WO2024181021A1 - 積層セラミックコンデンサ - Google Patents

積層セラミックコンデンサ Download PDF

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Publication number
WO2024181021A1
WO2024181021A1 PCT/JP2024/003420 JP2024003420W WO2024181021A1 WO 2024181021 A1 WO2024181021 A1 WO 2024181021A1 JP 2024003420 W JP2024003420 W JP 2024003420W WO 2024181021 A1 WO2024181021 A1 WO 2024181021A1
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WO
WIPO (PCT)
Prior art keywords
ceramic
internal electrodes
conductive
multilayer ceramic
xtio3
Prior art date
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Ceased
Application number
PCT/JP2024/003420
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English (en)
French (fr)
Japanese (ja)
Inventor
隆志 大原
英靖 大西
洸太 熊倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to CN202480012012.8A priority Critical patent/CN120642012A/zh
Priority to JP2025503683A priority patent/JPWO2024181021A1/ja
Priority to KR1020257023041A priority patent/KR20250121087A/ko
Publication of WO2024181021A1 publication Critical patent/WO2024181021A1/ja
Priority to US19/293,646 priority patent/US20250364180A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H01G4/0085—Fried electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Definitions

  • This invention relates to multilayer ceramic capacitors, and in particular to the composition of the internal electrodes in multilayer ceramic capacitors.
  • a multilayer ceramic capacitor typically comprises a laminate having a plurality of laminated dielectric layers made of ceramic and a plurality of internal electrodes respectively arranged along a plurality of interfaces between the dielectric layers, and a plurality of external electrodes provided on the outer surface of the laminate and electrically connected to the internal electrodes.
  • the internal electrodes comprise a plurality of first internal electrodes and a plurality of second internal electrodes arranged alternately in the stacking direction of the laminate, and the external electrodes comprise a first external electrode electrically connected to the first internal electrodes and a second external electrode electrically connected to the second internal electrodes.
  • the present invention was made in consideration of these problems, and aims to provide a multilayer ceramic capacitor with internal electrodes that can maintain a relatively high level of coverage even when the layers are made thin.
  • the multilayer ceramic capacitor of the present invention comprises a laminate having a plurality of laminated dielectric layers made of ceramic and a plurality of internal electrodes respectively arranged along a plurality of interfaces between the dielectric layers.
  • the internal electrode when a conductive metal or an alloy containing the conductive metal is represented by X, the internal electrode is characterized in that it contains a conductive component made of X and a ceramic component made of XTiO3 .
  • the coverage of the internal electrodes can be increased by including in the internal electrodes a ceramic component made of XTiO3 containing X that is the same as X contained as a conductive component in the internal electrodes. Therefore, even if the internal electrodes are made thinner, the coverage of the internal electrodes is not reduced, and the increase in capacitance of the multilayer ceramic capacitor can be prevented from being hindered.
  • FIG. 1 is a cross-sectional view illustrating a multilayer ceramic capacitor according to an embodiment of the present invention.
  • the multilayer ceramic capacitor 1 comprises a laminate 2.
  • the laminate 2 comprises a plurality of laminated dielectric layers 3 made of ceramic, and a plurality of internal electrodes 4 and 5 arranged along the interfaces between the plurality of dielectric layers 3.
  • the internal electrodes 4 and 5 are classified into a plurality of first internal electrodes 4 and a plurality of second internal electrodes 5 arranged alternately in the lamination direction of the laminate 2.
  • a first external electrode 6 and a second external electrode 7 are provided on the outer surface of the laminate 2, more specifically, on each of the opposing end faces.
  • the first external electrode 6 is electrically connected to the first internal electrode 4, and the second external electrode 7 is electrically connected to the second internal electrode 5.
  • the dielectric layer 3 is made of a ceramic mainly composed of ABO3 (A is at least one of Ba, Ca and Sr, and B is at least one of Ti and Zr).
  • the ceramic may contain ABO3 as the main component and at least one of Mn, Mg, Si, Y, Dy and Gd as a secondary component.
  • the dielectric layer 3 is made of a ceramic mainly composed of at least one selected from BaTiO3 , SrTiO3 and CaZrO3 .
  • the internal electrodes 4 and 5 preferably contain, as a conductive component, a conductive metal or an alloy containing the conductive metal, for example, one selected from nickel, copper, silver, and a silver/palladium alloy. Furthermore, as a characteristic composition, the internal electrodes 4 and 5 contain a ceramic component made of XTiO3, where X is the conductive metal or an alloy containing the conductive metal , which is the conductive component. The ceramic component made of XTiO3 preferably has an ilmenite crystal structure. As will be understood from the experimental example described later, the internal electrodes 4 and 5 may further contain, as a ceramic component, at least one selected from BaTiO3 , SrTiO3 , and CaZrO3 contained in the dielectric layer 3.
  • the content of the ceramic components in the internal electrodes 4 and 5 is preferably selected to be 5% by mass or more and 15% by mass or less.
  • the content is ⁇ (mass of ceramic components)/(mass of ceramic components + mass of conductive metal or alloy containing conductive metal) ⁇ x 100 (hereinafter the same).
  • the external electrodes 6 and 7 are formed, for example, by applying a conductive paste containing Ag or Cu as the main conductive component to the end faces of the laminate 2 and baking this. If necessary, for example, Ni plating and Sn plating may be applied on the thick film formed by baking.
