Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
  • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
  • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
  • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
  • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
  • H05K1/0203—Cooling of mounted components
  • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
  • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/06—Lamination
  • H05K2203/065—Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/06—Lamination
  • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/08—Treatments involving gases
  • H05K2203/082—Suction, e.g. for holding solder balls or components
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/08—Treatments involving gases
  • H05K2203/085—Using vacuum or low pressure
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/15—Position of the PCB during processing
  • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Definitions

• This disclosure relates to a circuit board manufacturing apparatus and a circuit board manufacturing method.
• JP Patent Publication 2003-48249 A discloses an apparatus for continuously bonding two or more sheets, at least one of which has an uneven surface, together under high vacuum, with pressure bonding, such as bonding a printed circuit board sheet with an uneven surface and a cover sheet to the sheet.
• pressure bonding such as bonding a printed circuit board sheet with an uneven surface and a cover sheet to the sheet.
• the present disclosure aims to provide a circuit board manufacturing device and a circuit board manufacturing method that can quickly draw a vacuum around the fixing points during the circuit board manufacturing process in which a circuit section is provided on a metal substrate via an insulating layer.
• the circuit board manufacturing apparatus of the second aspect is the circuit board manufacturing apparatus of the first aspect, further comprising heaters for heating the upper mold and the lower mold, respectively.
• the circuit board manufacturing apparatus of the third aspect is the circuit board manufacturing apparatus of the second aspect, further comprising a preheating section that is provided on the path along which the substrate and the insulating layer are transported to the receiving jig and on the path along which the substrate, the insulating layer and the circuit section are transported to the receiving jig, and that heats the substrate and the insulating layer or heats the substrate, the insulating layer and the circuit section.
• the manufacturing method of the circuit board of the fourth aspect uses the manufacturing apparatus of the circuit board of the first aspect, and includes a first step of setting the board with the insulating layer set on the board in the receiving jig, a second step of engaging the upper mold with the lower mold, sucking air in the sealed space formed between the lower mold and the upper mold with the air suction part, and pressing the insulating layer toward the board to fix the insulating layer to the board, and a second step of separating the upper mold from the lower mold and removing the board with the insulating layer fixed thereto from the receiving jig.
• the method includes a third step of removing the circuit board from the insulating layer, a fourth step of setting the substrate with the circuit part set on the insulating layer in the receiving jig, a fifth step of engaging the upper mold with the lower mold, sucking air from the sealed space formed between the lower mold and the upper mold with the air suction part, and pressing the circuit part toward the substrate to fix the circuit part to the insulating layer, and a sixth step of separating the upper mold from the lower mold and removing the substrate with the circuit part fixed on the insulating layer from the receiving jig.
• the fifth aspect of the circuit board manufacturing method uses the circuit board manufacturing apparatus of the second aspect, and performs the second and fifth steps while the upper and lower dies are heated by the heater.
• the sixth embodiment of the method for manufacturing a circuit board uses the circuit board manufacturing apparatus of the third embodiment, and performs the second step after the substrate and the insulating layer are heated in the preheating section, and performs the fifth step after the substrate, the insulating layer, and the circuit section are heated in the preheating section.
• the manufacturing method of the fourth aspect can be applied.
• the substrate with the insulating layer set thereon is set on the receiving jig (first step).
• the upper mold is engaged with the lower mold, the air in the sealed space formed between the lower mold and the upper mold is sucked by the air suction part, and the insulating layer is pressed toward the substrate side to fix the insulating layer to the substrate (second step).
• the upper mold is separated from the lower mold to remove the substrate with the insulating layer fixed thereto from the receiving jig (third step).
• the substrate with the circuit part set on the insulating layer is set on the receiving jig (fourth step).
• the upper mold is engaged with the lower mold to suck the air in the sealed space formed between the lower mold and the upper mold by the air suction part, and the circuit part is pressed toward the substrate side to fix the circuit part to the insulating layer (fifth step).
• the upper mold is separated from the lower mold to remove the substrate with the circuit part fixed on the insulating layer from the receiving jig (sixth step).
• the air in the sealed space formed between the lower and upper dies can be sucked in by the air suction unit. This allows the vacuum around the fixed parts to be drawn more quickly than in a configuration in which the air in the space outside the lower and upper dies is also sucked in to suck in the air in the sealed space formed between the lower and upper dies.
• the circuit board manufacturing apparatus of the second aspect can be applied to the manufacturing method of the fifth aspect, for example.
• the second and fifth steps can be performed while the upper and lower dies are heated by a heater.
• the circuit board manufacturing apparatus of the third aspect can be used to apply, for example, the manufacturing method of the sixth aspect.
• the second step can be performed after the substrate and insulating layer are heated in the preheating section
• the fifth step can be performed after the substrate, insulating layer, and circuit section are heated in the preheating section. This can shorten the heating time in the second and fifth steps.
