WO2024166504A1 - 電子部品及び電子部品の実装構造 - Google Patents

電子部品及び電子部品の実装構造 Download PDF

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Publication number
WO2024166504A1
WO2024166504A1 PCT/JP2023/042800 JP2023042800W WO2024166504A1 WO 2024166504 A1 WO2024166504 A1 WO 2024166504A1 JP 2023042800 W JP2023042800 W JP 2023042800W WO 2024166504 A1 WO2024166504 A1 WO 2024166504A1
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Prior art keywords
electrode
element body
electronic component
internal
external
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English (en)
French (fr)
Japanese (ja)
Inventor
紀行 大川
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Priority to JP2024576134A priority Critical patent/JPWO2024166504A1/ja
Publication of WO2024166504A1 publication Critical patent/WO2024166504A1/ja
Priority to US19/014,338 priority patent/US20250149250A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals

Definitions

  • This disclosure relates to electronic components and mounting structures for electronic components.
  • the electronic component described in Patent Document 1 has an element body, an internal electrode, a dummy internal electrode, and an external electrode.
  • the internal electrode and the dummy internal electrode are located inside the element body.
  • the external electrode covers a portion of the outer surface of the element body.
  • the external electrode is connected to the internal electrode.
  • the electronic component described in Patent Document 1 is subject to external mechanical shocks and thermal stress due to temperature changes. This can cause cracks to form in the body of the electronic component.
  • the electronic component described in Patent Document 1 aims to prevent cracks from forming in the body by using an internal structure of the body, such as a dummy internal electrode. However, no consideration is given to the relationship between the external electrodes and cracks and chips in the body.
  • one embodiment of the present disclosure is an electronic component comprising an element body, an internal electrode located inside the element body, and an external electrode covering a portion of the outer surface of the element body, the external electrode having a first electrode covering a portion of the outer surface of the element body and connected to the internal electrode, and a second electrode covering the outer surface of the first electrode, the second electrode being an electronic component having spherical copper particles and silicon.
  • one embodiment of the present disclosure is a mounting structure for an electronic component having a substrate and an electronic component mounted on the substrate, the electronic component comprising an element body, an internal electrode located inside the element body, and an external electrode covering a portion of the outer surface of the element body, the external electrode having a first electrode covering a portion of the outer surface of the element body and connected to the internal electrode, and a second electrode covering the outer surface of the first electrode, the second electrode having spherical copper particles and silicon, and when the surface of the outer surface of the element body facing the substrate is defined as a mounting surface, the first electrode covers at least a portion of the mounting surface, and the second electrode covers at least the outer surface of the first electrode at a portion that covers the mounting surface.
  • the second electrode has a structure in which spherical copper particles are dispersed in silicon. This makes the flexural strength of the second electrode relatively small. Therefore, when an external force such as an impact or thermal stress acts on the electronic component, the second electrode is more likely to deform and crack than the element body. In other words, the second electrode plays a role in mitigating the effects of external forces by breaking itself. Therefore, when an external force acts on the electronic component, cracks are less likely to occur in the element body. Even if the second electrode is broken, the internal electrode is connected to the first electrode. Therefore, conductivity between the external electrode and the internal electrode is ensured.
  • External electrodes can prevent cracks in the element.
  • FIG. 1 is a perspective view of an electronic component.
  • FIG. 2 is a side view of the electronic component.
  • FIG. 3 is a cross-sectional view taken along line 3-3 of FIG.
  • FIG. 4 is a schematic enlarged cross-sectional view of a first external electrode of an electronic component.
  • FIG. 5 is a schematic enlarged cross-sectional view of a first external electrode of an electronic component.
  • FIG. 6 is a flow chart illustrating a method for manufacturing an electronic component.
  • FIG. 7 is a diagram showing a mounting structure including an electronic component and a substrate according to a modified example.
