WO2022127810A1 - 传感器组件以及阀装置 - Google Patents

传感器组件以及阀装置 Download PDF

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Publication number
WO2022127810A1
WO2022127810A1 PCT/CN2021/138250 CN2021138250W WO2022127810A1 WO 2022127810 A1 WO2022127810 A1 WO 2022127810A1 CN 2021138250 W CN2021138250 W CN 2021138250W WO 2022127810 A1 WO2022127810 A1 WO 2022127810A1
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WO
WIPO (PCT)
Prior art keywords
pressure sensing
sensing unit
sealing
housing
end surface
Prior art date
Application number
PCT/CN2021/138250
Other languages
English (en)
French (fr)
Inventor
胡石锋
陈润
曹铮
钱柯浙
张荣荣
Original Assignee
浙江三花汽车零部件有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 浙江三花汽车零部件有限公司 filed Critical 浙江三花汽车零部件有限公司
Priority to KR1020237023795A priority Critical patent/KR20230116933A/ko
Priority to JP2023535651A priority patent/JP2023552853A/ja
Priority to US18/267,554 priority patent/US20240044734A1/en
Priority to EP21905737.9A priority patent/EP4266021A1/en
Publication of WO2022127810A1 publication Critical patent/WO2022127810A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0092—Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D21/00—Measuring or testing not otherwise provided for
    • G01D21/02—Measuring two or more variables by means not covered by a single other subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08—Protective devices, e.g. casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K13/00—Thermometers specially adapted for specific purposes
    • G01K13/02—Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/142—Multiple part housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/142—Multiple part housings
    • G01L19/143—Two part housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D3/00—Indicating or recording apparatus with provision for the special purposes referred to in the subgroups
    • G01D3/028—Indicating or recording apparatus with provision for the special purposes referred to in the subgroups mitigating undesired influences, e.g. temperature, pressure
    • G01D3/036—Indicating or recording apparatus with provision for the special purposes referred to in the subgroups mitigating undesired influences, e.g. temperature, pressure on measuring arrangements themselves
    • G01D3/0365—Indicating or recording apparatus with provision for the special purposes referred to in the subgroups mitigating undesired influences, e.g. temperature, pressure on measuring arrangements themselves the undesired influence being measured using a separate sensor, which produces an influence related signal

Definitions

  • the present application relates to the field of detection technology, and in particular, to a sensor assembly and a valve device using the sensor assembly.
  • the sensor assembly 100 in the related art includes a pressure sensor element 130 , an electronic circuit board 120 and a temperature sensor element 170 .
  • the sensor assembly 100 transmits fluid to the surface of the pressure sensor element 130 that senses pressure through the inlet opening 175 of the open fluid-tight channel, and isolates the temperature sensor 170 and wire 160 from the fluid through the closed fluid-tight channel.
  • Wires 160 extend within the elongated tubular member 165 and connect to the electronic circuit board 120 from the side through holes in the base.
  • the sensor assembly of this structure has many parts, the assembly process is complicated, and the production cost is high.
  • the purpose of the present application is to provide a sensor assembly and valve device with a simple structure, which is beneficial to reduce production costs.
  • a sensor assembly comprising a casing, a temperature sensing unit, a pressure sensing unit and a circuit unit, the temperature sensing unit includes a temperature sensing part, and the pressure sensing unit It includes a pressure sensing part, the sensor assembly has a detection channel, the temperature sensing part is located in the detection channel, the temperature sensing part can convert the temperature in the detection channel into an electrical signal, and the pressure sensing part can The pressure in the detection channel is converted into an electrical signal; the temperature sensing unit further includes a conductive part, the conductive part is electrically connected to the temperature sensing part and the circuit unit, and the sensor assembly further includes a connector, The connector includes a pin and a socket housing, the pin is electrically connected to the circuit unit, the housing is fixedly connected to the socket housing, and the pressure sensing unit is limited to the outer portion of the housing. Between the bottom wall and the plug housing, the plug housing includes a limiting portion, and the limiting portion can a
  • the present application also discloses a valve device, comprising a valve body and a sensor assembly, the valve body has a fluid channel, the detection channel communicates with the fluid channel, and the sensor assembly is the above-mentioned sensor assembly.
  • the sensor assembly includes a pressure sensing unit, a temperature sensing unit, a circuit unit and a connector, the housing is fixedly connected to the connector housing, and the pressure sensing unit and the circuit unit are limited to the bottom of the housing Between the wall and the socket housing, it is beneficial to reduce the number of parts, simplify the structure, and reduce the production cost.
  • FIG. 1 is a schematic three-dimensional structure diagram of a sensor assembly according to a first embodiment of the present application
  • FIG. 2 is a schematic diagram of an exploded structure of the sensor assembly of FIG. 1;
  • Fig. 3 is a front structural schematic diagram of the sensor assembly of Fig. 1;
  • Fig. 4 is A-A sectional structure schematic diagram in Fig. 3;
  • FIG. 5 is a perspective structural schematic diagram of the sealing assembly and the first-section assembly in FIG. 2 from a perspective;
  • FIG. 6 is a perspective structural schematic diagram of the sealing assembly and the first-section assembly in FIG. 2 from another perspective;
  • Fig. 7 is the top view structure schematic diagram of Fig. 5;
  • Fig. 8 is A-A sectional structure schematic diagram in Fig. 7;
  • Fig. 9 is a perspective structural schematic diagram of the assembly of the base and the second section in Fig. 2;
  • Fig. 10 is a three-dimensional schematic diagram of the connector in Fig. 2;
  • FIG. 11 is a schematic cross-sectional structural diagram of a sensor assembly according to a second embodiment of the present application.
  • Fig. 12 is a perspective view of the three-dimensional structure of the base in Fig. 11;
  • Figure 13 is an enlarged schematic view of a partial structure of the base in Figure 11;
  • FIG. 14 is a schematic cross-sectional structural diagram of the first embodiment of the pressure sensing unit of the present application.
  • 15 is a schematic cross-sectional structural diagram of a sensor assembly according to a third embodiment of the present application.
  • Fig. 16 is a perspective view of the three-dimensional structure of the base in Fig. 15;
  • Fig. 17 is the bottom view structure schematic diagram of the base in Fig. 16;
  • Fig. 18 is A-A sectional structure schematic diagram in Fig. 17;
  • FIG. 19 is a schematic cross-sectional structural diagram of a second embodiment of the pressure sensing unit of the present application.
  • FIG. 20 is a schematic cross-sectional structural diagram of a sensor assembly according to a fourth embodiment of the present application.
  • FIG. 21 is a schematic diagram of an exploded structure of a sensor assembly according to a fifth embodiment of the present application.
