CN116551096A - Tool fixture, welding method, gas detector probe and manufacturing method thereof - Google Patents
Tool fixture, welding method, gas detector probe and manufacturing method thereof Download PDFInfo
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- CN116551096A CN116551096A CN202211163087.5A CN202211163087A CN116551096A CN 116551096 A CN116551096 A CN 116551096A CN 202211163087 A CN202211163087 A CN 202211163087A CN 116551096 A CN116551096 A CN 116551096A
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- pressing plate
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- 238000003466 welding Methods 0.000 title claims abstract description 94
- 239000000523 sample Substances 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 238000003825 pressing Methods 0.000 claims abstract description 62
- 229910000679 solder Inorganic materials 0.000 claims description 44
- 238000005476 soldering Methods 0.000 claims description 39
- 230000008569 process Effects 0.000 claims description 14
- 230000017525 heat dissipation Effects 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 238000007639 printing Methods 0.000 claims description 7
- 239000002969 artificial stone Substances 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 230000004308 accommodation Effects 0.000 claims 1
- 239000007789 gas Substances 0.000 description 34
- 239000003507 refrigerant Substances 0.000 description 11
- 230000000875 corresponding effect Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 7
- WABPQHHGFIMREM-FTXFMUIASA-N lead-202 Chemical compound [202Pb] WABPQHHGFIMREM-FTXFMUIASA-N 0.000 description 3
- 229910001006 Constantan Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
- G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
- G01D5/16—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying resistance
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The embodiment of the invention provides a tool fixture, a welding method, a gas detector probe and a manufacturing method thereof. The tool fixture is used for welding; the tool fixture comprises a tray and a pressing plate; the tray is at least provided with a first limit groove; the pressing plate is provided with at least a first through hole; the first limiting groove at least can accommodate part of the element to be welded and limit the element to be welded; when the tray is assembled with the pressing plate for use, the first through hole is positioned at the first side of the first limiting groove. The tool fixture can improve welding efficiency.
Description
[ field of technology ]
The application relates to the technical field of electronic device production and processing, in particular to a tool fixture, a welding method, a gas detector probe and a manufacturing method thereof.
[ background Art ]
Capacitance, inductance, and resistance are common basic electronic devices; they can be used to fabricate a variety of more complex electronic devices; the characteristics of the basic electronic device can be used to manufacture various detectors, such as temperature characteristics of resistors, temperature detectors or gas detectors. However, how to process basic electronic devices to obtain corresponding detectors is a technical problem to be solved.
[ invention ]
In view of this, the embodiment of the application provides a tool fixture, a welding method, a gas detector probe and a manufacturing method thereof, and the tool fixture can improve welding efficiency.
In order to achieve the above purpose, the embodiment of the present invention provides the following technical solutions:
a tooling fixture, wherein the tooling fixture is used for welding; the tool fixture comprises a tray and a pressing plate; the tray is at least provided with a first limit groove; the pressing plate is provided with at least a first through hole; the first limiting groove at least can accommodate part of the element to be welded and limit the element to be welded; when the tray is assembled with the pressing plate for use, the first through hole is positioned at the first side of the first limiting groove.
At least part of the to-be-welded elements are placed in the first limiting groove, and the to-be-welded elements are limited, so that the to-be-welded elements cannot move relatively in the welding process, and the welding efficiency is improved.
The embodiment of the application also provides a welding method, wherein the tool fixture in any embodiment is used for welding; the welding method comprises the following steps:
placing a part of a component to be welded in a first limit groove of a tray of the tool fixture;
placing a pressing plate of the tool jig on the tray, so that at least part of welding parts of the elements to be welded are exposed from a first through hole of the pressing plate;
printing solder paste on the surface of the pressing plate, so that the solder paste flows to the welding part of the element to be welded;
placing the electronic device on the welding part of the element to be welded;
and welding the electronic device and the element to be welded.
Through the welding method, the part of the element to be welded is placed in the first limit groove, the pressing plate is placed on the tray, at least part of the welding part of the element to be welded is exposed through the first through hole, and after the solder paste is coated, the electronic device is placed on the welding part of the element to be welded, so that the electronic device and the element to be welded can be directly welded, and the welding efficiency is improved.
