CN218628724U - Dual-redundancy pressure sensor structure - Google Patents
Dual-redundancy pressure sensor structure Download PDFInfo
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- CN218628724U CN218628724U CN202222753252.4U CN202222753252U CN218628724U CN 218628724 U CN218628724 U CN 218628724U CN 202222753252 U CN202222753252 U CN 202222753252U CN 218628724 U CN218628724 U CN 218628724U
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Abstract
The utility model relates to a sensor technical field particularly, relates to a dual-redundancy pressure sensor structure, include: the upper end of the pressure interface is symmetrically provided with two mounting grooves, a sintering base is fixedly connected inside the mounting grooves, and the lower end of the sintering base is provided with a pressure detection mechanism which comprises a pressure ring, a pressure chip, a corrugated diaphragm and a ceramic insulating cover; the lower extreme of first circuit board is connected with the second circuit board through arranging the needle, and the passing through screw mounting of second circuit board is in the pressure interface upper end to pressure chip is connected with the second circuit board electricity, through the overall structure of equipment, can avoid pressure chip and surveyed medium direct contact to cause the chip to corrode, has expanded the medium application range of sensor, and the reliability of two redundancy sensors is higher than single channel sensor, and simple structure, convenient assembling, simultaneously anti-seismic performance is good.
Description
Technical Field
The utility model relates to a sensor technical field particularly, relates to a dual-redundancy pressure sensor structure.
Background
The pressure sensor is widely applied to the fields of aerospace, automotive electronics, industrial control and the like. The piezoresistive pressure chip based on the MEMS (micro-mechanical system) has the characteristics of high precision, low cost, good stability and the like. The piezoresistive chip is packaged into a pressure sensor core body after the process steps of bonding, gold wire bonding, oil filling and the like, the core body is arranged in a sensor structure, the core body is fixed and achieves a sealing effect through laser welding, then a rear end circuit is connected with a core body pin, temperature compensation is carried out on a sensor through a conditioning chip in a circuit, accordingly, the measured pressure is converted into required digital or analog signals to be output, and finally a shell, a shell cap and the like are subjected to laser welding, so that a sensor circuit part is isolated from the external environment.
The piezoresistive pressure sensor has the characteristics of simple structure, high reliability and the like. In recent years, flight equipment has higher requirements on the use working conditions of a pressure sensor, such as high pressure, wide temperature and the like, and in order to further improve the safety and reliability of the flight equipment, the industry market provides the requirements of the dual-redundancy pressure sensor, the dual-redundancy pressure sensor is a main use and a backup, the dual-redundancy pressure sensor and the backup are completely consistent in function, when one of the dual-redundancy pressure sensor fails, the other dual-redundancy pressure sensor can take over to work at any time.
SUMMERY OF THE UTILITY MODEL
The application provides a dual-redundancy pressure sensor structure to solve the problem that the existing pressure sensor structure is too large in size, complex in assembly process and low in reliability.
In order to solve the above technical problem or at least partially solve the above technical problem, the present application provides a dual redundancy pressure sensor structure, including:
the pressure detection device comprises a pressure interface, a pressure chip, a corrugated diaphragm and a ceramic insulation cover, wherein two mounting grooves are symmetrically formed in the upper end of the pressure interface, a sintering base is fixedly connected inside the mounting grooves, and a pressure detection mechanism is arranged at the lower end of the sintering base and comprises a pressure ring, a pressure chip, the corrugated diaphragm and the ceramic insulation cover;
the lower end of the first circuit board is connected with a second circuit board through a pin header, the second circuit board is installed at the upper end of the pressure interface through a screw, and the pressure chip is electrically connected with the second circuit board.
Optionally, the lower end of the pressure port is provided with a pressure transmission channel, the pressure transmission channel is Y-shaped, and the upper end of the pressure transmission channel is communicated with the two mounting grooves.
