Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
  • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
  • C08L23/10—Homopolymers or copolymers of propene
  • C08L23/12—Polypropene
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
  • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
  • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
  • C09J123/10—Homopolymers or copolymers of propene
  • C09J123/12—Polypropene
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
  • C09J153/02—Vinyl aromatic monomers and conjugated dienes
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K2201/00—Specific properties of additives
  • C08K2201/002—Physical properties
  • C08K2201/005—Additives being defined by their particle size in general
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K2201/00—Specific properties of additives
  • C08K2201/016—Additives defined by their aspect ratio
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/34—Silicon-containing compounds
  • C08K3/346—Clay

Definitions

• the present invention relates to a resin composition. More specifically, the present invention relates to a resin composition and a hot melt adhesive composition that are excellent in fluidity, water vapor barrier properties, adhesion, and thermal shock resistance.
• Two-component curing epoxy resins and silicone resins have generally been used as insulating resins for sealing electrical and electronic components used in automobiles and electrical appliances.
• Low-pressure molding using thermoplastic resins has become popular for sealing electrical and electronic components.
• the present invention was made against the background of the problems with the conventional technology. That is, the object of the present invention is to provide a resin composition that has excellent water vapor barrier properties while maintaining the fluidity, adhesiveness, and thermal shock resistance of resins that are excellent for low-pressure molding.
• a resin composition comprising a polyolefin resin (A), an acid-modified polyolefin resin (B), a styrene-isobutylene-styrene block copolymer (C), an adhesion imparting agent (D) and a filler (E), in which, when the total amount of the polyolefin resin (A), the acid-modified polyolefin resin (B), the styrene-isobutylene-styrene block copolymer (C), and the adhesion imparting agent (D) is 100 parts by mass, the content of the styrene-isobutylene-styrene block copolymer (C) is 8 to 32 parts by mass, the content of the adhesion imparting agent (D) is 8 to 27 parts by
• the resin composition of the present invention exhibits excellent resin fluidity, adhesion, and thermal shock resistance in low-pressure molding, and also has excellent water vapor barrier properties. Therefore, by using it as a sealing material for products that require a high level of waterproofing, it is possible to manufacture products that satisfy water vapor barrier properties.
• the resin composition of the present invention can be used as a hot melt adhesive, and is particularly suitable for sealing electrical and electronic components.
• FIG. 1 shows a schematic diagram of a chart measured by a differential scanning calorimeter.
• the resin composition of the present invention contains a polyolefin resin (A).
• a polyolefin resin (A) By containing the polyolefin resin (A), it is possible to impart good water vapor barrier properties to the resin composition.
• the polyolefin resin (A) used in the present invention is not particularly limited, but polypropylene resin is preferred from the viewpoint of water vapor barrier properties.
• ethylene- ⁇ -olefin copolymers and propylene- ⁇ -olefin copolymers are preferred from the viewpoint of adhesion to metals and films.
• polypropylene resins can be used in combination with ethylene- ⁇ -olefin copolymers and propylene- ⁇ -olefin copolymers.
• the polypropylene resin referred to here is a so-called homopolypropylene mainly composed of propylene units, which does not contain copolymerization components such as ⁇ -olefins other than propylene, or contains only a very small amount of 1 mol% at most.
• the polyolefin resin (A) does not correspond to the acid-modified polyolefin resin (B) described later, and refers to one that is not acid-modified.
• polypropylene resin and ethylene- ⁇ -olefin copolymer and/or propylene- ⁇ -olefin copolymer (hereinafter collectively referred to as olefin copolymer) are used in combination as the polyolefin resin (A)
• the preferred blend ratio of polypropylene resin/olefin copolymer is 20/80 to 80/20 by mass, more preferably 30/70 to 70/30, and even more preferably 40/60 to 60/40.
• the polyolefin resin (A) used in the present invention preferably has a melt mass flow rate (hereinafter sometimes abbreviated as MFR) measured according to JIS K 7210-1:2014 (test temperature 190°C, nominal load 2.16 kg) of 10 to 70 g/10 min.
• MFR melt mass flow rate
• the fluidity of the resin is maintained at an appropriate level, resulting in good moldability.
