WO2024103439A1 - 一种用于植入物表面改性的照射装置 - Google Patents

一种用于植入物表面改性的照射装置 Download PDF

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Publication number
WO2024103439A1
WO2024103439A1 PCT/CN2022/134824 CN2022134824W WO2024103439A1 WO 2024103439 A1 WO2024103439 A1 WO 2024103439A1 CN 2022134824 W CN2022134824 W CN 2022134824W WO 2024103439 A1 WO2024103439 A1 WO 2024103439A1
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implant
excimer lamp
section
voltage electrode
lamp tube
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PCT/CN2022/134824
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English (en)
French (fr)
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黄天赐
葛浩
李立胜
黄金帧
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广明源光科技股份有限公司
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Publication of WO2024103439A1 publication Critical patent/WO2024103439A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
    • B01J19/12—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electromagnetic waves
    • B01J19/122—Incoherent waves
    • B01J19/123—Ultraviolet light

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  • the present invention relates to the technical field of implant surface modification, and more particularly to an irradiation device for implant surface modification.
  • the surface modification treatment method using 172nmUV light is to place the implant to be modified and the light source at a predetermined distance and irradiate the structure of the implant. Therefore, in order to make the entire surface of the implant evenly irradiated with light, the usual method is to perform the treatment while maintaining the predetermined distance between the implant and the light source and rotating the implant. Using this method, the treatment time required for the surface modification of the implant takes about 20 to 30 minutes, and the traditional modification irradiation device has a complex structure, and is very inconvenient to assemble, use and store. Therefore, how to make the modification lamp small, portable, easy to assemble, store and use is one of the technical problems to be solved in this application. It is also necessary to propose an irradiation device for implant surface modification, which improves the efficiency of implant surface modification on the basis of convenient storage and disassembly of the modification lamp.
  • the present invention provides a modified lamp, comprising: at least one excimer lamp tube and an electrode assembly; the excimer lamp tube is arranged on the electrode assembly, the implant is located within the irradiation range of the excimer lamp tube, and the electrode assembly is electrically connected to an external power supply.
  • the electrode assembly includes a low-voltage electrode and a high-voltage electrode, the high-voltage electrode is arranged at the upper end of the excimer lamp tube, the low-voltage electrode is arranged at the lower end of the excimer lamp tube, and the high-voltage electrode and the low-voltage electrode are both electrically connected to an external power supply.
  • the low-voltage electrode is connected to the base through an insulating block, at least three excimer lamp tubes are provided, the multiple excimer lamp tubes are arranged parallel to each other, and the multiple excimer lamp tubes are arranged in a surrounding manner, and the middle space surrounded by the excimer lamp tubes is the irradiation working area.
  • the high-voltage electrode is arranged in the excimer lamp tube, and the lead-out portion of the high-voltage electrode is led out from the upper end of the excimer lamp tube.
  • a protective cap is arranged at the upper end of the excimer lamp tube, and the lead-out portion of the high-voltage electrode is led out from the wire outlet hole of the protective cap.
  • the present invention provides an irradiation device for surface modification of implants, comprising: the modification lamp, a sealed can and a vacuum pumping device, wherein the modification lamp is arranged in the sealed can, the vacuum pumping device is used to maintain a vacuum state in the sealed can, and the implant is located in the sealed can and within the irradiation range of the excimer lamp tube.
  • the sealed can includes the base, the outer shell and the upper cover; the base and the upper cover are respectively located at the two ends of the outer shell, and the upper cover is provided with a line lead-out hole, and the line of the high-voltage electrode is led out through the line lead-out hole, and the vacuum pumping equipment is used to vacuum the inside of the sealed can.
  • a placement hole is provided on the base, and the placement hole passes through the base, the insulating block and the low-voltage electrode.
  • a sealing bracket is provided in the placement hole, the implant is located at the top of the sealing bracket, a storage platform is provided on the top of the sealing bracket, the implant is placed on the storage platform, a blocking portion is provided on the side wall of the sealing bracket, the shape of the blocking portion is adapted to the shape of the placement hole, a lifting device is provided at the bottom of the sealing bracket, the lifting device is used to control the sealing bracket to insert the implant from the placement hole into the irradiation range of the excimer lamp for irradiation.
  • the line lead-out hole is provided with a sealing plug
  • the sealing plug includes a pressing sleeve and a bidirectional sleeve
  • the pressing sleeve and the bidirectional sleeve are both elastic parts
  • the pressing sleeve and the bidirectional sleeve are both sleeved on the line of the electrode assembly, the pressing sleeve is located on the inner side of the upper cover, and the bidirectional sleeve passes through the line lead-out hole.
  • the bidirectional sleeve includes an outer sealing section, a transition section, an inner sealing section and a folding section, the outer sealing section is connected to one end of the inner sealing section through the transition section, the other end of the inner sealing section is connected to the end of the folding section, the outer sealing section is located at the outer opening of the line lead-out hole, the inner sealing section is located at the inner opening of the line lead-out hole, the transition section is located in the line lead-out hole, the pressing sleeve includes an insertion section and a forming section, the insertion section is plugged into the transition section, and the shape of the forming section is adapted to the inner sealing section and the folding section.
