WO2024128175A1 - Module optique, dispositif d'inspection et procédé de conception de module optique - Google Patents

Module optique, dispositif d'inspection et procédé de conception de module optique Download PDF

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Publication number
WO2024128175A1
WO2024128175A1 PCT/JP2023/044164 JP2023044164W WO2024128175A1 WO 2024128175 A1 WO2024128175 A1 WO 2024128175A1 JP 2023044164 W JP2023044164 W JP 2023044164W WO 2024128175 A1 WO2024128175 A1 WO 2024128175A1
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Prior art keywords
light
optical module
solid
state imaging
correction filter
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PCT/JP2023/044164
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English (en)
Japanese (ja)
Inventor
隆史 小原
充優 伊與田
聖 藤原
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株式会社インターアクション
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Publication of WO2024128175A1 publication Critical patent/WO2024128175A1/fr

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  • This disclosure relates to an optical module, an inspection device, and a method for designing an optical module.
  • Patent Document 1 In optical inspection of solid-state imaging devices built into digital cameras and the like, inspection light is irradiated from a light source through an optical module onto the solid-state imaging device.
  • One such type of optical module is described in Patent Document 1.
  • Technology for placing an apodization filter between the light source and the object to be measured is described in Patent Documents 2 and 3.
  • Patent Document 2 does not use a diffuser.
  • a solid-state imaging element can be inspected by irradiating the solid-state imaging element with inspection light from an optical module and measuring the output signal of the solid-state imaging element at that time.
  • inspection light incident on the center and periphery of the solid-state imaging element. This is because inspection can be easier this way.
  • apodization filters used in ordinary cameras or in patent documents 2 and 3 are not optical modules used for inspecting solid-state imaging devices, they have optical characteristics in which the center is bright and gradually attenuates toward the periphery, making them difficult to apply to optical modules used for inspecting solid-state imaging devices.
  • the performance required for inspecting solid-state imaging elements varies depending on the specifications required by the customer who produces the solid-state imaging elements, or the type of optical equipment in which the solid-state imaging elements are mounted. Therefore, it is preferable for the optical module to be able to meet a variety of inspection requirements.
  • the objective of this disclosure is to provide an optical module, an inspection device, and a method for designing an optical module that allows the peripheral light ratio of inspection light to be changed for the purpose of inspecting solid-state imaging elements.
  • an optical module that irradiates a solid-state imaging element with inspection light for inspecting the solid-state imaging element, and includes a tube portion that passes light from a light source as inspection light, a diffusion plate provided in the tube portion that diffuses the light incident from the light source, and a light intensity correction filter that is provided in the tube portion at a position closer to the emission side of the inspection light than the diffusion plate and has optical performance that changes the peripheral light intensity ratio of the inspection light irradiated to the solid-state imaging element for inspection of the solid-state imaging element.
  • the light intensity compensation filter may be set so that its transmittance increases from the center to the periphery.
  • the light intensity correction filter may be provided inside the tube portion.
  • the light intensity correction filter may be provided on the exit side from which the inspection light is emitted, at either end of the optical axis direction of the tube portion.
  • a pinhole is provided on the exit side, and a light intensity correction filter may be provided at a position closer to the exit side of the pinhole than the inspection light.
  • a pinhole and an illumination lens located on the exit side of the inspection light exit port are provided, and the light intensity correction filter may be provided between the pinhole and the aspheric lens.
  • a pinhole and an illumination lens located on the exit side of the inspection light exit port are provided, and the light intensity correction filter may be provided between the aspheric lens and the solid-state imaging element.
  • the light intensity correction filter may be provided on the surface of the illumination lens that faces the solid-state imaging element.
  • the light compensation filter may be replaceable.
  • the light intensity correction filter may be provided so as to be replaceable together with a portion of the tube portion.
  • the tube portion is provided with a rotatable filter switching unit that holds a number of light intensity correction filters with different optical performance, and the filter switching unit may be operated to use any one of the multiple light intensity correction filters.
  • the light intensity correction filter may be provided so as to be replaceable together with the illumination lens.
  • the distance between the pinhole and the light compensation filter may be variable.
  • an inspection device includes any of the optical modules described above, a light source, and a probe card that is electrically connected to a solid-state imaging element and to which the optical module is attached so that light from the light source is irradiated as inspection light onto the solid-state imaging element.
  • an optical module for irradiating a solid-state imaging element with inspection light for inspecting the solid-state imaging element includes a tube section that passes light from a light source as inspection light, a diffusion plate provided in the tube section that diffuses the light incident from the light source, and a light intensity correction filter provided in the tube section at a position closer to the emission side of the inspection light than the diffusion plate and having optical performance for changing the peripheral light intensity ratio of the inspection light irradiated to the solid-state imaging element for inspection of the solid-state imaging element, the optical performance of the light intensity correction filter being determined based on the optical characteristics of the light beam incident on the solid-state imaging element in a nominal state in which the light intensity correction filter is not used.
  • the light intensity correction filter may have optical performance set to any value in the range of cosine ⁇ 0.4 to cosine ⁇ 1.5 so that the transmittance increases from the center to the periphery.
  • a method for designing an optical module for irradiating a solid-state imaging element with inspection light for inspecting the solid-state imaging element by a design device comprising: a tube section for passing light from a light source as the inspection light; a diffuser plate provided in the tube section for diffusing the light incident from the light source; and a light intensity correction filter provided in the tube section at a position closer to the emission side of the inspection light than the diffuser plate and having optical performance for changing the peripheral light intensity ratio of the inspection light irradiated to the solid-state imaging element for inspection of the solid-state imaging element, the design device executing a first step of acquiring a principal ray axis angle characteristic required for the solid-state imaging element; a second step of generating design data for determining optical performance based on the required principal ray axis angle characteristic so that the transmittance of the light intensity correction filter increases from the center to the periphery; and a third step of outputting the generated design
  • the optical performance may be designed to be any value in the range of cosine ⁇ 0.4 to cosine ⁇ 1.5 so that the transmittance increases from the center to the periphery of the light intensity correction filter.
  • the peripheral light ratio of the inspection light can be changed to inspect solid-state imaging devices.
  • FIG. 1 is a cross-sectional view showing an outline of an inspection device according to an embodiment.
