WO2024089886A1 - Système de montage de composants - Google Patents

Système de montage de composants Download PDF

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Publication number
WO2024089886A1
WO2024089886A1 PCT/JP2022/040452 JP2022040452W WO2024089886A1 WO 2024089886 A1 WO2024089886 A1 WO 2024089886A1 JP 2022040452 W JP2022040452 W JP 2022040452W WO 2024089886 A1 WO2024089886 A1 WO 2024089886A1
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WO
WIPO (PCT)
Prior art keywords
adhesive
component
feeder
feeder holding
unit
Prior art date
Application number
PCT/JP2022/040452
Other languages
English (en)
Japanese (ja)
Inventor
剛史 溝口
Original Assignee
株式会社Fuji
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Fuji filed Critical 株式会社Fuji
Priority to PCT/JP2022/040452 priority Critical patent/WO2024089886A1/fr
Publication of WO2024089886A1 publication Critical patent/WO2024089886A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Definitions

  • the technology disclosed in this specification relates to a component mounting system that mounts electronic components on a substrate.
  • Japanese Patent Application Laid-Open No. 9-75830 discloses a component mounting machine equipped with an adhesive supplying device that supplies adhesive.
  • the adhesive may not be applied properly on the board, for example, because the amount of adhesive applied is small.
  • a trial application is performed in which the adhesive is applied on a position other than the board.
  • the component mounting machine of Japanese Patent Application Laid-Open No. 9-75830 is provided with an application status checking device that has a sheet for trial application by the adhesive supplying device. Before applying adhesive to a circuit board, adhesive is trial applied to the sheet of the application status checking device. By checking the state of the adhesive trial applied to the sheet, it is confirmed whether the adhesive is properly supplied from the adhesive supplying device.
  • the type of circuit board to be produced may change, and the type of adhesive applied to the circuit board may change accordingly, and it may be necessary to replace it with a different type of adhesive before starting production with the component mounting machine.
  • the adhesive supply device when the amount of adhesive remaining in the adhesive supply device becomes insufficient, the adhesive supply device must be replaced.
  • the application status confirmation device when there are no more parts of the sheet that can be test-applied, the application status confirmation device must be replaced.
  • the adhesive supply device and application status confirmation device were installed on the component mounting machine by the operator. Therefore, when it becomes necessary to replace the adhesive supply device or application status confirmation device, the mounting process of the component mounting machine is stopped until the operator has completed the replacement work, resulting in problems of reduced productivity and increased labor costs.
  • This specification discloses technology for efficiently replacing or installing devices used to apply adhesive and devices used to check the state of adhesive application.
  • the component mounting system disclosed in this specification mounts electronic components on a board.
  • the component mounting system includes a component mounting machine provided with a feeder holding section, a component supply feeder that is detachably held in the feeder holding section and supplies electronic components to the component mounting machine, an adhesive supply device that is detachably held in the feeder holding section and supplies adhesive to the component mounting machine, an application status confirmation device that is detachably held in the feeder holding section and has a sheet on which adhesive supplied from the adhesive supply device can be applied and that confirms the application status of the adhesive supplied from the adhesive supply device based on the status of the adhesive applied to the sheet, a storage unit that houses the component supply feeder, the adhesive supply device, and the application status confirmation device, and a moving device that moves the component supply feeder between the storage unit and the feeder holding section and is configured to be able to move the adhesive supply device and the application status confirmation device between the storage unit and the feeder holding section.
  • the component supply feeder, adhesive supply device, and application status confirmation device can be installed in the feeder holding section, and can be moved by a moving device. This allows the adhesive supply device and application status confirmation device to be moved using the moving device that moves the component supply feeder, and also makes it possible to automatically install the adhesive supply device and application status confirmation device on the component mounting machine. This eliminates the need for an operator to replace the adhesive supply device and application status confirmation device, improving productivity.
  • FIG. 1 is a diagram showing a schematic configuration of a component mounting system according to an embodiment.
  • FIG. 2 is a diagram showing a schematic configuration of a component mounter.
  • FIG. 3 is a cross-sectional view taken along line III-III in FIG.
  • FIG. 2 is a block diagram showing a control system of the component mounter.