  • the multilayer ceramic capacitor 1 is manufactured, for example, through the following steps. First, a ceramic slurry is prepared containing ceramic raw material powder having the above-mentioned composition. Next, a suitable sheet forming method is applied to the ceramic slurry to form ceramic green sheets. Next, a conductive paste that is to become each of the internal electrodes 4 and 5 is applied by printing or the like onto predetermined ceramic green sheets out of the multiple ceramic green sheets. Next, the multiple ceramic green sheets are stacked and then pressed together to obtain a green laminate. Next, the green laminate is fired. In this firing process, the ceramic green sheets become the dielectric layers 3. After that, external electrodes 6 and 7 are formed on the end faces of the laminate 2.
  • the conductive paste to be used to form the internal electrodes 4 and 5 in the manufacture of the multilayer ceramic capacitor 1 described above is preferably prepared as follows.
  • the conductive paste is produced in the following steps: a first step of preparing a ceramic powder slurry containing ceramic powder, an organic solvent, and a dispersant; a second step of preparing a metal powder slurry containing conductive metal powder, an organic solvent, and a dispersant; a third step of preparing an organic vehicle containing an organic resin component and an organic solvent; and a fourth step of mixing the ceramic powder slurry, metal powder slurry, and organic vehicle.
  • a ceramic powder slurry is prepared by mixing a ceramic powder and a dispersant in an organic solvent.
  • the ceramic powder is changed depending on the type of conductive metal or its alloy constituting the conductive metal powder contained in the metal powder slurry produced in the second step described below. That is, when the conductive metal or its alloy constituting the conductive metal powder is X, the ceramic powder to be contained in the ceramic powder slurry is selected to be a powder made of XTiO3 . In addition to the above powder, the ceramic powder slurry may contain, as necessary, a powder made of at least one kind selected from BaTiO3 , SrTiO3 , and CaZrO3 as a co-material.
  • the ceramic powder made of XTiO3 can suppress the reaction that may occur between the powder made of X contained in the metal powder slurry produced in the second step during firing.
  • the ceramic powder may contain the above-mentioned XTiO3 as a main component and at least one of Mn, Mg, Si, Y, Dy and Gd as a subcomponent. When such a subcomponent is contained, the grain growth of the ceramic particles is further suppressed, and the sintering of the metal particles may be effectively suppressed.
  • the dispersant mixed with the ceramic powder in the first step may be, for example, an anionic polymer dispersant, and the organic solvent may be, for example, dihydroterpineol.
  • a metal powder slurry is prepared by mixing a conductive metal powder and a dispersant with an organic solvent.
  • the conductive metal powder may be, for example, a powder of one type selected from nickel, copper, silver, and a silver/palladium alloy.
  • the dispersant and organic solvent used in the second step may be the same as those used in the first step.
  • an organic vehicle is produced by mixing an organic resin component with an organic solvent.
  • organic resin component ethyl cellulose resin
  • the organic solvent used in the third step can be the same as that used in the first step.
  • the above-mentioned ceramic powder slurry, metal powder slurry, and organic vehicle are mixed to obtain a conductive paste that will become the internal electrodes 4 and 5.
  • This conductive paste contains a ceramic powder slurry, and as described above, the ceramic powder slurry contains a ceramic powder made of XTiO3 , so that the internal electrodes 4 and 5 provided in the multilayer ceramic capacitor 1 manufactured through the firing step contain a ceramic component made of XTiO3 .
  • the content of ceramic powder in the conductive paste is preferably selected to be 5% by mass or more and 15% by mass or less.
  • each powder of BaCO 3 and TiO 2 as main components was weighed, mixed by ball mill for 72 hours, and then heat-treated at top temperature of 1000 ° C for 2 hours to obtain heat-treated powder.
  • each powder of MnO, Dy 2 O 3 , MgO, SiO 2 and BaCO 3 was prepared as auxiliary components, and the auxiliary component powder was weighed so that the composition ratio of the heat-treated powder was 100BaTiO 3 + 0.5Mn + 1.0Dy + 1.0Mg + 1.0Si + 2.0Ba.
  • These auxiliary component powders were added to the heat-treated powder and mixed by ball mill for 24 hours, and then dried to obtain BaTiO 3 -based ceramic raw material powder.
  • ceramic component made of XTiO3 contained in the internal electrode ceramic powders made of NiTiO3 , CuTiO3 , AgTiO3 , and (Ag,Pd) TiO3 shown in the "Ceramic Component" section of "Internal Electrode” in Table 1 were prepared. More specifically, ( Ag0.7Pd0.3 ) TiO3 was used as the (Ag,Pd) TiO3 .
  • the ceramic powder made of XTiO3 and the BaTiO3- based ceramic powder were weighed out so as to have the ratio shown in volume percent in the "ceramic components" section of Table 1. These powders were premixed with dihydroterpineol as an organic solvent and an anionic polymer dispersant as a dispersant in a non-media agitation mill, and then dispersed in a media agitation mill to prepare a ceramic powder slurry (first step).
  • the metal powder slurry and the ceramic powder slurry were added to the organic vehicle and mixed and dispersed to produce a conductive paste for forming the internal electrodes (fourth step).
  • the ceramic powder content in the conductive paste for forming the internal electrodes was set to 10 mass%.
  • the internal electrode and dielectric layer located at the center in the height direction of the laminate in the sample multilayer ceramic capacitor were peeled off from each other by electrochemical peeling.
