WO2024108915A1 - 一种晶圆盒内晶圆片旋转装置 - Google Patents

一种晶圆盒内晶圆片旋转装置 Download PDF

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Publication number
WO2024108915A1
WO2024108915A1 PCT/CN2023/093366 CN2023093366W WO2024108915A1 WO 2024108915 A1 WO2024108915 A1 WO 2024108915A1 CN 2023093366 W CN2023093366 W CN 2023093366W WO 2024108915 A1 WO2024108915 A1 WO 2024108915A1
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WO
WIPO (PCT)
Prior art keywords
wafer
mounting plate
rotation axis
rotating device
support mounting
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Application number
PCT/CN2023/093366
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English (en)
French (fr)
Inventor
童建
李涛
郭亚飞
Original Assignee
江苏亚电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 江苏亚电科技有限公司 filed Critical 江苏亚电科技有限公司
Priority to CN202380017632.6A priority Critical patent/CN118541787A/zh
Publication of WO2024108915A1 publication Critical patent/WO2024108915A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present application belongs to the technical field of wafer production equipment, and in particular, relates to a wafer rotating device in a wafer box.
  • CN214753665U discloses a carrier swing mechanism and processing equipment, wherein the carrier swing mechanism includes: a swing platform, a swing shaft is provided at the bottom of the swing platform; a power component; a transmission component, and the two ends of the transmission component are respectively connected to the power component and the swing platform, and the power component is used to drive the swing platform to swing around the swing shaft through the transmission component.
  • the power component can drive the swing platform to swing through the transmission component, that is, the swing platform can swing relative to the processing tank, and the parts to be processed placed on the swing platform can be reciprocated according to the requirements.
  • the tilt angle changes, so that the parts to be processed can be tilted in the processing tank in a preset direction, thereby achieving the purpose of dynamic cleaning.
  • due to the obstruction of the wafer box to the water flow and air flow if the position of the wafer in the wafer box remains unchanged, then there will inevitably be a certain dead zone, resulting in a low cleaning effect.
  • the technical problem to be solved by the present invention is: to solve the deficiencies in the prior art, thereby providing a wafer rotating device in a wafer box which can change the position of the wafer in the wafer box.
  • a wafer rotating device in a wafer box comprising:
  • the support and installation assembly comprises a first support and installation plate, a second support and installation plate and a third support and installation plate which are sequentially connected and arranged in a Z shape, wherein the first support and installation plate is arranged horizontally, and the third support and installation plate is a wafer accommodating box limit block;
  • a rotation drive component is provided on the first rotation axis, the second rotation axis and the third rotation axis respectively on the first support mounting plate, the second support mounting plate and the third support mounting plate.
  • the first rotation axis and the second rotation axis, and the second rotation axis and the third rotation axis are connected by a transmission member.
  • a contact layer is provided on the surface of the third rotation axis, and the contact layer is used to contact with the bottom of the wafer, so that the wafer is driven to rotate when the third rotation axis rotates.
  • the wafer rotating device in a wafer box of the present invention comprises: the transmission member is a right-angle gear transmission pair.
  • the third rotation axis and the fourth rotation axis are both located on the top surface of the third supporting mounting plate.
  • the fourth rotating shafts are two parallel ones, and the second spur gears on the two fourth rotating shafts are meshed with the first spur gears to realize common rotation.
  • the outer contour of the contact layer is in the shape of a cam or an ellipse.
  • the outer contour of the contact layer on the fourth rotating axis is in the shape of a cam or an ellipse.
  • the long axes of the outer contours of the contact layers on the two fourth rotating axes are perpendicular to each other, or form a certain angle.
  • the material of the contact layer is PTFE material.
  • the third supporting mounting plate is arranged horizontally or inclined.
  • the fourth rotating shaft when the fourth rotating shaft rotates, it can swing along its axial direction.
  • the wafer rotating device in the wafer box of the present invention transmits power from one end of the first supporting mounting plate to the third supporting mounting plate through the first rotating shaft, the second rotating shaft, the third rotating shaft and the fourth rotating shaft which are mutually transmission-connected, thereby realizing the rotation of the wafer in the wafer accommodating box, that is, the wafer in the wafer accommodating box can be rotated during cleaning or drying, so that the position of the wafer in the wafer accommodating box is changed, and the wafer surface is changed relative to the wafer accommodating box by rotating the wafer surface.
