WO2024089886A1 - Component mounting system - Google Patents

Component mounting system Download PDF

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Publication number
WO2024089886A1
WO2024089886A1 PCT/JP2022/040452 JP2022040452W WO2024089886A1 WO 2024089886 A1 WO2024089886 A1 WO 2024089886A1 JP 2022040452 W JP2022040452 W JP 2022040452W WO 2024089886 A1 WO2024089886 A1 WO 2024089886A1
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WO
WIPO (PCT)
Prior art keywords
adhesive
component
feeder
feeder holding
unit
Prior art date
Application number
PCT/JP2022/040452
Other languages
French (fr)
Japanese (ja)
Inventor
剛史 溝口
Original Assignee
株式会社Fuji
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Fuji filed Critical 株式会社Fuji
Priority to PCT/JP2022/040452 priority Critical patent/WO2024089886A1/en
Publication of WO2024089886A1 publication Critical patent/WO2024089886A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Definitions

  • the technology disclosed in this specification relates to a component mounting system that mounts electronic components on a substrate.
  • Japanese Patent Application Laid-Open No. 9-75830 discloses a component mounting machine equipped with an adhesive supplying device that supplies adhesive.
  • the adhesive may not be applied properly on the board, for example, because the amount of adhesive applied is small.
  • a trial application is performed in which the adhesive is applied on a position other than the board.
  • the component mounting machine of Japanese Patent Application Laid-Open No. 9-75830 is provided with an application status checking device that has a sheet for trial application by the adhesive supplying device. Before applying adhesive to a circuit board, adhesive is trial applied to the sheet of the application status checking device. By checking the state of the adhesive trial applied to the sheet, it is confirmed whether the adhesive is properly supplied from the adhesive supplying device.
  • the type of circuit board to be produced may change, and the type of adhesive applied to the circuit board may change accordingly, and it may be necessary to replace it with a different type of adhesive before starting production with the component mounting machine.
  • the adhesive supply device when the amount of adhesive remaining in the adhesive supply device becomes insufficient, the adhesive supply device must be replaced.
  • the application status confirmation device when there are no more parts of the sheet that can be test-applied, the application status confirmation device must be replaced.
  • the adhesive supply device and application status confirmation device were installed on the component mounting machine by the operator. Therefore, when it becomes necessary to replace the adhesive supply device or application status confirmation device, the mounting process of the component mounting machine is stopped until the operator has completed the replacement work, resulting in problems of reduced productivity and increased labor costs.
  • This specification discloses technology for efficiently replacing or installing devices used to apply adhesive and devices used to check the state of adhesive application.
  • the component mounting system disclosed in this specification mounts electronic components on a board.
  • the component mounting system includes a component mounting machine provided with a feeder holding section, a component supply feeder that is detachably held in the feeder holding section and supplies electronic components to the component mounting machine, an adhesive supply device that is detachably held in the feeder holding section and supplies adhesive to the component mounting machine, an application status confirmation device that is detachably held in the feeder holding section and has a sheet on which adhesive supplied from the adhesive supply device can be applied and that confirms the application status of the adhesive supplied from the adhesive supply device based on the status of the adhesive applied to the sheet, a storage unit that houses the component supply feeder, the adhesive supply device, and the application status confirmation device, and a moving device that moves the component supply feeder between the storage unit and the feeder holding section and is configured to be able to move the adhesive supply device and the application status confirmation device between the storage unit and the feeder holding section.
  • the component supply feeder, adhesive supply device, and application status confirmation device can be installed in the feeder holding section, and can be moved by a moving device. This allows the adhesive supply device and application status confirmation device to be moved using the moving device that moves the component supply feeder, and also makes it possible to automatically install the adhesive supply device and application status confirmation device on the component mounting machine. This eliminates the need for an operator to replace the adhesive supply device and application status confirmation device, improving productivity.
  • FIG. 1 is a diagram showing a schematic configuration of a component mounting system according to an embodiment.
  • FIG. 2 is a diagram showing a schematic configuration of a component mounter.
  • FIG. 3 is a cross-sectional view taken along line III-III in FIG.
  • FIG. 2 is a block diagram showing a control system of the component mounter.
  • FIG. 2 is a diagram showing a schematic configuration of a parts feeder.
  • FIG. 2 is a diagram showing a schematic configuration of an adhesive supplying device.
  • FIG. 2 is a diagram showing a schematic configuration of a coating state checking device.
  • the component supply feeder may store first identification information that identifies the component supply feeder.
  • the adhesive supply device may store second identification information that identifies the adhesive supply device.
  • the coating state confirmation device may store third identification information that identifies the coating state confirmation device.
  • the component mounting machine may include an acquisition unit that is capable of communicating with each of the component supply feeder, adhesive supply device, and coating state confirmation device held in the feeder holding unit, and acquires first identification information, second identification information, and third identification information from each of the component supply feeder, adhesive supply device, and coating state confirmation device, and an identification unit that identifies the component supply feeder, adhesive supply device, and coating state confirmation device held in the feeder holding unit based on the first identification information, second identification information, and third identification information acquired by the acquisition unit.
  • the component mounting system disclosed in this specification may further include a management device that manages the component mounter and the moving device.
  • the adhesive supplying device may include a remaining amount measuring unit that measures the remaining amount of adhesive in the adhesive supplying device.
  • the component mounter may include a communication unit that transmits information about the remaining amount of adhesive measured by the remaining amount measuring unit of the adhesive supplying device held in the feeder holding unit to the management device.
  • the management device may move the adhesive supplying device from the feeder holding unit to a storage unit by the moving device, and may also move other adhesive supplying devices stored in the storage unit to the feeder holding unit. With this configuration, when the remaining amount of adhesive in the adhesive supplying device held in the feeder holding unit becomes low, the adhesive supplying device can be automatically replaced.
  • the component mounting system disclosed in this specification may further include a management device that manages the component mounter and the moving device.
  • the coating state confirmation device may include a winding unit that winds up the sheet, and a winding amount measuring unit that measures the winding amount of the sheet wound by the winding unit.
  • the component mounter may include a communication unit that transmits information about the winding amount of the sheet measured by the winding amount measuring unit of the coating state confirmation device held in the feeder holding unit to the management device.
  • the management device may move the coating state confirmation device from the feeder holding unit to the storage by the moving device, and may move other coating state confirmation devices stored in the storage to the feeder holding unit.
  • the feeder holding unit may be configured to be capable of holding multiple adhesive supply devices.
  • the time that the mounting process is stopped for the adhesive supply device replacement work can be shortened.
  • multiple adhesive supply devices that supply different types of adhesive can be installed simultaneously.
  • the component mounting system 1 includes a plurality of component mounters 10, a management device 8, a component feeder 30, a loader 50, a storage unit 54, an adhesive supply device 60, and an application status checking device 80.
  • each mounter 10 is communicatively connected to a management device 8.
  • the management device 8 is communicatively connected to the multiple mounters 10 and loaders 50, and manages the multiple mounters 10 and loaders 50.
  • the management device 8 and the multiple mounters 10 form a component mounting line 100.
  • the management device 8 is configured using a computer equipped with a CPU and a storage device.
  • the management device 8 controls the operation of each mounter 10 to control the entire component mounting line 100. That is, the management device 8 determines the type and position of the electronic components 4 to be mounted on the circuit board 2 by each of the multiple mounters 10, and instructs the mounters 10 of the type and position of the electronic components 4.
  • Each mounter 10 operates based on the instructions of the management device 8, and the necessary electronic components 4 are mounted on the circuit board 2.
  • the component mounter 10 mounts electronic components 4 on the circuit board 2.
  • the component mounter 10 is also called a surface mounter or chip mounter.
  • the circuit board 2 is sent from one end of the component mounting line 100 to the other end. Predetermined electronic components 4 are mounted on the circuit board 2 by each component mounter 10.
  • the circuit board 2 sent to the other end of the component mounting line 100 is shipped as a final product, or sent to a subsequent process as a semi-finished product.
  • the component mounter 10 includes a feeder holder 14, a head 16, an imaging device 20, a moving device 18 that moves the head 16 and the imaging device 20, a board conveyor 22, an operation panel 24, a communication unit 28, and a control device 26.
  • the feeder holding unit 14 has a plurality of slots, and the component feeder 30 can be detachably installed in each of the plurality of slots.
  • the feeder holding unit 14 may be fixed to the component mounter 10, or may be detachably installed with respect to the component mounter 10.
  • the feeder holding unit 14 has a connector 15.
  • FIG. 3 shows a state in which the component feeder 30 (and the adhesive supply device 60 and the application state confirmation device 80 described later) are not installed in the slot on the most +X direction side.
  • the connector 15 is provided at a position where it connects with the connector 40 (described later) of the component feeder 30 when the component feeder 30 is installed in the feeder holding unit 14.
  • the adhesive supply device 60 and the application state confirmation device 80 can also be detachably installed in the feeder holding unit 14. Note that the component feeder 30, the adhesive supply device 60, and the application state confirmation device 80 will be described in detail later.
  • the head 16 is detachably attached to a moving base 18a (described later) of the moving device 18.
  • the head 16 has one or more nozzles 6 that pick up the electronic components 4.
  • the nozzles 6 are detachably attached to the head 16.
  • the head 16 can move the nozzles 6 in the Z direction (here, vertically) and move the nozzles 6 closer to and farther from the component feeders 30 and the circuit board 2 installed in the feeder holding section 14.
  • the head 16 can pick up the electronic components 4 supplied from the component feeders 30 with the nozzles 6, and can mount the electronic components 4 picked up by the nozzles 6 on the circuit board 2.
  • Different types of heads 16 can be attached to the moving base 18a depending on the type of electronic components 4.
  • a head 16 to which an adhesive tool 66 (described later) can be attached can also be attached to the moving base 18a.
  • the imaging device 20 is fixed to the movable base 18a (described later) and moves integrally with the movable base 18a.
  • the imaging device 20 is equipped with a camera and a light source.
  • the camera is positioned so that its imaging direction faces downward, and captures images of the upper surface of the circuit board 2 and the upper surface of a sheet 84 (described later) provided on the coating state checking device 80.
  • a CCD camera is used as the camera.
  • the light source is composed of an LED, and illuminates the upper surface of the circuit board 2 and the upper surface of the sheet 84.
  • Image data of the image captured by the imaging device 20 is stored in the memory (not shown) of the control device 26.
  • the moving device 18 moves the head 16 and the imaging device 20 between the component feeder 30 and the circuit board 2.
  • the moving device 18 in this embodiment is an XY robot that moves the moving base 18a in the X direction and in the Y direction perpendicular to the X direction on a horizontal plane.
  • the moving device 18 is composed of a guide rail that guides the moving base 18a, a moving mechanism that moves the moving base 18a along the guide rail, and a motor that drives the moving mechanism.
  • the moving device 18 is disposed above the component feeder 30 and the circuit board 2.
  • the head 16 and the imaging device 20 are attached to the moving base 18a.
  • the head 16 and the imaging device 20 move above the component feeder 30, adhesive supply device 60, or application state checking device 80 installed in the feeder holding section 14, and above the circuit board 2, by the moving device 18.
  • the board conveyor 22 transports the circuit board 2 in the X direction.
  • the board conveyor 22 is composed of a pair of belt conveyors, a support device attached to the belt conveyors and supporting the circuit board 2 from below, and a drive device that drives the belt conveyor.
  • the board conveyor 22 receives the circuit board 2 from an adjacent board work machine on one side, carries it into the component mounter 10, and positions the circuit board 2 at the component mounting position.
  • the board conveyor 22 carries the circuit board 2 out of the component mounter 10 and hands it over to the adjacent board work machine on the other side.
  • the control device 26 is configured using a computer having a CPU and a storage device.
  • the control device 26 controls the operation of each part of the component mounter 10 based on the production program transmitted from the management device 8. As shown in FIG. 4, the control device 26 is connected to the head 16, the moving device 18, the imaging device 20, the board conveyor 22, the operation panel 24, and the communication unit 28, and controls each part of the head 16, the moving device 18, the imaging device 20, the board conveyor 22, the operation panel 24, and the communication unit 28.
  • the control device 26 also acquires information from the component feeder 30, the adhesive supply device 60, and the application state confirmation device 80 installed in the feeder holding unit 14 via the connector 15.
  • the information acquired from the component feeder 30 is, for example, identification information (described later) for identifying the component feeder 30 and information regarding the remaining amount of electronic components 4.
  • the information acquired from the adhesive supply device 60 is, for example, identification information (described later) for identifying the adhesive supply device 60 and information regarding the remaining amount of adhesive in the adhesive tool 66 (described later).
  • the information acquired from the coating state checking device 80 includes, for example, identification information (described below) that identifies the coating state checking device 80 and information regarding the amount of the sheet 84 (described below) that has been taken up.
