WO2023224252A1 - Module d'étanchéité et dispositif électronique le comprenant - Google Patents

Module d'étanchéité et dispositif électronique le comprenant Download PDF

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Publication number
WO2023224252A1
WO2023224252A1 PCT/KR2023/004301 KR2023004301W WO2023224252A1 WO 2023224252 A1 WO2023224252 A1 WO 2023224252A1 KR 2023004301 W KR2023004301 W KR 2023004301W WO 2023224252 A1 WO2023224252 A1 WO 2023224252A1
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WO
WIPO (PCT)
Prior art keywords
electronic device
module
circuit board
printed circuit
camera
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Application number
PCT/KR2023/004301
Other languages
English (en)
Korean (ko)
Inventor
이형우
오정은
정석원
윤병욱
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority claimed from KR1020220081673A external-priority patent/KR20230162495A/ko
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2023224252A1 publication Critical patent/WO2023224252A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16J—PISTONS; CYLINDERS; SEALINGS
    • F16J15/00—Sealings
    • F16J15/02—Sealings between relatively-stationary surfaces
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings

Definitions

  • Various embodiments disclosed in this document relate to a sealing module and an electronic device including the same.
  • an electronic device e.g. a smart phone
  • electronic devices can receive various information in real time by connecting to servers or other electronic devices in a wired or wireless manner.
  • An electronic device such as a smart phone includes a display on the front, and various additional devices may be placed around the active area (“active area” or “view area”) of the display (e.g., the upper part of the front of the electronic device).
  • active area or “view area”
  • a receiver for voice calls a camera for photographing subjects
  • a sensor for recognizing the user's face or iris an infrared projector as a light source for depth measurement
  • a proximity sensor or illuminance sensor e.g., a proximity sensor or illuminance sensor
  • Various sensors such as an air pressure sensor, may be placed on the upper part of the front of the electronic device.
  • the use of these electronic devices in entertainment fields such as multimedia and games is gradually increasing. For example, user demand for the performance of electronic devices, such as larger memory capacity, more advanced processor performance or communication speed, and improved video or sound quality, may increase.
  • Various sensors or input/output devices of electronic devices can be usefully used to meet these user needs.
  • the microphone module placed inside the electronic device is placed for the purpose of improving acoustic performance.
  • the microphone module is placed to improve sound performance when shooting camera video. Sound flowing into the electronic device must travel to the microphone module along a sealed acoustic path to prevent it from being transmitted through other paths.
  • the space in the thickness direction (Z-axis direction) is not constant due to product thickness variation and/or assembly variation, which may lead to difficulties in sealing this part.
  • a sponge with excessive overlap 60-70%) is used in the area where deviation in the thickness direction (Z-axis direction) occurs, the back plate may lift.
  • an electronic sealing connection made of an elastic, shock-absorbing rubber material is implemented. We would like to provide a device.
  • An electronic device includes a housing including an opening on one side, a printed circuit board located in the housing and to which an acoustic module is attached, and a sealing module provided between the housing and the printed circuit board.
  • the sealing module includes a first part including a hole corresponding to the opening, a second part extending from the first part and having a thinner thickness than the first part, and a third part extending from the second part.
  • a rubber portion including a portion, a first fixing member disposed on one surface of the first portion of the rubber portion facing a first direction, and a second direction opposite to the first direction of the third portion of the rubber portion. It may include a second fixing member disposed on one surface.
  • An electronic device includes a housing including an opening on one side, a printed circuit board located in the housing and to which an acoustic module is attached, and a sealing module provided between the housing and the printed circuit board.
  • the sealing module includes a first part including a sound hole corresponding to the opening, a second part extending from the first part and having a thickness thinner than at least a portion of the first part, and the second part. It may include a rubber portion including a third portion extending from the rubber portion, and a first fixing member disposed on one surface of the third portion of the rubber portion facing in the first direction.
  • An electronic device includes a housing including an opening on one side, a printed circuit board located in the housing and to which an acoustic module is attached, and a sealing module provided between the housing and the printed circuit board.
  • the sealing module includes a first part including a sound hole corresponding to the opening, a second part extending from the first part and having a thickness thinner than at least a portion of the first part, and the second part. a rubber portion extending from the rubber portion and including a third portion that is thinner in thickness than the first portion and thicker than the second portion, and disposed on one surface of the third portion of the rubber portion facing in the first direction. It may include a first fixing member.
  • a sealing connection part made of rubber is implemented between the back plate where Z-axis deviation occurs and the printed circuit board, and sealing can be performed regardless of the position deviation of the Z-axis using the elastic force of the rubber material. , internal shock transmission can be reduced depending on the shock absorption of the rubber material itself.
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to various embodiments.
  • FIG. 2 is a diagram illustrating an unfolded state of an electronic device according to an embodiment of the present disclosure.
  • FIG. 3 is a diagram illustrating a folded state of an electronic device according to an embodiment of the present disclosure.
  • Figure 4 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.
  • Figure 5 is an exploded perspective view of an acoustic module of an electronic device according to various embodiments of the present disclosure.
  • FIG. 6 is a diagram illustrating a back plate of an electronic device and an electronic device assembly excluding the back plate, according to various embodiments of the present disclosure.
  • FIG. 7 is a schematic cross-sectional view of the electronic device assembly of FIG. 6 , excluding the rear plate, taken along line A-A', according to various embodiments of the present disclosure.
  • FIG. 8 is a schematic cross-sectional view of the electronic device of FIG. 6 taken along line A-A' and an enlarged view showing a sound movement path according to a general electronic device.
  • FIG. 9 is an enlarged view of the rear housing of FIG. 6 according to various embodiments of the present disclosure.
  • FIG. 10A is an exploded perspective view of a sealing module of an electronic device according to various embodiments of the present disclosure.
  • FIG. 10B is a rear perspective view of a sealing module of an electronic device according to various embodiments of the present disclosure.
  • FIG. 10C is a front perspective view of a sealing module of an electronic device according to various embodiments of the present disclosure.
  • FIG. 11 is a schematic cross-sectional view of at least a portion of the sealing module of FIG. 10B taken along line B-B' according to various embodiments of the present disclosure.
  • Figure 12 is an exploded perspective view of a sealing module of an electronic device according to another embodiment of the present disclosure.
  • Figure 13 is a perspective view of a rubber portion of a sealing module according to another embodiment of the present disclosure.
  • FIG. 14 is a schematic cross-sectional view of the sealing module of FIG. 14 taken along line C-C' according to another embodiment of the present disclosure.
  • Figure 15 is a front view of a sealing module and a first support member combined, according to another embodiment of the present disclosure.
  • Figure 16 is a rear view of a sealing module and a first support member combined according to another embodiment of the present disclosure.
  • FIG. 17 is a schematic cross-sectional view of the electronic device of FIG. 6 taken along line A-A' according to another embodiment of the present disclosure.
  • Figure 18 is an exploded perspective view of a sealing module of an electronic device according to another embodiment of the present disclosure.
  • Figure 19 is a perspective view of a support member of an electronic device according to another embodiment of the present disclosure.
  • Figure 20 is a perspective view of a sealing module of an electronic device according to another embodiment of the present disclosure.
  • FIG. 21 is a schematic cross-sectional view of the electronic device of FIG. 6 taken along line A-A' according to another embodiment of the present disclosure.
  • Figure 22 is an exploded perspective view of a sealing module of an electronic device according to another embodiment of the present disclosure.
  • FIG. 23A is a front perspective view of a sealing module of an electronic device according to another embodiment of the present disclosure.
  • Figure 23b is a rear perspective view of a sealing module of an electronic device, according to another embodiment of the present disclosure.
