JP5355149B2 - Electronic device and method of detecting connection failure of electronic component using electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To detect breakage in a junction which joins a circuit board to an electronic component with sufficient accuracy in advance. <P>SOLUTION: An electronic apparatus includes: a chip component 11 which includes external electrodes; a first solder joint 16-1 for chip which is formed on a first and a second electrode pads 15-1 and 15-2 and is joined to one external electrode 13; a second solder joint 16-2 for chip which is formed on a third electrode pad 15-3 and is joined to the other external electrode 13; and a resistance measuring circuit 18 which is formed on a circuit board 14 and measures a resistance between the first and the second electrode pads 15-1 and 15-2. The first electrode pad 15-1 is formed so that the breakage life of the first solder joint 16-1 for chip determined by the area of the first electrode pad 15-1 become shorter than the breakage life of a solder joint for a semiconductor package which mounts the semiconductor package on the circuit board 14 in the proximity of the chip component 11. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to an electronic device including an electronic component, and in particular, an electronic device capable of detecting in advance a breakage of a solder joint that connects the electronic component and a circuit board, and an electronic component using the electronic device. The present invention relates to a connection failure detection method.

  In recent years, electronic devices in which a plurality of electronic components, which are semiconductor packages in which semiconductor chips are mounted, or chip-type passive components (hereinafter referred to as chip components) such as resistors and capacitors, are mounted have become highly functional and Multifunctionalization is required. Due to this demand, higher integration and larger scale of semiconductor chips are progressing. Along with this, the number of electrical joints such as solder bumps connecting the semiconductor package and the circuit board is greatly increased. However, on the other hand, the size of each electrical joint tends to be small. Therefore, there is a problem that the joint portion is damaged due to temperature fluctuation, bending, impact, vibration, and the like repeatedly generated in the semiconductor package.

  In order to solve such a problem, there is known a technique for preventing thermal fatigue damage by detecting an increase in resistance value due to thermal fatigue damage of a joint portion by means of resistance value detection included in a semiconductor package (Patent Document 1). reference).

Japanese Patent No. 3265197

  However, since the conventional thermal fatigue damage detection method is applied only to semiconductor packages, it has poor versatility and cannot detect thermal fatigue damage of electronic components other than semiconductor packages. is there.

  Further, there is a problem that it is difficult to improve the detection accuracy because the difference in life between the sensor bump and the connection bump which are a part of the resistance value detection means cannot be made large.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic device capable of accurately detecting in advance a breakage of a joint portion between a circuit board and an electronic component.

An electronic device according to the present invention includes a circuit board, a first electrode pad, a second electrode pad and a third electrode pad which are formed on the circuit board so as to be spaced apart from each other, and a substrate made of a dielectric. good beauty and external chip component with electrodes, the formed on the first electrode pad and the second on the electrode pads, the first chip solder joint that joins the front Kigaibu electrode, the third formed on the electrode pad, before a second solder joint chip to be bonded to Kigaibu electrode, are formed on the circuit board, the first electrode pad, said second electrode pad and the third A resistance measuring circuit for measuring a resistance between any two electrode pads, and a bonding area between the first chip solder joint and the first electrode pad, 1 chip solder joint and the second solder joint Damage the lifetime of electrode pads and the solder joint for the defined first chip by the bonding area is characterized in that less than breakage life of the second solder joint chip.
The electronic device of the present invention includes a circuit board, a first electrode pad, a second electrode pad, and a third electrode pad formed on the circuit board so as to be separated from each other, and a dielectric. A chip component having a base and external electrodes formed so as to cover both ends of the base, and formed on the first electrode pad and the second electrode pad, and joined to one of the external electrodes A first chip solder joint, formed on the third electrode pad, a second chip solder joint for joining to the other external electrode, and formed on the circuit board. A resistance measuring circuit for measuring a resistance between any two of the electrode pads, the second electrode pads, and the third electrode pads, and solder bonding for the first chip Part and said first The breakage life of the first chip solder joint determined by the joint area with the electrode pad or the joint area between the first chip solder joint and the second electrode pad is the second chip. It is characterized by being shorter than the breakage life of the solder joint for use.
The electronic device of the present invention includes a circuit board, a first electrode pad, a second electrode pad, and a third electrode pad formed on the circuit board so as to be separated from each other, and a dielectric. A chip component having a base and external electrodes formed so as to cover both ends of the base, and formed on the first electrode pad and the second electrode pad, and joined to one of the external electrodes A first chip solder joint, formed on the third electrode pad, a second chip solder joint for joining to the other external electrode, and formed on the circuit board. A resistance measuring circuit for measuring a resistance between any two of the electrode pads, the second electrode pads, and the third electrode pads, and in the vicinity of the chip component on the circuit board, For electronic parts An electronic component mounted by a solder joint, and a joint area between the first chip solder joint and the first electrode pad or a first chip solder joint and the second chip solder joint. The damage life of the first chip solder joint determined by the joint area with the electrode pad is shorter than the break life of the electronic component solder joint.

In addition, the connection failure detection method using the electronic apparatus of the present invention includes a circuit board, and a first electrode pad, a second electrode pad, and a third electrode that are formed on the circuit board so as to be separated from each other. A chip component including a pad, a base made of a dielectric and an external electrode; and a first chip solder joint formed on the first electrode pad and the second electrode pad and joined to the external electrode. And formed on the third electrode pad, bonded to the external electrode, and a bonding area between the first chip solder bonding portion and the first electrode pad, or a first chip solder bonding portion. And a second chip solder joint having a failure life longer than that of the first chip solder joint determined by the bonding area between the first electrode pad and the second electrode pad. Connection failure detection method The first chip solder joint is measured by measuring a resistance value between any two of the first electrode pad, the second electrode pad, and the third electrode pad. In this method, the damage life of the solder joint for the electronic component is detected by detecting breakage of the part or breakage of the solder joint for the second chip .

  ADVANTAGE OF THE INVENTION According to this invention, the electronic device which can detect beforehand the failure | damage of the junction part of a circuit board and an electronic component accurately can be provided.