• circuit board manufacturing apparatus and circuit board manufacturing method disclosed herein have the excellent effect of being able to quickly draw a vacuum around the fixing points during the circuit board manufacturing process in which a circuit section is provided on a metal substrate via an insulating layer.
• FIG. FIG. FIG. 2 is a block diagram showing a part of a manufacturing apparatus for a circuit board.
• FIG. 13 is a block diagram showing another part of the circuit board manufacturing apparatus.
• FIG. 2 is a perspective view showing an insulating layer formed on a PET film.
• FIG. 11 is a perspective view for explaining a process in an insulating layer cutting section.
• FIG. 2 is a perspective view showing a common conveying jig and a positioning jig;
• FIG. 13 is a perspective view for explaining a process in a first setting section, showing a state in which the substrate is set on a common transport jig;
• FIG. 13 is a perspective view for explaining a process in a first setting section, showing a process in which an insulating layer or the like is set on a substrate.
• FIG. 11 is a side view for explaining a process performed by the first preheating section.
• FIG. 2 is a side view showing an apparatus used in the first press section.
• FIG. 4 is a plan view showing a heating and pressurizing section transport section.
• FIG. 4 is a side cross-sectional view showing a heating and pressurizing unit and the like.
• FIG. 11 is a side cross-sectional view showing a step in which the insulating layer set on the substrate is pressed toward the substrate.
• FIG. FIG. 11 is a side view illustrating a first insulating layer fixing step.
• FIG. 11 is a side view illustrating a first insulating layer fixing step.
• FIG. 11 is a side view for explaining a second insulating layer fixing step.
• FIG. 11 is a side view for explaining a third insulating layer fixing step and a fourth insulating layer fixing step.
• FIG. 11 is a side view for explaining a third insulating layer fixing step and a fourth insulating layer fixing step.
• FIG. 11 is a side view for explaining a fifth insulating layer fixing step.
• FIG. 13 is a side view for explaining a sixth insulating layer fixing step and a seventh insulating layer fixing step.
• FIG. 13 is a side view for explaining a process performed by the first removal unit.
• FIG. 11 is a side view for explaining a process performed by the first cooling section.
• FIG. 11 is a side view for explaining a process performed by the first cooling section.
• FIG. 13 is a perspective view for explaining a process performed by a first peeling unit.
• FIG. 11 is a perspective view for explaining a process performed by a first inspection unit.
• FIG. 13 is a perspective view for explaining a process performed by a circuit attachment section.
• FIG. 13 is a perspective view for explaining a process in a second setting section, showing a process in which a circuit section and the like are set on a substrate.
• 11 is a side cross-sectional view showing a process in which the circuit unit set on the substrate is pressed toward the substrate.
• FIG. FIG. 13 is a side view for explaining the process performed by the second removal unit.
• FIG. 11 is a side view for explaining a process performed by the second cooling section.
• FIG. 11 is a perspective view for explaining a process performed by a second peeling unit.
• FIG. 11 is a perspective view for explaining a process performed by a second inspection unit.
• circuit board manufacturing apparatus 10 and the circuit board manufacturing method according to an embodiment of the present disclosure will be described using Figures 1 to 33.
• the general configuration of the circuit board 12 will be described, and then the configuration of the circuit board manufacturing apparatus 10 will be described together with the circuit board manufacturing method.
• the circuit board 12 includes a substrate 12 , an insulating layer 16 fixed onto the substrate 12 , and a circuit portion 18 fixed onto the insulating layer 16 .
• the substrate 12 is formed using a metal material.
• the substrate 12 has a plate-shaped portion 14A formed in a rectangular plate shape, and multiple heat dissipation portions 14B protruding from the plate-shaped portion 14A.
• An insulating layer 16 and a circuit portion 18 are fixed in a stacked state to one surface of the plate-shaped portion 14A in the thickness direction.
• Multiple heat dissipation portions 14B protrude from the other surface of the plate-shaped portion 14A in the thickness direction toward the opposite side to the plate-shaped portion 14A.
• the multiple heat dissipation portions 14B are formed, as an example, in a cylindrical shape, and are regularly arranged at set intervals from each other.
• the insulating layer 16 is formed in a sheet shape using an insulating material. This insulating layer 16 is interposed between the plate-shaped portion 14A of the substrate 12 and the circuit portion 18 to ensure insulation between the two.
• the circuit section 18 is formed in a rectangular plate shape using a conductive material. In this embodiment, multiple circuit sections 18 formed in a specified pattern are fixed onto the insulating layer 16.
• circuit board manufacturing apparatus 10 and circuit board manufacturing method 3 and 4 are block diagrams showing a schematic diagram of a circuit board manufacturing apparatus 10 (hereinafter simply referred to as "manufacturing apparatus 10") used in manufacturing the circuit board 12.
• the manufacturing apparatus 10 includes an insulating layer cutting section 20, a first setting section 22, a first preheating section 24, a first pressing section 26, a first removing section 28, a first cooling section 30, a first peeling section 32, and a first inspection section 34. Also, as shown in Fig.