  • FIG. 23C is a schematic cross-sectional view of the sealing module of FIG. 23A taken along line A-A' according to another embodiment of the present disclosure.
  • Figure 24a is a front perspective view of a sealing module and a support member combined, according to another embodiment of the present disclosure.
  • Figure 24b is a rear perspective view of a sealing module and a support member combined, according to another embodiment of the present disclosure.
  • FIG. 25A is a schematic cross-sectional view taken along line A-A' of the electronic device of FIG. 6 before assembly, according to another embodiment of the present disclosure.
  • FIG. 25B is a schematic cross-sectional view of the electronic device of FIG. 6 taken along line A-A' after assembly, according to another embodiment of the present disclosure.
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment 100, according to various embodiments.
  • the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with at least one of the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • a first network 198 e.g., a short-range wireless communication network
  • a second network 199 e.g., a long-distance wireless communication network.
  • the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197.
  • at least one of these components eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101.
  • some of these components e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.
  • the processor 120 for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • software e.g., program 140
  • the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132.
  • the commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • the processor 120 is a main processor 121 (e.g., a central processing unit or an application processor), or an auxiliary processor 123 (e.g., a graphics processing unit, a neural network processing unit) that can operate independently or together with the main processor 121. (NPU; neural processing unit), image signal processor, sensor hub processor, or communication processor).
  • main processor 121 e.g., a central processing unit or an application processor
  • auxiliary processor 123 e.g., a graphics processing unit, a neural network processing unit
  • the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can.
  • the auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.
  • the auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled.
  • coprocessor 123 e.g., image signal processor or communication processor
  • may be implemented as part of another functionally related component e.g., camera module 180 or communication module 190. there is.
  • the auxiliary processor 123 may include a hardware structure specialized for processing artificial intelligence models.
  • Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (e.g., server 108).
  • Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited.
  • An artificial intelligence model may include multiple artificial neural network layers.
  • Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above.
  • artificial intelligence models may additionally or alternatively include software structures.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto.
  • Memory 130 may include volatile memory 132 or non-volatile memory 134.
  • the program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.
  • the input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user).
  • the input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).
  • the sound output module 155 may output sound signals to the outside of the electronic device 101.
  • the sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback.
  • the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.
  • the display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user).
  • the display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device.
  • the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.
  • the audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g. : Sound can be output through the electronic device 102 (e.g., speaker or headphone).
  • an external electronic device e.g. : Sound can be output through the electronic device 102 (e.g., speaker or headphone).
  • the sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do.
  • the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.
  • the interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 to an external electronic device (eg, the electronic device 102) directly or wirelessly.
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card
  • connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 can capture still images and moving images.
  • the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 can manage power supplied to the electronic device 101.
  • the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101.
  • the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
  • the communication module 190 is a direct (e.g., wired) communication channel or wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108). can support the establishment of and communication through established communication channels.
  • Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication.
  • the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included.
  • a wireless communication module 192 e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 e.g., : LAN (local area network) communication module, or power line communication module
  • the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It can communicate with external electronic devices through telecommunication networks such as cellular networks, 5G networks, next-generation communication networks, the Internet, or computer networks (e.g., LAN or TAN).
  • telecommunication networks such as cellular networks, 5G networks, next-generation communication networks, the Internet, or computer networks (e.g., LAN or TAN).
  • telecommunication networks such as cellular networks, 5G networks, next-generation communication networks, the Internet, or computer networks (e.g., LAN or TAN).
  • telecommunication networks such as cellular networks, 5G networks, next-generation communication networks, the Internet, or computer networks (e.g., LAN or TAN).
  • LAN or TAN computer networks
  • the wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 to communicate within a communication network such as the first network 198 or the second network 199.
  • subscriber information e.g., International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (net radio access technology).
  • NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported.
  • the wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates.
  • the wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna.
  • the wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199).
  • the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC.
  • Peak data rate e.g., 20 Gbps or more
  • loss coverage e.g., 164 dB or less
  • U-plane latency e.g., 164 dB or less
  • the antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device).
  • the antenna module may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB).
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for the communication method used in the communication network, such as the first network 198 or the second network 199, is connected to the plurality of antennas by, for example, the communication module 190. can be selected. Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna.
  • other components eg, radio frequency integrated circuit (RFIC) may be additionally formed as part of the antenna module 197.
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.
  • a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the
  • peripheral devices e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • signal e.g. commands or data
  • commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199.
  • Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101.
  • all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108.
  • the electronic device 101 may perform the function or service instead of executing the function or service on its own.
  • one or more external electronic devices may be requested to perform at least part of the function or service.
  • One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101.
  • the electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request.
  • cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology can be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of Things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or server 108 may be included in the second network 199.
  • the electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.
  • Electronic devices may be of various types.
  • Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances.
  • Electronic devices according to embodiments of this document are not limited to the above-described devices.
  • first, second, or first or second may be used simply to distinguish one element from another, and may be used to distinguish such elements in other respects, such as importance or order) is not limited.
  • One (e.g. first) component is said to be “coupled” or “connected” to another (e.g. second) component, with or without the terms “functionally” or “communicatively”.
  • any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. can be used
  • a module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Various embodiments of the present document are software (e.g., a program) that includes one or more instructions stored in a storage medium (e.g., internal memory or external memory) that can be read by a machine (e.g., an electronic device). It can be implemented as: For example, a processor (eg, processor) of a device (eg, electronic device) may call at least one instruction among one or more instructions stored from a storage medium and execute it. This allows the device to be operated to perform at least one function according to the at least one instruction called.
  • the one or more instructions may include code generated by a compiler or code that can be executed by an interpreter.
  • a storage medium that can be read by a device may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves). This term refers to cases where data is stored semi-permanently in the storage medium. There is no distinction between temporary storage cases.
  • Computer program products are commodities and can be traded between sellers and buyers.
  • the computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or via an application store (e.g. Play Store TM ) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smartphones) or online.
  • a machine-readable storage medium e.g. compact disc read only memory (CD-ROM)
  • an application store e.g. Play Store TM
  • two user devices e.g. It can be distributed (e.g. downloaded or uploaded) directly between smartphones) or online.
  • at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.
  • each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately disposed in other components.
  • one or more of the components or operations described above may be omitted, or one or more other components or operations may be added.
  • multiple components eg, modules or programs
  • the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as those performed by the corresponding component of the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or , or one or more other operations may be added.
  • FIG. 2 is a front perspective view of an electronic device, according to various embodiments of the present disclosure.
  • 3 is a rear perspective view of an electronic device, according to various embodiments of the present disclosure.
  • 'Y' may refer to the longitudinal direction of the electronic device 101. Additionally, in one embodiment of the present invention, '+Y' may mean the upper direction of the electronic device, and '-Y' may mean the lower direction of the electronic device.
  • the electronic device 101 has a front side (210A), a back side (210B), and a side (210C) surrounding the space between the front side (210A) and the back side (210B).
  • ) may include a housing 210 including.
  • the housing 210 may refer to a structure that forms part of the front 210A of FIG. 2, the back 210B, and the side 210C of FIG. 2.
  • the front surface 210A may be formed at least in part by a substantially transparent front plate 202 (eg, a glass plate including various coating layers, a polymer plate, or a cover glass).
  • the front plate 202 (eg, cover glass) may be formed of 2D glass or 2,5D glass.
  • the back side 210B may be formed by the back plate 211.
  • the rear plate 211 may be formed of, for example, glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials.
  • the side 210C combines with the front plate 202 and the back plate 211 and may be formed by a side bezel structure (or “side member”) 218 comprising metal and/or polymer.
  • the back plate 211 and the side bezel structure 218 may be integrally formed and include the same material (eg, glass, a metallic material such as aluminum, or ceramic).