  • the storage table includes a transparent platform and a reflective cone barrel
  • the bottom of the reflective cone barrel is connected to the top of the sealing bracket
  • the transparent platform is arranged on the top surface of the reflective cone barrel
  • the implant is placed on the transparent platform
  • the inner wall of the reflective cone barrel is a total reflection mirror surface
  • the inner wall of the reflective cone barrel is provided with several layers of reflective platforms
  • the bottom of the reflective cone barrel is provided with a convex lens
  • the bottom surface of the convex lens is a total reflection mirror surface.
  • the present invention has at least the following beneficial effects:
  • the excimer lamp is one (or multiple) tubes in a ring shape, and the (surrounded) irradiation area is the working area.
  • the implant is placed in the working area for irradiation modification.
  • the electrode assemblies are at both ends of the excimer lamp, and are used to bombard the rare gas in the excimer lamp with high pressure and high frequency, thereby obtaining ultraviolet light of a specific wavelength (for example, ultraviolet light of 172nm wavelength that can be used for light modification), and then the implant (which can be a small implant such as a denture or bone, or a medium or large implant) is modified and irradiated.
  • the above-mentioned structural design can obtain a simple modification lamp for surface modification of implants, which has a simple structure, is compact and easy to use, and is easy to store, assemble and disassemble.
  • FIG1 is a schematic structural diagram of an irradiation device for implant surface modification according to the present invention.
  • FIG. 2 is a cross-sectional view of an irradiation device for implant surface modification according to the present invention.
  • FIG. 3 a is a cross-sectional view of an irradiation device for implant surface modification according to the present invention.
  • FIG. 3 b is a cross-sectional view of a sealing bracket in the irradiation device for implant surface modification according to the present invention.
  • FIG. 4 is an exploded view of a sealing plug in the irradiation device for implant surface modification according to the present invention.
  • FIG. 5 is a schematic diagram of the application of a sealing plug in the irradiation device for implant surface modification according to the present invention.
  • FIG. 6 is an exploded view of the placement table in the irradiation device for implant surface modification according to the present invention.
  • FIG. 7 is a schematic structural diagram of the bottom of the platform in the irradiation device for implant surface modification according to the present invention.
  • FIG8 is a schematic diagram of light reflected by a mounting table in the irradiation device for implant surface modification according to the present invention.
  • 9-11 are top, inside and bottom views of a first embodiment of an irradiation device for implant surface modification using a modification lamp according to the present invention.
  • 12a and 12b are schematic diagrams of an excimer lamp tube (with a high-voltage electrode inside) of a second embodiment of the modified lamp.
  • FIG. 12 c is a physical picture of the excimer lamp tube (with a high voltage electrode inside) of the second embodiment of the modified lamp.
  • 13-14 are actual pictures of the excimer lamp tube (with a high voltage electrode inside) of the second embodiment of the modified lamp without a protective cap and with a protective cap.
  • the present invention provides a modified lamp, comprising: at least one excimer lamp tube 1 and an electrode assembly; the excimer lamp tube 1 is arranged on the electrode assembly, the implant 3 is located within the irradiation range of the excimer lamp tube 1, and the electrode assembly is electrically connected to an external power supply.
  • the excimer lamp tube 1 is one (or formed by multiple tubes in a ring shape), the (surrounded) irradiation area is the working area, the implant 3 is placed in the working area for irradiation modification, and the electrode assemblies are at both ends of the excimer lamp tube 1, which are used to bombard the rare gas in the excimer lamp tube 1 with high pressure and high frequency, so as to obtain ultraviolet light of a specific wavelength (for example, ultraviolet light of 172nm wavelength that can be used for light modification), and then the implant 3 (which can be a small implant such as a denture or bone, or a medium or large implant) is modified and irradiated.
  • the above structural design can obtain a simple modification lamp for surface modification of implants, which has a simple structure, is compact and easy to use, and is easy to store, assemble and disassemble.
  • the electrode assembly includes a low-voltage electrode 5 and a high-voltage electrode 6, wherein the high-voltage electrode 6 is arranged at the upper end of the excimer lamp tube 1, and the low-voltage electrode 5 is arranged at the lower end of the excimer lamp tube 1, and the high-voltage electrode 6 and the low-voltage electrode 5 are both electrically connected to an external power supply.
  • the low-voltage electrode 5 is connected to the base 21 through an insulating block 7, and the surface of the high-voltage electrode 6 is wrapped with an insulating material to prevent the high voltage from generating creepage with the outside world or with the implant 3.
  • At least three excimer lamp tubes 1 are arranged, and the multiple excimer lamp tubes 1 are arranged in parallel with each other, and the multiple excimer lamp tubes 1 are arranged in a surrounding manner, and the middle space surrounded by the excimer lamp tubes 1 is an irradiation working area.
  • the implant 3 when performing surface modification of the implant 3, the implant 3 is placed into the working area from the placement hole, and the implant 3 should be located between the low-voltage electrode 5 and the high-voltage electrode 6, so as to ensure the irradiation area of the implant 3, the electrode assembly is turned on, and the low-voltage electrode 5 and the high-voltage electrode 6 bombard the rare gas in the excimer lamp 1 with high frequency and high pressure, thereby generating ultraviolet light, and the ultraviolet light is irradiated on the implant 3 to modify it, and after 1-2 minutes (the time required for different implants 3 can be adjusted according to actual conditions, for example, teeth can generally be completed in 10 seconds), the electrode assembly is turned off, and the modification of the implant 3 is completed.