• the manufacturing apparatus 10 includes a circuit part attaching section 36, a second setting section 38, a second preheating section 40, a second pressing section 42, a second removing section 44, a second cooling section 46, a second peeling section 48, and a second inspection section 50.
• the insulating layer cutting section 20 cuts the insulating layer 16 into a predetermined shape and size.
• the insulating layer 16 is formed in a sheet shape along a film 52 (hereinafter referred to as a PET film 52) formed using polyethylene terephthalate.
• the insulating layer cutting section 20 includes a cutting table 54 on which the insulating layer 16 is placed together with the PET film 52, and a cutter 56 that cuts the insulating layer 16 placed on the cutting table 54 together with the PET film 52.
• the insulating layer 16 is placed (set) on the cutting table 54 together with the PET film 52 with the insulating layer 16 facing downward relative to the PET film 52.
• the cutter 56 moves on the cutting table 54 in a predetermined trajectory, so that the insulating layer 16 is cut together with the PET film 52 into a predetermined shape and size.
• the cutting point is depicted by a two-dot chain line.
• All of the steps in the insulating layer cutting unit 20 may be performed automatically, or some or all of the steps in the insulating layer cutting unit 20 may be performed manually.
• the first set section 22 sets the insulating layer 16 cut to the shape and dimensions determined by the insulating layer cutting section 20 on the substrate 12.
• the first set section 22 uses a common transport jig 58 transported by a transport section 66 (see FIG. 10) described later, and a positioning jig 60 that engages with the common transport jig 58.
• the common transport jig 58 has a substrate setting section 58A in which the substrate 12 is set in a fitted state.
• the positioning jig 60 is formed of a metal material like the common transport jig 58.
• the positioning jig 60 has a rectangular positioning hole 60A formed so as to penetrate the positioning jig 60 in the vertical direction.
• the positioning jig 60 engages with the common transport jig 58 from above, thereby restricting the horizontal movement of the positioning jig 60 relative to the common transport jig 58 (direction perpendicular to the vertical direction).
• the substrate 12 is set in the substrate setting section 58A of the common conveying jig 58 in a position in which the heat dissipating sections 14B are on the lower side.
• the positioning jig 60 is engaged with the common conveying jig 58 from above.
• the positioning jig 60 When the positioning jig 60 is engaged with the common conveying jig 58, the portion of the plate-shaped section 14A of the substrate 12 to which the insulating layer 16 is fixed is exposed to the upper side through the positioning hole 60A. Next, adhesive is applied to the surface of the insulating layer 16 opposite to the PET film 52. Next, with the side of the insulating layer 16 to which the adhesive is applied facing downward, the insulating layer 16 is placed in the positioning hole 60A of the positioning jig 60, and the insulating layer 16 is set on the plate-shaped section 14A of the substrate 12 together with the PET film 52.
• a metal plate 62 and cardboard 64 whose shape and dimensions as viewed from above correspond to those of the insulating layer 16 are placed in the positioning hole 60A of the positioning jig 60, and the metal plate 62 and cardboard 64 are set on the insulating layer 16 (on the PET film 52). All of the steps in the first setting unit 22 may be performed automatically, or some or all of the steps in the first setting unit 22 may be performed manually.
• the first preheating section 24 heats the substrate 12 and insulating layer 16.
• the first preheating section 24 is equipped with a heating furnace 68 arranged to surround a transport section 66 that transports the common transport jig 58.
• the temperature inside the heating furnace 68 is maintained at a set temperature.
• the common transport jig 58 is moved within the heating furnace 68 by being transported by the transport section 66. This causes the substrate 12 set on the common transport jig 58 and the insulating layer 16 set on the substrate 12 to be heated.
• the first press section 26 presses the insulating layer 16 set on the substrate 12 toward the substrate 12.
• the first press section 26 includes a press section main body 70 having a mechanism for pressing an upper die 86 (described later) toward a lower die 84, a setup section 72 provided adjacent to the press section main body 70, and a heating and pressurizing section transport section 73 for moving a heating and pressurizing section 74 (described later) and the like between the press section main body 70 and the setup section 72.
• the first press section 26 includes two heating and pressurizing sections 74 on which the substrate 12 and the like are set, and an air suction section 76.
• the press section main body 70 includes a hydraulic cylinder 78 and an upper die engaging portion 80 supported by the hydraulic cylinder 78.
• An upper die 86 which will be described later, is removably engaged with the upper die engaging portion 80.
• the hydraulic cylinder 78 in this embodiment is configured such that a high-pressure cylinder 78A and a low-pressure cylinder 78B are stacked vertically.
• the setup section 72 is equipped with an upper die lifting section 82 that raises and lowers an upper die 86, which will be described later. By operating this upper die lifting section 82, it is possible to raise and lower the upper die 86 relative to the lower die 84.
