WO2024080654A1 - Batterie et dispositif électronique comprenant celle-ci - Google Patents

Batterie et dispositif électronique comprenant celle-ci Download PDF

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Publication number
WO2024080654A1
WO2024080654A1 PCT/KR2023/015200 KR2023015200W WO2024080654A1 WO 2024080654 A1 WO2024080654 A1 WO 2024080654A1 KR 2023015200 W KR2023015200 W KR 2023015200W WO 2024080654 A1 WO2024080654 A1 WO 2024080654A1
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WIPO (PCT)
Prior art keywords
circuit board
battery
electronic device
flexible circuit
area
Prior art date
Application number
PCT/KR2023/015200
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English (en)
Korean (ko)
Inventor
김난새
김기대
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority claimed from KR1020220144303A external-priority patent/KR20240050201A/ko
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2024080654A1 publication Critical patent/WO2024080654A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/202—Casings or frames around the primary casing of a single cell or a single battery
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/284—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders with incorporated circuit boards, e.g. printed circuit boards [PCB]
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits

Definitions

  • This disclosure relates to batteries and electronic devices including them.
  • Electronic devices refer to devices that perform specific functions according to installed programs, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, video/audio devices, desktop/laptop computers, and vehicle navigation devices. It can mean. For example, these electronic devices can output stored information as sound or video. As the degree of integration of electronic devices increases and high-speed, high-capacity wireless communication becomes more common, recently, various functions can be installed in a single electronic device such as a mobile communication terminal. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music/video playback, communication and security functions such as mobile banking, and functions such as schedule management and electronic wallet are integrated into one electronic device. There is. These electronic devices are being miniaturized so that users can conveniently carry them.
  • An electronic device includes a housing, a circuit board disposed within the housing, a battery protection circuit module (PCM) disposed within the housing, and the battery protection circuit and the circuit board. It may include a battery including a flexible circuit board that is electrically connected.
  • the flexible circuit board includes a first region disposed along a side of the battery facing the circuit board, and a first direction in which the first region extends from the first region toward the circuit board. It may include a second region extending in a second, different direction.
  • An electronic device may include a battery including a housing, a circuit board disposed within the housing, and a flexible circuit board disposed within the housing and electrically connected to the circuit board.
  • the flexible circuit board includes a first region disposed along a side of the battery facing the circuit board, and a first direction in which the first region extends from the first region toward the circuit board. It may include a second area extending in a second, different direction, and the first area and the second area may be arranged so as not to overlap.
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to an embodiment disclosed in this document.
  • Figure 2 is a perspective view showing the front of an electronic device, according to an embodiment disclosed in this document.
  • FIG. 3 is a perspective view showing the rear of the electronic device shown in FIG. 2, according to an embodiment disclosed in this document.
  • FIG. 4A is an exploded perspective view of the front of the electronic device shown in FIG. 2 according to an embodiment disclosed in this document.
  • FIG. 4B is an exploded perspective view showing the rear of the electronic device shown in FIG. 2, according to an embodiment disclosed in this document.
  • Figure 5a is a perspective view schematically showing a battery including a flexible circuit board, according to an embodiment disclosed in this document.
  • FIG. 5B is a perspective view schematically showing a battery including a flexible circuit board according to a comparative example with respect to FIG. 5A.
  • FIG. 5C is a perspective view schematically showing a battery including a flexible circuit board according to a comparative example with respect to FIG. 5A.
  • FIG. 6 is a diagram showing a battery disposed in a housing, according to an embodiment disclosed in this document.
  • FIG. 7 is a view of a battery including a flexible circuit board viewed from the rear of an electronic device, according to an embodiment disclosed in this document.
  • Figure 8 is a perspective view of a battery including a flexible circuit board, viewed from one side, according to an embodiment disclosed in this document.
  • FIG. 9 is a perspective view schematically showing a battery including a flexible circuit board disposed in a housing, according to an embodiment disclosed in this document.
  • Figure 10 is a cross-sectional view showing the arrangement relationship between the flexible circuit board of the housing and the battery, according to an embodiment disclosed in this document.
  • Electronic devices may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-described devices.
  • first, second, or first or second may be used simply to distinguish one component from another, and to refer to those components in other respects (e.g., importance or order) is not limited.
  • One (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.”
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. It can be used as A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately placed in other components. there is.
  • one or more of the above-described corresponding components or operations may be omitted, or one or more other components or operations may be added.
  • multiple components eg, modules or programs
  • the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component of the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, or omitted. Alternatively, one or more other operations may be added.
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to an embodiment disclosed in this document.
  • the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • a first network 198 e.g., a short-range wireless communication network
  • a second network 199 e.g., a long-distance wireless communication network.
  • the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197.
  • at least one of these components eg, the connection terminal 178) may be omitted, or one or more other components may be added to the electronic device 101.
  • some of these components are integrated into one component (e.g., display module 160). It can be.
  • the processor 120 for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • software e.g., program 140
  • the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132.
  • the commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • the processor 120 includes a main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor).
  • a main processor 121 e.g., a central processing unit or an application processor
  • auxiliary processor 123 e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor.
  • the electronic device 101 includes a main processor 121 and a secondary processor 123
  • the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can.
  • the auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.
  • the auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled.
  • co-processor 123 e.g., image signal processor or communication processor
  • may be implemented as part of another functionally related component e.g., camera module 180 or communication module 190. there is.
  • the auxiliary processor 123 may include a hardware structure specialized for processing artificial intelligence models.
  • Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself, where artificial intelligence is performed, or may be performed through a separate server (e.g., server 108).
  • Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited.
  • An artificial intelligence model may include multiple artificial neural network layers.
  • Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above.
  • artificial intelligence models may additionally or alternatively include software structures.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto.
  • Memory 130 may include volatile memory 132 or non-volatile memory 134.
  • the program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.
  • the input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user).
  • the input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).
