WO2024203049A1 - 固体電解コンデンサおよびその製造方法 - Google Patents

固体電解コンデンサおよびその製造方法 Download PDF

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Publication number
WO2024203049A1
WO2024203049A1 PCT/JP2024/008414 JP2024008414W WO2024203049A1 WO 2024203049 A1 WO2024203049 A1 WO 2024203049A1 JP 2024008414 W JP2024008414 W JP 2024008414W WO 2024203049 A1 WO2024203049 A1 WO 2024203049A1
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Prior art keywords
layer
substrate
solid electrolytic
adhesive layer
adhesive
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English (en)
French (fr)
Japanese (ja)
Inventor
淳一 栗田
穂菜美 名和
拡 木村
さおり 上田
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Priority to JP2025510132A priority Critical patent/JPWO2024203049A1/ja
Priority to CN202480019163.6A priority patent/CN120826755A/zh
Publication of WO2024203049A1 publication Critical patent/WO2024203049A1/ja
Priority to US19/318,883 priority patent/US20260004970A1/en
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/0029—Processes of manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H01G9/012—Terminals specially adapted for solid capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/022—Electrolytes; Absorbents
    • H01G9/025—Solid electrolytes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/07—Dielectric layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H01G9/10—Sealing, e.g. of lead-in wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/14—Structural combinations or circuits for modifying, or compensating for, electric characteristics of electrolytic capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/15—Solid electrolytic capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
    • H01G2009/05—Electrodes or formation of dielectric layers thereon characterised by their structure consisting of tantalum, niobium, or sintered material; Combinations of such electrodes with solid semiconductive electrolytes, e.g. manganese dioxide

Definitions

  • This disclosure relates to a solid electrolytic capacitor and a method for manufacturing the same.
  • Patent Document 1 proposes a solid electrolytic capacitor comprising: a rectangular resin molded body including an element stack, an insulating substrate, and a sealing resin that seals the periphery of the element stack; a first external electrode provided on a first end face of the resin molded body; and a second external electrode provided on a second end face of the resin molded body, wherein the element stack includes a first layer and a second layer stacked together, the first layer includes a valve metal base having a dielectric layer formed on its surface, and a solid electrolyte layer provided on the dielectric layer, the second layer includes an electrode lead layer, the valve metal base is exposed on the first end face of the resin molded body, the electrode lead layer is exposed on the second end face of the resin molded body, the first external electrode is connected to the valve metal base, and the second external electrode is connected to the electrode lead layer, a dummy layer that does not contribute to the capacitance of the capacitor is provided on one of the main surfaces of the element stack in the stacking direction, and the insul
  • the solid electrolytic capacitor comprises a capacitor element including an anode portion and a cathode portion, a substrate supporting the capacitor element, a sealing body sealing the capacitor element, a first external electrode electrically connected to the anode portion, a second external electrode electrically connected to the cathode portion, and an adhesive layer interposed between the capacitor element and a first surface of the substrate.
  • the maximum height Rz1 of the surface roughness of the first surface is 5 ⁇ m or more
  • the maximum height Rz2 of the surface roughness of the adhesive layer is 3 ⁇ m or more.
  • the manufacturing method includes the steps of preparing the capacitor element, preparing a substrate for supporting the capacitor element, applying an adhesive to a first surface of the substrate to become the adhesive layer, and placing the capacitor element on the substrate via the adhesive.
  • the maximum height Rz3 of the surface roughness of the first surface of the substrate prepared in the substrate preparation step is 10 ⁇ m or more.
  • ESR equivalent series resistance
  • FIG. 1 is a schematic cross-sectional view of a solid electrolytic capacitor according to an embodiment of the present disclosure.
  • 1 is a roughness curve of a first surface of a substrate according to an embodiment of the present disclosure.
  • 1 is an example of a cross-sectional image of a solid electrolytic capacitor E1 taken by a scanning electron microscope (SEM).
  • the substrate for a solid electrolytic capacitor may be, for example, an insulating substrate, a metal substrate, or a laminated substrate (such as a printed circuit board) on which a wiring pattern is formed.
  • the substrate is a plate-like body including an insulating layer formed from an organic material such as insulating resin. For this reason, substrates with an insulating layer are easily permeable to water vapor. If the substrate has a high water vapor permeability, moisture will penetrate the inside, and when the solid electrolytic capacitor is exposed to high temperatures during a reflow process, for example, gas will be generated inside and the volume will expand. The stress caused by the expansion is applied to the components inside the capacitor, damaging the components and causing fluctuations in the equivalent series resistance (ESR).
  • ESR equivalent series resistance
  • Solid electrolytic capacitor In a solid electrolytic capacitor equipped with a substrate, if the substrate has a high water vapor permeability, moisture is likely to penetrate into the inside. When the solid electrolytic capacitor is exposed to high temperatures during reflow processing, the moisture that penetrates into the inside vaporizes and expands, and the expansion easily applies stress to the internal components. When stress is applied to the capacitor element, the sealant, or the leads, cracks or peeling occurs, increasing the resistance and increasing the ESR of the solid electrolytic capacitor. In addition, since it is difficult to control the degree of stress caused by the expansion of the penetrated moisture and the parts to which the stress is applied, the variation in the ESR between individual units is also likely to be large.
  • a solid electrolytic capacitor according to one embodiment of the present disclosure (hereinafter also referred to as “capacitor (C)”) comprises a capacitor element including an anode portion and a cathode portion, a substrate supporting the capacitor element, a sealing body sealing the capacitor element, a first external electrode electrically connected to the anode portion, a second external electrode electrically connected to the cathode portion, and an adhesive layer interposed between the capacitor element and a first surface of the substrate.
  • the maximum height Rz1 of the surface roughness of the first surface is 5 ⁇ m or more
  • the maximum height Rz2 of the surface roughness of the adhesive layer is 3 ⁇ m or more.
