WO2024127623A1 - Solder deterioration sensing device - Google Patents

Solder deterioration sensing device Download PDF

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Publication number
WO2024127623A1
WO2024127623A1 PCT/JP2022/046354 JP2022046354W WO2024127623A1 WO 2024127623 A1 WO2024127623 A1 WO 2024127623A1 JP 2022046354 W JP2022046354 W JP 2022046354W WO 2024127623 A1 WO2024127623 A1 WO 2024127623A1
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WO
WIPO (PCT)
Prior art keywords
wiring member
solder
solder connection
detection device
deterioration detection
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Application number
PCT/JP2022/046354
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French (fr)
Japanese (ja)
Inventor
順昭 安藤
大介 越前谷
Original Assignee
三菱電機株式会社
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Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to PCT/JP2022/046354 priority Critical patent/WO2024127623A1/en
Publication of WO2024127623A1 publication Critical patent/WO2024127623A1/en

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  • This disclosure relates to a solder deterioration detection device with a failure prediction structure.
  • a large number of mounted components are soldered to the circuit boards mounted on electrical products. These mounted components are often exposed to stress due to external forces such as heat and vibration. Stress due to these external forces can cause cracks in the solder connections (the parts where the mounted components and the board are soldered together), and the progression of these cracks can cause the solder connections to break. If a break occurs in a solder connection, the electrical product may stop or malfunction unexpectedly, so it is desirable to predict the break before the solder connection breaks. If it were possible to predict the break before the solder connection breaks, it would clarify the timing for inspection or part replacement of the electrical product, allowing the electrical product to be used more efficiently, so there is a need for technology to predict failures in solder connections.
  • Patent Document 1 a first member, which is a sensor element, and a second member, which is a circuit board, are soldered together, and a solder connection is formed in an area where strain is concentrated when thermal stress occurs.
  • the solder connection for detecting deterioration is broken before the solder connection between the circuit board and the mounted component, and failure of the solder connection is predicted based on the change in electrical resistance caused by the break.
  • Patent Document 2 also discloses a configuration in which a dummy component, which is a resistor, is soldered to a circuit board.
  • the detection solder connection which is the solder connection of the dummy component, has at least one stricter condition for vibration, impact, and temperature stress than the solder connection between the circuit board and the mounted component. With this configuration, the detection solder connection is first disconnected, and failure of the solder connection is predicted based on the change in electrical characteristics caused by the disconnection.
  • This disclosure has been made to solve these problems, and aims to provide a solder deterioration detection device that detects deterioration of solder connections caused by thermal stress.
  • the solder deterioration detection device disclosed herein includes a first wiring member having a support leg portion that is fixed at one end to a circuit board to which mounted components are connected by solder and that rises from the circuit board and bends and extends; a second wiring member that is spaced apart from the first wiring member and has a thermally deformed portion that extends in a direction intersecting the direction in which the support leg portion bends and extends, and is made of a material having a linear thermal expansion coefficient greater than that of the first wiring member; an insulating connection portion that is sandwiched between the first wiring member and the second wiring member and that fixes the position of the second wiring member relative to the first wiring member; and a solder connection portion that is sandwiched between the first wiring member and the second wiring member, and in which an interface with the first wiring member and an interface with the second wiring member are formed along a direction intersecting the direction in which the thermally deformed portion extends.
  • the interface between the solder connection portion and the first wiring member and the interface between the solder connection portion and the second wiring member are formed along a direction intersecting the extension direction of the thermally deformed portion of the second wiring member. Therefore, when the temperature of the solder deterioration detection device rises, physical contact with the solder connection portion can be reduced or eliminated, making it possible to accurately detect deterioration of the solder connection portion.
  • 1 is a perspective view showing a circuit board according to a first embodiment of the present disclosure
  • 1 is a top view showing a solder deterioration detection device for a circuit board according to a first embodiment of the present disclosure
  • 1 is a side view showing a solder deterioration detection device for a circuit board according to a first embodiment of the present disclosure
  • 1 is a top view showing thermal deformation during a temperature rise of a solder deterioration detection device for a circuit board according to a first embodiment of the present disclosure
  • 10 is a top view showing another example of a solder deterioration detection device for a circuit board according to the first embodiment of the present disclosure.
  • FIG. 10 is a top view showing another example of a solder deterioration detection device for a circuit board according to the first embodiment of the present disclosure.
  • FIG. 10 is a side view showing an example of another embodiment of the solder deterioration detection device for a circuit board according to the first embodiment of the present disclosure.
  • FIG. 4 is a flowchart showing an operation during failure prediction according to the first embodiment of the present disclosure.
  • 11 is a top view showing a solder deterioration detection device for a circuit board according to a second embodiment of the present disclosure.
  • FIG. 13 is a top view showing a solder deterioration detection device for a circuit board according to a third embodiment of the present disclosure.
  • FIG. 13 is a diagram illustrating a schematic diagram of an electrical circuit of a solder deterioration detection device according to a third embodiment of the present disclosure.
  • FIG. 13 is a top view showing a solder deterioration detection device for a circuit board according to a fourth embodiment of the present disclosure.
  • FIG. 13 is a diagram illustrating a schematic diagram of an electrical circuit of a solder deterioration detection device according to a third embodiment of the present disclosure.
  • FIG. 13 is a top view showing a solder deterioration detection device for a circuit board according to a fourth embodiment of the present disclosure.
  • Fig. 1 is a perspective view showing a circuit board according to a first embodiment of the present disclosure.
  • the directions in this embodiment are defined as the X direction, the Y direction, and the Z direction, which are mutually orthogonal, respectively, for the lateral direction, the depth direction, and the height direction (out-of-plane direction of the circuit board) of the circuit board.
  • the above-mentioned coordinate system is set and the explanation is given, but the X direction, the Y direction, and the Z direction may be set appropriately depending on the arrangement of the solder deterioration detection device.
  • the solder deterioration detection device 100 is provided on a circuit board 2 having a plurality of mounted components 1 soldered to its surface.
  • the solder deterioration detection device 100 includes a first wiring member 3, a second wiring member 4, a solder connection 60, and an insulating connection 70.
  • the solder deterioration detection device 100 also includes a measurement unit 5 that measures the electrical characteristics of the solder connection 60, and a failure prediction unit 6 (not shown) that predicts failure due to breakage or crack growth in the solder connection 60.
  • the mounted components 1 are, for example, packages such as BGA (Ball Grid Array) type or QFP (Quad Flat Package) type, or electronic components such as capacitors, coils, and chip resistors, and may be any electronic components that can be mounted on a board.
  • packages such as BGA (Ball Grid Array) type or QFP (Quad Flat Package) type
  • electronic components such as capacitors, coils, and chip resistors, and may be any electronic components that can be mounted on a board.
  • FIG. 2 is a top view showing a circuit board solder deterioration detection device according to the first embodiment of the present disclosure.
  • FIG. 3 is a side view showing a circuit board solder deterioration detection device according to the first embodiment of the present disclosure.
  • the first wiring member 3 and the second wiring member 4 each have a support leg 31 and a support leg 41, and one end of each of the support legs 31 and the support leg 41 is fixed to the circuit board 2.
  • the support legs 31 and the support legs 41 rise from the circuit board 2, bend midway, and extend in one direction, and are formed in an L-shape when viewed from the side.
  • the second wiring member 4 extends in a direction intersecting the direction in which the support legs 31 and the support legs 41 extend, and has a thermally deformed portion 42 that expands or contracts due to temperature changes.
  • the direction in which the support legs 31 and the support legs 41 extend is described as the X direction
  • the direction in which the thermally deformed portion 42 extends is described as the Y direction, but this is not limited to this.
  • the second wiring member 4 is made of a material with a linear expansion coefficient greater than that of the first wiring member 3.
  • the first wiring member 3 and the second wiring member 4 are provided with the solder connection portion 60 and the insulating connection portion 70 sandwiched therebetween, and are spaced apart from each other in areas other than the solder connection portion 60 and the insulating connection portion 70.
  • the first wiring member 3 and the second wiring member 4 are electrically connected via a solder connection portion 60.
  • the solder connection portion 60 has an interface 601 with the first wiring member 3 and an interface 602 with the second wiring member 4 formed along a direction intersecting the direction in which the thermally deformed portion 42 extends.
  • the interfaces 601 and 602 are parallel to each other.
  • the direction in which the interfaces 601 and 602 are formed is perpendicular to the direction in which the thermally deformed portion 42 extends. This makes it easier for cracks to occur and progress at the interfaces 601 and 602 when the thermally deformed portion 42 expands due to a change in temperature.
  • the solder connection 60 is designed to have a shorter lifespan than the solder connection between the mounted component 1 and the circuit board 2.
  • the solder connection 60 is made of lead-free solder Sn-3Ag-0.5Cu, for example.
  • the solder material is not limited to the above-mentioned material, and may be eutectic solder or other lead-free solder. Also, Ag paste or the like may be used as long as cracks propagate and break along the interface of the connection in the same way as solder, and the solder connection can be designed to have a shorter lifespan than the solder connection between the circuit board 2 and the mounted component 1.
  • the insulating connection part 70 is made of, for example, a non-conductive resin, and connects the first wiring member 3 and the second wiring member 4 while insulating them.
  • the thermal deformation part 42 of the second wiring member 4 is thermally deformed, the insulating connection part 70 fixes the position of the first wiring member 3 relative to the second wiring member 4 in the Y direction.
  • the insulating connection part 70 needs to have a high strength relative to the solder connection part 60, and as long as the insulating connection part 70 does not break before the solder connection part 60 breaks, the insulating connection part 70 may be made of a material different from the above-mentioned.
  • the support legs 31 of the first wiring member 3 and the support legs 41 of the second wiring member 4 are fixed to the circuit board 2 mechanically with screws, bolts, etc. With this configuration, the solder deterioration detection device 100 and the circuit board 2 are not released from the fixation before the solder connection 60 breaks. If the solder deterioration detection device 100 and the circuit board 2 are not released from the fixation before the solder connection 60 breaks, they may be connected with adhesive or solder instead of mechanically.
  • the support legs 31 of the first wiring member 3 and the support legs 41 of the second wiring member 4 are not limited to being L-shaped, and may be curved in shape, and any shape may be used as long as the configuration can be configured to support the solder connection 60 by clamping both ends of the solder connection 60.
  • the first wiring member 3 and the second wiring member 4 are made of, for example, copper (linear expansion coefficient 17.7 ppm) or kovar (linear expansion coefficient 4.8 ppm). As long as the first wiring member 3 and the second wiring member 4 are both conductive and the linear expansion coefficient of the second wiring member 4 is greater than that of the first wiring member 3, they may be made of materials other than those mentioned above, such as conductive resin or a non-conductive material with a metallized layer on the surface to give it conductivity.
  • the solder deterioration detection device 100 is mounted on a circuit board 2 mounted on an inverter, servo motor, etc., and is subject to temperature changes due to the operating state of the device, such as the inverter or servo motor, and the environment in which it is used. For example, when the device is turned on, heat is transferred to the solder deterioration detection device 100 due to heat generation from the electronic component 1 and a rise in temperature in the surrounding devices, causing the temperature to rise. On the other hand, when the device is turned off, the heat generation from the electronic component 1 and the rise in temperature in the surrounding devices stop, and the temperature of the solder deterioration detection device 100 decreases over time. Repeated turning on and off of the device's power causes a temperature cycle to act on the circuit board 2 mounted on the device and the solder deterioration detection device 100.
  • the solder connection portion 60 connecting the first wiring member 3 and the second wiring member 4 is subjected to repeated stress.
  • an alloy layer with the connected material is formed at the interfaces 601 and 602 of the solder connection portion 60.
  • the connected material is copper
  • This alloy layer is about 1 to 3 ⁇ m thick and has a weaker strength than the solder or the base material of copper.
  • the second wiring member 4 is a top view showing thermal deformation of the solder deterioration detection device for a circuit board according to the first embodiment of the present disclosure when the temperature rises.
  • the second wiring member 4 is thermally deformed significantly in the Y direction in which the thermal deformation portion 42 extends.
  • the second wiring member 4 is made of a material with a higher linear expansion coefficient than the first wiring member 3, so the second wiring member 4 is thermally deformed more significantly than the first wiring member 3, that is, the solder connection portion 60 is thermally deformed so as to widen the crack and move away from the first wiring member 3 or the second wiring member 4.