• the resin composition is prevented from becoming extremely soft due to a decrease in viscosity, resulting in good mechanical properties.
• each of the polyolefin resins is within the above range.
• the upper limit of the melting point of the polyolefin resin (A) is desirably 210°C. It is preferably 200°C or lower, more preferably 190°C or lower.
• the lower limit is preferably 90°C or higher, more preferably 100°C or higher, even more preferably 110°C or higher, and particularly preferably 120°C or higher. It is preferable that the melting point is 5 to 10°C higher than the heat resistance temperature required for the corresponding application.
• each polyolefin resin is within the above range.
• the content of polyolefin resin (A) in the resin composition of the present invention is preferably 38 parts by mass or more, more preferably 40 parts by mass or more, even more preferably 42 parts by mass or more, and particularly preferably 48 parts by mass or more, when the total of polyolefin resin (A), acid-modified polyolefin resin (B), styrene-isobutylene-styrene block copolymer (C) and adhesion promoter (D) is taken as 100 parts by mass. Also, it is preferably 70 parts by mass or less, more preferably 68 parts by mass or less, and even more preferably 63 parts by mass or less.
• the content ratio of polyolefin resin (A) is equal to or more than the lower limit, the resin composition can be given particularly good water vapor barrier properties. Also, when it is equal to or less than the upper limit, the resin composition has good thermal shock resistance.
• the resin composition of the present invention contains an acid-modified polyolefin resin (B).
• an acid-modified polyolefin resin (B) By containing the acid-modified polyolefin resin (B), it is possible to impart good dispersibility with the polyolefin resin (A), the styrene-isobutylene-styrene block copolymer (C), the adhesion promoter (D) and the filler (E), and as a result, it is possible to impart appropriate adhesiveness, thermal shock resistance and water vapor barrier properties to the resin composition.
• the acid-modified polyolefin resin (B) is not particularly limited, and may be any resin having a polyolefin segment and a carboxylic acid segment, and examples thereof include ethylene-unsaturated carboxylic acid copolymers such as ethylene-vinyl acetate-maleic anhydride terpolymer, ethylene-ethyl acrylate-maleic anhydride terpolymer, unsaturated carboxylic acid graft-modified polyolefin resins such as maleic anhydride graft-modified polypropylene and maleic anhydride graft-modified propylene- ⁇ -olefin copolymer. Among them, unsaturated carboxylic acid graft-modified polyolefin resins are preferred, and it is more preferred that the unsaturated carboxylic acid used for graft modification is maleic anhydride.
• the melting point of the acid-modified polyolefin resin (B) used in the present invention is preferably 100°C or higher, more preferably 110°C or higher, and even more preferably 120°C or higher. It is also preferably 160°C or lower, and more preferably 150°C or lower. If the melting point of the acid-modified polyolefin resin (B) is equal to or higher than the lower limit, the heat resistance of the resin composition is good, and if it is equal to or lower than the upper limit, the flowability of the resin composition during molding is good.
• the content of the acid-modified polyolefin resin (B) in the resin composition of the present invention is preferably 1 part by mass or more, more preferably 3 parts by mass or more, and even more preferably 5 parts by mass or more, when the total of the polyolefin resin (A), the acid-modified polyolefin resin (B), the styrene-isobutylene-styrene block copolymer (C), and the adhesion promoter (D) is 100 parts by mass. It is also preferably 22 parts by mass or less, more preferably 20 parts by mass or less, even more preferably 15 parts by mass or less, and particularly preferably 10 parts by mass or less. .
• the content ratio of the acid-modified polyolefin resin (B) is equal to or more than the lower limit, the dispersibility with the polyolefin resin (A), the styrene-isobutylene-styrene block copolymer (C), the adhesion promoter (D), and the filler (E) is good. Also, when the content ratio of the acid-modified polyolefin resin (B) is equal to or less than the upper limit, the mechanical properties are good.
• the resin composition of the present invention contains a styrene-isobutylene-styrene block copolymer (C).
• a styrene-isobutylene-styrene block copolymer (C) By containing the styrene-isobutylene-styrene block copolymer (C), it is possible to impart appropriate thermal shock resistance to the resin composition.
