WO2024096201A1 - Dispositif électronique comprenant un trou d'évent - Google Patents

Dispositif électronique comprenant un trou d'évent Download PDF

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Publication number
WO2024096201A1
WO2024096201A1 PCT/KR2023/003597 KR2023003597W WO2024096201A1 WO 2024096201 A1 WO2024096201 A1 WO 2024096201A1 KR 2023003597 W KR2023003597 W KR 2023003597W WO 2024096201 A1 WO2024096201 A1 WO 2024096201A1
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WO
WIPO (PCT)
Prior art keywords
housing
electronic device
groove
hole
plate
Prior art date
Application number
PCT/KR2023/003597
Other languages
English (en)
Korean (ko)
Inventor
정양균
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020220154032A external-priority patent/KR20240062855A/ko
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2024096201A1 publication Critical patent/WO2024096201A1/fr

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings

Definitions

  • Various embodiments of the present disclosure relate to an electronic device including a vent hole.
  • the electronic device may include a housing that forms a sealed space for waterproofing.
  • the housing may include a vent hole to resolve the difference between the air pressure outside the housing and the air pressure inside the housing.
  • the vent hole may provide ventilation between the interior of the housing and the exterior of the housing.
  • the housing may include an air vent extending from the vent hole into the interior of the housing.
  • An electronic device may include a housing, a support member, and a structure.
  • the housing may include a first plate, a second plate, and a third plate.
  • the first plate may face a first direction.
  • the second plate may face a second direction opposite to the first direction.
  • the third plate may include a vent hole.
  • the third plate may be disposed between the first plate and the second plate.
  • the support member may extend from the third plate into the housing.
  • the support member may include a groove.
  • the groove may be recessed into the inside of the support member from one side facing the first plate.
  • the groove may contact the vent hole.
  • the structure may fill the groove.
  • the structure may be formed from the groove in the first direction.
  • the structure may be configured to provide at least a portion of an airflow path for air flowing between the exterior of the housing and the interior of the housing.
  • An electronic device may include a housing, a support member, and a structure.
  • the housing may include a first plate, a second plate, and a third plate.
  • the first plate may face a first direction.
  • the second plate may face a second direction opposite to the first direction.
  • the third plate may include a vent hole.
  • the third plate may be disposed between the first plate and the second plate.
  • the support member may extend from the third plate into the housing.
  • the support member may include a groove.
  • the groove may be recessed into the inside of the support member from one side facing the first plate.
  • the groove may contact the vent hole.
  • the structure may fill the groove.
  • the structure may be configured to provide at least a portion of an airflow path for air flowing between the exterior of the housing and the interior of the housing.
  • the structure may be configured to reduce moisture flowing into the vent hole from being transferred into the housing by shielding an end of the vent hole that is in contact with the groove.
  • FIG. 1 is a block diagram of an electronic device in a network environment according to an embodiment.
  • FIG. 2 is a diagram showing an exemplary electronic device.
  • FIG 3 is an exploded perspective view of an exemplary electronic device.
  • 4A shows a portion of an example electronic device.
  • FIG. 4B is an exploded perspective view of the exemplary structure of FIG. 4A.
  • FIG. 5A is a cross-sectional view of an exemplary electronic device taken along line A-A' of FIG. 4A.
  • 5B and 5C show example structures.
  • FIGS. 6A and 6B are cross-sectional views of an exemplary electronic device taken along line AA′ of FIG. 4A .
  • Figure 6C is an exploded perspective view of an exemplary structure.
  • FIG 7A shows an example electronic device.
  • FIG. 7B is a cross-sectional view of an exemplary electronic device taken along line B-B' of FIG. 7A.
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment 100, according to one embodiment.
  • the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • a first network 198 e.g., a short-range wireless communication network
  • a second network 199 e.g., a long-distance wireless communication network.
  • the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197.
  • at least one of these components eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101.
  • some of these components e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.
  • the processor 120 for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • software e.g., program 140
  • the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132.
  • the commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • the processor 120 includes a main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor).
  • a main processor 121 e.g., a central processing unit or an application processor
  • auxiliary processor 123 e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor.
  • the electronic device 101 includes a main processor 121 and a secondary processor 123
  • the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can.
  • the auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.
  • the auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled.
  • co-processor 123 e.g., image signal processor or communication processor
  • may be implemented as part of another functionally related component e.g., camera module 180 or communication module 190. there is.
  • the auxiliary processor 123 may include a hardware structure specialized for processing artificial intelligence models.
  • Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself, where artificial intelligence is performed, or may be performed through a separate server (e.g., server 108).
  • Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited.
  • An artificial intelligence model may include multiple artificial neural network layers.
  • Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above.
  • artificial intelligence models may additionally or alternatively include software structures.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto.
  • Memory 130 may include volatile memory 132 or non-volatile memory 134.
  • the program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.
  • the input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user).
  • the input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).
  • the sound output module 155 may output sound signals to the outside of the electronic device 101.
  • the sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback.
  • the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.
  • the display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user).
  • the display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device.
  • the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.
  • the audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).
  • the electronic device 102 e.g., speaker or headphone
  • the sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do.
  • the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.
  • the interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card interface
  • audio interface audio interface
  • connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 can capture still images and moving images.
  • the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 can manage power supplied to the electronic device 101.
  • the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101.
  • the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
  • Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication.
  • processor 120 e.g., an application processor
  • the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included.
  • a wireless communication module 192 e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 e.g., : LAN (local area network) communication module, or power line communication module
  • the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network
  • the wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 to communicate within a communication network such as the first network 198 or the second network 199.
  • subscriber information e.g., International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology).
  • NR access technology provides high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access to multiple terminals (massive machine type communications (mMTC)), or ultra-reliable and low-latency (URLLC). -latency communications)) can be supported.
  • the wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates.
  • the wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing.
  • MIMO massive array multiple-input and multiple-output
  • the wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC.
  • Peak data rate e.g., 20 Gbps or more
  • loss coverage e.g., 164 dB or less
  • U-plane latency e.g., 164 dB or less
  • the antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device).
  • the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB).
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is, for example, connected to the plurality of antennas by the communication module 190. can be selected. Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna.
  • other components eg, radio frequency integrated circuit (RFIC) may be additionally formed as part of the antenna module 197.
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.
  • a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the
  • peripheral devices e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • signal e.g. commands or data
  • commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199.
  • Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101.
  • all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108.
  • the electronic device 101 may perform the function or service instead of executing the function or service on its own.
  • one or more external electronic devices may be requested to perform at least part of the function or service.
  • One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101.
  • the electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request.
  • cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology can be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of Things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or server 108 may be included in the second network 199.
  • the electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.
  • FIG. 2 is a diagram illustrating an example electronic device 101.
  • the electronic device 101 may include a housing 210 that forms the exterior of the electronic device 101.
  • housing 210 surrounds a first side (or front) 200A, a second side (or back) 200B, and a space between the first side 200A and the second side 200B.
  • the housing 210 may refer to a structure that forms at least a portion of the first surface 200A, the second surface 200B, and/or the third surface 200C.
  • the electronic device 101 may include a substantially transparent first plate 202.
  • the first plate 202 may form at least a portion of the first surface 200A.
  • the first plate 202 may include, for example, a glass plate including various coating layers, or a polymer plate, but is not limited thereto.
  • the electronic device 101 may include a second plate 211 that is substantially opaque.
  • the second plate 211 may form at least a portion of the second surface 200B.
  • the second plate 211 is coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. can be formed.
  • the electronic device 101 may include a third plate (or side member) (eg, the third plate 218 in FIG. 3).
  • the third plate 218 is combined with the first plate 202 and/or the second plate 211 to form at least a portion of the third side 200C of the electronic device 101. You can.
  • the third plate 218 may form the entire third side 200C of the electronic device 101.
