CN218916589U

CN218916589U - Gas detector assembly and refrigerant detector assembly

Info

Publication number: CN218916589U
Application number: CN202222603349.7U
Authority: CN
Inventors: 陈石国
Original assignee: Hangzhou Leaderway Electronics Co ltd
Current assignee: Hangzhou Leaderway Electronics Co ltd
Priority date: 2022-01-05
Filing date: 2022-09-23
Publication date: 2023-04-25
Anticipated expiration: 2032-09-23

Abstract

The embodiment of the utility model provides a gas detector assembly and a refrigerant detector assembly. The gas detector assembly includes: comprises a base, an electronic device and a lead seat; the lead seat comprises a mounting part and at least 2 leads; at least a portion of each of the leads is located on the first side of the mounting portion and at least a portion of each of the leads is located on the second side of the mounting portion; the lead is a conductor; the lead wire on the first side of the mounting part is provided with a welding part, and the welding part is provided with a welding plane in the axial direction of the lead wire; the electronic device is welded and fixed with the welding part; the base includes a cavity within which the electronics are located. The gas detector assembly has the advantage of low production cost.

Description

Gas detector assembly and refrigerant detector assembly

[ field of technology ]

The application relates to the technical field of electronic device production and processing, in particular to a gas detector assembly and a refrigerant detector assembly.

[ background Art ]

Capacitance, inductance, and resistance are common basic electronic devices; they can be used to fabricate a variety of more complex electronic devices; the characteristics of the basic electronic device can be used to manufacture various detectors, such as temperature characteristics of resistors, temperature detectors or gas detectors. However, how to process basic electronic devices to obtain corresponding detectors is a technical problem to be solved.

[ utility model ]

In view of the above, the embodiment of the utility model provides a gas detector assembly and a refrigerant detector assembly, and the gas detector assembly has the advantage of low production cost.

In order to achieve the above object, the embodiment of the present utility model provides the following technical solutions:

a gas detector assembly comprising a base, electronics, and a lead frame; the lead seat comprises a mounting part and at least 2 leads; at least a portion of each of the leads is located on the first side of the mounting portion and at least a portion of each of the leads is located on the second side of the mounting portion; the lead is a conductor; the lead wire positioned on the first side of the mounting part is provided with a welding part; the electronic device is welded and fixed with the welding part; the base includes a cavity within which the electronics are located.

In one embodiment, the electronic device is a temperature-sensitive resistor; the welding part has a welding plane in an axial direction of the lead; and the temperature sensing resistor is welded and fixed with the welding part through the welding plane.

In one embodiment, the base is provided with ventilation holes; the ventilation holes are communicated with the cavity and the outer space of the base.

The embodiment of the application also provides a refrigerant detector assembly, which comprises a base and a first gas detector probe; the first gas detector probe comprises a first lead seat and a first temperature sensing resistor; the first lead seat comprises a mounting part and at least 2 leads; at least a portion of each of the leads is located on the first side of the mounting portion and at least a portion of each of the leads is located on the second side of the mounting portion; the lead is a conductor; the lead wire located at the first side of the mounting part is provided with a welding part, and the welding part is provided with a welding plane in the axial direction of the lead wire; the first temperature sensing resistor is welded and fixed with the welding part; the base comprises a first air chamber and air holes; the first temperature sensing resistor is positioned in the first air chamber, and the air holes are communicated with the first air chamber and the outer space of the base;

in one embodiment, a second gas detector probe is also included; the second gas detector probe comprises a second lead seat and a second temperature sensing resistor, wherein the second lead seat comprises a mounting part and at least 2 leads; at least part of each lead wire of the second lead wire seat is positioned on the first side of the mounting part of the second lead wire seat, and at least part of each lead wire of the second lead wire seat is positioned on the second side of the mounting part of the second lead wire seat; the lead wire of the second lead seat is a conductor; the lead wire positioned on the first side of the mounting part of the second lead seat is provided with a welding part of the second lead seat, and the welding part of the second lead seat is provided with a welding plane in the axial direction of the lead wire of the second lead seat; the second temperature sensing resistor is welded and fixed with the welding part; the base further comprises a second air chamber; the second temperature sensing resistor is located in the second air chamber.