  • the sound output module 155 may output sound signals to the outside of the electronic device 101.
  • the sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback.
  • the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.
  • the display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user).
  • the display module 160 may include, for example, a display, a hall area programmable device, or a projector and a control circuit for controlling the device.
  • the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.
  • the audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).
  • the electronic device 102 e.g., speaker or headphone
  • the sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do.
  • the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.
  • the interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card interface
  • audio interface audio interface
  • connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 can capture still images and moving images.
  • the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 can manage power supplied to the electronic device 101.
  • the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101.
  • the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
  • Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication.
  • processor 120 e.g., an application processor
  • the communication module 190 may be a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included.
  • a wireless communication module 192 e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 e.g., : LAN (local area network) communication module, or power line communication module
  • the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network
  • the wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199.
  • subscriber information e.g., International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology).
  • NR access technology provides high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access to multiple terminals (massive machine type communications (mMTC)), or ultra-reliable and low-latency (URLLC). -latency communications)) can be supported.
  • the wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates.
  • the wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing.
  • MIMO massive array multiple-input and multiple-output
  • the wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC.
  • Peak data rate e.g., 20 Gbps or more
  • loss coverage e.g., 164 dB or less
  • U-plane latency e.g., 164 dB or less
  • the antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device).
  • the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB).
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected to the plurality of antennas by, for example, the communication module 190. can be selected. Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna.
  • other components eg, radio frequency integrated circuit (RFIC) may be additionally formed as part of the antenna module 197.
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • a mmWave antenna module includes: a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.
  • a mmWave antenna module includes: a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side)
  • peripheral devices e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • signal e.g. commands or data
  • commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199.
  • Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101.
  • all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108.
  • the electronic device 101 may perform the function or service instead of executing the function or service on its own.
  • one or more external electronic devices may be requested to perform at least part of the function or service.
  • One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101.
  • the electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request.
  • cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology can be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of Things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or server 108 may be included in the second network 199.
  • the electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.
  • Figure 2 is a perspective view showing the front of an electronic device, according to an embodiment disclosed in this document.
  • FIG. 3 is a perspective view showing the rear of the electronic device shown in FIG. 2, according to an embodiment disclosed in this document.
  • the electronic device 101 (e.g., the electronic device 101 of FIG. 1) according to one embodiment has a first side (or front) 110A and a second side (or back). It may include a housing 110 including (110B), and a side (110C) surrounding the space between the first surface (110A) and the second surface (110B). In one embodiment (not shown), housing 110 may refer to a structure that forms part of the first side 110A of FIG. 2, the second side 110B and the side surfaces 110C of FIG. 3. there is.
  • the first surface 110A may be formed at least in part by a substantially transparent front plate 102 (eg, a glass plate including various coating layers, or a polymer plate).
  • the second surface 110B may be formed by a substantially opaque back plate 111.
  • the back plate 111 may be formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. You can.
  • Side 110C joins front plate 102 and back plate 111 and may be formed by a side structure (or “side bezel structure”) 118 comprising metal and/or polymer.
  • the back plate 111 and the side structure 118 may be integrally formed and include the same material (eg, a metallic material such as aluminum).
  • the front plate 102 may include a region(s) that is curved toward the back plate 111 at least a portion of the edge and extends seamlessly.
  • the front plate 102 (or the back plate 111) is bent toward the back plate 111 (or the front plate 102) so that only one of the extended areas is at one edge of the first side 110A. It can be included.
  • the front plate 102 or the rear plate 111 may have a substantially flat plate shape, and in this case, may not include a curved extended area.
  • the thickness of the electronic device 101 in the portion containing the curved and extended region may be smaller than the thickness of other portions.
  • the electronic device 101 includes a display 101, an audio module (e.g., microphone hall 103, external speaker hall 107, call receiver hall 114), and a sensor module (e.g., First sensor module 104, second sensor module (not shown), third sensor module 119), camera module (e.g., first camera device 105, second camera device 112, flash 113) )), a key input device 117, a light emitting element 106, and a connector hole (eg, a first connector hole 108 and a second connector hole 109).
  • the electronic device 101 may omit at least one of the components (eg, the key input device 117 or the light emitting device 106) or may additionally include another component.
  • the display 101 may output a screen or be visually exposed through a significant portion of the first side 110A (eg, the front plate 102).
  • the display 101 may be visually exposed through the front plate 102 forming the first surface 110A or through a portion of the side surface 110C.
  • the edges of the display 101 may be formed to be substantially the same as the adjacent outer shape of the front plate 102.
  • the distance between the outer edge of the display 101 and the outer edge of the front plate 102 may be formed to be substantially the same.
  • a recess or an opening is formed in a portion of the screen display area of the display 101, and an audio module (e.g., a receiver hole for a call (e.g., a receiver hole for a call) is aligned with the recess or the opening. 114)), a sensor module (e.g., the first sensor module 104), a camera module (e.g., the first camera device 105), and a light emitting element 106.
  • an audio module e.g., call receiver hole 114
  • a sensor module e.g., first sensor module 104
  • a camera e.g., the back of the screen display area of the display 101.
  • the display 101 may include at least one of a module (eg, the first camera device 105), a fingerprint sensor (not shown), and a light emitting device 106.
  • the display 101 is coupled to or adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of touch, and/or a digitizer that detects a magnetic field-type stylus pen. can be placed.
  • the audio modules 103, 107, and 114 may include a microphone hole 103 and a speaker hole (eg, an external speaker hole 107 and a call receiver hole 114).
  • a microphone for acquiring external sound may be placed inside the microphone hole 103, and in one embodiment, a plurality of microphones may be placed to detect the direction of the sound.
  • the speaker hole may include an external speaker hole 107 and a receiver hole 114 for a call.
  • the speaker hall e.g., external speaker hall 107, call receiver hall 114
  • microphone hole 103 are implemented as one hall, or the speaker hall (e.g., external speaker hall 107, call receiver hall 114) is implemented as one hall.
