WO2024071989A1 - Dispositif électronique incluant un capteur d'empreintes digitales - Google Patents

Dispositif électronique incluant un capteur d'empreintes digitales Download PDF

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Publication number
WO2024071989A1
WO2024071989A1 PCT/KR2023/014813 KR2023014813W WO2024071989A1 WO 2024071989 A1 WO2024071989 A1 WO 2024071989A1 KR 2023014813 W KR2023014813 W KR 2023014813W WO 2024071989 A1 WO2024071989 A1 WO 2024071989A1
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WIPO (PCT)
Prior art keywords
circuit board
printed circuit
cap
electronic device
cap printed
Prior art date
Application number
PCT/KR2023/014813
Other languages
English (en)
Korean (ko)
Inventor
김용운
박은수
오현철
최만기
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority claimed from KR1020220151208A external-priority patent/KR20240044291A/ko
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2024071989A1 publication Critical patent/WO2024071989A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • One embodiment of the present invention relates to an electronic device including a fingerprint sensor.
  • the electronic device may include at least one display and one or more input buttons (eg, a home button).
  • the input button may include, as part of the input button, a biometric sensor (eg, fingerprint sensor) for recognizing the user's biometric information (eg, fingerprint information).
  • Sensors have a structure in which the sensing area is exposed to the outside, and various methods such as ultrasonic method, cap method, and optical method can be used.
  • the laminated part located on the upper part of the fingerprint sensor is minimized to reduce acoustic impedance and modulus difference.
  • a structure may be needed.
  • an electronic device further including an EMR sensor (e.g., digitizer) panel for the above-mentioned minimized structure, an opening is formed in a portion of the EMR sensor (e.g., digitizer) panel, and a fingerprint sensor is attached to the display through the opening (open hole). It can be mounted as is.
  • EMR sensor e.g., digitizer
  • An electronic device includes a display; A digitizer located on the back of the display and including an opening, a fingerprint sensor attached to the back of the display inside the opening of the digitizer, a fingerprint sensor printed circuit board electrically connected to the fingerprint sensor, and a first conductive device facing in a first direction.
  • a first cap printed circuit board including patterns and partially laminated with the fingerprint sensor printed circuit board, including second conductive patterns facing a second direction perpendicular to the first direction, and the first cap printed circuit board. It may include a second cap printed circuit board including a slit formed through a portion of the substrate.
  • An electronic device includes a display, a digitizer located on the back of the display and including an opening, a fingerprint sensor attached to the back of the display inside the opening of the digitizer, and electrically connected to the fingerprint sensor.
  • a fingerprint sensor printed circuit board including first conductive patterns facing in a first direction, and a first cap printed circuit board formed to be partially laminated with the fingerprint sensor printed circuit board, facing in a second direction perpendicular to the first direction. It may include a second cap printed circuit board including second conductive patterns.
  • the fingerprint sensor assembly includes, inside the opening of the digitizer, a fingerprint sensor attached to the back of the display, a fingerprint sensor printed circuit board electrically connected to the fingerprint sensor, and a first conductive conductive device facing a first direction.
  • a first cap printed circuit board including patterns and partially laminated with the fingerprint sensor printed circuit board, including second conductive patterns facing a second direction perpendicular to the first direction, and the first cap printed circuit board. It may include a second cap printed circuit board including a slit formed through a portion of the substrate.
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to an embodiment disclosed in this document.
  • Figure 2 is a perspective view showing the front of an electronic device, according to an embodiment disclosed in this document.
  • FIG. 3 is a perspective view showing the rear of the electronic device shown in FIG. 2, according to an embodiment disclosed in this document.
  • FIG. 4A is an exploded perspective view of the front of the electronic device shown in FIG. 2 according to an embodiment disclosed in this document.
  • FIG. 4B is an exploded perspective view showing the rear of the electronic device shown in FIG. 2, according to an embodiment disclosed in this document.
  • Figure 5a is a perspective view showing a state before bonding of the first and second layers according to an embodiment of the present invention.
  • Figure 5b is a perspective view showing a state after bonding the first and second layers according to an embodiment of the present invention.
  • Figure 6 is a cross-sectional view schematically showing a fingerprint sensor assembly according to an embodiment of the present disclosure.
  • Figure 7 is a cross-sectional view showing a cross-section of an electronic device including a fingerprint sensor assembly, according to an embodiment of the present disclosure.
  • Figure 8 is a diagram showing a first cap printed circuit board and a second cap printed circuit board combined, according to an embodiment of the present disclosure.
  • FIG. 9 is a front view showing a second cap printed circuit board according to an embodiment of the present disclosure.
  • FIG. 10 is a front view showing a first cap printed circuit board according to an embodiment of the present disclosure.
  • FIG. 11 is a diagram for explaining a second portion of a first cap printed circuit board according to an embodiment of the present disclosure.
  • FIG. 12 is a view showing soldering of a first cap printed circuit board and a second cap printed circuit board according to an embodiment of the present disclosure.
  • Figure 13 is a diagram for explaining the opening size according to the soldering position of the first cap printed circuit board and the second cap printed circuit board, according to an embodiment of the present disclosure.
  • FIG. 14 is a cross-sectional view of an electronic device including a magnetic field shielding sheet according to an embodiment of the present disclosure.
  • Figure 15 is a diagram for explaining the attachment position of a magnetic field shielding sheet according to an embodiment of the present disclosure.
  • FIG. 16 is a cross-sectional view of an electronic device including a support member, according to an embodiment of the present disclosure.
  • 17 is a front view showing a second cap printed circuit board according to an embodiment of the present disclosure.
  • FIG. 18 is a front view showing a first cap printed circuit board according to an embodiment of the present disclosure.
  • Electronic devices may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-described devices.
  • first, second, or first or second may be used simply to distinguish one component from another, and to refer to that component in other respects (e.g., importance or order) is not limited.
  • One (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.”
  • any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.
  • module used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be interchangeable with terms such as logic, logic block, component, or circuit, for example. can be used
  • a module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately placed in other components. there is.
  • one or more of the above-described corresponding components or operations may be omitted, or one or more other components or operations may be added.
  • multiple components eg, modules or programs
  • the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as those performed by the corresponding component of the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, or omitted. Alternatively, one or more other operations may be added.
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to an embodiment disclosed in this document.
  • the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • a first network 198 e.g., a short-range wireless communication network
  • a second network 199 e.g., a long-distance wireless communication network.
  • the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197.
  • at least one of these components eg, the connection terminal 178) may be omitted, or one or more other components may be added to the electronic device 101.
  • some of these components are integrated into one component (e.g., display module 160). It can be.
  • the processor 120 for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores instructions or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • software e.g., program 140
  • the processor 120 stores instructions or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132.
  • the commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • the processor 120 includes the main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor).
  • the main processor 121 e.g., a central processing unit or an application processor
  • an auxiliary processor 123 e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor.
  • the electronic device 101 includes a main processor 121 and a secondary processor 123
  • the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can.
  • the auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.
  • the auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled.
  • co-processor 123 e.g., image signal processor or communication processor
  • may be implemented as part of another functionally related component e.g., camera module 180 or communication module 190. there is.
  • the auxiliary processor 123 may include a hardware structure specialized for processing artificial intelligence models.
  • Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself, where artificial intelligence is performed, or may be performed through a separate server (e.g., server 108).
  • Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited.
  • An artificial intelligence model may include multiple artificial neural network layers.
  • Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above.