  • FIG. 8 is a diagram showing a mounting structure including an electronic component and a substrate according to a modified example.
  • FIG. 9 is a cross-sectional view of an electronic component and a substrate according to a modified example.
  • FIG. 10 is a cross-sectional view of an electronic component and a substrate according to a modified example.
  • the electronic component 10 is a multilayer ceramic capacitor.
  • the electronic component 10 includes an element body 20.
  • the element body 20 is substantially rectangular prism-shaped and has a central axis CA.
  • an axis extending along the central axis CA is defined as a first axis X.
  • One of the axes perpendicular to the first axis X is defined as a second axis Y.
  • An axis perpendicular to the first axis X and the second axis Y is defined as a third axis Z.
  • one of the directions along the first axis X is defined as a first positive direction X1, and the direction opposite to the first positive direction X1 among the directions along the first axis X is defined as a first negative direction X2.
  • One of the directions along the second axis Y is defined as a second positive direction Y1, and the direction opposite to the second positive direction Y1 among the directions along the second axis Y is defined as a second negative direction Y2.
  • one of the directions along the third axis Z is defined as a third positive direction Z1, and the direction along the third axis Z opposite to the third positive direction Z1 is defined as a third negative direction Z2.
  • the outer surface 21 of the element body 20 has six flat surfaces 22.
  • the "surface” of the element body 20 here refers to a surface that can be observed when the entire element body 20 is observed. In other words, even if there are minute irregularities or steps that cannot be seen unless a part of the element body 20 is magnified and observed with a microscope, the surface is expressed as a flat surface or a curved surface.
  • the six flat surfaces 22 face in different directions.
  • the six flat surfaces 22 are broadly divided into a first end surface 22A facing the first positive direction X1, a second end surface 22B facing the first negative direction X2, and four side surfaces 22C.
  • the four side surfaces 22C are a surface facing the third positive direction Z1, a surface facing the third negative direction Z2, a surface facing the second positive direction Y1, and a surface facing the second negative direction Y2, respectively.
  • the boundary portions between two adjacent flat surfaces 22 and the boundary portions between three adjacent flat surfaces 22 are curved surfaces.
  • the corners of the element body 20 are so-called R-chamfered.
  • the element body 20 has a dimension along the first axis X that is larger than the dimension along the third axis Z.
  • the material of the element body 20 is a dielectric ceramic. Specifically, the material of the element body 20 is mainly composed of BaTiO3 .
  • the material of the element body 20 may also be mainly composed of CaTiO3 , SrTiO3 , CaZrO3 , etc.
  • the material of the element body 20 may also contain a Mn compound, a Co compound, a Si compound, a rare earth compound, etc. as a secondary component.
  • the electronic component 10 has four first internal electrodes 41 and four second internal electrodes 42 as wiring.
  • the first internal electrodes 41 and the second internal electrodes 42 are embedded inside the element body 20.
  • the material of the first internal electrode 41 is a conductive material.
  • the material of the first internal electrode 41 is Ni.
  • the material of the first internal electrode 41 may further include a metal such as Ni, Cu, Ag, Au, Pt, Sn, Pd, or an alloy containing these metals.
  • the material of the second internal electrode 42 is the same as the material of the first internal electrode 41.
  • the first internal electrode 41 has a rectangular plate shape.
  • the main surface of the first internal electrode 41 is perpendicular to the second axis Y.
  • the second internal electrode 42 has the same rectangular plate shape as the first internal electrode 41.
  • the main surface of the second internal electrode 42 is perpendicular to the second axis Y, similar to the first internal electrode 41.
  • the dimension of the first internal electrode 41 in the direction along the first axis X is smaller than the dimension of the element body 20 in the direction along the first axis X. Also, as shown in FIG. 1, the dimension of the first internal electrode 41 in the direction along the third axis Z is approximately two-thirds of the dimension of the element body 20 in the direction along the third axis Z. The dimensions of the second internal electrode 42 in each direction are the same as those of the first internal electrode 41.