  • the part blocked by the bottom of the wafer accommodating box is rotated upward after the wafer is rotated so as to be unobstructed, thereby improving the cleaning or drying effect.
  • FIG1 is a schematic diagram of the structure of a wafer rotating device in a wafer box according to an embodiment of the present application when the wafer rotating device is placed in a slot;
  • FIG2 is a schematic structural diagram of a wafer rotating device in a wafer box according to an embodiment of the present application
  • FIG3 is a schematic diagram of the structure of FIG2 in which the wafer containing box is hidden;
  • FIG4 is a schematic diagram of the lifting and lowering of the wafer rotating device in the wafer box
  • FIG. 5 is a top view of the wafer rotating device in the wafer box in FIG. 1 .
  • FIG6 is a perspective view of the wafer rotating device in the wafer box in FIG1 from another direction;
  • the terms “installed”, “connected”, and “connected” should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components.
  • installed should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components.
  • This embodiment provides a wafer rotating device in a wafer box, as shown in FIG1 , comprising:
  • the support and installation assembly 1 comprises a first support and installation plate 11, a second support and installation plate 12 and a third support and installation plate 13 which are sequentially connected and arranged in a Z shape, wherein the first support and installation plate 11 is arranged horizontally, the third support and installation plate 13 is a wafer accommodating box limit block and is used to limit the placement of the wafer accommodating box 9, and the first support and installation plate 11, the second support and installation plate 12 and the third support and installation plate 13 arranged in a Z shape facilitate the third support and installation plate 13 to enter and exit the slot body 8;
  • the rotation driving assembly 2 comprises a first rotation axis 21, a second rotation axis 22 and a third rotation axis 23 respectively arranged on the first support mounting plate 11, the second support mounting plate 12 and the third support mounting plate 13.
  • the first rotation axis 21 and the second rotation axis 22, and the second rotation axis 22 and the third rotation axis 23 are connected via transmission members.
  • the third rotation axis 23 is transmission-connected to a fourth rotation axis 24 arranged on the third support mounting plate 13. The surface of the fourth rotation axis 24 contacts the bottom of the wafer, and the wafer is driven to rotate together when the fourth rotation axis 24 rotates.
  • the wafer rotating device in the wafer box of this embodiment transmits power from one end of the first supporting mounting plate 11 to the third supporting mounting plate 13 through the first rotating shaft 21, the second rotating shaft 22, the third rotating shaft 23 and the fourth rotating shaft 24 which are mutually transmission-connected, thereby realizing the rotation of the wafer in the wafer containing box 9. That is, the wafer in the wafer containing box 9 can be rotated during cleaning or drying, so that the position of the wafer in the wafer containing box 9 is changed. By rotating the wafer surface, the wafer surface changes relative to the wafer containing box 9. For example, the part blocked by the bottom of the wafer containing box 9 is rotated to the top after the wafer is rotated so as to be unobstructed, thereby improving the cleaning or drying effect.
  • the first rotating shaft 21 is connected to a motor, which is omitted in the figure and can be arranged in a conventional manner.
  • the third rotating shaft 23 and the fourth rotating shaft 24 are both located on the top surface of the third supporting mounting plate 13.
  • the third rotating shaft 23 and the fourth rotating shaft 24 are respectively located on the bottom surface and the top surface of the third supporting mounting plate 13, and a through hole is opened on the third supporting mounting plate 13 for the first spur gear 28 on the third rotating shaft 23 to pass through so as to mesh with the second spur gear 27 on the fourth rotating shaft 24.
  • the transmission member is a right-angle gear transmission pair, that is, right-angle gears are set at the transmission connection positions of the first rotating shaft 21, the second rotating shaft 22 and the third rotating shaft 23, and a 90° transmission effect is achieved through the meshing right-angle gears.
  • the fourth rotation axes 24 are two parallel axes so as to make two-point contact with the bottom of the wafer.
