WO2024101586A1 - Dispositif électronique comprenant une structure isolante pour haut-parleur - Google Patents

Dispositif électronique comprenant une structure isolante pour haut-parleur Download PDF

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Publication number
WO2024101586A1
WO2024101586A1 PCT/KR2023/010694 KR2023010694W WO2024101586A1 WO 2024101586 A1 WO2024101586 A1 WO 2024101586A1 KR 2023010694 W KR2023010694 W KR 2023010694W WO 2024101586 A1 WO2024101586 A1 WO 2024101586A1
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WO
WIPO (PCT)
Prior art keywords
speaker
heat dissipation
electronic device
support member
enclosure
Prior art date
Application number
PCT/KR2023/010694
Other languages
English (en)
Korean (ko)
Inventor
백인철
박정식
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020220173159A external-priority patent/KR20240067755A/ko
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to US18/365,434 priority Critical patent/US20240155274A1/en
Publication of WO2024101586A1 publication Critical patent/WO2024101586A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details

Definitions

  • This disclosure relates to an electronic device including an insulating structure for a speaker.
  • the electronic device may include a speaker to provide audio signals to the user.
  • a speaker can provide auditory information to a user by being configured to output an audio signal. As a speaker operates within an electronic device, heat may be generated from the speaker.
  • an electronic device may include a housing including a first surface on which a display is disposed, and a second surface opposite to the first surface.
  • the electronic device may include a third side facing the first side, a fourth side facing the second side and including a yoke, and a speaker configured to output audio.
  • the electronic device may include a heat dissipation portion that faces the fourth side of the speaker and includes a heat-conducting material spaced apart from the fourth side, and may include an enclosure that surrounds at least a portion of the speaker.
  • the electronic device includes a first part disposed on the fourth side of the speaker, a second part facing the heat dissipation part, and a third part connecting the first part and the second part. It may include a support member between the fourth side of the speaker and the enclosure. The area of the first part disposed on the fourth surface may be larger than the area of the second part facing the heat dissipation part.
  • an electronic device may include a housing including a first side and a second side opposite the first side.
  • the electronic device may include a third side facing the first side and a fourth side facing the second side, and may include a speaker configured to output audio.
  • the electronic device may include a heat dissipation portion made of metal that faces the fourth side of the speaker and is spaced apart from the fourth side, and may include an enclosure surrounding at least a portion of the speaker.
  • the electronic device includes a first part disposed on the fourth side of the speaker, a second part facing the heat dissipation part, and a third part connecting the first part and the second part. It may include a support member between the fourth side of the speaker and the enclosure.
  • the area of the first part disposed on the fourth surface may be larger than the area of the second part facing the heat dissipation part.
  • the third portion of the support member may include at least one air gap configured to pass air within the enclosure to reduce heat transfer from the first portion to the third portion. there is.
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment 100 according to an embodiment.
  • FIG. 2 is a diagram illustrating an electronic device according to an embodiment.
  • Figure 3 is an exploded perspective view of an electronic device according to an embodiment.
  • 4A is a partially exploded perspective view of an example electronic device.
  • 4B shows the internal structure of an example electronic device.
  • FIG. 5 is a cross-sectional view of an example electronic device along line A-A' in FIG. 4B.
  • 6A, 6B, and 6C illustrate support members for a speaker of an example electronic device.
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment 100, according to one embodiment.
  • the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • a first network 198 e.g., a short-range wireless communication network
  • a second network 199 e.g., a long-distance wireless communication network.
  • the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197.
  • at least one of these components eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101.
  • some of these components e.g., sensor module 176, camera module 180, or antenna module 197) are combined into one component (e.g., display module 160). can be integrated.
  • the processor 120 for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • software e.g., program 140
  • the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132.
  • the commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • the processor 120 includes a main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor).
  • a main processor 121 e.g., a central processing unit or an application processor
  • auxiliary processor 123 e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor.
  • the electronic device 101 includes a main processor 121 and a secondary processor 123
  • the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can.
  • the auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.
  • the auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled.
  • co-processor 123 e.g., image signal processor or communication processor
  • may be implemented as part of another functionally related component e.g., camera module 180 or communication module 190. there is.
  • the auxiliary processor 123 may include a hardware structure specialized for processing artificial intelligence models.
  • Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself, where artificial intelligence is performed, or may be performed through a separate server (e.g., server 108).
  • Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited.
  • An artificial intelligence model may include multiple artificial neural network layers.
  • Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above.
  • artificial intelligence models may additionally or alternatively include software structures.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto.
  • Memory 130 may include volatile memory 132 or non-volatile memory 134.
  • the program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.
  • the input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user).
  • the input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).
  • the sound output module 155 may output sound signals to the outside of the electronic device 101.
  • the sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback.
  • the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.
  • the display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user).
  • the display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device.
  • the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.
  • the audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).
  • the electronic device 102 e.g., speaker or headphone
  • the sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do.
  • the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.
  • the interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card interface
  • audio interface audio interface
  • connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 can capture still images and moving images.
  • the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 can manage power supplied to the electronic device 101.
  • the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101.
  • the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
  • Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication.
  • processor 120 e.g., an application processor
  • the communication module 190 may be a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included.
  • a wireless communication module 192 e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 e.g., : LAN (local area network) communication module, or power line communication module
  • the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network
  • the wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 to communicate within a communication network such as the first network 198 or the second network 199.
  • subscriber information e.g., International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology).
  • NR access technology provides high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access to multiple terminals (massive machine type communications (mMTC)), or ultra-reliable and low-latency (URLLC). -latency communications)) can be supported.
  • the wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates.
  • the wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing.
  • MIMO massive array multiple-input and multiple-output
  • the wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC.
  • Peak data rate e.g., 20 Gbps or more
  • loss coverage e.g., 164 dB or less
  • U-plane latency e.g., 164 dB or less
  • the antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device).
  • the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB).
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is, for example, connected to the plurality of antennas by the communication module 190. can be selected. Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna.
  • other components eg, radio frequency integrated circuit (RFIC) may be additionally formed as part of the antenna module 197.
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to one side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band), and It may include a plurality of antennas (e.g., array antennas) disposed on or adjacent to another side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.
  • a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to one side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band), and It may include a plurality of antennas (e.g., array antennas) disposed on or adjacent to another side (e.g., top or side) of the printed circuit board
  • peripheral devices e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • signal e.g. commands or data
  • commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199.
  • Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101.
  • all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108.
  • the electronic device 101 may perform the function or service instead of executing the function or service on its own.
  • one or more external electronic devices may be requested to perform at least part of the function or service.
  • One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101.
  • the electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request.
  • cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology can be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of Things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or server 108 may be included in the second network 199.
  • the electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.
  • FIG. 2 is a diagram illustrating an electronic device according to an embodiment.
  • the electronic device 101 may include a housing 210 that forms the exterior of the electronic device 101.
  • housing 210 may include a first side 200A, a second side 200B, and a side 200C surrounding the space between the first side 200A and the second side 200B. there is.
  • the housing 210 may refer to a structure that forms at least a portion of the first surface 200A, the second surface 200B, and/or the side surfaces 200C.
  • the electronic device 101 may include a substantially transparent front plate 202.
  • the front plate 202 may form at least a portion of the first surface 200A.
  • the front plate 202 may include, for example, a glass plate including various coating layers, or a polymer plate, but is not limited thereto.
  • the electronic device 101 may include a substantially opaque rear plate 211.
  • the rear plate 211 may form at least a portion of the second surface 200B.
  • the back plate 211 is formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. It can be.
  • the electronic device 101 may include a side structure (or side member) 218.
  • the side structure 218 may be combined with the front plate 202 and/or the back plate 211 to form at least a portion of the side surface 200C of the electronic device 101.
  • side structure 218 may entirely form side 200C of electronic device 101, or in other examples, side structure 218 may form front plate 202 and/or back plate 211. ) may form the side 200C of the electronic device 101.
  • the front plate 202 and/or the rear plate may include a region that is curved from its edge toward the rear plate 211 and/or the front plate 202 and extends seamlessly.
  • the extended area of the front plate 202 and/or the back plate 211 may be, for example, located at both ends of a long edge of the electronic device 101, but according to the above-described example, It is not limited.
  • side structure 218 may include metal and/or polymer.
  • the back plate 211 and the side structure 218 may be formed integrally and may include the same material (eg, a metal material such as aluminum), but are not limited thereto.
  • back plate 211 and side structure 218 may be formed of separate construction and/or may include different materials.
  • the electronic device 101 includes a display 201, an audio module 203, 204, and 207, a sensor module (not shown), a camera module 205, 212, and 213, and a key input device 217. , a light emitting device (not shown), and/or a connector hole 208 may be included. According to one embodiment, the electronic device 101 may omit at least one of the above components (e.g., key input device 217 or a light emitting device (not shown)) or may additionally include other components. .