The embodiment of the application also provides a manufacturing method of the gas detector probe, wherein the gas detector probe comprises a lead seat and an electronic device; the gas detector probe is manufactured through the tool fixture; the manufacturing method comprises the following steps:
placing part of the mounting part of the lead seat in a first limit groove of a tray of the tool fixture;
placing a pressing plate of the tool fixture on the tray, so that at least part of the welding part is exposed through a first through hole of the pressing plate;
printing solder paste on the surface of the pressing plate so that the solder paste flows to the welding part;
placing the electronic device on the soldering portion;
and welding the electronic device and the lead seat.
Through placing partial installation department in first spacing groove, place the clamp plate on the tray for at least partial welding portion exposes through first through-hole, and, after the coating solder paste, place electronic device on the welding portion, thereby can directly weld electronic device and lead frame, improved welding efficiency.
The embodiment of the application also provides a gas detector probe, which comprises a lead seat and an electronic device; the lead frame and the electronic device are welded at least by the manufacturing method of the gas detector probe. The gas detector probe is manufactured by the manufacturing method of the gas detector probe, and the manufacturing process of the gas detector probe has the advantage of high efficiency.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of an electronic device provided in the present application before soldering with a lead;
fig. 2 is a schematic structural diagram of a lead frame provided in the present application;
fig. 3 is a schematic structural diagram of a tooling fixture according to an embodiment of the present application;
fig. 4 is a schematic perspective view of a tooling fixture according to an embodiment of the present application;
fig. 5 is a schematic structural diagram of welding an electronic device and a lead frame by using a tooling fixture according to an embodiment of the present application;
fig. 6 is a schematic structural view of a tray according to an embodiment of the present disclosure;
fig. 7 is a schematic structural view of a tray according to another embodiment of the present disclosure;
FIG. 8 is a schematic structural view of a platen according to an embodiment of the present disclosure;
FIG. 9 is a schematic structural view of a platen according to another embodiment of the present disclosure;
fig. 10 is a schematic structural diagram of a cross-sectional view of a tooling fixture after placement of a lead frame according to an embodiment of the present application;
fig. 11 is a schematic structural view of a cross-sectional view of another tooling fixture with a lead frame according to an embodiment of the present application
FIG. 12 is a flow chart of a welding method according to an embodiment of the present application;
FIG. 13 is a flow chart of a method of manufacturing a gas detector probe according to an embodiment of the present application;
FIG. 14 is a schematic view of a gas detector probe according to an embodiment of the present disclosure;
fig. 15 is a schematic structural diagram of a gas detector according to an embodiment of the present application.
[ detailed description ] of the invention
For a better understanding of the technical solution of the present invention, the following detailed description of the embodiments of the present invention refers to the accompanying drawings. It should be understood that the described embodiments are merely some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this application and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should be understood that the term "and/or" as used herein is merely one way of describing an association of associated objects, meaning that there may be three relationships, e.g., a and/or b, which may represent: the first and second cases exist separately, and the first and second cases exist separately. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship. In the following description, directional or positional relationships such as the terms "inner", "outer", "upper", "lower", "left", "right", etc., are presented merely to facilitate describing the embodiments and simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the application.
The present application provides a tooling fixture, as shown in fig. 3-4, the tooling fixture 30 is used for welding; the tooling fixture 30 comprises a tray 40 and a pressing plate 50; as shown in fig. 6, the tray 40 is provided with at least a first limit groove 401; as shown in fig. 8, the pressing plate 50 is provided with at least a first through hole 501; the first limiting groove 401 can at least accommodate part of the element to be welded and limit the element to be welded; when the tray 40 is assembled with the pressing plate 50, the first through hole 501 is located on the first side of the first limiting groove 401. As shown in fig. 6, the first through hole 501 is located on the first side of the first limiting groove 401, specifically, the first through hole 501 is located on the upper side of the corresponding first limiting groove 401. For example, the first through holes corresponding to the first limiting grooves of the first row are all located on the upper side of the first limiting grooves of the row, namely, the side where the point A is located. The first through holes corresponding to the first limit grooves of the second row are also positioned on the upper sides of the first limit grooves of the second row, namely positioned between the limit grooves of the first row and the limit grooves of the second row.