  • a speaker may be included (e.g., piezo speaker) without a receiver hole (114).
  • the sensor module may generate an electrical signal or data value corresponding to the internal operating state of the electronic device 101 or the external environmental state.
  • the sensor module may include, for example, a first sensor module 104 (e.g., a proximity sensor) and/or a second sensor module (not shown) (e.g., a fingerprint) disposed on the first side 110A of the housing 110. sensor), and/or a third sensor module 119 disposed on the second surface 110B of the housing 110.
  • the second sensor module (not shown) (e.g., fingerprint sensor) may be disposed on the first side 110A (e.g., display 101) as well as the second side 110B or side 110C of the housing 110. You can.
  • the electronic device 101 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor. It may further include at least one of (104).
  • the camera module includes a first camera device 105 disposed on the first side 110A of the electronic device 101, and a second camera device 112 disposed on the second side 110B. , and/or may include a flash 113.
  • the camera devices eg, the first camera device 105 and the second camera device 112 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash 113 may include, for example, a light emitting diode or a xenon lamp.
  • one or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be placed on one side of the electronic device 101.
  • the flash 113 may emit infrared rays, and the infrared rays emitted by the flash 113 and reflected by the subject may be received through the third sensor module 119.
  • the electronic device 101 or a processor of the electronic device 101 e.g., processor 120 in FIG. 1 may detect depth information of the subject based on the point in time when infrared rays are received from the third sensor module 119. .
  • the key input device 117 may be disposed on the side 110C of the housing 110.
  • the electronic device 101 may not include some or all of the key input devices 117 mentioned above, and the key input devices 117 not included may be other than soft keys on the display 101. It can be implemented in the form
  • the key input device may include a sensor module disposed on the second side 110B of the housing 110.
  • the light emitting device 106 may be disposed on, for example, the first surface 110A of the housing 110.
  • the light emitting device 106 may provide status information of the electronic device 101 in the form of light.
  • the light emitting device 106 may provide a light source that is linked to the operation of a camera module (eg, the first camera device 105).
  • the light emitting device 106 may include, for example, an LED, an IR LED, and a xenon lamp.
  • the connector hole (e.g., the first connector hole 108, the second connector hole 109) connects an external electronic device (e.g., the electronic device 1002 of FIG. 1) with power and/or data.
  • a first connector hole 108 capable of accommodating a connector for transmitting and receiving a connector (e.g., a USB connector), and/or a second connector hole capable of accommodating a connector for transmitting and receiving an audio signal with an external electronic device ( For example, it may include an earphone jack) (109).
  • FIG. 4A is an exploded perspective view of the front of the electronic device shown in FIG. 2 according to an embodiment disclosed in this document.
  • FIG. 4B is an exploded perspective view showing the rear of the electronic device shown in FIG. 2, according to an embodiment disclosed in this document.
  • the electronic device 101 (e.g., the electronic device 101 of FIG. 1, 2, or 3) includes a side structure 210 and a first support member 211 (e.g., a bracket ), front plate 220 (e.g., front plate 102 in Figure 2), display 230 (e.g., display 101 in Figures 2 and 3), printed circuit board (or board assembly) 240 , it may include a battery 250, a second support member 260 (e.g., rear case), an antenna, a camera assembly 207, and a back plate 280 (e.g., back plate 111 in FIG. 3).
  • a first support member 211 e.g., a bracket
  • front plate 220 e.g., front plate 102 in Figure 2
  • display 230 e.g., display 101 in Figures 2 and 3
  • printed circuit board (or board assembly) 240 it may include a battery 250, a second support member 260 (e.g., rear case), an antenna, a camera assembly 207,
  • the electronic device 101 may omit at least one of the components (e.g., the first support member 211 or the second support member 260) or may additionally include another component. there is. At least one of the components of the electronic device 101 may be the same or similar to at least one of the components of the electronic device 101 of FIG. 2 or 3, and overlapping descriptions will be omitted below.
  • the first support member 211 may be disposed inside the electronic device 101 and connected to the side structure 210, or may be formed integrally with the side structure 210.
  • the first support member 211 may be formed of, for example, a metallic material and/or a non-metallic (eg, polymer) material. When formed at least partially of a metal material, a portion of the side structure 210 or the first support member 211 may function as an antenna.
  • the first support member 211 may have a display 230 coupled to one side and a printed circuit board 240 to the other side.
  • the printed circuit board 240 includes a processor (e.g., processor 120 in FIG. 1), a memory (e.g., memory 130 in FIG.
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • the first support member 211 and the side structure 210 may be combined and referred to as a front case or housing 201.
  • the housing 201 may be generally understood as a structure for accommodating, protecting, or disposing the printed circuit board 240 or the battery 250.
  • the housing 201 includes a structure that can be visually or tactilely recognized by the user on the exterior of the electronic device 101, for example, a side structure 210, a front plate 220, and/or It may be understood as including a rear plate 280.
  • 'the front or rear of the housing 201' may mean the first side 110A of FIG. 2 or the second side 110B of FIG. 3.
  • the first support member 211 includes a front plate 220 (e.g., first side 110A in FIG. 2) and a back plate 280 (e.g., second side 110B in FIG. 3). It is disposed between them and may function as a structure for arranging electrical/electronic components such as a printed circuit board 240 or a camera assembly 207.
  • the display 230 may include a display panel 231 and a flexible printed circuit board 233 extending from the display panel 231.
  • the flexible printed circuit board 233 may be understood as being at least partially disposed on the rear side of the display panel 231 and electrically connected to the display panel 231.
  • reference number '231' may be understood as a protection sheet disposed on the rear of the display panel.
  • the protection sheet may be understood as being a part of the display panel 231.
  • the protective sheet may function as a buffering structure that absorbs external force (eg, a low-density elastomer such as a sponge) or an electromagnetic shielding structure (eg, a copper sheet (CU sheet)).