  • the display 201 may be visually exposed through a significant portion of the front plate 202. For example, at least a portion of display 201 may be visible through front plate 202 forming first side 200A. According to one embodiment, the display 201 may be disposed on the back of the front plate 202.
  • the outer shape of the display 201 may be substantially the same as the outer shape of the front plate 202 adjacent to the display 201. According to one embodiment, in order to expand the area to which the display 201 is visually exposed, the distance between the outer edge of the display 201 and the outer edge of the front plate 202 may be formed to be substantially the same.
  • the display 201 (or the first side 200A of the electronic device 101) may include a screen display area 201A.
  • the display 201 may provide visual information to the user through the screen display area 201A.
  • the screen display area 201A is shown to be located inside the first side 200A and spaced apart from the outer edge of the first side 200A.
  • the first side 200A is viewed from the front, at least a portion of an edge of the screen display area 201A substantially coincides with an edge of the first side 200A (or the front plate 202). It could be.
  • the screen display area 201A may include a sensing area 201B configured to obtain biometric information of the user.
  • the meaning of “the screen display area 201A includes the sensing area 201B” can be understood as at least a portion of the sensing area 201B being overlapped with the screen display area 201A.
  • the sensing area 201B like other areas of the screen display area 201A, can display visual information by the display 201 and can additionally acquire the user's biometric information (e.g., fingerprint). It can mean area.
  • the sensing area 201B may be formed in the key input device 217.
  • the display 201 may include an area where the first camera 205 is located.
  • an opening is formed in the area of the display 201, and a first camera 205 (e.g., a punch hole camera) is at least partially disposed within the opening to face the first surface 200A.
  • the screen display area 201A may surround at least a portion of the edge of the opening.
  • the first camera 205 eg, under display camera (UDC)
  • UDC under display camera
  • the display 201 can provide visual information to the user through the area, and additionally, the first camera 205 corresponds to the direction toward the first side 200A through the area of the display 201. An image can be obtained.
  • the display 201 may be combined with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of touch, and/or a digitizer that detects a magnetic field-type stylus pen. there is.
  • the audio modules 203, 204, and 207 may include microphone holes 203 and 204 and speaker holes 207.
  • the microphone holes 203 and 204 include a first microphone hole 203 formed in a partial area of the side 200C and a second microphone hole 204 formed in a partial area of the second side 200B. It can be included. Microphones (not shown) may be placed inside the microphone holes 203 and 204 to acquire external sounds. The microphone may include a plurality of microphones to detect the direction of sound.
  • the second microphone hole 204 formed in a partial area of the second surface 200B may be arranged adjacent to the camera modules 205, 212, and 213.
  • the second microphone hole 204 may acquire sound according to the operation of the camera modules 205, 212, and 213.
  • the speaker hole 207 may include an external speaker hole 207 and a receiver hole (not shown) for a call.
  • the external speaker hole 207 may be formed on a portion of the side 200C of the electronic device 101.
  • the external speaker hole 207 may be implemented as one hole with the microphone hole 203.
  • a receiver hole (not shown) for a call may be formed in another part of the side 200C.
  • the receiver hole for a call may be formed on the side opposite to the external speaker hole 207 on the side 200C. For example, based on the illustration in FIG.
  • the external speaker hole 207 is formed on the side 200C corresponding to the lower part of the electronic device 101, and the receiver hole for calls is formed on the upper part of the electronic device 101. It may be formed on the corresponding side (200C). However, it is not limited to this, and according to one embodiment, the call receiver hole may be formed in a location other than the side (200C). For example, a receiver hole for a call may be formed by a spaced space between the front plate 202 (or display 201) and the side structure 218.
  • the electronic device 101 includes at least one speaker (not shown) configured to output sound to the outside of the housing through the external speaker hole 207 and/or the call receiver hole (not shown). It can be included.
  • a sensor module may generate an electrical signal or data value corresponding to the internal operating state of the electronic device 101 or the external environmental state.
  • the sensor module may include a proximity sensor, HRM sensor, fingerprint sensor, gesture sensor, gyro sensor, barometric pressure sensor, magnetic sensor, acceleration sensor, grip sensor, color sensor, IR (infrared) sensor, biometric sensor, temperature sensor, It may include at least one of a humidity sensor or an illuminance sensor.
  • the camera modules 205, 212, and 213 include the first camera 205 arranged to face the first side 200A of the electronic device 101, and the camera module 205 to face the second side 200B. It may include a second camera 212 and a flash 213 that are disposed.
  • the second camera 212 may include a plurality of cameras (eg, a dual camera, a triple camera, or a quad camera).
  • the second camera 212 is not necessarily limited to including a plurality of cameras and may include one camera.
  • the first camera 205 and the second camera 212 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash 213 may include, for example, a light emitting diode or a xenon lamp.
  • two or more lenses an infrared camera, a wide-angle lens, and a telephoto lens
  • image sensors may be disposed on one side of the electronic device 101.
  • the key input device 217 may be placed on the side 200C of the electronic device 101.
  • the electronic device 101 may not include some or all of the key input devices 217, and the key input devices 217 that are not included may be other than soft keys on the display 201. It can be implemented in the form
  • the connector hole 208 may be formed on the side 200C of the electronic device 101 to accommodate a connector of an external device.
  • a connection terminal electrically connected to a connector of an external device may be disposed within the connector hole 208.
  • the electronic device 101 may include an interface module for processing electrical signals transmitted and received through the connection terminal.
  • the electronic device 101 may include a light emitting device (not shown).
  • the light emitting device (not shown) may be disposed on the first side 200A of the housing.
  • the light emitting device (not shown) may provide status information of the electronic device 101 in the form of light.
  • the light emitting device (not shown) may provide a light source linked to the operation of the first camera 205.
  • the light emitting device (not shown) may include an LED, an IR LED, and/or a xenon lamp.
  • Figure 3 is an exploded perspective view of an electronic device according to an embodiment.
  • the electronic device 101 includes a frame structure 240, a first printed circuit board 250, a second printed circuit board 252, a cover plate 260, and a battery. It may include (270).
  • the frame structure 240 includes a side wall 241 that forms the exterior of the electronic device 101 (e.g., the side 200C in FIG. 2) and a support extending inward from the side wall 241. It may include part 243. According to one embodiment, the frame structure 240 may be disposed between the display 201 and the back plate 211. According to one embodiment, the side walls 241 of the frame structure 240 may surround the space between the back plate 211 and the front plate 202 (and/or the display 201), and the frame structure 240 ) The support portion 243 may extend from the side wall 241 within the space.
  • the frame structure 240 may support or accommodate other components included in the electronic device 101.
  • the display 201 may be disposed on one side of the frame structure 240 facing in one direction (e.g., +z direction), and the display 201 may be disposed on the support portion 243 of the frame structure 240. It can be supported by .
  • a first printed circuit board 250, a second printed circuit board 252, and a battery 270 are disposed on the other side of the frame structure 240 facing in a direction opposite to the one direction (e.g., -z direction).
  • the second camera 212 may be disposed.
  • the first printed circuit board 250, the second printed circuit board 252, the battery 270 and the second camera 212 are supported by the side wall 241 and/or the support portion 243 of the frame structure 240. Each can be seated in a defined recess.
  • the first printed circuit board 250, the second printed circuit board 252, and the battery 270 may each be combined with the frame structure 240.
  • the first printed circuit board 250 and the second printed circuit board 252 may be fixed to the frame structure 240 through a coupling member such as a screw.
  • the battery 270 may be fixed to the frame structure 240 through an adhesive member (eg, double-sided tape).
  • an adhesive member eg, double-sided tape
  • the cover plate 260 may be disposed between the first printed circuit board 250 and the back plate 211. According to one embodiment, a cover plate 260 may be disposed on the first printed circuit board 250. For example, the cover plate 260 may be disposed on a side of the first printed circuit board 250 facing the -z direction.
  • the cover plate 260 may at least partially overlap the first printed circuit board 250 with respect to the z-axis. According to one embodiment, the cover plate 260 may cover at least a partial area of the first printed circuit board 250. Through this, the cover plate 260 can protect the first printed circuit board 250 from physical shock, or prevent and/or reduce separation of the connector coupled to the first printed circuit board 250.
  • the cover plate 260 is fixedly disposed on the first printed circuit board 250 through a coupling member (e.g., a screw), or is connected to the first printed circuit board 250 through the coupling member. Together they may be coupled into a frame structure 240.
  • a coupling member e.g., a screw
  • display 201 may be disposed between frame structure 240 and front plate 202.
  • the front plate 202 may be disposed on one side (e.g., +z direction) of the display 201, and the frame structure 240 may be disposed on the other side (e.g., -z direction).
  • the front plate 202 may be combined with the display 201.
  • the front plate 202 and the display 201 may be adhered to each other through an optical adhesive member (eg, optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.
  • OCA optically clear adhesive
  • OCR optically clear resin
  • front plate 202 may be coupled with frame structure 240.