  • the third plate 218 may form the third side 200C of the electronic device 101 together with the first plate 202 and/or the second plate 211.
  • the first plate 202 and/or the second plate 211 /Or the second plate 211 may include a region that is bent toward the second plate 211 and/or the first plate 202 at its edge and extends seamlessly.
  • the extended area of the first plate 202 and/or the second plate 211 may be, for example, located at both ends of a long edge of the electronic device 101, but in the above-described example It is not limited by .
  • the third plate 218 may include metal and/or polymer.
  • the second plate 211 and the third plate 218 may be formed integrally and may include the same material (eg, a metal material such as aluminum), but are not limited thereto.
  • the second plate 211 and the third plate 218 may be formed of separate configurations and/or may include different materials.
  • the electronic device 101 includes a display 201, an audio module 203, 204, and 207, a sensor module (not shown), a camera module 205, 212, and 213, and a key input device 217. , a light emitting device (not shown), and/or a connector hole 208 may be included. According to one embodiment, the electronic device 101 may omit at least one of the above components (e.g., key input device 217 or a light emitting device (not shown)) or may additionally include other components. .
  • the display 201 (e.g., the display module 160 of FIG. 1) may be visually exposed through a significant portion of the first plate 202.
  • the display 201 may be disposed on the back of the first plate 202 .
  • the outer shape of the display 201 may be substantially the same as the outer shape of the first plate 202 adjacent to the display 201. According to one embodiment, in order to expand the area to which the display 201 is visually exposed, the distance between the outer edge of the display 201 and the outer edge of the first plate 202 may be formed to be substantially the same.
  • the display 201 (or the first side 200A of the electronic device 101) may include a screen display area 201A.
  • the display 201 may provide visual information to the user through the screen display area 201A.
  • the screen display area 201A is shown to be located inside the first surface 200A, spaced apart from the outer edge of the first surface 200A.
  • the first side 200A when the first side 200A is viewed from the front, at least a portion of the edge of the screen display area 201A is substantially similar to the edge of the first side 200A (or the first plate 202). It may be consistent with .
  • the screen display area 201A may include a sensing area 201B configured to obtain biometric information of the user.
  • the meaning of “the screen display area 201A includes the sensing area 201B” can be understood as at least a portion of the sensing area 201B being overlapped with the screen display area 201A.
  • the sensing area 201B can display visual information by the display 201 like other areas of the screen display area 201A, and can additionally acquire the user's biometric information (e.g. fingerprint). It can mean area.
  • the sensing area 201B may be formed in the key input device 217.
  • the display 201 may include an area where the first camera module 205 (eg, the camera module 180 of FIG. 1) is located.
  • an opening is formed in the area of the display 201, and the first camera module 205 (e.g., a punch hole camera) is at least partially disposed within the opening to face the first surface 200A. It can be.
  • the screen display area 201A may surround at least a portion of the edge of the opening.
  • the first camera module 205 eg, under display camera (UDC)
  • UDC under display camera
  • the display 201 can provide visual information to the user through the area, and additionally, the first camera module 205 is positioned in a direction toward the first side 200A through the area of the display 201. A corresponding image can be obtained.
  • the display 201 may be combined with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of touch, and/or a digitizer that detects a magnetic field-type stylus pen. there is.
  • the audio modules 203, 204, and 207 may include microphone holes 203 and 204 and speaker holes 207.
  • the microphone holes 203 and 204 include a first microphone hole 203 formed in a partial area of the third surface 200C and a second microphone hole 204 formed in a partial area of the second surface 200B. ) may include.
  • Microphones (not shown) may be placed inside the microphone holes 203 and 204 to acquire external sounds.
  • the microphone may include a plurality of microphones to detect the direction of sound.
  • the second microphone hole 204 formed in a partial area of the second surface 200B may be arranged adjacent to the camera modules 205, 212, and 213.
  • the second microphone hole 204 may acquire sound according to the operation of the camera modules 205, 212, and 213.
  • the speaker hole 207 may include an external speaker hole 207 and a receiver hole (not shown) for a call.
  • the external speaker hole 207 may be formed in a portion of the third side 200C of the electronic device 101.
  • the external speaker hole 207 may be implemented as one hole with the microphone hole 203.
  • a receiver hole (not shown) for a call may be formed in another part of the third side 200C.
  • the receiver hole for a call may be formed on the third side 200C opposite the external speaker hole 207.
  • the external speaker hole 207 is formed on the third side 200C corresponding to the lower part of the electronic device 101, and the call receiver hole is on the electronic device 101.
  • the call receiver hole may be formed in a location other than the third surface 200C.
  • the receiver hole for a call may be formed by a space between the first plate 202 (or display 201) and the third plate 218.
  • the electronic device 101 includes at least one speaker (not shown) configured to output sound to the outside of the housing 210 through the external speaker hole 207 and/or the call receiver hole (not shown). Poetry) may be included.
  • a sensor module (not shown) (e.g., sensor module 176 in FIG. 1) provides an electrical signal or data value corresponding to the internal operating state of the electronic device 101 or the external environmental state.
  • the sensor module may include a proximity sensor, HRM sensor, fingerprint sensor, gesture sensor, gyro sensor, barometric pressure sensor, magnetic sensor, acceleration sensor, grip sensor, color sensor, IR (infrared) sensor, biometric sensor, temperature sensor, It may include at least one of a humidity sensor or an illuminance sensor.
  • the camera modules 205, 212, and 213 are a first camera module disposed to face the first side 200A of the electronic device 101. It may include (205), a second camera module 212 disposed to face the second surface 200B, and a flash 213.
  • the second camera module 212 may include a plurality of cameras (eg, a dual camera, a triple camera, or a quad camera).
  • the second camera module 212 is not necessarily limited to including a plurality of cameras and may include one camera.
  • the first camera module 205 and the second camera module 212 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash 213 may include, for example, a light emitting diode or a xenon lamp.
  • two or more lenses an infrared camera, a wide-angle lens, and a telephoto lens
  • image sensors may be disposed on one side of the electronic device 101.
  • the key input device 217 (eg, the input module 150 of FIG. 1) may be disposed on the third side 200C of the electronic device 101.
  • the electronic device 101 may not include some or all of the key input devices 217, and the key input devices 217 that are not included may be other than soft keys on the display 201. It can be implemented in the form
  • the connector hole 208 may be formed on the third side 200C of the electronic device 101 to accommodate a connector of an external device.
  • a connection terminal eg, connection terminal 178 in FIG. 1 that is electrically connected to a connector of an external device may be disposed in the connector hole 208.
  • the electronic device 101 may include an interface module (eg, interface 177 in FIG. 1) for processing electrical signals transmitted and received through the connection terminal.
  • the third plate 218 may include a vent hole 206.
  • air outside the housing 210 may flow into the housing 210 through the vent hole 206.
  • air inside the housing 210 may leak out of the housing 210 through the vent hole 206.
  • the electronic device 101 may include a light emitting device (not shown).
  • the light emitting device (not shown) may be disposed on the first surface 200A of the housing 210.
  • the light emitting device (not shown) may provide status information of the electronic device 101 in the form of light.
  • the light emitting device (not shown) may provide a light source linked to the operation of the first camera module 205.
  • the light emitting device (not shown) may include an LED, an IR LED, and/or a xenon lamp.
  • FIG 3 is an exploded perspective view of an exemplary electronic device.
  • the electronic device 101 includes a third plate 218, a support member 243, a first printed circuit board 250, a second printed circuit board 252, and a cover. It may include a plate 260 and a battery 270.
  • the electronic device 101 includes a third plate 218 forming the exterior of the electronic device 101 (e.g., the third side 200C of FIG. 2) and a surface from the third plate 218. It may include a support member 243 extending inward. According to one embodiment, the third plate 218 and the support member 243 may be disposed between the display 201 and the second plate 211. For example, the third plate 218 may surround the space between the second plate 211 and the first plate 202 (and/or the display 201). For example, the support member 243 may extend from the third plate 218 within the space.