  • the ceramic component XTiO3 in the internal electrodes contains X, which is also contained in the conductive component in the internal electrodes. Therefore, it is presumed that the conductive component contained in the internal electrodes remains without being expelled from the internal electrode portion, and acts to improve the heat resistance of the internal electrodes, resulting in a high coverage of 83% or more.
  • the ratio of XTiO3 in the ceramic components of the internal electrodes is not necessarily 100%, and as long as it is 10% or more, the effect of improving coverage was observed compared to when XTiO3 was not included. It is also noteworthy that the coverages of samples 2 and 5, in which the ratio of XTiO3 is 10%, are equal to the coverages of samples 1 and 4, in which the ratio of XTiO3 is 100%, respectively.
  • CaZrO3 -based ceramic raw material constituting dielectric layer As starting materials, the main component powders of CaCO3 and ZrO2 , and the subcomponent powders of MnO, SiO2 and MgO were weighed and mixed in a ball mill for 72 hours, and then heat-treated at a top temperature of 1000°C for 2 hours to obtain a CaZrO3 -based ceramic raw material powder.
  • ceramic component made of XTiO3 contained in the internal electrodes ceramic powders made of NiTiO3 , CuTiO3 , AgTiO3 , and (Ag,Pd) TiO3 shown in the "Ceramic Component" section of "Internal Electrode” in Table 2 were prepared. More specifically, ( Ag0.7Pd0.3 ) TiO3 was used as the (Ag,Pd) TiO3 .
  • the ceramic powder made of XTiO3 and the CaZrO3 -based ceramic powder were weighed out so as to have the ratio expressed in volume percent shown in the "ceramic components" section of Table 1. These powders, dihydroterpineol as an organic solvent, and an anionic polymer dispersant as a dispersant were premixed in a non-medium stirring mill, and then dispersed in a medium stirring mill to prepare a ceramic powder slurry (first step).
  • the metal powder slurry and the ceramic powder slurry were added to the organic vehicle and mixed and dispersed to produce a conductive paste for forming the internal electrodes (fourth step).
  • the ceramic powder content in the conductive paste for forming the internal electrodes was set to 10 mass%.
  • the ceramic component XTiO3 in the internal electrodes contains X, which is common to the conductive component in the internal electrodes. Therefore, it is presumed that the conductive component contained in the internal electrodes remains without being expelled from the internal electrode portion, and acts to improve the heat resistance of the internal electrodes, resulting in a high coverage of 83% or more.
  • the ratio of XTiO3 in the ceramic components in the internal electrodes is not necessarily 100%, and as long as it is 10% or more, an effect of improving coverage was observed compared to when XTiO3 was not included.
  • SrTiO3 -based ceramic raw material constituting dielectric layer As starting raw materials, the main component powders of SrCO3 and TiO2 , and the subcomponent powders of MnO, SiO2 and MgO were weighed and mixed in a ball mill for 72 hours, and then heat-treated at a top temperature of 1000°C for 2 hours to obtain SrTiO3 -based ceramic raw material powder.
  • ceramic component made of XTiO3 contained in the internal electrodes ceramic powders made of NiTiO3 , CuTiO3 , AgTiO3 , and (Ag,Pd) TiO3 shown in the "Ceramic Component" section of "Internal Electrode” in Table 3 were prepared. More specifically, ( Ag0.7Pd0.3 ) TiO3 was used as the (Ag,Pd) TiO3 .
  • the ceramic powder made of XTiO3 and the SrTiO3 -based ceramic powder were weighed out so as to have the ratio shown in volume percent in the "ceramic components" section of Table 3. These powders were premixed with dihydroterpineol as an organic solvent and an anionic polymer dispersant as a dispersant in a non-medium stirring mill, and then dispersed in a medium stirring mill to prepare a ceramic powder slurry (first step).
  • the metal powder slurry and the ceramic powder slurry were added to the organic vehicle and mixed and dispersed to produce a conductive paste for forming the internal electrodes (fourth step).
  • the ceramic powder content in the conductive paste for forming the internal electrodes was set to 10 mass%.
  • the ceramic component XTiO3 in the internal electrodes contains X, which is common to the conductive component in the internal electrodes. Therefore, it is presumed that the conductive component contained in the internal electrodes remains without being expelled from the internal electrode portion, and acts to improve the heat resistance of the internal electrodes, resulting in a high coverage of 82% or more.
  • the ratio of XTiO3 in the ceramic components in the internal electrodes is not necessarily 100%, and as long as it is 10% or more, an effect of improving coverage was observed compared to when XTiO3 was not included.
  • nickel, copper, silver, and a silver/palladium alloy were selected as the conductive components contained in the internal electrodes, but other conductive metals or alloys thereof may also be selected.
  • a laminate including a plurality of laminated dielectric layers made of ceramic and a plurality of internal electrodes respectively disposed along a plurality of interfaces between the dielectric layers,
  • the internal electrode contains a conductive component made of X and a ceramic component made of XTiO3 ; Multilayer ceramic capacitor.
  • ⁇ 4> The multilayer ceramic capacitor according to any one of ⁇ 1> to ⁇ 3>, wherein the internal electrodes have a coverage of more than 80%.
  • ⁇ 5> The multilayer ceramic capacitor according to any one of ⁇ 1> to ⁇ 4>, wherein X is one selected from the group consisting of nickel, copper, silver, and a silver/palladium alloy.
  • a conductive paste for forming an internal electrode of a multilayer ceramic capacitor comprising a conductive metal powder, a ceramic powder, an organic solvent, and an organic binder,
  • a conductive metal or an alloy containing the conductive metal is represented by X
  • the ceramic component is composed of XTiO3 .