  • FIG. 2 is a diagram showing a schematic configuration of a parts feeder.
  • FIG. 2 is a diagram showing a schematic configuration of an adhesive supplying device.
  • FIG. 2 is a diagram showing a schematic configuration of a coating state checking device.
  • the component supply feeder may store first identification information that identifies the component supply feeder.
  • the adhesive supply device may store second identification information that identifies the adhesive supply device.
  • the coating state confirmation device may store third identification information that identifies the coating state confirmation device.
  • the component mounting machine may include an acquisition unit that is capable of communicating with each of the component supply feeder, adhesive supply device, and coating state confirmation device held in the feeder holding unit, and acquires first identification information, second identification information, and third identification information from each of the component supply feeder, adhesive supply device, and coating state confirmation device, and an identification unit that identifies the component supply feeder, adhesive supply device, and coating state confirmation device held in the feeder holding unit based on the first identification information, second identification information, and third identification information acquired by the acquisition unit.
  • the component mounting system disclosed in this specification may further include a management device that manages the component mounter and the moving device.
  • the adhesive supplying device may include a remaining amount measuring unit that measures the remaining amount of adhesive in the adhesive supplying device.
  • the component mounter may include a communication unit that transmits information about the remaining amount of adhesive measured by the remaining amount measuring unit of the adhesive supplying device held in the feeder holding unit to the management device.
  • the management device may move the adhesive supplying device from the feeder holding unit to a storage unit by the moving device, and may also move other adhesive supplying devices stored in the storage unit to the feeder holding unit. With this configuration, when the remaining amount of adhesive in the adhesive supplying device held in the feeder holding unit becomes low, the adhesive supplying device can be automatically replaced.
  • the component mounting system disclosed in this specification may further include a management device that manages the component mounter and the moving device.
  • the coating state confirmation device may include a winding unit that winds up the sheet, and a winding amount measuring unit that measures the winding amount of the sheet wound by the winding unit.
  • the component mounter may include a communication unit that transmits information about the winding amount of the sheet measured by the winding amount measuring unit of the coating state confirmation device held in the feeder holding unit to the management device.
  • the management device may move the coating state confirmation device from the feeder holding unit to the storage by the moving device, and may move other coating state confirmation devices stored in the storage to the feeder holding unit.
  • the feeder holding unit may be configured to be capable of holding multiple adhesive supply devices.
  • the time that the mounting process is stopped for the adhesive supply device replacement work can be shortened.
  • multiple adhesive supply devices that supply different types of adhesive can be installed simultaneously.
  • the component mounting system 1 includes a plurality of component mounters 10, a management device 8, a component feeder 30, a loader 50, a storage unit 54, an adhesive supply device 60, and an application status checking device 80.
  • each mounter 10 is communicatively connected to a management device 8.
  • the management device 8 is communicatively connected to the multiple mounters 10 and loaders 50, and manages the multiple mounters 10 and loaders 50.
  • the management device 8 and the multiple mounters 10 form a component mounting line 100.
  • the management device 8 is configured using a computer equipped with a CPU and a storage device.
  • the management device 8 controls the operation of each mounter 10 to control the entire component mounting line 100. That is, the management device 8 determines the type and position of the electronic components 4 to be mounted on the circuit board 2 by each of the multiple mounters 10, and instructs the mounters 10 of the type and position of the electronic components 4.
  • Each mounter 10 operates based on the instructions of the management device 8, and the necessary electronic components 4 are mounted on the circuit board 2.
  • the component mounter 10 mounts electronic components 4 on the circuit board 2.
  • the component mounter 10 is also called a surface mounter or chip mounter.
  • the circuit board 2 is sent from one end of the component mounting line 100 to the other end. Predetermined electronic components 4 are mounted on the circuit board 2 by each component mounter 10.
  • the circuit board 2 sent to the other end of the component mounting line 100 is shipped as a final product, or sent to a subsequent process as a semi-finished product.
  • the component mounter 10 includes a feeder holder 14, a head 16, an imaging device 20, a moving device 18 that moves the head 16 and the imaging device 20, a board conveyor 22, an operation panel 24, a communication unit 28, and a control device 26.