Optionally, the lower extreme of sintering base is equipped with the installation cavity, and the inner chamber upper portion of installation cavity is equipped with pressure chip, and the fixed cover that has cup jointed ceramic insulation cover in the outside lower part of pressure chip, pressure chip and ceramic insulation cover all bond fixedly with sintering base.
Optionally, the lower end of the installation cavity is provided with a corrugated diaphragm, the outer side of the upper surface of the corrugated diaphragm is attached to the bottom surface of the sintering base, the upper surface of the pressure ring is attached to the outer side of the lower surface of the corrugated diaphragm, and the three are sealed and fixed through laser welding.
Optionally, a silicone oil injection channel is formed in the outer side of the sintering base, a pin is inserted into the upper portion of the silicone oil injection channel, and the lower end of the silicone oil injection channel is communicated with the mounting cavity.
Optionally, pins are sintered inside the sintering base, and the lower ends of the pins are connected to the input and output ends on the pressure chip, and the upper ends of the pins are connected to the input and output ends of the second circuit board.
Optionally, a shell is welded to the upper portion of the outer side of the pressure interface, and a shell cap is welded to the upper end of the shell.
Optionally, a shielding cable is welded at the upper end of the first circuit board, the shielding cable is inserted into an insertion hole in the middle of the shell cap, a copper column is fixedly connected between the shielding cable and the insertion hole in a sleeved mode, and the overlapping portion of the shielding cable and the copper column is pressed tightly through hydraulic pliers, so that the shielding cable is sealed and fixed.
The utility model has the advantages that:
through the overall structure of equipment, fill in the cavity intussuseption of passageway between the ripple diaphragm of core and pressure chip through silicon oil and be full of the stable silicon oil of nature, it is sealed through the pin after injecting into silicon oil, come the transmission force to act on the pressure chip through ripple diaphragm and silicon oil, this mode can avoid pressure chip and measured medium direct contact to cause the chip to corrode, the medium application range of sensor has been extended, and the reliability is higher than the single channel sensor to two redundancy sensors, and simple structure, high assembling convenience, simultaneously anti-seismic performance is good.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a cross-sectional view of the overall structure of an embodiment of the present invention;
fig. 2 is a top cross-sectional view of an embodiment of the present invention;
FIG. 3 is an internal structure diagram of the embodiment of the present invention;
fig. 4 is a circuit diagram of an embodiment of the present invention;
the mark in the figure is: 1. the novel high-voltage power supply comprises a shielding cable, 2 copper columns, 3 shell caps, 4 shells, 5 first circuit boards, 6 pin headers, 7 screws, 8 second circuit boards, 9 sintered bases, 10 pressure interfaces, 11 pressure rings, 12 pressure chips, 13 corrugated diaphragms, 14 ceramic insulating covers and 15 pins.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators in the embodiments of the present invention, such as upper, lower, left, right, front, and rear … …, are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture as shown in the drawings, if the specific posture is changed, the directional indicator is changed accordingly.
In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
In the prior art, flight equipment has higher requirements on the use working conditions of a pressure sensor, such as high pressure, wide temperature and the like, and in order to further improve the safety and reliability of the flight equipment, the industry market provides the requirements of a dual-redundancy pressure sensor, wherein the dual-redundancy pressure sensor is a main use pressure sensor and a backup pressure sensor, the dual-redundancy pressure sensor and the backup pressure sensor are completely consistent in function, and when one of the dual-redundancy pressure sensor fails, the other one can take over the work at any time.
In order to solve the problem, the utility model provides a dual-redundancy pressure sensor structure is arranged in solving prior art well structure volume too big, and assembly process is loaded down with trivial details to the lower problem of reliability.