  • 1 is a cross-sectional view of an optical module according to a first embodiment.
  • FIG. 4 is a plan view of a light amount correction filter.
  • 11 is a graph showing a change in transmittance of a light amount correction filter.
  • 1 is a graph showing a change in the amount of light on a solid-state imaging element.
  • 4 is a schematic diagram showing the positional relationship between a pinhole, a light amount correction filter, and a solid-state imaging element.
  • FIG. 11 is a graph showing how the amount of light changes depending on the distance between a pinhole and a light amount correction filter.
  • FIG. 11 is a cross-sectional view of an optical module according to a second embodiment.
  • FIG. 11 is a cross-sectional view of an optical module according to a third embodiment.
  • 11 is a graph showing the change in the light intensity ratio when a light intensity correction filter is placed in front of an aspherical lens (on the incident side of the inspection light) and behind an aspherical lens (on the exit side of the inspection light) as an example of an illumination lens.
  • FIG. 11 is a cross-sectional view of an optical module according to a fourth embodiment.
  • FIG. 4 is a side view of an aspheric lens and a light amount correction filter.
  • FIG. 13 is a side view of an aspheric lens and a light amount correction filter according to a fifth embodiment.
  • FIG. 23 is a plan view of a light amount correction filter according to a sixth embodiment.
  • FIG. 13 is a perspective view of an optical module according to a seventh embodiment.
  • FIG. 13 is a perspective view of an optical module according to an eighth embodiment.
  • FIG. 13 is a perspective view of an optical module according to a ninth embodiment.
  • FIG. 23 is a block diagram of an inspection device according to a tenth embodiment.
  • FIG. 23 is a cross-sectional view of an optical module according to an eleventh embodiment.
  • FIG. 23 is a cross-sectional view of an optical module according to a twelfth embodiment.
  • FIG. 23 is a cross-sectional view of an optical module according to a thirteenth embodiment.
  • FIG. 23 is a cross-sectional view of an optical module according to a fourteenth embodiment.
  • FIG. 23 is a cross-sectional view of an optical module according to a fifteenth embodiment.
  • FIG. 23 is an explanatory diagram showing a design method of an optical module according to Example 16.
  • FIG. These are examples of CRA characteristics requested by customers.
  • 1 is an example of a designed CRA characteristic.
  • FIG. 1 is an explanatory diagram showing CRA characteristics.
  • 1 is a graph of CRA characteristics.
  • 5 is a graph showing various intensity distributions of a light beam incident on a solid-state imaging element.
  • 11 is a graph showing a comparison between a light intensity correction filter conforming to cosine ⁇ 0.4 and a nominal state.
  • 11 is a graph showing a comparison between a light intensity correction filter conforming to cosine ⁇ 0.8 and a nominal state.
  • 11 is a graph showing a comparison between a light quantity correction filter conforming to cosine ⁇ 1.5 and a nominal state.
  • FIG. 11 is a graph showing a comparison between a light intensity correction filter conforming to cosine ⁇ 4.0 and a nominal state. Graph showing a comparison between straight and nominal conditions.
  • FIG. 11 is a cross-sectional view of an optical module according to a first modified example.
  • FIG. 11 is a cross-sectional view of an optical module according to a second modified example.
  • FIG. 13 is a cross-sectional view of an optical module according to a third modified example.
  • an optical module 5 and an inspection device 1 that change the peripheral illumination ratio of the inspection light 21 for inspecting a solid-state imaging element 101.
  • the optical module 5 has a light intensity correction filter 57 (see FIG. 2) that changes the light intensity distribution of the inspection light irradiated toward the solid-state imaging element.
  • illumination light refers to a light beam emitted from the optical module and used to inspect a solid-state imaging element.
  • the light beam may be abbreviated to light.
  • Example 1 will be described with reference to Figures 1 to 7.
  • Figure 1 shows an overview of an inspection device 1.
  • the inspection device 1 includes, for example, a light source 2, a probe card 3, a table 4, an optical module 5, and a calculation unit 10.
  • the light source 2 is, for example, a light source such as a halogen lamp light source, a xenon lamp light source, an LED light source, or a broadband laser light source. It is not limited to a white light source, and may be any light source that emits light used for inspecting the solid-state imaging element 101.
  • the light source 2 may also be called a light source device 2.
  • the light source 2 may include an optical system (not shown).
  • the optical system may include, for example, a lens, a filter, an aperture, a mirror, etc.
  • the light emitted from the light source 2 toward each optical module 5 is telecentric light in which the optical axis and the principal ray are parallel.
  • the wafer 100 is mounted on the inspection table 4.
  • the inspection table 4 is equipped with a chuck mechanism (not shown) such as a vacuum chuck or electrostatic chuck, and the chuck mechanism positions and holds the wafer 100.
  • the inspection table 4 can be displaced in predetermined increments on three axes of a Cartesian coordinate system. Since the inspection table 4 can be displaced in three axial directions, it is possible to position each optical module 5 and probe card 3 relative to each solid-state imaging element 101.
  • the probe card 3 includes one or more mounting portions 31 for mounting the optical module 5, a plurality of conductive pins 32 arranged on the periphery of the mounting portion 31 on the solid-state imaging element 101 side of both ends, and a circuit board (not shown).
  • Each solid-state imaging element 101 on the wafer 100 is electrically connected to the circuit board via the plurality of conductive pins 31, and is electrically connected to the calculation unit 10 via the circuit board.
  • the calculation unit 10 receives output signals from each solid-state imaging element 101 when irradiated with the inspection light 21, and controls the light source 2 and the table 4. Furthermore, the calculation unit 10 controls and diagnoses the solid-state imaging element 101 via the probe card 3. Diagnosis means, for example, detecting defects in a plurality of pixels of the solid-state imaging element 101.
  • one mounting portion 31 is formed for one solid-state imaging element 101.
  • one mounting portion 31 may be formed for multiple solid-state imaging elements 101.
  • FIG. 1 shows four mounting portions 31 formed in a straight line on the probe card 3, in reality, the mounting portions 31 may be formed in a matrix of, for example, 4 x 4. Multiple mounting portions 31 may be formed in a straight line on the probe card 3, or only one mounting portion 31 may be formed on the probe card 3.