  • the outer contour of the contact layer 241 is in the shape of an ellipse (or a cam) so that the wafer has a certain degree of ups and downs when it rotates, but the difference between the major axis and the minor axis of the ellipse should not be too large. Since the thickness of the wafer is related to the friction resistance of the wafer holding box, it is necessary to ensure that the wafer is not damaged when it rises and falls.
  • the long axes of the outer contours of the contact layers 241 on the two fourth rotation axes 24 are perpendicular to each other, or form a certain angle, as long as they are not parallel.
  • the long axis here refers to the long axis of the ellipse.
  • the material of the contact layer 241 on the upper surface of the fourth rotating shaft 24 is preferably PTFE.
  • all components in the supporting and mounting assembly 1 and the rotating driving assembly 2 are made of plastic to prevent corrosion by certain cleaning fluids that are corrosive to metals.
  • a plurality of positioning blocks are arranged on the third support and installation plate 13 to position two wafer accommodating boxes 9 arranged in parallel.
  • the third support mounting plate 13 can be arranged horizontally or inclined. In this case, the connecting gears of the second support mounting plate 12 and the third support mounting plate 13 need to be adjusted accordingly according to the inclination angle.
  • first rotating shaft 21, the second rotating shaft 22, the third rotating shaft 23 and the fourth rotating shaft 24 are all mounted on the first supporting mounting plate 11, the second supporting mounting plate 12 and the third supporting mounting plate 13 through a series of bearings.
  • the first right-angle gear transmission pair 25 and the second right-angle gear transmission pair 26 are used for transmission between the first rotating shaft 21 and the second rotating shaft 22, and between the second rotating shaft 22 and the third rotating shaft 23, respectively.
