CN218275079U - Lead wire seat, gas detector probe and refrigerant detector assembly - Google Patents

Abstract

The embodiment of the utility model provides a lead wire seat, gas detector probe and refrigerant detector subassembly. The lead wire seat comprises a mounting part and at least 2 lead wires; at least a portion of each of the leads is located on a first side of the mounting portion and at least a portion of each of the leads is located on a second side of the mounting portion; the lead is a conductor; the lead on the first side of the mounting portion has a bonding portion having a bonding plane in the axial direction of the lead. The lead wire seat can be welded with an electronic device through a welding plane, and the welding cost is low.

Description

Lead wire seat, gas detector probe and refrigerant detector assembly

[ technical field ] A method for producing a semiconductor device

The application relates to the technical field of electronic device production and processing, in particular to a lead wire seat, a gas detector probe and a refrigerant detector assembly.

[ background of the invention ]

Capacitors, inductors and resistors are common basic electronic devices; they can be used to fabricate a variety of more complex electronic devices; the use of the characteristics of the basic electronics can be used to manufacture a variety of detectors, for example the use of the temperature characteristics of a resistor, a temperature detector or a gas detector can be manufactured using a resistor. However, how to process the basic electronic device to obtain the corresponding detector is an urgent technical problem to be solved.

[ Utility model ] A method for manufacturing a semiconductor device

In view of this, the embodiment of the present application provides a lead wire seat, a gas detector probe and a refrigerant detector assembly, and the lead wire seat is used for welding with an electronic device, so that the welding cost is low.

In order to achieve the above object, the embodiment of the present invention provides the following technical solutions:

a lead wire holder comprises a mounting part and at least 2 lead wires; at least a portion of each of the leads is located on a first side of the mounting portion and at least a portion of each of the leads is located on a second side of the mounting portion; the lead is a conductor; the lead on the first side of the mounting portion has a bonding portion having a bonding plane in the axial direction of the lead.

In one embodiment, the mounting portion comprises a conductive housing having at least two apertures disposed therethrough; different ones of the leads pass through the mounting portion through different ones of the holes; the mounting part is internally filled with an insulating material; and the conductive shell and the lead are spaced by an insulating material filled in the mounting part.

In one embodiment, the mounting portion includes a first step portion and a second step portion, and the first step portion is provided with a first limiting mechanism; the second step portion is closer to the welding plane than the first step portion.

In one embodiment, the first step portion and the second step portion are both cylindrical, the first step portion and the second step portion are coaxially arranged, and the diameter of the first step portion is larger than that of the second step portion.

In one embodiment, the mounting portion is made of an insulating material.

In one embodiment, the lead on the first side of the mounting portion has a bent portion.

The embodiment of the application also provides a gas detector probe, which comprises the lead wire seat and the electronic device; the bonding pad of the electronic device is welded with at least part of the welding part of the lead base.

In one embodiment, the electronic device is a temperature sensing resistor, and the packaging form of the temperature sensing resistor is 0201/0402/0603/0805/1206; the welding mode comprises one or more of laser welding, reflow soldering, wave soldering, conductive adhesive bonding and manual welding.

The embodiment of the application also provides a refrigerant detector assembly, which comprises the gas detector probe.

In one embodiment, the refrigerant detector assembly further comprises a base including a cavity, the electronics of the gas detector probe being located within the cavity

The lead wire seat comprises a mounting part and a lead wire; at least part of the lead is positioned on the first side of the mounting part, and at least part of the lead is positioned on the second side of the mounting part; the lead on the first side of the mounting portion in the axial direction of the lead has a welding portion having a welding plane. The welding of the lead seat and the electronic device can be realized through the welding part with the welding plane, and the welding cost is low. The embodiment of the application also provides the gas detector probe and the refrigerant detector assembly comprising the lead seat, and the gas detector probe and the refrigerant detector assembly also have the advantage of low processing cost.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.