  • the display 230 may be disposed on the inner side of the front plate 220, and may include a light emitting layer to display the screen through at least a portion of the first side 110A of FIG. 2 or the front plate 220. can be output. As mentioned above, the display 230 may output a screen substantially through the entire area of the first side 110A or the front plate 220 of FIG. 2 .
  • the memory may include, for example, volatile memory or non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • the interface may electrically or physically connect the electronic device 101 to an external electronic device and may include a USB connector, SD card/MMC connector, or audio connector.
  • the second support member 260 may include, for example, an upper support member 260a and a lower support member 260b.
  • the upper support member 260a may be disposed to surround the printed circuit board 240 together with a portion of the first support member 211.
  • Circuit devices e.g., processors, communication modules, or memory
  • various electrical/electronic components implemented in the form of integrated circuit chips may be placed on the printed circuit board 240.
  • the printed circuit board 240 An electromagnetic shielding environment can be provided from the upper support member 260a.
  • the lower support member 260b may be utilized as a structure that can place electrical/electronic components such as a speaker module and an interface (e.g., USB connector, SD card/MMC connector, or audio connector).
  • electrical/electronic components such as speaker modules and interfaces (eg, USB connectors, SD card/MMC connectors, or audio connectors) may be placed on additional printed circuit boards, not shown.
  • the lower support member 260b may be arranged to surround an additional printed circuit board together with another part of the first support member 211.
  • the speaker module or interface disposed on the additional printed circuit board or lower support member 260b, not shown, may be connected to the audio module of FIG. 2 (e.g., microphone hole 103 or speaker hole (e.g., external speaker hole 107), call It may be disposed corresponding to the receiver hole 114) or the connector hole (eg, the first connector hole 108 and the second connector hole 109).
  • it may be disposed correspondingly to the audio module 207 or the connector holes 108 and 109.
  • the battery 250 is a device for supplying power to at least one component of the electronic device 101, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or fuel. It may include a battery. At least a portion of the battery 250 may be disposed, for example, on substantially the same plane as the printed circuit board 240 . The battery 250 may be placed integrally within the electronic device 101, or may be placed to be detachable from the electronic device 101.
  • the electronic device 101 may further include a separate sub-circuit board 290 within the first support member 211 and spaced apart from the printed circuit board 240.
  • the sub-circuit board 290 may be electrically connected to the printed circuit board 240 through a connection member such as a flexible connection board or cable.
  • the sub-circuit board 290 is electrically connected to electrical components disposed in the end area of the electronic device 101, such as the battery 289 or a speaker, USB connector, antenna connector, and/or SIM socket, to provide signals and power. can be conveyed.
  • the antenna may include a conductor pattern implemented on the surface of the second support member 260 through, for example, a laser direct structuring method.
  • the antenna may include a printed circuit pattern formed on the surface of the thin film, and the antenna in the form of a thin film may be disposed between the rear plate 280 and the battery 250.
  • Antennas may include, for example, near field communication (NFC) antennas, wireless charging antennas, and/or magnetic secure transmission (MST) antennas.
  • NFC near field communication
  • MST magnetic secure transmission
  • the antenna can perform short-distance communication with an external device or wirelessly transmit and receive power required for charging.
  • another antenna structure may be formed by part or a combination of the side structure 210 and/or the first support member 211.
  • camera assembly 207 may include at least one camera module. Inside the electronic device 101, the camera assembly 207 may receive at least a portion of the light incident through the optical hole or the camera window 212, 213, or 219. In one embodiment, camera assembly 207 may be placed on first support member 211 at a location adjacent printed circuit board 240 . In one embodiment, the camera module(s) of camera assembly 207 may be generally aligned with any one of camera windows 212, 213, 219 and at least partially aligned with second support member 260 (e.g., It can be wrapped around the upper support member (260a).
  • Figure 5a is a perspective view schematically showing a battery including a flexible circuit board, according to an embodiment disclosed in this document.
  • FIG. 5B is a perspective view schematically showing a battery including a flexible circuit board according to a comparative example with respect to FIG. 5A.
  • FIG. 5C is a perspective view schematically showing a battery including a flexible circuit board according to a comparative example with respect to FIG. 5A.
  • FIG. 6 is a diagram showing a battery disposed in a housing, according to an embodiment disclosed in this document.
  • FIG. 7 is a view of a battery including a flexible circuit board viewed from the rear of an electronic device, according to an embodiment disclosed in this document.
  • Figure 8 is a perspective view of a battery including a flexible circuit board, viewed from one side, according to an embodiment disclosed in this document.
  • the electronic device 101 includes a housing 201, a main circuit board 301 disposed within the housing 201 (e.g., printed circuit board 240 in FIGS. 4A and 4B), and a battery 250. ) may include.
  • the housing 201 may include a first support member 211 and a side structure 210.
  • the first support member 211 and the side structure 210 may be combined and referred to as a front case or housing 201.
  • the first support member 211 includes a first part (P1) and a second part (P2) extending from the first part (P1), and the main circuit board 301 and the battery 250 ) can be accepted and supported.
  • the main circuit board 301 may be placed on the first part (P1) of the first support member 211, and the battery 250 may be placed on the second part (P2).
  • the battery 250 of FIGS. 5A, 6, 7, and 8, the housing 201 of FIG. 6, and the main circuit board 301 include the battery 250 and housing 201 of FIGS. 4A and 4B. Some or all of it may be the same as the printed circuit board 240.
  • the structures of FIGS. 5A, 6, 7, and 8 may be selectively combined with the structures of FIGS. 4A and 4B.
  • the battery 250 may be mounted in a seating groove formed in the first support member 211 (eg, bracket) of the electronic device 101.
  • the battery 250 may include a battery cell 251, a battery protection circuit 252 (eg, a protection circuit module (PCM)), and a flexible circuit board 300.