  • the operation panel 24 is a display device that provides the worker with various information about the component mounter 10, and is also an input device that accepts instructions and information from the worker.
  • the communication unit 28 transmits and receives information to and from the management device 8. Specifically, the communication unit 28 receives information related to the production program from the management device 8. The communication unit 28 also transmits information related to the component feeder 30, adhesive supply device 60, and application state confirmation device 80 installed in the feeder holding unit 14 to the management device 8.
  • the information related to the component feeder 30 is, for example, the identification information of the component feeder 30 and the remaining amount of electronic components 4 contained in the component feeder 30.
  • the information related to the adhesive supply device 60 is, for example, the identification information of the adhesive supply device 60 and the remaining amount of adhesive in an adhesive tool 66 (described later) contained in the adhesive supply device 60.
  • the information related to the application state confirmation device 80 is, for example, the identification information of the application state confirmation device 80 and the take-up amount of a sheet 84 (described later) installed in the application state confirmation device 80.
  • the component feeder 30 is removably installed on the feeder holding section 14, and supplies electronic components 4 to the component mounter 10 (specifically, the nozzle 6). As shown in FIG. 5, the component feeder 30 includes a main body 32, a reel 34 removably attached to the main body 32, a tape delivery mechanism 38, a connector 40, and a control device 42.
  • a long length of tape 36 is wound around the reel 34, and contains multiple electronic components 4 at regular intervals.
  • the tape feeding mechanism 38 feeds out the tape 36 containing the electronic components 4 from the reel 34 at regular intervals.
  • the amount of tape 36 fed out by the tape feeding mechanism 38 is set according to the spacing between the electronic components 4 contained on the tape 36.
  • the electronic components 4 on the tape 36 that have been fed out are picked up by the head 16 at the component removal position 44.
  • the reel 34 is replaceable with respect to the main body 32 of the component feeder 30.
  • the connector 40 is disposed on the side of the component feeder 30 facing the +Y direction (i.e., the side facing the board conveyor 22 when the component feeder 30 is placed on the feeder holding section 14). When the component feeder 30 is placed on the feeder holding section 14, the connector 40 is connected to the connector 15 of the feeder holding section 14.
  • the control device 42 controls each part of the component feeder 30.
  • the memory (not shown) of the control device 42 stores identification information for identifying the component feeder 30.
  • the identification information includes information about the reels 34 installed in the component feeder 30 and the types of electronic components 4 accommodated by the reels 34.
  • the component feeder 30 is a tape-type component feeder, but is not limited to this configuration.
  • the component feeder may be a tray-type component feeder that stores multiple electronic components 4 on a tray, or a bulk-type component feeder that stores multiple electronic components 4 randomly in a container.
  • the loader 50 is a device that automatically attaches and removes the component feeder 30 to and from the feeder holding section 14.
  • the loader 50 is configured to remove and retrieve the component feeder 30 to be replaced from the feeder holding section 14, and to attach the component feeder 30 to be used in production to the feeder holding section 14.
  • the component mounters 10 that make up the component mounting line 100 are arranged in one direction, and the loader 50 is configured to be movable to each slot of the feeder holding section 14 of each component mounter 10 by a guide rail 52 provided along that one direction (the X direction in FIG. 3).
  • the loader 50 moves between the feeder holding section 14 of each component mounter 10 and the storage 54 along the guide rail 52.
  • the loader 50 also moves the adhesive supply device 60 and the application state confirmation device 80 between the feeder holding section 14 of each component mounter 10 and the storage 54, and attaches and removes the adhesive supply device 60 and the application state confirmation device 80 to and from the feeder holding section 14.
  • the loader 50 is configured to be able to communicate with the management device 8.
  • the storage 54 is located further upstream of the component mounter 10 located at the most upstream of the component mounting line 100.
  • the storage 54 houses multiple component feeders 30. Specifically, the storage 54 houses component feeders 30 that are not used in the mounting process, and also houses component feeders 30 that have been used in the mounting process.
  • a guide rail 52 is installed in front of the storage 54. That is, the guide rail 52 is installed in front of the storage 54 and multiple component mounters 10.
  • the loader 50 moves the component feeders 30 stored in the storage 54 to each slot of the feeder holding unit 14 of each component mounter 10, and moves the component feeders 30 from each slot of the feeder holding unit 14 of each component mounter 10 to the storage 54.
  • the storage 54 also houses an adhesive supply device 60 and an application state confirmation device 80 in addition to the component feeders 30.
  • the adhesive supplying device 60 is detachably installed on the feeder holding section 14, and supplies adhesive to the component mounter 10. As shown in FIG. 6, the adhesive supplying device 60 includes a main body 62, a pocket 64 provided in the main body 62, an adhesive tool 66, a heater 68, a connector 70, and a control device 72.
  • the main body 62 has a shape that allows it to be installed in the feeder holding portion 14. That is, the main body 62 has a shape that follows the slots of the feeder holding portion 14.
  • the dimension of the main body 62 in the X direction is larger than the dimension of the component feeder 30 in the X direction. Therefore, the adhesive supply device 60 is installed across multiple slots (two slots in this embodiment) of the feeder holding portion 14.
  • the pocket 64 is provided on the upper surface of the main body 62 on the +Y direction side.
  • the pocket 64 has a shape capable of accommodating an adhesive tool 66.
  • the adhesive tool 66 is accommodated in the pocket 64.
  • the adhesive tool 66 accommodates an adhesive (e.g., glue, etc.).
  • the adhesive tool 66 is attached to a type of head 16 to which the adhesive tool 66 can be attached, and while attached to the head 16, it is moved between the adhesive supply device 60 and the circuit board 2 by the moving device 18.
  • the adhesive tool 66 is used to apply adhesive to the circuit board 2.
  • pressure is applied to the adhesive in the adhesive tool 66 by a pressure application device (not shown), and the adhesive in the adhesive tool 66 is discharged from the tip.
  • the heater 68 is disposed around the pocket 64.
  • the heater 68 adjusts the temperature of the adhesive tool 66 housed in the pocket 64.
  • the connector 70 is disposed on the side of the adhesive supplying device 60 facing the +Y direction (i.e., the side facing the board conveyor 22 when the adhesive supplying device 60 is installed in the feeder holding section 14). When the adhesive supplying device 60 is installed in the feeder holding section 14, the connector 70 is connected to the connector 15 of the feeder holding section 14.
  • the control device 72 controls each part of the adhesive supply device 60.
  • the memory (not shown) of the control device 72 stores identification information for identifying the adhesive supply device 60.
  • the identification information includes information regarding the type of adhesive contained in the adhesive supply device 60.
  • the control device 72 also calculates the remaining amount of adhesive in the adhesive tool 66. Specifically, the control device 72 calculates the remaining amount of adhesive from the amount of adhesive applied from the adhesive tool 66 per application and the number of uses. The calculated remaining amount of adhesive is stored in the memory of the control device 72. Note that in this embodiment, the control device 72 calculates the remaining amount of adhesive, but is not limited to this configuration.
  • the adhesive supply device may be equipped with a mass measuring device that measures the mass of the adhesive in the adhesive tool 66, and the control device 72 may store the mass of adhesive obtained from the mass measuring device in the memory as the remaining amount of adhesive.
  • the application state checking device 80 is used to check whether adhesive is being applied properly from the adhesive tool 66 housed in the adhesive supply device 60 (i.e., the application state of the adhesive).
  • the application state checking device 80 is detachably installed on the feeder holding unit 14. As shown in FIG. 7, the application state checking device 80 includes a main body 82, a sheet 84, a supply unit 86 that supplies the sheet 84, a winding unit 88 that winds up the sheet 84, a motor 89, a connector 90, and a control device 92.
  • the main body 82 like the main body 62 of the adhesive supply device 60, has a shape that allows it to be installed in the feeder holding section 14.
  • the dimension of the main body 82 in the X direction is greater than the dimension of the component feeder 30 in the X direction. For this reason, the application state checking device 80 is installed across multiple slots (two slots in this embodiment) of the feeder holding section 14.
  • the sheet 84 is used to test apply adhesive (i.e., test apply adhesive) using the adhesive tool 66 housed in the adhesive supply device 60.
  • the sheet 84 is supplied from the supply unit 86, exposed to the outside from the main body 82 at the test application position 85, and taken up by the winding unit 88.
  • the supply unit 86 and the winding unit 88 are rotatably supported by the main body 82.
  • a motor 89 is connected to the winding unit 88, and the motor 89 rotates the winding unit 88 in the direction in which the sheet 84 is wound up (clockwise in FIG. 7). When the winding unit 88 rotates and winds up the sheet 84, the sheet 84 is pulled, causing the supply unit 86 to rotate as well.
  • the connector 90 is disposed on the side of the coating state checking device 80 facing the +Y direction (i.e., the side facing the board conveyor 22 when the coating state checking device 80 is installed on the feeder holding unit 14). When the coating state checking device 80 is installed on the feeder holding unit 14, the connector 90 is connected to the connector 15 of the feeder holding unit 14.
  • the control device 92 controls each part of the application state checking device 80.
  • a memory (not shown) of the control device 92 stores identification information for identifying the application state checking device 80.
  • the control device 92 calculates the amount of the sheet 84 wound up by the winding unit 88. Specifically, the control device 92 calculates the amount of the sheet 84 wound up from the drive amount of the motor 89 connected to the winding unit 88. The calculated amount of the sheet 84 wound up is stored in the memory of the control device 92.
  • the operation of checking the adhesive application state is performed when the adhesive supply device 60 and the application state checking device 80 are installed in the feeder holding section 14. In addition, the operation of checking the adhesive application state is performed before the adhesive is applied to the circuit board 2.
  • the control device 26 of the component mounter 10 mounts the adhesive tool 66 housed in the adhesive supply device 60 to the head 16.
  • the control device 26 moves the adhesive tool 66 above the trial application position 85, and applies the adhesive in the adhesive tool 66 onto the sheet 84 exposed at the trial application position 85.
  • the control device 26 moves the imaging device 20 above the trial application position 85, and captures an image of the trial application position 85 from above.
  • the control device 26 determines from the captured image whether the size and shape of the applied adhesive are within a predetermined range.
  • the control device 26 transmits information that the trial application has been completed to the application status confirmation device 80 via the connectors 15 and 90.
  • control device 92 of the coating state checking device 80 When the control device 92 of the coating state checking device 80 receives information from the control device 26 that the test coating has been completed, it drives the motor 89 a predetermined amount and winds up the sheet 84 in the winding section 88. Then, the sheet 84 to which adhesive has been applied by the test coating moves from the test coating position 85 to the winding section 88 side, and the sheet 84 to which no adhesive has been applied is exposed at the test coating position 85.
  • the loader 50 moves the component feeder 30 between the storage 54 and each component mounter 10.
  • the management device 8 uses the loader 50 to move the component feeder 30 required for each component mounter 10 in accordance with the production program.
  • the loader 50 can also move the adhesive supply device 60 and the application status confirmation device 80.
  • adhesive may be applied to the circuit board 2.
  • multiple different types of adhesive may be applied to the circuit board 2.
  • the management device 8 uses the loader 50 to move the adhesive supply device 60 required for each component mounter 10 in accordance with the production program.
  • the component mounter 10 on which the adhesive supply device 60 is installed needs to be equipped with an application status confirmation device 80 for test application.
  • the management device 8 uses the loader 50 to move the appropriate types of component feeders 30, adhesive supply devices 60, and application state confirmation devices 80 between the storage 54 and each component mounting machine 10 so that the necessary component feeders 30, adhesive supply devices 60, and application state confirmation devices 80 are installed on each component mounting machine 10.
  • the management device 8 may install multiple adhesive supply devices 60 in one component mounting machine 10 as necessary.
  • different types of adhesive supply devices 60 may be installed in one component mounting machine 10, or two or more of the same type of adhesive supply devices 60 may be installed in one component mounting machine 10.
  • the adhesive supply devices 60 are moved to the component mounting machine 10 by the loader 50.
  • the adhesive supply devices 60 can be installed in the feeder holding unit 14. Therefore, two or more adhesive supply devices 60 can be installed in one component mounting machine 10. Note that, in FIG. 3, two adhesive supply devices 60 are installed in the feeder holding unit 14, but the number of adhesive supply devices 60 installed in the feeder holding unit 14 is not particularly limited.
  • the number of adhesive supply devices 60 installed in the feeder holding unit 14 may be one, or may be three or more. By being able to install multiple adhesive supply devices 60 in one component mounting machine 10, the production program in the component mounting line 100 can be flexibly created. Additionally, two or more application state checking devices 80 may be installed on one component mounter 10.
  • the identification information of the component feeder 30, adhesive supply device 60, and application state confirmation device 80 installed in the feeder holding section 14 is output to the control device 26 of the component mounter 10 via the connectors 15, 40, 70, and 90.