  • the front plate 202 may include an outer portion extending outside the display 201 when viewed in the z-axis direction, and the outer portion of the front plate 202 and the frame structure 240 ( For example, it may be adhered to the frame structure 240 through an adhesive member (eg, double-sided tape) disposed between the side walls 241).
  • an adhesive member eg, double-sided tape
  • a processor, memory, and/or an interface may be mounted on the first printed circuit board 250 and/or the second printed circuit board 252.
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communications processor.
  • Memory may include, for example, volatile memory or non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • the interface may connect the electronic device 101 to an external electronic device electrically or physically and may include a USB connector, SD card/MMC connector, or audio connector.
  • the first printed circuit board 250 and the second printed circuit board 252 may be operatively or electrically connected to each other through a connecting member (eg, a flexible printed circuit board).
  • the battery 270 may supply power to at least one component of the electronic device 101.
  • the battery 270 may include a rechargeable secondary battery or fuel cell. At least a portion of the battery 270 may be disposed on substantially the same plane as the first printed circuit board 250 and/or the second printed circuit board 252.
  • the electronic device 101 may include an antenna module (not shown).
  • the antenna module may be disposed between the rear plate 211 and the battery 270.
  • the antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • NFC near field communication
  • MST magnetic secure transmission
  • the antenna module may perform short-distance communication with an external device or wirelessly transmit and receive power to and from an external device.
  • the first camera 205 (e.g., a front camera) has a lens in a portion of the front plate 202 (e.g., the first side 200A of FIG. 1) (e.g., the camera area 237). ) may be disposed on at least a portion of the frame structure 240 (eg, the support portion 243) to receive external light.
  • the second camera 212 (eg, a rear camera) may be disposed between the frame structure 240 and the rear plate 211.
  • the second camera 212 may be electrically connected to the first printed circuit board 250 through a connection member (eg, connector).
  • the second camera 212 may be arranged so that the lens can receive external light through the camera area 284 of the rear plate 211 of the electronic device 101.
  • the camera area 284 may be formed on the surface of the rear plate 211 (eg, the second surface 200B in FIG. 1). According to one embodiment, the camera area 284 may be formed to be at least partially transparent to allow external light to enter the lens of the second camera 212. According to one embodiment, at least a portion of the camera area 284 may protrude from the surface of the rear plate 211 at a predetermined height. However, it is not limited to this, and in another embodiment, the camera area 284 may form substantially the same plane as the surface of the rear plate 211.
  • the housing of the electronic device 101 may refer to a configuration or structure that forms at least part of the exterior of the electronic device 101.
  • the housing 210 of the electronic device 101 may refer to a configuration or structure that forms at least part of the exterior of the electronic device 101.
  • at least a portion of the front plate 202, frame structure 240, and/or back plate 211 forming the exterior of the electronic device 101 is referred to as the housing 210 of the electronic device 101. It can be.
  • 4A is a partially exploded perspective view of an example electronic device.
  • 4B shows the internal structure of an example electronic device.
  • the electronic device 101 may include a housing 210, a speaker 410, an enclosure 420, and a support member 450.
  • the housing 210 may include a first surface 200A and a second surface 200B opposite to the first surface 200A.
  • the housing 210 may provide an internal space for electronic components of the electronic device 101.
  • the housing 210 may further include a side surface 200C surrounding the space between the first surface 200A and a second surface 200B opposite the first surface 200A.
  • the housing 210 is surrounded by the first surface 200A, the second surface 200B, and the side surface 200C and accommodates electronic components (e.g., speaker 410) of the electronic device 101.
  • Internal space can be provided for
  • the housing 210 may refer to a structure that forms at least a portion of the first surface 200A, the second surface 200B, and/or the side surface 200C.
  • the front plate 202 and/or the display may form the first surface 200A of the housing 210.
  • the display 201 may be disposed on the first surface 200A.
  • the rear plate 211 may form the second surface 200B of the housing 210.
  • side structure 218 may form side 200C of housing 210.
  • the speaker 410 may be disposed in an internal space of the electronic device 101 surrounded by the front plate 202, the rear plate 211, and the side structure 218.
  • the side 200C of the housing 210 and/or the side structure 218 forming the side 200C may include a speaker hole 207 for audio output from the speaker 410. there is.
  • the speaker 410 is a part of the side 200C including the speaker hole 207 in the internal space of the electronic device 101 in order to transmit audio output from the speaker to the outside of the electronic device 101. It can be placed adjacent to .
  • the speaker 410 can output audio.
  • the speaker 410 faces the first side 200A of the housing 210, the third side 411 used to output the audio, and the second side 200B of the housing 210. It may include a fourth side 412.
  • the fourth surface 412 may include a yoke.
  • the third side 411 of the speaker 410 may face the front plate 202 forming the first side 200A of the housing 210.
  • the third side 411 of the speaker 410 may be a side facing the display 201 of the electronic device 101.
  • the third surface 411 may include a diaphragm for outputting audio from the speaker 410.
  • the speaker 410 may include at least one voice coil that provides vibration to the diaphragm within the speaker 410, and a magnet capable of forming a magnetic field. You can. When current flows through the at least one voice coil, the magnetic field formed in the at least one voice coil may interact with the magnetic field formed by the magnet, causing the voice coil to vibrate. Based on the vibration of the at least one voice coil, the diaphragm connected to the at least one voice coil may be configured to vibrate. The speaker 410 may be configured to output audio through the third surface 411 based on the vibration of the diaphragm.
  • the fourth side 412 of the speaker 410 may face the rear plate 211 forming the second side 200B of the housing 210.
  • the fourth side 412 may include a yoke configured to amplify the magnetic field formed within the speaker 410 to output audio.
  • the yoke may include a magnetic circuit for amplifying the magnetic field formed within the speaker 410.
  • the yoke may be a metal plate that forms the fourth surface 412.
  • the speaker 410 when the speaker 410 operates to output audio, it may radiate heat to surroundings of the speaker 410. For example, when outputting audio, the speaker 410 may be configured to radiate heat toward the first side 200A of the housing 210 through the third side 411 of the speaker 410. there is. For example, when outputting audio, the speaker 410 may be configured to radiate heat toward the second side 200B of the housing 210 through the fourth side 412 of the speaker 410. there is.
  • the enclosure 420 may surround at least a portion of the speaker 410.
  • the enclosure 420 may include a heat dissipation portion 445 facing the fourth surface 412 of the speaker 410 and spaced apart from the fourth surface 412 .
  • the enclosure 420 may cover the fourth side 412 of the speaker 410.
  • the enclosure 420 extends at least a portion of the third side 411 of the speaker 410 to the outside of the enclosure 420 to provide a path for audio output from the speaker 410. can be exposed.
  • the heat dissipation portion 445 may face the fourth side 412 of the speaker 410.
  • the heat dissipation portion 445 may be a portion through which heat emitted through the fourth surface 412 of the speaker 410 is transferred when the speaker 410 outputs audio.
  • the heat dissipation portion 445 may be disposed between the fourth side 412 of the speaker 410 and the second side 200B of the housing 210.
  • the enclosure 420 may include a first enclosure 430 and a second enclosure 440.
  • the first enclosure 430 may contact the third surface 411 of the speaker 410.
  • the first enclosure 430 may expose at least a portion of the third surface 411 to the outside of the enclosure 420 in order to provide a path for audio emitted from the third surface 411.
  • the first enclosure 430 may include a groove to accommodate the speaker 410.
  • the second enclosure 440 may be coupled to the first enclosure 430.
  • the second enclosure 440 may be extended from the first enclosure 430.
  • the second enclosure 440 may be combined with the first enclosure 430 to surround at least a portion of the speaker 410 together with the first enclosure 430.
  • the second enclosure 440 may be a portion including the heat dissipation portion 445 of the enclosure 420.
  • the enclosure 420 includes a first enclosure 430 and a second enclosure 440, thereby protecting the speaker 410 from external shock and transmitting the audio output from the speaker 410 to the speaker 410. It can provide space for resonance.
  • enclosure 420 has been described as being distinct from the housing 210, it is not limited thereto. Enclosure 420 may be part of housing 210 .
  • the first enclosure 430 may be a part of the front plate 202 that forms the first surface 200A of the housing 210.
  • the second enclosure 440 may be a part of the rear plate 211 that forms a second surface 200B opposite to the first surface 200A of the housing 210.
  • the enclosure 420 may include a side structure 218 that forms the side 200C of the housing 210 or a portion of a frame structure (e.g., the frame structure 240 of FIG. 3). It may be the side wall 241 and/or the support portion 243 of FIG. 3). By forming a part of the housing 210, the enclosure 420 can provide additional space for electronic components (eg, speaker 410) within the housing 210.
  • a side structure 218 that forms the side 200C of the housing 210 or a portion of a frame structure (e.g., the frame structure 240 of FIG. 3). It may be the side wall 241 and/or the support portion 243 of FIG. 3).
  • the enclosure 420 can provide additional space for electronic components (eg, speaker 410) within the housing 210.