  • the front plate 202 has two first edge regions 210D that are curved from the front side 210A toward the back plate 211 and extend seamlessly, the front plate (210D) 202) can be included at both ends of the long edge.
  • the rear plate 211 has two second edge regions 210E that are curved from the rear 210B toward the front plate 202 and extend seamlessly at both ends of the long edges.
  • the front plate 202 (or the rear plate 211) may include only one of the first edge areas 210D (or the second edge areas 210E). In another embodiment, some of the first edge areas 210D or the second edge areas 210E may not be included.
  • the side bezel structure 218 when viewed from the side of the electronic device 101, has a side that does not include the first edge regions 210D or the second edge regions 210E.
  • the side may have a first thickness (or width), and the side including the first edge areas 210D or the second edge areas 210E may have a second thickness that is thinner than the first thickness.
  • the electronic device 101 includes a display 201, audio modules 203, 207, and 214 (e.g., the audio module 170 in FIG. 1), and a sensor module (e.g., the sensor module in FIG. 1). (176)), camera modules 205, 212 (e.g., camera module 180 in FIG. 1), key input device 217 (e.g., input module 150 in FIG. 1), and connector hole 208, 209) (e.g., the connection terminal 178 of FIG. 1).
  • the electronic device 101 may omit at least one of the components (eg, the connector hole 209) or may additionally include another component.
  • the display 201 may be visually exposed, for example, through a significant portion of the front plate 202. In some embodiments, at least a portion of the display 201 may be exposed through the front plate 202 forming the front surface 210A and the first edge areas 210D. In some embodiments, the edges of the display 201 may be formed to be substantially the same as the adjacent outer shape of the front plate 202. In another embodiment (not shown), in order to expand the area where the display 201 is exposed, the distance between the outer edge of the display 201 and the outer edge of the front plate 202 may be formed to be substantially the same.
  • the surface of the housing 210 may include a screen display area formed as the display 201 is visually exposed.
  • the screen display area may include a front surface 210A and first edge areas 210D.
  • a recess or opening is formed in a portion of the screen display area (e.g., front surface 210A, first edge area 210D) of the display 201, and the recess Alternatively, it may include at least one of an audio module 214, a sensor module (not shown), a light emitting element (not shown), and a camera module 205 that are aligned with the opening.
  • an audio module 214, a sensor module (not shown), a camera module 205, a fingerprint sensor (not shown), and a light emitting element are installed on the back of the screen display area of the display 201. It may include at least one of (not shown).
  • the display 201 is coupled to or adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of touch, and/or a digitizer that detects a magnetic field type stylus pen. can be placed.
  • a touch detection circuit capable of measuring the intensity (pressure) of touch
  • a digitizer capable of measuring the intensity (pressure) of touch
  • a digitizer that detects a magnetic field type stylus pen.
  • at least a portion of the key input device 217 may be disposed in the first edge areas 210D and/or the second edge areas 210E.
  • the audio modules 203, 207, and 214 may include, for example, a microphone hole 203 and speaker holes 207 and 214.
  • a microphone for acquiring external sound may be placed inside the microphone hole 203, and in some embodiments, a plurality of microphones may be placed to detect the direction of sound.
  • the speaker holes 207 and 214 may include an external speaker hole 207 and a receiver hole 214 for calls.
  • the speaker holes 207 and 214 and the microphone hole 203 may be implemented as one hole, or a speaker may be included without the speaker holes 207 and 214 (e.g., piezo speaker).
  • the audio modules 203, 207, and 214 are not limited to the above structure, and can be designed in various ways, such as installing only some audio modules or adding new audio modules, depending on the structure of the electronic device 101.
  • a sensor module may generate, for example, an electrical signal or data value corresponding to an internal operating state of the electronic device 101 or an external environmental state.
  • the sensor module may include, for example, a first sensor module (e.g., proximity sensor) and/or a second sensor module (e.g., fingerprint sensor) disposed on the front 210A of the housing 210, and/ Alternatively, it may include a third sensor module (eg, HRM sensor) and/or a fourth sensor module (eg, fingerprint sensor) disposed on the rear surface (210B) of the housing 210.
  • the fingerprint sensor may be disposed on the front 210A (e.g., display 201) as well as the rear 210B of the housing 210.
  • the electronic device 101 includes sensor modules not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor or an illuminance sensor.
  • the sensor module is not limited to the above structure, and can be designed in various ways, such as installing only some sensor modules or adding a new sensor module, depending on the structure of the electronic device 101.
  • the camera modules 205 and 212 include, for example, a front camera module 205 disposed on the front 210A of the electronic device 101, and a rear camera module disposed on the rear 210B. (212), and/or may include flash (not shown).
  • the camera modules 205 and 212 may include one or more lenses, an image sensor, and/or an image signal processor. Flashes may include, for example, light-emitting diodes or xenon lamps. In some embodiments, two or more lenses (an infrared camera, a wide-angle and a telephoto lens) and image sensors may be placed on one side of the electronic device 101.
  • the camera modules 205 and 212 are not limited to the above structure, and can be designed in various ways, such as installing only some camera modules or adding new camera modules, depending on the structure of the electronic device 101.
  • the electronic device 101 may include a plurality of camera modules (e.g., a dual camera or a triple camera) each having different properties (e.g., angle of view) or functions.
  • a plurality of camera modules 205 and 212 including lenses with different angles of view may be configured, and the electronic device 101 may perform a camera operation in the electronic device 101 based on the user's selection.
  • the angle of view of the modules 205 and 212 can be controlled to change.
  • at least one of the plurality of camera modules 205 and 212 may be a wide-angle camera, and at least another one may be a telephoto camera.
  • the plurality of camera modules 205 and 212 may be a front camera, and at least another one may be a rear camera. Additionally, the plurality of camera modules 205 and 212 may include at least one of a wide-angle camera, a telephoto camera, or an infrared (IR) camera (eg, a time of flight (TOF) camera or a structured light camera). According to one embodiment, the IR camera may operate as at least part of the sensor module. For example, the TOF camera may operate as at least part of a sensor module (not shown) to detect the distance to the subject.
  • IR infrared
  • TOF time of flight
  • the key input device 217 may be disposed on the side 210C of the housing 210.
  • the electronic device 101 may not include some or all of the key input devices 217 mentioned above and the key input devices 217 not included may be displayed on the display 201, such as soft keys. It can be implemented in different forms.
  • the key input device may include a sensor module 216 disposed on the rear 210B of the housing 210.
  • a light emitting device may be disposed, for example, on the front surface 210A of the housing 210.
  • a light emitting device may provide status information of the electronic device 101 in the form of light.
  • a light emitting device may provide, for example, a light source linked to the operation of the front camera module 205.
  • Light-emitting devices may include, for example, LEDs, IR LEDs, and/or xenon lamps.
  • the connector holes 208 and 209 are, for example, a first connector hole that can accommodate a connector (for example, a USB connector) for transmitting and receiving power and/or data with an external electronic device.
  • a connector for example, a USB connector
  • 208, and/or a second connector hole 209 capable of accommodating a connector (eg, an earphone jack) for transmitting and receiving audio signals to and from an external electronic device.
  • some camera modules 205 among the camera modules 205 and 212, and/or some sensor modules among the sensor modules (not shown) are exposed to the outside through at least a portion of the display 201.
  • the camera module 205 may include a punch hole camera disposed inside a hole or recess formed on the back of the display 201.
  • the camera module 212 may be disposed inside the housing 210 so that the lens is exposed to the rear 210B of the electronic device 101.
  • the camera module 212 may be placed on a printed circuit board (eg, printed circuit board 240 in FIG. 4).