In one embodiment, the base includes at least two mounting holes; the first gas detector probe and the second gas detector probe are installed in the first gas chamber and the second gas chamber through the installation holes.

In one embodiment, the mounting portions of the first and second lead holders include first and second stepped portions, the first stepped portion being provided with a stopper mechanism; the second step is closer to the welding plane than the first step; the first step part is cylindrical, the second step part is also cylindrical, and the first step part and the second step part are coaxially arranged;

the mounting hole comprises a first hole wall, a second hole wall and a third hole wall; one end of the first hole wall is connected with one end of the second hole wall, and the other end of the second hole wall is connected with the third hole wall; the first step part is positioned in the through hole formed by the first hole wall, and the second step part is positioned in the through hole formed by the third hole wall.

In one embodiment, the first step portion is provided with a first stopper mechanism including one protruding portion protruding in a radial direction of the first step portion; the base is provided with a second limiting mechanism, and the second limiting mechanism comprises a protruding portion protruding along the radial direction of the first hole wall 4042 and is of a concave structure relative to the bottom of the base.

In one embodiment, the first temperature-sensing resistor is an NTC resistor and/or the second temperature-sensing resistor is an NTC resistor.

In one embodiment, sealant is coated between the mounting seat of the first gas detector probe and the mounting hole corresponding to the base; and sealing glue is coated between the mounting seat of the second gas detector probe and the mounting hole corresponding to the base.

The embodiment of the application also provides a gas detector assembly, which comprises a base, an electronic device and a lead seat; the lead wire of the lead wire seat is provided with a welding part, the welding part is provided with a welding plane, and after the electronic device is welded with the welding part with the welding plane, the electronic device is arranged in the cavity of the base, so that the electronic device has the advantage of low production cost.

The embodiment of the application also provides a refrigerant detector assembly, which comprises a base and a first gas detector probe; the first gas detector probe comprises a first lead seat and a first temperature sensing resistor; the first lead seat is provided with a welding part, and the welding part is provided with a welding plane; the first temperature sensing resistor is welded and fixed with the welding part; the first temperature sensing resistor is connected with the welding part with the welding plane, and has the advantage of low production cost. The base comprises a first air chamber and air holes; the first temperature sensing resistor is positioned in the first air chamber, and the air holes are communicated with the first air chamber and the outer space of the base; through the bleeder vent, refrigerant detector subassembly can detect the refrigerant concentration change of base outside space or detect whether external refrigerant exists.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of an electronic device provided in the present application before soldering with a lead;

fig. 2 is a schematic structural diagram of a lead frame according to an embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of a lead frame according to another embodiment of the present disclosure;

FIG. 4 is a schematic diagram of a gas detector probe according to an embodiment of the present disclosure;

FIG. 5 is a schematic diagram of a gas detector assembly according to an embodiment of the present disclosure;

FIG. 6 is a schematic view of the gas detector assembly of FIG. 5 prior to installation;

FIG. 7 is a schematic structural diagram of a refrigerant detector according to an embodiment of the present disclosure before installation;

FIG. 8 is a schematic cross-sectional view of a refrigerant detector according to an embodiment of the present disclosure;

FIG. 9 is a schematic view of another view angle structure of a refrigerant detector before installation according to an embodiment of the present disclosure;

fig. 10 is a flowchart of a method for manufacturing a lead frame according to an embodiment of the present disclosure;

fig. 11 is a schematic diagram of a structure of a lead after stress relief according to an embodiment of the present application.

[ detailed description ] of the utility model

For a better understanding of the technical solution of the present utility model, the following detailed description of the embodiments of the present utility model refers to the accompanying drawings. It should be understood that the described embodiments are merely some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The terminology used in the embodiments of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used in this application and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should be understood that the term "and/or" as used herein is merely one way of describing an association of associated objects, meaning that there may be three relationships, e.g., a and/or b, which may represent: the first and second cases exist separately, and the first and second cases exist separately. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship. In the following description, directional or positional relationships such as the terms "inner", "outer", "upper", "lower", "left", "right", etc., are presented merely to facilitate describing the embodiments and simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the application.