  • the first internal electrodes 41 and the second internal electrodes 42 are positioned alternately in the direction along the second axis Y. That is, a total of eight internal electrodes are arranged in the order of the first internal electrodes 41 and the second internal electrodes 42, alternating from the side surface 22C facing the second positive direction Y1 toward the second negative direction Y2. In this embodiment, the distance between each internal electrode in the direction along the second axis Y is equal.
  • the four first internal electrodes 41 and the four second internal electrodes 42 are all located at the center of the element body 20 in the direction along the third axis Z.
  • the first internal electrodes 41 are located closer to the first positive direction X1.
  • the second internal electrodes 42 are located closer to the first negative direction X2.
  • the end of the first internal electrode 41 on the first positive direction X1 side is approximately aligned with the end of the element body 20 on the first positive direction X1 side. Therefore, the end of the first internal electrode 41 on the first positive direction X1 side is exposed from the first end surface 22A of the element body 20.
  • the end of the first internal electrode 41 on the first negative direction X2 side is located inside the element body 20 and does not reach the end of the element body 20 on the first negative direction X2 side.
  • the end of the second internal electrode 42 on the first negative direction X2 side is approximately aligned with the end of the element body 20 on the first negative direction X2 side.
  • the end of the second internal electrode 42 on the first negative direction X2 side is exposed from the second end surface 22B of the element body 20.
  • the end of the second internal electrode 42 on the first positive direction X1 side is located inside the element body 20 and does not reach the end of the element body 20 on the first positive direction X1 side.
  • the electronic component 10 has a first external electrode 61 and a second external electrode 62.
  • the first external electrode 61 has a first electrode 61A, a second electrode 61B, and a third electrode 61C.
  • the first electrode 61A covers a portion of the outer surface 21 of the element body 20. Specifically, the first electrode 61A covers the first end face 22A of the element body 20 and a portion of the four side faces 22C in the first positive direction X1. The first electrode 61A is also connected to the first internal electrode 41 exposed from the first end face 22A.
  • the first electrode 61A is mostly copper and contains a small amount of glass.
  • the second electrode 61B covers the outer surface of the first electrode 61A. That is, the second electrode 61B is laminated on the first electrode 61A. Details of the second electrode 61B will be described later.
  • the third electrode 61C covers the outer surface of the second electrode 61B. That is, the third electrode 61C is laminated on the second electrode 61B. A portion of the third electrode 61C protrudes from the second electrode 61B.
  • the third electrode 61C has a two-layer structure consisting of a nickel layer and a tin layer, in that order from the second electrode 61B side.
  • the second external electrode 62 has a first electrode 62A, a second electrode 62B, and a third electrode 62C.
  • the first electrode 62A covers a portion of the outer surface 21 of the element body 20. Specifically, the first electrode 62A covers the second end face 22B of the element body 20 and portions of the four side faces 22C facing the first negative direction X2.
  • the first electrode 62A is also connected to the second internal electrode 42 exposed from the second end face 22B.
  • the material of the first electrode 62A is the same as the material of the first electrode 62A in the first external electrode 61.
  • the second electrode 62B covers the outer surface of the first electrode 62A. Therefore, the second electrode 62B is laminated on the first electrode 62A. Details of the second electrode 62B will be described later.
  • the third electrode 62C covers the outer surface 610 of the second electrode 62B. Therefore, the third electrode 62C is laminated on the second electrode 62B. Also, as shown in FIG. 3, a part of the third electrode 62C protrudes from the second electrode 62B.
  • the third electrode 62C has a two-layer structure of a nickel layer and a tin layer in that order from the second electrode 62B side.