  • artificial intelligence models may additionally or alternatively include software structures.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto.
  • Memory 130 may include volatile memory 132 or non-volatile memory 134.
  • the program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.
  • the input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user).
  • the input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).
  • the sound output module 155 may output sound signals to the outside of the electronic device 101.
  • the sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback.
  • the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.
  • the display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user).
  • the display module 160 may include, for example, a display, a hall area programmable device, or a projector and a control circuit for controlling the device.
  • the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.
  • the audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).
  • the electronic device 102 e.g., speaker or headphone
  • the sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do.
  • the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.
  • the interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card interface
  • audio interface audio interface
  • connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 can capture still images and moving images.
  • the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 can manage power supplied to the electronic device 101.
  • the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101.
  • the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
  • Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication.
  • processor 120 e.g., an application processor
  • the communication module 190 may be a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included.
  • a wireless communication module 192 e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 e.g., : LAN (local area network) communication module, or power line communication module
  • the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network
  • the wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199.
  • subscriber information e.g., International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology).
  • NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported.
  • the wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates.
  • the wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna.
  • the wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199).
  • the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC.
  • Peak data rate e.g., 20 Gbps or more
  • loss coverage e.g., 164 dB or less
  • U-plane latency e.g., 164 dB or less
  • the antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device).
  • the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB).
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected to the plurality of antennas by, for example, the communication module 190. can be selected Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna.
  • other components eg, radio frequency integrated circuit (RFIC) may be additionally formed as part of the antenna module 197.
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • a mmWave antenna module includes: a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.
  • a mmWave antenna module includes: a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side)
  • peripheral devices e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • signal e.g. commands or data
  • commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199.
  • Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101.
  • all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108.
  • the electronic device 101 may perform the function or service instead of executing the function or service on its own.
  • one or more external electronic devices may be requested to perform at least part of the function or service.
  • One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101.
  • the electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request.
  • cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology can be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of Things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or server 108 may be included in the second network 199.
  • the electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.
  • FIG. 2 is a perspective view showing the front of the electronic device 101 according to an embodiment disclosed in this document.
  • FIG. 3 is a perspective view showing the rear of the electronic device 101 shown in FIG. 3, according to an embodiment disclosed in this document.
  • the electronic device 101 (e.g., the electronic device 101 of FIG. 1) according to one embodiment has a first side (or front) 110A and a second side (or back). It may include a housing 110 including (110B), and a side (110C) surrounding the space between the first surface (110A) and the second surface (110B).
  • housing 110 may refer to a structure that forms part of the first side 110A in FIG. 2, the second side 110B and the side surfaces 110C in FIG. 3. there is.
  • the first surface 110A may be formed at least in part by a substantially transparent front plate 202 (eg, a glass plate including various coating layers, or a polymer plate).
  • the second surface 110B may be formed by a substantially opaque back plate 111.
  • the back plate 111 may be formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. You can.
  • Side 110C joins front plate 202 and back plate 111 and may be formed by a side structure (or “side bezel structure”) 118 comprising metal and/or polymer.
  • the back plate 111 and the side structure 118 may be formed as a single piece and include the same material (eg, a metallic material such as aluminum).
  • the front plate 202 may include a region(s) that is curved toward the rear plate 111 and extends seamlessly from at least a portion of the edge.
  • the front plate 202 (or the back plate 111) is bent toward the back plate 111 (or the front plate 202) so that only one of the extended regions is at one edge of the first side 110A. It can be included.
  • the front plate 202 or the rear plate 111 may have a substantially flat shape, and in this case, may not include a curved extended area.
  • the thickness of the electronic device 101 in the portion containing the curved and extended region may be smaller than the thickness of other portions.
  • the electronic device 101 includes a display 115, an audio module (e.g., microphone hall 103, external speaker hall 107, call receiver hall 114), and a sensor module (e.g., First sensor module 204, second sensor module (not shown), third sensor module 119), camera module (e.g., first camera device 105, second camera device 112, flash 113) )), a key input device 117, a light emitting element 106, and a connector hole (eg, a first connector hole 208 and a second connector hole 109).
  • the electronic device 101 may omit at least one of the components (eg, the key input device 117 or the light emitting device 106) or may additionally include another component.
  • the display 115 may output a screen or be visually exposed through a significant portion of the first side 110A (e.g., the front plate 202). In one embodiment, at least a portion of the display 115 may be visually exposed through the front plate 202 forming the first surface 110A or through a portion of the side surface 110C. In one embodiment, the edges of the display 115 may be formed to be substantially the same as the adjacent outer shape of the front plate 202. In one embodiment (not shown), in order to expand the area to which the display 115 is visually exposed, the distance between the outer edge of the display 115 and the outer edge of the front plate 202 may be formed to be substantially the same.
  • a recess or an opening is formed in a portion of the screen display area of the display 115, and an audio module (e.g., a receiver hole for a call (e.g., a receiver hole for a call) is aligned with the recess or the opening. 114)), a sensor module (e.g., the first sensor module 204), a camera module (e.g., the first camera device 105), and a light emitting element 106.
  • an audio module e.g., call receiver hole 114
  • a sensor module e.g., first sensor module 204
  • a camera e.g., the first camera device 105
  • the display 115 is coupled to or adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of touch, and/or a digitizer that detects a magnetic field type stylus pen. can be placed.
  • the audio modules 103, 107, and 114 may include a microphone hole 103 and a speaker hole (eg, an external speaker hole 107 and a call receiver hole 114).
  • a microphone for acquiring external sounds may be placed inside the microphone hole 103, and in one embodiment, a plurality of microphones may be placed to detect the direction of the sound.
  • the speaker hole may include an external speaker hole 107 and a receiver hole 114 for a call.
  • the speaker hall e.g., external speaker hall 107, call receiver hall 114
  • microphone hole 103 are implemented as one hall, or the speaker hall (e.g., external speaker hall 107, call receiver hall 114) is implemented as one hall.
  • a speaker may be included (e.g., piezo speaker) without a receiver hole (114).
  • the sensor module may generate an electrical signal or data value corresponding to the internal operating state of the electronic device 101 or the external environmental state.
  • the sensor module may include, for example, a first sensor module 204 (e.g., a proximity sensor) and/or a second sensor module (not shown) (e.g., a fingerprint) disposed on the first side 110A of the housing 110. sensor), and/or a third sensor module 119 disposed on the second surface 110B of the housing 110.
  • the second sensor module (not shown) (e.g., fingerprint sensor) may be disposed on the first side 110A (e.g., display 115) as well as the second side 110B or side 110C of the housing 110. You can.
  • the electronic device 101 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor. It may include at least one more.
  • the camera module includes a first camera device 105 disposed on the first side 110A of the electronic device 101, and a second camera device 112 disposed on the second side 110B. , and/or may include a flash 113.
  • the camera devices eg, the first camera device 105 and the second camera device 112 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash 113 may include, for example, a light emitting diode or a xenon lamp.
  • one or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be placed on one side of the electronic device 101.
  • the flash 113 may emit infrared rays, and the infrared rays emitted by the flash 113 and reflected by the subject may be received through the third sensor module 119.
  • the electronic device 101 or a processor of the electronic device 101 e.g., processor 120 in FIG. 1 may detect depth information of the subject based on the point in time when infrared rays are received from the third sensor module 119. .
  • the key input device 117 may be disposed on the side 110C of the housing 110.
