WO2024077820A1 - 温度压力传感器 - Google Patents

温度压力传感器 Download PDF

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Publication number
WO2024077820A1
WO2024077820A1 PCT/CN2023/075436 CN2023075436W WO2024077820A1 WO 2024077820 A1 WO2024077820 A1 WO 2024077820A1 CN 2023075436 W CN2023075436 W CN 2023075436W WO 2024077820 A1 WO2024077820 A1 WO 2024077820A1
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WO
WIPO (PCT)
Prior art keywords
sensing module
temperature sensing
temperature
pressure
electrical connector
Prior art date
Application number
PCT/CN2023/075436
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English (en)
French (fr)
Inventor
周敬训
李晴
潘英哲
Original Assignee
无锡莱顿电子有限公司
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Application filed by 无锡莱顿电子有限公司 filed Critical 无锡莱顿电子有限公司
Publication of WO2024077820A1 publication Critical patent/WO2024077820A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D21/00—Measuring or testing not otherwise provided for
    • G01D21/02—Measuring two or more variables by means not covered by a single other subclass

Definitions

  • the present application relates to the technical field of sensors, and in particular to a temperature and pressure sensor.
  • the temperature and pressure sensor is an integrated sensor that can measure the pressure and temperature of a medium at the same time.
  • the temperature and pressure sensor has the following technical problems.
  • the thermistor is connected to the temperature sensing module by inserting two leads of the thermistor into the through hole on the temperature sensing module and then welding them, and the diameter of the through hole on the temperature sensing module is very small.
  • only one protective cover is often used, and the length of the protective cover is relatively long, which will increase the difficulty of the lead wires passing through the through hole.
  • a high-precision temperature and pressure sensor in which a thermistor outer shell is provided with a thermistor protective cover, and the thermistor protective cover is arranged in the through hole of the shell.
  • the thermistor is connected to two thermistor connecting rods, and the two thermistor connecting rods pass through the PCB board and are connected to the PCB board.
  • This technical solution only uses one protective cover, which will increase the difficulty of the operator to insert the lead wires into the through hole.
  • the sensing module and the electrical connector terminals are connected by wires.
  • This connection method has high requirements for workers, consumes more man-hours, and the stability of the finished products produced is not high.
  • an integrated temperature and pressure sensor is known, in which a flexible circuit board is coupled above the temperature and pressure detection mechanism, and the flexible circuit board is connected to the terminals of the electrical connector through leads.
  • a temperature and pressure sensor is known, in which a pressure sensing element is electrically connected to a flexible circuit board.
  • the flexible circuit board and the electrical connector are connected by wires.
  • the sensing module and the electrical connector terminals in the above-mentioned known prior art are connected by wires. Compared with the spring clip connection method, the production efficiency is lower and the product stability is not good.
  • Each exemplary embodiment of the present application provides a temperature and pressure sensor.
  • Each exemplary embodiment of the present application provides a temperature and pressure sensor, including an electrical connector and a shell, wherein the electrical connector and the shell enclose an installation cavity, wherein a pressure sensing module, an injection molding base and a temperature sensing module are sequentially installed inside the installation cavity along the direction from the electrical connector to the shell, wherein the temperature sensing module is connected to a thermistor; the temperature sensing module and the plastic bracket are integrally injection molded to form a standard part.
  • the temperature sensing module includes a wire disposed on its surface and a solder joint and a contact connected to the wire; the thermistor includes two thermistor leads and a temperature sensing probe connected to the ends of the thermistor leads;
  • the thermistor lead wire passes through the temperature sensing module and is welded to the welding point on the temperature sensing module;
  • the outer side surface of the injection molded base abuts against the outer shell, the upper part of the inner side surface of the injection molded base abuts against the pressure sensing module, and the lower part of the inner side surface of the injection molded base abuts against the temperature sensing module.
  • the injection molded base is provided with a first vertical through hole aligned with the contact on the temperature sensing module, and the electrical connector is provided with an electrical connector terminal.
  • a first spring sheet is inserted into the first vertical through hole, one end of the first spring sheet abuts against the contact on the temperature sensing module, and the other end of the first spring sheet abuts against the electrical connector terminal.
  • the wire when the measured medium is conductive, the wire is covered with an insulating layer made by a thick film process.
  • the wire on the temperature sensing module is made of a thick film process, wherein the thickness of the thick film process is less than or equal to 5 microns, the bottom surface of the pressure sensing module, the inner side surface of the injection molding base and the top surface of the temperature sensing module constitute an accommodating cavity, and a second sealing ring is installed in the accommodating cavity to achieve sealing between the temperature sensing module and the pressure sensing module.
  • the plastic bracket is connected to a protective cover by a buckle, the protective cover is an open structure or a closed structure, and the thermistor is embedded in the protective cover;
  • a pressure inlet groove is provided on the outer wall of the plastic bracket, and a pressure inlet hole is provided on the side wall of the protective sleeve below the plastic bracket.
  • the pressure inlet hole cooperates with the pressure inlet groove to form a medium channel for transmitting the pressure of the measured medium to the pressure sensing module through the medium channel; the pressure sensing module and the temperature sensing module are ceramic modules.
  • the inner cavities of the plastic bracket and the protective cover are filled with insulating glue; the portion of the plastic bracket protruding from the temperature sensing module and the upper surface of the temperature sensing module form a cofferdam, and the cofferdam is used to accommodate and protect the solder joints and part of the circuit arranged on the upper surface of the temperature sensing module; the cofferdam is filled with insulating glue, which is used to protect the solder joints arranged on the upper surface of the temperature sensing module when the measured medium is conductive.
  • the housing is provided with an installation groove, and a first sealing ring is installed in the installation groove to achieve sealing between the temperature sensing module and the housing;
  • the electrical connector is made by upper and lower demoulding.
  • the inclined surface at the lower end of the electrical connector, the inclined surface at the upper end of the injection molding base and the shell form a sealing groove, and a third sealing ring is installed in the sealing groove.