• the heating and pressurizing section transport section 73 includes a rotating section 73A that can rotate with the vertical direction as the axial direction, and two lower die engagement sections 73B fixed to the upper part of the rotating section 73A.
• the two lower die engagement sections 73B are respectively engaged with two heating and pressurizing sections 74 described below.
• the heating and pressurizing section 74 on one lower die engagement section 73B moves from the press section main body section 70 to the setup section 72
• the heating and pressurizing section 74 on the other lower die engagement section 73B moves from the setup section 72 to the press section main body section 70.
• the position on the lower die engagement portion 73B arranged in the setup section 72 will be referred to as the "setup position P1," and the position on the lower die engagement portion 73B arranged in the press section main body 70 will be referred to as the "pressure position P2.”
• the two heating and pressurizing units 74 have the same configuration. Note that FIG. 13 only shows the heating and pressurizing unit 74 located on the press unit main body 70 side.
• the heating and pressurizing unit 74 includes a lower die 84, an upper die 86 that engages with the lower die 84, and a receiving jig 88 fixed to the lower die 84.
• the lower mold 84 comprises a lower plate portion 84A fixed to the lower mold engagement portion 73B, and a central convex portion 84B protruding upward from the horizontal center of the lower plate portion 84A.
• a receiving jig 88 which will be described later, is fixed to the upper surface of the central convex portion 84B.
• a heater 90 for heating the lower mold 84 is also provided on the lower plate portion 84A.
• an O-ring 92 is attached to the central convex portion 84B.
• a vacuum path 84C is formed in the lower plate portion 84A and the central convex portion 84B, with one end open to the upper surface of the central convex portion 84B and the other end connected to an air suction portion 76 such as a vacuum pump.
• the upper die 86 is disposed above the lower die 84.
• the upper die 86 has an upper plate portion 86A that detachably engages with the upper die engagement portion 80 and the upper die lifting portion 82 (see FIG. 11), and a peripheral wall portion 86B that protrudes downward from the horizontal end of the upper plate portion 86A.
• the upper die 86 moves toward the lower die 84, so that the upper die 86 engages with the lower die 84.
• the central convex portion 84B of the lower die 84 is disposed inside the peripheral wall portion 86B of the upper die 86.
• a sealed space 94 that surrounds the receiving jig 88 is formed between the upper die 86 and the lower die 84.
• the upper plate portion 86A is provided with a heater 90 for heating the upper mold 86.
• the upper mold 86 is provided with a concentrated pressure portion 86 that protrudes downward from the horizontal center of the upper plate portion 86A.
• FIG. 14 shows a plan view of the receiving jig 88 seen from above.
• This receiving jig 88 is formed in the shape of a rectangular block.
• the receiving jig 88 is also formed with a plurality of insertion holes 88A that are open on the upper side.
• These insertion holes 88A correspond to the heat dissipation sections 14B (see FIG. 1) of the substrate 12, and are regularly arranged at set intervals from each other. Then, as shown in FIG. 15, the substrate 12 is set on the receiving jig 88 with the heat dissipation sections 14B of the substrate 12 inserted into the insertion holes 88A, respectively.
• the lower surface of the plate-shaped section 14A (the surface that forms the bottom surface of the heat dissipation sections 14B of the substrate 12) and the upper surface of the receiving jig 88 are in contact.
• the substrate 12 that has been subjected to the process in the first preheat section 24 (that has passed through the heating furnace 68) is set in the heating and pressurizing section 74 that is arranged at the setup position P1.
• the manipulator (not shown) is operated to move the substrate 12 together with the positioning jig 60, etc., and the substrate 12 is set in the receiving jig 88 that is arranged at the setup position P1 (first step).
• the upper die lifting section 82 is operated to engage the upper die 86 with the lower die 84 at the setup position P1 (first insulating layer fixing step).
• the upper die 86 and the lower die 84 are heated to a temperature determined by the heater 90 described above. Also, when the upper die 86 is engaged with the lower die 84 at the setup position P1, the air suction section 76 is operated to suck in the air in the sealed space 94 between the upper die 86 and the lower die 84. That is, a vacuum is drawn in the sealed space 94 between the upper mold 86 and the lower mold 84.
• the rotating unit 73A is rotated to move the heating and pressurizing unit 74 located at the setup position P1 to the pressurizing position P2.
• the heating and pressurizing unit 74 located at the pressurizing position P2 moves to the setup position P1 (second insulating layer fixing process).
• the upper mold engagement portion 80 is engaged with the upper mold 86, and the upper mold 86 is pressed toward the lower mold 84 at the pressure position P2, thereby pressing the insulating layer 16 toward the substrate 12.
• This fixes the insulating layer 16 to the substrate 12 (second process, third insulating layer fixing process).
• the third insulating layer fixing process the state in which the insulating layer 16 is pressed toward the substrate 12 is maintained for a set time.