  • solder connection portion 60 cracks are generated and propagated along the interface 601 or interface 602 due to the temperature cycle, and finally break, so that when the temperature of the solder deterioration detection device 100 rises, the physical contact of the solder connection portion 60 can be reduced or eliminated.
  • the solder deterioration detection device 100 uses the measurement unit 5 to measure changes in the electrical characteristics of the solder connection 60, and predicts failure of the solder connection 60 using a method described below.
  • the electrical characteristic to be measured may be impedance instead of DC resistance, or may be the capacitance or inductance value in the case of a capacitor, coil, etc.
  • the solder deterioration detection device 100 is preferably placed in a location with severe temperature cycle conditions, such as near electronic components 1 such as capacitors, coils, and heat generating elements on the circuit board, or in a location on the circuit board 2 where temperature is easily transferred from peripheral devices. If the location of the electronic components 1 and peripheral devices makes it impossible to place the device in a location with severe temperature cycle conditions, a heater or heat generating element may be placed near or in contact with the solder deterioration detection device 100. By synchronizing the temperature change of the heater with the output change of the device, a temperature change can be applied directly to the solder deterioration detection device 100 rather than through heat transfer, improving detection accuracy.
  • severe temperature cycle conditions such as near electronic components 1 such as capacitors, coils, and heat generating elements on the circuit board, or in a location on the circuit board 2 where temperature is easily transferred from peripheral devices. If the location of the electronic components 1 and peripheral devices makes it impossible to place the device in a location with severe temperature cycle conditions, a heater or heat generating element
  • the solder connection 60 of the solder deterioration detection device 100 is manufactured, for example, by laser soldering.
  • the first wiring member 3 and the second wiring member 4 are shaped by cutting or pressing, and the interface 601 with the first wiring member 3 and the interface 602 with the second wiring member 4 are butted together and preheated by irradiating with a laser.
  • solder is supplied while heating to manufacture the solder connection 60.
  • the manufacturing method is not limited to laser soldering, and it is believed that it can also be manufactured by reflow or the like if a jig is used to prevent the interface 601 with the first wiring member 3 and the interface 602 with the second wiring member 4 of the solder connection 60 from shifting position when connected.
  • FIG. 5 is a top view showing another example of a solder deterioration detection device for a circuit board according to the first embodiment of the present disclosure.
  • the shape is not limited to being symmetrical with respect to the X-axis, but may be a rotationally symmetrical shape in which the first wiring member 3 and the second wiring member 4 are the same.
  • FIG. 6 is a top view showing another example of a solder deterioration detection device for a circuit board according to the first embodiment of the present disclosure.
  • the first wiring member 3 and the second wiring member 4 may have an asymmetric shape, and the solder deterioration detection device 100 may have a symmetric shape.
  • FIG. 7 is a side view showing an example of another form of the solder deterioration detection device for a circuit board according to the first embodiment of the present disclosure.
  • the above-mentioned solder deterioration detection device 100 has a structure that spreads in the X and Y directions in the figure, but as shown in FIG. 7, it may have a shape rotated 90 degrees about the X axis.
  • the thermally deformed portion 42 of the second wiring member 4 extends in the Z direction, which is a direction perpendicular to the circuit board 2.
  • the interface 601 of the solder connection portion 60 with the first wiring member 3 and the interface 602 with the second wiring member 4 are formed in the X direction, which is a direction intersecting the Z direction in which the thermally deformed portion 42 extends.
  • FIG. 8 is a flowchart showing the operation during failure prediction according to the first embodiment of the present disclosure.
  • the solder deterioration detection device 100 is connected to a measurement unit 5, which includes a means for measuring an electrical resistance value and a failure prediction unit 6 (not shown) that detects deterioration of the solder connection 60.
  • the measurement unit 5 measures the electrical resistance of the solder connection 60.
  • step S2 the failure prediction unit 6 judges the occurrence of a break or the like when the electrical resistance of the solder connection 60 exceeds a predetermined threshold.
  • the threshold of the electrical resistance is an electrical resistance value that can be set by the failure prediction 31, and the user can set any value in advance.
  • the failure prediction unit 6 can estimate the degree of damage to the solder connection 60 according to the electrical characteristics of the solder deterioration detection device 100 measured by the measurement unit 5 and the threshold of the electrical characteristic database.
  • the degree of damage can be defined, for example, as the ratio between the measured electrical resistance value and the value of the electrical characteristic database. Note that the electrical characteristics of the solder connection 60 and the degree of damage, which is the degree of deterioration of the solder connection 60, are stored in the electrical characteristic database in association with each other, and results derived from experiments, etc. are stored in advance.
  • step S3 the state of the solder connection 60 determined by the failure prediction unit 6 is output. At this time, if the solder connection 60 is broken, a break signal is output to the measurement unit 5.
  • the timing for measuring the electrical resistance value is, for example, when the power is turned on, when there is a large change in temperature, and if the power is turned on continuously, monitoring may be performed at regular intervals.
  • step S4 if a break signal is output, the break signal is displayed as an alarm on a display or the like. With this configuration, the user can know the degree of damage to the solder for which degradation is desired to be detected.
  • the solder deterioration detection device 100 disclosed herein comprises a first wiring member 3, a second wiring member 4, a solder connection portion 60, and an insulating connection portion 70, and an interface 601 between the solder connection portion 60 and the first wiring member 3 and an interface 602 between the solder connection portion 60 and the second wiring member 4 are formed along a direction intersecting the direction in which the thermal deformation portion 42 of the second wiring member 4 extends.
  • the solder deterioration detection device 100 can accurately detect changes in electrical characteristics that become evident by reducing or eliminating physical contact with the solder connection 60, thereby improving the accuracy of detecting solder deterioration. Also, by being equipped with a failure prediction unit 6, the solder deterioration detection device 100 can estimate the degree of damage to the solder connection 60.
  • Embodiment 2 In the second embodiment, the same components as those in the first embodiment of the present disclosure are designated by the same reference numerals, and descriptions of the same or corresponding parts will be omitted.
  • a solder deterioration detection device 100 according to the second embodiment will be described below with reference to the drawings.
  • the solder deterioration detection device 100 according to the second embodiment further includes a third wiring member 8 in addition to the configuration of the first embodiment.
  • FIG. 9 is a top view showing a circuit board solder deterioration detection device according to embodiment 2 of the present disclosure.
  • the third wiring member 8 has a support leg 81, one end of which is fixed to the circuit board 2.
  • the support leg 81 rises from the circuit board 2, bends midway and extends in one direction, and is formed in an L-shape when viewed from the side.
  • the third wiring member 8 is made of a material with a smaller linear thermal expansion coefficient than the second wiring member.
  • the second wiring member 4 has a thermally deformed portion 42 that extends along the Y direction, and is provided between the first wiring member 3 and the third wiring member 8.
  • the first wiring member 3 and the second wiring member 4 are connected via a solder connection portion 60 and an insulating connection portion 70, and are otherwise spaced apart from each other.
  • the second wiring member 4 and the third wiring member 8 are connected via a solder connection portion 61 and an insulating connection portion 71, and are otherwise spaced apart from each other.
  • the solder connection portion 60 connecting the first wiring member 3 and the second wiring member 4 has an interface 601 with the first wiring member 3 and an interface 602 with the second wiring member 4 formed along a direction intersecting the direction in which the thermally deformed portion 42 extends, and the interfaces 601 and 602 are parallel to each other.
  • the solder connection portion 61 connecting the second wiring member 4 and the third wiring member 8 has an interface 611 with the second wiring member 4 and an interface 612 with the third wiring member 8 formed along a direction intersecting the direction in which the thermally deformed portion 42 extends, and the interfaces 611 and 612 are parallel to each other.
  • solder which is the material of the solder connection 60
  • solder connection 60 is known to have a large variation in its lifespan. If the solder deterioration detection device 100 of this embodiment is viewed as an electric circuit, the solder connection 60 and the solder connection 61 are connected in series. If either the solder connection 60 or the solder connection 61 breaks, the solder deterioration detection device 100 will detect a change in the electrical characteristics of either the solder connection 60 or the solder connection 61. In other words, by having multiple solder connections, it is possible to take into account the lifespan variation of the solder connection, and the failure prediction accuracy of the solder connection between the mounted component 1 and the circuit board 2 can be improved compared to the first embodiment.
  • first wiring member 3 and the third wiring member 8 may be made of the same material as long as the material has a smaller linear expansion coefficient than the second wiring member 4.
  • interfaces 601, 602, 611, and 612 are all shown as being parallel to each other, but not all of the interfaces of the solder connection parts need to be parallel to each other, and interfaces 601 and 602, and interfaces 611 and 612 may each be parallel to each other. In that case, however, it is preferable that second wiring member 4 has a thermally deformed portion that extends in a direction intersecting the direction in which interfaces 601 and 602 are formed, and a thermally deformed portion that extends in a direction intersecting the direction in which interfaces 611 and 612 are formed.
  • the interface 601 of the solder connection portion 60 with the first wiring member and the interface 602 with the second wiring member 4 are formed side by side along the Y direction, which is the extension direction of the thermally deformed portion 42 of the second wiring member 4. Therefore, when the temperature of the solder deterioration detection device 100 rises, the thermally deformed portion 42 of the second wiring member 4 extends along the Y direction, and the solder connection portion 60 is thermally deformed so as to move away from the first wiring member 3 or the second wiring member 4. As a result, a gap is created when a crack propagates or after the solder connection portion 60 breaks, which reduces or eliminates physical contact, making it possible to accurately detect deterioration of the solder connection.
  • solder connection portion 61 is provided sandwiched between the second wiring member 4 and the third wiring member 8. Since solder is a material with large variation in characteristics, by providing multiple solder connection portions, it is possible to predict solder deterioration while taking this variation into account.
  • Embodiment 3 In the third embodiment, the same components as those in the first embodiment of the present disclosure are designated by the same reference numerals, and descriptions of the same or corresponding parts will be omitted.
  • a solder deterioration detection device 100 according to the third embodiment will be described below with reference to the drawings.
  • the solder deterioration detection device 100 according to the third embodiment further includes a third wiring member 8 in addition to the configuration of the first embodiment.
  • FIG. 10 is a top view showing a circuit board solder deterioration detection device according to embodiment 3 of the present disclosure.
  • the third wiring member 8 has a support leg 81, one end of which is fixed to the circuit board 2.
  • the support leg 81 rises from the circuit board 2, bends midway and extends in one direction, and is formed in an L-shape when viewed from the side.
  • the third wiring member 8 is made of a material with a smaller linear thermal expansion coefficient than the second wiring member 4.
  • the second wiring member 4 in this embodiment has thermally deformed portions 42A and 42B that each extend along the Y direction, and the thermally deformed portions 42A and 42B are arranged side by side between the first wiring member 3 and the third wiring member 8.
  • the first wiring member 3 and the second wiring member 4 are connected via the solder connection portion 60A and the solder connection portion 60B and the insulating connection portion 70, and are otherwise spaced apart from each other.
  • the second wiring member 4 and the third wiring member 8 are connected via the solder connection portion 61A and the solder connection portion 61B and the insulating connection portion 71, and are otherwise spaced apart from each other.
  • the solder connection portion 60A that connects the first wiring member 3 and the second wiring member 4 has an interface 601A with the first wiring member 3 and an interface 602A with the second wiring member 4 formed along a direction intersecting the direction in which the thermally deformed portion 42A extends, and the interfaces 601A and 602A are parallel to each other.
  • the solder connection portion 60B that connects the first wiring member 3 and the second wiring member 4 at a position different from the solder connection portion 60A has an interface 601B with the first wiring member 3 and an interface 602B with the second wiring member 4 formed along a direction intersecting the direction in which the thermally deformed portion 42A extends, and the interfaces 601B and 602B are parallel to each other.
  • the solder connection portion 61A connecting the second wiring member 4 and the third wiring member 8 has an interface 611A with the second wiring member 4 and an interface 612A with the third wiring member 8 formed along a direction intersecting the extension direction of the thermally deformed portion 42B, and the interfaces 611A and 612A are parallel to each other.
  • the solder connection portion 61B connecting the second wiring member 4 and the third wiring member 8 at a position different from the solder connection portion 61A has an interface 611B with the second wiring member 4 and an interface 612B with the third wiring member 8 formed along a direction intersecting the extension direction of the thermally deformed portion 42B, and the interfaces 611B and 612B are parallel to each other.