  • PCM protection circuit module
  • the battery cell 251 is an electrode assembly and may include a negative electrode sheet, a positive electrode sheet, and at least one separator.
  • the battery 250 may further include a pouch for storing the electrode assembly.
  • the battery cell 251 may have a wound structure, and a negative electrode sheet may be disposed on one side of the at least one separator, and a positive electrode sheet may be disposed on the other side.
  • the cathode sheet, at least one separator, and anode sheet may be wrapped together into a roll shape.
  • the battery cell 251 may be a flexible jelly roll type secondary battery that can be reversibly bent, and the jelly roll type secondary battery includes the negative electrode sheet, the positive electrode sheet, and the negative electrode sheet.
  • one surface of the battery cell 251 or the battery 250 may be provided in a flat rectangular shape corresponding to the shape of the seating groove.
  • the negative electrode sheet and the positive electrode sheet of the battery cell 251 may be arranged to face each other in shapes corresponding to each other, and a negative electrode tab 253b protruding to the outside is provided on one side of the negative electrode sheet, An anode tab 253a protruding outward may be provided on one side of the anode sheet.
  • the cathode tab 253b and/or the anode tab 253a may be formed to protrude toward the main circuit board 301.
  • the negative electrode tab 253b and the positive electrode tab 253a may protrude to a corresponding length and face each other in a spaced apart manner.
  • the battery protection circuit 252 is disposed on one side of the battery cell 251 and may be electrically connected to the negative tab 253b and the positive tab 253a protruding from the battery cell 251.
  • the battery protection circuit 252 may be formed to extend along the upper side of the battery cell 251 (eg, the side facing the main circuit board 301).
  • the battery protection circuit 252 is a module for controlling and protecting the inside of the battery cell 251, and can prevent overcharging and/or overdischarging of the battery cell 251.
  • the battery protection circuit 252 has a first side 252a facing the rear of the electronic device 101 (e.g., one side in the -Z-axis direction) and the first side 252a facing the front of the electronic device 101 (e.g., one side in the +Z-axis direction). It may include a second side 252b facing, and a side 252c facing the main circuit board 301.
  • the flexible circuit board 300 is disposed on one side of the battery protection circuit 252 (or battery cell 251), and is connected to the battery protection circuit 252 (or battery cell 251) and the main circuit board. (301) can be electrically connected.
  • the flexible circuit board 300 may be located between the battery protection circuit 252 and the main circuit board 301.
  • the flexible circuit board 300 may include a first end 330a, a first region 310, a second region 320, and a second end 330b.
  • the first area 310 may be disposed along the side of the battery 250 (eg, battery protection circuit 252) facing the main circuit board 301.
  • the first area 310 may be in contact with the side surface 252c of the battery protection circuit 252 and may extend along a first direction (eg, X-axis direction).
  • the first area 310 may be spaced apart from the side surface 252c of the battery protection circuit 252 and may extend along a first direction (eg, X-axis direction).
  • the second area 320 is arranged to face the main circuit board 301 from the first area 310 and extends in a second direction (e.g., Y-axis direction) different from the first direction (e.g., X-axis direction). can be placed.
  • a second direction e.g., Y-axis direction
  • X-axis direction e.g., X-axis direction
  • the first end 330a of the flexible circuit board 300 extends from one end of the first area 310 and may contact the battery protection circuit 252 for electrical connection.
  • the first end 330a may overlap a portion of the first surface 252a of the battery protection circuit 252.
  • the first end 330a of the flexible circuit board 300 is located in the center area of the first side 252a of the battery protection circuit 252 and extends toward the main circuit board 301. It can be.
  • the first end 330a is located between the positive electrode tab 253a and the negative electrode tab 253b of the battery cell 251, and at least a portion of the first area 310 extending from the first end 330a It may also be located between the anode tab 253a and the cathode tab 253b of the battery cell 251 (hereinafter referred to as front-drawn structure).
  • the second end 330b of the flexible circuit board 300 extends from one end of the second area 320 and may contact the main circuit board 301 for electrical connection.
  • the second end 330b may overlap a portion of one side of the main circuit board 301 (eg, one side facing the -Z axis).
  • a connecting member may be disposed at the second end 330b to be electrically connected to the main circuit board 301.
  • the connection member may include, for example, at least one of a Con to Con connector, a clip type connector, a coaxial cable connector, or an interposer.
  • the first area 310 and the second area 320 of the flexible circuit board 300 may be arranged so as not to overlap.
  • the first direction (e.g., X-axis direction) in which the first area 310 extends and the second direction (e.g., Y-axis direction) in which the second area 320 extends may be substantially perpendicular.
  • the first direction in which the first area 310 extends (e.g., X-axis direction) and the second direction in which the second area 320 extends (e.g., Y-axis direction) may be approximately 90 degrees or more.
  • the design may be modified into various shapes that do not overlap each other (e.g., the flexible circuit board 300 is not bent approximately 180 degrees).
  • the first region 310 of the flexible circuit board 300 may extend along the +X-axis direction or may extend along the -X-axis direction.
  • the first end 330a may be located between the positive electrode tab 253a and the negative electrode tab 253b of the battery cell 251.
  • the first area 310 extending from the first end 330a may be formed along the -X-axis direction or the +X-axis direction through design changes.
  • the flexible circuit board of the battery when the flexible circuit board of the battery is formed in a structure that is drawn out from the side of the battery (hereinafter referred to as the side draw structure), a solder pad connecting the flexible circuit board and the battery protection circuit is used. (solder pad) Additionally, it may be a structure placed on the side of the battery.
  • the wiring length of the flexible circuit board must be designed differently depending on the battery model, and as the wiring length changes (e.g. becomes longer), direct current resistance may increase, which may result in increased material costs and inconvenience in the design process. there is.
  • the front drawing structure of the flexible circuit board 300 (300a) can be applied to various battery models by changing only a part of the structure of the flexible circuit board 300, thereby providing common use of battery parts.