FIG. 1 is a schematic structural view of an electronic device provided herein before being bonded to a lead;

fig. 2 is a schematic structural diagram of a wire holder according to an embodiment of the present application;

fig. 3 is a schematic structural diagram of a wire holder according to another embodiment of the present application;

FIG. 4 is a schematic structural diagram of a gas detector probe according to an embodiment of the present application;

FIG. 5 is a schematic diagram of a gas detector assembly according to an embodiment of the present application;

FIG. 6 is a schematic illustration of the gas detector assembly of FIG. 5 prior to installation;

fig. 7 is a schematic structural diagram of a refrigerant detector according to an embodiment of the present application before being installed;

fig. 8 is a schematic cross-sectional view of a refrigerant detector according to an embodiment of the present disclosure;

fig. 9 is a schematic view of another view angle structure before the refrigerant detector is installed according to an embodiment of the present application;

fig. 10 is a flowchart illustrating a method for manufacturing a lead frame according to an embodiment of the present application;

fig. 11 is a schematic structural diagram of a lead after stress relief according to an embodiment of the present application.

[ detailed description ] embodiments

For better understanding of the technical solutions of the present invention, the following detailed descriptions are provided with reference to the accompanying drawings. It should be understood that the described embodiments are only some, and not all embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the embodiments of the present invention and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should be understood that the term "and/or" as used herein is merely one type of associative relationship that describes an associated object, meaning that three types of relationships may exist, e.g., A and/or B, may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship. In the following description, the appearances of the indicating orientation or positional relationship, such as the terms "inner", "outer", "upper", "lower", "left", "right", etc., are only for convenience in describing the embodiments and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the application.

As shown in fig. 1, in some cases, it is necessary to solder a pin 102 to a pad 101 of the electronic device 10 to implement the use of the electronic device 10. The electronic device 10 can be a chip capacitor, a chip inductor or a chip resistor, and the packaging form of the electronic device can be 0201/0402/0603/0805/1206/and the like. The lead 102 may be a flexible wire, such as a constantan wire, or may be a rigid lead, such as a copper, silver, gold, or other alloy conductive post. Because the constantan wire is generally smaller, a laser welding mode is suitable for the small-packaged surface-mounted device; when the lead is cylindrical, the welding between the lead and the bonding pad 101 is spot welding, and laser welding is also preferably used. However, laser welding is relatively expensive; in order to reduce the soldering cost, one end of the lead pin may be pressed flat, and the soldering with the pad 101 may be surface soldering. The surface welding can adopt various welding modes such as welding, compression joint, brazing and the like, and more specifically can adopt reflow soldering, wave soldering, selective wave soldering, manual welding, resistance welding, ultrasonic welding, friction welding, laser welding, electron beam welding and the like; the welding can be solder paste welding, gold welding, silver welding, metal alloy welding or the like; the surface welding may also be performed by means of bonding, such as conductive bonding using conductive glue. This is not limited in this application.

As shown in fig. 2 and 3, the present embodiment provides a lead frame 20, which includes a mounting portion 201 and at least 2 leads 202, at least a portion of each lead 202 is located on a first side of the mounting portion 201, at least a portion of each lead 202 is located on a second side of the mounting portion 202, and the leads 202 are conductors; at least a part of the lead 202 on the first side is flattened to form a welding part 2021, and the flattened lead has at least one welding plane, that is, the welding part 2021 has one welding plane; the soldering plane is located in the axial direction of the lead. It should be noted that the welding plane described in the present application is an approximate plane in engineering, and is not required to be an absolute plane in mathematical concept. The welding part 2021 of the lead 202 comprises the welding plane, the lead 202 is welded with the pad 101 of the electronic device 10 through the welding part 2021 and the pad 101 of the electronic device, surface welding is adopted between the lead 202 and the pad 101 of the electronic device, welding is firmer and more convenient, welding is more suitable for low-cost fusion, and the production and processing cost of welding is favorably reduced. The mounting portion 201 may be made of an insulating material, and at least functions to fix the lead 202. The mounting portion 201 may also be a hollow device made of a conductive material; specifically, the mounting portion 201 may be made of the same material as the lead 202, such as a metal conductor made of copper, silver plating, or gold plating; of course, the mounting portion 201 and the lead 202 may be made of different conductive materials. When the mounting portion is made of a conductive material, an insulating material, such as ceramic, glass, plastic, insulating glue, or the like, needs to be poured into the hollow mounting portion 201 to prevent a short circuit between the lead 202 and the mounting portion 201.

