WO2024096574A1 - Film multicouche de blindage contre les ondes électromagnétiques et son procédé de fabrication - Google Patents

Film multicouche de blindage contre les ondes électromagnétiques et son procédé de fabrication Download PDF

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WO2024096574A1
WO2024096574A1 PCT/KR2023/017268 KR2023017268W WO2024096574A1 WO 2024096574 A1 WO2024096574 A1 WO 2024096574A1 KR 2023017268 W KR2023017268 W KR 2023017268W WO 2024096574 A1 WO2024096574 A1 WO 2024096574A1
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polyurethane
layer
polyurethane layer
multilayer film
electromagnetic wave
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PCT/KR2023/017268
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English (en)
Korean (ko)
Inventor
안기석
이선숙
정하균
임순민
지슬기
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한국화학연구원
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Publication of WO2024096574A1 publication Critical patent/WO2024096574A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • the present invention relates to a multilayer film for electromagnetic wave shielding and a method of manufacturing the same. Specifically, it relates to a multilayer film for electromagnetic wave shielding that is formed from polyurethane containing a conductive filler and includes a porous polyurethane layer.
  • the most common electromagnetic wave shielding materials are metal materials such as aluminum (Al) or copper (Cu). Although metal materials have excellent shielding properties, they are difficult to apply in various forms due to poor flexibility and processability, and there is a problem with metal corrosion. In addition, when these materials are applied to automobiles, there is a problem that moldability is insufficient and weight reduction is difficult.
  • Polymer-based electromagnetic wave shielding materials are being actively researched because they can solve the problems of low flexibility and corrosion of existing metal materials and have the advantages of high chemical resistance and low density.
  • polymer-based electromagnetic wave shielding materials have the problem of lower shielding efficiency than existing metal-based shielding materials.
  • the purpose of the present invention is to provide a multilayer film for electromagnetic wave shielding with excellent electromagnetic wave shielding efficiency.
  • Another object of the present invention is to provide a method of manufacturing a multilayer film for electromagnetic wave shielding with excellent electromagnetic wave shielding efficiency even with a simple method.
  • the present inventors As a result of continuous research by the present inventors to produce a polymer-based electromagnetic wave shielding material with excellent electromagnetic wave shielding efficiency, the present inventors have found that all layers are a multi-layer film of three or more layers formed from polyurethane containing a conductive filler, and the middle layer is a metal coating layer formed in the pores.
  • the present invention was completed by discovering that it has excellent flexibility and durability and exhibits superior electromagnetic wave shielding efficiency than conventional polymer-based materials.
  • the present invention relates to a first polyurethane layer; A porous second polyurethane layer on the first polyurethane layer; and a third polyurethane layer on the second polyurethane layer, wherein the first to third polyurethane layers each independently contain a conductive filler, and the inside of the pores of the porous second polyurethane layer
  • a multilayer film for electromagnetic wave shielding in which a metal coating layer is formed.
  • the first polyurethane layer and the third polyurethane layer are each independently thermoplastic polyurethane; and a conductive filler containing carbon nanotubes and carbon black.
  • thermoplastic polyurethane to conductive filler may satisfy a weight ratio of 1:0.1 to 0.5.
  • the porous second polyurethane layer is thermoplastic polyurethane; and a conductive filler containing carbon black.
  • the porous second polyurethane layer may have an open-cell structure with an average pore diameter of 5 to 50 ⁇ m.
  • the porous second polyurethane layer may have a thickness of 100 to 600 ⁇ m.
  • the first polyurethane layer and the third polyurethane layer may each independently have a thickness ratio of 0.2 to 2 with respect to the porous second polyurethane layer.
  • thermoplastic polyurethane to conductive filler may satisfy a weight ratio of 1:0.01 to 0.2.
  • the first polyurethane layer and the third polyurethane layer are each independently located at an interface with the porous second polyurethane layer, a mixed layer in which the two layers forming each interface are physically mixed. It may further include.
  • the mixed layer may be formed when the surfaces of the two layers forming each interface come into contact in the presence of an organic solvent and the two layers are physically mixed.
  • the metal coating layer may include one or more conductive metals selected from gold, silver, platinum, palladium, nickel, and copper.
  • the thermoplastic polyurethane may have a specific gravity of 0.9 to 1.3 g/cc.
  • the multilayer film for electromagnetic wave shielding may have a thickness of 0.1 to 1.5 mm.
  • the multilayer film for electromagnetic wave shielding may have an EMI shielding effectiveness of 60 dB or more, measured under a thickness condition of 1 ⁇ 0.1 mm.