  • the fourth rotating shaft 24 when it rotates, it can swing along its axial direction (move back and forth within a certain range). Since it is a spur gear transmission method, the swing within the width of the spur gear will not affect the transmission effect, and the swing range cannot exceed the width of the accommodation position of a single wafer in the wafer accommodation box 9.
  • There are many ways to achieve axial swing one of which is to add an elastic member at one end of the fourth rotating shaft 24 to achieve an axial movement effect. In this way, the wafer can also have an additional movement effect in the axial direction of the fourth rotating shaft 24.
  • One end of the supporting mounting assembly 1 is connected to the swing mechanism, which can also achieve the swing effect of the wafer.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

本申请涉及一种晶圆盒内晶圆片旋转装置，通过相互传动连接的第一旋转轴、第二旋转轴、第三旋转轴和第四旋转轴将动力从第一支撑安装板上的一端传递到第三支撑安装板上，从而实现了晶圆在晶圆容纳盒内的转动，也即，晶圆容纳盒内的晶圆可以在清洗时或者干燥时发生转动，使晶圆在晶圆容纳盒内的位置发生改变，通过晶圆面发生转动，晶圆面相对于晶圆容纳盒发生改变，比如被晶圆容纳盒底部阻挡的部分在晶圆旋转后被转动到上方以不受阻碍，从而提高清洗或者干燥效果。

Description

一种晶圆盒内晶圆片旋转装置 技术领域
本申请属于晶圆生产设备技术领域，尤其是涉及一种晶圆盒内晶圆片旋转装置。
 背景技术
晶圆的清洗干燥分为无篮处理和有篮处理，有篮处理即是将晶圆置于晶圆容纳盒中，之后由相关组件将晶圆容纳盒连通晶圆一起送入槽体内以完成清洗或者干燥处理，CN214753665U公开了一种载体摆动机构和处理设备，其中载体摆动机构包括：摆动平台，摆动平台的底部设有摆动轴；动力组件；传动组件，传动组件的两端分别连接动力组件和摆动平台，动力组件用于通过传动组件带动摆动平台绕摆动轴摆动。本发明的技术方案中，动力组件能够通过传动组件驱动摆动平台摆动，即摆动平台能够相对处理槽进行摆动，放置在摆动平台上的待处理件可以按要求做往复的倾斜角度变化，使待处理件在处理槽内能够按预设方向倾斜，从而达到动态清洗的目的。然而，受到晶圆盒对水流和气流的阻碍作用，如果晶圆在晶圆盒内的位置保持不变，那么必然也会存在这一定的死区，导致清洗效果不高。
 技术问题
本发明要解决的技术问题是：为解决现有技术中的不足，从而提供一种能够改变晶圆片在晶圆盒内位置的晶圆盒内晶圆片旋转装置。
 技术解决方案
本发明解决其技术问题所采用的技术方案是：
一种晶圆盒内晶圆片旋转装置，包括：
支撑安装组件，包括成Z形布置的依次连接的第一支撑安装板、第二支撑安装板和第三支撑安装板，其中第一支撑安装板水平布置，第三支撑安装板晶圆容纳盒限位块；
旋转驱动组件，分别设置在第一支撑安装板、第二支撑安装板和第三支撑安装板上的第一旋转轴、第二旋转轴和第三旋转轴，第一旋转轴与第二旋转轴之间、第二旋转轴与第三旋转轴之间通过传动件连接，所述第三旋转轴表面设置有接触层，接触层用于与晶圆底部接触，在所述第三旋转轴旋转时带动晶圆一同旋转。
优选地，本发明的晶圆盒内晶圆片旋转装置，包括：所述传动件为直角齿轮传动副。
优选地，本发明的晶圆盒内晶圆片旋转装置，所述第三旋转轴和第四旋转轴均位于第三支撑安装板的顶面。
优选地，本发明的晶圆盒内晶圆片旋转装置，第四旋转轴为平行的两根，两个所述第四旋转轴上的第二直齿轮与第一直齿轮共同啮合以实现共同转动。
优选地，本发明的晶圆盒内晶圆片旋转装置，接触层的外轮廓的形状为凸轮或者椭圆形。