  • the four interfaces 601A, 602A, 601B, and 602B of the solder connection are parallel to each other, and the four interfaces 611A, 612A, 611B, and 612B are also parallel to each other.
  • two interfaces for one solder connection are parallel to each other, they do not need to be parallel to the interfaces of other solder connections. In this case, however, it is desirable that the interfaces of each solder connection are formed in a direction that intersects with the direction in which the thermally deformed portion extends.
  • FIG. 11 is a schematic diagram of an electrical circuit of a solder deterioration detection device according to the third embodiment of the present disclosure.
  • the solder connection portion 60A and the solder connection portion 60B that connect the first wiring member 3 and the second wiring member 4 are connected in parallel.
  • the solder connection portion 61A and the solder connection portion 61B that connect the second wiring member 4 and the third wiring member 8 are also connected in parallel.
  • the solder connection portion 60A and the solder connection portion 60B, and the solder connection portion 61A and the solder connection portion 61B are connected in series. If two or more of the four solder connection portions 60A, 60B, 61A, and 61B are broken, the solder deterioration detection device 100 will detect a change in the electrical characteristics of any of the four solder connection portions.
  • solder connection parts 60A and 60B connect the first wiring member 3 and the second wiring member 4
  • solder connection parts 61A and 61B connect the second wiring member 4 and the third wiring member 8
  • the number of solder connection parts connecting the wiring members is not limited to two, and more than one may be provided.
  • the interface 601A and interface 601B with the first wiring member 3, and the interface 602A and interface 602B with the second wiring member 4 are formed along a direction intersecting the extension direction of the thermally deformed portion 42A of the second wiring member 4. Therefore, when the temperature of the solder deterioration detection device 100 rises, the physical contact between the solder connection portion 60A and the solder connection portion 60B can be reduced or eliminated, making it possible to accurately detect deterioration of the solder connection portion.
  • a third wiring member 8 is further provided, and has solder connection portions 61A and 61B sandwiched between the second wiring member 4 and the third wiring member 8, and interfaces 611A and 611 with the second wiring member 4 and interfaces 612A and 612B with the third wiring member 8 are formed along a direction intersecting the extension direction of the thermally deformed portion 42B of the second wiring member 4.
  • Embodiment 4 the same components as those in the first embodiment of the present disclosure are designated by the same reference numerals, and descriptions of the same or corresponding parts will be omitted.
  • a solder deterioration detection device 100 according to the fourth embodiment will be described with reference to the drawings.
  • FIG. 12 is a top view showing a circuit board according to embodiment 4 of the present disclosure.
  • This embodiment is characterized in that the solder connection portion 60 of embodiment 1 has cutout portions 9A and 9B.
  • the solder deterioration detection device 100 includes a first wiring member 3, a second wiring member 4, a solder connection portion 60, and an insulating connection portion 70.
  • the solder connection portion 60 has an interface 601 with the first wiring member 3 and an interface 602 with the second wiring member 4 formed along a direction intersecting the extension direction of the thermally deformed portion 42 of the second wiring member 4.
  • the solder connection portion 60 has a notch portion 9A at both ends of the interface 601 with the first wiring member 3.
  • the solder connection portion 60 also has a notch portion 9B at both ends of the interface 602 with the second wiring member 4.
  • the interface 601 of the solder connection portion 60 with the first wiring member 3 and the interface 602 with the second wiring member 4 are formed along a direction intersecting the extension direction of the thermally deformed portion 42 of the second wiring member 4. Therefore, when the temperature of the solder deterioration detection device 100 rises, the physical contact of the solder connection portion 60 can be reduced or eliminated, making it possible to accurately detect deterioration of the solder connection portion.
  • the solder connection 60 is configured to have a notch at at least one of the interface 601 with the first wiring member 3 and the interface 602 with the second wiring member.
  • the tip of the notch becomes a stress concentration area, so that when a temperature cycle is applied, the stress generated in the solder connection 60 can be increased, and the propagation distance of cracks in the solder connection 60 can be shortened, resulting in a structure that is easier to break.
  • it is easier to set a shorter life than the solder connection between the circuit board 2 and the mounted component 1, so there is an effect that a structure can be easily designed to have a desired life.
  • FIG. 12 an example is shown in which the interface 601 with the first wiring member 3 and the interface 602 with the first wiring member 3 have the notches 9A and 9B at both ends, respectively, but the notches 9A and 9B may be provided at one end.
  • the arrangement of the notches 9A and 9B is not limited to the X direction, but may be provided only in the Z direction or on the entire circumference. Also, only the notch 9A on the second wiring member 4 side may be provided, or only the notch 9B on the first wiring member 3 side may be provided. It is sufficient that the solder connection 60 is configured to have a lower strength than the solder connection between the circuit board 2 and the mounted component 1.
  • FIG. 12 is described based on the first embodiment, it is not limited to the first embodiment, and can also be applied to structures such as the second and third embodiments having multiple solder connections.

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Abstract

Provided is a solder deterioration sensing device that can sense deterioration of a solder connection section caused by thermal stress, due to being provided with: a first wiring member (3) that has one end fixed to a circuit board to which a mounted component is connected by solder, that rises from the circuit board and comprises a support leg section which extends in a curve; a second wiring member (4) that is disposed separately from the first wiring member, that comprises a thermally deforming section (42) which extends in a direction that intersects the direction in which the first wiring member extends in a curve, and that comprises a material with a greater coefficient of linear thermal expansion than the first wiring member; an insulating connection section (70) that fixes the position of the second wiring member relative to the first wiring member; and a solder connection section (60), in which formed, along a direction that intersects with the direction in which the thermally deforming section extends, are an interface with the first wiring member and an interface with the second wiring member.

Description

はんだ劣化検知装置Solder deterioration detection device
　本開示は、故障予測構造を有するはんだ劣化検知装置に関するものである。 This disclosure relates to a solder deterioration detection device with a failure prediction structure.
　電気製品に搭載されている回路基板には多数の実装部品がはんだで接続されている。これらの実装部品は、外部からの熱や振動等の外力によるストレスにさらされる機会が多い。これらの外力によるストレスは、はんだ接続部（実装部品と基板とがはんだ接続された部分）にき裂を発生させ、そのき裂の進展によりはんだ接続部を断線させる場合がある。はんだ接続部に断線が発生すると、予期せぬ時に電気製品が停止・誤作動などしてしまうため、はんだ接続部の断線が発生する前の段階でその破断を予測することが望ましい。はんだ接続部の断線が発生する前の段階でその破断を予測することできれば、電気製品の点検や部品交換の時期を明確化し効率良く電気製品を使用できるため、はんだ接続部の故障予測を行う技術が必要とされている。 A large number of mounted components are soldered to the circuit boards mounted on electrical products. These mounted components are often exposed to stress due to external forces such as heat and vibration. Stress due to these external forces can cause cracks in the solder connections (the parts where the mounted components and the board are soldered together), and the progression of these cracks can cause the solder connections to break. If a break occurs in a solder connection, the electrical product may stop or malfunction unexpectedly, so it is desirable to predict the break before the solder connection breaks. If it were possible to predict the break before the solder connection breaks, it would clarify the timing for inspection or part replacement of the electrical product, allowing the electrical product to be used more efficiently, so there is a need for technology to predict failures in solder connections.
　例えば、特許文献１では、センサー素子である第１部材と回路基板の第２部材をはんだ接続し、熱ストレスが生じた際にひずみが集中する領域にはんだ接続部を形成している。この構成により、回路基板と実装部品とのはんだ接続部よりも劣化検知用のはんだ接続部を先に断線させ、その断線により生じた電気抵抗の変化に基づき、はんだ接続部の故障予測を行っている。 For example, in Patent Document 1, a first member, which is a sensor element, and a second member, which is a circuit board, are soldered together, and a solder connection is formed in an area where strain is concentrated when thermal stress occurs. With this configuration, the solder connection for detecting deterioration is broken before the solder connection between the circuit board and the mounted component, and failure of the solder connection is predicted based on the change in electrical resistance caused by the break.
　また、特許文献２では、抵抗器であるダミー部品を回路基板にはんだ付けした構成が開示されている。ダミー部品のはんだ接続部である検知用のはんだ接続部は、振動、衝撃及び温度によるストレスに対して少なくとも１つの条件を回路基板と実装部品のはんだ接続部よりも厳しい条件としている。この構成により、検知用はんだ接続部を先に断線させ、その断線により生じた電気的特性の変化に基づき、はんだ接続部の故障予測を行っている。 Patent Document 2 also discloses a configuration in which a dummy component, which is a resistor, is soldered to a circuit board. The detection solder connection, which is the solder connection of the dummy component, has at least one stricter condition for vibration, impact, and temperature stress than the solder connection between the circuit board and the mounted component. With this configuration, the detection solder connection is first disconnected, and failure of the solder connection is predicted based on the change in electrical characteristics caused by the disconnection.
特開２０１３―１３０５１９号公報JP 2013-130519 A 特開２００５―１０９０８４号公報JP 2005-109084 A
　このようなはんだ劣化検知装置にあっては、電気的特性の変化を計測することで、検知用のはんだ接続部の断線を検知し、製品機能が故障する前に回路基板と実装部品とのはんだ接続部の寿命を検出する方法が提案されている。しかし、検知用のはんだ接続部にき裂が進展していても物理的に接触していれば、電気的特性の変化が表れにくく、はんだ接続部の劣化を正確に検知できないという課題があった。 In this type of solder deterioration detection device, a method has been proposed in which a break in the detection solder connection is detected by measuring changes in electrical characteristics, and the lifespan of the solder connection between the circuit board and the mounted component is detected before the product functions fail. However, there was an issue that even if a crack has developed in the detection solder connection, if there is physical contact, changes in electrical characteristics are unlikely to appear, and deterioration of the solder connection cannot be accurately detected.
　本開示は、このような課題を解決するためになされたもので、熱ストレスに起因するはんだ接続部の劣化を検知するはんだ劣化検知装置を提供することを目的としている。 This disclosure has been made to solve these problems, and aims to provide a solder deterioration detection device that detects deterioration of solder connections caused by thermal stress.
　本開示に係るはんだ劣化検知装置は、実装部品がはんだで接続された回路基板に一端が固定されて回路基板から立ち上がり、屈曲して延伸する支持脚部を有する第１配線部材と、第１配線部材と離間して設けられ、支持脚部が屈曲して延伸する方向と交差する方向に延伸する熱変形部を有し、第１配線部材よりも線熱膨張係数が大きい材料からなる第２配線部材と、第１配線部材と第２配線部材との間に挟まれて設けられ、第１配線部材に対する第２配線部材の位置を固定する絶縁接続部と、第１配線部材と第２配線部材との間に挟まれて設けられ、熱変形部が延伸する方向と交差する方向に沿って、第１配線部材との界面及び第２配線部材との界面が形成されたはんだ接続部とを備える。 The solder deterioration detection device disclosed herein includes a first wiring member having a support leg portion that is fixed at one end to a circuit board to which mounted components are connected by solder and that rises from the circuit board and bends and extends; a second wiring member that is spaced apart from the first wiring member and has a thermally deformed portion that extends in a direction intersecting the direction in which the support leg portion bends and extends, and is made of a material having a linear thermal expansion coefficient greater than that of the first wiring member; an insulating connection portion that is sandwiched between the first wiring member and the second wiring member and that fixes the position of the second wiring member relative to the first wiring member; and a solder connection portion that is sandwiched between the first wiring member and the second wiring member, and in which an interface with the first wiring member and an interface with the second wiring member are formed along a direction intersecting the direction in which the thermally deformed portion extends.
　本開示に係るはんだ劣化検知装置は、第２配線部材の熱変形部の延伸する方向と交差する方向に沿って、はんだ接続部の第１配線部材との界面及び第２配線部材との界面が形成されているため、はんだ劣化検知装置が温度上昇した場合、はんだ接続部の物理的接触を減らす又はなくすことができ、はんだ接続部の劣化を正確に検知することが可能となる。 In the solder deterioration detection device disclosed herein, the interface between the solder connection portion and the first wiring member and the interface between the solder connection portion and the second wiring member are formed along a direction intersecting the extension direction of the thermally deformed portion of the second wiring member. Therefore, when the temperature of the solder deterioration detection device rises, physical contact with the solder connection portion can be reduced or eliminated, making it possible to accurately detect deterioration of the solder connection portion.
