WO2024082434A1 - 一种两级制冷模组以及光子美容仪 - Google Patents

一种两级制冷模组以及光子美容仪 Download PDF

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Publication number
WO2024082434A1
WO2024082434A1 PCT/CN2022/141630 CN2022141630W WO2024082434A1 WO 2024082434 A1 WO2024082434 A1 WO 2024082434A1 CN 2022141630 W CN2022141630 W CN 2022141630W WO 2024082434 A1 WO2024082434 A1 WO 2024082434A1
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WO
WIPO (PCT)
Prior art keywords
heat
conducting
fan
aluminum
plate
Prior art date
Application number
PCT/CN2022/141630
Other languages
English (en)
French (fr)
Inventor
周莹
李兵
Original Assignee
深圳市嘉宇康医疗器械有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202211473227.9A external-priority patent/CN115751763A/zh
Application filed by 深圳市嘉宇康医疗器械有限公司 filed Critical 深圳市嘉宇康医疗器械有限公司
Publication of WO2024082434A1 publication Critical patent/WO2024082434A1/zh

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Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
    • A61B18/18—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F7/00—Heating or cooling appliances for medical or therapeutic treatment of the human body
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N5/00—Radiation therapy
    • A61N5/06—Radiation therapy using light
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect

Definitions

  • the present invention relates to the field of beauty equipment, in particular to a two-stage refrigeration module and a photon beauty instrument.
  • Beauty devices that use pulsed light or laser or halogen lamp or other light sources or radio frequency to achieve beauty functions.
  • the light source component generates light waves, which are emitted from the light exit window of the working head of the beauty device to perform beauty treatments on the skin surface that is in contact (or not in direct contact) with the end face of the working head, such as hair removal, skin rejuvenation, spot removal, anti-inflammatory, soft blood vessels, wrinkle removal, skin redness removal, acne treatment, treatment of vascular lesions, treatment of pigmented lesions, or single or combined radio frequency therapy.
  • Some portable or handheld beauty devices on the market currently have poor heat dissipation inside the body, which affects the work of the beauty device and fails to achieve the expected beauty effect; the internal structure of the body is complex, the cooling effect of the working surface is poor, or the temperature of the working surface is too high, causing skin burns, and the user experience is poor.
  • the technical problem to be solved by the present invention is to provide a two-stage refrigeration module and a photon beauty instrument to solve the heat dissipation and working surface refrigeration problems of existing beauty instruments.
  • the present invention adopts the following technical solutions:
  • a two-stage refrigeration module comprises a primary semiconductor refrigeration component, a secondary semiconductor component and a cooling member; the primary and secondary semiconductor refrigeration components both comprise an electric double layer in the middle and a hot surface and a cold surface at both ends; the cooling member is connected between the primary semiconductor refrigeration component and the secondary semiconductor refrigeration component in a rapid cooling manner; the cooling member is a heat transfer structural component.
  • the two ends of the cooling member are respectively connected to the hot surface of the first-level semiconductor refrigeration member and the cold surface of the second-level semiconductor refrigeration member in a rapid heat transfer manner;
  • the heat transfer structural member is selected from one or a combination of heat conducting elements, heat pipes, temperature averaging plates, super heat conducting pipes, and super heat conducting plates made of heat conducting materials.
  • the super heat conductive pipe is an aluminum superconducting pipe
  • the super heat conductive plate is an aluminum superconducting plate
  • the aluminum superconducting plate or aluminum superconducting tube is sealed at both ends and has a working liquid encapsulated inside; more than two microgrooves are formed on the inner wall of the aluminum superconducting plate or aluminum superconducting tube when the aluminum material is formed; and a multi-microporous structure is formed in the aluminum superconducting plate or aluminum superconducting tube material when the aluminum material is formed.
  • the refrigeration module includes a heat-conducting structure and a heat sink; the heat-conducting structure is selected from one or a combination of heat-conducting elements, heat pipes, temperature equalizing plates, super heat-conducting pipes, and super heat-conducting plates made of heat-conducting materials; the heat-conducting structure is connected to the heat sink for rapid heat transfer; the heat-conducting structure is connected to the hot surface of the secondary semiconductor refrigeration element for rapid heat transfer, or, by arranging a hot end circuit of the secondary semiconductor refrigeration element on the heat-conducting structure and welding and electrically connecting the electric couple layer of the secondary semiconductor refrigeration element, the heat-conducting structure is directly used as the hot surface of the secondary semiconductor refrigeration element, so that the hot surface of the secondary semiconductor refrigeration element dissipates heat rapidly; the refrigeration module also includes a fan; the fan includes a shell and an impeller in the shell; the heat-conducting structure and/or the heat sink are arranged at the vent of the fan or as a part of the fan
  • the heat-conducting structure includes a plurality of aluminum superconducting plates or aluminum superconducting tubes, wherein the aluminum superconducting plates or aluminum superconducting tubes are single tubes and single roots, and a single channel is formed inside; the aluminum superconducting plates or aluminum superconducting tubes are plane-bent or 3D-bent to match the installation space; the heat-conducting structure also includes a heat-conducting plate, wherein the plurality of aluminum superconducting plates or aluminum superconducting tubes are combined with the heat-conducting plate, and the plurality of aluminum superconducting plates or aluminum superconducting tubes are arranged in at least two different directions or angles to reduce the defect of poor heat conduction effect caused by the effect of the anti-gravity direction; the heat sink includes one or more groups of heat-conducting material fins; the heat-conducting plate is arranged in a groove on the heat sink or on the top of the heat sink, or the heat sink and the heat-conducting plate are arranged on
  • the heat conducting plate is provided with a plurality of slots, the plurality of aluminum superconducting plates or aluminum superconducting tubes are adapted to the plurality of slots and are correspondingly installed in the slots, and the wall surfaces are in contact with each other for rapid heat transfer; the aluminum superconducting plates or aluminum superconducting tubes are welded or riveted to the slots to increase the contact area;
  • the secondary semiconductor refrigeration component is arranged on the heat conducting plate: the hot surface of the secondary semiconductor refrigeration component is fitted on the outer wall of the heat conducting plate, so that the heat of the hot surface is directly transferred to the heat conducting plate; or, the hot surface of the secondary semiconductor refrigeration component is installed on the outer wall of the heat conducting plate through the heat conducting component, and the heat of the hot surface is quickly transferred to the heat conducting plate through the heat conducting component; or, the heat conducting plate is used as a hot surface, on which a hot end circuit of the secondary semiconductor refrigeration component is arranged, which is welded and electrically connected to the PN galvanic particles of the galvanic layer;
  • the secondary semiconductor refrigeration component dissipates heat by a heat dissipation fan module;
  • the heat dissipation fan module includes a fan housing and an impeller, the interior of the fan housing is a cavity, and the impeller is installed in the cavity; a plurality of vents are provided on the fan housing, and the vents connect the cavity with the external air path of the fan;
  • at least part of the fan housing is composed of a heat-conducting outer shell, and the heat-conducting outer shell is selected from: a heat-conducting element made of heat-conducting material, a heat pipe, a temperature equalizing plate, a super heat-conducting pipe, a super heat-conducting plate, one or more of which are formed in a single piece or in a multi-piece splicing manner;
  • the hot surface of the secondary semiconductor refrigeration component is connected to the heat-conducting outer shell by heat transfer, or the heat-conducting outer shell is directly used as the hot surface of the secondary semiconductor refrigeration component.
  • the super heat conductive pipe is an aluminum superconducting pipe
  • the super heat conductive plate is an aluminum superconducting plate
  • the heat dissipation fan module includes a heat sink, and the heat sink is connected to the heat conductive shell for rapid heat transfer
  • the air duct of the heat sink is connected to the vent and cavity of the fan
  • the side elevation shell of the fan shell includes the heat conductive shell.
  • the side elevation shell of the fan housing includes the heat-conducting outer shell composed of a single-channel or multi-channel aluminum superconducting tube or aluminum superconducting plate; the inner wall of the side elevation shell of the fan housing is provided with the heat sink; the air duct direction of the heat sink is the rotation direction or axial direction of the impeller.
  • the present invention also relates to a photon beauty instrument, comprising a body provided with a plurality of ventilation holes, wherein a light source assembly, a power supply assembly and a control circuit board are arranged inside the body; the light source assembly, the power supply assembly and the control circuit board are electrically connected; the plurality of ventilation holes of the body are used for air inlet and outlet and form a ventilation channel with the space inside the body; the front end of the body is a working surface; a two-stage refrigeration module as described in any of the above embodiments is also arranged inside the body, and the first-stage semiconductor refrigeration plate directly serves as the working surface or cools the working surface.
  • the first-level semiconductor refrigeration plate uses a transparent crystal as the cold surface, the cold surface is directly used as the working surface, and the hot surface and the electric double layer of the first-level semiconductor refrigeration plate are provided with a light-transmitting window, so that the first-level refrigeration element has light transmittance; or, the cold surface, hot surface and electric double layer of the first-level semiconductor refrigeration plate jointly define the light-transmitting window, and the photons generated by the light source assembly are transmitted from the light-transmitting window to the outside of the working surface.
  • the cold surface of the first-level semiconductor refrigeration plate contacts and transfers heat with the working surface; or, the cold surface of the first-level refrigeration element and the working surface are connected by a heat transfer structure in a fast heat transfer manner.
  • the two-stage cooling module includes a fan, which is located in a ventilation channel inside the fuselage;
  • the light source assembly includes a lamp tube and a reflector cup, the ventilation channel inside the reflector cup is connected to the ventilation channel of the fan, and is connected to the ventilation channel inside the fuselage to form a heat dissipation ventilation channel for the light source assembly, and the fan promotes heat dissipation of the light source assembly;
  • a heat sink or a heat conductor is provided on one side of the reflector cup; a plurality of ventilation holes are formed on the fan shell;
  • the heat sink or the heat conductor of the reflector cup is installed at one of the ventilation holes, and the ventilation channel of the fan is connected to the ventilation channel in the fuselage to form a first ventilation channel for dissipating heat from the reflector cup;
  • the other ventilation channel of the fan is connected to the ventilation channel inside the reflector cup, and the ventilation channel of the fan is connected to the ventilation channel in the fuselage to form a second ventilation channel for dissip
  • the photon beauty device is a hair removal device, a photon skin rejuvenation device, an import and export beauty device or a radio frequency beauty device.
  • the two-stage refrigeration module of the present invention achieves the effects of rapid refrigeration and heat dissipation.
  • FIG. 1 is a perspective view of a beauty device according to a first embodiment of the present invention.
  • FIG. 2 is a three-dimensional view of the beauty instrument according to the first embodiment of the present invention with the upper shell removed.
  • FIG. 3 is a schematic diagram of the internal structure of the beauty instrument according to the first embodiment of the present invention.
  • FIG. 4 is a schematic diagram of a ventilation duct of a beauty instrument according to a first embodiment of the present invention.
  • FIG. 5 is a schematic diagram of another embodiment of the vent of the beauty instrument of the present invention.
  • FIG. 6 is a schematic diagram of the internal ventilation duct of the beauty instrument in the embodiment shown in FIG. 5 .
  • FIG. 7 is an exploded view of the beauty instrument of the embodiment shown in FIG. 1 .
  • FIG. 8 is a schematic structural diagram of a first embodiment of a refrigeration module of the present invention.
  • FIG. 9 is a perspective view of a first embodiment of a refrigeration module according to the present invention.
  • FIG. 10 is a partial exploded view of the refrigeration module of the present invention.
  • FIG. 11 is a three-dimensional diagram of the refrigeration module of the present invention.
  • FIG. 12 is a partial exploded view of the refrigeration module of the present invention.
  • FIG. 13 is a partial structural schematic diagram of the refrigeration module of the present invention.
  • FIG. 14 is a schematic diagram of a modified structure of a first embodiment of a refrigeration module of the present invention, wherein FIGS. 14( a ) and 14 ( b ) are from different viewing angles.
  • FIG. 15 is a schematic diagram of the structure of an alternative embodiment of a refrigeration module of the present invention, wherein FIG. 15 ( a ) and FIG. 15 ( b ) are different embodiments.
  • FIG. 16 is a perspective view of a beauty device according to a second embodiment of the present invention.
  • FIG. 17 is a three-dimensional view of the beauty device according to the second embodiment of the present invention with the upper shell removed.
  • FIG. 18 is a schematic diagram of the internal structure of a beauty instrument according to a second embodiment of the present invention.
  • FIG. 19 is an exploded view of a beauty device according to a second embodiment of the present invention.
  • 20-22 are several structural schematic diagrams of the second embodiment of the refrigeration module of the present invention.
  • Figure 23 is a schematic diagram of the structure of the aluminum superconducting plate or aluminum superconducting tube of the refrigeration module of an embodiment of the present invention, wherein Figure 23(a) is a three-dimensional view of a single aluminum superconducting plate or aluminum superconducting tube, and Figure 23(b) is a cross-sectional view of 23(a) along A-A.
  • 24-26 are several structural schematic diagrams of the third embodiment of the refrigeration module of the present invention.
  • FIG. 27 is a three-dimensional view of the beauty device according to the third embodiment of the present invention with the front shell removed.
  • FIG. 28 is a three-dimensional view of the beauty device according to the fourth embodiment of the present invention with the front shell removed.
  • FIG. 29 is an exploded view of a fourth embodiment of a refrigeration module of the present invention.
  • FIG. 30 is a three-dimensional diagram of a fourth embodiment of a refrigeration module of the present invention.
  • FIG. 31 is a schematic diagram of the internal structure of a beauty instrument according to a fifth embodiment of the present invention.
  • FIG. 32 is an exploded view of a beauty device according to a fifth embodiment of the present invention.
  • FIG. 33 is a three-dimensional diagram of a heat dissipation fan module according to an embodiment of the present invention.
  • FIG. 34 is a three-dimensional view of the heat dissipation fan module from another perspective according to the embodiment of the present invention.
  • FIG. 35 is an exploded view of the heat dissipation fan module according to an embodiment of the present invention.
  • FIG. 36 is a cross-sectional schematic diagram of a heat dissipation fan module according to an embodiment of the present invention.
  • FIG. 37 is a schematic structural diagram of the side elevation volute of the heat dissipation fan module according to an embodiment of the present invention.
  • FIG. 38 is a schematic diagram of an alternative structure of the embodiment shown in FIG. 37 .
  • 39-40 are schematic diagrams of another alternative structure of the embodiment shown in FIG. 37 .
  • 41-42 are schematic structural diagrams of alternative embodiments of the heat dissipation fan module shown in FIGS. 33-34 .
  • FIG. 43 is a three-dimensional diagram of a cooling fan module according to a modified embodiment of the present invention.
  • FIG. 44 is a schematic diagram of the structure of an alternative embodiment of FIG. 33 .
  • FIG. 45 is a cross-sectional schematic diagram of a heat dissipation fan module according to an alternative embodiment of the present invention.
  • FIG. 46 is a three-dimensional view of the heat dissipation fan module shown in FIG. 45 with the outer wall of the shell portion removed.
  • FIG. 47 is an exploded view of the cooling fan module shown in FIG. 45 .
  • 48-49 are three-dimensional views of a cooling fan module according to another alternative embodiment of the present invention from different viewing angles.
  • Figures 50-51 are cross-sectional schematic diagrams of different positions of the cooling fan module shown in Figures 48-49.
  • FIG52 is a partial exploded view of the cooling fan module shown in FIGS. 48-49 .
  • FIG. 53 is an exploded view of the cooling fan module shown in FIGS. 48-49 .
  • FIG. 54 is an exploded view of the cooling fan module shown in FIGS. 48-49 .
  • the present invention provides a refrigeration module 1, a heat dissipation fan module 200, and a photon beauty instrument 100 using the refrigeration module/heat dissipation fan module 200.
  • the refrigeration module 1 includes a semiconductor refrigeration element 10/10', and the semiconductor refrigeration element 10/10' includes an electric double layer 12 in the middle and a hot surface 11' and a cold surface 13 at both ends;
  • the refrigeration module 1 also includes a cooling member 15, one end of the cooling member 15 is connected to the cold surface 13 of the semiconductor refrigeration element in a fast heat transfer manner, and the other end is used to connect to the surface to be refrigerated in a fast cooling manner;
  • the cooling member 15 is a heat transfer structural member or a heat pipe or a VC temperature equalizing plate or a super heat conductive pipe or a super heat conductive plate.
  • the super heat conductive pipe is an aluminum superconducting pipe
  • the super heat conductive plate is an aluminum superconducting plate.
  • the cooling member 15 is a first cooling member
  • the refrigeration module 1 also includes a second cooling member 15'; the second cooling member 15' is arranged between the first cooling member 15 and the surface to be cooled, and is connected for rapid cooling; the second cooling member 15' is a heat conductive material tube or a heat conductive material plate or an aluminum superconducting tube or an aluminum superconducting plate or a heat pipe or a VC.
  • a two-stage refrigeration module 1 including a primary and a secondary semiconductor refrigeration element 10'/10 and a cooling element 15; the primary and the secondary semiconductor refrigeration element 10'/10 both include an electric double layer 12 in the middle and a hot surface 11' and a cold surface 13 at both ends; the cooling element 15 is connected between the primary semiconductor refrigeration element 10' and the secondary semiconductor refrigeration element 10 in a fast cooling manner; the cooling element 15 is a heat transfer structural element.
  • the two ends of the cooling element 15 are respectively connected to the hot surface 11' of the primary semiconductor refrigeration element 10' and the cold surface 13 of the secondary semiconductor refrigeration element 10 in a fast heat transfer manner;
  • the heat transfer structural element is selected from one or a combination of heat conduction elements, heat pipes, temperature averaging plates, super heat conduction pipes, and super heat conduction plates made of heat conductive materials.
  • the refrigeration module 1 includes a heat-conducting structure 19 and a heat sink 16;
  • the heat-conducting structure 19 is selected from one or a combination of heat-conducting elements, heat pipes, temperature averaging plates, super heat-conducting pipes, and super heat-conducting plates made of heat-conducting materials; the heat-conducting structure 19 is connected to the heat sink 16 by rapid heat transfer.
  • the heat-conducting structure 19 is connected to the hot surface 11' of the secondary semiconductor refrigeration element 10 by rapid heat transfer; or, by welding and electrically connecting the hot end circuit of the secondary semiconductor refrigeration element 10 on the heat-conducting structure 19 and the electric double layer 12 of the secondary semiconductor refrigeration element 10, the heat-conducting structure 19 is directly used as the hot surface 11' of the secondary semiconductor refrigeration element 10.
  • the two-stage refrigeration module 1 also includes a fan 18 or a heat-dissipating fan assembly 200; the fan 18 or the heat-dissipating fan assembly 200 includes a fan housing 180/210 and an impeller 181/220 in the housing.
  • the heat-conducting structure 19 and/or the heat sink 16 are arranged at the vent 182/201 of the fan or as a part of the fan housing 180/210.
  • the secondary semiconductor refrigeration element 10 of the two-stage refrigeration module 1 is cooled by a heat dissipation fan module 200.
  • the heat dissipation fan module 200 includes a fan housing 210 and an impeller 220.
  • the interior of the fan housing 210 is a cavity, and the impeller 220 is installed in the cavity.
  • the fan housing 210 is provided with a plurality of vents 201, and the vents 201 connect the cavity with the air path outside the fan.
  • At least part of the housing of the fan housing 210 is composed of a heat-conducting outer shell 211, and the heat-conducting outer shell 211 is selected from: a heat-conducting element made of a heat-conducting material, a heat pipe, a temperature-averaging plate, a super heat-conducting pipe, a super heat-conducting plate, or a combination thereof, in a single piece or in a multi-piece splicing.
  • the hot surface 11' of the secondary semiconductor refrigeration component 10 is connected to the heat-conducting shell 210 by heat transfer; or, the hot end circuit of the secondary semiconductor refrigeration component 10 is arranged on the heat-conducting shell 211, and is welded and electrically connected to the electric double layer 12 of the secondary semiconductor refrigeration component 10, so that the heat-conducting shell 211 directly serves as the hot surface of the secondary semiconductor refrigeration component 10.
  • the preferred embodiment of the present invention relates to a photon beauty instrument 100, including a fuselage provided with a plurality of vents 101, and a refrigeration module 1, a light source assembly 2, a power supply assembly 3 and a control circuit board 4 are arranged inside the fuselage.
  • the light source assembly 2 and the power supply assembly 3 are electrically connected to the control circuit board 4;
  • the plurality of vents 111 of the fuselage are used for air inlet and outlet and form a ventilation channel with the space inside the fuselage (such as the line shown by the arrows in Figures 4-6) to achieve heat dissipation inside the fuselage.
  • the front end of the fuselage is a working surface 113, which can directly contact the skin.
  • the light generated by the light source assembly 2 is transmitted to the working surface 113 and then emitted to perform beauty treatment on the skin.
  • the fuselage is also provided with a two-stage refrigeration module 1 as described in the above embodiment, in which the first-stage semiconductor refrigeration plate 10' directly serves as the working surface 113 or cools the working surface 113.
  • the primary semiconductor refrigeration plate 10' uses a transparent crystal as the cold surface 13, the cold surface 13 directly serves as the working surface 113, and the hot surface 11' and the electric double layer 12 of the primary semiconductor refrigeration plate 10' are provided with a light-transmitting window, so that the primary refrigeration element 10' has light transmittance; or, the cold surface 13, the hot surface 11' and the electric double layer 12 of the primary semiconductor refrigeration plate 10' jointly define the light-transmitting window, and the photons generated by the light source assembly are transmitted from the light-transmitting window to the outside of the working surface 113, so that the photons act on the skin outside the working surface.
  • the cold surface 13 of the primary semiconductor refrigeration plate 10' contacts and transfers heat with the working surface 113; or, the cold surface 13 of the primary refrigeration element 10' and the working surface are connected by a heat transfer structure in a rapid heat transfer manner.
  • the two-stage cooling module 1 includes a fan 18 or a heat dissipation fan assembly 200, which is located in the ventilation channel inside the fuselage;
  • the light source assembly 2 includes a lamp tube 20 and a reflective cup 21, and the ventilation channel inside the reflective cup 21 is connected to the ventilation channel of the fan 18 or the heat dissipation fan assembly 200, and is connected to the ventilation channel inside the fuselage to form a heat dissipation ventilation channel of the light source assembly 2, and the fan 18 or the heat dissipation fan assembly 200 promotes heat dissipation of the light source assembly.
  • a heat sink or heat conductor 22 is arranged on one side of the reflective cup 21; a plurality of vents 182/201 are formed on the fan housing 180/210 of the fan 18/heat dissipation fan assembly 200; a heat sink or heat conductor 22 of the reflective cup is installed at one of the vents, and the ventilation duct of the fan 18/heat dissipation fan assembly 200 is connected with the ventilation duct in the fuselage to form a first ventilation duct 101 for dissipating heat from the reflective cup 21; another vent of the fan 18/heat dissipation fan assembly 200 is connected with the air duct inside the reflective cup 21, and the ventilation duct of the fan 18/heat dissipation fan assembly 200 is connected with the ventilation duct in the fuselage to form a second ventilation duct 102 for dissipating heat from the reflective cup 21 and the lamp tube 20.
  • the present invention adopts a two-stage refrigeration module, which can solve the problems of uneven heat conduction efficiency, slow heat conduction, poor timeliness of heat conduction when the first-stage semiconductor refrigeration component dissipates heat through the heat transfer structural component, which reduces the refrigeration speed, and the problem of unbalanced heat at the front and rear ends or the left and right ends or the upper and lower ends of the heat sink when the heat is conducted to the heat sink, which affects the heat dissipation effect of the fan.
