CN218628423U - High-pressure-resistant temperature and pressure integrated sensor - Google Patents
High-pressure-resistant temperature and pressure integrated sensor Download PDFInfo
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- CN218628423U CN218628423U CN202222753143.2U CN202222753143U CN218628423U CN 218628423 U CN218628423 U CN 218628423U CN 202222753143 U CN202222753143 U CN 202222753143U CN 218628423 U CN218628423 U CN 218628423U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E30/00—Energy generation of nuclear origin
- Y02E30/30—Nuclear fission reactors
Abstract
The utility model relates to a sensor technical field particularly, relates to a highly compressed temperature pressure integration sensor, include: the left side of the upper end of the pressure interface is provided with a mounting groove, a sintering base is hermetically mounted in the mounting groove, the lower end of the sintering base is provided with a pressure detection mechanism, and the pressure detection mechanism comprises a pressure chip, a ceramic insulating cover, a corrugated diaphragm and a pressure ring; the temperature probe base is connected to the outer side of the lower end of the pressure interface in a sealing mode, and the inner side of the upper end of the temperature probe base is connected with the temperature-sensitive resistor and a third circuit board for achieving electrical connection of the temperature-sensitive resistor. Through the overall structure of equipment, can avoid pressure chip and surveyed medium direct contact to cause the chip to corrode, expand the medium application range of sensor to arrange pressure interface screw thread terminal surface in with temperature sensitive resistor, with traditional arrange temperature sensitive resistor in pressure core inside comparison, very big improvement temperature sensor's response rate.
Description
Technical Field
The utility model relates to a sensor technical field particularly, relates to a high pressure resistant temperature pressure integration sensor.
Background
The temperature sensor and the pressure sensor are two sensors with the largest use amount in the sensor industry, and the temperature sensor and the pressure sensor are required to be used together in many occasions, such as measuring the temperature and the pressure of liquid in a pipeline, one pressure sensor and one temperature sensor are required to be installed in the traditional mode, so that the temperature and pressure integrated sensor is very inconvenient, and particularly in places with limited space, the temperature and pressure integrated sensor can show unique excellent performance.
The utility model discloses the piezoresistive pressure sensor wide application that adopts is in fields such as aerospace, automotive electronics, industrial control. The piezoresistive pressure chip based on the MEMS (micro-mechanical system) has the characteristics of high precision, low cost, good stability and the like. The piezoresistive chip is packaged into a pressure sensor core body after the process steps of bonding, gold wire bonding, oil filling and the like, the core body is arranged in a sensor structure, the core body is fixed and achieves a sealing effect through laser welding, then a rear end circuit is connected with a core body pin, temperature compensation is carried out on a sensor through a conditioning chip in a circuit, accordingly, the measured pressure is converted into required digital or analog signals to be output, and finally a shell, a shell cap and the like are subjected to laser welding, so that a sensor circuit part is isolated from the external environment.
The temperature sensor adopts a platinum thermal resistor, the resistance value of which can change along with the change of temperature, and the platinum thermal resistor is widely applied to the fields of medical treatment, electronics, industry and the like. The temperature and pressure sensor is combined together through a special structure to form the temperature and pressure integrated sensor, however, in the prior art, the defects of the prior art are that the pressure resistance is low and the temperature measurement response is slow, so that the temperature and pressure integrated sensor resistant to high pressure is provided.
SUMMERY OF THE UTILITY MODEL
The application provides a high pressure resistant temperature pressure integration sensor to solve the lower and slower problem of temperature measurement response of current pressure sensor withstand voltage.
In order to solve the above technical problem or at least partially solve the above technical problem, the present application provides a high pressure resistant temperature and pressure integrated sensor, including:
the pressure detection device comprises a pressure interface, a pressure sensor and a controller, wherein the left side of the upper end of the pressure interface is provided with a mounting groove, a sintering base is hermetically mounted in the mounting groove, the lower end of the sintering base is provided with a pressure detection mechanism, and the pressure detection mechanism comprises a corrugated diaphragm, a ceramic insulation cover, a pressure chip and a pressure ring;
the temperature probe base is connected to the outer side of the lower end of the pressure interface in a sealing mode, and the inner side of the upper end of the temperature probe base is connected with a temperature-sensitive resistor and a third circuit board for achieving electrical connection of the temperature-sensitive resistor;
the circuit board is characterized in that the lower end of the circuit board is connected with a circuit board II through a pin header, the lower end of the circuit board II is installed at the upper end of the pressure interface through a screw and a single-head hexagonal copper column, and the pressure chip and the circuit board III are electrically connected with the circuit board II.