  • At least three excimer lamps 1 are arranged in a surrounding manner to obtain surrounding modified light irradiation of the implant 3, thereby ensuring the uniformity of the light irradiation of the implant 3 and the consistency of the light intensity, thereby avoiding repeated rotation of the implant 3 or irradiation of the modified lamp on it.
  • the high-voltage electrode 6 is fixed in the excimer lamp tube 1 by a fixing part, and the lead-out portion of the high-voltage electrode 6 is led out from the upper end of the excimer lamp tube 1.
  • a protective cap is provided at the upper end of the excimer lamp tube 1, and the lead-out portion of the high-voltage electrode 6 is led out from the wire outlet hole of the protective cap.
  • the fixing part is spring-shaped, used to fix the electrode and used as an electrode lead-out wire
  • the high-voltage electrode 6 is arranged in the excimer lamp tube 1, and the line is led out from the upper end
  • a protective cap is arranged at the upper end of the excimer lamp tube 1 to connect the high-voltage electrode 6 in series
  • glue is filled in the protective cap to prevent creepage.
  • the present invention provides an irradiation device for surface modification of implants, comprising: a modification lamp, a sealed tank 2 and a vacuum pumping device, wherein the modification lamp is arranged in the sealed tank 2, and the vacuum pumping device is used to maintain a vacuum state in the sealed tank 2, and the implant 3 is located in the sealed tank 2 and within the irradiation range of the excimer lamp tube 1.
  • the sealed tank 2 comprises a base 21, a shell 22 and an upper cover 23; the shell 22 is tubular, and the base 21 and the upper cover 23 are respectively located at the two ends of the shell 22, and a hole is opened at the upper end of the upper cover 23, and the opening is connected to the upper cover 23 with an insulating material (insulating glue, ceramic), and a line lead-out hole is arranged on the insulating material, so as to ensure that the high voltage does not creep with the upper cover 23.
  • the line of the high-voltage electrode 6 is led out through the line lead-out hole, and is sealed with the line lead-out hole through a sealing plug 4, and the vacuum pumping device is used to evacuate the inside of the sealed tank 2.
  • a placement hole is provided on the base 21, and the placement hole passes through the base 21, the insulating block 7 and the low-voltage electrode 5.
  • a sealing bracket 8 is provided in the placement hole, and the implant 3 is located at the top of the sealing bracket 8.
  • a placement table 9 is provided on the top of the sealing bracket 8, and the implant 3 is placed on the placement table 9.
  • a blocking portion 81 is provided on the side wall of the sealing bracket 8, and the shape of the blocking portion 81 is adapted to the shape of the placement hole.
  • a lifting device 82 is provided at the bottom of the sealing bracket 8, and the lifting device 82 is used to control the sealing bracket 8 to insert the implant 3 from the placement hole into the irradiation range of the excimer lamp tube 1 for irradiation.
  • the vacuum pumping device can keep the sealed tank 2 in a vacuum state, thereby improving the modification efficiency of the implant 3, and then modifying and irradiating the implant 3 (which can be a denture or bone, etc.) in a vacuum environment, and the sealed tank 2 can be equipped according to the size of the implant 3, so that the surface modification device is more compact and portable.
  • the sealed tank 2 can also prevent the modification light from leaking out, enhance the irradiation effect, and protect the operator from being irradiated by the modification light.
  • the sealing plug 4 includes a pressing sleeve 41 and a bidirectional sleeve 42, both of which are elastic parts. Both of the pressing sleeve 41 and the bidirectional sleeve 42 are sleeved on the line of the electrode assembly, the pressing sleeve 41 is located on the inner side of the upper cover 23, and the bidirectional sleeve 42 passes through the line lead-out hole.
  • the bidirectional sleeve 42 includes an outer sealing section 421, a transition section 422, an inner sealing section 423 and a folding section 424.
  • the outer sealing section 421 is connected to one end of the inner sealing section 423 through the transition section 422, and the other end of the inner sealing section 423 is connected to the end of the folding section 424.
  • the outer sealing section 421 is located at the outer opening of the line lead-out hole
  • the inner sealing section 423 is located at the inner opening of the line lead-out hole
  • the transition section 422 is located in the line lead-out hole.
  • the pressing sleeve 41 includes an insertion section 411 and a forming section 412.
  • the insertion section 411 is plugged into the transition section 422, and the shape of the forming section 412 is adapted to the inner sealing section 423 and the folding section 424.
  • the sealing plug 4 at the line lead-out hole usually adopts an I-shaped sealing plug to achieve a two-way clamping sealing effect, but the I-shaped sealing plug is inconvenient to install, and the line and the inner wall of the I-shaped sealing plug can slide relative to each other, which can easily cause air leakage. At the same time, the line can easily fall off from the high-voltage electrode 6 and the low-voltage electrode 5 during pulling, so it is necessary to use the sealing plug 4 in the present application to achieve the effects of fixing, anti-slip and two-way sealing.
  • the insertion section 411 and the transition section 422 are firmly connected and have a sealing effect.
  • the inner sealing section 423 also has a sealing effect.
  • the shaping section 412 and the folding section 424 are folded (the shaping section 412 can be surrounded by multiple deformation strips), as shown in Figure 5, to prevent the sealing plug 4 from being pulled out from the line lead-out hole.