As shown in fig. 1, in some cases, it may be desirable to solder out pins 102 on pads 101 of electronic device 10 to enable use of electronic device 10. The electronic device 10 may be a chip capacitor, chip inductor or chip resistor, and its package form may be 0201/0402/0603/0805/1206/etc. The leads 102 may be flexible wires, such as constantan wires, or may be hard pins, such as copper, silver, gold, or other alloy conductive posts. Because the constantan wires are generally smaller, a laser welding mode is adopted for small-package patch devices; when the lead is cylindrical, the welding between the lead and the bonding pad 101 is spot welding, and laser welding is also preferable. However, laser welding is relatively expensive; in order to reduce the soldering cost, one end of the lead pin may be pressed flat, so that the soldering between the lead pin and the pad 101 is surface soldering. The surface welding can adopt various welding modes including welding, crimping, brazing and the like, and more particularly can be reflow soldering, wave soldering, selective wave soldering, manual welding, resistance welding, ultrasonic welding, friction welding, laser welding, electron beam welding and the like; the welding can be solder paste welding, gold welding, silver welding or metal alloy welding; the surface welding may also be performed by means of bonding, such as conductive bonding with conductive glue. The present application is not limited in this regard.

As shown in fig. 2 and 3, the embodiment of the present application provides a lead frame 20, including a mounting portion 201 and at least 2 leads 202, at least a portion of each lead 202 being located on a first side of the mounting portion 201, at least a portion of each lead 202 being located on a second side of the mounting portion 202, the leads 202 being conductors; at least a portion of the wire 202 on the first side is flattened to form a bond 2021, the flattened wire having at least one bond plane, i.e., the bond 2021 has one bond plane; the bonding plane is located in the axial direction of the wire. The welding plane described in the present application is an engineering approximate plane, and is not required to be an absolute plane in terms of mathematics. The welding part 2021 of the lead 202 comprises the welding plane, and the welding of the lead 202 and the bonding pad 101 of the electronic device 10 is performed through the welding part 2021 and the bonding pad 101 of the electronic device, so that the welding is more firm and convenient, is more suitable for low-cost welding, and is beneficial to reducing the production and processing cost of welding. The mounting portion 201 may be made of an insulating material, and serves at least a fixing function for the lead 202. The mounting portion 201 may also be a hollow device made of an electrically conductive material; specifically, the mounting portion 201 may be made of the same material as the lead 202, for example, a metal conductor such as copper, silver or gold plating; of course, the mounting portion 201 and the lead 202 may be made of different conductive materials. When the mounting portion is made of a conductive material, an insulating material, such as ceramic, glass, plastic, insulating glue, etc., needs to be poured into the hollow mounting portion 201 to prevent a short circuit between the lead 202 and the mounting portion 201, and specifically, an insulation between the lead and the mounting portion may be achieved by using a glass sealing manner.

As shown in fig. 3, when the mounting portion 201 is a hollow device made of a conductive material, that is, the mounting portion 201 includes a conductive housing, the mounting portion 201 is provided with at least 2 holes 2013, and the number of holes 2013 is the same as the number of leads 202; the lead 202 can be passed through the aperture 2013 such that a portion of the lead 202 is located on a first side of the mounting portion 201 and a portion of the lead 202 is located on a second side of the mounting portion 201; and an insulating material can be poured into the mounting portion 201 through the hole, thereby preventing a short circuit between the lead 202 and the mounting portion 201.

In one embodiment, the cross-section of the wire 202 is circular except for the solder 2021; the inner diameter of the bore 2013 is greater than the radius of the circular cross-section of the lead 202.

Further, as shown in fig. 3, the mounting portion includes a first step 2011 and a second step 2012, the first step is provided with a first limiting mechanism 20111, the first step 2011 is cylindrical, the second step 2012 is also cylindrical, the first step and the second step are coaxially arranged, and the diameter of the first step is larger than that of the second step. When the lead frame 20 is mounted or fixed on a certain base, the first limiting mechanism 20111 is matched with the second limiting mechanism on the base to form a limit, so that the lead frame is convenient to mount or fix.