  • the shell is a metal shell
  • the injection molding base is provided with a second vertical through hole
  • a second spring piece is inserted into the second vertical through hole
  • a conductive part is provided on the pressure sensing module, one end of the second spring piece contacts the conductive part for contacting the grounding end on the pressure sensing module; the other end of the second spring piece passes through the second vertical through hole on the injection molding base and contacts the shell for grounding the metal shell.
  • a third spring sheet is provided between the pressure sensing module and the electrical connector, a pressure module circuit is provided on the surface of the pressure sensing module, an installation cavity is provided at the lower end of the electrical connector, one end of the third spring sheet is welded in the installation cavity of the electrical connector, and the other end of the third spring sheet is connected to the input and output terminals of the pressure sensing module.
  • the temperature sensing module and the plastic bracket are integrally injection molded to form a standard part.
  • the plastic bracket is connected to a protective cover by a snap connection, and the thermistor is embedded in the protective cover.
  • the plastic bracket and the temperature sensing module have the advantages of reliable structure and firm connection.
  • the plastic bracket and the protective cover are connected by a snap connection.
  • the advantage of the snap connection is that the connection is firm, the installation and disassembly are simple, and the work efficiency can be improved.
  • Such a design has the following advantages. (1) It can adapt to different application environments. For application environments where the temperature probe penetrates into different depths in the measured medium, the plastic bracket and the temperature sensing module remain unchanged as standard parts.
  • the protective cover can be an open structure or a closed structure.
  • the plastic bracket and the temperature sensing module are integrally molded by injection molding, and the two leads of the thermistor are welded to the temperature sensing module. Among them, the two leads of the thermistor need to be inserted into the through holes on the temperature sensing module.
  • the volume of the protective cover and thermistor is very small, and the diameter of the through hole is very small. Therefore, if only one protective cover is used, the length of the protective cover will be relatively long, which will increase the difficulty of inserting the lead into the through hole.
  • the lead can be passed through the plastic bracket first, and then inserted into the through hole on the temperature sensing module, and then the plastic bracket and the protective cover are snap-connected, which will greatly reduce the difficulty of inserting the lead into the hole and improve work efficiency.
  • the plastic bracket and protective cover can protect the thermistor.
  • the upper portion of the plastic bracket protrudes from the upper surface of the temperature sensing module, and the protruding portion of the plastic bracket and the upper surface of the temperature sensing module form a cofferdam.
  • the cofferdam is used to accommodate and protect the solder joints and part of the circuit arranged on the upper surface of the temperature sensing module. Insulating glue is poured into the cofferdam to protect the solder joints arranged on the upper surface of the temperature sensing module when the medium is conductive.
  • the ceramic module and the electrical connector terminal are connected by a spring clip to provide product stability, as described below.
  • the contact on the temperature sensing module is connected to the electrical connector terminal by a first spring clip, and the temperature signal is transmitted from the medium to the electronic connector.
  • the technical solution in the prior art is that the thermistor and the terminal are injection molded together in a plastic support, and the terminal of the plastic support and the terminal of the electrical connector are connected by welding with the FPC.
  • the first spring clip of the present application is easy to operate, and the circuit can be connected by simply placing the first spring clip in the correct position.
  • the conductive parts of the housing and the pressure sensing module are connected by the second spring clip, which can play the role of grounding the metal housing.
  • the pressure sensing module and the electrical connector are connected by a third spring clip to form a loop.
  • the structural design of the temperature and pressure sensor is optimized, and the sealing effect of the sealing ring is enhanced.
  • the structural design in the prior art will cause the sealing ring to play a sealing role between the plastic support and the shell.
  • plastics have large flatness and roughness, which is not conducive to the sealing effect of the sealing ring.
  • the surface roughness and flatness of ordinary injection-molded plastic parts are difficult to control, while the surface roughness of ceramic sheets has better surface roughness and flatness after grinding.
  • the ceramics of the present application are subjected to a double-sided grinding process, with small flatness and small roughness, which is beneficial to the sealing effect of the sealing ring.
  • the wires on the temperature sensing module are made by a thick film process, which has little effect on the sealing effect of the sealing ring, and the structure of the electrical connector of the present application is made by a demolding method of upper and lower demolding, which avoids the problem that the bulge caused by the parting line will affect the sealing effect of the sealing ring.
  • the inclined surface at the lower end of the electrical connector, the inclined surface at the upper end of the injection molding base and the shell are used to enclose a sealing groove, and the design of installing a third sealing ring in the sealing groove can make the sealing ring fit more tightly and enhance the sealing effect.
  • the benefits of providing the third sealing ring are: (1) sealing to prevent foreign matter in the environment from entering the interior of the sensor; and (2) anti-rotation to prevent relative rotation between the electrical connector and the housing.
  • FIG. 1 is a schematic diagram of a three-dimensional structure of an embodiment of the present application.
  • FIG. 2 is a cross-sectional view of an embodiment of the present application.
  • FIG. 3 is a cross-sectional view of an embodiment of the present application from another direction.
  • FIG. 4 is a schematic diagram of the structure of the connection between the temperature sensing module and the thermistor in one embodiment of the present application.
  • FIG. 5 is a schematic diagram of a parting line of an electrical connector in the prior art.
  • FIG6 is a cross-sectional view (opening structure) of the connection between a standard part consisting of a temperature sensing module and a plastic bracket and a thermistor in one embodiment of the present application.
  • FIG. 7 is a schematic diagram of the three-dimensional structure of the pressure inlet groove and the pressure inlet hole in one embodiment of the present application.
  • FIG. 8 is a cross-sectional view of the protective cover in an embodiment of the present application when the protective cover is in a closed structure.
  • FIG. 9 is a top view of a temperature sensing module according to an embodiment of the present application.
  • FIG. 10 is a schematic top view of a temperature sensing module provided with an insulating layer in an embodiment of the present application.
  • FIG. 11 is a schematic diagram of an insulating layer in an embodiment of the present application.