  • the surface of the adhesive layer facing the first surface of the substrate has a shape that generally follows the uneven shape of the first surface. Therefore, it can be said that the adhesive layer penetrates into the recesses of the first surface and is in close contact with the first surface. This makes it possible to reduce the amount of water vapor passing through the first surface of the substrate, and to reduce the fluctuation (especially the increase) in the ESR of the capacitor (C) when exposed to high temperatures such as in a reflow process.
  • the intrusion of moisture into the capacitor (C) itself can be reduced, thereby reducing the variation in the ESR fluctuation range between individual solid electrolytic capacitors.
  • Rz1 may be 6 ⁇ m or more, or 7 ⁇ m or more.
  • the upper limit of Rz1 is not particularly limited, but may be, for example, 100 ⁇ m or less, or 50 ⁇ m or less.
  • Rz1 can be obtained by cutting the capacitor (C) and taking a cross-sectional image using a scanning electron microscope (SEM) in the following manner.
  • the cross-sectional image is formed parallel to the lamination direction of the substrate, adhesive layer, and capacitor element.
  • the cross-sectional image is taken at a magnification of, for example, 300 times or more.
  • the length of the cross-sectional image in the planar direction of the first surface is 200 ⁇ m or more. From the cross-sectional image, a "roughness curve" can be calculated by removing the waviness curve from the cross-sectional curve of the first surface.
  • the "roughness curve" of the interface between the first surface and the adhesive layer can be calculated from the cross-sectional image. Then, Rz1 can be calculated from the roughness curve.
  • the cross-sectional image of the capacitor (C) to be measured is measured at multiple locations (for example, five or more locations), Rz1 is calculated from the roughness curve for each cross-sectional image, and the average value of all the calculated Rz1 is calculated.
  • Rz2 can be determined using a cross-sectional image of the capacitor (C) taken by SEM. From the cross-sectional image, a "roughness curve" of the surface of the adhesive layer or the interface between the first surface and the adhesive layer can be calculated. Rz2 is calculated from the roughness curve.
  • the cross-sectional image of the capacitor (C) to be measured is measured at multiple locations (e.g., five or more locations), Rz2 is calculated from the roughness curve for each cross-sectional image, and the average value of all calculated Rz2 is calculated.
  • the adhesive layer has a function of adhering the capacitor element to the substrate.
  • the adhesive layer is preferably formed of a curable adhesive.
  • the curable adhesive includes a curable resin.
  • the curable resin may be an insulating resin.
  • the adhesive may be conductive, non-conductive, or insulating.
  • the conductive adhesive forms a conductive adhesive layer.
  • the conductive adhesive or adhesive layer contains conductive filler particles.
  • the conductive filler particles may be metal particles such as silver particles, conductive carbon particles, etc.
  • the non-conductive (insulating) adhesive forms a non-conductive (insulating) adhesive layer.
  • the non-conductive (insulating) adhesive or adhesive layer contains insulating filler particles. Ceramic particles can be used as the insulating filler particles.
  • the insulating resin may include, for example, at least one selected from the group consisting of epoxy resin, acrylic resin, silicone resin, polyamide resin, and polyimide resin.
  • the maximum height Rz2 of the surface roughness of the adhesive layer may be 3 ⁇ m or more, but Rz2 may be 6 ⁇ m or more, or 7 ⁇ m or more.
  • the upper limit of Rz2 is not particularly limited, but may be, for example, 100 ⁇ m or less, or 50 ⁇ m or less.
  • Rz2 may be 50% or more, 80% or more, or 90% or more of Rz1.
  • the surface of the adhesive layer on the first surface side has a shape that substantially follows the shape of the first surface. It can also be said that the adhesive layer penetrates deep into the recesses of the first surface and adheres closely to the first surface.
  • the average porosity of the adhesive layer between the capacitor element and the first surface may be 50% or less, 20% or less, or 10% or less.
  • the surface of the adhesive layer on the first surface side has a shape that substantially follows the shape of the first surface. It can also be said that the adhesive layer penetrates deep into the recesses of the first surface and is in close contact with the first surface.
  • the average porosity (Rpav) of the adhesive layer can be determined using the cross-sectional image of the capacitor (C) used to determine Rz1. By binarizing the cross-sectional image, the area between the capacitor element and the first surface can be divided into the adhesive layer and the gap. The area Sa of the adhesive layer and the area Sp of the gap are determined, and the percentage (%) of Sp to the sum of Sa and Sp is calculated as the porosity Rp.
  • the cross-sectional image of the capacitor (C) to be measured is measured at multiple locations (e.g., five or more locations), Rp is calculated for each cross-sectional image, and the average value Rpav of all the calculated Rp is calculated.
  • the contact area where the capacitor element and the first surface are in close contact preferably occupies 20% or more of the area of the first surface of the substrate, more preferably 50% or more, even more preferably 80% or more, and even more preferably 90% or more.
  • the larger the proportion of the contact area the more significantly the amount of water vapor passing through the first surface of the substrate can be reduced.
  • the adhesion area can be identified by taking an external photograph of the second surface (i.e., the outer surface) opposite the first surface of the substrate and binarizing the external photograph.
  • the voids can be seen through the outer surface of areas other than the adhesion area.
  • the outer surface is observed to have a relatively low brightness and dark color. Therefore, the adhesion area and non-adhesion areas can be easily distinguished from the binarized external photograph.
  • the ratio of the contact area to the area of the first surface of the substrate can be calculated as the ratio of the area of the contact area to the area of the portion of the second surface of the substrate that is exposed as the outer surface (the portion that is not covered by the external electrode).
  • the porosity of the adhesive layer between the capacitor element and the first surface in the contact area is approximately 10% or less.
  • Rz2 is preferably 30% or more of the average thickness Tav of the adhesive layer.