优选地，本发明的晶圆盒内晶圆片旋转装置，所述第四旋转轴上的接触层的外轮廓的形状为凸轮或者椭圆形。
优选地，本发明的晶圆盒内晶圆片旋转装置，两个第四旋转轴上的接触层的外轮廓的长轴相互垂直，或者形成一定的夹角。
优选地，本发明的晶圆盒内晶圆片旋转装置，接触层的材料为PTFE材料。
优选地，本发明的晶圆盒内晶圆片旋转装置，第三支撑安装板为水平布置或者倾斜布置。
优选地，本发明的晶圆盒内晶圆片旋转装置，第四旋转轴旋转时，能够沿其轴向摆动。
 有益效果
本发明的有益效果是：本发明的晶圆盒内晶圆片旋转装置，通过相互传动连接的第一旋转轴、第二旋转轴、第三旋转轴和第四旋转轴将动力从第一支撑安装板上的一端传递到第三支撑安装板上，从而实现了晶圆在晶圆容纳盒内的转动，也即，晶圆容纳盒内的晶圆可以在清洗时或者干燥时发生转动，使晶圆在晶圆容纳盒内的位置发生改变，通过晶圆面发生转动，晶圆面相对于晶圆容纳盒发生改变，比如被晶圆容纳盒底部阻挡的部分在晶圆旋转后被转动到上方以不受阻碍，从而提高清洗或者干燥效果。
 附图说明
下面结合附图和实施例对本申请的技术方案进一步说明。
图1是本申请实施例的晶圆盒内晶圆片旋转装置置入槽内时的结构示意图；
图2是本申请实施例的晶圆盒内晶圆片旋转装置的结构示意图；
图3是图2中隐藏了晶圆容纳盒的结构示意图；
图4是晶圆盒内晶圆片旋转装置升降的示意图；
图5是图1中晶圆盒内晶圆片旋转装置的俯视图。
图6是图1中晶圆盒内晶圆片旋转装置另一个方向的立体图；
图中的附图标记为：
1　支撑安装组件；
2　旋转驱动组件；
8　槽体；
9　晶圆容纳盒；
11　第一支撑安装板；
12　第二支撑安装板；
13　第三支撑安装板；
21　第一旋转轴；
22　第二旋转轴；
23　第三旋转轴；
24　第四旋转轴；
25　第一直角齿轮传动副；
26　第二直角齿轮传动副；
27　第二直齿轮；
28  第一直齿轮；
241　接触层。
 本发明的最佳实施方式
需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互组合。
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请保护范围的限制。此外，术语“第一”、“第二”等仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”等的特征可以明示或者隐含地包括一个或者更多个该特征。在本发明创造的描述中，除非另有说明，“多个”的含义是两个或两个以上。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以通过具体情况理解上述术语在本申请中的具体含义。
下面将参考附图并结合实施例来详细说明本申请的技术方案。
实施例
本实施例提供一种晶圆盒内晶圆片旋转装置，如图1所示，包括：
支撑安装组件1，包括成Z形布置的依次连接的第一支撑安装板11、第二支撑安装板12和第三支撑安装板13，其中第一支撑安装板11水平布置，第三支撑安装板13晶圆容纳盒限位块并用于限制放置晶圆容纳盒9，Z形布置的第一支撑安装板11、第二支撑安装板12和第三支撑安装板13方便第三支撑安装板13进出槽体8；
旋转驱动组件2，分别设置在第一支撑安装板11、第二支撑安装板12和第三支撑安装板13上的第一旋转轴21、第二旋转轴22和第三旋转轴23，第一旋转轴21与第二旋转轴22之间、第二旋转轴22与第三旋转轴23之间通过传动件连接，所述第三旋转轴23与设置在第三支撑安装板13上的第四旋转轴24传动连接，第四旋转轴24的表面与晶圆底部接触，在所述第四旋转轴24旋转时带动晶圆一同旋转。
本实施例的晶圆盒内晶圆片旋转装置，通过相互传动连接的第一旋转轴21、第二旋转轴22、第三旋转轴23和第四旋转轴24将动力从第一支撑安装板11上的一端传递到第三支撑安装板13上，从而实现了晶圆在晶圆容纳盒9内的转动，也即，晶圆容纳盒9内的晶圆可以在清洗时或者干燥时发生转动，使晶圆在晶圆容纳盒9内的位置发生改变，通过晶圆面发生转动，晶圆面相对于晶圆容纳盒9发生改变，比如被晶圆容纳盒9底部阻挡的部分在晶圆旋转后被转动到上方以不受阻碍，从而提高清洗或者干燥效果。
第一旋转轴21与电机连接，电机在图上被省略了，按照通常的布置即可。
进一步地，第三旋转轴23和第四旋转轴24均位于第三支撑安装板13的顶面。作为替代的实施方式，第三旋转轴23和第四旋转轴24分别位于第三支撑安装板13的底面和顶面，第三支撑安装板13上开设有通孔，以供第三旋转轴23上的第一直齿轮28穿过以与第四旋转轴24上的第二直齿轮27啮合。
进一步地，传动件为直角齿轮传动副，也即第一旋转轴21、第二旋转轴22和第三旋转轴23的传动连接位置设置直角齿轮，通过啮合的直角齿轮以实现90°角的传动效果。