Specifically, the element to be soldered has a soldering portion for soldering with the electronic device. When the element to be welded is limited in the first limiting groove 401, at least part of the welding part is positioned on the first side of the first limiting groove 401 for limiting the element to be welded. When the tray 40 and the pressing plate 50 are assembled, each first through hole 501 on the pressing plate 50 is located at the first side of the corresponding first limiting groove 401, so that at least part of the welding part of the element to be welded limited by the first limiting groove 401 can be exposed through the corresponding first through hole 501, and the element to be welded is welded with the electronic device 10 after being coated with solder paste.
It should be noted that the size of the first limiting groove 401 is not too large relative to the element to be welded, so that the first limiting groove 401 and the element to be welded do not move relatively during the welding process. A plurality of first limiting grooves 401 can be formed in the tray 40, and the first limiting grooves 401 can be square grooves and can be used for placing at least part of to-be-welded elements, so that the specific shape is not limited. The pressing plate 50 can be provided with a plurality of first through holes 501, the first through holes 501 can be square holes, at least part of welding parts of the elements to be welded can be exposed, and the specific shape is not limited, so that a plurality of elements to be welded can be welded at the same time, and the welding efficiency is improved.
In one embodiment, the component to be soldered may be a lead frame. As shown in fig. 1, in some cases, it may be desirable to solder out pins 102 on pads 101 of electronic device 10 to enable use of electronic device 10. The electronic device 10 may be a chip capacitor, chip inductor or chip resistor, and its package form may be 0201/0402/0603/0805/1206/etc. The pins 102 may be flexible wires, such as constantan wires, or may be hard pins, such as copper, silver, gold, or other alloy conductive posts. Because the constantan wires are generally smaller, a laser welding mode is adopted for small-package patch devices; when the lead is cylindrical, the welding between the lead and the bonding pad 101 is spot welding, and laser welding is also preferable. However, laser welding is relatively expensive; in order to reduce the soldering cost, one end of the lead pin may be pressed flat, so that the soldering between the lead pin and the pad 101 is surface soldering. The surface welding can adopt various welding modes including welding, crimping or brazing, more specifically resistance welding, ultrasonic welding, friction welding, laser welding, electron beam welding and the like; the welding may be solder paste welding, gold welding, silver welding, metal alloy welding, or the like. The present application is not limited in this regard.
As shown in fig. 2, the present application provides a lead frame 20 including a mounting portion 201 and at least 2 leads 202, at least a portion of each lead 202 being located on a first side of the mounting portion 201, at least a portion of each lead 202 being located on a second side of the mounting portion 201, the leads 202 being conductors; at least a portion of the wire 202 on the first side is flattened to form a bond 2021, the flattened wire having at least one bond plane, i.e., the bond 2021 having one bond plane; the bonding plane is located in the axial direction of the lead 202. The use of the electronic device 10 is achieved by soldering the above-described electronic device 10 with the lead frame 20. However, if the electronic device 10 and the lead frame 20 are directly soldered, the lead frame 20 is not easily fixed, so that the soldering efficiency is low.
Fig. 5 is a schematic structural diagram of the present embodiment, in which the lead frame 20 and the electronic device 10 are welded by the fixture 30. The first limiting groove 401 can at least accommodate part of the mounting part 201 and limit the mounting part 201; when the mounting portion 201 is positioned in the first positioning groove, at least part of the welding portion 2021 is positioned on the first side of the first positioning groove 401, and at least part of the welding portion 2021 can be exposed through the first through hole 501.
Specifically, at least a portion of the mounting portion 201 can be received in the first limit groove 401 of the tray 40. The lead frame 20 has 2 leads 202, and each of the 2 leads 202 is provided with a solder 2021; when at least part of the mounting portion 201 is placed in the first limiting groove 401, the soldering portions 2021 on the 2 leads 202 are all at least partially exposed through the first through holes 501; the electronic device 10 also includes 2 pads 101, and after the 2 pads 101 of the electronic device 10 are placed on the 2 solder portions 2021, respectively, solder is applied to the corresponding pads 101 and the solder portions 2021.