  • the solid-state imaging element 101 is, for example, a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor.
  • a plurality of solid-state imaging elements 101 are formed on the wafer 100, and the wafer 100 is transported to an inspection stage where the inspection device 1 is disposed.
  • the inspection device 1 inspects the solid-state imaging elements 101 before they are separated from the wafer 100. However, the inspection device 1 can also inspect the solid-state imaging elements 101 separated from the wafer 100 one by one.
  • the type of light source 2 is selected according to the wavelength of light detected by the solid-state imaging element 101.
  • the solid-state imaging element 101 when used as a part of a camera mounted on a so-called smartphone, tablet terminal, wearable terminal, personal computer, etc., it detects visible light.
  • the solid-state imaging element 101 may detect light rays other than visible light, such as ultraviolet light or infrared light.
  • the configuration of the optical module 5 will be described with reference to Figure 2.
  • the purpose of the optical module 5 is, for example, to irradiate the imaging surface of the solid-state imaging element 101 with inspection light in order to inspect the solid-state imaging element 101. If the user of the solid-state imaging element 101 requires certain CRA (Chief Ray Angle) characteristics, the optical module 5 is provided with an aspheric lens 58 to realize the certain CRA, as will be described later with reference to Figure 8 etc.
  • CRA Choef Ray Angle
  • the optical module 5 has an outer shape that is generally cylindrical, and transmits light from the light source 2 in the axial direction.
  • the optical module 5 includes, for example, a tube 51, a plurality of light control filters 52(1), 52(2) provided at the entrance 511 of the tube 51, a condenser lens 53 provided midway along the optical axis 22 in the tube 51, a pinhole 55 provided on the exit 512 side of the tube 51, a diffusion plate 54 provided between the pinhole 55 and the condenser lens 53, and a light intensity correction filter 57 provided to cover the exit 512 side of the tube.
  • the axial position of the light intensity correction filter 57 is determined by an annular spacer 56. It is to be noted that, without using the spacer 56, an annular step for attaching the light intensity correction filter 57 may be integrally formed as an attachment part on the inner tip side of the tube 51.
  • the tube portion 51 is formed into a cylindrical shape from a metal material such as aluminum.
  • the outer and inner surfaces of the tube portion 51 may be painted black to prevent stray light.
  • the inner surface of the tube portion 51 may be left unpainted black to reflect light.
  • the tube portion 51 may be called a lens barrel 51.
  • the material, shape, and type of surface treatment of the tube portion 51 are not important.
  • the tube portion 51 may be formed from a resin material. The same applies to the other components.
  • the opening on the light source 2 side is the entrance 511
  • the opening on the solid-state imaging element 101 side is the exit 512.
  • an example will be described in which the central axis of the tube portion 51 and the axis (optical axis) 22 of the light incident from the light source 2 coincide.
  • this is not limiting, and the present disclosure can also be applied to cases in which the central axis of the tube portion 51 and the optical axis 22 do not coincide.
  • the cylindrical portion 51 is inserted into the mounting portion 31 of the probe card 3 as described above.
  • the cylindrical portion 51 is detachably attached to the probe card 3 by a flange-shaped mounting portion 513 provided on the entrance 511 side.
  • the cylindrical portion 51 can be attached to the probe card 3 via a screw (not shown).
  • the cylindrical portion 51 may be formed from a plurality of parts.
  • the optical components e.g., a light control filter, a focusing lens, a diffusion plate, a spacer, a light quantity correction filter
  • the optical components listed above are merely examples, and it is not necessary for all of the optical components to be attached in the cylindrical portion 51.
  • the dimming filters 52(1) and 52(2) are filters for adjusting the amount of light from the light source 2.
  • the amount of light incident from the light source 2 to each optical module 5 varies depending on the relative positional relationship between the light source 2 and each optical module 5. If the amount of light from the light source 2 is non-uniform, the amount of inspection light irradiated from each optical module 5 to the solid-state imaging element 101 will also be non-uniform, which will affect the inspection results. Therefore, the dimming filters 52(1) and 52(2) are provided at the entrance 511 of the tube portion 51 so that the amount of inspection light irradiated from each optical module 5 will be approximately uniform.
  • the dimming filters 52(1), 52(2) adjust the amount of light passing through the dimming filters 52(1), 52(2) by, for example, an anti-reflection film (not shown) formed on a glass substrate.
  • an anti-reflection film (not shown) formed on a glass substrate.
  • the amount of light (light intensity) from the light source 2 entering each optical module 5 can be adjusted by forming an anti-reflection film on both sides of the glass substrate, forming an anti-reflection film on only one side of the glass substrate, or using a glass substrate without an anti-reflection film.
  • the light adjustment filters 52(1) and 52(2) are formed to match the cross-sectional shape of the tube portion 51.
  • the light adjustment filters 52(1) and 52(2) are disk-shaped.
  • the light adjustment filters 52(1) and 52(2) are rectangular.
  • the number of light adjustment filters is not limited to two. As long as the amount of light can be adjusted, one light adjustment filter may be used, or three or more light adjustment filters may be used.
  • the light adjustment filters 52(1) and 52(2) will be referred to as light adjustment filters 52.
  • the condenser lens 53 is provided inside the tube portion 51, located below the dimming filter 52, that is, toward the exit port 512 in the direction along the optical axis 22.
  • the condenser lens 53 is provided inside the tube portion 51, located between the dimming filter 52 and the diffuser plate 54.
  • the condenser lens 53 is, for example, a plano-convex lens.
  • a plano-convex lens has one flat surface and the other convex surface.
  • the condenser lens 53 is provided inside the tube portion 51 with the convex surface facing the entrance port 511.
  • the focusing lens 53 focuses the light that has passed through the dimming filter 52 toward approximately the center of the diffusion plate 54 and the pinhole 55.
  • the position at which the light is focused by the focusing lens 53 is determined according to the axial length of the lens barrel 51 and the position of the pinhole 55.
  • the axial length of the lens barrel 51 is determined by the thickness dimension of the probe card 3.
  • the focusing lens 53 focuses the light that has passed through the dimming filter 52 toward approximately the center of the diffusion plate 54 by covering the opening area of the pinhole 55 with the light beam.