  • FIG. 12 is a cross-sectional view of a standard component composed of a temperature sensing module and a plastic bracket in one embodiment of the present application.
  • FIG. 13 is a schematic diagram of a three-dimensional structure of a temperature sensing module and a thermistor connected in one embodiment of the present application.
  • FIG. 14 is a schematic diagram of the three-dimensional structure of a standard component consisting of a temperature sensing module and a plastic bracket in an embodiment of the present application.
  • Injection molding base 401. First vertical through hole; 402. Second vertical through hole;
  • Temperature sensing module 601. Soldering point; 602. Contact point; 603. Wire;
  • Thermistor 1001. Thermistor lead wire; 1002. Temperature sensor;
  • sealing rings are often used to seal temperature and pressure sensors.
  • the electrical connector in the prior art adopts a left-right demolding direction, and a parting line will be left on the sealing surface of the plastic part. The protrusion caused by the parting line will affect the sealing effect of the sealing ring.
  • the sealing ring often plays a sealing role between the plastic support and the outer shell, and in the prior art, the surface roughness and flatness of ordinary injection-molded plastic parts are difficult to control, which is not conducive to the sealing effect of the sealing ring.
  • the inventors proposed a temperature and pressure sensor, which solves the problems of poor sealing effect of the sealing ring in the prior art, low production efficiency and poor product stability caused by the connection between the sensing module and the electrical connector terminals through wires.
  • connection may refer to one element being directly connected to another element or one element being connected to another element through an intermediate element.
  • each exemplary embodiment of the present application provides a temperature and pressure sensor, including an electrical connector 1 and a housing 12.
  • the electrical connector 1 and the housing 12 enclose an installation cavity.
  • a pressure sensing module 2 Inside the installation cavity, a pressure sensing module 2, an injection molding base 4, and a temperature sensing module 6 are sequentially installed along the direction from the electrical connector 1 to the housing 12.
  • the temperature sensing module 6 is connected to a thermistor 10.
  • the temperature sensing module 6 and the plastic bracket 8 are integrally injection molded to form a standard part.
  • the advantage of the plastic bracket 8 and the temperature sensing module 6 as a standard part is that the structure is reliable and the connection is firm.
  • the temperature sensing module 6 includes a wire 603 disposed on the surface thereof and a soldering point 601 and a contact 602 connected to the wire 603 , which can effectively ensure circuit connectivity.
  • the thermistor 10 includes two thermistor leads 1001 and a temperature probe 1002 connected to the ends of the thermistor leads 1001.
  • the temperature probe 1002 of the thermistor 10 contacts the measured medium and transmits the temperature signal from the measured medium to the electronic connector 1.
  • the thermistor lead 1001 passes through the temperature sensing module 6 and is welded to the welding point 601 on the temperature sensing module 6 .
  • the conductive line 603 is covered with an insulating layer 19 made by a thick film process.
  • the outer side of the injection molding base 4 abuts against the housing 12.
  • the upper part of the inner side of the injection molding base 4 abuts against the pressure sensing module 2.
  • the lower part of the inner side of the injection molding base 4 abuts against the temperature sensing module 6.
  • the injection molding base 4 is provided with a first vertical through hole 401 aligned with the contact 602 on the temperature sensing module 6.
  • the electrical connector 1 is provided with an electrical connector terminal 101.
  • a first spring clip 13 is inserted into the first vertical through hole 401.
  • One end of the first spring clip 13 contacts the contact 602 on the temperature sensing module 6, and the other end contacts the electrical connector terminal 101.
  • the temperature signal on the temperature sensing module 6 is transmitted to the electronic connector 1.
  • the technical solution in the prior art is that the thermistor and the terminal are injection molded in a plastic support together, and the terminal of the plastic support is connected to the terminal of the electrical connector by welding with the FPC.
  • the first spring clip 13 of the present application is easy to operate, and the circuit can be connected by only placing the first spring clip 13 in the correct position.
  • the wire 603 when the measured medium is conductive, the wire 603 is covered with an insulating layer 19 made by a thick film process.
  • the solder joint 601 and the contact 602 connected to the wire 603 on the temperature sensing module 6 are both made by thick film technology, wherein the thickness of the thick film technology is less than or equal to 5 microns.
  • the bottom surface of the pressure sensing module 2, the inner side surface of the injection molding base 4 and the top surface of the temperature sensing module 6 together form a receiving cavity.
  • a second sealing ring 5 is installed in the receiving cavity to seal between the temperature sensing module 6 and the pressure sensing module 2.
  • the wire 603 made by thick film technology has little effect on the sealing effect of the second sealing ring 5 due to its thin thickness.
  • the plastic bracket 8 is snap-connected with the protective cover 9.
  • the snap-connection has the advantages of being firmly connected, easy to install and disassemble, and improving work efficiency.
  • the thermistor 10 is embedded in the protective cover 9.
  • the plastic bracket 8 and the protective cover 9 can be adapted to different application environments.
  • the plastic bracket 8 and the temperature sensing module 6 as standard parts do not need to be changed. It is only necessary to change the length of the protective cover 9 to adapt to different use depths.
  • the protective cover 9 can be changed to adapt to different use depths.
  • the protective cover 9 can be an open structure, please refer to Figure 6 for details.
  • the protective cover 9 can also be a closed structure, please refer to Figure 8 for details.
  • the structure of the protective cover 9 is not limited to the structure described above.
  • the plastic bracket 8 and the temperature sensing module 6 are integrally formed by injection molding.
  • the two leads of the thermistor 10 are welded to the temperature sensing module 6, wherein the two leads of the thermistor 10 need to be inserted into the through holes on the temperature sensing module 6.
  • the volume of the protective cover 9 and the thermistor 10 is very small, and the diameter of the through hole is very small. Therefore, if only one protective cover 9 is used, the length of the protective cover 9 will be relatively long, thereby increasing the difficulty of inserting the lead into the through hole.