As shown in fig. 3, when the mounting portion 201 is a hollow device made of a conductive material, that is, the mounting portion 201 includes a conductive housing, the mounting portion 201 is provided with at least 2 holes 2013, and the number of the holes 2013 is the same as the number of the leads 202; the leads 202 can pass through the holes 2013 such that a portion of the leads 202 are on a first side of the mounting portion 201 and a portion of the leads 202 are on a second side of the mounting portion 201; and an insulating material may be injected into the mounting part 201 through the hole, thereby preventing a short circuit between the lead 202 and the mounting part 201.

In one embodiment, the cross-section of the lead 202 is circular except for the bond 2021; the inner diameter of the hole 2013 is larger than the radius of the circular cross-section of the lead 202.

Further, as shown in fig. 3, the mounting portion includes a first stepped portion 2011 and a second stepped portion 2012, the first stepped portion is provided with a first limiting mechanism 20111, the first stepped portion 2011 is cylindrical, the second stepped portion 2012 is also cylindrical, the first stepped portion and the second stepped portion are coaxially disposed, and the diameter of the first stepped portion is greater than that of the second stepped portion. When the wire holder 20 is mounted or fixed on a certain base, the first limiting mechanism 20111 is matched with the second limiting mechanism on the base to limit the position, so that the mounting or fixing is facilitated.

In order to adapt to the pad distance of the electronic device 10, in the lead frame 20 provided in the embodiment of the present application, as shown in fig. 3, the lead portion on the first side of the mounting portion 201 has a bent portion 2022, and the bent portion enables the distance of the soldering portion 2021 of the lead 202 to adapt to the pad distance of the electronic device. Meanwhile, lead stress can be removed through bending, and the electronic device 10 is prevented from falling off easily when being welded on the lead. Specifically, the shape of the bent portion is not limited. As shown in fig. 11, the bending portion may also be bent outward to adapt to the soldering of an electronic device with a larger pad distance, and meanwhile, the bending operation may remove the lead stress and improve the soldering firmness; of course, if the distance between the two leads 202 corresponds to the electronic device pad distance, the bonding can be completed without bending the leads. The distance of the lead portion on the second side of the mounting portion 201 is consistent with the package on a PCB (printed circuit board), and the lead base can be soldered to the PCB through the lead on the second side of the mounting portion to realize electrical connection, thereby forming a control circuit.

A general lead frame has no flattened welding portion 2021, that is, the lead of the lead frame is approximately a cylinder, the welding between the lead and the pad of the electronic device is not surface welding, and the distance between the pad of the electronic device and two leads is not necessarily adapted, so that the lead pitch may be greater than the pad distance of the electronic device, and the lead pitch may be smaller than the pad distance of the electronic device; at this time, in order to solder the electronic device to the lead frame, it is often necessary to add a flexible wire for transfer soldering: one end of the flexible lead is welded with the bonding pad of the electronic device, and the other end of the flexible lead is welded with the lead seat. If the electronic device bonding pad is very small, the wire diameter of the flexible lead is very small, the flexible lead and the bonding pad and the lead of the electronic device can be welded only by laser welding or energy storage welding, the welding cost is high, and the reject ratio is high; in addition, the manufacturing of the flexible lead, such as a flexible constantan wire and the like, adopts an etching process, so that the waste amount of raw materials is large; the flexible lead is easy to shift or bend and is easy to generate short circuit;

according to the method, a welding plane can be processed by flattening one end part of the lead seat and is used for surface welding of the welding pad of the electronic device, and the welding process can use a solder paste printing process, so that the welding cost is low; and a flexible lead is not required to be added, so that the method has the advantages of low processing cost, less materials and high qualification rate.