  • the support member 243 may support or accommodate other components included in the electronic device 101.
  • the display 201 may be placed on one side of the support member 243 facing in one direction (e.g., +z direction), and the display 201 may be supported by the support member 243.
  • a first printed circuit board 250, a second printed circuit board 252, and a battery 270 are placed on the other side of the support member 243 facing in a direction opposite to the one direction (e.g., -z direction).
  • the second camera module 212 may be disposed.
  • the first printed circuit board 250, the second printed circuit board 252, the battery 270, and the second camera module 212 are located on the rear panel defined by the third plate 218 and/or the support member 243. Each can be seated in a set.
  • the first printed circuit board 250, the second printed circuit board 252, and the battery 270 may each be combined with the support member 243.
  • the first printed circuit board 250 and the second printed circuit board 252 may be fixed to the support member 243 through a coupling member such as a screw.
  • the battery 270 may be fixed to the support member 243 through an adhesive member (eg, double-sided tape).
  • an adhesive member eg, double-sided tape
  • the cover plate 260 may be disposed between the first printed circuit board 250 and the second plate 211. According to one embodiment, a cover plate 260 may be disposed on the first printed circuit board 250. For example, the cover plate 260 may be disposed on a side of the first printed circuit board 250 facing the -z direction.
  • the cover plate 260 may at least partially overlap the first printed circuit board 250 with respect to the z-axis. According to one embodiment, the cover plate 260 may cover at least a partial area of the first printed circuit board 250. Through this, the cover plate 260 can protect the first printed circuit board 250 from physical shock or prevent the connector coupled to the first printed circuit board 250 from being separated.
  • the cover plate 260 is fixedly disposed on the first printed circuit board 250 through a coupling member (e.g., a screw), or is connected to the first printed circuit board 250 through the coupling member. Together, they can be coupled to the support member 243.
  • a coupling member e.g., a screw
  • the display 201 may be disposed between the support member 243 and the first plate 202.
  • the first plate 202 may be disposed on one side (e.g., +z direction) of the display 201, and the support member 243 may be disposed on the other side (e.g., -z direction).
  • the first plate 202 may be combined with the display 201.
  • the first plate 202 and the display 201 may be adhered to each other through an optical adhesive member (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.
  • OCA optically clear adhesive
  • OCR optically clear resin
  • the first plate 202 may be combined with the third plate 218.
  • the first plate 202 may include an outer portion extending outside the display 201 when viewed in the z-axis direction, and the outer portion of the first plate 202 and the third plate ( 218) may be adhered to the third plate 218 through an adhesive member (eg, waterproof tape) disposed between them.
  • an adhesive member eg, waterproof tape
  • the first printed circuit board 250 and/or the second printed circuit board 252 include a processor (e.g., processor 120 of FIG. 1) and a memory (e.g., memory 130 of FIG. 1). )), and/or an interface (e.g., interface 177 of FIG. 1) may be mounted.
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • Memory may include, for example, volatile memory or non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital
  • the interface may connect the electronic device 101 to an external electronic device electrically or physically and may include a USB connector, SD card/MMC connector, or audio connector.
  • the first printed circuit board 250 and the second printed circuit board 252 may be operatively or electrically connected to each other through a connecting member (eg, a flexible printed circuit board).
  • the battery 270 may supply power to at least one component of the electronic device 101 .
  • the battery 270 may include a rechargeable secondary battery or fuel cell. At least a portion of the battery 270 may be disposed on substantially the same plane as the first printed circuit board 250 and/or the second printed circuit board 252.
  • the electronic device 101 may include an antenna module (not shown) (eg, the antenna module 197 in FIG. 1).
  • the antenna module may be disposed between the second plate 211 and the battery 270.
  • the antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • NFC near field communication
  • MST magnetic secure transmission
  • the antenna module can perform short-distance communication with an external device or wirelessly transmit and receive power with an external device.
  • the first camera module 205 (e.g., front camera) has a lens in a portion of the first plate 202 (e.g., front 200A of FIG. 2) (e.g., camera area 237). ) may be disposed on at least a portion of the support member 243 to receive external light.
  • the second camera module 212 (eg, rear camera) may be disposed between the support member 243 and the second plate 211. According to one embodiment, the second camera module 212 may be electrically connected to the first printed circuit board 250 through a connection member (eg, connector). According to one embodiment, the second camera module 212 may be arranged so that the lens can receive external light through the camera area 284 of the second plate 211 of the electronic device 101.
  • the camera area 284 may be formed on the surface of the second plate 211 (eg, the rear surface 200B in FIG. 2). According to one embodiment, the camera area 284 may be formed to be at least partially transparent to allow external light to enter the lens of the second camera module 212. According to one embodiment, at least a portion of the camera area 284 may protrude from the surface of the second plate 211 at a predetermined height. However, it is not limited to this, and according to one embodiment, the camera area 284 may form substantially the same plane as the surface of the second plate 211.
  • the housing 210 of the electronic device 101 may refer to a configuration or structure that forms at least part of the exterior of the electronic device 101.
  • at least a portion of the first plate 202, third plate 218, and/or second plate 211 forming the exterior of the electronic device 101 is included in the housing 210 of the electronic device 101. ) can be referred to.
  • FIG. 4A shows a portion of an exemplary electronic device 101.
  • FIG. 4B is an exploded perspective view of the example structure 320 of FIG. 4A.
  • the electronic device 101 may include a housing 210, a support member 243, and a structure 320.
  • the housing 210 includes a first plate (e.g., the first plate 202 in FIG. 2) and a second plate (e.g., the second plate in FIG. 2) that form the exterior of the electronic device 101. plate 211), and a third plate 218.
  • the first plate 202 and the second plate 211 may face different directions.
  • the first plate 202 may face a first direction (eg, +z direction).
  • the second plate 211 may face a second direction (eg, -z direction) opposite to the first direction.
  • the third plate 218 may be disposed between the first plate 202 and the second plate 211.
  • the first plate 202, the second plate 211, and the third plate 218 are the first plate 202, the second plate 211, and the third plate 218.
  • An internal space surrounded by can be formed.
  • Various components of the electronic device 101 may be disposed in the internal space.
  • the internal space of the housing 210 in order to reduce moisture flowing into the internal space surrounded by the first plate 202, the second plate 211, and the third plate 218, the internal space of the housing 210 is, It can be sealed from the outside of the housing 210. Due to the sealed structure, the interior of the housing 210 can be waterproof. According to one embodiment, the housing 210 may be configured so that the air inside the housing 210 and the air outside the housing 210 communicate with each other. For example, when the sealed structure of the housing 210 blocks ventilation of air inside and outside the housing 210, the difference between the air pressure inside the housing 210 and the air pressure outside the housing 210 is It can happen. The difference in air pressure may cause problems in the electronic device 101.
  • the difference in barometric pressure can cause a window (e.g., a display window, camera window, or sensor window) to fog up, a barometric pressure sensor to malfunction, or a receiver's diaphragm to malfunction.
  • a window e.g., a display window, camera window, or sensor window
  • the sealed structure of the housing 210 may be structured to reduce the inflow of moisture and allow the inflow and/or outflow of air.
  • the third plate 218 may include a vent hole 206 for air flowing between the inside of the housing 210 and the outside of the housing 210.
  • the vent hole 206 is formed from one side 218-1 of the third plate 218 (e.g., one side 218-1 in FIG. 5A) facing the outside of the housing 210. ) It may penetrate to the other side 218-2 of the third plate 218 facing inward (e.g., the other side 218-2 in FIG. 5A).