  • the feeder holding unit 14 has a plurality of slots, and the component feeder 30 can be detachably installed in each of the plurality of slots.
  • the feeder holding unit 14 may be fixed to the component mounter 10, or may be detachably installed with respect to the component mounter 10.
  • the feeder holding unit 14 has a connector 15.
  • FIG. 3 shows a state in which the component feeder 30 (and the adhesive supply device 60 and the application state confirmation device 80 described later) are not installed in the slot on the most +X direction side.
  • the connector 15 is provided at a position where it connects with the connector 40 (described later) of the component feeder 30 when the component feeder 30 is installed in the feeder holding unit 14.
  • the adhesive supply device 60 and the application state confirmation device 80 can also be detachably installed in the feeder holding unit 14. Note that the component feeder 30, the adhesive supply device 60, and the application state confirmation device 80 will be described in detail later.
  • the head 16 is detachably attached to a moving base 18a (described later) of the moving device 18.
  • the head 16 has one or more nozzles 6 that pick up the electronic components 4.
  • the nozzles 6 are detachably attached to the head 16.
  • the head 16 can move the nozzles 6 in the Z direction (here, vertically) and move the nozzles 6 closer to and farther from the component feeders 30 and the circuit board 2 installed in the feeder holding section 14.
  • the head 16 can pick up the electronic components 4 supplied from the component feeders 30 with the nozzles 6, and can mount the electronic components 4 picked up by the nozzles 6 on the circuit board 2.
  • Different types of heads 16 can be attached to the moving base 18a depending on the type of electronic components 4.
  • a head 16 to which an adhesive tool 66 (described later) can be attached can also be attached to the moving base 18a.
  • the imaging device 20 is fixed to the movable base 18a (described later) and moves integrally with the movable base 18a.
  • the imaging device 20 is equipped with a camera and a light source.
  • the camera is positioned so that its imaging direction faces downward, and captures images of the upper surface of the circuit board 2 and the upper surface of a sheet 84 (described later) provided on the coating state checking device 80.
  • a CCD camera is used as the camera.
  • the light source is composed of an LED, and illuminates the upper surface of the circuit board 2 and the upper surface of the sheet 84.
  • Image data of the image captured by the imaging device 20 is stored in the memory (not shown) of the control device 26.
  • the moving device 18 moves the head 16 and the imaging device 20 between the component feeder 30 and the circuit board 2.
  • the moving device 18 in this embodiment is an XY robot that moves the moving base 18a in the X direction and in the Y direction perpendicular to the X direction on a horizontal plane.
  • the moving device 18 is composed of a guide rail that guides the moving base 18a, a moving mechanism that moves the moving base 18a along the guide rail, and a motor that drives the moving mechanism.
  • the moving device 18 is disposed above the component feeder 30 and the circuit board 2.
  • the head 16 and the imaging device 20 are attached to the moving base 18a.
  • the head 16 and the imaging device 20 move above the component feeder 30, adhesive supply device 60, or application state checking device 80 installed in the feeder holding section 14, and above the circuit board 2, by the moving device 18.
  • the board conveyor 22 transports the circuit board 2 in the X direction.
  • the board conveyor 22 is composed of a pair of belt conveyors, a support device attached to the belt conveyors and supporting the circuit board 2 from below, and a drive device that drives the belt conveyor.
  • the board conveyor 22 receives the circuit board 2 from an adjacent board work machine on one side, carries it into the component mounter 10, and positions the circuit board 2 at the component mounting position.
  • the board conveyor 22 carries the circuit board 2 out of the component mounter 10 and hands it over to the adjacent board work machine on the other side.
  • the control device 26 is configured using a computer having a CPU and a storage device.
  • the control device 26 controls the operation of each part of the component mounter 10 based on the production program transmitted from the management device 8. As shown in FIG. 4, the control device 26 is connected to the head 16, the moving device 18, the imaging device 20, the board conveyor 22, the operation panel 24, and the communication unit 28, and controls each part of the head 16, the moving device 18, the imaging device 20, the board conveyor 22, the operation panel 24, and the communication unit 28.
  • the control device 26 also acquires information from the component feeder 30, the adhesive supply device 60, and the application state confirmation device 80 installed in the feeder holding unit 14 via the connector 15.