  • the heat dissipation portion 445 may include metal.
  • the material of the heat dissipation portion 445 may be made of a different material from the remaining portion of the enclosure 420 excluding the heat dissipation portion 445.
  • the heat dissipation portion 445 may be made of a material with high thermal conductivity.
  • the heat dissipation portion 445 may include, but is not limited to, stainless used steel (SUS) and/or clad metal.
  • the clad metal may refer to a plate in which a metal different from the material of the layer is laminated on one or both sides of a layer made of a metal or non-metallic material.
  • the clad metal may be composed of a plate in which a metal different from the material of the layer is laminated on one or both sides of a layer composed of the base material of the enclosure 420.
  • the support member 450 may be disposed between the fourth side 412 of the speaker 410 and the enclosure 420.
  • the support member 450 may be disposed in the space between the fourth surface 412 of the speaker 410 and the heat dissipation portion 445 facing the fourth surface 412.
  • support member 450 may be disposed on fourth side 412 of speaker 410 within enclosure 420 .
  • a support member disposed on the fourth side may mean “a support member in contact with the fourth side.”
  • a support member disposed on the fourth side may refer to “a support member facing away from the fourth side.”
  • the heat dissipation portion 445 may be disposed on the support member 450 .
  • the support member 450 may be disposed below the heat dissipation portion 445 (-Z axis).
  • the support member 450 may be coupled to the fourth surface 412.
  • the support member 450 may be attached to the fourth side 412 .
  • the support member 450 is fixed to the fourth side 412 through at least one component (e.g., an adhesive material) between the fourth side 412 and the support member 450. can be fastened.
  • the heat dissipation portion 445 may face at least a portion of the support member 450 disposed on the fourth surface 412 (eg, the second portion 452 in FIG. 5 ).
  • the support member 450 may support the heat dissipation portion 445 through at least a portion of the support member 450 facing the heat dissipation portion 445 .
  • one element "supports" another element, for example, directly supporting two components by touching each other, or indirectly by having a separate component between the two components. It should be noted that it does not limit the arrangement relationship between two components, as it may mean supporting.
  • the support member 450 is disposed between the heat dissipation portion 445 and the fourth surface 412 of the speaker 410, so that the speaker 410 moves into the enclosure 420 as the speaker 410 operates. Vibration within can be reduced.
  • the support member 450 transfers at least a portion of the heat emitted from the fourth surface 412 of the speaker 410 to the heat dissipation portion ( 445).
  • the support member 450 is disposed between the fourth surface 412 and the heat dissipation portion 445, thereby increasing the distance between the fourth surface 412 and the heat dissipation portion 445.
  • the support member 450 additionally provides a heat transfer path between the fourth surface 412 and the heat dissipation portion 445, thereby reducing heat transferred from the speaker 410 to the heat dissipation portion 445. can be reduced.
  • the electronic device 101 may further include a heat insulating member 460.
  • the heat insulation member 460 is a support member 450 and the heat dissipation member to reduce heat transferred from the speaker 410 to the heat dissipation portion 445 of the enclosure 420 when audio is output from the speaker 410. It may be placed between portions 445.
  • the insulation member 460 may be in contact with the support member 450 and the heat dissipation portion 445.
  • one surface of the insulation member 460 may be in contact with the support member 450.
  • the other side of the insulation member 460 opposite to the one side may be in contact with the heat dissipation portion 445 of the enclosure 420.
  • the insulation member 460 may overlap the support member 450 and the heat dissipation portion 445 when viewed from above.
  • the heat insulating member 460 may be attached on a portion of the support member 450 facing the heat dissipation portion 445 (eg, the second portion 452 in FIG. 5 ).
  • the electronic device 101 can reduce heat transferred from the support member 450 to the heat dissipation portion 445 by including the heat insulating member 460.
  • the rigidity of the support member 450 may be higher than the rigidity of the insulation member 460.
  • the insulation member 460 may be deformed by vibration generated from the speaker 410 when audio is output from the speaker 410.
  • the insulation member 460 may be compressed or expanded by vibration generated from the speaker 410 when the speaker 410 operates.
  • the insulation member 460 may have the form of a sponge containing a material with low thermal conductivity, but is not limited thereto.
  • the electronic device 101 includes the heat insulating member 460 deformable by vibration of the speaker 410, thereby providing a support member 450 and/or enclosure 420 due to the vibration generated from the speaker 410. ) can reduce damage.
  • the electronic device 101 may further include a heat dissipation member 470.
  • the heat dissipation member 470 is configured to reduce heat transferred from the heat dissipation portion 445 of the enclosure 420 to the second surface 200B of the housing 210 when audio is output from the speaker 410. It may include a first area 471 disposed between the heat dissipation portion 445 and the second surface 200B, and a second area 472 extending from the first area 471.
  • the first area 471 of the heat dissipation member 470 may be disposed on the heat dissipation portion 445 of the enclosure 420.
  • the second surface 200B of the housing 210 may be disposed on the heat dissipation member 470.
  • the first area 471 of the heat dissipation member 470 may contact the outer surface of the heat dissipation portion 445.
  • the inner surface of the heat dissipating portion 445 which is opposite to the outer surface of the heat dissipating portion 445, may face the support member 450. At least a portion of the heat emitted from the fourth surface 412 of the speaker 410 may be transferred to the first area 471 through the support member 450 and the heat dissipation portion 445.
  • the second area 472 of the heat dissipation member 470 may be spaced apart from the enclosure 420 .
  • the second area 472 of the heat dissipation member 470 extends from the first area 471 to absorb heat transferred from the heat dissipation portion 445 of the enclosure 420 to the first area 471. At least a portion may be dispersed around the enclosure 420.
  • the heat dissipation member 470 includes a first area 471 between the heat dissipation portion 445 and the housing 200B, and a second area 472 extending from the first area 471, thereby dissipating the heat. Heat transferred from the portion 445 to the second surface 200B can be reduced.
  • the heat dissipation member 470 may include a material with high thermal conductivity.
  • the heat dissipation member 470 may include copper and/or silicon, but is not limited thereto.
  • the first region 471 of the heat dissipation member 470 is a portion adjacent to the enclosure 420 of the support member 450 when the second surface 200B of the housing 210 is viewed from above. (e.g., the second portion 452 of FIG. 5) may overlap.
  • the second portion 452 of the support member 450 is a portion of the speaker 410 and the enclosure 420 of the support member 450 adjacent to the enclosure 420. It can be.
  • the second part 452 may face the inner surface of the heat dissipation part 445. At least a portion of the heat emitted from the fourth surface 412 of the speaker 410 may be transferred to the heat dissipation portion 445 through the second portion 452 of the support member 450.
  • the first area 471 of the heat dissipation member 470 may contact the outer surface of the heat dissipation portion 445 opposite to the inner surface of the heat dissipation portion 445 facing the second portion 452.
  • the first area 471 is disposed between the heat dissipation portion 445 and the second surface 200B of the housing 210, when the second surface 200B is viewed from above, the first area ( 471) may overlap the second part 452.
  • the first area 471 of the heat dissipation member 470 overlaps the second portion 452 of the support member 450 when the second surface 200B is viewed from above, thereby forming the speaker 410.
  • the heat transferred from the fourth surface 412 to the heat dissipation member 470 through the support member 450 and the heat dissipation portion 445 is transferred to a second region extending from the first region 471 ( 472).
  • the heat dissipation member 470 can reduce the heat transferred from the heat dissipation portion 445 to the second surface 200B by dispersing the heat transferred to the heat dissipation member 470.
  • the electronic device 101 includes an enclosure 420 including a heat dissipation portion 445 facing the fourth side 412 of the speaker 410, thereby removing the heat from the speaker 410. Heat transmitted to the second surface 200B of the housing 210 can be reduced.
  • the electronic device 101 includes a support member 450 disposed between the heat dissipation portion 445 and the fourth surface 412, so that when the speaker 410 outputs audio, the speaker ( It is possible to reduce vibration of 410 and reduce heat transferred from the speaker 410 to the heat dissipation portion 445.
  • the electronic device 101 further includes a heat insulating member 460 disposed between the support member 450 and the heat dissipation portion 445, thereby allowing heat to be transmitted from the speaker 410 through the support member 450. Heat transmitted to the heat dissipation portion 445 can be reduced.
  • the electronic device 101 further includes a heat dissipation member 470 between the heat dissipation portion 445 and the second surface 200B, so that the second surface 200B is separated from the heat dissipation portion 445. The heat transmitted can be reduced.
  • FIG. 5 is a cross-sectional view of an example electronic device along line A-A' in FIG. 4B.
  • the electronic device 101 may include a housing 210, a speaker 410, an enclosure 420, and a support member 450.
  • the housing 210 may include a first surface 200A and a second surface 200B opposite to the first surface 200A.
  • the speaker 410 may include a third surface 411 facing the first surface 200A, and a fourth surface 412 facing the second surface 200B.