  • the electronic device 101 may not include some or all of the key input devices 117 mentioned above, and the key input devices 117 not included may be other than soft keys on the display 115. It can be implemented in the form
  • the key input device may include a sensor module disposed on the second side 110B of the housing 110.
  • the light emitting device 106 may be disposed on, for example, the first surface 110A of the housing 110.
  • the light emitting device 106 may provide status information of the electronic device 101 in the form of light.
  • the light emitting device 106 may provide a light source that is linked to the operation of a camera module (eg, the first camera device 105).
  • the light emitting device 106 may include, for example, an LED, an IR LED, and a xenon lamp.
  • the connector hole (e.g., the first connector hole 208, the second connector hole 109) connects an external electronic device (e.g., the electronic device 1002 of FIG. 1) with power and/or data.
  • a first connector hole 208 capable of accommodating a connector for transmitting and receiving a connector (e.g., a USB connector), and/or a second connector hole capable of accommodating a connector for transmitting and receiving an audio signal with an external electronic device ( For example, it may include an earphone jack) (109).
  • FIG. 4A is an exploded perspective view of the front of the electronic device 101 shown in FIG. 2 according to an embodiment disclosed in this document.
  • FIG. 4B is an exploded perspective view showing the rear of the electronic device 101 shown in FIG. 2 according to an embodiment disclosed in this document.
  • the electronic device 101 (e.g., the electronic device 101 of FIG. 1, 2, or 3) includes a side structure 210 and a first support member 211 (e.g., bracket), front plate 220 (e.g., front plate 202 in Figure 2), display 230 (e.g., display 115 in Figures 2 and 3), electromagnetic induction panel 290, printed circuit board (or substrate assembly) 240, battery 250, second support member 260 (e.g., rear case), antenna, camera assembly 207, and back plate 280 (e.g., back plate in FIG. 3 ( 111)) may be included.
  • first support member 211 e.g., bracket
  • front plate 220 e.g., front plate 202 in Figure 2
  • display 230 e.g., display 115 in Figures 2 and 3
  • electromagnetic induction panel 290 e.g., printed circuit board (or substrate assembly) 240
  • battery 250 e.g., second support member 260 (e.g., rear case)
  • the electromagnetic induction panel 290 may be a panel for detecting input from the pen input device 120.
  • the electromagnetic induction panel 290 may include a printed circuit board (PCB) (eg, flexible printed circuit board (FPCB)) and a shielding sheet.
  • the shielding sheet can prevent interference between components included in the electronic device 100 (e.g., display module, printed circuit board, electromagnetic induction panel, etc.) caused by electromagnetic fields.
  • the shielding sheet blocks electromagnetic fields generated from components, thereby allowing input from the pen input device 120 to be accurately transmitted to the coil included in the electromagnetic induction panel 290.
  • the electromagnetic induction panel 290 may include an opening formed in at least a portion of the area corresponding to the biometric sensor disposed in the electronic device 100.
  • the pen input device 291 (e.g., stylus pen) is guided and inserted into the interior of the housing 201 through an opening formed on the side of the housing (e.g., 110 in FIG. 2). It may be detachable and may include a button to facilitate detachment.
  • the pen input device 291 may have a separate resonance circuit built in and be linked to the electromagnetic induction panel 290 (eg, digitizer) included in the electronic device 101.
  • the pen input device 291 may include an electro-magnetic resonance (EMR) method, an active electrical stylus (AES) method, and an electric coupled resonance (ECR) method.
  • EMR electro-magnetic resonance
  • AES active electrical stylus
  • ECR electric coupled resonance
  • the electronic device 101 may omit at least one of the components (e.g., the first support member 211 or the second support member 260) or may additionally include another component. there is. At least one of the components of the electronic device 101 may be the same or similar to at least one of the components of the electronic device 101 of FIG. 2 or 3, and overlapping descriptions will be omitted below.
  • the first support member 211 may be disposed inside the electronic device 101 and connected to the side structure 210, or may be formed integrally with the side structure 210.
  • the first support member 211 may be formed of, for example, a metallic material and/or a non-metallic (eg, polymer) material. When formed at least partially of a metal material, a portion of the side structure 210 or the first support member 211 may function as an antenna.
  • the first support member 211 may have a display 230 coupled to one side and a printed circuit board 240 to the other side.
  • the printed circuit board 240 includes a processor (e.g., processor 120 in FIG. 1), memory (e.g., memory 130 in FIG.
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • the first support member 211 and the side structure 210 may be combined and referred to as a front case or housing 201.
  • the housing 201 may be generally understood as a structure for accommodating, protecting, or disposing the printed circuit board 240 or the battery 250.
  • the housing 201 includes a structure that can be visually or tactilely recognized by the user on the exterior of the electronic device 101, for example, a side structure 210, a front plate 220, and/or It may be understood as including a rear plate 280.
  • 'the front or rear of the housing 201' may mean the first side 110A of FIG. 2 or the second side 110B of FIG. 3.
  • the first support member 211 includes a front plate 220 (e.g., first side 110A in FIG. 2) and a back plate 280 (e.g., second side 110B in FIG. 3). It is disposed between them and may function as a structure for arranging electrical/electronic components such as a printed circuit board 240 or a camera assembly 207.
  • the display 230 may include a display panel 231 and a flexible printed circuit board 233 extending from the display panel 231.
  • the flexible printed circuit board 233 may be understood as being at least partially disposed on the rear side of the display panel 231 and electrically connected to the display panel 231.
  • reference number '231' may be understood as a protection sheet disposed on the rear of the display panel.
  • the protection sheet may be understood as being a part of the display panel 231.
  • the protective sheet may function as a buffering structure (eg, a low-density elastomer such as a sponge) or an electromagnetic shielding structure (eg, a copper sheet (CU sheet)) that absorbs external force.
  • the display 230 may be disposed on the inner side of the front plate 220, and may include a light emitting layer to display the screen through at least a portion of the first side 110A of FIG. 2 or the front plate 220. can be output. As mentioned above, the display 230 may output a screen substantially through the entire area of the first side 110A or the front plate 220 of FIG. 2 .
  • the memory may include, for example, volatile memory or non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • the interface may electrically or physically connect the electronic device 101 to an external electronic device and may include a USB connector, SD card/MMC connector, or audio connector.
  • the second support member 260 may include, for example, an upper support member 260a and a lower support member 260b.
  • the upper support member 260a may be disposed to surround the printed circuit board 240 together with a portion of the first support member 211.
  • Circuit devices e.g., processors, communication modules, or memory
  • various electrical/electronic components implemented in the form of integrated circuit chips may be placed on the printed circuit board 240.
  • the printed circuit board 240 An electromagnetic shielding environment can be provided from the upper support member 260a.
  • the lower support member 260b may be utilized as a structure that can place electrical/electronic components such as a speaker module and an interface (e.g., USB connector, SD card/MMC connector, or audio connector).
  • electrical/electronic components such as speaker modules and interfaces (eg, USB connectors, SD card/MMC connectors, or audio connectors) may be placed on additional printed circuit boards, not shown.
  • the lower support member 260b may be arranged to surround an additional printed circuit board together with another part of the first support member 211.
  • the speaker module or interface disposed on the additional printed circuit board or lower support member 260b, not shown, may be connected to the audio module of FIG. 2 (e.g., microphone hole 103 or speaker hole (e.g., external speaker hole 107), call It may be disposed corresponding to the receiver hole 114) or the connector hole (eg, the first connector hole 108 and the second connector hole 109).
  • it may be disposed correspondingly to the audio module 207 or the connector holes 108 and 109.