  • the present invention provides a refrigeration module 1 and a beauty instrument, wherein the refrigeration module 1 includes a semiconductor refrigeration element 10, which is used for refrigeration of the beauty instrument, and the semiconductor refrigeration element 10 includes a middle electric double layer and a hot surface 11' and a cold surface 13 at both ends; the refrigeration module also includes a heat-conducting structure 19 and a heat sink 16; the heat-conducting structure 19 includes a VC temperature-averaging plate or an aluminum superconducting plate or an aluminum superconducting tube; the heat-conducting structure is respectively connected to the heat sink 16 and the hot surface 11' of the semiconductor refrigeration element 10 for rapid heat transfer, so that the hot surface dissipates heat rapidly.
  • the refrigeration module 1 includes a semiconductor refrigeration element 10, which is used for refrigeration of the beauty instrument, and the semiconductor refrigeration element 10 includes a middle electric double layer and a hot surface 11' and a cold surface 13 at both ends; the refrigeration module also includes a heat-conducting structure 19 and a heat sink 16; the heat-conducting structure 19 includes a
  • the aluminum superconducting plate or aluminum superconducting tube is sealed at both ends, and a working liquid is encapsulated inside; more than two fine bone-shaped microgrooves 1911 are formed on the inner wall; and a multi-microporous structure 1912 is formed inside the aluminum superconducting plate or aluminum superconducting tube material.
  • the embodiment of the present invention relates to a beauty instrument 100, including a body provided with a plurality of vents 111.
  • the plurality of vents 111 can be provided at different or the same positions of the housing 110 and provided in different forms, including but not limited to: honeycomb holes, gaps, notches, etc. formed on the housing 110.
  • the vents can be one or more, and the cold wind or air from the environment enters the interior of the body from the vents, takes away the heat inside the body, and is discharged from the body through the vents.
  • a refrigeration module 1, a light source assembly 2, a power supply assembly 3 and a control circuit board 4 are provided inside the body.
  • the light source assembly 2 and the power supply assembly 3 are electrically connected to the control circuit board 4; the plurality of vents 111 of the body are used for air inlet and outlet and form a ventilation channel (the line shown by the arrows in Figures 4-6) with the space inside the body to achieve heat dissipation inside the body.
  • the front end of the body is a working surface 113, which can directly contact the skin. The light generated by the light source assembly 2 is transmitted to the working surface 113 and then emitted to perform beauty treatment on the skin.
  • the refrigeration module 1 of the embodiment of the present invention is mainly used for cooling the working surface 113 of the beauty instrument to achieve a cold compress effect on the skin.
  • the refrigeration module 1 includes a semiconductor refrigeration element 10, and the semiconductor refrigeration element 10 includes a middle electric double layer 12 and a hot surface 11' and a cold surface 13 at both ends.
  • the middle electric double layer 12 is a PN electric double particle arranged according to the hot end circuit set on the hot surface and the cold end circuit set on the cold surface and electrically connected to form the internal circuit of the semiconductor refrigeration element, which is electrically connected to the control circuit board 4 by the positive and negative electrodes or controlled by a separate circuit to control the operation of the semiconductor refrigeration element.
  • the refrigeration element 10 (specifically the cold surface 13) can be directly used as the working surface 113, or used to cool the working surface 113.
  • the technicians in this field can set an adaptive shape according to the needs, such as a transparent crystal or a ring.
  • the cold surface 13 of the refrigeration element 10 contacts the working surface 113, for example, it is set around the working surface.
  • the cold surface 13 of the refrigeration element 10 is in contact with the working surface 113 through a heat transfer element (or heat conductor).
  • the cold conductor (first cold conductor) 15 is a heat transfer structural member that can quickly transfer the heat of the working surface to the semiconductor refrigeration element to achieve the effect of cooling the working surface.
  • the heat transfer structural member can be a heat transfer element made of a heat conductive material such as (not limited to) a metal material such as (not limited to) a copper tube or a copper plate, etc.; or the heat transfer structural member can also be other heat transfer components such as a heat pipe (heat pipe) or a vapor chamber (VC, vapor chamber) or a super heat pipe or a super heat plate or other types of heat transfer components that can achieve heat transfer, connecting the semiconductor refrigeration element (cold surface) and the working surface.
  • a heat transfer element made of a heat conductive material such as (not limited to) a metal material such as (not limited to) a copper tube or a copper plate, etc.
  • the heat transfer structural member can also be other heat transfer components such as a heat pipe (heat pipe) or a vapor chamber (VC, vapor
  • the cold conductor (first cold conductor) 15 can be designed to be adapted according to the shape of the semiconductor refrigeration element 10, especially according to the shape of the cold surface 13, and the shape of the working surface 113, with the principle of rapid heat dissipation.
  • the working surface 113 can be made of transparent crystal or other light-transmitting materials.
  • the working surface 113 may also be annular, with a central through hole for light transmission, and in this case, no material limitation is imposed.
  • Heat pipes or vapor chambers use the principle of heat conduction and the rapid heat transfer properties of the refrigerant medium to quickly transfer the heat of the heating object to the outside of the heat source through the heat pipe. Heat is transferred by evaporation and condensation of the liquid in the fully enclosed vacuum tube or vacuum chamber, and the fluid principles such as capillary action are used to achieve a cooling effect. It has a series of advantages such as high thermal conductivity, excellent isothermal properties, variability of heat flux density, and reversibility of heat flow direction.
  • the heat exchanger composed of heat pipes or vapor chambers has the advantages of high heat transfer efficiency, compact structure, and low fluid resistance.
  • the cold surface 13 of the refrigeration element 10 and the working surface 113 quickly transfer the heat on the working surface 113 or the ambient heat of the working surface to the refrigeration element 10 (cold surface 13) through the cold conducting element 15, i.e., the heat pipe, to dissipate heat, and quickly transfer the heat to the refrigeration element.
  • the end of the cold conducting element (heat pipe) 15 in contact with the working surface 113 can be designed to be annular, in close contact with the periphery of the working surface, so as to quickly absorb the heat of the working surface 113 or the ambient heat of the working surface 113; according to the shape of the refrigeration element 10 or the cold surface 13, the end of the cold conducting element (heat pipe) 15 in contact with the refrigeration element 10 can be designed to extend a predetermined length from the annular bend to be placed on the cold surface 13 of the refrigeration element and in close contact with the cold surface 13.
  • the heat generated by the hot surface 11' of the semiconductor refrigeration element 10 is discharged outside the fuselage through the ventilation channel in the fuselage.
  • the semiconductor refrigeration element 10 enhances the heat dissipation effect through a heat dissipation component.
  • the heat dissipation component includes a VC temperature averaging plate 11 and a heat sink 16 arranged on the VC temperature averaging plate 11.
  • the hot surface 11' of the semiconductor refrigeration element is arranged on the outer wall of the VC temperature averaging plate 11, or the VC temperature averaging plate 11 directly serves as the hot surface of the semiconductor refrigeration element.
  • the VC temperature averaging plate 11 is used to dissipate heat from the refrigeration element 10.
  • the VC temperature plate 11 is located in the ventilation channel of the fuselage; the refrigeration element 10 is arranged on the VC temperature plate 11, and the hot surface 11' of the semiconductor refrigeration element is fitted on the outer wall of the VC temperature plate, so that the heat of the hot surface is directly transferred to the VC temperature plate 11; or, the hot surface 11' of the semiconductor refrigeration element is installed on the outer wall of the VC temperature plate through a heat conductive element, and the heat of the hot surface 11' is quickly transferred to the VC temperature plate 11 through the heat conductive element; or, the hot end circuit of the semiconductor refrigeration element is arranged on the VC temperature plate 11, and is welded and electrically connected to the PN galvanic particles of the electric double layer 12.
  • the VC temperature plate 11 is a closed flat cavity formed by a bottom plate, a frame and a cover plate, and a capillary structure is arranged in the cavity and a working fluid is contained.
  • an extended platform is formed at one end of the VC temperature plate 11 for setting or installing the semiconductor refrigeration element 10, and the area of the VC temperature plate 11 is larger than the electric double layer 12 and the cold surface 13, so that the hot surface 11' of the semiconductor refrigeration element has an extended VC temperature plate 11, thereby increasing the heat dissipation area.
  • the heat dissipation assembly also includes a heat sink 16 disposed on the VC temperature averaging plate 11 to increase the VC heat dissipation area.
  • the heat sink 16 can be disposed on the upper surface, the lower surface, or both surfaces of the VC temperature averaging plate 11 according to the heat dissipation requirements of the product.
  • the VC temperature averaging plate 11 is located behind the vent of the body; the heat sink on the VC temperature averaging plate 11 faces the vent 111 of the body.
  • the heat sink 16 is one or more groups of fins of heat-conducting material, and the position, quantity, and arrangement of the heat sink can be set according to the internal space of the beauty instrument.
  • the heat sink 16 is a group of parallel straight heat sink fins arranged in a matrix; or, the VC temperature equalizer 11 is a fan frame, and the heat sink 16 is a group of curved heat sink fins on the inner wall of the spiral fan frame (Figure 15 (a)), and the air duct is consistent with the spiral direction of the fan frame; or, the heat sink 16 is a group of heat sink fins arranged in a circular matrix, and the heat sink fins can be arranged along a straight line radiation direction, or the heat sink fins can be arranged at a certain angle to form a rotation direction (Figure 15 (b)).
  • the refrigeration module 1 of the present invention also includes a fan 18, which is located in the ventilation channel of the fuselage and is used to enhance the heat dissipation (cooling) efficiency.
  • the fan 18 includes a fan housing 180 and an impeller 181 installed in the internal cavity of the housing.
  • the fan housing 180 is provided with a plurality of openings as a plurality of vents 182 of the fan 18; the plurality of vents 182 of the fan 18 are used for air inlet and outlet, and are connected with the internal cavity of the fan housing 180 to form a ventilation channel of the fan 18, and are connected with the ventilation channel in the fuselage.
  • the VC temperature averaging plate 11 can be a part of the fan housing 180 or installed on the fan housing 180.
  • the VC temperature averaging plate 11 and the heat sink 16 are cooled by the ventilation channel of the fan 18, and the fan promotes gas flow to improve heat dissipation efficiency.
  • the VC temperature equalizing plate 11 can be set as a part of the fan 18 housing.
  • the fan 18 housing includes an upper shell, a lower shell 184 and a surrounding frame 183 in the middle. Heat dissipation teeth can be set on the inner wall of the surrounding frame 183 to increase the heat dissipation area of the VC temperature equalizing plate 11.
  • the VC temperature equalizing plate 11 is covered on the top (or bottom) of the annular surrounding frame as the upper shell (or lower shell) of the fan housing; the VC temperature equalizing plate 11 can be set as an annular flat plate, and the central through hole of the annular flat plate forms a ventilation port of the fan 18; the heat sink 16 is set as a group of parallel heat dissipation fins covering the central through hole, and the ventilation ducts between the heat dissipation fins are connected to the central through hole of the VC temperature equalizing plate 11 and the internal cavity of the fan housing.
  • the difference from the structure shown in FIG. 12-14 is that the heat dissipation fins are arranged on the annular edge of the central through hole of the VC temperature plate 1, and are arranged radially or rotated at a certain angle to arrange a circle.
  • the VC temperature averaging plate 11 is used as a surrounding frame outside the fan blade, the heat sink 16 can be arranged on the inner wall of the surrounding frame, and the semiconductor cooling element 10 is arranged on the outer wall of the surrounding frame.
  • the cooling module of the present invention is also used for heat dissipation of the light source assembly 2.
  • the light source assembly 2 includes a lamp tube 20, a reflective cup 21 outside the lamp tube, and electrode sheets 23 at both ends of the lamp tube.
  • the lamp tube 20 is preferably an IPL lamp tube that generates IPL photons, or a halogen lamp, or other suitable light sources.
  • the ventilation duct of the light source assembly 2 is connected to the ventilation duct of the fan 18, and is connected to the ventilation channel in the fuselage to form a heat dissipation ventilation duct of the light source assembly 2, and the fan 18 promotes the heat dissipation of the light source assembly 2.
  • a heat conductive member 22 may be provided on one side of the reflective cup, for example (but not limited to) the heat conductive member 22 is a group of heat conductive sheets (made of heat conductive material), one end of the heat conductive member is connected to the outer wall of the reflective cup, and the other end extends to the vent 182 of the fan 18.
  • a plurality of vents 182 are formed on the casing of the fan 18, specifically on the ribs outside the fan blades.
  • vents 182 are provided on the ribs, one of which (the first) is provided with a heat-conducting member of the reflective cup, and the ventilation duct of the fan 18 is connected with the ventilation duct in the fuselage to form a first ventilation duct 101 (refer to the arrow line in FIG4 ), which is used to dissipate heat for the heat-conducting member 22 of the reflective cup and the VC temperature averaging plate 11.
  • the external air or cold wind is discharged from the casing vents (including but not limited to a group of honeycomb holes and the gaps of the casing) directly facing the heat sink 16.
  • the impeller makes the air flow circulate in the internal cavity of the fan and flow through the heat conducting member 22 of the reflective cup and the VC temperature averaging plate 11, taking away the heat of the reflective cup 21 and the VC temperature averaging plate 11, and discharges the fan from another (second) vent 182 on the fan rib, and discharges from the outside of the fuselage through the ventilation channel in the fuselage from the ventilation port 111 at the end of the fuselage (including but not limited to a group of honeycomb holes and the gap of the shell) to achieve heat dissipation of the heat conducting member 22 of the reflective cup and the VC temperature averaging plate 11.
  • Another (third) vent 182 on the fan rib is connected to the air duct inside the lamp tube, and the ventilation duct of the fan 18 is connected to the ventilation duct in the fuselage to form a second ventilation duct 102 for heat dissipation of the reflective cup 21 and the lamp tube 20.
  • external air or cold wind enters from the housing vent 111 opposite to the heat sink 16, passes through the heat sink 16 and the VC temperature equalizing plate 11, and enters the fan 18 from the central through hole of the temperature equalizing plate 11.
  • the impeller causes part of the air to pass through another vent 182 on the fan frame to exit the fan and enter the reflective cup 21, taking away the heat of the lamp tube 20 and the reflective cup inside the reflector lamp and exiting the lamp tube, and passing through the ventilation channel in the fuselage and being discharged to the outside of the fuselage from the vent 111 at the end of the fuselage, further promoting the heat dissipation of the lamp tube 20 and the reflective cup 21.
  • vents 111 on the body shell of the beauty instrument can be set at different positions and different hole structures.
  • vents are set on the lower shell and the side of the body respectively.
  • the vents on the side serve as outlets of the first ventilation duct 101 and the second ventilation duct 102, and the ventilation duct in the body is connected to the vents 111 on the side.
  • the beauty instrument 100 of the present invention uses the cooling module 1 of each of the above embodiments to cool the working surface 113 of the head of the body, and the fan of the cooling module 1 can also be used as the heat dissipation of the light source assembly 2.
  • the photon beauty instrument can be a hair removal instrument, a photon skin rejuvenation instrument, an import and export beauty instrument, a radio frequency beauty instrument, etc., and the cooling module of the above embodiments can be used.
  • the beauty instrument 100 shown in FIG1-7 is described by taking a straight-type complete machine as an example, and can be used as an IPL photon hair removal device.
  • an embodiment of the present invention relates to a beauty instrument 100, including a housing 110 provided with a plurality of vents 111.
  • the housing 110 includes an upper housing 112 and a lower housing 118, which are interlocked with each other to form a cavity inside the housing.
  • An upper bracket 114 and a lower bracket 115 are also provided in the housing to cooperate with the upper housing 112 and the lower housing 118 respectively, and a lamp holder bracket 24 is provided inside the front end of the housing to install a refrigeration module 1, a light source assembly 2, a power supply assembly 3 and a control circuit board 4.
  • vents 111 can be arranged at different or the same positions of the housing 110 in different hole structures.
  • the vents 110 shown in the figure are arranged on the lower shell 118 or the side or end of the housing.
  • the cavity inside the fuselage forms a ventilation channel.
  • the cold wind or air from the environment enters the interior of the fuselage from the vents, takes away the heat inside the fuselage, and is discharged from the fuselage through the vents 111 at the same or different positions.
  • vents 111 of the fuselage are used for air inlet and outlet and form a ventilation channel with the space inside the fuselage (such as the line shown by the arrows in Figures 4-6) to achieve heat dissipation inside the fuselage.
  • the front end of the fuselage is a working surface 113, which can directly contact the skin.
  • the light generated by the light source assembly 2 is transmitted to the working surface 113 and then emitted to perform beauty treatment on the skin.
  • the light source assembly 2 is mounted on the front end of the fuselage through a lamp holder bracket 24.
  • a light outlet channel and a light outlet window are formed in the lamp holder bracket 24 for transmitting the light generated by the light source assembly.
  • the working surface 113 is mounted on the light outlet window.
  • the lamp tube 20 is mounted on the rear of the lamp holder bracket by a reflective cup 21, located behind the light outlet channel.
  • a filter 25 is provided in the light outlet direction of the light source assembly.
  • the heat conducting member 22 of the reflective cup extends backward to the vent of the fan.
  • a ventilation duct can be provided on the lamp holder bracket 24 as needed, which is connected to the ventilation duct inside the reflective cup for air cooling and heat dissipation.
  • the front end of the upper bracket 114 and the lower bracket 115 inside the fuselage is buckled to form a fan accommodating chamber, corresponding to which the refrigeration module 1 is installed.
  • the front end of the lower bracket 115 forms a window, which is directly opposite to a vent 111 formed on the lower shell 118 and is connected.
  • the heat sink 16 on the VC temperature averaging board 11 is located at the window and directly opposite to the vent 111 on the lower shell 118.
  • the semiconductor refrigeration component 10 is set on the platform extending from the front end of the VC temperature averaging board 11.
  • the cold conducting component, that is, the heat transfer element (heat pipe) 15 is supported by the lamp holder bracket.
  • the front end (ring-shaped) can be quickly contacted and connected with the working surface 113 by heat conduction, and the rear end (parallel straight pipe end) covers the cold surface of the semiconductor refrigeration component, which can quickly conduct heat transfer and close contact.
  • the fan is installed in the fan accommodating chamber, and the front end vent 182 of the perimeter frame corresponds to the heat conducting component 22 of the reflective cup, and the rear end vent is connected to the ventilation channel formed by buckling the upper and lower brackets.
  • the ventilation channel of the fan refers to the air inlet and air outlet markings shown in Figure 8.
  • the rear section where the upper bracket 114 and the lower bracket 115 are buckled together inside the body forms a power component accommodating chamber.
  • the power component 3 is generally a battery, such as a rechargeable battery or a capacitor battery.
  • the power component also includes a charging seat 31, which is used to connect an external power source to charge the battery, or directly power the beauty instrument.
  • the charging seat 31 is electrically connected to the control circuit board 4, installed on the housing, and can be connected to a cable.
  • the interior where the upper bracket 114 and the lower bracket 115 are fastened together also defines a ventilation duct 101/102.
  • the ventilation duct 101/102 is connected to the ventilation duct of the fan, to the ventilation duct in the reflective cup, and to the ventilation port (inlet and outlet) of the casing, forming a ventilation duct inside the fuselage.
  • the upper bracket 114 and the upper shell 112 are buckled together to form a cavity, and the control circuit board 4 is installed, and the control circuit board 4 is protected by the upper bracket 114 and the upper shell 112.
  • the housing is also equipped with a switch button 117 electrically connected to the control circuit board 4 and a corresponding switch circuit board 116 inside, which is used for power on and off control.
  • the refrigeration module 1 of the above embodiment is applied to an L-shaped beauty instrument, and the function and structure are the same or similar to the straight-plate model of Figures 1-7. Only the overall shape of the fuselage is matched, and the size, shape and position of the housing, bracket, power supply assembly 3, light source assembly 2, refrigeration module 1 and control circuit board 4 are adaptively set.
  • the L-shaped beauty instrument includes a handle 120 and a lamp head 130.
  • the lamp head 130 is rotatably connected to the top of the handle 120 through the knob 150, the knob seat 140 and the rotating pressure plate 151 at the top of the handle.
  • the rotating connection structure of the lamp head 130 and the handle and the structure of the handle can adopt the structure of the prior art.
  • the tail of the handle is a DC line 31', and a handle bracket 160 is arranged inside, and the power supply assembly 3 is installed.
  • the cavity on one side of the top of the handle bracket 160 is connected to the inside of the lamp head 130, and the lamp head housing is rotatably installed.
  • the lamp holder housing includes a front shell 131 and a front shell cover 132.
  • the lamp holder 130 is rotatably connected through the front shell cover 132, the knob 150, the knob seat 140, and the rotating pressure plate 151.
  • the lamp holder inner bracket 133 is installed on the front shell cover 132 and cooperates with the front shell 131.
  • the refrigeration module 1 is installed on one side and the control circuit board 4 is installed on the other side.
  • the front end of the lamp holder 130 is a working surface 113, which can be: a transparent crystal working surface, or an annular working surface, or an annular semiconductor refrigeration component, or a semiconductor refrigeration component with a transparent crystal cold surface, all of which are structures of the prior art.
  • the front end of the lamp holder 130 is provided with a lamp holder bracket 24, which is similar to the structure of the embodiment of Figures 1-7, and the light source assembly 2 is installed.
  • a heat pipe and a heat sink assembly 26 are provided on one side of the heat conducting member 22 of the reflective cup of the light source assembly 2, extending to the vent 182 of the fan 18, and a vent is provided on the front shell 131 to face the heat sink assembly 26.
  • the refrigeration module 1 is used to cool the working surface 113 and dissipate heat for the light source assembly 2 at the same time.
  • the present invention arranges a semiconductor refrigeration element 10 on a VC temperature averaging plate 11, and a cooling element, i.e., a heat transfer element (heat pipe) 15, connects the cold surface 13 of the refrigeration element to the working surface 113 of the beauty instrument to quickly conduct the cold, thereby forming a cold compress effect or a cooling effect on the working surface.
  • a heat sink 16 is arranged on the VC temperature averaging plate 11 to increase the heat dissipation area.
  • the VC temperature averaging plate 11 is combined with a fan, and the phase change effect of evaporation and condensation of the VC temperature averaging plate is utilized, and is used for the upper shell or lower shell or perimeter bone of the fan, thereby greatly improving the heat dissipation efficiency and speed when the fan rotates; adding a heat sink on the upper surface of the VC can increase the heat dissipation area of the VC, effectively increasing the contact area between the air and the heat sink when the air is sucked in, and adding a heat sink made of heat conductive material on the lower surface (inner wall of the perimeter bone) of the upper shell of the VC fan can greatly increase the contact area between the air and the heat sink, thereby achieving a better heat dissipation effect.
  • Heat sinks can be arranged on the upper surface, lower surface, or both sides of the VC temperature averaging plate according to the heat dissipation requirements of the product.
  • the second embodiment of the refrigeration module 1 of the present invention is mainly used for cooling the working surface 113 (refer to the previous embodiment) of the beauty instrument to achieve a cold compress effect on the skin.
  • the refrigeration module 1 includes a semiconductor refrigeration element 10, and the semiconductor refrigeration element 10 (refer to the previous embodiment) includes an electric double layer 12 in the middle and a hot surface 11' and a cold surface 13 at both ends.
  • the refrigeration element 10 (specifically the cold surface 13) can be directly used as the working surface 113, or used to cool the working surface 113.
  • those skilled in the art can set an adaptive shape as needed, such as a transparent crystal or a ring.
  • the cooling member 15 is a heat transfer structural member that can quickly transfer the heat of the working surface to the semiconductor refrigeration member to achieve the effect of cooling the working surface.
  • the heat transfer structural member can be a heat-conducting material such as (not limited to) metal materials such as (not limited to) copper/aluminum tubes or copper/aluminum plates, etc.
  • heat pipe heat pipe
  • VC heat pipe or temperature tube
  • super heat pipe or super heat plate other components that realize heat transfer.