Optionally, a pressure transmission channel is formed in the left side of the pressure interface, and the pressure transmission channel is communicated with the mounting groove.
Optionally, the lower end of the sintering base is provided with an installation cavity, the upper portion of an inner cavity of the installation cavity is provided with a pressure chip which is fixedly bonded with the sintering base, the lower portion of the outer side of the pressure chip is provided with a ceramic insulating cover, and the ceramic insulating cover is also fixedly bonded with the sintering base.
Optionally, the lower end of the installation cavity is provided with a corrugated diaphragm, the outer side of the upper surface of the corrugated diaphragm is attached to the bottom surface of the sintering base, the upper surface of the pressing ring is attached to the outer side of the lower surface of the corrugated diaphragm, and the three are sealed and fixed through laser welding.
Optionally, a silicone oil injection channel is formed in the outer side of the sintering base, a pin is inserted into the upper portion of the silicone oil injection channel, and the lower end of the silicone oil injection channel is communicated with the mounting cavity.
Optionally, pins are sintered inside the sintering base, the lower ends of the pins are connected with the input and output ends on the pressure chip, and the upper ends of the pins are connected with the input and output ends of the second circuit board.
Optionally, a shell is welded to the upper portion of the outer side of the pressure interface, and a shell cap is welded to the upper end of the shell.
Optionally, a shielding cable is welded at the upper end of the first circuit board, the shielding cable is inserted into the insertion hole in the middle of the shell cap, a copper column is fixedly connected between the shielding cable and the insertion hole in a sleeved mode, and a hydraulic clamp is used for pressing the superposed part of the cable and the copper column tightly, so that the shielding cable is sealed and fixed.
The utility model has the advantages that:
overall structure through equipment, it is full of the stable silicon oil of nature to pour into the cavity intussuseption of passageway between the ripple diaphragm of core and pressure chip into through the silicon oil, it is sealed through the pin after the silicon oil is poured into, come the transmission force to act on the pressure chip through ripple diaphragm and silicon oil, this mode can avoid the pressure chip to cause the chip to corrode with being surveyed medium direct contact, the medium application range of sensor has been extended, and arrange temperature sensitive resistor in pressure interface thread end, with the tradition arrange temperature sensitive resistor in the inside comparison of pressure core, very big improvement temperature sensor's response rate.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a cross-sectional view of the overall structure of the embodiment of the present invention.
Fig. 2 is a top cross-sectional view of an embodiment of the present invention.
Fig. 3 is an internal structure diagram of the embodiment of the present invention.
Fig. 4 is a circuit diagram of an embodiment of the present invention.
The labels in the figure are: 1. the temperature-sensitive type pressure sensor comprises a pressure interface, 2 corrugated diaphragms, 3 ceramic insulating covers, 4 pressure chips, 5 sintered bases, 6 circuit boards, 7 circuit boards, 8 shells, 9 shielding cables, 10 copper columns, 11 shell caps, 12 pin headers, 13 screws, 14 single-head hexagonal copper columns, 15 pins, 16 press rings, 17 circuit boards, 18 temperature-sensitive resistors and 19 temperature probe bases.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without making creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators in the embodiments of the present invention, such as up, down, left, right, front, back, 82308230, are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture as shown in the drawings, and if the specific posture is changed, the directional indicator is changed accordingly.
In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B", including either A or B or both A and B. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
In the prior art, a temperature sensor and a pressure sensor are two sensors with the largest use amount in the sensor industry, and the temperature sensor and the pressure sensor are required to be used together in many occasions, such as measuring the temperature and the pressure of liquid in a pipeline, and one pressure sensor and one temperature sensor are required to be installed in the traditional mode, so that the sensor is very inconvenient.
In order to solve the problem, the utility model provides a high pressure resistant temperature pressure integration sensor is arranged in solving among the prior art pressure sensor withstand voltage lower and the slower problem of temperature measurement response.