  • FIG. 22 is a schematic cross-sectional structural diagram of a sensor assembly according to a fifth embodiment of the present application.
  • Fig. 23 is a partial enlarged structural schematic diagram of part B in Fig. 22;
  • FIG. 24 is a schematic structural diagram of an embodiment of a sensor assembly in the prior art.
  • words such as “first”, “second” and similar words used in the description and claims of the present application do not indicate any order, quantity or importance, but are only used to distinguish the naming of features .
  • “a” or “an” and the like do not denote a quantitative limitation, but rather denote the presence of at least one.
  • words such as “front”, “rear”, “left”, “right”, “upper”, “lower” and other similar words appearing in this application are only for the convenience of description, and are not limited to a specific position or a type of spatial orientation.
  • a sensor assembly 100 provided by the present application includes a pressure sensing unit 1, a temperature sensing unit 2, a circuit unit 4, a connector 5, a sealing assembly 6 and a housing 9; On one side of the sensing unit 1, the sealing component 6 is located on the other side of the pressure sensing unit 1.
  • the circuit unit 4 is located above the pressure sensing unit 1, and the sealing component 6 is located on the pressure sensing unit Below 1, both the temperature sensing unit 2 and the pressure sensing unit 1 are electrically connected to the circuit unit 4, the housing 9 and the connector 5 are fixedly connected and form an accommodating cavity 59, and the pressure sensing unit 1 and the circuit unit 4 are located in the accommodating cavity 59.
  • the sensor assembly 100 has a detection channel 101; the temperature sensing unit 2 includes a temperature sensing part 21, at least part of the temperature sensing part 21 is located in the detection channel 101, and the temperature sensing part 21 can convert the temperature in the detection channel 101 into an electrical signal,
  • the temperature sensing portion 21 may be a thermistor, and the type of the temperature sensing portion 21 in the present application is not limited to this;
  • the pressure sensing unit 1 includes a pressure sensing portion 20 and a body portion 10 , the body portion 10 may be a ceramic substrate, and the pressure sensing portion 20 is connected to the body part 10, the pressure sensing part 20 can convert the pressure in the detection channel 101 into an electrical signal,
  • the accommodating cavity 59 includes an electric control cavity 591, the circuit unit 4 is located in the electric control cavity 591, the electric control cavity 591 and the detection channel 101 Isolation;
  • the sealing component 6 is located between the housing 9 and the pressure sensing unit 1, the sealing component 6 includes a sealing portion 61, and the sealing portion 61 is pressed
  • the temperature sensing unit 2 further includes a conductive part 22 and a base 3, the conductive part 22 is electrically connected to the temperature sensing part 21 and the circuit unit 4, at least part of the conductive part 22 is connected with the base 3 by injection molding, and at least part of the sealing part 61 is located on the base. between the seat 3 and the pressure sensing unit 1.
  • the sealing assembly 6 includes a sealing part 62 and a metal skeleton 61 , the main material of the sealing part 62 is rubber material, the sealing part 62 is formed by injection molding with the metal skeleton 61 as an insert, the metal skeleton 61 In the shape of a circular ring, along the radial direction of the sealing assembly 6, the outer edge of the metal frame 61 is aligned with the outer edge of the sealing part 62.
  • the alignment described here may include a certain assembly error, and the assembly error may be within 1mm.
  • the sealing portion 62 protrudes from the surface of the metal frame 61 , so that the pressure sensing unit 1 can contact the metal frame 61 after compressing the sealing portion 62 , and the metal frame 61 presses the sealing portion 62 to the bottom wall of the housing 9 .
  • the sealing assembly 6 has a first through hole 63 , the temperature sensing portion 21 is electrically connected to the circuit unit 4 through the conductive portion 22 , the conductive portion 22 includes a first section 221 , and one end of the first section 221 passes through the first through hole 63 and is connected to the circuit unit 4.
  • the other end of the first segment 221 is formed with a first flange portion 23, and the outer diameter of the first flange portion 23 is larger than the diameter of the first through hole 63, so that the first flange portion 23 is formed between the sealing portion 62 and the conductive portion 22.
  • a labyrinth structure is formed between the segments 221 to improve sealing.
  • the conductive part 22 further includes a second segment 222 and a third segment 223 , the second segment 222 is located between the first segment 221 and the third segment 223 , and the second segment 222 is electrically connected to the first segment 221 and the third segment 223 .
  • the second section 222 is connected to the base 3 by injection molding, and the second section 222 is in elastic contact with the first section 221 and is electrically connected.
  • one end of the second section 222 is formed by bending or punching
  • the arc-shaped convex part 220 has a certain elasticity
  • the other end of the second section 222 is formed with a plane part 230
  • the first flange part 23 of the first section 221 and the arc-shaped convex part 220 are formed.
  • the third section 223 is welded and fixed with the plane part 230, a through hole can be formed in the plane part 230, the third section 223 is inserted into the through hole and then welded and fixed, and the plane part 230 extends into the inner cavity of the base 3 corresponding to In this way, the insertion end of the third section 223 can be straight, and the structure is simple.
  • part of the second segment 222 is injection-molded and fixed to the base 3 , the base 3 has a second flange portion 31 and a cylindrical portion 32 , and the outer edge of the second flange portion 31 is larger in size than the cylindrical portion 32 .
  • the second flange portion 31 protrudes from the cylindrical portion 32, the upper end surface of the second flange portion 31 is in contact with the lower end surface of the sealing assembly 6, and the lower end surface of the second flange portion 31 is in contact with the bottom wall of the housing 9. In contact, the upper end surface of the sealing assembly 6 abuts against the lower end surface of the pressure sensing unit 1 and is connected in a sealed manner.
  • the cylindrical portion 32 has a notch portion 321, the height of the notch portion 321 corresponds to the height of the temperature sensing portion 21, and the notch portion 321 communicates with the inner cavity of the base 3 or the detection channel 101, so that the working medium can enter the detection through the notch portion 321.
  • Channel 101 there are four notches 321 , which are evenly distributed along the circumferential direction of the cylinder part 31 ; Both the flat surface portion 230 is exposed on the upper end surface of the second flange portion 31 .
  • the cylindrical portion 32 forms part of the side wall of the detection channel 101 .
  • the housing 9 has a first step portion 91 and a second step portion 92, the first step portion 91 and the second step portion 92 are located on the bottom wall of the housing 9, the first step portion 91 has a first step surface 911, The second stepped portion 92 has a second stepped surface 922.
  • the first stepped surface 911 is closer to the pressure sensing unit 1 than the second stepped surface 922.
  • the lower end surface of the sealing portion 61 is sealed with the first stepped surface 911.