  • the outer sealing section 421 can be inserted into the opening of the line lead-out hole to achieve sealing and prevent air leakage.
  • the connection between the insertion section 411 and the transition section 422 is tighter to prevent the line from being pulled and separated from the electrode assembly.
  • the outward turning of the pressing sleeve 41 and the bidirectional sleeve 42 can enable the sealing plug 4 to provide pulling force to the inside of the upper cover 23, thereby ensuring the sealing of the outer sealing section 421 and preventing the line from swinging and being scratched by the line lead-out hole.
  • the storage platform 9 includes a transparent platform 91 and a reflective cone barrel 92, the bottom of the reflective cone barrel 92 is connected to the top of the sealing bracket 8, the transparent platform 91 is arranged on the top surface of the reflective cone barrel 92, and the implant 3 is placed on the transparent platform 91.
  • the inner wall of the reflective cone barrel 92 is a full reflection mirror surface
  • the inner wall of the reflective cone barrel 92 is provided with several layers of reflective platforms
  • the bottom of the reflective cone barrel 92 is provided with a convex lens
  • the bottom surface of the convex lens is a full reflection mirror surface.
  • a storage table 9 can be set on the sealed bracket 8 to facilitate the placement of the implant 3. It is difficult to achieve the effect of full irradiation of the implant 3 by the traditional fixing frame method, because whenever the implant 3 needs to be fixed, a part of the implant 3 will be blocked. Therefore, a storage table 9 is set in the present application, and the storage table 9 uses a transparent platform 91 to support the implant 3. The ultraviolet light can penetrate the transparent platform 91 and enter the reflective cone barrel 92. A reflective platform and a convex lens are set in the reflective cone barrel 92, and the ultraviolet light is obliquely irradiated on the reflective cone barrel 92.
  • Reflection will be formed on the inner wall, and when reflected to the convex lens at the bottom, a focusing effect will be formed to increase the intensity of the ultraviolet light (which can be regarded as a small ultraviolet light emission source). Subsequently, the ultraviolet light is reflected to the inner wall of the reflecting cone 92 through the total reflection mirror surface on the bottom of the convex lens, thereby forming reflected ultraviolet light penetrating from the bottom of the transparent platform 91, and then irradiating and modifying the supporting surface of the implant 3 on the transparent platform 91 (as shown in Figure 8).