The embodiment of the present application further provides a manufacturing method of the lead frame, as shown in fig. 10, including the following steps:

s11, obtaining a lead and a mounting part; preparing a lead and a mounting part, and treating for subsequent processing;

s12, flattening one end part of the lead; that is, one end portion of the lead is flattened to obtain a flattened portion, i.e., a soldering portion 2021, which forms a soldering plane for soldering with the electronic device 10. Specifically, flatten lead wire tip and can extrude the realization through hydraulic pressure punching press, atmospheric pressure, also can extrude through cam mechanism and obtain, this application does not limit this.

S13, the lead 202 is inserted through the hole 2013 of the mounting part 201, so that part of the lead 202 is positioned on the first side of the mounting part 201 and part of the lead 202 is positioned on the second side of the mounting part 201;

s14, potting the installation part 201; that is, an insulating material is poured into the mounting portion to prevent the lead 202 and the mounting portion 201 from being short-circuited. Specifically, glass sealing can be realized by pouring a glass material through the hole 2013. By pouring an insulating material into the mounting portion 201, the lead 202 and the mounting portion 201 are prevented from being short-circuited by the insulating material interposed therebetween. And the potting enables fixation between the lead and the mounting portion housing, i.e., fixation of the lead and the mounting portion.

In the present application, the order of executing the steps is not limited, and the processing may be performed in the order of S12 → S13 → S14, or in the order of S13 → S14 → S12. However, when the process is performed in the sequence of S13 → S14 → S12, the insulating material inside the mounting portion 201 may be damaged when the one end portion of the lead is flattened in the step S12, thereby causing a defective product; in addition, the insulation material may be damaged to cause displacement or loss of the insulation material between the mounting part 201 and the lead 202, thereby easily causing short circuit between the mounting part 201 and the lead 202.

When processing is performed in the sequence S12 → S13 → S14, step S13 is performed by passing the unbanded end through the hole 2013 of the mounting portion 201 so that the flattened portion, i.e., the weld 2021, remains on the first side of the mounting portion 201 and at least a portion of the unbanded portion extends through the void 2013 to the second side of the mounting portion 201.

Further, in one embodiment, the manufacturing method further includes the steps of: and (4) stress relief. And stress relief, namely stress of the lead is removed, so that the lead is prevented from being elastically deformed, and a welding point bears stress, so that the welding is not firm and is easy to strip.

Specifically, the stress removing mode comprises bending and forming, so that the lead loses elastic force; thermal stress relief may also be used. This is not specifically limited by the present application.

In the above embodiments, the lead 202 is a rigid conductive pin, such as a conductive post made of copper, silver, gold, or other alloy, and the conductive pin may also be plated with gold or silver.

As shown in fig. 4, based on the lead frame, the embodiment of the present application further provides a gas detector probe 30, where the gas detector probe 30 includes the lead frame 20 and at least one electronic device, and at least one parameter value of the electronic device is related to a measured value. For example, the electronic device may be a temperature sensing resistor 10, which can sense temperature changes, and when the temperature changes, the resistance value of the temperature sensing resistor changes, and the temperature sensing resistor 100 is welded to the welding portion 2021 of the lead frame 20; the welding mode comprises one or more of laser welding, reflow welding, wave soldering, conductive adhesive bonding and manual welding; the welding mode can be laser welding or melting furnace welding; the soldering process may be a solder paste printing, a red glue process, etc., and is more suitable for a lower cost soldering technique because the soldering portion 2021 has a soldering plane. Specifically, the gas detector probe may be a temperature probe, a humidity probe, a refrigerant detector probe, or the like. The Temperature sensing resistor may be an NTC (Negative Temperature Coefficient) resistor or a PTC (Positive Temperature Coefficient) resistor.