  • the heat pipe (heat pipe) or temperature tube (vapor chamber) uses the principle of heat conduction and the rapid heat transfer properties of the refrigeration medium to quickly transfer the heat of the heating object to the outside of the heat source through the heat pipe.
  • the super heat pipe or super heat plate is preferably an aluminum super heat pipe/aluminum super heat plate.
  • Al superconducting heat pipes/aluminum superconducting heat plates can form microgrooves or micro-teeth or microporous channels on the surface of superconducting heat pipes or superconducting heat plates through aluminum material processing and forming processes as capillary structures inside superconducting tubes or superconducting plates. Copper powder may not be added to the inside of the aluminum superconducting tube (plate), and aluminum powder or aluminum silicon powder, etc. may be poured in.
  • the cooling member 15 connects the semiconductor refrigeration member (cold surface) and the working surface, and can be designed with a suitable shape based on the shape of the semiconductor refrigeration member 10, especially the shape of the cold surface 13, and the shape of the working surface 113, with the principle of rapid heat dissipation.
  • the cooling member 15 is a copper tube or ALVC aluminum superconducting tube (plate) or heat pipe or VC.
  • the end of the cooling member 15 in contact with the working surface 113 can be designed to be annular, in direct and close contact with the periphery of the working surface, so as to quickly absorb the heat of the working surface 113 or the surrounding environment of the working surface 113; or, a cooling member (second cooling member) 15' is further provided between the working surface 113 and the cooling member 15 for contact heat transfer.
  • the cooling member 15' is a copper tube or an ALVC superconducting tube (plate) or a heat pipe or VC, which can be set in an annular shape, and is fitted with the periphery of the working surface 113 and the annular end of the cooling member 15 to quickly transfer heat.
  • the end of the cooling member 15 in contact with the refrigeration element 10 can be designed to extend a predetermined length from the annular bend and be placed on the cold surface 13 of the refrigeration element and be in close contact with the cold surface 13.
  • the heat generated by the hot surface 11' of the semiconductor refrigeration element 10 is discharged outside the body through the ventilation channel in the body.
  • the semiconductor refrigeration element 10 enhances the heat dissipation effect through the heat dissipation component.
  • the heat dissipation component includes a heat conduction structure 19 and a heat sink 16, which is located in the ventilation channel of the beauty instrument body and is used to quickly dissipate the heat from the hot surface 11' of the semiconductor refrigeration element 10.
  • the heat conduction structure 19 includes a heat conduction plate 190 and a plurality of aluminum VC/ALVC superconducting tubes 191, each of which is a single tube.
  • the hot surface 11' of the semiconductor refrigeration element is arranged on the outer wall of the heat conduction plate 190, or the heat conduction plate 190 directly serves as the hot surface 11' of the semiconductor refrigeration element 10.
  • the semiconductor refrigeration element 10 is arranged on one side of the outer wall of the heat conduction plate 190, and a plurality of slots 192 are arranged on the other side.
  • the plurality of slots 192 are adapted to the plurality of aluminum VC/ALVC superconducting tubes 191, and the aluminum VC/ALVC superconducting tubes 191 are accommodated in the slots 192.
  • the heat conducting plate slot 192 is connected to the aluminum VC/ALVC superconducting tube 191, for example by riveting/welding, so as to increase the contact area between the two to achieve rapid heat transfer.
  • the aluminum VC/ALVC superconducting tube 191 forms microgrooves or microteeth or micropores on the inner wall surface of the aluminum VC/ALVC superconducting tube through an aluminum material processing and forming process, and forms a capillary effect inside the aluminum VC/ALVC superconducting tube.
  • a single channel 1910 is formed inside the tube, and more than two fine bone-shaped microgrooves 1911 are formed on the inner wall of the tube.
  • a large number of microporous structures 1912 can also be formed inside the tube wall of the aluminum VC/ALVC superconducting tube.
  • each aluminum VC/ALVC superconducting tube is a single channel 1910, which has the advantages of being able to realize plane bending or special-shaped 3D bending, being able to change the shape according to the change of the spatial form of the product, and being able to realize the longitudinal staggered combination of multiple aluminum VC/ALVC superconducting tubes to overcome the influence of the gravity direction.
  • FIG. 1910 has the advantages of being able to realize plane bending or special-shaped 3D bending, being able to change the shape according to the change of the spatial form of the product, and being able to realize the longitudinal staggered combination of multiple aluminum VC/ALVC superconducting tubes to overcome the influence of the gravity direction.
  • the aluminum VC/ALVC superconducting tube 191 is bent into an L shape, and correspondingly, the slot 192 on the heat conducting plate 190 is also L-shaped, and the aluminum VC/ALVC superconducting tube 191 is just embedded in the slot 192, forming an L-shaped heat conducting structure 19 as a whole, one end of the L shape is placed on the hot surface 11' of the semiconductor refrigeration element 10 for close contact and rapid heat transfer, and the other end of the L shape is installed in the heat sink 16. The heat generated by the hot surface 11' of the semiconductor refrigeration element 10 is quickly transferred to the heat sink 16 by the heat conducting structure 19 for heat dissipation.
  • the refrigeration element 10 is arranged on one side of the heat conducting plate 190, and the hot surface 11' of the semiconductor refrigeration element is fitted and installed on the outer wall of the heat conducting plate 190, so that the heat of the hot surface is directly transferred to the heat conducting plate 190; or, the hot surface 11' of the semiconductor refrigeration element is installed on the outer wall of the heat conducting plate 190 through the heat conducting element, and the heat of the hot surface 11' is quickly transferred to the heat conducting plate 190 through the heat conducting element; or, the heat conducting plate 190 is provided with a hot end circuit of the semiconductor refrigeration element, which is welded and electrically connected to the PN electric couple particles of the electric couple layer 12.
  • the heat conducting plate 190 is a heat conducting element made of a heat conducting material such as (not limited to) a metal material such as (not limited to) copper/aluminum or other heat conducting materials such as silicone grease/silicon wafer/elastic or soft heat conducting materials.
  • a heat conducting material such as (not limited to) a metal material such as (not limited to) copper/aluminum or other heat conducting materials such as silicone grease/silicon wafer/elastic or soft heat conducting materials.
  • the heat conducting plate 190 is made of a heat conducting material such as a copper/aluminum plate.
  • the heat sink 16 is arranged on the heat conducting plate 190 to increase the heat dissipation area.
  • the heat sink 16 is located behind the vent of the beauty instrument body; facing the vent 111 of the body (combined with Figure 16, Figure 27-28).
  • the heat sink 16 is one or more groups of heat conducting material fins, and the position, quantity and arrangement of the heat sink can be set according to the internal space of the beauty instrument.
  • One or more groups of heat dissipation fins are formed into a heat sink 16 of an integral structure by integral molding or by welding or riveting or by other fastening mechanisms; or, one or more groups of heat conducting material fins are arranged on the heat conducting plate to form a heat sink 16 of an integral structure.
  • a groove 161 is formed on the top surface of the heat sink 16, and one end of the heat conducting structure 19 is inserted into the groove 161, and rapid heat transfer can be achieved by riveting/welding to increase the contact area between the two.
  • the heat-conducting structure 19 may also be directly placed on the heat sink 16 , or the heat-conducting structure 19 may be connected to one side of the heat-conducting plate of the heat sink 16 (refer to FIG. 28 ).
  • the third embodiment of the refrigeration module 1 is mainly used for refrigerating the working surface 113 (refer to the above embodiment) of the beauty instrument to achieve a cold compress effect on the skin.
  • the refrigeration module 1 includes a semiconductor refrigeration element 10, a first cooling element 15, a second cooling element 15', a heat sink 16 and a heat conduction structure 19.
  • the structures of the first cooling element 15, the second cooling element 15' and the heat sink 16 are the same or similar to those of the second embodiment of the refrigeration module 1, and the above embodiment is directly cited.
  • the heat conduction structure 19 includes a heat conduction plate 190 and a plurality of aluminum VC/ALVC superconducting tubes 191, each aluminum VC/ALVC superconducting tube 191 is a single tube, preferably a single channel in the tube.
  • the hot surface 11' of the semiconductor refrigeration element is arranged on the outer wall of the heat conduction plate 190, or the heat conduction plate 190 directly serves as the hot surface 11' of the semiconductor refrigeration element 10.
  • a semiconductor refrigeration element 10 is arranged on one side of the outer wall of the heat conducting plate 190, and a plurality of slots 192 are arranged on the other side.
  • the plurality of slots 192 are adapted to a plurality of aluminum VC/ALVC superconducting tubes 191, and the aluminum VC/ALVC superconducting tubes 191 are accommodated in the slots 192.
  • the slots 192 of the heat conducting plate are connected to the aluminum VC/ALVC superconducting tubes 191, such as by riveting/welding, so as to increase the contact area between the two to achieve rapid heat transfer.
  • the heat conducting plate 190 includes a circular (not limited to a circular) area and a platform extending from one side, and the semiconductor refrigeration element 10 is arranged on the platform.
  • a plurality of slots 190 are arranged extending from the center of the circle to the circumference of the circle, and are evenly arranged in the circular area.
  • An aluminum VC/ALVC superconducting tube 191 is placed in each slot 190, and the slots 190 and the aluminum VC/ALVC superconducting tube 191 can be set with a certain curvature or arc.
  • multiple aluminum VC/ALVC superconducting tubes 191 are arranged radially along the radius or approximately along the radius direction to overcome the influence of the gravity direction.
  • multiple aluminum VC/ALVC superconducting tubes 191 can be arranged in a staggered combination in the longitudinal mode to overcome the influence of the gravity direction.
  • the heat conducting plate slot 190 is connected to the aluminum VC/ALVC superconducting tube 191, and the contact area between the two can be increased by riveting/welding to accelerate heat transfer.
  • the aluminum VC/ALVC superconducting tube 191 preferably adopts a single channel, and micro grooves, micro teeth or micro holes are formed on the inner wall surface of the aluminum VC/ALVC superconducting tube through aluminum material processing and forming technology. Coolant is encapsulated inside, and aluminum powder or aluminum silicon powder can be poured in, and aluminum mesh can also be added.
  • the refrigeration element 10 is arranged on a platform on one side of the heat conducting plate 190, and the hot surface 11' of the semiconductor refrigeration element is fitted on the outer wall of the heat conducting plate 190, so that the heat of the hot surface is directly transferred to the heat conducting plate 190; or, the hot surface 11' of the semiconductor refrigeration element is installed on the outer wall of the heat conducting plate 190 through the heat conducting element, and the heat of the hot surface 11' is quickly transferred to the heat conducting plate 190 through the heat conducting element; or, the heat conducting plate 190 is provided with a hot end circuit of the semiconductor refrigeration element, which is welded and electrically connected to the PN galvanic particles of the galvanic layer 12.
  • the heat conducting plate 190 is made of a heat conducting material such as a copper/aluminum plate.
  • the heat sink 16 is disposed on the heat conducting plate 190 to increase the heat dissipation area.
  • the circular area of the heat conducting structure 19 can be directly disposed on the top of the heat sink 16, or fixed to the top of the heat sink 16 by welding or riveting to quickly transfer heat.
  • the platform on one side of the heat conducting plate 190 extends out of the heat sink 16, and the semiconductor refrigeration element 10 is disposed on the platform.
  • the refrigeration module 1 of the third embodiment is applied to a beauty instrument, for example, to a beauty instrument of the shape shown in FIG16-19 , and other structural parts of the beauty instrument are the same or similar to those in the embodiment shown in FIG16-19 , and are directly cited.
  • the heat-conducting structure 19 is arranged on the vent at the top of the fan 18 , specifically, the circular area of the heat-conducting plate 190 is covered on the opening at the top of the fan, and the aluminum VC/ALVC superconducting tube 191 is installed on the heat-conducting plate toward the fan, and the heat sink 16 is located at the vent 111 on the outside facing the side of the front shell 131 , and the heat-conducting structure 19 , the fan 18 , and the heat sink 16 are all located in the ventilation channel in the fuselage, and the respective ventilation channels are connected, and the cold air is input from the vent 111 of the fuselage, and the heat is taken away in the ventilation channel in the fuselage and discharged to the outside of the fuselage through another vent 111 .
  • a semiconductor refrigeration component 10 is arranged on a platform on one side of the heat conduction plate 190, and a cooling component (copper/ALVC/heat pipe/VC) 15 (and a second cooling component 15') connects the cold surface of the refrigeration component 10 to the working surface 113 of the beauty instrument for rapid cooling, thereby forming a cold compress effect or a cooling effect on the working surface.
  • a cooling component copper/ALVC/heat pipe/VC
  • the beauty instrument of the embodiment shown in FIG28 uses the refrigeration module 1 of the third embodiment to cool the working surface 113 of the beauty instrument.
  • the other structural parts of the beauty instrument are the same or similar to those of the embodiments shown in FIGS. 16-19 and are directly cited.
  • the heat-conducting structure 19 is L-shaped, and one end of the heat sink 16 is mounted on the vent at the top of the fan 18.
  • the aluminum VC/ALVC superconducting tube 191 is mounted on the heat-conducting plate 190 and faces the fan inwardly.
  • the other end of the heat-conducting plate 190 is provided with a semiconductor refrigeration element 10, which is located outside the vent at the top of the fan 18.
  • the heat sink 16 is located outside the vent 111 facing the side of the front shell 131.
  • the heat-conducting structure 19, the fan 18, and the heat sink 16 are all located in the ventilation channel in the fuselage, and their respective ventilation channels are connected. Cold air is input from the vent 111 of the fuselage, and after taking away the heat in the ventilation channel in the fuselage, it is discharged to the outside of the fuselage through another vent 111.
  • a semiconductor refrigeration element 10 is arranged on a platform on one side of the heat conducting plate 190, and the cold surface of the refrigeration element 10 is connected to the working surface 113 of the beauty instrument by the cold conducting element (copper/ALVC/heat pipe/VC) 15 (and the cold conducting element 15') to quickly conduct cold, so as to form a cold compress effect or a cooling effect on the working surface.
  • the heat pipe and the heat sink assembly 26 arranged on one side of the heat conducting element 22 of the reflective cup of the light source assembly 2 can be omitted.
  • the groove 161 ( Figure 22) provided on the heat sink 16 is used to install one end of the heat conducting plate 190, and at the same time, a ventilation channel is formed, which is connected to the air duct between the adjacent fins of the heat sink 16 and the air duct of the fan, and is connected to the reflective cup of the light source assembly 2 and the ventilation channel inside it.
  • the heat conducting element 22 of the reflective cup of the light source assembly 2 is located at the vent of the fan 18 or in the ventilation channel in the fuselage, so as to realize air cooling and heat dissipation of the reflective cup 21 and the lamp tube 20.
  • the refrigeration module 1 is used to cool the working surface 113, and at the same time, the heat dissipation of the light source assembly 2 is realized.
  • the heat-conducting structure 19 of the above-mentioned embodiment of the present invention uses a plurality of aluminum superconducting plates or aluminum superconducting tubes 191 in combination with a heat-conducting plate (copper plate) 190, which can effectively solve the problem of the gravity direction of the product.
  • the pipeline can be set in two or more different directions/angles in the XY plane or the XYZ three-dimensional square. It is well known that heat and steam flow from the bottom to the top. In this way, when the beauty instrument is used from the bottom to the top, the gravity effect of the heat-conducting structure will be more obvious.
  • the present invention is designed to be arranged horizontally and vertically relative to each other (or in the form of intersecting lines with a certain angle, or in a ring ( Figures 24-26) staggered and circular design to better solve the heat dissipation problem.
  • the heat-conducting structure 19 significantly improves the heat dissipation efficiency.
  • the fourth embodiment of the refrigeration module 1 of the present invention adopts a two-stage refrigeration method, which is mainly used for cooling the working surface of the photon beauty instrument and internal heat dissipation to improve the refrigeration efficiency.
  • the specific implementation method is: a primary refrigeration component is set at the skin contact end, that is, the working surface, to act on the skin refrigeration, and the heat of the primary refrigeration component 10' is absorbed by the evaporation end of the cold conductive component (heat pipe/temperature averaging plate/(aluminum) super heat conductive pipe/(aluminum) super heat conductive plate) 15 and enters the internal channel of the heat pipe/temperature averaging plate/(aluminum) super heat conductive pipe/(aluminum) super heat conductive plate to transfer the heat to the condensation end, and a secondary refrigeration component 10 is set at the condensation end to actively cool the condensation end.
  • the temperature of the condensation end at this time depends on the power of the secondary refrigeration component 10. Since the temperature of the condensation end is much lower than the temperature of the ambient wind, the condensation speed and timeliness of the condensation end are greatly improved, so that the internal phase change cycle of the cold conducting component (heat pipe/VC/(aluminum) super heat conducting pipe or (aluminum) super heat conducting plate) 15 is accelerated to achieve the beneficial effect of improving the front-end refrigeration; the heat dissipation surface (hot surface) 13 of the secondary refrigeration component 10 is close to the fan air inlet or outlet, and the heat dissipation of the secondary refrigeration component 10 can be directly taken away by the fan using copper/aluminum heat conducting sheet, or the heat on the heat dissipation surface 13 of the secondary refrigeration component can be conducted to the fan housing through heat pipe/temperature averaging plate/(aluminum) super heat conducting pipe/(aluminum) super heat conducting plate, and the heat is taken away by the fan through the heat dissipation fin 16 set on the wall
  • the present embodiment ( Figures 29-30) is provided with a secondary refrigeration, which is equivalent to using the refrigeration component 10 of the refrigeration module 1 shown in Figures 8-15 as a secondary refrigeration component for refrigeration of the primary refrigeration component 10' connected to the cold end.
  • Two-stage refrigeration is adopted, which is mainly used for cooling the working surface 113 of the beauty instrument to achieve a cold compress effect on the skin.
  • the primary refrigeration component 10' is connected to the working surface 113 or directly serves as the working surface 113
  • the secondary refrigeration component 10 is connected to the heat dissipation fan assembly or is directly arranged on the fan housing.
  • the primary refrigeration component and the secondary refrigeration component preferably refer to semiconductor refrigeration components.
  • the semiconductor refrigeration component 10/10' includes a middle electric double layer 12 and a hot surface 11' and a cold surface 13 at both ends.
  • the middle electric double layer 12 is PN electric double particles arranged according to the hot end circuit set on the hot surface and the cold end circuit set on the cold surface and electrically connected to form the internal circuit of the semiconductor refrigeration component, which is electrically connected to the control circuit board 4 by the positive and negative poles or controlled by a separate circuit to control the operation of the semiconductor refrigeration component.
  • the primary refrigeration element 10' (specifically the cold surface 13) can be directly used as the working surface 113, or used to cool the working surface 113.
  • the primary refrigeration element 10' is directly used as the working surface, those skilled in the art can set an appropriate shape as needed, for example, a whole piece of transparent crystal is used as the cold surface 13 directly as the working surface 113, and the hot surface 11' and the electric double layer 12 are provided with a light-transmitting window, so that the primary refrigeration element 10' has light transmittance; for example, the cold surface 13, the hot surface 11' and the electric double layer 12 are set in a ring shape or jointly form a light-transmitting window, and the material is not limited at this time.
  • the primary refrigeration element 10' When the primary refrigeration element 10' is connected to the working surface 113 for cooling, its cold surface 13 is in contact with the working surface 113, for example, it is set at the periphery of the working surface, or the cold surface 13 of the primary refrigeration element 10' and the working surface 113 are in contact with the working surface 113 through a heat transfer element (or a heat conductive element).
  • a cooling member (first cooling member) 15 is provided to be connected between the primary semiconductor cooling member 10' (specifically its hot surface 11') and the secondary semiconductor cooling member 10 (specifically its cold surface 13) in a fast cooling manner; the heat of the primary semiconductor cooling member 10' can be quickly transferred to the secondary semiconductor cooling member 10, so as to achieve the effect of cooling the working surface.
  • the cooling member 15 is a heat transfer structural member, which can be a heat transfer material such as (not limited to) a heat transfer element made of a metal material such as a copper tube or a copper plate or other heat transfer structures, etc.; preferably a heat pipe (heat pipe) or a vapor chamber or an (aluminum) super heat pipe or (aluminum) super heat plate.
  • the cooling member 15 can be designed to be adapted according to the shape of the primary semiconductor cooling member 10' and the secondary semiconductor cooling member 10, based on the principle of fast heat dissipation.
  • the primary semiconductor cooling member 10' is directly used as the working surface 113, it has light transmittance or is provided with a light transmittance window.
  • the end of the cooling element (heat pipe) 15 in contact with the working surface 113 can be designed to be annular, in close contact with the periphery of the hot surface 11’ of the first-stage semiconductor refrigeration element 10’, so as to quickly absorb the heat of the first-stage semiconductor refrigeration element 10’ or the environment surrounding the first-stage semiconductor refrigeration element 10’; the end of the cooling element (heat pipe) 15 in contact with the second-stage refrigeration element 10 can be designed to extend a predetermined length from the annular bend and be placed on the cold surface 13 of the second-stage refrigeration element 10 and in close contact with the cold surface 13.
  • the secondary semiconductor refrigeration component 10 enhances the heat dissipation effect through the heat dissipation component.
  • the heat dissipation component includes a heat-conducting shell 11 formed by heat pipes or (aluminum) super heat-conducting pipes or (aluminum) super heat-conducting plates or temperature-averaging plates in a single piece or in a multi-piece manner, and a heat sink 16 arranged on the heat-conducting shell 11.
  • the heat surface 11' of the secondary semiconductor refrigeration component is arranged on the outer wall of the heat-conducting shell 11, or the heat-conducting shell 11 directly serves as the heat surface of the semiconductor refrigeration component.
  • the heat-conducting shell 11 is used to dissipate heat for the secondary refrigeration component 10.
  • the heat-conducting shell 11 When applied to a beauty instrument, the heat-conducting shell 11 is located in the ventilation channel of the body; the secondary refrigeration component 10 is arranged on the heat-conducting shell 11, and the hot surface 11' of the secondary semiconductor refrigeration component is fitted on the outer wall of the heat-conducting shell 11, so that the heat of the hot surface is directly transferred to the heat-conducting shell 11; or, the hot surface 11' of the secondary semiconductor refrigeration component 10 is installed on the outer wall of the (heat pipe/temperature averaging plate/(aluminum) super heat-conducting pipe/(aluminum) super heat-conducting plate) heat-conducting shell 11 through the heat-conducting component, and the heat of the hot surface 11' is quickly transferred to the (heat pipe/temperature averaging plate/(aluminum) super heat-conducting pipe/(aluminum) super heat-conducting plate) heat-conducting shell 11 through the heat-conducting component; or, the hot end circuit of
  • a temperature averaging plate/(aluminum) super heat conductive plate is used as a whole single piece or multiple pieces are spliced to form a heat conductive housing 11, which is a closed flat cavity formed by a bottom plate, a frame and a cover plate, and a capillary structure is provided in the cavity and contains a working fluid.
  • a heat conductive housing 11 is a closed flat cavity formed by a bottom plate, a frame and a cover plate, and a capillary structure is provided in the cavity and contains a working fluid.
  • an extension platform is formed at one end of the heat conductive housing 11 for setting or installing the secondary semiconductor refrigeration component 10, and the area of the heat conductive housing 11 is larger than the electric double layer 12 and the cold surface 13, so that the heat dissipation area of the hot surface 11' of the secondary semiconductor refrigeration component 10 is increased.
  • the heat sink 16 is provided on the heat-conducting housing 11 to increase the heat dissipation area.
  • the heat sink 16 can be provided on the upper surface or the lower surface or both surfaces of the heat-conducting housing 11 according to the heat dissipation requirements of the product.
  • the heat-conducting housing 11 is located behind the vent of the beauty instrument body, and the heat sink 16 is directly opposite to the vent 111 of the body.