  • the first area 310 of the flexible circuit board 300 may be formed to have a larger area than the second area 320.
  • the first area 310 extending along the side 252c of the battery protection circuit 252 is the second area 320 extending by the distance between the battery protection circuit 252 and the main circuit board 301. ) may have an area approximately 2 to 4 times larger than that of the area.
  • the battery 250 may generate high heat due to the resistance component of the charging wiring during high-speed charging.
  • high heat is generated in the battery protection circuit 252 and the flexible circuit board 300 of the battery 250, and the flexible circuit board 300 is attached to the housing 201 (e.g., the back plate 280 of FIG. 9B). )), the surface temperature of the electronic device may increase.
  • the flexible circuit board 300 is designed so as not to overlap, so that the battery 250 and its surroundings (e.g., electronics) Heat generated from the surface of the device 101 can be reduced.
  • a lot of heat may be generated in area A of the flexible circuit board 303 of FIG. 5B because there are overlapping substrate areas.
  • the area A may generate a current of approximately 18A due to the overlapping charging wires.
  • the flexible circuit board 300 can be designed so that no overlapping areas occur in the entire area. Accordingly, heat generation performance according to dispersion of the heat source can be improved.
  • the overlapping area between the flexible circuit board 300 and other heat sources is reduced. It can be designed. Accordingly, heat generated in the battery 250 and its surroundings can be reduced.
  • the area B of the flexible circuit board 303 in FIG. 5B has a contact area with the battery protection circuit 252, which is one of the main heat sources, so that the area is relatively large compared to the flexible circuit board 300 in FIG. 5A. It is placed. As area B of the flexible circuit board 303 in FIG. 5B overlaps the battery protection circuit 252, a lot of heat may be generated.
  • the first area 310 of the flexible circuit board 300 of FIG. 5A is in contact with the side 252c of the battery protection circuit 252, but the area of the first area 310 is smaller than that of FIG. 5B.
  • heat generation performance can be improved by dispersing the heat source.
  • the flexible circuit board 300 of FIG. 5A is designed so that the area of the first end 330a facing the -Z axis is relatively small compared to the area B of the flexible circuit board 303 of FIG. 5B. It can be. Accordingly, the overlap area between the housing disposed toward the -Z axis (e.g., the back plate 280 in FIG. 4b) and the flexible circuit board 300 is provided to be small, which may limit the increase in the surface temperature of the electronic device. You can. According to one embodiment (see FIG. 5A), compared to the comparative embodiment (see FIG. 5B), by reducing the length of the flexible circuit board 300, heat generated in and around the battery 250 can be reduced. You can.
  • the flexible circuit board 303 of FIG. 5B is arranged to have a relatively longer length than the flexible circuit board 300 of FIG. 5A.
  • the length of the flexible circuit board 300 in FIG. 5A is designed to be approximately 1/2 or less compared to the length of the flexible circuit board 303 in FIG. 5B, thereby reducing heat generation of the circuit board itself. Heat generation performance can be improved.
  • a circuit board with increased layers can be provided by reducing the bending angle of the flexible circuit board 300.
  • the maximum charge current of the battery must be designed to be 10A or more.
  • the width of the flexible circuit board must be expanded or the layers of the board must be increased from 2 to 3 layers or more (e.g. : It must be increased to 4 layers.
  • the second region 320 may be formed substantially vertically or may be formed at a bending angle of 90 degrees or more.
  • the flexible circuit board 300 By constructing the flexible circuit board 300 that does not bend sharply, it is possible to form a circuit board with three or more layers (e.g., four layers) that allows for free design of the number of layers and enables fast charging.
  • the flexible circuit board 300 according to the present disclosure is not limited to a design with three or more layers, and can provide a battery charging path through a two-layer design for 15W/25W charging.
  • FIG. 9 is a perspective view schematically showing a battery including a flexible circuit board disposed in a housing, according to an embodiment disclosed in this document.
  • Figure 10 is a cross-sectional view showing the arrangement relationship between the flexible circuit board of the housing and the battery, according to an embodiment disclosed in this document.
  • the electronic device 101 includes a housing (e.g., the housing 201 in FIG. 6) and a main circuit board 301 disposed within the housing (e.g., the printed circuit board 240 in FIGS. 4A and 4B). ) and a battery 250.
  • the housing 201 includes a front plate 220 (e.g., front plate 102 in FIG. 2), a rear plate 280 (e.g., rear plate 111 in FIG. 3), a first support member 210, and a first support member 210. 2 It may include a support member 260 (e.g. bracket).
  • the first support member 211 includes a first part (P1) and a second part (P2) extending from the first part (P1) and includes the main circuit board 301 and the battery 250.
  • P1 a first part
  • P2 a second part
  • the main circuit board 301 may be placed on the first part (P1) of the first support member 211
  • the battery 250 may be placed on the second part (P2).
  • the housing 201, main circuit board 301, and battery 250 of FIGS. 9 and 10 are similar to the housing 201, main circuit board 301, and battery of FIGS. 5A, 6, 7, and 8. It may be partially or entirely the same as (250).
  • the structures of FIGS. 9 and 10 may be selectively combined with the structures of FIGS. 5A, 6, 7, and 8.
  • the battery 250 may include a battery cell 251, a battery protection circuit 252 (eg, protection circuit module (PCM)), and a flexible circuit board 300.
  • PCM protection circuit module
  • the battery protection circuit 252 may be disposed on one side of the battery cell 251 and electrically connected to the battery cell 251.
  • the battery protection circuit 252 may be formed to extend along the upper side of the battery cell 251 (eg, the side facing the main circuit board 301).
  • the battery protection circuit 252 has a first side 252a facing the rear of the electronic device 101 (e.g., one side in the -Z-axis direction) and the first side 252a facing the front of the electronic device 101 (e.g., one side in the +Z-axis direction). It may include a second side 252b facing, and a side 252c facing the main circuit board 301.