本開示の実施の形態１に係る回路基板を示す斜視図である。1 is a perspective view showing a circuit board according to a first embodiment of the present disclosure; 本開示の実施の形態１に係る回路基板のはんだ劣化検知装置を示す上面図である。1 is a top view showing a solder deterioration detection device for a circuit board according to a first embodiment of the present disclosure; 本開示の実施の形態１に係る回路基板のはんだ劣化検知装置を示す側面図である。1 is a side view showing a solder deterioration detection device for a circuit board according to a first embodiment of the present disclosure; 本開示の実施の形態１に係る回路基板のはんだ劣化検知装置の温度上昇時の熱変形を示す上面図である。1 is a top view showing thermal deformation during a temperature rise of a solder deterioration detection device for a circuit board according to a first embodiment of the present disclosure; 本開示の実施の形態１に係る回路基板のはんだ劣化検知装置の別の形態の例を示す上面図である。10 is a top view showing another example of a solder deterioration detection device for a circuit board according to the first embodiment of the present disclosure. FIG. 本開示の実施の形態１に係る回路基板のはんだ劣化検知装置の別の形態の例を示す上面図である。10 is a top view showing another example of a solder deterioration detection device for a circuit board according to the first embodiment of the present disclosure. FIG. 本開示の実施の形態１に係る回路基板のはんだ劣化検知装置の別の形態の例を示す側面図である。10 is a side view showing an example of another embodiment of the solder deterioration detection device for a circuit board according to the first embodiment of the present disclosure. FIG. 本開示の実施の形態１に係る故障予測の際の動作を示すフローチャートである。4 is a flowchart showing an operation during failure prediction according to the first embodiment of the present disclosure. 本開示の実施の形態２に係る回路基板のはんだ劣化検知装置を示す上面図である。11 is a top view showing a solder deterioration detection device for a circuit board according to a second embodiment of the present disclosure. FIG. 本開示の実施の形態３に係る回路基板のはんだ劣化検知装置を示す上面図である。13 is a top view showing a solder deterioration detection device for a circuit board according to a third embodiment of the present disclosure. FIG. 本開示の実施の形態３に係るはんだ劣化検知装置の電気回路を模式的に示した図である。13 is a diagram illustrating a schematic diagram of an electrical circuit of a solder deterioration detection device according to a third embodiment of the present disclosure. FIG. 本開示の実施の形態４に係る回路基板のはんだ劣化検知装置を示す上面図である。13 is a top view showing a solder deterioration detection device for a circuit board according to a fourth embodiment of the present disclosure. FIG.
実施の形態１．
　図１は本開示の実施の形態１に係る回路基板を示す斜視図である。図１に示すように、本実施の形態における方向は、回路基板の横方向、奥行方向及び高さ方向（回路基板の面外方向）を、それぞれ互いに直交するＸ方向、Ｙ方向及びＺ方向、と定義する。なお、説明の便宜上、上述のような座標系を設定して説明を行ったが、はんだ劣化検知装置の配置によりＸ方向、Ｙ方向及びＺ方向を適宜設定してもよい。 Embodiment 1.
Fig. 1 is a perspective view showing a circuit board according to a first embodiment of the present disclosure. As shown in Fig. 1, the directions in this embodiment are defined as the X direction, the Y direction, and the Z direction, which are mutually orthogonal, respectively, for the lateral direction, the depth direction, and the height direction (out-of-plane direction of the circuit board) of the circuit board. For convenience of explanation, the above-mentioned coordinate system is set and the explanation is given, but the X direction, the Y direction, and the Z direction may be set appropriately depending on the arrangement of the solder deterioration detection device.
　図１に示すように、はんだ劣化検知装置１００は、表面に複数の実装部品１がはんだ付けされている回路基板２上に設けられる。はんだ劣化検知装置１００は、第１配線部材３と、第２配線部材４と、はんだ接続部６０と、絶縁接続部７０を備える。また、はんだ劣化検知装置１００は、はんだ接続部６０の電気的特性を測定する測定部５と、はんだ接続部６０の破断又はき裂の進展による故障を予測する故障予測部６（図示せず）を備える。ここで、実装部品１は、例えばＢＧＡ（Ｂａｌｌ　Ｇｒｉｄ　Ａｒｒａｙ）型やＱＦＰ（Ｑｕａｄ　Ｆｌａｔ　Ｐａｃｋａｇｅ）型といわれるパッケージ、又はコンデンサ、コイル、チップ抵抗等の電子部品であり、基板上に実装可能な電子部品であればよい。 As shown in FIG. 1, the solder deterioration detection device 100 is provided on a circuit board 2 having a plurality of mounted components 1 soldered to its surface. The solder deterioration detection device 100 includes a first wiring member 3, a second wiring member 4, a solder connection 60, and an insulating connection 70. The solder deterioration detection device 100 also includes a measurement unit 5 that measures the electrical characteristics of the solder connection 60, and a failure prediction unit 6 (not shown) that predicts failure due to breakage or crack growth in the solder connection 60. Here, the mounted components 1 are, for example, packages such as BGA (Ball Grid Array) type or QFP (Quad Flat Package) type, or electronic components such as capacitors, coils, and chip resistors, and may be any electronic components that can be mounted on a board.
　図２は、本開示の実施の形態１に係る回路基板のはんだ劣化検知装置を示す上面図である。図３は、本開示の実施の形態１に係る回路基板のはんだ劣化検知装置を示す側面図である。図２及び図３に示すように、第１配線部材３及び第２配線部材４はそれぞれ支持脚部３１及び支持脚部４１を有し、それぞれの支持脚部３１及び支持脚部４１の一端が回路基板２に固定される。支持脚部３１及び支持脚部４１は、回路基板２から立ち上がり、途中で屈曲して一方向に延伸し、側面からみると、Ｌ字型に形成されている。第２配線部材４は、支持脚部３１及び支持脚部４１が延伸する方向と交差する方向に延伸し、温度変化によって膨張又は収縮する熱変形部４２を有している。以下では、一例として、支持脚部３１及び支持脚部４１が延伸する方向をＸ方向、熱変形部４２が延伸する方向をＹ方向として説明するが、これに限定されるものではない。 2 is a top view showing a circuit board solder deterioration detection device according to the first embodiment of the present disclosure. FIG. 3 is a side view showing a circuit board solder deterioration detection device according to the first embodiment of the present disclosure. As shown in FIGS. 2 and 3, the first wiring member 3 and the second wiring member 4 each have a support leg 31 and a support leg 41, and one end of each of the support legs 31 and the support leg 41 is fixed to the circuit board 2. The support legs 31 and the support legs 41 rise from the circuit board 2, bend midway, and extend in one direction, and are formed in an L-shape when viewed from the side. The second wiring member 4 extends in a direction intersecting the direction in which the support legs 31 and the support legs 41 extend, and has a thermally deformed portion 42 that expands or contracts due to temperature changes. In the following, as an example, the direction in which the support legs 31 and the support legs 41 extend is described as the X direction, and the direction in which the thermally deformed portion 42 extends is described as the Y direction, but this is not limited to this.
　第２配線部材４は第１配線部材３よりも線膨張係数が大きい材料から構成される。また第１配線部材３と第２配線部材４は、はんだ接続部６０および絶縁接続部７０が間に挟まれて設けられ、はんだ接続部６０及び絶縁接続部７０以外の部分においては、互いに離間している。 The second wiring member 4 is made of a material with a linear expansion coefficient greater than that of the first wiring member 3. The first wiring member 3 and the second wiring member 4 are provided with the solder connection portion 60 and the insulating connection portion 70 sandwiched therebetween, and are spaced apart from each other in areas other than the solder connection portion 60 and the insulating connection portion 70.
　第１配線部材３と第２配線部材４は、はんだ接続部６０を介して電気的に接続される。はんだ接続部６０は、熱変形部４２が延伸する方向と交差する方向に沿って、第１配線部材３との界面６０１及び第２配線部材４との界面６０２が形成されている。界面６０１と界面６０２は、互いに平行関係にある。ここで、界面６０１及び界面６０２が形成される方向は、熱変形部４２が延伸する方向に直交する方向であることが好ましい。これにより、熱変形部４２が温度変化によって膨張した際、界面６０１及び６０２にき裂が発生及び進展しやすくなる。 The first wiring member 3 and the second wiring member 4 are electrically connected via a solder connection portion 60. The solder connection portion 60 has an interface 601 with the first wiring member 3 and an interface 602 with the second wiring member 4 formed along a direction intersecting the direction in which the thermally deformed portion 42 extends. The interfaces 601 and 602 are parallel to each other. Here, it is preferable that the direction in which the interfaces 601 and 602 are formed is perpendicular to the direction in which the thermally deformed portion 42 extends. This makes it easier for cracks to occur and progress at the interfaces 601 and 602 when the thermally deformed portion 42 expands due to a change in temperature.
　はんだ接続部６０は、実装部品１と回路基板２のはんだ接続部よりも寿命が短くなるように設計する。はんだ接続部６０は、例えば鉛フリーはんだＳｎ－３Ａｇ－０．５Ｃｕで構成される。はんだ材は上述の材料に限定されるものでなく、共晶はんだや、他の鉛フリーはんだであってもよい。又、はんだと同様に接続部の界面に沿ってき裂が進展・破断し、加えて、回路基板２と実装部品１とのはんだ接続部よりも寿命を短く設計できるのであれば、Ａｇペースト等であってもよい。 The solder connection 60 is designed to have a shorter lifespan than the solder connection between the mounted component 1 and the circuit board 2. The solder connection 60 is made of lead-free solder Sn-3Ag-0.5Cu, for example. The solder material is not limited to the above-mentioned material, and may be eutectic solder or other lead-free solder. Also, Ag paste or the like may be used as long as cracks propagate and break along the interface of the connection in the same way as solder, and the solder connection can be designed to have a shorter lifespan than the solder connection between the circuit board 2 and the mounted component 1.
　絶縁接続部７０は、例えば非導電性樹脂で構成され、第１配線部材３及び第２配線部材４を絶縁したうえで接続する。絶縁接続部７０は、第２配線部材４の熱変形部４２が熱変形した場合に、Ｙ方向における第２配線部材４に対する第１配線部材３の位置を固定する。絶縁接続部７０は、はんだ接続部６０に対して強度が高いことが必要であり、はんだ接続部６０が破断する前に絶縁接続部７０が破断しないのであれば、絶縁接続部７０は上述したものとは異なる部材で構成されていてもよい。 The insulating connection part 70 is made of, for example, a non-conductive resin, and connects the first wiring member 3 and the second wiring member 4 while insulating them. When the thermal deformation part 42 of the second wiring member 4 is thermally deformed, the insulating connection part 70 fixes the position of the first wiring member 3 relative to the second wiring member 4 in the Y direction. The insulating connection part 70 needs to have a high strength relative to the solder connection part 60, and as long as the insulating connection part 70 does not break before the solder connection part 60 breaks, the insulating connection part 70 may be made of a material different from the above-mentioned.
　第１配線部材３の支持脚部３１と回路基板２との固定及び第２配線部材４の支持脚部４１と回路基板２との固定は、ネジ、ボルト等で機械的に行われる。この構成により、はんだ接続部６０が破断する前に、はんだ劣化検知装置１００と回路基板２との固定が解除されない。はんだ接続部６０が破断する前に、はんだ劣化検知装置１００と回路基板２との固定が解除されないのであれば、機械的な接続ではなく、接着剤やはんだ接続であってもよい。なお、第１配線部材３の支持脚部３１及び第２配線部材４の支持脚部４１は、Ｌ字型に限らず、湾曲した形状でもよく、はんだ接続部６０の両端を挟み込むことで支持する構成とすることができれば、その形状はいずれでもよい。 The support legs 31 of the first wiring member 3 and the support legs 41 of the second wiring member 4 are fixed to the circuit board 2 mechanically with screws, bolts, etc. With this configuration, the solder deterioration detection device 100 and the circuit board 2 are not released from the fixation before the solder connection 60 breaks. If the solder deterioration detection device 100 and the circuit board 2 are not released from the fixation before the solder connection 60 breaks, they may be connected with adhesive or solder instead of mechanically. Note that the support legs 31 of the first wiring member 3 and the support legs 41 of the second wiring member 4 are not limited to being L-shaped, and may be curved in shape, and any shape may be used as long as the configuration can be configured to support the solder connection 60 by clamping both ends of the solder connection 60.