  • the heat sink 16 is one or more groups of heat-conducting material fins.
  • the heat dissipation assembly of the secondary refrigeration element 10 also includes a fan 18, which is located in the ventilation channel of the beauty instrument body to enhance the heat dissipation (cooling) efficiency.
  • a fan 18 which is located in the ventilation channel of the beauty instrument body to enhance the heat dissipation (cooling) efficiency.
  • the configuration of the heat dissipation fan 180, the secondary refrigeration element 10, the (heat pipe/temperature averaging plate/(aluminum) super heat pipe/(aluminum) super heat conductive plate) heat conductive shell 11 and the heat sink 16 is directly quoted in this embodiment with reference to the embodiments shown in Figures 10-15 and the above description, without further description.
  • the fan 18 includes a fan housing 180 and an impeller 181 installed in the internal cavity of the housing.
  • the fan housing 180 is provided with a plurality of openings as a plurality of vents 182 of the fan 18; the plurality of vents 182 of the fan 18 are used for air inlet and outlet, and are connected to the internal cavity of the fan housing 180 to form a ventilation channel of the fan 18, and are connected to the ventilation channel in the body.
  • the (heat pipe/temperature averaging plate/(aluminum) super heat conductive pipe/(aluminum) super heat conductive plate) heat conductive shell 11 can be a part of the fan housing 180 or installed on the fan housing 180.
  • the two-stage refrigeration module 1 of this embodiment is applied to the refrigeration and heat dissipation of the photon beauty instrument 100.
  • the heat dissipation component of the two-stage refrigeration module 1 is also used for heat dissipation of the light source component 2.
  • the light source component 2 includes a lamp tube 20 and a reflective cup 21 outside the lamp tube.
  • the lamp tube 20 is an IPL lamp tube that generates IPL photons or a halogen lamp or other applicable light sources.
  • the ventilation duct of the light source component 2 is connected to the ventilation duct of the fan 18 and to the ventilation duct in the fuselage to form a heat dissipation ventilation duct of the light source component 2, and the fan 18 promotes the heat dissipation of the light source component 2.
  • a heat conductive member 22 may be provided on one side of the reflective cup, for example (but not limited to) the heat conductive member 22 is a group of heat conductive sheets (made of heat conductive material), one end of the heat conductive member is connected to the outer wall of the reflective cup, and the other end extends to the vent 182 of the fan 18.
  • a plurality of vents 182 are formed on the casing of the fan 18, specifically on the ribs outside the fan blades.
  • three vents 182 are provided on the ribs, one of which (the first) is provided with a heat-conducting part of the reflective cup, and the ventilation duct of the fan 18 is connected with the ventilation duct in the fuselage to form a first ventilation duct 101 (refer to the arrow line in FIG4 ), which is used to dissipate heat for the heat-conducting part 22 of the reflective cup and the (heat pipe/temperature averaging plate/(aluminum) super heat-conducting pipe/(aluminum) super heat-conducting plate) heat-conducting housing 11.
  • the external air or cold wind is discharged from the casing vents (including but not limited to a group of honeycomb holes and the gaps in the casing) directly facing the heat sink 16.
  • 111 enters, passes through the heat sink 16 and the (heat pipe/heat averaging plate/(aluminum) super heat pipe/(aluminum) super heat pipe) heat conductive shell 11, and enters the fan 18 from the central through hole of the (heat pipe/heat averaging plate/(aluminum) super heat pipe/(aluminum) super heat pipe) heat conductive shell 11.
  • the impeller causes the airflow to circulate in the inner cavity of the fan and flow through the heat conductive part 22 of the reflective cup and the (heat pipe/heat averaging plate/(aluminum) super heat pipe/(aluminum) super heat pipe) heat conductive shell 11, taking away the heat of the reflective cup 21 and the (heat pipe/heat averaging plate/(aluminum) super heat pipe/(aluminum) super heat pipe) heat conductive shell 11, and then discharges the fan from another (second) vent 182 on the fan frame, and passes through the ventilation channel in the fuselage from the vent at the end of the fuselage (including but not limited to a group of honeycomb holes and the gap of the shell) 111 is discharged outside the fuselage, realizing heat dissipation of the heat conducting member 22 of the reflective cup and the (heat pipe/temperature averaging plate/(aluminum) super heat conducting pipe/(aluminum) super heat conducting plate) heat conducting housing 11.
  • Another (third) vent 182 on the fan rib is connected to the air duct inside the lamp tube, and the air duct of the fan 18 is connected to the air duct inside the fuselage to form a second air duct 102 for heat dissipation of the reflective cup 21 and the lamp tube 20.
  • the external air or cold wind enters from the housing vent 111 directly facing the heat sink 16, passes through the heat sink 16 and the (heat pipe/heat averaging plate/(aluminum) super heat pipe/(aluminum) super heat averaging plate) heat conductive housing 11, and enters the fan 18 from the central through hole of the heat averaging plate 11.
  • the impeller causes part of the airflow to pass through another vent 182 on the fan rib to exit the fan and enter the interior of the reflector cup 21, taking away the heat of the lamp tube 20 and the reflector cup inside the reflector lamp and exiting the lamp tube, and through the ventilation channel in the fuselage, it is discharged from the vent 111 at the end of the fuselage to the outside of the fuselage, further promoting the heat dissipation of the lamp tube 20 and the reflector cup 21.
  • the heat dissipation component and heat dissipation principle are the same as those of the embodiment shown in Figures 1-14.
  • the beauty instrument 100 of the present invention is the same as the embodiment shown in Figures 1-14, and the working surface 113 is formed by the transparent crystal cold surface of the primary refrigeration component 10'.
  • Photon beauty can be a hair removal instrument, a photon skin rejuvenation instrument, an import and export beauty instrument, a photon radio frequency beauty instrument, etc., and the refrigeration module of the above embodiment can be used.
  • the photon beauty instrument is provided with a primary refrigeration component 10 at the end in contact with the skin, that is, the working surface, to act on the skin refrigeration.
  • the heat of the primary refrigeration component 10' (specifically its hot surface 11') is absorbed by the evaporation end of the refrigeration component (heat pipe/temperature averaging plate/(aluminum) super heat pipe/(aluminum) super heat conductive plate) 15 and enters the internal channel to transfer the heat to the condensation end.
  • the condensation end is provided with a secondary refrigeration component 10 to actively cool the condensation end. The temperature of the condensation end at this time depends on the power of the secondary refrigeration component 10.
  • the condensation speed and timeliness of the condensation end are greatly improved, thereby accelerating the internal phase change cycle of the cooling element (heat pipe/temperature averaging plate/(aluminum) super heat pipe/(aluminum) super heat conductive plate) to achieve the beneficial effect of improving the front-end refrigeration;
  • the heat dissipation surface 11' of the secondary refrigeration element 10 is close to the fan air inlet or outlet, and the heat dissipation of the secondary refrigeration element can be directly carried away by the fan using the copper/aluminum heat conductive sheet 16, or the heat on the heat dissipation surface 11' of the secondary refrigeration element 10 can be conducted to the fan housing through the heat pipe/temperature averaging plate/(aluminum) super heat conductive pipe/(aluminum) super heat conductive plate, and the heat is carried away by the fan through the heat sink 16 arranged on the fan housing wall.
  • the beauty instrument 100 of the embodiment shown in Figures 31-32 is the same as the beauty instrument of the embodiment shown in Figures 1-7 in other structures.
  • the description of the corresponding embodiment is directly quoted in this embodiment and will not be repeated here.
  • Condensation belongs to passive heat dissipation, and the heat dissipation effect of the condensation end depends on the ambient temperature of the wind sucked by the fan; if the timeliness and speed of condensation are deteriorated, the effect of the internal circulation of the heat pipe will be deteriorated.
  • this embodiment adopts a two-stage refrigeration module 1, and the cooling element 15 transfers the first-level refrigeration element 10' to the second-level refrigeration element 10, which effectively solves the above problems of only using the first-level refrigeration element 10'.
  • the secondary refrigeration element 10 uses the heat dissipation component of the refrigeration module of the embodiment shown in Figures 20-26 to quickly dissipate heat, that is, the primary refrigeration element 10' (specifically its hot surface 11') is connected to the secondary refrigeration element 10 (specifically its cold surface 13) through a fast heat transfer between the cold conducting element 15 (15') to quickly conduct cold.
  • the heat generated by the hot surface 11' of the secondary semiconductor refrigeration element 10 is quickly dissipated by the heat conducting structure 19 and the heat sink 16.
  • the heat conducting structure 19 includes a heat conducting plate 190 and a plurality of aluminum VC/ALVC superconducting tubes 191, each of which is a single tube.
  • the hot surface 11' of the secondary semiconductor refrigeration element 10 is arranged on the outer wall of the heat conducting plate 190, or the heat conducting plate 190 directly serves as the hot surface 11' of the secondary semiconductor refrigeration element 10.
  • a secondary semiconductor refrigeration element 10 is disposed on one side of the outer wall of the heat conducting plate 190, and a plurality of slots 192 are disposed on the other side.
  • the plurality of slots 192 are adapted to a plurality of aluminum VC/ALVC superconducting tubes 191, and the aluminum VC/ALVC superconducting tubes 191 are accommodated in the slots 192.
  • the heat conducting plate slots 192 are connected to the aluminum VC/ALVC superconducting tubes 191, such as by riveting/welding, to increase the contact area between the two to achieve rapid heat transfer.
  • the heat dissipation assembly also includes a heat dissipation fan assembly, and the heat dissipation fan can be implemented by the structures of the above-mentioned embodiments or a common fan.
  • the heat dissipation fan module 200 includes a fan housing 210 and an impeller 220.
  • the interior of the fan housing 210 is a cavity, and the impeller 220 is installed in the cavity; a plurality of vents 201 are provided on the fan housing 210, and the vents 201 connect the cavity with the external air path of the fan, and at least part of the housing of the fan housing 210 is composed of a heat pipe or a super heat-conducting pipe or a super heat-conducting plate or VC 211.
  • the fan housing 210 includes a side elevation housing, and the top and bottom can be selectively provided with an upper shell and a bottom shell according to specific product needs.
  • the upper shell and the bottom shell can also be formed by the upper fins or the lower fins of the heat sink described below, and are not provided separately.
  • the side elevation housing can be a volute or a partial housing of a volute outside the impeller's rotating circumference.
  • the super heat conducting pipe is an aluminum superconducting pipe
  • the super heat conducting plate is an aluminum superconducting plate.
  • the through channel 2110 inside the aluminum superconducting pipe or aluminum superconducting plate is a single channel or multiple channels; the single channel or multiple channels are porous microgrooves; the channel 2110 and the porous microgrooves 2111 on its inner wall are interconnected; the single channel or multiple channels are sealed at both ends, and a working fluid is encapsulated inside.
  • the fan housing includes a volute outside the impeller, and the volute encloses a cavity inside the fan; the top of the volute can be provided with an upper shell or a vent 201 is formed at the top, and the bottom is a bottom shell or a vent 201 is formed; the vents at the top can also be a plurality of through holes provided on the upper shell, and the vents at the bottom can also be a plurality of through holes provided on the bottom shell.
  • the volute, the upper shell, or the bottom shell is partially or completely composed of a heat pipe, a super heat pipe, a super heat plate, or a VC 211.
  • the heat pipe, the super heat pipe, the super heat plate, or the VC 211 is a single piece or a plurality of pieces are spliced together.
  • the heat dissipation fan module 200 includes a heat sink 212, and the heat sink 212 is connected to the heat pipe or super heat pipe or super heat plate or VC 211 for rapid heat transfer.
  • the heat sink 212 is located in the cavity of the fan housing.
  • the heat sink 212 includes one or more groups of heat-conducting material fins; the air duct between adjacent fins, that is, the air duct of the heat sink, is connected to the vent of the fan and the cavity.
  • the side elevation of the fan housing i.e., the volute
  • the side elevation of the fan housing is provided with a heat pipe or a super heat-conducting pipe or a super heat-conducting plate or VC 211; the heat sink 212 is provided on the inner wall of the side elevation, and is spaced a predetermined distance from the impeller 220, so as not to affect the rotation of the impeller 220.
  • the side elevation of the volute is formed of a heat-conducting outer shell of a single-channel or multi-channel aluminum superconducting tube or aluminum superconducting plate; the heat sink 212 is provided on the inner wall of the heat-conducting outer shell.
  • the fins are provided along the radial circumference of the impeller rotation center; the air duct between adjacent fins is consistent with the airflow direction generated by the rotation of the impeller.
  • the inner wall of the single channel or multi-channel 2110 of the aluminum superconducting tube or aluminum superconducting plate is formed with two or more fine bone-shaped microgrooves 2111; the groove direction of the microgrooves 2111 is along the radial circumference of the impeller rotation center, which is consistent with the airflow direction generated by the rotation of the impeller.
  • a porous structure is formed inside the wall material of the microgrooves 2111.
  • the channel 2110, the microgrooves 2111 and the porous structure inside the material are formed in one step by an aluminum extrusion molding process.
  • the heat dissipation fan module 200 of the present invention includes a secondary semiconductor refrigeration component 10, and the heat dissipation surface (hot surface) of the secondary semiconductor refrigeration component 10 is connected to the heat pipe or super heat pipe or super heat plate or VC 211 by rapid heat conduction.
  • the heat dissipation surface of the secondary semiconductor refrigeration component 10 and the heat pipe or super heat pipe or super heat plate or VC 211 are mutually attached to contact and transfer heat, or are mutually attached to contact and transfer heat through the heat plate, or the heat dissipation surface of the secondary semiconductor refrigeration component 10 and the heat pipe or super heat pipe or super heat plate or VC 211 are respectively arranged at different parts of the fan housing, and are rapidly heat-conducted to each other.
  • the cooling fan module 200 includes a driving control circuit board 240 and a driving module 250.
  • the driving control circuit board 240 is electrically connected to the driving module 250.
  • the driving control circuit board 240 and the driving module 250 are electrically connected to an external power source through a power line or a power module.
  • the driving module 250 is used to drive the impeller 220 to rotate.
  • the electrodes of the secondary semiconductor refrigeration element 10 are electrically connected to the driving control circuit board 240 or to an external circuit board.
  • the drive control circuit board 240 is arranged outside the fan housing to achieve waterproofing; the vent 201 is provided with a sealing ring for waterproofing; the drive module 250 is arranged on the drive control circuit board 240 and installed on the outside of the fan bottom shell 214; since the drive control circuit board 240 and the drive module 250 are respectively arranged inside and outside the fan bottom shell 214, the drive control circuit board 240 and the drive module 250 are not affected when water is sucked into or enters the fan.
  • the drive module 250 includes a motor, and the motor output shaft is connected to the impeller shaft to drive the impeller 220 to rotate; or, the drive module 250 includes a motor stator coil, and a magnetic ring 25 is arranged inside the impeller, and the magnetic ring 25 is fixedly connected to the impeller 220.
  • the drive module 250 is powered on, a magnetic field is generated, and the rotation of the magnetic ring 25 drives the fan impeller to rotate.
  • the cooling fan module 200 is a radial flow fan or an axial flow fan; in a radial flow fan, the airflow generated by the rotation of the impeller 220 circulates along the radial circle of the impeller's rotation center and can be exhausted from the vents on the volute; in an axial flow fan, the airflow generated by the rotation of the impeller 220 is exhausted from the vents at the top or bottom of the volute along the direction of the central axis.
  • the ventilation port 201 of the fan is provided with a heat sink 212, and the air duct of the heat sink connects the cavity of the fan and the external environment.
  • the heat pipe or vapor chamber (VC) in the present invention uses the heat conduction principle and the rapid heat transfer property of the refrigerant medium to quickly transfer the heat of the heat-generating object to the outside of the heat source through the heat pipe.
  • Heat is transferred by evaporation and condensation of the liquid in the fully enclosed vacuum tube or vacuum chamber, and the fluid principle such as capillary action is used to achieve the cooling effect. It has a series of advantages such as high thermal conductivity, excellent isothermal property, heat flux density variability, and heat flow direction reversibility.
  • the heat exchanger composed of a heat pipe or vapor chamber has the advantages of high heat transfer efficiency, compact structure, and low fluid resistance.
  • the super heat-conducting pipe or super heat-conducting plate in the present invention is preferably an aluminum super heat-conducting pipe/aluminum super heat-conducting plate.
  • (Aluminum) super heat-conducting pipe or (aluminum) super heat-conducting plate, or ALVC super heat-conducting pipe (plate) uses evaporative refrigeration and gas-liquid phase change to quickly conduct heat.
  • aluminum super heat-conducting pipes/aluminum super heat-conducting plates can form micro grooves or micro teeth or microporous channels on the surface of super heat-conducting pipes or super heat-conducting plates through aluminum processing and forming (extrusion forming) technology as capillary structures inside super heat-conducting pipes or super heat-conducting plates.
  • Copper powder may not be added to the aluminum super heat-conducting pipe (plate), that is, ALVC aluminum super heat-conducting pipe (plate), but aluminum powder or aluminum silicon powder may be poured in, and aluminum mesh may be added, and refrigerant may be poured in and then sealed.
  • the heat dissipation fan module 200 of the first embodiment of the present invention is a blower module, including a fan housing 210 with a cavity formed inside, an impeller 220 installed in the cavity, and a secondary semiconductor refrigeration component 10 installed on the fan housing.
  • the fan housing 210 includes a volute on the side elevation, the volute cover is arranged outside the impeller 220, the volute is a heat-conducting outer shell, and a heat sink 212 is arranged on the inner wall of the volute.
  • the volute as a whole is composed of a heat pipe or a super heat-conducting pipe or a super heat-conducting plate or VC 211. This embodiment is described by taking the volute as an aluminum superconducting pipe or an aluminum superconducting plate as an example.
  • vents 201 which connect the cavity with the external air path of the fan.
  • air can be taken in through the top vent, and after entering the cavity, the impeller 220 urges the air flow to circulate and take away the heat on the surface of the heat sink 212, and finally discharged through the vents on the side elevation.
  • a plurality of vents 201 can also be formed on the bottom of the fan housing 210, i.e., the bottom shell 214, to assist in air intake.
  • the fan of this embodiment is a radial flow, and air is taken in through the top and bottom vents on the impeller or fan shaft, and air is discharged through the vents on the side elevation.
  • the air intake and air outlet can also be interchangeable, and the air intake and air outlet are not limited.
  • the fan housing 210 includes a side volute and a bottom shell, and the top is open as a vent.
  • the side volute is formed by a single heat pipe or super heat pipe or super heat plate or VC 211 (as shown in Figures 35-37 and 39) to form an integral heat-conducting outer shell, or by multiple heat pipes or super heat pipes or super heat plates or VC 211 ( Figure 38) to form a heat-conducting outer shell.
  • the heat pipe or super heat pipe or super heat plate or VC 211 is in close contact with the inner heat sink 212 for heat conduction.
  • the heat pipe or super heat pipe or super heat plate or VC 211 and the heat sink 212 can be connected by welding, riveting, bonding or other methods to quickly transfer heat.
  • the side elevation volute uses an aluminum superconducting tube or an aluminum superconducting plate 11, which can be a single piece or multiple pieces spliced together to form a heat-conducting shell.
  • the through channel 2110 along the length direction inside each aluminum superconducting tube or aluminum superconducting plate 11 is a single channel or multiple channels, each channel is sealed at both ends, and the working fluid is filled inside.
  • the inner wall of each channel 2110 forms a plurality of fine bone-shaped microgrooves 2111, and the microgrooves 2111 are connected with the flow channel of the channel 2110 where the working fluid is located, so as to allow the working fluid to circulate.
  • a porous structure is formed inside the material.
  • the porous and microgrooves 2111 form a capillary effect in the channel 2110. Copper powder may not be added to the channel 2110, and aluminum powder or aluminum silicon powder may be filled in, and an aluminum mesh may be added, and the refrigerant may be filled in and then sealed.
  • the porous, microgrooves 2111 and the channel 2110 can be simultaneously manufactured when forming a tubular shape through an aluminum material processing (extrusion) molding process, and form a capillary structure inside the aluminum superconducting tube or aluminum superconducting plate 11.
  • the groove direction of the micro groove 2111 and the length direction of the channel 2110 can be in the direction of impeller rotation (as shown in Figures 36-39), or can be set vertically along the axial direction, as shown in Figure 40.
  • the heat sink 212 is a group or multiple groups of heat-conducting material fins, and the position, quantity and arrangement of the heat sink can be set according to the fan cavity space.
  • One or more groups of heat sink fins are formed into a heat sink 212 of an integral structure by integral molding or by welding or riveting or by other fastening mechanisms; or, one or more groups of heat-conducting material fins (such as aluminum/copper/graphene or other heat-conducting fins) are arranged on the heat-conducting plate to form a heat sink 212 of an integral structure.
  • the shape of the heat sink 212 is compatible with the shape of the volute or heat pipe or super heat-conducting pipe or super heat-conducting plate or VC 211.
  • the heat sink 212 is cylindrical or annular as a whole, and is sleeved on the inner wall of the heat-conducting outer shell formed by the annular heat pipe or super heat-conducting pipe or super heat-conducting plate or VC 211, and is directly fitted or mutually fitted through heat-conducting parts to express heat transfer.
  • the vents on the side elevation can be formed by the air duct between the fins of the heat sink 212 passing through the outside and the inside of the cavity.
  • the heat sink 212 can be fixed to the inner wall of the heat-conducting shell formed by the heat pipe or super heat pipe or super heat plate or VC 211 outside the vents through a heat conductive plate or a fixing member; or at the vents on the side elevation, the fins and the heat pipe or super heat pipe or super heat plate or VC 211 are disconnected to form a channel connecting the fan cavity and the outside.
  • the uppermost heat sink is used as the upper shell of the fan to form an air duct with the fan bottom shell and the impeller assembly.
  • the upper shell of the fan may not be set separately, and the top is open to form a vent.
  • the secondary semiconductor refrigeration component 10 includes an electric double layer in the middle and a hot surface (heat dissipation surface) and a cold surface at both ends.
  • the hot surface of the secondary semiconductor refrigeration component is connected to the heat pipe or super heat pipe or super heat conductive plate or VC 211 by rapid heat conduction.
  • the heat dissipation surface of the secondary semiconductor refrigeration component 10 and the heat pipe or super heat pipe or super heat conductive plate or VC 211 are mutually attached to contact and transfer heat or mutually attached to contact and transfer heat through the heat conductive plate, or the outer wall of the heat pipe or super heat pipe or super heat conductive plate or VC 211 is directly used as the hot surface of the secondary semiconductor refrigeration component, on which a hot end circuit is set, welded with the electric double layer and electrically connected to form the internal circuit of the secondary semiconductor refrigeration component.
  • the hot surface of the secondary semiconductor refrigeration component 10 is attached to the outer wall of the heat pipe or super heat conductive pipe or super heat conductive plate or VC 211.
  • the impeller 220, the drive control circuit board 240 and the drive module 250 are installed on the fan bottom shell 214.
  • the drive module 250 adopts a motor, and the output shaft of the motor is axially connected to the central axis 221 of the impeller. The forward and reverse rotation of the motor drives the impeller to rotate.
  • the secondary semiconductor refrigeration element 10 is arranged on the outer wall of the fan bottom shell 214, for example, the secondary semiconductor refrigeration element 10 is attached to the bottom shell 214 and arranged in contact.
  • the fan bottom shell 214 is a heat-conducting element, which can be made of a heat-conducting material such as a metal plate or a heat pipe or a VC or a superconducting plate.
  • the fan bottom shell 214 is connected to the heat pipe or super heat pipe or super heat plate or VC 211 on the side surface for rapid heat transfer.
  • the heat dissipation fan module 200 of the second embodiment of the present invention is an axial flow fan module, including a fan housing 210 with a cavity formed inside, an impeller 220 installed in the cavity, and a secondary semiconductor refrigeration component 10 installed on the fan housing.