  • the word "approximately” is used to indicate that it includes not only exact agreement, but also substantial agreement. Substantially agreement includes cases where there is some deviation but it does not have a significant effect on the performance of the optical module 5.
  • the diffuser plate 54 is provided inside the tube portion 51 and resets the angular characteristics of the light that has passed through the dimming filter 52 from the light source 2, diffusing the light.
  • the diffuser plate 54 is set so that the inspection light is sufficiently diffused and enters the pinhole 55.
  • the pinhole 55 is an optical aperture stop.
  • the pinhole 55 is formed integrally with the tube portion 51.
  • the pinhole 55 may be formed as a separate member from the tube portion 51 and attached inside the tube portion 51.
  • the pinhole 55 is formed in a tapered shape that decreases in diameter toward the exit port 512 side.
  • the diameter dimension of the pinhole 55 is determined by the specifications (F value) required by the user of the inspection device 1.
  • F value the specifications
  • a diffuser plate 54 is placed immediately before the pinhole 55. That is, the diffuser plate 54 is provided on the entrance port 511 side along the optical axis 22 from the pinhole 55.
  • the light intensity correction filter 57 is attached to the exit port 512 of the tube portion 51 via a spacer 56.
  • the diameter of the light intensity correction filter 57 is larger than the diameter of the diffusion plate 54.
  • the light intensity correction filter 57 has a different light transmittance depending on the position on the filter. That is, the light intensity correction filter 57 has a low transmittance in the center, and the transmittance gradually increases from the center to the periphery.
  • FIG. 3 is a plan view of the light intensity correction filter 57.
  • FIG. 4 is a graph showing the change in transmittance of the light intensity correction filter 57.
  • the central portion 571 of the light intensity correction filter 57 has the lowest transmittance, and the transmittance gradually increases as one moves radially from the central portion 571 to the peripheral portion 572.
  • FIG. 4 shows the optical characteristics of four light intensity correction filters whose transmittances at the center portion 571 are 75%, 50%, 25%, and 0%. That is, the light intensity correction filter 57 of this embodiment attenuates the transmittance at the center portion 571 and linearly increases the transmittance from the center portion 571 to the peripheral portion 572.
  • the transmittance may change linearly or non-linearly (curved).
  • Figure 5 is a graph showing the change in the amount of inspection light on the solid-state imaging element 101 (on the wafer 100).
  • the vertical axis of Figure 5 shows the light amount ratio
  • the horizontal axis shows the image height.
  • Light from the light source 2 that has been uniformly adjusted by the dimming filter 52 passes through the diffuser 54 and the pinhole 55, and then passes through the light amount correction filter 57 having the characteristics of Figure 4, before entering the solid-state imaging element 101 of the wafer 100. For this reason, the amount of inspection light irradiated on the solid-state imaging element 101 gradually attenuates from the position of the optical axis 22 toward the periphery.
  • the dimming filter 52 and the light amount correction filter 57 are set individually so that the amount of inspection light is approximately uniform within a group of optical modules 5 attached to the same probe card 3.
  • Figure 6 is a schematic diagram showing the positional relationship between the pinhole 55, the light amount correction filter 57, and the solid-state imaging element 101.
  • FIG. 7 shows the relationship between the distance L and the amount of inspection light.
  • FIG. 7 shows the change in the amount of inspection light on the solid-state imaging element 101 (on the wafer 100).
  • an experiment was performed using a light amount correction filter 57 with a transmittance of 25% at the center 571.
  • the vertical axis of FIG. 7 shows the light amount ratio
  • the horizontal axis of FIG. 7 shows the image height.
  • the left end of the horizontal axis coincides with the optical axis 22, and the image height is 0%.
  • the position of "100%" shown on the horizontal axis shows the position where the image height is maximum, and is the outer edge of the range irradiated by the inspection light.
  • Characteristic C1 in FIG. 7 shows the case where the light amount correction filter 57 is not provided in the optical module 5.
  • Characteristics C2-C6 show the case where the pinhole 55 is disposed between the solid-state imaging element 101.
  • the distance L between the pinhole 55 and the light intensity correction filter 57 increases as the characteristics increase from C1 to C2, C3, C4, C5, and C6. That is, in the experimental example of FIG. 7, characteristic C2 is an example where the distance L between the pinhole 55 and the solid-state imaging element 101 is the shortest, and characteristic C6 is an example where the distance L is the longest (distance L for C6 > distance L for C5 > distance L for C4 > distance L for C3 > distance L for C2).
  • Inspection light for the solid-state imaging element 101 is preferably one that changes gradually from the amount of light at an image height of 0% to the amount of light at an image height of 100%. Therefore, in the example of FIG. 7, characteristic C3 is preferable. With characteristics C4-C6, the amount of light is greater at locations away from the central portion 571 than at the central portion 571, and therefore is not optimal as inspection light. However, the solid-state imaging element 101 may be inspected using inspection light with characteristics C4-C6.
  • the inspection light can be diffused using the diffuser plate 54 to inspect the solid-state imaging element 101, while changing the peripheral light ratio of the inspection light.
  • the light intensity correction filter 57 is used, the transmittance of which decreases from the central portion 571 to the peripheral portion 572. As shown by characteristic C3 in FIG. 7, this reduces unevenness in the inspection light irradiated from the optical module 5 to the solid-state imaging element 101, thereby improving the inspection accuracy.
  • the light intensity correction filter 57 is provided inside the tube portion 51, which prevents the light intensity correction filter 57 from coming into contact with surrounding foreign objects and becoming damaged.
  • the light intensity correction filter 57 is disposed closer to the exit port 512 than the pinhole 55, so that the change in light intensity can be adjusted for each optical module 5 by adjusting the distance L between the light intensity correction filter 57 and the pinhole 55 with the spacer 56.
  • the optical module 5 of this embodiment can appropriately adjust the amount of inspection light for each optical module 5 by adjusting the optical characteristics of the light intensity correction filter 57 (the transmittance of the central portion 571 and the degree of change in transmittance from the central portion 571 to the peripheral portion 572) and the distance L between the pinhole 55 and the light intensity correction filter 57.
  • Example 2 will be described using Figure 8. In the following examples, including this one, differences from the above-mentioned examples will be mainly described.