In this embodiment, the mounting portion 201 is substantially cylindrical, and at this time, the first limiting groove 401 may be a square groove, so that the mounting portion 201 may be placed, which is not limited to a specific shape in this application. The first through hole 501 may be a square hole, and at least a part of the welded portion 2021 may be exposed, which is not limited to a specific shape in the present application.
By restricting the lead frame 20 within the first restricting groove 401 and placing the pressing plate 50 on the tray 40 such that at least part of the solder 2021 is exposed through the first through hole 501; so that the electronic device 10 is placed on the soldering portion 2021 after the solder paste is applied, the electronic device 10 and the soldering portion 2021 can be directly soldered, thereby improving the soldering efficiency of the electronic device 10 and the lead frame 20.
It should be noted that the size of the first limiting groove 401 is not excessively large relative to the size of the mounting portion 201 of the lead frame 20, so that no relative movement occurs between the lead frame 20 and the tray 40 during the soldering process. The size of the first through hole 501 should be greater than or equal to the size of the electronic device 10 so that the electronic device 10 can be placed on the soldering portion 2021 of the lead frame 20 through the first through hole 501 during soldering. A plurality of first limit grooves 401 may be provided on the tray 40 so that a plurality of lead holders 20 may be simultaneously placed; the pressing plate 50 may be provided with a plurality of first through holes 501, so that the first side of each first limit groove 401 has one first through hole 501, so that after the mounting portion 201 of each lead frame 20 is placed in the first limit groove 401, the pressing plate 50 is placed on the tray 40, and each soldering portion 2021 can be exposed through the first through hole 501, so that after the electronic device 10 is placed in the soldering portion 2021, a plurality of electronic devices 10 and the lead frames 20 can be soldered at the same time.
Considering that the mounting portion 201 of the lead frame 20 is placed in the first limit groove 401 of the tray 40, the mounting portion 201 is protruded with respect to the surface of the tray 40, in one embodiment, as shown in fig. 9, the pressing plate 50 is provided with a second through hole 502, and the position of the second through hole 502 corresponds to the position of the first limit groove 401; the second through hole 502 has a size corresponding to the size of the mounting portion 201 such that the mounting portion 201 can be exposed through the second through hole 502. In this embodiment, the mounting portion 201 is a substantially cylindrical body, and its cross section is substantially rectangular, and in this case, the second through hole 502 may be a square hole, and the second through hole 502 may be used for the mounting portion 201 to pass through, which is not limited to a specific shape in this application.
It should be noted that, when the solder paste is printed on the surface of the platen 50, the position of the second through hole 502 should be avoided to prevent the solder paste from flowing into the second through hole 502. Specifically, when printing the solder paste, only the region where the first through hole 501 is located may be printed.
In one embodiment, as shown in fig. 10, the pressing plate 50 of the tooling fixture 30 is provided with a first step part 503, and the position of the first step part 503 corresponds to the position of the first limit groove 401 of the tray 40; the first stepped portion 503 is further provided with a first housing cavity 5031, the first housing cavity 5031 being capable of housing at least part of the mounting portion 201.
In this embodiment, the mounting portion 201 is a substantially cylindrical body, which is disposed behind the first limiting groove 401 and protrudes with respect to the upper surface of the tray 40, and the protruding portion mounting portion 201 may be defined as a first mounting branch portion; at this time, the height of the first mounting branch portion is greater than the thickness of the pressing plate 50, and the first step portion 503 may be provided, specifically, the first step portion 503 may be provided by thickening the thickness of the pressing plate 50 corresponding to the position of the first mounting branch portion, and since the lower surface of the pressing plate 50 should be adhered to the upper surface of the tray 40, the first step portion 503 may be provided on the upper surface side of the pressing plate 50 to protrude with respect to other portions on the upper surface side of the pressing plate 50. The first stepped portion 503 is also provided therein with a first receiving cavity 5031 for receiving the first mounting leg. The first accommodating cavity 5031 may be configured as a square cavity, and may be capable of accommodating the first mounting branch, and the shape thereof is not particularly limited herein.