• the styrene-isobutylene-styrene block copolymer (C) used in the present invention is not particularly limited, but a triblock structure is preferred from the viewpoints of water vapor barrier properties and thermal shock resistance.
• the styrene content of the styrene-isobutylene-styrene block copolymer (C) used in the present invention is preferably 10% by weight or more, more preferably 13% by weight or more, and even more preferably 15% by weight or more. It is also preferably 30% by weight or less, more preferably 25% by weight or less, and even more preferably 20% by weight or less.
• the styrene content of the styrene-isobutylene-styrene block copolymer (C) is equal to or greater than the lower limit, the heat resistance is good.
• the styrene content of the styrene-isobutylene-styrene block copolymer (C) is equal to or less than the upper limit, the flexibility is increased and the thermal shock resistance is good.
• the content of the styrene-isobutylene-styrene block copolymer (C) in the resin composition of the present invention must be 8 parts by mass or more when the total of the polyolefin resin (A), the acid-modified polyolefin resin (B), the styrene-isobutylene-styrene block copolymer (C) and the adhesion promoter (D) is 100 parts by mass. It is preferably 10 parts by mass or more, more preferably 12 parts by mass or more, even more preferably 15 parts by mass or more, and particularly preferably 18 parts by mass or more. It must also be 32 parts by mass or less.
• It is preferably 30 parts by mass or less, more preferably 28 parts by mass or less, even more preferably 25 parts by mass or less, and particularly preferably 22 parts by mass or less.
• the content ratio of the styrene-isobutylene-styrene block copolymer (C) is equal to or more than the lower limit, the thermal shock resistance is good.
• the content ratio of the styrene-isobutylene-styrene block copolymer (C) is equal to or less than the upper limit, the fluidity of the resin is high and the moldability is good.
• the resin composition of the present invention contains an adhesion promoter (D).
• an adhesion promoter (D) By containing the adhesion promoter (D), it is possible to impart good adhesion when the resin composition is used as a sealant, and also to appropriately improve the fluidity of the resin composition.
• the adhesion promoter (D) used in the present invention is not particularly limited, and a phenolic compound, a xylene-modified phenolic resin, a terpene-modified phenolic resin, a hydrogenated terpene-modified phenolic resin obtained by hydrogenating a terpene-modified phenolic resin, etc. can be used.
• a xylene-modified phenolic resin and a terpene-modified phenolic resin are preferred.
• the adhesion promoter (D) used in the present invention preferably has a hydroxyl group.
• the hydroxyl value of the adhesion promoter (D) is preferably 1 mgKOH/g or more, more preferably 30 mgKOH/g or more, and even more preferably 50 mgKOH/g or more. It is also preferably 100 mgKOH/g or less, more preferably 90 mgKOH/g or less, even more preferably 80 mgKOH/g or less, and particularly preferably 70 mgKOH/g or less.
• the hydroxyl value is equal to or less than the upper limit, it is possible to appropriately maintain moisture permeability while improving adhesion.
• the hydroxyl value can be measured, for example, by the potentiometric titration method specified in JIS K 0070:1992.
• the content of the adhesion promoter (D) in the resin composition of the present invention must be 8 parts by mass or more when the total of the polyolefin resin (A), the acid-modified polyolefin resin (B), the styrene-isobutylene-styrene block copolymer (C) and the adhesion promoter (D) is 100 parts by mass. It is preferably 10 parts by mass or more, more preferably 13 parts by mass or more, and even more preferably 15 parts by mass or more. It must be 27 parts by mass or less, and is preferably 25 parts by mass or less, more preferably 22 parts by mass or less, and even more preferably 20 parts by mass or less. When the content of the adhesion promoter (D) is within the above range, particularly good adhesion can be exhibited. In addition, a decrease in the flexibility of the resin composition and a decrease in adhesion due to embrittlement are suppressed.
• the resin composition of the present invention contains a filler (E).
• a filler (E) By containing the filler (E), it is possible to impart good water vapor barrier properties to the resin composition.
• the filler (E) used in the present invention is not particularly limited, and glass beads, calcium carbonate, kaolin, talc, glass fiber, carbon fiber, clay, etc. can be used.
