless steel jig, and the base surface was fixed to a glass plate using double-sided tape (Teraoka Seisakusho, No. 7641#75), and a pressure load of 5 megapascals was applied for 1 minute to adhere the test specimen. The test was then performed on the test specimen within a curing period of 30 minutes to 1 hour.
  • the test was measured using a Strograph E-L made by Toyo Seiki Seisakusho Co., Ltd. A tensile force is applied to the entire test specimen in a direction perpendicular to the surface of the test specimen at a speed of 50 millimeters per minute (mm/min) to obtain a load-displacement curve, and the maximum load and the displacement (millimeters) at which the bonded portion between the test specimen and the jig peels off are measured from the obtained curve, yielding the load capacity (Newtons) per 25 square millimeters.
  • the amount of silicone component transfer by X-ray fluorescence analysis of silicone adhesive is the amount of silicone component in the measurement of residue on a given sample, and was measured as follows. First, a tape-shaped silicone adhesive with a thickness of 30 micrometers and a size of 30 mm x 50 mm was attached to a biaxially oriented PET film (Lumirror (registered trademark) S-10 #50 manufactured by Toray Industries, Inc.), and the film was pressed by rolling the roller back and forth once while applying a load of 2 kilograms to the roller to obtain a measurement sample before peeling.
  • a biaxially oriented PET film Limirror (registered trademark) S-10 #50 manufactured by Toray Industries, Inc.
  • the tape-shaped silicone composition was peeled off from this pre-peeling measurement sample at a pulling speed of 300 mm per minute and a peel angle of 180 degrees within a curing time of 20 to 40 minutes in an atmosphere of 23 degrees Celsius and 50 percent humidity, to obtain a PET film as a post-peeling measurement sample.
  • the amount of Si present per area equivalent to a circle with a diameter of 30 mm on the bonded surface of this PET film was determined as X-ray intensity [number of X-ray photons per second (cps: counts per second)] using an X-ray fluorescence analyzer.
  • an X-ray fluorescence analyzer EDX-7000 manufactured by RIGAKU Corporation was used, and rhodium (Rh) was used as the X-ray source. The output was set to 15 kilovolts and 100 microamperes to measure the X-ray intensity.
  • Example 1 to Example 9 meet all of the required requirements.
  • Comparative Example 1 to Comparative Example 6 did not meet all of the required requirements, and did not meet at least some of the requirements.
  • the following properties can be achieved with a silicone composition in which the weight content of the MQ silicone resin relative to the sum of the addition-curing liquid silicone rubber and the MQ silicone resin is 10 percent or more and 40 percent or less, and the swelling degree of the addition-curing liquid silicone rubber after curing alone is 350 percent or less, as measured by the swelling degree measurement method described below.
  • the silicone composition has the following properties: These properties are adhesive properties that are designed to provide adhesive strength capable of temporarily fixing electronic components and the like having a size of less than 200 micrometers, to facilitate peeling without sinking into the silicone adhesive, and to prevent migration of materials from the silicone adhesive.
  • the silicone adhesive can achieve a Shore A hardness of 17 or more and 90 or less.
  • the silicone adhesive can achieve an adhesive strength (so-called dynamic adhesive strength) of 5.0 to 26.0 Newtons per 25 square millimeters.
  • the silicone adhesive can achieve a reference adhesion strength to float glass of 0.02 to 0.75 Newtons per centimeter width.
  • the silicone adhesive is capable of achieving silicone migration of less than 1 microgram per square centimeter as measured by X-ray fluorescence analysis;
  • the silicone adhesive which is the cured product of the silicone composition of the basic embodiment described above, can be used, for example, as adhesive member 1a of the first embodiment to adhesive member 1d of the fourth embodiment described below.
  • Fig. 1 is a cross-sectional view showing a schematic cross section of an adhesive member according to the first embodiment of the present invention.
  • the adhesive member 1a is formed from a silicone adhesive layer 2, which is a layer of silicone adhesive obtained by curing the silicone composition of the basic embodiment.
  • the adhesive member 1a of the first embodiment can be in an embodiment consisting of only the silicone adhesive layer 2.
  • the silicone adhesive layer 2 can be defined as including an embodiment of an adhesive sheet or adhesive tape in the form of a thin plate having two sides, such as a sheet or tape.
  • the adhesive member 1a can also be configured to further include a release liner 11 on the silicone adhesive layer 2.
  • the silicone adhesive layer 2 has two main surfaces 2a, 2b, and the release liner 11 is arranged so as to contact one or both of the two main surfaces 2a, 2b.
  • the material of the release liner 11 is typically polyethylene terephthalate (PET), but any resin film that has high separability to the silicone composition can be freely selected.
  • PET polyethylene terephthalate
  • an adhesive member 1b according to a second embodiment of the present invention will be described with reference to Fig. 2.
  • the adhesive member 1b according to the second embodiment of the present invention will be described with respect to differences from the first embodiment, and descriptions of the same parts as the first embodiment except for the main parts will be omitted.
  • the adhesive member 1b of the second embodiment has a silicone adhesive layer 2 and a substrate 3 that is a support for the silicone adhesive layer 2.
  • the substrate 3 can have a shape having at least one main surface 3a.
  • the silicone adhesive layer 2 is a cured product of the silicone composition, as in the first embodiment.
  • the silicone composition has exactly the same structure as in the first embodiment.
  • the silicone adhesive layer 2 can also be in the form of a thin plate having two main surfaces 2a and 2b, such as a sheet or tape.
  • the adhesive member 1b can be defined as including the form of an adhesive sheet or adhesive tape that can be used for temporarily fixing minute electronic components, etc.
  • the substrate 3 is not particularly limited, but can typically be selected to have the form of a film, nonwoven fabric, foam, cloth, paper, or a combination of these.
  • a substrate having a film-like form that makes it easy to obtain uniformity in thickness during the manufacturing process of thin substrates, etc. is preferable.
  • a resin film that has the necessary heat resistance in the usage environment is preferable.