  • the camera module 205 and/or the sensor module are configured to be in contact with the external environment through a transparent area from the internal space of the electronic device 101 to the front plate 202 of the display 201. can be placed. Additionally, some sensor modules 204 may be arranged to perform their functions without being visually exposed through the front plate 202 in the internal space of the electronic device.
  • FIG. 4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.
  • the electronic device 101 (e.g., the electronic device 101 of FIGS. 1 to 3) according to various embodiments includes a support bracket 270 and a front plate 220 (e.g., the electronic device 101 of FIG. 2).
  • Front plate 202 includes display 230 (e.g., display 201 of FIG. 2), printed circuit board 240 (e.g., PCB, flexible PCB (FPCB), or rigid flexible PCB (RFPCB)), battery (250) (e.g., battery 189 in FIG. 1), second support member 260 (e.g., rear case), antenna 290 (e.g., antenna module 197 in FIG. 1), rear plate 280 ) (e.g., the rear plate 211 of FIG. 2).
  • the support bracket 270 of the electronic device 101 may include a side bezel structure 271 (e.g., the side bezel structure 218 of FIG. 2) and a first support member 272. there is.
  • the electronic device 101 may omit at least one of the components (e.g., the first support member 272 or the second support member 260) or may additionally include other components. . At least one of the components of the electronic device 101 may be the same as or similar to at least one of the components of the electronic device 101 of FIG. 2 or 3, and overlapping descriptions will be omitted below.
  • the first support member 272 may be disposed inside the electronic device 101 and connected to the side bezel structure 271, or may be formed integrally with the side bezel structure 271.
  • the first support member 272 may be formed of, for example, a metallic material and/or a non-metallic (eg, polymer) material.
  • the first support member 272 may have a display 230 coupled to one side and a printed circuit board 240 to the other side.
  • the printed circuit board 240 may be equipped with a processor, memory, and/or an interface.
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • the printed circuit board 240 may include a flexible printed circuit board type radio frequency cable (FRC).
  • FRC radio frequency cable
  • the printed circuit board 240 may be disposed on at least a portion of the first support member 272, and may be connected to an antenna module (e.g., the antenna module 197 of FIG. 1) and a communication module (e.g., the antenna module 197 of FIG. 1). It may be electrically connected to the communication module 190).
  • the memory may include, for example, volatile memory or non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • the interface may electrically or physically connect the electronic device 101 to an external electronic device and may include a USB connector, SD card/MMC connector, or audio connector.
  • the battery 250 is a device for supplying power to at least one component of the electronic device 101, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or fuel. It may include a battery. At least a portion of the battery 250 may be disposed, for example, on substantially the same plane as the printed circuit board 240 . The battery 250 may be placed integrally within the electronic device 101, or may be placed to be detachable from the electronic device 101.
  • the second support member 260 (eg, rear case) may be disposed between the printed circuit board 240 and the antenna 290.
  • the second support member 260 may include one surface to which at least one of the printed circuit board 240 or the battery 250 is coupled, and the other surface to which the antenna 290 is coupled.
  • the antenna 290 may be disposed between the rear plate 280 and the battery 250.
  • the antenna 290 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • NFC near field communication
  • MST magnetic secure transmission
  • the antenna 290 can perform short-distance communication with an external device or wirelessly transmit and receive power required for charging.
  • an antenna structure may be formed by part or a combination of the side bezel structure 271 and/or the first support member 272.
  • the rear plate 280 may form at least a portion of the rear of the electronic device 101 (eg, the rear 210B of FIG. 3).
  • the rear plate 280 may include an opening 281 for placing a camera. The opening may be formed at a location where a camera module (eg, camera module 212 in FIG. 3) is disposed.
  • FIG. 5 is an exploded perspective view of the sound module 340 of the electronic device 101 according to various embodiments of the present disclosure.
  • FIG. 6 is a diagram illustrating the rear plate 311 of the electronic device 101 and the assembly of the electronic device 101 excluding the rear plate 311, according to various embodiments of the present disclosure.
  • FIG. 7 shows the assembly of the electronic device 101, excluding the back plate 311 and the back plate 311, of the electronic device 101 of FIG. 6 cut along line A-A', according to various embodiments of the present disclosure.
  • This is a schematic cross-sectional view.
  • FIG. 8 is a schematic cross-sectional view of the electronic device 101 of FIG. 6 taken along line A-A', according to a general electronic device 101, and an enlarged view showing a sound movement path.
  • FIG. 9 is an enlarged view of the rear housing 310 of FIG. 6 according to various embodiments of the present disclosure.
  • the electronic device 101 includes a housing 310, a printed circuit board 320 (e.g., a PCB, a flexible PCB (FPCB), or a rigid flexible PCB (RFPCB)), and a camera module 330. ), an audio module 340, and a rear case 350.
  • the housing 310, printed circuit board 320 e.g., PCB, flexible PCB (FPCB), or rigid flexible PCB (RFPCB)
  • camera module 330, and rear case 350 are configured as follows. Some or all of the configurations of the housing 210, printed circuit board 240, camera module 212, and second support member 260 of FIGS. 2 to 4 may be the same.
  • 'X' may refer to the width direction of the electronic device 101
  • 'Y' may refer to the longitudinal direction of the electronic device 101
  • 'Z' may refer to the thickness direction of the electronic device 101.
  • 'X' may mean a right direction (+X) and a left direction (-X).
  • 'Y' may mean an upward direction (+Y) and a downward direction (-Y).
  • 'Z' may mean the front direction (+Z) and the back direction (-Z).
  • the electronic device 101 may include a housing 310 including a front surface 310a and a rear surface 310b.
  • the housing 310 may refer to a structure that forms part of the front surface 310a and the rear surface 310b of FIG. 5 .
  • the front surface 310a may be formed at least in part by a substantially transparent front plate (not shown) (eg, a glass plate including various coating layers, a polymer plate, or a cover glass).
  • the back side 310b may be formed by the back plate 311.
  • the back plate 311 may be formed of, for example, glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials.
  • the printed circuit board 320 may be electrically connected to the camera module 330 and the sound module 340.
  • the camera module 330 and the sound module 340 may be placed on the printed circuit board 320.
  • the sound module 340 may be placed adjacent to the camera module 330.
  • the sound module 340 may be disposed adjacent to the opening 314 formed in the camera module 330.
  • the rear 310b of the housing 310 includes a rear plate 311, a plurality of camera supports 312 formed in the rear direction (e.g., -Z direction in FIG. 5), and the housing 310. It is substantially flat with the back side 310b of and may include a camera cover 313 to protect the camera module 330.
  • the plurality of camera supports 312 may include five camera supports.
  • the plurality of camera supports 312 may correspond to the location and thickness of the camera module 330.
  • the plurality of camera supports 312 may be formed to protrude in the rear direction (eg, -Z direction in FIG. 5).
  • the camera cover 313 may have a size and shape corresponding to the shape of the camera module 330 in order to protect the camera module 330.
  • it may have a circular shape.
  • the size and shape of the camera cover 313 are not limited, and the design may be changed in various ways depending on the size or arrangement relationship of surrounding structures.
  • the plurality of camera supports 312 has a ring shape surrounding the camera cover 313, and may be formed to correspond to the shape of the camera cover 313.
  • the plurality of camera supports 312 may be formed to extend from the rear housing 310 (310b) by a specified length in the thickness direction (Z-axis direction).
  • the plurality of camera supports 312 may be formed to extend a specified length from the rear housing 310 in the rear direction (eg, -Z direction in FIG. 5).
  • the plurality of camera supports 312 may be formed integrally with the rear surface 310b of the housing 310.
  • the plurality of camera supports 312 may be formed separately from the rear surface 310b of the housing 310 and may be detachable from the rear surface 310b of the housing 310.