  • the control device 26 identifies what device is installed in each slot of the feeder holding section 14 based on the acquired identification information. For example, when the component feeder 30 is installed in the feeder holding section 14, the control device 26 identifies from the acquired identification information that the device installed in the feeder holding section 14 is the component feeder 30 and the type of electronic component 4 that the component feeder 30 contains.
  • the control device 26 identifies from the acquired identification information that the device installed in the feeder holding section 14 is the adhesive supply device 60 and the type of adhesive that the adhesive supply device 60 contains. Furthermore, when the coating state checking device 80 is installed in the feeder holding unit 14, the control device 26 identifies, from the acquired identification information, that the device installed in the feeder holding unit 14 is the coating state checking device 80.
  • the component mounter 10 in which the adhesive supply device 60 and the application state confirmation device 80 are installed acquires information regarding the remaining amount of adhesive from the adhesive supply device 60, and acquires information regarding the rolled-up amount of sheet 84 from the application state confirmation device 80.
  • the component mounter 10 acquires information regarding the remaining amount of adhesive and information regarding the rolled-up amount of sheet 84, it transmits the acquired information to the management device 8 via the communication unit 28. This allows the management device 8 to grasp the remaining amount of adhesive in the adhesive supply device 60 installed in each component mounter 10 and the remaining amount of usable sheet 84 in the application state confirmation device 80.
  • the management device 8 causes the loader 50 to replace the adhesive supply device 60 and the application status checking device 80 based on information regarding the remaining amount of adhesive acquired from each component mounting machine 10 and information regarding the rolled-up amount of sheet 84. Specifically, when the management device 8 determines from the acquired information regarding the remaining amount of adhesive that the remaining amount of adhesive is less than a predetermined amount, it causes the loader 50 to move the adhesive supply device 60 having the adhesive tool 66 with less than the predetermined amount of remaining adhesive from the feeder holding unit 14 to the storage unit 54. Then, the management device 8 causes the loader 50 to move the adhesive supply device 60 having the adhesive tool 66 that contains sufficient adhesive from the storage unit 54 to the feeder holding unit 14.
  • the management device 8 determines that the remaining amount of the usable sheet 84 is less than a predetermined amount based on the acquired information on the winding amount of the sheet 84, the management device 8 moves the application state checking device 80 with the remaining amount of the sheet 84 less than the predetermined amount from the feeder holding unit 14 to the storage 54 by the loader 50, and moves the application state checking device 80 with a sufficient amount of usable sheet 84 stored therein from the storage 54 to the feeder holding unit 14 by the loader 50.
  • not only the component feeder 30 but also the adhesive supply device 60 and the application state checking device 80 can be moved between the feeder holding unit 14 and the storage 54 using the loader 50, so that the adhesive supply device 60 and the application state checking device 80 installed in the component mounter 10 can be automatically replaced.
  • the adhesive supply device 60 and the application state checking device 80 can be moved using the loader 50 that moves the component feeder 30, the adhesive supply device 60 and the application state checking device 80 can be automatically replaced without adding a dedicated configuration for replacing the adhesive supply device 60 or the application state checking device 80.
  • the connector 15 in the embodiment is an example of an "acquisition unit”
  • the control device 26 is an example of an “identification unit”
  • the component feeder 30 is an example of a “component supply feeder”
  • the loader 50 is an example of a "movement device”
  • the control device 72 is an example of a "remaining amount measurement unit”
  • the control device 92 is an example of a "take-up amount measurement unit”.

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  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

This component mounting system mounts an electronic component to a substrate. The component mounting system comprises: a component mounting device that is provided with a feeder holding part; a component supply feeder that is removably held by the feeder holding part and that supplies an electronic component to the component mounting device; an adhesive supply apparatus that is removably held by the feeder holding part and that supplies an adhesive to the component mounting device; an application state confirmation apparatus that is removably held by the feeder holding part, that is provided with a sheet to which the adhesive supplied from the adhesive supply apparatus can be applied, and that confirms the state of application of the adhesive supplied from the adhesive supply apparatus, on the basis of the state of the adhesive applied to the sheet; a storage container that accommodates the component supply feeder, the adhesive supply apparatus, and the application state confirmation apparatus; and a movement apparatus that moves the component supply feeder between the storage container and the feeder holding part and that can move the adhesive supply apparatus and the application state confirmation apparatus between the storage container and the feeder holding part.

Description

部品実装システムComponent Mounting System
　本明細書に開示する技術は、電子部品を基板に実装する部品実装システムに関する。 The technology disclosed in this specification relates to a component mounting system that mounts electronic components on a substrate.
　電子部品を基板に実装する部品実装機では、基板に接着剤を塗布して電子部品を実装することがある。例えば、特開平９－７５８３０号公報には、接着剤を供給する接着剤供給装置を備える部品実装機が開示されている。接着剤供給装置により接着剤を基板に塗布したときに、例えば接着剤の塗布量が少ない等、基板上に接着剤が適切に塗布されないことがある。このため、基板に接着剤を塗布する前に、基板とは別の位置に接着剤を試験的に塗布する試し塗布が行われる。特開平９－７５８３０号公報の部品実装機には、接着剤供給装置を試し塗布するためのシートを備える塗布状態確認装置が設けられている。回路基板に接着剤を塗布する前に、塗布状態確認装置のシートに接着剤が試し塗布される。シートに試し塗布された接着剤の状態を確認することによって、接着剤供給装置から適切に接着剤が供給されるか否かが確認される。 In a component mounting machine that mounts electronic components on a board, adhesive is sometimes applied to the board to mount the electronic components. For example, Japanese Patent Application Laid-Open No. 9-75830 discloses a component mounting machine equipped with an adhesive supplying device that supplies adhesive. When adhesive is applied to a board by the adhesive supplying device, the adhesive may not be applied properly on the board, for example, because the amount of adhesive applied is small. For this reason, before applying adhesive to the board, a trial application is performed in which the adhesive is applied on a position other than the board. The component mounting machine of Japanese Patent Application Laid-Open No. 9-75830 is provided with an application status checking device that has a sheet for trial application by the adhesive supplying device. Before applying adhesive to a circuit board, adhesive is trial applied to the sheet of the application status checking device. By checking the state of the adhesive trial applied to the sheet, it is confirmed whether the adhesive is properly supplied from the adhesive supplying device.
　生産計画によっては生産する回路基板の種類が変更されることがあり、それに伴って回路基板に塗布される接着剤の種類が異なり、部品実装機による生産を開始する前に異なる種類の接着剤に取り替えなければならないことがある。また、接着剤供給装置内の接着剤の残量が不十分になると、接着剤供給装置を交換する必要が生じる。同様に、塗布状態確認装置についても、シートに試し塗布可能な部分がなくなると、塗布状態確認装置を交換する必要が生じる。しかしなかがら、特開平９－７５８３０号公報の部品実装機では、接着剤供給装置及び塗布状態確認装置は、作業者によって部品実装機に設置されていた。このため、接着剤供給装置や塗布状態確認装置を交換する必要が生じると、作業者による交換作業が完了するまで部品実装機の実装処理が停止されてしまい、生産性が低下すると共に、人件費がかかるという問題があった。 Depending on the production plan, the type of circuit board to be produced may change, and the type of adhesive applied to the circuit board may change accordingly, and it may be necessary to replace it with a different type of adhesive before starting production with the component mounting machine. Also, when the amount of adhesive remaining in the adhesive supply device becomes insufficient, the adhesive supply device must be replaced. Similarly, when there are no more parts of the sheet that can be test-applied, the application status confirmation device must be replaced. However, in the component mounting machine of JP Patent Publication 9-75830, the adhesive supply device and application status confirmation device were installed on the component mounting machine by the operator. Therefore, when it becomes necessary to replace the adhesive supply device or application status confirmation device, the mounting process of the component mounting machine is stopped until the operator has completed the replacement work, resulting in problems of reduced productivity and increased labor costs.
　本明細書は、接着剤の塗布に用いる装置や接着剤の塗布状態を確認するために用いる装置を効率良く交換又は設置するための技術を開示する。 This specification discloses technology for efficiently replacing or installing devices used to apply adhesive and devices used to check the state of adhesive application.
　本明細書に開示する部品実装システムは、電子部品を基板に実装する。部品実装システムは、フィーダ保持部が設けられた部品実装機と、フィーダ保持部に着脱可能に保持され、電子部品を部品実装機に供給する部品供給フィーダと、フィーダ保持部に着脱可能に保持され、接着剤を部品実装機に供給する接着剤供給装置と、フィーダ保持部に着脱可能に保持され、接着剤供給装置から供給される接着剤を塗布可能なシートを備え、シートに塗布された接着剤の状態に基づいて接着剤供給装置から供給される接着剤の塗布状態を確認する塗布状態確認装置と、部品供給フィーダ、接着剤供給装置及び塗布状態確認装置を収容する保管庫と、保管庫とフィーダ保持部との間で部品供給フィーダを移動させると共に、保管庫とフィーダ保持部との間で接着剤供給装置及び塗布状態確認装置を移動可能に構成されている移動装置と、を備える。 The component mounting system disclosed in this specification mounts electronic components on a board. The component mounting system includes a component mounting machine provided with a feeder holding section, a component supply feeder that is detachably held in the feeder holding section and supplies electronic components to the component mounting machine, an adhesive supply device that is detachably held in the feeder holding section and supplies adhesive to the component mounting machine, an application status confirmation device that is detachably held in the feeder holding section and has a sheet on which adhesive supplied from the adhesive supply device can be applied and that confirms the application status of the adhesive supplied from the adhesive supply device based on the status of the adhesive applied to the sheet, a storage unit that houses the component supply feeder, the adhesive supply device, and the application status confirmation device, and a moving device that moves the component supply feeder between the storage unit and the feeder holding section and is configured to be able to move the adhesive supply device and the application status confirmation device between the storage unit and the feeder holding section.
　部品供給フィーダと接着剤供給装置と塗布状態確認装置は、フィーダ保持部に設置可能とされ、かつ、これらは移動装置により移動可能となっている。これにより、部品供給フィーダを移動させる移動装置を用いて接着剤供給装置と塗布確状態認装置を移動させることができ、また、接着剤供給装置と塗布確状態認装置を自動で部品実装機に設置することが可能となる。このため、作業者による接着剤供給装置と塗布確状態認装置の交換作業が不要となり、生産性を向上させることができる。 The component supply feeder, adhesive supply device, and application status confirmation device can be installed in the feeder holding section, and can be moved by a moving device. This allows the adhesive supply device and application status confirmation device to be moved using the moving device that moves the component supply feeder, and also makes it possible to automatically install the adhesive supply device and application status confirmation device on the component mounting machine. This eliminates the need for an operator to replace the adhesive supply device and application status confirmation device, improving productivity.
実施例に係る部品実装システムの概略構成を示す図。FIG. 1 is a diagram showing a schematic configuration of a component mounting system according to an embodiment. 部品実装機の概略構成を示す図。FIG. 2 is a diagram showing a schematic configuration of a component mounter. 図２のＩＩＩ－ＩＩＩ線における断面図。FIG. 3 is a cross-sectional view taken along line III-III in FIG. 部品実装機の制御系を示すブロック図。FIG. 2 is a block diagram showing a control system of the component mounter. 部品フィーダの概略構成を示す図。FIG. 2 is a diagram showing a schematic configuration of a parts feeder. 接着剤供給装置の概略構成を示す図。FIG. 2 is a diagram showing a schematic configuration of an adhesive supplying device. 塗布状態確認装置の概略構成を示す図。FIG. 2 is a diagram showing a schematic configuration of a coating state checking device.
　以下に説明する実施例の主要な特徴を列記しておく。なお、以下に記載する技術要素は、それぞれ独立した技術要素であって、単独であるいは各種の組合せによって技術的有用性を発揮するものであり、出願時の請求項に記載の組合せに限定されるものではない。 The main features of the embodiments described below are listed below. Note that the technical elements described below are independent technical elements that demonstrate technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing.