  • the second external electrode 62 does not reach the first external electrode 61 on the side surface 22C, and is disposed away from the first external electrode 61 in the direction along the first axis X. Furthermore, the first external electrode 61 and the second external electrode 62 are not stacked in the central portion in the direction along the first axis X on the side surface 22C of the element body 20. Note that in Figures 1 to 3, the first external electrode 61 and the second external electrode 62 are shown by two-dot chain lines.
  • the second electrode 61B contains copper and silicon.
  • the second electrode 61B is a sintered body.
  • the weight ratio of copper to silicon in the second electrode 61B is 0.5 or more and 2 or less.
  • at least a portion of the copper in the second electrode 61B is spherical copper particles 63.
  • the silicon in the second electrode 61B exists as silicone resin 64.
  • the silicone resin 64 is a polymer consisting of siloxane bonds and Si-C bonds.
  • the second electrode 61B is bisected into a first portion 631 located on the inner surface 620 side of the second electrode 61B, and a second portion 632 located on the outer surface 610 side of the second electrode 61B.
  • the inner surface 620 of the second electrode 61B is the boundary surface of the second electrode 61B that is closer to the first electrode 61A.
  • the outer surface 610 of the second electrode 61B is the surface of the second electrode 61B that is opposite the first electrode 61A.
  • the position where the second electrode 61B is bisected is the point where the average thickness of the second electrode 61B described below is divided into two equal parts.
  • the average particle size of the copper particles 63 differs between the first portion 631 and the second portion 632. Specifically, the average particle size of the copper particles 63 in the first portion 631 is smaller than the average particle size of the copper particles 63 in the second portion 632. In other words, the particle size of the copper particles 63 located in the first portion 631 is generally smaller than the particle size of the copper particles 63 located in the second portion 632. Overall, the particle size of the copper particles 63 becomes smaller toward the inner surface 620 within the second electrode 61B.
  • the particle size of copper particles 63 is calculated as follows. First, the outline of copper particles 63 is obtained by image processing using an electron microscope. The obtained image is analyzed, and the line segment connecting the edges of one copper particle 63 is taken as the major diameter. In addition, the line segment that intersects the major diameter and connects the edges of copper particles 63 is taken as the minor diameter. The particle size of copper particles 63 is calculated as the average of the major diameter and the minor diameter.
  • the silicone resin 64 as silicon is distributed in a mesh pattern. Specifically, when the second electrode 61B is viewed in cross section, the silicone resin 64 is distributed in a mesh pattern so as to fill the spaces between the multiple copper particles 63. Also, some of the silicone resin 64 is in the form of clumps. The clumped silicone resin 64 is formed when some of the meshed silicone resin 64 is condensed. In particular, the first portion 631 contains a greater proportion of clumped silicone resin 64 than the second portion 632.
  • the proportion of silicone resin 64 in the first portion 631 of the second electrode 61B is higher than the proportion of silicone resin 64 in the second portion 632 of the second electrode 61B. That is, the proportion of silicon in the first portion 631 is higher than the proportion of silicon in the second portion 632.
  • the proportion of silicone resin 64 is calculated as follows. First, the cross section of the second electrode 61B is photographed with an electron microscope. Next, the area of silicone resin 64 within a certain square range of the photographed image is calculated. Then, the area of silicone resin 64 relative to the area of the square is set as the proportion of silicone resin 64. At this time, the square range is determined so as not to extend beyond the first portion 631, and the proportion of silicone resin 64 is calculated. Then, the proportion of silicone resin 64 is calculated for three or more points within the range of the first portion 631, and the average of these values is set as the proportion of silicone resin 64 in the first portion 631. The same applies to the second portion 632.
  • the shortest distance from the surface of the first electrode 61A facing the base body 20 to the outer surface is defined as the thickness of the first electrode 61A.
  • the shortest distance from the inner surface 620 to the outer surface 610 of the second electrode 61B is defined as the thickness.
  • the average thickness of the second electrode 61B is smaller than the average thickness of the first electrode 61A.