  • the substrate 3 is a film-shaped support having at least one main surface 3a, and the main surface 2a is formed on one side of the silicone adhesive layer 2, and the silicone adhesive layer 2 is provided on the substrate 3 so that the main surface 2a is in contact with the main surface 3a of the substrate 3.
  • resin materials for the resin film as the substrate 3 include resin films such as polyimide (PI), polyamide (PA), polyether ether ketone (PEEK), polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), polyamide imide (PAI), polyether sulfone (PES), and fluororesins (PTFE, ETFE, PFA, etc.).
  • resin films can be used as a single layer or a laminated film of two or more layers.
  • the laminated film may include one or more combinations of multiple layers made of one or more materials made of different materials.
  • the silicone adhesive layer 2 can be formed by applying a silicone composition to the main surface 3a of the substrate 3 and curing it.
  • the main surface 3a of the substrate 3 to which the silicone composition is applied and attached may be subjected to an easy-adhesion treatment as necessary.
  • easy-adhesion treatments include primer treatment, corona treatment, etching treatment, plasma treatment, and sandblasting treatment.
  • One type of treatment or a combination of two or more types of treatments may be selected from these.
  • the thickness of the substrate 3 is not particularly limited and can be freely selected. It can be selected from the range of thicknesses preferably from 1 micrometer to 200 micrometers, more preferably from 2 micrometers to 150 micrometers, and particularly preferably from 2.5 micrometers to 125 micrometers.
  • the silicone adhesive layer 2 can be configured to have a main surface 2b formed on the opposite side to the main surface 2a of the silicone adhesive layer 2 that is in contact with the substrate 3, and a release liner 11 further provided on the main surface 2b.
  • the release liner 11 is the same as in the first embodiment.
  • the pressure-sensitive adhesive member 1c includes a silicone pressure-sensitive adhesive layer 2 and a substrate 3.
  • the silicone pressure-sensitive adhesive layer 2 is formed by curing a silicone composition, and has exactly the same structure as in the first and second embodiments.
  • the substrate 3 has exactly the same structure as in the second embodiment.
  • the adhesive member 1c of the third embodiment is a modification of the adhesive member 1b of the second embodiment, with two silicone adhesive layers 2 (21, 22) disposed on the substrate 3 of the adhesive member 1b of the second embodiment.
  • the adhesive member 1c of the third embodiment of the present invention will be described in terms of the differences from the second embodiment, and the description of the parts that are the same as the second embodiment except for the main parts will be omitted.
  • the substrate 3 is a film-shaped support having two main surfaces 3a, 3b.
  • the silicone adhesive layers 21, 22 can each be in the form of a thin plate such as a sheet or tape.
  • the silicone adhesive layer 21 has two main surfaces 21a, 21b
  • the silicone adhesive layer 22 has two main surfaces 22a, 22b.
  • the substrate 3 is provided with the silicone adhesive layer 21 such that one main surface 3a of the substrate 3 contacts the main surface 21a of the silicone adhesive layer 21, and the silicone adhesive layer 22 such that the other main surface 3b of the substrate 3 contacts the main surface 22a of the silicone adhesive layer 22.
  • the silicone adhesive layers 21 and 22 can be formed by applying a silicone composition to each of the two main surfaces 3a and 3b of the substrate 3 and curing the composition.
  • the silicone adhesive layers 21 and 22 may be in the form of a thin plate having two main surfaces, such as a sheet or tape, and may have a release liner 11 on at least one of the main surface 21b opposite the main surface 21a in contact with the substrate 3 of the silicone adhesive layer 21 and the main surface 22b opposite the main surface 22a in contact with the substrate 3 of the silicone adhesive layer 22.
  • the release liner 11 is not essential.
  • Figure 3 shows an example in which the release liner 11 is provided on both sides of the adhesive member 1c.
  • the release liner 11 is the same as in the second embodiment.
  • the adhesive member 1d of the fourth embodiment includes a silicone adhesive layer 2, a substrate 3, and another adhesive layer 4.
  • the silicone adhesive layer 2 has exactly the same structure as in the first embodiment.
  • the substrate 3 is the same as in the second embodiment.
  • the substrate 3 is also a support in the form of a film having, for example, two main surfaces 3a and 3b.
  • the adhesive member 1d is a modification of the adhesive member 1b of the second embodiment, and another adhesive layer 4 is disposed on the main surface 3b opposite to the main surface 3a on which the silicone adhesive layer 2 of the substrate 3 of the adhesive member 1b of the second embodiment is formed. That is, one main surface 3a of the substrate 3 is provided with the silicone adhesive layer 2 such that the main surface 3a of the substrate 3 and the main surface 2a of the silicone adhesive layer 2 are in contact, and the other main surface 3b of the substrate 3 is provided with the adhesive layer 4 such that the other main surface 3b of the substrate 3 and the main surface 4a of the adhesive layer 4 are in contact.
  • the silicone adhesive layer 2 is formed by applying it to the main surface 3a of the substrate 3 and curing it.
  • the other adhesive layer 4 is a layer formed from a material that can be freely selected as long as it has adhesive strength.
  • the other adhesive layer 4 is a layer formed as an adhesive from a material selected from at least one type or a mixture of two or more types of materials such as acrylic, rubber, silicone, and urethane.
  • the other adhesive layer 4 can be formed, for example, by applying it to the main surface 3b of the substrate 3.
  • the silicone adhesive layer 2 and the other adhesive layer 4 may each be in the form of a thin plate with two main surfaces, such as a sheet or tape, and a release liner 11 may be provided on the main surface 2b opposite the main surface 2a in contact with the substrate 3 of the silicone adhesive layer 2, and on the main surface 4b opposite the main surface 4a in contact with the substrate 3 of the other adhesive layer 4.
  • the release liner 11 may be the same as in the second embodiment.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
PCT/JP2024/011949 2023-04-06 2024-03-26 シリコーン組成物および粘着部材 WO2024210000A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2024521128A JPWO2024210000A1 (enrdf_load_stackoverflow) 2023-04-06 2024-03-26
TW113112289A TW202444831A (zh) 2023-04-06 2024-04-01 聚矽氧組成物及黏著構件