• the filler (E) used in the present invention is plate-shaped. By making the filler (E) plate-shaped, the water vapor barrier properties are particularly improved.
• being plate-shaped refers to a plate-like shape in which the height of the filler is extremely small compared to the width and depth of the filler.
• the aspect ratio of the filler (E), that is, the ratio of the minor axis to the major axis of the filler (E) (major axis/minor axis) is preferably 3 to 500.
• the aspect ratio of the filler (E) may be 5 or more, 10 or more, 20 or more, 50 or more, 100 or more, and 450 or less, 400 or less, 350 or less, 300 or less, or 200 or less.
• the aspect ratio of the filler (E) can be determined by a method such as automatic area measurement of an image obtained by observing the filler (E) with an electron microscope. If the aspect ratio of the filler (E) is too low, the water vapor barrier property decreases, and if the aspect ratio is too high, the dispersibility decreases and the mechanical properties may decrease.
• the content of the filler (E) in the resin composition of the present invention must be 1 part by mass or more, preferably 2 parts by mass or more, and more preferably 4 parts by mass or more, when the total of the polyolefin resin (A), the acid-modified polyolefin resin (B), the styrene-isobutylene-styrene block copolymer (C), and the adhesion promoter (D) is 100 parts by mass.
• the content of the filler (E) is equal to or more than the lower limit, the water vapor barrier property is good.
• the mechanical properties of the resin composition are good, and the shear adhesive strength may be improved.
• the content of the filler (E) must be 13 parts by mass or less, preferably 10 parts by mass or less, and more preferably 8 parts by mass or less.
• the adhesiveness is good.
• the particle size (D50) of the filler (D) in the resin composition of the present invention may be, for example, 1 to 50 ⁇ m.
• the particle size (D50) can be measured, for example, by a laser diffraction method or a dynamic light scattering method.
• the resin composition of the present invention contains at least the polyolefin resin (A), the acid-modified polyolefin resin (B), the styrene-isobutylene-styrene block copolymer (C), the adhesion promoter (D) and the filler (E). If necessary, it may further contain various additives such as an antioxidant.
• the resin composition of the present invention preferably has a melt viscosity of 5 to 1500 dPa ⁇ s at 240°C.
• the melt viscosity of the resin composition can be achieved by appropriately adjusting the types and blending ratios of the polyolefin resin (A), the acid-modified polyolefin resin (B), the styrene-isobutylene-styrene block copolymer (C), the adhesion promoter (D) and the filler (E).
• the melt viscosity at 240°C is a value measured as follows.
• the resin composition is dried to a moisture content of 0.1% or less, and then the resin composition heated and stabilized at 240°C is passed through a 10 mm thick die having a hole diameter of 1.0 mm at a pressure of 98 N/ cm2 using a flow tester (model number CFT-500C) manufactured by Shimadzu Corporation.
• a resin composition having a melt viscosity of 1500 dPa ⁇ s or less, preferably 1000 dPa ⁇ s or less a product with excellent electrical insulation can be obtained at a relatively low injection pressure of 0.1 to 20 MPa, and the characteristics are not impaired.
• the lower limit is preferably 5 dPa ⁇ s or more, more preferably 10 dPa ⁇ s or more, even more preferably 30 dPa ⁇ s or more, and most preferably 50 dPa ⁇ s or more.
• the resin composition of the present invention may further contain an antioxidant.
• the antioxidant used in the present invention is not particularly limited as long as it can prevent oxidation of the polyolefin resin (A), and hindered phenol-based antioxidants, phosphorus-based antioxidants, thioether-based antioxidants, etc. can be used.
• hindered phenol-based antioxidants include 1,3,5-tris(3,5-di-t-butyl-4-hydroxybenzyl)isocyanurate, 1,1,3-tri(4-hydroxy-2-methyl-5-t-butylphenyl)butane, 1,1-bis(3-t-butyl-6-methyl-4-hydroxyphenyl)butane, 3,5-bis(1,1-dimethylethyl)-4-hydroxy-benzenepropanoic acid, pentaerythrityl tetrakis(3,5-di-t-butyl-4-hydroxyphenyl)propionate, 3-(1,1-dimethylethyl)-4-hydroxy-5-methyl-benzenepropanoic acid, and the like.