  • the average thickness of each electrode is calculated as follows. First, a cross section including the outer surface 610 and inner surface 620 of the second electrode 61B is photographed with an electron microscope. Next, a range in the direction along the outer surface 610 of the second electrode 61B is identified for the photographed image. Within this range, the cross-sectional area of the second electrode 61B is calculated by image processing for a measurement range of at least 5 ⁇ m. Then, the thickness of the second electrode 61B is calculated by dividing the cross-sectional area of the second electrode 61B in the calculated measurement range by the length of the measurement range. In other words, the thickness of the second electrode 61B is the thickness in the measurement range. In this manner, the thickness of the second electrode 61B is measured at five cross sections, and the average thickness is calculated.
  • the thickness of the first electrode 61A is calculated in a similar manner. That is, a cross section of the first electrode 61A including the surface facing the element body 20 and the outer surface is photographed with an electron microscope. Next, a range in the photographed image in a direction along the outer surface of the first electrode 61A is identified. Within this range, the cross-sectional area of the first electrode 61A is calculated by image processing for a measurement range of at least 5 ⁇ m or more. Then, the thickness of the first electrode 61A is calculated by dividing the cross-sectional area of the first electrode 61A in the calculated measurement range by the length of the measurement range. In other words, the thickness of the first electrode 61A is the thickness in the measurement range. In this manner, the thickness of the first electrode 61A is measured at five cross sections, and the average value of the thicknesses is calculated.
  • the method for manufacturing electronic component 10 includes a laminate preparation step S11, a R-chamfering step S12, a conductor application step S13, a curing step S14, and a plating step S15.
  • a laminate is prepared.
  • the laminate at this stage is in a state before R-chamfering, and is a rectangular parallelepiped having six flat surfaces 22.
  • a plurality of ceramic sheets that will become the element body 20 are prepared.
  • the sheets are thin plates.
  • a conductive paste that will become the first internal electrode 41 is laminated on the sheets.
  • a ceramic sheet that will become the element body 20 is laminated on the paste.
  • a conductive paste that will become the second internal electrode 42 is laminated on the sheets.
  • the laminated sheets are compressed in the stacking direction by a means such as a die press. After that, the compressed sheet is cut to a predetermined size to form an unfired laminate. After that, the unfired laminate is fired at a high temperature to prepare the laminate.
  • the R-chamfering process S12 is performed.
  • the laminate prepared in the laminate preparation process S11 is R-chamfered. This process produces the base body 20 with R-chamfered corners.
  • a first conductor paste is applied by a dip method to a portion of the first end face 22A of the element body 20 and a portion of the second end face 22B of the element body 20. Specifically, the first conductor paste is applied so as to cover the entire first end face 22A and portions of the four side faces 22C. The first conductor paste is also applied so as to cover the entire second end face 22B and portions of the four side faces 22C.
  • the first conductor paste contains a copper component and a silicon component.
  • a second conductor paste is applied onto the first conductor paste at two locations.
  • the second conductor paste is a complex ink.
  • the second conductor paste is prepared as follows. First, an amine compound such as 2-ethylhexylamine is mixed with an alcohol amine such as 2-amino-2-methylpropanol. Then, a silicon component such as silicone resin is added at 10-300 wt% relative to the weight of Cu alone. Then, a metal salt is further added and dissolved to prepare the second conductor paste.
  • the second conductor paste contains a copper component and a silicon component. The sintering start temperature of the copper component is 170 degrees, and the hardening start temperature of the silicon component is 250 degrees.
  • the hardening step S14 is performed. Specifically, in the hardening step S14, the base body 20 to which the first conductive paste and the second conductive paste are applied is heated. In this embodiment, the base body 20 to which the first conductive paste and the second conductive paste are applied is heated in a nitrogen atmosphere. Then, the temperature is maintained within a range of 300 degrees to 600 degrees. This causes the first conductive paste and the second conductive paste to be fired. During the firing of the second conductive paste, sintering of the copper component contained in the second electrode 61B and the second electrode 62B is first started. At the time when sintering of the copper component starts, the silicon component is not hardened and has fluidity. Therefore, the silicon component fills the gaps between the copper components.
