JP7429306B2 - Component placement equipment, 3D modeling machines, and component placement systems - Google Patents

Description

This specification discloses a technology related to a component mounting device and a three-dimensional modeling machine.

The component mounting device described in Patent Document 1 includes a nozzle station inside the device. The nozzle station can accommodate a plurality of suction nozzles that replace the suction nozzles held by the rotary head.

JP 2019-110347 Publication

However, there is an upper limit to the number of suction nozzles that can be accommodated in a nozzle station. In the production of substrate products, there are cases where more suction nozzles are required than the number accommodated in a nozzle station, and there is a demand for increasing the number of suction nozzles that can be used in a component mounting apparatus.

In view of these circumstances, this specification discloses a component mounting device and a three-dimensional modeling machine that can increase the number of holding members that can be used in the component mounting device.

The component mounting device can include a holding member mounting unit on which a holding member capable of holding a component to be mounted on a board is mounted, as part of a component supply device that supplies the component.

Since the above component mounting device can include a holding member mounting unit in a part of the component supply device, it is possible to increase the number of holding members that can be used in the component mounting device.

FIG. 2 is a plan view showing a configuration example of a component mounting device. It is a perspective view showing an example of a holding member. It is a perspective view which shows an example of the holding member accommodation device and the holding part of the holding member mounting unit. It is a perspective view which shows another example of the accommodating part of a holding member accommodating device and a holding member mounting unit. FIG. 2 is a plan view showing an example of a component mounting device including a holding member mounting unit in a part of the component supply device. FIG. 2 is a perspective view showing an example of a holding member mounting unit installed in a part of the component supply device. FIG. 3 is a perspective view showing a state in which the accommodating section is removed from the attachment/detachment section. It is a block diagram showing an example of a control block of a component mounting device. FIG. 1 is a plan view showing a configuration example of a three-dimensional modeling machine.

1. Embodiment 1-1. Configuration Example of Component Mounting Device 10 The component mounting device 10 mounts a component 92 onto a board 91 . As shown in FIG. 1, the component mounting device 10 includes a board transport device 11, a component supply device 12, a component transfer device 13, a component camera 14, a board camera 15, a control device 16, an input/output device 17, and a holding member storage device. It is equipped with 40. Note that in this specification, the direction in which the substrate 91 is transported is the X-axis direction. The direction perpendicular to the X-axis direction on the horizontal plane is defined as the Y-axis direction. The direction perpendicular to the X-axis direction and the Y-axis direction is defined as the Z-axis direction.

The substrate transport device 11 is configured by, for example, a belt conveyor, and transports the substrate 91 in the transport direction (X-axis direction). The substrate 91 is a circuit board on which various circuits such as electronic circuits, electric circuits, magnetic circuits, etc. are formed. The board transport device 11 carries the board 91 into the component mounting device 10 and positions the board 91 at a predetermined position inside the device. The board transport device 11 carries the board 91 out of the component mounting device 10 after the component mounting device 10 completes the mounting process of the component 92 .

The component supply device 12 supplies components 92 to be mounted on the board 91. The component supply device 12 is provided with a plurality of slots 12a. At least some of the plurality of slots 12a can be equipped with feeders 12f. The feeder 12f holds a reel 12r around which a carrier tape 12c containing the component 92 is wound. The feeder 12f feeds the carrier tape 12c in pitches, and supplies the component 92 so that it can be picked up at a supply position 12s located on the tip side of the feeder 12f. Further, at least some of the plurality of slots 12a can be equipped with a tray unit 12t. The tray unit 12t includes a tray. Electronic components (for example, lead components) that are relatively large compared to chip components and the like are arranged on the tray.

The component transfer device 13 includes a head drive device 13a and a moving table 13b. The head driving device 13a is configured to be able to move the moving table 13b in the X-axis direction and the Y-axis direction using a linear motion mechanism. A mounting head 20 is removably (replaceably) provided on the moving table 13b using a clamp member. The mounting head 20 uses the holding member 30 to mount the component 92 onto the substrate 91 . Specifically, the mounting head 20 picks up and holds the component 92 supplied by the component supply device 12 using at least one holding member 30, and places the component 92 on the substrate 91 positioned by the substrate transfer device 11. Installing.