　第１配線部材３及び第２配線部材４は、例えば銅（線膨張係数１７．７ｐｐｍ）やコバール（線膨張係数４．８ｐｐｍ）で構成される。第１配線部材３及び第２配線部材４はともに導電性を有し、第１配線部材３に比べて第２配線部材４の線膨張係数が大きい構成であれば、上述したものとは異なる部材で構成されていてもよく、導電性樹脂や表面にメタライズ層を有し導電性を持たせた非導電性材料等でもよい。 The first wiring member 3 and the second wiring member 4 are made of, for example, copper (linear expansion coefficient 17.7 ppm) or kovar (linear expansion coefficient 4.8 ppm). As long as the first wiring member 3 and the second wiring member 4 are both conductive and the linear expansion coefficient of the second wiring member 4 is greater than that of the first wiring member 3, they may be made of materials other than those mentioned above, such as conductive resin or a non-conductive material with a metallized layer on the surface to give it conductivity.
　はんだ劣化検知装置１００は、インバーターやサーボモーター等に搭載される回路基板２上に設けられ、インバーターやサーボモーター等の機器の動作状態、及び、使用環境に起因した温度変化をすることになる。例えば、機器の電源がＯＮになると、電子部品１の発熱や、周辺機器の温度上昇により、はんだ劣化検知装置１００にも熱が伝わり、温度が上昇する。一方で機器の電源がＯＦＦになると、電子部品１の発熱や、周辺機器の温度上昇が止まり、時間経過に伴ってはんだ劣化検知装置１００の温度が低下する。機器の電源のＯＮとＯＦＦがくりかえされることにより、機器に搭載される回路基板２及びはんだ劣化検知装置１００に温度サイクルが作用することになる。 The solder deterioration detection device 100 is mounted on a circuit board 2 mounted on an inverter, servo motor, etc., and is subject to temperature changes due to the operating state of the device, such as the inverter or servo motor, and the environment in which it is used. For example, when the device is turned on, heat is transferred to the solder deterioration detection device 100 due to heat generation from the electronic component 1 and a rise in temperature in the surrounding devices, causing the temperature to rise. On the other hand, when the device is turned off, the heat generation from the electronic component 1 and the rise in temperature in the surrounding devices stop, and the temperature of the solder deterioration detection device 100 decreases over time. Repeated turning on and off of the device's power causes a temperature cycle to act on the circuit board 2 mounted on the device and the solder deterioration detection device 100.
　はんだ劣化検知装置１００に温度サイクルが作用すると、第１配線部材３と第２配線部材４は線膨張係数が異なるので、第１配線部材３と第２配線部材４を接続するはんだ接続部６０は繰り返し応力を受けることになる。一般に、金属材料をはんだで接続する場合、はんだ接続部６０の界面６０１、６０２には被接続材料との合金層が形成されることが知られている。例えば被接続材料が銅の場合は、銅とはんだの界面にはＣｕ３Ｓｎといった錫と銅の合金層が形成される。この合金層は１～３μｍほどの厚さであり、はんだや銅の母材に比べて強度が弱い。はんだ劣化検知装置１００に温度サイクルが作用し、はんだ接続部６０に繰り返し応力が作用すると、この合金層に沿ってき裂が発生及び進展し、最終的に破断することになる。 When the solder deterioration detection device 100 is subjected to a temperature cycle, the first wiring member 3 and the second wiring member 4 have different linear expansion coefficients, so the solder connection portion 60 connecting the first wiring member 3 and the second wiring member 4 is subjected to repeated stress. It is generally known that when connecting metal materials with solder, an alloy layer with the connected material is formed at the interfaces 601 and 602 of the solder connection portion 60. For example, when the connected material is copper, an alloy layer of tin and copper, such as Cu 3 Sn, is formed at the interface between the copper and the solder. This alloy layer is about 1 to 3 μm thick and has a weaker strength than the solder or the base material of copper. When the solder deterioration detection device 100 is subjected to a temperature cycle and repeated stress is applied to the solder connection portion 60, cracks are generated and propagate along this alloy layer, and the solder connection portion 60 is finally broken.
　図４は、本開示の実施の形態１に係る回路基板のはんだ劣化検知装置の温度上昇時の熱変形を示す上面図である。図４に示すように、はんだ劣化検知装置１００が温度上昇した場合、第２配線部材４は熱変形部４２の延伸するＹ方向に大きく熱変形する。絶縁接続部７０を基準とすると、第２配線部材４は、第１配線部材３よりも線膨張係数が大きい材料で構成されているため、第２配線部材４は第１配線部材３に比べて、より大きく熱変形する、つまり、はんだ接続部６０はき裂を広げて第１配線部材３又は第２配線部材４から離れるように熱変形することになる。はんだ接続部６０は温度サイクルによって、その界面６０１又は界面６０２に沿ってき裂が発生及び進展し、最終的に破断するため、はんだ劣化検知装置１００が温度上昇すると、はんだ接続部６０の物理的接触の減少又はなくすことができる。 4 is a top view showing thermal deformation of the solder deterioration detection device for a circuit board according to the first embodiment of the present disclosure when the temperature rises. As shown in FIG. 4, when the temperature of the solder deterioration detection device 100 rises, the second wiring member 4 is thermally deformed significantly in the Y direction in which the thermal deformation portion 42 extends. With the insulating connection portion 70 as a reference, the second wiring member 4 is made of a material with a higher linear expansion coefficient than the first wiring member 3, so the second wiring member 4 is thermally deformed more significantly than the first wiring member 3, that is, the solder connection portion 60 is thermally deformed so as to widen the crack and move away from the first wiring member 3 or the second wiring member 4. In the solder connection portion 60, cracks are generated and propagated along the interface 601 or interface 602 due to the temperature cycle, and finally break, so that when the temperature of the solder deterioration detection device 100 rises, the physical contact of the solder connection portion 60 can be reduced or eliminated.
　はんだ劣化検知装置１００では、はんだ接続部６０における電気的特性の変化を測定部５で測定することで、後述する方法により、はんだ接続部６０の故障予測を行う。測定する電気的特性は、直流抵抗値の代わりにインピーダンス等でもよく、コンデンサ、コイル等であればキャパシタ、又はインダクタンスの値であってもよい。 The solder deterioration detection device 100 uses the measurement unit 5 to measure changes in the electrical characteristics of the solder connection 60, and predicts failure of the solder connection 60 using a method described below. The electrical characteristic to be measured may be impedance instead of DC resistance, or may be the capacitance or inductance value in the case of a capacitor, coil, etc.
　はんだ劣化検知装置１００は、回路基板上のコンデンサやコイル、発熱素子といった電子部品１の近傍や、回路基板２の周辺機器からの温度が伝わりやすい箇所等の温度サイクル条件の厳しい箇所に配置されるのが望ましい。電子部品１や周辺機器の配置により温度サイクル条件の厳しい箇所に配置できないのであれば、ヒータや発熱素子等をはんだ劣化検知装置１００の近傍又ははんだ劣化検知装置１００に接触させた構成であってもよい。ヒータの温度変化を機器の出力変化と同期させることで、熱の伝わりではなく、はんだ劣化検知装置１００に直接温度変化を与えることができるので、検知精度が向上する。 The solder deterioration detection device 100 is preferably placed in a location with severe temperature cycle conditions, such as near electronic components 1 such as capacitors, coils, and heat generating elements on the circuit board, or in a location on the circuit board 2 where temperature is easily transferred from peripheral devices. If the location of the electronic components 1 and peripheral devices makes it impossible to place the device in a location with severe temperature cycle conditions, a heater or heat generating element may be placed near or in contact with the solder deterioration detection device 100. By synchronizing the temperature change of the heater with the output change of the device, a temperature change can be applied directly to the solder deterioration detection device 100 rather than through heat transfer, improving detection accuracy.
　はんだ劣化検知装置１００のはんだ接続部６０は、例えばレーザーはんだ付けによって製造される。まず切削加工やプレス加工により、第１配線部材３及び第２配線部材４の形を成形し、第１配線部材３との界面６０１及び第２配線部材４との界面６０２を突き合せた状態でレーザーを照射し予熱する。その後、はんだを供給しながら加熱し、はんだ接続部６０を製造する。製造方法はレーザーはんだ付けに限定されるものではなく、はんだ接続部６０の第１配線部材３との界面６０１及び第２配線部材４との界面６０２が接続時に位置ずれ等を起こさないように治具を用いるのであればリフロー等でも製造可能と考える。 The solder connection 60 of the solder deterioration detection device 100 is manufactured, for example, by laser soldering. First, the first wiring member 3 and the second wiring member 4 are shaped by cutting or pressing, and the interface 601 with the first wiring member 3 and the interface 602 with the second wiring member 4 are butted together and preheated by irradiating with a laser. Then, solder is supplied while heating to manufacture the solder connection 60. The manufacturing method is not limited to laser soldering, and it is believed that it can also be manufactured by reflow or the like if a jig is used to prevent the interface 601 with the first wiring member 3 and the interface 602 with the second wiring member 4 of the solder connection 60 from shifting position when connected.
　図５は、本開示の実施の形態１に係る回路基板のはんだ劣化検知装置の別の形態の例を示す上面図である。図５に示すように、Ｘ軸に対して対称な形状に限らず、第１配線部材３と第２配線部材４が同じである回転対称な形状であってもよい。 FIG. 5 is a top view showing another example of a solder deterioration detection device for a circuit board according to the first embodiment of the present disclosure. As shown in FIG. 5, the shape is not limited to being symmetrical with respect to the X-axis, but may be a rotationally symmetrical shape in which the first wiring member 3 and the second wiring member 4 are the same.
　また、図６は、本開示の実施の形態１に係る回路基板のはんだ劣化検知装置の別の形態の例を示す上面図である。図６に示すように、第１配線部材３と第２配線部材４が非対称な形状であり、はんだ劣化検知装置１００として対称な形状であってもよい。 FIG. 6 is a top view showing another example of a solder deterioration detection device for a circuit board according to the first embodiment of the present disclosure. As shown in FIG. 6, the first wiring member 3 and the second wiring member 4 may have an asymmetric shape, and the solder deterioration detection device 100 may have a symmetric shape.
　図７は、本開示の実施の形態１に係る回路基板のはんだ劣化検知装置の別の形態の例を示す側面図である。上述したはんだ劣化検知装置１００は、図中のＸ及びＹ方向に広がった構造であるが、図７に示すように、Ｘ軸に対して９０度回転させたような形状であってもよい。図７では第２配線部材４の熱変形部４２が回路基板２に対して垂直な方向であるＺ方向に延伸している。また、はんだ接続部６０の第１配線部材３との界面６０１及び第２配線部材４との界面６０２は、熱変形部４２が延伸するＺ方向に交差する方向であるＸ方向に形成される。 FIG. 7 is a side view showing an example of another form of the solder deterioration detection device for a circuit board according to the first embodiment of the present disclosure. The above-mentioned solder deterioration detection device 100 has a structure that spreads in the X and Y directions in the figure, but as shown in FIG. 7, it may have a shape rotated 90 degrees about the X axis. In FIG. 7, the thermally deformed portion 42 of the second wiring member 4 extends in the Z direction, which is a direction perpendicular to the circuit board 2. In addition, the interface 601 of the solder connection portion 60 with the first wiring member 3 and the interface 602 with the second wiring member 4 are formed in the X direction, which is a direction intersecting the Z direction in which the thermally deformed portion 42 extends.
　図８は、本開示の実施の形態１に係る故障予測の際の動作を示すフローチャートである。はんだ劣化検知装置１００は測定部５に接続されており、測定部５は電気抵抗値を測定する手段と、はんだ接続部６０の劣化を検知する故障予測部６（図示しない）を備える。ステップＳ１では、測定部５がはんだ接続部６０の電気抵抗を測定する。 FIG. 8 is a flowchart showing the operation during failure prediction according to the first embodiment of the present disclosure. The solder deterioration detection device 100 is connected to a measurement unit 5, which includes a means for measuring an electrical resistance value and a failure prediction unit 6 (not shown) that detects deterioration of the solder connection 60. In step S1, the measurement unit 5 measures the electrical resistance of the solder connection 60.