  • the hardening start temperature of the silicon component is higher than the sintering start temperature of the copper component.
  • the copper particles 63 are generated by sintering the copper component.
  • the silicone resin 64 is generated by hardening the silicon component.
  • the hardening start temperature of the silicon component is higher than the sintering start temperature of the copper component, so the silicone resin 64 becomes a mesh-like structure that fills the gaps between the copper particles 63.
  • the second electrode 61B and the second electrode 62B are formed as described above.
  • the plating process S15 is performed. Electroplating is performed on the locations where the second electrodes 61B and 62B are located. As a result, the third electrode 61C is formed on the surface of the second electrode 61B. Also, the third electrode 62C is formed on the surface of the second electrode 62B. Although not shown in the figure, the third electrodes 61C and 62C are electroplated with two types of metal, nickel and tin, to form a two-layer structure. In this manner, the electronic component 10 is formed.
  • the second electrode 61B has a silicone resin 64, and copper particles 63 are dispersed in the silicone resin 64. This makes the flexural strength of the second electrode 61B relatively small. Therefore, if an external force such as an impact or thermal stress acts on the electronic component 10, the second electrode 61B is likely to deform and crack before the element body 20 does. In other words, the second electrode 61B plays a role in mitigating the effects of the external force by breaking itself.
  • the silicone resin 64 has a higher adhesion to other members than the copper particles 63.
  • the proportion of the silicone resin 64 in the first portion 631 of the second electrode 61B is higher than the proportion of the silicone resin 64 in the second portion 632 of the second electrode 61B.
  • the silicone resin 64 is likely to be exposed to the inner surface 620 of the second electrode 61B. Therefore, the silicone resin 64 is likely to adhere to the first electrode 61A, and the second electrode 61B is unlikely to peel off from the first electrode 61A.
  • the second electrode 61B is in close contact with the first electrode 61A in this manner, even if a crack or the like occurs in the second electrode 61B, the crack propagates to the interface between the second electrode 61B and the first electrode 61A, and the entire second electrode 61B is prevented from peeling off from the first electrode 61A.
  • the second electrode 61B contains silicone resin 64.
  • the strength of the second electrode 61B can be designed to a preferred value by designing the content of silicone resin 64 to an arbitrary value.
  • the average thickness of the second electrode 61B is smaller than the average thickness of the first electrode 61A.
  • the overall thickness of the first external electrode 61 can be made thinner than when the average thickness of the second electrode 61B is the same as the average thickness of the first electrode 61A.
  • the above configuration is particularly useful for small electronic components.
  • the third electrode 61C covers the second electrode 61B.
  • the first electrode 61A and the second electrode 61B are formed by a dipping method. Even when the first external electrode 61 is formed of multiple layers, the use of this method can prevent a decrease in mass productivity.
  • the electronic component 10 is not limited to a multilayer ceramic capacitor.
  • the electronic component 10 may be a piezoelectric component having a base body 20, a first external electrode 61, and a second external electrode 62, a thermistor, an inductor, or the like.
  • the material of the element body 20 may be a dielectric material, a piezoelectric material, a magnetic material such as ferrite, or a composite material of synthetic resin and metal.
  • the second conductor paste may be a nano-ink.
  • nano-ink it is prepared as follows. Nano-metal powder is dispersed in a solvent containing cellosolves, carbitols, hydrocarbons, aromatics, etc. Then, various silicone-modified resins, silicone resins, sol-gel materials, etc. are added in an amount of 10-300 wt % relative to the weight of Cu alone.
  • the second conductor paste of nano-ink may be prepared in this manner, or a different method may be used.
  • the material when the second conductive paste is a complex ink is not limited to the example of the above embodiment.