  • the first section 221 The first flange portion 23 and the first stepped surface 911 can abut to limit the position to prevent the first flange portion 23 from crushing the arc-shaped convex portion 220; the second stepped portion 92 has a mounting hole 923, and the second flange The second flange portion 32 is laterally limited by the side wall of the second stepped portion 92, the cylindrical portion 32 of the base 3 is located in the mounting hole 923, at least the notch portion 321 exposes the housing 9 setting.
  • the housing 9 also has a third stepped surface 93 , and the metal frame 61 abuts against the third stepped surface 93 , which can prevent the metal frame 62 from pressing the sealing portion 62 against excessive deformation or even crushing.
  • the connector 5 includes a pin 52 and a socket housing 51, the pin 52 is electrically connected to the circuit unit 4, the pin 52 can be electrically connected to the circuit unit 4 and the external power supply, and the pin 52 is connected to the connector.
  • the socket housing 51 is fixed by injection molding, and the outer shell 9 is fixedly connected to the socket housing 51.
  • the outer shell 9 and the socket housing 51 are fixedly connected by riveting, and the socket housing 51 includes a limiting portion 511.
  • the limiting portion 511 can abut on the upper end surface of the pressure sensing unit 1 .
  • the limiting portion 511 in order to prevent the sealing of the sensor assembly from being affected due to the deformation of the components due to temperature changes, the limiting portion 511 does not directly contact the circuit board where the circuit unit is located, and the limiting portion 511 avoids the circuit unit The circuit board where it is located is in contact with the pressure sensing unit 1, so that the limiting portion 511 can be a limiting column or an annular portion with a notch. Referring to FIG.
  • the limiting portion 511 is an annular portion with a notch, and the housing 9 is connected to the socket housing 51 is fixedly connected, the limiting portion 511 is in contact with the pressure sensing unit 1, the lower end surface of the pressure sensing unit 1 is in contact with the upper end of the sealing assembly 6, and the lower end surface of the sealing assembly 6 is in contact with the upper end surface of the second flange portion 31 And the first step surface 911 of the casing 9 is in contact, and the lower end face of the second flange portion 31 is in contact with the bottom wall of the casing 9, so that the casing 9 is fixedly connected with the socket housing 51, and the circuit unit 4 is sealed in the electronic control unit.
  • the solution of cavity 591 is easy to install. Compared with the solution that needs to install two sealing rings, because the present application has one sealing part, the structure is simple, the sealing part is integrally formed, the material is the same, the temperature consistency is better, and the sealing reliability is improved.
  • 11 to 13 show the second embodiment of the sensor assembly 100.
  • the main difference between the second embodiment and the first embodiment is that the first section 221 and the second section 222 of the conductive portion 22 are connected differently.
  • the first section 221 and the second section 222 of the conductive part are fixedly connected, which is a rigid connection, specifically welding; in this embodiment, the second section 222 is connected to the base 3 by injection molding, and the second section 222
  • One end has an extension part 224 exposing the base 3
  • the extension part 224 is formed with a first groove 225, the first groove 225 is a blind hole, and the end of the first section 221 extends into the first groove 225 to limit the axial position Or as a reference for assembly positioning and connect the first segment 221 and the second segment 222 by welding, the first segment 221 and the second segment 222 are electrically connected, the outer edge of the extension part 224 is larger than the diameter of the first through hole 63, and the extension part 224
  • the upper end surface of the extension part 224 is
  • the sealing assembly 6 does not include a metal frame, and the sealing portion has a first through hole 63,
  • the pressure sensing unit 1 has a second through hole 64, the first section 221 of the conductive part 22 passes through the first through hole 63 of the sealing part and the second through hole 64 of the pressure sensing unit is mechanically connected to the circuit unit 4 and can be electrically connected.
  • the upper end surface of the first flange part 23 of the first segment 221 is in contact with the lower end surface of the sealing part 61, the lower end surface of the first flange part 23 is connected to the base 3 in a limited position, and the second segment 222 includes a vertical The segment 226, the vertical segment 226 abuts against and is electrically connected to the first flange portion 23, the pressure sensing unit of this embodiment can also be used for the sensor assembly 100 of the first embodiment. Compared with the first embodiment, the metal frame is saved, which is beneficial to further reduce the cost.
  • the base 3 further includes a limit ring 33 , the upper end surface of the limit ring 33 has a gap with the lower end surface of the pressure sensing unit 1 , the sealing portion 61 is annular, and the sealing portion 61 is located between the limit ring 33 and the outer casing. 9 between the side walls.
  • the pressure sensing unit 1 includes a body portion 10 and a pressure sensing portion 20 , the pressure sensing portion 20 is fixedly connected to the body portion 10 , and the limiting portion abuts the upper end of the body portion.
  • the pressure sensing unit 1 may be a ceramic capacitive sensor.
  • the pressure sensing unit 1 includes a body portion 10 and a pressure sensing portion 20 , and the body portion 10 includes a first end portion 11 and a pressure sensing portion 20 . It includes a second end portion 12, the first end portion 11 and the second end portion 12 are located on opposite sides of the pressure sensing unit 1 in the thickness direction, and the circuit unit 4 is located above the first end portion 11.
  • the circuit unit 4 is located on the circuit board, the circuit board is located above the first end portion 11 , and the pressure sensing portion is located at the second end portion 12 .
  • the second end portion 12 includes a first area 121 and a second area 122 , the first area 121 is a pressure sensitive area, and the second area 122 is surrounded by the outer edge of the first area 121 .
  • the first region 121 is exposed to the detection channel for converting the fluid pressure signal into an electrical signal.
  • the body portion 10 has a second groove 113 extending along the thickness direction of the pressure sensing unit 1.
  • the second groove 1113 corresponds to the first area 121.
  • the pressure sensing unit 1 further includes a conductive needle, and one end of the conductive needle is located in the second groove. In 113, the conductive needle corresponds to the first area 121, and converts the pressure signal in the detection channel into an electrical signal.
  • the pressure sensing unit 1 further includes a conductive column 14, and the conductive column 14 is electrically connected to the first area 121 and the circuit unit 4. It is used to transmit the electrical signal of the first region 121 to the circuit unit 4 .
  • the pressure sensing unit 1 has the second through hole 64 , the first section 221 of the conductive portion 22 passes through the first through hole 63 of the sealing assembly and the pressure sensing unit
  • the second through hole 64 is mechanically and electrically connected to the circuit unit 4, the upper end face of the first flange portion of the first segment 221 abuts and seals with the lower end face of the sealing portion, the pressure sensing unit 1 of this embodiment It can also be used in the sensor assembly 100 of the first embodiment. Referring to FIG. 4 , the lower end surface of the first flange portion 23 of the first segment 221 can elastically abut and electrically connect with the arc-shaped convex portion 220 .