For example, a suction nozzle, a chuck, etc. can be used as the holding member 30. As shown in FIG. 2, the holding member 30 of this embodiment is a suction nozzle that suctions a component 92, and includes a nozzle main body 31, a flange 32, an identification part 33, a grip part 34, and a movable part 35. It is equipped with The nozzle body portion 31 is a base portion, and is provided with a flange portion 32, a grip portion 34, and a movable portion 35. The identification portion 33 is provided on the surface of the flange portion 32 on the side where the grip portion 34 is provided. The component mounting device 10 can identify the holding member 30 by reading the identification section 33. The identification unit 33 can use, for example, a two-dimensional code.

The mounting head 20 includes an elevating member that is held movably up and down on the head body, and the elevating member can hold the holding member 30. The mounting head 20 can exchange the holding member 30 held by the mounting head 20 with a holding member 30 housed in a holding member accommodating device 40 or a holding member mounting unit 50, which will be described later, using an elevating member. The grip part 34 is formed so that the lifting member of the mounting head 20 can hold the holding member 30. The grip portion 34 only needs to be held by an elevating member, and its shape and the like are not limited. As shown in FIG. 2, the grip portion 34 of this embodiment is formed to protrude from the nozzle body portion 31 in a direction perpendicular to the axial direction of the holding member 30. As shown in FIG.

The movable part 35 is a part that can slide with respect to the nozzle main body part 31, and includes a nozzle tip part 35a that can suck the component 92. When the holding member 30 is held by the elevating member, the movable portion 35 is urged downward by a compression spring provided on the elevating member. The movable part 35 moves upward against the elastic force of the compression spring when the nozzle tip 35a contacts the component 92 and attracts the component 92, and when the nozzle tip 35a contacts the component 92, the movable part 35 moves upward against the elastic force of the compression spring. impact is reduced.

As the component camera 14 and the board camera 15, known imaging devices can be used. The component camera 14 is fixed to the base of the component mounting device 10 so that its optical axis is directed upward in the Z-axis direction (vertically upward direction). The component camera 14 can image the component 92 held by the holding member 30 from below. The board camera 15 is provided on the movable table 13b of the component transfer device 13 so that its optical axis points downward in the Z-axis direction (vertically downward direction). The board camera 15 can image the board 91 from above. The component camera 14 and the board camera 15 perform imaging based on control signals sent from the control device 16. Image data captured by the component camera 14 and the board camera 15 is transmitted to the control device 16.

The control device 16 includes a known arithmetic unit and a storage device, and constitutes a control circuit. Information, image data, etc. output from various sensors provided in the component mounting apparatus 10 are input to the control device 16 . The control device 16 sends control signals to each device based on a control program and predetermined mounting conditions set in advance. For example, the control device 16 causes the substrate camera 15 to take an image of the substrate 91 positioned by the substrate transport device 11. The control device 16 processes the image captured by the board camera 15 and recognizes the positioning state of the board 91. Further, the control device 16 causes the holding member 30 to collect the component 92 supplied by the component supply device 12, and causes the component camera 14 to take an image of the component 92 held by the holding member 30. The control device 16 performs image processing on the image captured by the component camera 14 to recognize the holding posture of the component 92.

The control device 16 moves the holding member 30 upward from a scheduled mounting position that is preset by a control program or the like. Further, the control device 16 corrects the scheduled mounting position based on the positioning state of the board 91, the holding posture of the component 92, etc., and sets the mounting position where the component 92 is actually mounted. The scheduled mounting position and the mounting position include the rotation angle in addition to the position (X-axis coordinate and Y-axis coordinate). The control device 16 corrects the target position (X-axis coordinate and Y-axis coordinate) and rotation angle of the holding member 30 according to the mounting position. The control device 16 lowers the holding member 30 at the corrected target position at the corrected rotation angle, and mounts the component 92 on the board 91. The control device 16 executes the mounting process of mounting the plurality of components 92 on the board 91 by repeating the above pick-and-place cycle.