  • the information acquired from the component feeder 30 is, for example, identification information (described later) for identifying the component feeder 30 and information regarding the remaining amount of electronic components 4.
  • the information acquired from the adhesive supply device 60 is, for example, identification information (described later) for identifying the adhesive supply device 60 and information regarding the remaining amount of adhesive in the adhesive tool 66 (described later).
  • the information acquired from the coating state checking device 80 includes, for example, identification information (described below) that identifies the coating state checking device 80 and information regarding the amount of the sheet 84 (described below) that has been taken up.
  • the operation panel 24 is a display device that provides the worker with various information about the component mounter 10, and is also an input device that accepts instructions and information from the worker.
  • the communication unit 28 transmits and receives information to and from the management device 8. Specifically, the communication unit 28 receives information related to the production program from the management device 8. The communication unit 28 also transmits information related to the component feeder 30, adhesive supply device 60, and application state confirmation device 80 installed in the feeder holding unit 14 to the management device 8.
  • the information related to the component feeder 30 is, for example, the identification information of the component feeder 30 and the remaining amount of electronic components 4 contained in the component feeder 30.
  • the information related to the adhesive supply device 60 is, for example, the identification information of the adhesive supply device 60 and the remaining amount of adhesive in an adhesive tool 66 (described later) contained in the adhesive supply device 60.
  • the information related to the application state confirmation device 80 is, for example, the identification information of the application state confirmation device 80 and the take-up amount of a sheet 84 (described later) installed in the application state confirmation device 80.
  • the component feeder 30 is removably installed on the feeder holding section 14, and supplies electronic components 4 to the component mounter 10 (specifically, the nozzle 6). As shown in FIG. 5, the component feeder 30 includes a main body 32, a reel 34 removably attached to the main body 32, a tape delivery mechanism 38, a connector 40, and a control device 42.
  • a long length of tape 36 is wound around the reel 34, and contains multiple electronic components 4 at regular intervals.
  • the tape feeding mechanism 38 feeds out the tape 36 containing the electronic components 4 from the reel 34 at regular intervals.
  • the amount of tape 36 fed out by the tape feeding mechanism 38 is set according to the spacing between the electronic components 4 contained on the tape 36.
  • the electronic components 4 on the tape 36 that have been fed out are picked up by the head 16 at the component removal position 44.
  • the reel 34 is replaceable with respect to the main body 32 of the component feeder 30.
  • the connector 40 is disposed on the side of the component feeder 30 facing the +Y direction (i.e., the side facing the board conveyor 22 when the component feeder 30 is placed on the feeder holding section 14). When the component feeder 30 is placed on the feeder holding section 14, the connector 40 is connected to the connector 15 of the feeder holding section 14.
  • the control device 42 controls each part of the component feeder 30.
  • the memory (not shown) of the control device 42 stores identification information for identifying the component feeder 30.
  • the identification information includes information about the reels 34 installed in the component feeder 30 and the types of electronic components 4 accommodated by the reels 34.
  • the component feeder 30 is a tape-type component feeder, but is not limited to this configuration.
  • the component feeder may be a tray-type component feeder that stores multiple electronic components 4 on a tray, or a bulk-type component feeder that stores multiple electronic components 4 randomly in a container.
  • the loader 50 is a device that automatically attaches and removes the component feeder 30 to and from the feeder holding section 14.
  • the loader 50 is configured to remove and retrieve the component feeder 30 to be replaced from the feeder holding section 14, and to attach the component feeder 30 to be used in production to the feeder holding section 14.
  • the component mounters 10 that make up the component mounting line 100 are arranged in one direction, and the loader 50 is configured to be movable to each slot of the feeder holding section 14 of each component mounter 10 by a guide rail 52 provided along that one direction (the X direction in FIG. 3).
  • the loader 50 moves between the feeder holding section 14 of each component mounter 10 and the storage 54 along the guide rail 52.
  • the loader 50 also moves the adhesive supply device 60 and the application state confirmation device 80 between the feeder holding section 14 of each component mounter 10 and the storage 54, and attaches and removes the adhesive supply device 60 and the application state confirmation device 80 to and from the feeder holding section 14.