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023014263 2023-04-06
JPPCT/JP2023/014263 2023-04-06

Publications (1)

Publication Number Publication Date
WO2024210000A1 true WO2024210000A1 (ja) 2024-10-10

Family

ID=92971727

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2024/011949 WO2024210000A1 (ja) 2023-04-06 2024-03-26 シリコーン組成物および粘着部材

Country Status (3)

Country Link
JP (1) JPWO2024210000A1 (enrdf_load_stackoverflow)
TW (1) TW202444831A (enrdf_load_stackoverflow)
WO (1) WO2024210000A1 (enrdf_load_stackoverflow)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017500394A (ja) * 2013-12-27 2017-01-05 東レ・ダウコーニング株式会社 室温硬化性シリコーンゴム組成物、その用途、および電子機器の補修方法
WO2020050167A1 (ja) * 2018-09-03 2020-03-12 マクセルホールディングス株式会社 ダイシング用粘着テープおよび半導体チップの製造方法
CN112940512A (zh) * 2021-02-05 2021-06-11 东莞市朗晟材料科技有限公司 一种耐温绝缘硅橡胶及其制备方法和耐温绝缘胶带
WO2021124724A1 (ja) * 2019-12-20 2021-06-24 マクセルホールディングス株式会社 ダイシング用粘着テープおよび半導体チップの製造方法
WO2022259869A1 (ja) * 2021-06-07 2022-12-15 フジコピアン株式会社 耐熱性粘着フィルム
CN115651602A (zh) * 2022-11-04 2023-01-31 万华化学集团股份有限公司 一种耐高温加成型有机硅压敏胶组合物及其制备方法和应用