In order to accommodate the pad distance of the electronic device 10, the lead frame 20 provided in the embodiment of the present application, as shown in fig. 3, has a bent portion 2022 at the lead portion on the first side of the mounting portion 201, where the bent portion makes the distance of the bonding portion 2021 of the lead 202 accommodate the electronic device pad distance. Meanwhile, the lead stress can be removed by bending, so that the electronic device 10 is prevented from easily falling off when being welded on the lead. Specifically, the shape of the bent portion is not limited. As shown in fig. 11, the bending part can also be bent outwards to adapt to the welding of the electronic device with larger pad distance, and meanwhile, the bending operation can remove the lead stress and improve the welding firmness; of course, if the distance between the two leads 202 is equal to the electronic device pad distance, the soldering can be completed without bending the leads. The distance of the lead portions on the second side of the mounting portion 201 coincides with the package on the PCB (printed circuit board) and the lead pads can be soldered to the PCB by the leads on the second side of the mounting portion to achieve electrical connection to form a control circuit.

The typical lead frame has no flattened bond 2021, i.e., the leads of the lead frame are approximately cylindrical, which are not surface bonded to the bond pads of the electronic device, nor do the distances between the bond pads of the electronic device and the two leads necessarily match, and the lead spacing may be greater than the bond pad distance of the electronic device, or the lead spacing may be less than the bond pad distance of the electronic device; at this time, in order to solder the electronic device to the lead frame, it is often necessary to add a flexible wire for transfer soldering: one end of the flexible wire is welded with the bonding pad of the electronic device, and then the other end of the flexible wire is welded with the lead seat. If the bonding pad of the electronic device is small, the wire diameter of the flexible wire is small, and the flexible wire, the bonding pad of the electronic device and the lead wire can be welded only by laser welding or energy storage welding, so that the welding cost is high and the reject ratio is high; and the manufacturing of the flexible lead, such as flexible constantan wires, adopts an etching process, and the waste amount of raw materials is large; the flexible lead is easy to shift or bend and is extremely easy to generate short circuit;

the flattening operation is carried out at one end of the lead seat, a welding plane can be processed for surface welding with the bonding pad of the electronic device, a solder paste printing process can be used in the welding process, and the welding cost is low; and the flexible wire does not need to be added, and the method has the advantages of low processing cost, less materials and high qualification rate.

The embodiment of the application also provides a manufacturing method of the lead seat, as shown in fig. 10, comprising the following steps:

s11, acquiring a lead and a mounting part; namely, preparing the lead wire and the mounting part for subsequent processing;

s12, flattening one end part of the lead; that is, one end portion of the lead is flattened to obtain a flattened portion, i.e., a solder 2021, which forms a solder plane for soldering with the electronic device 10. Specifically, one end of the flattening lead wire can be extruded by hydraulic stamping and air pressure, and can be obtained by extruding through a cam mechanism, which is not limited in the application.

S13, passing the lead 202 through the hole 2013 of the mounting portion 201, so that a part of the lead 202 is located at the first side of the mounting portion 201 and a part of the lead 202 is located at the second side of the mounting portion 201;

s14, encapsulating the mounting part 201; that is, an insulating material is poured into the mounting portion, preventing the lead 202 and the mounting portion 201 from being short-circuited. Specifically, the glass material may be poured through the hole 2013 to realize glass sealing. By filling the inside of the mounting portion 201 with an insulating material, the lead 202 and the mounting portion 201 are prevented from being short-circuited by the insulating material. And the encapsulation can realize the fixation between the lead wire and the mounting part shell, namely, the fixation of the lead wire and the mounting part.

The order of execution of the steps is not limited, and the steps may be performed in the order s12→s13→s14, or may be performed in the order s13→s14→s12. However, if the steps s13→s14→s12 are sequentially performed, there is a possibility that the insulating material in the mounting portion 201 is broken when flattening one end portion of the lead wire in step S12, and the finished product is defective; in addition, breakage of the insulating material may cause displacement or loss of the insulating material between the mounting portion 201 and the lead 202, thereby causing a short circuit between the mounting portion 201 and the lead 202 to occur extremely easily.