  • the plurality of camera supports 312 are formed in a ring-shaped first region 312a extending by a specified length in the thickness direction (Z-axis direction) and extending in an outer direction of the first region 312a. It may include a second area 312b disposed adjacent to the lower part of the rear plate 311, and a third area 312c extending in the inner direction of the first area 312a and capable of seating the camera cover 313. You can.
  • the second area 312b may be formed to extend from the outer surface of the ring-shaped first area 312a in the outer direction of the ring shape.
  • at least a portion of the second area 312b may be disposed at a location corresponding to the sound module 340.
  • the second area 312b may include a first hole 315 through which sound entering the electronic device can pass.
  • a support member 360 may be disposed below the second area 312b of the plurality of camera supports 312. According to various embodiments, the support member 360 may be disposed at a position corresponding to the sound module 340. According to various embodiments, the support member 360 may include a second hole 361 through which sound entering the electronic device can pass.
  • the electronic device 101 may include camera modules 330 (e.g., dual cameras or triple cameras) each having different properties (e.g., angle of view) or functions. At least one of the camera modules 330 may be a front camera, and at least another one may be a rear camera. According to one embodiment, at least some of the camera modules 330 may be disposed inside the housing 310 so that the lenses are exposed to the rear of the electronic device 101. For example, the camera module 330 may be disposed on and/or adjacent to the printed circuit board 320.
  • camera modules 330 e.g., dual cameras or triple cameras each having different properties (e.g., angle of view) or functions. At least one of the camera modules 330 may be a front camera, and at least another one may be a rear camera. According to one embodiment, at least some of the camera modules 330 may be disposed inside the housing 310 so that the lenses are exposed to the rear of the electronic device 101. For example, the camera module 330 may be disposed on and/or adjacent to the printed circuit board 320
  • the sound module 340 may convert sound into an electrical signal or, conversely, may convert an electrical signal into sound. According to one embodiment, the sound module 340 acquires sound through an input module (e.g., the input module 150 of FIG. 1) or an audio output module (e.g., the sound output module 155 of FIG. 1). , or the sound may be output through an external electronic device 101 (e.g., electronic device 102) (e.g., speaker or headphone) connected directly or wirelessly to the electronic device 101.
  • an input module e.g., the input module 150 of FIG. 1
  • an audio output module e.g., the sound output module 155 of FIG.
  • the sound may be output through an external electronic device 101 (e.g., electronic device 102) (e.g., speaker or headphone) connected directly or wirelessly to the electronic device 101.
  • the sound module 340 may be, for example, a microphone.
  • the microphone may be placed inside the housing 310 for the purpose of improving the sound performance of the video by allowing microphone sound to flow in the same direction as when shooting camera video.
  • the sound module 340 may be placed inside the housing 310.
  • the acoustic module 340 may be disposed on and/or adjacent to the printed circuit board 320 .
  • the sound module 340 may be disposed adjacent to the camera module 330 disposed on and/or adjacent to the printed circuit board 320. Sound that flows into the electronic device 101 from the outside of the electronic device 101 through the opening 314 may enter the sound module 340 by moving along a sealed acoustic path to prevent it from leaking elsewhere.
  • the rear surface 310b of the housing 310 may include an opening 314.
  • the opening 314 may be configured to transmit sound from outside the electronic device 101 to the sound module 340 inside.
  • the opening 314 may be configured to transmit sound to the internal sound module 340 when shooting a camera video.
  • the opening 314 may connect the exterior and interior of the electronic device 101.
  • the opening 314 may connect the outside of the electronic device 101 and the sound module 340 disposed inside the housing 310. Sound from outside the electronic device 101 may enter the inside of the housing 310 through the opening 314.
  • the opening 314 may be located on at least one surface of the plurality of camera supports 312.
  • the opening 314 may be located on at least one side of the first area 312a of the plurality of camera supports 312.
  • the opening 314 may be located on at least one surface of the first area 312a of the plurality of camera supports 312 that is exposed to the outside.
  • the acoustic path L through which external sound is transmitted to the acoustic module 340 is as follows.
  • the sound may move between the rear plate 311 and the second area 312b of the plurality of camera supports 312.
  • the sound that enters between the rear plate 311 and the second area 312b of the plurality of camera supports 312 is transmitted through the first hole 315 of the second area 312b and the second hole of the support member 360 ( It is possible to move into the interior of the electronic device 101 through 361). For example, it may move toward the front 310a of the electronic device 101 (+Z direction).
  • the sound passing through the first hole 315 of the second area 312b and the second hole 361 of the support member 360 passes through the printed circuit board 320 and is transmitted to the sound attached to the printed circuit board 320. It may be delivered inside the module 340.
  • the support member 360 and the printed circuit board 320 may be spaced apart by a predetermined distance G in the thickness direction (Z-axis direction).
  • the gap G between the support member 360 and the printed circuit board 320 varies due to thickness deviation of the components (support member 360, printed circuit board 320) and/or assembly deviation of the electronic device 101. may occur.
  • the gap G between the support member 360 and the printed circuit board 320 may have a spatial deviation of up to 0.1 mm to 0.15 mm.
  • the sealing module 400 as a component for sealing the gap G between the support member 360 and the printed circuit board 320 will be described below.
  • FIG. 10A is an exploded perspective view of the sealing module 400 of the electronic device 101 according to various embodiments of the present disclosure.
  • FIG. 10B is a rear perspective view 310b of the sealing module 400 of the electronic device 101 according to various embodiments of the present disclosure.
  • FIG. 10C is a front perspective view 310a of the sealing module 400 of the electronic device 101 according to various embodiments of the present disclosure.
  • FIG. 11 is a schematic cross-sectional view of at least a portion of the sealing module 400 of FIG. 10B taken along line B-B' according to various embodiments of the present disclosure.
  • the electronic device 101 may include a sealing module 400.
  • the configuration of the sealing module 400 of FIGS. 10A to 11 may be partially or entirely the same as the configuration of the sealing module 400 of FIGS. 5 to 9 .
  • 'X' may refer to the width direction of the electronic device 101
  • 'Y' may refer to the longitudinal direction of the electronic device 101
  • 'Z' may refer to the thickness direction of the electronic device 101.
  • 'X' may mean a right direction (+X) and a left direction (-X).
  • 'Y' may mean an upward direction (+Y) and a downward direction (-Y).
  • 'Z' may mean the front direction (+Z) and the back direction (-Z).
  • the sealing module 400 may include a rubber portion 410, a first fixing member 420, and a second fixing member 430. Referring to FIG. 9 , the sealing module 400 may be located between the printed circuit board 320 on which the sound module 340 is disposed and the support member 360.
  • the rubber portion 410 may have a shape substantially similar to a disk.
  • the rubber portion 410 may include an acoustic hole 440 corresponding to the acoustic module 340 at its center.
  • the rubber portion 410 includes a ring-shaped first portion 411 including a sound hole 440, a second portion 412 extending outward from the first portion 411, and a second portion 412. It may include a third portion 413 extending outward.
  • the shape of the rubber portion 410 is not limited to the above embodiment, and may be designed in various ways depending on the size and arrangement relationship of surrounding structures.
  • the rubber portion 410 may have a staircase structure with different thicknesses and heights.
  • the first part 411 may have a first thickness t1
  • the second part 412 may have a second thickness t2
  • the third part 413 may have a third thickness t3.
  • the first thickness t1 may correspond to the third thickness t3.
  • the first thickness t1 and the third thickness t3 may be substantially the same. This is to ensure that the rubber portion 410 is parallel to one surface of the electronic device 101 when brought into close contact in the Z-axis direction.