  • the amine compound may be any of primary amines, secondary amines, and tertiary amines, and the number of N atoms is not limited.
  • it may be a primary amine such as octylamine or hexylamine, a secondary amine such as di-n-butylamine, or a tertiary amine such as N,N-dimethylhexylamine.
  • the amine compound may also be an alcohol amine or diamine, and the positional relationship between the N atom and the OH group is not specified as ⁇ , ⁇ , ⁇ , etc.
  • the number of N and O atoms in one molecule is not particularly limited.
  • it may be an ⁇ -hydroxyamine such as 2-dimethylaminoethanol or 2-ethylaminoethanol, or a ⁇ -hydroxyamine such as 3-amino-1-propanol or 4-amino-2-butanol.
  • it may be a diamine such as ethylenediamine, or a cyclic diamine such as piperazine.
  • the silicon component may be, for example, various silicone-modified resins such as epoxy resins, polyester resins, and phenolic resins, and sol-gel materials.
  • metal salts made of formic acid, acetic acid, oxalic acid, and other organic acids may be used as the metal salt.
  • An example of this type of metal salt is anhydrous copper formate.
  • first internal electrodes 41 and second internal electrodes 42 are not limited to the example of the above embodiment.
  • the number of first internal electrodes 41 may be less than four or more than four. The same applies to the second internal electrodes 42.
  • the electronic component 10 may be provided with a glass film.
  • the glass film may be formed so as to cover a partial area of the outer surface 21 of the element body 20. In other words, even if there is a glass film covering the element body 20, it is sufficient that the electrical connection between the first internal electrode 41 and the first external electrode 61, and the electrical connection between the second internal electrode 42 and the second external electrode 62 are ensured.
  • the material of the first electrode 61A is not limited to the example of the above embodiment.
  • the material of the first electrode 61A may be a metal such as Ni, Ag, Cu, etc., or may be a composition containing any of these metals.
  • the second electrode 61B only needs to cover at least a portion of the first electrode 61A. However, it is preferable that the second electrode 61B covers at least the outer surface of the first electrode 61A that faces the substrate 100 when the electronic component 10 is mounted on the substrate 100.
  • the mounting structure shown in FIG. 7 has a substrate 100 and an electronic component 10 mounted on the substrate 100. Furthermore, of the outer surface 21 of the element body 20, the side surface 22C facing the second positive direction Y1 serves as the mounting surface 22S for the substrate 100.
  • the first electrode 61A covers the surface facing the first positive direction X1 and parts of the four side surfaces 22C of the outer surface 21 of the element body 20. In other words, the first electrode 61A covers parts of the mounting surface 22S.
  • the second electrode 61B covers a total of four surfaces of the outer surface of the first electrode 61A, including the surface facing the second positive direction Y1, the surface facing the second negative direction Y2, the surface facing the third positive direction Z1, and the surface facing the third negative direction Z2.
  • the second electrode 61B covers a total of three surfaces of the outer surface of the first electrode 61A, the surface facing the second positive direction Y1, the surface facing the third positive direction Z1, and the surface facing the third negative direction Z2.
  • the second electrode 61B covers only a total of two surfaces of the outer surface of the first electrode 61A, the surface facing the second positive direction Y1, and the surface facing the first positive direction X1.
  • the second electrode 61B covers only the surface of the outer surface of the first electrode 61A facing the second positive direction Y1. That is, in all of the examples shown in Figs.
  • the second electrode 61B covers the outer surface of the portion of the outer surface of the first electrode 61A that covers the mounting surface 22S. Furthermore, with the electronic component 10 of the examples in Figures 7 to 10, if the second electrode 61B collides with the substrate 100 during mounting, the effect of (1) of the above embodiment can be exerted, and the influence of external forces on the element body 20 can be suppressed.
  • the proportion of silicone resin 64 in the first portion 631 of the second electrode 61B may be lower than or the same as the proportion of silicone resin 64 in the second portion 632 of the second electrode 61B.