It should be noted that, the first step groove 503 protrudes from the other portion of the upper surface of the platen 50, and the amount of solder paste in the vicinity thereof is large, which may cause an excessive amount of solder paste flowing into the first through hole 501, which is liable to cause a short circuit during soldering, and the amount of solder paste flowing into the first through hole 501 can be controlled by reducing the size of the first through hole 501.
As shown in fig. 11, in one embodiment, the pressing plate 50 of the tooling fixture 30 is provided with a second accommodating cavity 504, and the position of the second accommodating cavity 504 corresponds to the position of the first limiting groove 401; the second receiving chamber 504 is capable of receiving at least a portion of the mounting portion 201. In this embodiment, the mounting portion 201 is a substantially cylindrical body, which is protruded with respect to the upper surface of the tray 40 after being placed in the first limiting groove 401, and the protruded portion mounting portion 201 may be defined as a first mounting leg; at this time, the first mounting branch portion has a smaller thickness than the pressing plate 50, and the second receiving chamber 504 may be directly provided at the lower surface side of the pressing plate 50 to receive the first mounting branch portion.
In the process of welding the electronic device 10 and the lead frame 20, as shown in fig. 7, in one embodiment, the tray 40 of the tooling fixture 30 is provided with a first heat dissipation hole 402. By providing the first heat dissipation holes 402, heat dissipation can be performed to the tray 40 during the welding process or after the welding is completed. The first heat dissipation holes 402 may be provided as much as possible to improve the uniformity of heat dissipation of the tray 40, preventing the tray 40 from being deformed due to uneven heating. The first heat dissipation holes 402 may be provided near the locations where the electronic device 10 and the lead frame 20 are soldered. The tray 40 may be a material having good temperature conductivity and excellent heat dissipation. For example, the tray 40 may be made of synthetic stone as a whole. The platen 50 may be a well-formed, highly accurate material. For example, the entire material of the platen 50 may be stainless steel.
When the pressing plate 50 is a magnetic substance, a magnet may be further provided on the tray 40. Grooves may be provided on the lower surface side of the tray 40 for placing the magnets; grooves may be provided on the upper surface side of the tray 40 for placing the magnets. The present application is not limited in this regard.
In one embodiment, the tray 40 includes S first limiting groove sets, each of the first limiting groove sets is equidistantly distributed on the tray 40 by an arrangement of m×n, and each first side of each first limiting groove 401 has a first through hole 501, so that after each lead holder 20 is placed in the first limiting groove 401 of the tray 40, the soldering portion 2021 of the lead holder 20 can be exposed through the first through hole 501. The first limiting groove group is a set formed by K first limiting grooves 401, the K first limiting grooves 401 may be arranged in a sequence manner of a×b, and S, M, N, K, A, B is a positive integer. For example, the tray 40 includes 2 sets of first limiting groove sets, where each set of first limiting groove sets is equidistantly distributed on the tray 40 in a row-two column arrangement manner; the first limiting groove group is a set formed by 100 first limiting grooves 401, and the 100 first limiting grooves 401 are arranged in a five-row and ten-column arrangement mode.
Further, the tray 40 is further provided with a first positioning hole 403, a second positioning hole 404, a third positioning hole 405 and a fourth positioning hole 406; the pressing plate 50 is further provided with a fifth positioning hole 505, a sixth positioning hole 506, a seventh positioning hole 507, and an eighth positioning hole 508, and positions of the fifth positioning hole 505, the sixth positioning hole 506, the seventh positioning hole 507, and the eighth positioning hole 508 correspond to positions of the first positioning hole 403, the second positioning hole 404, the third positioning hole 405, and the fourth positioning hole 406, respectively. Also, the positioning holes may be positioned at the upper left corner, the upper right corner, the lower left corner, or the lower right corner of the tray 40 or the pressing plate 50, respectively.
By respectively corresponding the positions of the first positioning hole 403, the second positioning hole 404, the third positioning hole 405 and the fourth positioning hole 406 to the positions of the fifth positioning hole 505, the sixth positioning hole 506, the seventh positioning hole 507 and the eighth positioning hole 508, the first through hole 501 of the pressing plate 50 is located at the first side of the first limiting hole 401 of the tray 40, and after the mounting portion 201 of the lead holder 20 is placed in the first limiting groove 401, the welding portion 2021 can be exposed through the first through hole 501. After the positioning holes of the tray 40 and the pressing plate 50 coincide, the tray 40 may be fixed to the pressing plate 50 by screws.