  • Rz2 is preferably a value significantly larger than the thickness of the adhesive layer.
  • the adhesive layer can be said to be significantly thinner than Rz2.
  • Rz2 may be 50% or more, 80% or more, 90% or more, or 100% or more of the average thickness Tav of the adhesive layer.
  • the average thickness Tav of the adhesive layer can be calculated as follows, using the cross-sectional image of the capacitor (C) used to calculate Rz1. In the cross-sectional image, the thickness of the adhesive layer is calculated at 20 ⁇ m intervals along the surface direction of the first surface, using the interface between the capacitor element and the adhesive layer as a reference. Tav is calculated by averaging the multiple calculated values (thicknesses) obtained.
  • the filler particles When the adhesive layer contains an insulating resin and filler particles, the filler particles have the effect of reducing the amount of water vapor passing through the first surface of the substrate. From the viewpoint of enhancing this effect, the size of the filler particles contained in the adhesive layer is preferably a size that allows the filler particles to penetrate deep into the recesses of the first surface.
  • the average particle size of the filler particles contained in the adhesive layer is, for example, 10 ⁇ m or less, and may be 5 ⁇ m or less.
  • the average particle diameter of the filler particles is calculated from the cross-sectional image of the capacitor (C) used to calculate Rz1. Specifically, 100 filler particles dispersed in the adhesive layer are randomly selected, and their maximum diameters are determined. The average particle diameter of the filler particles is calculated by averaging all of the maximum diameters obtained.
  • the filler particles may be located at a distance of 80% or more, or even 100% or more, of Tav from the interface between the capacitor element and the adhesive layer.
  • the content of filler particles in the adhesive layer is preferably, for example, 5% by volume or more and 90% by volume or less, and more preferably 30% by volume or more and 90% by volume or less, in order to facilitate penetration of the adhesive layer deep into the recesses of the first surface.
  • the filler particle content in the adhesive layer can be determined using the cross-sectional image of the capacitor (C) used to determine Rz1.
  • the adhesive layer region can be divided into insulating resin and filler particles.
  • the area Sr of the insulating resin and the area Sf of the filler particles are determined, and the percentage (%) of Sf relative to the total of Sr and Sf is calculated as the content.
  • the cross-sectional image of the capacitor (C) to be measured can be measured at multiple locations (e.g., five or more locations), the content can be calculated for each cross-sectional image, and the average of all the calculated contents can be calculated.
  • the capacitor (C) may include two or more stacked capacitor elements.
  • the intrusion of moisture into the capacitor (C) is reduced, so that even when the capacitor (C) is exposed to high temperatures, stress is suppressed from being applied to the components. Therefore, even when the capacitor (C) includes two or more stacked capacitor elements, electrical connection between the capacitor elements and the external electrodes is easily ensured when exposed to high temperatures, and high capacity is easily maintained.
  • the substrate has a first surface in contact with the adhesive layer.
  • the capacitor element is mounted to the first surface of the substrate via the adhesive layer.
  • the substrate includes at least one insulating layer.
  • the first surface is typically a surface of the insulating layer.
  • a substrate including an insulating layer is also referred to as an insulating substrate.
  • the insulating layer is formed of an insulating resin and may contain ceramic particles, glass fibers, etc.
  • ceramic particles include silica, alumina, glass, talc, and mica.
  • Glass fibers may be included in the form of a woven or nonwoven fabric (e.g., glass cloth). The ceramic particles and glass fibers have the effect of preventing moisture from penetrating into the capacitor (C). This further reduces fluctuations in the ESR of the capacitor (C) when exposed to high temperatures.
  • the amount of glass fiber contained in the insulating layer may be, for example, 50 parts by mass or more and 1,000 parts by mass or less, or 60 parts by mass or more and 700 parts by mass or less, per 100 parts by mass of insulating resin.
  • the amount of ceramic particles contained in the insulating layer may be, for example, 5 parts by mass or more and 300 parts by mass or less, or 10 parts by mass or more and 250 parts by mass or less, per 100 parts by mass of insulating resin.
  • the insulating resin may contain at least one selected from the group consisting of, for example, epoxy resin, polyimide resin, phenolic resin, and fluororesin.
  • Specific examples of substrates containing such insulating resins include glass epoxy substrates, paper phenolic substrates, glass polyimide substrates, and fluoro substrates. Glass epoxy substrates and glass polyimide substrates contain glass fibers. Such substrates are easy to obtain and relatively inexpensive, and are highly effective in reducing the fluctuation of the ESR of the capacitor (C) when exposed to high temperatures.
  • the thickness of the substrate may be 50 ⁇ m or more and 500 ⁇ m or less.
  • the substrate has a strength suitable for holding the capacitor element.
  • the thickness of the capacitor (C) can be made relatively small.
  • the substrate may include at least one metal layer.
  • the substrate may have one metal layer and two insulating layers sandwiching the metal layer and adhering to the surface of the metal layer.
  • the metal layers can further reduce the intrusion of moisture into the capacitor (C).
  • the metal layer may be laminated with the insulating layer, or may be formed on the insulating layer by a gas phase method such as deposition.
  • the thickness of the metal layer may be 5 ⁇ m or more and 100 ⁇ m or less.
  • the content of the metal layer in the entire substrate may be 1 mass % or more and 55 mass % or less. This can reduce the intrusion of moisture into the capacitor (C) and can provide a thin substrate.
  • the metal layer may be at least one type selected from the group consisting of copper foil and copper alloy foil.
  • the thickness of the substrate or metal layer is determined by measuring the thickness at any five or more selected locations on the substrate or metal layer and averaging the measurements.
  • the capacitor (C) comprises a step (i) of preparing at least one capacitor element, a step (ii) of preparing a substrate for supporting the capacitor element, a step (iii) of applying an adhesive to a first surface of the substrate to form an adhesive layer, and a step (iv) of mounting the capacitor element on the substrate via the adhesive.