As shown in fig. 1 to 4, the present embodiment provides a high pressure resistant temperature and pressure integrated sensor, including:
the pressure detection device comprises a pressure interface 1, wherein a mounting groove is formed in the left side of the upper end of the pressure interface 1, a sintering base 5 is hermetically mounted in the mounting groove, a pressure detection mechanism is arranged at the lower end of the sintering base 5, and the pressure detection mechanism comprises a corrugated diaphragm 2, a ceramic insulating cover 3, a pressure chip 4 and a pressure ring 16;
the temperature probe base 19 is connected to the outer side of the lower end of the pressure interface 1 in a sealing mode, and the inner side of the upper end of the temperature probe base 19 is connected with the temperature-sensitive resistor 18 and a third circuit board 17 for achieving electric connection of the temperature-sensitive resistor 18;
the pressure chip comprises a first circuit board 7, the lower end of the first circuit board 7 is connected with a second circuit board 6 through a pin header 12, the lower end of the second circuit board 6 is installed at the upper end of the pressure interface 1 through a screw 13 and a single-head hexagonal copper column 14, and the pressure chip 4 and a third circuit board 17 are electrically connected with the second circuit board 6.
Specifically, the method comprises the following steps: firstly, a sintering base 5, a pressure chip 4, a ceramic insulating cover 3, a corrugated diaphragm 2, a pressure ring 16 and a pin 15 are packaged into a pressure core body through silicon rubber bonding, laser welding, resistance welding and other processes, a cavity between the corrugated diaphragm 2 and the pressure chip 4 of the core body is filled with silicon oil with stable properties through a silicon oil injection channel, the cavity is sealed through the pin 15 after the silicon oil is injected, and the pressure chip 4 is acted on by transmission force through the corrugated diaphragm 2 and the silicon oil, so that the mode can avoid chip corrosion caused by direct contact of the pressure chip 4 and a measured medium, and the medium application range of the sensor is expanded.
Secondly, soldering the temperature-sensitive resistor 18 to the third circuit board 17, then mounting the third circuit board 17 on the temperature probe base 19, respectively leading out two ends of the electrode of the temperature-sensitive resistor 18 by using two cables, then laser welding the temperature probe base 19 to the pressure interface 1, leading out the cables along an inclined hole of the pressure interface 1 to be connected to the second circuit board 6, and finally completing the preparation of the temperature sensor. Compared with the traditional method that the temperature-sensitive resistor 18 is arranged in the pressure core body, the temperature-sensitive resistor 18 is arranged at the threaded end of the pressure interface 1, so that the response rate of the temperature sensor is greatly improved.
The pressure core is assembled on the pressure interface 1 through threaded connection, laser welding is carried out, the structural strength and the sealing performance are guaranteed through a double connection mode, a pressure source acts on the corrugated diaphragm 2 of the core through a pressure transmission channel of the pressure interface 1 and then acts on the pressure chip 4, then the second circuit board 6 packaged with electronic components is assembled on the pressure interface 1 through the single-head hexagonal copper column 14 and the screw 13, a core pin penetrates through the second circuit board 6 and is used for electrically connecting the pressure chip 4 with the second circuit board 6, the single-head hexagonal copper column 14 limits the second circuit board 6, insulation of the second circuit board 6 and the core is guaranteed, meanwhile, the second circuit board 6 is more reliably installed through the connection mode of the single-head hexagonal copper column 14 and the screw 13, the anti-vibration capacity is improved, the first circuit board 7 packaged with the electronic components is connected and assembled on the second circuit board 6 through pin array soldering, and temperature compensation, debugging and testing can be carried out on the sensor after the steps are completed.
The awaiting measuring is accomplished and the performance is up to standard, carries out the casing assembly at last, welds shell 8 to pressure interface 1 through laser welding on, then passes shielding cable 9 and assembles to shell cap 11 after copper post 10, uses hydraulic tong to compress tightly copper post 10 and shielding cable 9 coincidence part, again with shielding cable 9 tin soldering to circuit board 7 on, laser welding shell cap 11 and shell 8 at last, the whole table is the assembly completion.
In the present embodiment, as shown in fig. 1: and a pressure transmission channel is formed in the left side of the pressure connector 1 and is communicated with the mounting groove.
Specifically, the method comprises the following steps: the pressure transmission channel is an inlet of a measured medium, and the measured medium can press the corrugated diaphragm 2 after entering.
In this embodiment, as shown in fig. 1: the lower extreme of sintering base 5 is equipped with the installation cavity, and the inner chamber upper portion of installation cavity is equipped with pressure chip 4 and sintering base 5 bonding fixed, and the outside lower part of pressure chip 4 is equipped with ceramic insulation cover 3, ceramic insulation cover 3 also bonds fixedly with sintering base 5.
Specifically, the method comprises the following steps: the sintering base 5, the pressure chip 4, the ceramic insulating cover 3, the corrugated diaphragm 2, the pressure ring 16 and the pin 15 are packaged into a pressure core body through processes such as silicon rubber bonding, laser welding, resistance welding and the like, so that pressure detection can be performed on an entering measured medium.