It should be noted that the tray 40 may include H positioning holes; the pressing plate 50 may also include H positioning holes, and the positions of the positioning holes on the pressing plate 50 correspond to the positions of the positioning holes on the tray 40. Wherein H is a positive integer and H is greater than or equal to 2.
In one embodiment, the tray 40 is further provided with a first recess 407, and the first recess 407 may be disposed at an upper left corner, a lower left corner, an upper right corner, or a lower right corner of the tray. By providing first recess 407, it is convenient to pick up platen 50 from tray 40.
It should be noted that the tray 40 may include a plurality of first recesses 407.
The embodiment of the application also provides a welding method, as shown in fig. 12, for welding by using the tool fixture 30 according to any one of the embodiments, the welding method includes the following steps:
s701: placing a part of the element to be welded in a first limit groove 401 of a tray 40 of the tooling fixture 30;
s702: placing the pressing plate 50 of the tooling fixture 30 on the tray 40 so that at least part of the welding part of the element to be welded is exposed through the first through hole 501 of the pressing plate 50;
s703: printing solder paste on the surface of the pressing plate 50, so that the solder paste flows onto the welding parts of the components to be welded; wherein, the solder paste flows onto the welding part of the element to be welded through the first through hole 501; alternatively, the solder paste may be directly brushed onto the soldering portion of the element to be soldered.
S704: placing the electronic device 10 on the soldering portion of the component to be soldered; the electronic device 10 is placed on the soldered portion of the component to be soldered by the SMT pick and place process. The solder paste has a viscosity, and the electronic device 10 is preliminarily fixed on the soldered portion of the element to be soldered by the solder paste.
S705: and welding the electronic device and the element to be welded. And welding the electronic device and the element to be welded through a reflow welding process or a laser welding process and the like.
Through the above welding method, the element to be welded is limited in the first limiting groove 401, and at least part of the welding portion of the element to be welded is exposed through the first through hole 501, so that after the solder paste is coated, the welding can be directly performed, and the welding efficiency is improved.
The embodiment of the application also provides a manufacturing method of the gas detector probe, as shown in fig. 14, the gas detector probe 60 comprises an electronic device 10 and a lead seat 20; the gas detector probe 60 is manufactured by the tooling fixture 30 described above; as shown in fig. 13, the manufacturing method includes the steps of:
s801: placing part of the mounting part 201 of the lead frame 20 in a first limit groove 401 of a tray 40 of the tooling fixture 30;
s802: placing the pressing plate 50 of the tooling fixture 30 on the tray 40 such that at least part of the soldering portion 2021 of the lead frame 20 is exposed through the first through hole of the pressing plate 50;
specifically, the lead frame 20 has a mounting portion 201, and the first limiting groove 401 of the tray 40 of the tooling fixture 30 can accommodate at least a portion of the mounting portion 201. The lead frame 20 further has 2 leads 202, and each of the 2 leads 202 is provided with a solder 2021; when a part of the mounting portion 201 is placed in the first limit groove 401 of the tray 40, the pressing plate 50 is placed on the tray 40, and the soldering portions 2021 on the 2 leads 202 are each at least partially exposed through the first through hole 501 of the pressing plate 50.
S803: printing solder paste onto the surface of the platen 50 so that the solder paste flows to the solder 2021;
wherein, after the solder paste is printed on the surface of the pressing plate, the solder paste flows to the soldering part 2021 through the first through hole; alternatively, the solder paste may be brushed only to the region where the first through hole 501 is located.
S804: placing the electronic device 10 on the soldering portion 2021; specifically, the electronic device 10 also includes 2 pads 101, and the 2 pads 101 of the electronic device 10 are placed on the 2 lands 2021, respectively. The electronic device 10 is placed on the solder 2021 by the SMT pick and place process. The solder paste has a viscosity, and the electronic device 10 is preliminarily fixed on the solder 2021 of the lead frame 20 by the solder paste.