  • the present invention includes the steps of applying an organic solvent to both sides of a second polyurethane layer, then laminating and drying the first polyurethane layer, the second polyurethane layer, and the third polyurethane layer in that order to produce a multilayer film;
  • the first polyurethane layer to the third polyurethane layer each independently contain a conductive filler, and a metal coating layer is formed inside the pores of the second polyurethane layer. there is.
  • the first polyurethane layer and the third polyurethane layer each independently contain a solvent; thermoplastic polyurethane; and a conductive filler mixed with carbon nanotubes and carbon black. It may be manufactured through a non-solvent induced phase separation method from a polyurethane composition containing.
  • the porous second polyurethane layer includes (a-1) a solvent; thermoplastic polyurethane; and a conductive filler mixed with carbon black; manufacturing porous polyurethane through a solvent evaporation method from a polyurethane composition containing; and
  • a mixed layer may be formed by partially drying both surfaces of the second polyurethane layer in contact with the first polyurethane layer and the third polyurethane layer, respectively, in the presence of an organic solvent.
  • the present invention relates to a multilayer film for electromagnetic wave shielding and a method of manufacturing the same. Specifically, it is a multilayer film for electromagnetic wave shielding in which all layers are three or more layers formed from polyurethane containing a conductive filler, and the middle layer is a porous polyurethane layer with a metal coating layer formed in the pores.
  • the multilayer film for electromagnetic wave shielding according to one embodiment has excellent flexibility and chemical resistance, which were problems with conventional metal materials, and can exhibit excellent electromagnetic wave shielding efficiency.
  • Figure 1 is an SEM image measuring the surface and cross-sectional characteristics of polyurethane films according to Preparation Examples 1-1 to 1-3 of the present invention.
  • Figure 2 is a graph of the electromagnetic wave shielding efficiency of polyurethane films according to Preparation Examples 1-1 to 1-3 of the present invention.
  • Figure 3 is an SEM image of the pores of the porous polyurethane film according to Preparation Example 2 of the present invention.
  • Figure 4 is a graph of the electromagnetic wave shielding efficiency of the porous polyurethane film with a copper coating layer according to Preparation Example 2 of the present invention.
  • Figure 5(a) is a cross-sectional SEM image of the multilayer film for electromagnetic wave shielding according to Example 1 of the present invention
  • Figure 5(b) is a graph of electromagnetic wave shielding efficiency.
  • the present invention relates to a first polyurethane layer; A porous second polyurethane layer on the first polyurethane layer; and a third polyurethane layer on the second polyurethane layer, wherein the first to third polyurethane layers each independently contain a conductive filler, and the inside of the pores of the porous second polyurethane layer
  • a multilayer film for shielding electromagnetic waves in which a metal coating layer is formed.
  • the first polyurethane layer and the third polyurethane layer are each independently thermoplastic polyurethane; and a conductive filler containing carbon nanotubes and carbon black. Additionally, the thermoplastic polyurethane to the conductive filler may satisfy a weight ratio of 1:0.01 to 1, preferably 1:0.1 to 0.5, and more preferably 1:0.2 to 0.4.
  • the thermoplastic polyurethane of the first polyurethane layer and the third polyurethane layer may each independently be a commonly used or known thermoplastic polyurethane.
  • the thermoplastic polyurethane may have a weight average molecular weight of 10,000 to 1,000,000 g/mol.
  • the glass transition temperature may be -50°C to 30°C, but is not limited thereto.
  • the thermoplastic polyurethane may have a shore hardness (A) of 70 to 99 Shores A, preferably 80 to 97 Shores A, and a specific gravity (Specific Gravity) of 0.9 to 1.3 g/cc, preferably 1.0 to 1.25. It can be g/cc, but is no longer limited.
  • the conductive filler of the first polyurethane layer and the third polyurethane layer can form a kind of conductive composite by adsorbing carbon black on the surface of the carbon nanotube, and when it includes such a conductive composite, improved shielding performance is achieved.
  • the carbon nanotubes and carbon black may satisfy a weight ratio of 1:0.1 to 5, preferably 1:0.5 to 3, and more preferably 1:0.7 to 2.
  • the carbon nanotubes may be single-walled carbon nanotubes, double-walled carbon nanotubes, multi-walled carbon nanotubes, bundled carbon nanotubes, and combinations thereof, and the diameter of the carbon nanotubes is preferably 0.5 nm to 200 nm. may be 1 nm to 100 nm, the length may be 1 ⁇ m to 50 ⁇ m, preferably 2 ⁇ m to 10 ⁇ m, and the aspect ratio of the carbon nanotube may be 100 to 10,000, but is not limited thereto.
