WO2024119714A1 - 涂白led灯丝及其制作工艺和led灯泡 - Google Patents

涂白led灯丝及其制作工艺和led灯泡 Download PDF

Info

Publication number
WO2024119714A1
WO2024119714A1 PCT/CN2023/094498 CN2023094498W WO2024119714A1 WO 2024119714 A1 WO2024119714 A1 WO 2024119714A1 CN 2023094498 W CN2023094498 W CN 2023094498W WO 2024119714 A1 WO2024119714 A1 WO 2024119714A1
Authority
WO
WIPO (PCT)
Prior art keywords
white
coated
filament
glue
substrate
Prior art date
Application number
PCT/CN2023/094498
Other languages
English (en)
French (fr)
Inventor
皮保清
刘吉伟
赵云峰
贺雪昭
徐亚辉
Original Assignee
中山市木林森电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中山市木林森电子有限公司 filed Critical 中山市木林森电子有限公司
Priority to EP23844062.2A priority Critical patent/EP4407700A1/en
Publication of WO2024119714A1 publication Critical patent/WO2024119714A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps

Definitions

  • the present application relates to the field of LED lamps, and in particular to a white-coated LED filament and a manufacturing process thereof, and an LED bulb.
  • the existing production process of white coating filament lamps is to first apply white coating powder on the inner surface of the glass shell, and then combine it with the filament for a second time. The process is complicated and the production cost is high. In addition, the existing white coating layer of the glass shell is unstable, which is prone to color drift and instability of photoelectric parameters.
  • the present application provides a white-coated LED filament.
  • the white-coated LED filament comprises a filament body, wherein the filament body comprises a substrate in the shape of a long strip, a plurality of LED chips distributed in series on the substrate, and a packaging layer covering the LED chips, wherein the white-coated LED filament further comprises a white coating layer coated on the surface of the packaging layer.
  • the white-coating layer is composed of the following raw materials in parts by weight: 10 parts of glue, 0.1-100 parts of white-coating powder, the glue is silica gel, epoxy resin glue or modified epoxy silicone resin, and the white-coating powder is titanium dioxide, silicon dioxide or barium sulfate.
  • the substrate is any one of a flexible FPC substrate, a ceramic substrate or a glass fiber substrate.
  • the packaging layer is fluorescent glue, which is coated on both sides of the substrate.
  • the white-coated layer surrounds and covers the filament body.
  • the thickness of the white-coated layer is 1 ⁇ m to 5000 ⁇ m.
  • the embodiment of the present application also provides a process for manufacturing a white-coated LED filament.
  • a manufacturing process for a white-coated LED filament comprises brushing glue doped with white-coating powder on the surface of a filament body to form a white-coating layer on the surface of a packaging layer.
  • the white-coated layer is formed on the surface of the filament body by printing or dispensing.
  • the manufacturing process of the white-coated LED filament as described above includes the following steps:
  • drying After painting, dry it.
  • the drying conditions are 80°C-300°C/0.1h-1.5h first, then long bake at 100°C-300°C/2h-8h.
  • an embodiment further provides an LED light bulb.
  • An LED light bulb comprises at least a light bulb shell, in which the above-mentioned white-coated LED filament is installed.
  • the present application provides a white-coated LED filament, which optimizes the white coating powder originally coated on the inside of the glass shell to be coated on the surface of the filament, so that a white coating layer is formed on the surface of the filament, which is combined with the filament for one-time molding, simplifies the existing powder coating process inside the glass shell, and reduces the cost of use and production of finished products.
  • the present application provides a manufacturing process for white-coated LED filaments, which optimizes the original white-coating process.
  • the white-coating powder originally coated on the inside of the glass shell is brushed on the surface of the filament, and the filament is formed at one time, which greatly improves the stability of the white-coated filament lamp, makes the color drift and its photoelectric parameters controllable, has a simple production process and low cost, expands the scope of client use, and reduces the client use cost.
  • the present application provides an LED light bulb, which moves the powder coating process of the white bulb glass shell to the surface of the filament, and combines it with the filament for one-time molding, thereby reducing the cost of use, simplifying the existing powder coating process inside the glass shell, reducing the cost of use and production of finished products, and meeting the product requirements of existing market clients for white bulb coated filament lamps.
  • FIG1 is a schematic diagram of a white-coated LED filament structure in an embodiment of the present application.
  • FIG2 is a schematic cross-sectional view of a white-coated LED filament according to an embodiment of the present application.
  • FIG3 is a schematic longitudinal cross-sectional view of a white-coated LED filament according to an embodiment of the present application.
  • FIG4 is a schematic diagram of the structure of an LED bulb in an embodiment of the present application.
  • FIG. 5 is a schematic diagram of the structure of an LED bulb in another embodiment of the present application.