  • the loader 50 is configured to be able to communicate with the management device 8.
  • the storage 54 is located further upstream of the component mounter 10 located at the most upstream of the component mounting line 100.
  • the storage 54 houses multiple component feeders 30. Specifically, the storage 54 houses component feeders 30 that are not used in the mounting process, and also houses component feeders 30 that have been used in the mounting process.
  • a guide rail 52 is installed in front of the storage 54. That is, the guide rail 52 is installed in front of the storage 54 and multiple component mounters 10.
  • the loader 50 moves the component feeders 30 stored in the storage 54 to each slot of the feeder holding unit 14 of each component mounter 10, and moves the component feeders 30 from each slot of the feeder holding unit 14 of each component mounter 10 to the storage 54.
  • the storage 54 also houses an adhesive supply device 60 and an application state confirmation device 80 in addition to the component feeders 30.
  • the adhesive supplying device 60 is detachably installed on the feeder holding section 14, and supplies adhesive to the component mounter 10. As shown in FIG. 6, the adhesive supplying device 60 includes a main body 62, a pocket 64 provided in the main body 62, an adhesive tool 66, a heater 68, a connector 70, and a control device 72.
  • the main body 62 has a shape that allows it to be installed in the feeder holding portion 14. That is, the main body 62 has a shape that follows the slots of the feeder holding portion 14.
  • the dimension of the main body 62 in the X direction is larger than the dimension of the component feeder 30 in the X direction. Therefore, the adhesive supply device 60 is installed across multiple slots (two slots in this embodiment) of the feeder holding portion 14.
  • the pocket 64 is provided on the upper surface of the main body 62 on the +Y direction side.
  • the pocket 64 has a shape capable of accommodating an adhesive tool 66.
  • the adhesive tool 66 is accommodated in the pocket 64.
  • the adhesive tool 66 accommodates an adhesive (e.g., glue, etc.).
  • the adhesive tool 66 is attached to a type of head 16 to which the adhesive tool 66 can be attached, and while attached to the head 16, it is moved between the adhesive supply device 60 and the circuit board 2 by the moving device 18.
  • the adhesive tool 66 is used to apply adhesive to the circuit board 2.
  • pressure is applied to the adhesive in the adhesive tool 66 by a pressure application device (not shown), and the adhesive in the adhesive tool 66 is discharged from the tip.
  • the heater 68 is disposed around the pocket 64.
  • the heater 68 adjusts the temperature of the adhesive tool 66 housed in the pocket 64.
  • the connector 70 is disposed on the side of the adhesive supplying device 60 facing the +Y direction (i.e., the side facing the board conveyor 22 when the adhesive supplying device 60 is installed in the feeder holding section 14). When the adhesive supplying device 60 is installed in the feeder holding section 14, the connector 70 is connected to the connector 15 of the feeder holding section 14.
  • the control device 72 controls each part of the adhesive supply device 60.
  • the memory (not shown) of the control device 72 stores identification information for identifying the adhesive supply device 60.
  • the identification information includes information regarding the type of adhesive contained in the adhesive supply device 60.
  • the control device 72 also calculates the remaining amount of adhesive in the adhesive tool 66. Specifically, the control device 72 calculates the remaining amount of adhesive from the amount of adhesive applied from the adhesive tool 66 per application and the number of uses. The calculated remaining amount of adhesive is stored in the memory of the control device 72. Note that in this embodiment, the control device 72 calculates the remaining amount of adhesive, but is not limited to this configuration.
  • the adhesive supply device may be equipped with a mass measuring device that measures the mass of the adhesive in the adhesive tool 66, and the control device 72 may store the mass of adhesive obtained from the mass measuring device in the memory as the remaining amount of adhesive.
  • the application state checking device 80 is used to check whether adhesive is being applied properly from the adhesive tool 66 housed in the adhesive supply device 60 (i.e., the application state of the adhesive).
  • the application state checking device 80 is detachably installed on the feeder holding unit 14. As shown in FIG. 7, the application state checking device 80 includes a main body 82, a sheet 84, a supply unit 86 that supplies the sheet 84, a winding unit 88 that winds up the sheet 84, a motor 89, a connector 90, and a control device 92.