Based on the gas detector probe 30, the embodiment of the present application further provides a gas detector assembly 300, and the gas detector assembly 300 may specifically be a refrigerant detector assembly. As shown in fig. 5-6, gas detector assembly 300 includes temperature sensing resistor 100, wire holder 20, and base 40; the temperature sensing resistor 100 is welded on the flattened welding part 2021 of the lead base 20 to obtain a gas detector probe 30; the base has a cavity into which the gas detector probe 30 fits into the cavity of the base 40, resulting in a gas detector assembly 300. Further, in one embodiment, the base 40 is provided with a vent 401, through which the temperature sensing resistor 100 of the gas probe 30 can better detect changes in ambient temperature, humidity or gas concentration.

Further, the embodiment of the present application further provides a refrigerant detector assembly 3001. As shown in fig. 7-9, the refrigerant detector assembly 3001 includes a base 40 and at least 2 gas detector probes: a first gas detector probe 301 and a second gas detector probe 302; a first air chamber 403 and a second air chamber 402 are arranged inside the base 40; the first gas detector probe 301 comprises a first lead base and a first temperature sensing resistor, and the first temperature sensing resistor is welded on the welding part of the first lead base; the second gas detector probe 302 also includes a second wire holder and a second temperature sensing resistor welded to the flattened weld of the wire holder. The first and/or second wire holders are shown in fig. 2-3: the lead wire structure comprises a mounting part and at least 2 lead wires, wherein at least part of each lead wire is positioned on a first side of the mounting part, and at least part of each lead wire is positioned on a second side of the mounting part; the lead is a conductor; the lead on the first side of the mounting portion has a bonding portion having a bonding plane in the axial direction of the lead.

The first and second temperature sensing resistors may be NTC resistors, the NTC resistor of the second gas detector probe 302 being located inside the second gas chamber 402, and the NTC resistor of the first gas detector probe 301 being located inside the first gas chamber 403.

The base 40 is further provided with a mounting hole 404, and the size of the mounting hole 404 is matched with the size of the mounting part 201 of the lead wire seat of the gas detector probe 302; the gas detector probe 301/302 can be placed in the first gas chamber 403 and the second gas chamber 402 through the corresponding mounting holes 404, respectively;

the base 40 is provided with the air vent 401, the air vent 401 is communicated with the first air chamber 403 and the external space of the base, and the air probe can sense the refrigerant in the external environment through the air vent 401, so that the refrigerant detection function is achieved. That is, the gas detector probe may be a refrigerant detector probe and the gas detector assembly may be a refrigerant detector assembly. In other words, the refrigerant detector assembly is a kind of gas detector assembly. Specifically, the refrigerant may be an A2L refrigerant such as R32, which is flammable, and in order to ensure safety, it is necessary to monitor whether the refrigerant leaks to prevent danger. Of course other gases may be detected. Because the thermal conductivity of different gases is different, the NTC resistor can be used to detect different gas concentration information. For example, the R32 refrigerant and the air have different heat conductivities, and if the R32 refrigerant exists, the NTC resistance value changes, and different electric signals are generated.

In this embodiment, the second air chamber 402 is a reference air chamber, and the first air chamber 403 is a detection air chamber; further, the second air chamber 402 may be configured to be in a sealed state, and a gas without a refrigerant, such as air, may be injected to generate a reference signal without the measured gas; and the second air chamber is communicated with the external space through the air holes 401, and when a refrigerant exists in the external space, the resistance value of the NTC resistor on the probe 301 of the gas detector changes, so that a detection electric signal representing the information of the refrigerant is generated. In particular, the external space may be an indoor space in which an indoor unit of an air conditioning system is installed, such as an air-conditioned room. When the refrigerant detector assembly 3001 operates, the NTC resistor in the second air chamber 402 generates a reference electrical signal, and the NTC resistor in the first air chamber 403 generates a detection electrical signal, and the reference electrical signal and the detection electrical signal are compared to determine whether a refrigerant exists in the external environment, i.e., whether the refrigerant leaks from the air conditioning system. In addition, by arranging the reference air chamber, measurement errors caused by temperature and humidity can be compensated to a certain extent; temperature and humidity compensation can be further performed, and detection precision is improved. Of course, the refrigerant detector assembly can also be provided with only one detection air chamber, namely, the first air chamber, and the measurement error caused by the environment is compensated through software and hardware, so that the refrigerant detection accuracy is improved.