  • the pressure sensing unit of this embodiment can also be used in the sensor assembly 100 of the second embodiment.
  • the second section 222 is connected to the base 3 by injection molding, and the second section 222 is connected to the base 3 by injection molding.
  • One end of 222 has an extension part 224 exposing the base, the extension part 224 is formed with a first groove 225, the first groove 225 is a blind hole, and the end of the first section 221 extends into the first groove 225 to limit the axial position Or as a reference for assembly and positioning and connect the first segment 221 and the second segment 222 by welding, the first segment 221 and the second segment 222 are electrically connected, and the outer edge of the extension part 224 is larger than the diameter of the first through hole 63, so that the extension part The first through hole 63 can be covered, the upper end surface of the extension part 224 is in sealing contact with the sealing part 61 , and the lower end surface of the extension part 224 is fixed to the base 3 by injection molding.
  • the pressure sensing unit 1 is a MEMS (Micro Electro Mechanical System) pressure sensor, which is divided into two types: piezoresistive type and capacitive type, which are manufactured on the basis of bulk micromachining technology and sacrificial layer technology respectively; pressure sensing part 20 A single chip that integrates sensitive components with signal processing, calibration, compensation, and microcontrollers.
  • MEMS Micro Electro Mechanical System
  • the pressure sensing unit 1 includes a first end 11 and a second end 12 , the first end 11 and the second end 12 are located on opposite sides of the pressure sensing unit 1 in the thickness direction, and the circuit unit 4 is located at the first end 11 , as shown in FIG. 19 , the body portion 10 is formed with a third through hole 65 , and the pressure sensing portion 20 is located on one side of the first end portion 11 . fluid pressure.
  • the pressure sensor can be used in the sensor assembly 100 of the third embodiment.
  • the pressure sensing unit 1 has a second through hole 64 , and the first section 221 of the conductive portion passes through the first through hole 63 of the sealing assembly and the pressure sensing unit.
  • the second through hole 64 is mechanically and electrically connected to the circuit unit 4 , the upper end face of the first flange portion of the first segment abuts and seals with the lower end face of the sealing portion, and the detection channel 101 communicates with the third through hole 65 , the sensing film of the pressure sensing portion 20 is exposed to the third through hole 65 ; of course, the pressure sensing unit 1 can also be used in the first and second embodiments.
  • the base 3 is formed by using the second section 222 of the conductive portion as an injection-molded insert through an injection molding process, so as to seal and fix the second section 222 in the base 3 .
  • FIG. 20 shows the fourth embodiment of the sensor assembly.
  • the conductive portion 22 of the temperature sensing portion further includes an elastic portion 227, and the first section 221 passes through the elastic portion.
  • 227 is electrically connected to the circuit unit 4.
  • the elastic portion 227 is a spring
  • the circuit unit 4 is printed on the circuit board 41
  • the elastic portion 227 abuts between the circuit board 41 and the first section 221.
  • the circuit board 41 is provided with Pad, the first section 221 is provided with a stepped portion 2211, the elastic portion 227 is in contact with the pad and the stepped portion 2211, and the elastic portion 227 is in a compressed state between the pad and the stepped portion; One of the stepped portions is welded and abutted with the other.
  • the second segment 222 is fixedly connected to the first segment 221 , and the lower end of the first flange portion 23 of the first segment 221 is fixed by welding or crimping to the upper end surface of the second portion.
  • the main body 10 of the pressure sensing unit 1 is a ceramic base, the ceramic base has a second through hole 64, and the elastic part 227 is in the second through hole 64, which is beneficial to increase the guiding stability of the elastic part.
  • the sensor assembly 100 includes a housing 9, a temperature sensing unit 2, a pressure sensing unit 1 and a circuit unit 4, and the temperature sensing unit 2 and the pressure sensing unit 1 are electrically connected to the circuit unit 4,
  • the temperature sensing unit 2 includes a temperature sensing part 21
  • the pressure sensing unit 1 includes a pressure sensing part 11 and a body part 10
  • the body part 10 is a ceramic substrate
  • the temperature sensing part is The pressure sensing part 21 can convert the temperature in the detection channel 101 into an electrical signal
  • the pressure sensing part 11 can convert the pressure in the detection channel 101 into an electrical signal
  • the pressure sensing unit 1 further includes a metal layer 228, and the metal layer 228 is sealed with the ceramic substrate Connection
  • the pressure sensing part 11 is connected to the ceramic base at the limit
  • the circuit unit 4 is formed on the ceramic base
  • the conductive part 22 of the temperature sensing unit 2 is electrically connected to the temperature sensing part 21 and the circuit unit 4, and the conducting part 22 is
  • the pressure sensing unit in this embodiment is a MEMS pressure sensor.
  • the pressure sensing portion 11 includes a MEMS sensing portion 111 and a transmission portion 112.
  • the MEMS sensing portion 111 is electrically connected to the circuit unit 4 through the transmission portion 112.
  • the ceramic substrate and the metal layer 228 have a first Two through holes 64, one end of the first section 221 passes through the second tube through hole 64 and is electrically connected to the circuit unit 4, the other end of the first section 221 has a first flange portion 23, and the first flange portion 23 has a
  • the outer diameter is larger than the diameter of the second through hole 64 , the upper end surface of the first flange portion 23 can cover the second through hole 64 and is welded and fixed with the metal layer 228 , and the lower end surface of the first flange portion 23 is electrically connected to the second section 222 .
  • the sensor assembly 100 can be installed on a component having a flow channel, and the component can be an electronic expansion valve, which is used for refrigerant flow control in a vehicle air conditioning system to realize throttling of the refrigerant.
  • the sensor assembly 100 can be used as an integrated temperature and pressure sensor to detect the pressure and temperature of the refrigerant passing through the flow channel.
  • the components can also be four-way valves, heat exchangers, fluid pipeline thermal management system components, etc., which can realize the measurement of the pressure and temperature of the refrigerant in the thermal management system components. The points that are the same as those of the third embodiment will not be repeated here.
  • a valve device includes a valve body part and a sensor assembly 100, the sensor assembly 100 is fixedly mounted on the valve body part, the valve body part includes a flow channel, a detection channel 101 of the sensor assembly 100 communicates with the flow channel, and the pressure sensing unit 1 can To detect the pressure of the fluid in the flow channel, the temperature sensing unit 2 can detect the temperature of the fluid in the flow channel.