　ステップＳ２では、故障予測部６が、はんだ接続部６０の電気抵抗が所定の閾値を超えた時点で断線等の発生を判断する。このとき、電気抵抗の閾値は、故障予測３１で設定可能な電気抵抗の値であり、ユーザは予め任意の値を設定することができる。この予め設定した閾値となる電気抵抗の値を含む電気的特性データベースの値を適宜変更することにより、はんだ接続部６０の劣化の検知の仕方をき裂や断線等に変更することも可能である。故障予測部６は、測定部５で測定されたはんだ劣化検知装置１００の電気的特性と、電気的特性データベースの閾値に従って、はんだ接続部６０の損傷度を推定することができる。損傷度は、例えば、測定した電気抵抗の値と電気的特性データベースの値の比等で定義できる。なお、電気的特性データベースには、はんだ接続部６０の電気的特性と、はんだ接続部６０の劣化の度合である損傷度とが対応づけて保持されており、実験等により導出された結果が予め蓄積されている。 In step S2, the failure prediction unit 6 judges the occurrence of a break or the like when the electrical resistance of the solder connection 60 exceeds a predetermined threshold. At this time, the threshold of the electrical resistance is an electrical resistance value that can be set by the failure prediction 31, and the user can set any value in advance. By appropriately changing the value of the electrical characteristic database including the electrical resistance value that is the preset threshold, it is also possible to change the way of detecting the deterioration of the solder connection 60 to cracks, breaks, etc. The failure prediction unit 6 can estimate the degree of damage to the solder connection 60 according to the electrical characteristics of the solder deterioration detection device 100 measured by the measurement unit 5 and the threshold of the electrical characteristic database. The degree of damage can be defined, for example, as the ratio between the measured electrical resistance value and the value of the electrical characteristic database. Note that the electrical characteristics of the solder connection 60 and the degree of damage, which is the degree of deterioration of the solder connection 60, are stored in the electrical characteristic database in association with each other, and results derived from experiments, etc. are stored in advance.
　ステップＳ３では、故障予測部６で判断したはんだ接続部６０の状態を出力する。このとき、はんだ接続部６０が断線しているならば、断線信号を測定部５に出力する。電気抵抗値を測定するタイミングとしては、例えば温度変化の大きい電源ＯＮ時であり、電源ＯＮ状態が継続している場合には一定の時間間隔で監視を行ってもよい。ステップＳ４では、断線信号が出力された場合に、断線信号をアラームとして表示器等に表示する。このような構成にすることで、ユーザは劣化を検知したいはんだの損傷度を知ることができる。 In step S3, the state of the solder connection 60 determined by the failure prediction unit 6 is output. At this time, if the solder connection 60 is broken, a break signal is output to the measurement unit 5. The timing for measuring the electrical resistance value is, for example, when the power is turned on, when there is a large change in temperature, and if the power is turned on continuously, monitoring may be performed at regular intervals. In step S4, if a break signal is output, the break signal is displayed as an alarm on a display or the like. With this configuration, the user can know the degree of damage to the solder for which degradation is desired to be detected.
　以上のように、本開示のはんだ劣化検知装置１００は、第１配線部材３と、第２配線部材４と、はんだ接続部６０と、絶縁接続部７０とを備え、第２配線部材４の熱変形部４２が延伸する方向と交差する方向に沿って、はんだ接続部６０の第１配線部材３との界面６０１及び第２配線部材４との界面６０２が形成されている。 As described above, the solder deterioration detection device 100 disclosed herein comprises a first wiring member 3, a second wiring member 4, a solder connection portion 60, and an insulating connection portion 70, and an interface 601 between the solder connection portion 60 and the first wiring member 3 and an interface 602 between the solder connection portion 60 and the second wiring member 4 are formed along a direction intersecting the direction in which the thermal deformation portion 42 of the second wiring member 4 extends.
　この構成により、はんだ劣化検知装置１００が温度上昇した場合、第２配線部材４の熱変形部４２が延伸し、はんだ接続部６０は、第１配線部材３又は第２配線部材４から離れるように熱変形するため、はんだ接続部６０のき裂進展時又は破断後に隙間ができることで物理的接触を減らす又はなくすことができ、はんだ接続部の劣化を正確に検知することが可能となる。 With this configuration, when the temperature of the solder deterioration detection device 100 rises, the thermally deformed portion 42 of the second wiring member 4 extends, and the solder connection portion 60 thermally deforms so as to move away from the first wiring member 3 or the second wiring member 4. This creates a gap when a crack propagates or after the solder connection portion 60 breaks, reducing or eliminating physical contact, making it possible to accurately detect deterioration of the solder connection.
　またはんだ劣化検知装置１００は測定部５を備えることで、はんだ接続部６０の物理的接触を減らす又はなくすことで明確になった電気的特性の変化を正確に検知でき、はんだの劣化を検知する精度の向上が可能である。また、はんだ劣化検知装置１００は故障予測部６を備えることで、はんだ接続部６０の損傷度を推定することができる。　 Also, by being equipped with a measuring unit 5, the solder deterioration detection device 100 can accurately detect changes in electrical characteristics that become evident by reducing or eliminating physical contact with the solder connection 60, thereby improving the accuracy of detecting solder deterioration. Also, by being equipped with a failure prediction unit 6, the solder deterioration detection device 100 can estimate the degree of damage to the solder connection 60.
実施の形態２．
　実施の形態２では、本開示の実施の形態１と同一の構成要素には同一の符号を使用し、同一または対応する部分についての説明は省略する。以下、図面を参照して、実施の形態２に係るはんだ劣化検知装置１００について説明する。実施の形態２に係るはんだ劣化検知装置１００は、実施の形態１の構成に加えてさらに第３配線部材８を有する。 Embodiment 2.
In the second embodiment, the same components as those in the first embodiment of the present disclosure are designated by the same reference numerals, and descriptions of the same or corresponding parts will be omitted. A solder deterioration detection device 100 according to the second embodiment will be described below with reference to the drawings. The solder deterioration detection device 100 according to the second embodiment further includes a third wiring member 8 in addition to the configuration of the first embodiment.
　図９は、本開示の実施の形態２に係る回路基板のはんだ劣化検知装置を示す上面図である。図９に示すように、第３配線部材８は、支持脚部８１を有し、支持脚部８の一端が回路基板２に固定される。支持脚部８１は、回路基板２から立ち上がり、途中で屈曲して一方向に延伸しており、側面からみると、Ｌ字型に形成されている。第３配線部材８は、第２配線部材よりも線熱膨張係数が小さい材料からなる。 FIG. 9 is a top view showing a circuit board solder deterioration detection device according to embodiment 2 of the present disclosure. As shown in FIG. 9, the third wiring member 8 has a support leg 81, one end of which is fixed to the circuit board 2. The support leg 81 rises from the circuit board 2, bends midway and extends in one direction, and is formed in an L-shape when viewed from the side. The third wiring member 8 is made of a material with a smaller linear thermal expansion coefficient than the second wiring member.
　本実施の形態における第２配線部材４は、Ｙ方向に沿って延伸する熱変形部４２を有し、第１配線部材３と第３配線部材８との間に設けられている。 In this embodiment, the second wiring member 4 has a thermally deformed portion 42 that extends along the Y direction, and is provided between the first wiring member 3 and the third wiring member 8.
　第１配線部材３と第２配線部材４とは、はんだ接続部６０及び絶縁接続部７０を介して接続され、それ以外の部分では互いに離間している。また、第２配線部材４と第３配線部材８とは、はんだ接続部６１及び絶縁接続部７１を介して接続され、それ以外の部分では互いに離間している。 The first wiring member 3 and the second wiring member 4 are connected via a solder connection portion 60 and an insulating connection portion 70, and are otherwise spaced apart from each other. The second wiring member 4 and the third wiring member 8 are connected via a solder connection portion 61 and an insulating connection portion 71, and are otherwise spaced apart from each other.
　第１配線部材３と第２配線部材４とを接続するはんだ接続部６０は、熱変形部４２が延伸する方向と交差する方向に沿って、第１配線部材３との界面６０１及び第２配線部材４との界面６０２が形成され、界面６０１と界面６０２は、互いに平行関係にある。第２配線部材４と第３配線部材８とを接続するはんだ接続部６１は、熱変形部４２が延伸する方向と交差する方向に沿って、第２配線部材４との界面６１１及び第３配線部材８との界面６１２が形成され、界面６１１と界面６１２は、互いに平行関係にある。 The solder connection portion 60 connecting the first wiring member 3 and the second wiring member 4 has an interface 601 with the first wiring member 3 and an interface 602 with the second wiring member 4 formed along a direction intersecting the direction in which the thermally deformed portion 42 extends, and the interfaces 601 and 602 are parallel to each other. The solder connection portion 61 connecting the second wiring member 4 and the third wiring member 8 has an interface 611 with the second wiring member 4 and an interface 612 with the third wiring member 8 formed along a direction intersecting the direction in which the thermally deformed portion 42 extends, and the interfaces 611 and 612 are parallel to each other.
　一般的に部品に温度サイクル等の負荷が作用した場合、部品の製造ばらつきなどにより部品が破損に至るまでの寿命がばらつくことが知られている。特にはんだ接続部６０の材料であるはんだは、その寿命ばらつきが大きいことで知られている。本実施の形態のはんだ劣化検知装置１００を電気回路としてみた場合、はんだ接続部６０及びはんだ接続部６１は直列に接続されていることになる。はんだ接続部６０及びはんだ接続部６１のいずれか一方が破断した場合は、はんだ劣化検知装置１００は、はんだ接続部６０及びはんだ接続部６１のいずれか一方の電気的特性の変化を検出することになる。つまり、はんだ接続部を複数有することで、はんだ接続部の寿命ばらつきを考慮することができ、実施の形態１に比べて実装部品１と回路基板２とのはんだ接続部の故障予測精度を向上させることができる。 It is generally known that when a component is subjected to a load such as a temperature cycle, the lifespan of the component varies due to manufacturing variations in the component. In particular, the solder, which is the material of the solder connection 60, is known to have a large variation in its lifespan. If the solder deterioration detection device 100 of this embodiment is viewed as an electric circuit, the solder connection 60 and the solder connection 61 are connected in series. If either the solder connection 60 or the solder connection 61 breaks, the solder deterioration detection device 100 will detect a change in the electrical characteristics of either the solder connection 60 or the solder connection 61. In other words, by having multiple solder connections, it is possible to take into account the lifespan variation of the solder connection, and the failure prediction accuracy of the solder connection between the mounted component 1 and the circuit board 2 can be improved compared to the first embodiment.
　図９ではＺ軸に対して回転対称な構造を例として示しているが、回転対称でなくてもある方向に対して対称な構造であってもよく、また、非対称な構造であってもよい。また、第１配線部材３と、第３配線部材８は、第２配線部材４より線膨張係数が小さければ、同じ材料であってもよい。 In FIG. 9, a structure that is rotationally symmetrical with respect to the Z axis is shown as an example, but the structure may be symmetrical with respect to a certain direction, or may be asymmetrical. In addition, the first wiring member 3 and the third wiring member 8 may be made of the same material as long as the material has a smaller linear expansion coefficient than the second wiring member 4.
　図９では界面６０１、界面６０２、界面６１１及び界面６１２は全て平行関係にあるように記載しているが、全てのはんだ接続部の界面が平行関係になくてもよく、界面６０１と界面６０２及び界面６１１と界面６１２がそれぞれ平行関係にある構造であってもよい。ただしその場合、第２配線部材４は、界面６０１と界面６０２が形成される方向と交差する方向に延伸する熱変形部と、界面６１１と界面６１２が形成される方向と交差方向に延伸する熱変形部をそれぞれ有することが望ましい。 In FIG. 9, interfaces 601, 602, 611, and 612 are all shown as being parallel to each other, but not all of the interfaces of the solder connection parts need to be parallel to each other, and interfaces 601 and 602, and interfaces 611 and 612 may each be parallel to each other. In that case, however, it is preferable that second wiring member 4 has a thermally deformed portion that extends in a direction intersecting the direction in which interfaces 601 and 602 are formed, and a thermally deformed portion that extends in a direction intersecting the direction in which interfaces 611 and 612 are formed.