  • the second thickness t2 of the second portion 412 may be thinner than the first thickness t1 and the third thickness t3 to facilitate flow in the thickness direction (Z-axis direction). You can. Since the second thickness t2 is relatively thin, sealing is possible even if there is a deviation in the gap in the thickness direction (Z-axis direction) (e.g., gap G in FIG. 8) between the support member 360 and the printed circuit board 320. possible.
  • the height of the rubber portion 410 may be different.
  • the first part 411 may be formed to be spaced apart from the third part 413 by a first length l1 in the rear direction (eg, -Z direction in FIG. 10A).
  • the height of the first part 411 may be formed to be higher in the rear direction (eg, -Z direction in FIG. 10A) than the height of the third part 413.
  • the first part 411 may be formed to be spaced apart from the third part 413 in the rear direction (eg, -Z direction in FIG. 10A) by a predetermined distance.
  • the first part 411 may be formed to be spaced apart from the third part 413 in the rear direction (eg, -Z direction in FIG. 10A) by a first length l1. This is to prevent damage due to bending of the rubber portion 410 by providing a slight difference in the positions of the first part 411 and the third part 413 in the Z-axis direction.
  • the first fixing member 420 may be disposed on one side of the first portion 411 of the rubber portion 410 facing the rear direction (eg, -Z direction in FIG. 10A).
  • the first fixing member 420 may be, for example, double-sided tape.
  • the first part 411 of the rubber part 410 may be attached to the support member 360 by the first fixing member 420.
  • the second fixing member 430 may be disposed on one side of the third portion 413 of the rubber portion 410 facing the front direction (eg, +Z direction in FIG. 10A).
  • the second fixing member 430 may be, for example, double-sided tape.
  • the third portion 413 of the rubber portion 410 may be attached to the printed circuit board 320 by the second fixing member 430 .
  • FIG. 12 is an exploded perspective view of the sealing module 500 of the electronic device 101 according to another embodiment of the present disclosure.
  • Figure 13 is a perspective view of the rubber portion 510 of the sealing module 500 according to another embodiment of the present disclosure.
  • FIG. 14 is a schematic cross-sectional view of the sealing module 500 of FIG. 13 taken along line C-C' according to another embodiment of the present disclosure.
  • Figure 15 is a front view of the sealing module 500 and the support member 360 combined, according to another embodiment of the present disclosure.
  • Figure 16 is a rear view of the sealing module 500 and the support member 360 combined, according to another embodiment of the present disclosure.
  • FIG. 17 is a schematic cross-sectional view of the electronic device 101 of FIG. 6 taken along line A-A' according to another embodiment of the present disclosure.
  • the electronic device 101 includes a housing 310, a printed circuit board 320 (e.g., PCB, flexible PCB (FPCB), or rigid flexible PCB (RFPCB)), and a camera module 330. ), an acoustic module 340, a rear case 350, a support member 360, and a sealing module 500. 12 to 17, the housing 310, printed circuit board 320 (e.g., PCB, flexible PCB (FPCB), or rigid flexible PCB (RFPCB)), camera module 330, rear case 350, and support.
  • the member 360 and the sealing module 500 consist of the housing 310 of FIGS.
  • a printed circuit board 320 e.g., a PCB, a flexible PCB (FPCB), or a rigid flexible PCB (RFPCB)
  • a camera e.g., a PCB, a rigid flexible PCB (RFPCB)
  • a PCB printed circuit board
  • FPCB flexible PCB
  • RFPCB rigid flexible PCB
  • Some or all of the configurations of the module 330, rear case 350, support member 360, and sealing module 400 may be the same.
  • 'X' may refer to the width direction of the electronic device 101
  • 'Y' may refer to the longitudinal direction of the electronic device 101
  • 'Z' may refer to the thickness direction of the electronic device 101.
  • 'X' may mean a right direction (+X) and a left direction (-X).
  • 'Y' may mean an upward direction (+Y) and a downward direction (-Y).
  • 'Z' may mean the front direction (+Z) and the back direction (-Z).
  • the support member 360 may include a second hole 361 in at least a portion corresponding to the camera module 330 through which sound entering the electronic device can pass.
  • the side surface surrounding the second hole 361 of the support member may include a protrusion 362.
  • the sealing module 500 may be located between the printed circuit board 320 on which the sound module 340 is disposed and the support member 360.
  • the sealing module 500 may be combined with the support member 360.
  • the sealing module 500 may include a rubber portion 510 and a second fixing member 520.
  • the configuration of the rubber portion 510 of the sealing module 500 of FIGS. 12 to 17 and the second fixing member 520 is the rubber portion ( 410) and the configuration of the second fixing member 430 may be the same in whole or in part.
  • the rubber portion 510 of the sealing module 500 may have a shape similar to a disk including an acoustic hole 540 corresponding to the acoustic module 340 at the center.
  • the shape of the rubber portion 510 is not limited to the above embodiment, and may be designed in various ways depending on the size and arrangement relationship of surrounding structures.
  • the rubber portion 510 includes a first part 511 including a sound hole 540, a second part 512 extending outward from the first part 511, and an outer direction from the second part 512. It may include an extending third part 513.
  • the shape of the first portion 511 of the rubber portion 510 cut along line C-C' of FIG. 13 may be a hook shape.
  • the first part 511 of the rubber part 510 extends from the second part 512 in a direction close to the sound hole 540, and is formed as a 1-1 part substantially parallel to the XY plane ( 5111), a 1-2 part 5112 in which the part close to the sound hole 540 of the 1-1 part 5111 extends a specified length in the rear direction (-Z direction), and the 1-2 part ( It may include a first to third portion 5113 extending from 5112) by a specified length in a direction away from the sound hole 540.
  • the first part 511 may include a concave space S surrounded by the 1-1 part 5111, the 1-2 part 5112, and the 1-3 part 5113.
  • the concave space S may correspond to the protrusion 362 of the support member 360.
  • the concave space S may be combined with the protrusion 362 of the support member 360.
  • the concave space S may overlap at least a portion of the concave space S in order to come into close contact with the protrusion 362 of the support member 360.
  • the 1-1 portion 5111 of the first portion 511 of the rubber portion 510 has a first thickness (t4)
  • the second portion 512 has a second thickness (t5)
  • the third portion 513 may have a third thickness t6.
  • the first thickness t4 may correspond to the third thickness t6.
  • the first thickness t4 and the third thickness t6 may be substantially the same. This is to prevent deviation in the thickness direction when adhered closely in the Z-axis direction. This is to ensure that the rubber portion 410 is parallel to one surface of the electronic device 101 when brought into close contact in the Z-axis direction.
  • the second thickness t5 may be thinner than the first thickness t4 and the third thickness t6 to facilitate flow in the thickness direction (Z-axis direction). Since the second thickness t2 is relatively thin, sealing is possible even if there is a deviation in the gap G in the thickness direction (Z-axis direction) between the support member 360 and the printed circuit board 320.
  • the height of the rubber portion 410 may be different.
  • the 1-1 part 5111 may be formed to be spaced apart from the third part 513 by a predetermined distance in the rear direction (-Z direction).
  • the 1-1 part 5111 may be formed to be spaced apart from the third part 513 by a second length l2 in the rear direction (-Z direction).
  • the height of the 1-1 part 5111 may be formed to be higher in the rear direction (-Z direction) than the height of the third part 513.
  • the lower surface of the 1-1 part 5111 and the lower surface of the third part 513 may be spaced apart by a predetermined distance l in the thickness direction (Z-axis direction).
  • the lower surface of the 1-1 part 5111 and the lower surface of the third part 513 may be spaced apart by a second length l2 in the thickness direction (Z-axis direction). This is to prevent damage due to bending of the rubber portion 510 by providing a slight difference in the positions of the 1-1 portion 5111 and the third portion 513 in the Z-axis direction.