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Abstract

一种传感器组件和阀装置，包括温度传感单元、压力传感单元、电路单元、外壳以及接插件，外壳与所述接插壳体固定连接，压力传感单元和电路单元限位于外壳的底壁和接插壳体之间，这样有利于简化结构，降低生产成本。

Description

传感器组件以及阀装置
本申请要求于2020年12月15日提交中国专利局、申请号为202011478788.9、发明名称为“传感器组件以及阀装置”，以及于2020年12月29日提交中国专利局、申请号为202011589518.5、发明名称为“传感器组件以及阀装置”的两件中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及检测技术领域，具体而言，涉及一种传感器组件以及应用该传感器组件的阀装置。
背景技术
如图24所示，相关技术中的传感器组件100包括压力传感器元件130、电子电路板120和温度传感器元件170。传感器组件100通过开口式液密通道的入口开口部175传送流体到感测压力的压力传感器元件130的表面，以及通过封闭式的液密通道使温度传感器170和导线160与流体隔离。导线160在细长的管状元件165内延伸并从侧方穿过基座的孔连接至电子电路板120。
该结构的传感器组件的零部件较多，组装工艺复杂，生产成本高。
发明内容
本申请的目的在于提供一种结构简单，有利于降低生产成本的传感器组件和阀装置。
为实现上述目的，本申请采用如下技术方案：一种传感器组件，包括外壳、温度传感单元、压力传感单元以及电路单元，所述温度传感单元包括感温部，所述压力传感单元包括压力感应部，所述传感器组件具有检测通道，所述感温部位于所述检测通道内，所述感温部能够将所述检测通道内的温度转换为电信号，所述压力感应部能够将所述检测通道内的压力转 换为电信号；所述温度传感单元还包括导电部，所述导电部电连接所述感温部与所述电路单元，所述传感器组件还包括接插件，所述接插件包括插针和接插壳体，所述插针与所述电路单元电连接，所述外壳与所述接插壳体固定连接,所述压力传感单元限位于所述外壳的底壁和所述接插壳体之间，所述接插壳体包括限位部，所述限位部能够与所述压力传感单元的上端面抵接。
本申请还公开了一种阀装置，包括阀体和传感器组件，所述阀体具有流体通道，所述检测通道与所述流体通道连通，所述传感器组件为以上所述的传感器组件。
本申请的传感器组件和阀装置，该传感器组件包括压力传感单元、温度传感单元、电路单元以及接插件，外壳与接插壳体固定连接，压力传感单元和电路单元限位于外壳的底壁和接插壳体之间，这样有利于减少零部件数量，简化结构，降低生产成本。
附图说明
图1是本申请第一种实施方式的传感器组件的立体结构示意图；
图2是图1的传感器组件的一种分解结构示意图；
图3是图1的传感器组件的一个正视结构示意图；
图4是图3中的A-A剖视结构示意图；
图5是图2中密封组件和第一段组合件的一个视角的立体结构示意图；
图6是图2中密封组件和第一段组合件的另一个视角的立体结构示意图；
图7是图5的俯视结构示意图；
图8是图7中的A-A剖视结构示意图；
图9是图2中基座和第二段的组合件的一个视角的立体结构示意图；
图10是图2中接插件的一个立体结构示意图；
图11是本申请第二种实施方式的传感器组件的剖视结构示意图；
图12是图11中基座的一个视角的立体结构示意图；
图13是图11中基座的一个局部结构放大示意图；
图14是本申请的压力传感单元的第一种实施方式的剖视结构示意图；
图15是本申请第三种实施方式的传感器组件的剖视结构示意图；
图16是图15中基座的一个视角的立体结构示意图；
图17是图16中基座的仰视结构示意图；
图18是图17中的A-A剖视结构示意图；
图19是本申请的压力传感单元的第二种实施方式的剖视结构示意图；
图20是本申请第四种实施方式的传感器组件的剖视结构示意图；
图21是本申请第五种实施方式的传感器组件的分解结构示意图；
图22是本申请第五种实施方式的传感器组件的一个剖视结构示意图；
图23是图22中的B部局部放大结构示意图；
图24是现有技术的传感器组件的一个实施方式结构示意图。
具体实施方式
下面结合附图和具体实施例对本发明作进一步说明：
应当理解，本申请的说明书以及权利要求书中所使用的，例如“第一”、“第二”以及类似的词语，并不表示任何顺序、数量或者重要性，而只是用来区分特征的命名。同样，“一个”或者“一”等类似词语也不表示数量限制，而是表示存在至少一个。除非另行指出，本申请中出现的“前”、“后”、“左”、“右”、“上”、“下”等类似词语只是为了便于说明，而并非限于某一特定位置或者一种空间定向。“包括”或者“包含”等类似词语是一种开放式的表述方式，意指出现在“包括”或者“包含”前面的元件涵盖出现在“包括”或者“包含”后面的元件及其等同物，这并不排除出现在“包括”或者“包含”前面的元件还可以包含其他元件。本申请中如果出现“若干”，其含义是指两个以及两个以上。
参阅图1至图16，本申请提供的一种传感器组件100，包括压力传感单元1、温度传感单元2、电路单元4、接插件5、密封组件6以及外壳9；电路单元4位于压力传感单元1的一侧，密封组件6位于压力传感单元1 的另一侧，在图1至图10中，电路单元4位于压力传感单元1的上方，密封组件6位于压力传感单元1的下方，温度传感单元2和压力传感单元1均与电路单元4电性连接，外壳9和接插件5固定连接并形成容纳腔59，压力传感单元1和电路单元4位于容纳腔59，传感器组件100具有检测通道101；温度传感单元2包括感温部21，至少部分感温部21位于检测通道101内，感温部21能够将检测通道101内的温度转换为电信号，感温部21可以为热敏电阻，本申请的温感部21类型不以此为限；压力传感单元1包括压力感应部20和本体部10，本体部10可以为陶瓷基体，压力感应部20与本体部10连接，压力感应部20能够将检测通道101内的压力转换为电信号，容纳腔59包括电控腔591，电路单元4位于电控腔591，电控腔591与检测通道101隔离；本实施例中，密封组件6位于外壳9和压力传感单元1之间，密封组件6包括密封部61，密封部61被压紧于压力传感单元1和外壳9之间，密封部61与压力传感单元1密封接触，密封部61与外壳9密封接触，使得检测通道101的工作介质不能进入电控腔591，通过一个密封组件实现电路单元所在空间的密封，使得电路单元不会接触到被测工作介质，保证密封性能可靠的同时结构简单。