  • an aspherical lens 58 is provided as an illumination lens at the exit 512 of the tube portion 51.
  • the aspherical lens 58 is placed after the pinhole 55 to achieve the chief ray incident angle CRA (Chief Ray Angle) required by the user.
  • CRA chief ray incident angle
  • the lens is not limited to an aspherical lens, and for example, a spherical lens or a ball lens can also be used.
  • an aspherical or spherical lens can be provided on the exit 512 side of the tube portion 51.
  • the shape of the aspherical lens 58 is shown in a simplified form.
  • a diffuser 54, a pinhole 55, a light intensity correction filter 57A, and an aspherical lens 58 are provided in the direction toward the exit side along the optical axis 22.
  • the light intensity correction filter 57A is positioned between the diffuser 54 and the pinhole 55 and the aspherical lens 58.
  • This embodiment configured in this manner also achieves the same effects as those of the first embodiment. Furthermore, in this embodiment, an aspheric lens 58 that realizes a predetermined CRA is provided on the exit port 512 side of the tube portion 51, so that the specifications required by the user can be met.
  • aspherical lens 58 is thicker in the center and thinner toward the periphery, so it has the effect of adjusting the peripheral light ratio.
  • Aspherical lens 58 is a lens for illumination.
  • Aspherical lens 58 may or may not form an image on the solid-state imaging element.
  • the peripheral light ratio adjustment effect of aspherical lens 58 (the effect of adjusting the amount of inspection light irradiated to the solid-state imaging element; the same applies below) combined with the peripheral light ratio adjustment effect of light intensity correction filter 57A allows the amount of inspection light to be appropriately adjusted.
  • FIG. 9 is a cross-sectional view of an optical module 5B according to this example.
  • a light intensity correction filter 57B is provided, located closer to the exit 512 side than the aspherical lens 58.
  • a diffuser plate 54 is provided on the entrance 511 side of the pinhole 55, and an aspherical lens 58 is provided on the exit 512 side of the pinhole 55 via a spacer 56.
  • a light intensity correction filter 57B is provided outside the aspherical lens 58 (on the exit 512 side along the optical axis 22).
  • FIG. 10 shows the change in the light intensity ratio when light intensity correction filter 57B is placed in front of aspherical lens 58 (on the entrance side of the inspection light) and behind aspherical lens 58 (on the exit side of the inspection light).
  • FIG. 10 shows the change in the amount of light on solid-state imaging element 101 (on wafer 100).
  • the vertical axis of FIG. 10 shows the light intensity ratio
  • the horizontal axis shows the image height. "0%" on the horizontal axis is the image height at a position that coincides with optical axis 22, and "100%" on the horizontal axis is the position at which the image height is maximum.
  • light intensity correction filter 57B with a transmittance of 25% in the center is used.
  • the characteristic 70 shown by the dotted line indicates the change in the peripheral light ratio when the light intensity correction filter 57B is not used.
  • the amount of light significantly decreases as the inspection light moves away from the optical axis 22.
  • Characteristics 71 shown by the thin solid line is an example in which light intensity correction filter 57B with a transmittance of 25% at the center 571 is provided between aspheric lens 58 and pinhole 55.
  • the peripheral light intensity ratio of the inspection light irradiated to solid-state imaging element 101 can be gradually changed from the center 571 toward the peripheral area 572.
  • Characteristics 72 indicated by a thick solid line is an example in which light intensity correction filter 57B is provided on the outside of aspheric lens 58, that is, closer to the solid-state imaging element 101, as shown in FIG. 9.
  • the peripheral light intensity of the inspection light can be increased.
  • the amount of light around the periphery can be improved by simply placing the light intensity correction filter 57B outside the aspheric lens 58 (between the aspheric lens 58 and the solid-state image sensor 101) without changing the transmittance of the light intensity correction filter 57B.
  • the light intensity correction filter 57B can prevent the aspheric lens 58 from coming into contact with foreign matter and being damaged.
  • the light intensity correction filter 57B is exposed on the exit port 512 side of the tube portion 51, so the worker can visually inspect the light intensity correction filter 57C.
  • Example 4 will be described with reference to Figures 11 and 12.
  • a light intensity correction filter 57C is formed integrally with the aspherical lens 58C on the surface of the aspherical lens 58C that faces the solid-state imaging element 101.
  • a diffuser 54 is provided closer to the entrance 511 of the pinhole 55, and the aspherical lens 58C is provided closer to the exit 512 of the pinhole 55, and the light intensity correction filter 57C is integrally formed on the surface of the aspherical lens 58C that faces the solid-state imaging element 101 by means of deposition, printing, or the like.
  • FIG. 12 is a side view of the aspherical lens 57C and the light intensity correction filter 57C.
  • the light intensity correction filter 57C is integrally formed so as to cover the surface of the protruding portion of the aspherical lens 58C.
  • the light intensity correction filter 57C is integrally formed with the surface of the aspherical lens 58C that faces the solid-state imaging device 101, so that the light intensity correction filter 57C serves as a transparent protective cover, and can protect the aspherical lens 58C from foreign matter and the like.
  • the light intensity correction filter 57C is integrally formed along the convex shape of the aspherical lens 58C, which prevents interference between the conductive pin 32 of the probe guard 3 and the aspherical lens 58C, increasing design freedom.
  • the aspherical lens 58C can have high performance. Furthermore, by forming an infrared cut coating or the like on the surface of the aspherical lens 58C facing the pinhole 55, the aspherical lens 58C can have even higher performance.
  • a light intensity correction filter may be created by forming an anti-reflection coating.
  • Example 5 will be described with reference to Figure 13.
  • a light intensity correction filter 57D is integrally formed on the surface of the aspheric lens 58D facing the pinhole 55 by using a method such as deposition or printing.
  • This embodiment configured in this manner also achieves the same effects as embodiment 1.
  • This embodiment can also be made highly functional by providing the aspheric lens 58D with a light intensity correction filter function, thereby increasing the degree of freedom when designing the optical system.
  • Example 6 will be described with reference to Figure 14.
  • a plate member with many pores 573 formed therein is used as the light intensity correction filter 57E.
  • the formation density of the pores 573 is low in the center and increases toward the periphery.
  • This embodiment configured in this manner also has the same effect as the first embodiment.