1-2. Configuration Example of Holding Member Accommodating Device 40 The holding member accommodating device 40 is provided in a movable region of the mounting head 20 in a detachable manner. The holding member accommodating device 40 includes a plurality of accommodating recesses 41 and a shielding member 42, and can accommodate the holding member 30. In the holding member accommodating device 40 shown in FIG. 3, three accommodating recesses 41 and shielding members 42 are illustrated. In the holding member accommodating device 40 shown in FIG. 4, eight accommodating recesses 41 are illustrated, and in order to make the entire accommodating recesses 41 visible, the shielding member 42 is removed for convenience of explanation.

The plurality of accommodation recesses 41 are formed in a plurality of rows at a predetermined pitch in the holding member accommodation device 40 . The plurality of accommodation recesses 41 are formed inside the holding member accommodation device 40, and can accommodate, for example, the movable part 35 shown in FIG. 2. The shielding member 42 is provided on the upper surface of the holding member accommodating device 40 so as to be slidable, for example, along the longitudinal direction of the holding member accommodating device 40 (in the present embodiment, the X-axis direction).

The shielding member 42 is driven and controlled by a shielding member driving device. The shielding member driving device can use, for example, a linear motion mechanism such as an air cylinder. The shielding member driving device slides the shielding member 42 to the open position while the component mounting device 10 is in operation, allowing the holding member 30 to be accommodated and taken out. The shielding member driving device slides the shielding member 42 to the closed position during production stoppage of the component mounting device 10, during replacement work of the holding member storage device 40, etc., and regulates storage and removal of the holding member 30.

1-3. Configuration Example of Holding Member Mounting Unit 50 There is an upper limit to the number of holding members 30 that can be accommodated in the holding member accommodating device 40. In the production of board products, there are cases where more holding members 30 are required than the holding member accommodating device 40 can accommodate, and there is a demand for increasing the number of usable holding members 30 in the component mounting device 10. Therefore, the component mounting device 10 of this embodiment can include the holding member mounting unit 50 in a part of the component supply device 12 that supplies the component 92.

The component mounting device 10 shown in FIG. 5 includes a holding member mounting unit 50 in a part of the component supply device 12. As shown in FIGS. 5 and 6, the holding member mounting unit 50 includes a main body portion 51 and a housing portion 52. As shown in FIGS. The main body portion 51 is removably provided in the slot 12a of the component supply device 12. Specifically, the main body part 51 is formed in the same shape as the main body part of the feeder 12f, and can be installed in the slot 12a like the feeder 12f, and can be removed from the slot 12a. Therefore, the holding member mounting unit 50 of this embodiment is provided so as to be replaceable with the feeder 12f that holds the reel 12r around which the carrier tape 12c containing the component 92 is wound.

The accommodating portion 52 is provided at the upper part of the main body portion 51 and accommodates the holding member 30. Specifically, the accommodating portion 52 is provided in a movable area of the mounting head 20 when the holding member mounting unit 50 is mounted on the component supply device 12. Moreover, the accommodating portion 52 can have the same configuration as the holding member accommodating device 40. The housing section 52 includes a plurality of housing recesses 52a and a shielding member 52b.

The accommodation recess 52 a corresponds to the accommodation recess 41 of the holding member accommodation device 40 . The shielding member 52b corresponds to the shielding member 42 of the holding member accommodating device 40. The holding member mounting unit 50 shown in FIG. 6 includes an accommodation recess 52a similar to the accommodation recess 41 of the holding member accommodation device 40 shown in FIG. Also in the holding member mounting unit 50 shown in FIG. 6, the shielding member 52b is removed for convenience of explanation in order to make the entire accommodation recess 52a visible. Note that the holding member mounting unit 50 can also include a housing section 52 similar to the holding member housing device 40 shown in FIG. 3 .