  • the second fixing member 520 may be disposed on one side of the third portion 513 of the rubber portion 510 facing the front direction (+Z direction).
  • the second fixing member 520 may be, for example, double-sided tape.
  • the third portion 513 of the rubber portion 510 may be attached to the printed circuit board 320 by the second fixing member 520 .
  • FIG. 18 is an exploded perspective view of the sealing module 600 of the electronic device 101 according to another embodiment of the present disclosure.
  • Figure 19 is a perspective view of the support member 660 of the electronic device 101 according to another embodiment of the present disclosure.
  • FIG. 20 is a perspective view of the sealing module 600 of the electronic device 101 according to another embodiment of the present disclosure.
  • FIG. 21 is a schematic cross-sectional view of the electronic device 101 of FIG. 6 taken along line A-A' according to another embodiment of the present disclosure.
  • the electronic device 101 includes a housing 310, a printed circuit board 320 (e.g., PCB, flexible PCB (FPCB), or rigid flexible PCB (RFPCB)), and a camera module 330. ), an acoustic module 340, a rear case 350, a support member 360, and a sealing module 600.
  • the housing 310, printed circuit board 320 e.g., PCB, flexible PCB (FPCB), or rigid flexible PCB (RFPCB)
  • camera module 330 e.g., rear case 350
  • the member 360 and the sealing module 600 consist of the housing 310 of FIGS.
  • a printed circuit board 320 e.g., a PCB, a flexible PCB (FPCB), or a rigid flexible PCB (RFPCB)
  • a camera e.g., a PCB, a rigid flexible PCB (RFPCB)
  • a PCB printed circuit board
  • FPCB flexible PCB
  • RFPCB rigid flexible PCB
  • Some or all of the configurations of the module 330, rear case 350, support member 360, and sealing module 500 may be the same.
  • 'X' may refer to the width direction of the electronic device 101
  • 'Y' may refer to the longitudinal direction of the electronic device 101
  • 'Z' may refer to the thickness direction of the electronic device 101.
  • 'X' may mean a right direction (+X) and a left direction (-X).
  • 'Y' may mean an upward direction (+Y) and a downward direction (-Y).
  • 'Z' may mean the front (310a) direction (+Z) and the rear (310b) direction (-Z).
  • the sealing module 600 may include a rubber portion 610, a second fixing member 620, and a third fixing member 630.
  • the sealing module 600 may be located between the printed circuit board 320 on which the sound module 340 is disposed and the support member 660.
  • the configuration of the rubber portion 610 of the sealing module 600 of FIGS. 18 to 21 and the second fixing member 620 is the same as the rubber portion of the sealing module 500 of FIGS. 12 to 17 ( 510) and the configuration of the second fixing member 520 may be the same in whole or in part.
  • the rubber portion 610 may have a shape substantially similar to a disk.
  • the rubber portion 610 may include an acoustic hole 640 corresponding to the acoustic module 340 at its center.
  • the rubber portion 610 includes a ring-shaped first portion 611 including a sound hole 640, a second portion 612 extending outward from the first portion 611, and a second portion 612. It may include a third portion 613 extending outward.
  • the first part 611 may have a first thickness t7
  • the second part 612 may have a second thickness t8, and the third part 613 may have a third thickness t9.
  • the first thickness t7 may correspond to the third thickness t9.
  • the first thickness t7 and the third thickness t9 may be substantially the same. This is to prevent deviations from occurring in the thickness direction when adhered closely in the Z-axis direction.
  • the second thickness t8 may be thinner than the first thickness t7 and the third thickness t9 to facilitate flow in the thickness direction (Z-axis direction).
  • the first part 611 may be formed in a rearward direction (-Z direction) than the third part 613.
  • the lower surface of the first part 611 and the lower surface of the third part 613 may be spaced apart from each other by a predetermined distance in the thickness direction (Z-axis direction).
  • the lower surface of the first part 611 and the lower surface of the third part 613 may be spaced apart by a third length l3 in the thickness direction (Z-axis direction). This is to prevent damage due to bending of the rubber portion 610 by providing a slight difference in the positions of the first part 611 and the third part 613 in the Z-axis direction.
  • the second fixing member 620 may be disposed on one side of the third portion 613 of the rubber portion 610 facing the front direction (+Z direction).
  • the second fixing member 620 may be, for example, double-sided tape.
  • the third portion 613 of the rubber portion 610 may be attached to the printed circuit board 320 by the second fixing member 620 .
  • the third fixing member 630 may be disposed on one side of the first portion 611 of the rubber portion 610 facing the front direction (+Z direction). According to another embodiment (not shown), the third fixing member 630 may be disposed on one side of the first portion 611 of the rubber portion 610 facing the rear direction (+Z direction).
  • the third fixing member 630 may be a magnetic object.
  • the third fixing member 630 may be, for example, a magnet.
  • the magnetic third fixing member 630 may be disposed adjacent to the fourth fixing member 661 of the support member 660, which will be described later, to form an attractive force with the fourth fixing member 661.
  • the support member 660 may include a fourth fixing member 661 and an injection unit 662. At least a portion of the injection unit 662 may be recessed. For example, at least a portion of the injection unit 662 may be recessed in the front direction (+Z direction). For example, at least a portion of the injection unit 662 corresponding to the sound hole 640 may be recessed in the front direction (+Z direction).
  • the fourth fixing member 661 may correspond to the recessed portion of the injection unit 662.
  • the fourth fixing member 661 may be disposed in the recessed portion of the injection unit 662.
  • the fourth fixing member 661 may be disposed at a position corresponding to the first fixing member 620 of the sealing module 600.
  • the fourth fixing member 661 may be a magnetic object.
  • the first fixing member 620 and the fourth fixing member 661 may be brought into close contact by human force.
  • FIG. 22 is an exploded perspective view of the sealing module 700 of the electronic device 101 according to another embodiment of the present disclosure.
  • FIG. 23A is a front perspective view of the sealing module 700 of the electronic device 101 according to another embodiment of the present disclosure.
  • FIG. 23B is a rear perspective view 310b of the sealing module 700 of the electronic device 101 according to another embodiment of the present disclosure.
  • FIG. 23C is a schematic cross-sectional view of the sealing module 700 of FIG. 23A taken along line A-A' according to another embodiment of the present disclosure.
  • Figure 24a is a front perspective view of the sealing module 700 and the support member 360 combined, according to another embodiment of the present disclosure.
  • Figure 24b is a rear perspective view 310b of the sealing module 700 and the support member 360 combined, according to another embodiment of the present disclosure.
  • FIG. 25A is a schematic cross-sectional view taken along line A-A' of the electronic device 101 of FIG. 6 before assembly, according to another embodiment of the present disclosure.
  • FIG. 25B is a schematic cross-sectional view of the electronic device 101 of FIG. 6 taken along line A-A' after assembly, according to another embodiment of the present disclosure.
  • the electronic device 101 includes a housing 310, a printed circuit board 320 (e.g., PCB, flexible PCB (FPCB), or rigid flexible PCB (RFPCB)), and a camera module 330. ), an acoustic module 340, a rear case 350, a support member 360, and a sealing module 700. 22 to 25B, the housing 310, printed circuit board 320 (e.g., PCB, flexible PCB (FPCB), or rigid flexible PCB (RFPCB)), camera module 330, rear case 350, and support.
  • the member 360 and the sealing module 700 consist of the housing 310 of FIGS.
  • a printed circuit board 320 e.g., a PCB, a flexible PCB (FPCB), or a rigid flexible PCB (RFPCB)
  • a camera e.g., a PCB, a rigid flexible PCB (RFPCB)
  • a PCB printed circuit board
  • FPCB flexible PCB
  • RFPCB rigid flexible PCB
  • 'X' may refer to the width direction of the electronic device 101
  • 'Y' may refer to the longitudinal direction of the electronic device 101
  • 'Z' may refer to the thickness direction of the electronic device 101.