  • the battery 250 is a device for supplying power to at least one component of the electronic device 101, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or fuel. It may include a battery. At least a portion of the battery 250 may be disposed, for example, on substantially the same plane as the printed circuit board 240 . The battery 250 may be placed integrally within the electronic device 101, or may be placed to be detachable from the electronic device 101.
  • the antenna may include a conductor pattern implemented on the surface of the second support member 260 through, for example, a laser direct structuring method.
  • the antenna may include a printed circuit pattern formed on the surface of the thin film, and the antenna in the form of a thin film may be disposed between the rear plate 280 and the battery 250.
  • the antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • NFC near field communication
  • MST magnetic secure transmission
  • the antenna can perform short-distance communication with an external device or wirelessly transmit and receive power required for charging.
  • another antenna structure may be formed by part or a combination of the side structure 210 and/or the first support member 211.
  • camera assembly 207 may include at least one camera module. Inside the electronic device 101, the camera assembly 207 may receive at least a portion of the light incident through the optical hole or the camera window 212, 213, and 219. In one embodiment, camera assembly 207 may be placed on first support member 211 at a location adjacent printed circuit board 240 . In one embodiment, the camera module(s) of camera assembly 207 may be generally aligned with any one of camera windows 212, 213, 219 and at least partially aligned with second support member 260 (e.g., It can be wrapped around the upper support member (260a).
  • Figure 5a is a perspective view showing a state before bonding of the first and second layers 43 and 44 according to an embodiment of the present invention.
  • Figure 5b is a perspective view showing the state after bonding the first and second layers 43 and 44 according to an embodiment of the present invention.
  • the electronic device 40 (e.g., the electronic device 101 shown in FIGS. 1 to 4) according to an embodiment includes a display layer 41 and a touch detection function. It may include a layer 42 (touch detection layer).
  • the display layer 41 according to various embodiments may be located between a first plate of an electronic device housing and a second plate facing away from the first plate.
  • the touch detection layer 42 may be located between the display layer 41 and the second plate.
  • the display layer 41 has a first surface 41a facing in a first direction (arrow 1 direction) and a second surface facing in a second direction (e.g., the opposite direction of the first direction) (arrow 2 direction). It may include two sides (41b).
  • the display layer 41 may include a display made of a flexible material or a display made of a rigid material. Additionally, the display layer 41 may be flat, curved, or a combination thereof.
  • the touch detection layer 42 is an EMR sensor coupled to the second surface 41b of the display layer 41 and may include, for example, a digitizer.
  • the touch detection layer 42 may include a first layer 43 and a second layer 44 . At least a portion of the second layer 44 may be disposed to overlap with at least a portion of the first layer 43 and be joined by a bonding process, for example, a soldering process.
  • the first layer 43 includes a first surface 43a facing the display layer 41, a second surface 43b facing in the opposite direction from the first surface 43a, and a first surface 43b facing the display layer 41. It may include an opening 430 formed through the layer 43 .
  • the first layer 43 is a flexible printed circuit board (FPCB) on which conductive lines are patterned, and may include, for example, a first digitizer.
  • FPCB flexible printed circuit board
  • the second layer 44 is disposed between the opening 430 and the second plate, is combined with the first layer 43, and may be electrically connected to the first layer 43.
  • second layer 44 may include a second digitizer.
  • a pattern loop could not be formed in the first layer 43 at the portion where the opening 430 is located, but the second layer 44 was combined to form a pattern loop.
  • a first algorithm for linearity and malfunction prevention may be applied to the first layer 43 according to an embodiment, and a second algorithm for linearity and malfunction prevention may be applied to at least some of the nearby areas including the second layer 44. This can be applied.
  • Figure 6 is a cross-sectional view schematically showing a fingerprint sensor assembly according to an embodiment of the present disclosure.
  • FIG. 7 is a cross-sectional view showing a cross-section of an electronic device 101 including a fingerprint sensor assembly, according to an embodiment of the present disclosure.
  • the electronic device 101 may include a display 310, a digitizer 320 located on the rear of the display 310, and a fingerprint sensor assembly disposed on the rear of the display 310.
  • the fingerprint sensor assembly may include a fingerprint sensor 330, a fingerprint sensor printed circuit board 340, a first cap printed circuit board 360, and a second cap printed circuit board 350.
  • the configuration of the display 310, digitizer 320, and fingerprint sensor assembly of the electronic device 101 is the display 201 of the electronic device 101 of FIGS. 2 to 6, All or part of the configuration of the electromagnetic induction panel 290 may be the same.
  • the structures of FIGS. 6 and 7 may be selectively combined with the structures of FIGS. 2 to 6 .
  • a spatial coordinate system defined by the X-axis, Y-axis, and Z-axis orthogonal to each other is shown.
  • the X-axis may represent the width direction of the electronic device 101
  • the Y-axis may represent the longitudinal direction of the electronic device 101
  • the Z-axis may represent the thickness direction of the electronic device 101.
  • the digitizer 320 may be located behind the display 310.
  • the digitizer 320 may include an opening 321 (eg, opening 430 in FIG. 5A) for attaching the fingerprint sensor 330.
  • the digitizer 320 may include an opening 321 corresponding to the location and size of the fingerprint sensor 330.
  • the fingerprint sensor 330 may be attached to the rear of the display 310.
  • the fingerprint sensor 330 may be disposed inside the opening 321 of the digitizer 320.
  • the size of the fingerprint sensor 330 may increase.
  • the size of the opening 321 of the digitizer 320 corresponding to the fingerprint sensor 330 also increases, and the cap printed circuit board connecting the digitizer 320 and the fingerprint sensor 330 increases.
  • the size of the first cap printed circuit board 360 and the second cap printed circuit board 350 may also be increased.
  • the fingerprint sensor 330 may be electrically connected to the fingerprint sensor printed circuit board 340.
  • the fingerprint sensor printed circuit board 340 may connect the fingerprint sensor 330 and the main printed circuit board (not shown).
  • the electronic device 101 is a straight line heading in the first direction (1) in order to solve the linearity problem by removing a curved detour pattern such as a ' ⁇ ' shape or an 'n' shape.
  • a first cap printed circuit board 360 including first conductive patterns 3601 in the form of a straight line and second conductive patterns 3501 in the form of a straight line facing a second direction (2) perpendicular to the first direction (1). ) may be separated and included as a separate configuration.
  • the specific structure and shape of the fingerprint sensor assembly including the first cap printed circuit board 360 and the second cap printed circuit board 350 will be described below.
  • Figure 8 is a diagram showing the first cap printed circuit board 360 and the second cap printed circuit board 350 combined, according to an embodiment of the present disclosure.
  • FIG. 9 is a front view showing a second cap printed circuit board 350 according to an embodiment of the present disclosure.
  • FIG. 10 is a front view showing a first cap printed circuit board 360 according to an embodiment of the present disclosure.
  • FIG. 11 is a diagram for explaining the second portion 362 of the first cap printed circuit board 360 according to an embodiment of the present disclosure.
  • the electronic device 101 may include a display 310, a digitizer 320 located on the rear of the display 310, and a fingerprint sensor assembly disposed on the rear of the display 310.
  • the fingerprint sensor assembly may include a fingerprint sensor 330, a fingerprint sensor printed circuit board 340, a first cap printed circuit board 360, and a second cap printed circuit board 350.
  • the configuration of the electronic device 101 may be completely or partially the same as the configuration of the electronic device 101 of FIGS. 5 to 6 .