It is sectional drawing which shows typically the principal part of the electronic device which concerns on the 1st Embodiment of this invention. FIG. 1B is a horizontal sectional view cut along a broken line AA ′ in FIG. 1A. It is explanatory drawing which showed typically the mode of the wiring which connects an electrode pad and a resistance measurement circuit. It is sectional drawing which shows typically the electronic device which concerns on each embodiment of this invention. It is sectional drawing which shows typically the modification of the electronic device which concerns on each embodiment of this invention. It is sectional drawing which shows typically the principal part of the electronic device which concerns on the 2nd Embodiment of this invention. It is explanatory drawing which shows typically the change of the resistance value by the thermal fatigue failure detected by the chip component which the electronic device which concerns on the 2nd Embodiment of this invention has. It is explanatory drawing which shows typically the change of the resistance value by the failure | damage by the external force detected by the chip component which the electronic device which concerns on the 2nd Embodiment of this invention has. It is sectional drawing which shows typically the principal part of the electronic device which concerns on the 1st modification of the 2nd Embodiment of this invention. It is sectional drawing which shows typically the principal part of the electronic device which concerns on the 2nd modification of the 2nd Embodiment of this invention. It is sectional drawing which shows typically the principal part of the electronic device which concerns on the 3rd Embodiment of this invention. It is the figure which looked at the horizontal cross section cut | disconnected along broken line AA 'of FIG. 7A from the bottom. It is a horizontal sectional view showing a modification of the external electrode shown in FIG. 7B. It is sectional drawing which shows typically the principal part of the electronic device which concerns on the 4th Embodiment of this invention. It is sectional drawing which shows typically the principal part of the electronic device which concerns on the 5th Embodiment of this invention. It is the figure which looked at the horizontal cross section cut | disconnected along broken line AA 'of FIG. 9A from the bottom. It is sectional drawing which shows typically the principal part of the electronic device which concerns on the 6th Embodiment of this invention. It is sectional drawing which shows typically the principal part of the electronic device which concerns on the 7th Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(First embodiment)
FIG. 1A is a cross-sectional view schematically showing a main part of an electronic apparatus according to a first embodiment of the present invention.

  As shown in FIG. 1A, in the electronic device of the first embodiment, the chip component 11 has a rectangular parallelepiped shape, for example, and covers a base 12 made of a dielectric material such as ceramic and both ends of the base 12. The external electrode 13 is formed. The chip component 11 is a resistor in which a resistor 22 for electrically connecting the external electrodes 13 at both ends is formed on a base 12.

  On the other hand, the first electrode pad 15-1 and the second electrode pad 15 are spaced apart from each other at predetermined positions on the circuit board 14 made of, for example, FR-4 (heat-resistant glass base epoxy resin laminate). -2 and a third electrode pad 15-3 are formed. Each of these electrode pads 15-1, 15-2, 15-3 is made of a metal such as Cu, for example. In the chip component 11, the first chip solder joint 16-1 integrally formed on the first electrode pad 15-1 and the second electrode pad 15-2 and one external electrode 13 are joined. The second chip solder joint 16-2 formed on the third electrode pad 15-3 and the other external electrode 13 are joined to each other so as to be mounted on the circuit board 14. Of the first and second chip solder joint portions 16-1 and 16-2, a portion that is joined to the external electrode 13 on the side surface of the base 12 is particularly referred to as a fillet 17.

  Each of the first electrode pad 15-1 and the second electrode pad 15-2 is electrically connected to an electrical characteristic measurement circuit 18 formed on the circuit board 14 by a wiring 19. For convenience of explanation, the wiring 19 is provided in the circuit board 14 in FIG. 1A, but actually, it is formed on the surface of the circuit board 14 as shown in FIG. 1C. In the following embodiments, the wiring 19 is not shown, but is actually formed on the surface of the circuit board 14 as in FIG. 1C. With such wiring 19, as shown by a dotted line in FIG. 1A, the electrical characteristic measurement circuit 18, the wiring 19, the second electrode pad 15-2, the first chip solder joint 16-1, the first electrode A circuit network including a conductive path in the order of the pad 15-1 and the wiring 19 is formed. The current value, voltage, and the like flowing through such a circuit network can be measured by the electrical characteristic measurement circuit 18 as necessary.

  In the following description of each embodiment including this embodiment, the electrical characteristic measurement circuit 18 will be described as being a resistance measurement circuit 18 that detects a resistance value. The electrical characteristic measuring circuit 18 may be newly mounted on the circuit board 14 in order to measure electrical characteristics such as resistance, or already mounted for other uses such as a CPU. You may use things. Further, the positional relationship between the electrical characteristic measurement circuit 18 and the chip component 11 is not limited. That is, the electrical characteristic measurement circuit 18 may be mounted in the vicinity of the chip component 11 or may be mounted in a distant place.

  Here, the first electrode pad 15-1 is a first chip solder joint determined by the joint area between the electrode pad 15-1 and the first chip solder joint 16-1 joined thereto. The damage life of the part 16-1 is formed so as to be shorter than the damage life of the solder joint part 21 for the semiconductor package 20 mounted in the vicinity of the chip component 11 described later. Alternatively, the rupture life of the connection between the first and second electrode pads 15-1 and 15-2 and the wiring 19 formed on the circuit board 14 bonded to each of them is mounted in the vicinity of the chip component 11 described later. In addition, the solder joint portion 21 for the semiconductor package 20 is formed to be shorter than the breakage life.

  Note that the above-described failure life of the first chip solder joint 16-1 or breakage life with the wiring 19 is as shown in FIG. 1B, which is a horizontal sectional view taken along the broken line AA ′ of FIG. 1A. Further, the area of the first electrode pad 15-1 can be reduced by reducing it.

  On the circuit board 14 in the vicinity of the chip component 11 described above, as shown in FIG. 2A, the semiconductor package 20 is mounted by a semiconductor package solder joint portion 21. Here, the vicinity means a position where the load applied to the first and second chip solder joints 16-1 and 16-2 and the load applied to the semiconductor package solder joint 21 are approximately the same. .

  Next, the electronic device according to the first embodiment described above is used as a connection failure detection device, and an electronic component to be detected is mounted on a circuit board 14 of this device by a solder joint for electronic components. A method for detecting in advance the breakage of the solder joint for components will be described. In the method described below, the detection target electronic component is the semiconductor package 20 shown in FIG. 2A, and the electronic component solder joint is the semiconductor package solder joint 21.

  As shown in FIG. 2A, on the circuit board 14, the semiconductor circuit 20 is mounted in the vicinity of the chip component 11 according to the electronic device of the first embodiment. Apply current.