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017500394A (ja) * 2013-12-27 2017-01-05 東レ・ダウコーニング株式会社 室温硬化性シリコーンゴム組成物、その用途、および電子機器の補修方法
WO2020050167A1 (ja) * 2018-09-03 2020-03-12 マクセルホールディングス株式会社 ダイシング用粘着テープおよび半導体チップの製造方法
WO2021124724A1 (ja) * 2019-12-20 2021-06-24 マクセルホールディングス株式会社 ダイシング用粘着テープおよび半導体チップの製造方法
CN112940512A (zh) * 2021-02-05 2021-06-11 东莞市朗晟材料科技有限公司 一种耐温绝缘硅橡胶及其制备方法和耐温绝缘胶带
WO2022259869A1 (ja) * 2021-06-07 2022-12-15 フジコピアン株式会社 耐熱性粘着フィルム
CN115651602A (zh) * 2022-11-04 2023-01-31 万华化学集团股份有限公司 一种耐高温加成型有机硅压敏胶组合物及其制备方法和应用

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
KITAZAKI, YASUAKI: "Adhesive Technology Lecture No. 7: Silicone Adhesives", KONBATEKKU = CONVERTECH, KAKO GIJUTSU KENKYUKAI, TOKYO, JP, vol. 37, no. 7 (436), 15 June 2009 (2009-06-15), JP , pages 81 - 85, XP009560259, ISSN: 0911-2316 *

Also Published As

Publication number Publication date
JPWO2024210000A1 (enrdf_load_stackoverflow) 2024-10-10
TW202444831A (zh) 2024-11-16

Similar Documents

Publication Publication Date Title
KR101822197B1 (ko) 무용제형 부가형 실리콘 점착제 조성물 및 점착성 물품
TW201906978A (zh) 壓感黏合層形成性有機聚矽氧烷組合物及其使用
KR101186709B1 (ko) 실리콘 고무계 점착 시트
JP6378516B2 (ja) シリコーン系粘着テープ
WO2010087525A1 (en) Curable silicone rubber composition
CN110072697B (zh) 层压体和电子组件制造方法
JP7648329B2 (ja) 感圧接着層形成性オルガノポリシロキサン組成物およびその使用
KR102632461B1 (ko) 다이싱용 점착 테이프 및 반도체칩의 제조 방법
JP7678750B2 (ja) 感圧接着層形成性オルガノポリシロキサン組成物およびその使用
EP4268980A1 (en) Silicone adhesive composition and use thereof
CN109196070B (zh) 粘着剂组合物和粘着带
JP7678751B2 (ja) 感圧接着層形成性オルガノポリシロキサン組成物およびその使用
KR102232802B1 (ko) 점착제 조성물 및 점착 테이프
WO2022138341A1 (ja) 一体型ダイシングダイボンディング用シートおよび半導体装置の製造方法
WO2024210000A1 (ja) シリコーン組成物および粘着部材
CN111094498B (zh) 有机硅系粘着剂组合物和粘着胶带
KR102469375B1 (ko) 실리콘계 점착성 보호 필름 및 이를 포함하는 광학 부재
US20240301144A1 (en) Organopolysiloxane composition for transducer, laminate comprising cured film thereof, use therefor, and manufacturing method therefor
JP7326015B2 (ja) 真空プロセス用粘着テープ
CN109476962B (zh) 压敏粘着片
TWI888513B (zh) 樹脂組成物及黏著帶
JP2006022168A (ja) 粘着性支持体
JP2018069449A (ja) 未加硫シリコーンゴム積層体
WO2025121372A1 (ja) 熱伝導性シリコーン複合シート
KR20250126734A (ko) 핫 멜트성 경화성 실리콘 조성물, 당해 조성물을 사용하는 적층체 및 반도체 장치의 제조 방법

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 2024521128

Country of ref document: JP

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 24784789

Country of ref document: EP

Kind code of ref document: A1