　本明細書に開示する部品実装システムでは、部品供給フィーダは、当該部品供給フィーダを識別する第１識別情報を記憶していてもよい。接着剤供給装置は、当該接着剤供給装置を識別する第２識別情報を記憶していてもよい。塗布状態確認装置は、当該塗布状態確認装置を識別する第３識別情報を記憶していてもよい。部品実装機は、フィーダ保持部に保持されている部品供給フィーダ、接着剤供給装置及び塗布状態確認装置とそれぞれ通信可能であり、当該部品供給フィーダ、当該接着剤供給装置及び当該塗布状態確認装置のそれぞれから第１識別情報、第２識別情報及び第３識別情報を取得する取得部と、取得部で取得した第１識別情報、第２識別及び第３識別情報に基づいて、フィーダ保持部に保持されている部品供給フィーダ、接着剤供給装置及び塗布状態確認装置を識別する識別部と、を備えていてもよい。このような構成によると、フィーダ保持部に部品供給フィーダ、接着剤供給装置又は塗布状態確認装置を設置すると、フィーダ保持部に部品供給フィーダ、接着剤供給装置及び塗布状態確認装置識別のいずれが設置されたのかを識別することができる。また、識別情報から部品供給フィーダや接着剤供給装置の種類も識別可能とすることもできる。 In the component mounting system disclosed in this specification, the component supply feeder may store first identification information that identifies the component supply feeder. The adhesive supply device may store second identification information that identifies the adhesive supply device. The coating state confirmation device may store third identification information that identifies the coating state confirmation device. The component mounting machine may include an acquisition unit that is capable of communicating with each of the component supply feeder, adhesive supply device, and coating state confirmation device held in the feeder holding unit, and acquires first identification information, second identification information, and third identification information from each of the component supply feeder, adhesive supply device, and coating state confirmation device, and an identification unit that identifies the component supply feeder, adhesive supply device, and coating state confirmation device held in the feeder holding unit based on the first identification information, second identification information, and third identification information acquired by the acquisition unit. With this configuration, when the component supply feeder, adhesive supply device, or coating state confirmation device is installed in the feeder holding unit, it is possible to identify which of the component supply feeder, adhesive supply device, and coating state confirmation device is installed in the feeder holding unit. It is also possible to identify the type of component supply feeder or adhesive supply device from the identification information.
　本明細書に開示する部品実装システムは、部品実装機及び移動装置を管理する管理装置をさらに備えていてもよい。接着剤供給装置は、当該接着剤供給装置の接着剤の残量を計測する残量計測部を備えていてもよい。部品実装機は、フィーダ保持部に保持されている接着剤供給装置の残量計測部で計測された接着剤の残量に関する情報を管理装置に送信する通信部を備えていてもよい。管理装置は、フィーダ保持部に保持されている接着剤供給装置の接着剤の残量が所定量より少なくなると、移動装置によって、当該接着剤供給装置をフィーダ保持部から保管庫に移動させると共に、保管庫に収容されている他の接着剤供給装置をフィーダ保持部に移動させてもよい。このような構成によると、フィーダ保持部に保持されている接着剤供給装置の接着剤の残量が少なくなると、接着剤供給装置を自動で交換することができる。 The component mounting system disclosed in this specification may further include a management device that manages the component mounter and the moving device. The adhesive supplying device may include a remaining amount measuring unit that measures the remaining amount of adhesive in the adhesive supplying device. The component mounter may include a communication unit that transmits information about the remaining amount of adhesive measured by the remaining amount measuring unit of the adhesive supplying device held in the feeder holding unit to the management device. When the remaining amount of adhesive in the adhesive supplying device held in the feeder holding unit becomes less than a predetermined amount, the management device may move the adhesive supplying device from the feeder holding unit to a storage unit by the moving device, and may also move other adhesive supplying devices stored in the storage unit to the feeder holding unit. With this configuration, when the remaining amount of adhesive in the adhesive supplying device held in the feeder holding unit becomes low, the adhesive supplying device can be automatically replaced.
　本明細書に開示する部品実装システムは、部品実装機及び移動装置を管理する管理装置をさらに備えていてもよい。塗布状態確認装置は、シートを巻き取る巻取部と、巻取部で巻き取られたシートの巻取量を計測する巻取量計測部と、を備えていてもよい。部品実装機は、フィーダ保持部に保持されている塗布状態確認装置の巻取量計測部で計測されたシートの巻取量に関する情報を管理装置に送信する通信部を備えていてもよい。管理装置は、フィーダ保持部に保持されている塗布状態確認装置のシートの巻取量が所定量より多くなると、移動装置によって、当該塗布状態確認装置をフィーダ保持部から保管庫に移動させると共に、保管庫に収容されている他の塗布状態確認装置をフィーダ保持部に移動させてもよい。このような構成によると、フィーダ保持部に保持されている塗布状態確認装置の使用可能なシートが少なくなると、塗布状態確認装置を自動で交換することができる。 The component mounting system disclosed in this specification may further include a management device that manages the component mounter and the moving device. The coating state confirmation device may include a winding unit that winds up the sheet, and a winding amount measuring unit that measures the winding amount of the sheet wound by the winding unit. The component mounter may include a communication unit that transmits information about the winding amount of the sheet measured by the winding amount measuring unit of the coating state confirmation device held in the feeder holding unit to the management device. When the winding amount of the sheet of the coating state confirmation device held in the feeder holding unit becomes greater than a predetermined amount, the management device may move the coating state confirmation device from the feeder holding unit to the storage by the moving device, and may move other coating state confirmation devices stored in the storage to the feeder holding unit. With this configuration, when the number of usable sheets of the coating state confirmation device held in the feeder holding unit decreases, the coating state confirmation device can be automatically replaced.
　本明細書に開示する部品実装システムでは、フィーダ保持部は、複数の接着剤供給装置を保持可能に構成されていてもよい。このような構成によると、フィーダ保持部に複数の接着剤供給装置を設置することで、接着剤供給装置の交換作業のために実装処理が停止する時間を短くすることができる。また、異なる種類の接着剤を供給する複数の接着剤供給装置を同時に設置することができる。 In the component mounting system disclosed in this specification, the feeder holding unit may be configured to be capable of holding multiple adhesive supply devices. With such a configuration, by installing multiple adhesive supply devices in the feeder holding unit, the time that the mounting process is stopped for the adhesive supply device replacement work can be shortened. In addition, multiple adhesive supply devices that supply different types of adhesive can be installed simultaneously.
　図面を参照して、実施例に係る部品実装システム１について説明する。図１に示すように、部品実装システム１は、複数の部品実装機１０と、管理装置８と、部品フィーダ３０と、ローダ５０と、保管庫５４と、接着剤供給装置６０と、塗布状態確認装置８０を備えている。 The component mounting system 1 according to the embodiment will be described with reference to the drawings. As shown in FIG. 1, the component mounting system 1 includes a plurality of component mounters 10, a management device 8, a component feeder 30, a loader 50, a storage unit 54, an adhesive supply device 60, and an application status checking device 80.
　図１に示すように、各部品実装機１０は、管理装置８に通信可能に接続されている。管理装置８は、複数の部品実装機１０及びローダ５０と通信可能に接続されており、複数の部品実装機１０及びローダ５０を管理している。管理装置８と、複数の部品実装機１０によって部品実装ライン１００が構成されている。管理装置８は、ＣＰＵ及び記憶装置を備えるコンピュータを用いて構成されている。管理装置８は、各部品実装機１０の動作を制御することで、部品実装ライン１００全体を制御している。すなわち、管理装置８は、複数の部品実装機１０のそれぞれに対して、その部品実装機１０で回路基板２に実装する電子部品４の種類及び位置等を決定し、それらを部品実装機１０に指示する。各部品実装機１０が管理装置８の指示に基づいて動作することで、回路基板２に必要な電子部品４が実装される。 As shown in FIG. 1, each mounter 10 is communicatively connected to a management device 8. The management device 8 is communicatively connected to the multiple mounters 10 and loaders 50, and manages the multiple mounters 10 and loaders 50. The management device 8 and the multiple mounters 10 form a component mounting line 100. The management device 8 is configured using a computer equipped with a CPU and a storage device. The management device 8 controls the operation of each mounter 10 to control the entire component mounting line 100. That is, the management device 8 determines the type and position of the electronic components 4 to be mounted on the circuit board 2 by each of the multiple mounters 10, and instructs the mounters 10 of the type and position of the electronic components 4. Each mounter 10 operates based on the instructions of the management device 8, and the necessary electronic components 4 are mounted on the circuit board 2.
　部品実装機１０は、回路基板２に電子部品４を実装する。部品実装機１０は、表面実装機やチップマウンタとも称される。回路基板２は、部品実装ライン１００の一端から他端に向かって送られる。回路基板２には、各部品実装機１０において、予め定められた電子部品４が実装される。部品実装ライン１００の他端まで送られた回路基板２は、最終製品として出荷、又は半製品として後工程に送られる。 The component mounter 10 mounts electronic components 4 on the circuit board 2. The component mounter 10 is also called a surface mounter or chip mounter. The circuit board 2 is sent from one end of the component mounting line 100 to the other end. Predetermined electronic components 4 are mounted on the circuit board 2 by each component mounter 10. The circuit board 2 sent to the other end of the component mounting line 100 is shipped as a final product, or sent to a subsequent process as a semi-finished product.
　図２～図４に示すように、部品実装機１０は、フィーダ保持部１４と、ヘッド１６と、撮像装置２０と、ヘッド１６と撮像装置２０を移動させる移動装置１８と、基板コンベア２２と、操作パネル２４と、通信部２８と、制御装置２６を備えている。 As shown in Figures 2 to 4, the component mounter 10 includes a feeder holder 14, a head 16, an imaging device 20, a moving device 18 that moves the head 16 and the imaging device 20, a board conveyor 22, an operation panel 24, a communication unit 28, and a control device 26.
　フィーダ保持部１４は、複数のスロットを備えており、複数のスロットのそれぞれには、部品フィーダ３０を着脱可能に設置することができる。フィーダ保持部１４は、部品実装機１０に固定されたものであってもよいし、部品実装機１０に対して着脱可能なものであってもよい。図３に示すように、フィーダ保持部１４は、コネクタ１５を備えている。なお、図３では、最も＋Ｘ方向側のスロットには、部品フィーダ３０（及び、後述の接着剤供給装置６０と塗布状態確認装置８０）が設置されていない状態を示している。コネクタ１５は、フィーダ保持部１４に部品フィーダ３０を設置したときに、部品フィーダ３０のコネクタ４０（後述）と接続する位置に設けられている。また、フィーダ保持部１４には、接着剤供給装置６０及び塗布状態確認装置８０を着脱可能に設置することもできる。なお、部品フィーダ３０、接着剤供給装置６０及び塗布状態確認装置８０については、後に詳述する。 The feeder holding unit 14 has a plurality of slots, and the component feeder 30 can be detachably installed in each of the plurality of slots. The feeder holding unit 14 may be fixed to the component mounter 10, or may be detachably installed with respect to the component mounter 10. As shown in FIG. 3, the feeder holding unit 14 has a connector 15. Note that FIG. 3 shows a state in which the component feeder 30 (and the adhesive supply device 60 and the application state confirmation device 80 described later) are not installed in the slot on the most +X direction side. The connector 15 is provided at a position where it connects with the connector 40 (described later) of the component feeder 30 when the component feeder 30 is installed in the feeder holding unit 14. The adhesive supply device 60 and the application state confirmation device 80 can also be detachably installed in the feeder holding unit 14. Note that the component feeder 30, the adhesive supply device 60, and the application state confirmation device 80 will be described in detail later.
　ヘッド１６は、移動装置１８の移動ベース１８ａ（後述）に着脱可能に取り付けられる。ヘッド１６は、電子部品４を吸着する１又は複数のノズル６を有する。ノズル６は、ヘッド１６に着脱可能に取り付けられている。ヘッド１６は、ノズル６をＺ方向（ここでは鉛直方向）に移動可能であり、フィーダ保持部１４に設置された部品フィーダ３０や回路基板２に対して、ノズル６を接近及び離間させる。ヘッド１６は、部品フィーダ３０から供給される電子部品４をノズル６によって吸着すると共に、ノズル６に吸着された電子部品４を回路基板２上に装着することができる。移動ベース１８ａには、電子部品４の種類に応じて異なる種類のヘッド１６を取り付けることができる。また、移動ベース１８ａには、接着剤ツール６６（後述）を装着可能なヘッド１６も取り付けることができる。 The head 16 is detachably attached to a moving base 18a (described later) of the moving device 18. The head 16 has one or more nozzles 6 that pick up the electronic components 4. The nozzles 6 are detachably attached to the head 16. The head 16 can move the nozzles 6 in the Z direction (here, vertically) and move the nozzles 6 closer to and farther from the component feeders 30 and the circuit board 2 installed in the feeder holding section 14. The head 16 can pick up the electronic components 4 supplied from the component feeders 30 with the nozzles 6, and can mount the electronic components 4 picked up by the nozzles 6 on the circuit board 2. Different types of heads 16 can be attached to the moving base 18a depending on the type of electronic components 4. In addition, a head 16 to which an adhesive tool 66 (described later) can be attached can also be attached to the moving base 18a.