  • the reflecting platform on the inner wall of the reflecting cone 92 can avoid the incident light of the ultraviolet light from being at right angles to the inner wall of the reflecting cone 92, thereby reducing the waste of ultraviolet light source caused by the ultraviolet light returning along the incident light path.
  • the terms “installed”, “connected”, “connected”, “fixed” and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined.
  • installed installed, “connected”, “connected”, “fixed” and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined.
  • the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

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Abstract

一种用于植入物表面改性的照射装置，包括：至少一根准分子灯管（1）和电极组件；准分子灯管（1）设置在电极组件上，植入物（3）位于准分子灯管（1）照射范围内，电极组件与外接电源电连接。准分子灯管（1）为一根或多根，多根时呈环形围绕设置，照射区域为工作区域，植入物（3）置于工作区域内进行照射改性，电极组件在准分子灯管（1）的两端，用来对准分子灯管（1）内的稀有气体进行高压、高频轰击，从而获取特定波长的紫外线，进而对植入物（3）进行改性照射。照射装置的改性灯用于小型植入物的表面改性，结构简单、小巧便于使用，便于收纳、组装和拆卸。

Description

一种用于植入物表面改性的照射装置 技术领域
本发明涉及植入物表面改性技术领域，更具体地说，本发明涉及一种用于植入物表面改性的照射装置。
背景技术
使用172nmUV光的表面改性处理方法是将待改性的植入物和光源间隔预定距离并照射植入物的结构。因此，为了使植入物的整个表面被光均匀地照射，通常的方法是在保持植入物和光源之间的预定距离并旋转种植体的同时进行处理。使用这种方法，种植体表面改性处理所需的处理时间需要大约20至30分钟，而且传统改性照射装置结构复杂、组装、使用和收纳都非常不方便。因此，如何使改性灯小巧、便携、方便组装、收纳、使用是本申请要解决的技术问题之一。并且还有必要提出一种用于植入物表面改性的照射装置，在配合改性灯方便收纳、拆组的基础上，提高植入物表面改性的效率。
发明内容
在发明内容部分中引入了一系列简化形式的概念，这将在具体实施方式部分中进一步详细说明。本发明的发明内容部分并不意味着要试图限定出所要求保护的技术方案的关键特征和必要技术特征，更不意味着试图确定所要求保护的技术方案的保护范围。
为至少部分地解决上述问题，本发明提供了一种改性灯，包括：至少一根准分子灯管和电极组件；所述准分子灯管设置在所述电极组件上，植入物位于所述准分子灯管照射范围内，所述电极组件与外接电源电连接。
优选的是，所述电极组件包括低压电极和高压电极，所述高压电极设置在所述准分子灯管的上端，所述低压电极设置在所述准分子灯管的下端，所述高压电极和所述低压电极均与外接电源电连接。
优选的是，所述低压电极通过绝缘块与底座连接，所述准分子灯管至少设置三根，多根所述准分子灯管相互平行设置，且多根所述准分子灯管呈环绕布置，所述准分子灯管所环绕而成的中部空间为照射工作区。
优选的是，所述高压电极设置在所述准分子灯管内，并且所述高压电极的引出部从所述准分子灯管的上端引出，所述准分子灯管的上端设置有保护帽，所述高压电极的引出部从所述保护帽的出线孔引出。
本发明提供一种用于植入物表面改性的照射装置包括：所述的改性灯、密封罐和抽真空设备，所述改性灯设置在所述密封罐内，所述抽真空设备用于使所述密封罐内维持真空状态， 植入物位于所述密封罐内，并位于所述准分子灯管照射范围内。
优选的是，所述密封罐包括所述底座、外壳和上盖；所述底座和所述上盖分别位于所述外壳的两端，所述上盖上设置有线路引出孔，所述高压电极的线路通过所述线路引出孔引出，所述抽真空设备用于所述密封罐内部抽真空。
优选的是，所述底座上设置有放置孔，所述放置孔贯穿所述底座、所述绝缘块与所述低压电极。
优选的是，所述放置孔内设置有密封支架，植入物位于所述密封支架的顶部，所述密封支架的顶部设置有置物台，植入物设置在所述置物台上，所述密封支架的侧壁上设置有阻挡部，所述阻挡部的形状与所述放置孔的形状相适应，所述密封支架的底部设置有升降装置，所述升降装置用于控制所述密封支架将植入物从放置孔插入至准分子灯管的照射范围内进行照射。
优选的是，所述线路引出孔设置有密封塞，所述密封塞包括压套和双向套，所述压套和所述双向套均为弹性件，所述压套和所述双向套均套设在所述电极组件的线路上，所述压套位于所述上盖内侧，所述双向套贯穿所述线路引出孔。
优选的是，所述双向套包括外密封段、过渡段、内密封段和翻折段，所述外密封段通过所述过渡段与所述内密封段的一端连接，所述内密封段的另一端与所述翻折段的端部连接，所述外密封段位于所述线路引出孔的外侧开口处，所述内密封段位于所述线路引出孔的内侧开口处，所述过渡段位于所述线路引出孔内，所述压套包括插入段与定型段，所述插入段与所述过渡段插接，所述定型段的形状与所述内密封段和所述翻折段相适应。