The accommodating portion 52 can be formed integrally with the main body portion 51. Moreover, the accommodating part 52 can also be provided in the main body part 51 removably. For example, as shown in FIG. 7, the holding member mounting unit 50 includes a connecting portion 53. The connecting portion 53 is provided at the upper part of the main body portion 51, and includes a fixing portion 53a and a pressing portion 53b. The fixing portion 53a and the pressing portion 53b are spaced apart from each other in the longitudinal direction (X-axis direction) of the housing portion 52. The pressing portion 53b is supported movably in the longitudinal direction (X-axis direction) of the accommodating portion 52 with respect to a fixed portion 53a fixed to the connecting portion 53. The pressing portion 53b is urged by an elastic member in a direction toward the fixed portion 53a.

When fixing the accommodating part 52 to the connecting part 53, the engaging part provided on the lower surface of the accommodating part 52 is sandwiched between the fixing part 53a and the pressing part 53b, so that the accommodating part 52 is fixed to the connecting part 53. be done. When removing the accommodating part 52 from the connecting part 53, the pressing part 53b is moved in the direction away from the fixing part 53a against the elastic force of the elastic member, and the accommodating part 52 is removed from the connecting part 53. Note that the connecting portion 53 is only an example, and the connecting portion 53 can take various forms.

1-4. Control Example Regarding Holding Member Mounting Unit 50 The component mounting device 10 can include a setting section 61 . The component mounting device 10 can also include a control section 62. As shown in FIG. 8, the component mounting apparatus 10 of this embodiment includes a setting section 61 and a control section 62. Further, the setting section 61 and the control section 62 are provided in the control device 16 of the component mounting apparatus 10.

The setting section 61 allows the user to set whether or not the holding member mounting unit 50 can be used. The setting unit 61 can allow the user to set whether or not the holding member mounting unit 50 can be used, for example, using the input/output device 17. As the input/output device 17, for example, a known input/output device such as a touch panel can be used. The input/output device 17 displays various information regarding the component mounting device 10 and the production of board products, and accepts various operations by the user. Furthermore, the setting section 61 can allow the user to set whether or not the holding member mounting unit 50 can be used when creating the control program described above.

For example, as shown in FIG. 5, it is assumed that the holding member accommodating device 40 and the holding member mounting unit 50 can each accommodate a maximum of eight holding members 30. If the number of types of holding members 30 required in the production of substrate products exceeds the maximum number of holding members 30 that can be accommodated in the holding member storage device 40 (8 in this case), the user can use the holding member mounting unit 50. Set. In this case, as shown in FIG. 5, a part of the component supply device 12 is equipped with a holding member mounting unit 50, and the component mounting device 10 can use up to 16 holding members 30.

If the number of types of holding members 30 required in the production of board products is less than the maximum number that can be accommodated in the holding member storage device 40 (8 in this case), the user may disable the holding member mounting unit 50. Set. In this case, as shown in FIG. 1, the holding member mounting unit 50 is not installed, and the component mounting apparatus 10 can use a maximum of eight holding members 30. Furthermore, as the number of types of components 92 required in the production of board products increases, the number of component supply media such as the feeder 12f installed in the component supply device 12 tends to increase. Therefore, a component supply medium such as a feeder 12f can be installed in the empty slot 12a of the component supply device 12 in which the holding member mounting unit 50 is not installed.

In this manner, the user determines whether or not the holding member mounting unit 50 can be used depending on the types of the holding member 30 and components 92 necessary for producing the board product. Therefore, it is preferable that the setting section 61 guides the types of the holding member 30 and the parts 92 that are necessary in the production of the board product. Thereby, the user can set whether or not the holding member mounting unit 50 can be used based on the guidance.

Further, as the number of types of holding members 30 that can be mounted increases, the size of the holding member mounting unit 50 tends to increase, and the area occupied by the component supply device 12 tends to increase. For example, in the above example, assume that the number of types of holding members 30 required in the production of board products is 11 (=8+3). In this case, it is sufficient to equip the holding member mounting unit 50 in which the maximum number of holding members 30 accommodated is three, and there is no need to equip the holding member mounting unit 50 in which the maximum number of holding members 30 accommodated is eight. When the holding member mounting unit 50 with a maximum capacity of 3 holding members 30 is installed, the occupied area of the component supply device 12 is reduced compared to the case where the holding member mounting unit 50 with a maximum capacity of 8 holding members 30 is installed. Easy to reduce.