  • the average thickness of the second electrode 61B may be the same as or smaller than the average thickness of the first electrode 61A.
  • the configuration related to the third electrode 61C in the first external electrode 61 may be omitted.
  • the average particle size of the copper particles 63 in the first portion 631 of the second electrode 61B may be the same as, smaller than, or larger than the average particle size of the copper particles 63 in the second portion 632 of the second electrode 61B.
  • silicon is not limited to the silicone resin 64.
  • silicon may be silica (silicon dioxide) or the like.
  • the manufacturing process of the electronic component 10 in the above embodiment is not limited to the example in the above embodiment.
  • the element body 20 may be subjected to a process such as physical polishing.
  • the method for applying the first conductive paste and the second conductive paste is not limited to the example in the above embodiment.
  • these pastes may be applied by printing, or may be applied by an inkjet method or the like.
  • the first conductive paste and the second conductive paste may be applied by different methods.
  • the curing step S14 may be performed in a plurality of steps. That is, the baking may be performed in a plurality of steps.
  • the sintering start temperature of the copper component and the hardening start temperature of the silicon component of the second conductive paste are not limited to the examples in the above embodiment.
  • An electronic component comprising: an element body; an internal electrode located inside the element body; and an external electrode covering a portion of an outer surface of the element body, the external electrode having a first electrode covering a portion of the outer surface of the element body and connected to the internal electrode; and a second electrode covering the outer surface of the first electrode, the second electrode having spherical copper particles and silicon.
  • a mounting structure for an electronic component comprising a substrate and an electronic component mounted on the substrate, the electronic component comprising an element body, an internal electrode located inside the element body, and an external electrode covering a portion of an outer surface of the element body, the external electrode having a first electrode covering a portion of the outer surface of the element body and connected to the internal electrode, and a second electrode covering the outer surface of the first electrode, the second electrode comprising spherical copper particles and silicon, wherein when a surface of the outer surface of the element body facing the substrate is defined as a mounting surface, the first electrode covers at least a portion of the mounting surface, and the second electrode covers at least a portion of the outer surface of the first electrode that covers the mounting surface.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
PCT/JP2023/042800 2023-02-08 2023-11-29 電子部品及び電子部品の実装構造 Ceased WO2024166504A1 (ja)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014039000A (ja) * 2012-08-10 2014-02-27 Samsung Electro-Mechanics Co Ltd 積層セラミックキャパシタ及びその製造方法。
JP2014135463A (ja) * 2013-01-09 2014-07-24 Samsung Electro-Mechanics Co Ltd 導電性樹脂組成物、これを含む積層セラミックキャパシタ及びその製造方法
JP2015026840A (ja) * 2013-10-25 2015-02-05 株式会社村田製作所 セラミック電子部品及びテーピング電子部品連
JP2020155719A (ja) * 2019-03-22 2020-09-24 株式会社村田製作所 積層セラミックコンデンサ
JP2021174956A (ja) * 2020-04-30 2021-11-01 株式会社村田製作所 積層セラミックコンデンサ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014039000A (ja) * 2012-08-10 2014-02-27 Samsung Electro-Mechanics Co Ltd 積層セラミックキャパシタ及びその製造方法。
JP2014135463A (ja) * 2013-01-09 2014-07-24 Samsung Electro-Mechanics Co Ltd 導電性樹脂組成物、これを含む積層セラミックキャパシタ及びその製造方法
JP2015026840A (ja) * 2013-10-25 2015-02-05 株式会社村田製作所 セラミック電子部品及びテーピング電子部品連
JP2020155719A (ja) * 2019-03-22 2020-09-24 株式会社村田製作所 積層セラミックコンデンサ
JP2021174956A (ja) * 2020-04-30 2021-11-01 株式会社村田製作所 積層セラミックコンデンサ

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