• the antioxidant content is preferably 0.1 parts by mass or more per 100 parts by mass of the total of polyolefin resin (A), acid-modified polyolefin resin (B), styrene-isobutylene-styrene block copolymer (C) and adhesion promoter (D), more preferably 0.2 parts by mass or more, and even more preferably 0.3 parts by mass or more. If the content is too low, it may have a negative effect on long-term durability at high temperatures. It is also preferably 5 parts by mass or less, more preferably 3 parts by mass or less, and even more preferably 1 part by mass or less. If the content is too high, it may have a negative effect on adhesion, etc.
• the resin composition of the present invention may contain other resins such as polyamide, polycarbonate, acrylic, ethylene vinyl acetate, etc., which do not fall under any of the polyolefin resin (A), the acid-modified polyolefin resin (B), the styrene-isobutylene-styrene block copolymer (C), the adhesion promoter (D), and the filler (E), isocyanate compounds, curing agents such as melamine, pigments such as carbon black and titanium oxide, and flame retardants such as antimony trioxide and brominated polystyrene, within a range that does not impair the effects of the present invention. By adding these components, adhesion, flexibility, durability, etc. may be improved.
• other resins such as polyamide, polycarbonate, acrylic, ethylene vinyl acetate, etc.
• the polyolefin resin (A) is preferably contained in an amount of 30 to 70% by weight, more preferably 40 to 60% by weight, based on the entire resin composition of the present invention. If the content of polyolefin resin (A) is too low, the excellent water vapor barrier properties and durability of the polyolefin resin (A) itself tend to decrease, and if the content is too high, flexibility and adhesion tend to decrease.
• light stabilizers include benzotriazole-based light stabilizers, benzophenone-based light stabilizers, hindered amine-based light stabilizers, nickel-based light stabilizers, and benzoate-based light stabilizers.
• benzotriazole-based light stabilizer examples include 2-(3,5-di-tert-amyl-2'hydroxyphenyl)benzotriazole, 2-(2-hydroxy-5-tert-octylphenyl)benzotriazole, 2-(2'-hydroxy-3'-tert-butyl-5'-methylphenyl)-5-chlorobenzotriazole, 2-(2H-benzotriazol-2-yl)-p-cresol, 2-(2'-hydroxy-5'-methylphenyl)-benzotriazole, 2,4-di-tert-butyl-6-(5-chlorobenzotriazol-2-yl)phenol, and 2-[2-hydroxy-3,5-di(1,1-dimethylbenzyl)]-2H-benzotriazole.
• hindered amine light stabilizer examples include bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate, dimethyl succinate/1-(2-hydroxyethyl)-4-hydroxy-2,2,6,6-tetramethylpiperidine polycondensate, poly[ ⁇ 6-(1,1,3,3-tetramethylbutyl)amino-1,3,5-triazine-2,4-diyl ⁇ (2,2,6,6-tetramethyl-4-piperidyl) imino ⁇ hexamethylene(2,2,6,6-tetramethyl-4-piperidyl)imino ⁇ ], 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl)-s-triazine-2,4,6(1H,3H,5H)trione, tris(4-tert-butyl-3-hydroxy-2,6-dimethylbenzyl)-s-triazine-2,4,6-(1H,3H,5H)tri
• the resin composition of the present invention can be used as a hot melt adhesive composition.
• the hot melt adhesive composition can be suitably used as a sealant for electric and electronic components.
• the resin composition of the present invention can be injected into a mold in which a product to be waterproofed is set, thereby obtaining a molded product that seals the product. More specifically, when a screw-type hot melt molding applicator is used, the resin composition is heated and melted at about 180 to 250°C, and injected into a mold through an injection nozzle. After a certain cooling time, the molded product can be removed from the mold to obtain the molded product.
• the moisture permeability (water vapor barrier property) was calculated from the weight of water absorbed by calcium chloride every 24 hours between (1) 24 hours and 48 hours, (2) 48 hours and 72 hours, and (3) 72 hours and 96 hours, and the average value of the three moisture permeability values was taken as the moisture permeability.
• the moisture permeability was calculated by the following formula.
• the moisture permeability area refers to the area of the film made of the resin composition.