温度传感单元2包括还包括导电部22和基座3，导电部22电性连接感温部21与电路单元4，至少部分导电部22与基座3注塑连接，至少部分密封部61位于基座3和压力传感单元1之间。
参见图5至图8，本实施例中，密封组件6包括密封部62和金属骨架61，密封部62的主要材料为橡胶材料，密封部62以金属骨架61为嵌件注塑形成，金属骨架61呈圆环状，沿密封组件6的径向，金属骨架61的外缘与密封部62的外缘对齐，这里所述的对齐可以包括一定的装配误差，装配误差可以在1mm以内，沿密封组件6的高度方向，密封部62凸出金属骨架61表面设置，这样，压力传感单元1压缩密封部62后能够与金属骨架61接触，金属骨架61将密封部62压向外壳9的底壁。
密封组件6具有第一贯穿孔63，感温部21通过导电部22与电路单元4电连接，导电部22包括第一段221，第一段221的一端穿过第一贯穿孔63与电路单元4电连接，第一段221的另一端形成有第一凸缘部23，第一 凸缘部23的外径大于第一贯穿孔63的孔径，这样在密封部62和导电部22的第一段221之间形成迷宫结构，提高密封性。
导电部22还包括第二段222和第三段223，第二段222位于第一段221和第三段223之间，第二段222电连接第一段221和第三段223。本实施例中，第二段222与基座3注塑连接，第二段222与第一段221弹性接触并电连接，本实施例中，在第二段222的一末端通过折弯或冲压形成有弧形凸起部220，弧形凸起部220具有一定的弹性，第二段222的另一端形成有平面部230，第一段221的第一凸缘部23与弧形凸起部220抵接并电连接，第三段223与平面部230焊接固定，可以在平面部230形成通孔，第三段223插入通孔后焊接固定，平面部230伸入基座3的内腔对应的区域，这样第三段223的插入端可以呈平直状，结构简单，第三段223与感温部21固定连接，在第三段223的一末端连接感温部21。
结合图4和图9，部分第二段222与基座3注塑固定，基座3具有第二凸缘部31和筒部32，第二凸缘部31的外缘尺寸大于筒部32的外缘尺寸，第二凸缘部31凸出筒部32设置，第二凸缘部31的上端面与密封组件6的下端面抵接，第二凸缘部31的下端面与外壳9的底壁接触，密封组件6的上端面与压力传感单元1的下端面抵接并密封连接。筒部32具有缺口部321，缺口部321的高度与感温部21的高度对应，缺口部321与基座3的内腔或者说检测通道101连通，以使得工作介质能够通过缺口部321进入检测通道101。本实施例中，缺口部321为四个，沿筒部31的周向均匀分布；弧形凸起部220和平面部230均凸出第二凸缘部31的上端面，弧形凸起部220和平面部230均露出于第二凸缘部31的上端面。筒部32形成部分检测通道101的侧壁。
结合参阅图4，外壳9具有第一台阶部91和第二台阶部92，第一台阶部91和第二台阶部92位于外壳9的底壁，第一台阶部91具有第一台阶面911，第二台阶部92具有第二台阶面922，第一台阶面911比第二台阶面922更加靠近压力传感单元1，密封部61的下端面与第一台阶面911密封连接，第一段221的第一凸缘部23与第一台阶面911可以抵接限位，防止第一凸缘部23将弧形凸起部220压溃；第二台阶部92具有安装孔923， 第二凸缘部31与第二台阶面922抵接轴向限位，第二凸缘部32通过第二台阶部92的侧壁横向限位，基座3的筒部32位于安装孔923内，至少缺口部321露出外壳9设置。本实施例中，外壳9还具有第三台阶面93，金属骨架61与第三台阶面93抵接，能够防止金属骨架62将密封部62压紧的变形量过大，甚至压溃。
结合参阅图4和图10，接插件5包括插针52和接插壳体51，插针52与电路单元4电连接，插针52能够电连接电路单元4与外部电源，插针52与接插壳体51注塑固定，外壳9与接插壳体51固定连接，本实施方式中，外壳9与接插壳体51通过铆接固定连接，接插壳体51包括限位部511，限位部511能够与压力传感单元1的上端面抵接。在一种实施方式中，为了防止传感器组件由于温度变化零部件产生形变的原因导致密封性受影响，限位部511不与电路单元所在的电路板直接抵接，限位部511避开电路单元所在的电路板与压力传感单元1抵接，这样限位部511可以为限位柱或者环形部具有缺口，参阅图10，限位部511为环形部具有缺口，外壳9与接插壳体51固定连接，限位部511与压力传感单元1抵接，压力传感单元1的下端面与密封组件6的上端抵接，密封组件6的下端面与第二凸缘部31的上端面以及外壳9的第一台阶面911抵接，第二凸缘部31的下端面与外壳9的底壁接触，这样通过外壳9与接插壳体51固定连接，将电路单元4密封于电控腔591的方案，安装方便，相对于需要安装两个密封圈的方案，由于本申请一个密封部，结构简单，密封部一体成型，材料相同，温度一致性较好，密封可靠性提高。
图11-图13为传感器组件100的第二种实施方式，第二种实施方式与第一种实施方式的主要区别在于：导电部22的第一段221和第二段222的连接方式不同，本实施例中，导电部的第一段221和第二段222固定连接，为刚性连接，具体可以为焊接；在该实施方式中，第二段222与基座3注塑连接，第二段222的一端具有露出基座3的延伸部224，延伸部224形成有第一凹槽225，第一凹槽225为盲孔，第一段221的末端伸入第一凹槽225内轴向限位或作为组装定位的基准并通过焊接连接第一段221和第二段222，第一段221和第二段222电连接，延伸部224的外缘大于第 一贯穿孔63的孔径，延伸部224的上端面与密封部61密封接触，延伸部224的下端面与基座3注塑固定。
图15-图18为传感器组件100的第三种实施方式，与第一种实施方式的主要区别点在于：本实施方式中，密封组件6不包括金属骨架，密封部具有第一贯穿孔63，压力传感单元1具有第二贯穿孔64，导电部22的第一段221穿过密封部的第一贯穿孔63和压力传感单元的第二贯穿孔64与电路单元4机械连接并可以电连接，第一段221的第一凸缘部23的上端面与密封部61的下端面抵接，第一凸缘部23的下端面与基座3限位连接，第二段222包括竖直段226，竖直段226与第一凸缘部23抵接并电连接，该实施方式的压力传感单元也可以用于第一种实施方式的传感器组件100。与第一种实施方式相比较，节省了金属骨架，有利于进一步降低成本。本实施例中，基座3还包括限位环33，限位环33的上端面与压力传感单元1的下端面具有间隙，密封部61呈环形，密封部61位于限位环33和外壳9的侧壁之间。