Therefore, when using the holding member mounting unit 50, the setting unit 61 selects the holding member necessary for the production of the board product from among the plurality of types of holding member mounting units 50 each having a different number of types of holding members 30 that can be mounted. It is preferable to guide the holding member mounting unit 50 in which the holding member mounting unit 30 can be mounted. Thereby, the user can select the holding member mounting unit 50 based on the guidance.

As described above, the holding member mounting unit 50 of this embodiment is provided so as to be replaceable with the feeder 12f that holds the reel 12r around which the carrier tape 12c containing the component 92 is wound. In this case, if the holding member mounting unit 50 is driven and controlled using a feed signal that pitches the carrier tape 12c, the control circuit on the part supplying device 12 side can be shared with the drive control of the feeder 12f, and the control circuit can be simplified. can be converted into

Therefore, it is preferable that the component mounting apparatus 10 includes a control section 62. When exchanging the holding member 30 between the mounting head 20 and the holding member mounting unit 50, the control unit 62 transmits a sending signal to the holding member mounting unit 50 for pitch-feeding the carrier tape 12c, so that the holding member mounting unit 50 does not mount the holding member. The unit 50 is driven and controlled.

For example, the control unit 62 raises the accommodating portion 52 that accommodates the holding member 30, releases the restriction by the shielding member 52b that restricts the falling of the holding member 30 in the holding member mounting unit 50, and causes the mounting head 20 to attach the holding member Have them exchange 30. As shown in FIG. 8, the holding member mounting unit 50 of the present embodiment includes a housing part lifting device 50a that raises and lowers the housing part 52, and a shielding member driving device that slides the shielding member 52b to the open position or the closed position described above. 50b. For example, a linear motion mechanism such as an air cylinder can be used for the storage section lifting device 50a and the shielding member driving device 50b.

As shown in FIG. 6, the holding member mounting unit 50 of this embodiment includes an air delivery section 54. As shown in FIG. The air delivery section 54 is a tube that sends out air, and sends air supplied to the main body section 51 from an external air source to a storage section lifting device 50a and a shielding member drive device 50b provided inside the storage section 52. Send to. When the holding member mounting unit 50 receives the sending signal from the control section 62, it drives the accommodation section lifting device 50a using air supplied from the air delivery section 54, thereby raising the accommodation section 52.

Further, upon receiving the sending signal from the control section 62, the holding member mounting unit 50 drives the shielding member driving device 50b using air supplied from the air delivery section 54 to slide the shielding member 52b to the open position. . As a result, the distance between the accommodating portion 52 of the holding member mounting unit 50 and the mounting head 20 is maintained at a distance that allows the holding member 30 to be replaced, and the restriction by the shielding member 52b is released, and the mounting head 20 is This allows the holding member 30 to be replaced.

The component mounting apparatus 10 that includes the holding member mounting unit 50 can increase the number of holding members 30 that can be mounted, compared to a case that does not include the holding member mounting unit 50. Therefore, the holding member mounting unit 50 can also mount holding members 30 in excess of the required number of holding members 30 required in the production of substrate products. In this case, the control unit 62 controls the holding members 30 that are installed in the mounting head 20 and whose collection rate of parts 92 is less than the allowable value, and the holding members 30 that are installed in the holding member mounting unit 50. It is also possible to have the mounting head 20 replace the holding member 30 with a collection rate equal to or higher than the allowable value.

The collection rate of the part 92 is the ratio of the normal number of times the part 92 was successfully collected to the number of times the part 92 was collected (the sum of the abnormal number of times the part 92 could not be collected normally and the normal number). , are sequentially stored in the storage device. As the holding member 30 is used in production, there is a possibility that, for example, sliding failure of the movable part 35 shown in FIG. There is.