  • the enclosure 420 may include a heat dissipation portion 445 facing the fourth surface 412.
  • the third surface 411 of the speaker 410 is the first surface 200A of the housing 210 and/or a structure forming the first surface 200A (e.g., in FIG. 2). It may be the side facing the display 201 and/or the front plate 202).
  • the fourth side 412 of the speaker 410 is opposite to the third side 411, and the second side 200B is opposite to the first side 200A of the housing 210. It may be a surface facing the structure forming the second surface 200B (eg, the rear plate 211 of FIG. 2).
  • the third surface 411 may include a vibration plate.
  • the diaphragm has a direction (e.g., +z direction) toward the first side 200A of the housing 210, based on the third side 411, or a second side opposite to the first side 200A. It may vibrate in a direction facing (200B) (e.g., -z direction).
  • the speaker 410 may be configured to output a sound signal to the outside of the electronic device 101 based on the vibration of the diaphragm disposed on the third surface 411.
  • the third surface 411 although not shown, may include a waterproof structure to block foreign substances from entering the internal space of the enclosure 420.
  • the third side 411 may include a waterproof part 411a.
  • the waterproof portion 411a may be disposed along the edge of the third side 411.
  • the waterproof portion 411a may be a portion of the third side 411 that is in contact with the enclosure 420.
  • the waterproof portion 411a may be a portion in contact with the support portion 432 that supports the speaker 410 of the enclosure 420.
  • the waterproof portion 411a may be a portion in contact with the first enclosure 430 including the audio hole 431 facing the third surface 411.
  • the third surface 411 includes the waterproof portion 411a, thereby blocking and/or reducing the inflow of foreign substances from the outside into the internal space of the enclosure 420.
  • the fourth side 412 may include a yoke.
  • the yoke may constitute at least a portion of the exterior of the speaker 410 forming the fourth surface 412.
  • the yoke may include a magnetic circuit to amplify the magnetic field formed within the speaker 410.
  • the fourth surface 412 has a structure (e.g., a structure for supporting the fourth surface 412) in order to reduce movement of the speaker 410 due to vibration output from the speaker 410. May include a support structure 450.
  • the support member 450 includes a first part 451, a second part 452, and a third part connecting the first part 451 and the second part 452 ( 453) may be included.
  • the first part 451 may be disposed on the fourth surface 412 of the speaker 410.
  • the second part 452 may face the heat dissipation part 445 of the enclosure 420.
  • the first part 451 may be a part adjacent to the fourth surface 412 of the fourth surface 412 and the heat dissipation part 445 of the support member 450.
  • the first portion 451 may be in contact with the fourth surface 412.
  • the first part 451 may support the fourth surface 412.
  • the first part 451 may be fixed on the fourth side 412 through a component (e.g., an adhesive member) between the first part 451 and the fourth side 412. You can.
  • the second portion 452 may be a portion adjacent to the heat dissipating portion 445 among the fourth surface 412 and the heat dissipating portion 445 of the support member 450.
  • the heat dissipation portion 445 may face the second portion 452 and fall apart.
  • the second portion 452 may emit at least a portion of the heat transferred from the speaker 410 to the support member 450 to the heat dissipation portion 445.
  • the second part 452 is connected to a support member ( At least a portion of the heat transferred to 450) may be transferred to the heat dissipation portion 445.
  • the third part 453 may extend from the first part 451 to the second part 452.
  • the third part 453 is such that when the speaker 410 outputs audio, the distance d2 between the fourth surface 412 of the speaker 410 and the heat dissipation part 445 is maintained, The first part 451 and the second part 452 can be supported.
  • the third part 453 is a support member caused by vibration of the speaker 410 by supporting the first part 451 and the second part 452 when the speaker 410 outputs audio. (450) Damage can be reduced.
  • the thickness of the third part 453 may be thinner than the thickness of the first part 451 and/or the thickness of the second part 452. As the thickness of the third part 453 is thinner than the thickness of the first part 451 and/or the thickness of the second part 452, the third part 453 is smaller than the first part 453. Heat transferred from 451 to the second part 452 can be reduced.
  • the area A1 of the first part 451 of the support member 450 disposed on the fourth surface 412 of the speaker 410 is the heat dissipation part 445 of the enclosure 420. It may be larger than the area A2 of the second part 452 of the support member 450 facing.
  • the second part 452 may overlap a portion of the first part 451.
  • the area A1 of the first part 451 disposed on the fourth surface 412 is the area of one surface of the first part 451 facing the fourth surface 412. You can.
  • the area A2 of the second part 452 facing the heat dissipating part 445 may be the area of one surface of the second part 452 facing the heat dissipating part 445.
  • the area of the one surface of the first part 451 facing the fourth surface 412 may be larger than the area of the one surface of the second part 452 facing the heat dissipation part 445. there is.
  • the area A1 of the first part 451 disposed on the fourth surface 412 is larger than the area A2 of the second part 452 facing the heat dissipation part 445.
  • the first part 451 can reduce vibration of the speaker 410 as the speaker 410 outputs audio.
  • the area A2 of the second part 452 facing the heat dissipation part 451 is smaller than the area A1 of the first part 451 disposed on the fourth surface 412.
  • the second part 452 can reduce heat transferred from the fourth surface 412 to the heat dissipation part 445 through the support member 450 when the speaker 410 outputs audio. there is.
  • the electronic device 101 includes a support member 450 and a heat dissipation portion ( 445) and may further include a heat insulating member 460 that is in contact with the second part 452 of the support member 450 and the heat dissipation part 445.
  • the area A2 of the second portion 452 of the support member 450 that is in contact with the heat insulating member 460 and faces the heat dissipating portion 445 is in contact with the heat dissipating portion 445. It may be larger than the area A3 of the insulation member 460.
  • the second portion 452 may fall while facing the heat dissipation portion 445 .
  • One surface of the second part 452 facing the heat dissipation part 445 may be in contact with the heat insulating member 460.
  • the area (A3) of one surface of the heat insulating member 460 in contact with the heat dissipation portion 445 is the area (A2) of the one surface of the second part 452 in contact with the heat insulating member 460. It can be smaller than
  • the area A2 of one surface of the second part 452 that is in contact with the heat insulating member 460 and faces the heat dissipation portion 445 is the area A2 of the heat dissipation portion 445 in contact with the heat insulating member 460.
  • the size of the heat insulating member 460 may be smaller than the size of the second portion 452.
  • the heat insulating member 460 may overlap a portion of the second portion 452.
  • the area A3 of the heat insulating member 460 in contact with the heat dissipation part 445 is narrower than the area A2 of the second part 452 facing the heat dissipation part 445, so that the heat insulating member ( 460 may reduce heat transferred from the fourth surface 412 of the speaker 410 to the heat dissipation portion 445 through the second portion 452 of the support member 450.
  • the third part 453 of the support member 450 is connected to the first part 451 of the support member 450 when audio is output from the speaker 410.
  • At least one air gap 510 includes a first part 451, a second part 452, and a third part connecting the first part 451 and the second part 452 ( 453).
  • at least one air gap 510 may be connected to an internal space (eg, resonance space S) of the enclosure 420.
  • at least one air gap 510 may contain at least a portion of the air within the enclosure 420.
  • the third part 453 of the support member 450 includes the at least one air gap 510, thereby reducing the thickness of the third part 453. By reducing the thickness of the third part 453, the third part 453 can reduce heat transferred from the first part 451 to the second part 452.
  • the third portion 453 includes the at least one air gap 510 configured to pass air within the enclosure 420, thereby allowing air to flow from the first portion 451 to the second portion 452. It may be configured to transfer at least a portion of the transferred heat to the air passing through the at least one air gap 510.
  • the at least one air gap 510 is configured to transfer at least a portion of the heat transferred from the first part 451 to the second part 452 to the air passing through the at least one air gap 510.
  • the first portion 451 of the support member 450 may include an opening 520.
  • the opening 520 may be in contact with the fourth surface 412 of the speaker 410 and connected to at least one air gap 510.
  • the opening 520 may penetrate the first portion 451.
  • the opening 520 may contact the inner surface of at least one air gap 510.
  • the opening 520 may be connected to the internal space of the enclosure 420 through at least one air gap 510.
  • the first part 451 may include the opening 520 connected to the at least one air gap 510, thereby further containing air passing through the at least one air gap 510.
  • the opening 520 further includes the air, thereby transferring at least a portion of the heat transferred from the fourth surface 412 of the speaker 410 to the support member 450 to the air contained in the opening 520. It can be configured to do so.
  • the air contained in the opening 520 includes at least a portion of the heat transferred from the fourth surface 412 to the support member 450, so that the opening 520 is formed by the fourth surface 412. Heat transmitted from the support member 450 to the heat dissipation portion 445 can be reduced.
  • the third portion 453 of the support member 450 may be at least partially bent to extend from the first portion 451 to the second portion 452.
  • the third portion 453 may have a curvature.