• T-peel adhesive strength Method for preparing T-peel adhesive test specimens
• a substrate (aluminum substrate: A5052 (thickness: 0.1 mm)) was cut to a size of 40 mm x 25 mm, and the surface was wiped with acetone to remove oil.
• a film having a thickness of about 200 ⁇ m was prepared from the resin composition by heat pressing using a heat press machine (SA-303 manufactured by Tester Sangyo Co., Ltd.).
• the heat pressing conditions were a temperature of 200° C., a pressing pressure of 6 MPa, and a pressing time of 10 seconds.
• the heat pressed film was cut to a size of 20 mm x 25 mm, two sheets were stacked, and sandwiched between aluminum substrates cut in advance, and heat sealed using a heat seal tester (TP-701-B manufactured by Tester Sangyo Co., Ltd.).
• the heat sealing conditions were a temperature of 220° C., a pressure of 0.4 MPa, and a pressing time of 30 seconds, and a T-peel adhesive test specimen in which a film made of the resin composition was sandwiched between aluminum substrates was obtained.
• T-peel adhesive strength test piece The aluminum substrate of the T-peel adhesive strength test piece was clamped with an autograph (AG-IS manufactured by Shimadzu Corporation) and the film layer made of the resin composition was peeled off with a T-peel in an environment of 25° C. or 90° C. to measure the T-peel adhesive strength.
• the pulling speed was 300 mm/min.
• Thermal shock resistance test method The thermal shock resistance test samples were subjected to thermal shock test in a thermal shock test chamber (TSE-11 manufactured by Espec Corporation) under conditions of -45°C and 95°C (1 cycle: -45°C 9 minutes, 95°C 10 minutes), and the test was performed up to 2000 cycles. Evaluation criteria: ⁇ : No cracking of the resin composition or peeling from the aluminum substrate after 2000 cycles. ⁇ : Cracking of the resin composition or peeling from the aluminum substrate after 2000 cycles.
• the melt viscosity, water vapor barrier property, T-peel adhesive strength and thermal shock resistance of the resin compositions were evaluated by the methods described separately. The evaluation results are shown in Table 1 below.
• polyolefin resin (A-1): J107G, manufactured by Prime Polymer Co., Ltd., homopolypropylene resin, melting point: 165°C, density: 0.90 g/ cm3
• E-3 UBS-0005E, manufactured by Unitika Ltd., glass beads, spherical, particle size: up to 5 ⁇ m, aspect ratio: 1 Styrene-ethylene-butylene-styrene block copolymer (F-1): Tuftec H1043, manufactured by Asahi Kasei Corporation, styrene-ethylene-butylene-styrene block copolymer, styrene content: 67% by weight, MFR: 2.0 g/10 min (230° C., 2.16 kg), density: 0.97 g/cm 3
• the resin compositions of Examples 1 to 9 had excellent results in terms of melt viscosity (fluidity), moisture permeability (water vapor barrier property), T-peel adhesive strength (adhesiveness), and thermal shock resistance.
• Comparative Example 1 did not contain any filler, and therefore had poor water vapor barrier property.
• Comparative Example 2 had a high filler content, high melt viscosity, and poor adhesion and thermal shock resistance.
• Comparative Example 3 contained spherical filler, and therefore had poor water vapor barrier property.
• Comparative Example 4 contained a small amount of adhesion promoter, and therefore had an increased melt viscosity and poor adhesion.
• Comparative Example 5 contained too much adhesion promoter, and therefore the adhesion actually decreased. Comparative Example 6 did not contain any styrene-isobutylene-styrene block copolymer, and therefore had poor thermal shock resistance. Comparative Example 7 contained a large amount of styrene-isobutylene-styrene block copolymer, and therefore had poor adhesion. In Comparative Example 8, a styrene-ethylene-butylene-styrene block copolymer was used instead of a styrene-isobutylene-styrene block copolymer, resulting in poor moisture permeability and adhesion.
• the resin composition of the present invention has a low melt viscosity during product molding, excellent adhesion to aluminum substrates, and excellent water vapor barrier properties and thermal shock resistance, making it useful as a hot melt adhesive composition for waterproofing purposes.

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