  • the fan housing 210 includes a volute on the side elevation, and the volute as a whole is composed of a heat pipe or a super heat conductive pipe or a super heat conductive plate or VC 211.
  • the side elevation of the fan housing i.e., the volute
  • a heat pipe or a super heat conductive pipe or a super heat conductive plate or VC 211 is provided with a heat pipe or a super heat conductive pipe or a super heat conductive plate or VC 211; more preferably, the side elevation of the volute is composed of a single-channel or multi-channel aluminum superconducting tube or aluminum superconducting plate to form a heat conductive outer shell.
  • the heat sink 212 is arranged on the inner wall of the side elevation, and the fins of the heat sink 212 are arranged in a ring along the diameter direction, and the air ducts between the fins are connected in the axial direction.
  • a circle of fins is set above the impeller 220 to form a top heat sink 212, and a circle of fins is set below to form a bottom heat sink 212.
  • the air ducts of the upper and lower heat sinks are preferably aligned and form vents at the top and bottom of the fan respectively, which are used for air inlet and outlet.
  • the impeller 220 rotates to inhale air from the air duct (air inlet vent) of the top heat sink and discharge it axially downward along the air duct (air outlet vent) of the bottom heat sink 212, and the air inlet and outlet directions can be reversed.
  • the heat dissipation fan module 200 of the second embodiment is the same as the first embodiment.
  • the side elevation shell i.e., the volute
  • the side elevation shell is composed of a heat pipe or a super heat pipe or a super heat conductive plate or VC 211 as a whole single piece or a multi-piece splicing to form a heat conductive shell.
  • the heat sink on the inner wall can be connected by welding, riveting, bonding or other fixing methods to quickly transfer heat.
  • the vertical volute is composed of a single-channel or multi-channel aluminum superconducting tube or aluminum superconducting plate to form a heat conductive shell.
  • the inner wall of the single channel or multi-channel 2110 of the aluminum superconducting tube or aluminum superconducting plate forms more than two fine bone-shaped microgrooves 2111; multiple micropores are formed in the wall material of the microgrooves 2111.
  • the groove direction of the channel 2110 and the porous microgrooves 2111 is set along the axial direction of the impeller rotation center, which is consistent with the airflow direction generated by the rotation of the impeller.
  • the secondary semiconductor refrigeration component 10 is arranged on the outer wall of the side elevation heat-conducting housing, and its heat dissipation surface (hot surface) is quickly connected to the heat pipe or super heat-conducting pipe or super heat-conducting plate or VC 211 on the side elevation by heat conduction, or the heat pipe or super heat-conducting pipe or super heat-conducting plate or VC 211 directly serves as the heat dissipation surface (hot surface) of the secondary semiconductor refrigeration component 10, and its outer wall is provided with a hot end circuit, which is electrically connected to the semiconductor electric double layer and welded.
  • the impeller 220 is rotatably mounted by a fixed bracket 223 and a clamping ring 222 arranged in the cavity.
  • the fixed bracket 223 is provided with a central axis of the impeller, which is inserted into the central axis hole of the impeller 220 and is clamped and fixed at the top by the clamping ring 222.
  • a driving control circuit board 240 and a driving module 250 are arranged outside the bottom of the volute.
  • the driving module 250 adopts a motor, the output shaft of the motor is axially connected to the central axis 221 of the impeller, and the forward and reverse rotation of the motor drives the impeller to rotate.
  • the heat dissipation fan module 200 of the present invention uses heat pipes/VC/(aluminum) super heat pipes/(aluminum) super heat conductive plates as the shell of the fan (which can be a side facade, an upper cover, a bottom cover, or a volute), and uses its phase change heat conduction characteristics to quickly transfer the heat source to the fan cavity, and dissipate heat through the air flow generated when the fan impeller rotates.
  • the present invention effectively utilizes the internal space of the fan to make the product smaller and more efficient in heat dissipation; it is more effectively combined with the application product to reduce the original shell material cost of the fan.
  • the contact area between the heat sink and the air flow is increased. Under the condition of equal heat dissipation requirements, the present invention improves the heat dissipation efficiency and thus reduces the fan speed, current, noise, etc.
  • heat dissipation fan module 200 of the present invention Another technical feature of the heat dissipation fan module 200 of the present invention is that when the application product uses semiconductor refrigeration, the heat dissipation surface of the refrigeration component can directly fit (contact) with the fan shell (i.e., heat conduction component: heat pipe/VC/(aluminum) super heat conduction pipe/(aluminum) super heat conduction plate), effectively shortening the heat transfer distance and accelerating the heat transfer, making the application product more effective.
  • heat conduction component heat pipe/VC/(aluminum) super heat conduction pipe/(aluminum) super heat conduction plate
  • the heat dissipation fan module 200 of the third embodiment of the present invention can be used as a waterproof fan, preferably a magnetic fan module, including a fan housing 210 with a cavity formed inside, an impeller 220 installed in the cavity, and a secondary semiconductor refrigeration component 10 installed on the fan housing.
  • the fan housing 210 includes a volute on the side elevation, an upper shell 215 on the top of the volute, and a bottom shell 214 on the bottom, which together enclose a cavity inside the fan.
  • the arc portion of the volute is composed of a heat pipe or a super heat-conducting pipe or a super heat-conducting plate or VC 211; more preferably, the side elevation of the volute, that is, the volute, includes an arc-shaped heat-conducting outer shell composed of a single-channel or multi-channel aluminum superconducting tube or aluminum superconducting plate.
  • the heat sink 212 is arranged on the inner wall of the arc-shaped heat-conducting outer shell of the side elevation, and the fins of the heat sink 212 are arranged in an arc shape along the diameter direction, and the air ducts between the fins are connected along the radial arc direction.
  • the fan vent 201 is arranged on the side elevation volute for air inlet and outlet.
  • the upper and lower shells are not provided with vents to facilitate waterproofing.
  • the third embodiment of the heat dissipation fan module 200 is similar to the first and second embodiments.
  • the arc-shaped heat-conducting outer shell of the side vertical volute is composed of a heat pipe or a super heat-conducting pipe or a super heat-conducting plate or VC 211.
  • the heat-conducting outer shell is formed by a whole single piece or by splicing multiple pieces.
  • the heat sink on the inner wall can be connected by welding, riveting, bonding or other fixing methods to quickly transfer heat.
  • the vertical volute is composed of a single-channel or multi-channel aluminum superconducting tube or aluminum superconducting plate to form an arc-shaped heat-conducting outer shell.
  • the inner wall of the single-channel or multi-channel 2110 of the aluminum superconducting tube or aluminum superconducting plate forms more than two fine bone-shaped microgrooves 2111; multiple micropores are formed in the wall material of the microgrooves 2111.
  • the groove direction of the channel 2110 and the porous microgrooves 2111 is set along the radial arc direction of the impeller rotation center, which is consistent with the airflow direction generated by the rotation of the impeller.
  • the secondary semiconductor refrigeration component 10 is arranged on the outer wall of the side-face heat-conducting outer shell, and its heat dissipation surface (hot surface) is connected to the heat pipe or super heat-conducting pipe or super heat-conducting plate or VC 211 of the side-face by rapid heat conduction, or the heat pipe or super heat-conducting pipe or super heat-conducting plate or VC 211 directly serves as the heat dissipation surface (hot surface) of the secondary semiconductor refrigeration component 10, and its outer wall is provided with a hot end circuit, which is electrically connected and welded to the semiconductor electric double layer.
  • the secondary semiconductor refrigeration component 10 is arranged on the upper shell 215 or the bottom shell 214, and the upper shell 215 or the bottom shell 214 is connected to the arc-shaped heat-conducting outer shell by rapid heat transfer.
  • the hot surface of the secondary semiconductor refrigeration component is arranged on the fan housing in a close contact manner.
  • the impeller 220 is located in the cavity and installed on the bottom shell 214.
  • An axial hole is set in the center of the impeller 220.
  • a shaft sleeve 229 is fixed in the shaft hole.
  • a convex ring is formed on the inner wall of the shaft sleeve 229.
  • the upper bearing 228 and the lower bearing 226 are installed in the shaft sleeve 229 and are respectively located above and below the convex ring.
  • a magnetic ring is sleeved inside the impeller 220. Specifically, an annular cavity is formed outside the shaft sleeve 229 in the impeller. The magnetic ring is sleeved on the inner wall of the outer ring of the annular cavity inside the impeller and is fixed to the impeller 220.
  • the bottom shell 214 is provided with the central axis 221 of the impeller, and a hollow annular boss is formed on the bottom shell.
  • the central axis is installed in the center of the boss, and the bottom of the central axis 221 is elastically clamped by a spring 227.
  • the central axis 221 is inserted into the inner sleeve of the central axis hole of the impeller 220, and cooperates with the bearing and the convex ring.
  • the top of the central axis 221 is formed with a clamping groove, which is clamped by a clamping ring 222 to prevent it from falling off.
  • the top of the hollow annular boss on the bottom shell 214 is adaptively inserted into the annular cavity inside the impeller 220, and the drive module 250 is installed in the hollow cavity defined by the hollow annular boss formed on the bottom shell 214, and the drive control circuit board 240 is located outside the bottom shell 214.
  • a drive control circuit board 240 and a drive module 250 are arranged outside the bottom of the volute.
  • the drive module 250 includes a motor stator coil 251. When the drive module is powered on, a magnetic field is generated, thereby driving the fan impeller 220 to rotate.
  • the drive module 250 and the drive control circuit board 240 are respectively arranged on the inner and outer sides of the fan bottom shell 214, the drive module 250 and the drive control circuit board 240 are not affected when water is sucked into or enters the fan.
  • the drive module 250 and the drive control circuit board 240 are separated from the fan assembly, and the drive control circuit board 240 is arranged outside the fan housing 210, which can achieve waterproofing.