As shown in fig. 1 to 4, in the present embodiment, a pressure interface 10 is provided, two mounting grooves are symmetrically formed in an upper end of the pressure interface 10, a sintering base 9 is fixedly connected inside the mounting grooves, and a pressure detection mechanism is arranged at a lower end of the sintering base 9, and the pressure detection mechanism includes a pressure ring 11, a pressure chip 12, a corrugated diaphragm 13 and a ceramic insulating cover 14;
the pressure chip comprises a first circuit board 5, wherein the lower end of the first circuit board 5 is connected with a second circuit board 8 through a pin header 6, the second circuit board 8 is installed at the upper end of the pressure interface 1 through a screw 7, and a pressure chip 12 is electrically connected with the second circuit board 8.
Specifically, the method comprises the following steps: firstly, a sintering base 9, a pressure chip 12, a ceramic insulating cover 14, a corrugated diaphragm 13, a pressure ring 11 and a pin 15 are packaged into a pressure core body through processes of silicon rubber bonding, laser welding, resistance welding and the like, a cavity between the corrugated diaphragm 13 and the pressure chip 12 of the core body is filled with silicon oil with stable properties through a silicon oil injection channel, the cavity is sealed through the welding pin 15 after the silicon oil is injected, and the pressure chip 12 is acted on by transmission force through the corrugated diaphragm 13 and the silicon oil, so that the chip corrosion caused by direct contact of the pressure chip 12 and a measured medium can be avoided, and the medium application range of the sensor is expanded.
The pressure core body is assembled on the pressure interface 10 through threaded connection, laser welding is carried out again, structural strength and sealing performance are guaranteed through a double connection mode, a pressure source acts on a corrugated diaphragm 13 of the core body through a pressure transmission channel of the pressure interface 10 and then acts on a pressure chip 12, then a second circuit board 8 with packaged electronic components is assembled on the pressure interface 10 through a screw 7, core pins penetrate through the second circuit board 8 to be used for electric connection, the first circuit board 5 with packaged electronic components is assembled on the second circuit board 8 through pin arrangement soldering connection, and temperature compensation, debugging and testing can be carried out on the sensor after the steps are completed.
The examination of awaiting measuring is accomplished and the performance is up to standard, carries out the casing assembly at last, through laser welding with shell 4 welding to pressure interface 10 on, then pass copper post 2 with shielding cable 1 after assemble to shell cap 3 on, use hydraulic tong to compress tightly copper post 2 and shielding cable 1 coincidence part, again with shielding cable 1 tin soldering to first circuit board 5 on, at last laser welding shell cap 3 and shell 4, the whole table is the assembly completion promptly.
The pressure detection mechanisms are provided with two pressure detection mechanisms, one pressure detection mechanism is used as a main pressure detection mechanism, the other pressure detection mechanism is used as a standby pressure detection mechanism, the two pressure detection mechanisms are completely consistent in function, and when one pressure detection mechanism fails, the other pressure detection mechanism can take over the work at any time.
In this embodiment, as shown in fig. 1: the lower end of the pressure connector 10 is provided with a pressure transmission channel, the pressure transmission channel is Y-shaped, and the upper end of the pressure transmission channel is communicated with the two mounting grooves.
Specifically, the method comprises the following steps: the pressure transmission channel is an inlet of the measured medium, and the measured medium can press the corrugated diaphragm 13 after entering.
In this embodiment, as shown in fig. 1: the lower extreme of sintering base 9 is equipped with the installation cavity, and the inner chamber upper portion of installation cavity is equipped with pressure chip 12, and the fixed cover in outside lower part of pressure chip 12 has connect ceramic insulation cover 14, pressure chip 12 and ceramic insulation cover 14 all bond fixedly with sintering base 9.
Specifically, the method comprises the following steps: the sintering base 9, the pressure chip 12, the ceramic insulating cover 14, the corrugated diaphragm 13, the pressure ring 11 and the pin 15 are packaged into a pressure core body through processes such as silicon rubber bonding, laser welding, resistance welding and the like, so that the entered medium to be detected can be detected.