In this embodiment, as shown in fig. 1: the lower extreme of installation cavity is equipped with corrugated diaphragm 2, and the outside of 2 upper surfaces of corrugated diaphragm and the laminating of the bottom surface of sintering base 5, laminates the upper surface of clamping ring 16 and the lower surface outside of corrugated diaphragm 2 again, and the three passes through laser welding seal fixation.
Specifically, the method comprises the following steps: after being extruded by a measured medium, the corrugated diaphragm 2 can extrude silicon oil filled in a cavity between the corrugated diaphragm 2 and the pressure chip 4, and after the silicon oil is extruded, the pressure intensity is changed to extrude the pressure chip 4, so that the external pressure can be detected.
In this embodiment, as shown in fig. 1: and a silicone oil injection channel is formed in the outer side of the sintering base 5, a pin 15 is inserted into the upper part of the silicone oil injection channel, and the lower end of the silicone oil injection channel is communicated with the mounting cavity.
Specifically, the method comprises the following steps: the pin 15 is intended to seal the upper end of the silicone oil injection channel.
In the present embodiment, as shown in fig. 1 and 3: and pins are sintered in the sintering base 5, the lower ends of the pins are connected with the input and output ends on the pressure chip 4, and the upper ends of the pins are connected with the input and output ends of the second circuit board 6.
Specifically, the method comprises the following steps: the second circuit board 6 can process the electric information transmitted by the pressure chip 4 and the third circuit board 17.
In the present embodiment, as shown in fig. 1 and 2: the outer shell 8 is welded to the upper portion of the outer side of the pressure connector 1, and the shell cap 11 is welded to the upper end of the outer shell 8.
Specifically, the method comprises the following steps: the housing 8 and the housing cap 11 form a single piece which can seal the upper side of the pressure connection 1 and also protect the upper components of the pressure connection 1.
In the present embodiment, as shown in fig. 1: a circuit board 7's upper end welding has shielding cable 9, shielding cable 9 pegs graft at shell cap 11 middle part spliced eye to it has copper post 10 to fix the cover between shielding cable 9 and the spliced eye, uses hydraulic tong to compress tightly shielding cable 9 and copper post 10 coincidence part, makes shielding cable 9 sealed fixed.
Specifically, the method comprises the following steps: the shielding cable 9 can accomplish the sensor and be connected with external control system's electricity, reaches sensor power supply and pressure detection's purpose, adopts copper post 10 to compress tightly shielding cable 9 simultaneously, can reach sealed purpose, makes inner structure, circuit isolated with external environment, prevents to corrode extension sensor life.
When the pressure sensor measures pressure, a measured medium enters through a pressure transmission channel on the pressure interface 1 and acts on the corrugated diaphragm 2 in the sensor core to extrude the corrugated diaphragm 2, the corrugated diaphragm 2 can transmit extrusion force to the pressure chip 4 through silicone oil injected into the installation cavity, namely the installation cavity is sealed through the pin 15 after being injected with the silicone oil, the internal silicone oil is extruded by the corrugated diaphragm 2 and then transmits the extrusion force to the pressure chip 4, the pressure chip 4 converts the sensed pressure into change of resistance value by utilizing piezoresistive effect, an equivalent circuit of the pressure chip is shown in figure 4, the pressure chip 4 integrates 4 piezoresistors to form a Wheatstone bridge, when the pressure is acted, the resistance values of R1 and R3 are increased, the resistance values of R2 and R4 are reduced, an external power supply supplies power to the sensor through a shielding cable 9, the voltage conversion chip converts the external voltage into a stable reference voltage signal (+ 5V power supply voltage) and supplies the stable reference voltage signal to the temperature compensation conditioning chip, and the internal excitation voltage of the temperature compensation conditioning chip is supplied to the pressure chip 4, when the pressure is changed, the output signal V of the pressure chip 4 is supplied to the pressure chip 4 0 The voltage is fed back to the temperature compensation conditioning chip, the temperature compensation conditioning chip transmits the compensated output signal to an external circuit through a shielding cable 9, the output signal of the external cable is monitored, and then the pressure measurement function can be completed, and the voltage conversion chip and the temperature compensation conditioning chip are respectively welded on the first circuit board 7 and the second circuit board 6;
when measuring temperature, a third circuit board 17 is arranged in a temperature probe base 19, a PT1000 platinum thermal resistor is soldered on the third circuit board 17, namely the temperature sensitive resistor 18 is the PT1000 platinum thermal resistor, the temperature sensitive resistor 18 is designed and manufactured by using the basic principle that the resistance value of a platinum wire changes along with the change of temperature, the platinum thermal resistor is connected into a circuit according to different resistance values of temperature to supply power to the resistor at constant voltage, the resistance value is calculated by observing the change value of the current along with the temperature and then by the ohm law R = U/I, and the temperature measurement can be finished by contrasting the resistance value of the PT1000 and a temperature relation table.