Further, as shown in fig. 9, the base 40 is provided with a second limit mechanism 4041; the second limit mechanism 4041 on the base is adapted to the first limit mechanism 20111 on the lead holder 20 to form a limit, so that the installation or fixation is facilitated.

Further, as shown in fig. 3, if the mounting portion includes a first stepped portion 2011 and a second stepped portion 2012, the first stepped portion is provided with a first limiting mechanism 20111, and the first limiting mechanism 20111 is a protruding portion protruding along a radial direction of the first stepped portion 2011; the first stepped portion 2011 is cylindrical, the second stepped portion 2012 is also cylindrical, the first stepped portion and the second stepped portion are coaxially disposed, and the diameter of the first stepped portion is greater than that of the second stepped portion. Accordingly, the mounting aperture 404 of the base 40 includes a first aperture wall 4042, a second aperture wall 4043, and a third aperture wall 4044; the first aperture wall 4042 is connected at one end to the second aperture wall 4043 and the second aperture wall 4043 is connected at the other end to the third aperture wall 4044; first step 2011 is positioned within the through-hole defined by first hole wall 4042 and second step 2012 is positioned within the through-hole defined by third hole wall 4044. The second limiting mechanism 4041 of the base 40 is a protrusion protruding along the radial direction of the first hole wall 4042, and is a concave structure relative to the base bottom.

After the gas detector probes 301 and 302 are installed in the corresponding gas chambers, the installation holes 404 of the base 40 need to be sealed, specifically, the installation holes 404 can be sealed by using a sealant; of course, other modes may be used, for example, a mode of using the mounting portion to be in interference fit with the mounting hole and adding the sealant, and a mechanical sealing mode may also be adopted, which is not limited in this application.

In the description of the specification, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the specification. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present specification, "a plurality" means at least two, e.g., two, three, etc., unless explicitly defined otherwise.

The above description is only a preferred embodiment of the present disclosure, and should not be taken as limiting the present disclosure, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present disclosure should be included in the protection scope of the present disclosure.

Claims (10)

1. A lead wire holder is characterized by comprising a mounting part and at least 2 lead wires; at least a portion of each of the leads is located on a first side of the mounting portion and at least a portion of each of the leads is located on a second side of the mounting portion; the lead is a conductor; the lead on the first side of the mounting portion has a bonding portion having a bonding plane in an axial direction of the lead.

2. The wire holder of claim 1, wherein the mounting portion comprises a conductive casing having at least two holes formed therethrough; different ones of the leads pass through the mounting portion through different apertures through the conductive housing; the mounting part is internally filled with an insulating material; and an insulating material filled in the mounting part is arranged between the conductive shell and the lead at intervals.

3. The wire holder according to claim 2, wherein the mounting portion comprises a first stepped portion and a second stepped portion, the first stepped portion being provided with a first stopper mechanism; the second step portion is closer to the welding plane than the first step portion.

4. The wire holder according to claim 3, wherein the first step portion and the second step portion are each cylindrical, the first step portion and the second step portion are coaxially arranged, and a diameter of the first step portion is larger than a diameter of the second step portion.

5. The wire holder according to claim 1, wherein the mounting portion is entirely made of an insulating material.

6. The wire holder according to any one of claims 1 to 5, wherein the wire on the first side of the mounting portion has a bent portion.

7. A gas detector probe comprising a lead frame and electronics as claimed in any one of claims 1 to 6; the welding part of the lead seat is welded with the welding part of at least part of the electronic device.

8. A gas detector probe according to claim 7 wherein the electronic device is a temperature sensing resistor packaged in the form of 0201/0402/0603/0805/1206;

the welding mode comprises one or more of laser welding, reflow soldering, wave soldering, conductive adhesive bonding and manual welding.

9. A refrigerant detector assembly including a gas detector probe according to claim 7 or 8.

10. The refrigerant detector assembly of claim 9 further comprising a pedestal, the pedestal including a cavity, the electronics of the gas detector probe being located within the cavity.

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