　以上のように、本開示の実施の形態２に係るはんだ劣化検知装置１００においても、第２配線部材４の熱変形部４２の延伸する方向であるＹ方向に沿って、はんだ接続部６０の第１配線部材との界面６０１及び第２配線部材４との界面６０２が並んで形成されるため、はんだ劣化検知装置１００が温度上昇した場合、第２配線部材４の熱変形部４２がＹ方向に沿って伸び、はんだ接続部６０は、第１配線部材３又は第２配線部材４から離れるように熱変形するため、はんだ接続部６０のき裂進展時又は破断後に隙間ができることで物理的接触を減らす又はなくすことができ、はんだ接続部の劣化を正確に検知することが可能となる。 As described above, in the solder deterioration detection device 100 according to the second embodiment of the present disclosure, the interface 601 of the solder connection portion 60 with the first wiring member and the interface 602 with the second wiring member 4 are formed side by side along the Y direction, which is the extension direction of the thermally deformed portion 42 of the second wiring member 4. Therefore, when the temperature of the solder deterioration detection device 100 rises, the thermally deformed portion 42 of the second wiring member 4 extends along the Y direction, and the solder connection portion 60 is thermally deformed so as to move away from the first wiring member 3 or the second wiring member 4. As a result, a gap is created when a crack propagates or after the solder connection portion 60 breaks, which reduces or eliminates physical contact, making it possible to accurately detect deterioration of the solder connection.
　さらに本実施の形態では、第３配線部材８を備え、第２配線部材４と第３配線部材８との間に挟まれて設けられたはんだ接続部６１を有する。はんだは特性のばらつきが大きい材料であるため、複数のはんだ接続部を設けることにより、このばらつきを考慮したうえではんだの劣化を予測することが可能となる。 Furthermore, in this embodiment, a third wiring member 8 is provided, and a solder connection portion 61 is provided sandwiched between the second wiring member 4 and the third wiring member 8. Since solder is a material with large variation in characteristics, by providing multiple solder connection portions, it is possible to predict solder deterioration while taking this variation into account.
実施の形態３．
　実施の形態３では、本開示の実施の形態１と同一の構成要素には同一の符号を使用し、同一または対応する部分についての説明は省略する。以下、図面を参照して、実施の形態３に係るはんだ劣化検知装置１００について説明する。実施の形態３に係るはんだ劣化検知装置１００は、実施の形態１の構成に加えてさらに第３配線部材８を有する。 Embodiment 3.
In the third embodiment, the same components as those in the first embodiment of the present disclosure are designated by the same reference numerals, and descriptions of the same or corresponding parts will be omitted. A solder deterioration detection device 100 according to the third embodiment will be described below with reference to the drawings. The solder deterioration detection device 100 according to the third embodiment further includes a third wiring member 8 in addition to the configuration of the first embodiment.
　図１０は本開示の実施の形態３に係る回路基板のはんだ劣化検知装置を示す上面図である。第３配線部材８は、支持脚部８１を有し、支持脚部８の一端が回路基板２に固定される。支持脚部８１は、回路基板２から立ち上がり、途中で屈曲して一方向に伸びており、側面からみると、Ｌ字型に形成されている。第３配線部材８は、第２配線部材４よりも線熱膨張係数が小さい材料からなる。 FIG. 10 is a top view showing a circuit board solder deterioration detection device according to embodiment 3 of the present disclosure. The third wiring member 8 has a support leg 81, one end of which is fixed to the circuit board 2. The support leg 81 rises from the circuit board 2, bends midway and extends in one direction, and is formed in an L-shape when viewed from the side. The third wiring member 8 is made of a material with a smaller linear thermal expansion coefficient than the second wiring member 4.
　本実施の形態の第２配線部材４は、Ｙ方向に沿ってそれぞれ延伸する熱変形部４２Ａ及び熱変形部４２Ｂを有し、熱変形部４２Ａ及び熱変形部４２Ｂは第１配線部材３と第３配線部材８との間に並んで設けられている。 The second wiring member 4 in this embodiment has thermally deformed portions 42A and 42B that each extend along the Y direction, and the thermally deformed portions 42A and 42B are arranged side by side between the first wiring member 3 and the third wiring member 8.
　第１配線部材３と第２配線部材４とは、はんだ接続部６０Ａ及びはんだ接続部６０Ｂと、絶縁接続部７０を介して接続され、それ以外の部分では互いに離間している。また、第２配線部材４と第３配線部材８とは、はんだ接続部６１Ａ及びはんだ接続部６１Ｂと、絶縁接続部７１とを介して接続され、それ以外の部分では互いに離間している。 The first wiring member 3 and the second wiring member 4 are connected via the solder connection portion 60A and the solder connection portion 60B and the insulating connection portion 70, and are otherwise spaced apart from each other. The second wiring member 4 and the third wiring member 8 are connected via the solder connection portion 61A and the solder connection portion 61B and the insulating connection portion 71, and are otherwise spaced apart from each other.
　第１配線部材３と第２配線部材４とを接続するはんだ接続部６０Ａは、熱変形部４２Ａが延伸する方向と交差する方向に沿って第１配線部材３との界面６０１Ａ及び第２配線部材４との界面６０２Ａが形成され、界面６０１Ａと界面６０２Ａは、互いに平行関係にある。また、はんだ接続部６０Ａとは異なる位置で第１配線部材３と第２配線部材４とを接続するはんだ接続部６０Ｂは、熱変形部４２Ａが延伸する方向と交差する方向に沿って第１配線部材３との界面６０１Ｂ及び第２配線部材４との界面６０２Ｂとが形成され、界面６０１Ｂと界面６０２Ｂは、互いに平行関係にある。 The solder connection portion 60A that connects the first wiring member 3 and the second wiring member 4 has an interface 601A with the first wiring member 3 and an interface 602A with the second wiring member 4 formed along a direction intersecting the direction in which the thermally deformed portion 42A extends, and the interfaces 601A and 602A are parallel to each other. The solder connection portion 60B that connects the first wiring member 3 and the second wiring member 4 at a position different from the solder connection portion 60A has an interface 601B with the first wiring member 3 and an interface 602B with the second wiring member 4 formed along a direction intersecting the direction in which the thermally deformed portion 42A extends, and the interfaces 601B and 602B are parallel to each other.
　第２配線部材４と第３配線部材８とを接続するはんだ接続部６１Ａは、熱変形部４２Ｂが延伸する方向と交差する方向に沿って第２配線部材４との界面６１１Ａ及び第３配線部材８との界面６１２Ａが形成され、界面６１１Ａと界面６１２Ａは、互いに平行関係にある。また、はんだ接続部６１Ａとは異なる位置で第２配線部材４と第３配線部材８とを接続するはんだ接続部６１Ｂは、熱変形部４２Ｂが延伸する方向と交差する方向に沿って第２配線部材４との界面６１１Ｂ及び第３配線部材８との界面６１２Ｂが形成され、界面６１１Ｂと界面６１２Ｂは、互いに平行関係にある。 The solder connection portion 61A connecting the second wiring member 4 and the third wiring member 8 has an interface 611A with the second wiring member 4 and an interface 612A with the third wiring member 8 formed along a direction intersecting the extension direction of the thermally deformed portion 42B, and the interfaces 611A and 612A are parallel to each other. The solder connection portion 61B connecting the second wiring member 4 and the third wiring member 8 at a position different from the solder connection portion 61A has an interface 611B with the second wiring member 4 and an interface 612B with the third wiring member 8 formed along a direction intersecting the extension direction of the thermally deformed portion 42B, and the interfaces 611B and 612B are parallel to each other.
　図１０において、はんだ接続部の界面６０１Ａ、界面６０２Ａ、界面６０１Ｂ、及び界面６０２Ｂの４つは平行関係にあり、また界面６１１Ａ、界面６１２Ａ、界面６１１Ｂ、及び界面６１２Ｂの４つも平行関係にあるように記載しているが、１つのはんだ接続部に対する２つの界面が平行関係にあれば、他のはんだ接続部の界面と平行関係にある必要はない。ただしその場合は、熱変形部が延伸する方向と交差する方向に各はんだ接続部の界面が形成されることが望ましい。 In FIG. 10, the four interfaces 601A, 602A, 601B, and 602B of the solder connection are parallel to each other, and the four interfaces 611A, 612A, 611B, and 612B are also parallel to each other. However, if two interfaces for one solder connection are parallel to each other, they do not need to be parallel to the interfaces of other solder connections. In this case, however, it is desirable that the interfaces of each solder connection are formed in a direction that intersects with the direction in which the thermally deformed portion extends.
　図１１は、本開示の実施の形態３に係るはんだ劣化検知装置の電気回路を模式的に示した図である。図１１に示すように、第１配線部材３と第２配線部材４とを接続するはんだ接続部６０Ａとはんだ接続部６０Ｂは並列接続である。また、第２配線部材４と第３配線部材８とを接続するはんだ接続部６１Ａとはんだ接続部６１Ｂも互いに並列接続される。さらに、はんだ接続部６０Ａ及びはんだ接続部６０Ｂと、はんだ接続部６１Ａ及びはんだ接続部６１Ｂは直列に接続される構成となる。これら４つあるはんだ接続部６０Ａ、６０Ｂ、６１Ａ、６１Ｂの内、２つ以上破断すれば、はんだ劣化検知装置１００は、４つあるはんだ接続部のいずれかの電気的特性の変化を検出することになる。 FIG. 11 is a schematic diagram of an electrical circuit of a solder deterioration detection device according to the third embodiment of the present disclosure. As shown in FIG. 11, the solder connection portion 60A and the solder connection portion 60B that connect the first wiring member 3 and the second wiring member 4 are connected in parallel. The solder connection portion 61A and the solder connection portion 61B that connect the second wiring member 4 and the third wiring member 8 are also connected in parallel. Furthermore, the solder connection portion 60A and the solder connection portion 60B, and the solder connection portion 61A and the solder connection portion 61B are connected in series. If two or more of the four solder connection portions 60A, 60B, 61A, and 61B are broken, the solder deterioration detection device 100 will detect a change in the electrical characteristics of any of the four solder connection portions.
　ここで、第１配線部材３と第２配線部材４とを接続するはんだ接続部６０Ａ及びはんだ接続部６０Ｂと、第２配線部材４と第３配線部材８とを接続するはんだ接続部６１Ａ及びはんだ接続部６１Ｂがある例を示したが、配線部材同士を接続するはんだ接続部は２つに限らずさらに複数設けてもよい。 Here, an example is shown in which solder connection parts 60A and 60B connect the first wiring member 3 and the second wiring member 4, and solder connection parts 61A and 61B connect the second wiring member 4 and the third wiring member 8, but the number of solder connection parts connecting the wiring members is not limited to two, and more than one may be provided.
　以上のように、本開示の実施の形態３に係るはんだ劣化検知装置１００においても、第２配線部材４の熱変形部４２Ａの延伸する方向と交差する方向に沿って、第１配線部材３との界面６０１Ａ及び界面６０１Ｂと、第２配線部材４との界面６０２Ａ及び界面６０２Ｂが形成されるため、はんだ劣化検知装置１００が温度上昇した場合、はんだ接続部６０Ａ及びはんだ接続部６０Ｂの物理的接触を減らす又はなくすことができ、はんだ接続部の劣化を正確に検知することが可能となる。 As described above, in the solder deterioration detection device 100 according to the third embodiment of the present disclosure, the interface 601A and interface 601B with the first wiring member 3, and the interface 602A and interface 602B with the second wiring member 4 are formed along a direction intersecting the extension direction of the thermally deformed portion 42A of the second wiring member 4. Therefore, when the temperature of the solder deterioration detection device 100 rises, the physical contact between the solder connection portion 60A and the solder connection portion 60B can be reduced or eliminated, making it possible to accurately detect deterioration of the solder connection portion.
　さらに本実施の形態では、第３配線部材８をさらに備え、第２配線部材４と第３配線部材８との間に挟まれて設けられたはんだ接続部６１Ａ及びはんだ接続部６１Ｂを有し、第２配線部材４の熱変形部４２Ｂの延伸する方向と交差する方向に沿って、第２配線部材４との界面６１１Ａ及び界面６１１と、第３配線部材８との界面６１２Ａ、６１２Ｂが形成される。このように、はんだ接続部を２つ以上有することで、はんだ接続部の寿命ばらつきを考慮することができ、実装部品１と回路基板２とのはんだ接続部の故障予測精度を向上させることができる。 Furthermore, in this embodiment, a third wiring member 8 is further provided, and has solder connection portions 61A and 61B sandwiched between the second wiring member 4 and the third wiring member 8, and interfaces 611A and 611 with the second wiring member 4 and interfaces 612A and 612B with the third wiring member 8 are formed along a direction intersecting the extension direction of the thermally deformed portion 42B of the second wiring member 4. In this way, by having two or more solder connections, it is possible to take into account the variation in the life span of the solder connections, and the accuracy of failure prediction of the solder connections between the mounted component 1 and the circuit board 2 can be improved.