  • the drive control circuit board 240 When the wind passes through the air duct, the water will not affect the drive control circuit board 240.
  • a sealing ring can be arranged at the vent of this embodiment, so that waterproofing between the product and the fan module 200 can be achieved.
  • cooling conduction and “heat conduction”, “heat transfer” or “heat transfer” can be interpreted as having the same meaning, all of which refer to heat transfer, and can be used interchangeably.
  • the symbol “/” means “or”.
  • the terms “installed”, “connected”, “connected”, “fixed” and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection, an electrical connection, or a connection capable of transmitting data; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two components or the interaction relationship between two components.
  • installed installed
  • “connected”, “connected”, “fixed” and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection, an electrical connection, or a connection capable of transmitting data; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two components or the interaction relationship between two components.

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Abstract

一种两级制冷模组（1）以及光子美容仪（100），其中两级制冷模组（1）包括一级半导体制冷件（10'）和二级半导体制件（10）以及导冷件（15）；一级和二级半导体制冷件（10'/10）均包括中间的电偶层(12)以及两端的热面（11'）和冷面（13）；导冷件（15）以快速导冷的方式连接于一级半导体制冷件（10'）和二级半导体制冷件（10）之间；导冷件（15）为热传递结构件。光子美容仪（100）采用该两级制冷模组（1），一级半导体制冷片（10'）直接作为光子美容仪（100）前端工作面或者给光子美容仪（100）前端工作面制冷。采用两级制冷模组（1），可解决一级半导体制冷件（10'）通过热传递结构件散热时导热效率不均、导热慢、导热的时效性差使制冷速度降低、热量传导至散热片时存在散热片前后端或左右端或上下端的热量不均衡问题，影响风扇散热的效果等问题。

Description

一种两级制冷模组以及光子美容仪 技术领域
本发明涉及美容设备领域，尤其是一种两级制冷模组以及光子美容仪。
 背景技术
利用脉冲光或激光或卤素灯或其他光源或者射频实现美容功能的美容仪，光源组件产生光波，自美容仪的工作头部的出光窗口射出，以对工作头部端面接触（或非直接接触）的皮肤表面进行美容处理，例如脱毛、嫩肤、去斑、消炎、软件血管、去皱、皮肤去红、治疗痤疮、治疗血管性病变、治疗色素性病变或者单独或结合射频理疗等功能。当前市面上一些便携式或手持式的美容仪，都存在机身内部散热效果不佳，影响美容仪工作，达不到预期的美容效果；机身内部结构复杂，工作面制冷效果不佳，或者工作面温度过高导致灼烧皮肤，用户体验欠佳。
 技术问题
本发明所要解决的技术问题是：提供一种两级制冷模组以及光子美容仪，解决现有美容仪散热及工作面制冷问题。
 技术解决方案
为解决上述技术问题，本发明采用如下技术方案：
一种两级制冷模组，包括一级半导体制冷件和二级半导体制件以及导冷件；所述一级和二级半导体制冷件均包括中间的电偶层以及两端的热面和冷面；所述导冷件以快速导冷的方式连接于一级半导体制冷件和二级半导体制冷件之间；所述导冷件为热传递结构件。
进一步地，所述导冷件的两端分别与一级半导体制冷件的热面和二级半导体制冷件的冷面之间以快速热传递的方式连接；所述热传递结构件是选自导热材料制成的导热元件、热管、均温板、超级导热管、超级导热板中一种或几种的组合。
在一些实施例中，所述超级导热管为铝超导管，所述超级导热板为铝超导板；
所述铝超导板或铝超导管两端密封，内部封装有工作液体；通过铝材成型时在所述铝超导板或铝超导管的内壁形成有两条以上微槽；通过铝材成型时在所述铝超导板或铝超导管材料内形成多微孔结构。
在一些实施例中，所述制冷模组包括导热结构和散热片；所述导热结构是选自导热材料制成的导热元件、热管、均温板、超级导热管、超级导热板中一种或几种的组合；所述导热结构与散热片之间快速热传递地连接；所述导热结构与二级半导体制冷件的热面之间快速热传递地连接，或者，通过在所述导热结构上设置二级半导体制冷件的热端电路与二级半导体制冷件的电偶层焊接和电连接，使所述导热结构直接作为二级半导体制冷件的热面，以使二级半导体制冷件的热面快速散热；所述制冷模组还包括风扇；所述风扇包括壳体和壳体内的叶轮；所述导热结构和/或散热片设置于风扇的通风口或者作为风扇壳体的一部分。
在一些实施例中，所述导热结构包括若干根铝超导板或铝超导管，所述铝超导板或铝超导管为单管单根，内部形成单通道；铝超导板或铝超导管平面折弯或异形3Ｄ折弯，与安装空间相适配；所述导热结构还包括导热板，所述若干根铝超导板或铝超导管与导热板结合，若干根铝超导板或铝超导管布设包括至少两个不同方向或角度以减小反重力方向的效应导致导热效果变差的缺陷；所述散热片包括一组或多组导热材料翅片；所述导热板设置于所述散热片上的凹槽内或者设置于散热片顶部，或者，所述散热片以及所述导热板设置于另一导热件上。
在一些实施例中，所述导热板上设置有若干条开槽，所述若干根铝超导板或铝超导管与所述若干条开槽相适配且对应安装于开槽内，壁面之间相互接触以快速热传递；铝超导板或铝超导管与开槽之间焊接或铆接，以增大接触面积；所述二级半导体制冷件设置于导热板上：二级半导体制冷件的热面贴合安装在导热板的外壁上，使热面的热量直接传导至导热板；或者，二级半导体制冷件的热面通过导热件安装于导热板的外壁，通过导热件将热面的热量快速传导至所述导热板；或者，所述导热板用作热面，其上设置有二级半导体制冷件的热端电路，与电偶层的PN电偶粒子焊接和电连接；所述若干根铝超导板或铝超导管在XY平面使用两个不同方向或角度，或具备一定角度的相交线形式，或环形或交错式或循环式的设计。
在一些实施例中，所述二级半导体制冷件是由散热风扇模组进行散热；所述散热风扇模组包括风扇壳体以及叶轮，风扇壳体内部为腔体，叶轮安装于腔体中；风扇壳体上设置有若干通风口，通风口将腔体与风扇外部气路连通；风扇壳体的至少部分壳体由导热外壳构成，所述导热外壳是由选自：导热材料制成的导热元件、热管、均温板、超级导热管、超级导热板中一种或几种的组合以整体单片式或者以多片式拼接形成；所述二级半导体制冷件的热面与所述导热外壳之间热传传递地连接，或者，所述导热外壳直接作为二级半导体制冷件的热面。
在一些实施例中，所述超级导热管为铝超导管，所述超级导热板为铝超导板；所述散热风扇模组包括散热片，所述散热片与所述导热外壳之间快速传热地连接；所述散热片的风道与风扇的通风口以及腔体连通；风扇壳体的侧立面壳体包括所述导热外壳。
在一些实施例中，风扇壳体的侧立面壳体包括由单通道或多通道的铝超导管或铝超导板构成的所述导热外壳；风扇壳体的侧立面壳体内壁设置有所述散热片；散热片的风道方向为叶轮的旋转方向或轴向方向。
本发明还涉及一种光子美容仪，包括设置有若干通风口的机身，机身内部设置有光源组件、电源组件以及控制电路板；光源组件、电源组件与控制电路板电连接；机身的若干通风口用作进风和出风且与机身内的空间形成通风通道；机身的前端为与工作面；机身内还设置有如上任一项实施例所述的两级制冷模组，所述一级半导体制冷片直接作为所述工作面或者给所述工作面制冷。
进一步地，所述一级半导体制冷片直接作为工作面时：所述一级半导体制冷片以透明晶体作为冷面，冷面直接作为工作面，一级半导体制冷片的热面和电偶层设置有透光窗，使所述一级制冷件具有透光性；或者，所述一级半导体制冷片的冷面、热面和电偶层共同限定透光窗，光源组件产生的光子从透光窗传输至工作面外。所述一级半导体制冷片给所述工作面制冷时：所述一级半导体制冷片的冷面与工作面接触传热；或者，所述一级制冷件的冷面与所述工作面之间通过热传递结构件以快速热传递的方式连接。
在一些实施例中，所述两级制冷模组包括风扇，位于机身内的通风通道中；光源组件包括灯管以及反光杯，反光杯内部的通风道与风扇的通风道连通，且与机身内的所述通风通道连通，形成光源组件的散热通风道，由风扇促进光源组件散热；所述反光杯一侧设置有散热片或导热件；风扇的壳体上形成有多个通风口；其中一个通风口处安装所述反光杯的散热片或导热件，且将风扇的通风道与机身内的通风通道连通形成第一通风道，用于给反光杯散热；风扇的另一通风口与反光杯内部的风道连通，且将风扇的通风道与机身内的通风通道连通形成第二通风道，用于给反光杯和灯管散热。
在一些实施例中，所述光子美容是脱毛仪，光子嫩肤仪，导入导出美容仪或射频美容仪。
 有益效果
本发明的两级制冷模组实现快速制冷和散热的效果。
下面结合附图对本发明作进一步的详细描述。
 附图说明
图1是本发明第一实施例的美容仪的立体图。
图2是本发明第一实施例的美容仪的移去上壳后的立体图。
图3是本发明第一实施例的美容仪的内部结构的示意图。
图4是本发明第一实施例的美容仪通风道的示意图。
图5是本发明美容仪通风口其他实施例的示意图。
图6是图5所示实施例中美容仪内部通风道的示意图。
图7是图1所示实施例的美容仪的爆炸图。
图8是本发明制冷模组的第一种实施例的结构示意图。
图9是本发明制冷模组的第一种实施例的立体图。
图10是本发明制冷模组的部分爆炸图。
图11是本发明制冷模组的立体图。
图12是本发明制冷模组的部分爆炸图。
图13是本发明制冷模组的部分结构示意图。
图14是本发明制冷模组的第一种实施例的变换结构示意图，其中图14（a）和14（b）分别为不同视角。
图15是本发明制冷模组的替换实施例的结构示意图，其中图15（a）和15（b）分别不同实施例。
图16是本发明第二实施例的美容仪的立体图。
图17是本发明第二实施例的美容仪的移去上壳后的立体图。
图18是本发明第二实施例的美容仪的内部结构的示意图。
图19是本发明第二实施例的美容仪的爆炸图。
图20-22为本发明制冷模组的第二种实施例的几种结构示意图。
图23是本发明实施例的制冷模组的铝超导板或铝超导管的结构示意图，其中图23(a)为单根铝超导板或铝超导管的立体图，图23(b)为23(a)沿A-A的剖视图。
图24-26为本发明制冷模组的第三种实施例的几种结构示意图。
图27是本发明第三实施例的美容仪的移去前壳后的立体图。
图28是本发明第四实施例的美容仪移去前壳后的立体图。
图29为本发明制冷模组的第四种实施例的爆炸图。
图30为本发明制冷模组的第四种实施例的立体图。
图31是本发明第五实施例的美容仪的内部结构示意图。
图32是本发明第五实施例的美容仪的爆炸图。
图33是本发明实施例的散热风扇模组的立体图。
图34是本发明实施例的散热风扇模组另一视角的立体图。
图35是本发明实施例的散热风扇模组的爆炸图。
图36是本发明实施例的散热风扇模组的截面示意图。
图37是本发明实施例散热风扇模组侧立面蜗壳的结构示意图。
图38是图37所示实施例的替换结构的示意图。
图39-40是图37所示实施例的另一种替换结构的示意图。。
图41-42是图33-34所示散热风扇模组的替换实施例的结构示意图。
图43是本发明一种变换实施例的散热风扇模组的立体图。
图44是图33的替换实施例的结构示意图。
图45是本发明一种变换实施例的散热风扇模组的截面示意图。
图46是图45所示散热风扇模组的去掉壳体部分外壁立体图。
图47是图45所示的散热风扇模组的爆炸图。
图48-49是本发明另一种变换实施例的散热风扇模组不同视角的立体图。
图50-51是图48-49所示散热风扇模组的不同位置的截面示意图。
图52是图48-49所示散热风扇模组部分爆炸图。
图53是图48-49所示散热风扇模组的爆炸图。
图54是图48-49所示散热风扇模组的爆炸图。
 本发明的实施方式
需要说明的是，在不冲突的情况下，本发明中的各实施例及实施例中的特征可以相互结合，下面结合附图和具体实施例对本发明作进一步详细说明。
参照图1-54，本发明提供一种制冷模组1、散热风扇模组200，以及应用该制冷模组/散热风扇模组200的光子美容仪100。制冷模组1包括半导体制冷件10/10’，半导体制冷件10/10’包括中间的电偶层12以及两端的热面11’和冷面13；制冷模组1还包括导冷件15，导冷件15的一端与半导体制冷件的冷面13之间以快速热传递的方式连接，另一端用于与待制冷表面之间以快速导冷的方式连接；导冷件15为热传递结构件或热管或VC均温板或超级导热管或超级导热板。优选地，超级导热管为铝超导管，超级导热板为铝超导板。在一些实施例中，导冷件15为第一导冷件，制冷模组1还包括第二导冷件15’；第二导冷件15’设置于第一导冷件15与待制冷表面之间，快速导冷地连接；第二导冷件15’为导热材料管或导热材料板或铝超导管或铝超导板或热管或VC。
作为本发明的优选实施例，涉及一种两级制冷模组1，包括一级和二级半导体制冷件10’/10以及导冷件15；一级和二级半导体制冷件10’/10均包括中间的电偶层12以及两端的热面11’和冷面13；导冷件15以快速导冷的方式连接于一级半导体制冷件10’和二级半导体制冷件10之间；导冷件15为热传递结构件。导冷件15的两端分别与一级半导体制冷件10’的热面11’和二级半导体制冷件10的冷面13之间以快速热传递的方式连接；热传递结构件是选自导热材料制成的导热元件、热管、均温板、超级导热管、超级导热板中一种或几种的组合。进一步地，制冷模组1包括导热结构19和散热片16；导热结构19是选自导热材料制成的导热元件、热管、均温板、超级导热管、超级导热板中一种或几种的组合；导热结构19与散热片16之间快速热传递地连接。导热结构19与二级半导体制冷件10的热面11’之间快速热传递地连接；或者，通过在导热结构19上设置二级半导体制冷件10的热端电路与二级半导体制冷件10的电偶层12焊接和电连接，使导热结构19直接作为二级半导体制冷件10的热面11’。两级制冷模组1还包括风扇18或散热风扇组件200；风扇18或散热风扇组件200包括风扇壳体180/210和壳体内的叶轮181/220。导热结构19和/或散热片16设置于风扇的通风口182/201处或者作为风扇壳体180/210的一部分。
结合参照图33-53，本发明的另一优选实施例中，两级制冷模组1的二级半导体制冷件10是由散热风扇模组200进行散热。散热风扇模组200包括风扇壳体210以及叶轮220，风扇壳体210内部为腔体，叶轮220安装于腔体中；风扇壳体210上设置有若干通风口201，通风口201将腔体与风扇外部气路连通；风扇壳体210的至少部分壳体由导热外壳211构成，导热外壳211是由选自：导热材料制成的导热元件、热管、均温板、超级导热管、超级导热板中一种或几种的组合以整体单片式或者以多片式拼接形成。二级半导体制冷件10的热面11’与导热外壳210之间热传传递地连接；或者，导热外壳211上设置二级半导体制冷件10的热端电路与二级半导体制冷件10的电偶层12焊接和电连接，使导热外壳211直接作为二级半导体制冷件10的热面。
本发明的优选实施例涉及一种光子美容仪100，包括设置有若干通风口101的机身，机身内部设置有制冷模组1、光源组件2、电源组件3以及控制电路板4。光源组件2、电源组件3与控制电路板4电连接；机身的若干通风口111用作进风和出风且与机身内的空间形成通风通道（如图4-6中箭头所示线路）以实现机身内部散热。机身的前端为工作面113，工作面113可直接与皮肤接触，光源组件2产生的光传输至工作面113射出后对皮肤进行美容处理。机身内还设置有如上实施例所述的两级制冷模组1，其中一级半导体制冷片10’直接作为工作面113或者给工作面113制冷。具体地，一级半导体制冷片10’直接作为工作面113时：一级半导体制冷片10’以透明晶体作为冷面13，冷面13直接作为工作面113，一级半导体制冷片10’的热面11’和电偶层12设置有透光窗，使一级制冷件10’具有透光性；或者，一级半导体制冷片10’的冷面13、热面11’和电偶层12共同限定透光窗，光源组件产生的光子从透光窗传输至工作面113外，使光子作用于工作面外的皮肤。一级半导体制冷片10’给工作面113制冷时：一级半导体制冷片10’的冷面13与工作面113接触传热；或者，一级制冷件10’的冷面13与工作面之间通过热传递结构件以快速热传递的方式连接。两级制冷模组1包括风扇18或散热风扇组件200，位于机身内的通风通道中；光源组件2包括灯管20以及反光杯21，反光杯21内部的通风道与风扇18或散热风扇组件200的通风道连通，且与机身内的通风通道连通，形成光源组件2的散热通风道，由风扇18或散热风扇组件200促进光源组件散热。其中，反光杯21一侧设置有散热片或导热件22；风扇18/散热风扇组件200的风扇壳体180/210上形成有多个通风口182/201；其中一个通风口处安装反光杯的散热片或导热件22，且将风扇18/散热风扇组件200的通风道与机身内的通风通道连通形成第一通风道101，用于给反光杯21散热；风扇18/散热风扇组件200的另一通风口与反光杯21内部的风道连通，且将风扇18/散热风扇组件200的通风道与机身内的通风通道连通形成第二通风道102，用于给反光杯21和灯管20散热。
本发明采用二级制冷模组，可解决一级半导体制冷件通过热传递结构件散热时导热效率不均、导热慢、导热的时效性差使制冷速度降低、热量传导至散热片时存在散热片前后端或左右端或上下端的热量不均衡问题，影响风扇散热的效果等问题。
以下为制冷模组、散热风扇组件200以及光子美容仪100的多种具体实施例，结合参照附图。以下各种具体实施例的部分结构之间可重新组合，获得更多的实施例，均包含在本发明揭露的范围之类。
参照图1-28，本发明提供一种制冷模组1以及美容仪，其中种制冷模组1包括半导体制冷件10，用于美容仪的制冷，半导体制冷件10包括中间的电偶层以及两端的热面11’和冷面13；制冷模组还包括导热结构19和散热片16；导热结构19包括VC均温板或铝超导板或铝超导管；导热结构分别与散热片16以及半导体制冷件10的热面11’之间快速热传递地连接，以使热面快速散热。
铝超导板或铝超导管两端密封，内部封装有工作液体；内壁形成有两条以上的细骨形微槽1911；铝超导板或铝超导管材料内形成多微孔结构1912。
请参照图1-19所示，本发明的实施例涉及一种美容仪100，包括设置有若干通风口111的机身，若干通风口111可以设置于机壳110的不同或同一位置，以不同形式设置，包括但不限于：机壳110上形成的蜂窝状孔、缝隙、缺口等形式，通风口可以是一个或者多个，在功能上实现环境的冷风或空气自通风口进入机身内部，带走机身内部的热量，由通风口排出机身外。机身内部设置有制冷模组1、光源组件2、电源组件3以及控制电路板4。光源组件2、电源组件3与控制电路板4电连接；机身的若干通风口111用作进风和出风且与机身内的空间形成通风通道（如图4-6中箭头所示线路）以实现机身内部散热。机身的前端为工作面113，工作面113可直接与皮肤接触，光源组件2产生的光传输至工作面113射出后对皮肤进行美容处理。
参照图8-14，本发明实施例的制冷模组1，主要用于美容仪的工作面113的制冷，以达到对皮肤的冷敷效果。制冷模组1包括半导体制冷件10，半导体制冷件10包括中间的电偶层12以及两端的热面11’和冷面13。中间的电偶层12为PN电偶粒子按热面上设置的热端电路和冷面上设置的冷端电路排列且电连接形成半导体制冷件的内部电路，由正负极与控制电路板4电连接或单独的电路控制，以控制半导体制冷件工作。具体实施例中，制冷件10（具体是指冷面13）可以直接用作工作面113，或者用于给工作面113制冷。制冷件10直接用作工作面时，本领域技术人员可根据需要设置适配的形状，例如透明晶体或环形等。制冷件10用于给工作面113制冷时，制冷件10的冷面13与工作面113接触，例如设置于工作面的周边。或者，制冷件10的冷面13与工作面113通过传热元件（或导热件）与工作面113接触。导冷件（第一导冷件）15为热传递结构件，能快速将工作面的热量传递至半导体制冷件，实现给工作面制冷的效果。热传递结构件可以是导热材料例如（不限于）金属材料制成的导热元件例如（不限于）铜管或铜板等；或者热传递结构件也可以是由其他可实现热传递的例如热管(heat pipe)或均温板（VC，vapor chamber)或超级导热管或超级导热板或其他类型的传热组件，连接半导制冷件（冷面）与工作面之间。导冷件（第一导冷件）15可根据半导体制冷件10的形状，特别是根据冷面13的形状，以及工作面113的形状，以迅速散热为原则设计适配的形状。工作面113可以是透明晶体或其他透光材质制成。工作面113也可以是环形，环形中心通孔透光，此时不作材质限定。
热管(heat pipe)或均温板（vapor chamber)是通过利用热传导原理与制冷介质的快速热传递性质，透过热管将发热物体的热量迅速传递到热源外。通过在全封闭真空管或真空板内的液体的蒸发与凝结来传递热量，利用毛细作用等流体原理，起到制冷的效果，具有很高的导热性、优良的等温性、热流密度可变性、热流方向可逆性等一系列优点。热管(heat pipe)或均温板（vapor chamber)组成的换热器具有传热效率高、结构紧凑、流体阻损小等优点。
结合参照图7-11，作为一种较佳实施例，制冷件10的冷面13与工作面113通过导冷件15即热管将工作面113上的热量或工作面的环境热量迅速传递到制冷件10（冷面13）进行散热，将热量迅速传递到制冷件。根据工作面113的形状以及预期的制冷效果，导冷件（热管）15与工作面113接触的一端可设计为环状，与工作面的周边密切接触，以快速吸收工作面113或工作面113周围环境的热量；根据制冷件10或冷面13的形状，导冷件（热管）15与制冷件10接触的一端可设计为：自环形弯折延伸预定长度放置于制冷件的冷面13上且与冷面13紧密接触。
半导体制冷件10的热面11’产生的热量，由机身内的通风通道将热量排出机身外。较佳地，半导体制冷件10通过散热组件加强散热效果。散热组件包括VC均温板11以及VC均温板11上设置的散热片16，所述半导体制冷件的热面11’设置于VC均温板11的外壁，或者，所述VC均温板11直接作为半导体制冷件的热面。VC均温板11用于制冷件10的散热。VC均温板11位于机身的通风通道中；制冷件10设置于VC均温板11上，半导体制冷件的热面11’贴合安装在VC均温板的外壁上，使热面的热量直接传导至VC均温板11；或者，半导体制冷件的热面11’通过导热件安装于VC均温板的外壁，通过导热件将热面11’的热量快速传导至VC均温板11；或者，VC均温板11上设置有半导体制冷件的热端电路，与电偶层12的PN电偶粒子焊接和电连接。VC均温板11由底板、边框和盖板形成的封闭的平板型腔体，腔体内设置有毛细结构且容纳有工作流体。作为非限定性举例，VC均温板11的一端形成延伸平台用于设置或安装半导体制冷件10，VC均温板11的面积大于电偶层12以及冷面13，使半导体制冷件的热面11’具有延展的VC均温板11，增大散热面积。
散热组件还包括VC均温板11上设置的散热片16，以增大VC散热面积。可根据产品的散热需求于VC均温板11上表面或下表面或双面设置散热片16。较佳地，VC均温板11位于机身的通风口后方；VC均温板11上的散热片正对机身的通风口111。散热片16为一组或多组导热材料翅片，可以根据美容仪内部空间来设置散热片的位置和数量以及排列。结合图10-15，在VC均温板11的表面，散热片16为一组平行的直线型散热翅片排列为矩阵；或者，VC均温板11为风扇骨围，散热片16为螺旋的风扇骨围内壁的一组曲线型散热翅片（图15（a）），风道与风扇骨围的螺旋方向一致；或者，散热片16为一组散热翅片排列成圆环形矩阵，散热翅片可以沿直线辐射方向设置，或者散热翅片呈一定角度形成旋转方向设置（图15（b））。
本发明的制冷模组1还包括风扇18，风扇18位于机身的通风通道中，用于加强散热（制冷）效率。风扇18包括风扇壳体180以及壳体内部空腔中安装的叶轮181，风扇壳体180设置有若干开口作为风扇18的若干通风口182；风扇18的若干通风口182用作进风和出风，与风扇壳体180的内部空腔连通形成风扇18的通风道，与机身内的通风通道连通。VC均温板11可以是风扇壳体180的一部分或者安装于风扇壳体180上。VC均温板11和散热片16由风扇18的通风道散热，风扇促进气体流动提交散热效率。
VC均温板11可以设置为风扇18壳体的一部。风扇18壳体包括上壳、下壳184以及中间的围骨183。围骨183内壁可设置散热齿，以增大VC均温板11的散热面积。如图12-14中，VC均温板11作为风扇壳体的上壳（或下壳）盖设于环形围骨顶部（或底部）；VC均温板11可设置为环形平板，环形平板的中心通孔形成风扇18的一个通风口；散热片16设置为覆盖于中心通孔上的一组平行的散热翅片，散热翅片之间的通风道与VC均温板11的中心通孔以及风扇壳体的内部空腔连通。
参照图15（b），与图12-14所示结构不同之处在于，散热翅片排列于VC均温板1的中心通孔的环形边沿，辐射状排列或 者旋转一定角度排列一圈。
参照图15（a）中，VC均温板11作为扇叶外的围骨，散热片16可设置于围骨内壁，半导体制冷件10设置于围骨外壁。