  In this state, when the first chip solder joint 16-1 is damaged by the load, the circuit network is broken. When the circuit network breaks in this way, the electrical resistance value measured by the resistance detection circuit 18 increases. Therefore, by measuring the resistance value with the resistance detection circuit 18, it is possible to detect that the circuit network is broken. That is, it is detected that the first chip solder joint 16-1 is damaged by the load.

  However, the first electrode pad 15-1 is formed in such a size that the first chip solder joint 16-1 bonded thereto is damaged earlier than the semiconductor package solder joint 21. Yes. Therefore, when the circuit network breaks, the semiconductor package solder joint 21 is not yet damaged.

  That is, in the resistance detection circuit 18, it is possible to detect in advance that the solder joint portion 21 for the semiconductor package is damaged by detecting an increase in the electrical resistance value due to the breaking of the circuit network.

  Note that the connection between the first electrode pad 15-1 and the first chip solder joint 16-1 or the electrical connection between the first electrode pad 15-2 and the wiring 19 on the circuit board 14 is broken. The electrical connection between the second electrode pad 15-2 and the first chip solder joint 16-1 or the second electrode pad 15-2 and the circuit board 14 is maintained even if the circuit network is broken by the above. Therefore, the original function of the chip component 11 is maintained.

  As described above, according to the electronic apparatus of the first embodiment, it is not only possible to detect the breakage of the first chip solder joint 16-1 by detecting the breakage of the circuit network. In addition, the breakage of the solder joint 21 for a semiconductor package mounted in the vicinity of the chip component 11 can be detected in advance.

  Here, since the first electrode pad 15-1 can be formed to have an arbitrary size, the damage life of the solder joint portion 21 for the semiconductor package and the first electrode pad 15- The difference with the damage life of the first chip solder joint portion 16-1 joined to 1 can be arbitrarily set. Therefore, by increasing this life difference, it is possible to detect in advance the breakage of the semiconductor package solder joint 21 with high accuracy.

  In general, when a large bending load or impact load is generated in the semiconductor package 20, the semiconductor package 20 is often damaged from the outer peripheral portion of the electrode pad 15 of the chip component 11 adjacent thereto. In contrast, in the chip component 11 of this embodiment, the first electrode pad 15-1 that is the outer peripheral portion of the electrode pad 15 is made small as shown in FIG. It is formed to become. As described above, in the first chip solder joint 16-1 to be joined to the first electrode pad 15-1 that is easily damaged by a bending load or an impact load, the vicinity of the joint surface is broken, so that the circuit network is broken. Therefore, it is highly effective for detecting in advance the breakage of the solder joint 21 for a semiconductor package due to a bending load or an impact load.

  Further, in the above-described embodiment, the component to be detected for damage of the solder joint is the semiconductor package 20. However, according to the present embodiment, the breakage of the circuit network is made shorter than the life of the joint of a general electronic component, thereby detecting in advance the breakage of the joint of an electronic component other than the semiconductor package 20. You can also.

  Further, since the chip component 11 according to the electronic device of the present embodiment is a small component, a plurality of chip components 11 can be mounted in a limited space on the circuit board 14. Therefore, it becomes possible to detect the breakage of the joint with higher accuracy and to grasp the load history of the entire circuit board 14. As a result, it is possible to prevent adverse effects caused by the occurrence of poor electrical connection due to delays in the maintenance / replacement time of electronic components.

  Furthermore, since the chip component 11 is a small component, it can be formed on an electronic component such as the semiconductor package 20 as shown in FIG. 2B, for example. In this case, the electrical characteristic detection circuit 18 for detecting the breakage of the circuit network is incorporated in the semiconductor package 20. The circuit 18 is connected to the first electrode pad 15-1 and the second electrode pad 15-2 by a wiring (not shown), so that the breakage of the solder joint 21 for the semiconductor package is detected in advance. be able to.

(Second Embodiment)
Next, a second embodiment of the present invention will be described. FIG. 3 is a cross-sectional view schematically showing an electronic apparatus according to the second embodiment of the present invention. Note that, in the description of the structure of the electronic device of the second embodiment, a different part from the structure of the electronic device of the first embodiment will be described. Also, a method for detecting in advance the breakage of the solder joint portion 21 for the semiconductor package that connects the semiconductor package 20 and the circuit board 14 by using the electronic device of each embodiment described later including the electronic device of the second embodiment. Since is the same method as in the first embodiment, description thereof is omitted.

  As shown in FIG. 3, the electronic device of the second embodiment is different from the electronic device of the first embodiment in that the first chip solder joint 16-1 is the first electrode pad 15-. 1 and the second electrode pad 15-2 are different from each other. That is, the first chip solder joints 16-1 are different from each other in being formed.

  When the chip component 11 is mounted on the circuit board 14, due to solder leakage, the first chip solder joint 16-1 on the first electrode pad 15-1 and the second electrode pad 15- 2, the external electrode 13 on the lower surface of the base 12 is treated to prevent solder leakage (not shown). Specifically, for example, on the surface of the external electrode 13 on the lower surface of the base 12, an epoxy resin or the like is applied between the bonding surface with the first chip solder bonding portion 16-1.

  As described above, the first chip solder joints 16-1 are formed on the first electrode pad 15-1 and the second electrode pad 15-2, respectively, so that a dotted line in FIG. As shown by, the resistance measurement circuit 18, the wiring 19, the second electrode pad 15-2, the first chip solder joint 16-1, the external electrode 13, the first chip solder joint 16-1, A conductive network is formed in the order of the first electrode pad 15-1 and the wiring 19. The resistance value of such a network can be detected by the resistance measurement circuit 18 as necessary.

  In the electronic device of the second embodiment described above, the second electrode pad 15-2 includes the first chip solder joint 16-1 on the electrode pad 15-2 and the external electrode 13 joined thereto. As shown in FIG. 2A, the failure life of the first chip solder joint portion 16-1 determined by the joint area with the semiconductor chip 20 is as follows. It is formed to be shorter than the breakage life. The damage life of the first chip solder joint 16-1 on the second electrode pad 15-2 can be shortened by reducing the area of the second electrode pad 15-2.

  According to the electronic device of the second embodiment described above, the second electrode pad 15-2 has an area of the electrode pad 15-2, and the first chip solder joint 16-1 has a semiconductor. It is formed so as to have a size that is damaged before the solder joint portion 21 for the package. Therefore, the same effect as the electronic device of the first embodiment can be obtained.