  • the carbon black may be any one or a combination of two or more selected from furnace black, acetylene black, thermal black, and channel black, and carbon black with an average particle diameter of 1 nm to 10 ⁇ m may be used, but for the purpose of the present invention, There is no limitation thereto as long as it does not impair the physical properties.
  • the first polyurethane layer and the third polyurethane layer may each independently have a thickness of 10 ⁇ m to 2 mm, preferably 100 to 800 ⁇ m, and more preferably 200 to 600 ⁇ m. .
  • the porous second polyurethane layer is thermoplastic polyurethane; and a conductive filler containing carbon black.
  • the thermoplastic polyurethane to the conductive filler may satisfy a weight ratio of 1:0.001 to 1, preferably 1:0.01 to 0.2, and more preferably 1:0.02 to 0.1.
  • thermoplastic polyurethane of the porous second polyurethane layer may each independently be a commonly used or known thermoplastic polyurethane.
  • thermoplastic polyurethane may be the same as or different from the thermoplastic polyurethane of the first polyurethane layer described above. Additionally, the detailed description of the carbon black is the same as described above and is therefore omitted.
  • the porous second polyurethane layer may have an open cell structure, and the open cell structure has an average pore diameter of 1 to 100 ⁇ m, preferably 5 to 50 ⁇ m, more preferably. It may be 5 to 40 ⁇ m.
  • the structure and average diameter of the pores can be easily adjusted depending on the manufacturing method.
  • the porous second polyurethane layer may have a thickness of 50 ⁇ m to 1 mm, preferably 100 to 800 ⁇ m, and more preferably 200 to 600 ⁇ m.
  • the first polyurethane layer (l 1 ) and the third polyurethane layer (l 3 ) each independently have a thickness ratio (l) to the porous second polyurethane layer (l 2 ).
  • 1 /l 2 or l 3 /l 2 ) may be 0.05 to 5, preferably 0.1 to 3, and more preferably 0.2 to 2.
  • the first polyurethane layer and the third polyurethane layer are each independently located at an interface with the porous second polyurethane layer, a mixed layer in which the two layers forming each interface are physically mixed. It may further include. Specifically, the mixed layer may be formed when the surfaces of the two layers forming each interface come into contact in the presence of an organic solvent and the two layers are physically mixed.
  • the multilayer film may be laminated in the following order: first polyurethane layer/first mixed layer/porous second polyurethane layer/second mixed layer/third polyurethane layer. Specifically, the first mixed layer is the first mixed layer.
  • a polyurethane layer and a porous second polyurethane layer may be physically mixed, and the second mixed layer may be a physical mixture of a third polyurethane layer and a porous second polyurethane layer.
  • a mixed layer may be formed as polyurethane is dissolved by an organic solvent and contacted in a fluid state to form an interface. Accordingly, by having the multilayer film according to one embodiment further have a mixed layer, it is possible to realize superior flexibility, durability, and electromagnetic wave shielding efficiency.
  • the mixed layer that is, the first mixed layer and the second mixed layer, may be independently 0.01 to 5 ⁇ m and 0.1 to 1 ⁇ m, but are not limited thereto.
  • the first polyurethane layer and the third polyurethane layer may each independently further include an adhesive layer at an interface with the porous second polyurethane layer.
  • the adhesive layer can be used without major limitations as long as it is capable of adhering to the first to third polyurethane layers.
  • epoxy, acrylic, urethane, etc. adhesives can be used, but are not limited thereto.
  • the adhesive layer is not greatly limited as long as it does not impair the physical properties to be implemented in the present invention, and may be, for example, 0.1 to 10 ⁇ m.
  • the metal coating layer may include one or more conductive metals selected from gold, silver, platinum, palladium, nickel, and copper. Additionally, the metal coating layer may be in the form of the conductive metal adsorbed inside the pores in the form of particles, and the thickness of the metal coating layer may be 0.05 to 10 ⁇ m, preferably 0.1 to 3 ⁇ m, but is not limited thereto. The metal coating layer may be included in an amount of 0.1 to 10 parts by weight, preferably 0.5 to 5 parts by weight, based on 100 parts by weight of the thermoplastic polyurethane of the porous second polyurethane layer.