  • the lead can be first passed through the plastic bracket 8, and then inserted into the through hole on the temperature sensing module 6, and then the plastic bracket 8 and the protective cover 9 are snap-connected, thereby greatly reducing the difficulty of inserting the lead into the hole and improving work efficiency.
  • the plastic bracket 8 and the protective cover 9 can protect the thermistor 10.
  • a pressure inlet groove 11 is provided on the outer wall of the plastic bracket 8, and a pressure inlet hole 18 is provided on the side wall of the protective cover 9 located below the plastic bracket 8.
  • the pressure inlet hole 18 cooperates with the pressure inlet groove 11 to form a medium channel, which is used to allow the pressure of the measured medium to act on the pressure sensing module 2 through the medium channel.
  • the pressure sensing module 2 and the temperature sensing module 6 can be ceramic modules.
  • the inner cavity of the plastic bracket 8 and the protective cover 9 is filled with insulating glue.
  • the portion of the plastic bracket 8 protruding from the temperature sensing module 6 and the upper surface of the temperature sensing module 6 form a cofferdam 17.
  • the cofferdam 17 is used to accommodate and protect the solder joints and part of the circuit arranged on the upper surface of the temperature sensing module 6.
  • the cofferdam 17 is filled with insulating glue to protect the solder joints arranged on the upper surface of the temperature sensing module 6 when the measured medium is conductive.
  • the housing 12 is provided with a mounting groove 16.
  • a first sealing ring 7 is installed in the mounting groove 16, which is used to seal between the temperature sensing module 6 and the housing 12.
  • the sealing O-ring seals between the plastic support and the housing.
  • plastics have greater flatness and roughness, which is not conducive to the sealing effect of the sealing O-ring.
  • the surface roughness and flatness of ordinary injection-molded plastic parts are difficult to control, while the surface roughness of ceramic sheets is ground to have better surface roughness and flatness.
  • the ceramics of the present application have undergone a double-sided grinding process, with low flatness and roughness, which is beneficial to the sealing effect of the first sealing ring 7.
  • the electrical connector 1 is made by demoulding from top to bottom.
  • the lower bevel of the electrical connector 1, the upper bevel of the injection molding base 4 and the housing 12 form a sealing groove.
  • a third sealing ring 3 is installed in the sealing groove.
  • the function of the third sealing ring 3 is:
  • the electrical connector 1 adopts a top-down demolding method, and there is no parting line on the surface of the electrical connector 1 and the injection molding base 4 that contacts the third sealing ring 3, and the sealing effect is good.