  • the first part 451 may have a planar shape facing the fourth surface 412 of the speaker 410 in order to support the fourth surface 412 .
  • the second part 452 may have a planar shape to support the heat dissipation part 445 of the enclosure 420.
  • the third part 453 may be a part that extends from the first part 451 to the second part 452 and has a curved shape. As the third part 453 is at least partially bent, the path of heat transferred from the first part 451 to the second part 452 can be lengthened. As the path of heat transferred from the first part 451 to the second part 452 is lengthened, the heat transferred from the fourth surface 412 to the heat dissipation part 445 through the support member 450 is , can be reduced.
  • the enclosure 420 includes an audio hole 431 facing the third side 411 of the speaker 410 to provide a path through which audio of the speaker 410 is output, and the audio hole It may further include a support portion 432 disposed along the edge of 431 and supporting the third surface 411.
  • the thickness d1 of the support portion 432 may be smaller than the distance d2 between the fourth surface 412 of the speaker 410 and the heat dissipation portion 445.
  • the audio hole 431 may expose at least a portion of the third surface 411 to the outside of the enclosure 420.
  • the audio hole 431 is a speaker hole (e.g., the speaker hole in FIG. 2) of the housing 210 to provide a path for audio output from the third side 411 of the speaker 410. 207)).
  • the support portion 432 may support the edge of the third surface 411.
  • the support portion 432 may extend from the inner surface of the audio hole 431.
  • the support portion 432 may be a portion in contact with the speaker 410 of the enclosure 420.
  • the enclosure 420 includes a first enclosure 430 in contact with at least a portion of the third surface 411 of the speaker 410, and a first enclosure 430 coupled to the third surface 411. ) may further include a second enclosure 440 covering the fourth side 412 of the speaker 410, which is opposite to the speaker 410.
  • the first enclosure 430 may include an audio hole 431 of the enclosure 420 and a support portion 432 disposed along an edge of the audio hole 431. By including the audio hole 431, the enclosure 420 can provide a path for audio output from the third side 411 to be transmitted to the outside of the electronic device 101.
  • the enclosure 420 includes a support portion 432 that supports the third surface 411, thereby reducing vibration of the speaker 410 when the speaker 410 outputs the audio. .
  • the support portion 432 may form an edge of the audio hole 431.
  • the third side 411 of the speaker 410 faces the audio hole 431, and the fourth side 412 of the speaker 410, which is opposite to the third side 411, has a heat dissipation portion 445. can face.
  • the fourth side opposite to the third side 411 ( The distance d2 between 412) and the heat dissipation portion 445 may be long. Since the thickness d1 of the support portion 432 is smaller than the distance d2 between the fourth surface 412 and the heat dissipation portion 445, the support portion 432 is connected to the enclosure 420. It is possible to provide a space for the support member 450 and reduce heat transferred from the fourth surface 412 to the heat dissipation portion 445.
  • the enclosure 420 may further include a resonance space (S) that surrounds at least a portion of the speaker 410 and is configured to resonate the audio output from the speaker 410.
  • the support portion 432 of the enclosure 420 may seal the resonance space (S).
  • the resonance space (S) may be in contact with the fourth side 412, which is opposite to the third side 411 from which audio of the speaker 410 is output.
  • the resonance space S may be an internal space of the enclosure 420.
  • the resonance space S may be separated from the outside of the enclosure 420 by the speaker 410 and the enclosure 420.
  • the resonance space (S) may be defined as a space surrounded by the enclosure 420 and the speaker 410.
  • the vibration range of the diaphragm in the speaker 410 may be limited as the frequency of audio output from the third side 411 by the diaphragm is lowered.
  • the resonance space (S) can reduce the limitation of the vibration range of the diaphragm by providing additional space for resonance of the audio.
  • the support portion 432 is in contact with the third surface 411 of the speaker 410, so that it is in contact with the fourth surface 412 of the speaker 410, which is opposite to the third surface 411.
  • the resonance space (S) can be sealed.
  • the support portion 452 may block and/or reduce foreign substances from flowing into the resonance space S from the outside of the enclosure 420 by sealing the resonance space S.
  • the resonance space (S) is such that the thickness (d1) of the support portion (432) is smaller than the distance (d2) between the fourth surface (412) and the heat dissipation portion (445), thereby forming the fourth surface (412). ) and may include an additional space between the heat dissipation portion 445. By including the additional space, the resonance space S can reduce heat transferred from the fourth surface 412 to the heat dissipation portion 445 when the speaker 410 outputs audio.
  • the enclosure 420 may further include a shielding structure 480 for shielding at least a portion of the third surface 411 of the speaker 410.
  • the shielding structure 480 may contact the edge of the audio hole 431 of the enclosure 420.
  • the shielding structure 480 may include at least one through hole 485 that overlaps the third surface 411 of the speaker 410 when viewed from above.
  • the shielding structure 480 may protrude from the support portion 432 of the first enclosure 430 toward the outside of the first enclosure 430 .
  • the shielding structure 480 may cover at least a portion of the audio hole 431.
  • shielding structure 480 may overlap third side 411 of speaker 410 when viewed from above.
  • the enclosure 420 includes the shielding structure 480 to prevent the third surface 411 of the speaker 410 and/or the diaphragm disposed on the third surface 411 from being damaged by external shock. This can reduce the inflow of foreign substances from the outside of the enclosure 420 through the audio hole 431.
  • At least one through hole 485 of the shielding structure 480 may include a first through hole 485a and a second through hole 485b.
  • the first through hole 485a and the second through hole 485b may be spaced apart from each other.
  • the through holes 485a and 485b may overlap the third side 411 of the speaker 410 when viewed from above.
  • the through holes 485a and 485b may each be connected to the audio hole 431.
  • the shielding structure 480 includes the through holes 485a and 485b connected to the audio hole 431, thereby preventing the outside of the electronic device 101 from the third side 411 of the speaker 410.
  • a path for audio output can be provided.
  • the electronic device 101 includes a support member 450 disposed between the fourth surface 412 and the heat dissipation portion 445 of the speaker 410, so that the speaker 410 When outputting audio, heat transferred from the fourth surface 412 to the heat dissipation portion 445 of the enclosure 420 can be reduced.
  • the support member 450 has an area A1 of the first part 451 larger than an area A2 of the second part 452, so that when the speaker 410 outputs the audio, the speaker ( 410) can reduce vibration.
  • the support member 450 is connected from the fourth surface 412 through the support member 450 because the area A2 of the second part 452 is smaller than the area A1 of the first part. Heat transmitted to the heat dissipation portion 445 can be reduced.
  • the electronic device 101 further includes a heat insulating member 460 in contact with the second part 452 and the heat dissipation part 445, thereby insulating the heat from the second part 452 to the heat dissipation part 445. It can reduce the heat transmitted.
  • the third portion 453 of the support member 450 includes at least one air gap 510 configured to pass air within the enclosure 420, thereby allowing air to pass through from the first portion 451. Heat transmitted to the second part 452 can be reduced.
  • 6A, 6B, and 6C illustrate support members for a speaker of an example electronic device.
  • the electronic device 101 may include a speaker 410, an enclosure 420, and a support member 450.
  • the support member 450 may be disposed between the fourth surface 412 of the speaker 410 and the heat dissipation portion 445 of the enclosure 420.
  • the support member 450 includes a first part 451 disposed on the fourth surface 412, a second part 452 facing the heat dissipation part 445, and the first part 451. and a third part 453 connecting the second part 452.
  • the first part 451 may be in contact with the fourth surface 412
  • the second part 452 may be in contact with the heat dissipation part 445.
  • the area A2 of the second part 452 in contact with the heat dissipation part 445 is such that the heat dissipates from the fourth surface 412 through the support member 450 while audio is output from the speaker 410.
  • the area A1 of the first portion 451 in contact with the fourth surface 412 may be smaller than the area A1.
  • the area A1 of the fourth surface 412 in contact with the first part 451 may be larger than the area A2 of the heat dissipation part 452 in contact with the second part 452.
  • the area A1 of the first part 451 in contact with the fourth surface 412 is larger than the area A2 of the second part 452 in contact with the heat dissipation part 445, so that the first part 451 can reduce vibration of the speaker 410 when the speaker 410 outputs audio.
  • the area A2 of the second part 452 in contact with the heat dissipation part 445 is smaller than the area A1 of the first part 451 in contact with the fourth surface 412, so that the second part 452 is in contact with the heat dissipation part 445. 452 may reduce heat transferred from the fourth surface 412 to the heat dissipation portion 445 through the support member 450.
  • the support member 450 has a pyramid shape between the fourth side 412 of the speaker 410 and the heat dissipation portion 445 of the enclosure 420. shape).
  • the area A2 of the second part 452 in contact with the heat dissipation part 445 is equal to the area A2 of the first part 451 in contact with the fourth surface 412. It may be smaller than the area (A1) of.
  • the heat insulating member 460 may be omitted.
  • the support member 450 has a track shape ( track shape).