The control unit 62 acquires the sampling rate of the parts 92 of the holding member 30 mounted on the mounting head 20 from the storage device, and determines whether the sampling rate of the parts 92 is less than the allowable value. When a holding member 30 whose collection rate of parts 92 is less than the allowable value is discovered, the control unit 62 controls the holding member 30 and the holding member mounted on the holding member mounting unit 50 during idle time during production, for example. It is possible to cause the mounting head 20 to replace the member 30 with the holding member 30 whose collection rate is equal to or higher than the allowable value. Thereby, the component mounting apparatus 10 can prevent a mounting failure of the component 92 due to a defect in the holding member 30 from occurring.

1-5. Configuration Example of Three-Dimensional Modeling Machine 90 The three-dimensional modeling machine 90 includes a three-dimensional modeling device 70, a circuit forming device 80, and a component mounting device 10. As shown in FIG. 9, in the three-dimensional modeling machine 90 of this embodiment, the three-dimensional modeling device 70, the circuit forming device 80, and the component mounting device 10 are integrated into one module.

The three-dimensional modeling device 70 forms a three-dimensional object 90f on a modeling palette 90m. The three-dimensional modeling device 70 only needs to be able to form the three-dimensional object 90f on the modeling pallet 90m, and any known three-dimensional modeling device can be used. For example, the three-dimensional modeling device 70 can form the three-dimensional model 90f on the modeling palette 90m using a modeling ink containing a polymerizable compound that polymerizes and solidifies when irradiated with ultraviolet rays as a raw material.

The circuit forming device 80 forms a circuit pattern 90c on a shaped object 90f. The circuit forming device 80 only needs to be able to form the circuit pattern 90c on the shaped object 90f, and any known circuit forming device can be used. For example, the circuit forming device 80 can draw the circuit pattern 90c on the object 90f using conductive ink containing fine metal particles such as silver in a solvent. The circuit forming apparatus 80 can form a circuit pattern 90c on a shaped object 90f during or after shaping.

The component mounting device 10 may be in any of the forms described above. Note that the component mounting device 10 can include a paste supply unit. The paste supply unit supplies a paste-like conductive material that electrically and mechanically connects the mounting position of the component 92 of the circuit pattern 90c and the connection portion of the component 92. Conductive materials include paste-like conductive adhesives that have a higher viscosity than conductive ink, molten solder, and the like. Before mounting the component 92, the component mounting apparatus 10 can apply a conductive material to the mounting position of the component 92 on the circuit pattern 90c.

Furthermore, the three-dimensional modeling machine 90 of this embodiment is provided with a pallet moving device 90p. The pallet moving device 90p moves the modeling pallet 90m between the three-dimensional modeling device 70, the circuit forming device 80, and the component mounting device 10. The modeling pallet 90m is moved by the pallet moving device 90p in the order of the three-dimensional modeling device 70, the circuit forming device 80, and the component mounting device 10, and the formation of the object 90f described above, the formation of the circuit pattern 90c, and the mounting of the component 92 are performed. It will be done. As the pallet moving device 90p, for example, a conveying device constituted by a belt conveyor or the like, a conveying device that grips and moves the modeling pallet 90m with a robot hand, or the like can be used.

In the 3D printing machine 90 in which the 3D printing device 70, the circuit forming device 80, and the component mounting device 10 are integrated into one module, the component mounting device 10 needs to produce a wide variety of board products in one module. be. Therefore, in the component mounting device 10, the number of holding members 30 to be mounted is likely to increase compared to a case where the mounting process of the component 92 can be distributed using a plurality of component mounting devices 10. Furthermore, it is necessary to accommodate large-sized holding members 30 in consideration of attachment of large-sized parts 92, and the number of holding members 30 that can be accommodated in one holding member storage device 40 tends to decrease. Furthermore, in the three-dimensional modeling machine 90 that is made into one module, there is little free space, and it is often difficult to add the holding member storage device 40.

Therefore, the component mounting device 10 that can include the holding member mounting unit 50 as a part of the component supply device 12 is a three-dimensional printing device in which the three-dimensional printing device 70, the circuit forming device 80, and the component mounting device 10 are integrated into one module. It is suitable for use in the machine 90. The three-dimensional modeling machine 90 of this embodiment includes the component mounting device 10 that can include the holding member mounting unit 50 as a part of the component supply device 12, so the number of holding members 30 that can be used in the component mounting device 10 is can be increased.