  • the multilayer film for electromagnetic wave shielding may have a thickness of 0.1 to 5 mm, specifically 0.1 to 1.5 mm, and more specifically 0.2 to 1 mm, but can be easily adjusted depending on the application field or use. It can be.
  • the multilayer film for electromagnetic wave shielding has an electromagnetic wave shielding effectiveness (EMI shielding effectiveness) of 50 dB or more, 60 dB or more, 70 dB or more, and 60 to 200 measured under a thickness condition of 1 ⁇ 0.1 mm. It could be dB.
  • EMI shielding effectiveness an electromagnetic wave shielding effectiveness
  • the present invention includes the steps of applying an organic solvent to both sides of a second polyurethane layer, then laminating and drying the first polyurethane layer, the second polyurethane layer, and the third polyurethane layer in that order to produce a multilayer film;
  • a method for manufacturing a multilayer film for electromagnetic wave shielding, wherein the first to third polyurethane layers each independently contain a conductive filler, and a metal coating layer is formed inside the pores of the second polyurethane layer. can be provided.
  • the first polyurethane layer and the third polyurethane layer each independently contain a solvent; thermoplastic polyurethane; It may be manufactured through a non-solvent induced phase separation method from a polyurethane composition (first polyurethane composition) containing; and a conductive filler mixed with carbon nanotubes and carbon black.
  • the first polyurethane composition can be prepared by mixing a first composition containing thermoplastic polyurethane and a solvent with a second composition containing a conductive filler mixed with carbon nanotubes and carbon black.
  • the first composition may contain more than 1% by weight, or more than 5% by weight, of the thermoplastic polyurethane, and the second composition may contain more than 5% by weight, or more than 20% by weight, of the conductive filler. Not limited.
  • the first composition to the second composition may be included in a 1:1 volume ratio, or a 1:2 volume ratio.
  • the solvent can be used without major limitations as long as it is a solvent in which the thermoplastic polyurethane, carbon nanotubes, and carbon black are easily dispersed, and includes DMF (dimethylformamide), MEK (Mathylethylketon), IPA (isopropyl alcohol), and toluene. It may be any one or a combination of two or more selected from the like.
  • a film can be manufactured by adding the first polyurethane composition prepared herein to water according to a non-solvent induced phase separation method.
  • the non-solvent induced phase separation method follows a commonly used or known method. Additionally, the film undergoes a typical heat compression process (temperature conditions of 180°C or higher, preferably 180 to 300°C and pressure conditions of 3 MPa or higher, 3 to 50 MPa) for 5 minutes or more, preferably 10 to 60 minutes. ) can be performed.
  • the film manufactured through this can be applied to the first polyurethane layer and the third polyurethane layer.
  • the porous second polyurethane layer includes (a-1) a solvent; thermoplastic polyurethane; and a conductive filler mixed with carbon black; manufacturing porous polyurethane through a vapor phase-induced phase separation method from a polyurethane composition (second polyurethane composition) containing; and (a-2) contacting the porous polyurethane with a plating composition containing a copper precursor to form a metal coating layer inside the pores.
  • the dry weight of the two-polyurethane composition may be 99% by weight or less, or 80% by weight or less, or 5 to 70% by weight, but is not limited thereto.
  • a porous polyurethane film can be manufactured from the two polyurethane compositions according to a vapor phase-induced phase separation method.
  • the gas phase-induced phase separation method may use commonly used or known methods, for example, humidity conditions of 50 to 99RH%, preferably 70 to 95RH%, and temperature conditions of 60°C or lower, preferably 40°C or lower. Pore may be formed by evaporating the solvent.
  • the solvent can be used without major limitations as long as it is a solvent in which the thermoplastic polyurethane and carbon black are easily dispersed, and any one selected from DMF (dimethylformamide), MEK (Mathylethylketon), IPA (isopropyl alcohol), and toluene. Or it may be a combination of two or more.
  • an adhesive may be applied to both sides of the second polyurethane layer and then adhered to the first polyurethane layer and the third polyurethane layer, respectively.
  • the application thickness of the adhesive can be easily adjusted within a range that does not impair the physical properties targeted by the present invention, and may be, for example, 0.01 to 100 ⁇ m. After applying the adhesive and adhering to each layer, it can be dried under normal conditions, and additionally, a normal heat compression process can be performed.