  • the maximum height Rz3 of the surface roughness of the first surface of the substrate prepared in step (ii) is preferably 10 ⁇ m or more, and may be 30 ⁇ m or more.
  • the first surface of the substrate can also be said to be roughened.
  • the adhesive may be allowed to penetrate into the first surface of the substrate (specifically, the irregularities of the first surface) under reduced pressure.
  • reduced pressure the air remaining in the irregularities of the first surface is at least partially removed, allowing the adhesive to smoothly penetrate into the first surface having a large maximum height Rz3.
  • Under reduced pressure means, for example, a pressure of 0.1 MPa or less, or even a pressure of 0.07 MPa or less.
  • the viscosity of the adhesive at 25°C is, for example, 5 Pa ⁇ s or more and 75 Pa ⁇ s or less, and may be 50 Pa ⁇ s or less.
  • the viscosity of the adhesive at 25°C refers to the viscosity measured using an E-type viscometer (cone plate).
  • the substrate after curing i.e., the substrate on which the adhesive layer is formed
  • the water vapor permeability of the substrate on which the adhesive layer is formed may be, for example, 30 g/m 2 /day or less, or 25 g/m 2 /day or less.
  • the lower limit of the water vapor permeability of the substrate is preferably as low as possible, but it is difficult to make it completely 0 g/m 2 /day, and it may be, for example, 0.1 g/m 2 /day or more.
  • the water vapor permeability of the substrate can be measured in accordance with JIS Z 0208:1976 "Test method for moisture permeability of moisture-proof packaging materials (cup method)." The test is carried out under temperature and humidity conditions of 85°C and 85% relative humidity. However, a wide substrate without a capacitor element placed on it is used as the measurement sample for the "substrate with an adhesive layer formed" used to measure the water vapor permeability.
  • the moisture absorption amount of the capacitor (C) can be reduced even when the water vapor permeability of the constituent material of the substrate itself is high (for example, exceeds 10 g/ m2 /day).
  • the capacitor element includes an anode part and a cathode part.
  • An insulating separation layer may be provided to electrically separate the anode part and the cathode part.
  • the capacitor (C) includes at least one capacitor element, and may include two or more capacitor elements. The two or more capacitor elements may be, for example, stacked.
  • the anode portion is typically at least a portion of the anode body.
  • the anode body may include a first portion and a second portion.
  • the first portion includes one end (first end) of the anode body.
  • the second portion includes the other end (second end).
  • the cathode portion is formed in the second portion.
  • the anode portion may be at least a portion of the first portion.
  • the anode body may be a foil of anode material (anode foil) or a sintered body of particles of anode material.
  • the anode material may include a valve metal, an alloy containing a valve metal, an intermetallic compound containing a valve metal, etc.
  • the valve metal may be aluminum, tantalum, niobium, titanium, etc.
  • a porous portion may be formed on the surface of at least the second portion of the anode foil.
  • the anode foil has a core portion and a porous portion formed on the surface of the core portion.
  • the porous portion may be formed, for example, by roughening the surface of at least the second portion of the anode foil by etching.
  • the etching may be performed by a known method, for example, electrolytic etching.
  • the second portion of the anode foil may be roughened, or the entire surface of the anode foil may be roughened. In the former case, no porous portion is formed on the surface of the first portion. In the latter case, porous portions are formed on the surfaces of the first and second portions.
  • the masking member is preferably an insulating material such as resin. The masking member may be removed before the formation of the solid electrolyte layer.
  • the surface of the first portion has a porous portion
  • at least a portion of the porous portion may be removed or compressed in advance. This can prevent the reliability of the capacitor (C) from decreasing due to air entering through the porous portion.
  • the end faces of the multiple first ends may each be exposed from the outer surface of the sealing body and electrically connected to the first external electrode.
  • the capacitor (C) has a generally rectangular parallelepiped shape, one surface (e.g., the bottom surface) may correspond to the second surface of the substrate, and the remaining five surfaces may correspond to the outer surfaces of the sealing body.
  • the dielectric layer can be formed by anodizing at least the second portion of the anode body.
  • the anodization (chemical conversion treatment) is performed, for example, by immersing the anode body in a chemical conversion solution and applying a voltage between the anode body as an anode and a cathode immersed in the chemical conversion solution.
  • the dielectric layer contains an oxide of the valve metal.
  • the dielectric layer contains aluminum oxide.
  • the dielectric layer is formed at least on the surface of the second portion in which the porous portion is formed (including the inner wall surfaces of the holes in the porous portion).
  • the method for forming the dielectric layer is not limited as long as an insulating layer that functions as a dielectric can be formed on the surface of the second part.
  • the dielectric layer may also be formed on the surface of the first part.
  • the cathode section is formed in a second portion of the anode body having the dielectric layer.
  • the cathode section may cover a surface of the separation layer facing the second portion.
  • the cathode section includes, for example, a solid electrolyte layer covering at least a portion of the dielectric layer, and a cathode extraction layer covering at least a portion of the solid electrolyte layer.
  • the cathode section is formed by forming a solid electrolyte so as to cover at least a portion of the dielectric layer, and forming the cathode extraction layer so as to cover at least a portion of the solid electrolyte layer.
  • the solid electrolyte layer includes, for example, a conductive polymer (conjugated polymer, dopant, etc.)
  • the solid electrolyte layer may include a manganese compound.
  • conjugated polymer for example, a ⁇ -conjugated polymer (such as polypyrrole, polythiophene, polyaniline, and derivatives thereof) may be used.
  • polythiophene derivatives include poly(3,4-ethylenedioxythiophene) (PEDOT).
  • polystyrene sulfonic acid PSS
  • naphthalene sulfonic acid toluene sulfonic acid, etc. may also be used.