  In general, the thermal fatigue damage that occurs in the first chip solder joint 16-1 due to the difference in linear expansion coefficient between the circuit board 14 and the base 12 of the chip component 11 is the first chip. It often occurs at the solder joint 16-1 and subsequently at the fillet 17. On the other hand, the chip component 11 of the second embodiment is formed so that the breakage life of the first chip solder joint 16-1 is low. Therefore, according to the electronic device of the second embodiment, it has a high effect for detecting in advance the breakage of the solder joint 21 for the semiconductor package due to the difference in linear expansion coefficient.

  Here, even if the electrical connection between the first chip solder joint 16-1 and the external electrode 13 on the lower surface of the base 12 is broken, the electrical connection between the fillet 17 and the external electrode 13 on the side surface of the base 12 is achieved. Since the bonding is maintained, the chip component 11 can maintain its original function.

  Next, a temporal change in the electrical resistance value due to the breakage of the circuit network formed in the electronic device of the second embodiment described above will be described. FIG. 4A schematically shows a temporal change in the electric resistance value when the network is broken due to thermal fatigue failure. In FIG. 4A, the vertical axis represents the electric resistance value, and the horizontal axis represents the time. Note that the data shown in FIG. 4A is data processed under a certain rule, such as calculating a time average value of measured electrical resistance values or limiting only to measured values at the time of temperature rise. . As shown in FIG. 4A, when the network breaks due to thermal fatigue damage, the electrical resistance value increases relatively slowly.

  On the other hand, FIG. 4B schematically shows a temporal change in the electrical resistance value when the network is broken by an external force such as bending or impact. As shown in FIG. 4B, when the circuit network is broken by an external force, the electric resistance value rapidly increases.

  Therefore, according to the electronic device of the second embodiment, the circuit network for detecting the resistance is the first chip solder joint on the first electrode pad 15-1 on which the circuit network is easily broken by an external force. 4A and 4B, since the first chip solder joint 16-1 on the part 16-1 and the second electrode pad 15-2 on the second electrode pad 15-2 that easily breaks due to thermal fatigue passes. By detecting the change in value over time, the cause of the network breakage can also be predicted.

  In the electronic apparatus of the second embodiment described above, only the first chip solder joints 16-1 that are joined to one of the external electrodes 13 are formed apart from each other. However, as shown in FIGS. 5 and 6, the second chip solder joints 16-2 may also be formed apart from each other. Below, the modification of this 2nd Embodiment is demonstrated with reference to drawings.

(First Modification of Second Embodiment)
FIG. 5 is a cross-sectional view schematically showing a main part of an electronic apparatus according to a first modification of the second embodiment. In the description of this modified example, portions different from the electronic device of the second embodiment will be described.

  As shown in FIG. 5, in the electronic device of the first modified example, the second chip solder joints 16-2 are formed apart from each other as compared with the electronic device of the second embodiment. The point is different.

  Further, the second chip solder joints 16-2 spaced apart from each other are respectively formed on the third electrode pad 15-3 and the fourth electrode pad 15-3 spaced apart from the third electrode pad 15-3. Formed on the electrode pad 15-4.

  In the electronic device described above, the second electrode pad 15-2 and the third electrode pad 15-3 are each electrically connected to the resistance measurement circuit 18 formed on the circuit board 14 by the wiring 19. Yes. Thereby, as indicated by a dotted line in FIG. 5, the resistance measurement circuit 18, the wiring 19, the third electrode pad 15-3, the second chip solder joint 16-2, the external electrode 13, the resistor 22, and the outside A conductive network is formed in the order of the electrode 13, the first chip solder joint 16-1, the second electrode pad 15-2, and the wiring 19. The current value and voltage flowing in such a network can be detected by the resistance measurement circuit 18 as necessary.

  According to the electronic device of the first modified example of the second embodiment described above, the second electrode pad 15-2 and the third electrode pad 15-3 are as described in the second embodiment. In addition, these areas are formed in such a size that the first chip solder joint 16-1 and the second chip solder joint 16-2 are broken before the semiconductor package solder joint 21. ing. Therefore, the same effect as that of the electronic device of the second embodiment can be obtained.

  Furthermore, in the electronic device of the first modified example, since the circuit network is easily broken at both ends of the chip component 11, the semiconductor package is compared with the electronic device of the second embodiment. The breakage of the joint portion 21 can be detected in advance with higher accuracy.

(Second modification of the second embodiment)
FIG. 6 is a cross-sectional view schematically showing a main part of an electronic apparatus according to a second modification of the second embodiment. In the description of this modified example, parts different from the electronic device of the first modified example of the second embodiment will be described.

  As illustrated in FIG. 6, in the electronic device of the second modification example of the second embodiment, the area of the second electrode pad 15-2 and the area of the third electrode pad 15-3 are different from each other. The point is different from the chip component 11 according to the first modification of the second embodiment.

  The wiring 19 connected to the resistance measurement circuit 18 is connected to the first electrode pad 15-1 and the second electrode pad 15-2. Further, it is connected to the third electrode pad 15-3 and the fourth electrode pad 15-4. Accordingly, as shown by dotted lines in FIG. 6, a circuit network is formed at two locations. One circuit network includes a resistance measurement circuit 18, a wiring 19, a first electrode pad 15-1, a first chip solder joint 16-1, an external electrode 13, and a first chip solder joint 16-1. , A second electrode pad 15-2, and a circuit network that is conductive in this order. The other circuit network includes a resistance measurement circuit 18, a wiring 19, a fourth electrode pad 15-4, a second chip solder joint 16-2, an external electrode 13, and a second chip solder joint 16-2. , A third electrode pad 15-3, and a circuit network that is conductive in this order. The resistance value of each of such two circuit networks can be measured by the resistance measuring circuit 18 as necessary.

  According to the electronic device of the second modified example described above, the second electrode pad 15-2 and the third electrode pad 15-3 are as described in the first modified example of the second embodiment. In addition, these areas are formed in such a size that the first chip solder joint 16-1 and the second chip solder joint 16-2 are broken before the semiconductor package solder joint 21. ing. Therefore, the same effect as that of the chip component 11 according to the first modification of the second embodiment can be obtained.

  Further, in the electronic device of the second modification, the areas of the second electrode pad 15-2 and the third electrode pad 15-3 are formed different from each other. The breakage occurs in stages. That is, first, the second chip solder joint 16-2 formed on the third electrode pad 15-3 having a small area is damaged, and subsequently, the second electrode pad 15-2 having a large area. The first chip solder joint 16-1 formed above is damaged. Therefore, it is possible to detect in advance the breakage of the semiconductor package solder joint 21 step by step.