本发明的制冷模组同时用于光源组件2散热。光源组件2包括灯管20、灯管外的反光杯21以及灯管两端的电极片23，灯管20较佳为IPL灯管，产生IPL光子，或者为卤素灯,或其他适合光源。光源组件2的通风道与风扇18的通风道连通，且与机身内的所述通风通道连通，形成光源组件2的散热通风道，由风扇18促进光源组件2散热。反光杯一侧可设置有导热件22，例如（但不限于）导热件22为一组导热片（由导热材料制成），导热件的一端连接于反光杯外壁，另一端延伸至风扇18的通风口182处。风扇18的壳体上，具体是在扇叶外的骨围上，形成有多个通风口182，如图13，围骨上设置有三处通风口182，其中之一（第一）通风口处安装所述反光杯的导热件，且将风扇18的通风道与机身内的通风通道连通形成第一通风道101（参照图4中的箭头标示线），用于给反光杯的导热件22和VC均温板11散热，此时，外部的空气或冷风自散热片16正对的机壳通风口(包括但不限于一组蜂窝孔以及壳体的缝隙) 111进入，经散热片16和VC均温板11，自均温板11的中心通孔进入风扇18内，由叶轮使气流在风扇内部空腔循环且流经反光杯的导热件22和VC均温板11，将反光杯21和VC均温板11的热量带走，由风扇围骨上的另一（第二）通风口182排出风扇，且经机身内的通风通道自机身端部的通风口 (包括但不限于一组蜂窝孔以及壳体的缝隙) 111排出机身外部，实现反光杯的导热件22和VC均温板11散热。风扇围骨上的再一（第三）通风口182与灯管内部的风道连通，且将风扇18的通风道与机身内的通风通道连通形成第二通风道102，用于给反光杯21和灯管20散热。此时，外部的空气或冷风自散热片16正对的机壳通风口111进入，经散热片16和VC均温板11，自均温板11的中心通孔进入风扇18内，由叶轮使部分气流经风扇围骨上的另一通风口182排出风扇且进入反光杯21内部，带走反光灯内部灯管20以及反光杯的热量排出灯管且经机身内的通风通道自机身端部的通风口111排出机身外部，进一步促进灯管20以及反光杯21的散热。
美容仪机身壳体上的通风口111可设置于不同位置、不同的孔结构，例如图5-6，分别在机身的下壳和侧面设置通风口，侧面的通风口作为第一通风道101和第二通风道102的出口，机身内的通风通道对应与侧面的通风口111连通。
本发明的美容仪100，应用上述各实施例的制冷模组1，给机身头部的工作面113制冷，制冷模组1的风扇还可同时用作光源组件2的散热。光子美容可以是脱毛仪，光子嫩肤仪，导入导出美容仪，射频美容仪等，均可采用上述实施例的制冷模组。
图1-7所示的美容仪100，是以一种直板型整机为例进行说明，可用作IPL光子脱毛仪。请参照图1-19所示，本发明的实施例涉及一种美容仪100，包括设置有若干通风口111的机壳110。机壳110包括上壳112和下壳118，相互扣合，内部形成机身内部的空腔。机身内还设置有上支架114和下支架115分别与上壳112和下壳118配合，机身前端内部设置有灯头支架24，以安装制冷模组1、光源组件2、电源组件3以及控制电路板4。
若干通风口111可以设置于机壳110的不同或同一位置，以不同孔结构形式。图中所示的通风口110设置于机壳的下壳118或侧面或端部上。机身内部的空腔形成有通风通道。环境的冷风或空气自通风口进入机身内部，带走机身内部的热量，又由相同或不同位置的通风口111排出机身外。机身的若干通风口111用作进风和出风且与机身内的空间形成通风通道（如图4-6中箭头所示线路）以实现机身内部散热。机身的前端为工作面113，工作面113可直接与皮肤接触，光源组件2产生的光传输至工作面113射出后对皮肤进行美容处理。
光源组件2通过灯头支架24安装于机身前端，灯头支架24内形成有出光通道和出光窗，用于传输光源组件产生的光。工作面113安装于出光窗，灯管20由反光杯21安装于灯头支架后部，位于出光通道后方，光源组件的出光方向设置有滤光片25。反光杯的导热件22向后伸出至风扇的通风口处。灯头支架24上可根据需要设置通风道，与反光杯内部的通风道连通，以便于风冷散热。
机身内部的上支架114和下支架115扣合的前端内部形成风扇容纳腔，对应安装制冷模组1，下支架115前端形成窗口，正对下壳118上形成的一处通风口111且连通，VC均温板11上的散热片16位于窗口处正对下壳118上的通风口111。VC均温板11前端延伸的平台上设置半导体制冷件10，导冷件即传热元件（热管）15由灯头支架支撑，前端（环状）与工作面113可迅速导热地接触连接，后端（平行直管端部）覆盖于半导体制冷件的冷面，可迅速进行热传递地紧密接触。风扇安装风扇容纳腔内，围骨的前端通风口182与反光杯的导热件22对应，后端的通风口与上下支架扣合后形成的通风通道连通。风扇的通风道参照图8所示的进风和出风标示。
机身内部的上支架114和下支架115扣合的后段内部形成电源组件容纳腔，电源组件3一般为电池，例如可充电电池或电容电池，电源组件还包括充电座31，用于连接外部电源给电池充电，或者直接给美容仪供电。充电座31与控制电路板4电连接，安装于机壳上，可连接线缆。
电源组件容纳腔的一侧，上支架114和下支架115扣合的内部还限定有通风通101/102，风，通风道101/102与风扇的通风道连通，与反光杯内的通风道连通，与机壳的通风口（进风和出风）连通，形成机身内部的通风通道。
上支架114与上壳112扣合形成的空腔，安装控制电路板4，通过上支架114与上壳112保护控制电路板4。机壳上还安装有与控制电路板4电连接的开关按键117以及内部对应的开关线路板116，用于开关机控制等。
参照图16-19所示实施例，将前述实施例的制冷模组1应用于L形美容仪，功能及结构与图1-7的直板机型相同或类似，仅配合机身的整体形状，适应性的设置机壳、支架、电源组件3、光源组件2、制冷模组1以及控制电路板4的尺寸和形状及位置配合。L形美容仪包括手柄120和灯头130。通过手柄顶部的旋扭150、旋扭座140、旋转压板151，将灯头130可转动地连接于手柄120的顶部，灯头130与手柄的旋转连接结构以及手柄的结构可采用现有技术的结构。手柄尾部为DC线31’，内部设置手柄部支架160，安装电源组件3。手柄部支架160顶部一侧的腔体与灯头130内部连通，可转动地安装灯头壳体。灯头壳体包括前壳131和前壳盖132，通过前壳盖132与旋扭150、旋扭座140、旋转压板151配合将灯头130可转动地连接。灯头内支架133安装于前壳盖132与前壳131配合，一侧安装制冷模组1，另一侧安装控制电路板4。灯头130的前端为工作面113，可以是：透明晶体工作面，或环形工作面，或为环形半导体制冷件，或为具有透明晶体冷面的半导体制冷件，均为现有技术的结构。灯头130内部的前端设置有灯头支架24，与图1-7实施例结构相似，安装光源组件2，光源组件2的反光杯的导热件22一侧设置有热管和散热片组件26，伸出至风扇18的通风口182，前壳131上设置有通风口与散热片组件26正对。本实施例中，采用制冷模组1给工作面113制冷，同时实现给光源组件2散热。
本发明通过VC均温板11上设置半导体制冷件10，由导冷件即传热元件（热管）15将制冷件的冷面13与美容仪的工作面113连接迅速导冷，在工作面形成冷敷效果或降温效果。VC均温板11上设置散热片16提高散热面积。进一步地，VC均温板11与风扇结合，利用VC均温板蒸发与冷凝的相变效应，用于风扇上壳或者下壳或围骨，更大程度上提高了风扇转动时的散热效率与速度；在ＶＣ上表面增加散热片，可增加ＶＣ的散热面积，有效地增加了吸风时空气与散热片的接触面积，于ＶＣ风扇上壳的下表面（围骨内壁）增加导热材料的散热片，可更大程度地加大空气与散热片之间的接触面积，使散热效果更佳。可根据产品的散热需求于VC均温板的上表面或下表面或双面设置散热片。
参照图20-23，本发明制冷模组1的第二实施例，主要用于美容仪的工作面113（参照前述实施例）的制冷，以达到对皮肤的冷敷效果。制冷模组1包括半导体制冷件10，半导体制冷件10（参照前述实施例）包括中间的电偶层12以及两端的热面11’和冷面13，具体实施例中，制冷件10（具体是指冷面13）可以直接用作工作面113，或者用于给工作面113制冷。制冷件10直接用作工作面时，本领域技术人员可根据需要设置适配的形状，例如透明晶体或环形等。制冷件10用于给工作面113制冷时，制冷件10的冷面13与工作面113接触，例如设置于工作面的周边。或者，制冷件10的冷面13与工作面113通过传热元件（或导热件）与工作面113接触。导冷件15为热传递结构件，能快速将工作面的热量传递至半导体制冷件，实现给工作面制冷的效果。热传递结构件可以是导热材料例如（不限于）金属材料例如（不限于）铜/铝管或铜/铝板等或者其他导热材料如硅脂/硅片/弹性或软性导热材料制成的导热元件；也可以是热管(heat pipe)或VC（均温板或均温管）或超级导热管或超级导热板或其他实现热传递的组件。热管(heat pipe)或均温板（vapor chamber)是利用热传导原理与制冷介质的快速热传递性质，透过热管将发热物体的热量迅速传递到热源外。超级导热管或超级导热板较佳为铝超导热管/铝超导热板。（铝）超导热管或（铝）超导热板，或称为ALVC超导管（板），是利用蒸发制冷，气液相变，使热量快速传导。结合参照图23，与一般热管和VC均温板相比较而言，铝超导热管/铝超导热板可通过铝材加工成型工艺在超导热管或超导热板的表面形成微槽或微齿状或微孔通道作为超导管或超导板内部的毛细结构。铝超导管（板）内部可不加入铜粉，可灌入铝粉或铝硅粉等，可加入铝网，灌入制冷剂后密封。导冷件15连接半导制冷件（冷面）与工作面之间，可根据半导体制冷件10以的形状，特别是根据冷面13的形状，以及工作面113的形状，以迅速散热为原则设计适配的形状。本实施例中，导冷件15为铜管或ALVC铝超导管（板）或热管或VC。
根据工作面113的形状以及预期的制冷效果，导冷件15与工作面113接触的一端可设计为环状，与工作面的周边直接密切接触，以快速吸收工作面113或工作面113周围环境的热量；或者，在工作面113与导冷件15进一步设置导冷件(第二导冷件)15’，接触传热。导冷件15’为铜管或ALVC超导管（板）或热管或VC，可以设置为环形，与工作面113的周边以及导冷件15的环形端贴合设置，以快速传热。根据制冷件10或冷面13的形状，导冷件15与制冷件10接触的一端可设计为：自环形弯折延伸预定长度放置于制冷件的冷面13上且与冷面13紧密接触。
半导体制冷件10的热面11’产生的热量，由机身内的通风通道将热量排出机身外。具体地，半导体制冷件10通过散热组件加强散热效果。散热组件包括导热结构19和散热片16，位于美容仪机身的通风通道中，用于给半导体制冷件10热面11’快速散热。导热结构19包括导热板190以及若干根铝VC/ALVC超导管191，每根铝VC/ALVC超导管191为单管单根。所述半导体制冷件的热面11’设置于导热板190的外壁，或者，所述导热板190直接作为半导体制冷件10的热面11’。导热板190的外壁的一侧设置半导体制冷件10，另一侧设置有若干条开槽192，若干条开槽192与若干根铝VC/ALVC超导管191相适配，铝VC/ALVC超导管191容设于开槽192内。导热板开槽192与铝VC/ALVC超导管191连接，例如铆压/焊接，以增加两者之间的接触面积实现快速传热。
结合对照图23，铝VC/ALVC超导管191，通过铝材加工成型工艺在铝VC/ALVC超导管的内壁表面形成微槽或微齿状或微孔，在铝VC/ALVC超导管内部形成毛细作用。图23(b)所示，铝材挤出成型铝VC/ALVC超导管时，管内形成单通道1910，管内壁形成有两条以上的细骨形微槽1911，还可在铝VC/ALVC超导管的管壁内部形成大量微孔结构1912，铝材成型为管状后，通过向管内抽注液，可灌入铝粉或铝硅粉等，还可加入铝网，抽真空后烧结密封端部，获得超级导热性能的铝VC/ALVC超导管。较佳地，每条铝VC/ALVC超导管为单通道1910，优点是：可实现平面折弯或异形3Ｄ折弯，可根据产品空间形态的变化而变化形状，可实现多根铝VC/ALVC超导管纵模交错组合以克服重力方向的影响。图23(a)所示的例子中，铝VC/ALVC超导管191弯折为L形，相应地，导热板190上的开槽192也为L形，铝VC/ALVC超导管191刚好嵌入开槽192内，整体形成L形导热结构19，L形的一端放置于半导体制冷件10的热面11’上紧密接触快速传热，L形的另一端安装于散热片16内。半导体制冷件10的热面11’产生的热量由导热结构19快速传递至散热片16进行散热。
制冷件10设置于导热板190的一侧，半导体制冷件的热面11’贴合安装在导热板190的外壁上，使热面的热量直接传导至导热板190；或者，半导体制冷件的热面11’通过导热件安装于导热板190的外壁，通过导热件将热面11’的热量快速传导至导热板190；或者，导热板190上设置有半导体制冷件的热端电路，与电偶层12的PN电偶粒子焊接和电连接。导热板190是由导热材料例如（不限于）金属材料例如（不限于）铜/铝或者其他导热材料如硅脂/硅片/弹性或软性导热材料制成的导热元件。较佳地，导热板190是由导热材料例如铜/铝板。
散热片16设置于导热板190上，以增大散热面积。较佳地，散热片16位于美容仪机身的通风口后方；正对机身的通风口111（结合图16、图27-28）。散热片16为一组或多组导热材料翅片，可以根据美容仪内部空间来设置散热片的位置和数量以及排列。一组或多组散热翅片通过一体成型或通过焊接或者铆接或由其他紧固机构固定形成整体结构的散热片16；或者，一组或多组导热材料翅片设置于导热板上形成整体结构的散热片16。散热片16的顶面形成凹槽161，导热结构19的一端插入凹槽161内，可通过铆压/焊接以增加两者之间的接触面积实现快速传热。
在其他实施例中，导热结构19也可以直接放置于散热片16上，或者，导热结构19连接于散热片16的导热板的一侧（参照图28）。
参照图24-26，制冷模组1的第三实施例，主要用于美容仪的工作面113（参照前述实施例）的制冷，以达到对皮肤的冷敷效果。制冷模组1包括半导体制冷件10、第一导冷件15、第二导冷件15’、散热片16和导热结构19。第一导冷件15、第二导冷件15’、散热片16的结构与上述制冷模组1的第二实施例相同或相似，直接引用上述实施例。导热结构19包括导热板190以及若干根铝VC/ALVC超导管191，每根铝VC/ALVC超导管191为单管单根，较佳地管内为单通道。所述半导体制冷件的热面11’设置于导热板190的外壁，或者，所述导热板190直接作为半导体制冷件10的热面11’。导热板190的外壁的一侧设置半导体制冷件10，另一侧设置有若干条开槽192，若干条开槽192与若干根铝VC/ALVC超导管191相适配，铝VC/ALVC超导管191容设于开槽192内。导热板开槽192与铝VC/ALVC超导管191连接，例如铆压/焊接，以增加两者之间的接触面积实现快速传热。本实施例中，导热板190包括圆形（不限于圆形）区域以及一侧延伸的平台，平台上设置半导体制冷件10。圆形区域自圆心向圆周边沿延伸贯通地设置若干条开槽190，间隔均匀地布设于圆形面积，每条开槽190内放置一条铝VC/ALVC超导管191，开槽190和铝VC/ALVC超导管191可设置一定的曲度或弧度。非限定性例子中，多根铝VC/ALVC超导管191安装后沿半径或近似沿半径方向形成辐射状排布，可克服重力方向的影响。在其他实施例中，多根铝VC/ALVC超导管191可纵模交错组合设置，克服重力方向的影响。导热板开槽190与铝VC/ALVC超导管191连接，可通过铆压/焊接以增加两者之间的接触面积，加快传热。
与前述实施例相同，铝VC/ALVC超导管191较佳采用单通道，通过铝材加工成型工艺在铝VC/ALVC超导管的内壁表面形成微槽或微齿状或微孔，内部封装有冷却液，可灌入铝粉或铝硅粉等，还可加入铝网。
制冷件10设置于导热板190的一侧的平台上，半导体制冷件的热面11’贴合安装在导热板190的外壁上，使热面的热量直接传导至导热板190；或者，半导体制冷件的热面11’通过导热件安装于导热板190的外壁，通过导热件将热面11’的热量快速传导至导热板190；或者，导热板190上设置有半导体制冷件的热端电路，与电偶层12的PN电偶粒子焊接和电连接。较佳地，导热板190是由导热材料制成的例如铜/铝板。
散热片16设置于导热板190上，以增大散热面积。非限定性例子中，导热结构19圆形区域可以直接设置于散热片16顶部，或通过焊接或铆接固定于散热片16顶部，以快速传热。导热板190一侧的平台伸出散热片16，半导体制冷件10设置于平台上。
参照图27，上述第三实施例的制冷模组1应用于美容仪，例如，应用于图16-19所示形状的美容仪，美容仪的其他结构件与图16-19所示实施例中相同或相似，直接引用。导热结构19设置于风扇18顶部的通风口上，具体是导热板190的圆形区域盖设于风扇顶部的开口上，导热板上安装铝VC/ALVC超导管191朝向风扇，散热片16位于外部朝向前壳131侧面的通风口111，导热结构19、风扇18、散热片16均位于机身内的通风通道中，且各自的通风通道连通，由机身的通风口111输入冷空气，在机身内的通风通道内带走热量后由另一通风口111排出至机身外部。
导热板190一侧的平台上设置半导体制冷件10，由导冷件（铜/ALVC/热管/VC）15(以及第二导冷件15’)将制冷件10的冷面与美容仪的工作面113连接迅速导冷，在工作面形成冷敷效果或降温效果。
图27中所示的美容仪与前述实施例的工作原理相同，在此不作赘述。
图28所示实施例的美容仪是采用上述第三实施例的制冷模组1给美容仪的工作面113制冷，美容仪的其他结构件与图16-19所示实施例中相同或相似，直接引用。导热结构19为L形，其安装于散热片16的一端盖设于风扇18顶部的通风口上，导热板190上安装铝VC/ALVC超导管191向内朝向风扇，导热板190另一端设置半导体制冷件10，位于风扇18顶部的通风口外侧。风散热片16位于外部朝向前壳131侧面的通风口111，导热结构19、风扇18、散热片16均位于机身内的通风通道中，且各自的通风通道连通，由机身的通风口111输入冷空气，在机身内的通风通道内带走热量后由另一通风口111排出至机身外部。
导热板190一侧的平台上设置半导体制冷件10，由导冷件（铜/ALVC/热管/VC）15(以及导冷件15’)将制冷件10的冷面与美容仪的工作面113连接迅速导冷，在工作面形成冷敷效果或降温效果。本实施例中，可省略光源组件2的反光杯的导热件22一侧设置的热管和散热片组件26。散热片16上开设的凹槽161（图22），安装导热板190的一端，同时形成通风通道，与散热片16相邻翅片之间的风道以及风扇的风道连通，与光源组件2的反光杯及其内部的通风通道连通，光源组件2的反光杯的导热件22位于风扇18的通风口或者位于机身内的通风通道内，实现对反光杯21和灯管20进行风冷散热。本实施例中，采用制冷模组1给工作面113制冷，同时实现给光源组件2散热。
本发明上述实施例的导热结构19采用多根铝超导板或铝超导管191单管与导热板（铜板）190结合，可以有效的解决产品重力方向的问题，管道可以在XY平面或XYZ三维方使用两个或两个以上不同方向/角度设置。众所周知的是热与蒸气是由下往上窜/流动，如此地，当美容仪处于由下往上使用时，导热结构的重力效果会比较明显，由于反重力方向的效应导致此状态下的导热效果变差，无法达到理想的散热效果，本发明设计成横竖相对设置（或具备一定角度的相交线形式，或环形（图24-26）交错式划循环式设计时可以更好地解决散热问题。导热结构19使散热效力显著提高。
参照图29-30，本发明的制冷模组1的第四种实施例，采用两级制冷方式，主要用作给光子美容仪工作面制冷以及内部散热，提高制冷效率。具体实施方式为：接触皮肤端即工作面设置一级制冷件，作用于皮肤制冷，一级制冷件10’的热量经导冷件（热管/均温板/（铝）超级导热管/（铝）超级导热板）15的蒸发端吸热进入热管/均温板/（铝）超级导热管/（铝）超级导热板内部通道将热量传递至冷凝端，冷凝端设置二级制冷件10对冷凝端进行主动式制冷，此时的冷凝端的温度取决于二级制冷件10的功率。由于冷凝端的温度远低于环境风的温度，冷凝端的冷凝速度与时效性大大提高，从而使导冷件（热管/ＶＣ/（铝）超级导热管或（铝）超级导热板）15的内部相变循环加快而达到提升前端制冷的有益效果；二级制冷件10的散热面(热面)13贴近风扇进风口或出风口，二级制冷件10的散热可直接采用铜/铝导热片由风扇将热量直接带走，亦可通过热管/均温板/（铝）超级导热管/（铝）超级导热板将二级制冷件散热面13上的热量传导至风扇壳体，由设置在风扇壳体壁上的散热片16经风扇吹风或吸风将热量带走。相较于图8-15所示制冷模组1的实施例而言，本实施例（图29-30）设置二级制冷，相当于将图8-15所示制冷模组1的制冷件10作为二级制冷件，用于冷端连接的一级制冷件10’的制冷。采用两级制冷，主要用于美容仪的工作面113的制冷，以达到对皮肤的冷敷效果。一级制冷件10’连接工作面113或者直接作为工作面113，二级制冷件10连接于散热风扇组件或者直接设置于风扇壳体。一级制冷件和二件制冷件较佳是指半导体制冷件，半导体制冷件10/10’包括中间的电偶层12以及两端的热面11’和冷面13。中间的电偶层12为PN电偶粒子按热面上设置的热端电路和冷面上设置的冷端电路排列且电连接形成半导体制冷件的内部电路，由正负极与控制电路板4电连接或单独的电路控制，以控制半导体制冷件工作。
具体实施例中，一级制冷件10’（具体是指冷面13）可以直接用作工作面113，或者用于给工作面113制冷。一级制冷件10’直接用作工作面时，本领域技术人员可根据需要设置适配的形状，例如以整块透明晶体作为冷面13直接作为工作面113，热面11’和电偶层12设置有透光窗，使一级制冷件10’具有透光性；以例如，冷面13、热面11’和电偶层12设置为环形或者共同形成有透光窗，此时不作材质限定。一级制冷件10’连接工作面113制冷时，其冷面13与工作面113接触，例如设置于工作面的周边，或者，一级制冷件10’的冷面13与工作面113通过传热元件（或导热件）与工作面113接触。
设置导冷件（第一导冷件）15以快速导冷方式连接于一级半导体制冷件10’（具体是其热面11’）和二级半导体制冷件10（具体是其冷面13）之间；能快速将一级半导体制冷件10’的热量传递至二级半导体制冷件10，实现给工作面制冷的效果。导冷件15为热传递结构件，热传递结构件可以是导热材料例如（不限于）金属材料制成的导热元件例如铜管或铜板或者其他传热结构等；较佳为热管(heat pipe)或均温板（vapor chamber)或（铝）超级导热管或（铝）超级导热板。导冷件15可根据一级半导体制冷件10’和二级半导体制冷件10的形状，以快速散热为原则设计适配的形状。一级半导体制冷件10’直接作为工作面113时，其具有透光性或设置有透光窗。导冷件（热管）15与工作面113接触的一端可设计为环状，与一级半导体制冷件10’的热面11’的周边密切接触，以快速吸收一级半导体制冷件10’或一级半导体制冷件10’周围环境的热量；导冷件（热管）15与二级制冷件10接触的一端可设计为：自环形弯折延伸预定长度放置于二级制冷件10的冷面13上且与冷面13紧密接触。
二级半导体制冷件10通过散热组件加强散热效果。散热组件包括由热管或（铝）超级导热管或（铝）超级导热板或均温板以整体单片式或者以多片式拼接形成导热外壳11以及导热外壳11上设置的散热片16，所述二级半导体制冷件的热面11’设置于导热外壳11的外壁，或者，所述导热外壳11直接作为半导体制冷件的热面。导热外壳11用于二级制冷件10的散热。应用于美容仪时，导热外壳11位于机身的通风通道中；二级制冷件10设置于导热外壳11上，二级半导体制冷件的热面11’贴合安装在导热外壳11的外壁上，使热面的热量直接传导至导热外壳11；或者，二级半导体制冷件10的热面11’通过导热件安装于（热管/均温板/（铝）超级导热管/（铝）超级导热板）导热外壳11的外壁，通过导热件将热面11’的热量快速传导至(热管/均温板/（铝）超级导热管/（铝）超级导热板)导热外壳11；或者，(热管/均温板/（铝）超级导热管/（铝）超级导热板)导热外壳11上设置有半导体制冷件的热端电路，与电偶层12的PN电偶粒子焊接和电连接。较佳采用均温板/（铝）超级导热板以整体单片式或者以多片式拼接形成导热外壳11，其由底板、边框和盖板形成的封闭的平板型腔体，腔体内设置有毛细结构且容纳有工作流体。作为非限定性举例，导热外壳11的一端形成延伸平台用于设置或安装二级半导体制冷件10，导热外壳11的面积大于电偶层12以及冷面13，使二级半导体制冷件10的热面11’散热面积增大。
导热外壳11上设置散热片16，以增大散热面积。可根据产品的散热需求于导热外壳11上表面或下表面或双面设置散热片16。较佳地，导热外壳11位于美容仪机身的通风口后方，其上散热片正对机身的通风口111。散热片16为一组或多组导热材料翅片。
二级制冷件10的散热组件还包括风扇18，风扇18位于美容仪机身的通风通道中，用于加强散热（制冷）效率。本实施例中散热风扇180、二级制冷件10、(热管/均温板/（铝）超级导热管/（铝）超级导热板)导热外壳11以及散热片16的配置参照图10-15所示实施例以及上述描述，直接引用于本实施例中，不作文字赘述。风扇18包括风扇壳体180以及壳体内部空腔中安装的叶轮181，风扇壳体180设置有若干开口作为风扇18的若干通风口182；风扇18的若干通风口182用作进风和出风，与风扇壳体180的内部空腔连通形成风扇18的通风道，与机身内的通风通道连通。(热管/均温板/（铝）超级导热管/（铝）超级导热板)导热外壳11可以是风扇壳体180的一部分或者安装于风扇壳体180上。
本实施例的两级制冷模组1应用于光子美容仪100的制冷和散热，参照图31-32，两级制冷模组1的散热组件同时用于光源组件2散热。光源组件2包括灯管20、灯管外的反光杯21，灯管20为IPL灯管产生IPL光子或者为卤素灯或者其他适用光源。光源组件2的通风道与风扇18的通风道连通，且与机身内的所述通风通道连通，形成光源组件2的散热通风道，由风扇18促进光源组件2散热。反光杯一侧可设置有导热件22，例如（但不限于）导热件22为一组导热片（由导热材料制成），导热件的一端连接于反光杯外壁，另一端延伸至风扇18的通风口182处。风扇18的壳体上，具体是在扇叶外的骨围上，形成有多个通风口182，如图13，围骨上设置有三处通风口182，其中之一（第一）通风口处安装所述反光杯的导热件，且将风扇18的通风道与机身内的通风通道连通形成第一通风道101（参照图4中的箭头标示线），用于给反光杯的导热件22和(热管/均温板/（铝）超级导热管/（铝）超级导热板)导热外壳11散热，此时，外部的空气或冷风自散热片16正对的机壳通风口(包括但不限于一组蜂窝孔以及壳体的缝隙) 111进入，经散热片16和(热管/均温板/（铝）超级导热管/（铝）超级导热板)导热外壳11，自(热管/均温板/（铝）超级导热管/（铝）超级导热板)导热外壳11的中心通孔进入风扇18内，由叶轮使气流在风扇内部空腔循环且流经反光杯的导热件22和(热管/均温板/（铝）超级导热管/（铝）超级导热板)导热外壳11，将反光杯21和(热管/均温板/（铝）超级导热管/（铝）超级导热板)导热外壳11的热量带走，由风扇围骨上的另一（第二）通风口182排出风扇，且经机身内的通风通道自机身端部的通风口 (包括但不限于一组蜂窝孔以及壳体的缝隙) 111排出机身外部，实现反光杯的导热件22和(热管/均温板/（铝）超级导热管/（铝）超级导热板)导热外壳11散热。风扇围骨上的再一（第三）通风口182与灯管内部的风道连通，且将风扇18的通风道与机身内的通风通道连通形成第二通风道102，用于给反光杯21和灯管20散热。此时，外部的空气或冷风自散热片16正对的机壳通风口111进入，经散热片16和(热管/均温板/（铝）超级导热管/（铝）超级导热板)导热外壳11，自均温板11的中心通孔进入风扇18内，由叶轮使部分气流经风扇围骨上的另一通风口182排出风扇且进入反光杯21内部，带走反光灯内部灯管20以及反光杯的热量排出灯管且经机身内的通风通道自机身端部的通风口111排出机身外部，进一步促进灯管20以及反光杯21的散热。散热组件以及散热原理与图1-14所示实施例相同。