优选的是，所述置物台包括透明平台和反射锥桶，所述反射锥桶的底部与所述密封支架的顶部连接，所述透明平台设置在所述反射锥桶的顶面，植入物放置在所述透明平台上，所述反射锥桶的内壁为全反射镜面，所述反射锥桶的内壁设置有若干层反射平台，所述反射锥桶的底部设置有凸透镜，所述凸透镜的底面为全反射镜面。
相比现有技术，本发明至少包括以下有益效果：
准分子灯管为一根(或由多根呈环形围绕而成)，(围绕的)照射区域为工作区域，植入物置于工作区域内进行照射改性，电极组件在准分子灯管的两端，用来对准分子灯管内的稀有气体进行高压、高频轰击，从而获取特定波长的紫外线(例如可用于光改性的172nm波长的紫外光)，进而对植入物(可为假牙或骨头等小型植入物，也可以是中、大型植入物)进行改性照射。通过上述结构的设计可以获得一款简易的改性灯，用于植入物的表面改性，结构简单、小巧便于使用，便于收纳、组装和拆卸。
本发明所述的用于植入物表面改性的照射装置，本发明的其它优点、目标和特征将部分通过下面的说明体现，部分还将通过对本发明的研究和实践而为本领域的技术人员所理解。
附图说明
附图用来提供对本发明的进一步理解，并且构成说明书的一部分，与本发明的实施例一起用于解释本发明，并不构成对本发明的限制。在附图中：
图1为本发明所述的用于植入物表面改性的照射装置的结构示意图。
图2为本发明所述的用于植入物表面改性的照射装置的剖视图。
图3a为本发明所述的用于植入物表面改性的照射装置的剖视图。
图3b为本发明所述的用于植入物表面改性的照射装置中密封支架的剖视图。
图4为本发明所述的用于植入物表面改性的照射装置中密封塞的爆炸图。
图5为本发明所述的用于植入物表面改性的照射装置中密封塞应用的示意图。
图6为本发明所述的用于植入物表面改性的照射装置中置物台的爆炸图。
图7为本发明所述的用于植入物表面改性的照射装置中置物台底部的结构示意图。
图8为本发明所述的用于植入物表面改性的照射装置中光线经置物台反射的示意图。
图9-11为本发明所述的用于植入物表面改性的照射装置应用改性灯第一种实施方式的顶部、内部和底部实物图。
图12a、b为改性灯第二种实施方式的准分子灯管(内部为高压电极)的示意图。
图12c为改性灯第二种实施方式的准分子灯管(内部为高压电极)的实物图。
图13-14为改性灯第二种实施方式的准分子灯管(内部为高压电极)无保护帽和带有保护帽的实物图。
图中：1准分子灯管、2密封罐、21底座、22外壳、23上盖、3植入物、4密封塞、41压套、411插入段、412定型段、42双向套、421外密封段、422过渡段、423内密封段、424翻折段、5低压电极、6高压电极、7绝缘块、8密封支架、阻挡部(81)、升降装置(82)、9置物台、91透明平台、92反射锥桶。
具体实施方式
下面结合附图以及实施例对本发明做进一步的详细说明，以令本领域技术人员参照说明书文字能够据以实施。
应当理解，本文所使用的诸如“具有”、“包含”以及“包括”术语并不排除一个或多个其它元件或其组合的存在或添加。
如图1-图11所示，本发明提供了一种改性灯，包括：至少一根准分子灯管1和电极组件； 所述准分子灯管1设置在所述电极组件上，植入物3位于所述准分子灯管1照射范围内，所述电极组件与外接电源电连接。
上述技术方案的工作原理及有益效果：准分子灯管1为一根(或由多根呈环形围绕而成)，(围绕的)照射区域为工作区域，植入物3置于工作区域内进行照射改性，电极组件在准分子灯管1的两端，用来对准分子灯管1内的稀有气体进行高压、高频轰击，从而获取特定波长的紫外线(例如可用于光改性的172nm波长的紫外光)，进而对植入物3(可为假牙或骨头等小型植入物，也可以是中、大型植入物)进行改性照射。通过上述结构的设计可以获得一款简易的改性灯，用于植入物的表面改性，结构简单、小巧便于使用，便于收纳、组装和拆卸。
在第一种实施方式中，所述电极组件包括低压电极5和高压电极6，所述高压电极6设置在所述准分子灯管1的上端，所述低压电极5设置在所述准分子灯管1的下端，所述高压电极6和所述低压电极5均与外接电源电连接。所述低压电极5通过绝缘块7与底座21连接，高压电极6表面采用绝缘材料进行包裹，防止高压与外界或高压与植入物3产生爬电，所述准分子灯管1至少设置三根，多根所述准分子灯管1相互平行设置，且多根所述准分子灯管1呈环绕布置，所述准分子灯管1所环绕而成的中部空间为照射工作区。
上述技术方案的工作原理及有益效果：在进行植入物3的表面改性的时候，将植入物3从放置孔放入工作区域内，并且应当保证植入物3位于低压电极5和高压电极6之间，从而保证植入物3的照射面积，开启电极组件，低压电极5和高压电极6高频、高压轰击准分子灯管1内的稀有气体，从而产生紫外光，紫外光照射在植入物3上对其进行改性，1-2分钟后(不同的植入物3所需要的时间可按照实际进行调整，例如，牙齿一般10秒就可以完成)关闭电极组件，植入物3改性完成。本实施例中以至少三根准分子灯管1呈环绕布置，以获得对植入物3环绕式的改性光照射，从而保证植入物3光照的均匀性和光强的一致性，从而避免反复转动植入物3或改性灯对其照射。
在第二种实施方式中，所述高压电极6通过固定件固定在所述准分子灯管1内，并且所述高压电极6的引出部从所述准分子灯管1的上端引出，所述准分子灯管1的上端设置有保护帽，所述高压电极6的引出部从所述保护帽的出线孔引出。
上述技术方案的工作原理及有益效果：固定件为弹簧状，用于固定电极并作为电极引出线使用，高压电极6设置在准分子灯管1内，并从上端将线路引出，在准分子灯管1的上端 设置保护帽用来将高压电极6进行串联，并且在保护帽内进行灌胶，从而防止爬电。
本发明提供了一种用于植入物表面改性的照射装置，包括：改性灯、密封罐2和抽真空设备，所述改性灯设置在所述密封罐2内，所述抽真空设备用于使所述密封罐2内维持真空状态，植入物3位于所述密封罐2内，并位于所述准分子灯管1照射范围内。所述密封罐2包括所述底座21、外壳22和上盖23；所述外壳22为管状，并且所述底座21和所述上盖23分别位于所述外壳22的两端，上盖23上端开孔，开孔处用绝缘材料(绝缘胶、陶瓷)与上盖23连接，线路引出孔设置在绝缘材料上，从而确保高压不与上盖23发生爬电。所述高压电极6的线路通过所述线路引出孔引出，并通过密封塞4与所述线路引出孔密封，所述抽真空设备用于所述密封罐2内部抽真空。所述底座21上设置有放置孔，所述放置孔贯穿所述底座21、所述绝缘块7与所述低压电极5，所述放置孔内设置有密封支架8，植入物3位于所述密封支架8的顶部，所述密封支架8的顶部设置有置物台9，植入物3设置在所述置物台9上，所述密封支架8的侧壁上设置有阻挡部81，所述阻挡部81的形状与所述放置孔的形状相适应，所述密封支架8的底部设置有升降装置82，所述升降装置82用于控制所述密封支架8将植入物3从放置孔插入至准分子灯管1的照射范围内进行照射。