  • the structures of FIGS. 8 to 11 may be selectively combined with the structures of FIGS. 5 to 6.
  • a spatial coordinate system defined by the X-axis, Y-axis, and Z-axis orthogonal to each other is shown.
  • the X-axis may represent the width direction of the electronic device 101
  • the Y-axis may represent the longitudinal direction of the electronic device 101
  • the Z-axis may represent the thickness direction of the electronic device 101.
  • the second cap printed circuit board 350 may include second conductive patterns 3501 facing in a second direction (2) perpendicular to the first direction (1).
  • the second conductive patterns 3501 may have a straight line shape facing the second direction (2).
  • the second cap printed circuit board 350 may be a flat rectangular board.
  • the second cap printed circuit board 350 may include a slit 353 formed so that a portion of the first cap printed circuit board 360 penetrates.
  • the slit 353 may be formed by being recessed in the longitudinal direction (eg, Y-axis direction in FIG. 8).
  • a plurality of slits 353 may be formed corresponding to the positions of the first conductive patterns 3601 of the first cap printed circuit board 360.
  • the slit 353 is a first slit 353 and a second cap printed circuit recessed from the upper edge of the second cap printed circuit board 350 in a downward direction (e.g., -Y direction in FIG. 8).
  • It may include a second slit 353 recessed from the lower edge of the substrate 350 in an upward direction (eg, +Y direction in FIG. 8).
  • the size and/or length of the slit 353 may be recessed to correspond to the size of the first conductive patterns 3601 of the first cap printed circuit board 360.
  • the second cap printed circuit board 350 includes a first region 351 located to the left of the slit 353 (e.g., -X direction in FIG. 8) with respect to the slit 353, and It may be divided into a second area 352 located to the right of the slit 353 (eg, +X direction in FIG. 8).
  • the first area 351 and the second area 352 may have different arrangement relationships with the first cap printed circuit board 360, which will be described later.
  • the second conductive patterns 3501 may be soldered at the upper and lower corners where ends of the second conductive patterns 3501 are located.
  • the soldering area 354 may be formed to correspond to the arrangement of the second conductive patterns 3501 of the second cap printed circuit board 350 in the width direction (eg, the X-axis direction in FIG. 8 ). As the second cap printed circuit board 350 is soldered to the digitizer 320 from the upper and lower sides, the position and/or height of the second cap printed circuit board 350 may be fixed.
  • the first cap printed circuit board 360 may include first conductive patterns 3601 facing in the first direction (1).
  • the first conductive patterns 3601 may have a straight line shape facing the first direction (1).
  • the first conductive patterns 3601 of the first cap printed circuit board 360 are formed in a completely straight line to ensure linearity of a digital pen (eg, stylus pen).
  • the first cap printed circuit board 360 is a 1-1 cap printed circuit board 360a on which 1-1 conductive patterns disposed in the upper direction (e.g., +Y axis direction in FIG. 9) are formed. ), a 1-2 cap printed circuit board 360b on which 1-2 conductive patterns disposed in the lower direction (e.g., -Y axis direction in FIG. 9) are formed, and a 1-1 cap printed circuit board 360a and a connection portion 360c connecting the 1-2 cap printed circuit board 360b in the left direction (eg, -X direction in FIG. 9).
  • the distance between the 1-1 cap printed circuit board 360a and the 1-2 cap printed circuit board 360b may be shorter than the Y-axis direction length of the fingerprint sensor 330 ( Figure 6).
  • the distance between the 1-1 cap printed circuit board 360a and the 1-2 cap printed circuit board 360b may be shorter than the Y-axis direction length of the fingerprint sensor 330 ( Figure 6).
  • at least a portion of the 1-1 cap printed circuit board 360a and the 1-2 cap printed circuit board 360b may correspond to the fingerprint sensor 330.
  • at least a portion of the 1-1 cap printed circuit board 360a and the 1-2 cap printed circuit board 360b may overlap the fingerprint sensor 330.
  • the first cap printed circuit board 360 may be formed to penetrate the slit 353 formed in the second cap printed circuit board 350.
  • the first cap printed circuit board 360 when referring to FIG. 11, is formed to be disposed in the front direction (e.g., -Z direction of FIG. 11) of the second cap printed circuit board 350.
  • a first portion 361, a second portion 362 including a portion penetrating the slit 353 of the second cap printed circuit board 350, and a rearward direction of the second cap printed circuit board 350 (e.g., It may include a third part 363 formed to be disposed in the +Z direction of FIG. 11.
  • the first portion 361 of the first cap printed circuit board 360 corresponds to the first area 351 of the second cap printed circuit board 350 in the width direction (e.g., x-axis direction in FIG. 11). It can be.
  • the first portion 361 of the first cap printed circuit board 360 may be disposed in the front direction (e.g., -Z direction in FIG. 11) of the first area 351 of the second cap printed circuit board 350. there is.
  • the second portion 362 of the first cap printed circuit board 360 corresponds to the slit 353 portion of the second cap printed circuit board 350 based on the width direction (e.g., the x-axis direction in FIG. 11). You can.
  • the third portion 363 of the first cap printed circuit board 360 corresponds to the second area 352 of the second cap printed circuit board 350 in the width direction (e.g., x-axis direction in FIG. 11). It can be.
  • the third portion 363 of the first cap printed circuit board 360 may be disposed in the rear direction (e.g., +Z direction in FIG. 11) of the second area 352 of the second cap printed circuit board 350. there is.
  • the first part 361 and the third part 363 of the first cap printed circuit board 360 have a height in the Z-axis direction with respect to the display 310. may be different.
  • the height difference t1 between the first part 361 and the third part 363 may be approximately 0.15 mm or more and 0.2 mm or less.
  • the second part 362 of the first cap printed circuit board 360 may connect the first part 361 and the third part 363, which have different heights.
  • the second part 362 is predetermined based on the flat first part 361 and/or the third part 363 in order not to stress or cause deformation of a portion of the second cap printed circuit board 350. It can be formed to be inclined at an angle.
  • a portion of the first cap printed circuit board 360 may be in contact with the fingerprint sensor printed circuit board 340.
  • a portion of the first cap printed circuit board 360 may be formed into a laminated portion (laminated portion 370 in FIGS. 6 and 7) that is combined and/or laminated with the fingerprint sensor printed circuit board 340. there is.
  • the laminating portion 370 for laminating the first cap printed circuit board 360 to the fingerprint sensor printed circuit board 340 the left direction of the first cap printed circuit board 360 (e.g., -X direction in FIG. 11 ) can be confirmed, the seating position of the fingerprint sensor printed circuit board 340 can be fixed, and lifting of the fingerprint sensor printed circuit board 340 can be prevented.
  • FIG. 12 is a diagram showing soldering of the first cap printed circuit board 360 and the second cap printed circuit board 350 according to an embodiment of the present disclosure.
  • FIG. 13 is a diagram for explaining the size of the opening 321 according to the soldering position of the first cap printed circuit board 360 and the second cap printed circuit board 350, according to an embodiment of the present disclosure.
  • the electronic device 101 may include a display 310, a digitizer 320 located on the rear of the display 310, and a fingerprint sensor assembly disposed on the rear of the display 310.
  • the fingerprint sensor assembly may include a fingerprint sensor 330, a fingerprint sensor printed circuit board 340, a first cap printed circuit board 360, and a second cap printed circuit board 350.
  • the configuration of the electronic device 101 may be the same in whole or in part as the configuration of the electronic device 101 of FIGS. 8 to 11 .