  • the solid electrolyte layer can be formed, for example, by polymerizing a precursor of a conjugated polymer (monomer, oligomer, etc.) and a dopant (naphthalenesulfonic acid, toluenesulfonic acid, etc.) on a dielectric layer using at least one of chemical polymerization and electrolytic polymerization.
  • a conjugated polymer monomer, oligomer, etc.
  • a dopant naphthalenesulfonic acid, toluenesulfonic acid, etc.
  • the solid electrolyte layer may be formed by applying a solution or dispersion of the conjugated polymer and the dopant to the dielectric layer and drying it.
  • the dispersion medium may be, for example, water, an organic solvent, or a mixture of these.
  • the cathode extraction layer includes, for example, a conductive layer in contact with the solid electrolyte layer and covering at least a portion of the solid electrolyte layer.
  • the conductive layer includes at least a first layer covering at least a portion of the solid electrolyte layer.
  • the cathode extraction layer may include the first layer and a second layer covering at least a portion of the first layer.
  • the cathode extraction layer may include a first layer containing conductive carbon and a second layer containing a metal layer (for example, a metal foil).
  • the conductive carbon included in the first layer may be, for example, graphite (artificial graphite, natural graphite, etc.).
  • the first layer may be made of a metal foil.
  • the first layer of metal foil may be made of, for example, aluminum (Al) foil, copper (Cu) foil, valve metal (aluminum, tantalum, niobium, etc.) or an alloy thereof.
  • the surface of the metal foil may be roughened.
  • the surface of the metal foil may have a chemical conversion coating.
  • the metal foil may have a second layer of a coating of a different metal or nonmetal different from the metal that constitutes the metal foil.
  • the different metal or nonmetal may be, for example, a metal such as titanium (Ti) or nickel (Ni), or a nonmetal such as carbon (e.g., conductive carbon).
  • the metal foil may be an Al foil with Ni vapor-deposited on the surface.
  • the metal foil may have a Ti, TiC, TiO, C (carbon) film, etc.
  • the second layer may be a layer containing metal powder.
  • a conductive adhesive may be used for the second layer.
  • a metal paste layer containing metal powder and resin may be used as the conductive adhesive.
  • the metal paste layer may be a silver paste layer containing silver particles and resin.
  • the resin is preferably a thermosetting resin such as an imide resin or an epoxy resin.
  • the metal foil may be attached to the solid electrolyte layer or the first layer via a layer containing conductive carbon, a metal paste layer, etc.
  • the cathode portion includes a metal foil
  • the end face of the metal foil can be exposed from the outer surface of the sealing body and can be easily electrically connected to the second external electrode.
  • the metal foil may be provided on at least one of the multiple capacitor elements, or the metal foil may be interposed between adjacent capacitor elements.
  • the separation layer is formed before the cathode part is formed.
  • the separation layer may be provided in the vicinity of the cathode part so as to cover at least a part of the surface of the first part. From the viewpoint of suppressing the intrusion of air into the inside of the capacitor (C), the separation layer may be in close contact with the first part and the sealing body.
  • the separation layer may be disposed on the first part via a dielectric layer. Such a separation layer is provided after the dielectric layer is formed. If necessary, the separation layer may be provided before the dielectric layer is formed.
  • the separation layer may be provided, for example, by attaching a sheet-like insulating member (such as a resin tape) to the first portion.
  • the separation layer may be formed as an insulating member that adheres closely to the first portion by applying or impregnating at least a portion of the first portion with a liquid resin. The application or impregnation of the liquid resin to the first portion and the attachment of a sheet-like insulating member may be used in combination.
  • the capacitor (C) may include a spacer.
  • the spacer is disposed, for example, between at least one of the ends of adjacent anode parts and adjacent cathode parts of the stacked capacitor elements.
  • the spacer may be conductive (made of metal, etc.) or insulating. When an insulating spacer is used, the spacer may be exposed from the outer surface of the sealing body together with the end surface of the anode part or the cathode part.
  • the insulating spacer may be formed of, for example, a thermoplastic resin or a curable resin.
  • the capacitor element (or a plurality of stacked capacitor elements) is sealed by being covered with a sealing body.
  • the capacitor element may be sealed such that at least one end face of the anode part and the cathode part is exposed from the outer surface of the sealing body, or after sealing, the sealing body may be partially removed to expose at least one end face of the anode part and the cathode part from the outer surface of the sealing body.
  • the encapsulant preferably contains, for example, a cured product of a thermosetting resin.
  • the encapsulant may contain a filler, a curing agent, a polymerization initiator, a catalyst, etc.
  • the encapsulant may be formed using a molding technique such as injection molding.
  • the encapsulant may be formed by using a specific mold to mold a composition containing a thermosetting resin so as to cover the capacitor element supported on the substrate.
  • the contact layer may be formed, for example, of an electroless Ni plating layer, an electrolytic Ni plating layer, or a Ni plating layer and an electroless Ag plating layer covering the Ni plating layer.
  • the contact layer may be formed by a sputtering method, a vacuum deposition method, a chemical vapor deposition (CVD) method, a cold spray method, or a thermal spray method.
  • CVD chemical vapor deposition
  • the contact layer can more reliably electrically connect the end face of the anode or cathode to the external electrode.
  • the external electrodes include a first external electrode connected to the anode portion of the capacitor element and a second external electrode connected to the cathode portion.
  • Each external electrode may include a metal layer.
  • the metal layer is, for example, a plating layer.
  • the metal layer includes, for example, at least one selected from the group consisting of nickel (Ni), copper (Cu), zinc (Zn), tin (Sn), silver (Ag), and gold (Au).
  • the metal layer may be formed using a film formation technique such as electrolytic plating, electroless plating, sputtering, vacuum deposition, chemical vapor deposition (CVD), cold spray, or thermal spray.