上述技术方案的工作原理及有益效果：在进行植入物3的表面改性的时候，首先利用密封支架8，将植入物3安装在置物台9上，之后将密封支架8从放置孔插入，直至阻挡部81与放置孔完全重合、密封，启动升降装置82带动密封支架8从放置孔插入至准分子灯管1的照射范围内，从而使植入物3移动至工作区域内，并且应当保证植入物3位于低压电极5和高压电极6之间，从而保证植入物3的照射面积，之后启动抽真空设备，使密封罐2内变为真空状态，开启电极组件，低压电极5和高压电极6高频、高压轰击准分子灯管1内的稀有气体，从而产生紫外光，紫外光照射在植入物3上对其进行改性，1-2分钟后(不同的植入物3所需要的时间可按照实际进行调整，例如，牙齿一般10秒就可以完成)关闭电极组件和抽真空设备，将改性后的植入物3取出即可使用。抽真空设备可以使密封罐2内保持真空状态，从而提高植入物3的改性效率，进而对植入物3(可为假牙或骨头等)在真空环境下进行改性照射，并且可以根据植入物3的体积大小配备密封罐2，从而使本表面改性装置体积更加小巧、便携。密封罐2也可以避免改性光外漏、增强照射效果，同时保护操作人员可以不受改性光的照射。
在一个实施例中，所述密封塞4包括压套41和双向套42，所述压套41和所述双向套42 均为弹性件，所述压套41和所述双向套42均套设在所述电极组件的线路上，所述压套41位于所述上盖23内侧，所述双向套42贯穿所述线路引出孔。所述双向套42包括外密封段421、过渡段422、内密封段423和翻折段424，所述外密封段421通过所述过渡段422与所述内密封段423的一端连接，所述内密封段423的另一端与所述翻折段424的端部连接，所述外密封段421位于所述线路引出孔的外侧开口处，所述内密封段423位于所述线路引出孔的内侧开口处，所述过渡段422位于所述线路引出孔内，所述压套41包括插入段411与定型段412，所述插入段411与所述过渡段422插接，所述定型段412的形状与所述内密封段423和所述翻折段424相适应。
上述技术方案的工作原理及有益效果：线路引出孔处的密封塞4通常采用工字型密封塞，从而实现双向卡接密封的效果，但是工字型密封塞安装不便，并且线路与工字型密封塞的内壁可以相对滑动，很容易导致漏气，同时线路在拉扯的过程中很容易从高压电极6和低压电极5处脱落，所以需要通过本申请中的密封塞4实现固定、防滑动且双向密封的效果，在安装的时候首先安装双向套42，用手指捏住外密封段421使其小于线路引出孔的孔径，然后将其从上盖23的内侧向外侧贯穿线路引出孔，直至外密封段421全部从线路引出孔拉出，此时，过渡段422位于线路引出孔内，内密封段423卡在线路引出孔的底部开口处，实现双向套42的自固定，之后将压套41套设在线路上，并将线路从双向套42中穿过，调整好线路位置之后，将压套41沿着线路向上推，直至插入段411插入至过渡段422内为止，此时在线路的挤压下，插入段411与过渡段422之间牢固连接且起到密封的效果，同时内密封段423也起到密封的效果，之后将定型段412和翻折段424翻折(定型段412可由多根变形条合围而成)，如图5所示，防止密封塞4从线路引出孔处被拔出，当抽真空的时候，外密封段421可以插入至线路引出孔的开口处从而实现密封，防止漏气，当线路被向外拉拽的时候，插入段411与过渡段422的连接更加紧密从而防止线路被拉拽与电极组件分离，压套41和双向套42的外翻可以使密封塞4向上盖23内部提供拉力，从而保证外密封段421的密封性，以及防止线路摆动被线路引出孔划坏的情况出现。
在一个实施例中，所述置物台9包括透明平台91和反射锥桶92，所述反射锥桶92的底部与所述密封支架8的顶部连接，所述透明平台91设置在所述反射锥桶92的顶面，植入物3放置在所述透明平台91上。所述反射锥桶92的内壁为全反射镜面，所述反射锥桶92的内壁设置有若干层反射平台，所述反射锥桶92的底部设置有凸透镜，所述凸透镜的底面为全反射镜面。
上述技术方案的工作原理及有益效果：为了方便植入物3在密封罐2内进行照射，密封支架8上可以设置置物台9来方便安置植入物3，传统固定架的方式很难实现植入物3全面照射的效果，因为但凡需要固定就会导致植入物3有一部分被遮挡，因此本申请中设置有置物台9，置物台9采用透明平台91对植入物3进行支撑，紫外光可以穿透透明平台91进入至反射锥桶92内，并且在反射锥桶92内设置有反射平台和凸透镜，紫外光倾斜照射在反射锥桶92的内壁上会形成反射，当反射至底部的凸透镜的时候会形成聚焦的效果，以增加紫外光的强度(可视为小型紫外光发射源)，随后紫外光经由凸透镜底面的全反射镜面又反射至反射锥筒92的内壁，从而形成从透明平台91底部穿透的反射紫外光，进而对植入物3在透明平台91的支撑面进行照射改性(如图8所示)，通过反射锥筒92内壁的反射平台可以避免紫外光的入射光线与反射锥筒92的内壁呈直角，减少紫外光沿入射线路返回造成的紫外光源浪费。
在本发明的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”、“顺时针”、“逆时针”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
在本发明中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接或彼此可通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系，除非另有明确的限定。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