2. One example of effects of the embodiment Since the component mounting device 10 can include the holding member mounting unit 50 in a part of the component supply device 12, the number of usable holding members 30 in the component mounting device 10 can be increased. can.

10: component mounting device, 12: component supply device, 12a: slot,
12c: carrier tape, 12r: reel, 12f: feeder,
20: Mounting head, 30: Holding member, 50: Holding member mounting unit,
51: Main body part, 52: Accommodating part, 52b: Shielding member, 61: Setting part,
62: Control unit, 70: Three-dimensional printing device, 80: Circuit forming device,
90: Three-dimensional modeling machine, 91: Board, 92: Parts, 90c: Circuit pattern,
90f: Modeling object, 90m: Modeling palette.

Claims (10)

A component mounting device that can include a holding member mounting unit that mounts a holding member capable of holding a component to be mounted on a board as part of a component supply device that supplies the component ,
The holding member mounting unit is provided to be replaceable with a feeder that holds a reel around which a carrier tape that accommodates the component is wound,
The component mounting device sends a sending signal for pitch-feeding the carrier tape when exchanging the holding member between a mounting head that uses the holding member to mount the component on the board and the holding member mounting unit. a control unit that transmits the information to the holding member mounting unit to drive and control the holding member mounting unit,
The control unit raises a housing part that accommodates the holding member, releases the restriction by a shielding member that restricts falling off of the holding member in the holding member mounting unit, and causes the mounting head to replace the holding member. Parts mounting device . A component mounting device that can include a holding member mounting unit that mounts a holding member capable of holding a component to be mounted on a board as part of a component supply device that supplies the component ,
The holding member mounting unit is provided to be replaceable with a feeder that holds a reel around which a carrier tape that accommodates the component is wound,
The component mounting device sends a sending signal for pitch-feeding the carrier tape when exchanging the holding member between a mounting head that uses the holding member to mount the component on the board and the holding member mounting unit. a control unit that transmits the information to the holding member mounting unit to drive and control the holding member mounting unit,
The control unit includes the holding member that is installed in the mounting head and whose collection rate of the component is less than a tolerance value, and the holding member that is installed in the holding member mounting unit. A component mounting device that causes the mounting head to replace the holding member whose collection rate is greater than or equal to an allowable value . The holding member mounting unit is
a main body portion that is removably installed in the slot of the component supply device;
an accommodating part provided on the upper part of the main body part and accommodating the holding member;
The component mounting device according to claim 1 or 2 , comprising: 4. The component mounting device according to claim 3 , wherein the accommodating section is removably provided in the main body section. The component mounting device according to any one of claims 1 to 4 , further comprising a setting section that allows a user to set whether or not the holding member mounting unit can be used. 6. The component mounting apparatus according to claim 5 , wherein the setting section guides the type of the holding member and the component required in production of a board product. When the holding member mounting unit is used, the setting unit selects the holding member necessary for producing the board product from among the plurality of types of holding member mounting units each having a different number of types of the holding member that can be mounted. The component mounting device according to claim 5 or 6, wherein the mounting member mounting unit is guided. a three-dimensional modeling device that forms a three-dimensional object on a modeling palette;
a circuit forming device that forms a circuit pattern on the shaped object;
The component mounting device according to any one of claims 1 to 7 , which mounts the component supplied from the component supply device onto the circuit pattern formed on the shaped object;
A three-dimensional modeling machine equipped with The three-dimensional printer according to claim 8 , wherein the three-dimensional printer, the circuit forming device, and the component mounting device are integrated into one module. a holding member mounting unit equipped with a holding member capable of holding a component mounted on a board;
a component mounting device that can include the holding member mounting unit as a part of a component supply device that supplies the component ;
A component mounting system comprising:
The holding member mounting unit includes an accommodating portion that accommodates the holding member,
The accommodating portion is raised, the restriction by the shielding member that restricts the falling of the holding member in the holding member mounting unit is released, and the holding member is removed by the mounting head that mounts the component on the board using the holding member. A parts mounting system in which parts are replaced .

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