  • the triangle area formed by the inclined surface at the lower end of the electrical connector 1, the inclined surface at the upper end of the injection molding base 4, and the outer shell 12 provides a sealing groove for the third sealing ring 3, so that the third sealing ring 3 can fit more tightly.
  • the housing 12 is a metal housing
  • the injection molding base 4 is provided with a second vertical through hole 402.
  • a second spring 14 is inserted into the second vertical through hole 402.
  • a conductive portion is provided on the pressure sensing module 2.
  • One end of the second spring 14 contacts the conductive portion, and is used to contact the grounding terminal on the pressure sensing module 2.
  • the other end of the second spring 14 passes through the second vertical through hole 402 on the injection molding base 4 and contacts the housing 12, and is used to play the role of grounding the metal housing.
  • a third spring sheet 15 is provided between the pressure sensing module 2 and the electrical connector 1.
  • the circuit on the pressure sensing module 2 is in contact with the electrical connector 1 through the third spring sheet 15.
  • the pressure module circuit is provided on the surface of the pressure sensing module 2, and a mounting cavity is provided at the lower end of the electrical connector 1.
  • One end of the third spring sheet 15 is welded in the mounting cavity of the electrical connector 1, and the other end of the third spring sheet 15 is connected to the input and output terminals of the pressure sensing module 2.

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  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

一种温度压力传感器，包括电气接插件（1）和外壳（12），电气接插件（1）与外壳（12）围合成一安装腔体，安装腔体内部沿电气接插件（1）至外壳（12）的方向顺次安装有压力感应模块（2）、注塑底座（4）以及温度感应模块（6），温度感应模块（6）连接有热敏电阻（10）；温度感应模块（6）和塑料支架（8）一体注塑成型，构成一个标准件。

Description

温度压力传感器
本申请要求于2022年10月9日提交中国专利局、申请号为202211226328.6、申请名称为“一种温度压力传感器”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及传感器的技术领域，尤其是涉及一种温度压力传感器。
 背景技术
温度压力传感器是一种一体式传感器，能够同时测量介质的压力与温度。在现有技术中，温度压力传感器存在以下几个技术问题。
现有技术中，热敏电阻与温度感应模块的连接方式是通过热敏电阻的两根引线穿入温度感应模块上的通孔再进行焊接，而温度感应模块上的通孔的直径很小。现有技术中往往只采用一个保护套，保护套的长度相对很长，会增大引线穿入通孔的难度。例如，已知一种高精度温度压力传感器，其热敏电阻外套有一个热敏电阻保护套，热敏电阻保护套设置在外壳的通孔内。热敏电阻连接有两根热敏电阻连接杆，两根热敏电阻连接杆穿过PCB板并与PCB板连接。该技术方案只采用了一个保护套，会增加操作工人将引线穿入通孔的难度。
现有技术中，感应模块与电气接插件端子之间通过导线连接，这种连接方式对工人的要求较高、所耗工时较多，生产出的成品稳定性不高。例如，已知一种一体式温度压力传感器，其中，温度压力检测机构上方耦合有柔性电路板，柔性电路板通过引线与电气接插件的端子连接。再例如，已知一种温度压力传感器，其中，压力感应元件与柔性电路板电连接。柔性电路板与电气接插件之间通过导线连接。上述已知现有技术中的感应模块和电气接插件端子之间均采用导线连接的方式，其相较于采用弹片连接的方式，生产效率较低，且产品的稳定性不好。
 发明内容
本申请各示例性实施例提供一种温度压力传感器。
本申请各示例性实施例提供一种温度压力传感器，包括电气接插件和外壳，所述电气接插件与所述外壳围合成一安装腔体，所述安装腔体内部沿所述电气接插件至所述外壳的方向顺次安装有压力感应模块、注塑底座以及温度感应模块，所述温度感应模块连接有热敏电阻；所述温度感应模块和塑料支架一体注塑成型，构成一个标准件。
在一实施例中，所述温度感应模块包括在其表面设置的导线以及与所述导线连接的焊点和触点；所述热敏电阻包括两根热敏电阻引线以及连接在所述热敏电阻引线末端的感温探头；
所述热敏电阻引线贯穿温度感应模块与所述温度感应模块上的焊点焊接；
所述注塑底座的外侧面与所述外壳抵接，所述注塑底座的内侧面的上部与所述压力感应模块抵接，所述注塑底座的内侧面的下部与所述温度感应模块抵接，所述注塑底座开设有与所述温度感应模块上的所述触点对齐的第一竖向通孔，所述电气接插件设有电气接插件端子。