In the present embodiment, as shown in fig. 1: the lower extreme of installation cavity is equipped with ripple diaphragm 13, and the outside of ripple diaphragm 13 upper surface and the laminating of the bottom surface of sintering base 9, and the lower surface outside laminating of the upper surface of clamping ring 11 and ripple diaphragm 13 again, the three passes through laser welding sealing fixation.
Specifically, the method comprises the following steps: after being extruded by the measured medium, the corrugated diaphragm 13 can extrude the silicone oil filled in the cavity between the corrugated diaphragm 13 and the pressure chip 12, and after the silicone oil is extruded, the pressure intensity changes to extrude the pressure chip 12, so that the external pressure can be detected.
In this embodiment, as shown in fig. 1: a silicone oil injection channel is formed in the outer side of the sintering base 9, a pin 15 is inserted into the upper portion of the silicone oil injection channel, and the lower end of the silicone oil injection channel is communicated with the mounting cavity.
Specifically, the method comprises the following steps: the pin 15 is intended to seal the upper end of the silicone oil injection channel.
In the present embodiment, as shown in fig. 1 and 3: pins are sintered in the sintering base 9, the lower ends of the pins are connected with the input and output ends of the pressure chip 12, and the upper ends of the pins are connected with the input and output ends of the second circuit board 8.
Specifically, the method comprises the following steps: the second circuit board 8 is capable of processing the electrical information transmitted by the pressure chip 12.
In the present embodiment, as shown in fig. 1 and 2: the outer shell 4 is welded on the upper portion of the outer side of the pressure connector 10, and the shell cap 3 is welded on the upper end of the outer shell 4.
Specifically, the method comprises the following steps: the whole of the housing 4 and the housing cap 3 can seal the upper side of the pressure connection 10 and also protect the upper parts of the pressure connection 10.
In this embodiment, as shown in fig. 1: the welding of the upper end of first circuit board 5 has shielding cable 1, shielding cable 1 pegs graft at 3 middle part spliced eyes of shell cap to shielding cable 1 and fixed the cup joint have copper post 2 between the spliced eye, use hydraulic tong to compress tightly shielding cable 1 and the coincidence part of copper post 2, make shielding cable 1 sealed fixed.
Specifically, the method comprises the following steps: the electric connection of sensor and external control system can be accomplished to shielding cable 1, reaches sensor power supply and pressure detection's purpose, adopts copper post 2 to compress tightly shielding cable 1 simultaneously, can reach sealed purpose, makes inner structure, circuit isolated with external environment, prevents to corrode extension sensor life.
When the pressure sensor measures pressure, a measured medium enters through a pressure transmission channel on the pressure interface 10 and acts on a corrugated diaphragm 13 in a sensor core body to extrude the corrugated diaphragm 13, the corrugated diaphragm 13 can transmit extrusion force to a pressure chip 12 through silicon oil injected into an installation cavity, namely the installation cavity is sealed through a pin 15 after being injected with the silicon oil, the internal silicon oil is extruded by the corrugated diaphragm 13 and then can transmit the extrusion force to the pressure chip 12, the pressure chip 12 converts the sensed pressure into change of resistance value by utilizing piezoresistive effect, an equivalent circuit of the pressure chip is shown in figure 4, the pressure chip 12 integrates 4 piezoresistors to form a Wheatstone bridge, when the pressure is acted, the resistance values of R1 and R3 are increased, the resistance values of R2 and R4 are reduced, an external power supply supplies power to the sensor through a shielding cable 1, the voltage conversion chip converts external voltage into a stable reference voltage signal (+ 5V power supply voltage) and supplies the stable reference voltage signal to the temperature compensation conditioning chip, and then supplies the internal excitation voltage Vs of the temperature compensation conditioning chip to the pressure chip 12, and when the pressure is changed, the output signal V of the pressure chip 12 enters into a pressure chip 12 0 The temperature compensation conditioning chip feeds back the output signal to the external circuit through the shielding cable 1, the output signal of the external cable is monitored, the pressure measurement function can be completed, and the voltage conversion chip and the temperature compensation conditioning chip are respectively welded on the first circuit board 5 and the second circuit board 8.