尽管本发明的实施方案已公开如上，但其并不仅仅限于说明书和实施方式中所列运用，它完全可以被适用于各种适合本发明的领域，对于熟悉本领域的人员而言，可容易地实现另外的修改，因此在不背离权利要求及等同范围所限定的一般概念下，本发明并不限于特定的细节与这里示出与描述的图例。

Claims (10)

  1. 一种改性灯，其特征在于，包括：至少一根准分子灯管(1)和电极组件；所述准分子灯管(1)设置在所述电极组件上，植入物(3)位于所述准分子灯管(1)照射范围内，所述电极组件与外接电源电连接。
  2. 根据权利要求1所述的改性灯，其特征在于，所述电极组件包括低压电极(5)和高压电极(6)，所述高压电极(6)设置在所述准分子灯管(1)的上端，所述低压电极(5)设置在所述准分子灯管(1)的下端，所述高压电极(6)和所述低压电极(5)均与外接电源电连接。
  3. 根据权利要求2所述的改性灯，其特征在于，所述低压电极(5)通过绝缘块(7)与底座(21)连接，所述准分子灯管(1)至少设置三根，多根所述准分子灯管(1)相互平行设置，且多根所述准分子灯管(1)呈环绕布置，所述准分子灯管(1)所环绕而成的中部空间为照射工作区。
  4. 根据权利要求3所述的改性灯，其特征在于，所述高压电极(6)设置在所述准分子灯管(1)内，并且所述高压电极(6)的引出部从所述准分子灯管(1)的上端引出，所述准分子灯管(1)的上端设置有保护帽，所述高压电极(6)的引出部从所述保护帽的出线孔引出。
  5. 一种用于植入物表面改性的照射装置，其特征在于，包括：如权利要求3或4任意一项所述的改性灯、密封罐(2)和抽真空设备，所述改性灯设置在所述密封罐(2)内，所述抽真空设备用于使所述密封罐(2)内维持真空状态，植入物(3)位于所述密封罐(2)内，并位于所述准分子灯管(1)照射范围内。
  6. 根据权利要求5所述的用于植入物表面改性的照射装置，其特征在于，所述密封罐(2)包括所述底座(21)、外壳(22)和上盖(23)；所述底座(21)和所述上盖(23)分别位于所述外壳(22)的两端，所述上盖(23)上设置有线路引出孔，所述高压电极(6)的线路通过所述线路引出孔引出，所述抽真空设备用于所述密封罐(2)内部抽真空。
  7. 根据权利要求6所述的用于植入物表面改性的照射装置，其特征在于，所述底座(21)上设置有放置孔，所述放置孔贯穿所述底座(21)、所述绝缘块(7)与所述低压电极(5)。
  8. 根据权利要求7所述的用于植入物表面改性的照射装置，其特征在于，还包括密封支架(8)，植入物(3)位于所述密封支架(8)的顶部，所述密封支架(8)的顶部设置有置物台(9)，植入物(3)设置在所述置物台(9)上，所述密封支架(8)的侧壁上设置有阻挡部(81)，所述阻挡部(81)的形状与所述放置孔的形状相适应，所述密封支架(8)的底部设置有升降装置(82)，所述升降装置(82)用于控制所述密封支架(8)将植入物(3)从放置 孔插入至准分子灯管(1)的照射范围内进行照射。
  9. 根据权利要求6所述的用于植入物表面改性的照射装置，其特征在于，还包括密封塞(4)，所述密封塞(4)与所述线路引出孔密封，所述密封塞(4)包括压套(41)和双向套(42)，所述压套(41)和所述双向套(42)均为弹性件，所述压套(41)和所述双向套(42)均套设在所述电极组件的线路上，所述压套(41)位于所述上盖(23)内侧，所述双向套(42)贯穿所述线路引出孔。
  10. 根据权利要求9所述的用于植入物表面改性的照射装置，其特征在于，所述双向套(42)包括外密封段(421)、过渡段(422)、内密封段(423)和翻折段(424)，所述外密封段(421)通过所述过渡段(422)与所述内密封段(423)的一端连接，所述内密封段(423)的另一端与所述翻折段(424)的端部连接，所述外密封段(421)位于所述线路引出孔的外侧开口处，所述内密封段(423)位于所述线路引出孔的内侧开口处，所述过渡段(422)位于所述线路引出孔内，所述压套(41)包括插入段(411)与定型段(412)，所述插入段(411)与所述过渡段(422)插接，所述定型段(412)的形状与所述内密封段(423)和所述翻折段(424)相适应。
PCT/CN2022/134824 2022-11-16 2022-11-28 一种用于植入物表面改性的照射装置 WO2024103439A1 (zh)

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CN101136307A (zh) * 2006-08-29 2008-03-05 优志旺电机株式会社 准分子灯
CN203288564U (zh) * 2013-06-06 2013-11-13 北京华创朗润环境科技有限公司 准分子高能紫外灯
CN113893051A (zh) * 2021-11-02 2022-01-07 桂林市啄木鸟医疗器械有限公司 种植体表面改性装置
CN113893050A (zh) * 2021-11-02 2022-01-07 桂林市啄木鸟医疗器械有限公司 种植体表面改性装置
US20220084808A1 (en) * 2020-09-15 2022-03-17 Led Smart Inc. Excimer lamp
CN114534115A (zh) * 2022-03-17 2022-05-27 深圳市禾庆科技有限公司 一种准分子灯光源
CN216652507U (zh) * 2021-11-30 2022-06-03 广明源光科技股份有限公司 一种种植体表面改性装置

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CN101136307A (zh) * 2006-08-29 2008-03-05 优志旺电机株式会社 准分子灯
CN203288564U (zh) * 2013-06-06 2013-11-13 北京华创朗润环境科技有限公司 准分子高能紫外灯
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