在一实施例中，所述第一竖向通孔内穿设有第一弹片，所述第一弹片的一端与所述温度感应模块上的所述触点相抵触，所述第一弹片的另一端与所述电气接插件端子相抵触。
在一实施例中，在被测介质具有导电性的情况下，所述导线上覆盖由厚膜工艺制成的绝缘层。
在一实施例中，所述温度感应模块上的所述导线采用厚膜工艺制成，其中厚膜工艺的厚度小于或等于5微米，所述压力感应模块的底面、所述注塑底座的内侧面以及所述温度感应模块的顶面构成一个容置腔，所述容置腔内安装有第二密封圈，用于实现所述温度感应模块和所述压力感应模块之间的密封。
在一实施例中，所述塑料支架通过卡扣连接有保护套，所述保护套为开口结构或闭口结构，所述热敏电阻嵌设在保护套内部；
所述塑料支架的外侧壁开设有进压槽，保所述护套位于塑料支架下方的侧壁上开设有进压孔，所述进压孔与所述进压槽配合形成介质通道，用于使被测介质的压力通过所述介质通道传递到所述压力感应模块上；所述压力感应模块和所述温度感应模块为陶瓷模块。
在一实施例中，所述塑料支架和所述保护套的内腔灌注有绝缘胶；所述塑料支架凸出所述温度感应模块的部分与所述温度感应模块的上表面围合成围堰，所述围堰用于容纳并保护设置在温度感应模块上表面的焊点及部分电路；所述围堰内灌入有绝缘胶，用于在被测介质具有导电性的情况下对设置在所述温度感应模块上表面的焊点进行保护。
在一实施例中，所述外壳开设有安装沟槽，所述安装沟槽内安装有第一密封圈，用于实现温度感应模块与外壳之间的密封；
所述电气接插件采用由上下脱模的脱模方式制成的电气接插件，所述电气接插件下端的斜面、所述注塑底座上端的斜面以及所述外壳围合成一个密封沟槽，所述密封沟槽内安装有第三密封圈。
在一实施例中，所述外壳为金属外壳，所述注塑底座开设有第二竖向通孔，所述第二竖向通孔内穿设有第二弹片，所述压力感应模块上设有导电部位，所述第二弹片的一端接触所述导电部位，用于接触所述压力感应模块上的接地端；所述第二弹片的另一端贯穿所述注塑底座上的所述第二竖向通孔与所述外壳接触，用于使金属外壳接地。
在一实施例中，所述压力感应模块和所述电气接插件之间设有第三弹片，所述压力感应模块的表面设有压力模块电路，所述电气接插件的下端设有安装腔，所述第三弹片的一端焊接在所述电气接插件的安装腔内，所述第三弹片的另一端连接所述压力感应模块的输入输出端子。
与现有技术相比，本申请各示例性实施例的有益效果是：
一、在本申请各示例性实施例中，将温度感应模块和塑料支架一体注塑成型，构成一个标准件。塑料支架通过卡扣连接的方式连接有保护套，热敏电阻嵌设在保护套内部。塑料支架和温度感应模块作为一个标准件具有结构可靠、连接牢固的优点。塑料支架和保护套之间通过卡扣连接的方式连接，卡扣连接的好处是连接牢靠，安装拆卸简单，可以提高工作效率。这样的设计有以下几点好处。（1）可以适应不同的应用环境，对于温度探头深入被测介质中不同深度的应用环境，塑料支架和温度感应模块作为标准件不变，只需要通过更改保护套的长度，适应不同的使用深度。（2）可以满足客户对保护套的不同的结构要求，保护套可以是开口结构，也可以是闭口结构。（3）塑料支架与温度感应模块通过注塑一体成型，热敏电阻的两根引线与温度感应模块焊接，其中，需要将热敏电阻的两根引线穿入温度感应模块上的通孔。保护套和热敏电阻的体积很小，通孔的直径很小，因此若只采用一个保护套，保护套的长度相对会很长，从而会增大引线穿入通孔的难度。而采用塑料支架加保护套的结构后，可以先将引线贯穿塑料支架，然后将其穿入温度感应模块上的通孔，再将塑料支架与保护套卡扣连接，从而会大大减小引线穿入孔的难度，提高工作效率。（4）塑料支架和保护套可以对热敏电阻起到保护作用。
二、在本申请各示例性实施例中，塑料支架的上部凸出温度感应模块的上表面，塑料支架凸出部分与温度感应模块的上表面形成围堰。围堰用于容纳并保护设置在温度感应模块上表面的焊点及部分电路。所述围堰内灌入有绝缘胶，用于在介质具有导电性的情况下对设置在温度感应模块上表面的焊点进行保护。
三、在本申请各示例性实施例中，陶瓷模块与电气接插件端子之间通过弹片连接，以提供产品的稳定性，具体说明如下。（1）通过第一弹片连接温度感应模块上的触点与电气接插件端子，将温度信号由介质传递到电子接插件。现有技术中的技术方案为热敏电阻与端子一起被注塑在塑料支撑中，塑料支撑的端子与电气接插件的端子之间通过与FPC的焊接被连通。对比现有技术的技术方案，本申请的第一弹片操作方便，只需要将第一弹片放在正确的位置，即可保证电路的联通。（2）通过第二弹片连接外壳和压力感应模块的导电部位，可以起到金属外壳接地的作用。（3）通过第三弹片连接压力感应模块和电气接插件，形成回路。
四、在本申请各示例性实施例中，优化了对温度压力传感器的结构设计，增强了密封圈的密封效果。现有技术中的结构设计会导致密封圈在塑料支撑和外壳之间起密封作用。而塑料与陶瓷相比，其平面度大，粗糙度大，对密封圈的密封效果不利。在现有技术中普通注塑成型的塑料件，其表面粗糙度和平整度难以把控，而陶瓷片的表面粗糙度经过研磨，具有更好的表面粗糙度和平整度。本申请的陶瓷经双面磨工艺，平面度小，粗糙度小，对密封圈的密封效果有益。温度感应模块上的导线采用厚膜工艺制成，对密封圈的密封效果影响极小，并且本申请的电气接插件的结构采用上下脱模的脱模方式制成，避免了分型线造成的凸起会影响密封圈的密封效果的问题。采用电气接插件下端的斜面、注塑底座上端的斜面以及外壳围合成一个密封沟槽，密封沟槽内安装有第三密封圈的设计可以使密封圈更紧密的贴合，增强了密封效果。其中设置第三密封圈的好处为：（1）密封，防止环境中的异物进入传感器内部；（2）防转，防止电气接插件与外壳之间的相对转动。
 附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请一实施例的立体结构示意图。
图2为本申请一实施例的剖视图。
图3为本申请一实施例另一方向的剖视图。
图4为本申请一实施例中的温度感应模块和热敏电阻连接的结构示意图。
图5为现有技术中的电气接插件的分型线的示意图。
图6为本申请一实施例中的温度感应模块和塑料支架构成的标准件与热敏电阻连接的剖视图（开口结构）。
图7为本申请一实施例中的进压槽和进压孔的的立体结构示意图。
图8为本申请一实施例中的保护套为闭口结构时的剖视图。
图9为本申请一实施例中的温度感应模块的俯视图。
图10为本申请一实施例中的设有绝缘层的温度感应模块的俯视示意图。
图11为本申请一实施例中的绝缘层的示意图。
图12为本申请一实施例中的温度感应模块与塑料支架构成的标准件的剖视图。
图13为本申请一实施例中的温度感应模块和热敏电阻连接的立体结构示意图。
图14为本申请一实施例中的温度感应模块和塑料支架构成的标准件的立体结构示意图。
附图标记说明：
1、电气接插件；101、电气接插件端子；
2、压力感应模块；3、第三密封圈；