  • the white-coated LED filament comprises a filament body 1, wherein the filament body 1 comprises a substrate 11 in the form of a long strip, a plurality of LED chips 12 distributed in series on the substrate 11, and a packaging layer 13 covering the LED chips 12.
  • the white-coated LED filament further comprises a white coating layer 2 coated on the surface of the packaging layer 13.
  • the present application provides a white-coated LED filament, which optimizes the white coating powder originally coated on the inside of the glass shell to be coated on the surface of the filament, so that a white coating layer is formed on the surface of the filament, which is combined with the filament for one-time molding, simplifies the existing powder coating process inside the glass shell, and reduces the cost of client use and production of finished products.
  • the white coating layer 2 is composed of the following raw materials in parts by weight: 10 parts of glue, 0.1 to 100 parts of white coating powder.
  • 10 parts of glue 0.1 to 100 parts of white coating powder.
  • the ratio of white coating powder is less than 10:0.01, the white effect cannot be achieved, and when the ratio of white coating powder is greater than 10:100, the painting process cannot be completed.
  • the glue is silica gel, epoxy resin glue or modified epoxy silicone resin
  • the white powder is titanium dioxide, silicon dioxide or barium sulfate.
  • the white coating process of the present application can be adapted to existing LED substrates, and is not limited to any one of flexible FPC substrates, ceramic substrates or glass fiber substrates.
  • FIGS. 1-4 are embodiments of ceramic substrates
  • FIG. 5 is an embodiment of a flexible FPC substrate.
  • the encapsulation layer 13 is coated on both sides of the substrate 11 , and the encapsulation layer is fluorescent glue, and the LED chip is encapsulated by the fluorescent glue.
  • the white coating layer 2 surrounds and covers the filament body 1, and the white coating powder originally coated on the inner surface of the glass shell is moved to the surface of the filament, and is combined with the filament for one-time molding.
  • the white coating layer makes the filament body have good diffusion performance, making the light soft and not dazzling.
  • the thickness of the white coating layer 2 is 1 ⁇ m to 5000 ⁇ m.
  • the thickness is less than 1 ⁇ m, the purpose of reducing diffusion cannot be achieved, and when the thickness is greater than 5000 ⁇ m, the cost is wasted.
  • the present application can effectively improve the defect of unstable coating of existing white-coated filament lamps and produce white-coated filaments without losing the lumen of the entire lamp.
  • electrical connection terminals 14 are provided at both ends of the substrate 11, and an external power source is electrically connected through the electrical connection terminals 14 to supply power to the LED chip.
  • the present application adopts printing or dispensing to form a white coating layer 2 on the surface of the filament body 1.
  • the present application prints the white coating powder or forms it with the filament at one time by dispensing, which greatly improves the stability of the white coating filament lamp, makes the color drift and its photoelectric parameters in a controllable state, increases the scope of client use, reduces the client use cost, and improves the competitive advantage of our company's filament.
  • the dispensing step includes:
  • Step S1 Fixing, first fix the filament body 1;
  • Step S2 Loading fluorescent glue, loading the evenly mixed fluorescent glue into the glue dispensing machine;
  • Step S3 Apply glue by first applying glue on one side of the filament body 1 through a glue dispenser, and then turning the filament body 1 over and applying glue on the other side of the filament body 1;
  • Step S4 drying, the drying condition is 80°C-300°C/0.1h-1.5h to quickly shape the fluorescent glue
  • Step S5 loading glue, loading the glue mixed with the white powder into the glue dispensing machine
  • Step S6 Apply glue by first applying glue on one side of the filament body 1 through a glue dispenser, and then turning the filament body 1 over and applying glue on the other side of the filament body 1;
  • Step S7 drying.
  • the drying conditions are 80°C-300°C/0.1h-1.5h first, and then long baking at 100°C-300°C/2h-8h. Long baking is beneficial to better bonding of the fluorescent glue layer and the white glue layer and eliminating stress in the colloid, thereby improving product performance.
  • the brightness and luminous efficiency of the filament whitening used in the embodiment of the present application will be higher than that of the glass shell whitening used in the comparison example, and the color tolerance will be more concentrated.
  • the present application optimizes the original whitening process, and the whitening powder originally coated on the inside of the glass shell is brushed on the surface of the filament, and the filament is formed at one time, which greatly improves the stability of the whitened filament lamp, makes the color drift and its photoelectric parameters controllable, has a simple production process and low cost, thereby increasing the scope of client use and reducing the client use cost.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Luminescent Compositions (AREA)