  • 'X' may mean a right direction (+X) and a left direction (-X).
  • 'Y' may mean an upward direction (+Y) and a downward direction (-Y).
  • 'Z' may mean the front (310a) direction (+Z) and the rear (310b) direction (-Z).
  • the sealing module 700 may include a rubber portion 710 and a first fixing member 720.
  • the sealing module 700 may be located between the printed circuit board 320 on which the sound module 340 is disposed and the support member 360.
  • the configuration of the rubber portion 710 of the sealing module 700 of FIGS. 22 to 25B and the fifth fixing member 720 are similar to the rubber portion of the sealing module 600 of FIGS. 18 to 21 ( 610) and the configuration of the second fixing member 620 may be the same in whole or in part.
  • the rubber portion 710 may include an acoustic hole 740 corresponding to the acoustic module 340 at its center.
  • the rubber portion 710 includes a ring-shaped first portion 711 including a sound hole 740, a second portion 712 extending outward from the first portion 711, and a second portion 712. It may include a third portion 713 extending outward.
  • the first part 711 has a first thickness t10
  • the second part 712 has a second thickness t11
  • the third part 713 has a first thickness t10. It may be 3 thickness (t12).
  • one surface of the first portion 711 facing the rear direction (-Z direction) may not be in contact with one surface of the support member 360.
  • One surface of the first portion 711 facing the rear direction (-Z direction) may be disposed inside the second hole 361 located at the center of the support member 360.
  • the one side facing the rear direction (-Z direction) of the first part 711 is more inclined toward the rear direction (-Z direction) than the one side facing the rear direction (-Z direction) of the third part 713. It can be formed spaced apart.
  • one surface of the first portion 711 facing the front direction (+Z direction) may contact one surface of the printed circuit board 320.
  • One side of the first portion 711 facing the front direction (+Z direction) may be in close contact with one side of the printed circuit board 320 facing the back direction (-Z direction).
  • One surface facing the front direction (+Z direction) of the first part 711 may be formed to be spaced apart in the front direction (+Z direction) from one surface facing the front direction (+Z direction) of the third part 713.
  • one side facing the front direction (+Z direction) of the first part 711 is facing the front direction (+Z direction) by the fourth length l4 more than the one side facing the front direction (+Z direction) of the third part 713.
  • the fourth length l4 may be 0.2 mm or more considering the Z-axis spatial deviation.
  • the fourth length l4 may be 0.2 mm or more and 0.3 or less considering the Z-axis spatial deviation (0.1 mm or more and 0.2 or less).
  • one surface of the first portion 711 facing the front direction (+Z direction) may be mirror molded to improve adhesion.
  • the first thickness t10 may be thicker than the gap G between the support member 360 and the printed circuit board 320. This is to ensure close contact and sealing between the support member 360 and the printed circuit board 320.
  • the width of the first portion 711 may be the first width w1.
  • the first width w1 may be, for example, approximately 0.5 mm or more to prevent leakage after close contact.
  • the second thickness t11 may be thinner than the first thickness t10 and the third thickness t12 to facilitate flow in the thickness direction (Z-axis direction).
  • the fifth fixing member 720 may be disposed on one side of the rubber portion 710 facing the rear direction (-Z direction).
  • the fifth fixing member 720 may be disposed on one side of the third portion 713 of the rubber portion 710 facing the rear direction (-Z direction).
  • the fifth fixing member 720 may be, for example, double-sided tape.
  • the third portion 713 of the rubber portion 710 may be attached to the support member 360 by the fifth fixing member 720.
  • the third portion 713 of the rubber portion 710 is attached to the support member 360 and the support member 360 and the printed circuit board ( 320) can be closely adhered to the Z-axis direction.
  • One side of the first portion 711 facing the front direction (+Z direction) may be in close contact with one side of the printed circuit board 320 facing the back direction (-Z direction).
  • the shape of the rubber portion 710 may be deformed.
  • the third part 713 is oriented in the front direction (+Z direction), and one side of the third part 713 faces the front direction (+Z direction) and is directed to the back side of the printed circuit board 320 (-Z direction).
  • the second portion 712 of the rubber portion 710 may be stretched.
  • the second part 712 of the rubber part 710 is a part that connects the first part 711 and the third part 713, and the end connected to the third part 713 is oriented in the front direction (+Z direction). It can increase.
  • the contracting force of the second part 712 of the rubber part 710 can be used to push the first part 711 in the front direction (+Z direction) to bring it into close contact with the printed circuit board 320. By adjusting the force with which the rubber part 710 adheres, the lifting of the rear plate can be reduced.
  • the sealing module 400 according to various embodiments of the present disclosure described above and the electronic device 101 including the same are not limited to the above-described embodiments and drawings, and may be substituted in various ways within the technical scope of the present disclosure. It will be clear to those skilled in the art that modifications and changes are possible.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Telephone Set Structure (AREA)

Abstract

Un dispositif électronique selon un autre mode de réalisation de la présente divulgation comprend : un boîtier comprenant une ouverture sur une surface ; une carte de circuit imprimé située dans le boîtier et ayant un module sonore fixé à celle-ci ; et un module d'étanchéité disposé entre le boîtier et la carte de circuit imprimé, le module d'étanchéité pouvant comprendre : une première partie comprenant un trou sonore correspondant à l'ouverture ; une seconde partie s'étendant à partir de la première partie et ayant une épaisseur plus mince qu'une épaisseur d'au moins une partie de la première partie ; une partie en caoutchouc comprenant une troisième partie s'étendant à partir de la deuxième partie ; un premier élément de fixation disposé sur une surface de la première partie de la partie en caoutchouc faisant face à une première direction ; et un second élément de fixation disposé sur une surface de la troisième partie de la partie en caoutchouc faisant face à une seconde direction opposée à la première direction.
PCT/KR2023/004301 2022-05-20 2023-03-30 Module d'étanchéité et dispositif électronique le comprenant WO2023224252A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20220062180 2022-05-20
KR10-2022-0062180 2022-05-20
KR1020220081673A KR20230162495A (ko) 2022-05-20 2022-07-04 실링 모듈 및 이를 포함하는 전자 장치
KR10-2022-0081673 2022-07-04

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WO2023224252A1 true WO2023224252A1 (fr) 2023-11-23

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110051360A1 (en) * 2009-08-31 2011-03-03 Apple Inc. Handheld computing device
KR20180049916A (ko) * 2016-11-04 2018-05-14 엘지전자 주식회사 이동 단말기
US20190045094A1 (en) * 2017-08-07 2019-02-07 Apple Inc. Electronic device having a vision system assembly held by a self-aligning bracket assembly
KR20210057593A (ko) * 2019-11-12 2021-05-21 삼성전자주식회사 마이크로폰을 포함하는 전자 장치
KR20210101462A (ko) * 2020-02-10 2021-08-19 삼성전자주식회사 마이크 모듈을 포함하는 전자 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110051360A1 (en) * 2009-08-31 2011-03-03 Apple Inc. Handheld computing device
KR20180049916A (ko) * 2016-11-04 2018-05-14 엘지전자 주식회사 이동 단말기
US20190045094A1 (en) * 2017-08-07 2019-02-07 Apple Inc. Electronic device having a vision system assembly held by a self-aligning bracket assembly
KR20210057593A (ko) * 2019-11-12 2021-05-21 삼성전자주식회사 마이크로폰을 포함하는 전자 장치
KR20210101462A (ko) * 2020-02-10 2021-08-19 삼성전자주식회사 마이크 모듈을 포함하는 전자 장치

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