  • a mixed layer may be formed by partially drying both surfaces of the second polyurethane layer in contact with the first polyurethane layer and the third polyurethane layer, respectively, in the presence of an organic solvent. Specifically, a small amount of organic solvent (0.01 to 0.5 ml/cm2, preferably 0.05 to 0.2 ml/cm2) is applied to both sides of the second polyurethane layer to provide fluidity to the polyurethane on a part of the surface, and then the first polyurethane layer is applied. By contacting the polyurethane layer and the third polyurethane layer, respectively, the above-described first mixed layer and second mixed layer can be formed. Additionally, the organic solvent may be the same as or different from the solvent described above.
  • the step (a-2) of forming a metal coating layer inside the pores by contacting the porous polyurethane with a plating composition containing a copper precursor is a commonly used or known plating method, For example, plating may be performed for more than 1 hour, preferably 2 to 6 hours, using an electroless plating method.
  • the copper precursor is copper acetate, copper acetate hydrate, copper acetylacetonate, copper isobutyrate, copper carbonate, copper chloride, copper chloride hydrate, copper ethyl acetoacetate, and copper 2-ethylhexanoate.
  • the plating composition may include 0.01 to 10% by weight and 0.1 to 5% by weight of the copper precursor.
  • the multilayer film for electromagnetic wave shielding according to an embodiment of the present invention has excellent flexibility and durability, and can achieve excellent electromagnetic wave shielding efficiency by solving the problem of insufficient shielding efficiency, which was a disadvantage of conventional polymer electromagnetic wave shielding materials.
  • the multilayer film for electromagnetic wave shielding can be widely applied to materials that require formability, flexibility, and excellent electromagnetic wave shielding efficiency in various industrial fields such as construction materials, industrial products, and automobiles.
  • Film surface and cross-section characteristics The surface and cross-section of the multilayer film were measured using a scanning electron microscope (JEOL IT-500HR) under 5 kV acceleration voltage conditions.
  • Sheet resistance The sheet resistance of the multilayer film was measured using a CMT-SR1000N device from AIT Co., Ltd. using a 4-point probe measurement method.
  • thermoplastic polyurethane physical properties Weight average molecular weight was measured using GPC, and glass transition temperature was measured using DSC. In addition, Shore Hardness (A) was measured according to ASTM D 2240, and Specific Gravity (Specific Gravity) was measured according to ASTM D 792.
  • Electromagnetic wave shielding efficiency (EMI SE, dB): The electromagnetic wave shielding efficiency of the multilayer film was manufactured to the standard of 41.4 ⁇ 41.4 mm 2 according to the waveguides of the vector network analyzer and was measured using a Keysight PNA N5224B analysis device. The frequency range was measured in the X-band frequency range of 8-12 GHz.
  • 10% by weight of the first composition was prepared by dispersing thermoplastic polyurethane (TPU, Neothane 5195AP: hardness: 97 Shores A, specific gravity 1.21 g/cc) in DMF (Dimethylformamide), and CNT (CNT MR99) and carbon black were added to DMF.
  • TPU thermoplastic polyurethane
  • CNT MR99 CNT MR99
  • Carbon black were added to DMF.
  • Super P weight ratio 1:1
  • the first polyurethane composition was added to water to induce a non-solvent-induced phase separation method, and the phase-separated polyurethane film was dried in a drying oven at 60°C for 12 hours.
  • the dried polyurethane film was subjected to a hot press process at a temperature of 200°C and a pressure of 10MPa for 30 minutes to produce a polyurethane film with a thickness of approximately 300 ⁇ m.
  • Preparation Example 1-1 was performed in the same manner except that Neothane 5075AP (hardness: 77 Shores A, specific gravity: 1.18 g/cc) was used as thermoplastic polyurethane (TPU).
  • Neothane 5075AP hardness: 77 Shores A, specific gravity: 1.18 g/cc
  • TPU thermoplastic polyurethane
  • Preparation Example 1-1 was performed in the same manner except that Neothane 6175AP (hardness: 78 Shores A, specific gravity: 1.09 g/cc) was used as thermoplastic polyurethane (TPU).
  • Neothane 6175AP hardness: 78 Shores A, specific gravity: 1.09 g/cc
  • TPU thermoplastic polyurethane
  • a third composition of 10% by weight was prepared by dissolving thermoplastic polyurethane (TPU, Neothane 5195AP) in DMF, and 5 parts by weight of carbon black (Super P) was added and dispersed in the third composition based on 100 parts by weight of the TPU.
  • a second polyurethane composition was prepared. The second polyurethane composition was injected into a 10x10cm2 silicone mold, and the solvent was evaporated under 90RH% humidity and 30°C temperature conditions to prepare a porous polyurethane film. The pores of the prepared porous polyurethane film were analyzed by SEM and shown in Figure 3 (a), and the measured sheet resistance was 22.88 ⁇ 6.8 K ⁇ .