  • the vent hole 206 may be configured to resolve the difference in air pressure between the internal space of the sealed housing 210 and the outside of the housing 210.
  • Air vents may be configured to allow movement of air and reduce movement of moisture.
  • the third plate 218 includes a microphone hole 203 for transmitting vibrations from external sounds to the microphone module inside the electronic device 101, and a speaker hole for sound signals output from the speaker. It may include (207) and/or a connector hole (208) into which a connector of an external electronic device can be connected.
  • the connector hole 208 may be disposed between the microphone hole 203 and the vent hole 206.
  • the distance d1 from the microphone hole 203 to the connector hole 208 may be substantially equal to the distance d2 from the vent hole 206 to the connector hole 208.
  • the third plate 218 includes a microphone hole 203 and a vent hole 206 arranged symmetrically with the connector hole 208 in the center, thereby providing aesthetics. .
  • the support member 243 may be disposed within the housing 210.
  • the support member 243 may extend from the third plate 218 into the housing 210 .
  • the support member 243 may support components of the electronic device 101.
  • a camera e.g., camera module 212 of FIG. 3
  • a printed circuit board e.g., the first printed circuit board 250 of FIG. 3 or the second printed circuit board 250 of FIG. Circuit board 252
  • the camera module 212 and printed circuit boards 250 and 252 may be placed at designated positions on the support member 243.
  • the support member 243 may include a groove 310.
  • the groove 310 may be recessed from one side 243a of the support member 243 toward the other side 243b of the support member 243.
  • the groove 310 may be recessed into the inside of the support member 243 from one side 243a of the support member 243 facing the first plate 202.
  • the groove 310 may be formed along the z-axis direction within the support member 243. The formation direction of the groove 310 may be parallel to the first direction and the second direction.
  • the groove 310 formed in the support member 243 may contact the vent hole 206 formed in the third plate 218.
  • At least a portion of the airflow path may be formed along the formation direction of the groove 310. Since the groove 310 is recessed into the interior of the support member 243 from one side 243a of the support member 243 (e.g., one side 243a in FIG. 5A), a ventilation space is created within the groove 310. may be formed along the direction in which the groove 310 is depressed. For example, the groove 310 may have a depth along the z-axis on the support member 243, and the ventilation space may be formed along the depth of the groove 310.
  • the ventilation space for air flowing between the inside of the housing 210 and the outside of the housing 210 is formed on the support member 243.
  • the ventilation space for air flowing between the inside of the housing 210 and the outside of the housing 210 may be limited. If the ventilation space is limited, the flow of air inside and outside the housing 210 may not be smooth.
  • the ventilation space can be expanded spatially (or three-dimensionally) from a plane.
  • the groove 310 can provide an expanded ventilation space through a simple structure. Because the groove 310 can spatially expand the ventilation space for air flowing between the inside of the housing 210 and the outside of the housing 210, the electronic device 101 according to one embodiment includes the housing 210.
  • the air pressure difference between the inside and the outside of the housing 210 can be easily resolved. For example, air circulation between the inside of the housing 210 and the outside of the housing 210 may be smoothly achieved through a spatially expanded ventilation space.
  • the structure 320 may be disposed within the groove 310.
  • the structure 320 may fill the groove 310 formed along the z-axis direction within the support member 243.
  • the structure 320 may be formed from the groove 310 in a first direction.
  • the structure 320 may be configured to provide at least a portion of an airflow path for air flowing between the inside of the housing 210 and the outside of the housing 210.
  • the structure 320 may include a through hole 324 penetrating the interior of the structure 320. Air in the groove 310 may pass through the structure 320 through the through hole 324. For example, when the air inside the housing 210 flows out of the housing 210, the structure 320 passes through the through hole 324 of the structure 320 from inside the housing 210 into the groove 310. ) and may provide at least a portion of the airflow path of the air flowing into the vent hole 206. For example, when air outside the housing 210 flows into the housing 210, the structure 320 opens the through hole 324 of the structure 320 from the vent hole 206 and the groove 310. It may provide at least a portion of an airflow path of air passing through and into the housing 210 .
  • the structure 320 may include an opening 325 that is in contact with the through hole 324 and is exposed on the side 323 of the structure 320.
  • the structure 320 may be formed along the direction in which the groove 310 extends to fill the groove 310.
  • the structure 320 may extend from the bottom surface of the groove 310 toward one surface 243a of the support member 243.
  • the support member 243 may be configured to reduce moisture flowing through the vent hole 206 from flowing into the housing 210 through the groove 310 by filling the groove 310 .
  • the opening 325 may not be formed on the side 323 facing the vent hole 206, but may be formed on the side 323 not facing the vent hole 206.
  • the electronic device 101 includes a sealant 350 for sealing between the groove 310 and the structure 320 and/or a membrane to reduce the inflow of moisture into the structure 320. (For example, the first membrane 331 in FIG. 4B and/or the second membrane 332 in FIG. 6B).
  • FIG. 5A is a cross-sectional view of the exemplary electronic device 101 taken along line A-A' of FIG. 4A.
  • 5B and 5C show an example structure 320.
  • the third plate 218 may include a vent hole 206. Air may flow from the outside of the housing 210 into the housing 210 through the vent hole 206, or may flow out from the inside of the housing 210 to the outside of the housing 210.
  • the vent hole 206 of the third plate 218 and the groove 310 of the support member 243 may contact each other.
  • the vent hole 206 is formed from one side 218-1 of the third plate 218 facing the outside of the housing 210 and the other side of the third plate 218 facing the inside of the housing 210. It can penetrate up to (218-2).
  • the groove 310 may contact an end of the vent hole 206 formed on the other side 218-2 of the third plate 218.
  • the groove 310 may be recessed from one surface 243a of the support member 243 toward the inside of the support member 243.
  • the groove 310 may be recessed in the -z direction from one surface 243a of the support member 243.
  • the structure 320 may fill the groove 310.
  • the structure 320 may be formed from the bottom surface of the groove 310 toward one surface 243a of the support member 243.
  • the structure 320 may be configured to provide at least a portion of the airflow path P for air flowing between the outside of the housing 210 and the inside of the housing 210.
  • FIG. 5B shows structure 320 viewed from vent hole 206 toward groove 310 .
  • FIG. 5C shows structure 320 viewed from groove 310 toward vent hole 206.
  • the structure 320 has a first side 321, a second side 322, a side 323 between the first side 321 and the second side 322, and It may include a through hole 324.
  • the first side 321 and the second side 322 may be opposite to each other.
  • the first surface 321 may form a surface of the structure 320 that faces a first direction (eg, +z direction).
  • the second surface 322 may form a surface of the structure 320 facing a second direction (eg, -z direction) opposite to the first direction.
  • the side surface 323 may be disposed between the first surface 321 and the second surface 322.
  • the through hole 324 may extend from the first surface 321 to the inside of the structure 320.
  • the through hole 324 may extend from the first surface 321 facing the inside of the housing 210 toward the second surface 322 .
  • the through hole 324 may contact the opening 325 formed on the side surface 323. Opening 325 may be disposed within side 323 between first side 321 and second side 322 .
  • the opening 325 is in contact with the through hole 324, thereby connecting the through hole 324 to the groove 310.
  • the opening 325 may be formed in another part 323b of the side 323 that is opposite to the part 323a facing the vent hole 206.
  • the opening 325 is formed in the other part 323b opposite to the part 323a facing the vent hole 206, so that moisture flowing into the groove 310 from the vent hole 206 flows into the structure 320. can be reduced.
  • the opening 325 is recessed from the other part 323b into the inside of the structure 320, thereby connecting the through hole 324 formed inside the structure 320 to the outside of the structure 320.
  • the through hole 324 may be connected to the groove 310 through an opening 325.
  • a waterproof member 351 may be disposed within the through hole 324.
  • the waterproof member 351 may be configured to allow air to flow through the through hole 324 and reduce the inflow of moisture.