  • the main body 82 like the main body 62 of the adhesive supply device 60, has a shape that allows it to be installed in the feeder holding section 14.
  • the dimension of the main body 82 in the X direction is greater than the dimension of the component feeder 30 in the X direction. For this reason, the application state checking device 80 is installed across multiple slots (two slots in this embodiment) of the feeder holding section 14.
  • the sheet 84 is used to test apply adhesive (i.e., test apply adhesive) using the adhesive tool 66 housed in the adhesive supply device 60.
  • the sheet 84 is supplied from the supply unit 86, exposed to the outside from the main body 82 at the test application position 85, and taken up by the winding unit 88.
  • the supply unit 86 and the winding unit 88 are rotatably supported by the main body 82.
  • a motor 89 is connected to the winding unit 88, and the motor 89 rotates the winding unit 88 in the direction in which the sheet 84 is wound up (clockwise in FIG. 7). When the winding unit 88 rotates and winds up the sheet 84, the sheet 84 is pulled, causing the supply unit 86 to rotate as well.
  • the connector 90 is disposed on the side of the coating state checking device 80 facing the +Y direction (i.e., the side facing the board conveyor 22 when the coating state checking device 80 is installed on the feeder holding unit 14). When the coating state checking device 80 is installed on the feeder holding unit 14, the connector 90 is connected to the connector 15 of the feeder holding unit 14.
  • the control device 92 controls each part of the application state checking device 80.
  • a memory (not shown) of the control device 92 stores identification information for identifying the application state checking device 80.
  • the control device 92 calculates the amount of the sheet 84 wound up by the winding unit 88. Specifically, the control device 92 calculates the amount of the sheet 84 wound up from the drive amount of the motor 89 connected to the winding unit 88. The calculated amount of the sheet 84 wound up is stored in the memory of the control device 92.
  • the operation of checking the adhesive application state is performed when the adhesive supply device 60 and the application state checking device 80 are installed in the feeder holding section 14. In addition, the operation of checking the adhesive application state is performed before the adhesive is applied to the circuit board 2.
  • the control device 26 of the component mounter 10 mounts the adhesive tool 66 housed in the adhesive supply device 60 to the head 16.
  • the control device 26 moves the adhesive tool 66 above the trial application position 85, and applies the adhesive in the adhesive tool 66 onto the sheet 84 exposed at the trial application position 85.
  • the control device 26 moves the imaging device 20 above the trial application position 85, and captures an image of the trial application position 85 from above.
  • the control device 26 determines from the captured image whether the size and shape of the applied adhesive are within a predetermined range.
  • the control device 26 transmits information that the trial application has been completed to the application status confirmation device 80 via the connectors 15 and 90.
  • control device 92 of the coating state checking device 80 When the control device 92 of the coating state checking device 80 receives information from the control device 26 that the test coating has been completed, it drives the motor 89 a predetermined amount and winds up the sheet 84 in the winding section 88. Then, the sheet 84 to which adhesive has been applied by the test coating moves from the test coating position 85 to the winding section 88 side, and the sheet 84 to which no adhesive has been applied is exposed at the test coating position 85.
  • the loader 50 moves the component feeder 30 between the storage 54 and each component mounter 10.
  • the management device 8 uses the loader 50 to move the component feeder 30 required for each component mounter 10 in accordance with the production program.
  • the loader 50 can also move the adhesive supply device 60 and the application status confirmation device 80.
  • adhesive may be applied to the circuit board 2.
  • multiple different types of adhesive may be applied to the circuit board 2.
  • the management device 8 uses the loader 50 to move the adhesive supply device 60 required for each component mounter 10 in accordance with the production program.
  • the component mounter 10 on which the adhesive supply device 60 is installed needs to be equipped with an application status confirmation device 80 for test application.
  • the management device 8 uses the loader 50 to move the appropriate types of component feeders 30, adhesive supply devices 60, and application state confirmation devices 80 between the storage 54 and each component mounting machine 10 so that the necessary component feeders 30, adhesive supply devices 60, and application state confirmation devices 80 are installed on each component mounting machine 10.