When processing in the order s12→s13→s14, step S13 should be performed such that the unbuckled end portion passes through the hole 2013 of the mounting portion 201, such that the flattened portion, i.e., the weld 2021, remains on the first side of the mounting portion 201, while at least a portion of the unbuckled portion passes through the void 2013, extending to the second side of the mounting portion 201.

Further, in one embodiment, the above manufacturing method further includes the steps of: and (5) stress relief. Stress relief refers to stress relief of the lead wire, preventing the lead wire from elastic deformation and enabling welding spots to bear stress, so that welding is unstable and easy to be relieved.

Specifically, the stress relief mode comprises bending and forming, so that the lead loses elastic force; a heating stress relief mode can also be used. This is not particularly limited in this application.

In the above embodiment, the lead 202 is a conductive pin with a certain rigidity, such as a copper pillar, a silver pillar, a gold pillar, or other alloy, and the conductive pin may be gold-plated or silver-plated.

As shown in fig. 4, based on the above-mentioned lead frame, the present embodiment also provides a gas detector probe 30, and the gas detector probe 30 includes the above-mentioned lead frame 20 and at least one electronic device, and at least one parameter value of the electronic device is related to the measured value. For example, the electronic device may be a temperature-sensing resistor 10, the temperature-sensing resistor may sense a temperature change, and when the temperature changes, the resistance of the temperature-sensing resistor changes, and the temperature-sensing resistor 100 is soldered to the soldering portion 2021 of the lead frame 20; the welding mode comprises one or more of laser welding, reflow soldering, wave crest welding, conductive adhesive bonding and manual welding; the soldering process may be a solder paste printing, a red glue process, etc., and is more suitable for lower cost soldering techniques because the solder 2021 has a soldering plane. Specifically, the gas detector probe may be a refrigerant detector probe or the like. The temperature-sensing resistor may be an NTC (Negative Temperature Coefficient: negative temperature coefficient) resistor, a PTC (Positive Temperature Coefficient: positive temperature coefficient) resistor.

Based on the gas detector probe 30, the embodiment of the present application further provides a gas detector assembly 300, and the gas detector assembly 300 may be a refrigerant detector assembly. As shown in fig. 5-6, the gas detector assembly 300 includes a temperature sensing resistor 100, a lead frame 20, and a base 40; the temperature-sensing resistor 100 is welded on the flattened welding part 2021 of the lead frame 20 to obtain a gas detector probe 30; the base has a cavity and the gas detector probe 30 is received in the cavity of the base 40 to provide the gas detector assembly 300. Further, in one embodiment, the base 40 is provided with a vent 401, and the temperature sensing resistor 100 of the gas detector probe 30 can better detect the change of the ambient temperature, humidity or gas concentration through the vent 401.

Further, the embodiment of the application also provides a refrigerant detector assembly 3001. As shown in fig. 7-9, the coolant detector assembly 3001 includes a base 40 and at least 2 gas detector probes: a first gas detector probe 301 and a second gas detector probe 302; a first air chamber 403 and a second air chamber 402 are arranged inside the base 40; the first gas detector probe 301 comprises a first lead seat and a first temperature sensing resistor, and the first temperature sensing resistor is welded at a welding part of the first lead seat; the second gas detector probe 302 also includes a second lead frame and a second temperature-sensing resistor welded to the flattened weld of the lead frame. The first and/or second lead frame is shown in fig. 2-3: the device comprises a mounting part and at least 2 leads, wherein at least part of each lead is positioned on a first side of the mounting part, and at least part of each lead is positioned on a second side of the mounting part; the lead is a conductor; the lead at the first side of the mounting portion has a welded portion having a welding plane in an axial direction of the lead.

The first and second temperature sensing resistors may be NTC resistors, the NTC resistor of the second gas detector probe 302 being located inside the second gas chamber 402 and the NTC resistor of the first gas detector probe 301 being located inside the first gas chamber 403.