  • the waterproof member 351 may include a porous material including a plurality of pores that allow gas to pass through and reduce moisture to pass through.
  • the waterproof member 351 may include polytetrafluoroethylene (PTFE), but is not limited thereto.
  • the vent hole 206, groove 310, and structure 320 create an airflow path P for air flowing between the inside of the housing 210 and the outside of the housing 210. can be formed. As air flows through the airflow path P, the air pressure inside the housing 210 can be maintained substantially the same as the air pressure outside the housing 210.
  • the air pressure outside the housing 210 may be higher than the air pressure inside the housing 210.
  • the atmospheric pressure outside the housing 210 may be higher than the atmospheric pressure inside the housing 210.
  • the air outside the housing 210 is blown into the housing 210 by the difference between the air pressure outside the housing 210 and the air pressure inside the housing 210. ) may enter the interior.
  • the airflow path P for air flowing from the outside of the housing 210 into the inside of the housing 210 is from the outside of the housing 210 through the vent hole 206, between the groove 310 and the structure 320, and through the opening 325. ), and may extend into the housing 210 along the through hole 324.
  • air outside the housing 210 may flow into the groove 310 through the vent hole 206 formed in the third plate 218.
  • Air introduced into the groove 310 may flow through the opening 325 between the structure 320 and the groove 310.
  • Air may flow into the through hole 324 through the opening 325 and into the housing 210 where the air pressure is relatively low along the through hole 324.
  • the air pressure inside the housing 210 may be increased to be in balance with the air pressure outside the housing 210.
  • the atmospheric pressure inside the housing 210 may be higher than the atmospheric pressure outside the housing 210.
  • the volume of those areas may decrease.
  • the reduction in volume may cause an increase in air pressure inside the housing 210.
  • the air inside the housing 210 is higher than the air pressure outside the housing 210, the air inside the housing 210 is transferred to the housing 210 by the difference between the air pressure inside the housing 210 and the air pressure outside the housing 210. ) can flow outward.
  • the airflow path P for air flowing from inside the housing 210 to the outside of the housing 210 is formed from the inside of the housing 210 through a through hole 324, an opening 325, a structure 320, and a groove 310.
  • the air inside the housing 210 may flow into the structure 320 (eg, through hole 324) through the through hole 324 formed on the first surface 321. Air introduced into the structure 320 may flow into the opening 325 along the through hole 324. Air may flow through the opening 325 and into the groove 310 .
  • the air flowing from the structure 320 to the groove 310 passes between the structure 320 and the groove 310, and passes through the vent hole 206 in contact with the groove 310, into the housing 210 having a relatively low air pressure. ) may leak outside.
  • the air pressure inside the housing 210 can be lowered to be in balance with the air pressure outside the housing 210.
  • structure 320 may provide a portion of the airflow path (P).
  • the through hole 324 extending from the first side 321 into the inside of the structure 320 and the opening 325 formed on the side 323 allow air to ventilate between the inside of the structure 320 and the groove 310. You can.
  • the structure 320 provides an airflow path (P) to resolve the difference between the air pressure inside the housing 210 and the air pressure outside the housing 210, thereby providing an electronic device ( 101) malfunction and damage can be reduced.
  • a portion of the airflow path P may be formed within the groove 310 in the direction in which the groove 310 is formed.
  • a portion of the airflow path P is in a first direction (e.g., +z direction) or a second direction (e.g., -z direction) between the side 323 of the structure 320 and the groove 310. can be formed.
  • a portion of the airflow path P may be formed in the first or second direction along the interior of the structure 320 (eg, through hole 324).
  • the portion 323a of the side 323 facing the vent hole 206 is used to shield the inside of the structure 320. Therefore, air flowing into the groove 310 from the vent hole 206 may flow between the side 323 of the structure 320 and the groove 310. Air may flow into the through hole 324 through the opening 325 within the groove 310 and into the housing 210 along the through hole 324.
  • a portion of the airflow path is within the groove 310, between the groove 310 and the side 323 of the structure 320, in a first direction (e.g., +z direction) or a second direction (e.g., -z direction) and may be formed in a first direction along the inside of the structure 320 (eg, through hole 324).
  • a first direction e.g., +z direction
  • a second direction e.g., -z direction
  • the air when air flows out from the inside of the housing 210 to the outside of the housing 210, the air may flow into the opening 325 along the through hole 324. Air may flow into the vent hole 206 between the structure 320 and the groove 310 through the opening 325, and may flow out of the housing 210 through the vent hole 206. Since the opening 325 is disposed between the first surface 321 and the second surface 322, a portion of the airflow path is inside the structure 320 (e.g., through hole 324) in the second direction. It can be formed in (e.g. +z direction).
  • the ventilation space can be expanded.
  • a portion of the ventilation space may be formed along the direction in which the groove 310 extends.
  • the ventilation space may be formed along the depth of the groove 310.
  • the electronic device 101 may include a first membrane 331 disposed on the airflow path.
  • the electronic device 101 may include a first membrane 331 disposed on the side 323 of the structure 320.
  • the first membrane 331 may be attached on the side 323 of the structure 320 via an adhesive member 340 disposed between the side 323 and the first membrane 331.
  • the first membrane 331 may be configured to reduce moisture flowing into the housing 210.
  • the first membrane 331 may be configured to allow air to pass through and to reduce the passage of moisture. For example, air may easily pass through the first membrane 331, and moisture may have difficulty passing through the first membrane 331.
  • the first membrane 331 may be configured to reduce moisture flowing into the structure 320 from the groove 310.
  • the first membrane 331 may cover at least a portion of the side surface 323.
  • the first membrane 331 may cover the through hole 324 by wrapping the opening 325 connecting the through hole 324 to the groove 310. Even if moisture flows into the groove 310 through the vent hole 206, it may be difficult for the moisture to flow into the through hole 324 due to the first membrane 331 covering the through hole 324.
  • the first membrane 331 can prevent moisture from flowing into the housing 210 by reducing moisture flowing into the through hole 324.
  • the first membrane 331 can reduce damage to the electronic device 101 caused by moisture.
  • the electronic device 101 may include an adhesive member 340 for fixing the first membrane 331.
  • the adhesive member 340 may be disposed along the side 323 of the structure 320, and the first membrane 331 may be attached to the adhesive member 340.
  • an adhesive material may be applied to the surface of the adhesive member 340, and the adhesive member 340 may be disposed between the first membrane 331 and the side surface 323.
  • the first membrane 331 may be attached to the side 323 of the structure 320 by an adhesive member 340.
  • the adhesive member 340 may be part of the structure 320 or may be an adhesive member separate from the structure 320.
  • the adhesive member 340 may be a waterproof tape, but is not limited thereto.
  • the electronic device 101 may include a sealing member 350.
  • the sealing member 350 is disposed between the groove 310 and the structure 320, thereby sealing the space between the groove 310 and the structure 320.
  • the sealing member 350 may have a ring shape.
  • the inner peripheral surface of the sealing member 350 surrounds the side 323 of the structure 320, and the outer peripheral surface of the sealing member 350 may be in contact with the groove 310.
  • the sealing member 350 may include a flexible material. The sealing member 350 can seal the space between the structure 320 and the groove 310 by being forced between the structure 320 and the groove 310.
  • the width L2 of the sealing member 350 may be larger than the width L1 of the groove 310.
  • the sealing member 350 may be inserted between the groove 310 and the structure 320 in a compressed state. In a state inserted between the groove 310 and the structure 320, the sealing member 350 expands due to a restoring force, thereby firmly sealing the space between the groove 310 and the structure 320.
  • the structure 320 may include a flange 370 for fixing the sealing member 350. The flange 370 can reduce the separation of the sealing member 350 between the structure 320 and the groove 310.