4、注塑底座；401、第一竖向通孔；402、第二竖向通孔；
5、第二密封圈；
6、温度感应模块；601、焊点；602、触点；603、导线；
7、第一密封圈；8、塑料支架；9、保护套；
10、热敏电阻；1001、热敏电阻引线；1002、感温探头；
11、进压槽；12、外壳；13、第一弹片；14、第二弹片；15、第三弹片；16、安装沟槽；17、围堰；18、进压孔；19、绝缘层。
 实施方式
现有技术中，往往采用密封圈对温度压力传感器进行密封。发明人发现，现有技术中没有对温度压力传感器做很好的结构设计，导致密封圈的密封效果不是很好。例如，现有技术中电气接插件采用的是左右脱模的脱模方向，塑料件的密封面上会留下分型线，分型线造成的凸起会影响密封圈的密封效果。再例如，现有技术中密封圈往往在塑料支撑和外壳之间起密封作用，而在现有技术中普通注塑成型的塑料件表面粗糙度和平整度难以把控，不利于密封圈的密封效果。
基于上述现有技术的技术问题，发明人提出一种温度压力传感器，解决了现有技术中密封圈的密封效果不好、感应模块与电气接插件端子之间通过导线连接导致生产效率低、产品稳定性差等问题。
为了更好地了解本申请的目的、结构及功能，下面结合附图和具体较佳实施方式，对本申请一种温度压力传感器做进一步详细的描述。
本申请的描述中，需要理解的是，术语“左侧”、“右侧”、“上部”、“下部”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作。术语“第一”、“第二”等并不表示零部件的重要程度，因此不能理解为对本申请的限制。本实施例中采用的具体尺寸只是为了举例说明技术方案，并不限制本申请的保护范围。在本申请的描述中，除非上下文中另有说明，“多个”的含义是两个或两个以上。另外，术语“包括”“包含”及其任何变形，均意图在于覆盖不排他的包含，即在包含后面所列元素之外，还可以包含额外的其他元素。
在本申请的描述中，除非上下文中另有说明，术语“连接”可以指一个元件直接与另一个元件连接，也可以指一个元件通过中间元件与另一个元件连接。
如图1至图14所示，本申请各示例性实施例提供一种温度压力传感器，包括电气接插件1和外壳12。电气接插件1与外壳12围合成一安装腔体。安装腔体内部沿电气接插件1至外壳12的方向顺次安装有压力感应模块2、注塑底座4以及温度感应模块6。温度感应模块6连接有热敏电阻10。 温度感应模块6和塑料支架8一体注塑成型，构成一个标准件。塑料支架8和温度感应模块6作为一个标准件的优点是结构可靠，连接牢靠。
在一实施例中，温度感应模块6包括在其表面设置的导线603以及与导线603连接的焊点601和触点602，这可以有效保证电路联通。
热敏电阻10包括两根热敏电阻引线1001以及连接在热敏电阻引线1001末端的感温探头1002。热敏电阻10的感温探头1002接触被测介质，将温度信号由被测介质传递到电子接插件1。
热敏电阻引线1001贯穿温度感应模块6与温度感应模块6上的焊点601焊接。
如图10至图11所示，导线603上覆盖有由厚膜工艺制成的绝缘层19。
注塑底座4的外侧面与外壳12抵接。注塑底座4的内侧面的上部与压力感应模块2抵接。注塑底座4的内侧面的下部与温度感应模块6抵接。注塑底座4开设有与温度感应模块6上的触点602对齐的第一竖向通孔401。电气接插件1设有电气接插件端子101。
在一实施例中，第一竖向通孔401内穿设有第一弹片13。第一弹片13的一端与温度感应模块6上的触点602相抵触，另一端与电气接插件端子101相抵触。通过第一弹片13的连接，将温度感应模块6上的温度信号传递到电子接插件1。现有技术中的技术方案为热敏电阻与端子一起被注塑在塑料支撑中，塑料支撑的端子与电气接插件的端子之间通过与FPC的焊接被连通。对比现有技术的技术方案，本申请的第一弹片13操作方便，只需要将第一弹片13放在正确的位置，即可保证电路的联通。
在一实施例中，在被测介质具有导电性的情况下，导线603上覆盖由厚膜工艺制成的绝缘层19。
在一实施例中，温度感应模块6上的导线603连接的焊点601和触点602均采用厚膜工艺制成，其中，厚膜工艺的厚度小于或等于5微米。压力感应模块2的底面、注塑底座4的内侧面和温度感应模块6的顶面共同构成一个容置腔。该容置腔内安装有第二密封圈5，用于在温度感应模块6和压力感应模块2之间起密封作用。由厚膜工艺制成的导线603因其厚度很薄对第二密封圈5的密封效果影响极小。
在一实施例中，塑料支架8卡扣连接有保护套9。卡扣连接的优点是连接牢靠，安装拆卸简单，可以提高工作效率。热敏电阻10嵌设在保护套9内部。
设置塑料支架8和保护套9的优点如下。
（1）设置塑料支架8和保护套9可以适应不同的应用环境。对于温度探头深入被测介质中不同深度的应用环境，塑料支架8和温度感应模块6作为标准件不需改变，只需要通过更改保护套9的长度，以适应不同的使用深度，具体的请参照图5。
（2）可以满足客户对保护套9的不同的结构要求。保护套9可以是开口结构，具体的请参照图6。保护套9还可以是闭口结构，具体的请参照图8。当然，保护套9的结构不局限于以上描述的结构。
（3）塑料支架8与温度感应模块6通过注塑一体成型。热敏电阻10的两根引线与温度感应模块6进行焊接，其中，需要将热敏电阻10的两根引线穿入温度感应模块6上的通孔。保护套9和热敏电阻10的体积很小，通孔的直径很小。因此，若只采用一个保护套9，保护套9的长度相对会很长，从而增大引线穿入通孔的难度。而采用塑料支架8加保护套9的结构后，可以先将引线先贯穿塑料支架8，然后将其穿入温度感应模块6上的通孔，再将塑料支架8与保护套9卡扣连接，从而大大减小引线穿入孔的难度，提高工作效率。
（4）塑料支架8和保护套9可以对热敏电阻10起到保护作用。
塑料支架8的外侧壁开设有进压槽11，保护套9位于塑料支架8下方的侧壁上开设有进压孔18。进压孔18与进压槽11配合形成介质通道，用于使被测介质的压力通过该介质通道作用到压力感应模块2上。其中，压力感应模块2和温度感应模块6可以为陶瓷模块。
在一实施例中，塑料支架8和保护套9的内腔灌注有绝缘胶。塑料支架8凸出于温度感应模块6的部分与温度感应模块6的上表面围合成围堰17。围堰17用于容纳并保护设置在温度感应模块6上表面的焊点及部分电路。围堰17内灌入有绝缘胶，用于在被测介质具有导电性的情况下对设置在温度感应模块6上表面的焊点进行保护。
在一实施例中，外壳12开设有安装沟槽16。安装沟槽16内安装有第一密封圈7，用于在温度感应模块6与外壳12之间起密封作用。而现有技术中的技术方案中，密封O形圈在塑料支撑和外壳之间起密封作用。由于塑料与陶瓷相比，其平面度大，粗糙度大，因而对密封O形圈的密封效果不利。此外，在现有技术中普通注塑成型的塑料件表面粗糙度和平整度难以把控，而陶瓷片的表面粗糙度经过研磨，具有更好的表面粗糙度和平整度。本申请的陶瓷经双面磨工艺，平面度小，粗糙度小，对第一密封圈7的密封效果有益。