  Specifically, the load applied to the joint portion 21 when the semiconductor package solder joint portion 21 is damaged is set to 100%. At this time, the area of the third electrode pad 15-3 is designed so that the breakage of the network passing through the third electrode pad 15-3 having a small area occurs at a load of 50%. Then, the area of the second electrode pad 15-2 is designed so that the breakage of the network passing through the second electrode pad 15-2 having a large area is caused at a load of 80%. By forming the second and third electrode pads 15-2 and 15-3 in this manner, it is possible to detect in advance the breakage of the semiconductor package solder joint portion 21 step by step.

(Third embodiment)
Next, a third embodiment of the present invention will be described. FIG. 7A is a cross-sectional view schematically showing a main part of an electronic apparatus according to a third embodiment of the present invention. Note that in the description of the electronic device of the third embodiment, portions different from the electronic device of the second embodiment will be described.

  As shown in FIG. 7A, the electronic device of the third embodiment is different from the electronic device of the second embodiment in the shape of the external electrode 13 on one lower surface of the base 12.

That is, in FIG. 7B, as shown in a horizontal sectional view taken along the broken line AA ′ in FIG. 7A, in the chip component 11 according to the third embodiment, the external electrode 13 on one lower surface of the base 12 is The first external electrode 13-1 to be joined to the first chip solder joint 16-1 on the first electrode pad 15-1 and the first chip on the second electrode pad 15-2 A second external electrode 13-1 joined to the solder joint 16-1, and a third external electrode that electrically connects the first external electrode 13-1 and the second external electrode 13-2. 13-3. These external electrodes 13-1, 13-2, and 13-3 are all integrally formed of the same material. As a result, as shown by dotted lines in FIGS. 7A and 7B, the resistance detection circuit 18 and the wiring 19 , Second electrode pad 15-2, first chip solder joint 16-1, second external electrode 13-2, third external electrode 13-3, first external electrode 13-1, A circuit network is formed in the order of one solder joint 16-1 for a chip, the first electrode pad 15-1, and the wiring 19. The resistance value of such a network can be measured by the resistance measurement circuit 18 as necessary.

  According to the electronic device of the third embodiment described above, the area of the second electrode pad 15-2 is the same as that of the first chip solder joint 16-1, and the solder joint 21 for the semiconductor package. It is formed so as to have a size that breaks earlier. Therefore, the same effect as that of the electronic device of the second embodiment can be obtained.

  Furthermore, according to the electronic device of the third embodiment, the chip component 11 can be easily mounted on the circuit board 14 as compared with the electronic device of the second embodiment. This is because in the chip component 11 of the third embodiment, the interval between the first external electrode 13-1 and the second external electrode 13-2 is widened, and the third external electrode 13-3 therebetween is This is because it is formed thin. In general, solder for mounting spreads along the surface of the external electrode 13. Therefore, by forming the third external electrode 13-3 to be thin, it becomes difficult for the solder to spread on the surface of the third external electrode 13-3. Therefore, during mounting, the first and second electrode pads 15- 1 and 15-2 can be prevented from being joined to the first chip solder joint 16-1. Therefore, the first chip solder joints 16-1 are formed apart from each other without applying an epoxy resin or the like to the surface of the external electrode 13 on the lower surface of the base 12 as described in the second embodiment. be able to.

  The solder spreads on the third external electrode 13-3, and the first chip solder joints 16-1 on the first and second electrode pads 15-1 and 15-2 are joined. Even in this case, the solder for the first chip 16-1 on the second electrode pad 15-2 breaks, and at the same time, the solder spread on the surface of the third external electrode 13-3 is also cut. . Therefore, even if the solder spreads on the surface of the third external electrode 13-3 as described above, the breakage of the first chip solder joint 16-1 on the second electrode pad 15-2. As a result, the electrical resistance value increases. That is, it is possible to detect in advance the breakage of the solder joint portion 21 for the semiconductor package 20 mounted in the vicinity of the chip component 11.

  Moreover, the timing at which the network breaks can be adjusted by the arrangement position of the third external electrode 13-3. In general, a crack generated in the first chip solder joint 16-1 that causes breakage of the network is generated from the outside and propagates in the inner direction. Therefore, for example, when the third external electrode 13-3 is arranged outside as shown in FIG. 7C, compared with the case where the third external electrode 13-3 is arranged near the center as shown in FIG. As a result, the network is broken and the electrical resistance value increases. That is, the breaking life of the circuit network can be adjusted by the position where the third external electrode 13-3 is formed.

(Fourth embodiment)
Next, a fourth embodiment of the present invention will be described. FIG. 8: is sectional drawing which shows typically the principal part of the electronic device of the 4th Embodiment of this invention. Note that, in the description of the electronic device of the fourth embodiment, parts different from the electronic device of the third embodiment will be described.

  As shown in FIG. 8, in the electronic device of the fourth embodiment, compared to the electronic device of the third embodiment, the external electrodes 13 at both ends of the chip component 11 are separated from each other by the first external device. The difference is that the electrode 13-1 and the second external electrode 13-2 are configured. That is, as in the third embodiment, the third external electrode 13-3 as shown in FIG. 7B is formed between the first external electrode 13-1 and the second external electrode 13-2. Instead, they are formed completely apart.

  Furthermore, in the electronic device according to the fourth embodiment, the second external electrodes 13-2 at both ends of the chip component 11 are formed as a single plate-like second external electrode 13-2 on the lower surface of the base 12. Is formed.

  Further, as compared with the electronic device of the third embodiment, the first chip solder joint 16-1 to be joined to the one external electrode 13 of the chip component 11 is mutually similar to the third embodiment. Similarly to the third embodiment, the second chip solder joints 16-2 that are formed apart from each other and joined to the other external electrode 13 are also formed apart from each other.

  Further, as compared with the electronic device of the third embodiment, the first chip solder joint 16-1 is formed on the first and second electrode pads 15-1 and 15-2, respectively. The third embodiment is similar to the third embodiment except that second chip solder joints 16-2 are formed on the third and fourth electrode pads 15-3 and 15-4, respectively. Different from form.