  • the prepared porous polyurethane film was immersed in a plating composition containing 1.2 wt% of a copper precursor (copper sulfate), electroless plating was performed for 3 hours, and then dried to prepare a porous polyurethane film with a copper coating layer formed. .
  • a plating composition containing 1.2 wt% of a copper precursor (copper sulfate)
  • electroless plating was performed for 3 hours, and then dried to prepare a porous polyurethane film with a copper coating layer formed.
  • FIG. 3 shows a graph measuring the electromagnetic wave shielding efficiency of the porous polyurethane film with the copper coating layer of Preparation Example 2.
  • a small amount (about 0.05 to 0.2 mL/cm2) of DMF was applied to both sides of the porous polyurethane film on which the copper coating layer of Preparation Example 2 was formed, and then the polyurethane film of Preparation Example 1-1 was brought into contact with both sides at room temperature. was pressed for 10 minutes at a pressure of 2 kPa.
  • Example 2 The same procedure as Example 1 was performed except that a polyurethane-based adhesive (3M) was applied instead of DMF.
  • 3M polyurethane-based adhesive
  • Example 2 the same procedure as Example 1 was performed, except that a thermoplastic polyurethane (TPU) film of the same thickness used in Preparation Example 1-1 was used instead of the polyurethane film of Preparation Example 1-1.
  • TPU thermoplastic polyurethane
  • Example 1 The electromagnetic wave shielding efficiencies of Example 1, Preparation Examples 1-1, 2, and Comparative Example 1 were compared in Table 2 below.
  • Example 1 Example 2 Manufacturing Example 1-1 Production example 2 Comparative Example 1 Electromagnetic wave shielding efficiency [dB] 78.7 65.3 39.8 50.7 52.9
  • the multilayer film for electromagnetic wave shielding according to Example 1 showed remarkable electromagnetic wave shielding efficiency compared to Comparative Example 1, which was manufactured using a polyurethane layer containing no conductive filler, and Preparation Example 1- It was confirmed that when the polyurethane film of 1 or Preparation Example 2 was manufactured as a multilayer film, it showed more excellent electromagnetic wave shielding efficiency than when used alone.
  • the multilayer film of Example 1 has a thickness at each interface (interface between the first polyurethane layer and the porous second polyurethane layer, and between the second polyurethane layer and the porous third polyurethane layer). It was confirmed that the electromagnetic wave shielding efficiency was further improved by including a mixed layer in which the two layers forming the interface were physically mixed.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)

Abstract

La présente invention concerne un film multicouche de blindage contre les ondes électromagnétiques et son procédé de fabrication. Plus précisément, le film multicouche de protection contre les ondes électromagnétiques décrit est formé à partir de polyuréthane contenant une charge conductrice et comprend une couche de polyuréthane poreuse. Le film multicouche de blindage contre les ondes électromagnétiques peut présenter une excellente efficacité de blindage contre les ondes électromagnétiques tout en ayant des propriétés de flexibilité, de résistance chimique, et analogues.
PCT/KR2023/017268 2022-11-04 2023-11-01 Film multicouche de blindage contre les ondes électromagnétiques et son procédé de fabrication WO2024096574A1 (fr)

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KR1020220146151A KR102709695B1 (ko) 2022-11-04 2022-11-04 전자파 차폐용 다층필름 및 이의 제조방법
KR10-2022-0146151 2022-11-04

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Citations (5)

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KR20220105186A (ko) * 2021-01-18 2022-07-27 한국재료연구원 전자파 차폐용 복합 소재 및 이의 제조방법

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11220283A (ja) * 1998-01-30 1999-08-10 Seiren Co Ltd 導電性材料
KR20090028278A (ko) * 2007-09-14 2009-03-18 주식회사 유비텍 도전성 탄성 복합 시트와 그 제조 방법
KR20170069069A (ko) * 2015-12-10 2017-06-20 현대자동차주식회사 전자파 차폐 복합필름, 이의 제조방법 및 상기 전자파 차폐 복합필름을 포함하는 대쉬아이솔레이션 패드
KR20190008006A (ko) * 2017-07-14 2019-01-23 윤일구 다공성 폴리우레탄 폼을 이용한 등방성 도전 폼 및 그 제조방법
KR20220105186A (ko) * 2021-01-18 2022-07-27 한국재료연구원 전자파 차폐용 복합 소재 및 이의 제조방법

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