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Ceramic Capacitors (AREA)
PCT/JP2024/003420 2023-02-27 2024-02-02 積層セラミックコンデンサ Ceased WO2024181021A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN202480012012.8A CN120642012A (zh) 2023-02-27 2024-02-02 层叠陶瓷电容器
JP2025503683A JPWO2024181021A1 (https=) 2023-02-27 2024-02-02
KR1020257023041A KR20250121087A (ko) 2023-02-27 2024-02-02 적층 세라믹 콘덴서
US19/293,646 US20250364180A1 (en) 2023-02-27 2025-08-07 Multilayer ceramic capacitor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023028471 2023-02-27
JP2023-028471 2023-02-27

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US19/293,646 Continuation US20250364180A1 (en) 2023-02-27 2025-08-07 Multilayer ceramic capacitor

Publications (1)

Publication Number Publication Date
WO2024181021A1 true WO2024181021A1 (ja) 2024-09-06

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PCT/JP2024/003420 Ceased WO2024181021A1 (ja) 2023-02-27 2024-02-02 積層セラミックコンデンサ

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US (1) US20250364180A1 (https=)
JP (1) JPWO2024181021A1 (https=)
KR (1) KR20250121087A (https=)
CN (1) CN120642012A (https=)
WO (1) WO2024181021A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05304043A (ja) * 1992-04-27 1993-11-16 Toshiba Corp 導体形成用貴金属系組成物
JPH0645183A (ja) * 1992-07-21 1994-02-18 Matsushita Electric Ind Co Ltd パラジウムペーストおよび積層チップコンデンサの製造方法
JPH07192528A (ja) * 1993-12-27 1995-07-28 Nec Corp 導電性ペースト

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016031807A (ja) 2014-07-28 2016-03-07 住友金属鉱山株式会社 導電性ペースト及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05304043A (ja) * 1992-04-27 1993-11-16 Toshiba Corp 導体形成用貴金属系組成物
JPH0645183A (ja) * 1992-07-21 1994-02-18 Matsushita Electric Ind Co Ltd パラジウムペーストおよび積層チップコンデンサの製造方法
JPH07192528A (ja) * 1993-12-27 1995-07-28 Nec Corp 導電性ペースト

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US20250364180A1 (en) 2025-11-27
CN120642012A (zh) 2025-09-12
KR20250121087A (ko) 2025-08-11
JPWO2024181021A1 (https=) 2024-09-06

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