　撮像装置２０は、移動ベース１８ａ（後述）に固定されており、移動ベース１８ａと一体的に移動する。撮像装置２０は、カメラと光源を備えている。カメラは、その撮像方向が下方に向かうように配置されており、回路基板２の上面や塗布状態確認装置８０が備えるシート８４（後述）の上面を撮像する。カメラには、例えばＣＣＤカメラが用いられる。光源は、ＬＥＤにより構成されており、回路基板２の上面やシート８４の上面を照明する。撮像装置２０によって撮像された画像の画像データは、制御装置２６のメモリ（図示省略）に記憶される。 The imaging device 20 is fixed to the movable base 18a (described later) and moves integrally with the movable base 18a. The imaging device 20 is equipped with a camera and a light source. The camera is positioned so that its imaging direction faces downward, and captures images of the upper surface of the circuit board 2 and the upper surface of a sheet 84 (described later) provided on the coating state checking device 80. For example, a CCD camera is used as the camera. The light source is composed of an LED, and illuminates the upper surface of the circuit board 2 and the upper surface of the sheet 84. Image data of the image captured by the imaging device 20 is stored in the memory (not shown) of the control device 26.
　移動装置１８は、部品フィーダ３０と回路基板２との間でヘッド１６及び撮像装置２０を移動させる。本実施例の移動装置１８は、移動ベース１８ａをＸ方向及び水平面においてＸ方向に垂直なＹ方向に移動させるＸＹロボットである。移動装置１８は、移動ベース１８ａを案内するガイドレールや、移動ベース１８ａをガイドレールに沿って移動させる移動機構、また当該移動機構を駆動するモータ等によって構成されている。移動装置１８は、部品フィーダ３０及び回路基板２の上方に配置されている。移動ベース１８ａに対してヘッド１６及び撮像装置２０が取り付けられている。ヘッド１６及び撮像装置２０は、移動装置１８によってフィーダ保持部１４に設置された部品フィーダ３０、接着剤供給装置６０又は塗布状態確認装置８０の上方や回路基板２の上方を移動する。 The moving device 18 moves the head 16 and the imaging device 20 between the component feeder 30 and the circuit board 2. The moving device 18 in this embodiment is an XY robot that moves the moving base 18a in the X direction and in the Y direction perpendicular to the X direction on a horizontal plane. The moving device 18 is composed of a guide rail that guides the moving base 18a, a moving mechanism that moves the moving base 18a along the guide rail, and a motor that drives the moving mechanism. The moving device 18 is disposed above the component feeder 30 and the circuit board 2. The head 16 and the imaging device 20 are attached to the moving base 18a. The head 16 and the imaging device 20 move above the component feeder 30, adhesive supply device 60, or application state checking device 80 installed in the feeder holding section 14, and above the circuit board 2, by the moving device 18.
　基板コンベア２２は、回路基板２をＸ方向へ搬送する。本実施例の基板コンベア２２は、一対のベルトコンベアと、ベルトコンベアに取り付けられるとともに回路基板２を下方から支持する支持装置と、ベルトコンベアを駆動する駆動装置により構成されている。基板コンベア２２は、一方側に隣接する基板作業機から回路基板２を受け取って部品実装機１０内へ搬入し、回路基板２を部品実装位置へ位置決めする。基板コンベア２２は、回路基板２に対する電子部品４の実装が完了すると、回路基板２を部品実装機１０から搬出し、他方側に隣接する基板作業機へ受け渡す。 The board conveyor 22 transports the circuit board 2 in the X direction. In this embodiment, the board conveyor 22 is composed of a pair of belt conveyors, a support device attached to the belt conveyors and supporting the circuit board 2 from below, and a drive device that drives the belt conveyor. The board conveyor 22 receives the circuit board 2 from an adjacent board work machine on one side, carries it into the component mounter 10, and positions the circuit board 2 at the component mounting position. When mounting of electronic components 4 on the circuit board 2 is completed, the board conveyor 22 carries the circuit board 2 out of the component mounter 10 and hands it over to the adjacent board work machine on the other side.
　制御装置２６は、ＣＰＵ及び記憶装置を備えるコンピュータを用いて構成されている。制御装置２６は、管理装置８から送信される生産プログラムに基づいて、部品実装機１０の各部の動作を制御する。図４に示すように、制御装置２６は、ヘッド１６、移動装置１８、撮像装置２０、基板コンベア２２、操作パネル２４及び通信部２８と接続しており、ヘッド１６、移動装置１８、撮像装置２０、基板コンベア２２、操作パネル２４及び通信部２８の各部を制御している。また、制御装置２６は、コネクタ１５を介して、フィーダ保持部１４に設置された部品フィーダ３０、接着剤供給装置６０及び塗布状態確認装置８０から情報を取得する。部品フィーダ３０から取得する情報は、例えば、部品フィーダ３０を識別する識別情報（後述）や、電子部品４の残量に関する情報である。接着剤供給装置６０から取得する情報は、例えば、接着剤供給装置６０を識別する識別情報（後述）や、接着剤ツール６６（後述）内の接着剤の残量に関する情報である。塗布状態確認装置８０から取得する情報は、例えば、塗布状態確認装置８０を識別する識別情報（後述）や、シート８４（後述）の巻取量に関する情報である。 The control device 26 is configured using a computer having a CPU and a storage device. The control device 26 controls the operation of each part of the component mounter 10 based on the production program transmitted from the management device 8. As shown in FIG. 4, the control device 26 is connected to the head 16, the moving device 18, the imaging device 20, the board conveyor 22, the operation panel 24, and the communication unit 28, and controls each part of the head 16, the moving device 18, the imaging device 20, the board conveyor 22, the operation panel 24, and the communication unit 28. The control device 26 also acquires information from the component feeder 30, the adhesive supply device 60, and the application state confirmation device 80 installed in the feeder holding unit 14 via the connector 15. The information acquired from the component feeder 30 is, for example, identification information (described later) for identifying the component feeder 30 and information regarding the remaining amount of electronic components 4. The information acquired from the adhesive supply device 60 is, for example, identification information (described later) for identifying the adhesive supply device 60 and information regarding the remaining amount of adhesive in the adhesive tool 66 (described later). The information acquired from the coating state checking device 80 includes, for example, identification information (described below) that identifies the coating state checking device 80 and information regarding the amount of the sheet 84 (described below) that has been taken up.
　操作パネル２４は、作業者に部品実装機１０の各種の情報を提供する表示装置であると共に、作業者からの指示や情報を受け付ける入力装置である。 The operation panel 24 is a display device that provides the worker with various information about the component mounter 10, and is also an input device that accepts instructions and information from the worker.
　通信部２８は、管理装置８との間で情報を送受信する。具体的には、通信部２８は、管理装置８から生産プログラムに関する情報を受信する。また、通信部２８は、管理装置８に、フィーダ保持部１４に設置された部品フィーダ３０、接着剤供給装置６０及び塗布状態確認装置８０に関する情報を送信する。部品フィーダ３０に関する情報は、例えば、部品フィーダ３０の識別情報と、部品フィーダ３０に収容される電子部品４の残量である。接着剤供給装置６０に関する情報は、例えば、接着剤供給装置６０の識別情報と、接着剤供給装置６０に収容される接着剤ツール６６（後述）内の接着剤の残量である。塗布状態確認装置８０に関する情報は、例えば、塗布状態確認装置８０の識別情報と、塗布状態確認装置８０に設置されるシート８４（後述）の巻取量である。 The communication unit 28 transmits and receives information to and from the management device 8. Specifically, the communication unit 28 receives information related to the production program from the management device 8. The communication unit 28 also transmits information related to the component feeder 30, adhesive supply device 60, and application state confirmation device 80 installed in the feeder holding unit 14 to the management device 8. The information related to the component feeder 30 is, for example, the identification information of the component feeder 30 and the remaining amount of electronic components 4 contained in the component feeder 30. The information related to the adhesive supply device 60 is, for example, the identification information of the adhesive supply device 60 and the remaining amount of adhesive in an adhesive tool 66 (described later) contained in the adhesive supply device 60. The information related to the application state confirmation device 80 is, for example, the identification information of the application state confirmation device 80 and the take-up amount of a sheet 84 (described later) installed in the application state confirmation device 80.
　部品フィーダ３０は、フィーダ保持部１４に着脱可能に設置され、部品実装機１０（具体的には、ノズル６）に電子部品４を供給する。図５に示すように、部品フィーダ３０は、本体３２と、本体３２に着脱可能に取り付けられたリール３４と、テープ送出機構３８と、コネクタ４０と、制御装置４２を備えている。 The component feeder 30 is removably installed on the feeder holding section 14, and supplies electronic components 4 to the component mounter 10 (specifically, the nozzle 6). As shown in FIG. 5, the component feeder 30 includes a main body 32, a reel 34 removably attached to the main body 32, a tape delivery mechanism 38, a connector 40, and a control device 42.
　リール３４には、複数の電子部品４を一定の間隔で収容する長尺のテープ３６が巻かれている。テープ送出機構３８は、電子部品４を収容するテープ３６を、リール３４から一定量ずつ送り出す。テープ送出機構３８によるテープ３６の送り出し量は、テープ３６に収容された電子部品４の間隔に応じて設定される。送り出されたテープ３６上の電子部品４は、部品取出位置４４において、ヘッド１６により取り上げられる。リール３４は、部品フィーダ３０の本体３２に対して交換可能となっている。 A long length of tape 36 is wound around the reel 34, and contains multiple electronic components 4 at regular intervals. The tape feeding mechanism 38 feeds out the tape 36 containing the electronic components 4 from the reel 34 at regular intervals. The amount of tape 36 fed out by the tape feeding mechanism 38 is set according to the spacing between the electronic components 4 contained on the tape 36. The electronic components 4 on the tape 36 that have been fed out are picked up by the head 16 at the component removal position 44. The reel 34 is replaceable with respect to the main body 32 of the component feeder 30.
　コネクタ４０は、部品フィーダ３０の＋Ｙ方向側の側面（すなわち、部品フィーダ３０がフィーダ保持部１４に設置されたときに基板コンベア２２側に位置する側面）に配置されている。コネクタ４０は、部品フィーダ３０がフィーダ保持部１４に設置されると、フィーダ保持部１４のコネクタ１５と接続される。 The connector 40 is disposed on the side of the component feeder 30 facing the +Y direction (i.e., the side facing the board conveyor 22 when the component feeder 30 is placed on the feeder holding section 14). When the component feeder 30 is placed on the feeder holding section 14, the connector 40 is connected to the connector 15 of the feeder holding section 14.
　制御装置４２は、部品フィーダ３０の各部を制御している。また、制御装置４２のメモリ（図示省略）は、部品フィーダ３０を識別する識別情報を記憶している。識別情報は、部品フィーダ３０に設置されているリール３４やリール３４が収容する電子部品４の種類等に関する情報を含んでいる。 The control device 42 controls each part of the component feeder 30. In addition, the memory (not shown) of the control device 42 stores identification information for identifying the component feeder 30. The identification information includes information about the reels 34 installed in the component feeder 30 and the types of electronic components 4 accommodated by the reels 34.
　なお、本実施例では、部品フィーダ３０は、テープ式の部品フィーダであるが、このような構成に限定されない。例えば、部品フィーダは、トレイ上に複数の電子部品４を収容するトレイ式の部品フィーダや、容器内に複数の電子部品４をランダムに収容するバルク式の部品フィーダであってもよい。 In this embodiment, the component feeder 30 is a tape-type component feeder, but is not limited to this configuration. For example, the component feeder may be a tray-type component feeder that stores multiple electronic components 4 on a tray, or a bulk-type component feeder that stores multiple electronic components 4 randomly in a container.
　図１に示すように、ローダ５０は、フィーダ保持部１４への部品フィーダ３０の取り付け及び取り外しを自動で行う装置である。ローダ５０は、交換対象の部品フィーダ３０をフィーダ保持部１４から取り外して回収するとともに、生産に使用される部品フィーダ３０をフィーダ保持部１４に取り付けるように構成されている。部品実装ライン１００を構成する各部品実装機１０は、一方向に沿って配列されており、ローダ５０は、当該一方向（図３のＸ方向）に沿って設けられたガイドレール５２によって、各部品実装機１０のフィーダ保持部１４の各スロットに対して移動可能に構成されている。ローダ５０は、ガイドレール５２に沿って各部品実装機１０のフィーダ保持部１４と保管庫５４との間で移動する。また、ローダ５０は、接着剤供給装置６０と塗布状態確認装置８０についても、各部品実装機１０のフィーダ保持部１４と保管庫５４との間で移動させ、フィーダ保持部１４へ接着剤供給装置６０や塗布状態確認装置８０を取り付け及び取り外しする。ローダ５０は、管理装置８と通信可能に構成されている。 As shown in FIG. 1, the loader 50 is a device that automatically attaches and removes the component feeder 30 to and from the feeder holding section 14. The loader 50 is configured to remove and retrieve the component feeder 30 to be replaced from the feeder holding section 14, and to attach the component feeder 30 to be used in production to the feeder holding section 14. The component mounters 10 that make up the component mounting line 100 are arranged in one direction, and the loader 50 is configured to be movable to each slot of the feeder holding section 14 of each component mounter 10 by a guide rail 52 provided along that one direction (the X direction in FIG. 3). The loader 50 moves between the feeder holding section 14 of each component mounter 10 and the storage 54 along the guide rail 52. The loader 50 also moves the adhesive supply device 60 and the application state confirmation device 80 between the feeder holding section 14 of each component mounter 10 and the storage 54, and attaches and removes the adhesive supply device 60 and the application state confirmation device 80 to and from the feeder holding section 14. The loader 50 is configured to be able to communicate with the management device 8.