  • the structures of FIGS. 12 to 13 may be selectively combined with the structures of FIGS. 8 to 11 .
  • a spatial coordinate system defined by the X-axis, Y-axis, and Z-axis orthogonal to each other is shown.
  • the X-axis may represent the width direction of the electronic device 101
  • the Y-axis may represent the longitudinal direction of the electronic device 101
  • the Z-axis may represent the thickness direction of the electronic device 101.
  • both ends of the first cap printed circuit board 360 may be soldered 380 to the digitizer 320.
  • the 1-1 cap printed circuit board 360a may be soldered at an end 380a in the left direction (e.g., -X direction in FIG. 12) and an end 380b in the right direction (e.g., +X direction in FIG. 12).
  • the 1-2 cap printed circuit board 360b may be soldered at an end 380c in the left direction (e.g., -X direction in FIG. 12) and an end 380d in the right direction (e.g., +X direction in FIG. 12).
  • the ends of the conductive patterns of the cap printed circuit board extend in the vertical direction and are soldered (381a) in the upper direction (e.g., the +Y axis direction in FIG. 13) and/or the lower direction (e.g., the -Y axis direction in FIG. 13). , 381b) can be. Since the cap is soldered in the upper direction (e.g., +Y-axis direction in FIG. 13) and/or lower direction (e.g., -Y-axis direction in FIG. 13) of the printed circuit board, a digitizer opening (e.g., sized to include it) is required. 21 in FIG. 13 may be necessary.
  • the electronic device 101 has a left end (e.g., -X direction in FIG. 13) and a right end (e.g., +X direction in FIG. 13) of the first cap printed circuit board 360. ) Since it is soldered at the end, the opening 321 of the digitizer 320 can be formed with a shorter length based on the width direction (e.g., the X-axis direction in FIG. 13). Referring to FIG. 13 , it can be seen that compared to the opening of a general electronic device, the length of the opening 321 in the width direction (e.g., the X-axis direction of FIG. 13) can be reduced.
  • the reduction ratio of the aperture 321 of the digitizer 320 may be, for example, approximately 15% or more and 20% or less. Compared to the aperture of a typical electronic device, the reduction ratio of the aperture 321 of the digitizer 320 may be, for example, approximately 18.4%.
  • FIG. 14 is a cross-sectional view of an electronic device 101 including a magnetic field shielding sheet 390 according to an embodiment of the present disclosure.
  • Figure 15 is a diagram for explaining the attachment position of the magnetic field shielding sheet 390 according to an embodiment of the present disclosure.
  • the electronic device 101 may include a display 310, a digitizer 320 located on the rear of the display 310, and a fingerprint sensor assembly disposed on the rear of the display 310.
  • the fingerprint sensor assembly may include a fingerprint sensor 330, a fingerprint sensor printed circuit board 340, a first cap printed circuit board 360, and a second cap printed circuit board 350.
  • the configuration of the electronic device 101 may be the same in whole or in part as the configuration of the electronic device 101 of FIGS. 12 and 13 .
  • the structures of FIGS. 14 and 15 may be selectively combined with the structures of FIGS. 12 and 13.
  • a spatial coordinate system defined by the X-axis, Y-axis, and Z-axis orthogonal to each other is shown.
  • the X-axis may represent the width direction of the electronic device 101
  • the Y-axis may represent the longitudinal direction of the electronic device 101
  • the Z-axis may represent the thickness direction of the electronic device 101.
  • the fingerprint sensor assembly of the electronic device 101 may further include a magnetic field shielding sheet 390.
  • a magnetic field shielding sheet 390 (magnetic metal powder (MMP)) may be disposed on the first cap printed circuit board 360 and/or the second cap printed circuit board 350.
  • MMP magnetic metal powder
  • the magnetic field shielding sheet 390 absorbs external noise by applying an electromagnetic interference (EMI) absorber to prevent electromagnetic interference between the input tool and the first cap printed circuit board 360 and/or the second cap printed circuit board 350. More accurate recognition of X and Y coordinates can be achieved through induction.
  • the magnetic field shielding sheet 390 may be a composite sheet further containing a copper (cu) component.
  • the magnetic field shielding sheet 390 must be placed on a printed circuit board and must have a structure that covers one side facing the +Z direction, so it may need to be divided and attached.
  • the magnetic field shielding sheet 390 may be divided and arranged so that a printed circuit board is not disposed on the magnetic field shielding sheet 390.
  • the magnetic field shielding sheet 390 may be disposed on one side most facing the +Z direction when the first cap printed circuit board 360 and the second cap printed circuit board 350 are combined.
  • the magnetic field shielding sheet 390 may be disposed on the second part 362 and the third part 363 where the first cap printed circuit board 360 is most located in the +Z direction.
  • the magnetic field shielding sheet 390 includes a first shielding sheet 391 disposed on the second portion 362 and the third portion 363 of the 1-1 cap printed circuit board 360a, A second shielding sheet 392 may be disposed on the second portion 362 and the third portion 363 of the 1-2 cap printed circuit board 360b.
  • the third, fourth, and fifth shielding sheets are installed at positions that do not correspond to the first cap printed circuit board 360 based on the Z-axis direction. (393, 394, 395) can be placed.
  • the sixth shielding sheet 396 may be attached to the first area 351 where the second cap printed circuit board is most located in the +Z direction.
  • the seventh shielding sheet 397 may be attached between the first area 351 and the second area 352 where the second cap printed circuit board is located most in the +Z direction.
  • FIG. 16 is a cross-sectional view of an electronic device 101 including a support member 399 according to an embodiment of the present disclosure.
  • the electronic device 101 may include a display 310, a digitizer 320 located on the rear of the display 310, and a fingerprint sensor assembly disposed on the rear of the display 310.
  • the fingerprint sensor assembly may include a fingerprint sensor 330, a fingerprint sensor printed circuit board 340, a first cap printed circuit board 360, and a second cap printed circuit board 350.
  • the configuration of the electronic device 101 may be completely or partially the same as the configuration of the electronic device 101 of FIGS. 14 and 15 .
  • the structure of Figure 16 may be selectively combined with the structure of Figures 14 and 15.
  • a spatial coordinate system defined by the X-axis, Y-axis, and Z-axis orthogonal to each other is shown.
  • the X-axis may represent the width direction of the electronic device 101
  • the Y-axis may represent the longitudinal direction of the electronic device 101
  • the Z-axis may represent the thickness direction of the electronic device 101.
  • the first cap printed circuit board 360 and/or the second cap printed circuit board 350 cannot avoid contact with the fingerprint sensor.
  • the first cap printed circuit board 360 and/or the second cap printed circuit board 350 may further include a support member 399 to prevent sagging to prevent the first cap printed circuit board 360 and/or the second cap printed circuit board 350 from coming into contact with the fingerprint sensor.
  • FIG. 17 is a front view showing a second cap printed circuit board 450 according to an embodiment of the present disclosure.
  • FIG. 18 is a front view showing a first cap printed circuit board 460 according to an embodiment of the present disclosure.
  • the electronic device 101 may include a display 310, a digitizer 320 located on the rear of the display 310, and a fingerprint sensor assembly disposed on the rear of the display 310.
  • the fingerprint sensor assembly may include a fingerprint sensor 330, a fingerprint sensor printed circuit board 340, a first cap printed circuit board 360, and a second cap printed circuit board 350.
  • the configuration of the electronic device 101 may be completely or partially the same as the configuration of the electronic device 101 of FIG. 16 .