Abstract

一种涂白LED灯丝及其制作工艺和LED灯泡，将原有涂在玻壳内部的涂白粉涂至灯丝表面，使其在灯丝表面形成涂白层，与灯丝结合一次性成型，简化现有玻壳内部涂粉工艺，降低客户端使用和制作成本，大大提高了涂白灯丝灯的稳定性，使得色漂及其光电参数处于可管控状态。

Description

涂白LED灯丝及其制作工艺和LED灯泡 技术领域
本申请涉及LED灯领域，具体涉及一种涂白LED灯丝及其制作工艺和LED灯泡。
 背景技术
随着 LED 灯丝灯的不断发展，LED 灯丝灯涂白泡要求越发严格，现有涂白灯丝灯制作工艺，是先将涂白粉涂在玻壳内部表面，再次与灯丝二次结合，工艺复杂，制作成本高，且现有玻壳涂白层不稳定，容易产生色漂、光电参数会产生不稳定性的问题。
 技术问题
为克服现有涂白灯丝灯工艺复杂、制作成本高、玻壳涂白层不稳定的技术问题，本申请一方面提供了一种涂白LED灯丝。
 技术解决方案
涂白LED灯丝，包括灯丝本体，所述灯丝本体包括呈长条带状的基板、多个串联分布设于所述基板上的LED芯片和包覆所述LED芯片的封装层，其特征在于：所述的涂白LED灯丝还包括涂覆于所述封装层表面的涂白层。
如上所述的涂白LED灯丝，所述涂白层由下述重量份的原料组成：10份胶水、0.1～100份涂白粉，所述胶水为硅胶、环氧树脂胶或改性环氧硅树脂，所述涂白粉为二氧化钛、二氧化硅或硫酸钡。
如上所述的涂白LED灯丝，所述基板为柔性FPC基板、陶瓷基板或玻纤基板中任一种。
如上所述的涂白LED灯丝，所述封装层为荧光胶，包覆于所述基板两侧。
如上所述的涂白LED灯丝，所述涂白层环绕包覆所述灯丝本体。
如上所述的涂白LED灯丝，所述涂白层厚度为1μm～5000μm。
另一方面，本申请实施例还提供一种涂白LED灯丝的制作工艺。
一种涂白LED灯丝的制作工艺，包括在灯丝本体表面涂刷掺杂有涂白粉的胶水，以在封装层表面形成涂白层。
如上所述的涂白LED灯丝的制作工艺，采用印刷或点胶方式在灯丝本体表面涂刷形成涂白层。
如上所述的涂白LED灯丝的制作工艺，点胶步骤包括：
将表层成型有荧光胶的灯丝本体固定；
将混合有涂白粉的胶水装入点胶机；
通过点胶机先在灯丝本体一侧表面涂刷混合有涂白粉的胶水，再将灯丝本体翻面涂刷另一侧表面；
涂刷完成后烘干，烘干条件为先80℃-300℃/0.1h-1.5h，再转长烤100℃-300℃/2h-8h。
本申请第三目的，实施例还提供一种LED灯泡。
一种LED灯泡，至少包括灯泡壳，所述灯泡壳内安装有上述的涂白LED灯丝。
 有益效果
1、本申请提供一种涂白LED灯丝，将原有涂在玻壳内部的涂白粉优化涂至灯丝表面，使其在灯丝表面形成涂白层，与灯丝结合一次性成型，简化现有玻壳内部涂粉工艺，降低使用和制作成品成本。
2、本申请提供一种涂白LED灯丝的制作工艺，对原有涂白工艺做优化处理，将原有涂在玻壳内部的涂白粉涂刷于灯丝表面，与灯丝一次性成型，大大的提高了涂白灯丝灯的稳定性，使得色漂及其光电参数处于可管控状态，生产制作工艺简单，成本较低，提高客户端使用范围，降低客户端使用成本。
3、本申请提供一种LED灯泡，将涂白泡玻壳涂粉工艺移至灯丝表面，与灯丝结合一次性成型，使得使用成本降低，简化现有玻壳内部涂粉工艺，降低使用和制作成品成本，可满足现有市场客户端对灯丝灯涂白泡的产品要求。
 附图说明
图1是本申请实施例中涂白LED灯丝结构示意图；
图2本申请实施例中涂白LED灯丝横截面示意图；
图3本申请实施例中涂白LED灯丝纵截面示意图；
图4本申请实施例中LED灯泡结构示意图；
图5本申请另一实施例中LED灯泡结构示意图。
 本发明的最佳实施方式
涂白LED灯丝，包括灯丝本体1，所述灯丝本体1包括呈长条带状的基板11、多个串联分布设于所述基板11上的LED芯片12和包覆所述LED芯片12的封装层13，所述的涂白LED灯丝还包括涂覆于所述封装层13表面的涂白层2。
本申请提供一种涂白LED灯丝，将原有涂在玻壳内部的涂白粉优化涂至灯丝表面，使其在灯丝表面形成涂白层，与灯丝结合一次性成型，简化现有玻壳内部涂粉工艺，降低客户端使用和制作成品成本。