The base 40 is also provided with a mounting hole 404, and the size of the mounting hole 404 is adapted to the size of the mounting part 201 of the lead frame of the gas detector probe 302; the gas detector probes 301/302 can be placed in the first gas chamber 403 and the second gas chamber 402 through corresponding mounting holes 404, respectively;

the base 40 is provided with a vent 401, the vent 401 is communicated with the first air chamber 403 and the outer space of the base, and the air detector probe can sense the refrigerant in the external environment through the vent 401, thereby playing a role in refrigerant detection. Specifically, the refrigerant may be an A2L refrigerant such as R32, which is flammable, and in order to ensure safety, whether the refrigerant leaks or not needs to be monitored to prevent danger. Of course, it can also be used to detect other gases such as carbon dioxide, hydrogen, ammonia, etc. Because the thermal conductivity of different gases is different, NTC resistors can be used to detect different gas concentration information. For example, the R32 refrigerant and air have different thermal conductivities, and if the R32 refrigerant is present, the NTC resistance changes, and different electrical signals are generated.

In this embodiment, the second air chamber 402 is a reference air chamber, and the first air chamber 403 is a detection air chamber; further, the second air chamber 402 may be configured to be sealed, and a gas, such as air, without a refrigerant may be injected to generate a reference signal without the measured gas; the second air chamber is communicated with the external space through the air holes 401, when the external space has the refrigerant, the resistance value of the NTC resistor on the gas detector probe 301 is changed, and an electric signal representing the refrigerant information detection is generated. Specifically, the external space may be an indoor space equipped with an indoor unit of an air conditioning system, such as a room equipped with an air conditioner. When the refrigerant detector assembly 3001 works, the NTC resistor in the second air chamber 402 generates a reference electric signal, the NTC resistor in the first air chamber 403 generates a detection electric signal, and by comparing the reference electric signal and the detection electric signal, whether the refrigerant exists in the external environment, that is, whether the air conditioning system leaks the refrigerant can be judged. In addition, by arranging the reference air chamber, measurement errors caused by temperature and humidity can be made up to a certain extent; temperature and humidity compensation can be further performed, and detection accuracy is improved. Of course, the refrigerant detector assembly can be provided with only one detection air chamber, namely the first air chamber, and the measurement error caused by the environment is compensated through software and hardware, so that the refrigerant detection accuracy is improved.

Further, as shown in fig. 9, the base 40 is provided with a second limit mechanism 4041; the second limiting mechanism 4041 on the base is adapted to the first limiting mechanism 20111 on the lead frame 20 to form a limit, so as to be convenient for installation or fixation.

Further, as shown in fig. 3, if the mounting portion includes a first step 2011 and a second step 2012, the first step is provided with a first limiting mechanism 20111, and the first limiting mechanism 20111 is a protruding portion protruding along a radial direction of the first step 2011; the first step 2011 is cylindrical, the second step 2012 is also cylindrical, the first step and the second step are coaxially disposed, and the diameter of the first step is larger than the diameter of the second step. Correspondingly, the mounting hole 404 of the base 40 includes a first hole wall 4042, a second hole wall 4043 and a third hole wall 4044; one end of the first hole wall 4042 is connected with one end of the second hole wall 4043, and the other end of the second hole wall 4043 is connected with the third hole wall 4044; the first step 2011 is located in the through hole formed by the first hole wall 4042, and the second step 2012 is located in the through hole formed by the third hole wall 4044. The second limiting mechanism 4041 of the base 40 is a protruding portion protruding along the radial direction of the first hole wall 4042, and is a concave structure relative to the bottom of the base.

After the gas detector probes 301 and 302 are installed in the corresponding gas chambers, the mounting holes 404 of the base 40 need to be sealed, and specifically, the mounting holes 404 may be sealed with sealant; of course, other manners, such as a manner of using the mounting portion and the mounting hole in an interference fit and adding sealant, or a mechanical sealing manner, may be used, which is not limited in this application.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present specification. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present specification, the meaning of "plurality" means at least two, for example, two, three, etc., unless explicitly defined otherwise.