The above description is only exemplary of the invention, and is intended to enable those skilled in the art to understand and implement the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (8)
1. A high pressure resistant temperature and pressure integrated sensor, comprising:
the pressure detection device comprises a pressure interface (1), wherein a mounting groove is formed in the left side of the upper end of the pressure interface (1), a sintering base (5) is hermetically mounted in the mounting groove, a pressure detection mechanism is arranged at the lower end of the sintering base (5), and the pressure detection mechanism comprises a corrugated diaphragm (2), a ceramic insulating cover (3), a pressure chip (4) and a pressure ring (16);
the temperature probe base (19) is connected to the outer side of the lower end of the pressure interface (1) in a sealing mode, and the inner side of the upper end of the temperature probe base (19) is connected with a temperature-sensitive resistor (18) and a third circuit board (17) for achieving electric connection of the temperature-sensitive resistor (18);
the pressure chip comprises a first circuit board (7), wherein the lower end of the first circuit board (7) is connected with a second circuit board (6) through a pin header (12), the lower end of the second circuit board (6) is installed at the upper end of a pressure interface (1) through a screw (13) and a single-head hexagonal copper column (14), and a pressure chip (4) and a third circuit board (17) are electrically connected with the second circuit board (6).
2. The integrated temperature and pressure sensor according to claim 1, wherein: and a pressure transmission channel is formed in the left side of the pressure interface (1) and is communicated with the mounting groove.
3. The integrated temperature and pressure sensor according to claim 1, wherein: the lower extreme of sintering base (5) is equipped with the installation cavity, and the inner chamber upper portion of installing the cavity is equipped with pressure chip (4) and bonds fixedly with sintering base (5), and the outside lower part of pressure chip (4) is equipped with ceramic insulating boot (3), ceramic insulating boot (3) also bonds fixedly with sintering base (5).
4. The integrated temperature and pressure sensor according to claim 3, wherein: the lower extreme of installation cavity is equipped with corrugated diaphragm (2), and the outside of corrugated diaphragm (2) upper surface laminates with the bottom surface of sintering base (5), laminates the upper surface of clamping ring (16) and the lower surface outside of corrugated diaphragm (2) again, and the three passes through laser welding and seals fixedly.
5. The integrated temperature and pressure sensor according to claim 1, wherein: and a silicone oil injection channel is formed in the outer side of the sintering base (5), a pin (15) is inserted into the upper part of the silicone oil injection channel, and the lower end of the silicone oil injection channel is communicated with the mounting cavity.
6. The integrated temperature and pressure sensor with high pressure resistance as claimed in claim 1, wherein: pins are sintered in the sintering base (5), the lower ends of the pins are connected with the input and output ends of the pressure chip (4), and the upper ends of the pins are connected with the input and output ends of the second circuit board (6).
7. The integrated temperature and pressure sensor according to claim 1, wherein: the outer side upper portion of pressure connector (1) welds shell (8), and the upper end welding of shell (8) has shell cap (11).
8. The integrated temperature and pressure sensor according to claim 1, wherein: the upper end welding of a circuit board (7) has shielding cable (9), shielding cable (9) are pegged graft at shell cap (11) middle part spliced eye to the fixed copper post (10) that has cup jointed between shielding cable (9) and the spliced eye, use hydraulic pressure pincers to compress tightly shielding cable (9) and copper post (10) coincidence portion, make shielding cable (9) sealed fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222753143.2U CN218628423U (en) | 2022-10-19 | 2022-10-19 | High-pressure-resistant temperature and pressure integrated sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222753143.2U CN218628423U (en) | 2022-10-19 | 2022-10-19 | High-pressure-resistant temperature and pressure integrated sensor |
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| Publication Number | Publication Date |
|---|---|
| CN218628423U true CN218628423U (en) | 2023-03-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222753143.2U Active CN218628423U (en) | 2022-10-19 | 2022-10-19 | High-pressure-resistant temperature and pressure integrated sensor |
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| Country | Link |
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| CN (1) | CN218628423U (en) |
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- 2022-10-19 CN CN202222753143.2U patent/CN218628423U/en active Active
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