  • the management device 8 may install multiple adhesive supply devices 60 in one component mounting machine 10 as necessary.
  • different types of adhesive supply devices 60 may be installed in one component mounting machine 10, or two or more of the same type of adhesive supply devices 60 may be installed in one component mounting machine 10.
  • the adhesive supply devices 60 are moved to the component mounting machine 10 by the loader 50.
  • the adhesive supply devices 60 can be installed in the feeder holding unit 14. Therefore, two or more adhesive supply devices 60 can be installed in one component mounting machine 10. Note that, in FIG. 3, two adhesive supply devices 60 are installed in the feeder holding unit 14, but the number of adhesive supply devices 60 installed in the feeder holding unit 14 is not particularly limited.
  • the number of adhesive supply devices 60 installed in the feeder holding unit 14 may be one, or may be three or more. By being able to install multiple adhesive supply devices 60 in one component mounting machine 10, the production program in the component mounting line 100 can be flexibly created. Additionally, two or more application state checking devices 80 may be installed on one component mounter 10.
  • the identification information of the component feeder 30, adhesive supply device 60, and application state confirmation device 80 installed in the feeder holding section 14 is output to the control device 26 of the component mounter 10 via the connectors 15, 40, 70, and 90.
  • the control device 26 identifies what device is installed in each slot of the feeder holding section 14 based on the acquired identification information. For example, when the component feeder 30 is installed in the feeder holding section 14, the control device 26 identifies from the acquired identification information that the device installed in the feeder holding section 14 is the component feeder 30 and the type of electronic component 4 that the component feeder 30 contains.
  • the control device 26 identifies from the acquired identification information that the device installed in the feeder holding section 14 is the adhesive supply device 60 and the type of adhesive that the adhesive supply device 60 contains. Furthermore, when the coating state checking device 80 is installed in the feeder holding unit 14, the control device 26 identifies, from the acquired identification information, that the device installed in the feeder holding unit 14 is the coating state checking device 80.
  • the component mounter 10 in which the adhesive supply device 60 and the application state confirmation device 80 are installed acquires information regarding the remaining amount of adhesive from the adhesive supply device 60, and acquires information regarding the rolled-up amount of sheet 84 from the application state confirmation device 80.
  • the component mounter 10 acquires information regarding the remaining amount of adhesive and information regarding the rolled-up amount of sheet 84, it transmits the acquired information to the management device 8 via the communication unit 28. This allows the management device 8 to grasp the remaining amount of adhesive in the adhesive supply device 60 installed in each component mounter 10 and the remaining amount of usable sheet 84 in the application state confirmation device 80.
  • the management device 8 causes the loader 50 to replace the adhesive supply device 60 and the application status checking device 80 based on information regarding the remaining amount of adhesive acquired from each component mounting machine 10 and information regarding the rolled-up amount of sheet 84. Specifically, when the management device 8 determines from the acquired information regarding the remaining amount of adhesive that the remaining amount of adhesive is less than a predetermined amount, it causes the loader 50 to move the adhesive supply device 60 having the adhesive tool 66 with less than the predetermined amount of remaining adhesive from the feeder holding unit 14 to the storage unit 54. Then, the management device 8 causes the loader 50 to move the adhesive supply device 60 having the adhesive tool 66 that contains sufficient adhesive from the storage unit 54 to the feeder holding unit 14.
  • the management device 8 determines that the remaining amount of the usable sheet 84 is less than a predetermined amount based on the acquired information on the winding amount of the sheet 84, the management device 8 moves the application state checking device 80 with the remaining amount of the sheet 84 less than the predetermined amount from the feeder holding unit 14 to the storage 54 by the loader 50, and moves the application state checking device 80 with a sufficient amount of usable sheet 84 stored therein from the storage 54 to the feeder holding unit 14 by the loader 50.
  • not only the component feeder 30 but also the adhesive supply device 60 and the application state checking device 80 can be moved between the feeder holding unit 14 and the storage 54 using the loader 50, so that the adhesive supply device 60 and the application state checking device 80 installed in the component mounter 10 can be automatically replaced.