The above description is only exemplary of the invention, and is intended to enable those skilled in the art to understand and implement the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (8)
1. A dual redundancy pressure sensor structure, comprising:
the pressure detection device comprises a pressure interface (10), wherein two mounting grooves are symmetrically formed in the upper end of the pressure interface (10), a sintering base (9) is fixedly connected to the inside of each mounting groove, a pressure detection mechanism is arranged at the lower end of each sintering base (9), and each pressure detection mechanism comprises a pressure ring (11), a pressure chip (12), a corrugated diaphragm (13) and a ceramic insulating cover (14);
the pressure chip comprises a first circuit board (5), wherein the lower end of the first circuit board (5) is connected with a second circuit board (8) through a pin header (6), the second circuit board (8) is installed at the upper end of a pressure interface (10) through a screw (7), and a pressure chip (12) is electrically connected with the second circuit board (8).
2. A dual redundancy pressure sensor architecture, according to claim 1, wherein: the lower end of the pressure interface (10) is provided with a pressure transmission channel, the pressure transmission channel is Y-shaped, and the upper end of the pressure transmission channel is communicated with the two mounting grooves.
3. A dual redundancy pressure sensor architecture, according to claim 1, wherein: the lower extreme of sintering base (9) is equipped with the installation cavity, and the inner chamber upper portion of installing the cavity is equipped with pressure chip (12), and the fixed cover in outside lower part of pressure chip (12) has connect ceramic insulation cover (14), pressure chip (12) and ceramic insulation cover (14) all bond fixedly with sintering base (9).
4. A dual redundancy pressure sensor architecture according to claim 3, wherein: the lower extreme of installation cavity is equipped with ripple diaphragm (13), and the bottom surface laminating of the outside of ripple diaphragm (13) upper surface and sintering base (9), laminates the upper surface of clamping ring (11) and the lower surface outside of ripple diaphragm (13) again, and the three passes through laser welding sealing fixation.
5. A dual redundancy pressure sensor structure, according to claim 1, wherein: and a silicone oil injection channel is formed in the outer side of the sintering base (9), a pin (15) is inserted into the upper part of the silicone oil injection channel, and the lower end of the silicone oil injection channel is communicated with the mounting cavity.
6. A dual redundancy pressure sensor structure, according to claim 1, wherein: pins are sintered in the sintering base (9), the lower ends of the pins are connected with input and output ends on the pressure chip (12), and the upper ends of the pins are connected with input and output ends of the second circuit board (8).
7. A dual redundancy pressure sensor structure, according to claim 1, wherein: the upper portion of the outer side of the pressure connector (10) is welded with the shell (4), and the upper end of the shell (4) is welded with the shell cap (3).
8. A dual redundancy pressure sensor architecture, according to claim 1, wherein: the upper end welding of first circuit board (5) has shielding cable (1), shielding cable (1) is pegged graft at shell cap (3) middle part spliced eye to fixed the cup jointing has copper post (2) between shielding cable (1) and the spliced eye, uses hydraulic tong to compress tightly shielding cable (1) and copper post (2) coincidence part, makes shielding cable (1) sealed fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222753252.4U CN218628724U (en) | 2022-10-19 | 2022-10-19 | Dual-redundancy pressure sensor structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222753252.4U CN218628724U (en) | 2022-10-19 | 2022-10-19 | Dual-redundancy pressure sensor structure |
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| Publication Number | Publication Date |
|---|---|
| CN218628724U true CN218628724U (en) | 2023-03-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222753252.4U Active CN218628724U (en) | 2022-10-19 | 2022-10-19 | Dual-redundancy pressure sensor structure |
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|---|---|
| CN (1) | CN218628724U (en) |
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2022
- 2022-10-19 CN CN202222753252.4U patent/CN218628724U/en active Active
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