S805: the electronic device 10 is soldered to the lead frame 20. Specifically, the soldering portion 2021 of the lead frame 20 has a soldering plane, the electronic device 10 includes a pad 101, and the electronic device 10 and the lead frame 20 are soldered by the pad 101 and the soldering plane, so that the electronic device 10 is completely fixed on the lead frame 20, and point connection is achieved. The soldering process may be reflow soldering or laser soldering.
The present application also provides a gas detector probe, as shown in fig. 14, a gas detector probe 60 comprising the above-described lead frame 20 and at least one electronic device 10; the lead frame 20 includes a solder 2021, and the electronic device 10 includes a pad 101; the bonding portion 2021 is at least partially bonded to the pad 101 by the bonding method described above.
At least one parameter value of the electronic device 10 is correlated to the measured value. For example, the electronic device 10 may be a temperature-sensing resistor, where the temperature-sensing resistor senses a temperature change, and when the temperature changes, the resistance of the temperature-sensing resistor changes, and the temperature-sensing resistor is soldered to the soldering portion 2021 of the lead frame 20; the welding mode can be laser welding and furnace welding; the welding process may be reflow soldering or the like, and because the weld 2021 has a welding plane, it is more suitable for lower cost fusion techniques. The temperature-sensing resistor may be an NTC (Negative Temperature Coefficient: negative temperature coefficient) resistor, a PTC (Positive Temperature Coefficient: positive temperature coefficient) resistor.
The gas detector probe 60 may be a refrigerant detector probe, which is not limited in this application. When the gas detector probe 60 is a refrigerant detector probe, it can be used for sensing refrigerant. Specifically, the refrigerant may be an A2L refrigerant such as R32, which is flammable, and in order to ensure safety, it is necessary to detect whether the refrigerant leaks or not to prevent danger. Of course, the refrigerant detector probe can also detect whether the refrigerant leaks by sensing other gases. The thermal conductivity of different gases is different, and NTC resistors can be used to detect different gas concentration information. For example, the R32 refrigerant and air have different thermal conductivities, and if the R32 refrigerant exists, the NTC resistance changes, and different electrical signals are generated.
Based on the gas detector probe 60, the present application also provides a gas detector assembly, and the gas detector assembly 700 may be a refrigerant detector assembly. As shown in fig. 15, the gas detector assembly 700 includes the electronic device 10, the lead frame 20, and the base 80; a gas detector probe is obtained by welding the electronic device 10 with the lead frame 20; the base 80 is provided with mounting holes 801, and the gas detector assembly 700 is obtained by fixing the mounting portion 201 of the lead frame 20 in the mounting holes 801.
The present application also provides a method of manufacturing the above gas detector assembly, the method comprising the steps of:
s901: the gas detector probe 60 is secured within the base 80. Specifically, after the mounting portion 201 of the lead frame 20 of the gas detector probe 60 is fitted into the mounting hole 801 of the base 80, the mounting hole 801 is sealed; the mounting hole may be sealed using a sealant; other means, such as a form of applying a sealant by interference fit between the mounting portion 201 and the mounting hole 801, or a mechanical sealing method, may be used, which is not limited in this application.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present specification. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present specification, the meaning of "plurality" means at least two, for example, two, three, etc., unless explicitly defined otherwise.
The foregoing description of the preferred embodiments is provided for the purpose of illustration only, and is not intended to limit the scope of the disclosure, since any modifications, equivalents, improvements, etc. that fall within the spirit and principles of the disclosure are intended to be included within the scope of the disclosure.
Claims (11)
1. The tool fixture is characterized in that the tool fixture is used for welding; the tool fixture comprises a tray and a pressing plate; the tray is at least provided with a first limit groove; the pressing plate is provided with at least a first through hole; the first limiting groove at least can accommodate part of the element to be welded and limit the element to be welded; when the tray is assembled with the pressing plate for use, the first through hole is positioned at the first side of the first limiting groove.
2. The tooling fixture of claim 1, wherein the component to be soldered is a lead frame; the lead seat comprises a mounting part and a welding part; the first limiting groove can at least contain part of the mounting part and limit the mounting part; when the mounting part is limited in the first limiting groove, at least part of the welding part is positioned on the first side of the first limiting groove, and at least part of the welding part can be exposed through the first through hole.