  • this embodiment by changing the formation density of the pores 573, it is possible to obtain a light intensity correction filter 57E that reduces the amount of light (light flux) passing through the center and increases the amount of light passing toward the periphery.
  • FIG. 15 is a perspective view of the optical module 5F.
  • the flange-shaped mounting portion 513 is located at the bottom of the figure.
  • the tip side (solid-state imaging element 101 side) of the tube portion 51 is a removable cap portion 514.
  • the cap portion 514 is provided with an aspheric lens 58.
  • the light intensity correction filter 57F can be replaced by removing the cap portion 514 from the tube portion 51.
  • the portion of the tube portion 51 to which the aspheric lens 58 is attached is provided as a cap portion 514 that is detachably attached to the tube portion 51, so that the light intensity correction filter 57F can be replaced simply by removing the cap portion 514. This makes it possible to follow changes in the user's required specifications.
  • FIG. 16 is a perspective view of an optical module 5G of this embodiment.
  • the optical module 5G is formed in a rectangular cylindrical shape.
  • the optical module 5G of this embodiment has a filter replacement slit 515 at the tip side (the side facing the solid-state imaging element 101) of the tube portion 51, and the light intensity correction filter 57G can be attached and detached to the tube portion 51 by inserting the slit 515.
  • the light intensity correction filter 57G may be replaced manually by an operator, or automatically by a robotic hand (not shown).
  • a filter switching section 59H is provided at the tip side of the cylindrical section 51H.
  • the filter switching section 59H includes, for example, a slit 591H for filter switching and a filter holder 592H that enters and exits the cylindrical section 51H via a slit 515H.
  • Filter holder 592H is provided with light intensity correction filters 57H(1)-57H(3) with multiple optical capabilities (optical characteristics). Filter 592H is located near slit 591H and is attached to the tip side of tube portion 51H so that it can rotate horizontally. By rotating filter holder 592H horizontally by a predetermined angle, any one of the multiple light intensity correction filters 57H(1)-57H(3) can be selected for use.
  • any one of the multiple light intensity correction filters 57H(1)-57H(3) can be selected for use, so that light intensity correction filters 57H(1)-57H(3) with different optical performance can be switched for use, and changes in the user's required specifications can be followed.
  • FIG. 18 is a block diagram of an inspection device 1J according to this example.
  • the optical module 5J of this example is provided with a filter switching unit 59J for switching between light intensity correction filters.
  • the filter switching unit 59J is provided with light intensity correction filters 57J(1)-57(3) with different optical performance.
  • the filter-free unit 57J(0) is not provided with a light intensity correction filter and is simply an opening.
  • the filter switching unit 59J operates in response to a switching signal from the calculation unit 10 and selects the specified light intensity correction filter.
  • the light intensity correction filters 57J(1) and 57(2) have optical characteristics in which the transmittance increases from the center to the periphery
  • the light intensity correction filter 57J(3) has optical characteristics in which the transmittance decreases from the center to the periphery.
  • the filter switching unit 59J can be operated in response to an instruction from the calculation unit 10 to automatically switch the light intensity correction filter.
  • Example 11 will be described with reference to Figure 19.
  • the reflectance of the inner surface 516 of the tube portion 51K is set high, thereby reflecting the incident light and directing it to the pinhole 55, thereby increasing the amount of light incident on the pinhole 55.
  • the reflectance of the inner surface 516 is preferably set to, for example, 50% or more.
  • This embodiment configured in this way also achieves the same effects as the first embodiment.
  • the optical module 5L of this example is not provided with a focusing lens. Furthermore, the optical module 5L of this example has a high reflectance of the inner surface 516L of the tube portion 51L. It is preferable that the reflectance of the inner surface 516L is set to, for example, 50% or more.
  • the light that enters after passing through the dimming filter 52 reflects off the highly reflective inner surface 516L of the tube portion 51L toward the exit side 512, then toward the diffuser pinhole 55, and enters the pinhole 55 via the diffuser 54.
  • the light that passes through the pinhole 55 then passes through the aspheric lens 58C and light intensity correction filter 57C described in FIG. 11, and is irradiated onto the solid-state imaging element 101.
  • This embodiment configured in this way also achieves the same effects as the first embodiment.
  • a light pipe 60 is provided coaxially within a cylindrical member 51M.
  • the light pipe 60 may also be called a rod integrator.
  • the light pipe 60 is formed from a glass material or a resin material that is transparent to the light from the light source, and has a trapezoidal column shape with a larger diameter on the incident side than on the exit side.
  • the light pipe 60 guides the light that has entered through the light control filter 52 to the pinhole 55 side.
  • a light intensity correction filter 57M is provided on the exit side of the light pipe 60.
  • the inner peripheral surface of the cylindrical member 51M can be tapered so that the diameter decreases toward the pinhole side, and the reflectance of the tapered inner peripheral surface can be set high (for example, to a reflectance of 50% or more), thereby eliminating the need for a light pipe.
  • the inner peripheral surface of the cylindrical member 51M can function as a light pipe.
  • Example 14 will be described with reference to Figure 22.
  • a light pipe 60N is coaxially arranged inside a tube portion 51N.
  • the exit side (lower end side) of the light pipe 60 irradiates a light beam to a pinhole 55 via a diffusion plate 54.
  • the light beam that passes through the pinhole 55 is emitted via a light intensity correction filter 57N and irradiated to the solid-state imaging element 101.
  • This embodiment configured in this way also achieves the same effects as the first embodiment.
  • Example 15 will be described with reference to FIG. 23.
  • a light intensity correction filter whose transmittance increases from the center to the periphery is used.
  • the optical module 5P of this example is provided with a light intensity correction filter 57P whose transmittance decreases from the center to the periphery.
  • the optical module 5P of this embodiment can illuminate the solid-state imaging element 101 so that the center is bright and the periphery is slightly dark, creating a situation in which the solid-state imaging element 101 is actually used in a camera, allowing the optical performance of the solid-state imaging element 101 to be inspected.
  • Example 16 will be explained using Figures 24 to 37.
  • the optical performance of the light intensity correction filter is determined according to the characteristics of the chief ray axis angle (Chief Ray Angle, CRA) requested by the customer. According to this example, it is possible to obtain a light intensity correction filter with appropriate optical performance in response to various customer requests.