  Further, the wiring 19 connected to the resistance measurement circuit 18 is connected to the second electrode pad 15-2 and the third electrode pad 15-3, respectively. Therefore, as indicated by a dotted line in FIG. 8, the resistance measurement circuit 18, the wiring 19, the third electrode pad 15-3, the second solder joint 16-2, and the plate-like second external electrode 13- 2, a circuit network that is conductive in the order of the first chip solder joint 16-1, the second electrode pad 15-2, and the wiring 19 is formed. The resistance value of such a network can be measured by the resistance measurement circuit 18 as necessary.

  According to the electronic device of the fourth embodiment described above, the areas of the second electrode pad 15-2 and the third electrode pad 15-3 are the first solder joint 16-1 and The second solder joints 16-2 are formed so as to be sized so as to be broken before the semiconductor package solder joints 21. Therefore, the same effect as the electronic device of the third embodiment can be obtained.

  Further, in the electronic device of the fourth embodiment, as described in the first modification of the second embodiment, there are two places (second electrode pad) where the circuit network is likely to break due to thermal fatigue. The first chip solder joint 16-1 on the second chip 15-2 and the second chip solder joint 16-2 on the third electrode pad 15-3). Compared with electronic equipment, breakage due to thermal fatigue of the solder joint 21 for semiconductor package can be detected in advance with higher accuracy.

  Furthermore, in the electronic device of the fourth embodiment, the second external electrodes 13-2 formed on both ends of the chip component 11 are formed as a single plate-like second external electrode 13-2. 12, and it is not necessary to form a third external electrode 13-3 to be electrically connected to each first external electrode 13-1, so that it is compared with the chip component 11 of the third embodiment. Thus, it is easy to manufacture the chip component 11. In addition, since the third external electrode 13-3 is not formed, the first chip solder joints 16-1 spaced apart from each other are joined at the time of mounting, and the second chip solder joints 16 separated from each other. -2 can be more effectively suppressed from joining.

  However, since the third external electrode 13-3 is not formed and the circuit network does not include the third external electrode 13-3, the circuit network does not include the third external electrode 13-3 as in the chip component 11 of the third embodiment. It does not have a function to adjust the fracture life.

(Fifth embodiment)
Next, a fifth embodiment of the present invention will be described. FIG. 9A is a cross-sectional view schematically showing an electronic apparatus according to a fifth embodiment of the present invention. Note that in the description of the electronic apparatus of the fifth embodiment, portions different from those of the fourth embodiment will be described.

  As shown in FIG. 9A and FIG. 9B, which is a top view taken along the broken line AA ′ in FIG. 9A, the electronic device of the fifth embodiment is a base compared to the electronic device of the fourth embodiment. 12 is different in structure of the second external electrode 13-2 formed on the lower surface of Twelve.

  That is, the second external electrode 13-2 of the chip component 11 according to the fifth embodiment is configured such that the electrode widths at the locations where the first and second chip solder joints 16-1 and 16-2 are joined, respectively. In this structure, the electrode width of the portion that is not joined is narrower. In other words, the structure is such that the second external electrodes 13-2 at both ends of the chip component 11 are joined by the thin third external electrodes 13-3 made of the same material as the second external electrodes 13-2. .

  Therefore, the circuit network formed in the electronic device of the fifth embodiment is the same as the circuit network formed in the electronic device of the fourth embodiment, as indicated by the dotted lines in FIGS. 9A and 9B.

  According to the electronic apparatus of the fifth embodiment described above, the area of the second electrode pad 15-2 and the third electrode pad 15-3 is the first chip solder joint 16-. The first and second chip solder joints 16-2 are formed so as to be broken before the semiconductor package solder joints 21. Therefore, the same effect as that of the electronic device of the fourth embodiment can be obtained. However, since the structure of the second external electrode 13-2 is complicated, the effect of the ease of manufacturing the chip component 11 cannot be expected.

  However, when the structure of the second external electrode 13-2 is formed as shown in FIG. 9B, compared with the structure of the second external electrode 13-2 of the chip component 11 according to the fourth embodiment, When the chip component 11 is mounted on the circuit board 14, the spread of the first and second chip solder joints 16-1 and 16-2 to be joined to the second external electrode 13-2 is suppressed. Can do. This is because the solder at the time of mounting spreads along the surface of the external electrode 13 as described in the fourth embodiment. Therefore, as compared with the electronic device of the fourth embodiment, each of the second external electrodes 13-2 formed on the lower surface of the base 12 and the first and second chip solder joints 16-1, Since each junction area with 16-2 can be controlled easily, the lifetime of a circuit network can be controlled easily.

(Sixth embodiment)
Next, a sixth embodiment of the present invention will be described. FIG. 10: is sectional drawing which shows typically the principal part of the electronic device of the 6th Embodiment of this invention. Note that in the description of the electronic device of the sixth embodiment, parts different from the electronic device of the third embodiment will be described.

  As shown in FIG. 10, in the electronic device of the sixth embodiment, the external electrodes 13 on one lower surface of the base 12 are separated from each other as compared with the electronic device of the third embodiment. 13-1 and the second external electrode 13-2, and the first external electrode 13-1 and the second external electrode 13-2 are not connected by the third external electrode 13-3. The point is different.

  In addition, as compared with the electronic device of the third embodiment, the first external electrode 13-1 and the second external electrode 13-2 that are separated from each other include the first chip solder joint 16-1. The other external electrode 13 is connected to the second electrode pad 15-2 via the second chip solder joint 16-2. Is also different.

  Also, the first and second chip solder joints 16-1 and 16-2 are different from the electronic device of the third embodiment in that the fillet 17 is not formed.

  In the electronic apparatus of the sixth embodiment, the wiring 19 connected to the resistance measurement circuit 18 is connected to the first and second electrode pads 15-1 and 15-2, respectively. Therefore, as indicated by a dotted line in FIG. 10, the resistance measurement circuit 18, the wiring 19, the second electrode pad 15-2, the second chip solder joint 16-2, the external electrode 13, the resistor 22, the first Of the external electrode 13-1, the first chip solder joint 16-1, the first electrode pad 15-1, and the wiring 19 are formed in this order. The resistance value of such a network can be measured by the resistance measurement circuit 18 as necessary.

  Here, when a thermal stress is generated in the chip solder joint 16 due to a difference in linear expansion coefficient between the circuit board 14 and the base 12, the crack generated in the first chip solder joint 16-1 does not have the fillet 17. In this case, normally, as shown by an arrow in FIG. 10, the chip component 11 progresses from the external direction toward the center of the chip component 11. Therefore, the breakage of the circuit network formed in the electronic device of the sixth embodiment occurs at the first chip solder joint 16-1 whose breakage life is determined by the joint area with the first external electrode 13-1. .