进一步地，第四旋转轴24为平行的两根，以对晶圆底部进行两点接触。
进一步地，两个所述第四旋转轴24上的第二直齿轮27与第一直齿轮28共同啮合以实现共同转动。
进一步地，接触层241的外轮廓的形状为椭圆形（或者凸轮），以使得晶圆在转动时具有一定的起伏，但是椭圆的长轴和短轴之间的差值不宜过大，因晶圆的厚度和晶圆容纳盒的摩擦阻力有关，需要保证晶圆在起伏时不发生损坏即可。
进一步地，两个第四旋转轴24上的接触层241的外轮廓的长轴相互垂直，或者形成一定的夹角，只要不平行即可。这里的长轴是指椭圆额长轴，两个长轴不共线的椭圆在共同转动时，能够使晶圆的两侧的升降高度不同，从而加强抖动效果。
第四旋转轴24上表面具有的接触层241的材料优选为PTFE，当然，支撑安装组件1、旋转驱动组件2中的所有部件均为塑料材质，以防止某些对金属具有腐蚀作用的清洗液的腐蚀。
如图4所示，由其他部件带动支撑安装组件1升降而实现晶圆容纳盒9进出干燥槽或者清洗槽。如图3所示，第三支撑安装板13上设置的若干定位块以定位两个并列设置的晶圆容纳盒9。
进一步地，第三支撑安装板13可以是水平布置也可以是倾斜布置，此时，第二支撑安装板12和第三支撑安装板13的连接齿轮需要根据倾斜角度做出对应的调整。
需要说明的是，第一旋转轴21、第二旋转轴22、第三旋转轴23和第四旋转轴24均通过一系列的轴承安装在第一支撑安装板11、第二支撑安装板12和第三支撑安装板13上。第一直角齿轮传动副25和第二直角齿轮传动副26分别用于第一旋转轴21与第二旋转轴22之间、第二旋转轴22与第三旋转轴23之间的传动。
作为一种可选的实施方式，第四旋转轴24旋转时，能够沿其轴向摆动（在一定范围内来回运动），由于是直齿轮的传动方式，在直齿轮宽度范围内的摆动不会影响传动效果，且摆动范围不能超过晶圆容纳盒9内单个晶圆片的容纳位宽度。具体实现轴向摆动的方式有多种，其中一种为在第四旋转轴24一端增加弹性件以实现轴向运动效果。这样能够使得晶圆在第四旋转轴24轴向上也增加一个运动效果。
支撑安装组件1的一端连接到摆动机构上，也可以实现晶圆的摆动效果。
以上述依据本申请的理想实施例为启示，通过上述的说明内容，相关工作人员完全可以在不偏离本项申请技术思想的范围内，进行多样的变更以及修改。本项申请的技术性范围并不局限于说明书上的内容，必须要根据权利要求范围来确定其技术性范围。

Claims (10)

  1.  一种晶圆盒内晶圆片旋转装置，其特征在于，包括：
    支撑安装组件（1），包括成Z形布置的依次连接的第一支撑安装板（11）、第二支撑安装板（12）和第三支撑安装板（13），其中第一支撑安装板（11）水平布置，第三支撑安装板（13）上设置有晶圆容纳盒限位块；
    旋转驱动组件（2），分别设置在第一支撑安装板（11）、第二支撑安装板（12）和第三支撑安装板（13）上的第一旋转轴（21）、第二旋转轴（22）和第三旋转轴（23），第一旋转轴（21）与第二旋转轴（22）之间、第二旋转轴（22）与第三旋转轴（23）之间通过传动件连接，所述第三旋转轴（23）表面设置有接触层（241），接触层（241）用于与晶圆底部接触，在所述第三旋转轴（23）旋转时带动晶圆一同旋转。
  2. 根据权利要求1所述的晶圆盒内晶圆片旋转装置，其特征在于，包括：所述传动件为直角齿轮传动副。
  3. 根据权利要求1所述的晶圆盒内晶圆片旋转装置，其特征在于，所述第三旋转轴（23）和第四旋转轴（24）均位于第三支撑安装板（13）的顶面。
  4. 根据权利要求3所述的晶圆盒内晶圆片旋转装置，其特征在于，第四旋转轴（24）为平行的两根，两个所述第四旋转轴（24）上的第二直齿轮（27）与第一直齿轮（28）共同啮合以实现共同转动。
  5. 根据权利要求3或4所述的晶圆盒内晶圆片旋转装置，其特征在于，接触层（241）的外轮廓的形状为凸轮或者椭圆形。
  6. 根据权利要求5所述的晶圆盒内晶圆片旋转装置，其特征在于，所述第四旋转轴（24）上的接触层（241）的外轮廓的形状为凸轮或者椭圆形。
  7. 根据权利要求6所述的晶圆盒内晶圆片旋转装置，其特征在于，两个第四旋转轴（24）上的接触层（241）的外轮廓的长轴相互垂直，或者形成一定的夹角。
  8. 根据权利要求6所述的晶圆盒内晶圆片旋转装置，其特征在于，接触层（241）的材料为PTFE材料。
  9. 根据权利要求1所述的晶圆盒内晶圆片旋转装置，其特征在于，第三支撑安装板（13）为水平布置或者倾斜布置。
  10. 根据权利要求1所述的晶圆盒内晶圆片旋转装置，其特征在于，第四旋转轴（24）旋转时，能够沿其轴向摆动。
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