The foregoing description of the preferred embodiments is provided for the purpose of illustration only, and is not intended to limit the scope of the disclosure, since any modifications, equivalents, improvements, etc. that fall within the spirit and principles of the disclosure are intended to be included within the scope of the disclosure.

Claims

1. A gas detector assembly comprising a base, electronics, and a lead frame; the lead seat comprises a mounting part and at least 2 leads; at least a portion of each of the leads is located on the first side of the mounting portion and at least a portion of each of the leads is located on the second side of the mounting portion; the lead is a conductor; the lead wire positioned on the first side of the mounting part is provided with a welding part; the electronic device is welded and fixed with the welding part; the base includes a cavity within which the electronics are located.

2. The gas detector assembly of claim 1, wherein the electronic device is a temperature-sensing resistor; the welding part has a welding plane in an axial direction of the lead; and the temperature sensing resistor is welded and fixed with the welding part through the welding plane.

3. The gas detector assembly of claim 1, wherein the base is provided with ventilation holes; the ventilation holes are communicated with the cavity and the outer space of the base.

4. The refrigerant detector assembly is characterized by comprising a base and a first gas detector probe; the first gas detector probe comprises a first lead seat and a first temperature sensing resistor; the first lead seat comprises a mounting part and at least 2 leads; at least a portion of each of the leads is located on the first side of the mounting portion and at least a portion of each of the leads is located on the second side of the mounting portion; the lead is a conductor; the lead wire positioned on the first side of the mounting part is provided with a welding part; the first temperature sensing resistor is welded and fixed with the welding part; the base comprises a first air chamber and air holes; the first temperature sensing resistor is positioned in the first air chamber, and the air holes are communicated with the first air chamber and the outer space of the base.

5. The refrigerant detector assembly according to claim 4, wherein the welding portion has a welding plane in an axial direction of the lead wire, and the first temperature-sensing resistor is welded to the welding portion through the welding plane.

6. The refrigerant detector assembly according to claim 5, further comprising a second gas detector probe; the second gas detector probe comprises a second lead seat and a second temperature sensing resistor, wherein the second lead seat comprises a mounting part and at least 2 leads; at least part of each lead wire of the second lead wire seat is positioned on the first side of the mounting part of the second lead wire seat, and at least part of each lead wire of the second lead wire seat is positioned on the second side of the mounting part of the second lead wire seat; the lead wire of the second lead seat is a conductor; the lead wire positioned on the first side of the mounting part of the second lead seat is provided with a welding part of the second lead seat, and the welding part of the second lead seat is provided with a welding plane in the axial direction of the lead wire of the second lead seat; the second temperature sensing resistor is welded and fixed with the welding part; the base further comprises a second air chamber; the second temperature sensing resistor is located in the second air chamber.

7. The refrigerant detector assembly according to claim 6, wherein the base includes at least two mounting holes; the first gas detector probe and the second gas detector probe are installed in the first gas chamber and the second gas chamber through the installation holes.

8. The refrigerant detector assembly according to claim 7, wherein the mounting portions of the first and second lead frames include a first step portion and a second step portion, the first step portion being provided with a stopper mechanism; the second step is closer to the welding plane than the first step; the first step part is cylindrical, the second step part is also cylindrical, and the first step part and the second step part are coaxially arranged;

9. The refrigerant detector assembly according to claim 8, wherein the first step portion is provided with a first stopper mechanism including a protruding portion protruding in a radial direction of the first step portion; the base is provided with a second limiting mechanism, and the second limiting mechanism comprises a protruding portion protruding along the radial direction of the first hole wall and is of a concave structure relative to the bottom of the base.

10. The refrigerant detector assembly according to any of the claims 6-9, characterized in that the first temperature-sensing resistor is an NTC resistor and/or the second temperature-sensing resistor is an NTC resistor; the NTC resistor is packaged in 0201/0402/0603/0805/1206.

11. The refrigerant detector assembly according to claim 10, wherein a sealant is coated between the mounting seat of the first gas detector probe and the mounting hole corresponding to the base; and sealing glue is coated between the mounting seat of the second gas detector probe and the mounting hole corresponding to the base.