  • the flexible circuit board 300 may include a first end 330a, a first region 310, a second region 320, and a second end 330b.
  • the first area 310 may be disposed along the side of the battery 250 (eg, battery protection circuit 252) facing the main circuit board 301.
  • the first area 310 may be in contact with the side surface 252c of the battery protection circuit 252 and may extend along a first direction (eg, X-axis direction).
  • the second area 320 is arranged to face the main circuit board 301 from the first area 310 and extends in a second direction (e.g., Y-axis direction) different from the first direction (e.g., X-axis direction). can be placed.
  • the flexible circuit board 300 of the battery 250 is in contact with the housing 201 (e.g., the rear plate 280). During this time, the surface temperature of the electronic device may increase.
  • the flexible circuit board 300 of the battery 250 may be arranged to overlap the rear plate 280 to a small extent. According to one embodiment, the flexible circuit board 300 of the battery 250 may be placed so as not to contact the rear plate 280.
  • the first area 310 of the flexible circuit board 300 occupies a significant portion (for example, about half) of the flexible circuit board 300, and the first area 310 is entirely located on the rear surface. It may have little overlap with the plate 280 or may be spaced apart.
  • the second area 320 of the flexible circuit board 300 may also have little overlap with the back plate 280 or may be spaced apart from the rear plate 280 .
  • the first area 310 is disposed at a relatively long distance from the rear plate 280 compared to the second area 320 and other parts (e.g., the first end 330a and the second end 330b). It can be.
  • the flexible circuit board 300 does not overlap or make contact with the rear plate 280 and is disposed along the side 252c of the battery protection circuit 252, thereby reducing overall surface heat generation of the electronic device.
  • high heat may be generated in the battery protection circuit 252 of the battery 250 and the flexible circuit board 300.
  • at least a portion of the flexible circuit board 300 of the battery 250 is placed in contact with the first support member 210 of the housing 201, thereby dissipating heat generated from the flexible circuit board 300. It can spread throughout the electronic device.
  • the first support member 211 may include a first part (P1) where the main circuit board 301 is placed, and a second part (P2) where the battery 250 is placed.
  • the second part (P2) includes a support surface 211a on which the battery 250 rests and a partition 211b that extends substantially perpendicular to the support surface 211a and is formed to surround at least a portion of the battery 250. It can be included.
  • the partition wall 211b may have a rib structure to separate the battery 250 and the main circuit board 301.
  • At least a portion of the flexible circuit board 300 may be placed in contact with the support surface 211a and/or the partition wall 211b of the first support member 211.
  • one side of the first area 310 of the flexible circuit board 300 e.g., the edge of the first area 310) is arranged to make line contact (C) with the support surface 211a, thereby forming the flexible circuit board.
  • a heat transfer path may be provided so that the heat of 300 is spread throughout the electronic device through the first support member 211.
  • One side of the first region 310 of the flexible circuit board 300 (e.g., one side of the first region 310 facing the main circuit board 301) is arranged to make surface contact (D) with the partition wall 211b, A heat transfer path may be provided so that the heat of the flexible circuit board 300 is spread throughout the electronic device through the first support member 211.
  • a portable electronic device includes a battery and a main circuit board, and the battery may include a flexible circuit board for electrically connecting the battery cell and the main circuit board.
  • the structure of the flexible circuit board of the battery in the electronic device is changed to prevent heat generated from the battery from concentrating on one part of the surface of the electronic device (e.g., to prevent hot spots from occurring). can do.
  • the flexible circuit board of the battery is formed so as not to overlap as a whole or the area overlapping with the battery protection circuit module (PCM) is reduced, the temperature generated in the battery and adjacent areas The rise can be suppressed.
  • PCM battery protection circuit module
  • the flexible circuit board of the battery is arranged to be spaced apart from the exterior material of the electronic device, thereby suppressing temperature rise occurring in the battery and adjacent areas.
  • direct current resistance can be reduced and temperature rise occurring in the battery and adjacent areas can be suppressed.
  • the number of layers can be increased to provide a design advantageous for fast charging.
  • the diffusion of heat can be increased by placing the flexible circuit board of the battery in contact with the internal support member of the electronic device.
  • the flexible circuit board of the battery can be formed to be drawn out from near the center of the battery protection circuit rather than from the side, so that it can be applied to various models with different battery connector positions.
  • the electronic device 101 includes a housing 201, a circuit board (240 in FIGS. 4A and 4B; 301 in FIG. 6) disposed in the housing, and a battery protection device. It may include a battery 250 including a circuit 252 (protection circuit module (PCM)) and a flexible circuit board 300 that electrically connects the battery protection circuit and the circuit board.
  • the flexible circuit board includes a first region 310 disposed along a side of the battery facing the circuit board, and a second region 310 disposed toward the circuit board from the first region and extending the first region. It may include a second area 320 extending in a second direction (Y-axis direction) that is different from the first direction (X-axis direction).
  • the first area 310 of the flexible circuit board extends above the side 252c of the battery protection circuit 252, and the first area and the second area are arranged so as not to overlap. You can.
  • the first area 310 of the flexible circuit board is spaced apart from the side 252c of the protection circuit 252 and may overlap with at least a portion of the circuit board.
  • the battery 250 may further include a battery cell 251 and a positive electrode tab 253a and a negative electrode tab 253b protruding from the battery cell toward the circuit board. At least a portion of the first area of the flexible circuit board may be located between the anode tab and the cathode tab.
  • the flexible circuit board 300 may include a first end 330a and a second end 330b forming both ends.
  • the first end extends from one end of the first area and is disposed to overlap so as to be electrically connected to the battery protection circuit, and the second end extends from one end to the second area and is electrically connected to the circuit board. They can be placed overlapping as much as possible.
  • the battery 250 further includes a battery cell 251 and a positive electrode tab 253a and a negative electrode tab 253b protruding from the battery cell toward the circuit board, and the flexible circuit board.