　保管庫５４は、部品実装ライン１００の最も上流に配置される部品実装機１０のさらに上流側に配置されている。保管庫５４は、複数の部品フィーダ３０を収容する。具体的には、保管庫５４は、実装処理で使用されていない部品フィーダ３０を収容すると共に、実装処理で使用後の部品フィーダ３０を収容する。保管庫５４の前面には、ガイドレール５２が設置されている。すなわち、ガイドレール５２は、保管庫５４と複数の部品実装機１０の前面に設置されている。ローダ５０は、保管庫５４に収容されている部品フィーダ３０を各部品実装機１０のフィーダ保持部１４の各スロットに移動させると共に、各部品実装機１０のフィーダ保持部１４の各スロットから部品フィーダ３０を保管庫５４に移動させる。また、保管庫５４は、部品フィーダ３０と共に、接着剤供給装置６０と塗布状態確認装置８０も収容している。 The storage 54 is located further upstream of the component mounter 10 located at the most upstream of the component mounting line 100. The storage 54 houses multiple component feeders 30. Specifically, the storage 54 houses component feeders 30 that are not used in the mounting process, and also houses component feeders 30 that have been used in the mounting process. A guide rail 52 is installed in front of the storage 54. That is, the guide rail 52 is installed in front of the storage 54 and multiple component mounters 10. The loader 50 moves the component feeders 30 stored in the storage 54 to each slot of the feeder holding unit 14 of each component mounter 10, and moves the component feeders 30 from each slot of the feeder holding unit 14 of each component mounter 10 to the storage 54. The storage 54 also houses an adhesive supply device 60 and an application state confirmation device 80 in addition to the component feeders 30.
　接着剤供給装置６０は、フィーダ保持部１４に着脱可能に設置され、部品実装機１０に接着剤を供給する。図６に示すように、接着剤供給装置６０は、本体６２と、本体６２に設けられるポケット６４と、接着剤ツール６６と、ヒータ６８と、コネクタ７０と、制御装置７２を備えている。 The adhesive supplying device 60 is detachably installed on the feeder holding section 14, and supplies adhesive to the component mounter 10. As shown in FIG. 6, the adhesive supplying device 60 includes a main body 62, a pocket 64 provided in the main body 62, an adhesive tool 66, a heater 68, a connector 70, and a control device 72.
　本体６２は、フィーダ保持部１４に設置可能な形状を有している。すなわち、本体６２は、フィーダ保持部１４のスロットに倣う形状を有している。本体６２のＸ方向の寸法は、部品フィーダ３０のＸ方向の寸法より大きい。このため、接着剤供給装置６０は、フィーダ保持部１４の複数スロット（本実施例では、２つのスロット）に跨って設置される。 The main body 62 has a shape that allows it to be installed in the feeder holding portion 14. That is, the main body 62 has a shape that follows the slots of the feeder holding portion 14. The dimension of the main body 62 in the X direction is larger than the dimension of the component feeder 30 in the X direction. Therefore, the adhesive supply device 60 is installed across multiple slots (two slots in this embodiment) of the feeder holding portion 14.
　ポケット６４は、本体６２の＋Ｙ方向側の上面に設けられている。ポケット６４は、接着剤ツール６６を収容可能な形状を有している。接着剤ツール６６は、ポケット６４に収容されている。接着剤ツール６６には、接着剤（例えば、グルー等）が収容されている。接着剤ツール６６は、接着剤ツール６６を装着可能な種類のヘッド１６に装着され、ヘッド１６に装着された状態で接着剤供給装置６０と回路基板２との間を移動装置１８によって移動する。接着剤ツール６６は、回路基板２に接着剤を塗布するために用いられる。接着剤ツール６６がヘッド１６に装着されると、図示しない圧力印加装置によって接着剤ツール６６内の接着剤に圧力が印加され、接着剤ツール６６内の接着剤が先端から吐出されるようになっている。 The pocket 64 is provided on the upper surface of the main body 62 on the +Y direction side. The pocket 64 has a shape capable of accommodating an adhesive tool 66. The adhesive tool 66 is accommodated in the pocket 64. The adhesive tool 66 accommodates an adhesive (e.g., glue, etc.). The adhesive tool 66 is attached to a type of head 16 to which the adhesive tool 66 can be attached, and while attached to the head 16, it is moved between the adhesive supply device 60 and the circuit board 2 by the moving device 18. The adhesive tool 66 is used to apply adhesive to the circuit board 2. When the adhesive tool 66 is attached to the head 16, pressure is applied to the adhesive in the adhesive tool 66 by a pressure application device (not shown), and the adhesive in the adhesive tool 66 is discharged from the tip.
　ヒータ６８は、ポケット６４の周囲に配置されている。ヒータ６８は、ポケット６４に収容されている接着剤ツール６６の温度を調整する。接着剤を安定した状態で回路基板２に塗布するためには、接着剤を室温より高い所定の温度に調節する必要がある。ポケット６４の近傍にヒータ６８が配置されることによって、接着剤ツール６６をポケット６４に収容している間に、接着剤ツール６６に収容される接着剤の温度を好適に調節することができる。 The heater 68 is disposed around the pocket 64. The heater 68 adjusts the temperature of the adhesive tool 66 housed in the pocket 64. In order to apply the adhesive to the circuit board 2 in a stable state, it is necessary to adjust the adhesive to a predetermined temperature higher than room temperature. By disposing the heater 68 near the pocket 64, it is possible to suitably adjust the temperature of the adhesive housed in the adhesive tool 66 while the adhesive tool 66 is housed in the pocket 64.
　コネクタ７０は、接着剤供給装置６０の＋Ｙ方向側の側面（すなわち、接着剤供給装置６０がフィーダ保持部１４に設置されたときに基板コンベア２２側に位置する側面）に配置されている。コネクタ７０は、接着剤供給装置６０がフィーダ保持部１４に設置されると、フィーダ保持部１４のコネクタ１５と接続される。 The connector 70 is disposed on the side of the adhesive supplying device 60 facing the +Y direction (i.e., the side facing the board conveyor 22 when the adhesive supplying device 60 is installed in the feeder holding section 14). When the adhesive supplying device 60 is installed in the feeder holding section 14, the connector 70 is connected to the connector 15 of the feeder holding section 14.
　制御装置７２は、接着剤供給装置６０の各部を制御している。また、制御装置７２のメモリ（図示省略）は、接着剤供給装置６０を識別する識別情報を記憶している。識別情報は、接着剤供給装置６０に収容されている接着剤の種類に関する情報を含んでいる。また、制御装置７２は、接着剤ツール６６内の接着剤の残量を算出する。具体的には、制御装置７２は、接着剤ツール６６から塗布される接着剤の１回の塗布量と使用回数から、接着剤の残量を算出する。算出された接着剤の残量は、制御装置７２のメモリに記憶される。なお、本実施例では、制御装置７２が接着剤の残量を算出しているが、このような構成に限定されない。例えば、接着剤供給装置は、接着剤ツール６６内の接着剤の質量を計測する質量計測装置を備えていてもよく、制御装置７２は、質量計測装置から取得した接着剤の質量を接着剤の残量としてメモリに記憶させてもよい。 The control device 72 controls each part of the adhesive supply device 60. The memory (not shown) of the control device 72 stores identification information for identifying the adhesive supply device 60. The identification information includes information regarding the type of adhesive contained in the adhesive supply device 60. The control device 72 also calculates the remaining amount of adhesive in the adhesive tool 66. Specifically, the control device 72 calculates the remaining amount of adhesive from the amount of adhesive applied from the adhesive tool 66 per application and the number of uses. The calculated remaining amount of adhesive is stored in the memory of the control device 72. Note that in this embodiment, the control device 72 calculates the remaining amount of adhesive, but is not limited to this configuration. For example, the adhesive supply device may be equipped with a mass measuring device that measures the mass of the adhesive in the adhesive tool 66, and the control device 72 may store the mass of adhesive obtained from the mass measuring device in the memory as the remaining amount of adhesive.
　塗布状態確認装置８０は、接着剤供給装置６０に収容される接着剤ツール６６から、接着剤が適切に塗布されるか否か（すなわち、接着剤の塗布状態）を確認するために用いられる。塗布状態確認装置８０は、フィーダ保持部１４に着脱可能に設置される。図７に示すように、塗布状態確認装置８０は、本体８２と、シート８４と、シート８４を供給する供給部８６と、シート８４を巻き取る巻取部８８と、モータ８９と、コネクタ９０と、制御装置９２を備えている。 The application state checking device 80 is used to check whether adhesive is being applied properly from the adhesive tool 66 housed in the adhesive supply device 60 (i.e., the application state of the adhesive). The application state checking device 80 is detachably installed on the feeder holding unit 14. As shown in FIG. 7, the application state checking device 80 includes a main body 82, a sheet 84, a supply unit 86 that supplies the sheet 84, a winding unit 88 that winds up the sheet 84, a motor 89, a connector 90, and a control device 92.
　本体８２は、接着剤供給装置６０の本体６２と同様に、フィーダ保持部１４に設置可能な形状を有している。本体８２のＸ方向の寸法は、部品フィーダ３０のＸ方向の寸法より大きい。このため、塗布状態確認装置８０は、フィーダ保持部１４の複数スロット（本実施例では、２つのスロット）に跨って設置される。 The main body 82, like the main body 62 of the adhesive supply device 60, has a shape that allows it to be installed in the feeder holding section 14. The dimension of the main body 82 in the X direction is greater than the dimension of the component feeder 30 in the X direction. For this reason, the application state checking device 80 is installed across multiple slots (two slots in this embodiment) of the feeder holding section 14.
　シート８４は、接着剤供給装置６０に収容される接着剤ツール６６を用いて接着剤を試験的に塗布する（すなわち、接着剤を試し塗布する）ために用いられる。シート８４は、供給部８６から供給され、試し塗布位置８５で本体８２から外部に露出し、巻取部８８に巻き取られる。供給部８６と巻取部８８は、回転可能に本体８２に支持されている。巻取部８８には、モータ８９が接続されており、モータ８９により巻取部８８がシート８４を巻き取る方向（図７では、時計回り）に回転する。巻取部８８が回転してシート８４を巻き取ることにより、シート８４が引っ張られて供給部８６も回転する。 The sheet 84 is used to test apply adhesive (i.e., test apply adhesive) using the adhesive tool 66 housed in the adhesive supply device 60. The sheet 84 is supplied from the supply unit 86, exposed to the outside from the main body 82 at the test application position 85, and taken up by the winding unit 88. The supply unit 86 and the winding unit 88 are rotatably supported by the main body 82. A motor 89 is connected to the winding unit 88, and the motor 89 rotates the winding unit 88 in the direction in which the sheet 84 is wound up (clockwise in FIG. 7). When the winding unit 88 rotates and winds up the sheet 84, the sheet 84 is pulled, causing the supply unit 86 to rotate as well.
　コネクタ９０は、塗布状態確認装置８０の＋Ｙ方向側の側面（すなわち、塗布状態確認装置８０がフィーダ保持部１４に設置されたときに基板コンベア２２側に位置する側面）に配置されている。コネクタ９０は、塗布状態確認装置８０がフィーダ保持部１４に設置されると、フィーダ保持部１４のコネクタ１５と接続される。 The connector 90 is disposed on the side of the coating state checking device 80 facing the +Y direction (i.e., the side facing the board conveyor 22 when the coating state checking device 80 is installed on the feeder holding unit 14). When the coating state checking device 80 is installed on the feeder holding unit 14, the connector 90 is connected to the connector 15 of the feeder holding unit 14.
　制御装置９２は、塗布状態確認装置８０の各部を制御している。また、制御装置９２のメモリ（図示省略）は、塗布状態確認装置８０を識別する識別情報を記憶している。また、制御装置９２は、シート８４が巻取部８８に巻き取られた巻取量を算出している。具体的には、巻取部８８に接続されているモータ８９の駆動量からシート８４の巻取量を算出する。算出されたシート８４の巻取量は、制御装置９２のメモリに記憶される。 The control device 92 controls each part of the application state checking device 80. In addition, a memory (not shown) of the control device 92 stores identification information for identifying the application state checking device 80. In addition, the control device 92 calculates the amount of the sheet 84 wound up by the winding unit 88. Specifically, the control device 92 calculates the amount of the sheet 84 wound up from the drive amount of the motor 89 connected to the winding unit 88. The calculated amount of the sheet 84 wound up is stored in the memory of the control device 92.