参阅图14和图19，压力传感单元1包括本体部10和压力感应部20，压力感应部20与本体部10固定连接，限位部与本体部的上端部抵接。
在图14中，压力传感单元1可以为陶瓷电容传感器，该实施例中，压力传感单元1包括本体部10和压力感应部20，本体部10包括第一端部11，压力感应部20包括第二端部12，第一端部11与第二端部12位于压力传感单元1厚度方向的相反两侧，电路单元4位于第一端部11的上方，本实施例中，电路单元4位于电路板，电路板位于第一端部11的上方，压力感应部位于第二端部12。第二端部12包括第一区121与第二区122，第一区121为压力感应敏感区，第二区122围设在第一区121的外沿。第一区121暴露于检测通道中，用于将流体压力信号转化为电信号。本体部10具有沿压力传感单元1厚度方向延伸的第二凹槽113，第二凹槽1113与第一区121对应，压力感应单元1还包括导电针，导电针的一端位于第二凹槽113内，导电针与第一区121对应，将检测通道内的压力信号转换为电信号，压力传感单元1还包括导电柱14，导电柱14电性连接第一区121与电路单元4，用于将第一区121的电信号传递至电路单元4。
以上压力传感器可以用于在图15中的实施方式中，压力传感单元1具有第二贯穿孔64，导电部22的第一段221穿过密封组件的第一贯穿孔63和压力传感单元的第二贯穿孔64与电路单元4机械连接并可以电连接，第一段221的第一凸缘部的上端面与密封部的下端面抵接并密封，该实施方式的压力传感单元1也可以用于第一种实施方式的传感器组件100，结合图4，第一段221的第一凸缘部23的下端面可以与弧形凸起部220弹性抵接并电连接。当然，该实施方式的压力传感单元也可以用于第二种实施方式的传感器组件100，结合图11至图13，该实施方式中，第二段222与基座3注塑连接，第二段222的一端具有露出基座的延伸部224，延伸部224形成有第一凹槽225，第一凹槽225为盲孔，第一段221的末端伸入第一凹槽225内轴向限位或作为组装定位的基准并通过焊接连接第一段221和第二段222，第一段221和第二段222电连接，延伸部224的外缘大于第一贯穿孔63的孔径，使得延伸部可以覆盖第一贯穿孔63，延伸部224的上端面与密封部61密封接触，延伸部224的下端面与基座3注塑固定。在图19中，压力传感单元1为MEMS(微机电系统)压力传感器，分为压阻式和电容式两类，分别以体微机械加工技术和牺牲层技术为基础制造；压力感应部20为敏感元件与信号处理、校准、补偿、微控制器集成的单芯片。
压力传感单元1包括第一端部11与第二端部12，第一端部11与第二端部12位于压力传感单元1厚度方向的相反两侧，电路单元4位于第一端部11的上方，如图19所示，本体部10形成有第三贯穿孔65，压力感应部20位于第一端部11的一侧，通过第三贯穿孔65压力感应部能够检测检测通道内的流体的压力。该压力传感器可以用于第三种实施方式的传感器组件100，压力传感单元1具有第二贯穿孔64，导电部的第一段221穿过密封组件的第一贯穿孔63和压力传感单元的第二贯穿孔64与电路单元4机械连接并可以电连接，第一段的第一凸缘部的上端面与密封部的下端面抵接并密封，检测通道101与第三贯穿孔65连通，压力感应部20的感应膜露于第三贯穿孔65；当然该压力感应单元1也可用于第一种和第二种实施方式。基座3以导电部的第二段222为注塑嵌件通过注塑包胶工艺(inert  molding)成型，以实现将第二段222密封固定于基座3内。
图20为传感器组件的第四种实施方式，与第三种实施方式的主要区别点在于：本实施例中，温度传感部的导电部22还包括弹性部227，第一段221通过弹性部227与电路单元4电连接，本实施例中，弹性部227为弹簧，电路单元4印刷于电路板41，弹性部227抵接于电路板41和第一段221之间，电路板41设置有焊盘，第一段221设置有台阶部2211，弹性部227与焊盘和台阶部2211抵接，弹性部227在焊盘和台阶部之间处于压缩状态；当然弹性部也可以与焊盘或台阶部之一焊接，与另一抵接。第二段222与第一段221固定连接，第一段221的第一凸缘部23的下端与第二部的上端面焊接固定或压接固定。压力感应单元1的本体部10为陶瓷基体，陶瓷基体具有第二贯穿孔64，弹性部位227于第二贯穿孔64内，这样有利于增加弹性部的导向稳定性。
图21-图23为传感器组件的第五种实施方式结构示意图；本实施例中，传感器组件100，包括外壳9、温度传感单元2、压力传感单元1以及电路单元4，温度传感单元2和压力传感单元1均与电路单元4电连接，温度传感单元2包括感温部21，压力传感单元1包括压力感应部11和本体部10，本体部10为陶瓷基体，感温部21能够将检测通道101内的温度转换为电信号，压力感应部11能够将检测通道101内的压力转换为电信号，压力传感单元1还包括金属层228，金属层228与陶瓷基体密封连接，压力感应部11与陶瓷基体限位连接，电路单元4成形于陶瓷基体，温度传感单元2的导电部22电连接感温部21与电路单元4，导电部22与金属层228焊接固定；直接利用陶瓷基体成形电路单元，不需要单独设置电路板。
本实施例中的压力感应单元为MEMS压力传感器，压力感应部11包括MEMS感应部111和传输部112，MEMS感应部111通过传输部112与电路单元4电连接，陶瓷基体和金属层228具有第二贯穿孔64，第一段221的一端穿过第二管穿孔64并与所述电路单元4电连接，第一段221的另一端具有第一凸缘部23，第一凸缘部23的外径大于第二贯穿孔64的孔径，第一凸缘部23的上端面能够覆盖第二贯穿孔64并与金属层228焊接固定，第一凸缘部23的下端面与第二段222电连接。传感器组件100可以安装在 具有流道的部件上，部件可以是电子膨胀阀，用于车辆空调系统中的制冷剂流量控制，实现对制冷剂的节流。传感器组件100作为温度压力一体传感器，可以用于检测经过流道内的制冷剂的压力和温度。当然，部件也可以是四通阀、换热器、流体管路热管理系统部件等，可以实现对热管理系统部件内制冷剂的压力和温度进行测量。与第三种实施方式相同的地方，在此不再赘述。