• the upper mold 86 and the lower mold 84 are heated by the heater 90, and a vacuum is drawn in the sealed space 94 between the upper mold 86 and the lower mold 84.
• the substrate 12 that has been processed by the first preheat unit 24 (that has passed through the heating furnace 68) is set in the heating and pressurizing unit 74 that is located at the setup position P1.
• the upper die lifting unit 82 is operated to engage the upper die 86 with the lower die 84 at the setup position P1 (fourth insulating layer fixing process).
• the air suction unit 76 is operated to draw a vacuum in the sealed space 94 between the upper die 86 and the lower die 84.
• the rotating portion 73A is rotated to move the heating and pressurizing portion 74, which has completed the third insulating layer fixing process, from the pressurizing position P2 to the preparation position.
• the heating and pressurizing portion 74 which has completed the fourth insulating layer fixing process, moves from the preparation position P1 to the pressurizing position P2 (fifth insulating layer fixing process).
• the upper die engagement portion 80 is engaged with the upper die 86, and the upper die 86 is pressed toward the lower die 84 at the pressure position P2, thereby pressing the insulating layer 16 toward the substrate 12. This fixes the insulating layer 16 to the substrate 12 (sixth insulating layer fixing process).
• the substrate 12 to which the insulating layer 16 is fixed is removed from the heating and pressurizing section 74 located at the setup position P1.
• the manipulator (not shown) is operated to move the substrate 12 together with the positioning jig 60, etc., and the substrate 12 is removed from the receiving jig 88 located at the setup position P1 (third process).
• the substrate 12 removed from the receiving jig 88 is returned to the common conveying jig 58 on the conveying section 66 together with the positioning jig 60, etc.
• the substrate 12 that has completed the process by the first preheating section 24 (passed through the heating furnace 68) is set in the heating and pressurizing section 74 located at the setup position P1 (seventh insulating layer fixing process).
• the substrates 12 that have completed the process by the first preheating section 24 are fed one after another into the first press section 26.
• the substrates 12 and other materials fed into the first press section 26 are sent out one after another to the next process.
• the fourth insulating layer fixing process can be performed simultaneously with the third insulating layer fixing process.
• the seventh insulating layer fixing process can be performed simultaneously with the sixth insulating layer fixing process. This makes it possible to prevent the waiting time before the process of fixing the substrate 12 and the insulating layer 16 from becoming long.
• the substrate 12 to which the insulating layer 16 is fixed can be removed from the heating and pressing section 74 at the setup position P1.
• the substrate 12 before the insulating layer 16 is fixed can be set in the heating and pressing section 74 at the setup position P1. Furthermore, when the insulating layer 16 is pressed toward the substrate 12 at the pressurizing position P2, the substrate 12 before the insulating layer 16 is fixed can be heated by the heaters 90 provided on the upper die 86 and the lower die 84 at the preparation position P1. Also, when the insulating layer 16 is pressed toward the substrate 12 at the pressurizing position P2, the sealed space 94 formed between the upper die 86 and the lower die 84 can be evacuated at the preparation position P1. In this way, in this embodiment, the time that the substrate 12 that has completed the process by the first preheating unit 24 is left waiting without doing anything before being inserted into the first pressing unit 26 can be reduced.
• the substrate 12 is set on the receiving jig 88 with the heat dissipation sections 14B of the substrate 12 inserted into the insertion holes 88A of the receiving jig 88.
• the lower surface of the plate-shaped section 14A (the surface forming the bottom surface of the heat dissipation sections 14B in the substrate 12) is in contact with the upper surface of the receiving jig 88. This allows the bottom surfaces of the heat dissipation sections 14B in the substrate 12 to be supported by the upper surface of the receiving jig 88.
• pressure can be applied to the fixing points of the insulating layer 16.
• the concentrated pressing portion 86 of the upper mold 86 is inserted into the positioning hole 60A of the positioning jig 60, so that the portion of the plate-shaped portion 14A of the substrate 12 on which the insulating layer 16 is placed is pressed in a concentrated manner. This allows pinpoint pressing of the portion of the plate-shaped portion 14A of the substrate 12 on which the insulating layer 16 is placed.
• the concentrated pressing portion 86 of the upper mold 86 presses the portion of the plate-shaped portion 14A of the substrate 12 on which the insulating layer 16 is placed via the cardboard 64 and the metal plate 62. This makes it possible to uniformly press the portion of the plate-shaped portion 14A of the substrate 12 on which the insulating layer 16 is placed.
• the metal plate 62 between the cardboard 64 and the insulating layer 16 (PET film 52), it is possible to prevent the unevenness of the cardboard 64 from being transferred to the insulating layer 16.
• the air in the sealed space 94 formed between the lower die 84 and the upper die 86 can be sucked in by the air suction unit 76.
• the substrate 12 and the like are heated in the process in the first preheat section 24. This makes it possible to shorten the time required to heat the substrate 12 and the like in the process in the first press section 26.