　ここで、塗布状態確認装置８０を用いて接着剤の塗布状態を確認する動作について説明する。接着剤の塗布状態を確認する動作は、フィーダ保持部１４に接着剤供給装置６０と塗布状態確認装置８０が設置されている状態で実行される。また、接着剤の塗布状態を確認する動作は、接着剤が回路基板２に塗布される前に実行される。 Here, the operation of checking the adhesive application state using the application state checking device 80 will be described. The operation of checking the adhesive application state is performed when the adhesive supply device 60 and the application state checking device 80 are installed in the feeder holding section 14. In addition, the operation of checking the adhesive application state is performed before the adhesive is applied to the circuit board 2.
　まず、部品実装機１０の制御装置２６は、接着剤供給装置６０に収容されている接着剤ツール６６をヘッド１６に装着させる。次いで、制御装置２６は、接着剤ツール６６を試し塗布位置８５の上方に移動させて、試し塗布位置８５に露出しているシート８４上に接着剤ツール６６内の接着剤を塗布する。次いで、制御装置２６は、撮像装置２０を試し塗布位置８５の上方に移動させ、試し塗布位置８５を上方から撮像する。次いで、制御装置２６は、撮像画像から、塗布された接着剤の大きさや形状が所定の範囲内であるか否かを判断する。次いで、制御装置２６は、コネクタ１５、９０を介して、塗布状態確認装置８０に試し塗布が終了した旨の情報を送信する。 First, the control device 26 of the component mounter 10 mounts the adhesive tool 66 housed in the adhesive supply device 60 to the head 16. Next, the control device 26 moves the adhesive tool 66 above the trial application position 85, and applies the adhesive in the adhesive tool 66 onto the sheet 84 exposed at the trial application position 85. Next, the control device 26 moves the imaging device 20 above the trial application position 85, and captures an image of the trial application position 85 from above. Next, the control device 26 determines from the captured image whether the size and shape of the applied adhesive are within a predetermined range. Next, the control device 26 transmits information that the trial application has been completed to the application status confirmation device 80 via the connectors 15 and 90.
　塗布状態確認装置８０の制御装置９２は、制御装置２６から試し塗布が終了した旨の情報を取得すると、モータ８９を所定量だけ駆動し、巻取部８８でシート８４を巻き取る。すると、試し塗布により接着剤が塗布されたシート８４が試し塗布位置８５から巻取部８８側に移動し、試し塗布位置８５には、接着剤が塗布されていないシート８４が露出する。 When the control device 92 of the coating state checking device 80 receives information from the control device 26 that the test coating has been completed, it drives the motor 89 a predetermined amount and winds up the sheet 84 in the winding section 88. Then, the sheet 84 to which adhesive has been applied by the test coating moves from the test coating position 85 to the winding section 88 side, and the sheet 84 to which no adhesive has been applied is exposed at the test coating position 85.
　本実施例では、ローダ５０は、部品フィーダ３０を保管庫５４と各部品実装機１０との間で移動させる。部品実装ライン１００で生産を開始する際には、管理装置８は、生産プログラムに応じて、各部品実装機１０に必要な部品フィーダ３０をローダ５０で移動させる。また、上述したように、ローダ５０は、接着剤供給装置６０と塗布状態確認装置８０も移動することができる。生産プログラムによっては、回路基板２に接着剤を塗布することがある。また、回路基板２に異なる複数種類の接着剤を塗布することもある。部品実装ライン１００で生産を開始する際には、管理装置８は、生産プログラムに応じて、各部品実装機１０に必要な接着剤供給装置６０をローダ５０で移動させる。また、接着剤供給装置６０を設置する部品実装機１０には、試し塗布するために塗布状態確認装置８０を設置する必要がある。管理装置８は、部品実装ライン１００で生産を開始する前に、各部品実装機１０に必要な部品フィーダ３０、接着剤供給装置６０及び塗布状態確認装置８０が設置されるように、ローダ５０を用いて、保管庫５４と各部品実装機１０との間で適切な種類の部品フィーダ３０と、接着剤供給装置６０と、塗布状態確認装置８０を移動させる。 In this embodiment, the loader 50 moves the component feeder 30 between the storage 54 and each component mounter 10. When starting production on the component mounting line 100, the management device 8 uses the loader 50 to move the component feeder 30 required for each component mounter 10 in accordance with the production program. As described above, the loader 50 can also move the adhesive supply device 60 and the application status confirmation device 80. Depending on the production program, adhesive may be applied to the circuit board 2. Also, multiple different types of adhesive may be applied to the circuit board 2. When starting production on the component mounting line 100, the management device 8 uses the loader 50 to move the adhesive supply device 60 required for each component mounter 10 in accordance with the production program. In addition, the component mounter 10 on which the adhesive supply device 60 is installed needs to be equipped with an application status confirmation device 80 for test application. Before starting production on the component mounting line 100, the management device 8 uses the loader 50 to move the appropriate types of component feeders 30, adhesive supply devices 60, and application state confirmation devices 80 between the storage 54 and each component mounting machine 10 so that the necessary component feeders 30, adhesive supply devices 60, and application state confirmation devices 80 are installed on each component mounting machine 10.
　このとき、図３に示すように、管理装置８は、必要に応じて、１つの部品実装機１０に複数の接着剤供給装置６０を設置させてもよい。例えば、１つの部品実装機１０に異なる種類の接着剤供給装置６０を設置してもよいし、１つの部品実装機１０に同じ種類の接着剤供給装置６０を２つ以上設置してもよい。この場合にも、接着剤供給装置６０は、ローダ５０によって部品実装機１０に移動される。本実施例では、接着剤供給装置６０は、フィーダ保持部１４に設置可能である。このため、１つの部品実装機１０に２つ以上の接着剤供給装置６０を設置することができる。なお、図３では、フィーダ保持部１４に２つの接着剤供給装置６０が設置されているが、フィーダ保持部１４に設置される接着剤供給装置６０の数は特に限定されない。フィーダ保持部１４に設置される接着剤供給装置６０の数は、１つであってもよいし、３つ以上であってもよい。１つの部品実装機１０に複数の接着剤供給装置６０を設置可能であることにより、部品実装ライン１００における生産プログラムを柔軟に作成することができる。また、１つの部品実装機１０に２つ以上の塗布状態確認装置８０を設置してもよい。 At this time, as shown in FIG. 3, the management device 8 may install multiple adhesive supply devices 60 in one component mounting machine 10 as necessary. For example, different types of adhesive supply devices 60 may be installed in one component mounting machine 10, or two or more of the same type of adhesive supply devices 60 may be installed in one component mounting machine 10. In this case, the adhesive supply devices 60 are moved to the component mounting machine 10 by the loader 50. In this embodiment, the adhesive supply devices 60 can be installed in the feeder holding unit 14. Therefore, two or more adhesive supply devices 60 can be installed in one component mounting machine 10. Note that, in FIG. 3, two adhesive supply devices 60 are installed in the feeder holding unit 14, but the number of adhesive supply devices 60 installed in the feeder holding unit 14 is not particularly limited. The number of adhesive supply devices 60 installed in the feeder holding unit 14 may be one, or may be three or more. By being able to install multiple adhesive supply devices 60 in one component mounting machine 10, the production program in the component mounting line 100 can be flexibly created. Additionally, two or more application state checking devices 80 may be installed on one component mounter 10.
　部品フィーダ３０、接着剤供給装置６０及び塗布状態確認装置８０がそれぞれ部品実装機１０のフィーダ保持部１４に設置されると、コネクタ１５、４０、７０、９０を介して、フィーダ保持部１４に設置された部品フィーダ３０、接着剤供給装置６０及び塗布状態確認装置８０の識別情報が部品実装機１０の制御装置２６に出力される。制御装置２６は、取得した識別情報に基づいて、フィーダ保持部１４の各スロットに、どのような装置が設置されたのかを識別する。例えば、部品フィーダ３０がフィーダ保持部１４に設置された場合、制御装置２６は、取得した識別情報から、フィーダ保持部１４に設置された装置が部品フィーダ３０であることと、その部品フィーダ３０が収容する電子部品４の種類を特定する。また、接着剤供給装置６０がフィーダ保持部１４に設置された場合、制御装置２６は、取得した識別情報から、フィーダ保持部１４に設置された装置が接着剤供給装置６０であることと、その接着剤供給装置６０が収容する接着剤の種類を特定する。また、塗布状態確認装置８０がフィーダ保持部１４に設置された場合、制御装置２６は、取得した識別情報から、フィーダ保持部１４に設置された装置が塗布状態確認装置８０であることを特定する。 When the component feeder 30, adhesive supply device 60, and application state confirmation device 80 are installed in the feeder holding section 14 of the component mounter 10, the identification information of the component feeder 30, adhesive supply device 60, and application state confirmation device 80 installed in the feeder holding section 14 is output to the control device 26 of the component mounter 10 via the connectors 15, 40, 70, and 90. The control device 26 identifies what device is installed in each slot of the feeder holding section 14 based on the acquired identification information. For example, when the component feeder 30 is installed in the feeder holding section 14, the control device 26 identifies from the acquired identification information that the device installed in the feeder holding section 14 is the component feeder 30 and the type of electronic component 4 that the component feeder 30 contains. Also, when the adhesive supply device 60 is installed in the feeder holding section 14, the control device 26 identifies from the acquired identification information that the device installed in the feeder holding section 14 is the adhesive supply device 60 and the type of adhesive that the adhesive supply device 60 contains. Furthermore, when the coating state checking device 80 is installed in the feeder holding unit 14, the control device 26 identifies, from the acquired identification information, that the device installed in the feeder holding unit 14 is the coating state checking device 80.
　また、実装処理の実行中には、接着剤供給装置６０及び塗布状態確認装置８０が設置された部品実装機１０は、接着剤供給装置６０から接着剤の残量に関する情報を取得すると共に、塗布状態確認装置８０からシート８４の巻取量に関する情報を取得する。部品実装機１０は、接着剤の残量に関する情報やシート８４の巻取量に関する情報を取得すると、取得した情報を通信部２８を介して管理装置８に送信する。これにより、管理装置８は、各部品実装機１０に設置された接着剤供給装置６０内の接着剤の残量や、塗布状態確認装置８０内の使用可能なシート８４の残量を把握することができる。 In addition, during the execution of the mounting process, the component mounter 10 in which the adhesive supply device 60 and the application state confirmation device 80 are installed acquires information regarding the remaining amount of adhesive from the adhesive supply device 60, and acquires information regarding the rolled-up amount of sheet 84 from the application state confirmation device 80. When the component mounter 10 acquires information regarding the remaining amount of adhesive and information regarding the rolled-up amount of sheet 84, it transmits the acquired information to the management device 8 via the communication unit 28. This allows the management device 8 to grasp the remaining amount of adhesive in the adhesive supply device 60 installed in each component mounter 10 and the remaining amount of usable sheet 84 in the application state confirmation device 80.