进一步地，所述涂白层2由下述重量份的原料组成：10份胶水、0.1～100份涂白粉，涂白粉比例小于10：0.01时将无法实现白色效果，涂白粉比例大于10:100时将无法完成涂刷工艺。
更进一步的，所述胶水为硅胶、环氧树脂胶或改性环氧硅树脂，所述涂白粉为二氧化钛、二氧化硅或硫酸钡等。
进一步地，本申请的涂白工艺可适应于现有的LED基板，不阔不限于柔性FPC基板、陶瓷基板或玻纤基板中任一种，如图1-4为陶瓷基板的实施例，图5为柔性FPC基板实施例。
进一步地，所述封装层13包覆于所述基板11两侧，封装层为荧光胶，通过荧光胶对LED芯片进行封装。
进一步地，所述涂白层2环绕包覆所述灯丝本体1，将原有涂至玻壳内部表面的涂白粉，移至灯丝表面，与灯丝结合一次性成型，通过涂白层使得灯丝本体具有良好漫射性能，使得发光柔和，不刺眼。
进一步地，所述涂白层2厚度为1μm～5000μm，厚度低于1μm时无法达到减少漫射的目的，而厚度高于5000μm则浪费成本，本申请能有效的提高现有涂白灯丝灯涂层不稳定的缺陷，在不损失整灯流明的情况下，制作出涂白灯丝。
进一步地，所述基板11两端均设有电连接端子14，通过电连接端子14电连接外部电源为LED芯片供电。
一种涂白LED灯丝的制作工艺，包括在灯丝本体1表面涂刷掺杂有白色高反射率的涂白粉的胶水，以在封装层13表面形成涂白层2。本制作工艺相对于常规灯丝灯涂白泡的制作成本低，将原有涂白工艺做优化处理，将原有涂在玻壳内部的涂白粉涂刷于灯丝表面，与灯丝一次性成型，大大的提高了涂白灯丝灯的稳定性，使得色漂及其光电参数处于可管控状态，提高客户端使用范围，降低客户端使用成本。
进一步地，本申请采用印刷或点胶方式在灯丝本体1表面涂刷形成涂白层2，本申请将涂白粉印刷或者通过点胶的方式，与灯丝一次性成型，大大的提高了涂白灯丝灯的稳定性，使得色漂及其光电参数处于可管控状态，提高客户端使用范围，降低客户端使用成本，提高我司灯丝竞争优势。
更进一步地，点胶步骤包括：
步骤S1：固定，先将灯丝本体1固定；
步骤S2：装荧光胶，将混合均匀的荧光胶水装入点胶机；
步骤S3：刷胶，通过点胶机先在灯丝本体1一侧表面涂刷，再将灯丝本体1翻面涂刷灯丝本体1另一侧表面；
步骤S4：烘干，烘干条件为 80℃-300℃/0.1h-1.5h 将荧光胶快速成型；
步骤S5：装胶，将混合有涂白粉的胶水装入点胶机；
步骤S6：刷胶，通过点胶机先在灯丝本体1一侧表面涂刷，再将灯丝本体1翻面涂刷灯丝本体1另一侧表面；
步骤S7：烘干，烘干条件为先80℃-300℃/0.1h-1.5h，再转长烤100℃-300℃/2h-8h，长烤有利于荧光胶层与白胶层更好的结合及消除胶体内应力，提高产品性能。
一种LED灯泡，至少包括灯泡壳3，所述灯泡壳3内安装有上述的涂白LED灯丝，LED芯片与基板能够通过灯泡壳完整的隔绝空气，避免LED芯片及基板氧化，LED芯片能在密闭的空间良好的运行，为LED灯丝创造了使用环境，大大提高LED灯丝使用寿命，本申请将涂白泡玻壳涂粉工艺移至灯丝表面，与灯丝结合一次性成型，使得使用成本降低，简化现有玻壳内部涂粉工艺，降低使用和制作成品成本，可满足现有市场客户端对灯丝灯涂白泡的产品要求。
将实施例制备的采用涂白灯丝灯泡与现有的涂白玻壳灯泡进行性能测试，测试效果如下：
表1：实施例采用涂白灯丝灯泡性能测试结果
表2：对比例采用涂白玻壳灯泡性能测试结果
由测试结果可知，本申请实施例采用灯丝涂白比对比例采用玻璃壳涂白亮度、光效会更高，色容差也会更集中，本申请对原有涂白工艺做优化处理，将原有涂在玻壳内部的涂白粉涂刷于灯丝表面，与灯丝一次性成型，大大的提高了涂白灯丝灯的稳定性，使得色漂及其光电参数处于可管控状态，生产制作工艺简单，成本较低，提高客户端使用范围，降低客户端使用成本。
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。