本发明的美容仪100，与图1-14所示实施例相同，工作面113是由一级制冷件10’的透明晶体冷面形成。光子美容可以是脱毛仪，光子嫩肤仪，导入导出美容仪，光子射频美容仪等，均可采用上述实施例的制冷模组。光子美容仪内接触皮肤端即工作面设置一级制冷件10，作用于皮肤制冷，一级制冷件10’的热量（具体是其热面11’）经导冷件（热管/均温板/（铝）超级导热管/（铝）超级导热板）15的蒸发端吸热进入内部通道将热量传递至冷凝端，冷凝端设置二级制冷件10对冷凝端进行主动式制冷，此时的冷凝端的温度取决于二级制冷件10的功率。由于冷凝端的温度远低于环境风的温度，冷凝端的冷凝速度与时效性大大提高，从而使导冷件（热管/均温板/（铝）超级导热管/（铝）超级导热板）的内部相变循环加快而达到提升前端制冷的有益效果；二级制冷件10的散热面11’贴近风扇进风口或出风口，二级制冷件的散热可直接采用铜/铝导热片16由风扇将热量直接带走，亦可通过热管/均温板/（铝）超级导热管/（铝）超级导热板将二级制冷件10散热面11’上的热量传导至风扇壳体，由设置在风扇壳体壁上的散热片16经风扇吹风或吸风将热量带走。
图31-32所示实施例的美容仪100与图1-7所示实施例的美容仪其他结构相同，对应实施例的描述直接引用于本实施例中，在此不重复描述。从热管的原理而言，导冷件15的蒸发端受热汽化后的热量需经过冷凝端的管壁“传导”至散热片16由风扇18将热量带走，冷凝属于从动/被动式散热，且冷凝端的散热效果取决于风扇吸入的风的环境温度；如冷凝的时效性与速度会变差从而影响热管内部循环的效果变差。仅采用一级半导体制冷件10’给皮肤制冷存在导热效率不均、导热慢、导热的时效性差，且热量传导至散热片时存在散热片前后端或左右端或上下端的热量不均衡的问题，导致风扇把吸进或吹出的部份风达到最大的效果亦会影响散热的效果；本实施例采用两级制冷模组1，由导冷件15将一级制冷件10’传递至二级制冷件10，有效的解决了仅采用一级制冷件10’的以上问题。
在其他实施例中，是二级制冷件10采用图20-26所示实施例的制冷模组的散热组件进行快速散热，即一级制冷件10’（具体是其热面11’）通过导冷件15（15’）与二级制冷件10(具体是其冷面13)之间快速热传递地连接，以快速导冷。二级半导体制冷件10的热面11’产生的热量由导热结构19和散热片16快速散热。导热结构19包括导热板190以及若干根铝VC/ALVC超导管191，每根铝VC/ALVC超导管191为单管单根。二级半导体制冷件10的热面11’设置于导热板190的外壁，或者，所述导热板190直接作为二级半导体制冷件10的热面11’。导热板190的外壁的一侧设置二级半导体制冷件10，另一侧设置有若干条开槽192，若干条开槽192与若干根铝VC/ALVC超导管191相适配，铝VC/ALVC超导管191容设于开槽192内。导热板开槽192与铝VC/ALVC超导管191连接，例如铆压/焊接，以增加两者之间的接触面积实现快速传热。散热组件还包括散热风扇组件，散热风扇可采用上述各实施例的结构或者普通的风扇实现。
以下实施你还，参照图33-54，是将上述实施例的二级制冷件10采用散热风扇模组200快速散热。本实施例中，散热风扇模组200包括风扇壳体210以及叶轮220，风扇壳体210内部为腔体，叶轮220安装于腔体中；风扇壳体210上设置有若干通风口201，通风口201将腔体与风扇外部气路连通，风扇壳体210的至少部分壳体由热管或超级导热管或超级导热板或VC 211构成。风扇壳体210包括侧立面壳体，顶部和底部可根据具体产品需要选择性设置上壳和底壳，上壳和底壳也可由下述散热片的上层翅片或下层翅片形成，不另行设置。侧立面壳体可以是叶轮旋转圆周外侧的蜗壳或蜗壳的部分壳体。
优选地，超级导热管为铝超导管，超级导热板为铝超导板。铝超导管或铝超导板内部的贯通通道2110为单通道或多通道；单通道或多通道为多孔微槽通道；通道2110及其内壁的多孔微槽2111相互连通；单通道或多通道两端密封，内部封装有工作流体。
风扇壳体包括叶轮外侧的蜗壳，蜗壳围合形成风扇内部的腔体；蜗壳顶部可设置上壳或顶部形成通风口201，底部为底壳或形成通风口201；顶部的通风口也可以是设置于上壳上的若干通孔，底部的通风口也可以是设置于底壳上的若干通孔。蜗壳或上壳或底壳的部分地或者全部由热管或超级导热管或超级导热板或VC 211构成。热管或超级导热管或超级导热板或VC 211为整体单片式或者由多片式拼接。
散热风扇模组200包括散热片212，散热片212与热管或超级导热管或超级导热板或VC 211 之间快速传热地连接。散热片212位于风扇壳体内的腔体内。散热片212包括一组或多组导热材料翅片；相邻翅片之间的风道即散热片的风道与风扇的通风口以及腔体连通。
优选地，风扇壳体的侧立面即蜗壳设置有热管或超级导热管或超级导热板或VC 211；散热片212设置于侧立面内壁，与叶轮220间隔预定间距，不影响叶轮220旋转。更优选地，蜗壳侧立面由单通道或多通道的铝超导管或铝超导板构成导热外壳；散热片212设置于导热外壳内壁。翅片沿叶轮旋转中心径向圆周设置；相邻翅片之间的风道与叶轮旋转产生的气流方向一致。
铝超导管或铝超导板的单通道或多通道2110的内壁形成两条以上细骨状微槽2111；微槽2111的沟槽方向沿叶轮旋转中心径向圆周，与叶轮旋转产生的气流方向一致。微槽2111的壁面材料内部形成多孔结构。通道2110、微槽2111以及材料内部的多孔结构是通过铝材挤出成型工艺一次成型而形成。
优选地，本发明散热风扇模组200包括二级半导体制冷件10，二级半导体制冷件10的散热面(热面)与热管或超级导热管或超级导热板或VC 211之间快速热传导地连接。二级半导体制冷件10的散热面与热管或超级导热管或超级导热板或VC 211相互贴合接触传热或者通过导热板相互贴合地接触传热，或者，二级半导体制冷件10的散热面与热管或超级导热管或超级导热板或VC 211分别设置于风扇壳体的不同部位，相互之间快递热传导。
散热风扇模组200包括驱动控制电路板240和驱动模块250，驱动控制电路板240与驱动模块250电连接，驱动控制电路板240和驱动模块250通过电源线或电源模块与外部电源电连接；驱动模块250用于驱动叶轮220旋转。二级半导体制冷件10的电极与驱动控制电路板240电连接或者与外部电路板电连接。
在一些实施例中，驱动控制电路板240设置于风扇壳体外部实现防水；通风口201设置密封圈防水；驱动模块250设置于驱动控制电路板240上，且安装于风扇底壳214外侧；由于驱动控制电路板240和驱动模块250与风扇叶轮220分别设立于风扇底壳214内外侧，当风扇内吸入或进入水时，驱动控制电路板240和驱动模块250不受影响。驱动模块250包括电机，电机输出轴与叶轮轴联以驱动叶轮220旋转；或者，驱动模块250包括电机定子线圈，叶轮内部套设磁环25，磁环25与叶轮220固定连接，驱动模块250通电后产生磁场，磁环25旋转驱动风扇叶轮旋转。
散热风扇模组200为径向流风机或轴流风机；径向流风机中，叶轮220旋转产生的气流沿叶轮旋转中心径向圆周循环后可由蜗壳上的通气口排气；轴流风机中，叶轮220旋转产生的气流沿中心轴线方向自蜗壳顶部的通风口或者底部的通风口排气。
在一些实施例中，风扇的通风口201设置有散热片212，由散热片的风道连通风扇的腔体和外部环境。
本发明中的热管(heat pipe)或均温板（vapor chamber，VC)是通过利用热传导原理与制冷介质的快速热传递性质，透过热管将发热物体的热量迅速传递到热源外。通过在全封闭真空管或真空板内的液体的蒸发与凝结来传递热量，利用毛细作用等流体原理，起到制冷的效果，具有很高的导热性、优良的等温性、热流密度可变性、热流方向可逆性等一系列优点。热管(heat pipe)或均温板（vapor chamber)组成的换热器具有传热效率高、结构紧凑、流体阻损小等优点。
本发明中的超级导热管或超级导热板较佳为铝超导热管/铝超导热板。（铝）超导热管或（铝）超导热板，或称为ALVC超导管（板），是利用蒸发制冷，气液相变，使热量快速传导。与一般热管和VC均温板相比较而言，铝超导热管/铝超导热板可通过铝材加工成型（挤出成型）工艺在超导热管或超导热板的表面形成微槽或微齿状或微孔通道作为超导管或超导板内部的毛细结构。铝超导管（板）即ALVC铝超导管（板）内部可不加入铜粉，可灌入铝粉或铝硅粉等，可加入铝网，灌入制冷剂后密封。
以下对结合附图对具体实施例进行描述，下述各实施例仅为本领域技术人员理解并实施本发明的技术方案，并非限定本发明。本发明的保护范围以权利要求书为准。下述各实施例的散热风扇模组200中的结构可进行替换、组合或改进，均属于本发明揭露的范围。
参照图33-40，本发明第一实施例的散热风扇模组200，为一种鼓风机模组，包括内部形成腔体的风扇壳体210、安装于腔体内的叶轮220以及安装于风扇壳体上的二级半导体制冷件10。风扇壳体210包括侧立面的蜗壳，蜗壳罩设在叶轮220外，蜗壳为导热外壳，其内壁设置散热片212，蜗壳整体由热管或超级导热管或超级导热板或VC 211构成。本实施例以蜗壳整体为铝超导管或铝超导板为例进行说明。
风扇壳体210侧立面蜗壳及顶部设置有通风口201，通风口201将腔体与风扇外部气路连通，例如可由顶部的通风口进风，进入腔体后由叶轮220促请气流循环带走散热片212表面热量，最后由侧立面的通风口排出。参照图34，还可在风扇壳体210的底部即底壳214上形成若干通风口201辅助进风，本实施例的风扇为径向流，由叶轮或风扇轴上方向的顶部和底部通风口进风，侧立面的通风口出风，进风和出风也可互换，进风和出风不作限定。
本实施例中，风扇壳体210包壳侧立面蜗壳和底壳，顶部敞开作为通风口。侧立面蜗壳是由单片热管或超级导热管或超级导热板或VC 211（图35-37，图39所示）形成整体导热外壳，或由多片热管或超级导热管或超级导热板或VC 211（图38）构成导热外壳，热管或超级导热管或超级导热板或VC 211与内层的散热片212密接接触导热，热管或超级导热管或超级导热板或VC 211与散热片212之间可通过焊接或铆接或粘结或其他方式连接，快速热传递。
较佳地，侧立面蜗壳采用铝超导管或铝超导板11，可以是单片或多片拼接形成导热外壳，每片铝超导管或铝超导板11内部沿长度方向的贯通通道2110为单通道或多通道，每条通道两端密封，内部灌装工作流体。每条通道2110的内壁形成多条细骨状微槽2111，微槽2111与其所在通道2110流道贯通，供工作流体流通。材料内部形成多孔结构。多孔和微槽2111在通道2110内形成毛细作用。通道2110内可不加入铜粉，可灌入铝粉或铝硅粉等，可加入铝网，灌入制冷剂后密封。多孔、微槽2111以及通道2110均可通过铝材加工（挤出）成型工艺形成管状时同步制成完成，且形成铝超导管或铝超导板11内部的毛细结构。微槽2111的沟槽方向以及通道2110的长度方向可以叶轮旋转方向（如图36-39的所示），也可沿轴向方向竖直设置，如图40所示。
散热片212为一组或多组导热材料翅片，可以根据风扇腔体空间来设置散热片的位置和数量以及排列。一组或多组散热翅片通过一体成型或通过焊接或者铆接或由其他紧固机构固定形成整体结构的散热片212；或者，一组或多组导热材料翅片（例如铝/铜/石墨烯或其他导热翅片）设置于导热板上形成整体结构的散热片212。散热片212的形状与蜗壳或热管或超级导热管或超级导热板或VC 211形状相适配，本实施例中，散热片212整体呈筒体或环形，套设于环形热管或超级导热管或超级导热板或VC 211构成的导热外壳的内壁，直接贴合设置或通过导热件相互贴合设置，以快递热传递。侧立面的通风口可以是由散热片212的翅片之间的风道贯通外部以及腔体内部从，散热片212在通风口之外可通过导热板固定或者固定件固定在热管或超级导热管或超级导热板或VC 211构成的导热外壳的内壁；或者在侧立面通风口处，翅片和热管或超级导热管或超级导热板或VC 211断开形成连通风扇腔体与外部的通道。本实施例中，利用最上层的散热片作风扇的上壳，使之与风扇底壳及叶轮组形成风道，可不另行设置风扇的上壳，顶部敞口形成通风口。
二级半导体制冷件10包括中间的电偶层以及两端的热面（散热面）和冷面。二级半导体制冷件的热面与所述热管或超级导热管或超级导热板或VC 211快速热传导地连接。二级半导体制冷件10的散热面与热管或超级导热管或超级导热板或VC 211相互贴合接触传热或者通过导热板相互贴合地接触传热，或者，热管或超级导热管或超级导热板或VC 211外壁直接用作二级半导体制冷件的热面，其上设置热端电路，与电偶层焊接且电连接形成二级半导体制冷件的内部电路。本实施例中，二级半导体制冷件10的热面与热管或超级导热管或超级导热板或VC 211的外壁贴合。
叶轮220、驱动控制电路板240以及驱动模块250安装于风扇底壳214上，驱动模块250采用电机，电机的输出轴与叶轮的中心轴221之间轴联，电机正反转带动叶轮旋转。
参照图41-42作为一种替换方式，二级半导体制冷件10设置于风扇底壳214外壁，例如，二级半导体制冷件10与底壳214贴合，接触式设置。风扇底壳214为导热件，可以是导热材料制成例如金属板或热管或VC或超导板，风扇底壳214与侧立面的热管或超级导热管或超级导热板或VC 211之间快速热传递地连接。
参照图33-47，本发明第二实施例的散热风扇模组200，为一种轴流式风机模组，包括内部形成腔体的风扇壳体210、安装于腔体内的叶轮220以及安装于风扇壳体上的二级半导体制冷件10。风扇壳体210包括侧立面的蜗壳，蜗壳整体由热管或超级导热管或超级导热板或VC 211构成。风扇壳体的侧立面即蜗壳设置有热管或超级导热管或超级导热板或VC 211；更优选地，蜗壳侧立面由单通道或多通道的铝超导管或铝超导板构成导热外壳。散热片212设置于侧立面内壁，散热片212的翅片沿直径方向的环形排布，翅片之间的风道沿轴向方向贯通。在腔体内，叶轮220的上方设置一圈翅片形成顶部散热片212，下方设置一圈翅片形成底部散热片212，上下两散热片的风道较佳的对齐设置，且分别形成风扇顶部和底部的通风口，用作进风和出风，叶轮220旋转自顶部散热片的风道（进风通风口）吸入空气沿轴向向下沿底部散热片212的风道（出风通风口）排出，进风和出风方向可对换。
第二实施例散热风扇模组200与第一实施例相同，侧立面壳体即蜗壳由热管或超级导热管或超级导热板或VC 211为整体单片式或者由多片式拼接形成导热外壳，内壁的散热片可通过焊接或铆接或粘结或其他固定方式，快速热传递地连接。优选地，立面蜗壳由单通道或多通道的铝超导管或铝超导板构成导热外壳，铝超导管或铝超导板的单通道或多通道2110的内壁形成两条以上细骨形微槽2111；微槽2111的壁内材料内形成多个微孔。通道2110以及多孔微槽2111的沟槽方向沿叶轮旋转中心的轴向方向设置，与叶轮旋转产生的气流方向一致。
二级半导体制冷件10设置于侧立面导热外壳的外壁，其散热面(热面)与侧立面的热管或超级导热管或超级导热板或VC 211之间快速热传导地连接，或者热管或超级导热管或超级导热板或VC 211直接作为二级半导体制冷件10的散热面(热面)，其外壁设置热端电路，与半导体电偶层电连接且焊接。
叶轮220由腔体内设置的固定支架223以及卡环222转动安装，固定支架223上设有叶轮的中心轴，插入叶轮220的中心轴孔内，顶部由卡环222卡紧固定。
蜗壳底部外设置驱动控制电路板240以及驱动模块250，本实施例中，驱动模块250采用电机，电机的输出轴与叶轮的中心轴221之间轴联，电机正反转带动叶轮旋转。
本发明散热风扇模组200利用热管/VC/（铝）超级导热管/（铝）超级导热板等做为风扇的壳体（可以是侧立面，上盖，底盖，蜗壳），利用其相变导热的特点使其快速将热源传递至风扇的腔体内，通过风扇叶轮转动时产生的空气流动进行散热。本发明有效的利用了风扇的内部空间使产品体积更小，散热效率更高；更有效的与应用产品结合，减少了风扇原本的壳料成本。加大了散热片与空气流动时的接触面积。本发明在同等散热需求的情况下，提高了散热效率从而可降低风扇速度，电流，噪音等。
本发明散热风扇模组200的另一技术特点在于利用应用产品在使用半导体制冷时，其制冷件的散热面可直接与风扇的壳体（即导热件：热管/VC/（铝）超级导热管/（铝）超级导热板）相贴合（接触）；有效的缩短了热量传递的距离，加快了热量的传递。使应用产品的效果更佳。
参照图48-54，本发明第三实施例的散热风扇模组200，可作为一种防水风扇，较佳为磁力风机模组，包括内部形成腔体的风扇壳体210、安装于腔体内的叶轮220以及安装于风扇壳体上的二级半导体制冷件10。风扇壳体210包括侧立面的蜗壳以及蜗壳顶部的上壳215和底部的底壳214，且共同围合形成风扇内部的腔体。蜗壳的弧形部分由热管或超级导热管或超级导热板或VC 211构成；更优选地，蜗壳侧立面即蜗壳包括由单通道或多通道的铝超导管或铝超导板构成弧形导热外壳。散热片212设置于侧立面弧形导热外壳的内壁，散热片212的翅片沿直径方向的弧形排布，翅片之间的风道沿径向弧形方向贯通。本实施例中，风扇通风口201设置于侧立面蜗壳上，用作进风和出风。上壳和下壳不设置通风口以便于防水。
第三实施例散热风扇模组200与第一、二实施例类似，侧立面蜗壳的弧形导热外壳由热管或超级导热管或超级导热板或VC 211构成，由整体单片式或者由多片式拼接形成导热外壳，内壁的散热片可通过焊接或铆接或粘结或其他固定方式，快速热传递地连接。优选地，立面蜗壳由单通道或多通道的铝超导管或铝超导板构成弧形导热外壳，铝超导管或铝超导板的单通道或多通道2110的内壁形成两条以上细骨形微槽2111；微槽2111的壁内材料内形成多个微孔。通道2110以及多孔微槽2111的沟槽方向沿叶轮旋转中心的径向弧形方向设置，与叶轮旋转产生的气流方向一致。
二级半导体制冷件10设置于侧立面导热外壳的外壁，其散热面(热面)与侧立面的热管或超级导热管或超级导热板或VC 211之间快速热传导地连接，或者热管或超级导热管或超级导热板或VC 211直接作为二级半导体制冷件10的散热面(热面)，其外壁设置热端电路，与半导体电偶层电连接且焊接。或者，二级半导体制冷件10设置于上壳215或底壳214上，上壳215或底壳214与弧形导热外壳之间快速热传递地连接。二级半导体制冷件的热面贴合接触地设置于风扇壳体上。
叶轮220位于腔体内且安装于底壳214上，叶轮220中心设置有轴孔，轴孔内固定设置有轴套229，轴套229内壁形成有凸环，上轴承228以及下轴承226安装于轴套229内且分别位于凸环上下方，叶轮220内部套设有磁环，具体是在叶轮内位于轴套229外形成有环形腔，磁环套设于叶轮内部的环形腔的外环内壁与叶轮220固定。
底壳214上设有叶轮的中心轴221，底壳上形成中空环形凸台，凸台中心安装中心轴，由弹簧227弹性卡紧中心轴221的底部，中心轴221插入叶轮220的中心轴孔内轴套中，与轴承以及凸环配合，中心轴221的顶部形成有卡槽，由卡环222卡紧防脱。底壳214上的中空环形凸台的顶部适配地插入叶轮220内部的环形腔中，驱动模块250安装于底壳214上形成中空环形凸台限定的中空腔体中，驱动控制电路板240位于底壳214外。本实施例中，蜗壳底部外设置驱动控制电路板240以及驱动模块250，驱动模块250包括电机定子线圈251，驱动模块通电后产生磁场，从而带动风扇叶轮220转动，由于驱动模块250及驱动控制电路板240与风扇叶轮220分别设立于风扇底壳214的内外侧，故当风扇内吸入或进入水时，驱动模块250及驱动控制电路板240不受影响。本实施例中，驱动模块250及驱动控制电路板240与风扇组分离，驱动控制电路板240设置于风扇壳体210外，可实现防水，风经过风道时水不会对驱动控制电路板240造成影响。应用于产品时，本实施例的通风口处可设置密封圈，从而可实现产品与风扇模组200之间的防水。
上述各实施例中，“导冷”与“导热”、“传热”或“热传递”可解释为具有相同的含义，均为热传递，可相互替换使用。符号“/”表示“或”。
可以理解，前述各实施例中，使用的方位词例如“上”“下”“顶”“底”“左”“右”“竖直”“水平”“横向”“前”“后”等，均以附图所示部件的相对位置而言，并非限定为绝对的地理方位。
以上各实施例的技术特征可进行组合、变换或替换从而得到不同的实施例，这些实施例均属于本发明实施例的揭露范围。上述实施例中有些共同结构或类似结构在一些实施例中有描述，在其他实施例中未作描述的，这些共同结构或类似结构同样适用这些实施例，均属于本发明实施例的揭露范围。
在本发明中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接或可传输数据的连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个组件内部的连通或两个组件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
尽管已经示出和描述了本发明的实施例，对于本领域的普通技术人员而言，可以理解在不脱离本发明的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型，均应属于本发明的范围；本发明的保护范围由所附权利要求及其等同范围限定。

Claims (12)

  1. 一种两级制冷模组，包括一级半导体制冷件，其特征在于：所述制冷模组还包括二级半导体制件以及导冷件；所述一级和二级半导体制冷件均包括中间的电偶层以及两端的热面和冷面；所述导冷件以快速导冷的方式连接于一级半导体制冷件和二级半导体制冷件之间；所述导冷件为热传递结构件。
  2. 如权利要求1所述的两级制冷模组，其特征在于：所述导冷件的两端分别与一级半导体制冷件的热面和二级半导体制冷件的冷面之间以快速热传递的方式连接；所述热传递结构件是选自导热材料制成的导热元件、热管、均温板、超级导热管、超级导热板中一种或几种的组合。
  3. 如权利要求2所述的两级制冷模组，其特征在于：
    所述超级导热管为铝超导管，所述超级导热板为铝超导板；
    所述铝超导板或铝超导管两端密封，内部封装有工作液体；
    通过铝材成型时在所述铝超导板或铝超导管的内壁形成有两条以上微槽；
    通过铝材成型时在所述铝超导板或铝超导管材料内形成多微孔结构。
  4. 如权利要求1-3任一项所述的两级制冷模组，其特征在于：
    所述制冷模组包括导热结构和散热片；所述导热结构是选自导热材料制成的导热元件、热管、均温板、超级导热管、超级导热板中一种或几种的组合；
    所述导热结构与散热片之间快速热传递地连接；
    所述导热结构与二级半导体制冷件的热面之间快速热传递地连接；或者，通过在所述导热结构上设置二级半导体制冷件的热端电路与二级半导体制冷件的电偶层焊接和电连接，使所述导热结构直接作为二级半导体制冷件的热面；
    所述制冷模组还包括风扇；所述风扇包括壳体和壳体内的叶轮；
    所述导热结构和/或散热片设置于风扇的通风口或者作为风扇壳体的一部分。
  5. 如权利要求4所述的两级制冷模组，其特征在于：
    所述导热结构包括若干根铝超导板或铝超导管，所述铝超导板或铝超导管为单管单根，内部形成单通道；
    铝超导板或铝超导管平面折弯或异形3Ｄ折弯，与安装空间相适配；
    所述导热结构还包括导热板，所述若干根铝超导板或铝超导管与导热板结合，若干根铝超导板或铝超导管布设包括至少两个不同方向或角度以减小反重力方向的效应导致导热效果变差的缺陷；
    所述散热片包括一组或多组导热材料翅片；所述导热板设置于所述散热片上的凹槽内或者设置于散热片顶部，或者，所述散热片以及所述导热板设置于另一导热件上。
  6. 如权利要求5所述的两级制冷模组，其特征在于：
    所述导热板上设置有若干条开槽，所述若干根铝超导板或铝超导管与所述若干条开槽相适配且对应安装于开槽内，壁面之间相互接触以快速热传递；
    铝超导板或铝超导管与开槽之间焊接或铆接，以增大接触面积；
    所述二级半导体制冷件设置于导热板上：二级半导体制冷件的热面贴合安装在导热板的外壁上，使热面的热量直接传导至导热板；或者，二级半导体制冷件的热面通过导热件安装于导热板的外壁，通过导热件将热面的热量快速传导至所述导热板；或者，所述导热板用作热面，其上设置有二级半导体制冷件的热端电路，与电偶层的PN电偶粒子焊接和电连接；
    所述若干根铝超导板或铝超导管在XY平面使用两个不同方向或角度，或具备一定角度的相交线形式，或环形或交错式或循环式的设计。
  7. 如权利要求1-3任一项所述的两级制冷模组，其特征在于：
    所述二级半导体制冷件是由散热风扇模组进行散热；
    所述散热风扇模组包括风扇壳体以及叶轮，风扇壳体内部为腔体，叶轮安装于腔体中；风扇壳体上设置有若干通风口，通风口将腔体与风扇外部气路连通；
    风扇壳体的至少部分壳体由导热外壳构成，所述导热外壳是由选自：导热材料制成的导热元件、热管、均温板、超级导热管、超级导热板中一种或几种的组合以整体单片式或者以多片式拼接形成；
    所述二级半导体制冷件的热面与所述导热外壳之间热传传递地连接；或者，所述导热外壳上设置二级半导体制冷件的热端电路与二级半导体制冷件的电偶层焊接和电连接，使所述导热外壳直接作为二级半导体制冷件的热面。
  8. 如权利要求7所述的两级制冷模组，其特征在于：所述超级导热管为铝超导管，所述超级导热板为铝超导板；所述散热风扇模组包括散热片，所述散热片与所述导热外壳之间快速传热地连接；所述散热片的风道与风扇的通风口以及腔体连通；风扇壳体的侧立面壳体包括所述导热外壳。
  9. 如权利要求8所述的两级制冷模组，其特征在于：
    风扇壳体的侧立面壳体包括由单通道或多通道的铝超导管或铝超导板构成的所述导热外壳；
    风扇壳体的侧立面壳体内壁设置有所述散热片；散热片的风道方向为叶轮的旋转方向或轴向方向。
  10. 一种光子美容仪，包括设置有若干通风口的机身，机身内部设置有光源组件、电源组件以及控制电路板；光源组件、电源组件与控制电路板电连接；机身的若干通风口用作进风和出风且与机身内的空间形成通风通道；机身的前端为与工作面；其特征在于：机身内还设置有如权利要求1~9任一项所述的两级制冷模组，所述一级半导体制冷片直接作为所述工作面或者给所述工作面制冷。
  11. 如权利要求10所述的光子美容仪，其特征在于：
    所述一级半导体制冷片直接作为工作面时：所述一级半导体制冷片以透明晶体作为冷面，冷面直接作为工作面，一级半导体制冷片的热面和电偶层设置有透光窗，使所述一级制冷件具有透光性；或者，所述一级半导体制冷片的冷面、热面和电偶层共同限定透光窗，光源组件产生的光子从透光窗传输至工作面外；
    所述一级半导体制冷片给所述工作面制冷时：所述一级半导体制冷片的冷面与工作面接触传热；或者，所述一级制冷件的冷面与所述工作面之间通过热传递结构件以快速热传递的方式连接。
  12. 如权利要求10所述的光子美容仪，其特征在于：
    所述两级制冷模组包括风扇，位于机身内的通风通道中；
    光源组件包括灯管以及反光杯，反光杯内部的通风道与风扇的通风道连通，且与机身内的所述通风通道连通，形成光源组件的散热通风道，由风扇促进光源组件散热；
    所述反光杯一侧设置有散热片或导热件；风扇的壳体上形成有多个通风口；其中一个通风口处安装所述反光杯的散热片或导热件，且将风扇的通风道与机身内的通风通道连通形成第一通风道，用于给反光杯散热；风扇的另一通风口与反光杯内部的风道连通，且将风扇的通风道与机身内的通风通道连通形成第二通风道，用于给反光杯和灯管散热；
    所述光子美容是脱毛仪，光子嫩肤仪，导入导出美容仪或射频美容仪。
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