• All of the steps in the first press section 26 described above may be performed automatically, or some of the steps in the first press section 26 may be performed manually.
• the positioning jig 60 is removed from the common transport jig 58 sent from the first press section 26.
• the metal plate 62 and the cardboard 64 set on the insulating layer 16 are removed. Note that all of the processes in the first removal section 28 may be performed automatically, or some or all of the processes in the first removal section 28 may be performed manually.
• the first cooling section 30 cools the substrate 12 and the insulating layer 16.
• the first cooling section 30 has fans 96 provided above and below the transport section 66 that transports the common transport jig 58.
• the common transport jig 58 is transported by the transport section 66 so that the common transport jig 58 passes between the upper and lower fans 96. This cools the substrate 12 set on the common transport jig 58 and the insulating layer 16 fixed on the substrate 12.
• the first peeling unit 32 removes the PET film 52 from the insulating layer 16.
• the first peeling unit 32 includes an adsorption unit 98 that adsorbs the PET film 52, and a nozzle 100 that sprays compressed air between the PET film 52 and the insulating layer 16.
• the adsorption unit 98 first adsorbs the horizontal center of the PET film 52.
• the adsorption unit 98 is moved while spraying compressed air from the nozzle 100 toward between the PET film 52 and the insulating layer 16. This causes the PET film 52 to be peeled off from the insulating layer 16.
• the PET film 52 peeled off from the insulating layer 16 is transported by the adsorption unit 98 and discarded in a designated container. All of the steps in the first peeling unit 32 may be performed automatically, or some or all of the steps in the first peeling unit 32 may be performed manually.
• the first inspection unit 34 inspects whether the insulating layer 16 is fixed at a predetermined position on the substrate 12. As shown in FIG. 26, the first inspection unit 34 is equipped with a camera 102. In the process in the first inspection unit 34, the image of the substrate 12 and the insulating layer 16 taken by the camera 102 is compared with the inspection data to inspect whether the insulating layer 16 is fixed at a predetermined position on the substrate 12. If the inspection result shows that the insulating layer 16 is fixed at a predetermined position on the substrate 12, the substrate 12 to which the insulating layer 16 is fixed is transported to the next process.
• the substrate 12 to which the insulating layer 16 is fixed is discarded without being sent to the next process.
• all of the processes in the first inspection unit 34 may be performed automatically, or some or all of the processes in the first inspection unit 34 may be performed manually.
• the circuit part 18 is attached to the urethane sheet 104.
• the shape and dimensions of the urethane sheet 104 as viewed in the thickness direction are set to correspond to the shape and dimensions of the insulating layer 16.
• An adhesive layer to which the circuit part 18 can be attached is formed on one side of the urethane sheet 104.
• the circuit part 18 is attached to a specified position on the surface of the urethane sheet 104 on which the adhesive layer is formed. This fixes the circuit part 18 to the urethane sheet 104. All of the processes in the circuit part attachment section 36 may be performed automatically, or some or all of the processes in the circuit part attachment section 36 may be performed manually.
• the circuit section 18 fixed to the urethane sheet 104 is set on the insulating layer 16 fixed to the substrate 12.
• adhesive is applied to the surface of the circuit unit 18 opposite the urethane sheet 104.
• adhesive is applied to the portion of the insulating layer 16 where the circuit unit 18 is fixed.
• the circuit unit 18 is set on the insulating layer 16 together with the urethane sheet 104 with the surface of the circuit unit 18 opposite the urethane sheet 104 facing downward.
• the cardboard 64 is set on the urethane sheet 104. All of the processes in the second setting unit 38 may be performed automatically, or some or all of the processes in the second setting unit 38 may be performed manually.
• the second preheating section 40 heats the substrate 12, insulating layer 16, and circuit section 18.
• the process in the second preheating section 40 is the same as the process in the first preheating section 24. That is, in the process in the second preheating section 40, the common transport jig 58 is moved within the heating furnace 68 by being transported by the transport section 66 (see FIG. 10). This heats up the substrate 12, insulating layer 16, circuit section 18, etc., that are set on the common transport jig 58.
• the circuit section 18 set on the insulating layer 16 is pressed towards the substrate 12.
• the process in the second press section 42 uses the press section main body section 70, setup section 72, heating and pressurizing section transport section 73, two heating and pressurizing sections 74 and air suction section 76 shown in FIGS. 11 to 14, as in the process in the first press section 26.
• each process in the second press section 42 is similar to each process in the first press section 26. Therefore, in explaining each process in the second press section 42, the same figures used in explaining each process in the first press section 26 will be used.
• the substrate 12 that has been processed by the second preheat section 40 (passed through the heating furnace 68) is set in the heating and pressurizing section 74 located at the setup position P1 (step 4).
• a manipulator (not shown) is operated to set the substrate 12 in the receiving jig 88 located at the setup position P1.