Claims (10)

  1.  涂白LED灯丝，包括灯丝本体（1），所述灯丝本体（1）包括呈长条带状的基板（11）、多个串联分布设于所述基板（11）上的LED芯片（12）和包覆所述LED芯片（12）的封装层（13），其特征在于：所述的涂白LED灯丝还包括涂覆于所述封装层（13）表面的涂白层（2）。
  2.  根据权利要求1所述的涂白LED灯丝，其特征在于：所述涂白层（2）由下述重量份的原料组成：10份胶水、0.1～100份涂白粉，所述胶水为硅胶、环氧树脂胶或改性环氧硅树脂，所述涂白粉为二氧化钛、二氧化硅或硫酸钡。
  3.  根据权利要求1所述的涂白LED灯丝，其特征在于：所述基板（11）为柔性FPC基板、陶瓷基板或玻纤基板中任一种。
  4.  根据权利要求1所述的涂白LED灯丝，其特征在于：所述封装层（13）为荧光胶，包覆于所述基板（11）两侧。
  5.  根据权利要求1所述的涂白LED灯丝，其特征在于：所述涂白层（2）环绕包覆所述灯丝本体（1）。
  6.  根据权利要求1所述的涂白LED灯丝，其特征在于：所述涂白层（2）厚度为1μm～5000μm。
  7.  根据权利要求1-6任一项所述的涂白LED灯丝的制作工艺，其特征在于，包括在灯丝本体（1）表面涂刷掺杂有涂白粉的胶水，以在封装层（13）表面形成涂白层（2）。
  8.  根据权利要求7所述的涂白LED灯丝的制作工艺，其特征在于：采用印刷或点胶方式在灯丝本体（1）表面涂刷形成涂白层（2）。
  9.  根据权利要求8所述的涂白LED灯丝的制作工艺，其特征在于：点胶步骤包括：
    将表层成型有荧光胶的灯丝本体（1）固定；
    将混合有涂白粉的胶水装入点胶机；
    通过点胶机先在灯丝本体（1）一侧表面涂刷混合有涂白粉的胶水，再将灯丝本体（1）翻面涂刷另一侧表面；
    涂刷完成后烘干，烘干条件为先80℃-300℃/0.1h-1.5h，再转长烤100℃-300℃/2h-8h。
  10.  一种LED灯泡，至少包括灯泡壳（3），其特征在于，所述灯泡壳（3）内安装有权利要求1-9任一项所述的涂白LED灯丝。
PCT/CN2023/094498 2022-12-06 2023-05-16 涂白led灯丝及其制作工艺和led灯泡 WO2024119714A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP23844062.2A EP4407700A1 (en) 2022-12-06 2023-05-16 White-coated led lamp filament and manufacturing process therefor, and led bulb

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202211557156.0A CN115954425A (zh) 2022-12-06 2022-12-06 涂白led灯丝及其制作工艺和led灯泡
CN202211557156.0 2022-12-06

Publications (1)