  • Each external electrode may include, for example, a laminated structure of a Ni layer and a tin layer. It is preferable that the outer surface of each external electrode is made of a metal that has excellent wettability with solder. Examples of such metals include tin (Sn), gold (Au), silver (Ag), and palladium (Pd).
  • Each external electrode may include, for example, a laminated structure of a conductive paste layer and a plating layer.
  • a laminated structure of a Ni layer and a Sn layer (such as a Ni/Sn plating layer) may be used as the plating layer.
  • the conductive paste layer may be formed to cover at least one end face of the anode part and the cathode part of the capacitor element or a plurality of capacitor elements.
  • the conductive paste layer may be formed to cover the end face via a contact layer.
  • the conductive paste layer may be formed to cover not only the end face of the anode part or the cathode part, but also the surface (side face, etc.) of the sealing body where the end face is exposed.
  • the conductive paste layer can be formed by applying a conductive paste containing conductive particles and a resin material to the surface of the sealing body where the end face of the anode or cathode is exposed, and then drying it.
  • the conductive particles can be, for example, metal particles such as silver or copper, or particles of a conductive inorganic material such as carbon.
  • FIG. 1 is a cross-sectional view showing a schematic structure of a capacitor (C) according to one embodiment of the present disclosure.
  • a solid electrolytic capacitor 100 includes a plurality of stacked capacitor elements 10, a sealing body 14 that seals the capacitor elements 10, a first external electrode 21, and a second external electrode 22.
  • the stacked capacitor elements 10 are supported on an insulating substrate 17.
  • An adhesive layer 18 is interposed between the substrate 17 and the capacitor element 10 closest to the substrate 17.
  • the surface of the substrate 17 on which the adhesive layer 18 is formed is the first surface S1, and the opposite surface (outer surface) is the second surface S2.
  • the first surface S1 of the substrate 17 is roughened, and at the interface between the first surface S1 and the adhesive layer 18, the adhesive layer 18 penetrates into the recesses of the first surface S1 and adheres closely to the first surface S1. This prevents moisture from penetrating into the solid electrolytic capacitor 100 through the substrate 17, reducing the amount of moisture absorbed by the solid electrolytic capacitor.
  • Each capacitor element 10 includes an anode body 3 constituting an anode portion, and a cathode portion 6.
  • the anode body 3 is, for example, an anode foil.
  • the anode body 3 has a core portion 4 and a porous portion 5 formed on the surface of the core portion 4 (the surface layer of the anode body 3).
  • a dielectric layer (not shown) is formed on at least a portion of the surface of the porous portion 5.
  • the cathode portion 6 covers at least a portion of the dielectric layer.
  • the cathode portion 6 includes a solid electrolyte layer 7 and a cathode lead layer.
  • the capacitor element 10 has one end (first end) where the anode body 3 is exposed without being covered by the cathode portion 6.
  • the other end (second end) of the capacitor element 10 is covered by the cathode portion 6.
  • the portion of the anode body 3 that is covered by the cathode portion 6 (particularly the solid electrolyte layer 7) is referred to as the second portion 2, and the other portion is referred to as the first portion 1.
  • the first portion 1 is not covered by the cathode portion 6 of the anode body 3.
  • the end of the first portion 1 is the first end, and the end of the second portion 2 is the second end.
  • the second portion 2 has a core portion 4 and a porous portion 5 formed on the surface of the core portion 4.
  • the first portion 1 may or may not have a porous portion 5 on its surface.
  • the dielectric layer is formed at least along the surface of the porous portion 5 formed in the second portion 2.
  • the surface of the dielectric layer is formed with an uneven shape corresponding to the shape of the surface of the anode body 3.
  • the solid electrolyte layer 7 can be formed so as to fill in the unevenness of the dielectric layer.
  • the cathode extraction layer may include, for example, a first layer 8 such as a carbon layer that covers at least a portion of the solid electrolyte layer 7, and a metal foil 20 as a second layer that covers at least a portion of the first layer 8.
  • the metal foil 20 is interposed between the second portions 2 of the capacitor elements 10 adjacent to each other in the stacking direction.
  • the metal foil 20 constitutes part of the cathode portion 6 of the capacitor element 10.
  • the metal foil 20 has a carbon layer 20b on its surface.
  • a conductive adhesive 9 may be interposed between the carbon layer 20b and the capacitor element 10.
  • the conductive adhesive 9 contains, for example, carbon or silver.
  • an insulating separation layer (or insulating member) 12 may be formed so as to cover the surface of the anode body 3. This restricts contact between the cathode portion 6 and the exposed portion (first portion 1) of the anode body 3.
  • the separation layer 12 is, for example, an insulating resin layer.
  • the sealing body 14 has a substantially rectangular parallelepiped outer shape, and the solid electrolytic capacitor 100 also has a substantially rectangular parallelepiped outer shape.
  • the sealing body 14 has a first outer surface 14a and a second outer surface 14b opposite the first outer surface 14a.
  • the end face 1a of the first end of the anode body 3, which is the anode portion of each capacitor element 10, is exposed at the first outer surface 14a.
  • the end face 20a of the metal foil 20 constituting the cathode portion 6 is exposed from the sealing body at the second outer surface 14b.
  • the end face 20a and second outer face 14b of the metal foil 20 exposed from the sealing body 14 are covered with a second external electrode 22.
  • a contact layer 15 is formed on the end face 20a of the metal foil 20 so as to cover the end face 20a.
  • the second external electrode 22 is electrically connected to the end face 20a of the metal foil 20 constituting the cathode section 6 via the contact layer 15.
  • the end face 1a and first outer surface 14a exposed from the sealing body 14 at the first end of the multiple anode bodies 3 are covered with a first external electrode 21.
  • a contact layer 15 is formed on the end face 1a of the anode body 3 so as to cover the end face 1a.