• the upper die lifting section 82 is operated to engage the upper die 86 with the lower die 84 at the setup position P1 (first circuit section fixing step).
• the upper die 86 and the lower die 84 are heated to a temperature determined by the heater 90 described above.
• the air suction section 76 is operated to suck in the air in the sealed space 94 between the upper die 86 and the lower die 84. That is, a vacuum is drawn in the sealed space 94 between the upper die 86 and the lower die 84.
• the rotating part 73A is rotated to move the heating and pressurizing part 74 arranged at the setup position P1 to the pressurizing position P2.
• the heating and pressurizing part 74 arranged at the pressurizing position P2 moves to the setup position P1 (second circuit part fixing process).
• the upper die engagement portion 80 is engaged with the upper die 86, and the upper die 86 is pressed toward the lower die 84 at the pressure position P2, thereby pressing the circuit portion 18 set on the insulating layer 16 toward the substrate 12.
• This fixes the circuit portion 18 to the insulating layer 16 (fifth process, third circuit portion fixing process).
• the third circuit portion fixing process the state in which the circuit portion 18 is pressed toward the substrate 12 is maintained for a set time.
• the circuit portion 18 is pressed toward the substrate 12 at a lower pressure than in the third insulating layer fixing process described above.
• the third insulating layer fixing process only the high pressure cylinder 78A may be operated, and in the third circuit portion fixing process, only the low pressure cylinder 78B may be operated.
• the upper mold 86 and the lower mold 84 are also heated by the heater 90, and a vacuum is drawn in the sealed space 94 between the upper mold 86 and the lower mold 84.
• the substrate 12 that has been processed by the second preheat unit 40 (that has passed through the heating furnace 68) is set in the heating and pressurizing unit 74 that is located at the setup position P1.
• the upper die lifting unit 82 is operated to engage the upper die 86 with the lower die 84 at the setup position P1 (fourth circuit unit fixing process).
• the air suction unit 76 is operated to draw a vacuum in the sealed space 94 between the upper die 86 and the lower die 84.
• the rotating portion 73A is rotated to move the heating and pressurizing portion 74, which has completed the third circuit portion fixing process, from the pressurizing position P2 to the preparation position.
• the heating and pressurizing portion 74 which has completed the fourth circuit portion fixing process, moves from the preparation position P1 to the pressurizing position P2 (fifth circuit portion fixing process).
• the upper die engagement portion 80 is engaged with the upper die 86, and the upper die 86 is pressed toward the lower die 84 at the pressure position P2, thereby pressing the circuit portion 18 set on the insulating layer 16 toward the substrate 12. This fixes the circuit portion 18 to the insulating layer 16 (sixth circuit portion fixing process).
• the substrate 12 with the circuit part 18 fixed on the insulating layer 16 is removed from the heating and pressurizing part 74 arranged at the setup position P1.
• the substrate 12 is removed from the receiving jig 88 arranged at the setup position P1 by operating a manipulator (not shown) (sixth process).
• the substrate 12 removed from the receiving jig 88 is returned to the common conveying jig 58 on the conveying part 66.
• the substrate 12 that has completed the process by the second preheating part 40 (passed through the heating furnace 68) is set in the heating and pressurizing part 74 arranged at the setup position P1 (seventh circuit part fixing process).
• the substrates 12 and the like that have completed the process by the second preheating part 40 are fed one after another into the second press part 42.
• the substrates 12 and the like fed into the second press part 42 are sent out one after another to the next process.
• the fourth circuit part fixing process can be performed simultaneously with the third circuit part fixing process.
• the seventh circuit part fixing process can be performed simultaneously with the sixth circuit part fixing process. This makes it possible to prevent the waiting time before the process of fixing the circuit part 18 and the insulating layer 16 from becoming long.
• the substrate 12 with the circuit part 18 fixed on the insulating layer 16 can be removed from the heating and pressing section 74 at the setup position P1.
• the substrate 12 with the circuit part 18 set on the insulating layer 16 can be set in the heating and pressing section 74 at the setup position P1. Furthermore, when the circuit part 18 is pressed toward the substrate 12 at the pressurizing position P2, the substrate 12 with the circuit part 18 set on the insulating layer 16 can be heated by the heaters 90 provided on the upper die 86 and the lower die 84 at the preparation position P1. Also, when the circuit part 18 is pressed toward the substrate 12 at the pressurizing position P2, the sealed space 94 formed between the upper die 86 and the lower die 84 can be evacuated at the preparation position P1. In this way, in this embodiment, the time that the substrate 12, etc. that has completed the process by the second preheating unit 40 is left waiting without doing anything before being inserted into the second pressing unit 42 can be reduced.
• the substrate 12 is set on the receiving jig 88 with the heat dissipation sections 14B of the substrate 12 inserted into the insertion holes 88A of the receiving jig 88.