  • CRA chief ray axis angle
  • FIG. 24 is an explanatory diagram showing a method for designing an optical module.
  • the design device 200 is formed, for example, using a computer equipped with a processor, a main memory device, an auxiliary memory device, a communication unit, and a user interface unit (none of which are shown).
  • the processor executes a specific computer program transferred from the auxiliary memory device to the main memory device, and the device functions as a design device that designs a light intensity correction filter 57 with optical performance that meets customer requirements.
  • the design device 200 acquires specification data from the specification data storage unit 210, which stores specification data including the CRA characteristics that are customer requirements, and executes steps S201 to S203, which will be described later.
  • the design device 200 when the design device 200 acquires the CRA characteristic data from the specification data storage unit (S201), it designs the light intensity correction filter 57 having optical performance according to the CRA characteristic required by the customer (S202). As described below, the design device 200 designs the optical performance of the light intensity correction filter 57 to be any value in the range from cosine ⁇ 0.4 to cosine ⁇ 1.5 so that the transmittance increases from the center to the periphery of the light intensity correction filter 57 (S202).
  • the design device 200 transfers the design data of the created light intensity correction filter to the design data storage unit 220 for storage.
  • the design data storage unit 220 may be provided within the design device 200.
  • Figure 25 shows an example of CRA characteristics requested by a customer. For each specified image height, the chief ray incidence angle, upper ray incidence angle, and lower ray incidence angle are determined.
  • Figure 26 shows an example of designed CRA characteristics. Although not shown in Figure 26, design data is obtained for each specified image height, with the principal ray incidence angle, upper ray incidence angle, and lower ray incidence angle determined.
  • FIG. 27 is an explanatory diagram showing the CRA characteristics.
  • a light beam from the right side enters the aspherical lens 581 on the entrance side, is refracted at a predetermined angle, passes through the light intensity correction filter 57, and enters the aspherical lens 58 on the exit side.
  • the light beam refracted at the predetermined angle by the aspherical lens 58 enters the imaging surface of the solid-state imaging element 101.
  • Figure 28 is a graph of CRA characteristics.
  • the graph shows the CRA characteristics required by the customer for the chief ray, upper ray, and lower ray.
  • the horizontal axis is the image height, and the vertical axis is the angle of incidence.
  • Figure 29 is a graph showing various intensity distributions of light beams incident on the solid-state imaging element 101.
  • the horizontal axis is image height.
  • the vertical axis is normalized light beam intensity.
  • the dotted line on the image height axis is a reference line indicating the position where the image height is 100%.
  • the horizontal line extending horizontally from the intensity axis is a reference line indicating the position where the light beam intensity is 100%.
  • Figure 29 shows a number of incident light characteristics, ranging from the characteristic when no light intensity correction filter is used to the characteristic of cosine ⁇ 5.0. In other words, light with various characteristics is incident on the solid-state imaging element 101 according to the customer's wishes.
  • the light transmittance of the light intensity correction filter 57 is set so that the brightness of these different light specifications is as uniform as possible between the center and the periphery.
  • Figure 30 shows an example of a light intensity correction filter 57 used for incident light with a characteristic of cosine ⁇ 0.4.
  • the vertical and horizontal axes and the vertical and horizontal reference lines are the same as described in Figure 29. The same is true for Figures 31 to 34 described below, so the explanation will be omitted below.
  • the dotted line graph in the figure shows the characteristics of the light beam adjusted by a light intensity correction filter that matches the characteristics of cosine ⁇ 0.4 (the optical performance of the light intensity correction filter).
  • the solid line in the figure shows the characteristics of the light beam that enters the solid-state imaging element when a light intensity correction filter is not used. The case when a light intensity correction filter is not used is referred to here as the nominal state.
  • Figure 31 is a graph comparing a light intensity correction filter that follows cosine ⁇ 0.8 with the nominal state.
  • Figure 32 is a graph comparing the light intensity correction filter according to cosine ⁇ 1.5 with the nominal state.
  • Figure 33 is a graph comparing a light intensity correction filter that follows cosine ⁇ 4.0 with the nominal state. It can be seen that when a light beam that follows cosine ⁇ 4.0 is incident, the difference between the center and periphery of the light intensity correction filter becomes large.
  • Figure 34 is a graph comparing the straight condition with the nominal condition.
  • the optical performance of the light intensity correction filter 57 is set to a value in the range of cosine ⁇ 0.4 to cosine ⁇ 1.5 so that the transmittance increases from the center to the periphery. This allows the light beam to be incident on the imaging surface of the solid-state imaging element 101 at an angle requested by the customer, and also reduces the difference in light intensity between the center and periphery. From the results shown in Figures 29 to 34, a person skilled in the art would be able to understand that characteristics not shown in the figures are also feasible.
  • Figure 35 is a cross-sectional view of an optical module 5Q according to a first modified example. Only one lens 58 is mounted on the emission port 512 side of the tube portion 51, and a light intensity correction filter 57Q is provided on the rear side (incident side) of the lens 58.
  • Figure 36 is a cross-sectional view of an optical module 5R according to a second modified example.
  • a first lens 581 and a second lens 58 are arranged on the emission port 512 side of the tube portion 51, spaced apart in the axial direction.
  • the first lens 581 can be called the entrance lens
  • the second lens 58 can be called the exit lens.
  • a light intensity correction filter 57R is provided between the lenses 581 and 58.
  • FIG. 37 is a cross-sectional view of an optical module 5S according to a third modified example. No lens is provided on the emission port 512 side of this optical module 5S.
  • optical modules of each of the modified examples described above can be combined as appropriate with each of the above-mentioned embodiments.
  • the inspection device of Example 1 can be combined with any of the optical modules disclosed in Examples 2-9.
  • Examples 7-9 can be combined with any of the optical modules disclosed in Examples 1-6.
  • the inspection device of Example 10 can be combined with any of the optical modules disclosed in Examples 1-9.