  • FIGS. 6A and 6B are cross-sectional views of the exemplary electronic device 101 taken along line A-A' of FIG. 4A.
  • Figure 6C is an exploded perspective view of an example structure 320.
  • the airflow path for air flowing between the outside of the housing 210 and the inside of the housing 210 includes a first airflow path (P1) flowing into the through hole 324 through the opening 325, and It may include a second airflow path (P2) passing through the second surface 322 of the structure 320 and flowing into the through hole 324.
  • the first airflow path P1 may be referred to as the airflow path shown in FIG. 5A (eg, the airflow path P in FIG. 5A).
  • air in the groove 310 may flow into the through hole 324 through the opening 325 and/or the end of the through hole 324.
  • the through hole 324 may extend from the first surface 321 to the second surface 322. Air introduced into the groove 310 through the vent hole 206 may flow between the structure 320 and the groove 310. The air between the structure 320 and the groove 310 may flow into the structure 320 through the through hole 324 of the second surface 322, and pass through the through hole 324 into the housing 210. ) may enter the interior.
  • the second airflow path P2 is from outside the housing 210, through the vent hole 206, between the second surface 322 and the groove 310, and along the through hole 324, through the housing ( 210) It can be extended internally.
  • Air introduced into the groove 310 may flow into the through hole 324 formed in the second surface 322 along the space between the second surface 322 and the groove 310. Air introduced into the through hole 324 may flow within the through hole 324 toward the inside of the housing 210 where the air pressure is relatively low (eg, in the first direction).
  • the air inside the housing 210 flows through the through hole 324 formed on the first side 321 of the structure ( 320) may flow inside (e.g., through hole 324).
  • Air introduced into the through hole 324 may flow in a direction from the first surface 321 to the second surface 322 (eg, the second direction) within the through hole 324.
  • the electronic device 101 may provide a first airflow path (P1) and/or a second airflow path (P2) for air between the inside of the housing 210 and the outside of the housing 210.
  • the first airflow path (P1) and the second airflow path (P2) may be independent from each other.
  • the electronic device 101 may include only a first airflow path P1, a second airflow path P2, or a first airflow path P1 and a second airflow path. It may include both (P2).
  • the first airflow path (P1) and the second airflow path (P2) provide airflow paths for air between the inside of the housing 210 and the outside of the housing 210, thereby It can enable ventilation between the two.
  • the electronic device 101 may include a waterproof tape 380 for sealing between the groove 310 and the structure 320.
  • the waterproof tape 380 may be disposed between the structure 320 and the third plate 218 and/or between the structure 320 and the support member 243.
  • the third plate 218 may include a first step 218-3 to support a portion of the flange 370.
  • the support member 243 may include a second step 243-1 to support another part of the flange 370.
  • the waterproof tape 380 may be disposed between the first step 218-3 and the flange 370 and/or between the second step 243-1 and the flange 370.
  • One side of the waterproof tape 380 (e.g., the side facing the +z direction) may be attached to the flange 370, and the other side of the waterproof tape 380 (e.g., the side facing the -z direction) may be, It may be attached to the first step portion 218-3 and the second step portion 243-1.
  • the waterproof tape 380 seals between the groove 310 and the structure 320, thereby reducing moisture flowing into the housing 210 through the groove 310 and the structure 320. You can.
  • the waterproof tape 380 has high adhesion to the flange 370, the first step 218-3, and the second step 243-1, and may include a material with high waterproofing properties.
  • the electronic device 101 is shown as including a sealing member 350
  • the electronic device 101 is shown as including a waterproof tape 380, but is limited thereto. It doesn't work.
  • the electronic device 101 may include both the sealing member 350 and the waterproof tape 380, or may include either the sealing member 350 or the waterproof tape 380.
  • the electronic device 101 may include a second membrane 332 disposed on the second airflow path.
  • the electronic device 101 may include a second membrane 332 disposed between the second surface 322 and the groove 310.
  • the second membrane 332 may be attached to the second side 322 through an adhesive member 341 disposed between the second side 322 and the second membrane 332 .
  • the second membrane 332 may be configured to reduce moisture flowing into the housing 210.
  • the second membrane 332 may be configured to allow air to pass through and to reduce the passage of moisture. For example, air may easily pass through the second membrane 332, and moisture may have difficulty passing through the second membrane 332.
  • the second membrane 332 may be configured to reduce moisture flowing into the structure 320 from the through hole 324 extending to the second surface 322.
  • the second membrane 332 may cover at least a portion of the second surface 322.
  • the second membrane 332 may surround the through hole 324 formed in the second surface 322.
  • the through hole 324 extending to the second side 322 is formed by the second membrane 332. It can be shielded. Even if moisture flows into the groove 310 through the vent hole 206, it may be difficult for moisture to flow into the through hole 324 due to the second membrane 332 covering the second surface 322.
  • the second membrane 332 can prevent moisture from flowing into the housing 210 by reducing moisture flowing into the through hole 324 extending to the second surface 322. According to one embodiment, the second membrane 332 can reduce damage to the electronic device 101 due to moisture. According to one embodiment, the first membrane 331 can reduce moisture flowing in along the first airflow path (P1), and the second membrane 332 can reduce moisture flowing in along the second airflow path (P2). It can reduce moisture.
  • the groove 310 and the structure 320 can provide an expanded ventilation space for ventilation between the inside of the housing 210 and the outside of the housing 210, and reduce moisture flowing through the ventilation space, thereby reducing the amount of moisture flowing into the housing 210. The waterproof performance of the device 101 can be improved.
  • FIG. 7A shows an example electronic device 101.
  • FIG. 7B is a cross-sectional view of the exemplary electronic device 101 taken along line B-B' of FIG. 7A.
  • the third plate 218 may include a first edge 218a, a second edge 218b, a third edge 218c, and a fourth edge 218d.
  • the first edge 218a and the second edge 218b may be parallel to each other.
  • the first edge 218a may form an edge disposed in the +y direction of the housing 210.
  • the second edge 218b may form an edge disposed in the -y direction of the housing 210.
  • the third edge 218c and the fourth edge 218d may be parallel to each other.
  • the third edge 218c may form an edge disposed in the +x direction of the housing 210.
  • the fourth edge 218d may form an edge disposed in the -x direction of the housing 210.
  • the third edge 218c and the fourth edge 218d may be perpendicular to the first edge 218a and the second edge 218b.
  • the third edge 218c may extend from one end 218a-1 of the first edge 218a to one end 218b-1 of the second edge 218b.
  • the fourth edge 218d extends from the other end 218a-2 opposite to the one end 218a-1 of the first edge 218a, to the one end 218b-1 of the second edge 218b. It can be extended to the other end (218b-2) opposite to.
  • the housing 210 may have a roughly rectangular shape.
  • the length of the housing 210 in the y-axis direction may be longer than the length of the housing 210 in the x-axis direction.
  • the length of the third edge 218c and the fourth edge 218d may be longer than the length of the first edge 218a and the second edge 218b.
  • the electronic device 101 may further include a camera 212.
  • Camera 212 may be placed within housing 210 .
  • the camera 212 may be disposed within the housing 210 closer to the first edge 218a of the first edge 218a and the second edge 218b.
  • the camera 212 may be spaced apart in one direction (e.g., +y direction) based on an imaginary line passing through the centers of the relatively long third edge 218c and fourth edge 218d. there is.
  • the vent hole 206 may be placed in an edge opposite to the edge adjacent to the camera 212.
  • the vent hole 206 may be disposed on the second edge 218b among the first edge 218a and the second edge 218b.
  • the vent hole 206 may be disposed on the second edge 218b parallel to the first edge 218a adjacent to the camera 212.
  • the vent hole 206 may be disposed within an edge located in another direction (eg, -y direction) opposite to the one direction, based on the virtual line.