  • the support member 450 is formed by bending the third part 453 extending from the first part 451 to the second part 452 at least partially so that the support member 450 includes at least one part included in the third part 453.
  • the size of one air gap 510 can be increased. However, it is not limited to this.
  • the second portion 452 of the support member 450 may contact the heat dissipation portion 445 of the enclosure 420.
  • the thermal conductivity of the heat dissipation portion 445 may be higher than the thermal conductivity of the support member 450. Since the thermal conductivity of the support member 450 is lower than the thermal conductivity of the heat dissipation portion 445, the support member 450 is separated from the fourth surface 412 of the speaker 410 by the support member 450. ) can reduce the heat transferred to the heat dissipation part 445 in contact with the second part 452.
  • the third portion 453 of the support member 450 may include at least one air gap 510 that allows air within the enclosure 420 to pass.
  • the at least one air gap 510 may include a plurality of air gaps.
  • the support member 450 is configured to extend from the fourth side 412 of the speaker 410 to the heat dissipation portion 445 through the support member 450. At least a portion of the transferred heat may be transferred to air passing through each of the plurality of air gaps. At least a portion of the heat transferred to the heat dissipation portion 445 through the support member 450 is transferred to the air passing through each of the plurality of air gaps, so that the support member 450 is exposed to the fourth surface 412. ) can reduce the heat transferred from the heat dissipation portion 445.
  • the support member 450 may further include rubber.
  • the support member 450 may be deformable by vibration generated from the speaker 410 when audio is output from the speaker 410. Since the support member 450 further includes rubber, the support member 450 may have low thermal conductivity. Because the support member 450 has low thermal conductivity, the support member 450 can reduce heat transferred from the fourth surface 412 through the support member 450 to the heat dissipation portion 445. there is. Since the support member 450 is deformable by the vibration generated from the speaker 410, the support member 450 can be deformed by the vibration generated when the speaker 410 outputs audio. Damage to 410 and/or enclosure 420 can be reduced.
  • the support member 450 has an area (A2) of the second part 452 in contact with the heat dissipation part 445 of the enclosure 420 and the fourth surface 412 of the speaker 410.
  • A2 area of the second part 452 in contact with the heat dissipation part 445 of the enclosure 420 and the fourth surface 412 of the speaker 410.
  • the electronic device (e.g., the electronic device 101 of FIG. 1) has a first side (e.g., the first side of FIG. 2) on which a display (e.g., the display 201 of FIG. 2) is disposed. (200A)), and a housing (e.g., housing 210 of FIG. 2) including a second side (e.g., second side 200B of FIG. 2) opposite to the first side.
  • the electronic device has a third side facing the first side (e.g., the third side 411 in FIG. 4A), and a fourth side facing the second side and including a yoke (e.g., the third side 411 in FIG. 4a).
  • the electronic device includes a heat dissipation portion (e.g., heat dissipation portion 445 in FIG. 4A) comprising a thermal conductive material facing the fourth side of the speaker and spaced apart from the fourth side. , may include an enclosure (eg, enclosure 420 in FIG. 4A) surrounding at least a portion of the speaker.
  • the electronic device includes a first part disposed on the fourth side of the speaker (e.g., the first part 451 in FIG. 5) and a second part facing the heat dissipation part (e.g., the first part 451 in FIG. 5).
  • the fourth side of the speaker including a second part 452), and a third part connecting the first part and the second part (e.g., the third part 453 in FIG. 5) It may include a support member (eg, support member 450 in FIG. 4A) between the enclosures.
  • the area of the first part disposed on the fourth surface e.g., area A1 in FIG. 5) is the area of the second part facing the heat dissipation part (e.g., area A2 in FIG. 5). It could be wider.
  • the electronic device may reduce vibration of the speaker and reduce heat transferred from the fourth surface to the heat dissipation portion when the audio is output from the speaker by including the support member. there is.
  • the support member may increase an area supporting the fourth surface of the speaker by making the area of the first part larger than the area of the second part.
  • the support member may reduce heat transferred from the fourth surface to the heat dissipation portion through the second portion of the support member by having the area of the second portion be smaller than the area of the first portion.
  • the electronic device is disposed between the support member and the heat dissipation portion to reduce heat transferred from the speaker to the heat dissipation portion when the audio is output, and the second portion and the heat dissipation portion. It may further include a thermally insulating member (eg, thermally insulating member 460 in FIG. 4A) that includes a thermally insulating material that is in contact with. According to the above-mentioned embodiment, the electronic device can reduce heat transferred from the support member to the heat dissipation portion by including the heat insulating member.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the rigidity of the support member may be higher than the rigidity of the insulation member.
  • the insulation member may be deformable by vibration generated from the speaker when the audio is output.
  • the support member can reduce vibration of the speaker when the speaker outputs the audio by having a rigidity of the support member higher than that of the heat insulating member.
  • the insulation member is deformable, thereby reducing damage to the speaker and/or the enclosure including the heat dissipation portion due to vibration of the speaker when the speaker outputs the audio.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the area of the second portion in contact with the heat insulating member and facing the heat dissipation portion is larger than the area of the heat insulating member in contact with the heat dissipation portion (e.g., area A3 in FIG. 5). You can.
  • the heat insulating member reduces the heat transferred from the second part to the heat dissipating part through the heat insulating member by having the area of the heat insulating member smaller than the area of the second part. You can do it.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the third portion of the support member is configured to pass air within the enclosure to reduce heat transferred from the first portion to the second portion when the audio is output. It may include at least one air gap (eg, at least one air gap 510 in FIG. 5).
  • the third part of the support member can transfer at least a portion of the heat transferred from the first part to the second part to the air by including the at least one air gap. .
  • the third portion transfers at least a portion of the heat transferred from the first portion to the second portion to the air passing through the at least one air gap, thereby forming the heat dissipating portion from the fourth side through the support member.
  • the heat transmitted can be reduced.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the first part may be in contact with the fourth surface of the speaker and may include an opening (eg, opening 520 in FIG. 5) connected to the at least one air gap.
  • the first part of the support member can provide additional space for air passing through the at least one air gap by including the opening.
  • the opening may reduce heat transferred from the fourth side through the support member to the heat dissipation portion by providing the additional space for the air.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the electronic device includes a first device disposed between the heat dissipation portion and the second surface to reduce heat transferred from the heat dissipation portion to the second surface of the housing when the audio is output.
  • a heat dissipation member e.g., a heat dissipation member
  • a heat dissipation member including a region (e.g., the first region 471 in FIG. 4B) and a second region extending from the first region (e.g., the second region 472 in FIG. 4B). It may further include a heat dissipation member 470).
  • the electronic device includes the heat dissipation member, thereby reducing heat transferred from the heat dissipation portion of the enclosure to the second surface of the housing.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the first area may overlap the second portion of the support member when the second side of the housing is viewed from above.
  • the first region of the heat dissipation member overlaps the second portion when the second side is viewed from above, thereby allowing at least a portion of the heat emitted from the second side to pass through the heat dissipation portion. It can be delivered.
  • the first region may reduce heat transferred from the heat dissipation portion to the second surface of the housing by dispersing the heat transmitted through the heat dissipation portion through the second region.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the first part may be in contact with the fourth surface
  • the second part may be in contact with the heat dissipation part.
  • the area of the second part in contact with the heat dissipation part is such that while the audio is output, the heat transferred from the fourth side to the heat dissipation part through the support member is reduced. It may be less than the area of 1 part.
  • the support member is configured to support the support member from the fourth surface by having an area of the second part in contact with the heat dissipation part being smaller than the area of the first part in contact with the fourth surface. Through this, the heat transmitted to the heat dissipation part can be reduced.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the support member further includes rubber and may be deformable by vibration generated from the speaker when the audio is output.
  • the support member may have low thermal conductivity by including rubber. By being deformable, the support member can reduce damage to the speaker and/or the enclosure due to vibration of the speaker when the audio is output from the speaker.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the third portion may be at least partially curved to extend from the first portion to the second portion.
  • the third part can be bent at least partially to increase the path for heat transferred from the first part to the second part.
  • the third part may reduce heat transferred from the first part to the second part by increasing the path.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the enclosure has an audio hole facing the third side (e.g., the audio hole 431 in FIG. 5, and an edge of the audio hole) to provide a path through which the audio of the speaker is output. It may further include a support portion disposed along the third surface (e.g., the support portion 432 in FIG. 5) and the thickness of the support portion (e.g., thickness d1 in FIG. 5).
  • the distance between the fourth surface and the heat dissipation portion e.g., distance d2 in FIG. 5) may be smaller than the distance between the fourth side and the heat dissipation portion. The distance is greater than the thickness of the support portion supporting the third side, thereby providing space for the support member and reducing heat transfer from the fourth side to the heat dissipation portion. Examples may include various effects, including those mentioned above.
  • the enclosure may further include a resonance space (e.g., resonance space S in FIG. 5) surrounding at least a portion of the speaker and configured to resonate the audio output from the speaker. there is.
