JPWO2024210000A1 - - Google Patents

Info

Publication number
JPWO2024210000A1
JPWO2024210000A1 JP2024521128A JP2024521128A JPWO2024210000A1 JP WO2024210000 A1 JPWO2024210000 A1 JP WO2024210000A1 JP 2024521128 A JP2024521128 A JP 2024521128A JP 2024521128 A JP2024521128 A JP 2024521128A JP WO2024210000 A1 JPWO2024210000 A1 JP WO2024210000A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024521128A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024210000A1 publication Critical patent/JPWO2024210000A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2024521128A 2023-04-06 2024-03-26 Pending JPWO2024210000A1 (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023014263 2023-04-06
PCT/JP2024/011949 WO2024210000A1 (ja) 2023-04-06 2024-03-26 シリコーン組成物および粘着部材

Publications (1)

Publication Number Publication Date
JPWO2024210000A1 true JPWO2024210000A1 (enrdf_load_stackoverflow) 2024-10-10

Family

ID=92971727

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024521128A Pending JPWO2024210000A1 (enrdf_load_stackoverflow) 2023-04-06 2024-03-26

Country Status (3)

Country Link
JP (1) JPWO2024210000A1 (enrdf_load_stackoverflow)
TW (1) TW202444831A (enrdf_load_stackoverflow)
WO (1) WO2024210000A1 (enrdf_load_stackoverflow)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105849201A (zh) * 2013-12-27 2016-08-10 道康宁东丽株式会社 室温下可固化的有机硅橡胶组合物及其用途以及修复电子设备的方法
TWI799618B (zh) * 2018-09-03 2023-04-21 日商麥克賽爾股份有限公司 切割用黏著帶及半導體晶片之製造方法
KR102841521B1 (ko) * 2019-12-20 2025-08-04 맥셀 주식회사 다이싱용 점착 테이프 및 반도체칩의 제조 방법
CN112940512A (zh) * 2021-02-05 2021-06-11 东莞市朗晟材料科技有限公司 一种耐温绝缘硅橡胶及其制备方法和耐温绝缘胶带
KR20240019757A (ko) * 2021-06-07 2024-02-14 후지 코피안 가부시키가이샤 내열성 점착 필름
CN115651602B (zh) * 2022-11-04 2024-06-25 万华化学集团股份有限公司 一种耐高温加成型有机硅压敏胶组合物及其制备方法和应用

Also Published As

Publication number Publication date
TW202444831A (zh) 2024-11-16
WO2024210000A1 (ja) 2024-10-10

Similar Documents

Publication Publication Date Title
BR102023005164A2 (enrdf_load_stackoverflow)
BR102023001987A2 (enrdf_load_stackoverflow)
BR102023001877A2 (enrdf_load_stackoverflow)
BY13155U (enrdf_load_stackoverflow)
BY13157U (enrdf_load_stackoverflow)
CN307050627S (enrdf_load_stackoverflow)
CN307049337S (enrdf_load_stackoverflow)
CN307048310S (enrdf_load_stackoverflow)
CN307048148S (enrdf_load_stackoverflow)
CN307048036S (enrdf_load_stackoverflow)
CN307047948S (enrdf_load_stackoverflow)
CN307047894S (enrdf_load_stackoverflow)
CN307047846S (enrdf_load_stackoverflow)
CN307047266S (enrdf_load_stackoverflow)
CN307046719S (enrdf_load_stackoverflow)
CN307046248S (enrdf_load_stackoverflow)
CN307045251S (enrdf_load_stackoverflow)
CN307044697S (enrdf_load_stackoverflow)
CN307044312S (enrdf_load_stackoverflow)
BY13173U (enrdf_load_stackoverflow)
BY13171U (enrdf_load_stackoverflow)
BY13170U (enrdf_load_stackoverflow)
BY13169U (enrdf_load_stackoverflow)
BY13168U (enrdf_load_stackoverflow)
BY13167U (enrdf_load_stackoverflow)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240408

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20240408

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240521

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20240719

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20241114