3. The tooling jig according to claim 2, wherein the pressing plate is further provided with a second through hole, and the position of the second through hole corresponds to the position of the first limit groove; the size of the second through hole is matched with the size of the mounting part, so that the mounting part can be exposed through the second through hole;
or the pressing plate is provided with a first step part, and the position of the first step part corresponds to the position of the first limit groove; the first step portion further includes a first receiving cavity capable of receiving at least a portion of the mounting portion;
or the pressing plate is provided with a second accommodating cavity, and the position of the second accommodating cavity corresponds to the position of the first limit groove; the second accommodation chamber is capable of accommodating at least part of the mounting portion.
4. The tooling jig according to any one of claims 1-3, wherein the tray is further provided with a first heat dissipation hole; or the whole material of the tray is synthetic stone; or the whole material of the pressing plate is stainless steel; alternatively, the tray further comprises a magnet.
5. The tooling jig according to any one of claims 1-3, wherein the tray comprises S first limiting groove sets, each first limiting groove set is equidistantly distributed on the tray in an arrangement mode of M x N, and a first side of each first limiting groove is provided with one first through hole, wherein the first limiting groove sets are a set of K first limiting grooves; the S, M, N, K is a positive integer.
6. The tooling jig according to any one of claims 1-3, wherein the tray is further provided with a first positioning hole, a second positioning hole, a third positioning hole, and a fourth positioning hole; the pressing plate is further provided with a fifth positioning hole, a sixth positioning hole, a seventh positioning hole and an eighth positioning hole, and positions of the fifth positioning hole, the sixth positioning hole, the seventh positioning hole and the eighth positioning hole correspond to positions of the first positioning hole, the second positioning hole, the third positioning hole and the fourth positioning hole respectively.
7. A tooling jig according to any one of claims 1 to 3, wherein the tray is further provided with a first recess provided in the upper left, lower left, upper right or lower right corner of the tray.
8. A welding method, characterized by welding by the tooling fixture of any one of claims 1-7, comprising the steps of:
placing a part of a component to be welded in a first limit groove of a tray of the tool fixture;
placing a pressing plate of the tool jig on the tray, so that at least part of welding parts of the elements to be welded are exposed from a first through hole of the pressing plate;
printing solder paste on the surface of the pressing plate, so that the solder paste flows to the welding part of the element to be welded;
placing the electronic device on the welding part of the element to be welded;
and welding the electronic device and the element to be welded.
9. A method of manufacturing a gas detector probe, the gas detector probe comprising a lead frame and electronics; the gas detector probe is manufactured at least by a tooling fixture as claimed in any one of claims 1-7; the manufacturing method comprises the following steps:
placing part of the mounting part of the lead seat in a first limit groove of a tray of the tool fixture;
placing a pressing plate of the tool fixture on the tray, so that at least part of welding parts of the lead seat are exposed through a first through hole of the pressing plate;
printing solder paste on the surface of the pressing plate so that the solder paste flows to the welding part;
placing the electronic device on the soldering portion;
and welding the electronic device and the lead seat.
10. The method of manufacturing a gas detector probe according to claim 9, wherein the electronic device is placed on the soldered portion by an SMT paster process; or the electronic device and the lead seat are welded through a reflow soldering process or laser welding; alternatively, the electronic device and the lead frame are soldered by a soldering plane of a soldering portion of the lead frame and a soldering pad of the electronic device.
11. A gas detector probe, characterized in that the gas detector probe comprises a lead frame and an electronic device; the lead frame and the electronic device are soldered at least by the manufacturing method of the gas detector probe according to claim 9 or 10.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210114975 | 2022-01-31 | ||
| CN2022101149751 | 2022-01-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116551096A true CN116551096A (en) | 2023-08-08 |
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ID=87498851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211163087.5A Pending CN116551096A (en) | 2022-01-31 | 2022-09-23 | Tool fixture, welding method, gas detector probe and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116551096A (en) |
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2022
- 2022-09-23 CN CN202211163087.5A patent/CN116551096A/en active Pending
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