  • the support portion of the enclosure may seal the resonant space.
  • the enclosure can improve the sound quality of the audio output from the speaker by including the resonance space.
  • the support portion may block foreign substances from entering the resonance space from the outside of the enclosure by sealing the resonance space.
  • the second part may be in contact with the heat dissipation part.
  • the thermal conductivity of the heat dissipation portion may be higher than the thermal conductivity of the support member.
  • the support member has a heat dissipation portion from the fourth side through the support member, such that the thermal conductivity of the support member is lower than the thermal conductivity of the heat dissipation portion in contact with the support member. The heat transmitted can be reduced.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the heat dissipation portion may include metal. According to the above-mentioned embodiment, the heat dissipation portion may have high thermal conductivity by including metal. The heat dissipation portion may include metal, thereby reducing heat transferred from the heat dissipation portion to the second surface of the housing.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • an electronic device may include a housing including a first side and a second side opposite the first side.
  • the electronic device may include a third side facing the first side and a fourth side facing the second side, and may include a speaker configured to output audio.
  • the electronic device may include a heat dissipation portion made of metal that faces the fourth side of the speaker and is spaced apart from the fourth side, and may include an enclosure surrounding at least a portion of the speaker.
  • the electronic device includes a first part disposed on the fourth side of the speaker, a second part facing the heat dissipation part, and a third part connecting the first part and the second part. It may include a support member between the fourth side of the speaker and the enclosure.
  • the area of the first part disposed on the fourth surface may be larger than the area of the second part facing the heat dissipation part.
  • the third portion of the support member has at least one air gap configured to pass air within the enclosure to reduce heat transferred from the first portion to the second portion when the audio is output. It can be included.
  • the electronic device may reduce vibration of the speaker and reduce heat transferred from the fourth surface to the heat dissipation portion when the audio is output from the speaker by including the support member. there is.
  • the support member may increase an area supporting the fourth surface of the speaker by making the area of the first part larger than the area of the second part.
  • the support member may reduce heat transferred from the fourth surface to the heat dissipation portion through the second portion of the support member by having the area of the second portion be smaller than the area of the first portion.
  • the third part of the support member may include the at least one air gap, thereby transferring at least a portion of the heat transferred from the first part to the second part to the air.
  • the third portion transfers at least a portion of the heat transferred from the first portion to the second portion to the air passing through the at least one air gap, thereby forming the heat dissipating portion from the fourth side through the support member.
  • the heat transmitted can be reduced.
  • the heat dissipation portion may have high thermal conductivity by including metal.
  • the heat dissipation portion may include metal, thereby reducing heat transferred from the heat dissipation portion to the second surface of the housing.
  • the electronic device is disposed between the support member and the heat dissipation portion to reduce heat transferred from the speaker to the heat dissipation portion when the audio is output, and the second portion and the heat dissipation portion. It may further include an insulating member including an insulating material in contact with. According to the above-mentioned embodiment, the electronic device can reduce heat transferred from the support member to the heat dissipation portion by including the heat insulating member.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the rigidity of the support member may be higher than the rigidity of the insulation member.
  • the insulation member may be deformable by vibration generated from the speaker when the audio is output.
  • the support member can reduce vibration of the speaker when the speaker outputs the audio by having a rigidity of the support member higher than that of the heat insulating member.
  • the insulation member is deformable, thereby reducing damage to the speaker and/or the enclosure including the heat dissipation portion due to vibration of the speaker when the speaker outputs the audio.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the electronic device includes a first device disposed between the heat dissipation portion and the second surface to reduce heat transferred from the heat dissipation portion to the second surface of the housing when the audio is output. It may further include a heat dissipation member including a region and a second region extending from the first region. According to the above-mentioned embodiment, the electronic device includes the heat dissipation member, thereby reducing heat transferred from the heat dissipation portion of the enclosure to the second surface of the housing.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the first part may be in contact with the fourth surface
  • the second part may be in contact with the heat dissipation part.
  • the area of the second part in contact with the heat dissipation part is such that while the audio is output, the heat transferred from the fourth side to the heat dissipation part through the support member is reduced. It may be less than the area of 1 part.
  • the support member is configured to support the support member from the fourth surface by having an area of the second part in contact with the heat dissipation part being smaller than the area of the first part in contact with the fourth surface. Through this, the heat transmitted to the heat dissipation part can be reduced.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the enclosure includes an audio hole facing the third side to provide a path through which the audio of the speaker is output, and a support disposed along an edge of the audio hole and supporting the third side. Additional parts may be included.
  • the thickness of the support portion may be smaller than the distance between the fourth surface and the heat dissipation portion.
  • the electronic device provides space for the support member by having the distance between the fourth side and the heat dissipation portion be greater than the thickness of the support portion supporting the third side. It is possible to provide and reduce heat transferred from the fourth surface to the heat dissipation portion.
  • the above-mentioned embodiments may have various effects including the above-mentioned effects.
  • the enclosure may further include a resonance space surrounding at least a portion of the speaker and configured to resonate the audio output from the speaker.
  • the support portion of the enclosure may be configured to seal the resonant space.
  • the enclosure can improve the sound quality of the audio output from the speaker by including the resonance space.
  • the support portion may block foreign substances from entering the resonance space from the outside of the enclosure by sealing the resonance space.
  • Electronic devices may be of various types.
  • Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances.
  • Electronic devices according to embodiments of this document are not limited to the above-described devices.
  • first, second, or first or second may be used simply to distinguish one element from another, and may be used to distinguish such elements in other respects, such as importance or order) is not limited.
  • One (e.g. first) component is said to be “coupled” or “connected” to another (e.g. second) component, with or without the terms “functionally” or “communicatively”.
  • any of the components can be connected to the other components directly (e.g., wired), wirelessly, or through a third component.
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. It can be used as A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Various embodiments of the present document are one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140) including these.
  • a processor e.g., processor 120
  • the one or more instructions may include code generated by a compiler or code that can be executed by an interpreter.
  • a storage medium that can be read by a device may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves). This term refers to cases where data is stored semi-permanently in the storage medium. There is no distinction between temporary storage cases.
  • Computer program products are commodities and can be traded between sellers and buyers.
  • the computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or through an application store (e.g. Play StoreTM) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online.
  • a machine-readable storage medium e.g. compact disc read only memory (CD-ROM)
  • an application store e.g. Play StoreTM
  • two user devices e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online.
  • at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.
  • each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately placed in other components. there is.
  • one or more of the components or operations described above may be omitted, or one or more other components or operations may be added.
  • multiple components eg, modules or programs
  • the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component of the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, or omitted. Alternatively, one or more other operations may be added.

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Abstract

Un dispositif électronique selon un mode de réalisation peut comprendre : un boîtier ; un haut-parleur ; et une enceinte entourant le haut-parleur et comprenant une partie de dissipation de chaleur faisant face au haut-parleur et espacée de celui-ci. Le dispositif électronique peut comprendre un élément de support entre le haut-parleur et l'enceinte, l'élément de support comprenant : une première section disposée sur le haut-parleur ; une seconde section disposée à l'intérieur de l'enceinte et faisant face à la partie de dissipation de chaleur ; et une troisième section reliant la première section et la seconde section. La zone de la première section peut être supérieure à la zone de la seconde section. Divers autres modes de réalisation sont possibles.
PCT/KR2023/010694 2022-11-09 2023-07-24 Dispositif électronique comprenant une structure isolante pour haut-parleur WO2024101586A1 (fr)

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KR1020220173159A KR20240067755A (ko) 2022-11-09 2022-12-12 스피커를 위한 단열 구조를 포함하는 전자 장치

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130040616A (ko) * 2011-10-14 2013-04-24 엘지전자 주식회사 이동 단말기
KR101330111B1 (ko) * 2012-03-30 2013-11-15 주식회사 이엠텍 일체형 스피커
US20140301587A1 (en) * 2013-04-03 2014-10-09 Em-Tech Co., Ltd. Slim enclosure speaker with side acoustic emission structure
KR20200060117A (ko) * 2018-11-22 2020-05-29 삼성전자주식회사 안테나 모듈을 포함하는 전자장치
KR20210123510A (ko) * 2020-04-03 2021-10-14 삼성전자주식회사 스피커 모듈을 포함하는 전자 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130040616A (ko) * 2011-10-14 2013-04-24 엘지전자 주식회사 이동 단말기
KR101330111B1 (ko) * 2012-03-30 2013-11-15 주식회사 이엠텍 일체형 스피커
US20140301587A1 (en) * 2013-04-03 2014-10-09 Em-Tech Co., Ltd. Slim enclosure speaker with side acoustic emission structure
KR20200060117A (ko) * 2018-11-22 2020-05-29 삼성전자주식회사 안테나 모듈을 포함하는 전자장치
KR20210123510A (ko) * 2020-04-03 2021-10-14 삼성전자주식회사 스피커 모듈을 포함하는 전자 장치

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