実施の形態４．
　実施の形態４では、本開示の実施の形態１と同一の構成要素には同一の符号を使用し、同一または対応する部分についての説明は省略する。以下、図面を参照して、実施の形態４に係るはんだ劣化検知装置１００について説明する。 Embodiment 4.
In the fourth embodiment, the same components as those in the first embodiment of the present disclosure are designated by the same reference numerals, and descriptions of the same or corresponding parts will be omitted. Hereinafter, a solder deterioration detection device 100 according to the fourth embodiment will be described with reference to the drawings.
　図１２は、本開示の実施の形態４に係る回路基板を示す上面図である。本実施の形態では、実施の形態１のはんだ接続部６０に切欠き部９Ａ、９Ｂを有することを特徴とする。図１２に示すように、はんだ劣化検知装置１００は、第１配線部材３と、第２配線部材４と、はんだ接続部６０と、絶縁接続部７０とを備える。はんだ接続部６０は、第２配線部材４の熱変形部４２の延伸する方向と交差する方向に沿って、第１配線部材３との界面６０１及び第２配線部材４との界面６０２が形成される。 FIG. 12 is a top view showing a circuit board according to embodiment 4 of the present disclosure. This embodiment is characterized in that the solder connection portion 60 of embodiment 1 has cutout portions 9A and 9B. As shown in FIG. 12, the solder deterioration detection device 100 includes a first wiring member 3, a second wiring member 4, a solder connection portion 60, and an insulating connection portion 70. The solder connection portion 60 has an interface 601 with the first wiring member 3 and an interface 602 with the second wiring member 4 formed along a direction intersecting the extension direction of the thermally deformed portion 42 of the second wiring member 4.
　はんだ接続部６０は、第１配線部材３との界面６０１の両端に切欠き部９Ａを有する。また、はんだ接続部６０は、第２配線部材４との界面６０２の両端に切欠き部９Ｂを有する。 The solder connection portion 60 has a notch portion 9A at both ends of the interface 601 with the first wiring member 3. The solder connection portion 60 also has a notch portion 9B at both ends of the interface 602 with the second wiring member 4.
　以上のように、本開示の実施の形態４に係るはんだ劣化検知装置１００においても、第２配線部材４の熱変形部４２の延伸する方向と交差する方向に沿って、はんだ接続部６０の第１配線部材３との界面６０１及び第２配線部材４との界面６０２が形成されるため、はんだ劣化検知装置１００が温度上昇した場合、はんだ接続部６０の物理的接触を減らす又はなくすことができ、はんだ接続部の劣化を正確に検知することが可能となる。 As described above, in the solder deterioration detection device 100 according to the fourth embodiment of the present disclosure, the interface 601 of the solder connection portion 60 with the first wiring member 3 and the interface 602 with the second wiring member 4 are formed along a direction intersecting the extension direction of the thermally deformed portion 42 of the second wiring member 4. Therefore, when the temperature of the solder deterioration detection device 100 rises, the physical contact of the solder connection portion 60 can be reduced or eliminated, making it possible to accurately detect deterioration of the solder connection portion.
　さらに本実施の形態では、はんだ接続部６０が、はんだ接続部６０の第１配線部材３との界面６０１及び第２配線部材との界面６０２の少なくともいずれか一方に切欠き部を設ける構成とした。これにより、切欠き部の先端が応力集中部となるため、温度サイクルが作用した場合に、はんだ接続部６０に発生する応力を大きくでき、また、はんだ接続部６０内のき裂の進展距離を短くでき、より破断させやすい構造とすることができる。つまり、回路基板２と実装部品１とのはんだ接続部よりも短寿命に設定することが容易になるため、目的の寿命に設計しやすい構造とすることができるという効果を有する。 Furthermore, in this embodiment, the solder connection 60 is configured to have a notch at at least one of the interface 601 with the first wiring member 3 and the interface 602 with the second wiring member. As a result, the tip of the notch becomes a stress concentration area, so that when a temperature cycle is applied, the stress generated in the solder connection 60 can be increased, and the propagation distance of cracks in the solder connection 60 can be shortened, resulting in a structure that is easier to break. In other words, it is easier to set a shorter life than the solder connection between the circuit board 2 and the mounted component 1, so there is an effect that a structure can be easily designed to have a desired life.
　なお、図１２において、第１配線部材３との界面６０１及び第１配線部材３との界面６０２の両端に、それぞれ切欠き部９Ａ、９Ｂを有する例を示したが、一端に切欠き部９Ａ、９Ｂを設けてもよい。切欠き部９Ａ、９Ｂの配置場所は、Ｘ方向のみに限定されるものではなく、Ｚ方向のみや、全周部に切欠き部を設けてもよい。また、第２配線部材４側の切欠き部９Ａだけでもよく、第１配線部材３側の切欠き部９Ｂだけでもよい。回路基板２と実装部品１とのはんだ接続部の強度よりもはんだ接続部６０の強度が低強度となるように構成されていればよい。図１２は実施の形態１をもとに記載しているが、実施の形態１に限定されるものでなく、はんだ接続部を複数有する実施の形態２、３のような構造でも適用可能である。 In FIG. 12, an example is shown in which the interface 601 with the first wiring member 3 and the interface 602 with the first wiring member 3 have the notches 9A and 9B at both ends, respectively, but the notches 9A and 9B may be provided at one end. The arrangement of the notches 9A and 9B is not limited to the X direction, but may be provided only in the Z direction or on the entire circumference. Also, only the notch 9A on the second wiring member 4 side may be provided, or only the notch 9B on the first wiring member 3 side may be provided. It is sufficient that the solder connection 60 is configured to have a lower strength than the solder connection between the circuit board 2 and the mounted component 1. Although FIG. 12 is described based on the first embodiment, it is not limited to the first embodiment, and can also be applied to structures such as the second and third embodiments having multiple solder connections.
　なお、以上の実施の形態に示した構成は、本開示の内容の一例を示すものであり、別の公知の技術と組み合わせることも可能である。また本開示の要旨を逸脱しない範囲で、構成の一部を省略、変更することも可能である。 The configurations shown in the above embodiments are merely examples of the contents of this disclosure, and may be combined with other known technologies. Furthermore, parts of the configurations may be omitted or modified without departing from the spirit of this disclosure.
１　実装部品、２　回路基板、３　第１配線部材、４　第２配線部材、５　測定部、６　故障予測部、８　第３配線部材、３１　第１配線部材の支持脚部、４１　第２配線部材の支持脚部、４２　熱変形部、６０　６１　はんだ接続部、６０１　はんだ接続部の第１配線部材との界面、６０２　はんだ接続部の第２配線部材との界面、７０　絶縁接続部、８１　第３配線部材の支持脚部、９Ａ、９Ｂ　切欠き部、１００　はんだ劣化検知装置 1 Mounted component, 2 Circuit board, 3 First wiring member, 4 Second wiring member, 5 Measurement unit, 6 Failure prediction unit, 8 Third wiring member, 31 Support leg of first wiring member, 41 Support leg of second wiring member, 42 Thermal deformation unit, 60 61 Solder connection unit, 601 Interface between solder connection unit and first wiring member, 602 Interface between solder connection unit and second wiring member, 70 Insulated connection unit, 81 Support leg of third wiring member, 9A, 9B Notch unit, 100 Solder deterioration detection device

Claims (8)

  1. 実装部品がはんだで接続された回路基板に一端が固定されて前記回路基板から立ち上がり、屈曲して延伸する支持脚部を有する第１配線部材と、
    前記第１配線部材と離間して設けられ、前記支持脚部が屈曲して延伸する方向と交差する方向に延伸する熱変形部を有し、前記第１配線部材よりも線熱膨張係数が大きい材料からなる第２配線部材と、
    前記第１配線部材と前記第２配線部材との間に挟まれて設けられ、前記第１配線部材に対する前記第２配線部材の位置を固定する絶縁接続部と、
    前記第１配線部材と前記第２配線部材との間に挟まれて設けられ、前記熱変形部が延伸する方向と交差する方向に沿って、前記第１配線部材との界面及び前記第２配線部材との界面が形成されたはんだ接続部と
    を備えるはんだ劣化検知装置。     a first wiring member having a support leg portion which is fixed at one end to a circuit board to which mounted components are connected by soldering and which rises from the circuit board and which bends and extends;
    a second wiring member provided at a distance from the first wiring member, having a thermally deformed portion extending in a direction intersecting a direction in which the support leg portion is bent and extends, and made of a material having a linear thermal expansion coefficient larger than that of the first wiring member;
    an insulating connection portion that is sandwiched between the first wiring member and the second wiring member and that fixes a position of the second wiring member with respect to the first wiring member;
    a solder deterioration detection device comprising: a solder connection portion sandwiched between the first wiring member and the second wiring member, and having an interface with the first wiring member and an interface with the second wiring member formed along a direction intersecting the direction in which the thermal deformation portion extends.
  2. 前記はんだ接続部の前記第１配線部材との界面及び前記第２配線部材との界面は、前記熱変形部が延伸する方向と直交する方向に沿って形成される請求項１に記載のはんだ劣化検知装置。 The solder deterioration detection device according to claim 1, wherein the interface of the solder connection with the first wiring member and the interface with the second wiring member are formed along a direction perpendicular to the direction in which the thermally deformed portion extends.
  3. 前記第１配線部材及び前記第２配線部材と電気的に接続され、前記はんだ接続部の電気抵抗を測定する測定部を備える請求項１又は２に記載のはんだ劣化検知装置。 The solder deterioration detection device according to claim 1 or 2, further comprising a measuring unit electrically connected to the first wiring member and the second wiring member, for measuring the electrical resistance of the solder connection portion.
  4. 予め設定した閾値となる電気抵抗の値を含む電気的特性データベースを有し、前記測定部で測定した前記はんだ接続部の電気抵抗の値と前記電気的特性データベースを用いて、前記はんだ接続部の劣化の度合いである損傷度を推定する故障予測部を備える請求項１から３のいずれか一項に記載のはんだ劣化検知装置。 A solder deterioration detection device according to any one of claims 1 to 3, comprising an electrical characteristics database including a preset threshold electrical resistance value, and a failure prediction unit that uses the electrical resistance value of the solder connection measured by the measurement unit and the electrical characteristics database to estimate a degree of damage, which is the degree of deterioration of the solder connection.
  5. 前記第２配線部材よりも線熱膨張係数が小さい材料からなる第３配線部材を備え、前記第３配線部材は、前記はんだ接続部及び前記絶縁接続部を介して前記第２配線部材と接続され、前記はんだ接続部の前記第２配線部材との界面及び第３配線部材との界面は、前記熱変形部が延伸する方向と交差する方向に沿って形成される請求項１から４のいずれか一項に記載のはんだ劣化検知装置。 A solder deterioration detection device according to any one of claims 1 to 4, comprising a third wiring member made of a material having a smaller linear thermal expansion coefficient than the second wiring member, the third wiring member being connected to the second wiring member via the solder connection portion and the insulating connection portion, and the interface of the solder connection portion with the second wiring member and the interface of the solder connection portion with the third wiring member being formed along a direction intersecting the direction in which the thermal deformation portion extends.
  6. 前記第１配線部材と前記第３配線部材が同じ材料であることを特徴とする請求項５に記載のはんだ劣化検知装置。 The solder deterioration detection device according to claim 5, characterized in that the first wiring member and the third wiring member are made of the same material.
  7. 前記はんだ接続部を複数有することを特徴とする請求項１から６のいずれか一項に記載のはんだ劣化検知装置。 The solder deterioration detection device according to any one of claims 1 to 6, characterized in that it has a plurality of the solder connection parts.
  8. 前記はんだ接続部に切欠き部を有することを特徴とする請求項１から７のいずれか一項に記載のはんだ劣化検知装置。 A solder deterioration detection device according to any one of claims 1 to 7, characterized in that the solder connection has a notch.
PCT/JP2022/046354 2022-12-16 2022-12-16 Solder deterioration sensing device WO2024127623A1 (en)

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