  • the groove 310 may be disposed closer to the second edge 218b among the first edge 218a and the second edge 218b in order to contact the vent hole 206.
  • the groove 310 is formed due to the placement space of the camera 212. It can be formed without limitation. Since the groove 310 can be formed to have a thickness within the support member 243, it can provide sufficient ventilation space.
  • the structure 320 may include a guide 360.
  • the guide 360 may be formed on the side 323 of the structure 320 facing the vent hole 206.
  • the guide 360 may be formed in a direction toward the vent hole 206, on the side 323 of the structure 320 facing the vent hole 206.
  • a fluid to be introduced into the groove 310 through the vent hole 206 or an object inserted into the vent hole 206 may face the guide 360 when it flows into the groove 310 from the vent hole 206. there is.
  • the guide 360 may disperse the fluid L introduced through the vent hole 206 and reduce the speed of the fluid L (eg, air or moisture).
  • the fluid L flowing into the groove 310 through the vent hole 206 may be dispersed into the groove 310 by the guide 360.
  • air may flow into the through hole 324 along the first membrane 331 attached to the outside of the structure 320 through the adhesive member 340.
  • moisture flowing into the groove 310 through the vent hole 206 may collide with the guide 360 and be slowed down.
  • the guide 360 can prevent damage to the vent hole 206 and the groove 310 by dispersing the fluid L and reducing the speed of the fluid L.
  • the guide 360 can reduce damage to the groove 310 by an object inserted through the vent hole 206.
  • the groove 310 may be damaged by a rod-shaped object inserted into the vent hole 206.
  • the guide 360 may prevent insertion of the object. Since the object is difficult to be inserted into the groove 310 while in contact with the guide 360, the guide 360 can reduce damage to the groove 310 due to collision between the object and the groove 310.
  • An electronic device (e.g., electronic device 101 in FIG. 4a) according to an embodiment includes a housing (e.g., housing 210 in FIG. 4a), a support member (e.g., support member 243 in FIG. 4a), and It may include a structure (e.g., structure 320 in FIG. 4A).
  • the housing includes a first plate (e.g., the first plate 202 in FIG. 2), a second plate (e.g., the second plate 211 in FIG. 2), and a third plate (e.g., the third plate in FIG. 4A). It may include a plate 218).
  • the first plate may face a first direction (eg, +z direction in FIG. 4A).
  • the second plate may face a second direction opposite to the first direction (eg, -z direction in FIG. 4A).
  • the third plate may include a vent hole (eg, the vent hole 206 in FIG. 4A).
  • the third plate may be positioned between the first plate and the second plate.
  • the support member may extend from the third plate into the housing.
  • the support member may include a groove (eg, groove 310 in FIG. 4A).
  • the groove may be recessed into the interior of the support member from one side facing the first plate.
  • the groove may contact the vent hole.
  • the structure may fill the groove.
  • the structure may be formed from the groove in the first direction.
  • the structure may be configured to provide at least a portion of an airflow path for air flowing between the exterior of the housing and the interior of the housing.
  • the groove may provide a ventilation space for ventilation of the housing. Since the groove can have depth by being depressed from one side of the support member toward the inside of the support member, the ventilation space can be spatially expanded.
  • the electronic device according to one embodiment can easily resolve the air pressure difference between the inside of the housing and the outside of the housing by securing a ventilation space. For example, air circulation between the inside of the housing and the outside of the housing can be smoothly achieved through a spatially expanded ventilation space.
  • the structure may be configured to reduce moisture flowing into the vent hole from being transferred into the housing by shielding an end of the vent hole that is in contact with the groove.
  • the groove since the groove may have depth, moisture may flow in through the groove.
  • the structure may be configured to reduce moisture entering the interior of the housing by filling the grooves.
  • the end of the vent hole may be shielded by a structure. Even if moisture flows into the vent hole, it may be difficult to flow into the groove due to the structure.
  • the structure has a first side (e.g., the first side 321 in FIG. 5B), a second side (e.g., the second side 322 in FIG. 5b), and a through hole (e.g., FIG. It may include a through hole 324 in 5b) and a side surface (e.g., side 323 in FIG. 5b).
  • the first surface may face the first direction.
  • the second side may be opposite to the first side.
  • the through hole may extend from the first surface into the interior of the structure.
  • the side surface may be located between the first surface and the second surface.
  • the side surface may include an opening (eg, opening 325 in FIG. 5C) that contacts the through hole.
  • the airflow path includes a first airflow path extending inside the housing, from outside the housing, along the vent hole, between the structure and the groove, along the opening, and the through hole (e.g. It may include an airflow path (P) in FIG. 5A).
  • the opening is located on another part of the side (e.g., other part 323b in FIG. 5A), opposite the part of the side facing the vent hole (e.g., part 323a in FIG. 5A). )) can be formed.
  • the structure may provide at least a portion of an airflow path for air between the interior of the housing and the exterior of the housing. For example, when the air pressure inside the housing is lower than the air pressure outside the housing, air outside the housing may flow into the groove through the vent hole. The air in the groove may flow through the opening into the through hole and then flow into the interior of the housing along the through hole.
  • the structure may be configured to provide a first airflow path to equalize the air pressure inside and outside the housing.
  • the through hole may extend from the first surface to the second surface.
  • the airflow path may include a second airflow path extending from outside the housing, into the interior of the housing, along the vent hole, between the second face and the groove, and along the through hole (e.g., the second airflow path in FIG. 6A ). (P2)) may be included.
  • the structure may be configured to provide a first airflow path and/or a second airflow path. A portion of the second airflow path may be formed along between the groove and the second surface. The first airflow path and the second airflow path may enable ventilation between the housing interior and the housing exterior by providing an airflow path for air between the housing interior and the housing exterior.
  • the electronic device may further include a membrane (eg, the second membrane in FIG. 6C).
  • the membrane may be positioned between the second side and the groove.
  • the membrane may be configured to reduce moisture flowing into the structure from the through hole extending to the second surface.
  • the second membrane can reduce moisture flowing in along the second airflow path.
  • the electronic device may further include a membrane (eg, the first membrane in FIG. 4B).
  • the membrane may cover at least a portion of the side of the structure.
  • the membrane may be configured to reduce moisture flowing into the structure from the groove.
  • the electronic device may further include an adhesive member (eg, the adhesive member 340 of FIG. 5A).
  • the adhesive member may be positioned between the membrane and the side of the structure.
  • the adhesive member may attach the membrane to the side of the structure.
  • the membrane may cover the through hole by wrapping the opening.
  • the first membrane can reduce moisture flowing in along the first airflow path.
  • the electronic device may further include a sealing member (eg, the sealing member 350 of FIG. 4B).
  • the sealing member may be disposed within the groove, between the groove and the structure, and seal the space between the groove and the structure.
  • the sealing member can reduce moisture flowing in between the groove and the structure by sealing the space between the groove and the structure.
  • the sealing member can reduce moisture flowing into the housing from between the groove and the membrane disposed on the outside of the structure.
  • a portion of the airflow path may be formed in the first direction or the second direction within the groove, between a side of the structure and the groove, and along an interior of the structure.
  • a path for air flowing between the outside of the housing and the inside of the housing may be provided along the direction in which the groove is formed.
  • an airflow path can be formed along the above direction, so that the ventilation space can be expanded spatially.
  • the structure may include a guide (eg, guide 370 in FIG. 7B) formed on a side of the structure facing the vent hole.
  • the guide can disperse the fluid flowing in through the vent hole and reduce the speed of the fluid. For example, moisture or air that passes through the vent hole and flows into the groove may be dispersed into the groove by the guide. For example, moisture or air that passes through the vent hole and flows into the groove may be slowed down by colliding with the guide.
  • the guide can prevent damage to vent holes and grooves by dispersing the fluid and reducing the velocity of the fluid.