电气接插件1采用上下脱模的脱模方式制成。电气接插件1下端的斜面、注塑底座4上端的斜面以及外壳12围合成一个密封沟槽。密封沟槽内安装有第三密封圈3，
其中，第三密封圈3的作用为：
（1）密封，防止环境中的异物进入传感器内部；以及
（2）防转，防止电气接插件1与外壳12之间的相对转动。
现有技术中电气接插件往往使用采用密封O形圈径向密封，电气接插件采用的是左右脱模的脱模方向。因此，塑料件的密封面上会留下分型线，分型线造成的凸起会影响密封圈的密封效果。而在本申请上述实施例中的电气接插件1采用的是上下脱模的脱模方式，电气接插件1与注塑底座4在与第三密封圈3接触的面上均无分型线，密封效果良好。此外，电气接插件1下端的斜面、注塑底座4上端的斜面以及外壳12装配合形成的三角区为第三密封圈3提供了密封沟槽，使得第三密封圈3能更紧密的贴合。
在一实施例中，外壳12为金属外壳，所述注塑底座4开设有第二竖向通孔402。第二竖向通孔402内穿设有第二弹片14。压力感应模块2上设有导电部位。第二弹片14的一端接触所述导电部位，用于接触压力感应模块2上的接地端。第二弹片14的另一端贯穿注塑底座4上的第二竖向通孔402与外壳12接触，用于起到金属外壳接地的作用。
在一实施例中，所述压力感应模块2和电气接插件1之间设有第三弹片15。压力感应模块2上的电路与电气接插件1之间通过第三弹片15接触连通。压力感应模块2的表面设有压力模块电路，电气接插件1的下端设有安装腔，第三弹片15的一端焊接在电气接插件1的安装腔内，第三弹片15的另一端连接压力感应模块2的输入输出端子。
可以理解，本申请是通过一些实施例进行描述的，本领域技术人员知悉的，在不脱离本申请的精神和范围的情况下，可以对这些特征和实施例进行各种改变或等效替换。另外，在本申请的教导下，可以对这些特征和实施例进行修改以适应具体的情况及材料而不会脱离本申请的精神和范围。因此，本申请不受此处所公开的具体实施例的限制，所有落入本申请的权利要求范围内的实施例都属于本申请所保护的范围内。

Claims (10)

  1. 一种温度压力传感器，包括电气接插件（1）和外壳（12），其中，所述电气接插件（1）与所述外壳（12）围合成一安装腔体，所述安装腔体内部沿所述电气接插件（1）至所述外壳（12）的方向顺次安装有压力感应模块（2）、注塑底座（4）以及温度感应模块（6），所述温度感应模块（6）连接于热敏电阻（10）；所述温度感应模块（6）和塑料支架（8）一体注塑成型，构成一个标准件。
  2. 根据权利要求1所述的温度压力传感器，其中，所述温度感应模块（6）包括在其表面设置的导线（603）以及与所述导线（603）连接的焊点（601）和触点（602）；
    所述热敏电阻（10）包括两根热敏电阻引线（1001）以及连接在所述热敏电阻引线（1001）末端的感温探头（1002）；
    所述热敏电阻引线（1001）贯穿所述温度感应模块（6）并与所述温度感应模块（6）上的焊点（601）焊接；
    所述注塑底座（4）的外侧面与所述外壳（12）抵接，所述注塑底座（4）的内侧面的上部与所述压力感应模块（2）抵接，所述注塑底座（4）的内侧面的下部与所述温度感应模块（6）抵接，所述注塑底座（4）开设有与所述温度感应模块（6）上的所述触点（602）对齐的第一竖向通孔（401），且所述电气接插件（1）设有电气接插件端子（101）。
  3. 根据权利要求2所述的温度压力传感器，其中，所述第一竖向通孔（401）内穿设有第一弹片（13），所述第一弹片（13）的一端与所述温度感应模块（6）上的所述触点（602）相抵触，且所述第一弹片（13）的另一端与所述电气接插件端子（101）相抵触。
  4. 根据权利要求2所述的温度压力传感器，其中，在被测介质具有导电性的情况下，所述导线（603）上覆盖由厚膜工艺制成的绝缘层（19）。
  5. 根据权利要求2所述的温度压力传感器，其中，所述温度感应模块（6）上的所述导线（603）采用厚膜工艺制成，所述压力感应模块（2）的底面、所述注塑底座（4）的内侧面以及所述温度感应模块（6）的顶面构成一个容置腔，所述容置腔内安装有第二密封圈（5），用于实现所述温度感应模块（6）和所述压力感应模块（2）之间的密封。
  6. 根据权利要求1所述的温度压力传感器，其中，所述塑料支架（8）卡扣连接于保护套（9），所述保护套（9）为开口结构或闭口结构，所述热敏电阻（10）嵌设在所述保护套（9）内部；
    所述塑料支架（8）的外侧壁开设有进压槽（11），所述保护套（9）位于所述塑料支架（8）下方的侧壁上开设有进压孔（18），所述进压孔（18）与所述进压槽（11）配合形成介质通道，用于使被测介质的压力通过所述介质通道传递到所述压力感应模块（2）上；且所述压力感应模块（2）和所述温度感应模块（6）为陶瓷模块。
  7. 根据权利要求6所述的温度压力传感器，其中，所述塑料支架（8）和所述保护套（9）的内腔灌注有绝缘胶；所述塑料支架（8）凸出于所述温度感应模块（6）的部分与所述温度感应模块（6）的上表面围合成围堰（17），所述围堰（17）用于容纳并保护设置在所述温度感应模块（6）上表面的焊点及部分电路；且所述围堰（17）内灌入有绝缘胶，用于在所述被测介质具有导电性的情况下对设置在所述温度感应模块（6）上表面的所述焊点进行保护。
  8. 根据权利要求1所述的温度压力传感器，其中，所述外壳（12）开设有安装沟槽（16），所述安装沟槽（16）内安装有第一密封圈（7），用于实现所述温度感应模块（6）与所述外壳（12）之间的密封；
    所述电气接插件（1）为由上下脱模的脱模方式制成的电气接插件，所述电气接插件（1）下端的斜面、所述注塑底座（4）上端的斜面以及所述外壳（12）围合成一个密封沟槽，所述密封沟槽内安装有第三密封圈（3）。
  9. 根据权利要求1所述的温度压力传感器，其中，所述外壳（12）为金属外壳，所述注塑底座（4）开设有第二竖向通孔（402），所述第二竖向通孔（402）内穿设有第二弹片（14），所述压力感应模块（2）上设有导电部位，所述第二弹片（14）的一端接触所述导电部位，用于接触所述压力感应模块（2）上的接地端；且所述第二弹片（14）的另一端贯穿所述注塑底座（4）上的所述第二竖向通孔（402）以与所述外壳（12）接触，用于使所述金属外壳接地。
  10. 根据权利要求1所述的温度压力传感器，其中，所述压力感应模块（2）和所述电气接插件（1）之间设有第三弹片（15），所述压力感应模块（2）的表面设有压力模块电路，所述电气接插件（1）的下端设有安装腔，所述第三弹片（15）的一端焊接在所述电气接插件（1）的所述安装腔内，且所述第三弹片（15）的另一端连接所述压力感应模块（2）的输入输出端子。
PCT/CN2023/075436 2022-10-09 2023-02-10 温度压力传感器 WO2024077820A1 (zh)

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