  • An optical module for irradiating a solid-state imaging element with inspection light for inspecting the solid-state imaging element comprising: a tube portion through which light from a light source passes as the inspection light; a diffusion plate provided in the cylindrical portion and configured to diffuse light incident from the light source; an optical module comprising: a light intensity correction filter that is provided on the cylindrical portion and positioned on the exit side of the inspection light relative to the diffusion plate, and that has optical performance that changes the peripheral light ratio of the inspection light irradiated to the solid-state imaging element in order to inspect the solid-state imaging element.
  • An optical module that irradiates a solid-state imaging element with inspection light for inspecting the solid-state imaging element comprising: a tube portion that passes light from a light source as the inspection light; a diffusion plate provided in the tube portion that diffuses the light incident from the light source; and a light intensity correction filter that is provided in the tube portion at a position closer to the emission side of the inspection light than the diffusion plate and has optical performance that changes the marginal light ratio of the inspection light irradiated to the solid-state imaging element for inspection of the solid-state imaging element, wherein the optical performance of the light intensity correction filter is determined based on the optical characteristics of a light beam incident on the solid-state imaging element in a nominal state in which the light intensity correction filter is not used.
  • (Configuration 20) A method for designing an optical module that irradiates a solid-state imaging element with inspection light for inspecting the solid-state imaging element by a design device, the optical module comprising: a tube portion that passes light from a light source as the inspection light; a diffuser plate provided in the tube portion that diffuses light incident from the light source; and a light intensity correction filter that is provided in the tube portion at a position closer to the emission side of the inspection light than the diffuser plate and has optical performance that changes an edge light ratio of the inspection light irradiated to the solid-state imaging element for inspection of the solid-state imaging element, the design device executing a first step of acquiring a chief ray axis angular characteristic required for the solid-state imaging element; a second step of generating design data that determines the optical performance based on the required chief ray axis angular characteristic so that transmittance increases from the center to the periphery of the light intensity correction filter; and a third step of outputting the generated design data.

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  • Testing Of Optical Devices Or Fibers (AREA)

Abstract

L'invention concerne un module optique et un dispositif d'inspection permettant de modifier le rapport d'éclairage périphérique de la lumière d'inspection pour l'inspection d'un élément d'imagerie à semi-conducteurs. Un module optique (5) projette, sur un élément d'imagerie à semi-conducteurs, une lumière d'inspection pour inspecter l'élément d'imagerie à semi-conducteurs, et comprend : une section cylindrique (51) qui laisse passer la lumière provenant d'une source lumineuse en tant que lumière d'inspection ; une plaque de diffusion (54) qui est disposée dans la section cylindrique et qui diffuse la lumière entrante provenant de la source lumineuse ; et un filtre de correction d'éclairage (57) qui est disposé dans la section cylindrique et qui est situé plus loin vers le côté d'émission de lumière d'inspection que la plaque de diffusion, et qui présente des performances optiques permettant de modifier le rapport d'éclairage périphérique de la lumière d'inspection qui est projetée sur l'élément d'imagerie à semi-conducteurs pour l'inspection de celui-ci.
PCT/JP2023/044164 2022-12-13 2023-12-11 Module optique, dispositif d'inspection et procédé de conception de module optique WO2024128175A1 (fr)

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PCT/JP2022/045897 WO2024127516A1 (fr) 2022-12-13 2022-12-13 Module optique et dispositif d'inspection

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JPH0290645A (ja) * 1988-09-28 1990-03-30 Hitachi Ltd 撮像素子の検査方法及びそれに使用する検査装置
JPH0571732U (ja) * 1992-01-10 1993-09-28 株式会社ニコン 照明補助装置
JPH1114501A (ja) * 1997-06-26 1999-01-22 Nikon Corp イメージセンサーの検査方法および検査装置
JPH11248598A (ja) * 1998-03-05 1999-09-17 Nikon Corp イメージセンサユニットの検査方法および検査装置
WO2004053451A1 (fr) * 2002-12-06 2004-06-24 Inter Action Corporation Instrument d'essai pour dispositif imageur transistorise
JP2006234450A (ja) * 2005-02-23 2006-09-07 Yokogawa Electric Corp 光源装置
JP2007107895A (ja) * 2005-10-11 2007-04-26 Yokogawa Electric Corp 光源装置
JP2009244531A (ja) * 2008-03-31 2009-10-22 Konica Minolta Opto Inc 光学素子
JP2013161809A (ja) * 2012-02-01 2013-08-19 Nikon Corp 照明装置、検査装置、および撮像素子の製造方法
JP2017009855A (ja) * 2015-06-24 2017-01-12 デクセリアルズ株式会社 ヘッドアップディスプレイ装置
JP2022145349A (ja) * 2021-03-20 2022-10-04 応用電機株式会社 光学系及び光学テスト装置
JP2022164061A (ja) * 2021-04-15 2022-10-27 株式会社インターアクション 瞳モジュール及び検査装置

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0290645A (ja) * 1988-09-28 1990-03-30 Hitachi Ltd 撮像素子の検査方法及びそれに使用する検査装置
JPH0571732U (ja) * 1992-01-10 1993-09-28 株式会社ニコン 照明補助装置
JPH1114501A (ja) * 1997-06-26 1999-01-22 Nikon Corp イメージセンサーの検査方法および検査装置
JPH11248598A (ja) * 1998-03-05 1999-09-17 Nikon Corp イメージセンサユニットの検査方法および検査装置
WO2004053451A1 (fr) * 2002-12-06 2004-06-24 Inter Action Corporation Instrument d'essai pour dispositif imageur transistorise
JP2006234450A (ja) * 2005-02-23 2006-09-07 Yokogawa Electric Corp 光源装置
JP2007107895A (ja) * 2005-10-11 2007-04-26 Yokogawa Electric Corp 光源装置
JP2009244531A (ja) * 2008-03-31 2009-10-22 Konica Minolta Opto Inc 光学素子
JP2013161809A (ja) * 2012-02-01 2013-08-19 Nikon Corp 照明装置、検査装置、および撮像素子の製造方法
JP2017009855A (ja) * 2015-06-24 2017-01-12 デクセリアルズ株式会社 ヘッドアップディスプレイ装置
JP2022145349A (ja) * 2021-03-20 2022-10-04 応用電機株式会社 光学系及び光学テスト装置
JP2022164061A (ja) * 2021-04-15 2022-10-27 株式会社インターアクション 瞳モジュール及び検査装置

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