  • another electronic device may further include a camera (eg, camera 212 in FIG. 7A).
  • the camera may be placed within the housing.
  • the third plate has a first edge (e.g., the first edge 218a in FIG. 7A), a second edge (e.g., the second edge 218b in FIG. 7A), and a third edge (e.g., the first edge 218a in FIG. 7A). 3 edge 218c), and a fourth edge (eg, the fourth edge 218d in FIG. 7A).
  • the second edge may be parallel to the first edge.
  • the third edge may be longer than the first edge and the second edge.
  • the third edge may extend from one end of the first edge to one end of the second edge.
  • the fourth edge may extend from the other end of the first edge to the other end of the second edge.
  • the fourth edge may be parallel to the third edge.
  • the camera may be disposed closer to the first edge among the first edge and the second edge.
  • the vent hole may be disposed on the second edge among the first edge and the second edge. According to one embodiment of the present disclosure, because the vent hole is disposed in an edge opposite to the edge adjacent to the camera, the groove can be formed without limitation due to the placement space of the camera. Since the groove can be formed to have a thickness within the support member, it can provide sufficient ventilation space.
  • the third plate may include a microphone hole (eg, microphone hole 203 in FIG. 4A) and a connector hole (eg, connector hole 208 in FIG. 4A).
  • the connector hole may be disposed between the microphone hole and the vent hole.
  • the connector hole may be connected to a connector of an external electronic device.
  • the distance from the microphone hole to the connector hole may be equal to the distance from the vent hole to the connector hole.
  • the third plate may provide aesthetics by including a microphone hole and a vent hole symmetrically arranged with the connector hole in the center.
  • An electronic device may include a housing, a support member, and a structure.
  • the housing may include a first plate, a second plate, and a third plate.
  • the first plate may face a first direction.
  • the second plate may face a second direction opposite to the first direction.
  • the third plate may include a vent hole.
  • the third plate may be disposed between the first plate and the second plate.
  • the support member may extend from the third plate into the housing.
  • the support member may include a groove.
  • the groove may be recessed into the inside of the support member from one side facing the first plate.
  • the groove may contact the vent hole.
  • the structure may fill the groove.
  • the structure may be configured to provide at least a portion of an airflow path for air flowing between the exterior of the housing and the interior of the housing.
  • the structure may be configured to reduce moisture flowing into the vent hole from being transferred into the housing by shielding an end of the vent hole that is in contact with the groove.
  • the structure may include a first side, a second side, a through hole, and a side surface.
  • the first surface may face the first direction.
  • the second side may be opposite to the first side.
  • the through hole may extend from the first surface into the interior of the structure.
  • the side surface may be disposed between the first surface and the second surface.
  • the side surface may include an opening in contact with the through hole.
  • the airflow path may include a first airflow path extending from outside the housing into the housing, along the vent hole, between the structure and the groove, the opening, and the through hole.
  • the through hole may extend from the first surface to the second surface.
  • the airflow path may include a second airflow path extending from the exterior of the housing into the housing, along the vent hole, between the second surface and the groove, and along the through hole.
  • the structure may be configured to provide a first airflow path and/or a second airflow path. A portion of the second airflow path may be formed along between the groove and the second surface. The first airflow path and the second airflow path may enable ventilation between the housing interior and the housing exterior by providing an airflow path for air between the housing interior and the housing exterior.
  • the electronic device may further include a membrane (eg, the first membrane in FIG. 4B).
  • the membrane may cover at least a portion of the side of the structure.
  • the membrane may be configured to reduce moisture flowing into the structure from the groove.
  • the electronic device may further include a sealing member.
  • the sealing member may be disposed within the groove, between the groove and the structure, and seal the space between the groove and the structure. According to an embodiment of the present disclosure, the sealing member can reduce moisture flowing in between the groove and the structure by sealing the space between the groove and the structure.
  • Electronic devices may be of various types.
  • Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances.
  • Electronic devices according to embodiments of this document are not limited to the above-described devices.
  • first, second, or first or second may be used simply to distinguish one element from another, and may be used to distinguish such elements in other respects, such as importance or order) is not limited.
  • One (e.g. first) component is said to be “coupled” or “connected” to another (e.g. second) component, with or without the terms “functionally” or “communicatively”.
  • any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. It can be used as A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Various embodiments of the present document are one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140) including these.
  • the processor 120 e.g., processor 120
  • the device e.g., electronic device 101
  • the one or more instructions may include code generated by a compiler or code that can be executed by an interpreter.
  • a storage medium that can be read by a device may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves). This term refers to cases where data is stored semi-permanently in the storage medium. There is no distinction between temporary storage cases.
  • Computer program products are commodities and can be traded between sellers and buyers.
  • the computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or through an application store (e.g. Play StoreTM) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online.
  • a machine-readable storage medium e.g. compact disc read only memory (CD-ROM)
  • an application store e.g. Play StoreTM
  • two user devices e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online.
  • at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory 130 of a manufacturer's server, an application store's server, or a relay server. there is.
  • each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately placed in other components. there is.
  • one or more of the components or operations described above may be omitted, or one or more other components or operations may be added.
  • multiple components eg, modules or programs
  • the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component of the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, or omitted. Alternatively, one or more other operations may be added.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Studio Devices (AREA)

Abstract

Un dispositif électronique selon un mode de réalisation comprend : un boîtier qui comprend une première plaque faisant face à une première direction, une deuxième plaque faisant face à une seconde direction opposée à la première direction, et une troisième plaque disposée entre les première et deuxième plaques et comprenant un trou d'évent ; un élément de support qui comprend une rainure évidée à partir d'une surface de celui-ci faisant face à la première plaque dans l'élément de support et adjacente au trou d'évent, et s'étend à partir de la troisième plaque dans le boîtier ; et une structure qui remplit la rainure et est formée dans la première direction à partir de la rainure. La structure est configurée pour fournir au moins une partie d'un trajet d'écoulement d'air pour l'air s'écoulant entre l'extérieur et l'intérieur du boîtier. L'invention permet aussi divers autres modes de réalisation.
PCT/KR2023/003597 2022-11-02 2023-03-17 Dispositif électronique comprenant un trou d'évent WO2024096201A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20220144816 2022-11-02
KR10-2022-0144816 2022-11-02
KR10-2022-0154032 2022-11-16
KR1020220154032A KR20240062855A (ko) 2022-11-02 2022-11-16 벤트 홀을 포함하는 전자 장치

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WO2024096201A1 true WO2024096201A1 (fr) 2024-05-10

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002353675A (ja) * 2001-05-25 2002-12-06 Denso Corp 電子制御ユニットの筐体構造
JP2009010234A (ja) * 2007-06-28 2009-01-15 Kenwood Corp 内圧調整防水構造
KR20210079657A (ko) * 2019-12-20 2021-06-30 삼성전자주식회사 통기 및 방수 구조를 포함하는 웨어러블 전자 장치
KR20210097335A (ko) * 2020-01-30 2021-08-09 삼성전자주식회사 에어 벤트를 포함하는 전자 장치
KR20220101538A (ko) * 2021-01-11 2022-07-19 삼성전자주식회사 방수 구조를 포함하는 전자 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002353675A (ja) * 2001-05-25 2002-12-06 Denso Corp 電子制御ユニットの筐体構造
JP2009010234A (ja) * 2007-06-28 2009-01-15 Kenwood Corp 内圧調整防水構造
KR20210079657A (ko) * 2019-12-20 2021-06-30 삼성전자주식회사 통기 및 방수 구조를 포함하는 웨어러블 전자 장치
KR20210097335A (ko) * 2020-01-30 2021-08-09 삼성전자주식회사 에어 벤트를 포함하는 전자 장치
KR20220101538A (ko) * 2021-01-11 2022-07-19 삼성전자주식회사 방수 구조를 포함하는 전자 장치

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