  • the first end and at least a portion of the first region may be located between the anode tab and the cathode tab.
  • the housing may include a front plate 220 and a rear plate 280.
  • the flexible circuit board may be spaced apart from the front plate or the rear plate.
  • the battery protection circuit may include a first surface 252a facing the rear of the electronic device, and a side 252c perpendicular to the first surface and facing the circuit board.
  • the direction in which the first region of the flexible circuit board faces may be arranged substantially perpendicular to the rear plate.
  • the housing includes a support member 211 that provides a space for mounting the battery and the circuit board, and at least a portion of the support member is disposed in contact with the first region of the flexible circuit board. It can be.
  • the support member may include a support surface 211a for supporting the battery and a partition 211b extending in a direction substantially perpendicular to the support surface and formed to surround at least a portion of the battery. You can.
  • One side of the first region of the flexible circuit board may be arranged to be in line contact with the support surface so that heat from the flexible circuit board is transferred to the support member.
  • one surface of the first region of the flexible circuit board may be arranged to make surface contact with the partition wall so that heat of the flexible circuit board is transferred to the support member.
  • the first region or the second region of the flexible circuit board may be formed of at least three substrate layers.
  • the first region of the flexible circuit board may be disposed between the circuit board and the battery protection circuit, and at least a portion of the second region of the flexible circuit board may be disposed to overlap the circuit board. there is.
  • the first direction in which the first region of the flexible circuit board extends and the second direction in which the second region extends may be 90 degrees or more.
  • the first direction in which the first region of the flexible circuit board extends and the second direction in which the second region extends may be substantially perpendicular.
  • the electronic device 101 includes a housing 201, a circuit board (240 in FIGS. 4A and 4B; 301 in FIG. 6) disposed in the housing, and a circuit disposed in the housing. It may include a battery 250 including a flexible circuit board 300 electrically connected to the substrate.
  • the flexible circuit board includes a first region 310 disposed along a side of the battery facing the circuit board, and a second region 310 disposed toward the circuit board from the first region and extending the first region. It may include a second area 320 extending in a second direction different from the first direction, and the first area and the second area may be arranged so as not to overlap.
  • the first area 310 of the flexible circuit board may extend on the side 252c of the battery protection circuit 252.
  • the flexible circuit board 300 may include a first end 330a and a second end 330b forming both ends.
  • the first end extends from one end of the first area and is disposed to overlap so as to be electrically connected to the battery protection circuit, and the second end extends from one end to the second area and is electrically connected to the circuit board. They can be placed overlapping as much as possible.
  • the battery 250 further includes a battery cell 251 and a positive electrode tab 253a and a negative electrode tab 253b protruding from the battery cell toward the circuit board, and the flexible circuit board.
  • the first end and at least a portion of the first region may be located between the anode tab and the cathode tab.
  • the housing includes a front plate 220 and a rear plate 280, and the flexible circuit board may be spaced apart from the front plate or the rear plate.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Battery Mounting, Suspending (AREA)

Abstract

Un dispositif électronique selon un mode de réalisation de la présente invention peut comprendre : un boîtier ; une carte de circuit imprimé disposée dans le boîtier ; et une batterie qui est disposée dans le boîtier, et qui comprend un module de circuit de protection de batterie (PCM) et une carte de circuit imprimé souple pour connecter électriquement le PCM de batterie et la carte de circuit imprimé. La carte de circuit imprimé souple peut comprendre : une première zone disposée le long de la surface latérale de la batterie faisant face à la carte de circuit imprimé ; et une seconde zone qui est agencée pour faire face à la carte de circuit imprimé à partir de la première zone, et qui s'étend dans une seconde direction qui diffère d'une première direction dans laquelle s'étend la première zone.
PCT/KR2023/015200 2022-10-11 2023-10-04 Batterie et dispositif électronique comprenant celle-ci WO2024080654A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20220129760 2022-10-11
KR10-2022-0129760 2022-10-11
KR10-2022-0144303 2022-11-02
KR1020220144303A KR20240050201A (ko) 2022-10-11 2022-11-02 배터리 및 이를 포함하는 전자 장치

Publications (1)

Publication Number Publication Date
WO2024080654A1 true WO2024080654A1 (fr) 2024-04-18

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PCT/KR2023/015200 WO2024080654A1 (fr) 2022-10-11 2023-10-04 Batterie et dispositif électronique comprenant celle-ci

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Country Link
WO (1) WO2024080654A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101559624B1 (ko) * 2013-06-14 2015-10-12 삼성에스디아이 주식회사 배터리 팩
KR20200085604A (ko) * 2019-01-07 2020-07-15 삼성전자주식회사 인쇄 회로 기판 측면으로부터 연결된 가요성 회로 기판을 포함하는 배터리 및 그를 포함하는 전자 장치
CN112820990A (zh) * 2019-11-15 2021-05-18 东莞新能德科技有限公司 电池
CN215184172U (zh) * 2021-05-20 2021-12-14 东莞新能德科技有限公司 电池及用电设备
KR102429345B1 (ko) * 2016-12-23 2022-08-04 삼성전자주식회사 피씨엠 케이스 및 그것을 포함하는 전자 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101559624B1 (ko) * 2013-06-14 2015-10-12 삼성에스디아이 주식회사 배터리 팩
KR102429345B1 (ko) * 2016-12-23 2022-08-04 삼성전자주식회사 피씨엠 케이스 및 그것을 포함하는 전자 장치
KR20200085604A (ko) * 2019-01-07 2020-07-15 삼성전자주식회사 인쇄 회로 기판 측면으로부터 연결된 가요성 회로 기판을 포함하는 배터리 및 그를 포함하는 전자 장치
CN112820990A (zh) * 2019-11-15 2021-05-18 东莞新能德科技有限公司 电池
CN215184172U (zh) * 2021-05-20 2021-12-14 东莞新能德科技有限公司 电池及用电设备

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