  • the adhesive supply device 60 and the application state checking device 80 can be moved using the loader 50 that moves the component feeder 30, the adhesive supply device 60 and the application state checking device 80 can be automatically replaced without adding a dedicated configuration for replacing the adhesive supply device 60 or the application state checking device 80.
  • the connector 15 in the embodiment is an example of an "acquisition unit”
  • the control device 26 is an example of an “identification unit”
  • the component feeder 30 is an example of a “component supply feeder”
  • the loader 50 is an example of a "movement device”
  • the control device 72 is an example of a "remaining amount measurement unit”
  • the control device 92 is an example of a "take-up amount measurement unit”.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

La présente invention concerne un système de montage de composants qui permet de monter un composant électronique sur un substrat. Le système de montage de composants comprend : un dispositif de montage de composants qui est pourvu d'une partie de maintien de dispositif d'alimentation ; un dispositif d'alimentation en composants qui est maintenu amovible par la partie de maintien de dispositif d'alimentation et qui fournit un composant électronique au dispositif de montage de composants ; un appareil d'alimentation en adhésif qui est maintenu amovible par la partie de maintien de dispositif d'alimentation et qui fournit un adhésif au dispositif de montage de composants ; un appareil de confirmation d'état d'application qui est maintenu amovible par la partie de maintien de dispositif d'alimentation, qui est équipé d'une feuille sur laquelle l'adhésif fourni par l'appareil d'alimentation en adhésif peut être appliqué, et qui confirme l'état d'application de l'adhésif fourni par l'appareil d'alimentation en adhésif, sur la base de l'état de l'adhésif appliqué sur la feuille ; un récipient de stockage qui contient le dispositif d'alimentation en composants, l'appareil d'alimentation en adhésif et l'appareil de confirmation de l'état d'application ; et un appareil de mouvement qui déplace le dispositif d'alimentation en composants entre le récipient de stockage et la partie de maintien de dispositif d'alimentation, et qui peut déplacer l'appareil d'alimentation en adhésif et l'appareil de confirmation d'état d'application entre le récipient de stockage et la partie de maintien de dispositif d'alimentation.
PCT/JP2022/040452 2022-10-28 2022-10-28 Système de montage de composants WO2024089886A1 (fr)

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WO2024089886A1 true WO2024089886A1 (fr) 2024-05-02

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001320159A (ja) * 2000-05-11 2001-11-16 Yamaha Motor Co Ltd 電子部品の実装方法および表面実装機
JP2006237566A (ja) * 2005-01-27 2006-09-07 Matsushita Electric Ind Co Ltd 部材交換順序決定方法およびその装置
JP2009253192A (ja) * 2008-04-10 2009-10-29 Panasonic Corp 電子部品実装用装置および粘性体の試し塗布装置
JP2010034571A (ja) * 2009-09-30 2010-02-12 Fuji Mach Mfg Co Ltd 電子回路部品装着機
JP2012104728A (ja) * 2010-11-12 2012-05-31 Fuji Mach Mfg Co Ltd 粘性液状物塗布装置
JP2016115910A (ja) * 2014-12-18 2016-06-23 富士機械製造株式会社 対基板作業装置および塗布ノズル用ユニット
JP2022040317A (ja) * 2018-02-16 2022-03-10 株式会社Fuji 基板作業システム

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001320159A (ja) * 2000-05-11 2001-11-16 Yamaha Motor Co Ltd 電子部品の実装方法および表面実装機
JP2006237566A (ja) * 2005-01-27 2006-09-07 Matsushita Electric Ind Co Ltd 部材交換順序決定方法およびその装置
JP2009253192A (ja) * 2008-04-10 2009-10-29 Panasonic Corp 電子部品実装用装置および粘性体の試し塗布装置
JP2010034571A (ja) * 2009-09-30 2010-02-12 Fuji Mach Mfg Co Ltd 電子回路部品装着機
JP2012104728A (ja) * 2010-11-12 2012-05-31 Fuji Mach Mfg Co Ltd 粘性液状物塗布装置
JP2016115910A (ja) * 2014-12-18 2016-06-23 富士機械製造株式会社 対基板作業装置および塗布ノズル用ユニット
JP2022040317A (ja) * 2018-02-16 2022-03-10 株式会社Fuji 基板作業システム

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