一种阀装置，其包括阀体部和传感器组件100，传感器组件100固定安装于阀体部，阀体部包括流道，传感器组件100的检测通道101与流道连通，压力传感单元1能够检测流道内流体的压力，温度传感单元2能够检测流道内流体的温度。
需要说明的是：以上实施例仅用于说明本发明而并非限制本发明所描述的技术方案，尽管本说明书参照上述的实施例对本发明已进行了详细的说明，但是，本领域的普通技术人员应当理解，所属技术领域的技术人员仍然可以对本发明进行修改或者等同替换，而一切不脱离本发明的精神和范围的技术方案及其改进，均应涵盖在本发明的权利要求范围内。

Claims (13)

  1. 一种传感器组件，包括外壳、温度传感单元、压力传感单元以及电路单元，所述温度传感单元包括感温部，所述压力传感单元包括压力感应部，所述传感器组件具有检测通道，所述感温部位于所述检测通道内，所述感温部能够将所述检测通道内的温度转换为电信号，所述压力感应部能够将所述检测通道内的压力转换为电信号；其特征在于：所述温度传感单元还包括导电部，所述导电部电连接所述感温部与所述电路单元，所述传感器组件还包括接插件，所述接插件包括插针和接插壳体，所述插针与所述电路单元电连接，所述外壳与所述接插壳体固定连接,所述压力传感单元限位于所述外壳的底壁和所述接插壳体之间，所述接插壳体包括限位部，所述限位部能够与所述压力传感单元的上端面抵接。
  2. 根据权利要求1所述的传感器组件，其特征在于：所述传感器组件还包括密封组件，所述密封组件位于所述外壳和所述压力传感单元之间；所述密封组件包括密封部，所述密封部被压紧于所述压力传感单元和所述外壳之间，所述密封部与所述压力传感单元密封接触，所述密封部与所述外壳密封接触。
  3. 根据权利要求2所述的传感器组件，其特征在于：所述温度传感单元还包括基座，所述基座与所述外壳限位连接，所述感温部位于所述基座形成的内腔，所述检测通道包括所述基座形成的内腔，所述导电部包括第一段、第二段以及第三段，所述第一段直接与所述电路单元连接，所述第二段与所述基座注塑连接，所述第二段与所述第一段接触并电连接，所述第三段与所述感温部固定连接，所述第三段与所述第二段焊接固定；所述 外壳与所述接插壳体铆接固定。
  4. 根据权利要求3所述的传感器组件，其特征在于：所述密封组件具有第一贯穿孔，所述压力传感单元具有第二贯穿孔，所述导电部的第一段的一端穿过所述第一贯穿孔和所述第二贯穿孔与所述电路单元电连接，所述第一段的另一端形成有第一凸缘部，所述第一凸缘部的外径大于所述第一贯穿孔的孔径，所述第一凸缘能够覆盖所述第一贯穿孔。
  5. 根据权利要求2-4任一项所述的传感器组件，其特征在于：所述密封组件还包括金属骨架，所述密封部以所述金属骨架为嵌件注塑形成，所述金属骨架呈圆环状，沿所述密封组件的径向，所述金属骨架的外缘与所述密封部的外缘对齐，沿所述密封组件的高度方向，所述密封部凸出所述金属骨架表面设置，部分所述压力传感单元压缩所述密封部后与所述金属骨架接触，所述金属骨架将所述密封部压向所述外壳的底壁。
  6. 根据权利要求2-4所述的传感器组件，其特征在于：所述压力传感单元的上端面与所述接插壳体抵接，所述压力传感单元的下端面压缩所述密封部后与所述外壳抵接，所述密封部的上端面与所述压力传感单元的下端面抵接并密封连接，所述密封部的下端面与所述外壳密封连接。
  7. 根据权利要求5或6所述的传感器组件，其特征在于：所述密封部的主要材料为橡胶材料，所述密封组件具有第一贯穿孔，所述温度传感单元包括导电部，所述感温部通过所述导电部与所述电路单元电连接，所述导电部包括第一段，所述第一段的一端穿过所述第一贯穿孔与所述电路单元电连接，所述第一段的另一端形成有第一凸缘部，所述第一凸缘部的外径大于所述第一贯穿孔的孔径。
  8. 根据权利要求5所述的传感器组件，其特征在于：所述接插壳体包括限位部，所述限位部能够与所述压力传感单元的上端面抵接，所述外壳与所述接插壳体铆接固定，所述基座具有第二凸缘部，所述第二凸缘部的上端面与所述密封组件的下端面抵接，所述第二凸缘部的下端面与所述外壳的底壁接触，所述密封组件的上端面与所述压力传感单元的下端面抵接。
  9. 根据权利要求5所述的传感器组件，其特征在于：所述接插壳体包括限位部，所述传感器组件包括电路板，所诉电路单元印刷于所述电路板，所述限位部能够与所述电路板的上端面抵接，所述压力传感单元包括本体部，所述压力感应部与所述本体部固定连接，所述电路单元的下端面与所述本体部的上端面抵接，所述外壳与所述接插壳体铆接固定，所述基座具有第二凸缘部，所述第二凸缘部的上端面与所述密封组件的下端面抵接，所述第二凸缘部的下端面与所述外壳的底壁接触，所述密封组件的上端面与所述本体部的下端面抵接。
  10. 根据权利要求1所述的传感器组件，其特征在于：所述压力传感单元还包括本体部，所述本体部与所述压力感应部固定连接，所述本体部包括陶瓷基体和金属层，所述金属层与所述陶瓷基体密封连接，所述压力感应部与所述陶瓷基体限位连接，所述电路单元成形于所述陶瓷基体，所述导电部与所述金属层焊接固定。
  11. 根据权利要求10所述的传感器组件，其特征在于：所述压力传感单元为MEMS压力传感单元，所述压力感应部包括MEMS感应部和传输部，所述MEMS感应部通过所述传输部与所述电路单元电连接，所述导电部包括第一段和第二段，所述陶瓷基体和金属层具有贯穿孔，所述第一段 的一端穿过所述贯穿孔并与所述电路单元电连接，所述第一段的另一端具有第一凸缘部，所述第一凸缘部的外径大于所述贯穿孔的孔径，所述第一凸缘部的上端面能够覆盖所述贯穿孔并与所述金属层焊接固定，所述第一凸缘部的下端面与所述第二段电连接。
  12. 根据权利要求11所述的传感器组件，其特征在于：所述基座还包括限位环，所述限位环的上端面与所述压力传感单元的下端面具有间隙，所述密封部呈环形，所述密封部位于所述限位环和所述外壳的侧壁之间。
  13. 根据权利要求3所述的传感器组件，其特征在于：所述外壳具有第一台阶部和第二台阶部，所述第一台阶部和所述第二台阶部位于所述外壳的底壁，所述第一台阶部具有第一台阶面，所述第二台阶部具有第二台阶面，所述第一台阶面比所述第二台阶面更加靠近所述压力传感单元，所述密封部的下端面与所述第一台阶面密封连接，所述第二台阶部具有安装孔，所述第二凸缘部与所述第二台阶面抵接，所述第二凸缘部通过所述第二台阶部的侧壁限位，部分所述基座位于所述安装孔内。
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