  In the electronic device of the sixth embodiment, the first external electrode 13-1 of the chip component 11 has a bonding area between the first external electrode 13-1 and the first chip solder bonding portion 16-1 that is the first chip solder bonding. The part 16-1 is formed so as to be sized so as to be broken before the solder joint part 21 for semiconductor package.

  According to the electronic device of the sixth embodiment described above, the same effect as that of the electronic device of the third embodiment is obtained by forming the one external electrode 13 of the chip component 11 as described above. be able to.

  Furthermore, in the electronic device of the sixth embodiment, one external electrode 13 is composed of the first external electrode 13-1 and the second external electrode 13-2. The chip solder joints 16-1 are not formed separately as in the third embodiment. Therefore, the chip component 11 can be easily mounted on the circuit board 14 as compared with the electronic device of the third embodiment.

  However, since the third external electrode 13-3 is not formed and the circuit network does not include the third external electrode 13-3, the circuit network does not include the third external electrode 13-3 as in the chip component 11 of the third embodiment. It does not have a function to adjust the fracture life.

(Seventh embodiment)
Next, a seventh embodiment of the present invention will be described. FIG. 11: is sectional drawing which shows typically the principal part of the electronic device of the 7th Embodiment of this invention.

  The electronic device of the seventh embodiment shown in FIG. 11 has both the structure of the electronic device of the first embodiment shown in FIG. 1A and the structure of the electronic device of the second embodiment shown in FIG. It is characterized by. In the description of the electronic device according to the seventh embodiment, a different part from the second embodiment will be described.

  As shown in FIG. 11, the electronic device of the seventh embodiment has a first electrode pad 15-1 of the chip component 11 according to the second embodiment as compared with the electronic device of the second embodiment. The difference is that the corresponding electrode pad 15 is composed of two first electrode pads 15-1 separated from each other.

  The first wiring 19-1 connected to the resistance measurement circuit 18 is connected to one of the two first electrode pads 15-1 and the second electrode pad 15-2 that are separated from each other. Further, the second wiring 19-2 connected to the resistance measurement circuit 18 is connected to two first electrode pads 15-1 that are separated from each other. Therefore, as shown by a dotted line in FIG. 11, two types of circuit networks are formed.

  The first network includes a resistance measurement circuit 18, a first wiring 19-1, a second electrode pad 15-1, a first chip solder joint 16-1, an external electrode 13, and a first chip. This is a circuit network that conducts in the order of the solder joint portion 16-2, the first electrode pad 15-1, and the first wiring 19-1.

  The second network includes a resistance measurement circuit 18, a second wiring 19-2, a first electrode pad 15-1, a first chip solder joint 16-1, a first electrode pad 15-1, It is a circuit network that is conducted in the order of the second wiring 19-2.

  The resistance values of the first and second circuit networks can be measured by the resistance measuring circuit 18 as necessary.

  According to the electronic device of the seventh embodiment described above, the second embodiment is achieved by appropriately forming one area of the second electrode pad 15-2 as described in the second embodiment. The same effect as that of the electronic device can be obtained. Furthermore, the same effect as that of the electronic device of the first embodiment can be obtained by appropriately forming one area of the first electrode pads 15-1 separated from each other as described in the first embodiment. Can do.

  Furthermore, according to the electronic apparatus of the seventh embodiment, since the first circuit network and the second circuit network described above are formed on one chip component 11, the cause of the breakage is It is possible to detect with differentiation.

  The embodiment of the present invention has been described above. However, the embodiments of the present invention are not limited to the above-described embodiments as they are, and can be embodied by modifying the components without departing from the scope of the invention in the implementation stage.

  Moreover, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the above-described embodiments. For example, some components may be deleted from all the components shown in the embodiment.

  Furthermore, constituent elements over different embodiments may be appropriately combined. For example, the chip component 11 of the first embodiment, the third embodiment, and the sixth embodiment described above may be modified in the same manner as the modifications of the second embodiment. Moreover, you may deform | transform the chip component 11 of 4th Embodiment and 5th Embodiment similarly to the 2nd modification of 2nd Embodiment.

  In each embodiment, the base 12 of the chip component 11 is made of ceramic, and the circuit board 14 is made of FR-4. However, in this invention, what has a difference in these thermal expansion coefficients should just be, and it becomes possible to detect with high precision especially, so that a thermal expansion coefficient difference is large.

  Moreover, the chip component 11 which concerns on the electronic device of each embodiment was resistance. However, the chip component 11 according to the first modification of the second embodiment shown in FIG. 5 and the other chip components 11 other than the chip component 11 according to the sixth embodiment shown in FIG. It may be a capacitor having no resistor 22 between them.

  DESCRIPTION OF SYMBOLS 11 ... Chip component, 12 ... Base | substrate, 13 ... External electrode, 13-1 ... 1st external electrode, 13-2 ... 2nd external electrode, 13-3 ... Third external electrode, 14 ... Circuit board, 15 ... Electrode pad, 15-1 ... First electrode pad, 15-2 ... Second electrode pad, 15-3 ... Third electrode pad, 15-4... Fourth electrode pad, 16... Chip solder joint, 16-1... First chip solder joint, 16-2. 2 solder joints for chip, 17... Fillet, 18... Electrical characteristic measurement circuit (resistance measurement circuit), 19... Wiring, 19-1. Second wiring, 20... Semiconductor package, 21... Solder joint for semiconductor package, 22.