  • the structures of FIGS. 17 and 18 may be selectively combined with the structure of FIG. 16.
  • a spatial coordinate system defined by the X-axis, Y-axis, and Z-axis orthogonal to each other is shown.
  • the X-axis may represent the width direction of the electronic device 101
  • the Y-axis may represent the longitudinal direction of the electronic device 101
  • the Z-axis may represent the thickness direction of the electronic device 101.
  • the second cap printed circuit board 450 has second conductive patterns 4501 facing in a second direction (2) perpendicular to the first direction (1). It can be included.
  • the second conductive patterns 4501 may have a straight line shape facing the second direction (2).
  • the second cap printed circuit board 450 may be a flat rectangular board.
  • the second cap printed circuit board 450 is formed to be disposed in the left direction (e.g., -X direction in FIG. 17) and the 2-1 cap printed circuit board 451 formed to be disposed in the right direction (e.g., It can be divided into a 2-2 cap printed circuit board 452 formed to be disposed in the +X direction of FIG. 17).
  • the 2-1st cap printed circuit board 451 and the 2-2nd cap printed circuit board 452 may have different arrangement relationships with the first cap printed circuit board 460, which will be described later.
  • the 2-1 cap printed circuit board 451 and the 2-2 cap printed circuit board 452 may have different lengths in the width direction (eg, X-axis direction in FIG. 17).
  • the width length of the 2-1 cap printed circuit board 451 may be shorter than the width length of the 2-2 cap printed circuit board 452.
  • the number of second conductive patterns 4501 disposed on the 2-1 cap printed circuit board 451 is equal to the number of second conductive patterns 4501 disposed on the 2-2 cap printed circuit board 452. It may be less than the number of .
  • the second conductive patterns 4501 may be soldered at the upper and lower corners where ends of the second conductive patterns 4501 are located.
  • the soldering area 454 may be formed to correspond to the width direction arrangement of the second conductive patterns 4501 of the second cap printed circuit board 450. As the second cap printed circuit board 450 is soldered to the digitizer 320 from the upper and lower sides, the position of the second cap printed circuit board 450 may be fixed.
  • the first cap printed circuit board 460 may include first conductive patterns 4601 facing in the first direction (1).
  • the first conductive patterns 4601 may have a straight line shape facing the first direction (1).
  • the first conductive patterns 4601 of the first cap printed circuit board 460 are formed in a completely straight line to ensure linearity of a digital pen (eg, stylus pen).
  • the first cap printed circuit board 460 may be formed to penetrate the second cap printed circuit board 450.
  • the first cap printed circuit board 460 may be formed to penetrate the 2-1st cap printed circuit board 451 and the 2-2 cap printed circuit board 452.
  • the first cap printed circuit board 460 includes a first portion 461 formed to be disposed in the front direction (e.g., -Z direction of FIG. 18) of the second cap printed circuit board 450, a second portion 462 including a portion penetrating between the 2-1 cap printed circuit board 451 and the 2-2 cap printed circuit board 452 of the 2-cap printed circuit board 450, and a second The cap may include a third portion 463 disposed in a rear direction (eg, +Z direction in FIG. 18) of the printed circuit board 450.
  • the first portion 461 of the first cap printed circuit board 460 may correspond to the first area 351 of the second cap printed circuit board 450 based on the width direction (x-axis direction). You can.
  • the first portion 461 of the first cap printed circuit board 460 may be disposed in the front direction (e.g., -Z direction in FIG. 18) of the first area 351 of the second cap printed circuit board 450.
  • the second portion 462 of the first cap printed circuit board 460 is aligned with the 2-1 cap printed circuit board 451 and the second cap printed circuit board 451 based on the width direction (e.g., x-axis direction in FIG. 18).
  • -2 Cap may correspond to the space formed between the printed circuit boards 452.
  • the third portion 463 of the first cap printed circuit board 460 is located in the second region of the second cap printed circuit board 450 based on the width direction (e.g., x-axis direction in Figure 18). 352).
  • the third portion 463 of the first cap printed circuit board 460 may be disposed in the rear direction (e.g., +Z direction in FIG. 18) of the second area 352 of the second cap printed circuit board 450. there is.
  • the first part 461 and the third part 463 of the first cap printed circuit board 460 may have different heights in the Z-axis direction with respect to the display 310.
  • the height difference between the first part 461 and the third part 463 may be approximately 0.15 mm or more and 0.2 mm or less.
  • the second part 462 of the first cap printed circuit board 460 may connect the first part 461 and the third part 463, which have different heights.
  • the second part 462 is predetermined based on the flat first part 461 and/or the third part 463 in order not to stress or cause deformation of a portion of the second cap printed circuit board 450. It can be formed to be inclined at an angle.
  • a portion of the first cap printed circuit board 460 may be in contact with the fingerprint sensor printed circuit board 340.
  • a portion of the first cap printed circuit board 460 may be combined or laminated with the fingerprint sensor printed circuit board 340.
  • the cap printed circuit board of the comparative example may include first conductive patterns facing a first direction and second conductive patterns extending perpendicularly from the first conductive patterns and facing a second direction perpendicular to the first direction.
  • the first conductive patterns or the second conductive patterns are not connected in a straight line but are formed in a curved shape such as a ' ⁇ ' or 'n' shape, and are formed in the upper and lower areas (+Y, -Y axis) of the cap printed circuit board. direction) can be implemented to be soldered.
  • a linearity problem of a digital pen (eg, stylus pen) depending on the digitizer may occur in an area where the first conductive patterns or the second conductive patterns are formed in a curved shape.
  • An electronic device provides a sensor bonding structure to improve the problem of the pattern loop discontinuity of the electromagnetic induction panel in an electronic device in which a fingerprint sensor in-display type sensor is mounted. You can.
  • An electronic device (e.g., 101 in FIG. 1) according to an embodiment of the present invention operates in a first direction ( Example: a first cap printed circuit board (e.g., 360 in FIG. 8) including first conductive patterns (e.g., 3601 in FIG. 8) facing 1 in FIG. 8 and a second direction perpendicular to the first direction (e.g., 3601 in FIG. 8)
  • Example: The second cap printed circuit board (e.g., 350 in FIG. 8) including the second conductive patterns (e.g., 3501 in FIG. 8) facing 2 in FIG. 8 may be separated and included as a separate configuration. .
  • An electronic device (e.g., 101 in FIG. 1) according to an embodiment of the present disclosure includes a display (e.g., 310 in FIG. 7), a digitizer (e.g., 310 in FIG. 7), located on the back of the display, and including an opening (e.g., 321 in FIG. 7).
  • a display e.g., 310 in FIG. 7
  • a digitizer e.g., 310 in FIG. 7
  • a fingerprint sensor disposed in at least a portion of the opening of the digitizer and attached to the rear of the display (e.g., 330 in FIG. 7), a fingerprint sensor printed circuit board electrically connected to the fingerprint sensor
  • the fingerprint sensor printed circuit board (e.g. : 360 in FIG. 8), including second conductive patterns (e.g., 3501 in FIG. 8) facing in a second direction perpendicular to the first direction, and a slit formed so that a portion of the first cap printed circuit board passes through It may include a second cap printed circuit board (e.g., 350 in FIG. 8) including (e.g., 353 in FIG. 8).