　管理装置８は、各部品実装機１０から取得した接着剤の残量に関する情報やシート８４の巻取量に関する情報に基づいて、ローダ５０に接着剤供給装置６０や塗布状態確認装置８０を交換させる。具体的には、管理装置８は、取得した接着剤の残量に関する情報から、接着剤の残量が所定量より少ないと判断すると、接着剤の残量が所定量より少ない接着剤ツール６６を備える接着剤供給装置６０を、ローダ５０でフィーダ保持部１４から保管庫５４に移動させる。そして、管理装置８は、接着剤が十分に収容されている接着剤ツール６６を備える接着剤供給装置６０を、ローダ５０で保管庫５４からフィーダ保持部１４に移動させる。同様に、管理装置８は、取得したシート８４の巻取量に関する情報から、使用可能なシート８４の残量が所定量より少ないと判断すると、シート８４の残量が所定量より少ない塗布状態確認装置８０を、ローダ５０でフィーダ保持部１４から保管庫５４に移動させ、使用可能なシート８４が十分に収容されている塗布状態確認装置８０を、ローダ５０で保管庫５４からフィーダ保持部１４に移動させる。このように、本実施例では、部品フィーダ３０だけでなく、接着剤供給装置６０と塗布状態確認装置８０もローダ５０を用いてフィーダ保持部１４と保管庫５４との間で移動できるため、部品実装機１０に設置されている接着剤供給装置６０と塗布状態確認装置８０を自動で交換することが可能となる。また、接着剤供給装置６０と塗布状態確認装置８０は、部品フィーダ３０を移動させるローダ５０を用いて移動可能であるため、接着剤供給装置６０や塗布状態確認装置８０を交換するための専用の構成を追加することなく、接着剤供給装置６０と塗布状態確認装置８０を自動で交換することができる。 The management device 8 causes the loader 50 to replace the adhesive supply device 60 and the application status checking device 80 based on information regarding the remaining amount of adhesive acquired from each component mounting machine 10 and information regarding the rolled-up amount of sheet 84. Specifically, when the management device 8 determines from the acquired information regarding the remaining amount of adhesive that the remaining amount of adhesive is less than a predetermined amount, it causes the loader 50 to move the adhesive supply device 60 having the adhesive tool 66 with less than the predetermined amount of remaining adhesive from the feeder holding unit 14 to the storage unit 54. Then, the management device 8 causes the loader 50 to move the adhesive supply device 60 having the adhesive tool 66 that contains sufficient adhesive from the storage unit 54 to the feeder holding unit 14. Similarly, when the management device 8 determines that the remaining amount of the usable sheet 84 is less than a predetermined amount based on the acquired information on the winding amount of the sheet 84, the management device 8 moves the application state checking device 80 with the remaining amount of the sheet 84 less than the predetermined amount from the feeder holding unit 14 to the storage 54 by the loader 50, and moves the application state checking device 80 with a sufficient amount of usable sheet 84 stored therein from the storage 54 to the feeder holding unit 14 by the loader 50. In this way, in this embodiment, not only the component feeder 30 but also the adhesive supply device 60 and the application state checking device 80 can be moved between the feeder holding unit 14 and the storage 54 using the loader 50, so that the adhesive supply device 60 and the application state checking device 80 installed in the component mounter 10 can be automatically replaced. In addition, since the adhesive supply device 60 and the application state checking device 80 can be moved using the loader 50 that moves the component feeder 30, the adhesive supply device 60 and the application state checking device 80 can be automatically replaced without adding a dedicated configuration for replacing the adhesive supply device 60 or the application state checking device 80.
　実施例で説明した部品実装システム１に関する留意点を述べる。実施例のコネクタ１５は、「取得部」の一例であり、制御装置２６は、「識別部」の一例であり、部品フィーダ３０は、「部品供給フィーダ」の一例であり、ローダ５０は、「移動装置」の一例であり、制御装置７２は、「残量計測部」の一例であり、制御装置９２は、「巻取量計測部」の一例である。 Notes regarding the component mounting system 1 described in the embodiment will be described below. The connector 15 in the embodiment is an example of an "acquisition unit", the control device 26 is an example of an "identification unit", the component feeder 30 is an example of a "component supply feeder", the loader 50 is an example of a "movement device", the control device 72 is an example of a "remaining amount measurement unit", and the control device 92 is an example of a "take-up amount measurement unit".
　以上、本明細書に開示の技術の具体例を詳細に説明したが、これらは例示にすぎず、請求の範囲を限定するものではない。請求の範囲に記載の技術には、以上に例示した具体例を様々に変形、変更したものが含まれる。また、本明細書または図面に説明した技術要素は、単独であるいは各種の組合せによって技術的有用性を発揮するものであり、出願時請求項記載の組合せに限定されるものではない。また、本明細書または図面に例示した技術は複数目的を同時に達成するものであり、そのうちの一つの目的を達成すること自体で技術的有用性を持つものである。 　Specific examples of the technology disclosed in this specification have been described in detail above, but these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and variations of the specific examples exemplified above. Furthermore, the technical elements described in this specification or drawings exert technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Furthermore, the technology exemplified in this specification or drawings achieves multiple objectives simultaneously, and achieving one of those objectives is itself technically useful.
　本明細書では、請求項４において「請求項２に記載の部品実装システム」を「請求項２又は３に記載の部品実装システム」に変更した技術思想も開示されている。 This specification also discloses the technical idea of changing "the component mounting system described in claim 2" in claim 4 to "the component mounting system described in claim 2 or 3."

Claims (5)

  1. 　電子部品を基板に実装する部品実装システムであって、
    　フィーダ保持部が設けられた部品実装機と、
    　前記フィーダ保持部に着脱可能に保持され、前記電子部品を前記部品実装機に供給する部品供給フィーダと、
    　前記フィーダ保持部に着脱可能に保持され、接着剤を前記部品実装機に供給する接着剤供給装置と、
    　前記フィーダ保持部に着脱可能に保持され、前記接着剤供給装置から供給される前記接着剤を塗布可能なシートを備え、前記シートに塗布された前記接着剤の状態に基づいて前記接着剤供給装置から供給される前記接着剤の塗布状態を確認する塗布状態確認装置と、
    　前記部品供給フィーダ、前記接着剤供給装置及び前記塗布状態確認装置を収容する保管庫と、
    　前記保管庫と前記フィーダ保持部との間で前記部品供給フィーダを移動させると共に、前記保管庫と前記フィーダ保持部との間で前記接着剤供給装置及び前記塗布状態確認装置を移動可能に構成されている移動装置と、を備える部品実装システム。     A component mounting system for mounting electronic components on a substrate, comprising:
    a component mounter provided with a feeder holding unit;
    a component supply feeder that is detachably held by the feeder holding section and supplies the electronic components to the component mounter;
    an adhesive supplying device that is detachably held by the feeder holding portion and supplies an adhesive to the component mounter;
    an application state confirmation device that is detachably held by the feeder holding portion, includes a sheet onto which the adhesive supplied from the adhesive supply device can be applied, and confirms an application state of the adhesive supplied from the adhesive supply device based on a state of the adhesive applied to the sheet;
    a storage facility for housing the component supply feeder, the adhesive supply device, and the application state checking device;
    A component mounting system comprising: a moving device configured to move the component supply feeder between the storage facility and the feeder holding unit, and to move the adhesive supply device and the application status confirmation device between the storage facility and the feeder holding unit.
  2. 　前記部品供給フィーダは、当該部品供給フィーダを識別する第１識別情報を記憶しており、
    　前記接着剤供給装置は、当該接着剤供給装置を識別する第２識別情報を記憶しており、
    　前記塗布状態確認装置は、当該塗布状態確認装置を識別する第３識別情報を記憶しており、
    　前記部品実装機は、
    　　前記フィーダ保持部に保持されている前記部品供給フィーダ、前記接着剤供給装置及び前記塗布状態確認装置とそれぞれ通信可能であり、当該部品供給フィーダ、当該接着剤供給装置及び当該塗布状態確認装置のそれぞれから前記第１識別情報、前記第２識別情報及び前記第３識別情報を取得する取得部と、
    　　前記取得部で取得した前記第１識別情報、前記第２識別及び前記第３識別情報に基づいて、前記フィーダ保持部に保持されている前記部品供給フィーダ、前記接着剤供給装置及び前記塗布状態確認装置を識別する識別部と、を備えている、請求項１に記載の部品実装システム。     the component supply feeder stores first identification information for identifying the component supply feeder;
    the adhesive supplying device stores second identification information for identifying the adhesive supplying device,
    the coating state checking device stores third identification information for identifying the coating state checking device,
    The component mounter includes:
    an acquisition unit capable of communicating with each of the component supply feeders, the adhesive supply device, and the application state confirmation device held in the feeder holding unit, and configured to acquire the first identification information, the second identification information, and the third identification information from each of the component supply feeders, the adhesive supply device, and the application state confirmation device;
    2. The component mounting system of claim 1, further comprising an identification unit that identifies the component supply feeder, the adhesive supply device, and the application state confirmation device held in the feeder holding unit based on the first identification information, the second identification information, and the third identification information acquired by the acquisition unit.
  3. 　前記部品実装機及び前記移動装置を管理する管理装置をさらに備えており、
    　前記接着剤供給装置は、当該接着剤供給装置の前記接着剤の残量を計測する残量計測部を備えており、
    　前記部品実装機は、前記フィーダ保持部に保持されている前記接着剤供給装置の前記残量計測部で計測された前記接着剤の残量に関する情報を前記管理装置に送信する通信部を備えており、
    　前記管理装置は、前記フィーダ保持部に保持されている前記接着剤供給装置の前記接着剤の残量が所定量より少なくなると、前記移動装置によって、当該接着剤供給装置を前記フィーダ保持部から前記保管庫に移動させると共に、前記保管庫に収容されている他の接着剤供給装置を前記フィーダ保持部に移動させる、請求項２に記載の部品実装システム。     The component mounter further includes a management device that manages the component mounter and the moving device,
    the adhesive supplying device includes a remaining amount measuring unit that measures a remaining amount of the adhesive in the adhesive supplying device,
    the component mounter includes a communication unit that transmits information regarding the remaining amount of the adhesive measured by the remaining amount measuring unit of the adhesive supplying device held in the feeder holding unit to the management device,
    The component mounting system of claim 2, wherein when the remaining amount of adhesive in the adhesive supplying device held in the feeder holding section becomes less than a predetermined amount, the management device moves the adhesive supplying device from the feeder holding section to the storage unit using the moving device, and moves other adhesive supplying devices stored in the storage unit to the feeder holding section.
  4. 　前記部品実装機及び前記移動装置を管理する管理装置をさらに備えており、
    　前記塗布状態確認装置は、前記シートを巻き取る巻取部と、前記巻取部で巻き取られた前記シートの巻取量を計測する巻取量計測部と、を備えており、
    　前記部品実装機は、前記フィーダ保持部に保持されている前記塗布状態確認装置の巻取量計測部で計測された前記シートの巻取量に関する情報を前記管理装置に送信する通信部を備えており、
    　前記管理装置は、前記フィーダ保持部に保持されている前記塗布状態確認装置の前記シートの巻取量が所定量より多くなると、前記移動装置によって、当該塗布状態確認装置を前記フィーダ保持部から前記保管庫に移動させると共に、前記保管庫に収容されている他の塗布状態確認装置を前記フィーダ保持部に移動させる、請求項２に記載の部品実装システム。     The component mounter further includes a management device that manages the component mounter and the moving device,
    the application state checking device includes a winding unit that winds up the sheet, and a winding amount measuring unit that measures a winding amount of the sheet wound by the winding unit,
    the component mounter includes a communication unit configured to transmit information regarding a take-up amount of the sheet measured by a take-up amount measuring unit of the coating state checking device held in the feeder holding unit to the management device,
    3. The component mounting system of claim 2, wherein when the take-up amount of the sheet of the coating state confirmation device held in the feeder holding section becomes greater than a predetermined amount, the management device uses the moving device to move the coating state confirmation device from the feeder holding section to the storage facility, and also moves other coating state confirmation devices stored in the storage facility to the feeder holding section.
  5. 　前記フィーダ保持部は、複数の前記接着剤供給装置を保持可能に構成されている、請求項１～４のいずれか一項に記載の部品実装システム。 The component mounting system according to any one of claims 1 to 4, wherein the feeder holding unit is configured to be capable of holding a plurality of the adhesive supply devices.
PCT/JP2022/040452 2022-10-28 2022-10-28 Component mounting system WO2024089886A1 (en)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001320159A (en) * 2000-05-11 2001-11-16 Yamaha Motor Co Ltd Method of mounting electronic parts, and surface mounting machine
JP2006237566A (en) * 2005-01-27 2006-09-07 Matsushita Electric Ind Co Ltd Method of determining member changing order and its device
JP2009253192A (en) * 2008-04-10 2009-10-29 Panasonic Corp Electronic part mounting apparatus and trial application device for viscous substance
JP2010034571A (en) * 2009-09-30 2010-02-12 Fuji Mach Mfg Co Ltd Apparatus for mounting electronic circuit component
JP2012104728A (en) * 2010-11-12 2012-05-31 Fuji Mach Mfg Co Ltd Apparatus for applying viscous liquid material
JP2016115910A (en) * 2014-12-18 2016-06-23 富士機械製造株式会社 Board working device and unit for coating nozzle
JP2022040317A (en) * 2018-02-16 2022-03-10 株式会社Fuji Board work system

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001320159A (en) * 2000-05-11 2001-11-16 Yamaha Motor Co Ltd Method of mounting electronic parts, and surface mounting machine
JP2006237566A (en) * 2005-01-27 2006-09-07 Matsushita Electric Ind Co Ltd Method of determining member changing order and its device
JP2009253192A (en) * 2008-04-10 2009-10-29 Panasonic Corp Electronic part mounting apparatus and trial application device for viscous substance
JP2010034571A (en) * 2009-09-30 2010-02-12 Fuji Mach Mfg Co Ltd Apparatus for mounting electronic circuit component
JP2012104728A (en) * 2010-11-12 2012-05-31 Fuji Mach Mfg Co Ltd Apparatus for applying viscous liquid material
JP2016115910A (en) * 2014-12-18 2016-06-23 富士機械製造株式会社 Board working device and unit for coating nozzle
JP2022040317A (en) * 2018-02-16 2022-03-10 株式会社Fuji Board work system

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