Publication Number Publication Date
WO2024119714A1 true WO2024119714A1 (zh) 2024-06-13

Family

ID=87288455

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2023/094498 WO2024119714A1 (zh) 2022-12-06 2023-05-16 涂白led灯丝及其制作工艺和led灯泡

Country Status (3)

Country Link
EP (1) EP4407700A1 (zh)
CN (1) CN115954425A (zh)
WO (1) WO2024119714A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115954425A (zh) * 2022-12-06 2023-04-11 中山市木林森电子有限公司 涂白led灯丝及其制作工艺和led灯泡

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103879099A (zh) * 2012-12-21 2014-06-25 信越化学工业株式会社 具有荧光体含有层和白色颜料含有层的热固化性硅酮树脂片材、使用该片材的发光装置的制造方法，以及封装发光半导体装置
CN109723984A (zh) * 2017-10-27 2019-05-07 通用电气照明解决方案有限责任公司 具有白色灯丝外观的led白炽灯
CN114023865A (zh) * 2021-11-09 2022-02-08 浙江英特来光电科技有限公司 一种灯丝和灯丝制造方法
WO2022035754A1 (en) * 2020-08-10 2022-02-17 Global Value Lighting Llc Methods and compositions of coatings for led light bulb filaments
CN115954425A (zh) * 2022-12-06 2023-04-11 中山市木林森电子有限公司 涂白led灯丝及其制作工艺和led灯泡

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103879099A (zh) * 2012-12-21 2014-06-25 信越化学工业株式会社 具有荧光体含有层和白色颜料含有层的热固化性硅酮树脂片材、使用该片材的发光装置的制造方法，以及封装发光半导体装置
CN109723984A (zh) * 2017-10-27 2019-05-07 通用电气照明解决方案有限责任公司 具有白色灯丝外观的led白炽灯
WO2022035754A1 (en) * 2020-08-10 2022-02-17 Global Value Lighting Llc Methods and compositions of coatings for led light bulb filaments
CN114023865A (zh) * 2021-11-09 2022-02-08 浙江英特来光电科技有限公司 一种灯丝和灯丝制造方法
CN115954425A (zh) * 2022-12-06 2023-04-11 中山市木林森电子有限公司 涂白led灯丝及其制作工艺和led灯泡

Also Published As

Publication number Publication date
EP4407700A1 (en) 2024-07-31
CN115954425A (zh) 2023-04-11

Similar Documents

Publication Publication Date Title
CN207364690U (zh) Led灯丝以及led球泡灯
WO2024119714A1 (zh) 涂白led灯丝及其制作工艺和led灯泡
US20120267661A1 (en) Light emitting device package and lighting device with the same
KR20100120011A (ko) 다층 양자점 및 그 다층 양자점을 적용한 발광소자
WO2018205694A1 (zh) 波长转换装置和激光荧光转换型光源
TW200805694A (en) Light-emitting component and manufacturing method thereof
WO2022042432A1 (zh) 一种发光二极管灯丝及应用所述发光二极管灯丝的球泡灯
JP2013501374A (ja) 誘電体コーティングを用いる高出力ｌｅｄ装置アーキテクチャおよび製造方法
CN108386738B (zh) 一种高显指柔性灯丝灯
WO2023165215A1 (zh) 一种led灯珠及背光灯条
CN219435893U (zh) 涂白led灯丝及led灯泡
CN114023865B (zh) 一种灯丝和灯丝制造方法
CN105047796B (zh) 一种全周光led光源及其制备方法
CN207967046U (zh) 一种csp封装led可变色温灯丝灯引脚连接结构
CN208919753U (zh) 发光二极管光源仙人掌灯泡
CN206364010U (zh) 一种基于倒装式封装的可调光cob光源
CN209169183U (zh) 一种led灯具
CN112993129A (zh) 一种光源封装结构及封装工艺、led灯泡
KR20100002662A (ko) 발광장치 및 발광장치 제조방법
TWM341939U (en) White light emitting diode module
CN215335830U (zh) 一种全光谱高色品质白光led封装结构
CN204512988U (zh) 一种led灯
CN210040248U (zh) 一种提高近紫外全光谱的led封装体和led灯具
CN221102085U (zh) 一种led灯丝及应用所述led灯丝的球泡灯
TWI703745B (zh) 一種ｌｅｄ燈及其增加流明的方法

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2023844062

Country of ref document: EP

Effective date: 20240328