  • the first conductive patterns may be in the form of a straight line facing the first direction
  • the second conductive patterns may be in the form of a straight line facing the second direction
  • the slit is a first slit recessed in the second direction (downward direction) from the upper edge of the second cap printed circuit board and the second slit at the lower edge of the second cap printed circuit board. It may include a second slit recessed in a fourth direction (upward direction) opposite to the second direction, and may correspond to the positions of the first conductive patterns of the first cap printed circuit board.
  • the first cap printed circuit board is a 1-1 cap printed circuit board on which 1-1 conductive patterns are formed disposed in the fourth direction (e.g., 360a of FIG. 10), the second direction A 1-2 cap printed circuit board on which 1-2 conductive patterns are formed (e.g., 360b in FIG. 10), and one side of the 1-1 cap printed circuit board and the 1-2 cap printed circuit board. It may include a connection part (e.g., 360c in FIG. 10) connected to.
  • the first cap printed circuit board includes a first part formed to be disposed in a front direction of the second cap printed circuit board (e.g., 361 in FIG. 10), extending from the first part, and A second part (e.g., 362 in FIG. 10) including a part penetrating the slit of the second cap printed circuit board, and extending from the second part and disposed in the rear direction of the second cap printed circuit board. It may include a formed third part (e.g., 363 in FIG. 10).
  • the second part of the first cap printed circuit board may be formed to be inclined at a predetermined angle based on the first part and the third part that are formed flat.
  • the first conductive patterns of the first cap printed circuit board are soldered to the digitizer at both ends facing the first direction
  • the second conductive patterns of the second cap printed circuit board are soldered to the digitizer. It can be soldered to the digitizer at both ends facing two directions.
  • it may further include a magnetic field shielding sheet (eg, 390 in FIG. 14) disposed on the first cap printed circuit board or the second cap printed circuit board.
  • a magnetic field shielding sheet eg, 390 in FIG. 14
  • the magnetic field shielding sheet may be divided and arranged such that a printed circuit board is not disposed on the magnetic field shielding sheet.
  • a support member (eg, 395 in FIG. 16 ) may be further included at the bottom of the second printed circuit board.
  • An electronic device includes a display, a digitizer located on the back of the display and including an opening, a fingerprint sensor attached to the back of the display inside the opening of the digitizer, and electrically connected to the fingerprint sensor.
  • a fingerprint sensor printed circuit board a first cap printed circuit board (horizontal CAP) including first conductive patterns facing a first direction and partially laminated with the fingerprint sensor printed circuit board, a first cap printed circuit board (horizontal CAP) perpendicular to the first direction. It may include a second cap printed circuit board (vertical CAP) including second conductive patterns facing two directions.
  • the second cap printed circuit board (e.g., 450 in FIG. 17) is a 2-1 cap printed circuit board (e.g., 451 in FIG. 17) formed to be disposed in the left direction (-X direction), and It may include a 2-2 cap printed circuit board (eg, 452 in FIG. 17 ) formed to be disposed to the right (+X direction) of the slit.
  • the first cap printed circuit board has a first part formed to be disposed in the front direction of the 2-1 cap printed circuit board (e.g., 461 in Figure 18), extending from the first part, and , a second part including a part penetrating a space formed between the 2-1 cap printed circuit board and the 2-2 cap printed circuit board (e.g., 462 in FIG. 18), and extending from the second part. and may include a third part (e.g., 463 in FIG. 18) disposed on the rear side of the 2-2 cap printed circuit board.
  • a third part e.g., 463 in FIG. 18
  • the second part of the first cap printed circuit board may be formed to be inclined at a predetermined angle based on the first part and the third part that are formed flat.
  • the first conductive patterns may be in the form of a straight line facing the first direction
  • the second conductive patterns may be in the form of a straight line facing the second direction
  • the first conductive patterns of the first cap printed circuit board are soldered to the digitizer at both ends facing the first direction
  • the second conductive patterns of the second cap printed circuit board are soldered to the digitizer. It can be soldered to the digitizer at both ends facing two directions.
  • it may further include a magnetic field shielding sheet disposed on the first cap printed circuit board or the second cap printed circuit board.
  • the magnetic field shielding sheet may be divided and arranged such that a printed circuit board is not disposed on the magnetic field shielding sheet.
  • a support member may be further included at the bottom of the second printed circuit board.
  • a fingerprint sensor assembly includes a fingerprint sensor configured to be attached to the back of a display, a fingerprint sensor printed circuit board electrically connected to the fingerprint sensor, and first conductive patterns facing a first direction, and the fingerprint
  • a first cap printed circuit board formed to be partially bonded to a sensor printed circuit board, comprising second conductive patterns facing a second direction perpendicular to the first direction, and a portion of the first cap printed circuit board penetrating.
  • a second cap printed circuit board may include a slit.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Telephone Set Structure (AREA)

Abstract

Selon un mode de réalisation, la présente invention concerne un dispositif électronique qui peut comprendre : un écran ; un numériseur situé sur une surface arrière de l'écran et comprenant une ouverture ; une carte de circuit imprimé de capteur d'empreintes digitales connectée électriquement au capteur d'empreintes digitales ; une première carte de circuit imprimé de capuchon qui comprend des premiers motifs conducteurs orientés vers une première direction et est formée pour stratifier partiellement la carte de circuit imprimé de capteur d'empreintes digitales ; et une seconde carte de circuit imprimé de capuchon qui comprend des seconds motifs conducteurs orientés vers une seconde direction perpendiculaire à la première direction et comprend une fente formée pour permettre à une partie de la première carte de circuit imprimé de capuchon de passer à travers celle-ci.
PCT/KR2023/014813 2022-09-28 2023-09-26 Dispositif électronique incluant un capteur d'empreintes digitales WO2024071989A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2022-0123312 2022-09-28
KR20220123312 2022-09-28
KR1020220151208A KR20240044291A (ko) 2022-09-28 2022-11-14 지문 센서를 포함하는 전자 장치
KR10-2022-0151208 2022-11-14

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WO2024071989A1 true WO2024071989A1 (fr) 2024-04-04

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120242635A1 (en) * 2009-10-30 2012-09-27 Validity Sensors, Inc., a Delaware Corporation Fingerprint sensor and integratable electronic display
US20170205928A1 (en) * 2016-01-19 2017-07-20 Japan Display Inc. Sensor-equipped display device
KR20170125778A (ko) * 2016-04-19 2017-11-15 삼성전자주식회사 지문 인식 기능을 지원하는 전자 장치 및 이의 운용 방법
KR20180130151A (ko) * 2017-05-29 2018-12-07 삼성전자주식회사 함몰 영역이 형성된 레이어에 실장된 모듈을 포함하는 전자 장치
KR20190119366A (ko) * 2018-04-12 2019-10-22 삼성전자주식회사 터치 센서 접합 구조를 포함하는 전자 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120242635A1 (en) * 2009-10-30 2012-09-27 Validity Sensors, Inc., a Delaware Corporation Fingerprint sensor and integratable electronic display
US20170205928A1 (en) * 2016-01-19 2017-07-20 Japan Display Inc. Sensor-equipped display device
KR20170125778A (ko) * 2016-04-19 2017-11-15 삼성전자주식회사 지문 인식 기능을 지원하는 전자 장치 및 이의 운용 방법
KR20180130151A (ko) * 2017-05-29 2018-12-07 삼성전자주식회사 함몰 영역이 형성된 레이어에 실장된 모듈을 포함하는 전자 장치
KR20190119366A (ko) * 2018-04-12 2019-10-22 삼성전자주식회사 터치 센서 접합 구조를 포함하는 전자 장치

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