  • the end face of the separation layer 12 is also exposed from the first outer surface 14a of the sealing body 14, and this exposed end face is also covered with a first external electrode 21.
  • the first external electrode 21 is electrically connected to the end face 1a of the anode body 3 via the contact layer 15.
  • the first external electrode 21 comprises, for example, a conductive paste layer 21A, such as a silver paste layer, and a Ni/Sn plating layer 21B covering the conductive paste layer 21A.
  • the second external electrode 22 comprises, for example, a conductive paste layer 22A, such as a silver paste layer, and a Ni/Sn plating layer 22B covering the conductive paste layer 22A.
  • the first external electrode 21 covers the entire first outer surface 14a of the sealing body 14, and also covers a third outer surface perpendicular to the first outer surface 14a and a portion of the first outer surface 14a side of the substrate 17.
  • the second external electrode 22 covers the entire second outer surface 14b, and also covers a third outer surface 14c perpendicular to the second outer surface 14b and a portion of the second outer surface 14b side of the substrate 17. This configuration can further increase the adhesion between the first external electrode 21 and the first outer surface 14a, and between the second external electrode 22 and the second outer surface 14b.
  • the first external electrode 21 and the second external electrode 22, which cover a portion of the substrate 17, are each exposed on the bottom surface of the solid electrolytic capacitor 100. These exposed portions constitute the anode terminal and the cathode terminal of the solid electrolytic capacitor 100, respectively.
  • a capacitor element including an anode portion and a cathode portion; A substrate supporting the capacitor element; a sealant that seals the capacitor element; a first external electrode electrically connected to the anode portion; a second external electrode electrically connected to the cathode portion; an adhesive layer interposed between the capacitor element and a first surface of the substrate; Equipped with At the interface between the first surface and the adhesive layer, The maximum height Rz1 of the surface roughness of the first surface is 5 ⁇ m or more, A solid electrolytic capacitor, wherein the maximum height Rz2 of the surface roughness of the adhesive layer is 3 ⁇ m or more.
  • the adhesive layer includes an insulating resin and filler particles; 6.
  • FIG. 9 A method for producing a solid electrolytic capacitor according to any one of techniques 1 to 8, comprising the steps of: providing the capacitor element; providing a substrate for supporting the capacitor element; applying an adhesive to a first surface of the substrate to form the adhesive layer; placing the capacitor element on the substrate via the adhesive; Equipped with a maximum height Rz3 of surface roughness of the first surface of the substrate prepared in the step of preparing the substrate is 10 ⁇ m or more.
  • Substrate E is an insulating substrate consisting of an insulating layer having a maximum surface roughness height (Rz3) of 33.8 ⁇ m on the first surface and a thickness of 100 ⁇ m, the insulating layer containing a nonwoven fabric of glass fiber, the glass fiber content being 125 parts by mass relative to 100 parts by mass of insulating resin, and the insulating resin being a cured product of a composition mainly composed of epoxy resin.
  • Rz3 maximum surface roughness height
  • the adhesive A is a thermosetting insulating resin composition containing an epoxy resin as a main component and 5% by volume of filler particles having an average particle size of 0.5 ⁇ m, and has a viscosity of 25 Pa ⁇ s at 25°C.
  • Substrate E on which an adhesive layer was formed was prepared by the following two methods, and the water vapor transmission rate (g/m 2 /day) of the substrate was measured by the procedure already described.
  • adhesive A was applied by bar coating printing to the first surface of substrate E in an amount such that the average thickness Tav of the adhesive layer became 10 ⁇ m, and then the adhesive was cured by heating at 80° C. to form an adhesive layer 18.
  • the water vapor transmission rate of the substrate after the adhesive layer 18 was formed (hereinafter referred to as "substrate C1") was 33.2 g/m 2 /day.
  • adhesive A was applied by screen printing to the first surface of substrate E in an amount such that the average thickness Tav of the adhesive layer was 10 ⁇ m, adhesive A was sufficiently penetrated into the first surface with a squeegee, and then the adhesive was cured by heating at 80° C. to form an adhesive layer 18.
  • the water vapor transmission rate of the substrate after the adhesive layer 18 was formed (hereinafter referred to as "substrate E1") was 20.2 g/ m2 /day.
  • substrates C1 and E1 coated with adhesive were prepared using the two methods described above, and without curing the adhesive, seven capacitor elements were mounted on the first surface of each of the substrates C1 and E1, to prepare solid electrolytic capacitors as shown in Figure 1 in the following manner.
  • the seven elements with the first layer 8 formed were laminated with the first portions overlapping, with the metal foil 20 (aluminum foil with a carbon layer 20b, thickness 20 ⁇ m) as the second layer interposed between the first layers 8 of adjacent elements.
  • the metal foil 20 of the second layer was attached to the adjacent first layer 8 via the conductive adhesive 9.
  • a cathode lead layer including the first layer 8 and the metal foil 20 as the second layer was formed, and a capacitor element 10 including the cathode lead layer was completed.
  • the cathode portion 6 includes a solid electrolyte layer 7 and a cathode lead layer.
  • sealing body 14 The seven stacked capacitor elements 10 obtained in (4) above were molded using a sealing material mainly composed of epoxy resin, with the second surface of the substrate 17 exposed, and a sealing body 14 made of insulating resin was formed around the capacitor elements 10.
  • the side surface side portion of the sealing body 14 was cut by dicing to form a first outer surface 14a and a second outer surface 14b.
  • the sealing body 14 was cut so that the end surface 1a of the anode body 3 of each capacitor element 10 and the substrate 17 were exposed from the first outer surface 14a, and the end surface 20a of the metal foil 20 and the substrate 17 were exposed from the second outer surface 14b, thereby obtaining a capacitor precursor.