• the lower surface of the plate-shaped section 14A (the surface forming the bottom surface of the heat dissipation sections 14B of the substrate 12) is in contact with the upper surface of the receiving jig 88.
• This allows the bottom surfaces of the heat dissipation sections 14B of the substrate 12 to be supported by the upper surface of the receiving jig 88.
• pressure can be applied to the fixing points of the circuit section 18.
• the concentrated pressing portion 86 of the upper mold 86 is configured to concentrate pressure on the portion where the circuit portion 18 is set. This allows pinpoint pressure to be applied to the portion where the circuit portion 18 is set.
• the concentrated pressing portion 86 of the upper mold 86 presses the portion where the circuit portion 18 is set through the cardboard 64 and the urethane sheet 104.
• the urethane sheet 104 is pressed toward the substrate 12 through the cardboard 64, a portion of the urethane sheet 104 comes into contact with the insulating layer 16 and presses the insulating layer 16 downward. This makes it possible to suppress bulging of the insulating layer 16 at points where the circuit portion 18 is not fixed.
• the adhesive that protrudes from between the insulating layer 16 and the circuit portion 18 can be absorbed by the urethane sheet 104.
• the air in the sealed space 94 formed between the lower die 84 and the upper die 86 can be sucked in by the air suction unit 76.
• the substrate 12 and the like are heated in the process in the second preheat section 40. This makes it possible to shorten the time required to heat the substrate 12 and the like in the process in the second press section 42.
• All of the steps in the second press section 42 described above may be performed automatically, or some of the steps in the second press section 42 may be performed manually.
• the cardboard 64 set on the urethane sheet 104 is removed. All of the steps in the second removal section 44 may be performed automatically, or some or all of the steps in the second removal section 44 may be performed manually.
• the second cooling section 46 cools the substrate 12, the insulating layer 16, and the circuit section 18.
• the common transport jig 58 is transported by the transport section 66 so that the common transport jig 58 passes between the upper and lower fans 96. This cools the substrate 12 set on the common transport jig 58, the insulating layer 16 fixed on the substrate 12, and the circuit section 18 fixed on the insulating layer 16.
• the second peeling section 48 removes the urethane sheet 104.
• the second peeling section 48 has a gripping section 106 that grips the urethane sheet 104.
• the gripping section 106 first grips an end of the urethane sheet 104.
• the gripping section 106 gripping the end of the urethane sheet 104 is moved. This causes the urethane sheet 104 to be peeled off from the circuit section 18 and the insulating layer 16.
• the urethane sheet 104 peeled off from the circuit section 18 and the insulating layer 16 is carried by the gripping section 106 and discarded in a specified container. All of the processes in the second peeling section 48 may be performed automatically, or some or all of the processes in the second peeling section 48 may be performed manually.
• the second inspection unit 50 inspects whether the circuit unit 18 is fixed at a predetermined position on the board 12. As shown in FIG. 33, in the process in the second inspection unit 50, the images of the board 12, the insulating layer 16, and the circuit unit 18 taken by the camera 102 are compared with the inspection data to inspect whether the circuit unit 18 is fixed at a predetermined position on the board 12. If the inspection result shows that the circuit unit 18 is fixed at a predetermined position on the board 12, the board 12 (circuit board 12) with the circuit unit 18 fixed to the insulating layer 16 is shipped as a product.
• the board 12 (circuit board 12) with the circuit unit 18 fixed to the insulating layer 16 is discarded without being shipped as a product.
• all of the processes in the second inspection unit 50 may be performed automatically, or some or all of the processes in the second inspection unit 50 may be performed manually.
• circuit board 12 shown in Figures 1 and 2 is manufactured.
• the insulating layer cutting section 20, first setting section 22, first preheating section 24, first pressing section 26, first removal section 28, first cooling section 30, first peeling section 32, and first inspection section 34 shown in FIG. 3 and the circuit section attachment section 36, second setting section 38, second preheating section 40, second pressing section 42, second removal section 44, second cooling section 46, second peeling section 48, and second inspection section 50 shown in FIG. 4 may be shared equipment, or may be independently provided equipment.

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• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Mechanical Engineering (AREA)
• Production Of Multi-Layered Print Wiring Board (AREA)
• Insulated Metal Substrates For Printed Circuits (AREA)

Priority Applications (4)

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Publications (1)

Family

ID=91896745

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Citations (5)

• 2023
  • 2023-11-20 CN CN202380090965.1A patent/CN120570070A/zh active Pending
  • 2023-11-20 WO PCT/JP2023/041664 patent/WO2024150533A1/ja not_active Ceased
  • 2023-11-20 JP JP2024570061A patent/JPWO2024150533A1/ja active Pending
  • 2023-11-20 EP EP23916150.8A patent/EP4651643A4/en active Pending
  • 2023-11-20 KR KR1020257026520A patent/KR20250134111A/ko active Pending

Patent Citations (5)

Non-Patent Citations (1)

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