Claims (17)

A circuit board;
A first electrode pad, a second electrode pad and a third electrode pad which are formed on the circuit board so as to be spaced apart from each other;
A chip component having a base and outer portions electrode made of a dielectric material,
Is formed on the first electrode pad and the second on the electrode pads, the first chip solder joint that joins the front Kigaibu electrode,
Formed on the third electrode pad, and the second chip solder joint that joins the front Kigaibu electrode,
A resistance measuring circuit which is formed on the circuit board and measures a resistance between any two of the first electrode pad, the second electrode pad and the third electrode pad;
Equipped with,
The first chip defined by the bonding area between the first chip solder bonding portion and the first electrode pad or the bonding area between the first chip solder bonding portion and the second electrode pad. An electronic device characterized in that a breakage life of the solder joint portion for solder is shorter than a breakage life of the second solder joint portion for chip .   A circuit board;
  A first electrode pad, a second electrode pad and a third electrode pad which are formed on the circuit board so as to be spaced apart from each other;
  A chip component including a base made of a dielectric and external electrodes formed to cover both ends of the base;
  A first chip solder joint formed on the first electrode pad and the second electrode pad and joined to one of the external electrodes;
  A second chip solder joint formed on the third electrode pad and joined to the other external electrode;
  A resistance measuring circuit which is formed on the circuit board and measures a resistance between any two of the first electrode pad, the second electrode pad and the third electrode pad;
  Comprising
  The first chip defined by the bonding area between the first chip solder bonding portion and the first electrode pad or the bonding area between the first chip solder bonding portion and the second electrode pad. An electronic device characterized in that a breakage life of the solder joint portion for solder is shorter than a breakage life of the second solder joint portion for chip. In the vicinity of the chip component on the circuit board further comprises an electronic component mounted by an electronic component solder joint,
The first chip determined by the bonding area between the first chip solder bonding portion and the first electrode pad or the bonding area between the first chip solder bonding portion and the second electrode pad. the electronic device according to claim 1 or 2 damaged life of the solder joint chip, characterized in that less than breakage life of the solder joint for an electronic component.   A circuit board;
  A first electrode pad, a second electrode pad and a third electrode pad which are formed on the circuit board so as to be spaced apart from each other;
  A chip component including a base made of a dielectric and external electrodes formed to cover both ends of the base;
  A first chip solder joint formed on the first electrode pad and the second electrode pad and joined to one of the external electrodes;
  A second chip solder joint formed on the third electrode pad and joined to the other external electrode;
  A resistance measuring circuit which is formed on the circuit board and measures a resistance between any two of the first electrode pad, the second electrode pad and the third electrode pad;
  In the vicinity of the chip component on the circuit board, an electronic component mounted by an electronic component solder joint, and
  Comprising
The first chip defined by the bonding area between the first chip solder bonding portion and the first electrode pad or the bonding area between the first chip solder bonding portion and the second electrode pad. An electronic apparatus characterized in that a breakage life of the solder joint portion for use is shorter than a breakage life of the solder joint portion for electronic parts. The chip component is mounted on an electronic component mounted on the circuit board by an electronic component solder joint,
The first chip determined by the bonding area between the first chip solder bonding portion and the first electrode pad or the bonding area between the first chip solder bonding portion and the second electrode pad. damage the lifetime of the solder joint for chip, an electronic device according to claim 1, 2 or 4, characterized in that less than breakage life of the solder joint for an electronic component. The solder joint for the first chip, the electronic apparatus according to any one of claims 1 to 5, characterized in that integrally formed on the first electrode pad and the second electrode pad . The first solder joint chip, the first electrode pad and the upper and the second electrode pad, electrons according to any one of claims 1 to 5, characterized in that the respectively formed machine. The third electrode pad includes two electrode pads spaced apart from each other, and the second chip solder joint on the two electrode pads is disposed on the two third electrode pads spaced apart from each other. The electronic device according to claim 7 , wherein the electronic device is formed respectively. 9. The electronic apparatus according to claim 8 , wherein a resistor for connecting the external electrodes formed on both ends of the base to each other is formed on the upper surface of the base. The resistance measurement circuit measures a resistance between the first electrode pad and the second electrode pad and a resistance between the two third electrode pads spaced apart from each other. Item 9. The electronic device according to Item 8 . The first electrode pad and the second of said formed respectively on the electrode pads first Kigai portion electrode prior to bonding to the solder joint for chip solder joints for each of the first chip Consisting of first and second external electrodes to be joined,
Kigai unit electrodes prior to bonding to the said second solder joint for chip formed respectively on the two third electrode pads spaced from each other is bonded to the solder joint for each of said second chip Comprising first and second external electrodes,
The second external electrodes to be joined to the first and second chip solder joints are respectively formed on the lower surface of the base and are connected to each other by the same material as the first and second external electrodes. The electronic device according to claim 8 , wherein The first electrode pad comprises two electrode pads spaced apart from each other,
The resistance measurement circuit measures a resistance between one of the two first electrode pads spaced apart from each other and the second electrode pad and a resistance between the two first electrode pads spaced apart from each other. The electronic apparatus according to claim 7 . A circuit board;
A first electrode pad formed on the circuit board and spaced apart from each other; a second electrode pad;
A base made of a dielectric, an external electrode formed so as to cover both ends of the base, and a resistor formed on the upper surface of the base and electrically connecting the external electrodes at both ends of the base Chip parts,
A first chip solder joint formed on the first electrode pad and joined to one of the external electrodes;
A second chip solder joint formed on the second electrode pad and joined to the other external electrode;
A resistance measuring circuit formed on the circuit board and measuring a resistance between the first electrode pad and the second electrode pad;
Comprising
The one external electrode formed on the lower surface of the base is constituted by a first external electrode and a second external electrode which are spaced apart from each other. In the vicinity of the chip component on the circuit board further comprises an electronic component mounted by an electronic component solder joint,
The failure life of the first chip solder joint determined by the joint area between the first chip solder joint and the second external electrode is greater than the failure life of the electronic component solder joint. The electronic device according to claim 13 , wherein the electronic device is short. The chip component is mounted on an electronic component mounted on the circuit board by an electronic component solder joint,
The failure life of the first chip solder joint determined by the joint area between the first chip solder joint and the second external electrode is greater than the failure life of the electronic component solder joint. The electronic device according to claim 13 , wherein the electronic device is short. A circuit board;
A first electrode pad, a second electrode pad and a third electrode pad which are formed on the circuit board so as to be spaced apart from each other;
A chip component having a dielectric base and external electrodes;
A first solder joint for a chip formed on the first electrode pad and the second electrode pad and joined to the external electrode;
Formed on the third electrode pad and bonded to the external electrode, the bonding area between the first chip solder bonding portion and the first electrode pad, or the first chip solder bonding portion and the A second chip solder joint having a failure life longer than that of the first chip solder joint determined by a bonding area with the second electrode pad;
A connection failure detection method using an electronic device having
Of the first electrode pad, the second electrode pad, and the third electrode pad, the resistance value between any two electrode pads is measured to break the first chip solder joint or A connection failure detection method , wherein the failure life of the electronic component solder joint is detected by detecting breakage of the second chip solder joint . The connection failure detection method according to claim 16 , wherein the cause of damage to the electronic component solder joint portion is specified based on a temporal change in the resistance value.

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