  • the first external electrode 21 and the second external electrode 22 were formed so as to cover the contact layer 15 formed in (6) above and the first outer surface 14a and the second outer surface 14b, respectively.
  • a conductive paste containing silver particles and resin was applied to the contact layer 15 and the outer surface of the sealing body, and then heated and dried to form conductive paste layers 21A and 22A, respectively.
  • an electrolytic Ni plating layer and an electrolytic Sn plating layer were formed to cover the conductive paste layers 21A and 22A, respectively.
  • Ni/Sn plating layers 21B and 22B, respectively were formed to obtain solid electrolytic capacitors.
  • a total of 20 solid electrolytic capacitors were produced for each example using the same procedure.
  • the solid electrolytic capacitors were left to stand in a thermostatic chamber at 30°C and 60% RH for 192 hours.
  • the solid electrolytic capacitors were removed from the thermostatic chamber and cooled to 25°C.
  • the mass increase of 20 solid electrolytic capacitors was measured and the average value was calculated.
  • the moisture absorption amount of the solid electrolytic capacitors using substrate C1 was 104.2 ⁇ g/piece, and the moisture absorption amount of the solid electrolytic capacitors using substrate E1 was 63.4 ⁇ g/piece.
  • the capacitance ( ⁇ F) and ESR (m ⁇ ) of each of the 20 solid electrolytic capacitors after moisture absorption were measured using the same method as above.
  • the solid electrolytic capacitors were subjected to a reflow process in accordance with IPC/JEDEC J-STD-020D. Specifically, the solid electrolytic capacitors were preheated at a holding temperature of 150-200°C for a holding time of 180 seconds or less. After preheating, the solid electrolytic capacitors were heated to a temperature of 255°C or higher (maximum temperature 260°C) for 30 seconds. The heating at the maximum temperature of 260°C was limited to 10 seconds or less. The capacitors were then cooled to 25°C over 10 minutes, and this heating and cooling process was repeated two more times (i.e., three times in total). The capacitance ( ⁇ F) and ESR (m ⁇ ) of each of the 20 solid electrolytic capacitors after reflow were measured using the same method as above.
  • ⁇ Solid electrolytic capacitor E1> Rz1: 7.5 ⁇ m Rz2: 7.4 ⁇ m Tav: 7.5 ⁇ m Rpav: 1.5% Rx: 99.0% ⁇ Solid electrolytic capacitor C1> Rz1: 7.5 ⁇ m Rz2: 2.8 ⁇ m Tav: 10.0 ⁇ m Rpav: 15.0% Rx: 62.0%
  • a cross-sectional image (magnification of 100,000 times the original) of an example of a solid electrolytic capacitor E1 is shown in Fig. 3. In Fig. 3, the interface between the adhesive layer and the first surface of the substrate is highlighted with a white line. It can be seen that the surface of the adhesive layer on the first surface side has a shape that substantially follows the shape of the first surface of the substrate, and that the adhesive layer penetrates deep into the recesses of the first surface.
  • the solid electrolytic capacitor according to the present disclosure can prevent moisture from penetrating into the interior through a substrate including an insulating layer, and can suppress fluctuations in ESR when exposed to high temperatures such as during reflow processing. Therefore, the solid electrolytic capacitor according to the present disclosure can be used in a variety of applications requiring high reliability, and is also useful in applications requiring high heat resistance and applications in high humidity environments. However, the applications of the solid electrolytic capacitor are not limited to these.

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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6437006A (en) * 1987-07-31 1989-02-07 Matsushita Electric Industrial Co Ltd Chip-like sold electrolytic capacitor
JPH06151261A (ja) * 1992-11-10 1994-05-31 Toshiba Chem Corp 固体電解コンデンサ
JP2004104048A (ja) * 2002-09-13 2004-04-02 Nec Tokin Corp チップ型固体電解コンデンサ
WO2006082772A1 (ja) * 2005-02-04 2006-08-10 Sanyo Electric Co., Ltd. 電子部品及びその製造方法
JP2007173559A (ja) * 2005-12-22 2007-07-05 Nichicon Corp チップ状固体電解コンデンサ
JP2007317976A (ja) * 2006-05-29 2007-12-06 Nichicon Corp 固体電解コンデンサの製造方法
WO2014050112A1 (ja) * 2012-09-28 2014-04-03 三洋電機株式会社 固体電解コンデンサ及びその製造方法
JP2018198298A (ja) * 2016-06-15 2018-12-13 株式会社村田製作所 固体電解コンデンサ
JP2020178098A (ja) * 2019-04-22 2020-10-29 パナソニックＩｐマネジメント株式会社 固体電解コンデンサおよびその製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6437006A (en) * 1987-07-31 1989-02-07 Matsushita Electric Industrial Co Ltd Chip-like sold electrolytic capacitor
JPH06151261A (ja) * 1992-11-10 1994-05-31 Toshiba Chem Corp 固体電解コンデンサ
JP2004104048A (ja) * 2002-09-13 2004-04-02 Nec Tokin Corp チップ型固体電解コンデンサ
WO2006082772A1 (ja) * 2005-02-04 2006-08-10 Sanyo Electric Co., Ltd. 電子部品及びその製造方法
JP2007173559A (ja) * 2005-12-22 2007-07-05 Nichicon Corp チップ状固体電解コンデンサ
JP2007317976A (ja) * 2006-05-29 2007-12-06 Nichicon Corp 固体電解コンデンサの製造方法
WO2014050112A1 (ja) * 2012-09-28 2014-04-03 三洋電機株式会社 固体電解コンデンサ及びその製造方法
JP2018198298A (ja) * 2016-06-15 2018-12-13 株式会社村田製作所 固体電解コンデンサ
JP2020178098A (ja) * 2019-04-22 2020-10-29 パナソニックＩｐマネジメント株式会社 固体電解コンデンサおよびその製造方法

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